Electronic device

Abstract

The present application relates to an electronic device. The electronic device includes a display module divided into a curved area and a non-curved area arranged in a first direction, and having a front surface and a rear surface opposite the front surface; a cover member covering a portion of the curved area and disposed on the front surface; a first protection member disposed on the rear surface to overlap the non-curved area; a second protection member disposed on the rear surface to overlap the curved area and spaced apart from the first protection member; a driving element disposed on the front surface to overlap the curved area; and a reinforcement disposed between the cover member and the driving element on the front surface. The curved area is capable of being bent along a virtual bending axis extending in a second direction perpendicular to the first direction, and the cover member and the reinforcement expose a portion of the front surface through a space therebetween.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0087409, filed on July 15, 2020, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates herein to an electronic device, and more specifically, to an electronic device with improved reliability. Background Technology

[0004] Electronic devices are activated based on electrical signals. Electronic devices may include devices composed of various electronic components, such as display units that display images or input sensing units that sense external input. These electronic components can be electrically connected to each other via signal lines arranged in different ways.

[0005] The signal lines can be configured in various quantities depending on the number of electronic components or the processing environment, and are designed to be curved and arranged in a suitable space to prevent electrical signal interference within a predetermined panel area. Summary of the Invention

[0006] This disclosure provides an electronic device in which a protective member and a reinforcing member are provided with predetermined spaces therein, thereby preventing defects from occurring when bent.

[0007] An embodiment of the present invention provides an electronic device comprising: a display module divided into a curved region and a non-curved region arranged in a first direction, and having a front surface and a rear surface facing the front surface; a cover member covering a portion of the curved region and disposed on the front surface; a first protective member disposed on the rear surface and overlapping the non-curved region; a second protective member disposed on the rear surface, overlapping the curved region and spaced apart from the first protective member; a drive element disposed on the front surface and overlapping the curved region; and a reinforcement disposed on the front surface between the cover member and the drive element, wherein the curved region is bendable along a virtual bending axis extending in a second direction perpendicular to the first direction, and the cover member and the reinforcement expose a portion of the front surface through the space between the cover member and the reinforcement.

[0008] The distance in the first direction from the side surface of the second protective member facing the side surface of the first protective member to the side surface of the adjacent cover member of the reinforcing member may be about 2.0 mm or more.

[0009] The reinforcement can be attached to the front surface via an adhesive layer.

[0010] The side surface of the adjacent cover member of the reinforcement can be aligned with the side surface of the adjacent cover member of the adhesive layer.

[0011] The reinforcement may include a first portion that overlaps with the adhesive layer and a second portion that protrudes from the first portion toward the cover member.

[0012] The side surface of the second part may be inclined relative to the side surface of the adjacent cover member of the adhesive layer.

[0013] The reinforcing components may include stainless steel.

[0014] The covering member may include a first covering portion adjacent to the non-bending area and a second covering portion extending from the first covering portion, and when the display module is not bent, the upper surface of the second covering portion may be inclined from the first covering portion toward the reinforcement.

[0015] The electronic device may also include a functional layer disposed between the first protective member and the second protective member when the electronic device is bent along a virtual bending axis, and the functional layer may include at least one of a light blocking layer, a heat dissipation layer and a buffer layer.

[0016] The display module may include: a display panel having multiple pixels; and an input sensing panel directly disposed on the display panel and sensing external input.

[0017] The input sensing panel may include: a first sensing insulating layer in contact with a display panel; a first conductive layer disposed on the first sensing insulating layer; a second sensing insulating layer disposed on the first sensing insulating layer and covering the first conductive layer; a second conductive layer disposed on the second sensing insulating layer; and a third sensing insulating layer disposed on the second sensing insulating layer and covering the second conductive layer.

[0018] The reinforcement may surround at least a portion of the drive element.

[0019] The electronic device may also include: a flexible circuit board disposed on the front surface and overlapping the curved area, and a main circuit board connected to the display module via the flexible circuit board.

[0020] In an embodiment of the present invention, an electronic device includes: a display panel divided into a curved region and a non-curved region arranged in a first direction, and having a front surface for displaying an image and a rear surface facing the front surface; an input sensing panel for sensing external input, disposed on the front surface and overlapping the non-curved region; a cover member covering a portion of the curved region and disposed on the front surface; a first protective member disposed on the rear surface overlapping the non-curved region; a second protective member disposed on the rear surface, overlapping the curved region and spaced apart from the first protective member; a drive element disposed on the front surface and overlapping the curved region; and a reinforcement disposed on the front surface between the cover member and the drive element, wherein the curved region is bendable along a virtual bending axis extending along a second direction perpendicular to the first direction, and the cover member and the reinforcement expose a portion of the front surface through the space between the cover member and the reinforcement.

[0021] The distance from the side surface of the second protective member facing the side surface of the first protective member to the side surface of the adjacent cover member of the reinforcing member in the first direction may be about 2.0 mm or greater.

[0022] The reinforcement can be attached to the front surface via an adhesive layer.

[0023] The side surface of the adjacent cover member of the reinforcement can be aligned with the side surface of the adjacent cover member of the adhesive layer.

[0024] The reinforcement may include a first portion that overlaps with the adhesive layer and a second portion that protrudes from the first portion toward the cover member.

[0025] The side surface of the second part may be inclined relative to the side surface of the adjacent cover member of the adhesive layer.

[0026] The input sensing panel may include: a first sensing insulating layer in contact with a display panel; a first conductive layer disposed on the first sensing insulating layer; a second sensing insulating layer disposed on the first sensing insulating layer and covering the first conductive layer; a second conductive layer disposed on the second sensing insulating layer; and a third sensing insulating layer disposed on the second sensing insulating layer and covering the second conductive layer. Attached Figure Description

[0027] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0028] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present invention.

[0029] Figure 2A This is an exploded perspective view of an electronic device according to an embodiment of the concept of the present invention;

[0030] Figure 2B This is a block diagram of an electronic device according to an embodiment of the present invention.

