Welding apparatus and welding method

Abstract

Embodiments of the present application provide a welding device and a welding method. The welding device according to the embodiments of the present application includes a worktable on which a substrate is placed, a portal crane disposed above the worktable, a welding unit that moves along the portal crane and welds a chip on the substrate, and a control unit that moves the welding unit in order to position the welding unit at a welding position on the substrate and controls the welding unit to weld the chip at the welding position. The control unit can determine a moving distance of the welding unit based on a weighted sum of a number of consecutive driving times of the welding unit and an idle time.

Description

TECHNICAL FIELD

[0001] The present application relates to a bonding apparatus and a bonding method for bonding a chip on a substrate, and more particularly to a bonding apparatus and a bonding method for performing determination and correction of a bonding position based on driving record of a bonding unit. BACKGROUND

[0002] A semiconductor (or display) manufacturing process is a process for manufacturing a semiconductor element on a substrate (e.g., wafer), such as exposure, evaporation, etching, ion implantation, cleaning, packaging, etc. In particular, in the packaging process, as a technology for replacing wire bonding between chips for electrical connection of stacked chips, a TSV (Through Silicon Via) technology is disclosed, which opens a fine hole in a chip and inserts a conductive body in the corresponding hole to electrically connect a lower chip and an upper chip.

[0003] As a part of the TSV bonding process, a chip bonding process for bonding a chip on a substrate can be performed. Generally, a bonding head of a bonding unit extracts a chip and then moves to a bonding position on a substrate to bond the chip to the corresponding bonding position. Here, whether the corresponding bonding position and the bonding head are aligned is checked using a vision unit (e.g., a camera) provided in the bonding unit, and bonding is performed after the bonding head is aligned using the vision unit.

[0004] On the other hand, in order to improve the efficiency of the semiconductor manufacturing process, a method for rapidly bonding a chip on a substrate is required, but the bonding time can be delayed due to the sequence of correction using the vision unit as described above. SUMMARY

[0005] Therefore, embodiments of the present application provide a bonding apparatus and a bonding method for accurately and rapidly bonding a chip on a substrate.

[0006] The problems to be solved by the present application are not limited to the above-mentioned, and other problems to be solved not mentioned can be clearly understood by those skilled in the art from the following description.

[0007] The bonding apparatus according to an embodiment of the present application includes a worktable on which a substrate is placed, a gantry provided above the worktable, a bonding unit that moves along the gantry and bonds a chip on the substrate, and a control part that moves the bonding unit in order to position the bonding unit at a bonding position on the substrate and controls the bonding unit to bond a chip at the bonding position. The control part can determine a movement distance of the bonding unit based on a weighted sum of a number of consecutive driving times of the bonding unit and an idle time.

[0008] In one embodiment, the control section can determine the movement distance of the soldering unit using a linear regression formula of a weighted sum of a parameter related to the number of consecutive drives of the soldering unit and a parameter related to the idle time and an offset value.

[0009] In one embodiment, the control section can correct a first weighting value applied to the parameter related to the number of consecutive drives and a second weighting value applied to the parameter related to the idle time based on a result of a soldering inspection for a chip on the substrate.

[0010] In one embodiment, the control section can correct the first weighting value and the second weighting value when an amplitude of a soldering error based on a result of a post-soldering inspection is within a reference range.

[0011] In one embodiment, the first weighting value and the second weighting value can be determined based on a least square approximation, a maximum likelihood estimation, or a random sample consensus (RANSAC).

[0012] In one embodiment, the number of consecutive drives can correspond to a number of times the soldering unit performs soldering of a reference number of times or more without an idle time.

[0013] In one embodiment, the idle time can be determined as a reference time when a time during which the soldering unit operates in a standby state exceeds the reference time.

[0014] A soldering method according to an embodiment of the present application includes a step of positioning a substrate on a worktable, a step of determining a soldering position, a step of moving a soldering unit in order to position the soldering unit at the soldering position, and a step of soldering a chip at the soldering position on the substrate. The step of moving the soldering unit can include a step of determining a movement distance of the soldering unit based on a weighted sum of a parameter related to a number of consecutive drives of the soldering unit and a parameter related to an idle time.

