Repair method of a display device

Abstract

The present invention relates to a repair method for a display device. The display device includes: a driving backplane, a plurality of light-emitting units, and a packaging layer; the plurality of light-emitting units are bonded to the driving backplane; the packaging layer is located on the surface of the driving backplane to which the light-emitting units are bonded and covers the light-emitting units; at least one defective light-emitting unit is included in the display device; electrical tests are performed on each light-emitting unit to determine the target area where the defective light-emitting unit is located; the packaging layer located in the target area is removed to form an opening, and the opening exposes the defective light-emitting unit; the defective light-emitting unit exposed by the opening is peeled off; the repair light-emitting unit is transferred to the surface of the driving backplane located in the opening; the opening is filled with a filling layer. Selective repair of defective points is completed, without the need for additional equipment and other process flows, with low manufacturing and screening costs, improving the defective point repair efficiency and the display effect of the display panel, and promoting the mass production process of Micro LED products.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method for repairing a display device. Background Art

[0002] As a new generation of display technology, the micro light emitting diode (Micro LED) display has higher brightness, better luminous efficiency, better color restoration ability compared with the liquid crystal display (LCD) and the organic light emitting diode (OLED) display technologies. At the same time, it has the performance of low power consumption and long life, and is favored by the industry. As the size of the Micro LED chip continues to shrink, during mass transfer, it is easy to have poor contact between the Micro LED chip and the driving backplane, and the Micro LED chip itself is damaged, which will cause pixel dark spots in the finally prepared display panel, and the display effect of the display panel will be greatly reduced.

[0003] Nowadays, during the production of the display panel, providing dual Micro LED chips for repair can compensate for the brightness, but the repaired Micro LED display panel still has visual differences; or, repairing by an additional designed repair circuit, and the repair circuit often needs to use methods such as laser ablation to melt the circuit, resulting in a significant decrease in the repair efficiency of the poorly contacted Micro LED chip, seriously affecting the mass production process of the Micro LED display panel.

[0004] Therefore, how to improve the dark spot repair efficiency and the display effect of the Micro LED display panel is an urgent problem to be solved. Summary of the Invention

[0005] In view of the above deficiencies of the prior art, the purpose of the present application is to provide a method for repairing a display device, aiming to solve the problems that the repaired display panel has visual differences when using dual Micro LED chips and the repair efficiency is reduced by designing a repair circuit in the prior art.

[0006] A method for repairing a display device, characterized in that the display device includes: a driving backplane, a plurality of light emitting units and a plastic encapsulation layer; the plurality of light emitting units are bonded to the driving backplane; the plastic encapsulation layer is located on the surface of the driving backplane bonded with the light emitting units and covers the light emitting units; at least one defective light emitting unit is included in the display device;

[0007] Perform electrical tests on each of the light emitting units to determine the target area where the defective light emitting unit is located;

[0008] Remove the encapsulation layer within the target area to form an opening that exposes the defective pixel light-emitting unit.

[0009] Peel off the defective pixel light-emitting unit exposed by the opening.

[0010] Transfer the repair light-emitting unit to the surface of the driving backplane within the opening.

[0011] Fill the opening with a filling layer.

[0012] In the repair method of the above display device, the display device includes at least one defective pixel light-emitting unit. By performing an electrical test on each light-emitting unit in the display device, the target area where the defective pixel light-emitting unit is located is determined. The light-emitting units in normal contact with the driving backplane generate heat, and the part of the encapsulation layer located on the light-emitting units in normal contact with the driving backplane is cured. The defective pixel light-emitting units in contact with the driving backplane do not generate heat, and the encapsulation layer within the target area is not cured, so that the normal pixels and defective pixels can be selectively distinguished. Remove the encapsulation layer within the target area to form an opening, and peel off the defective pixel light-emitting unit exposed by the opening, that is, remove the defective pixel. Then transfer the repair light-emitting unit to the surface of the driving backplane within the opening, and fill the opening with a filling layer to complete the selective repair of the defective pixel. There is no need for additional equipment and other process flows, and the manufacturing and screening costs are low, improving the defective pixel repair efficiency and the display effect of the display panel, and promoting the mass production process of Micro LED products.

[0013] Optionally, the encapsulation layer includes a thermosetting adhesive layer; the electrical test on each light-emitting unit to determine the target area where the defective pixel light-emitting unit is located includes: passing a current through each light-emitting unit. By using the method of passing a current, the light-emitting units in normal contact with the driving backplane can be quickly aged, generating a large amount of heat that can quickly cure the thermosetting adhesive layer and cure the part of the encapsulation layer located on the light-emitting units in normal contact with the driving backplane, thereby distinguishing the uncured encapsulation layer from the cured encapsulation layer.

