Substrate processing apparatus and substrate conveying method

Abstract

This invention provides a substrate processing apparatus and a substrate transport method. The second transport mechanism (23) of the substrate processing apparatus (100) includes a first non-shared hand (H_F), a second non-shared hand (H_S), and M shared hands (H_1 to H_M). In one transport cycle, the M shared hands (H_1 to H_M) support the substrate (W) before and after processing at different times. In one transport cycle, the first non-shared hand (H_F) supports only the substrate (W) before processing. In one transport cycle, the second non-shared hand (H_S) supports only the substrate (W) after processing. When the second transport mechanism (23) has received N substrates (W) from the substrate placement section (29), the second non-shared hand (H_S) does not support the substrate (W), while the M shared hands (H_1 to H_M) and the first non-shared hand (H_F) support the substrate (W).

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate conveying method. Background Technology

[0002] The substrate processing system described in Patent Document 1 includes a first processing unit, a second processing unit, a main conveying device, a first conveying device, and a second conveying device.

[0003] The main transport device has multiple (5) wafer holding sections to hold the wafers. The main transport device can move in both the horizontal and vertical directions and can rotate around the vertical axis, thereby enabling the simultaneous transport of multiple wafers between the cassette and the transfer module using the wafer holding sections.

[0004] The first conveying device includes a wafer holding section. Furthermore, the first conveying device uses the wafer holding section to perform processes such as removing a wafer from the transfer module and conveying it to the first processing unit, and removing a wafer processed by the first processing unit from the first processing unit and conveying it to the transfer module. Therefore, the wafer holding section is shared between the wafer before processing and the wafer after processing.

[0005] The second conveying device includes a wafer holding section. Furthermore, the second conveying device uses the wafer holding section to perform processes such as removing wafers from the transfer module and conveying them to the second processing unit, and removing wafers processed by the second processing unit from the second processing unit and conveying them to the transfer module. Therefore, the wafer holding section is shared between the wafers before and after processing.

[0006] For convenience, the following description will focus on the first conveying device and the first processing unit.

[0007] [Previous Technical Documents]

[0008] [Patent Literature]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 2016-201526 Summary of the Invention

[0010] [The problem the invention aims to solve]

[0011] The inventors of this application explored the possibility of a first conveying device having multiple wafer holding sections (e.g., more than three wafer holding sections) and the possibility of sharing multiple wafer holding sections between pre-processed and post-processed wafers. Furthermore, the inventors of this application actively researched the operation of conveying multiple wafers from multiple wafer holding sections to multiple first processing units, aiming to improve the throughput of the wafer (substrate) conveying operation of the first conveying device (conveyor mechanism).

[0012] The purpose of this invention is to provide a substrate processing apparatus and substrate conveying method that can improve the productivity of the substrate conveying action of the conveying mechanism.

[0013] [Technical means to solve the problem]

[0014] According to one aspect of the present invention, a substrate processing apparatus includes a substrate placement section, a plurality of processing units, and a conveying mechanism. The substrate placement section holds a plurality of substrates. Each of the plurality of processing units processes the substrate. The conveying mechanism conveys the substrate between the substrate placement section and the processing units. In one conveying cycle, the conveying mechanism receives N (N is an integer of 2 or more) substrates from the substrate placement section before processing by the processing units, conveys the N substrates to N processing units among the plurality of processing units, removes the N substrates after processing by the N processing units from the N processing units, and delivers the N substrates to the substrate placement section. The conveying mechanism includes a plurality of hands. Each of the plurality of hands supports the substrate. The plurality of hands includes a first non-shared hand, a second non-shared hand, and M (M is an integer of 1 or more) shared hands disposed between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are arranged continuously in a vertical direction from the first non-shared hand to the second non-shared hand. Within one transport cycle, the M shared hands support the substrate before and after processing by the processing unit at different times. Within one transport cycle, the first non-shared hand only supports the substrate before processing by the processing unit. Within one transport cycle, the second non-shared hand only supports the substrate after processing by the processing unit. When the transport mechanism has received the N substrates from the substrate placement section, the second non-shared hand does not support the substrate, while the M shared hands and the first non-shared hand support the substrate.

[0015] In one embodiment of the invention, in the substrate processing apparatus, preferably: within one transfer cycle, the M shared hands and the first non-shared hand receive the substrate from the substrate placement section. Preferably: within one transfer cycle, the second non-shared hand removes the processed substrate from the processing unit. Preferably: within one transfer cycle, the shared hand adjacent to the second non-shared hand among the M shared hands moves the unprocessed substrate into the processing unit where the substrate has been removed by the second non-shared hand. Preferably: within one transfer cycle, the shared hand adjacent to the second non-shared hand removes the processed substrate from a processing unit different from the processing unit where the unprocessed substrate has been moved in by the shared hand.

[0016] In one embodiment of the invention, in the substrate processing apparatus, it is preferable that the total number of the M shared hands, the first non-shared hand, and the second non-shared hand is N+1. Preferably, M = N-1.

[0017] In one embodiment of the invention, in the substrate processing apparatus, it is preferable that the total number of the plurality of hands is 2N.

[0018] In one embodiment of the invention, in the substrate processing apparatus, N = 2 is preferred.

[0019] In one embodiment of the present invention, the substrate processing apparatus preferably further includes a control unit for controlling the conveying mechanism. Preferably, the conveying mechanism is controlled by the control unit and operates in either a first substrate conveying mode or a second substrate conveying mode. Preferably, the first substrate conveying mode is a mode in which the N+1 hands of the 2N hands are used as the M shared hands, the first non-shared hands, and the second non-shared hands. Preferably, the second substrate conveying mode is a mode in which N hands of the 2N hands are used only to support the substrate before it is processed by the processing unit, and the other N hands are used only to support the substrate after it has been processed by the processing unit.

[0020] In one embodiment of the invention, in the substrate processing apparatus, it is preferable that the total number of the plurality of hands is N+1.

[0021] According to another aspect of the present invention, a substrate transport method is performed using a transport mechanism that transports the substrates between a substrate mounting section for mounting multiple substrates and multiple processing units for processing the substrates. The substrate transport method includes the following steps: in one transport cycle, receiving N (N is an integer greater than 2) substrates from the substrate mounting section before processing by the processing units, transporting the N substrates into N processing units among the multiple processing units, removing the N substrates after processing by the N processing units from the N processing units, and delivering the N substrates to the substrate mounting section. The transport mechanism has multiple hands, each supporting a substrate. The multiple hands include a first non-shared hand, a second non-shared hand, and M (M is an integer greater than 1) shared hands disposed between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are continuously arranged vertically from the first non-shared hand to the second non-shared hand. In the step of delivering the N substrates to the substrate placement unit, within one transport cycle, the M shared hands support the substrate before and after processing by the processing unit at different times. Within one transport cycle, the first non-shared hand only supports the substrate before processing by the processing unit, and within one transport cycle, the second non-shared hand only supports the substrate after processing by the processing unit. When the transport mechanism has received the N substrates from the substrate placement unit, the second non-shared hand does not support the substrate, while the M shared hands and the first non-shared hand support the substrate.

[0022] In one embodiment of the present invention, in the substrate transfer method, preferably, in the step of delivering the N substrates to the substrate placement unit, within one transfer cycle, the M shared hands and the first non-shared hand receive the substrate from the substrate placement unit; within one transfer cycle, the second non-shared hand removes the processed substrate from the processing unit; within one transfer cycle, the shared hand adjacent to the second non-shared hand among the M shared hands transfers the unprocessed substrate into the processing unit from which the substrate has been removed by the second non-shared hand; within one transfer cycle, the shared hand adjacent to the second non-shared hand removes the processed substrate from a processing unit different from the processing unit from which the unprocessed substrate has been transferred into by the shared hand.

[0023] In one embodiment of the invention, in the substrate transfer method, it is preferable that the total number of the M shared hands, the first non-shared hand, and the second non-shared hand is N+1. Preferably, M = N-1.

[0024] In one embodiment of the invention, in the substrate transfer method, it is preferred that the total number of the plurality of hands is 2N.

[0025] In one embodiment of the present invention, in the substrate transport method, N = 2 is preferred.

[0026] In one embodiment of the invention, in the substrate transfer method, it is preferred that the transfer mechanism operates in either a first substrate transfer mode or a second substrate transfer mode. Preferably, the first substrate transfer mode is a mode in which the N+1 hands of the 2N hands are used as the M shared hands, the first non-shared hands, and the second non-shared hands. Preferably, the second substrate transfer mode is a mode in which N hands of the 2N hands are used only to support the substrate before processing by the processing unit, and the other N hands are used only to support the substrate after processing by the processing unit.

[0027] In one embodiment of the invention, in the substrate transfer method, it is preferred that the total number of the plurality of hands is N+1.

[0028] [The effects of the invention]

[0029] The substrate processing apparatus and substrate conveying method according to the present invention can improve the productivity of the substrate conveying action of the conveying mechanism. Attached Figure Description

[0030] Figure 1 This is a top view showing the interior of the substrate processing apparatus according to an embodiment of the present invention.

[0031] Figure 2 It is along Figure 1 A sectional view along line II-II.

[0032] Figure 3 It is along Figure 1 A cross-sectional view along line III-III.

[0033] Figure 4 This is a side view showing the substrate processing apparatus of this embodiment.

[0034] Figure 5 This is a side view showing the interior of the processing unit in this embodiment.

[0035] Figure 6 This is a side view showing the first conveying mechanism, the substrate placement section, and the second conveying mechanism of the substrate processing apparatus of this embodiment.

[0036] Figure 7 This diagram illustrates an example of the entire process of the first substrate transfer method performed by the substrate processing apparatus of this embodiment.

[0037] Figure 8This is a flowchart illustrating the beginning of the first substrate transfer method performed by the substrate processing apparatus of this embodiment.

[0038] Figure 9 This is a flowchart illustrating the latter part of the first substrate transfer method performed by the substrate processing apparatus of this embodiment.

[0039] Figure 10 This diagram illustrates an example of the entire process of the second substrate transfer method performed by the substrate processing apparatus of this embodiment.

[0040] Figure 11 This is a flowchart illustrating the beginning of the second substrate transfer method performed by the substrate processing apparatus of this embodiment.

[0041] Figure 12 This is a flowchart illustrating the latter part of the second substrate transfer method performed by the substrate processing apparatus of this embodiment.

[0042] Figure 13 This diagram is used to explain the first substrate transfer method performed by the substrate processing apparatus of this embodiment.

[0043] Figure 14 This is a graph showing the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method when the second transport mechanism of this embodiment has 2N second hands.

[0044] Figure 15 This is a graph showing the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method when the second transport mechanism of this embodiment has N+1 second hands and N is an odd number.