[0031] Figure 3A This is a cross-sectional view of a display module according to an embodiment of the present invention;

[0032] Figure 3B yes Figure 3A An enlarged cross-sectional view of the display module;

[0033] Figure 4 This is a plan view of a display panel according to an embodiment of the present invention.

[0034] Figure 5 This is a plan view of an input sensing panel according to an embodiment of the present invention;

[0035] Figure 6 This is a cross-sectional view of an electronic device according to an embodiment of the present invention;

[0036] Figure 7 This is a rear view of an electronic device according to an embodiment of the present invention;

[0037] Figure 8 It is along Figure 2A The sectional view shown is taken by line I-I'.

[0038] Figure 9 This is a cross-sectional view of components of an electronic device according to an embodiment of the present invention; and

[0039] Figure 10 This is a cross-sectional view of a component of an electronic device according to another embodiment of the concept of the present invention. Detailed Implementation

[0040] In this disclosure, when an element (or region, layer, portion, etc.) is referred to as being “on”, “connected to”, or “linked to” another element, it means that the element may be directly disposed on / directly connected to / directly linked to the other element, or that a third element may be disposed between them.

[0041] The same reference numerals denote the same elements. Furthermore, in the figures, the thickness, scale, and dimensions of elements are exaggerated for the purpose of effectively describing the technical content. As used herein, “about” or “approximately” includes the value and the average of the specific value within an acceptable range of deviations determined by a person skilled in the art considering the measurements discussed and the errors associated with the measurement of the specific quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, or ±5%.

[0042] The terminology used herein is for the purpose of describing particular implementations only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms (including “at least one”) unless otherwise clearly indicated. “At least one” should not be construed as limiting “a” or “an.” “Or” means “and / or.” The term “and / or” includes all combinations that may define one or more of the relevant configurations.

[0043] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element without departing from the scope of exemplary embodiments of the inventive concept, and similarly, a second element may be referred to as a first element. Singular terms may include plural forms unless the context clearly indicates otherwise.

[0044] Furthermore, terms such as "below," "down," "above," and "up" are used to describe the relationships of the configurations shown in the accompanying drawings. These terms are used as relative concepts and are described with reference to the directions indicated in the accompanying drawings.

[0045] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It will also be understood that terms defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and shall not be interpreted in an ideal or overly formal sense unless expressly defined herein.

[0046] It should be understood that the terms "comprising" or "having" are intended in this disclosure to indicate the presence of the stated features, integrals, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, or combinations thereof. Embodiments of the inventive concept will be described below with reference to the accompanying drawings.

[0047] Figure 1This is a perspective view of an electronic device according to an embodiment of the present invention. Figure 2A This is an exploded perspective view of an electronic device according to an embodiment of the present invention. Figure 2B This is a block diagram of an electronic device according to an embodiment of the present invention.

[0048] Reference Figure 1 and Figure 2B An electronic device EA can be a device activated by an electrical signal. The electronic device EA can include various implementations. For example, the electronic device EA can be used not only for large electronic devices such as televisions, monitors, or billboards, but also for small and medium-sized electronic devices such as personal computers, laptops, personal digital terminals, car navigation units, game consoles, portable electronic devices, and cameras. Furthermore, these are presented only as examples, and therefore the electronic device EA can be used for other electronic devices without departing from the inventive concept. In this embodiment, a smartphone is exemplarily shown as an electronic device EA.

[0049] The electronic device EA can display an image IM on a display surface FS parallel to the first direction DR1 and the second direction DR2, facing a third direction DR3. The image IM can include still images and moving images. Figure 1 An example of a viewing window and icon as an image IM is shown. The display surface FS on which the image IM is displayed can correspond to the front surface of the electronic device EA and the front surface of the window panel WP.

[0050] In this implementation, the front surface (in other words, the upper surface) and the rear surface (in other words, the lower surface) of each component are defined relative to the direction along which it displays the image IM. The front and rear surfaces may be opposite each other on a third direction DR3, and the normal direction of each of the front and rear surfaces may be parallel to the third direction DR3.

[0051] The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and can be changed to other directions. In this specification, "on a plane" or "in a plan view" can be defined as the view from a third direction towards DR3.

[0052] The electronic device EA may include a window panel WP, an anti-reflective panel RPP, a display module DM, a cover member CM, a reinforcement ST, a drive element F-IC, a drive control unit DCM, protective members PF1 and PF2, a functional layer MP, an electronic module EM, a power module PSM, and a housing HU. In some embodiments, the window panel WP and the housing HU may be combined to form the appearance of the electronic device EA.

[0053] Window panel WP may include optically transparent insulating materials. For example, window panel WP may include glass or plastic. Window panel WP may have a multi-layer structure or a single-layer structure. For example, window panel WP may include multiple plastic films bonded together by adhesive, or it may include a glass substrate and plastic films bonded together by adhesive.

[0054] As described above, the display surface FS of the window panel WP can define the front surface of the electronic device EA. The transmissive region TA can be an optically transparent region. For example, the transmissive region TA can be a region with a visible light transmittance of about 90% or more.

[0055] The border region BZA can be a region with relatively lower light transmittance than the transmission region TA. The border region BZA can define the outer shape of the transmission region TA. The border region BZA can be adjacent to and surround the transmission region TA.

[0056] The border area BZA can be defined by the border pattern WM, which will be described later (see [link]). Figure 6 The border area BZA may cover the peripheral area NAA of the display module DM to prevent the peripheral area NAA from being seen from the outside. However, this is shown exemplarily, and in a window panel WP according to another embodiment of the present invention, the border area BZA may be omitted.

[0057] An anti-reflective panel RPP can be disposed below the window panel WP. The anti-reflective panel RPP can reduce the reflectivity of external light incident from the window panel WP. In embodiments of the present invention, the anti-reflective panel RPP can be omitted and can be configured to be included in the display module DM.

[0058] The display module DM can display an image IM and sense external input. The display module DM may include a front surface IS having an active area AA and a peripheral area NAA. The active area AA can be an area that is activated according to an electrical signal.

