Display Devices

Abstract

The display device includes: a window including a glass substrate; a display panel arranged below the window; and a digitizer arranged below the display panel, wherein the digitizer includes: a base film arranged below the display panel; a first conductive layer arranged below the base film; a first insulating layer arranged below the first conductive layer; a second conductive layer arranged below the first insulating layer; and a second insulating layer arranged below the second conductive layer, and the window, the display panel and the digitizer may be capable of being folded and unfolded.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims priority to and the benefit of Korean Patent Application No. 10-2020-0075894 filed in the Korean Intellectual Property Office (KIPO) on June 22, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device that senses input from an electromagnetic pen. Technical Field

[0005] The display device can sense external input applied from the outside. The external input can be an input from a user. The user's input can include various types of external inputs, such as a part of the user's body, light, heat, an electromagnetic pen, or pressure. In particular, the display device may include a digitizer capable of sensing a touch input from an electromagnetic pen. The digitizer can be applied to the display device in various forms by methods such as an electromagnetic resonance (EMR) method or an active electrostatic (AES) method. Summary of the invention

[0006] The present disclosure relates to a display device capable of sensing input from an electromagnetic pen.

[0007] In one aspect, a display device may include: a window including a glass substrate; a display panel disposed below the window; and a digitizer disposed below the display panel. The digitizer may include: a base film disposed below the display panel; a first conductive layer disposed below the base film; a first insulating layer disposed below the first conductive layer; a second conductive layer disposed below the first insulating layer; and a second insulating layer disposed below the second conductive layer. The window, the display panel, and the digitizer may be capable of being folded and unfolded.

[0008] In an implementation, a thickness of the first conductive layer may be greater than a thickness of the second conductive layer.

[0009] In an implementation, the second conductive layer may include a first sub conductive layer disposed under the first insulating layer and a second sub conductive layer disposed under the first sub conductive layer.

[0010] In an embodiment, each of the first sub conductive layer and the first insulating layer may include an opening, and the second sub conductive layer may electrically contact the first conductive layer through the opening of each of the first sub conductive layer and the first insulating layer.

[0011] In an implementation, the first sub-conductive layer may directly contact the first insulating layer.

[0012] In an implementation, the digitizer may further include an intermediate base film disposed between the second conductive layer and the first insulating layer.

[0013] In an implementation, each of the base film and the intermediate base film may include polyimide.

[0014] In an implementation, each of the first insulating layer and the second insulating layer may include a pressure-sensitive adhesive film.

[0015] In an implementation, one of the first insulating layer and the second insulating layer may include photosensitive polyimide, and the other of the first insulating layer and the second insulating layer may be a pressure-sensitive adhesive film.

[0016] In an embodiment, the digitizer may further include a cover layer disposed under the second insulating layer.

[0017] In an embodiment, the number of layers of the second conductive layer may be greater than the number of layers of the first conductive layer.

[0018] In an embodiment, the display panel and the digitizer may be folded inwardly such that a first portion of the display panel and a second portion of the display panel face each other.

[0019] In an embodiment, the display panel may include a sensor layer sensing an external input from outside the display device and a display layer disposed under the sensor layer and displaying an image. The display layer may be disposed between the sensor layer and the digitizer.

[0020] In an embodiment, the display device may further include a protective film disposed between the display panel and the digitizer, wherein the display panel may be attached to the protective film, and a base film of the digitizer may be attached to the protective film.

[0021] In an embodiment, the digitizer may include an upper surface and a lower surface, the upper surface of the digitizer may face the display panel, the lower surface of the digitizer may be spaced apart from the display panel, the upper surface of the digitizer is disposed between the display panel and the lower surface of the digitizer, and in an unfolded state, the upper surface of the digitizer may be flat and the lower surface of the digitizer may be uneven.

[0022] In one aspect, a display device may include: a sensor layer that senses input from outside the display device; a display layer that is disposed below the sensor layer and displays an image toward the sensor layer; and a digitizer that is disposed below the display layer and includes an upper surface facing the display layer and a lower surface separated from the display layer, wherein the upper surface of the digitizer may be disposed between the display layer and the lower surface of the digitizer, the upper surface of the digitizer may be flat, and the lower surface of the digitizer may be uneven.

[0023] In an embodiment, the digitizer may include: a base film disposed below the display layer and adjacent to an upper surface of the digitizer; a first conductive layer disposed below the base film; a first insulating layer disposed below the first conductive layer; a second conductive layer disposed below the first insulating layer; and a second insulating layer disposed below the second conductive layer. The sensor layer, the display layer, and the digitizer may be foldable and unfoldable.

[0024] In an implementation, the digitizer may further include an intermediate base film disposed between the second conductive layer and the first insulating layer.

[0025] In an embodiment, the second conductive layer may include a first sub-conductive layer in contact with the intermediate base film and a second sub-conductive layer disposed under the first sub-conductive layer, each of the first sub-conductive layer, the intermediate base film, and the first insulating layer may include an opening, and the second sub-conductive layer may contact the first conductive layer through the opening of each of the first sub-conductive layer, the intermediate base film, and the first insulating layer.

[0026] In an implementation, each of the first insulating layer and the second insulating layer may include a pressure-sensitive adhesive film or a photosensitive polyimide. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Further understanding of embodiments of the present invention will become more apparent by describing some embodiments of the present invention in detail with reference to the accompanying drawings.

[0028] Figure 1A is a schematic perspective view of a display device according to an embodiment.

[0029] Figure 1B is a schematic perspective view of a display device according to an embodiment.

[0030] Figure 2A is a schematic perspective view of a display device according to an embodiment.

[0031] Figure 2B is a schematic perspective view of a display device according to an embodiment.

[0032] Figure 3 It is along Figure 1A A schematic cross-sectional view taken along line II'.

[0033] Figure 4 is a schematic cross-sectional view of a part of the configuration of a display device according to an embodiment.

[0034] Figure 5 is a schematic plan view briefly showing the configuration of a digitizer according to the embodiment.

[0035] Figure 6 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0036] Figure 7 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0037] Figure 8 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0038] Fig. 9 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0039] Fig.10 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0040] FIG. 11A to FIG. 11F is a schematic cross-sectional view illustrating a part of a method for manufacturing a display device according to an embodiment.

[0041] Fig.12 is a schematic cross-sectional view showing a part of the configuration of a display device according to an embodiment. DETAILED DESCRIPTION

[0042] Since the present disclosure can have various modified embodiments, some embodiments are shown in the drawings and described in the detailed description of the present invention. However, this does not limit the present disclosure to specific embodiments, and it should be understood that the present disclosure covers all modifications, equivalents and replacements within the thought and technical scope of the present invention.

[0043] In order to clearly describe the present invention, parts irrelevant to the description may be omitted, and the same elements will be referred to with the same reference numerals throughout the specification.

[0044] For convenience of explanation, the thickness of some layers and regions may be exaggerated. In the drawings, the thickness of layers, films, panels, regions, etc. may be exaggerated for clarity.

[0045] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on," "connected to," or "coupled to" another element, it may be directly on the other element, or directly connected to or directly coupled to the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly on" another element, there are no intervening elements. The term "on..." or "above..." means being located on or below an object portion, and does not necessarily mean being located on the upper side of the object portion based on the direction of gravity.

