A motherboard testing method, device, electronic equipment and storage medium

Abstract

The present application provides a motherboard testing method, including: obtaining a digital template corresponding to the motherboard to be tested; determining a target supporting hole based on the position information of all supporting holes of the digital template; confirming the position information of a supporting column corresponding to the target supporting hole on a carrier board based on the position information of the target supporting hole; placing the motherboard to be tested on the carrier board based on the position information of the target supporting hole and the position information of the supporting column; testing the motherboard to be tested placed on the carrier board; the present application also provides a motherboard testing device, an electronic device and a storage medium.

Description

Technical Field

[0001] The present application relates to the field of data processing technology, and in particular to a motherboard testing method, device, electronic equipment and storage medium. Background Art

[0002] After the printed circuit boards (PCB) are assembled into motherboards (PCBA) through the assembly or plug-in process, the electronic and electrical functions of the motherboard need to be tested (FCT) to determine whether the motherboard functions normally. Therefore, how to improve the efficiency of the test is a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides a motherboard testing method, device, electronic device and storage medium to at least solve the above technical problems existing in the prior art.

[0004] The first aspect of the present application provides a motherboard testing method, comprising:

[0005] Get the digital template corresponding to the motherboard to be tested;

[0006] Determining target supporting holes based on position information of all supporting holes of the digital template;

[0007] Based on the position information of the target support hole, confirming the position information of the support column corresponding to the target support hole on the carrier plate;

[0008] Based on the position information of the target support hole and the position information of the support column, placing the motherboard to be tested on the carrying plate;

[0009] The mainboard to be tested placed on the carrier board is tested.

[0010] In the above scheme, obtaining the digital template corresponding to the motherboard to be tested includes:

[0011] Determining the model of the motherboard to be tested based on the identification of the motherboard to be tested;

[0012] Based on the model of the mainboard to be tested, the digital template corresponding to the mainboard to be tested is obtained.

[0013] In the above solution, the determining of the target supporting holes based on the position information of all supporting holes of the digital template includes:

[0014] confirming at least one group of candidate supporting holes based on all supporting holes of the digital template;

[0015] Based on the position information of the at least one group of candidate supporting holes, determining a fitness value corresponding to the at least one group of candidate supporting holes;

[0016] Confirming that a group of candidate supporting holes with the largest fitness value are the target supporting holes;

[0017] The fitness value is used to characterize the stability of the mainboard to be tested placed on the carrier board based on the target supporting hole after the candidate supporting hole is used as the target supporting hole.

[0018] In the above solution, determining the fitness value corresponding to the at least one group of candidate supporting holes based on the position information of the at least one group of candidate supporting holes includes:

[0019] Determine the fitness value corresponding to the at least one group of candidate support holes based on the sum of the distances between each support hole in the candidate support holes and the first position of the motherboard to be tested, and the sum of the distances between any two support holes in the candidate support holes;

[0020] The first position is the center point of the minimum circumscribed rectangle of the motherboard to be tested.

[0021] In the above solution, the step of confirming the position information of the support column on the carrier plate corresponding to the target support hole based on the position information of the target support hole includes:

[0022] Confirm that a first support hole in the target support hole located at a second position of the motherboard to be tested corresponds to a fixed support column on the carrier plate;

[0023] Determining position information of the movable support column on the carrying plate based on position information of the target support hole and position information of the fixed support column on the carrying plate;

[0024] Wherein, the target support holes correspond one-to-one to the fixed support columns and the movable support columns.

[0025] In the above solution, based on the position information of the target support hole, confirming the position information of the support column on the carrier plate corresponding to the target support hole includes:

[0026] Based on the relative position information of the first support hole in the target support holes and the second support hole in the target support holes, and the position information of the fixed support column on the support plate, determine the position information of the mobile support column corresponding to the second support hole on the support plate;

[0027] The second supporting hole is a supporting hole among the target supporting holes except the first supporting hole.

[0028] In the above solution, before placing the motherboard to be tested on the carrier board based on the position information of the target support hole and the position information of the support column, the method further includes:

[0029] Confirming the first position information of the motherboard to be tested;

[0030] Based on the first posture information, moving the motherboard to be tested into the field of view of a local camera;

[0031] The second position information of the mainboard to be tested is confirmed based on the local camera.

[0032] In the above solution, the step of confirming the first position information of the motherboard to be tested includes:

[0033] Based on the position information of the component of the first shape on the mainboard to be tested, the first position information of the mainboard to be tested is confirmed.

[0034] In the above solution, the step of confirming the second posture information of the motherboard to be tested includes:

[0035] The local camera acquires position information of at least one component of a first shape on the mainboard to be tested;

[0036] Based on the position information of at least one component of the first shape on the mainboard to be tested, confirming the second posture information of the mainboard to be tested;

[0037] The second posture information is used to place the mainboard to be tested on the carrying board.

[0038] In the above solution, the testing of the motherboard to be tested placed on the carrier board includes:

[0039] Confirming the position of at least one interface of the motherboard to be tested based on a side camera;

[0040] connecting at least one data line to the at least one interface based on the location of the at least one interface;

[0041] The mainboard to be tested is tested based on the at least one data line.