[0059] In this implementation, the effective area AA can be an area for displaying the image IM, or it can be an area for sensing external input. The transmission area TA can overlap with the front surface IS or at least a portion of the effective area AA.

[0060] Therefore, the user can view the image IM or provide external input through the transmission area TA. However, this is only shown as an example, and in the display module DM according to an embodiment of the present invention, the area for displaying the image IM and the area for sensing external input can be separated from each other in the effective area AA, and are not limited to any of the above embodiments.

[0061] The peripheral area NAA can be the area covered by the border area BZA. The peripheral area NAA can be adjacent to the active area AA. The peripheral area NAA can surround the active area AA. The driving element or driving wiring used to drive the active area AA can be set in the peripheral area NAA.

[0062] The display module (DM) may include a display panel (DP) and an input sensing panel (ISP). The display panel (DP) can be configured to essentially generate an image (IM). The image (IM) generated by the display panel (DP) can be viewed by the user externally through the transmission area (TA).

[0063] External input can include various forms of input provided from outside the electronic device EA. For example, external input can include external input applied when approaching or being near the electronic device EA at a predetermined distance (e.g., hovering), and contact with a part of the body (such as a user's hand). Furthermore, external input can take various forms such as force, pressure, and light, and is not limited to any of the above embodiments.

[0064] A cover member CM is disposed on the display module DM. For example, the cover member CM may be disposed on the display panel DP and overlap with the peripheral area NAA. The cover member CM can alleviate stress generated when the portion of the display panel DP that overlaps with the peripheral area NAA is bent. The cover member CM comprises a synthetic resin. For example, the cover member CM may comprise at least any one of acrylonitrile butadiene styrene copolymer (“ABS”), polyurethane acrylate (“UA”), polyurethane (“PU”), polyethylene (“PE”), ethylene vinyl acetate (“EVA”), and polyvinyl chloride (“PVC”).

[0065] The driving element F-IC is disposed on the display module DM. For example, the driving element F-IC can be disposed on the portion of the display panel DP that overlaps with the peripheral area NAA, and can be disposed spaced apart from the cover member CM.

[0066] The driving element F-IC may include driving elements for driving the display module DM. For example, the driving element F-IC may include a timing controller that controls the display panel DP included in the display module DM. The timing controller can receive input image signals and convert them into image data to be displayed by pixels. Furthermore, the timing controller can receive various control signals, such as vertical synchronization signals, horizontal synchronization signals, master clock signals, and data enable signals, and can output a signal corresponding to each of these signals.

[0067] Furthermore, the driving element F-IC may also include a circuit unit that controls the input sensing panel ISP, and is not limited to any of the above embodiments.

[0068] The drive control unit (DCM) may include a main circuit board (MCB) and a flexible circuit board (FCB). The DCM can be electrically connected to the display module (DM) to control the display panel (DP) and the input sensing panel (ISP). The FCB can be connected to one end of the display panel (DP) to connect the main circuit board (MCB) to the drive element (F-IC).

[0069] The main circuit board (MCB) may also include multiple electronic components mounted on it. These electronic components are electrically connected via circuit wiring. The MCB can be electrically connected to the display module (DM) connected to the driving element (F-IC) via a flexible circuit board (FCB).

[0070] In addition, the main circuit board (MCB) may also include a protective cover covering the electronic components. The protective cover may be made of metal and can be soldered to the main circuit board (MCB). The main circuit board (MCB) can be electrically connected to the motherboard of the electronic module (EM) via a connector (not shown). The flexible circuit board (FCB) may include a flexible film, multiple circuit traces disposed on the flexible film, and pads corresponding to pads included in the display panel (DP).

[0071] The reinforcing element ST is positioned on the display panel DP. For example, the reinforcing element ST may be positioned between the drive element F-IC and the cover element CM.

[0072] The reinforcing member ST may surround at least a portion of the drive element F-IC (see...). Figure 7 For example, the stiffener ST can surround the remaining surfaces of the drive element F-IC, except for the surface adjacent to the flexible circuit board FCB. Therefore, stress generated when the display panel DP bends in the area where the drive element F-IC is located can be prevented from being transmitted to the drive element F-IC. Thus, a display module DM with improved reliability can be provided. The stiffener ST can include stainless steel.

[0073] Protective components PF1 and PF2 can be disposed on the rear surface of the display panel DP. That is, protective components PF1 and PF2 can be disposed on the surface of the display panel DP opposite to the surface on which the input sensing panel ISP, cover component CM, reinforcing member ST, driving element F-IC and flexible circuit board FCB are disposed.

[0074] The first protective member PF1 and the second protective member PF2 can be arranged to be spaced apart from each other. When the display panel DP is not bent, the first protective member PF1 can overlap with the input sensing panel ISP. When the display panel DP is not bent, the second protective member PF2 can overlap with a portion of the cover member CM, the reinforcing member ST, the driving element F-IC, and the flexible circuit board FCB.

[0075] Protective components PF1 and PF2 may comprise a plastic film as a base layer. The protective components PF1 and PF2 may comprise a plastic film comprising any one selected from the group consisting of: polyethylene terephthalate (“PET”), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (“PP”), polystyrene (“PS”), polyacrylonitrile (“PAN”), styrene-acrylonitrile copolymer (“SAN”), acrylonitrile-butadiene-styrene (ABS), polymethyl methacrylate (“PMMA”), and combinations thereof. The electronic device EA conceived according to the present invention comprises protective components PF1 and PF2 disposed on the rear surface of the display panel DP, and thus can have excellent heat resistance, fatigue strength, and electrical properties, and can be less affected by temperature and humidity.

[0076] The materials forming the protective components PF1 and PF2 are not limited to plastic resins, but may include organic / inorganic composite materials. The protective components PF1 and PF2 may include a porous organic layer and an inorganic material filling the pores of the organic layer.

[0077] The functional layer MP can be disposed on the rear surface of the display panel DP. More specifically, when the display panel DP is bent (see...). Figure 6 In this configuration, the functional layer MP can be disposed between the first protective member PF1 and the second protective member PF2. The functional layer MP may include multiple layers. For example, the functional layer MP may include a light-blocking layer, a heat dissipation layer, a buffer layer, and multiple adhesive layers.