[0045] Figure 16 This is a graph showing the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method when the second transport mechanism of this embodiment has N+1 second hands and N is an even number. Detailed Implementation

[0046] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, the same or equivalent parts are labeled with the same reference numerals in the drawings, and therefore will not be described again. Additionally, for ease of explanation, a three-dimensional orthogonal coordinate system (X, Y, Z) is indicated in the drawings as appropriate. Moreover, in the drawings, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. Furthermore, in the description of the embodiments, the first direction DX, the second direction DY, and the third direction DZ will be used as appropriate. The first direction DX, the second direction DY, and the third direction DZ are orthogonal to each other. As an example, the first direction DX and the second direction DY are approximately parallel to the horizontal direction, and the third direction DZ is approximately parallel to the vertical direction. For ease of explanation, the third direction DZ is sometimes referred to as "vertical direction DZ".

[0047] First, refer to Figure 1 The substrate processing apparatus 100 of this embodiment will be described. Figure 1 This is a top view showing the interior of the substrate processing apparatus 100 according to this embodiment. Furthermore, in this embodiment, the intake system and exhaust system are omitted for simplicity of the drawings and description.

[0048] Figure 1 The substrate processing apparatus 100 shown processes substrate W. Substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disc, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

[0049] The substrate processing apparatus 100 includes a transfer unit 1 and a processing unit 20. The processing unit 20 is disposed adjacent to the transfer unit 1. The transfer unit 1 supplies a substrate W to the processing unit 20. The processing unit 20 processes the substrate W. The transfer unit 1 retrieves the substrate W from the processing unit 20.

[0050] The transfer unit 1 includes multiple carrier placement units 3 (e.g., four carrier placement units 3). The multiple carrier placement units 3 are arranged along a first direction DX. Each of the multiple carrier placement units 3 is used to place multiple carriers C. Each of the multiple carriers C contains multiple substrates W. In this embodiment, as an example, each of the multiple carriers C contains 25 substrates W. The carriers C are, for example, FOUP (front-opening unified pod).

[0051] The transfer unit 1 includes a first transfer chamber 5. The first transfer chamber 5 is located between the multiple carrier placement units 3 and the processing unit 20.

[0052] The transfer unit 1 includes at least one first transfer mechanism 7. In this embodiment, as an example, the transfer unit 1 includes one first transfer mechanism 7. The first transfer mechanism 7 is disposed in the first transfer chamber 5. The first transfer mechanism 7 transfers the substrate W. Specifically, the first transfer mechanism 7 transfers the substrate W between each carrier C and the processing unit 20.

[0053] The first conveying mechanism 7 has multiple first-hand parts 9 and first-hand drive units 11. Furthermore, Figure 1 Only one first hand 9 is shown; the markings of the other first hand 9s have been omitted for simplicity. Each first hand 9 supports one substrate W. In this embodiment, each first hand 9 supports one substrate W in a horizontal position. A first hand drive unit 11 is connected to each first hand 9. The first hand drive unit 11 moves each first hand 9. The first hand drive unit 11 is equipped with multiple electric motors.

[0054] Next, refer to Figure 1 and Figure 2 The first hand unit 9 and the first hand drive unit 11 will be described. Figure 2 It is along Figure 1 A sectional view along line II-II.

[0055] like Figure 2 As shown, multiple first-hand arms 9 are arranged along the vertical direction DZ. In this embodiment, as an example, the first conveying mechanism 7 has five first-hand arms 9. In fact, as described below, the multiple first-hand arms 9 are arranged at intervals along the vertical direction DZ. When the first-hand drive unit 11 moves the multiple first-hand arms 9, the vertical interval of the multiple first-hand arms 9 in the vertical direction DZ must be maintained unchanged. Each first-hand arm 9 receives an unprocessed substrate W from the carrier C and conveys the unprocessed substrate W to the processing unit 20. In addition, each first-hand arm 9 receives a processed substrate W from the processing unit 20 and conveys it to the carrier C.

[0056] like Figure 1 and Figure 2 As shown, the first hand drive unit 11 includes a track 11a, a horizontal moving part 11b, a vertical moving part 11c, a rotating part 11d, a rotating shaft 11e, and a forward and backward part 11f.

[0057] Track 11a is disposed at the bottom of the first conveying chamber 5. Track 11a extends along the first direction DX. Horizontal moving part 11b is supported on track 11a. Horizontal moving part 11b moves along track 11a in the first direction DX. Vertical moving part 11c is supported on horizontal moving part 11b. Vertical moving part 11c moves relative to horizontal moving part 11b in the vertical direction DZ.

[0058] The rotating part 11d is supported on the vertical moving part 11c. The rotating part 11d rotates relative to the vertical moving part 11c. The rotating part 11d is driven by the rotating shaft 11e and rotates about the rotating axis A1. The rotating axis A1 is an imaginary line extending along the vertical direction DZ.

[0059] The advancing / retracting section 11f moves back and forth in one horizontal direction determined by the direction of the rotating section 11d. The advancing / retracting section 11f is connected to each of the first hands 9. Moreover, the advancing / retracting section 11f causes each of the first hands 9 to move back and forth in one horizontal direction determined by the direction of the rotating section 11d. The advancing / retracting section 11f is connected to each of the first hands 9.

[0060] As referenced above Figure 1 and Figure 2 As explained, the first conveying mechanism 7 includes a first hand drive unit 11. Therefore, each first hand 9 can move parallel to the vertical direction DZ. In this case, the first hand drive unit 11 causes all of the first hand 9 to move along the vertical direction DZ. Furthermore, each first hand 9 can rotate about a rotation axis A1. In this case, the first hand drive unit 11, for example, causes all of the first hand 9 to rotate. Moreover, each first hand 9 can move parallel to the horizontal direction in any direction.

[0061] Next, refer to Figures 1-4 The processing unit 20 will be explained. Figure 3 It is along Figure 1 A cross-sectional view along line III-III. Figure 4 This is a side view of the substrate processing apparatus 100.

[0062] like Figure 1 , Figure 3 and Figure 4 As shown, the processing unit 20 includes a plurality of processing units 21. Each of the plurality of processing units 21 processes the substrate W one by one. For example, each processing unit 21 processes the substrate W using a processing solution (e.g., a chemical solution). In this embodiment, as an example, the processing unit 20 includes 24 processing units 21.

[0063] Specifically, the processing unit 20 has multiple processing towers TW. As an example, each processing tower TW consists of K processing units 21 arranged along the vertical direction DZ. In this embodiment, K is an integer greater than or equal to 2. In each processing tower TW, K / 2 processing units 21 are arranged in the lower segment LW, and K / 2 processing units 21 are arranged in the upper segment UP.

[0064] In this embodiment, as an example, K=6, and one processing tower TW is composed of 6 processing units 21. Moreover, the processing unit 20 has 4 processing towers TW. Sometimes the 4 processing towers TW are referred to as processing towers TW1, TW2, TW3, and TW4, respectively.

[0065] Processing towers TW1 and TW2 are configured along the second direction DY. Processing towers TW3 and TW4 are configured along the second direction DY. Processing towers TW1 and TW2 are opposite to processing towers TW3 and TW4 in the first direction DX, separated by the second transfer chamber 31.

[0066] In addition, such as Figure 1 and Figure 2 As shown, the processing unit 20 also includes a plurality of substrate mounting sections 29. In this embodiment, as an example, the processing unit 20 includes two substrate mounting sections 29. Each substrate mounting section 29 can mount multiple substrates W. In this embodiment, as an example, each substrate mounting section 29 can mount 20 substrates W. Each substrate mounting section 29 is adjacent to the first transfer chamber 5.

[0067] In the following, for the two substrate mounting portions 29, the substrate mounting portion 29 located in the lower segment LW is sometimes referred to as "substrate mounting portion 29L", and the substrate mounting portion 29 located in the upper segment UP is referred to as "substrate mounting portion 29U".

[0068] The substrate mounting section 29L is disposed in the second transport chamber 31 of the lower section LW. The substrate mounting section 29U is disposed in the second transport chamber 31 of the upper section UP. The substrate mounting section 29L and the substrate mounting section 29U are arranged in a straight line along the vertical direction DZ.

[0069] In addition, such as Figure 2 As shown, the processing unit 20 also includes a plurality of second conveying mechanisms 23 and a plurality of second conveying chambers 31. In this embodiment, as an example, the processing unit 20 includes two second conveying mechanisms 23 and two second conveying chambers 31. The second conveying mechanism 23 is an example of a "conveying mechanism".

[0070] Two second transport chambers 31 are arranged along the vertical direction DZ. Each second transport chamber 31 extends along the second direction DY. Each second transport chamber 31 is connected to the first transport chamber 5.

[0071] Each of the second transport mechanisms 23 transports the substrate W. Specifically, the second transport mechanism 23 transports the substrate W between the substrate placement section 29 and the processing unit 21. Hereinafter, for the two second transport mechanisms 23, the second transport mechanism 23 located in the lower section LW is sometimes referred to as "second transport mechanism 23L", and the second transport mechanism 23 located in the upper section UP is referred to as "second transport mechanism 23U".

[0072] The second conveying mechanism 23L is configured in the second conveying chamber 31 of the lower section LW. The second conveying mechanism 23U is configured in the second conveying chamber 31 of the upper section UP.

[0073] like Figures 1-3As shown, each of the second conveying mechanisms 23 includes multiple second hands 25 and a second hand drive unit 17. In this embodiment, as an example, each of the second conveying mechanisms 23 includes four second hands 25. The second hand 25 is an example of a "hand".

[0074] Each second hand 25 supports one substrate W. In this embodiment, each second hand 25 supports one substrate W in a horizontal position. A second hand drive unit 17 is connected to each second hand 25. The second hand drive unit 17 moves each second hand 25. The second hand drive unit 17 is equipped with multiple electric motors.

[0075] Specifically, in each of the second conveying mechanisms 23, a plurality of second hands 25 are arranged along the vertical direction DZ. In fact, as described below, in each of the second conveying mechanisms 23, the plurality of second hands 25 are arranged at intervals along the vertical direction DZ. Furthermore, when the second hand drive unit 17 moves the plurality of second hands 25, the vertical interval DZ of the plurality of second hands 25 must be maintained constant. For example, the second hand 25 receives an unprocessed substrate W from the substrate placement unit 29 and conveys the unprocessed substrate W to the processing unit 21. For example, the second hand 25 receives a processed substrate W from the processing unit 21 and delivers it to the substrate placement unit 29.

[0076] The second manual drive unit 17 includes two support columns 27a, a vertical moving part 27b, a horizontal moving part 27c, a rotating part 27d, a rotating shaft 27e, and a forward and backward part 27f.