[0015] In one embodiment, the step of determining the movement distance of the soldering unit can include a step of determining the movement distance of the soldering unit using a linear regression formula of a weighted sum of the parameter related to the number of consecutive drives of the soldering unit and the parameter related to the idle time and an offset value.

[0016] In one embodiment, the soldering method can further include a step of correcting a first weighting value applied to a parameter related to the number of consecutive driving times and a second weighting value applied to a parameter related to the idle time based on a soldering inspection result for a chip on the substrate.

[0017] In one embodiment, the step of correcting the first weighting value and the second weighting value can include a step of correcting the first weighting value and the second weighting value when an amplitude of a soldering error based on a post-soldering inspection result is within a reference range.

[0018] A soldering apparatus according to an embodiment of the present application includes a loading section in which a container for accommodating a substrate is placed, a substrate transfer section that transfers the substrate from the container placed in the loading section, a soldering processing section that solder a chip on the substrate supplied from the substrate transfer section, and an inspection section that receives the substrate processed by the soldering processing section from the substrate transfer section and inspects the chip soldered on the processed substrate. The soldering processing section includes a worktable on which the substrate is placed, a gantry provided above the worktable, a soldering unit that moves along the gantry and solder a chip on the substrate, and a control section that moves the soldering unit in order to position the soldering unit at a soldering position on the substrate and controls the soldering unit to solder a chip at the soldering position. The control section can determine a moving distance of the soldering unit based on a weighted sum of a number of consecutive driving times of the soldering unit and an idle time.

[0019] According to an embodiment of the present application, a moving distance of a soldering unit is determined and corrected using a driving record of the soldering unit, so that the soldering unit can quickly move to an accurate position and quickly solder a chip on a substrate.

[0020] Effects of the present application are not limited to the above-mentioned, and other effects not mentioned herein will be apparent to those skilled in the art from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 An outline structure of a soldering apparatus according to an embodiment of the present application is shown.

[0022] Figure 2 An outline structure of a soldering processing device in a soldering apparatus according to an embodiment of the present application is shown.

[0023] Figure 3 and Figure 4 Examples of a soldering device and a configuration of a temperature sensor in the soldering device according to an embodiment of the present application are shown.

[0024] Figure 5 is a flowchart showing a soldering method according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present application pertains can easily practice the present application. The present application can be implemented in various different ways, and is not limited to the embodiments described herein.

[0026] For the sake of clarity, portions unrelated to the description have been omitted, and the same reference numerals are used throughout the specification to designate the same or similar constituent elements.

[0027] In addition, in the plurality of embodiments, the same reference numerals are used to designate only representative embodiments with respect to the constituent elements having the same structure, and only the structure different from the representative embodiments is described in the remaining other embodiments.

[0028] In the entire specification, when it is stated that a certain part is "connected" or "coupled" to another part, it not only includes the case of "directly connected" or "directly coupled" but also includes the case of "indirectly connected" or "indirectly coupled" with other parts interposed therebetween. In addition, when it is stated that a certain part "includes" a certain constituent element, it means that other constituent elements can be further included, not excluding other constituent elements, unless otherwise specifically noted.

[0029] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those skilled in the art to which the present application pertains. Terms such as terms defined in a generally used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the relevant technology, and should not be ideally or excessively interpreted as formal meanings unless otherwise clearly defined in the present application.

[0030] Figure 1 An outline structure of a welding apparatus according to an embodiment of the present application is shown. The welding apparatus 10 according to the embodiment of the present application can be used to weld a chip 32 on a substrate 20. Here, the chips 32, 42 can also be supplied through a tray or a carrier tape 30, and can be supplied from a wafer 40.

[0031] The soldering apparatus 10 can include a loading section 300 for placing a container 22 that houses a substrate 20, a substrate transfer section 500 for transferring the substrate 20 from the container placed in the loading section 300, a soldering process section 100A, 100B for soldering a chip 32, 42 on the substrate 20 supplied from the substrate transfer section 500, and an inspection section 400 for receiving the substrate 20 on which the soldering process is performed by the soldering process section 100A, 100B from the substrate transfer section 500 and inspecting the chip 32, 42 soldered on the soldering-processed substrate 20. In addition, a carrier tape supply section 110, 124 for supplying a carrier tape on which the chip 32, 42 to be soldered on the substrate 20 is attached, a chip carrier loading section 190 for placing a container 50 that supplies a wafer 40 on which the chip is mounted.