[0042] In the above solution, after testing the motherboard to be tested placed on the carrier board, the method further includes:

[0043] Based on the test results, the motherboard to be tested is moved to a corresponding position.

[0044] A second aspect of the present application provides a motherboard testing device, the device comprising:

[0045] An acquisition unit, used for acquiring a digital template corresponding to the motherboard to be tested;

[0046] A first determining unit, configured to determine a target supporting hole based on position information of all supporting holes of the digital template;

[0047] A second determining unit, configured to determine position information of a support column on the carrier plate corresponding to the target support hole based on the position information of the target support hole;

[0048] A placement unit, used for placing the motherboard to be tested on the carrier board based on the position information of the target support hole and the position information of the support column;

[0049] The testing unit is used to test the mainboard to be tested placed on the carrying board.

[0050] The third aspect of the present application provides an electronic device, including a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; the memory is used to store computer programs; and the processor is used to implement the method steps described in the above-mentioned image positioning method when executing the program stored in the memory.

[0051] A fourth aspect of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method steps described in the above-mentioned image positioning method are implemented.

[0052] Through the motherboard testing method provided in the present application, a digital template corresponding to the motherboard to be tested is obtained; based on the position information of all support holes of the digital template, a target support hole is determined; based on the position information of the target support hole, the position information of the support column corresponding to the target support hole on a carrier board is confirmed; based on the position information of the target support hole and the position information of the support column, the motherboard to be tested is placed on the carrier board; and testing the motherboard to be tested placed on the carrier board can improve the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 An optional schematic diagram of a motherboard test in the related art is shown;

[0054] Figure 2 Another optional schematic diagram of a motherboard test in the related art is shown;

[0055] Figure 3 An optional flow chart of a motherboard testing method provided in an embodiment of the present application is shown;

[0056] Figure 4An optional flow chart of confirming the first position information of the motherboard to be tested provided by an embodiment of the present application is shown;

[0057] Figure 5 A schematic diagram of a template image or an image to be located provided in an embodiment of the present application is shown;

[0058] Figure 6 A schematic diagram of data flow in a motherboard test system provided in an embodiment of the present application is shown;

[0059] Figure 7 An optional schematic diagram of a motherboard testing system provided in an embodiment of the present application is shown;

[0060] Figure 8 Another optional flow chart of the motherboard testing method provided in the embodiment of the present application is shown;

[0061] Fig. 9 A schematic diagram showing a support hole and a circular positioning component on a motherboard to be tested provided in an embodiment of the present application is shown;

[0062] Fig.10 A schematic diagram showing a support column on a load-bearing plate provided in an embodiment of the present application is shown;

[0063] Fig.11 A schematic diagram of an image captured by a local camera provided in an embodiment of the present application is shown;

[0064] Fig.12 A schematic diagram showing an image acquired by a wing camera provided in an embodiment of the present application is shown;

[0065] Fig.13 An optional structural schematic diagram of a motherboard testing device provided in an embodiment of the present application is shown;

[0066] Fig.14 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0067] In order to make the purpose, features, and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0068] In the production process of laptops and other electronic products, it is necessary to test the electronic and electrical functions of the motherboard PCBA under the power-on state to detect whether the motherboard PCBA functions normally. FCT is a very important link in the PCBA production process. It is at the back end of the production process and is an important means to ensure the quality of PCBA.

[0069] Improving the function and efficiency of FCT, enhancing the versatility and centralization of PCBA testing instruments, and developing an automated testing system to integrate FCT testing are necessary means to improve testing efficiency, ensure product quality, and reduce testing costs in PCBA production.

[0070] In related technologies, the following two solutions are mainly used for PCBA detection:

[0071] 1) Test for a single motherboard model.

[0072] Figure 1 An optional schematic diagram of a motherboard test in the related art is shown.

[0073] like Figure 1 As shown, a tray, a card slot type conveying device, a test box, and test modules and interfaces corresponding to the functions of the motherboard are used that match the motherboard model; the motherboard is placed on the tray using the card slot type motherboard conveying device that matches the motherboard model, and the tray with the motherboard is placed in the test box that matches the motherboard model using a robot to perform a motherboard function test.

[0074] However, the above solution 1) is only applicable to PCBAs of fixed models, and in order to adapt to various models of PCBAs, it is necessary to configure a card slot type transmission device adapted to different models of PCBAs, various test modules and interfaces corresponding to the functions of the fixed models of mainboards, which increases the cost of PCBA testing.

[0075] 2) Manual-based motherboard testing.

[0076] Figure 2 Another optional schematic diagram of a motherboard test in the related art is shown.

[0077] like Figure 2 As shown, the motherboard is manually placed in a dedicated motherboard test box, and the power supply, HDMI and other interfaces are manually plugged in to perform a motherboard function test.

[0078] However, in the above solution 2), each test station or test equipment needs to be equipped with corresponding testers, which has high labor costs; the degree of automation and test efficiency are low, and testers are required to have high professional skills; in addition, the use of a specific model of motherboard test box also increases the cost of PCBA testing.