[0077] Two support columns 27a are disposed in the second transport chamber 31. Specifically, the two support columns 27a are disposed on the inner side of the second transport chamber 31. The two support columns 27a are spaced apart in the second direction DY. Each support column 27a extends in the vertical direction DZ. A vertical moving part 27b is supported by the two support columns 27a. The vertical moving part 27b extends in the second direction DY, spanning the two support columns 27a. The vertical moving part 27b moves along the two support columns 27a in the vertical direction DZ. A horizontal moving part 27c is supported by the vertical moving part 27b. The horizontal moving part 27c moves along the vertical moving part 27b between the two support columns 27a in the second direction DY.

[0078] The rotating part 27d is supported by the horizontally moving part 27c. The rotating part 27d rotates relative to the horizontally moving part 27c. The rotating part 27d is driven by the rotating shaft 27e and rotates about the rotating axis A2. The rotating axis A2 is an imaginary line extending along the vertical direction DZ.

[0079] The advancing / retracting section 27f moves relative to the rotating section 27d. The advancing / retracting section 27f moves back and forth in a horizontal direction determined by the direction of the rotating section 27d. The advancing / retracting section 27f is connected to each of the second hands 25.

[0080] As referenced above Figures 1-3 As explained, each of the second conveying mechanisms 23 includes a second hand drive unit 17. Therefore, each second hand 25 can move parallel to the vertical direction DZ. In this case, the second hand drive unit 17 causes all of the second hands 25 to move along the vertical direction DZ. Furthermore, each second hand 25 can rotate about the rotation axis A2. In this case, the second hand drive unit 17, for example, causes all of the second hands 25 to rotate. Moreover, each second hand 25 can move parallel to the horizontal direction in any direction.

[0081] Here, as Figure 1 As shown, the substrate processing apparatus 100 also includes a control unit 200. The control unit 200 controls each component of the substrate processing apparatus 100. Specifically, the control unit 200 controls the first conveying mechanism 7, the second conveying mechanism 23, and the processing unit 21.

[0082] The control unit 200 is, for example, a computer. Specifically, the control unit 200 includes a processor and a storage device. The processor includes, for example, a CPU (Central Processing Unit). The storage device stores data and computer programs. The storage device includes, for example, a main storage device such as semiconductor memory, and auxiliary storage devices such as semiconductor memory, solid-state drives, and / or hard disk drives. The storage device may also include removable media. The storage device is an example of a non-transitory computer-readable storage medium.

[0083] Specifically, the processor of the control unit 200 controls the first conveying mechanism 7, the second conveying mechanism 23, and the processing unit 21 by executing computer programs stored in the storage device.

[0084] Continue to refer to Figure 1 and Figure 2 The entire process of the first conveying mechanism 7 and the second conveying mechanism 23 conveying the substrate W is described.

[0085] The first transfer mechanism 7's first hand 9 receives unprocessed multiple substrates W from the carrier C and delivers the unprocessed multiple substrates W to the substrate placement section 29L or substrate placement section 29U. As a result, the unprocessed multiple substrates W are placed in the substrate placement section 29L or substrate placement section 29U. In this embodiment, "unprocessed substrate" refers to the substrate W that has not yet been processed by the processing unit 21, that is, the substrate W that has not yet been processed by the processing unit 21.

[0086] The second transfer mechanism 23L's second hand 25 receives multiple unprocessed substrates W from the substrate placement section 29L and transfers the unprocessed substrates W one by one into each processing unit 21 of the lower section LW. Then, each processing unit 21 of the lower section LW processes the unprocessed substrates W.

[0087] Additionally, the second transfer mechanism 23L's second hand 25 removes the processed substrates W from each processing unit 21 of the lower section LW and delivers the processed multiple substrates W to the substrate placement section 29L. As a result, the processed multiple substrates W are placed in the substrate placement section 29L.

[0088] On the other hand, the second hand 25 of the second conveying mechanism 23U receives multiple unprocessed substrates W from the substrate placement section 29U and moves the unprocessed substrates W one by one into each processing unit 21 of the upper section UP. Then, each processing unit 21 of the upper section UP processes the unprocessed substrates W.

[0089] Additionally, the second transfer mechanism 23U's second hand 25 removes the processed substrates W from each processing unit 21 of the upper section UP and delivers the processed multiple substrates W to the substrate placement section 29U. As a result, the processed multiple substrates W are placed in the substrate placement section 29U.

[0090] The first transfer mechanism 7 receives the processed multiple substrates W from the substrate placement section 29L or the substrate placement section 29U, and delivers the processed multiple substrates W to the carrier C. As a result, the processed multiple substrates W are housed in the carrier C.

[0091] Next, refer to Figure 5 The processing unit 21 will be described. Figure 5 This is a side view showing the interior of the processing unit 21. (Example) Figure 5 As shown, the processing unit 21 includes a processing housing 41, a substrate holding part 43, a rotation drive part 45, a first nozzle 47, a first nozzle moving part 47a, a second nozzle 49, a second nozzle moving part 49a, a third nozzle 51, a third nozzle moving part 51a, a fourth nozzle 53, a fourth nozzle moving part 53a, and a receiving cup 55. Additionally, the substrate processing apparatus 100 also includes a first processing liquid supply pipe 473, a second processing liquid supply pipe 493, a third processing liquid supply pipe 513, and a rinsing liquid supply pipe 533.

[0092] The processing housing 41 has a box-shaped design. The processing housing 41 houses a substrate holding part 43, a rotary drive part 45, a first nozzle 47, a first nozzle moving part 47a, a second nozzle 49, a second nozzle moving part 49a, a third nozzle 51, a third nozzle moving part 51a, a fourth nozzle 53, a fourth nozzle moving part 53a, and a receiving cup 55. Additionally, the processing housing 41 houses a portion of a first processing liquid supply pipe 473, a portion of a second processing liquid supply pipe 493, a portion of a third processing liquid supply pipe 513, and a portion of a rinsing liquid supply pipe 533. The substrate W, which has been moved into the processing unit 21 by the second conveying mechanism 23, is housed inside the processing housing 41.

[0093] The substrate holding portion 43 holds the substrate W horizontally. The substrate holding portion 43 is, for example, a vacuum rotary chuck. However, the method by which the substrate holding portion 43 holds the substrate W is not limited to vacuum. The substrate holding portion 43 may also hold the substrate W in a clamping or Bernoulli manner, for example.

[0094] The rotation drive unit 45 rotates the substrate holding unit 43 about the rotation axis A3. As a result, the substrate W and the substrate holding unit 43 rotate together about the rotation axis A3. The rotation axis A3 is an imaginary line extending along the vertical direction DZ. The rotation drive unit 45 includes, for example, an electric motor.

[0095] The first nozzle 47 supplies the first processing liquid to the substrate W from above. Specifically, the first nozzle 47 sprays the first processing liquid onto the rotating substrate W. The first nozzle moving part 47a moves the first nozzle 47 between a processing position and a retracted position. After moving to the processing position, the first nozzle 47 faces the substrate W in plan view. After moving to the retracted position, the first nozzle 47 is not facing the substrate W in plan view. Specifically, after moving to the retracted position, the first nozzle 47 is retracted to the periphery of the substrate W in plan view.

[0096] Specifically, the first nozzle moving part 47a has a first nozzle arm 471 and a first nozzle drive part 472. The first nozzle arm 471 extends in a generally horizontal direction. The first nozzle 47 is disposed at the front end of the first nozzle arm 471. The first nozzle drive part 472 causes the first nozzle arm 471 to rotate about a rotation axis extending in the vertical direction DZ along a generally horizontal plane. As a result, the first nozzle 47 moves in a circumferential direction about the rotation axis extending in the vertical direction DZ. The first nozzle drive part 472 includes an electric motor capable of rotating in both directions.

[0097] The first processing liquid supply pipe 473 supplies the first processing liquid to the first nozzle 47. The first processing liquid supply pipe 473 is a tubular component for the flow of the first processing liquid. In this embodiment, the first processing liquid is an acidic liquid. For example, the first processing liquid is hydrofluoric acid, a mixture of sulfuric acid and hydrogen peroxide water (SPM), sulfuric acid, sulfuric acid-hydrogen peroxide water, hydrofluoric acid-nitric acid (a mixture of hydrofluoric acid and nitric acid), or hydrochloric acid.

[0098] The second nozzle 49 supplies the second processing liquid to the substrate W from above. Specifically, the second nozzle 49 ejects the second processing liquid onto the rotating substrate W. The second nozzle moving part 49a, like the first nozzle moving part 47a, moves the second nozzle 49 between a processing position and a retracted position. Specifically, the second nozzle moving part 49a, like the first nozzle moving part 47a, has a second nozzle arm 491 and a second nozzle drive part 492. The configuration of the second nozzle arm 491 and the second nozzle drive part 492 is the same as that of the first nozzle arm 471 and the first nozzle drive part 472, therefore, description is omitted.

[0099] The second processing liquid supply pipe 493 supplies the second processing liquid to the second nozzle 49. The second processing liquid supply pipe 493 is a tubular component for the flow of the second processing liquid. In this embodiment, the second processing liquid is an alkaline liquid. For example, the second processing liquid is ammonia-hydrogen peroxide water (SC1), ammonia, ammonium fluoride solution, or tetramethylammonium hydroxide (TMAH).

[0100] The third nozzle 51 supplies the third processing liquid to the substrate W from above. Specifically, the third nozzle 51 sprays the third processing liquid onto the rotating substrate W. The third nozzle moving part 51a, like the first nozzle moving part 47a, moves the third nozzle 51 between a processing position and a retracted position. Specifically, the third nozzle moving part 51a, like the first nozzle moving part 47a, has a third nozzle arm 511 and a third nozzle drive part 512. The configuration of the third nozzle arm 511 and the third nozzle drive part 512 is the same as that of the first nozzle arm 471 and the first nozzle drive part 472, therefore, description is omitted.

[0101] The third processing fluid supply pipe 513 supplies the third processing fluid to the third nozzle 51. The third processing fluid supply pipe 513 is a tubular component for the flow of the third processing fluid. In this embodiment, the third processing fluid is an organic solvent. For example, the third processing fluid is isopropanol (IPA), methanol, ethanol, hydrofluoroether (HFE), or acetone.

[0102] The fourth nozzle 53 supplies rinsing fluid to the substrate W from above. Specifically, the fourth nozzle 53 sprays rinsing fluid onto the rotating substrate W. The fourth nozzle moving part 53a, like the first nozzle moving part 47a, moves the fourth nozzle 53 between a processing position and a retracted position. Specifically, the fourth nozzle moving part 53a, like the first nozzle moving part 47a, has a fourth nozzle arm 531 and a fourth nozzle drive part 532. The configuration of the fourth nozzle arm 531 and the fourth nozzle drive part 532 is the same as that of the first nozzle arm 471 and the first nozzle drive part 472, therefore, description is omitted.

[0103] The flushing fluid supply pipe 533 supplies flushing fluid to the fourth nozzle 53. The flushing fluid supply pipe 533 is a tubular component for the flow of flushing fluid. For example, the flushing fluid is pure water, carbonated water, electrolyzed water, hydrogen water, ozone water, or diluted hydrochloric acid.