[0046] Unless explicitly described to the contrary, the word “comprise” or “include” and variations such as “comprises”, “comprising” or “including”, will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0047] The phrase "in a plan view" means observing an object portion from the top, and the phrase "in a cross-sectional view" means observing a cross section cutting the object portion vertically from the side.

[0048] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, "A and / or B" can be understood to mean "A, B, or A and B".

[0049] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the scope of the claims, the first element, first component, first region, first layer or first regional section discussed below may be referred to as the second element, second component, second region, second layer or second regional section. Unless mentioned to the contrary, the singular forms "one", "a kind of" and "the" are intended to also include plural forms.

[0050] In the specification and claims, the phrase "at least one" is intended to include the meaning of "at least one selected from the group of..." for purposes of its meaning and interpretation.

[0051] Terms such as "below", "lower", "above", "upper", etc. are used to describe the relationship of the configurations shown in the drawings. These terms are used as relative concepts and are described with reference to the directions indicated in the drawings.

[0052] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formalized meaning unless clearly defined in the specification.

[0053] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0054] Figure 1Ais a schematic perspective view of a display device according to an embodiment. Figure 1B is a schematic perspective view of a display device according to an embodiment.

[0055] Reference Figure 1A and Figure 1B , the display device 1000 may be a device activated by an electrical signal. For example, the display device 1000 may be a mobile phone, a tablet computer, a car navigation unit, a game console, or a wearable device, but is not limited thereto. Figure 1A and Figure 1B , a mobile phone is exemplarily shown as the display device 1000 .

[0056] The display device 1000 may sense an external input applied from the outside. The external input may be an input of a user. The input of the user may include various types of external inputs such as a part of the user's body, light, heat, or pressure. Figure 1A , an electromagnetic pen 2000 is shown as an example. The display device 1000 may sense an external input through electromagnetic resonance (EMR) generated between a magnetic field generated inside the display device 1000 and the electromagnetic pen 2000.

[0057] The display device 1000 may display an image through the active area 1000A. When the display device 1000 is not folded, the active area 1000A may include a plane defined by the first direction DR1 and the second direction DR2. The thickness direction of the display device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and the rear surface (or lower surface) of the member forming (or constituting) the display device 1000 may be defined relative to the third direction DR3.

[0058] The active region 1000A may include a first region 1000A1, a second region 1000A2, and a third region 1000A3. The second region 1000A2 may be bent relative to a folding axis 1000FX extending in a second direction DR2. Therefore, the first region 1000A1 and the third region 1000A3 may be referred to as non-folding regions, and the second region 1000A2 may be referred to as a folding region.

[0059] When the display device 1000 is folded, the first area 1000A1 and the third area 1000A3 may face each other. Therefore, in a fully folded state, the active area 1000A may not be exposed to the outside, which may be called an inner fold. However, the embodiment is not limited thereto.

[0060] For example, in an embodiment, when the display device 1000 is folded, the first area 1000A1 and the third area 1000A3 may be opposite to each other. Therefore, in the folded state, the active area 1000A may be exposed to the outside, which may be called external folding.

[0061] The display device 1000 may perform only one of the inner folding and the outer folding. As another example, the display device 1000 may perform both the inner folding and the outer folding. In this case, the same area of ​​the display device 1000, for example, the second area 1000A2 may be folded both inner and outer.

[0062] exist Figure 1A and Figure 1B In the embodiment, one folding region and two non-folding regions are shown as an example, but the number of folding regions and non-folding regions is not limited thereto. For example, the display device 1000 may include more than two non-folding regions and a plurality of folding regions disposed between adjacent non-folding regions.

[0063] As an example, Figure 1A and Figure 1B The folding axis 1000FX is shown to extend in the second direction DR2, but the embodiment is not limited thereto. For example, the folding axis 1000FX may extend in the first direction DR1. In this case, the first region 1000A1, the second region 1000A2, and the third region 1000A3 may be sequentially arranged in the second direction DR2.

[0064] The active area 1000A may overlap with at least one electronic module. For example, the electronic module may include a camera module and a proximity illumination sensor (or light sensor). The electronic module may receive an external input transmitted through the active area 1000A, or may provide an output through the active area 1000A. The portion of the active area 1000A overlapping with the camera module and the proximity illumination sensor may have a higher transmittance than other portions of the active area 1000A. Therefore, the area in which a plurality of electronic modules are to be arranged may not be in the peripheral area 1000NA around the active area 1000A. As a result, the area ratio of the active area 1000A to the total area of ​​the display device 1000 may increase.

[0065] Figure 2A is a schematic perspective view of a display device according to an embodiment. Figure 2B is a schematic perspective view of a display device according to an embodiment.

[0066] Reference Figure 2A and Figure 2BThe display device 1001 may be a foldable display device. The display device 1001 may display an image through an active area 1000Aa. The active area 1000Aa may include a first area 1000A1a, a second area 1000A2a, a third area 1000A3a, a fourth area 1000A4a, and a fifth area 1000A5a.

[0067] The second region 1000A2a may be bent relative to a folding axis 1000FX1 extending in the second direction DR2. The fourth region 1000A4a may be bent relative to a folding axis 1000FX2 extending in the second direction DR2. Therefore, the first region 1000A1a, the third region 1000A3a, and the fifth region 1000A5a may be referred to as non-folding regions. The second region 1000A2a and the fourth region 1000A4a may be referred to as folding regions.

[0068] The second area 1000A2a can be folded outward, and the fourth area 1000A4a can be folded inward. Figure 2A As shown, when the display device 1001 is completely folded, the first area 1000A1a may be exposed to the outside, and the third area 1000A3a, the fourth area 1000A4a, and the fifth area 1000A5a may not be exposed to the outside.

[0069] Figure 3 It is along Figure 1A A schematic cross-sectional view taken along line II'. Figure 4 is a schematic cross-sectional view of a part of the configuration of a display device according to an embodiment.

[0070] Reference Figure 3 and Figure 4 , the display device 1000 may include a display panel 100 , an upper functional layer, and a lower functional layer.

[0071] Reference Figure 4 , the display panel 100 may be configured to generate an image and sense an external input applied from the outside. For example, the display panel 100 may include a display layer 110 and a sensor layer 120. The display layer 110 may be configured to generate an image. The display layer 110 may be a light-emitting display layer. For example, the display layer 110 may be an organic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer.

[0072] The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting element layer 113 , and an encapsulation layer 114 .

[0073] The base layer 111 may include a synthetic resin layer. The synthetic resin layer may include a thermosetting resin. The base layer 111 may have a multilayer structure. For example, the base layer 111 may have a three-layer structure including a synthetic resin layer, an adhesive layer and a synthetic resin layer. The synthetic resin layer may be or include a polyimide-based resin layer, but the embodiment is not limited to a specific material. The synthetic resin layer may include at least any one of an acrylic resin, a methacrylate resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin and a perylene resin. The base layer 111 may include a glass substrate or an organic / inorganic composite material substrate.

[0074] The circuit layer 112 may be disposed on the base layer 111. The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer are formed on the base layer 111 by a method such as coating or vapor deposition, and then the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a single or multiple photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 112 may be formed.

[0075] The light emitting element layer 113 may be disposed on the circuit layer 112. The light emitting element layer 113 may include a light emitting element. For example, the light emitting element layer 113 may include an organic light emitting material, a quantum dot, a quantum rod, or a micro LED.