[0032] As an example, the soldering process section can include a first soldering process section 100A and a second soldering process section 100B having the same structure. As shown in FIG. 1, the first soldering process section 100A and the second soldering process section 100B can be symmetrically arranged with the substrate transfer section 500 as the center. In addition, the loading section 300 and the inspection section 400 can be arranged back to back with the substrate transfer section 500 as the center. Figure 1

[0033] Referring to FIG. 1, if the container 22 for housing the substrate 20 is placed in the loading section 300, the substrate 20 housed in the container 22 is transferred to the soldering process section 100A, 100B by the substrate handling robot 510 of the substrate transfer section 500. In addition, the chip 32, 42 for use in soldering can be supplied to the soldering process section 100A, 100B from the carrier tape supply section 110, 124 provided as a chip loading section or the container 50 placed in the chip carrier loading section 190 that supplies the wafer 40 on which the chip is mounted. The soldering unit 130 for soldering the chip 32, 42 on the substrate 20 placed in the worktable 102 is provided, and the operation of the soldering unit 130 and the soldering method will be described later. Figure 1

[0034] If the soldering of the chip 32, 42 on the substrate 20 is completed, the substrate 20 after the soldering is transferred to the inspection section 400 for inspection (PBI: Post Bonding Inspection) by the substrate handling robot 510. The substrate alignment unit 600 is provided in the inspection section 400, and the substrate alignment unit 600 can align the substrate 20 in the inspection table and the inspection device. After the inspection in the inspection section 400 is completed, the substrate 20 can be housed in the container 22 of the loading section 300 by the substrate handling robot 510 and carried out for the subsequent process.

[0035] Figure 2 An outline structure of the soldering process section in the soldering apparatus according to an embodiment of the present application is shown. Figure 2 An outline structure of the soldering process section in the soldering apparatus according to an embodiment of the present application is shown. Figure 1 ​​the detailed structure of the soldering processing part 100A.

[0036] Referring to Figure 2 The soldering processing part 100A provides a worktable 102 for placing the substrate 20, a portal crane 136, 138 provided above the worktable 102, and a soldering unit 130 which moves along the portal crane 136, 138 and solder the chip 32 on the substrate 20. Although not shown, a control part for controlling the driving (horizontal movement, vertical movement) of the soldering unit can be provided.

[0037] The soldering unit 130 can include a soldering head 132 for soldering the chip 32, 42 on the substrate 20, and a head driving part for moving the soldering head 132 in horizontal and vertical directions. The soldering head 132 can be installed with a soldering tool having a size corresponding to the chip 32, 42. The soldering unit 130 can extract the chip 32, 42 by vacuum pressure, and can be provided with a heater (not shown) for heating the chip 32, 42 in the soldering head 132. The worktable 102 can be moved in the horizontal direction by a worktable driving part 104. For example, the worktable 102 can be moved in the X-axis direction by the worktable driving part 104, and the soldering head 132 can be moved in the Y-axis direction by the head driving part. That is, the arrangement between the soldering position on the substrate 20 and the soldering head 132 can be performed by the worktable driving part 104 and the head driving part. In addition, the worktable 102 can be configured to be rotatable for the arrangement of the substrate 20.

[0038] An upper arrangement camera 146 for detecting the soldering position on the substrate 20 can be disposed above the worktable 102. As an example, the upper arrangement camera 146 can be configured to be movable in the Y-axis direction by an upper arrangement camera driving part 148 on the first portal crane 136, and can be used for the arrangement of the soldering position and the soldering head 132. That is, the soldering position on the substrate 20 can be detected by the upper arrangement camera 146, and the position of the soldering head 132 can be adjusted using the position coordinates of the detected soldering position.