[0104] A cup 55 is disposed around the substrate holding portion 43. The cup 55 surrounds the side of the substrate W held in the substrate holding portion 43. The cup 55 receives the first to third processing liquids and rinsing liquid that are scattered from the rotating substrate W.

[0105] Next, refer to Figure 6 The first conveying mechanism 7, the second conveying mechanism 23L, 23U, and the substrate mounting section 29L, 29U will be described.

[0106] Figure 6 This is a side view showing the first conveying mechanism 7, the second conveying mechanism 23L, 23U, and the substrate mounting portion 29L, 29U.

[0107] like Figure 6 As shown, the first conveying mechanism 7 has P first-hand 9s. In this specification, unless otherwise specified, P is an integer greater than 2, representing the total number of first-hand 9s. As a preferred example, the P first-hand 9s are arranged at equal intervals d along the vertical direction DZ.

[0108] Each of the first 9 supports either the substrate W before or after processing. Each of the first 9 supports one substrate W at a time.

[0109] In this embodiment, as an example, P=5, and the first conveying mechanism 7 has 5 first hands 9.

[0110] The second conveying mechanism 23L and the second conveying mechanism 23U each have Q second hands 25. In this specification, unless otherwise specified, Q is an integer of 3 or more, representing the total number of second hands 25 in each of the second conveying mechanisms 23L and 23U. As a preferred example, the Q second hands 25 are arranged at equal intervals d along the vertical direction DZ. That is, the vertical distance between two adjacent second hands 25 in the vertical direction DZ is interval d. Each second hand 25 supports one substrate W at a time.

[0111] For example, a portion of the Q second hands 25 can be used to support the substrate W before processing or to support the substrate W after processing.

[0112] For example, it is also possible that a portion of the Q second-hand 25 supports the substrate W before processing, while another portion of the second-hand 25 supports the substrate W after processing.

[0113] In this embodiment, as an example, Q=4, and the second conveying mechanism 23L and the second conveying mechanism 23U each have 4 second hands 25.

[0114] Below, the four second-hand 25s of each of the second conveying mechanism 23L and the second conveying mechanism 23U are respectively named as second-hand HA, second-hand HB, second-hand HC and second-hand HD from bottom to top.

[0115] Both the substrate mounting portion 29L and the substrate mounting portion 29U have R support portions 291. In this specification, unless otherwise specified, R is an integer of 2 or more, representing the total number of support portions 291 in both the substrate mounting portion 29L and the substrate mounting portion 29U. R is, for example, an even number of 2 or more. The R support portions 291 are arranged at intervals along the vertical direction DZ. Preferably, the R support portions 291 are arranged at equal intervals d along the vertical direction DZ. That is, the vertical distance between two adjacent support portions 291 in the vertical direction DZ is interval d. Each support portion 291 supports one substrate W. Specifically, each support portion 291 supports one substrate W in a horizontal position.

[0116] As a preferred example, the intervals d of the support portion 291, the first hand portion 9, and the second hand portion 25 are approximately equal.

[0117] In this embodiment, as an example, the lower segment 291A of the substrate mounting portion 29L and the substrate mounting portion 29U each supports the substrate W before processing by R / 2 support portions 291, and the upper segment 291B supports the substrate W after processing by R / 2 support portions 291.

[0118] In addition, in this embodiment, as an example, R=20, and the substrate mounting portion 29L and the substrate mounting portion 29U each have 20 support portions 291.

[0119] Furthermore, the spacing of the first hand 9 is not particularly limited; for example, it may not be equal, or only a portion of it may be equal. Similarly, the spacing of the second hand 25 is not particularly limited; for example, it may not be equal, or only a portion of it may be equal. Furthermore, the spacing of the support portions 291 is not particularly limited; for example, it may not be equal, or only a portion of it may be equal. Moreover, the spacing between adjacent support portions 291, the spacing between adjacent first hand 9, and the spacing between adjacent second hand 25 may also be unequal.

[0120] Next, refer to Figure 7 An example of the first substrate transfer method of this embodiment will be described. Figure 7 In the description, if there is no need to specify a particular substrate W, it is abbreviated as "substrate".

[0121] The first substrate transport method is performed using a second transport mechanism 23 that transports substrates between the substrate placement section 29 and the processing unit 21. In the first substrate transport method, M second transport mechanisms 25 are shared between the substrate before processing and the substrate after processing, thereby transporting multiple substrates. In this specification, unless otherwise specified, M is an integer greater than or equal to 1. The first substrate transport method is equivalent to an example of a "substrate transport method".

[0122] Figure 7 This diagram illustrates an example of the entire process of the first substrate transport method. Figure 7 For simplicity, this description focuses on the substrate placement section 29L located in the lower section LW, the second conveying mechanism 23L located in the lower section LW, and the processing units 21A and 21B among the multiple processing units 21 located in the lower section LW. Processing units 21A and 21B are positioned at different locations. Furthermore, the lower section 291A of the substrate placement section 29L is used to place the substrate before processing, and the upper section 291B of the substrate placement section 29L is used to place the substrate after processing.

[0123] Furthermore, in the description of the first substrate transfer method, the second hand HA is sometimes referred to as "first non-shared hand HA", the second hand HB as "shared hand HB", and the second hand HC as "second non-shared hand HC". Figure 7 In the exemplary first substrate transport method shown, the second hand HD is not used.

[0124] Furthermore, in the following description, the transport cycle CY represents a round of operations in the following sequence: the second transport mechanism 23 receives the unprocessed substrate from the substrate placement section 29, then the second transport mechanism 23 transports the unprocessed substrate into the processing unit 21, and the second transport mechanism 23 removes the processed substrate from the processing unit 21, and then the second transport mechanism 23 places the processed substrate into the substrate placement section 29.

[0125] like Figure 7 As shown, at a certain time, 10 untreated substrates W1 to W10 are placed along the vertical direction DZ in the lower section 291A of the substrate placement section 29L, while no substrate is placed in the upper section 291B of the substrate placement section 29L.

[0126] In the first substrate transfer method, within one transfer cycle CY, the second transfer mechanism 23L transfers two unprocessed substrates W1 and W2 into two processing units 21A and 21B, and transfers two processed substrates WX1 and WX2 out of the two processing units 21A and 21B. The transfer cycle CY is repeated.

[0127] Specifically, in the first substrate transport method, within one transport cycle CY, the second transport mechanism 23L receives two substrates W1 and W2 from the substrate placement section 29L before they are processed by the processing units 21A and 21B, and transports the two substrates W1 and W2 into two processing units 21A and 21B among the multiple processing units 21. It also transports two substrates WX1 and WX2 after they have been processed by the two processing units 21A and 21B from the two processing units 21A and 21B, and delivers the two substrates WX1 and WX2 to the substrate placement section 29L.

[0128] More specifically, the four second hands HA to HD include the first non-shared hand HA, the shared hand HB, and the second non-shared hand HC. The shared hand HB is positioned between the first non-shared hand HA and the second non-shared hand HC. The shared hand HB is adjacent to the second non-shared hand HC in the first specific direction SD1. The first non-shared hand HA is adjacent to the shared hand HB in the first specific direction SD1.

[0129] The first specific direction SD1 represents the direction from the second non-shared hand HC toward the first non-shared hand HA. Conversely, the second specific direction SD2 is the opposite direction of the first specific direction SD1, representing the direction from the first non-shared hand HA toward the second non-shared hand HC. Both the first specific direction SD1 and the second specific direction SD2 are approximately parallel to the up / down direction DZ. For example, the first specific direction SD1 represents the down direction, and the second specific direction SD2 represents the up direction.

[0130] The first non-shared hand HA, the shared hand HB, and the second non-shared hand HC are arranged continuously along the vertical direction DZ from the first non-shared hand HA to the second non-shared hand HC.

[0131] Furthermore, within one transport cycle CY, the first non-shared hand HA only supports the substrate W1 before processing by processing unit 21B. Additionally, within one transport cycle CY, the shared hand HB supports the substrate W2 before processing by processing unit 21A and the substrate WX1 after processing by processing unit 21B at different times. Moreover, within one transport cycle CY, the second non-shared hand HC only supports the substrate WX2 after processing by processing unit 21A.

[0132] Continue to refer to Figure 7 The states ST1 to ST4 of the second conveying mechanism 23L within one conveying cycle CY are explained.

[0133] In state ST1, where the second conveying mechanism 23L has received two substrates W1 and W2 from the substrate placement section 29L, the second non-shared hand HC does not support substrate W, while the shared hand HB and the first non-shared hand HA support substrates W1 and W2. In the first substrate conveying method, the second hand HD is not used.

[0134] State ST2 following state ST1 indicates the state of the second conveying mechanism 23L when the second non-shared hand HC, which does not support the substrate, moves the processed substrate WX2 out of the processing unit 21A, and the shared hand HB moves the unprocessed substrate W2 into the same processing unit 21A.

[0135] State ST3 following state ST2 indicates the state of the second conveying mechanism 23L when the shared hand HB, which does not support the substrate in state ST2, moves the processed substrate WX1 out of the processing unit 21B, and the first non-shared hand HA moves the unprocessed substrate W1 into the same processing unit 21B.

[0136] State ST4 following state ST3 indicates the state of the second conveying mechanism 23L when the substrate WX1 is supported by the shared hand HB, the substrate WX2 is supported by the second non-shared hand HC, and the first non-shared hand HA does not support the substrate.

[0137] As referenced above Figure 7 As explained, according to this embodiment, the second transport mechanism 23L of the substrate processing apparatus 100 includes a first non-shared hand HA, a shared hand HB, and a second non-shared hand HC arranged continuously in the vertical direction DZ. Therefore, when performing the removal and loading of substrates W1, W2, WX1, and WX2 to processing units 21A and 21B, compared to the case where the substrates before and after processing do not share a hand, the vertical direction DZ movement distance of the first non-shared hand HA to the second non-shared hand HC (specifically, the second hand HA to HD) can be shortened. As a result, the throughput of the second transport mechanism 23L in transporting substrates W1, W2, WX1, and WX2 can be improved. (Refer to...) Figure 8 , Figure 9 , Figure 11 and Figure 12 Specific examples are given to illustrate this point in detail.

[0138] Next, refer to Figure 8 and Figure 9 A detailed description of an example of the first substrate transport method is provided. In the following description, when referring to the entirety of the first non-shared hand HA, shared hand HB, second non-shared hand HC, and second hand HD, it is sometimes referred to as the second hand HA to HD to avoid redundancy. In addition, when there is no need to specify a particular substrate W, it is abbreviated as "substrate".