[0078] A light-blocking layer can be used to prevent components disposed on the display module DM from being seen through the effective area AA. Although not shown, the light-blocking layer may include a binder and multiple pigment particles dispersed therein. The pigment particles may include carbon black, etc. An electronic device EA according to an embodiment of the present invention includes a light-blocking layer and can therefore have enhanced light-blocking properties.

[0079] The heat dissipation layer can effectively dissipate the heat generated from the display module (DM). The heat dissipation layer may include, but is not limited to, at least one of graphite, copper (Cu), and aluminum (Al), which have excellent heat dissipation properties. In addition to enhancing heat dissipation, the heat dissipation layer may also possess electromagnetic wave shielding or electromagnetic wave absorption properties.

[0080] The buffer layer can be a synthetic resin foam. The buffer layer may include a matrix and multiple pores. The buffer layer may be elastic and may have a porous structure.

[0081] The matrix may include flexible materials. The matrix may include synthetic resins. For example, the matrix may include at least any one of acrylonitrile butadiene styrene copolymer (ABS), polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA), and polyvinyl chloride (PVC).

[0082] Multiple pores facilitate the absorption of impacts applied to the buffer layer. Because the buffer layer has a porous structure, multiple pores can be defined.

[0083] However, the embodiments of the present invention are not limited to this, and at least one of the light blocking layer, heat dissipation layer and buffer layer may be omitted, and multiple layers may be set as a single layer, and the embodiments of the present invention are not limited to this.

[0084] The electronic module EM includes a motherboard and various functional modules mounted on the motherboard that operate the electronic equipment EA. The motherboard can be electrically connected to the display module DM via a connector (not shown). In this case, the motherboard may include a rigid type of printed circuit board.

[0085] like Figure 2B As shown, the electronic module EM may include a first electronic module EM1 and a second electronic module EM2. The first electronic module EM1 may include a control module 10, a wireless communication module 20, an image input module 30, an audio input module 40, a memory 60, and an external interface 70. The second electronic module EM2 may include an audio output module 50, a light emitting module 80, a light receiving module 90, and a camera module 100. Some of these modules may not be mounted on the motherboard but may be electrically connected to the motherboard via a flexible circuit board.

[0086] The control module 10 controls the overall operation of the electronic device EA. The control module 10 may be a microprocessor. For example, the control module 10 activates or deactivates the display module DM. The control module 10 may control the image input module 30, audio input module 40, audio output module 50, etc., based on touch signals received from the display module DM.

[0087] The wireless communication module 20 can send wireless signals to / receive wireless signals from another terminal using Bluetooth or Wi-Fi. The wireless communication module 20 can also send / receive voice signals using common communication lines. The wireless communication module 20 includes a transmitting unit 22 for modulating and transmitting the signal to be transmitted, and a receiving unit 24 for demodulating the received signal.

[0088] The image input module 30 processes image signals and converts them into image data that can be displayed on the electronic device EA. The audio input module 40 receives external audio signals via a microphone in recording mode, voice recognition mode, etc., and converts the signals into electronic voice data. The audio output module 50 converts audio data received from the wireless communication module 20 or audio data stored in the memory 60 and outputs the audio data to the outside.

[0089] External interface 70 is used as an interface for connecting to an external charger, a wired / wireless data port, a card (e.g., memory card, SIM / UIM card) slot, etc.

[0090] A light emitting module 80 generates and outputs light. The light emitting module 80 can output infrared light. The light emitting module 80 may include LED elements. A light receiving module 90 can sense infrared light. When a predetermined level or higher of infrared light is sensed, the light receiving module 90 can be activated. The light receiving module 90 may include a CMOS sensor. After the infrared light generated in the light emitting module 80 is output, the infrared light is reflected by an external object (e.g., a user's finger or face), and the reflected infrared light can be incident on the light receiving module 90. The camera module 100 captures an external image.

[0091] The power supply module (PSM) provides the power required for the overall operation of the electronic device (EA). The PSM may include a conventional battery module.

[0092] The housing HU houses the display module DM. The housing HU can be integrated with the window panel WP to form the appearance of the electronic device EA. The housing HU absorbs external impacts and prevents foreign matter / moisture from penetrating into the display module DM, thus protecting the components housed within the housing HU. Additionally, although not shown, the housing HU can be configured as a combination of multiple storage components.

[0093] Figure 3A This is a cross-sectional view of a display module according to an embodiment of the present invention. Figure 3B yes Figure 3A An enlarged cross-sectional view of the display module. Figure 4 This is a plan view of a display panel according to an embodiment of the present invention. Figure 5 This is a plan view of an input sensing panel according to an embodiment of the present invention.

[0094] Reference Figure 3A and Figure 3B The display module (DM) may include a display panel (DP) and an input sensing panel (ISP).

[0095] The display panel (DP) may include a base substrate (BS), a circuit element layer (ML-D), a display element layer (EML), and a thin-film encapsulation layer (ECL). The input sensing panel (ISP) may include multiple sensing insulating layers (TIL1, TIL2, and TIL3) and multiple conductive layers (TML1 and TML2).

[0096] The base substrate BS can be a foundation layer on which circuit element layers ML-D, display element layers EML, thin film encapsulation layers ECL, and input sensing panels ISP can be stacked. The base substrate BS can be flexible or rigid, can be a single layer or have a multi-layer structure, and is not limited to any of the above embodiments.

[0097] The circuit element layer ML-D can be disposed on the base substrate BS. The circuit element layer ML-D may include multiple insulating layers, multiple conductive layers, and semiconductor layers. The multiple conductive layers of the circuit element layer ML-D can form signal lines or control circuits for pixels.

[0098] The display element layer (EML) can be disposed on the circuit element layer (ML-D). The display element layer (EML) may include organic light-emitting diodes (OLEDs). However, this is only presented as an example, and the display element layer (EML) according to embodiments of the present invention may include inorganic light-emitting diodes, organic-inorganic light-emitting diodes (OLEDs), or liquid crystal layers.