[0076] The encapsulation layer 114 may be disposed on the light emitting element layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked, but the layers constituting the encapsulation layer 114 are not limited thereto.

[0077] The inorganic layer can protect the light emitting element layer 113 from moisture and oxygen, and the organic layer can protect the light emitting element layer 113 from impurities such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but the embodiment is not limited thereto.

[0078] The sensor layer 120 may be disposed on the display layer 110. The sensor layer 120 may sense an external input applied from the outside. The external input may be an input of a user. For example, the input of the user may include various types of external inputs such as a part of the user's body, light, heat, a pen, or pressure.

[0079] The sensor layer 120 may be formed on the display layer 110 through a continuous process. In this case, the sensor layer 120 may be directly disposed on the display layer 110. Directly disposed may mean that no third component is disposed between the sensor layer 120 and the display layer 110. For example, a separate bonding member may not be disposed between the sensor layer 120 and the display layer 110. As another example, the sensor layer 120 may be bonded to the display layer 110 through a bonding member. The bonding member may include a conventional adhesive or glue.

[0080] The sensor layer 120 may include a base insulating layer 121 , a first conductive layer 122 , a sensing insulating layer 123 , a second conductive layer 124 , and a cover insulating layer 125 .

[0081] The base insulating layer 121 may be directly disposed on the display layer 110. For example, the base insulating layer 121 may directly contact the encapsulation layer 114. The base insulating layer 121 may have a single-layer structure or a multi-layer structure. As another example, the base insulating layer 121 may be omitted. As another example, the base insulating layer 121 may be formed on a separate base layer, and the base layer may be bonded to the display layer 110 by an adhesive member.

[0082] Each of the first conductive layer 122 and the second conductive layer 124 may have a single layer structure or a multilayer structure stacked in the third direction DR3. The single conductive layer may include a metal layer or a transparent conductive layer. The metal layer may include at least any one of molybdenum, silver, titanium, copper, aluminum and alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium tin zinc oxide (ITZO). The transparent conductive layer may include a conductive polymer such as PEDOT, metal nanowires, graphene, etc.

[0083] The multilayer conductive layer may include a multilayer metal layer. For example, the multilayer metal layer may have a three-layer structure such as titanium / aluminum / titanium. The multilayer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0084] Each of the first conductive layer 122 and the second conductive layer 124 may include a pattern forming a sensing electrode. The sensor layer 120 may obtain information about an external input by sensing a change in capacitance between the electrodes.

[0085] The sensing insulating layer 123 may be disposed between the first conductive layer 122 and the second conductive layer 124, and may cover or overlap the first conductive layer 122. At least a portion of the second conductive layer 124 may be electrically connected to at least a portion of the first conductive layer 122 through a contact hole passing through the sensing insulating layer 123. The covering insulating layer 125 may be disposed on the sensing insulating layer 123, and may cover or overlap the second conductive layer 124.

[0086] At least any one of the base insulating layer 121, the sensing insulating layer 123, and the cap insulating layer 125 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0087] At least one of the base insulating layer 121, the sensing insulating layer 123, and the cover insulating layer 125 may include an organic film. The organic film may include at least one of acrylic-based resin, methacrylic-based resin, polyisoprene, vinyl resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin.

[0088] Refer again Figure 3 , an upper functional layer may be disposed on the display panel 100. The upper functional layer may include an anti-reflection member 200 and an upper member 300.

[0089] The anti-reflection member 200 may be referred to as an anti-reflection layer. The anti-reflection member 200 may reduce the reflectivity of external light incident from the outside. The anti-reflection member 200 may include a stretched synthetic resin film. For example, the anti-reflection member 200 may be provided by dyeing an iodine compound on a polyvinyl alcohol film (PVA film). However, this is given as an example, and the material constituting the anti-reflection member 200 is not limited to the above examples.

[0090] The anti-reflection member 200 may be bonded to the display panel 100 by a first adhesive layer 1010. The first adhesive layer 1010 may be a transparent adhesive layer, such as a pressure sensitive adhesive film (PSA), an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). The adhesive layer described below may include a conventional adhesive or glue. In another embodiment, the first adhesive layer 1010 may be omitted, and in this case, the anti-reflection member 200 may be directly disposed on the display panel 100. In this case, a separate adhesive layer may not be disposed between the anti-reflection member 200 and the display panel 100.

[0091] The upper member 300 may be disposed on the anti-reflection member 200. The upper member 300 may include a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a light blocking layer 360, a shock absorbing layer 370, and a second hard coating layer 380. The components included in the upper member 300 are not limited to the above components. At least some of the above components may be omitted, and other components may be added.

[0092] The first hard coating layer 310 may be disposed on the outermost surface of the display device 1000. The first hard coating layer 310 may be a functional layer for improving the use characteristics of the display device 1000, and may be coated on the protective layer 320. For example, the first hard coating layer 310 may enhance anti-fingerprint, anti-pollution, and anti-scratch properties. The thickness of the first hard coating layer 310 may be about 3 μm to about 7 μm, and may be, for example, about 5 μm, but the thickness of the first hard coating layer 310 is not limited thereto.

[0093] The protective layer 320 may be disposed under the first hard coating layer 310. The protective layer 320 may protect components disposed under the protective layer 320. The protective layer 320 may be additionally provided with the first hard coating layer 310 and an anti-fingerprint layer to improve properties such as chemical resistance and wear resistance. The protective layer 320 may include a film having an elastic modulus of about 15 GPa or less at room temperature. For example, the protective layer 320 may include a polyethylene terephthalate film. The thickness of the protective layer 320 may be about 40 μm to about 60 μm, and may be, for example, about 50 μm. However, the thickness of the protective layer 320 is not limited thereto.

[0094] The first upper adhesive layer 330 may be disposed under the protective layer 320. The protective layer 320 and the window 340 may be bonded to each other through the first upper adhesive layer 330.

[0095] The window 340 may be disposed under the first upper adhesive layer 330. The window 340 may include an optically transparent insulating material. For example, the window 340 may include a glass substrate or a synthetic resin film.

[0096] When the window 340 is a glass substrate, the thickness of the window 340 may be about 80 μm or less, for example, about 30 μm, but the thickness of the window 340 is not limited thereto. When the window 340 is a synthetic resin film, the window 340 may include a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0097] The window 340 may have a multi-layer structure or a single-layer structure. For example, the window 340 may include a plurality of synthetic resin films bonded by an adhesive, or a glass substrate and a synthetic resin film bonded by an adhesive.

[0098] Although not shown, a functional layer may be further provided on one surface of the window 340. For example, the functional layer may be provided between the window 340 and the first upper adhesive layer 330. The functional layer may be a hard coating layer. However, the embodiment is not limited thereto, and the functional layer may include an anti-fingerprint layer, an anti-scattering layer, etc. The thickness of the functional layer may be about 3 μm to about 7 μm, and may be, for example, about 5 μm. However, the thickness of the functional layer is not limited thereto.

[0099] The second upper adhesive layer 350 may be disposed under the window 340. The window 340 and the shock absorbing layer 370 may be bonded to each other by the second upper adhesive layer 350.