[0079] Based on this, the embodiment of the present application provides a motherboard testing method, which uses vision to guide the manipulator to perform a series of motherboard placement and cable plugging and unplugging actions, replacing manual labor and improving the efficiency of the motherboard electronic and electrical function testing; using a movable carrier plate instead of a dedicated carrier plate for a specific model, making the carrier plate universal and saving hardware costs. At the same time, it also supports the motherboard to be placed arbitrarily on the conveyor belt, avoiding the use of a card slot type conveyor device, saving hardware costs; using R&D data to generate a digital template as the only data source to guide image positioning, avoiding physical online modeling, and improving the efficiency of motherboard testing.

[0080] Figure 3 An optional flow chart of the motherboard testing method provided in an embodiment of the present application is shown and will be explained according to each step.

[0081] Step S101, obtaining a digital template corresponding to the motherboard to be tested.

[0082] In some embodiments, a motherboard testing device (hereinafter referred to as the device) determines the model of the motherboard to be tested based on the identification of the motherboard to be tested; and obtains the digital template corresponding to the motherboard to be tested based on the model of the motherboard to be tested.

[0083] In a specific implementation, the identification of the motherboard to be tested may be the radio frequency identification (RFID) information of the motherboard to be tested. The device may obtain the radio frequency identification information of the motherboard to be tested based on a sensor included in the device or a sensor outside the device, and determine the model of the motherboard to be tested based on the radio frequency identification information.

[0084] In some optional embodiments, the device can obtain the digital template from a server outside the device, or the device can also pre-store the correspondence between the motherboard model and the digital template and at least one digital template, and obtain the digital template based on the model of the motherboard to be tested.

[0085] Step S102: determining a target supporting hole based on the position information of all supporting holes of the digital template.

[0086] In some embodiments, the device confirms at least one group of candidate support holes based on all the support holes of the digital template; determines the fitness value corresponding to the at least one group of candidate support holes based on the position information of the at least one group of candidate support holes; confirms a group of candidate support holes with the largest fitness value as the target support holes; wherein the fitness value is used to characterize the stability of the mainboard to be tested placed on the supporting board based on the target support holes after the candidate support holes are used as target support holes.

[0087] In a specific implementation, the device determines the fitness value corresponding to at least one group of candidate support holes based on the sum of the distances between each support hole in the candidate support holes and the first position of the motherboard to be tested, and the sum of the distances between any two support holes in the candidate support holes; wherein the first position is the center point of the minimum circumscribed rectangle of the motherboard to be tested.

[0088] For example, when each group of candidate supporting holes includes N candidate supporting holes, the fitness value may be determined by the following formula:

[0089]

[0090] Among them, α is the weight, which can be set according to actual needs; (candSuppHole.x i , candSuppHole.y i ) is the coordinate of the i-th candidate supporting hole in a set of candidate supporting holes; (x c ,y c ) is the coordinate of the first position; fitness is the fitness value of a set of candidate support holes.

[0091] Step S103: based on the position information of the target support hole, confirm the position information of the support column on the carrier plate corresponding to the target support hole.

[0092] In some embodiments, the device confirms that a first support hole among the target support holes located at the second position of the mainboard to be tested corresponds to the fixed support column on the supporting plate; based on the position information of the target support hole and the position information of the fixed support column on the supporting plate, the position information of the movable support column on the supporting plate is determined; wherein, the target support hole corresponds one-to-one to the fixed support column and the movable support column; the second position is located at the upper left corner of the mainboard to be tested, and the first support hole located at the second position of the mainboard to be tested is the support hole located at the upper left corner of the mainboard to be tested (or the support hole that is closest to the upper left corner of the mainboard to be tested).

[0093] In a specific implementation, the device determines the position information of the mobile support column corresponding to the second support hole on the supporting plate based on the relative position information of the first support hole in the target support hole and the second support hole in the target support hole, and the position information of the fixed support column on the supporting plate; the second support hole is the support hole in the target support hole other than the first support hole.

[0094] The position information of the movable support column on the bearing plate relative to the fixed support column can be determined by the following formula:

[0095]

[0096] The position information coordinates of the first support hole are fixedHole, (fixedHole.x, fixedHole.y), and the position information coordinates of the ith support hole (which can be the second support hole) are (suppHole.x i ,suppHole.y i After determining the position information of the movable support column on the supporting plate relative to the fixed support column, the position information of the movable support column on the supporting plate is determined in combination with the position information of the fixed support column on the supporting plate.

[0097] Step S104: placing the motherboard to be tested on the carrier board based on the position information of the target supporting holes and the position information of the supporting columns.

[0098] In some embodiments, the device can also confirm the first posture information of the mainboard to be tested before placing the mainboard to be tested on the supporting plate based on the position information of the target support hole and the position information of the support column; move the mainboard to be tested to the field of view of the local camera based on the first posture information; and confirm the second posture information of the mainboard to be tested based on the local camera.