[0099] The thin-film encapsulation layer ECL may include an organic layer OEL and multiple inorganic layers LIL and UIL for sealing the organic layer OEL. The thin-film encapsulation layer ECL can seal the display element layer EML to prevent moisture and oxygen from being introduced into the display element layer EML.

[0100] Inorganic layers LIL and UIL prevent external moisture or oxygen from penetrating into the display element layer EML. Inorganic layers LIL and UIL can comprise silicon nitride, silicon oxide, or a combination thereof. Inorganic layers LIL and UIL can be formed through a deposition process.

[0101] An organic layer (OEL) can be disposed on the display element layer (EML) to provide a flat surface. Curves or particles formed on the upper surface of the display element layer (EML) can be covered by the organic layer (OEL) to prevent components formed on the organic layer (OEL) (e.g., input sensing panel (ISP)) from being affected.

[0102] The input sensing panel (ISP) is disposed on the thin-film encapsulation layer (ECL). The ISP can be directly disposed on the ECL and formed together with it via a continuous process. The ISP can sense external input using either self-capacitance or mutual capacitance. The sensing patterns included in the ISP can be arranged and connected in different ways depending on the type of sensing pattern.

[0103] The input sensing panel (ISP) may include sensing insulating layers TIL1, TIL2, and TIL3, and at least one conductive layer TML1 and TML2. The sensing insulating layers TIL1, TIL2, and TIL3 may comprise any of inorganic and organic materials.

[0104] The first sensing insulating layer TIL1 can be directly disposed on the second inorganic layer UIL of the thin-film encapsulation layer ECL. The first conductive layer TML1 is disposed on the first sensing insulating layer TIL1. The second sensing insulating layer TIL2 is disposed on the first sensing insulating layer TIL1 and can cover the first conductive layer TML1. The second conductive layer TML2 is disposed on the second sensing insulating layer TIL2. The third sensing insulating layer TIL3 is disposed on the second sensing insulating layer TIL2 and can cover the second conductive layer TML2. However, embodiments of the present invention are not limited to these; the first sensing insulating layer TIL1 can be omitted, the first conductive layer TML1 can be directly disposed on the second inorganic layer UIL, and the invention is not limited to any of the above embodiments.

[0105] The conductive layers TML1 and TML2 according to the embodiments may comprise any one of a single-layer metal and a transparent conductive material. For example, the metal may comprise molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

[0106] The transparent conductive layer may include transparent conductive oxides, such as indium tin oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (ZnO) or indium tin zinc oxide (“ITZO”). Alternatively, the transparent conductive layer may include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0107] Furthermore, conductive layers TML1 and TML2 may comprise multiple metal layers. These multiple metal layers may have a three-layer structure, such as titanium / aluminum / titanium. The multiple conductive layers TML1 and TML2 may comprise at least one metal layer and at least one transparent conductive layer.

[0108] Reference Figure 4 The effective area AA of the display panel DP can be the area where the image is displayed, and the peripheral area NAA can be the area where driving circuits, driving wiring, etc. are set. Within the effective area AA, the light-emitting element of each of multiple pixels PX can be set. The effective area AA can overlap with at least a portion of the transmissive area TA, and the peripheral area NAA can be covered by the border area BZA.

[0109] Multiple signal lines GL, DL, PL, and EL can be connected to pixel PX to send electrical signals to pixel PX. Among the signal lines included in the display panel DP, scan line GL, data line DL, power line PL, and light emission control line EL are exemplarily shown. However, this is presented as an example, and the signal lines GL, DL, PL, and EL according to embodiments of the present invention may also include initialization voltage lines, and are not limited to any of the above embodiments.

[0110] The power pattern VDD can be set in the peripheral area NAA. The power pattern VDD can be connected to multiple power lines PL. Therefore, the display panel DP includes the power pattern VDD, and thus can provide the same first power signal to multiple pixels PX.

[0111] Display pads (PDD) are disposed in the peripheral area (NAA). The display pads (PDD) may include a first pad (D1) and a second pad (D2). Multiple first pads (D1) may be provided, each connected to a data line (DL). The second pad (D2) may be connected to the power pattern (VDD) to electrically connect to the power line (PL). The display panel (DP) is connected to the flexible circuit board (FCB) via the display pads (PDD), thereby providing the pixel (PX) with electrical signals supplied from the main circuit board (MCB). Simultaneously, the display pads (PDD) may also include pads other than the first pads (D1) and the second pads (D2) for receiving other electrical signals, and the embodiments of the present invention are not limited to any of the above embodiments.

[0112] Reference Figure 5 The input sensing panel (ISP) may include multiple sensing electrodes TE1 and TE2, multiple sensing traces TL1, TL2 and TL3, and multiple sensing pads PDT.

[0113] The input sensing panel (ISP) can be divided into an effective area AA-I and an adjacent peripheral area NAA-I. The peripheral area NAA-I can surround the effective area AA-I.

[0114] Multiple sensing electrodes TE1 and TE2 may include a first sensing electrode TE1 and a second sensing electrode TE2.

[0115] First sensing electrodes TE1 may extend along a first direction DR1 and may be arranged in multiples to be arranged along a second direction DR2. Each first sensing electrode TE1 may include a first sensing pattern SP1 and a first bridging pattern BP1. The first sensing pattern SP1 may be arranged along the first direction DR1. At least one first bridging pattern BP1 may be connected to two adjacent first sensing patterns SP1.

[0116] The second sensing electrode TE2 may extend along the second direction DR2 and may be arranged in multiple configurations to be arranged along the first direction DR1. The second sensing electrode TE2 may include a second sensing pattern SP2 and a second bridging pattern BP2. The second sensing pattern SP2 may be arranged along the second direction DR2. At least one second bridging pattern BP2 may extend from two adjacent second sensing patterns SP2.

[0117] Sensing wiring TL1, TL2, and TL3 can be located in the peripheral area NAA-I. Sensing wiring TL1, TL2, and TL3 may include a first sensing wiring TL1, a second sensing wiring TL2, and a third sensing wiring TL3.