[0039] A first lower camera 150 can be provided between the gantries 136, 138, and the state in which the chips 32, 42 are vacuum-sucked to the lower surface of the soldering tool can be observed by the first lower camera 150. The first lower camera 150 can be used to correct the posture of the chips 32, 42 sucked by the soldering tool. The gantries 136, 138 include movement guides 141, 142 for horizontally moving the soldering unit 130. The soldering unit 130 can move along the movement guides 141, 142. Although not illustrated, a control section for controlling the soldering of the soldering unit 130 can be provided. The control section can be implemented by one or more processors. As explained below, the control section can control the soldering unit 130 to move the soldering unit 130 in order to position the soldering unit 130 at a soldering position, and to solder the chips 32, 42 at the soldering position. According to an embodiment of the present application, the control section can compensate for a movement amount error using a driving record (number of continuous driving times, idle time) of the soldering unit 130.

[0040] In addition, a first carrier tape supply section 110 that supplies the first carrier tape 30 having small containers for respectively housing the chips 32 to be soldered to the substrate 20 and a second carrier tape supply section 124 that supplies the second carrier tape 38 can be provided. In particular, either one of the first carrier tape supply section 110 and the second carrier tape supply section 124 can be selectively used. For example, after all of the chips 32 housed in the first carrier tape 30 are supplied, the chips 32 housed in the second carrier tape 38 can be supplied. In addition, the first carrier tape supply section 110 and the second carrier tape supply section 124 can also supply different kinds of tapes from each other. Unlike the example of Figure 2 Unlike the example of

[0041] In addition, as a means for supplying the chips 42, a wafer 40 provided with the chips 42 can be provided. The wafer 40 is placed on a wafer worktable 160, and a chip carrier loading section 190 for supporting the container 50 in which the wafer 40 for supplying the chips is housed can be provided on one side of the wafer worktable 160. In addition, a wafer transfer unit 192 for taking out the wafer 40 from the container 50 and transferring it onto the wafer worktable 160 can be provided on one side of the chip carrier loading section 190. The wafer transfer unit 192 can include a gripper 194 for gripping the wafer 40 and a gripper driving section 196 for moving the gripper 194 in a horizontal direction.

[0042] A first chip transfer unit 170 for picking up and transferring the chips 32, 42 one by one from the carrier tape 30, 38 or the wafer 40 can be disposed above the carrier tape supply 110, 124 and the wafer table 160. The first chip transfer unit 170 can include a picker 172 disposed above the carrier tape supply 110, 124 and the wafer table 160 for picking up the chips 32, 42 by vacuum pressure and a picker drive 174 for moving the picker 172 in a horizontal direction, for example, the X-axis direction. In addition, the picker drive 174 can move the picker 172 in a vertical direction for picking up the chips 32, 42.

[0043] A second chip transfer unit 180 for moving the chips 32, 42 transferred by the picker 172 to a position adjacent to the table 102 can be disposed between the carrier tape supply 110, 124 and the wafer table 160. The second chip transfer unit 180 can include a chip shuttle 182 for supporting the chips 32, 42 and a shuttle drive 184 for moving the chip shuttle 182 in a horizontal direction, for example, the Y-axis direction, between a first position between the carrier tape supply 110, 124 and the wafer table 160 and a second position adjacent to the table 102.

[0044] A first upper camera 200 for detecting the position of the chips 32 can be disposed above the carrier tape supply 110, 124 and a second upper camera 202 for detecting the position of the chips 32, 42 to be picked up on the wafer 40 can be disposed above the wafer table 160. In addition, a third upper camera 204 for inspecting the chips 32, 42 on the chip shuttle 182 can be disposed above the second chip transfer unit 180.

[0045] The first, second, and third upper cameras 200, 202, 204 can be configured to be movable in a horizontal direction, for example, the X-axis direction, by a second camera drive 206. In addition, a second lower camera 210 for observing the chips 32, 42 picked up by the picker 172 can be disposed below the first chip transfer unit 170. The second lower camera 210 can be used to correct the posture of the chips 32, 42 picked up by the picker 172.