[0139] Figure 8 and Figure 9 This is a flowchart illustrating an example of a first substrate transport method. For example... Figure 8 and Figure 9As shown, the first substrate transfer method includes steps S1 to S12 within one transfer cycle CY. In the first substrate transfer method, the second hand (HD) is not used. In steps S1 to S12, the second hand (HA to HD) is moved by the second hand drive unit 17, which is controlled by the control unit 200.

[0140] like Figure 8 As shown, in step S1, the first non-shared hand HA supports the substrate W1 before processing, and the shared hand HB supports the substrate W2 before processing. On the other hand, the second non-shared hand HC does not support the substrate. The second non-shared hand HC faces the transfer port 41a of the processing unit 21A. Then, the second non-shared hand HC begins to move towards the processed substrate WX2 located inside the processing unit 21A.

[0141] Furthermore, the state representation of the second hand HA to HD in step S1 Figure 7 The state shown is that the second hands HA to HD of ST1 have moved to the position of processing unit 21A. In addition, during the processing of substrate WX2, the transfer port 41a is blocked by a shielding component (not shown).

[0142] Next, in step S2, the second non-shared hand HC removes the processed substrate WX2 from the processing unit 21A through the transfer port 41a.

[0143] Next, in step S3, the second non-shared hand HC returns to its previous position. Then, the second hands HA to HD begin moving in the second specific direction SD2.

[0144] Next, in step S4, the second hand HA~HD moves a distance d in the second specific direction SD2 and then stops. The distance d is approximately equal to the vertical distance d between the second non-shared hand HC and the shared hand HB in the vertical direction. Figure 6 As a result, the shared hand HB faces the transfer port 41a of the processing unit 21A. Then, the shared hand HB begins to move into the processing unit 21A.

[0145] Next, in step S5, the common hand HB moves the substrate W2 before processing into the processing unit 21A through the transfer port 41a.

[0146] Next, in step S6, the shared hand HB returns to its previous position. Then, the second hand HA~HD begins processing the next processing unit 21B. Figure 9 )move.

[0147] Next, as Figure 9As shown, in step S7, the first non-shared hand HA supports the substrate W1 before processing, and the second non-shared hand HC supports the substrate WX2 after processing. On the other hand, the shared hand HB does not support the substrate. The shared hand HB faces the transfer port 41a of the processing unit 21B. Then, the shared hand HB begins to move towards the processed substrate WX1 located inside the processing unit 21B.

[0148] Furthermore, the state representation of the second hand HA to HD in step S7 Figure 8 The state shown in step S6 indicates that the second hands HA to HD have moved to the position of processing unit 21B. Additionally, during the processing of substrate WX1, the transfer port 41a is blocked by a shielding component (not shown).

[0149] Next, in step S8, the common hand HB moves the processed substrate WX1 out of the processing unit 21B through the transfer port 41a.

[0150] Next, in step S9, the shared hand HB returns to its original position before moving. Then, the second hand HA to HD begin moving in the second specific direction SD2.

[0151] Next, in step S10, the second hand HA~HD moves a distance d in the second specific direction SD2 and then stops. The distance d is approximately equal to the vertical distance d between the shared hand HB and the first non-shared hand HA in the vertical direction. Figure 6 As a result, the first non-shared hand HA faces the transfer port 41a of the processing unit 21B. Then, the first non-shared hand HA begins to move into the interior of the processing unit 21B.

[0152] Next, in step S11, the first non-shared hand HA moves the substrate W1 before processing into the processing unit 21B through the transfer port 41a.

[0153] Next, in step S12, the first non-shared hand HA returns to its original position before moving. Then, the second hands HA to HD begin moving towards the substrate mounting section 29L ( Figure 7 The shared hand HB and the second non-shared hand HC then deliver substrates WX1 and WX2 to the substrate mounting section 29L, respectively.

[0154] And so, as Figure 8 and Figure 9 As shown, steps S1 to S12 are executed within one transfer cycle CY. As a result, within one transfer cycle CY, two unprocessed substrates W1 and W2 can be transferred into two processing units 21A and 21B, and two processed substrates WX1 and WX2 can be transferred out from two processing units 21A and 21B.

[0155] In particular, in this embodiment, the shared hand HB is shared between the action of moving the substrate W2 before processing into the processing unit 21A and the action of moving the substrate WX1 after processing out of the processing unit 21B. Therefore, the second non-shared hand HC to the first non-shared hand HA can be used sequentially in the first specific direction SD1 for moving out the substrates WX2 and WX1 and moving in the substrates W1 and W2.

[0156] As a result, to move the processed substrate WX2 from processing unit 21A to the same processing unit 21A after the processing unit has removed the processed substrate WX2, the shared hand HB only needs to move a distance d in the second specific direction SD2 (the interval d between the second non-shared hand HC and the shared hand HB). Similarly, to move the processed substrate WX1 from processing unit 21B to the same processing unit 21B after the processing unit has removed the processed substrate WX1, the first non-shared hand HA only needs to move a distance d in the second specific direction SD2 (the interval d between the shared hand HB and the first non-shared hand HA). Therefore, compared to the case where the processed and unprocessed substrates are not handled by a shared hand, the throughput of the second transfer mechanism 23L in moving substrates W1, W2, WX1, and WX2 can be improved. The following will discuss... Figure 11 and Figure 12 The second substrate transport method shown is compared to illustrate this point in detail.

[0157] In addition, in this embodiment, the transfer cycle CY (steps S1 to S12) of the first substrate transfer method is repeatedly executed while changing the processing unit 21.

[0158] In addition, the second transport unit 23U ( Figure 6 Similar to the second conveying mechanism 23L, the first substrate conveying method is performed.

[0159] Next, refer to Figure 10 An example of the second substrate transport method of this embodiment will be described. The second substrate transport method is performed using a second transport mechanism 23 that transports substrate W between the substrate placement section 29 and the processing unit 21. In the second substrate transport method, of the Q second hands 25, a portion of the second hands 25 continuously in the vertical direction DZ supports only the substrate W before processing, and another portion of the second hands 25 continuously in the vertical direction DZ supports only the substrate W after processing, thereby transporting multiple substrates W. Therefore, in the second substrate transport method, the second hands 25 are not shared between the substrate W after processing and the substrate W before processing.

[0160] Figure 10 This diagram illustrates an example of the entire process of the second substrate transfer method. Figure 10 In, with Figure 7Similarly, the illustrations focus on the substrate placement section 29L, the second transport mechanism 23L, and the processing units 21A and 21B. Furthermore, the lower section 291A of the substrate placement section 29L is used to place the substrate before processing, and the upper section 291B of the substrate placement section 29L is used to place the substrate after processing. Moreover, the definition of the transport cycle CY in the second substrate transport method is the same as the definition of the transport cycle CY in the first substrate transport method.

[0161] like Figure 10 As shown, at a certain time, 10 untreated substrates W1 to W10 are placed along the vertical direction DZ in the lower section 291A of the substrate placement section 29L, while no substrate is placed in the upper section 291B of the substrate placement section 29L.

[0162] In the second substrate transfer method, similar to the first substrate transfer method, within one transfer cycle CY, the second transfer mechanism 23L receives two substrates W1 and W2 from the substrate placement section 29L before processing by processing units 21A and 21B, and transfers the two substrates W1 and W2 into two processing units 21A and 21B among the multiple processing units 21. It also removes two substrates WX1 and WX2 after processing by the two processing units 21A and 21B from the two processing units 21A and 21B, and delivers the two substrates WX1 and WX2 to the substrate placement section 29L. The transfer cycle CY is repeated.

[0163] Specifically, in the second substrate transport method, within one transport cycle CY, in the four second hands HA~HD, the consecutive second hands HA and HB on the vertical direction DZ of the lower segment only support the untreated substrates W1 and W2. Furthermore, the consecutive second hands HC and HD on the vertical direction DZ of the upper segment only support the treated substrates WX1 and WX2.

[0164] Continue to refer to Figure 10 The states ST11 to ST14 of the second conveying mechanism 23L within one conveying cycle CY will be explained.

[0165] In state ST11, where the second conveying mechanism 23L has received two substrates W1 and W2 from the substrate placement section 29L, the second hands HA and HB support substrates W1 and W2 respectively, while the second hands HC and HD do not support substrates.

[0166] State ST12 after state ST11 indicates the state of the second conveying mechanism 23L when the second hand HD moves the processed substrate WX2 out of the processing unit 21A and the second hand HB moves the unprocessed substrate W2 into the same processing unit 21A.

[0167] State ST13 after state ST12 indicates the state of the second transfer mechanism 23L when the second transfer HC removes the processed substrate WX1 from the processing unit 21B and the second transfer HA moves the unprocessed substrate W1 into the same processing unit 21B.

[0168] State ST14 following state ST13 indicates the state of the second transport mechanism 23L when the substrates WX1 and WX2 are supported by the second HC and HD, but the substrates are not supported by the second HA and HB.

[0169] As referenced above Figure 10 As explained, according to this embodiment, the second conveying mechanism 23L of the substrate processing apparatus 100 includes: dedicated second hands HA and HB for supporting the substrates W1 and W2 before processing; and dedicated second hands HC and HD for supporting the substrates WX1 and WX2 after processing. Therefore, it is possible to prevent the processing liquid in the processing unit 21 from adhering to the second hands HA and HB via the processed substrates WX1 and WX2. Furthermore, it is possible to prevent the adhering of processing liquid to the newly supported substrates before processing on the second hands HA and HB.

[0170] Next, refer to Figure 11 and Figure 12 A detailed description of an example of the second substrate transport method is provided. In the following description, unless a specific substrate W is specified, it is abbreviated as "substrate".

[0171] Figure 11 and Figure 12 This is a flowchart illustrating an example of a second substrate transport method. For example... Figure 11 and Figure 12 As shown, the second substrate transfer method includes steps S21 to S32 within one transfer cycle CY. In steps S21 to S32, the second hand HA to HD are moved by the second hand drive unit 17 controlled by the control unit 200.

[0172] like Figure 11 As shown, in step S21, the second hands HA and HB support the unprocessed substrates W1 and W2, respectively. On the other hand, the second hands HC and HD do not support the substrate. The second hand HD faces the transfer port 41a of the processing unit 21A. Then, the second hand HD begins to move towards the processed substrate WX2 located inside the processing unit 21A.

[0173] Furthermore, the state representation of the second hand HA to HD in step S21 Figure 10 The state shown is that the second hand HA~HD of state ST11 has been moved to the position of processing unit 21A.

[0174] Next, in step S22, the second HD takes out the processed substrate WX2 from the processing unit 21A through the transfer port 41a.

[0175] Next, in step S23, the second hand HD returns to its original position before moving. Then, the second hand HA~HD begins to move in the second specific direction SD2.

[0176] Next, in step S24, the second hands HA to HD move a distance of 2d (=2×d) in the second specific direction SD2 and then stop. The distance 2d is approximately equal to the vertical distance DZ between the second hands HD and HB, which is 2d. Figure 6 As a result, the second HB moves toward the transfer port 41a of the processing unit 21A. Then, the second HB begins to move toward the interior of the processing unit 21A.