[0099] In a specific implementation, the device confirms the first posture information of the mainboard to be tested based on the position information of the component of the first shape on the mainboard to be tested, and moves the mainboard to be tested to the field of view of a local camera based on the first posture information; the local camera included in the device obtains the position information of at least one component of the first shape on the mainboard to be tested; based on the position information of at least one component of the first shape on the mainboard to be tested, confirms the second posture information of the mainboard to be tested; the second posture information is used to place the mainboard to be tested on the carrier board.

[0100] In a specific implementation, after the motherboard to be tested moves into the field of view of the local camera, the local camera included in the device obtains the position information of any first-shaped component on the motherboard to be tested; moves the motherboard to be tested, and records the distance and direction of movement; the local camera obtains the position information of any first-shaped component on the motherboard to be tested; based on the position information of the first-shaped component obtained twice by the local camera, and the distance and direction of movement of the motherboard to be tested, confirm the second posture information of the motherboard to be tested. Among them, the first-shaped components obtained twice by the local camera can be the same component or different components.

[0101] In some optional embodiments, the device can also place the mainboard to be tested on the supporting board based on the second posture information, the position information of the target support hole and the position information of the support column on the supporting board; wherein the target support hole corresponds one-to-one to the support column.

[0102] Step S105 , testing the motherboard to be tested placed on the carrier board.

[0103] In some embodiments, the device confirms the position of at least one interface of the motherboard to be tested based on a wing camera; connects at least one data line to the at least one interface based on the position of the at least one interface; tests the motherboard to be tested based on the at least one data line; and moves the motherboard to be tested to a corresponding position based on the test result.

[0104] In a specific implementation, if the test result indicates that the motherboard to be tested passes the test, the motherboard to be tested is moved to a qualified area; if the test result indicates that the motherboard to be tested fails the test, the motherboard to be tested is moved to a failed area.

[0105] In this way, through the motherboard testing method provided in the embodiment of the present application, the movement of the motherboard to be tested and the plugging and unplugging of the test line can be guided by camera vision, which can reduce manual intervention in the process of motherboard testing and save human resources. In addition, the motherboard testing method provided in the embodiment of the present application does not limit the model of the motherboard. Any model of motherboard can obtain its corresponding digital template based on RFID, and then determine the target support hole and the corresponding support column on the class, place the motherboard for testing, and further reduce hardware costs. In addition, each motherboard is equipped with RFID, which is convenient for production cycle management and data traceability.

[0106] Figure 4 The optional flow diagram of confirming the first posture information of the motherboard to be tested provided by the embodiment of the present application is shown, and the description will be made according to each step. Among them, confirming the first posture information of the motherboard to be tested can also use any other achievable method, and the present application does not make specific restrictions.

[0107] Step S201 , obtaining a first pyramid image corresponding to an image of a digital template and a second pyramid image corresponding to an image of a motherboard to be tested.

[0108] In some embodiments, the motherboard testing device acquires an image of a digital template, and / or acquires an image of a motherboard to be tested; wherein the image of the digital template and the image of the motherboard to be tested correspond to the same model of PCBA. The device acquires a first pyramid image corresponding to the image of the digital template and a second pyramid image corresponding to the image of the motherboard to be tested; wherein the first pyramid image and the second pyramid image include the same number of images, and the resolution of each corresponding layer is the same (for example, the resolution of the image at the top layer in the first pyramid is the same as the resolution of the image at the top layer in the second pyramid).

[0109] In some embodiments, before the apparatus obtains the first pyramid image corresponding to the image of the digital template and the second pyramid image corresponding to the image of the motherboard to be tested, it can also determine the relative position information of the first-shaped component and the second component on the image of the digital template.

[0110] In a specific implementation, the device determines the center coordinates and diameter of the component of the first shape on the image of the digital template; determines the coordinate information of the second component on the image of the digital template; based on the center coordinates and diameter of the component of the first shape on the image of the digital template, and the coordinate information of the second component on the image of the digital template, confirms the relative position information of the component of the first shape and the second component on the image of the digital template. Wherein, the first shape can be a circle; the component of the first shape can be a circular component on the image of the digital template; the second component can be a component corresponding to the component to be positioned on the image of the motherboard to be tested.

[0111] In some embodiments, before acquiring the first pyramid image corresponding to the image of the digital template and the second pyramid image corresponding to the image of the mainboard to be tested, the apparatus may also determine a coordinate set of a component of a first shape on the image of the mainboard to be tested.

[0112] In a specific implementation, the device determines the coordinate information of the center of at least one circle on the image of the motherboard to be tested that meets the first condition; clusters all circles on the image of the motherboard to be tested that meet the first condition to obtain a clustering result; determines the coordinate information corresponding to the clustering result whose difference between the diameter of the component of the first shape on the image of the digital template is less than a second threshold value as the coordinate set of the component of the first shape on the image of the motherboard to be tested. The first condition includes that the absolute value of the difference between the radius of the circular component and the radius of the circular component of the image of the digital template is within a first range.

[0113] Figure 5 A schematic diagram of a template image or an image to be positioned provided in an embodiment of the present application is shown. Figure 5In the first shape component ( Figure 5 The color of the circular component indicated in the figure is different from the colors of other components. Compared with the shape distinction method, the coordinate information of the component of the first shape can be obtained more quickly. Figure 5 In the example, the color of the second component is different from the colors of other components, and the coordinate information of the second component can be obtained by color retrieval.