[0100] In an embodiment, the sidewall 340S of the window 340 and the sidewall 350S of the second upper adhesive layer 350 may be disposed inwardly from the sidewalls of other layers, for example, from the sidewall 1000S of the display panel 100 and the sidewall 320S of the protective layer 320. An object "disposed inwardly" may mean that the object is closer to the active area 1000A than other objects.

[0101] The folding operation of the display device 1000 may change the position or structural relationship between the layers. According to an embodiment, the sidewall 340S of the window 340 is disposed inward from the sidewall 1000S of the display panel 100 and the sidewall 320S of the protective layer 320, and thus even in the case where the positional relationship is changed, the possibility that the sidewall 340S of the window 340 protrudes more than the sidewall 320S of the protective layer 320 can be reduced. Therefore, the possibility that an external impact is transmitted through the sidewall 340S of the window 340 can be reduced. As a result, the possibility of the window 340 having a crack can be reduced.

[0102] The first distance 340W between the sidewall 340S of the window 340 and the sidewall 320S of the protective layer 320 may be greater than or equal to a predetermined distance. In this case, the first distance 340W may be a distance in a direction parallel to the first direction DR1. In a plan view, the first distance 340W may correspond to a distance between the sidewall 340S and the sidewall 320S.

[0103] The first distance 340W may be about 180 μm to about 205 μm, for example, about 196 μm, but the embodiment is not limited thereto. For example, the first distance 340W may be about 50 μm or more, for example, about 300 μm. As the first distance 340W becomes larger, the protective layer 320 protrudes more than the window 340, and a portion of the protective layer 320 is bent to be attached to other components, for example, to the housing. As the area of ​​the protective layer 320 becomes larger, the possibility of impurities flowing from the upper portion of the protective layer 320 being introduced into the lower portion of the protective layer 320 can be reduced.

[0104] The window 340 and the second upper adhesive layer 350 may be bonded to the shock absorbing layer 370 by a lamination process. Considering the lamination process tolerance, the area of ​​the window 340 and the second upper adhesive layer 350 may be smaller than the area of ​​the shock absorbing layer 370. The area of ​​the second upper adhesive layer 350 may be smaller than the area of ​​the window 340. For example, in the process of attaching the window 340, pressure may be applied to the second upper adhesive layer 350. The second upper adhesive layer 350 may expand in the first direction DR1 and the second direction DR2 under pressure. In this case, the area of ​​the second upper adhesive layer 350 may be less than or equal to the area of ​​the window 340 to prevent the second upper adhesive layer 350 from protruding more than the window 340.

[0105] In the case where the first upper adhesive layer 330 and the second upper adhesive layer 350 are attached, the window 340 does not slide in the folding operation of the display device 1000, and thus a buckling phenomenon may occur in the window 340. However, according to an embodiment, the area of ​​the second upper adhesive layer 350 is smaller than that of the window 340. Therefore, the first upper adhesive layer 330 may not be attached to the second upper adhesive layer 350, and thus the possibility of foreign matter adhering to the second upper adhesive layer 350 may be reduced.

[0106] The second distance 350W between the sidewall 350S of the second upper adhesive layer 350 and the sidewall 320S of the protective layer 320 may be greater than or equal to a predetermined distance. In this case, the second distance 350W may be a distance in a direction parallel to the first direction DR1. In a plan view, the second distance 350W may correspond to a distance between the sidewall 350S and the sidewall 320S.

[0107] The second distance 350W may be about 392 μm, but the embodiment is not limited thereto. For example, the second distance 350W may be selected from a range of about 292 μm to about 492 μm, but is not limited thereto.

[0108] The shock absorbing layer 370 may be a functional layer for protecting the display panel 100 from external impacts. The shock absorbing layer 370 may be selected from a film having an elastic modulus of about 1 GPa or more at room temperature. The shock absorbing layer 370 may be a stretched film including an optical function. For example, the shock absorbing layer 370 may be an optical axis control film. For example, the shock absorbing layer 370 may be a biaxially stretched PET film. The thickness of the shock absorbing layer 370 may be about 35 μm to about 45 μm, for example about 41 μm, but the thickness of the shock absorbing layer 370 is not limited thereto. In an embodiment, the shock absorbing layer 370 may be omitted.

[0109] The second hard coating layer 380 may be disposed on the surface of the shock absorbing layer 370. The second hard coating layer 380 may include an organic coating agent, an inorganic coating agent, or an organic / inorganic hybrid coating agent. The embodiment is not limited to a specific material for the second hard coating layer 380, as long as the material can reduce haze. Haze can be defined by the degree of diffusion of light incident on the substrate. A high degree of haze may refer to a phenomenon in which light is scattered to cause opaque blur.

[0110] The light blocking layer 360 may be disposed between the shock absorbing layer 370 and the second upper adhesive layer 350. The light blocking layer 360 may be printed on the upper surface of the shock absorbing layer 370 to be disposed. The light blocking layer 360 may overlap with the peripheral area 1000NA. The light blocking layer 360 is a color layer and may be formed by a coating method. The light blocking layer 360 may include a polymer resin and a pigment mixed with the polymer resin. The polymer resin may be, for example, an acrylic resin or a polyester, and the pigment may be a carbon-based pigment. However, the embodiment is not limited thereto.

[0111] The light blocking layer 360 may be printed after the second hard coating layer 380 is formed on the shock absorbing layer 370. The shock absorbing layer 370 may include a surface that is more uneven than the second hard coating layer 380, and therefore, the adhesion may be better when the light blocking layer 360 is printed on the shock absorbing layer 370 than when the light blocking layer 360 is printed on the second hard coating layer 380. For example, since the light blocking layer 360 is directly printed on the uneven surface of the shock absorbing layer 370, the possibility of the light blocking layer 360 being separated from the shock absorbing layer 370 may be reduced. For example, the possibility of the light blocking layer 360 being separated from the surface to be printed (e.g., the shock absorbing layer 370) is reduced, and therefore the product reliability of the display device 1000 may be improved. However, the position of the light blocking layer 360 is not limited to Figure 3 Example shown.

[0112] The upper member 300 may be bonded to the anti-reflection member 200 through the second adhesive layer 1020. The second adhesive layer 1020 may include a conventional adhesive or glue.

[0113] The lower functional layer may be disposed below the display panel 100. For example, the lower functional layer may include a lower protective film 400, a digitizer 500, a buffer member 600, a first lower member 700, a second lower member 800, and a step compensation member 900. The components included in the lower functional layer are not limited to the above components. For example, at least some of the above components may be omitted, and other components may be added.

[0114] The lower protective film 400 may be bonded to the rear surface of the display panel 100 through the third adhesive layer 1030. The lower protective film 400 may prevent scratches on the rear surface of the display panel 100 during the manufacturing process of the display device 1000. The lower protective film 400 may be a colored polyimide film. For example, the lower protective film 400 may be an opaque yellow film, but the embodiment is not limited thereto.

[0115] The digitizer 500 may be bonded to the rear surface of the lower protective film 400 through the fourth adhesive layer 1040. The digitizer 500 may sense a signal transmitted by the electromagnetic pen 2000 among external inputs (see Figure 1A ). The digitizer 500 may sense external input through electromagnetic resonance (EMR).

[0116] Reference Figure 4 The digitizer 500 may include a base film 511, a first conductive layer 512, a first insulating layer 513, a second conductive layer 514, and a second insulating layer 515. The base film 511, the first conductive layer 512, the first insulating layer 513, the second conductive layer 514, and the second insulating layer 515 may be sequentially stacked in a direction away from the display panel 100.