[0014] Optionally, the display device further includes a plurality of spaced-apart heat insulation structures located on the surface of the driving backplane; the light-emitting units are located between adjacent heat insulation structures. By designing a plurality of spaced-apart heat insulation structures, a plurality of light-emitting units are isolated to block the diffusion of a large amount of heat energy generated by the aging of the light-emitting units in normal contact, and it will not affect the adjacent uncured encapsulation layer.

[0015] Optionally, the height of the heat insulation structure is greater than the thickness of the encapsulation layer. It can effectively isolate the encapsulation layer. After the electrical detection of the light-emitting units, the adjacent encapsulation layers do not affect each other whether they are cured or not, and the selective peeling of the defective pixel light-emitting unit is realized.

[0016] Optionally, removing the encapsulation layer within the target area to form an opening includes: removing the encapsulation layer between adjacent heat insulation structures within the target area.

[0017] Optionally, removing the encapsulation layer within the target area to form an opening includes: using a wet etching solution to remove the encapsulation layer within the target area. The encapsulation layer within the target area is not cured. After curing, the material of the encapsulation layer has mutated and is distinguishable from the uncured encapsulation layer. The cured encapsulation layer cannot be dissolved in the wet etching solution, while the uncured encapsulation layer can be dissolved in the wet etching solution, enabling rapid removal of the uncured encapsulation layer.

[0018] Optionally, the encapsulation layer includes a thermosetting adhesive layer, and a thermosetting adhesive solvent is used to remove the encapsulation layer within the target area.

[0019] Optionally, there is a bonding layer between the light-emitting unit and the driving backplane, and the light-emitting unit and the driving backplane are eutectically bonded via the bonding layer; peeling off the defective pixel light-emitting unit exposed by the opening includes: using an acidic solution to remove the bonding layer to peel off the defective pixel light-emitting unit exposed by the opening.

[0020] Optionally, there is a bonding layer between the light-emitting unit and the driving backplane, and the bonding layer includes an anisotropic conductive adhesive layer; peeling off the defective pixel light-emitting unit exposed by the opening includes: using a conductive adhesive cleaning agent to remove the bonding layer to peel off the defective pixel light-emitting unit exposed by the opening.

[0021] Optionally, there is a bonding layer between the light-emitting unit and the driving backplane, and the same wet solution is used to remove the encapsulation layer and the bonding layer within the target area. By using the same wet solution to simultaneously remove the encapsulation layer and the bonding layer within the target area, the defective pixel repair efficiency is further improved, and the process complexity and defective pixel repair cost are reduced. Description of the Drawings

[0022] Figure 1 It is a partial cross-sectional schematic diagram of a display device provided in an embodiment of the present application with at least one defective contact between a light-emitting unit and a driving backplane;

[0023] Figure 2 It is a schematic flowchart of a repair method for a display device provided in an embodiment of the present application;

[0024] Figure 3 It is a partial cross-sectional schematic diagram of the structure obtained after removing the uncured encapsulation layer to form an opening provided in an embodiment of the present application;

[0025] Figure 4A partial cross-sectional view of the structure obtained after exposing the light-emitting unit through the peeling opening according to an embodiment of the present application;

[0026] Figure 5 A partial cross-sectional view of the structure obtained after transferring the reserved light-emitting unit to the surface of the driving backplane located within the opening according to an embodiment of the present application;

[0027] Figure 6 A partial cross-sectional view of the repaired structure obtained by filling the opening with a plastic encapsulation layer according to an embodiment of the present application.

[0028] Explanation of reference numerals:

[0029] 100 - display device, 11 - driving backplane, 12 - light-emitting unit, 121 - epitaxy, 122 - first electrode, 123 - second electrode, 101 - defective pixel light-emitting unit;

[0030] 13 - plastic encapsulation layer, 14 - heat insulation structure, 15 - bonding layer, 16 - opening, 17 - repaired light-emitting unit, 18 - filling layer, 200 - repaired structure. Detailed implementation manners

[0031] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the description of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0033] The problems of pixel dark spots are usually caused by the following situations. First: During the mass transfer process, the Micro LED chip is in poor contact with the driving backplane. Second: During the detection and repair process, the Micro LED chip is poorly repaired. Third: The Micro LED chip itself is damaged and has quality defects, all of which will cause pixel dark spot problems. In the prior art, most of them use the method of using dual MicroLED chips or designing a repair circuit for repair. Although using dual Micro LED chips can compensate for the brightness of the display panel, there are still visual differences and the display effect of the display panel decreases. When designing a repair circuit to repair dark spots, methods such as laser ablation are often used to melt the circuit, and the efficiency of repairing dark spots by this method is low, seriously restricting the mass production process of the Micro LED display panel.