[0046] The following describes a method of determining and correcting a welding position according to an embodiment of the present application. When the alignment method of the welding head 132 using general vision data is used, the welding unit 130 is moved and the chips 32, 42 are welded to the substrate 20 after the pattern on the substrate 20 is recognized using the upper arrangement camera 146. When the layers are stacked, the chip is welded above the chip after the chip on the substrate 20 is recognized. When the alignment method based on the general vision data is used, the calibration method for the welding position determination is set according to the average data of the welding position error values. In this case, there is a problem that the cumulative error (for example, heat-induced error) generated as the welding is continuously performed cannot be reflected.

[0047] Accordingly, the embodiment of the present application provides a method of determining and correcting the driving amount (moving distance) of the welding unit 130 based on the driving record (continuous driving number, idle time) of the welding unit 130. That is, the present application provides a method of compensating for heat without a temperature sensor of the welding unit 130, recording data related to the continuous driving number and the idle time when the welding unit 130 is driven, and performing linear regression compensation when the welding unit 130 is driven and aligned.

[0048] The control unit records the continuous driving number of the welding unit 130 and records the idle time when the welding is stopped. Preferably, the welding is performed until the increase in the variation of the welding precision by post-bonding inspection (PBI) is slowed down. That is, the welding is preferentially performed until the welding error range is maintained within the reference range.

[0049] In the constant temperature space, the idle time is recorded as the maximum idle time for a certain time (for example, 4 hours) or more. When the continuous driving number is recorded due to the re-operation of the welding unit 130, the idle time is proportionally reduced. When the continuous driving number is recorded at the time when the increase in the variation of the welding position error in the post-bonding inspection is slowed down, the idle time is cleared. The driving amount for the welding is corrected according to the linear regression formula reflecting the continuous driving number and the idle time based on the driving data of the welding unit 130.

[0050] According to the embodiment of the present application, a method of implementing the correlation between the welding error extracted through the welding inspection result and the driving record (continuous driving number, idle time) of the welding unit 130 as a linear regression model and determining and correcting the moving distance of the welding unit 130 using the corresponding linear regression model is provided. The following describes a case in which the moving distance of the welding unit 130 moving along the moving guide 141, 142 of the gantry 136, 138 is corrected. Figure 3 and Figure 4 A case in which the moving distance of the welding unit 130 moving along the moving guide 141, 142 of the gantry 136, 138 is corrected is described as an example. Not only the case in which the welding unit 130 moves along the moving guide 141, 142 of the gantry 136, 138 but also the case in which the welding unit 130 moves along the moving guide 141, 142 of the gantry 136, 138 is described.Figure 3 and Figure 4 Such one-dimensional movement, of course, can apply the present application in two- and three-dimensional driving.

[0051] Figure 3 and Figure 4 A welding device according to an embodiment of the present application is shown. Figure 3 A welding device is shown as viewed from the side, Figure 4 A welding device is shown as viewed from above.

[0052] Referring to Figure 3 and Figure 4 A portal crane 136, 138 is provided above the workbench 102, and a movement guide 141, 142 for horizontal movement of the unit of the welding unit 130 is provided as a part of the portal crane 136, 138. The welding unit 130 can move toward the welding position along the movement guide 141, 142 and weld the chip 32, 42 to the substrate 20. Heat generated due to friction and the like as the welding unit 130 moves along the movement guide 141, 142 can cause an error in the movement distance toward the welding position.

[0053] The movement amount for welding is corrected by reflecting the error due to thermal deformation by a linear regression formula using the driving record (number of continuous driving times, idle time) of the welding unit 130 as a parameter, so that improvement of welding precision and rapid welding can be achieved. For example, in a linear regression formula like the following mathematical formula 1, when the movement distance correction amount is set as y, xl, x2,..., xn are parameters related to the driving record including the number of continuous driving times and the idle time, βl, β2,..., β3 correspond to weighting values applied to each parameter. β0 is an offset value, and can correspond to a value set in advance or reflecting past welding errors and the like.