[0114] Step S202, transforming each layer of the first pyramid image, and determining the transformation coefficient corresponding to the first pyramid image as the target coefficient when the distance between the component of the first shape in the transformed first pyramid image and the component of the first shape in the corresponding layer of the image pyramid of the mainboard to be tested is less than a first threshold.

[0115] In some embodiments, the apparatus transforms each layer of the image in the first pyramid image, and determines that the transformation coefficient corresponding to the first pyramid image is the target coefficient when the distance between the component of the first shape in the transformed first pyramid image and the component of the first shape in the corresponding layer of the image pyramid of the mainboard to be tested is less than a first threshold.

[0116] In some embodiments, the apparatus determines at least one set of coefficients for transforming each layer of the first pyramid image; wherein each set of coefficients comprises a translation coefficient, a scaling coefficient, and a rotation angle coefficient.

[0117] In specific implementation, the device determines the translation coefficient in each group of coefficients based on a translation amount threshold range and a first step length; determines the scaling coefficient in each group of coefficients based on a scaling amount threshold range and a second step length; and determines the rotation angle coefficient in each group of coefficients based on a rotation angle threshold range and a third step length.

[0118] In some embodiments, the device transforms the uppermost layer of the first pyramid image to the lowermost layer of the first pyramid image in sequence based on at least one set of coefficients; wherein the layers of the first pyramid image have different serial numbers and corresponding coefficients.

[0119] Step S203: determining the first position information of the motherboard to be tested based on the target coefficient.

[0120] In some embodiments, the device determines the first bit pose information of the mainboard to be tested based on the target coefficient.

[0121] Figure 6 A schematic diagram of data flow in a motherboard test system provided in an embodiment of the present application is shown; Figure 7An optional schematic diagram of a motherboard testing system provided in an embodiment of the present application is shown and will be described according to each part.

[0122] like Figure 7 The motherboard testing system 400 shown is used to implement the above-mentioned motherboard positioning method and / or the method for confirming the first position information of the motherboard to be tested. The motherboard testing system 400 includes the motherboard testing device.

[0123] like Figure 7 As shown, the motherboard testing system 400 includes a pick-and-place robot (also referred to as a loading and unloading arm), wherein the pick-and-place robot can be a six-axis robot; an automatic plug-in module 402, wherein the automatic plug-in module can include a three-axis robot for connecting the data cable to the motherboard to be tested or unplugging the data cable from the interface of the motherboard to be tested, a test module 403 and a carrier module 404.

[0124] The carrier module 404 may include a carrier plate (which may be a multifunctional carrier plate) and a cover plate (which may be an integrated cover plate).

[0125] In actual application, the motherboard test system obtains the model of the PCBA of the motherboard to be tested according to the front-end RFID information of the motherboard to be tested, downloads the corresponding digital template from the server included in the motherboard test system or the server outside the motherboard test system, and automatically adjusts the grasping method and the layout of the support columns on the carrier board (i.e., the method of determining the support holes and the support columns in steps S101 to S105); obtains the position information of the motherboard PCBA by visual positioning (the method of steps S201 to S203), and the pick-and-place robot picks up the motherboard PCBA to be tested from the conveyor belt included in the electronic device or the conveyor belt outside the electronic device, and places it on the multi-functional carrier board, and the visually guided automatic plug-in module inserts the power supply, USB, Type-C and other interfaces on the motherboard; the test module tests the motherboard to be tested and uploads the test results to the motherboard test device and the database; the pick-and-place robot removes the tested motherboard from the support columns of the carrier board and puts it into a good material box (qualified area) or a defective material box (unqualified area).

[0126] Correspondingly, such as Figure 6As shown, the motherboard testing device (which can be an industrial computer or an industrial computer) obtains the RFID information of the motherboard to be tested. Optionally, the motherboard testing device can obtain the RFID information of the motherboard to be tested through an industrial camera (or a local camera) or a sensor. The motherboard testing device can also obtain the RFID information of the motherboard to be tested through a radio frequency identification device. Then, the motherboard testing device obtains the digital template corresponding to the motherboard to be tested from the database, and determines the support holes of the motherboard to be tested and the support columns on the carrier plate; then the manipulator is controlled to move the motherboard to be tested onto the carrier plate, and optionally, the integrated cover plate is controlled to move above the carrier plate; after the test is completed, the pick-and-place manipulator removes the tested motherboard from the support columns of the carrier plate and puts it into a good material box (qualified area) or a defective material box (unqualified area). Optionally, the test results are displayed on the display interface.

[0127] Figure 8 Another optional flow chart of the motherboard testing method provided in the embodiment of the present application is shown and will be explained according to each step.

[0128] Step S301, obtaining a digital template corresponding to the motherboard to be tested.

[0129] In some embodiments, after the motherboard to be tested is placed on a conveyor belt inside or outside the device, a sensor inside or outside the device is triggered; the device confirms the model of the motherboard to be tested based on the RFID information of the motherboard to be tested obtained by the sensor; based on the model of the motherboard to be tested, a digital template corresponding to the motherboard to be tested is obtained from a database inside or outside the device.