[0177] Next, in step S25, the second hand HB moves the substrate W2 before processing into the processing unit 21A through the transfer port 41a.

[0178] Next, in step S26, the second hand HB returns to its previous position. Then, the second hand HA~HD begins processing the next processing unit 21B. Figure 12 )move.

[0179] Next, as Figure 12 As shown, in step S27, the second hand HA supports the substrate W1 before processing, while the second hand HB does not support the substrate. On the other hand, the second hand HC does not support the substrate, while the second hand HD supports the processed substrate WX2. The second hand HC faces the transfer port 41a of the processing unit 21B. Then, the second hand HC begins to move towards the processed substrate WX1 located inside the processing unit 21B.

[0180] Furthermore, the state representation of the second hand HA to HD in step S27 Figure 11 The state shown in step S26 is that the second hand HA~HD has been moved to the position of processing unit 21B.

[0181] Next, in step S28, the second hand HC removes the processed substrate WX1 from the processing unit 21B through the transfer port 41a.

[0182] Next, in step S29, the second hand HC returns to its original position before moving. Then, the second hands HA to HD begin moving in the second specific direction SD2.

[0183] Next, in step S30, the second hands HA to HD move a distance of 2d (=2×d) in the second specific direction SD2 and then stop. The distance 2d is approximately equal to the vertical distance 2d between the second hands HC and HA in the vertical direction DZ. Figure 6As a result, the second HA is positioned opposite the transfer port 41a of the processing unit 21B. Then, the second HA begins to move into the interior of the processing unit 21B.

[0184] Next, in step S31, the second hand HA transports the substrate W1 before processing into the processing unit 21B through the transfer port 41a.

[0185] Next, in step S32, the second hand HA returns to its previous position. Then, the second hand HA~HD begins to move towards the substrate mounting section 29L ( Figure 10 Then, the second HC and HD deliver substrates WX1 and WX2 to the substrate mounting section 29L, respectively.

[0186] And so, as Figure 11 and Figure 12 As shown, steps S21 to S32 are executed within one transfer cycle CY. As a result, within one transfer cycle CY, two unprocessed substrates W1 and W2 can be transferred into two processing units 21A and 21B by the second hands HA and HB, and two processed substrates WX1 and WX2 can be transferred out of two processing units 21A and 21B by the second hands HC and HD.

[0187] In addition, in this embodiment, regarding the second substrate transfer method, the transfer cycle CY (steps S21 to S32) is repeatedly executed while changing the processing unit 21.

[0188] In addition, the second transport unit 23U ( Figure 6 Similar to the second conveying mechanism 23L, the second substrate conveying method is performed.

[0189] Here, refer to Figure 8 and Figure 11 Compare the first substrate transport method with the second substrate transport method. Figure 8 As shown in steps S3 and S4, the vertical movement distance of the shared hand HB in the vertical direction DZ is "d". On the other hand, as... Figure 11 As shown in steps S23 and S24, the moving distance of the second hand HB is "2d". Therefore, the moving distance d of the common hand HB in the first substrate transfer method is less than the moving distance 2d of the second hand HB in the second substrate transfer method. Similarly, as Figure 9 Steps S9, S10 and Figure 12 As shown in steps S29 and S30, the moving distance d of the first non-shared hand HA in the first substrate transfer method is less than the moving distance 2d of the second hand HA in the second substrate transfer method.

[0190] As a result, in the first substrate transfer method, compared to the second substrate transfer method, the throughput of the second transfer mechanism 23 in the action of transferring substrates W1, W2, WX1, and WX2 can be improved. In other words, in the first substrate transfer method, compared to the case where the substrates before and after processing are not handled together, the throughput of the second transfer mechanism 23 in the action of transferring substrates W1, W2, WX1, and WX2 can be improved.

[0191] For example, in the first substrate transport method, compared with the second substrate transport method, the vertical movement distance DZ of the second transport mechanism HA to HD is shorter by "d" relative to one processing unit 21. Moreover, since the transport cycle CY is repeatedly executed, shortening the movement distance by "d" relative to one processing unit 21 is useful for improving the productivity of the second transport mechanism 23 in transporting the substrate.

[0192] Above, refer to Figures 7-12 The first substrate transport method and the second substrate transport method have been described. For example, after the second transport mechanism 23 is configured to perform either the first substrate transport method or the second substrate transport method, the substrate processing apparatus 100 is delivered to the user by the manufacturer. That is, either the first substrate transport method or the second substrate transport method is installed on the substrate processing apparatus 100.

[0193] However, both the first substrate transport method and the second substrate transport method can be installed on the substrate processing apparatus 100, and the first substrate transport method and the second substrate transport method can be selectively executed. In this case, the user can select the ideal substrate transport method according to the situation. As a result, the user's convenience can be improved.

[0194] Based on the above references Figures 7-9 In the illustrative first substrate transfer method, three second-hand 25 units are used. However, the first substrate transfer method is not limited to using three second-hand 25 units, and can be implemented as follows: Figure 13 This is generalized. Furthermore, in the following description, the number of processing units 21 performing substrate W loading and unloading within one transport cycle CY is denoted as "N". In this specification, unless otherwise specified, N is an integer greater than 2. The description focuses on N processing units 21. Additionally, for ease of understanding, the description focuses on N+1 secondary processing units 25 used in the first substrate transport method out of a plurality (Q) of secondary processing units 25.

[0195] Figure 13 This diagram is used to illustrate the generalization of the first substrate transport method. Figure 13 The image shows one of a plurality of second conveying mechanisms 23. For example... Figure 13As shown, in the first substrate transport method, within one transport cycle CY, the second transport mechanism 23 receives N substrates W from the substrate placement section 29 before processing by the processing unit 21, and transports the N substrates W into N processing units 21_1 to 21_N among the multiple processing units 21, and transports out N substrates W after processing by the N processing units 21_1 to 21_N from the N processing units 21_1 to 21_N, and delivers the N processed substrates W to the substrate placement section 29.

[0196] Furthermore, the N processing units 21_1 to 21_N may be a portion of the multiple processing units 21 provided by the substrate processing apparatus 100 (the total number of processing units 21 is greater than N), or they may be all processing units 21 (the total number of processing units 21 is equal to N).

[0197] Multiple second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S. M is an integer greater than or equal to 1. The M shared hands H_1 to H_M are arranged between the first non-shared hand H_F and the second non-shared hand H_S.

[0198] The total number of the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S is N+1. Furthermore, M = N-1. That is to say, the second conveying mechanism 23 has N-1 shared hands H_1 to H_M.

[0199] In addition, the N+1 second hands 25 (first non-shared hands H_F, shared hands H_1 to H_M, and second non-shared hands H_S) can be a part of the multiple (Q) second hands 25 possessed by the second conveying mechanism 23, or they can be all the second hands 25.

[0200] The first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S are arranged continuously along the vertical direction DZ from the first non-shared hand H_F to the second non-shared hand H_S.

[0201] Furthermore, when the second conveying mechanism 23 has received the N substrates W before processing from the substrate placement section 29, the second non-shared hand H_S does not support the substrates W, while the M shared hands H_1 to H_M and the first non-shared hand H_F support the substrates W. In other words, the M shared hands H_1 to H_M and the first non-shared hand H_F support the N substrates W.

[0202] Within one transport cycle CY, M shared hands H_1 to H_M support the substrate W before and after processing by the processing unit 21 at different times.

[0203] Within one transport cycle CY, the first non-shared hand H_F only supports the substrate W before it is processed by the processing unit 21.

[0204] Within one transport cycle CY, the second non-shared hand H_S only supports the substrate W processed by the processing unit 21.

[0205] Continue to refer to Figure 13 The operation of the second conveying mechanism 23 in the first substrate conveying method is described in detail.

[0206] Within one transport cycle CY, M shared hands H_1 to H_M and the first non-shared hand H_F each receive the substrate W before processing from the substrate placement section 29.

[0207] Within one transfer cycle CY, the second non-shared hand H_S moves to a position opposite to the transfer port 41a of the processing unit 21_1, and removes the processed substrate W from the processing unit 21_1.

[0208] Within one transfer cycle CY, by moving N+1 second hands 25 a distance d in the second specific direction SD2, the shared hand H_M among the M shared hands H_1 to H_M adjacent to the second non-shared hand H_S is moved to a position opposite to the transfer port 41a of the processing unit 21_1. The distance d represents the interval between adjacent second hands 25 in the vertical direction DZ. Then, the shared hand H_M transfers the substrate W before processing into the processing unit 21_1, which has already had the substrate W removed by the second non-shared hand H_S. The processing unit 21_1 processes the substrate W.

[0209] Within one transfer cycle CY, by moving N+1 second hands 25, the shared hand H_M adjacent to the second non-shared hand H_S moves to a position opposite to the transfer port 41a of processing unit 21_2. Processing unit 21_2 is a different processing unit from processing unit 21_1, which has already been transferred into the substrate W before processing by shared hand H_M. Then, shared hand H_M removes the processed substrate W from processing unit 21_2.

[0210] Within one transfer cycle CY, by moving N+1 second hands 25 a distance d in the second specific direction SD2, the common hand H_M-1, which is adjacent to the common hand H_M among the M common hands H_1 to H_M, moves to a position opposite to the transfer port 41a of the processing unit 21_2. Common hand H_M-1 is adjacent to the common hand H_M in the first specific direction SD1. Then, common hand H_M-1 transfers the substrate W, which has already been moved out of the substrate W by the common hand H_M, into the processing unit 21_2 before processing. The processing unit 21_2 processes the substrate W.

[0211] Within one transfer cycle CY, by moving N+1 second hands 25, the shared hand H_M-1 adjacent to the shared hand H_M moves to a position opposite to the transfer port 41a of the processing unit 21_3. The processing unit 21_3 is a different processing unit from the processing unit 21_2, which was moved into the substrate W before processing by the shared hand H_M-1. Then, the shared hand H_M-1 removes the processed substrate W from the processing unit 21_3.

[0212] Within one transfer cycle CY, by moving N+1 second hands 25 a distance d in the second specific direction SD2, the shared hand H_M-2 adjacent to the shared hand H_M-1 is moved to a position opposite to the transfer port 41a of the processing unit 21_3. The shared hand H_M-2 is adjacent to the shared hand H_M-1 in the first specific direction SD1. Then, the shared hand H_M-2 transfers the substrate W before processing into the processing unit 21_3, which has already had the substrate W removed by the shared hand H_M-1. The processing unit 21_3 processes the substrate W.