[0054] [mathematical formula 1]

[0055] y = β0 + β1χ1 + β2χ2 +... + β n χ n

[0056] That is, the control section that controls the driving of the soldering unit 130 can determine the movement distance of the soldering unit 130 based on a linear regression formula that reflects the weighted sum of parameters related to the driving record (the number of continuous driving, the idle time) of the soldering unit 130. The respective weight values are changed in consideration of the welding error detected in the post-welding inspection step. As a method for correcting the weight values of the linear regression formula, various algorithms (for example, Least Square Approximation, Maximum Likelihood (ML) estimation, or RANSAC (Random Sample Consensus)) can be applied.

[0057] According to the embodiment of the present application, the control section can determine the movement distance of the soldering unit 130 based on the weighted sum of the number of continuous driving and the idle time of the soldering unit 130. That is, the correlation between the driving data of the soldering unit 130 and the welding error is inferred, and the movement distance for welding based on the driving data of the soldering unit 130 is corrected according to the correlation, so that the welding can be performed more rapidly and accurately.

[0058] In the embodiment of the present application, the control section can determine the movement distance of the soldering unit using a linear regression formula that adds an offset value to the weighted sum of the parameter related to the number of continuous driving and the parameter related to the idle time of the soldering unit 130.

[0059] In the embodiment of the present application, the control section can correct the first weight value applied to the parameter related to the number of continuous driving and the second weight value applied to the parameter related to the idle time based on the welding inspection result for the chips 32, 42 on the substrate 20.

[0060] In the embodiment of the present application, when the amplitude of the welding error based on the post-welding inspection result is within the reference range, the control section can correct the first weight value and the second weight value applied to the parameter related to the number of continuous driving and the parameter related to the idle time.

[0061] In the embodiment of the present application, the number of continuous driving can correspond to the number of times that the soldering unit 130 performs welding of more than a reference number (for example, 3 times) without the idle time.

[0062] In the embodiment of the present application, when the time during which the soldering unit 130 operates in the standby state exceeds a reference time (for example, 4 hours), the idle time is no longer increased and can be determined as the reference time.

[0063] Figure 5 A flowchart showing a soldering method according to the embodiment of the present application is shown. Figure 5The work of the control section (processor) described above can be performed.

[0064] The welding method according to an embodiment of the present application can include a step of positioning the substrate 20 on the worktable 102 (S505), a step of confirming a welding position on the substrate 20 (S510), a step of moving the welding unit 130 in order to position the welding unit 130 on the welding position (S515), and a step of welding the chips 32, 42 at the welding position on the substrate 20 (S520). The step of moving the welding unit 130 (S515) according to an embodiment of the present application can include a step of determining a movement distance of the welding unit 130 based on a weighted sum of a parameter related to the number of consecutive driving of the welding unit 130 and a parameter related to the idle time.

[0065] In an embodiment, the step of determining the movement distance of the welding unit 130 can include a step of determining the movement distance of the welding unit 130 using a linear regression equation to which an offset value is added to the weighted sum of the parameter related to the number of consecutive driving of the welding unit 130 and the parameter related to the idle time.

[0066] In an embodiment, the welding method can further include a step of correcting a first weighting value applied to the parameter related to the number of consecutive driving and a second weighting value applied to the parameter related to the idle time based on a result of a welding inspection for the chips 32, 42 on the substrate 20.

[0067] In an embodiment, the step of correcting the first weighting value and the second weighting value can correct the first weighting value and the second weighting value when an amplitude of a welding error based on a result of a post-welding inspection is within a reference range.

[0068] In an embodiment, the first weighting value and the second weighting value can be determined based on a least square approximation, a maximum likelihood (ML) estimation, or a random sample consensus (RANSAC).

[0069] In an embodiment, the number of consecutive driving can correspond to the number of times that the welding unit 130 performs welding more than a reference number of times without the idle time.

[0070] In an embodiment, when a time during which the welding unit 130 operates in a standby state exceeds a reference time, the idle time can be determined as the reference time.

[0071] The above describes various embodiments of the present application, the drawings referred to so far and the detailed description of the application recorded are only examples of the present application, which are only used for the purpose of illustrating the present application, and are not used for limiting or restricting the scope of the present application recorded in the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments can be made according to them. Therefore, the true technical protection scope of the present application should be determined by the technical concept of the appended claims.