[0117] According to an embodiment, the base film 511 of the digitizer 500 may directly contact the fourth adhesive layer 1040. When the display device 1000 is not folded, the base film 511 may have a flat surface. For example, the upper surface 500US of the digitizer 500 may be flat, and the lower surface 500BS of the digitizer 500 may have an uneven shape.

[0118] One of the outermost surfaces of the digitizer 500 is a flat base film 511, and thus the digitizer 500 can be attached to the fourth adhesive layer 1040 without an additional separate planarization process. Therefore, the thickness of the digitizer 500 may not be increased due to the additional planarization layer. The first conductive layer 512 and the second conductive layer 514 are spaced apart from the display panel 100, and the base film 511 is located between the first conductive layer 512 and the second conductive layer 514 and the display panel 100, and thus the lines included in the first conductive layer 512 and the second conductive layer 514 may be less visible. A detailed description will be provided below.

[0119] Refer again Figure 3 , the buffer member 600 may be disposed below the digitizer 500. The buffer member 600 may protect the display panel 100 from impact transmitted from the bottom. The buffer member 600 may enhance the impact resistance of the display device 1000.

[0120] The buffer member 600 may include a first buffer adhesive layer 610, a barrier film 620, a buffer layer 630, and a second buffer adhesive layer 640. The components included in the buffer member 600 are not limited to the above components. For example, at least some of the above components may be omitted, and other components may be added.

[0121] The first buffer adhesive layer 610 and the second buffer adhesive layer 640 may include conventional adhesives or adhesives. The first buffer adhesive layer 610 may be attached to the digitizer 500, and the second buffer adhesive layer 640 may be attached to the first lower assembly 700. The barrier film 620 may be provided to enhance impact resistance. The barrier film 620 may be used to prevent deformation of the display panel 100. The barrier film 620 may be a synthetic resin film, such as a polyimide film, but the embodiment is not limited thereto. The buffer layer 630 may include, for example, foam or sponge. The foam may include polyurethane foam or thermoplastic polyurethane foam. In the case where the buffer layer 630 includes foam, the buffer layer 630 may be formed by using the barrier film 620 as a base layer. For example, a foaming agent is applied to the barrier film 620 to form the buffer layer 630.

[0122] At least any one of the blocking film 620 or the buffer layer 630 may have a color that absorbs light. For example, at least any one of the blocking film 620 or the buffer layer 630 may be black. In this case, components disposed under the buffer member 600 may not be visible from the outside.

[0123] The first lower member 700 may be disposed below the buffer member 600. The first lower member 700 may include a plate 710, a lower adhesive layer 720, and a cover layer 730. The components included in the first lower member 700 are not limited to the above components. For example, at least some of the above components may be omitted, and other components may be added.

[0124] The board 710 may include a material having an elastic modulus of about 70 GPa or more at room temperature. For example, the board 710 may include SUS304, but the embodiment is not limited thereto. The board 710 may support components disposed on the upper portion. The board 710 may improve the heat dissipation performance of the display device 1000.

[0125] The opening 711 may be defined in a portion of the plate 710. The opening 711 may be defined in a region overlapping the second region 1000A2. For example, the opening 711 may overlap the second region 1000A2 in a plan view or when viewed in the third direction DR3. Due to the opening 711, at least a portion of the plate 710 may be more easily bent or deformed.

[0126] The cover layer 730 may be attached to the board 710 through the lower adhesive layer 720. The lower adhesive layer 720 may include a conventional adhesive or glue. The cover layer 730 may cover or overlap the opening 711 of the board 710. Therefore, introduction of foreign matter into the opening 711 may be additionally prevented.

[0127] The cover layer 730 may include a material having an elastic modulus lower than that of the plate 710. For example, the cover layer 730 may include thermoplastic polyurethane, but the embodiment is not limited thereto.

[0128] The second lower member 800 may be disposed below the first lower member 700. The second lower members 800 may be spaced apart from each other. For example, a second lower member 800 may be disposed in the first region 1000A1, and another second lower member 800 may be disposed in the third region 1000A3.

[0129] Each of the second lower members 800 may be attached to the first lower member 700 by a fifth adhesive layer 1050. For example, the fifth adhesive layer 1050 may be attached to the lower surface of the first lower member 700 overlapping the first area 1000A1, and another fifth adhesive layer 1050 may be attached to the lower surface of the first lower member 700 overlapping the third area 1000A3. For example, the fifth adhesive layer 1050 may not overlap the second area 1000A2.

[0130] Although not shown, a step compensation film may be further provided between each of the second lower members 800 and the first lower member 700. For example, a step compensation film may be provided in an area overlapping with the second region 1000A2. The adhesion of one surface of the step compensation film may be lower than the adhesion of the other surface. For example, the surface may not have adhesion. The one surface may be a surface facing the first lower member 700.

[0131] Each of the second lower members 800 may include a lower plate 810, a heat sink 820, and an insulating film 830. The components included in each of the second lower members 800 are not limited to the above components. For example, at least some of the above components may be omitted, and other components may be added.

[0132] A plurality of lower plates 810 may be provided. One of the lower plates 810 may overlap a portion of the second area 1000A2 and the first area 1000A1, and another of the lower plates 810 may overlap another portion of the second area 1000A2 and the third area 1000A3.

[0133] The lower plates 810 may be spaced apart from each other in the second area 1000A2. However, the lower plates 810 may be disposed as close as possible to support the area in which the opening 711 of the plate 710 is formed. For example, the lower plates 810 may prevent the shape of the area defining the opening 711 of the plate 710 from being deformed due to pressure applied from the top.

[0134] The lower plate 810 may prevent the shape of components disposed on the second lower member 800 from being deformed due to the configuration disposed below the second lower member 800 .

[0135] Each lower plate 810 may include a metal alloy. For example, each lower plate 810 may include a copper alloy. However, the material constituting the lower plate 810 is not limited thereto. A heat sink 820 may be attached below the lower plate 810. The heat sink 820 may be a heat conductive sheet with high thermal conductivity. For example, the heat sink 820 may include a heat dissipation layer 821, a first heat dissipation adhesive layer 822, a second heat dissipation adhesive layer 823, and a gap band 824.

[0136] The gap tape 824 may be attached to the first heat dissipation adhesive layer 822 and the second heat dissipation adhesive layer 823, which are separated from each other by the heat dissipation layer 821 therebetween. The gap tape 824 may have a plurality of layers. For example, the gap tape 824 may include a base layer, an upper adhesive layer disposed on an upper surface of the base layer, and a lower adhesive layer disposed on a lower surface of the base layer.

[0137] The heat dissipation layer 821 may be attached to the lower plate 810 by the first heat dissipation adhesive layer 822. The heat dissipation layer 821 may be sealed by the first heat dissipation adhesive layer 822, the second heat dissipation adhesive layer 823, and the gap tape 824. The heat dissipation layer 821 may be a graphitized polymer film. The polymer film may be, for example, a polyimide film. An insulating film 830 may be attached below the heat sink 820. For example, the insulating film 830 may be attached to the second heat dissipation adhesive layer 823. The insulating film 830 may prevent rattling in the display device 1000.