[0130] In some optional embodiments, the pick-and-place robot included in the device can adjust the width of the end gripper of the pick-and-place robot based on prior information of the digital template (such as shape information, including size, thickness, etc.) to grasp the motherboard to be tested.

[0131] Step S302, adjusting the position of the supporting column on the supporting plate.

[0132] In some embodiments, the device confirms the target support hole based on the prior information of the digital template, and confirms the position information of the support column on the support plate corresponding to the target support hole based on the position information of the target support hole.

[0133] Fig. 9 A schematic diagram of the support holes and circular positioning components on the mainboard to be tested provided in an embodiment of the present application is shown.

[0134] In a specific implementation, the device confirms at least one group of candidate support holes based on all the support holes of the digital template; determines the fitness value corresponding to the at least one group of candidate support holes based on the position information of the at least one group of candidate support holes; and confirms a group of candidate support holes with the largest fitness value as the target support holes; wherein the fitness value is used to characterize the stability of the mainboard to be tested placed on the carrier board based on the target support holes after the candidate support holes are used as target support holes.

[0135] In a specific implementation, the device determines the fitness value corresponding to at least one group of candidate support holes based on the sum of the distances between each support hole in the candidate support holes and the first position of the motherboard to be tested, and the sum of the distances between any two support holes in the candidate support holes; wherein the first position is the center point of the minimum circumscribed rectangle of the motherboard to be tested.

[0136] For example, when each group of candidate supporting holes includes N candidate supporting holes, the fitness value may be determined by the following formula:

[0137]

[0138] Among them, α is the weight, which can be set according to actual needs; (candSuppHole.x i , candSuppHole.y i ) is the coordinate of the i-th candidate supporting hole in a set of candidate supporting holes; (x c ,y c ) is the coordinate of the first position; fitness is the fitness value of a group of candidate support holes. The group of candidate support holes with the largest fitness value is the target support hole, denoted as suppHole.

[0139] The target support holes correspond to the support columns on the carrier plate. Fig.10 A schematic diagram of the support columns on the supporting plate provided in an embodiment of the present application is shown.

[0140] like Fig.10 As shown, the support column on the carrier plate includes a fixed support column and a movable support column, wherein the position of the fixed support column relative to the carrier plate cannot be changed and corresponds to the first support hole; the position information of the movable support column relative to the carrier plate can be changed, and can be changed according to the position of the target support hole relative to the first support hole. Optionally, the fixed support column (the center of the circle corresponding to the top view) can be set as the origin, and accordingly, a plane rectangular coordinate system is set based on the horizontal plane where the carrier plate is located.

[0141] In some embodiments, the device confirms that a first support hole among the target support holes located at the second position of the mainboard to be tested corresponds to the fixed support column on the supporting plate; based on the position information of the target support hole and the position information of the fixed support column on the supporting plate, the position information of the movable support column on the supporting plate is determined; wherein, the target support hole corresponds one-to-one to the fixed support column and the movable support column; the second position is located at the upper left corner of the mainboard to be tested, and the first support hole located at the second position of the mainboard to be tested is the support hole located at the upper left corner of the mainboard to be tested (or the support hole that is closest to the upper left corner of the mainboard to be tested).

[0142] In a specific implementation, the device determines the position information of the mobile support column corresponding to the second support hole on the supporting plate based on the relative position information of the first support hole in the target support hole and the second support hole in the target support hole, and the position information of the fixed support column on the supporting plate; the second support hole is the support hole in the target support hole other than the first support hole.

[0143] The position information of the movable support column on the bearing plate relative to the fixed support column can be determined by the following formula:

[0144]

[0145] Among them, the position information coordinates of the first support hole are fixedHole, (fixedHole.x, fixedHole.y), and the position information coordinates of the i-th support hole (the second support hole) are (suppHole.x i ,suppHole.y i After determining the position information of the movable support column on the carrier plate relative to the fixed support column, the position information of the fixed support column on the carrier plate is collected to determine the position information of the movable support column on the carrier plate.

[0146] In some optional embodiments, the device sends the position information of the mobile support column on the carrier plate to the controller controlling the pick-and-place robot, so that the pick-and-place robot can pick up the mobile support column and set the mobile support column on the carrier plate based on the position information of the mobile support column on the carrier plate. Optionally, the mobile support column can be fixed on the carrier plate by powering on. The controller can be a controller included in the device or a controller outside the device, or even the device.

[0147] Step S303, determining the position information of the motherboard to be tested.

[0148] In some embodiments, an industrial camera acquires an image of a mainboard to be tested, determines the first position information of the mainboard to be tested in the industrial camera coordinate system based on a circular positioning component on the mainboard to be tested, and sends it to a controller that controls the pick-and-place robot.

[0149] Specifically, the device can confirm the first position information of the motherboard to be tested based on the process from step S201 to step S203, which will not be repeated here.

[0150] The pick-and-place control hand grabs the motherboard to be tested based on the first posture information, and moves the motherboard to be tested into the field of view of the local camera included in the device; and confirms the second position information of the motherboard to be tested based on the local camera.