[0213] Within one transfer cycle CY, by moving N+1 second hands 25, the shared hand H_M-2 adjacent to the shared hand H_M-1 moves to a position opposite to the transfer port 41a of the processing unit 21_4. The processing unit 21_4 is a different processing unit from the processing unit 21_3, which was moved into the substrate W before processing by the shared hand H_M-2. Then, the shared hand H_M-2 removes the processed substrate W from the processing unit 21_4.

[0214] From this point onward, similarly, within one transport cycle CY, the substrate W is transported in and out of processing units 21_4 to 21_N-1 using shared hands H_M-3 to H_2. Processing units 21_4 to 21_N-1 process the substrate W.

[0215] Then, within one transfer cycle CY, by moving N+1 second hands 25, the shared hand H_1 adjacent to the shared hand H_2, i.e., the shared hand H_1 adjacent to the first non-shared hand H_F, is moved to a position opposite to the transfer port 41a of the processing unit 21_N. The processing unit 21_N is a different processing unit from the processing unit 21_N-1 that has already been moved out of the substrate W by the shared hand H_2. The shared hand H_1 is adjacent to the shared hand H_2 in the first specific direction SD1. Then, the shared hand H_1 moves the processed substrate W out of the processing unit 21_N.

[0216] In other words, within one transfer cycle CY, the processed substrate W is transferred from the Nth processing unit 21_N using a shared hand H_1.

[0217] Then, within one transport cycle CY, by moving N+1 second hands 25 a distance d in the second specific direction SD2, the first non-shared hand H_F moves to a position opposite to the transport port 41a of the processing unit 21_N. Subsequently, the first non-shared hand H_F transports the substrate W, which has been removed from the substrate W by the shared hand H_1 adjacent to the first non-shared hand H_F, into the processing unit 21_N, and then into the substrate W before processing. The processing unit 21_N processes the substrate W.

[0218] In other words, within one transfer cycle CY, the first non-shared hand H_F transfers the substrate W before processing to the Nth processing unit 21_N.

[0219] Then, the M shared hands H_1 to H_M and the second non-shared hand H_S deliver the processed N substrates W to the substrate mounting section 29.

[0220] As referenced above Figure 13 As explained, in this embodiment, the shared hands H_1 to H_M are shared between the action of moving the substrate W before processing into processing units 21_1 to 21_N-1 and the action of moving the substrate W after processing out of processing units 21_2 to 21_N. Therefore, the second non-shared hands H_S to the first non-shared hands H_F can be used sequentially for moving the substrate W out and moving the substrate W in, facing the first specific direction SD1.

[0221] As a result, in order to move the unprocessed substrate W into the same processing unit 21 after the processed substrate W has been removed from the processing unit 21, the shared hands H_1 to H_M and the first non-shared hand H_F only need to move a distance d (the interval d of the second hand 25) in the second specific direction SD2. Therefore, compared to the case where the unprocessed substrate W and the processed substrate W do not share hands (e.g., the second substrate transfer method), the productivity of the second transfer mechanism 23L in transferring the substrate W can be improved.

[0222] Next, having generalized the first substrate transfer method, refer to Figures 14-16 The relationship between the total number Q of the second substrate 25, the number of the second substrate 25 used in the first substrate transport method, and the number of the second substrate 25 used in the second substrate transport method is explained. Figures 14-16 The diagram shows one of the multiple second transport mechanisms 23. Additionally, the number of processing units 21 that perform the loading and unloading of substrate W within one transport cycle CY is denoted as "N".

[0223] Figure 14This is a graph showing the relationship between the total number Q of the second transfer mechanism 25, the number of second transfer mechanisms 25 used in the first substrate transfer method, and the number of second transfer mechanisms 25 used in the second substrate transfer method when the second transfer mechanism 23 has 2N second transfer mechanisms 25.

[0224] like Figure 14 As shown, Q = 2 × N = 2N. Therefore, the total number Q of the multiple second-hand 25s possessed by the second conveying mechanism 23 is 2N. That is, the second conveying mechanism 23 has 2N second-hand 25s. In this example, N is an integer greater than 2.

[0225] Furthermore, when the first substrate transfer method is installed in the substrate processing apparatus 100, the 2N second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S. M is an integer greater than or equal to 1.

[0226] The total number of the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S is N+1. Furthermore, M = N-1. That is, the second transport mechanism 23 has N-1 shared hands H_1 to H_M. In addition, in the first substrate transport method, N-1 of the Q (=2N) second hands 25 are not used.

[0227] On the other hand, when the second substrate transfer method is installed in the substrate processing apparatus 100, for example, among the 2N second hands 25, N consecutive second hands 25 in the vertical direction DZ (e.g., the lower second hands 25) support the substrate W before processing, and another N consecutive second hands 25 in the vertical direction DZ (e.g., the upper second hands 25) support the substrate W after processing.

[0228] As referenced above Figure 14 As explained, according to this embodiment, by setting the total number Q of the second transfer mechanism 25 to 2N, all the second transfer mechanisms 25 can be used when the second substrate transfer method is installed on the substrate processing apparatus 100. As a result, the throughput when transferring substrate W can be increased in the second substrate transfer method. In addition, by pre-equipping the second transfer mechanism 23 with 2N second transfer mechanisms 25, when the first substrate transfer method is installed on the substrate processing apparatus 100, there is no need to add new second transfer mechanisms 25, and the existing N+1 second transfer mechanisms 25 can be used.

[0229] For example, when N=2, the first substrate transfer method can be performed using a first non-shared hand H_F, a shared hand H_1, and a second non-shared hand H_S. That is, the first substrate transfer method can be performed with a minimal configuration of the second hand 25. Therefore, the cost of the second transfer mechanism 23 can be reduced.

[0230] Here, for example, a reference is installed on the substrate processing apparatus 100. Figure 14 Either the first substrate transfer method or the second substrate transfer method described herein.

[0231] However, both the first substrate transfer method and the second substrate transfer method can be installed on the substrate processing apparatus 100.

[0232] Specifically, the second conveying mechanism 23 can also be controlled by the control unit 200 and operate in either the first substrate conveying mode MD1 or the second substrate conveying mode MD2.

[0233] The first substrate transport mode MD1 is the mode in which the second transport mechanism 23 performs the first substrate transport method. Specifically, the first substrate transport mode MD1 is the mode in which N+1 of the 2N second hands 25 are used as the first non-shared hands H_F, M shared hands H_1 to H_M, and the second non-shared hands H_S.

[0234] The second substrate transport mode MD2 is the mode in which the second transport mechanism 23 performs the second substrate transport method. Specifically, the second substrate transport mode MD2 is a mode in which N of the 2N second hands 25 are used to support only the substrate W before it is processed by the processing unit 21, and the other N second hands 25 are used to support only the substrate W after it has been processed by the processing unit 21.

[0235] The user can operate the second transport mechanism 23 in either the first substrate transport mode MD1 or the second substrate transport mode MD2 via the operation control unit 200. This improves user convenience. Similarly, the manufacturer of the substrate processing apparatus 100 can also set it to either the first substrate transport mode MD1 or the second substrate transport mode MD2 before shipping via the operation control unit 200. This improves manufacturer convenience.

[0236] Figure 15 This is a graph showing the relationship between the total number Q of the second transfer mechanism 25, the number of second transfer mechanisms 25 used in the first substrate transfer method, and the number of second transfer mechanisms 25 used in the second substrate transfer method when the second transfer mechanism 23 has N+1 second transfer mechanisms 25 and N is an odd number.

[0237] like Figure 15 As shown, Q = N+1. Therefore, in the second conveying mechanism 23, the total number Q of multiple second-hand 25s is N+1. That is, the second conveying mechanism 23 has N+1 second-hand 25s. In this example, N is an odd number greater than 3.

[0238] Furthermore, when the first substrate transfer method is installed in the substrate processing apparatus 100, the N+1 second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S. M is an integer greater than or equal to 1.

[0239] The total number of the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S is N+1. Furthermore, M = N-1. That is, the second transport mechanism 23 has N-1 shared hands H_1 to H_M. Specifically, in the first substrate transport method, all of the Q (=N+1) second hands 25 are used. In other words, according to this embodiment, the number of second hands 25 when performing the first substrate transport method is optimized, and there are no redundant second hands 25. Therefore, the cost of the second transport mechanism 23 can be reduced.

[0240] On the other hand, when the second substrate transfer method is installed in the substrate processing apparatus 100, for example, among the N+1 second hands 25, (N+1) / 2 second hands 25 (e.g., the lower second hands 25) continuously along the vertical direction DZ support the substrate W before processing, and another (N+1) / 2 second hands 25 (e.g., the upper second hands 25) continuously along the vertical direction DZ support the substrate W after processing.

[0241] Here, for example, a reference is installed on the substrate processing apparatus 100. Figure 15 Either the first substrate transfer method or the second substrate transfer method described herein.

[0242] Among them, with Figure 14 Similarly, the second conveying mechanism 23 can also be controlled by the control unit 200 and operate in either the first substrate conveying mode MD10 or the second substrate conveying mode MD20.

[0243] The first substrate transport mode MD10 is the mode in which the second transport mechanism 23 performs the first substrate transport method. Specifically, the first substrate transport mode MD10 is a mode in which Q (=N+1) second hands 25 are all used as the first non-shared hands H_F, M shared hands H_1~H_M, and the second non-shared hands H_S.

[0244] The second substrate transport mode MD20 is the mode in which the second transport mechanism 23 performs the second substrate transport method. Specifically, the second substrate transport mode MD20 is a mode in which (N+1) / 2 consecutive second hands 25 in the vertical direction DZ of Q (=N+1) second hands 25 are used to support only the substrate W before it is processed by the processing unit 21, and another (N+1) / 2 consecutive second hands 25 in the vertical direction DZ are used to support only the substrate W after it has been processed by the processing unit 21.

[0245] When both the first substrate transport mode MD10 and the second substrate transport mode MD20 are installed, the convenience for users and manufacturers can be improved in the same way as when both the first substrate transport mode MD1 and the second substrate transport mode MD2 are installed.

[0246] Figure 16 This is a graph showing the relationship between the total number Q of the second transfer mechanism 25, the number of second transfer mechanisms 25 used in the first substrate transfer method, and the number of second transfer mechanisms 25 used in the second substrate transfer method when the second transfer mechanism 23 has N+1 second transfer mechanisms 25 and N is an even number.

[0247] like Figure 16 As shown, Q = N+1. Therefore, in the second conveying mechanism 23, the total number Q of multiple second-hand 25s is N+1. That is, the second conveying mechanism 23 has N+1 second-hand 25s. In this example, N is an even number greater than 2.

[0248] Furthermore, when the first substrate transfer method is installed in the substrate processing apparatus 100, the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S when N is an even number are compared with the reference. Figure 15 The first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S are the same when N is odd.