[0138] The step compensating member 900 may be attached under the board 710. For example, the lower adhesive layer 720 may be attached under a portion of the board 710, and the step compensating member 900 may be attached under another portion of the board 710.

[0139] The step compensation member 900 may include a first compensation adhesive layer 910, a step compensation film 920, and a second compensation adhesive layer 930. The first compensation adhesive layer 910 may be attached to the lower surface of the board 710. The step compensation film 920 may be a synthetic resin film. The second compensation adhesive layer 930 may be attached to the lower surface of the step compensation film 920 and a device (not shown).

[0140] Figure 5 is a schematic plan view showing the configuration of a digitizer according to the embodiment.

[0141] Reference Figure 5 , the digitizer 500 may include a first coil 510 and a second coil 520. The first coil 510 may be referred to as a driving coil, and the second coil 520 may be referred to as a sensing coil.

[0142] Each of the first coils 510 may extend in the first direction DR1 and may be arranged to be spaced apart from each other in the second direction DR2. Each of the second coils 520 may extend in the second direction DR2 and may be arranged to be spaced apart from each other in the first direction DR1.

[0143] The AC signal may be sequentially provided or applied to the first terminal 510t of the first coil 510. The first coil 510 is formed in the form of a closed curve, and when current flows through the first coil 510, magnetic lines of force may be induced between the first coil 510 and the second coil 520. The second coil 520 may sense the electromagnetic pen 2000 (see Figure 1A ) transmits the induced electromagnetic force to the second terminal 520t of the second coil 520 and can output a signal.

[0144] Figure 5 The configuration of the digitizer 500 is shown as an example, but the embodiment is not limited thereto. The structural relationship between the first coil 510 and the second coil 520 is not limited to Figure 5 The structural relationships shown are shown, and various modifications can be made.

[0145] Figure 6 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0146] Reference Figure 5 and Figure 6 The digitizer 500 may include a base film 501 , a first conductive layer 502 , a first adhesive layer 503 , an intermediate base film 504 , a second conductive layer 505 , a second adhesive layer 506 , and a cover layer 507 .

[0147] The thickness TK1 of the digitizer 500 may refer to a maximum thickness among thicknesses in a direction parallel to the third direction DR3. The thickness TK1 of the digitizer 500 may correspond to a distance between the upper surface 500US and the lower surface 500BS.

[0148] According to an embodiment, components forming the digitizer 500 may be sequentially stacked on the surface of the base film 501. Therefore, one of the outermost surfaces of the digitizer 500 may be defined by the surface of the base film 501. For example, the upper surface 500US of the digitizer 500 may be defined by the surface of the base film 501, and the lower surface 500BS of the digitizer 500 may be defined by the surface of the cover layer 507.

[0149] Therefore, according to an embodiment, when the digitizer 500 is attached to the display panel 100 (see Figure 4 ), the base film 501 may be attached to face the display panel 100 (see Figure 4 ). The surface of the digitizer 500, for example, the upper surface 500US, is flat, and thus the planarization process for the digitizer 500 can be omitted. Therefore, in the case where the display device 1000 is repeatedly folded, a buckling phenomenon caused by the planarization layer can be prevented. Since the planarization layer is omitted, the thickness TK1 of the digitizer 500 can be reduced to improve the display device 1000 (see Figure 1A )’s folding performance and reliability issues that may be caused by the increase in thickness TK1 of the digitizer 500.

[0150] Both the first conductive layer 502 and the second conductive layer 505 may be disposed below the base film 501. Both the first conductive layer 502 and the second conductive layer 505 may be disposed on the display panel 100 (see Figure 4 ) is separated, and the base film 501 is between the first conductive layer 502 and the second conductive layer 505 and the display panel 100. Therefore, in the case where the planarization layer is omitted, when the display device 1000 (see Figure 1A ) from the outside, the first conductive layer 502 and the second conductive layer 505 may be less visible (or invisible).

[0151] The first conductive layer 502 may include copper, but the embodiment is not limited thereto. The first conductive layer 502 may include a plurality of first conductive patterns. Some of the first conductive patterns may form a first coil 510 (see Figure 5 ), and the other first conductive patterns may form a second coil 520 (see Figure 5 As another example, all of the first conductive patterns may be configured to be included in the first coil 510 (see Figure 5 ) or may be configured to be included in the second coil 520 (see Figure 5 )middle.

[0152] The first adhesive layer 503 may be disposed below the base film 501 and may overlap with the first conductive layer 502. The first adhesive layer 503 may be a pressure sensitive adhesive film (PSA). The intermediate base film 504 may overlap with the first adhesive layer 503. The intermediate base film 504 and the base film 501 may be (or include) a polyimide film. The first adhesive layer 503 and the intermediate base film 504 may be referred to as a first insulating layer.

[0153] The second conductive layer 505 may be disposed under the intermediate base film 504. The second conductive layer 505 may include a first sub-conductive layer 5051 and a second sub-conductive layer 5052. The number of layers of the second conductive layer 505 may be greater than the number of layers of the first conductive layer 502. Both the first sub-conductive layer 5051 and the second sub-conductive layer 5052 may include copper, but the embodiment is not limited thereto.

[0154] The first sub-conductive layer 5051 , the intermediate base film 504 , and the first adhesive layer 503 may be a flexible copper clad laminate (FCCL). The second sub-conductive layer 5052 may be a conductive layer plated on the first sub-conductive layer 5051 .

[0155] The second conductive layer 505 may include second conductive patterns. Some of the second conductive patterns may be electrically connected to the first conductive patterns disposed on the first conductive layer 502. For example, some of the second conductive patterns may form the first coil 510 (see Figure 5 ), and can be electrically connected to the first conductive pattern to form the first coil 510 (see Figure 5 ) pattern.

[0156] An opening CH1 may be defined in the first sub-conductive layer 5051, the first adhesive layer 503, and the intermediate base film 504. A portion of the first conductive layer 502 may be exposed in or through the opening CH1. A portion of the second sub-conductive layer 5052 may be filled in the opening CH1. The second sub-conductive layer 5052 may be in electrical contact with the first conductive layer 502.

[0157] According to an embodiment, the intermediate base film 504 is disposed between the first sub conductive layer 5051 and the first adhesive layer 503. The intermediate base film 504 may reduce the possibility that the first sub conductive layer 5051 is corroded.

[0158] In the display device 1000 (see Figure 1A ) is folded, the display panel 100 (see Figure 3 ) and the first portion of the display panel 100 (see Figure 3 ) may face each other. The display panel 100 (see Figure 3 ) may be the first portion of the first region 1000A1 (see Figure 3 ) overlapped portion, and the display panel 100 (see Figure 3 ) can be the second part of the third area 1000A3 (see Figure 3 ) overlapped portion. In this case, the stress on the second conductive layer 505 may be greater than the stress on the first conductive layer 502. According to an embodiment, the thickness TK4 of the second conductive layer 505 may be less than the thickness TK3 of the first conductive layer 502. Therefore, the possibility of the second conductive layer 505 having cracks can be reduced.

[0159] The second adhesive layer 506 may be disposed under the intermediate base film 504, and may overlap the second conductive layer 505. For example, the second conductive layer 505 may be disposed between the intermediate base film 504 and the second adhesive layer 506.