[0151] Fig.11 A schematic diagram of an image captured by a local camera provided in an embodiment of the present application is shown. Fig.11 The middle circular component is a component of the first shape.

[0152] In some optional embodiments, after the pick-and-place control hand moves the motherboard to be tested into the field of view of the local camera included in the device, a first photo is taken (obtaining Fig.11 The local camera obtains the position information of any first-shaped component on the mainboard to be tested; based on the position information of the first-shaped component obtained twice by the local camera, and the moving distance and direction of the mainboard to be tested, the second position information of the mainboard to be tested is confirmed. The first-shaped components obtained twice by the local camera can be the same component or different components.

[0153] Step S304, placing the motherboard to be tested on the carrier board.

[0154] In some embodiments, the device places the mainboard to be tested on the carrier plate based on the second posture information and the position information of the at least one support column (including a fixed support column and a movable support column), so that the target support hole of the mainboard to be tested corresponds one-to-one to the at least one support column.

[0155] Step S305: The side camera confirms the position information of at least one interface on the mainboard to be tested.

[0156] In some embodiments, the apparatus confirms position information of at least one interface of the mainboard to be tested based on a side camera.

[0157] Fig.12 A schematic diagram of an image acquired by a wing camera provided in an embodiment of the present application is shown.

[0158] In some optional embodiments, such as Fig.12 As shown, the device can confirm the position information of the at least one interface based on a specific shape and / or size in the image acquired by the side-wing camera.

[0159] Step S306: Connecting a data line based on the location of the at least one interface and the test requirements.

[0160] In some embodiments, the device connects at least one data line to the at least one interface based on the location of the at least one interface and the test requirement, wherein the at least one data line corresponds to the test requirement.

[0161] In a specific implementation, the device includes a pick-and-place robot or other robot that connects the at least one data line to the at least one interface based on the test requirements; the at least one interface may optionally include at least one of the following: a power interface, a High Definition Multimedia Interface (HDMI) port, and a Universal Serial Bus (USB) interface (including at least a USB2.0 interface, a USB3.0 interface, and a next-generation USB interface), etc.

[0162] In some optional embodiments, after the device connects at least one data line to the at least one interface, the integrated cover may be closed.

[0163] Step S307, testing the motherboard to be tested.

[0164] In some embodiments, the device tests the motherboard to be tested based on the at least one piece of data, and moves the motherboard to be tested to a corresponding position based on the test result.

[0165] In some optional embodiments, the device may also upload the test results to a database and / or display them on a display interface.

[0166] In some other optional embodiments, after the device obtains the test result, the at least one data line can be pulled out by a robot, so that the at least one data line is separated from the at least one interface, so as to move the motherboard to be tested.

[0167] In a specific implementation, if the test result indicates that the motherboard to be tested passes the test, the motherboard to be tested is moved to a qualified area; if the test result indicates that the motherboard to be tested fails the test, the motherboard to be tested is moved to a failed area.

[0168] In this way, through the motherboard testing method provided in the embodiment of the present application, the movement of the motherboard to be tested and the plugging and unplugging of the test line can be guided by camera vision, which can reduce manual intervention in the process of motherboard testing and save human resources. In addition, the motherboard testing method provided in the embodiment of the present application does not limit the model of the motherboard. Any model of motherboard can obtain its corresponding digital template based on RFID, and then determine the target support hole and the corresponding support column on the class, place the motherboard for testing, and further reduce hardware costs. In addition, each motherboard is equipped with RFID, which is convenient for production cycle management and data traceability.

[0169] Fig.13 An optional structural schematic diagram of a motherboard testing device provided in an embodiment of the present application is shown and will be described according to each part.

[0170] In some embodiments, the motherboard testing device 500 includes: an acquisition unit 501 , a first determination unit 502 , a second determination unit 503 , a placement unit 504 , and a testing unit 505 .

[0171] An acquisition unit 501 is used to acquire a digital template corresponding to the motherboard to be tested;

[0172] A first determining unit 502, configured to determine a target supporting hole based on position information of all supporting holes of the digital template;

[0173] A second determining unit 503 is used to confirm the position information of the support column corresponding to the target support hole on the carrier plate based on the position information of the target support hole;

[0174] A placement unit 504, configured to place the motherboard to be tested on the carrier board based on the position information of the target support hole and the position information of the support column;

[0175] The testing unit 505 is used to test the motherboard to be tested placed on the carrier board.

[0176] The acquisition unit 501 is specifically configured to determine the model of the motherboard to be tested based on the identification of the motherboard to be tested; and acquire the digital template corresponding to the motherboard to be tested based on the model of the motherboard to be tested.

[0177] The first determination unit 502 is specifically used to confirm at least one group of candidate support holes based on all the support holes of the digital template; determine the fitness value corresponding to the at least one group of candidate support holes based on the position information of the at least one group of candidate support holes; and confirm that a group of candidate support holes with the largest fitness value are the target support holes; wherein the fitness value is used to characterize the stability of the mainboard to be tested placed on the carrier board based on the target support holes after the candidate support holes are used as target support holes.