[0249] On the other hand, when the second substrate transfer method is installed in the substrate processing apparatus 100, for example, among the N+1 second substrates 25, N / 2 consecutive second substrates 25 in the vertical direction DZ (e.g., the lower second substrate 25) support the substrate W before processing, and another N / 2 consecutive second substrates 25 in the vertical direction DZ support the substrate W after processing. Moreover, the uppermost or lowermost second substrate 25 is not used.

[0250] Here, for example, a reference is installed on the substrate processing apparatus 100. Figure 16 Either the first substrate transfer method or the second substrate transfer method described herein.

[0251] Among them, with Figure 14 Similarly, the second conveying mechanism 23 can also be controlled by the control unit 200 and operate in either the first substrate conveying mode MD100 or the second substrate conveying mode MD200.

[0252] Substrate transport mode MD100 and reference Figure 15 The first substrate transport mode described is the same as MD10.

[0253] The second substrate transport mode MD200 is a mode in which N / 2 consecutive second hands 25s in the vertical direction DZ of Q (=N+1) second hands 25s are used to support the substrate W before it is processed by the processing unit 21, and another N / 2 consecutive second hands 25s in the vertical direction DZ are used to support the substrate W after it is processed by the processing unit 21.

[0254] When both the first substrate transport mode MD100 and the second substrate transport mode MD200 are installed, the convenience for users and manufacturers can be improved in the same way as when both the first substrate transport mode MD1 and the second substrate transport mode MD2 are installed.

[0255] Above, refer to the attached diagram ( Figures 1 to 16 The embodiments of the present invention have been described. However, the present invention is not limited to the described embodiments, but can be implemented in various forms without departing from its spirit (for example, as described in (1) to (4) below). In addition, the various constituent elements disclosed in the embodiments can be appropriately changed. For example, a constituent element from all the constituent elements shown in a certain embodiment can be added to the constituent elements of other embodiments, or several constituent elements from all the constituent elements shown in a certain embodiment can be deleted from the embodiment.

[0256] To facilitate understanding of the invention, the accompanying drawings are schematic representations of the various constituent elements, and for ease of drawing, the thickness, length, number, spacing, etc., of the constituent elements shown in the drawings may sometimes differ from the actual figures. Furthermore, the configuration of the constituent elements shown in the embodiments is merely an example and is not particularly limited; various modifications can certainly be made without substantially departing from the effects of the invention.

[0257] (1) In reference Figure 13 In the described first substrate transfer method, the second transfer mechanism 23 may have one or more second hands 25 continuous with the first non-shared hand H_F on a first specific direction SD1, and may also have one or more second hands 25 continuous with the second non-shared hand H_S on a second specific direction SD2. (Refer to...) Figures 7-9 The same applies to the second conveying mechanism 23 described herein.

[0258] (2) In Figure 13 In the first substrate transport method, the lowest segment of the N+1 second hands 25 is designated as the first non-shared hand H_F, and the highest segment of the second hands 25 is designated as the second non-shared hand H_S (first configuration). However, it is also possible to designate the lowest segment of the N+1 second hands 25 as the second non-shared hand H_S, and the highest segment of the second hands 25 as the first non-shared hand H_F (second configuration).

[0259] In this case, the first specific direction SD1 and the second specific direction SD2 are... Figure 13 The situation is the opposite. That is, the first specific direction SD1 represents the up direction, and the second specific direction SD2 represents the down direction. Furthermore, in this case, Figure 13 In the above, the reference symbols for the common hand 25 are “H_1~H_M” from top to bottom, and the reference symbols for the processing unit 21 are “21_1~21_N” from top to bottom.

[0260] Alternatively, when repeatedly executing the transfer cycle CY, the first and second forms can be mixed together while performing the first substrate transfer method.

[0261] In addition, for reference Figures 7-9 The same applies to the second conveying mechanism 23 described above; the second configuration can also be used in the first substrate conveying method. For example, the second hand HC can be set as the first non-shared hand, and the second hand HA can be set as the second non-shared hand. Furthermore, in reference... Figures 7-9 In the second transfer mechanism 23 described, the second transfer mechanism HA may be omitted, and the second transfer mechanism HB to HC may be used to perform the first substrate transfer method.

[0262] (3) Figure 1 The control unit 200 shown can determine the processing unit 21 for moving the substrate W out and in within a transport cycle CY according to a preset schedule, or it can be determined in an event-driven manner. The event-driven manner refers to the method of determining the optimal processing unit 21 from multiple processing units 21 at the time point when determining the processing unit 21 for moving the substrate W out and in.

[0263] (4) Figures 1-3 The configuration of the first drive unit 11 shown is not particularly limited, as long as it can drive the first hand 9. For example, the rotation axes of all five first hand 9s may be common. For example, as long as the rotation axes are consistent, the rotation axes of four consecutive first hand 9s in the vertical direction DZ may be common, while the rotation axis of the third first hand 9 may be different. Similarly, the configuration of the second drive unit 17 is not particularly limited, as long as it can drive the second hand 25.

[0264] [Industry availability]

[0265] This invention relates to a substrate processing apparatus and a substrate conveying method, which are industrially applicable.

[0266] [Explanation of Symbols]

[0267] 7: First transport organization

[0268] 9: First move

[0269] 21, 21A, 21B, 21_1~21_N: Processing Units

[0270] 23, 23L, 23U: Second conveying mechanism (conveyor)

[0271] 25,HA~HD,H_F,H_S,H_1~H_M: Second move (hand, first non-shared hand, second non-shared hand, shared hand)

[0272] 29, 29L, 29U: Substrate mounting portion

[0273] 100: Substrate processing apparatus

[0274] 200: Control Department.

Claims

1. A substrate processing apparatus comprising: a substrate mounting portion on which a plurality of substrates are mounted; a plurality of processing units each processing the substrates; and a transfer mechanism which transfers the substrates between the substrate mounting portion and the processing units, wherein N is an integer of 2 or more, the transfer mechanism comprises a plurality of hands each supporting the substrates, the plurality of hands includes a first non-common hand, a second non-common hand, and M common hands disposed between the first non-common hand and the second non-common hand, where M is an integer of 1 or more, the first non-common hand, the M common hands, and the second non-common hand are disposed continuously in an up-down direction from the first non-common hand to the second non-common hand, in one transfer cycle, the M common hands support the substrates before processing by the processing units and the substrates after processing by the processing units at different timings, in the one transfer cycle, the first non-common hand supports only the substrates before processing by the processing units, in the one transfer cycle, the second non-common hand supports only the substrates after processing by the processing units, in a state where the transfer mechanism has received the N substrates from the substrate mounting portion, the second non-common hand does not support the substrates, and the M common hands and the first non-common hand support the substrates, the total number of the M common hands, the first non-common hand, and the second non-common hand is N+1, and M=N-1, and the total number of the plurality of hands is 2N.

2. The substrate processing apparatus according to claim 1, wherein in the one transfer cycle, the M common hands and the first non-common hand receive the substrates from the substrate mounting portion, in the one transfer cycle, the second non-common hand carries out the substrates after processing from the processing units, in the one transfer cycle, a common hand of the M common hands adjacent to the second non-common hand carries in the substrates before processing to the processing unit from which the substrates after processing have been carried out by the second non-common hand, in the one transfer cycle, the common hand adjacent to the second non-common hand carries out the substrates after processing from the processing unit different from the processing unit to which the substrates before processing have been carried in by the common hand.

3. The substrate processing apparatus according to claim 1, wherein 4. The substrate processing apparatus according to any one of claims 1 to 3, wherein further comprising a control portion which controls the transfer mechanism, and the transfer mechanism is controlled by the control portion to operate in either a first substrate transfer mode or a second substrate transfer mode, the first substrate transfer mode is a mode in which N+1 hands of the 2N hands are used as the M common hands, the first non-common hand, and the second non-common hand, the second substrate transfer mode is a mode in which N hands of the 2N hands are used to support only the substrates before processing by the processing units, and the other N hands are used to support only the substrates after processing by the processing units. In one transport cycle, the transport mechanism receives N substrates from the substrate placement portion, and transports the N substrates to N processing units of the plurality of processing units, and transports the N substrates from the N processing units, and delivers the N substrates to the substrate placement portion, wherein 5. The substrate processing apparatus according to any one of claims 1 to 4, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ N＝2。 ​ ​ ​ ​ ​ 5. A substrate conveying method, which is performed by a conveying mechanism that conveys substrates between a substrate mounting portion on which a plurality of substrates are mounted and a plurality of processing units that process the substrates, and The substrate conveying method includes the steps of: in one conveying cycle, receiving N pieces of the substrates before processing by the processing units from the substrate placement section, conveying the N pieces of the substrates to N processing units among the plurality of processing units, and conveying the N pieces of the substrates after processing by the N processing units from the N processing units, and delivering the N pieces of the substrates to the substrate placement section, wherein, N is an integer of 2 or more; the conveying mechanism has a plurality of hands that each support the substrate, the plurality of hands includes a first non-common hand, a second non-common hand, and M common hands disposed between the first non-common hand and the second non-common hand, where M is an integer of 1 or more, the first non-common hand, the M common hands, and the second non-common hand are disposed continuously in a vertical direction from the first non-common hand to the second non-common hand; in the step of delivering the N substrates to the substrate mounting portion, in the one conveying cycle, the M common hands support the substrates before processing by the processing units and the substrates after processing at different timings, in the one conveying cycle, the first non-common hand supports only the substrates before processing by the processing units, in the one conveying cycle, the second non-common hand supports only the substrates after processing by the processing units, in a state where the conveying mechanism has received the N substrates from the substrate mounting portion, the second non-common hand does not support the substrates, and the M common hands and the first non-common hand support the substrates, the total number of the M common hands, the first non-common hand, and the second non-common hand is N + 1, and M = N - 1, the total number of the plurality of hands is 2N.

6. The substrate conveying method according to claim 5, wherein in the step of delivering the N substrates to the substrate mounting portion, in the one conveying cycle, the M common hands and the first non-common hand receive the substrates from the substrate mounting portion, in the one conveying cycle, the second non-common hand carries out the substrates after processing from the processing units, in the one conveying cycle, a common hand adjacent to the second non-common hand among the M common hands carries in the substrates before processing to the processing unit from which the substrates after processing have been carried out by the second non-common hand, in the one conveying cycle, the common hand adjacent to the second non-common hand carries out the substrates after processing from the processing unit different from the processing unit to which the substrates before processing have been carried in by the common hand.

7. The substrate conveying method according to claim 5, wherein N＝2。 8. The substrate conveying method according to any one of claims 5 to 7, wherein the conveying mechanism operates in either a first substrate conveying mode or a second substrate conveying mode, the first substrate conveying mode is a mode in which N + 1 hands among the 2N hands are used as the M common hands, the first non-common hand, and the second non-common hand, the second substrate conveying mode is a mode in which N hands among the 2N hands are used to support only the substrates before processing by the processing units, and the other N hands are used to support only the substrates after processing by the processing units.

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