[0034] Based on this, the present application hopes to provide a solution that can solve the above technical problems, and its detailed content will be elaborated in the subsequent embodiments.

[0035] In an embodiment of the present application, as Figure 1 shown, the display device 100 includes: a driving backplane 11, a plurality of light-emitting units 12, and a packaging layer 13; the plurality of light-emitting units 12 are bonded to the driving backplane 11; the packaging layer 13 is located on the surface of the driving backplane 11 to which the light-emitting units 12 are bonded, and covers the light-emitting units 12; the display device 100 includes at least one defective light-emitting unit 101, and the defective light-emitting unit 101 is a light-emitting unit 12 with poor contact with the driving backplane 11.

[0036] As an example, the display device 100 includes a display panel with at least one defective light-emitting unit 101. This display panel can emit light for display and has pixel dark spots; the light-emitting units 12 with normal contact with the driving backplane 11 are normal points. During the process of lighting up the display device 100, the above-mentioned defective points are displayed as dark spots in the picture, which will greatly reduce the display effect of the display panel, and has a relatively fatal impact on the current immature Micro LED products.

[0037] As an example, the driving backplane 11 may include, but is not limited to, a printed circuit board (Printed Circuit Board, PCB board); the physical and chemical properties of the PCB board are very stable, and it can be used stably for a long time as a carrier of electronic components. After being powered on, the driving backplane 11 and the light-emitting units 12 form a circuit for the light-emitting units 12 to emit light for display.

[0038] As an example, the light-emitting units 12 may include, but are not limited to, Micro LED chips, Mini LED chips, photodetector diodes, MOS devices, or MEMS (Micro-Electro-Mechanical System) devices, etc.

[0039] As an example, please continue to refer to Figure 1, there is a bonding layer 15 between the light-emitting unit 12 and the driving backplane 11. The bonding layer 15 may include, but is not limited to, an electrode layer, an anisotropic conductive adhesive layer (ACF), etc.; the light-emitting unit 12 may further include an epitaxial layer 121, a first electrode 122, and a second electrode 123; the first electrode 122 and the second electrode 123 are located on the surface of the bonding layer 15 away from the driving backplane 11, and there is a gap between the first electrode 122 and the second electrode 123. The first electrode 122 and the second electrode 123 correspond to the bonding layer 15 one by one. The epitaxial layer 121 is located on the surface of the first electrode 122 and the second electrode 123 away from the bonding layer 15. The total number of the second electrodes and the second electrode 123 may be less than or equal to the number of the bonding layer 15.

[0040] As an example, the materials and shapes of the first electrode 122 and the second electrode 123 are not limited either. The materials of the first electrode 122 and the second electrode 123 may include, but are not limited to, an alloy material formed by one or any combination of Cr, Ti, Al, Ni, Pt, W, Pb, Rh, Sn, Cu, and Ag. The materials of the first electrode 122 and the second electrode 123 may be the same or different; the first electrode 122 may be a P electrode, and the second electrode 123 may be an N electrode; or the first electrode 122 may be an N electrode, and the second electrode 123 may be a P electrode.

[0041] As an example, a packaging layer 13 may be formed on the surface of the driving backplane 11 by, but not limited to, a deposition process or a coating process. Specifically, a packaging layer 13 may be formed on the surface of the driving backplane 11 by, but not limited to, a physical vapor deposition process, a chemical vapor deposition process, or an atomic layer deposition process, etc.; or a packaging layer 13 may be formed on the surface of the driving backplane 11 by a spin coating method using a spin coater, etc.

[0042] As an example, the material of the packaging layer 13 may include, but is not limited to, a thermosetting adhesive. The packaging layer 13 may include, but is not limited to, a thermosetting adhesive layer. The packaging layer 13 seals the plurality of light-emitting units 12 to protect the plurality of light-emitting units 12 from falling off the surface of the driving backplane 11.