Claims

1. A welding apparatus, characterized in that, include: The workbench is where the baseboard is placed; A gantry crane is installed above the work platform; The welding unit moves along the gantry crane and welds chips onto the substrate; and The control unit moves the welding unit to a welding position on the substrate and controls the welding unit to weld the chip at that welding position. The control unit uses a linear regression equation of the weighted sum of the offset values ​​of parameters related to the number of consecutive drives of the welding unit and parameters related to the idle time to determine the moving distance of the welding unit.

2. The welding apparatus according to claim 1, characterized in that, Based on the soldering inspection results of the chips on the substrate, the control unit corrects a first weighted value for parameters related to the number of consecutive drives and a second weighted value for parameters related to the idle time.

3. The welding apparatus according to claim 2, characterized in that, When the amplitude of the welding error based on the post-weld inspection results is within the reference range, the control unit corrects the first weighted value and the second weighted value.

4. The welding apparatus according to claim 2, characterized in that, The first weighted value and the second weighted value are determined based on the least squares approximation method, maximum likelihood estimation or random sampling consensus algorithm.

5. The welding apparatus according to claim 1, characterized in that, The number of consecutive drives is equivalent to the number of times the welding unit performs welding more than the baseline number without idle time.

6. The welding apparatus according to claim 1, characterized in that, When the welding unit operates in standby mode for a period of time exceeding a reference time, the idle time is determined as the reference time.

7. A welding method, characterized in that, include: The step of placing the substrate on the worktable; Steps for determining the welding position; The step of moving the welding unit to position it in the welding position; as well as The step of welding chips at welding locations on the substrate. The step of moving the welding unit includes: The step of determining the moving distance of the welding unit using a linear regression of the weighted sum of offset values ​​of parameters related to the number of consecutive drives of the welding unit and parameters related to idle time.

8. The welding method according to claim 7, characterized in that, The welding method further includes: The steps involve correcting a first weighted value for parameters related to the number of consecutive drives and a second weighted value for parameters related to the idle time based on the soldering inspection results of the chips on the substrate.

9. The welding method according to claim 8, characterized in that, The steps for correcting the first weighted value and the second weighted value include: The step of correcting the first weighted value and the second weighted value when the amplitude of the welding error based on the post-weld inspection results is within the reference range.

10. The welding method according to claim 8, characterized in that, The first weighted value and the second weighted value are determined based on the least squares approximation method, maximum likelihood estimation or random sampling consensus algorithm.

11. The welding method according to claim 7, characterized in that, The number of consecutive drives is equivalent to the number of times the welding unit performs welding more than the baseline number without idle time.

12. The welding method according to claim 7, characterized in that, When the welding unit operates in standby mode for a period of time exceeding a reference time, the idle time is determined as the reference time.

13. A welding device, characterized in that, include: The loading section is a container used to hold the substrate. A substrate transfer unit transfers the substrate from a container placed in the loading unit; The welding processing unit welds chips onto a substrate provided from the substrate transfer unit. as well as The inspection unit receives the substrate processed by the soldering unit from the substrate transfer unit and inspects the chips soldered onto the processed substrate. The welding processing unit includes: The workbench is where the baseboard is placed; A gantry crane is installed above the work platform; The welding unit moves along the gantry crane and welds chips onto the substrate; and The control unit moves the welding unit to a welding position on the substrate and controls the welding unit to weld the chip at that welding position. The control unit uses a linear regression equation that weights and sums the offset values ​​of the number of consecutive drives to the welding unit and the idle time to determine the moving distance of the welding unit.

14. The welding equipment according to claim 13, characterized in that, The control unit adjusts a first weighted value applicable to the number of consecutive drives and a second weighted value applicable to the idle time based on the soldering inspection results of the chips on the substrate.

15. The welding equipment according to claim 14, characterized in that, When the amplitude of the welding error based on the post-weld inspection results is within the reference range, the control unit corrects the first weighted value and the second weighted value.

16. The welding equipment according to claim 13, characterized in that, The number of consecutive drives is equivalent to the number of times the welding unit performs welding more than the baseline number without idle time.

17. The welding equipment according to claim 13, characterized in that, When the welding unit operates in standby mode for a period of time exceeding a reference time, the idle time is determined as the reference time.

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