[0118] The first sensing wiring TL1 can be connected to the second sensing electrode TE2. The second sensing wiring TL2 can be connected to one end of the first sensing electrode TE1. The third sensing wiring TL3 can be connected to the other end of the first sensing electrode TE1. The other end of the first sensing electrode TE1 can be the portion opposite to one end of the first sensing electrode TE1.

[0119] According to an embodiment of the present invention, the first sensing electrode TE1 can be connected to the second sensing wiring TL2 and the third sensing wiring TL3. Therefore, for the first sensing electrode TE1, which has a relatively longer length than the second sensing electrode TE2, sensitivity can be maintained uniformly according to the region. However, this is presented as an example, and the third sensing wiring TL3 according to an embodiment of the present invention can be omitted, and is not limited to any of the above embodiments.

[0120] The sensing pad PDT can be located in the peripheral area NAA-I. The sensing pad PDT may include a first sensing pad TP1, a second sensing pad TP2, and a third sensing pad TP3. The first sensing pad TP1 can be connected to a first sensing trace TL1 to be electrically connected to a second sensing electrode TE2. The second sensing pad TP2 can be connected to a second sensing trace TL2. The third sensing pad TP3 can be connected to a third sensing trace TL3. Therefore, the second sensing pad TP2 and the third sensing pad TP3 can be electrically connected to the first sensing electrode TE1.

[0121] However, the embodiments of the present invention are not limited to this, and the sensing pads PDT of the input sensing panel ISP can be disposed on the same layer as the display pads PDD of the display panel DP through contact holes defined in the sensing insulating layer, and are not limited to any of the above embodiments.

[0122] Figure 6 This is a cross-sectional view of an electronic device according to an embodiment of the present invention. Figure 7 This is a rear view of an electronic device according to an embodiment of the present invention. Figure 8 It is along Figure 2A The cross-sectional view shown is taken along line I-I'. (For...) Figures 1 to 5 Configurations that are identical or similar to those in the figure are assigned the same or similar reference numerals, and redundant descriptions are omitted.

[0123] Reference Figure 6 The window panel WP may include a base window WB and a frame pattern WM. The base window WB may include an optically transparent insulating material. For example, the base window WB may include a glass substrate or a synthetic resin film. An anti-fingerprint layer and a hard coating for protecting the base window WB may be provided on the front and back surfaces of the base window WB. Furthermore, in an embodiment, the base window WB may have chamfered edges.

[0124] A border pattern (WM) may define the border area (BZA) of a window panel (WP). The border pattern (WM) is a colored layer and can be formed by an application method. The border pattern (WM) may include a polymer resin and pigments mixed with the polymer resin. The polymer resin may be, for example, an acrylic-based resin or a polyester, and the pigment may be a carbon-based pigment.

[0125] In an embodiment of the invention, a portion of the display module DM can be bent to be housed within a housing HU. For example, a region of the display panel DP that does not overlap with the input sensing panel ISP when the display panel DP is not bent can be bent along a virtual bending axis AX extending in a second direction DR2. Therefore, the display panel DP can be divided into a bent region BA and a non-bent region NBA along a first direction DR1. The non-bent region NBA is the portion of the display panel DP extending from the boundary between the bent region BA and the non-bent region NBA to one end of the display panel DP in the first direction DR1. The bent region BA is the remaining portion of the display panel DP extending from the boundary to the other end of the display panel DP in the first direction DR1 opposite to that end. The display panel DP may include a front surface DP-U and a rear surface DP-B.

[0126] In this embodiment, the covering member CM, the reinforcing member ST, and the driving element F-IC can be disposed on the front surface DP-U of the display panel DP, and the first protective member PF1 and the second protective member PF2 can be disposed on the rear surface DP-B of the display panel DP.

[0127] A cover member CM covers a portion of the curved area BA and is disposed on the front surface DP-U of the display panel DP. A first protective member PF1 is disposed on the rear surface DP-B of the display panel DP and overlaps with the non-curved area NBA, and a second protective member PF2 is disposed on the rear surface DP-B of the display panel DP, overlaps with the curved area BA, and is spaced apart from the first protective member PF1. A drive element F-IC is disposed on the front surface DP-U of the display panel DP and overlaps with the curved area BA, and a reinforcement ST is disposed on the front surface DP-U between the cover member CM and the drive element F-IC to cover at least one side portion of the drive element F-IC.

[0128] The reinforcing member ST and the cover member CM can be arranged to be spaced apart from each other by a predetermined space PS therebetween. Therefore, a portion of the front surface DP-U of the display panel DP, as much as the space PS, of DP-N (exposed surface) can be exposed between the reinforcing member ST and the cover member CM.

[0129] According to the present invention, adhesive layers AM1 to AM6 can be disposed between corresponding components. For example, the first adhesive layer AM1 can be disposed between the window panel WP and the anti-reflective panel RPP to bond the window panel WP and the anti-reflective panel RPP. The second adhesive layer AM2 can be disposed between the anti-reflective panel RPP and the input sensing panel ISP to bond the anti-reflective panel RPP and the input sensing panel ISP. The third adhesive layer AM3 can be disposed between the display panel DP and the first protective member PF1 to bond the display panel DP and the first protective member PF1. The fourth adhesive layer AM4 can be disposed between the first protective member PF1 and the functional layer MP to bond the first protective member PF1 and the functional layer MP. The fifth adhesive layer AM5 can be disposed between the functional layer MP and the second protective member PF2 to bond the functional layer MP and the second protective member PF2. The sixth adhesive layer AM6 can be disposed between the second protective member PF2 and the display panel DP to bond the second protective member PF2 and the display panel DP.

[0130] The adhesive layers AM1 to AM6 conceived according to the present invention can be transparent adhesive layers, such as pressure-sensitive adhesive (“PSA”) films, optically transparent adhesive (“OCA”) films, or optically transparent resins (“OCR”).