[0043] In one embodiment, please continue to refer to Figure 1 , the display device 100 further includes a plurality of spaced-apart heat insulation structures 14 (banks). The heat insulation structures 14 are located on the surface of the driving backplane 11; the light-emitting units 12 are located between adjacent heat insulation structures 14. There is also a packaging layer 13 between adjacent heat insulation structures 14.

[0044] In one embodiment, the height of the heat insulation structure 14 is greater than the thickness of the encapsulation layer 13. The heat insulation structure 14 divides the encapsulation layer 13 into several parts and isolates them; when a large amount of heat energy is generated during the aging of the light-emitting unit 12, adjacent encapsulation layers 13 will not affect each other.

[0045] As an example, the material of the heat insulation structure 14 may include but is not limited to silicon nitride (SiN), silicon dioxide (SiO2), etc., and the heat insulation structure 14 may include but is not limited to a silicon nitride (SiN) layer, a silicon dioxide (SiO2) layer, etc.

[0046] As an example, the shape of the heat insulation structure 14 may include but is not limited to cylindrical, columnar, trapezoidal, etc.; in this embodiment, taking Figure 1 as an example, the shape of the heat insulation structure 14 is trapezoidal, and the present application does not limit this, as long as the encapsulation layer 13 and the light-emitting unit 12 can be separated from each other.

[0047] As an example, multiple spaced-apart heat insulation structures 14 located on the surface of the driving backplane 11 may be arranged at equal intervals, and the interval size may be determined according to the actual situation of the process parameters and the size of the display device 100. The present application does not limit this. Of course, in other embodiments, multiple heat insulation structures 14 may also be arranged at unequal intervals on the surface of the driving backplane 11.

[0048] In one embodiment of the present application, as Figure 2 shown, a repair method for a display device is provided. The repair method for the display device is used to repair the display device 100, and the repair method for the display device includes the following steps:

[0049] Step S10: Perform an electrical test on each light-emitting unit to determine the target area where the defective light-emitting unit is located;

[0050] Step S20: Remove the encapsulation layer within the target area to form an opening, and the opening exposes the defective light-emitting unit;

[0051] Step S30: Peel off the defective light-emitting unit exposed by the opening;

[0052] Step S40: Transfer the repaired light-emitting unit to the surface of the driving backplane located within the opening;

[0053] Step S50: Fill the opening with a filling layer.

[0054] In the repair method of the above display device, the display device includes at least one defective pixel light-emitting unit. By electrically testing each light-emitting unit in the display device, the target area where the defective pixel light-emitting unit is located is determined; the light-emitting units in normal contact with the driving backplane generate heat, and the part of the encapsulation layer located on the light-emitting units in normal contact with the driving backplane is cured; the defective pixel light-emitting units in contact with the driving backplane do not generate heat, and the encapsulation layer in the target area is not cured, so that normal pixels and defective pixels can be selectively distinguished; the encapsulation layer in the target area is removed to form an opening, and the defective pixel light-emitting unit exposed by peeling off the opening is removed, that is, the defective pixel is removed; then the repaired light-emitting unit is transferred to the surface of the driving backplane in the opening, and the opening is filled with a filling layer to complete the selective repair of the defective pixel. There is no need for additional equipment and other process flows, and the manufacturing and screening costs are low, improving the defective pixel repair efficiency and the display effect of the display panel, and promoting the mass production process of Micro LED products.

[0055] In one embodiment, the encapsulation layer 13 includes a thermosetting adhesive layer; Step S10: Electrically test each light-emitting unit 12 to determine the target area where the defective pixel light-emitting unit is located, including the following steps:

[0056] Step S10: Pass a current through each light-emitting unit 12. Please continue to refer to Figure 1 .

[0057] Specifically, since the light-emitting unit 12 has an internal resistance, when a current is passed through the light-emitting unit 12 to light up the light-emitting unit 12, the current flows through the internal resistance, and a large amount of heat energy is generated by the internal resistance in the light-emitting unit 12 in normal contact with the driving backplane 11, thereby curing the encapsulation layer 13 near the light-emitting unit 12 in normal contact, that is, the encapsulation layer 13 in the area between the adjacent heat insulation structures 14 where the light-emitting unit 12 in normal contact with the driving backplane 11 is located is cured. However, for the light-emitting unit 12 with poor contact with the driving backplane 11 (i.e., the defective pixel light-emitting unit 101), since no current will flow through, the internal resistance of the defective pixel light-emitting unit 101 will not generate heat, and the encapsulation layer 13 in the area between the adjacent heat insulation structures 14 where the light-emitting unit 12 with poor contact with the driving backplane 11 is located is not cured, thus realizing the distinction between normal pixels and defective pixels.