[0160] The cover layer 507 may be disposed under the second adhesive layer 506. The cover layer 507 may be a polyimide film, and the cover layer 507 and the second adhesive layer 506 may be referred to as a second insulating layer or a capping layer. The capping layer is a layer covering or overlapping the second conductive layer 505, and may be a layer for protecting and insulating the second conductive layer 505.

[0161] According to an embodiment, the first conductive layer 502 and the second conductive layer 505 are formed on one side of the base film 501, and thus the overcoat layer may be provided only on one side with respect to the base film 501. Accordingly, the thickness TK1 of the digitizer 500 may be reduced compared to the case where a plurality of overcoats are provided.

[0162] Figure 7 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0163] Reference Figure 7 The digitizer 500 a may include a base film 501 , a first conductive layer 502 , a first adhesive layer 503 , a second conductive layer 505 , a second adhesive layer 506 , and a cover layer 507 .

[0164] When with Figure 6 By comparison, the intermediate base film 504 can be omitted from the digitizer 500a (see Figure 6 ). Therefore, the thickness TK1a of the digitizer 500a can be greater than Figure 6 The thickness TK1 of the digitizer 500 is thin. The intermediate base film 504 is omitted, and thus the distance TK2a between the first conductive layer 502 and the second conductive layer 505 of the digitizer 500a may also be smaller than the distance TK2 between the first conductive layer 502 and the second conductive layer 505 of the digitizer 500.

[0165] According to an embodiment, when the digitizer 500a is attached to the display panel 100 (see Figure 4), the surface of the flat base film 501 can be attached. Therefore, the planarization layer for planarizing the adhesion surface is omitted, and thus the buckling phenomenon caused by the planarization layer can be prevented. Display device 1000 (see Figure 1A ) can be improved due to the reduced thickness of the digitizer 500a. Both the first conductive layer 502 and the second conductive layer 505 can be connected to the display panel 100 (see Figure 4 ) is separated, and the base film 501 is between the first conductive layer 502 and the second conductive layer 505 and the display panel 100. Accordingly, the first conductive layer 502 and the second conductive layer 505 can be reduced or prevented from being separated from the display device 1000 (see Figure 1A ) externally visible defects.

[0166] Figure 8 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0167] Reference Figure 8 , the digitizer 500b may include a base film 501, a first conductive layer 502, a first adhesive layer 503, a second conductive layer 505, and a second insulating layer 506b.

[0168] The first adhesive layer 503 may be a pressure-sensitive adhesive film and may be referred to as a first insulating layer. The second insulating layer 506b may include a photosensitive organic material. For example, the second insulating layer 506b may include photosensitive polyimide.

[0169] When with Figure 6 In comparison, the second insulating layer 506b is formed of photosensitive polyimide, and thus the cover layer 507 can be omitted (see Figure 6 ) and a second adhesive layer 506 (see Figure 6 ) of the temporary bonding and thermal bonding process. Accordingly, the manufacturing process can be further simplified. The thickness TK1b of the digitizer 500b can be adjusted by adjusting the thickness of the second insulating layer 506b.

[0170] Fig. 9 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0171] Reference Fig. 9 , the digitizer 500c may include a base film 501, a first conductive layer 502, a first insulating layer 503c, a second conductive layer 505c, a second adhesive layer 506, and a cover layer 507. The second adhesive layer 506 and the cover layer 507 may be referred to as an insulating layer or a cover layer.

[0172] The first insulating layer 503c may include a photosensitive organic material. For example, the first insulating layer 503c may include a photosensitive polyimide. The thickness of the first insulating layer 503c may be greater than Figure 6The thickness of the first insulating layer (eg, the first adhesive layer 503 and the intermediate base film 504) is thin. The distance TK2c between the first conductive layer 502 and the second conductive layer 505c of the digitizer 500c may also be smaller than the distance TK2 between the first conductive layer 502 and the second conductive layer 505 of the digitizer 500 (see Figure 6 ). Therefore, the display device 1000 (see Figure 1A )'s folding performance can be improved due to the reduction in thickness Tk1c of the digitizer 500c.

[0173] The second conductive layer 505c may be disposed under the first insulating layer 503c. The second conductive layer 505c may be formed on the first insulating layer 503c by a sputtering process, but the embodiment is not limited thereto. The thickness TK4c of the second conductive layer 505c may be less than the thickness TK3c of the first conductive layer 502.

[0174] Fig.10 is a schematic cross-sectional view of a digitizer according to an embodiment.

[0175] Reference Fig.10 , the digitizer 500d may include a base film 501, a first conductive layer 502, a first insulating layer 503c, a second conductive layer 505c, and a second insulating layer 506d.

[0176] The first insulating layer 503c and the second insulating layer 506d may include a photosensitive organic material. For example, each of the first insulating layer 503c and the second insulating layer 506d may include photosensitive polyimide.

[0177] Both the first insulating layer 503 c and the second insulating layer 506 d of the digitizer 500 d include a photosensitive organic material, and thus the thickness Tk1 d of the digitizer 500 d can be further reduced than that of the digitizer in the above-described embodiment.

[0178] FIG. 11A to FIG. 11E is a schematic cross-sectional view illustrating a part of a method for manufacturing a display device according to an embodiment.

[0179] Reference Fig.11A , providing a first flexible copper clad laminate 500f1. The first flexible copper clad laminate 500f1 may include a base film 501 and a copper clad layer 502p. The resist layer 3000 may be laminated on the copper clad layer 502p. The resist layer 3000 may include a dry film resist or be formed by a dry film resist. For example, the dry film resist is laminated on the first flexible copper clad laminate 500f1, and then, when the protective film of the dry film resist is peeled off, the resist layer 3000 may be laminated on the copper clad layer 502p. Thereafter, the copper clad layer 502p may be patterned by an exposure process and a development process.

[0180] Reference Fig.11A and Fig. 11B , patterning the copper clad layer 502p to form the first conductive layer 502. The second flexible copper clad board 500f2 overlaps the first conductive layer 502 and is attached to the base film 501. The second flexible copper clad board 500f2 may include an adhesive layer 503P, an intermediate base film 504P, and a copper clad layer 5051P. Figure 7 In the digitizer 500a shown, the second flexible copper-clad board 500f2 may include only an adhesive layer 503P and a copper-clad layer 5051P.

[0181] Thereafter, the portion of the second flexible copper clad laminate 500f2 overlapping the hole region 11A may be removed. For example, the portion of the second flexible copper clad laminate 500f2 overlapping the hole region 11A may be removed by a process such as laser cutting.

[0182] Reference Fig. 11C In the embodiment, the intermediate conductive layer 5052P is plated on the copper clad layer 5051P. The intermediate conductive layer 5052P may be filled in the opening CH1 passing through the adhesive layer 503P, the intermediate base film 504P, and the copper clad layer 5051P.

[0183] Reference Fig.11D , the resist layer 3100 may be stacked on the intermediate conductive layer 5052P. The resist layer 3100 may be formed of a dry film resist. Thereafter, the intermediate conductive layer 5052P and the copper clad layer 5051P may be patterned by an exposure process and a development process.

[0184] Reference Fig.11D and Fig.11E , the intermediate conductive layer 5052P and the copper clad layer 5051P may be patterned to form the second conductive layer 505. The copper clad layer 5051P may be patterned to form the first sub-conductive layer 5051, and the intermediate conductive layer 5052P may be patterned to form the second sub-conductive layer 5052.