[0131] According to the present invention, when a portion of the display panel DP bends, the bending may be affected by a reinforcing member ST, which includes stainless steel. For example, in terms of rigidity, the display panel DP with the reinforcing member ST attached may be more robust than a display panel without the reinforcing member ST attached. Therefore, the display panel DP with the reinforcing member ST attached may interfere with components provided on the rear surface DP-B of the display panel DP. For example, the display panel DP may be dented by the side surface PF2-S of the second protective member PF2 provided on the rear surface DP-B.

[0132] Reference Figure 7 The circuit incorporates a high-capacity power supply module (PSM), which increases the size of the PSM and consequently reduces the spacing TH between the PSM and the main circuit board (MCB) in the first direction DR1. Consequently, the space PS between the reinforcing member ST and the covering member CM decreases, leading to interference between them.

[0133] Reference Figure 8 The reinforcing member ST-A can be disposed on the front surface DP-U of the display panel DP, and an adhesive layer AD is present therebetween. In this embodiment, the side surface SS of the adjacent cover member CM of the reinforcing member ST-A can be aligned (i.e., coplanar) with the side surface of the adjacent cover member CM of the adhesive layer AD. The alignment in this inventive concept may include errors (i.e., deviations) in the manufacturing process.

[0134] The adhesive layer AD can be a transparent adhesive layer, such as a pressure-sensitive adhesive (PSA) film, an optically transparent adhesive (OCA) film, or an optically transparent resin (OCR).

[0135] The reinforcing member ST-A of this invention can be positioned at a predetermined distance from the side surface PF2-S of the second protective member PF2 in the first direction DR1. According to this invention, the distance TT from the side surface PF2-S of the second protective member PF2 facing the first protective member PF1 to the side surface SS of the adjacent covering member CM of the reinforcing member ST-A can be approximately 2 millimeters (mm) or greater.

[0136] [Table 1]

[0137] <Comparative Example 0> <Comparative Example 1> <Comparative Example 2> <Comparative Example 3> Reinforcing components (O / X) X O O O Distance TT (mm) 1.66 2.00 2.11 [defect] X O X X

[0138] Referring to Table 1, [Defect] indicates experimental data showing whether repeated bending of the bending area BA of the display panel DP results in a depression on the rear surface DP-B of the display panel DP due to the second protective member PF2. Comparative Example 0 is the case where the bending area BA of the display panel DP is bent multiple times without the reinforcement ST-A attached. Compared to the display panel DP with the reinforcement ST-A attached, the display panel DP without the reinforcement ST-A attached is relatively weaker in rigidity, thus having improved bending characteristics. Therefore, the defect of the rear surface DP-B of the display panel DP being depressed due to the second protective member PF2 can be prevented.

[0139] Comparative Examples 1 to 3 show cases where the bending area BA of the display panel DP was bent multiple times when the reinforcement ST-A was attached to the display panel DP.

[0140] As in Comparative Example 1, when the distance TT from the side surface PF2-S of the second protective member PF2 facing the side surface PF1-S of the first protective member PF1 to the side surface SS of the adjacent cover member CM of the reinforcement ST-A is about 1.66 mm, a defect may occur where the rear surface DP-B of the display panel DP is recessed due to the second protective member PF2.

[0141] As in Comparative Examples 2 and 3, when the distance TT from the side surface PF2-S of the second protective member PF2 facing the side surface PF1-S of the first protective member PF1 to the side surface SS of the adjacent cover member CM of the reinforcement ST-A is about 2.00 mm or greater, it may not result in a defect of recessed rear surface DP-B of the display panel DP due to the second protective member PF2.

[0142] According to the present invention, the reinforcing member ST-A is positioned at a predetermined distance from the side surface PF2-S of the second protective member PF2 (which is configured to overlap with the curved area BA of the display panel DP), and thus defects caused by interference between the second protective member PF2, which is disposed on the rear surface DP-B of the display panel DP, and the display panel DP can be prevented. Therefore, an electronic device EA with improved reliability can be provided.

[0143] In this embodiment, the covering member CM may include a first covering portion CP and a second covering portion CC. The first covering portion CP may be relatively closer to the non-curved region NBA than the second covering portion CC. The second covering portion CC may extend from the first covering portion CP. The upper surface of the second covering portion CC may be inclined in the direction from the first covering portion CP toward the reinforcing member ST-A. That is, the thickness of the second covering portion CC in the thickness direction of the display panel DP gradually decreases along the direction from the first covering portion CP to the reinforcing member ST-A.

[0144] Furthermore, in the present invention, the distance TT from the side surface PF2-S of the second protective member PF2 facing the side surface PF1-S of the first protective member PF1 to the side surface SS of the adjacent covering member CM of the reinforcing member ST-A can be about 2.5 mm or less.

[0145] Figure 9 This is a cross-sectional view of components of an electronic device according to an embodiment of the present invention. Figure 10 This is a cross-sectional view of components of an electronic device according to an embodiment of the present invention. Figure 9 and Figure 10 It is along Figure 2A Other embodiments of the cross-sectional view taken by line I-I' shown. For... Figures 1 to 8 Configurations that are identical or similar to those in the figure are assigned the same or similar reference numerals, and redundant descriptions are omitted.

[0146] Reference Figure 9 In this embodiment, the reinforcing member ST-B may include a first portion T1 and a second portion T2. ​​The first portion T1 may overlap with the adhesive layer AD, and the second portion T2 may not overlap with the adhesive layer AD. The second portion T2 may protrude from the first portion T1 toward the covering member CM, i.e., protrude in the first direction DR1.

[0147] Reference Figure 10 In this embodiment, the reinforcing member ST-C may include a first portion T3 and a second portion T4. The first portion T3 may overlap with the adhesive layer AD, and the second portion T4 may not overlap with the adhesive layer AD. The second portion T4 may protrude from the first portion T3 toward the covering member CM, i.e., protrude in the first direction DR1.

[0148] exist Figure 10 In this embodiment, the side surface SS of the second portion T4 may be inclined in a direction toward the side surface of the adjacent cover member CM of the adhesive layer AD. In other words, the side surface SS of the second portion T4 may be inclined relative to the plane of the side surface of the adjacent cover member CM of the adhesive layer AD.