[0058] In one embodiment, by designing a plurality of heat insulation structures 14 arranged at intervals, a plurality of light-emitting units 12 are separated to block the diffusion of a large amount of heat energy generated by the aging of the light-emitting units 12 in normal contact with the driving backplane 11, and it will not affect the adjacent uncured encapsulation layer 13. The height of the heat insulation structure 14 is greater than the thickness of the encapsulation layer 13, which can effectively isolate the encapsulation layer 13. After the electrical detection of the light-emitting unit 12, the adjacent encapsulation layers 13 will not affect each other whether they are cured or not, realizing the selective peeling of the defective pixel light-emitting unit 101.

[0059] In one embodiment, as Figure 3As shown, in step S20, the encapsulation layer 13 within the target area is removed to form an opening 16, including the following steps:

[0060] Step S201: Remove the encapsulation layer 13 between adjacent thermal insulation structures 14 within the target area.

[0061] In one embodiment, please continue to refer to Figure 3 , in step S20, the encapsulation layer 13 within the target area is removed to form an opening 16, and the opening 16 is the area between the thermal insulation structures 14 on both sides of the removed uncured encapsulation layer 13. The size of the opening 16 can be determined according to the actual process parameters and the size of the display device 100, and the present application does not limit this.

[0062] In one embodiment, please continue to refer to Figure 3 , step S20: Remove the encapsulation layer 13 within the target area to form an opening 16, including the following steps:

[0063] Step S202: Use a wet etching solution to remove the encapsulation layer 13 within the target area.

[0064] Specifically, the material of the cured encapsulation layer 13 itself has mutated and is distinguished from the uncured encapsulation layer 13. The cured encapsulation layer 13 is insoluble in the wet etching solution, while the uncured encapsulation layer 13 dissolves in the wet etching solution, and the uncured encapsulation layer 13 can be quickly removed.

[0065] In one embodiment, the encapsulation layer 13 includes a thermosetting adhesive layer, and a thermosetting adhesive solvent is used to remove the uncured encapsulation layer 13. The thermosetting adhesive solvent can dissolve and corrode the uncured encapsulation layer 13. Due to the mutated characteristics of the cured encapsulation layer 13 itself, it is insoluble in the thermosetting adhesive solvent. The present application does not limit the type of the thermosetting adhesive solvent.

[0066] In one embodiment, there is a bonding layer 15 between the light-emitting unit 12 and the driving backplane 11, and the light-emitting unit 12 and the driving backplane 11 are eutectically bonded via the bonding layer 15; step S30: Peel off the defective light-emitting unit 101 exposed by the opening 16, and further includes the following steps:

[0067] Step S301: Use an acidic solution to remove the bonding layer 15 to peel off the defective light-emitting unit 101 exposed by the opening 16, as Figure 4 shown.

[0068] Specifically, the bonding layer 15 includes an electrode layer, and the material of the electrode layer may include, but is not limited to, an alloy material formed by one or any combination of Cr, Ti, Al, Ni, Pt, W, Pb, Rh, Sn, Cu, and Ag. The material of the electrode layer may be the same as or different from the materials of the first electrode 122 and the second electrode 123. The acidic solution may include, but is not limited to, acetic acid, carbonic acid, sulfuric acid, hydrochloric acid, etc. One or more acidic solutions capable of dissolving the bonding layer 15 may be selected according to the material of the electrode layer, and the present application does not limit this.

[0069] As an example, but not limited to, methods such as immersion, spraying, or atomization can be used to treat the Figure 3 obtained structure with an acidic solution.

[0070] It should be noted that during the process of dissolving the bonding layer 15 with the acidic solution, the cured encapsulation layer 13 and the heat insulation structure 14 will not be damaged.

[0071] In one embodiment, there is a bonding layer 15 between the light-emitting unit 12 and the driving backplane 11, and the bonding layer 15 includes an anisotropic conductive film layer (ACF); Step S30: Peeling off the defective light-emitting unit 101 exposed by the opening 16 further includes the following steps:

[0072] Step S302: Using a conductive adhesive cleaning agent to remove the bonding layer 15 to peel off the defective light-emitting unit 101 exposed by the opening 16, please continue to refer to Figure 4 .