[0185] The overcoat 500c1 is disposed on the second conductive layer 505. The overcoat 500c1 may include a second adhesive layer 506 and a cover layer 507. After the overcoat 500c1 is temporarily attached to the second conductive layer 505, the overcoat 500c1 may be press-bonded to the second conductive layer 505 and the intermediate base film 504.

[0186] Reference Fig.11F , the digitizer 500 is coupled to the display panel 100 . For example, the digitizer 500 may be attached to the lower protective film 400 through the fourth adhesive layer 1040 .

[0187] The upper surface 500US of the digitizer 500 in contact with the fourth adhesive layer 1040 may be flat. Therefore, the process of adding a flattening layer to flatten the digitizer 500 may be omitted. Figure 1A ) When the digitizer 500 is repeatedly folded, the buckling phenomenon caused by the planarization layer can be prevented. Omitting the planarization layer can reduce the thickness of the digitizer 500, and thus can improve the folding performance and the display device 1000 (see Figure 1A ) reliability issues.

[0188] Both the first conductive layer 502 and the second conductive layer 505 may be disposed below the base film 501. For example, both the first conductive layer 502 and the second conductive layer 505 may be spaced apart from the display panel 100, with the base film 501 between the first conductive layer 502 and the second conductive layer 505 and the display panel 100. Thus, the first conductive layer 502 and the second conductive layer 505 may be spaced apart from the display device 1000 (see Figure 1A )’s exterior is less visible (or may be invisible).

[0189] Fig.12 is a schematic cross-sectional view showing a part of the configuration of a display device according to an embodiment.

[0190] Reference Fig.12 The digitizer 500e may further include a third adhesive layer 508 and a magnetic shielding layer 509. The magnetic shielding layer 509 may shield the display device 1000 (see Figure 1A ) in the electronic module. Accordingly, the sensing sensitivity of the digitizer 500e can be enhanced.

[0191] As described above, the surface of the digitizer (e.g., the upper surface of the digitizer) is flat, and thus the process for flattening the digitizer can be omitted. Accordingly, in the case of repeatedly folding the display device, the buckling phenomenon caused by the flattening layer can be prevented. Since the flattening layer is omitted, the thickness of the digitizer can be reduced to enhance the folding performance, and the reliability problem of the display device that may be caused by the increase in the thickness of the digitizer can be reduced.

[0192] All conductive layers of the digitizer may be separated from the display panel, and the base film of the digitizer is between all conductive layers of the digitizer and the display panel. Therefore, the conductive layer may be less visible or may not be visible from the outside of the display device.

[0193] Although the inventive concept has been described with reference to the embodiments of the present disclosure, it should be understood that the present disclosure should not be limited to these preferred embodiments, but various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the present disclosure.

[0194] Therefore, the claimed invention of the present disclosure is not intended to be limited to what is set forth in the detailed description of the specification, but rather is intended to be defined by the appended claims.

Claims

1. A display device, comprising: A window including a glass substrate; A display panel, disposed below the window; as well as A digitizer is arranged below the display panel, wherein: The digitizer comprises: A base film, disposed below the display panel; A first conductive layer is disposed below the base film; A first insulating layer, disposed below the first conductive layer; a second conductive layer, disposed below the first insulating layer; and a second insulating layer disposed below the second conductive layer, and The window, the display panel and the digitizer are capable of folding and unfolding, in: The digitizer further includes an upper surface and a lower surface, The upper surface of the digitizer faces the display panel, and In the unfolded state, the upper surface of the digitizer is flat and the lower surface of the digitizer is uneven.

2. The display device according to claim 1, wherein: The thickness of the first conductive layer is greater than the thickness of the second conductive layer.

3. The display device according to claim 1, wherein: The second conductive layer comprises: a first sub-conductive layer, disposed below the first insulating layer; and The second sub-conductive layer is arranged below the first sub-conductive layer.

4. The display device according to claim 3, wherein: Each of the first sub-conductive layer and the first insulating layer includes an opening, and The second sub-conductive layer is in electrical contact with the first conductive layer through the opening of each of the first sub-conductive layer and the first insulating layer.

5. The display device according to claim 3, wherein: The first sub-conductive layer directly contacts the first insulating layer.

6. The display device according to claim 1, wherein: The digitizer further includes an intermediate base film disposed between the second conductive layer and the first insulating layer.

7. The display device according to claim 6, wherein: Each of the base film and the intermediate base film includes polyimide.

8. The display device according to claim 1, wherein: Each of the first insulating layer and the second insulating layer includes a pressure-sensitive adhesive film.

9. The display device according to claim 1, wherein: One of the first insulating layer and the second insulating layer includes photosensitive polyimide, and The other of the first insulating layer and the second insulating layer is a pressure-sensitive adhesive film.

10. The display device according to claim 1, wherein: The digitizer further includes a cover layer disposed below the second insulating layer.

11. The display device according to claim 1, wherein: The number of the second conductive layers is greater than the number of the first conductive layers.

12. The display device according to claim 1, wherein: The display panel and the digitizer are folded inwardly so that a first portion of the display panel and a second portion of the display panel face each other.

13. The display device according to claim 1, wherein: The display panel comprises: a sensor layer that senses an external input from outside the display device; and A display layer is provided below the sensor layer and displays an image, and the display layer is provided between the sensor layer and the digitizer.

14. The display device according to claim 1, further comprising a protective film disposed between the display panel and the digitizer, wherein: The display panel is attached to the protective film, and The base film of the digitizer is attached to the protective film.

15. The display device according to claim 1, wherein: The lower surface of the digitizer is spaced apart from the display panel, The upper surface of the digitizer is disposed between the display panel and the lower surface of the digitizer.

16. A display device comprising: a sensor layer for sensing input from outside of the display device; A display layer, disposed below the sensor layer and displaying an image toward the sensor layer; as well as a digitizer disposed below the display layer and comprising an upper surface facing the display layer and a lower surface spaced apart from the display layer, wherein: The upper surface of the digitizer is disposed between the display layer and the lower surface of the digitizer, The upper surface of the digitizer is flat, and The lower surface of the digitizer is uneven.

17. The display device according to claim 16, wherein: The digitizer comprises: a base film disposed below the display layer and adjacent to the upper surface of the digitizer; A first conductive layer, disposed below the base film; A first insulating layer, disposed below the first conductive layer; a second conductive layer, disposed below the first insulating layer; and a second insulating layer, disposed below the second conductive layer, Wherein, the sensor layer, the display layer and the digitizer are capable of being folded and unfolded.

18. The display device according to claim 17, wherein: The digitizer further includes an intermediate base film disposed between the second conductive layer and the first insulating layer.

19. The display device according to claim 18, wherein: The second conductive layer comprises: a first sub-conductive layer contacting the intermediate base film; and a second sub-conductive layer, disposed below the first sub-conductive layer, Each of the first sub-conductive layer, the intermediate base film, and the first insulating layer includes an opening, and The second sub-conductive layer is in electrical contact with the first conductive layer through the opening of each of the first sub-conductive layer, the intermediate base film, and the first insulating layer.

20. The display device according to claim 18, wherein: Each of the first insulating layer and the second insulating layer includes a pressure-sensitive adhesive film or a photosensitive polyimide.

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