[0149] According to the embodiment, the reinforcing members ST-B and ST-C are spaced apart from the front surface DP-U of the display panel DP by an adhesive layer AD along the third direction DR3, and include second portions T2 and T4 protruding from the adhesive layer AD, and therefore even if the size of the power module PSM is such as Figure 7 The increase shown allows for the reinforcements ST-B and ST-C to be provided without interfering with the cover member CM, even when the space PS between the cover member CM and the reinforcements ST-B and ST-C is reduced.

[0150] According to the present invention, the reinforcing member is positioned at a predetermined distance from the side surface of the second protective member (which is configured to overlap with the curved area of ​​the display panel), and thus defects caused by interference between the second protective member disposed on the rear surface of the display panel and the display panel can be prevented. Therefore, an electronic device with improved reliability can be provided.

[0151] Although the inventive concept has been described with reference to preferred embodiments thereof, it will be understood that the inventive concept is not to be limited to these preferred embodiments, but that various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the inventive concept.

[0152] Therefore, the technical scope of the present invention is not intended to be limited to what is set forth in the detailed description of the specification, but is intended to be defined by the appended claims.

Claims

1. Electronic devices, including: The display module is divided into curved and non-curved regions arranged in a first direction, and has a front surface and a rear surface opposite to the front surface. A covering member that covers a portion of the curved area and is disposed on the front surface; A first protective member is disposed on the rear surface and overlaps with the non-curved region; A second protective member is disposed on the rear surface, overlapping the curved area and spaced apart from the first protective member; A drive element is disposed on the front surface and overlaps with the curved region; as well as A reinforcing member is disposed on the front surface between the cover member and the drive element. The bending region is capable of bending along a virtual bending axis, which extends along a second direction perpendicular to the first direction. The cover member and the reinforcement member expose a portion of the front surface through the space between the cover member and the reinforcement member.

2. The electronic device according to claim 1, wherein, The distance in the first direction from the side surface of the second protective member facing the side surface of the first protective member to the side surface of the reinforcing member adjacent to the cover member is 2.0 mm or greater.

3. The electronic device according to claim 1, wherein, The reinforcement is attached to the front surface via an adhesive layer.

4. The electronic device according to claim 3, wherein, The side surface of the reinforcing member adjacent to the cover member is aligned with the side surface of the adhesive layer adjacent to the cover member.

5. The electronic device according to claim 3, wherein, The reinforcement includes a first portion that overlaps with the adhesive layer and a second portion that protrudes from the first portion toward the cover member.

6. The electronic device according to claim 5, wherein, The side surface of the second portion is inclined relative to the side surface of the adhesive layer adjacent to the cover member.

7. The electronic device according to claim 1, wherein, The reinforcing component is made of stainless steel.

8. The electronic device according to claim 1, wherein, The covering member includes a first covering portion adjacent to the non-curved region and a second covering portion extending from the first covering portion, and When the display module is not bent, the upper surface of the second cover portion is inclined from the first cover portion toward the reinforcement.

9. The electronic device according to claim 1, further comprising: A functional layer is disposed between the first protective member and the second protective member when the electronic device is bent along the virtual bending axis. The functional layer includes at least one of a light-blocking layer, a heat dissipation layer, and a buffer layer.

10. The electronic device according to claim 1, wherein, The display module includes: The display panel has multiple pixels; and An input sensing panel is directly mounted on the display panel and senses external inputs.

11. The electronic device according to claim 10, wherein, The input sensing panel includes: The first sensing insulating layer is in contact with the display panel; A first conductive layer is disposed on the first sensing insulating layer; A second sensing insulating layer is disposed on the first sensing insulating layer and covers the first conductive layer; A second conductive layer is disposed on the second sensing insulating layer; and A third sensing insulating layer is disposed on the second sensing insulating layer and covers the second conductive layer.

12. The electronic device according to claim 1, wherein, The reinforcement surrounds at least a portion of the drive element.

13. The electronic device according to claim 1, further comprising: A flexible circuit board is disposed on the front surface and overlaps with the curved region. The main circuit board is connected to the display module via the flexible circuit board.

14. Electronic devices, including: The display panel is divided into curved and non-curved areas arranged in a first direction, and has a front surface for displaying images and a rear surface opposite to the front surface. An input sensing panel, which senses external input, is disposed on the front surface and overlaps with the non-curved area; A covering member that covers a portion of the curved area and is disposed on the front surface; A first protective member is disposed on the rear surface and overlaps with the non-curved region; A second protective member is disposed on the rear surface, overlapping the curved area and spaced apart from the first protective member; A drive element is disposed on the front surface and overlaps with the curved region; as well as A reinforcing member is disposed on the front surface between the cover member and the drive element. The bending region is capable of bending along a virtual bending axis, which extends along a second direction perpendicular to the first direction. The cover member and the reinforcement member expose a portion of the front surface through the space between the cover member and the reinforcement member.

15. The electronic device according to claim 14, wherein, The distance in the first direction from the side surface of the second protective member facing the side surface of the first protective member to the side surface of the reinforcing member adjacent to the cover member is 2.0 mm or greater.

16. The electronic device according to claim 14, wherein, The reinforcement is attached to the front surface via an adhesive layer.

17. The electronic device according to claim 16, wherein, The side surface of the reinforcing member adjacent to the cover member is aligned with the side surface of the adhesive layer adjacent to the cover member.

18. The electronic device according to claim 16, wherein, The reinforcement includes a first portion that overlaps with the adhesive layer and a second portion that protrudes from the first portion toward the cover member.

19. The electronic device according to claim 18, wherein, The side surface of the second portion is inclined relative to the side surface of the adhesive layer adjacent to the cover member.

20. The electronic device according to claim 14, wherein, The input sensing panel includes: The first sensing insulating layer is in contact with the display panel; A first conductive layer is disposed on the first sensing insulating layer; A second sensing insulating layer is disposed on the first sensing insulating layer and covers the first conductive layer; A second conductive layer is disposed on the second sensing insulating layer; and A third sensing insulating layer is disposed on the second sensing insulating layer and covers the second conductive layer.

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