[0073] It should be noted that during the process of removing the bonding layer 15 with the conductive adhesive cleaning agent, the cured encapsulation layer 13 and the heat insulation structure 14 will not be damaged.

[0074] In one embodiment, there is a bonding layer 15 between the light-emitting unit 12 and the driving backplane 11, and the uncured encapsulation layer 13 and the bonding layer 15 are removed using the same wet solution. By using the same wet solution to simultaneously remove the uncured encapsulation layer 13 and the bonding layer 15, the dark spot repair efficiency is further increased, and the process complexity and dark spot repair cost are reduced.

[0075] As an example, the type of the wet solution can be tested and adjusted according to the actual process conditions, and the present application does not limit this.

[0076] In one embodiment, as Figure 5 shown, in step S40, the repaired light-emitting unit 17 is transferred to the surface of the driving backplane 11 located within the opening 16, thereby replacing the defective light-emitting unit. Among them, the repaired light-emitting unit 17 includes the light-emitting units 12 that are pre-stored and not massively transferred, and the quality of the repaired light-emitting unit 17 is not problematic and can emit light normally.

[0077] In one embodiment, as Figure 6 shown, in step S50, the opening 16 is filled with the filling layer 18; wherein, the filling layer 18 is an unused encapsulation layer 13, and its material properties have not changed. The upper surface of the filling layer 18 is flush with the upper surface of the already cured encapsulation layer 13.

[0078] In one embodiment, step S50: After filling the opening 16 with the filling layer 18, the following steps are further included:

[0079] Step S60: Repeat the above steps until all the defective pixel light-emitting units 101 are repaired and replaced to obtain the repaired structure 200.

[0080] Specifically, the repaired structure 200 includes a display panel without any dark spots and capable of normal display.

[0081] It should be understood that the application of the present invention is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present invention.

Claims

1. A repair method for a display device, characterized in that, The display device includes: a driving backplane, a plurality of light-emitting units, and a packaging layer; the plurality of light-emitting units are bonded to the driving backplane; the packaging layer is located on the surface of the driving backplane where the light-emitting units are bonded, and covers the light-emitting units; at least one defective light-emitting unit is included in the display device; Electrically test each of the light-emitting units to determine the target area where the defective light-emitting unit is located; Remove the packaging layer within the target area to form an opening, and the opening exposes the defective light-emitting unit; Peel off the defective light-emitting unit exposed by the opening; Transfer a repair light-emitting unit to the surface of the driving backplane within the opening; Fill the opening with a filling layer; The display device further includes a plurality of heat insulation structures arranged at intervals, and the heat insulation structures are located on the surface of the driving backplane; the light-emitting units are located between adjacent heat insulation structures.

2. The repair method of the display device according to claim 1, characterized in that, The packaging layer includes a thermosetting adhesive layer; the electrically testing each of the light-emitting units to determine the target area where the defective light-emitting unit is located includes: passing an electric current through each of the light-emitting units.

3. The repair method of the display device according to claim 1, wherein, The height of the heat insulation structure is greater than the thickness of the packaging layer.

4. The repair method of the display device according to claim 1, wherein, The removing the packaging layer within the target area to form an opening includes: removing the packaging layer between adjacent heat insulation structures within the target area.

5. The repair method of the display device according to any one of claims 1-4, characterized in that The removing the packaging layer within the target area to form an opening includes: using a wet etching solution to remove the packaging layer within the target area.

6. The repair method of the display device according to claim 5, characterized in that, The packaging layer includes a thermosetting adhesive layer, and a thermosetting adhesive solvent is used to remove the packaging layer within the target area.

7. The repair method of the display device according to claim 6, characterized in that, A bonding layer is provided between the light-emitting unit and the driving backplane, and the light-emitting unit and the driving backplane are eutectically bonded via the bonding layer; The peeling off the defective light-emitting unit exposed by the opening includes: using an acidic solution to remove the bonding layer to peel off the defective light-emitting unit exposed by the opening.

8. The repair method of the display device according to claim 6, characterized in that, A bonding layer is provided between the light-emitting unit and the driving backplane, and the bonding layer includes an anisotropic conductive adhesive layer; the peeling off the defective light-emitting unit exposed by the opening includes: Using a conductive adhesive cleaning agent to remove the bonding layer to peel off the defective light-emitting unit exposed by the opening.

9. The repair method of the display device according to claim 5, characterized in that, A bonding layer is provided between the light-emitting unit and the driving backplane, and the same wet solution is used to remove the bonding layer within the target area.

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