[0178] The first determination unit 502 is specifically used to determine the fitness value corresponding to the at least one group of candidate support holes based on the sum of the distances between each support hole in the candidate support holes and the first position of the motherboard to be tested, and the sum of the distances between any two support holes in the candidate support holes; wherein the first position is the center point of the minimum circumscribed rectangle of the motherboard to be tested.

[0179] The second determination unit 503 is specifically used to confirm that the first support hole in the target support hole located at the second position of the mainboard to be tested corresponds to the fixed support column on the supporting board; based on the position information of the target support hole and the position information of the fixed support column on the supporting board, determine the position information of the movable support column on the supporting board; wherein, the target support hole corresponds one-to-one to the fixed support column and the movable support column.

[0180] The second determination unit 503 is specifically used to determine the position information of the mobile support column corresponding to the second support hole on the supporting plate based on the relative position information of the first support hole in the target support hole and the second support hole in the target support hole, and the position information of the fixed support column on the supporting plate; the second support hole is the support hole in the target support hole except the first support hole.

[0181] The first determination unit 502 or the second determination unit 503 is also used to confirm the first posture information of the mainboard to be tested before placing the mainboard to be tested on the supporting board based on the position information of the target support hole and the position information of the support column; move the mainboard to be tested to the field of view of the local camera based on the first posture information; and confirm the second posture information of the mainboard to be tested based on the local camera.

[0182] The first determining unit 502 or the second determining unit 503 is specifically configured to confirm the first pose information of the mainboard to be tested based on the position information of the component of the first shape on the mainboard to be tested.

[0183] The first determination unit 502 or the second determination unit 503 is specifically used for the local camera to obtain the position information of at least one first-shaped component on the mainboard to be tested; based on the position information of at least one first-shaped component on the mainboard to be tested, confirm the second posture information of the mainboard to be tested; the second posture information is used to place the mainboard to be tested on the carrier board.

[0184] The testing unit 505 is specifically used to confirm the position of at least one interface of the mainboard to be tested based on the side camera; based on the position of the at least one interface, connect at least one data line to the at least one interface; and test the mainboard to be tested based on the at least one data line.

[0185] The placement unit 504 is further used to move the motherboard to be tested to a corresponding position based on the test result.

[0186] Fig.14 The schematic diagram of the hardware structure of the electronic device provided by the embodiment of the present application is shown, and the electronic device 700 includes: at least one processor 701, a memory 702 and at least one network unit 704. The various components in the electronic device 700 are coupled together through a bus system 705. It can be understood that the bus system 705 is used to realize the connection and communication between these components. In addition to the data bus, the bus system 705 also includes a power bus, a control bus and a status signal bus. However, for the sake of clarity, in Fig.14 Various buses are labeled as bus system 705.

[0187] It can be understood that the memory 702 can be a volatile memory or a non-volatile memory, and can also include both volatile and non-volatile memories. Among them, the non-volatile memory can be ROM, programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), magnetic random access memory (FRAM), ferromagnetic random access memory, flash memory, magnetic surface memory, optical disk, or compact disc read-only memory (CD-ROM); the magnetic surface memory can be a disk memory or a tape memory. The volatile memory can be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), direct memory bus random access memory (DRRAM). The memory 702 described in the embodiments of the present application is intended to include but is not limited to these and any other suitable types of memory.

[0188] The memory 702 in the embodiment of the present application is used to store various types of data to support the operation of the electronic device 700. Examples of such data include: any computer program for operating on the electronic device 700, such as the application 722. The program for implementing the method of the embodiment of the present application may be included in the application 722.

[0189] The method disclosed in the embodiment of the present application can be applied to the processor 701, or implemented by the processor 701. The processor 701 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the method can be completed by the hardware integrated logic circuit or software instructions in the processor 701. The processor 701 may be a general-purpose processor, a digital signal processor (DSP, Digital Signal Processor), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The processor 701 can implement or execute the methods, steps and logic block diagrams disclosed in the embodiment of the present application. The general-purpose processor may be a microprocessor or any conventional processor, etc. In combination with the steps of the method disclosed in the embodiment of the present application, it can be directly embodied as a hardware decoding processor to execute, or it can be executed by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium, which is located in the memory 702, and the processor 701 reads the information in the memory 702 and completes the steps of the aforementioned method in combination with its hardware.

[0190] In an exemplary embodiment, the electronic device 700 may be implemented by one or more application specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), FPGAs, general purpose processors, controllers, MCUs, MPUs, or other electronic components to execute the aforementioned method.

[0191] In addition to the above-mentioned methods and devices, an embodiment of the present application may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present application described in the above-mentioned "Exemplary Method" section of this specification.

[0192] The computer program product may be written in any combination of one or more programming languages ​​to write program codes for performing the operations of the embodiments of the present application, including object-oriented programming languages, such as Java, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as an independent software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0193] In addition, an embodiment of the present application may also be a computer-readable storage medium on which computer program instructions are stored. When the computer program instructions are executed by a processor, the processor executes the steps of the method according to various embodiments of the present application described in the above "Exemplary Method" section of this specification.

[0194] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0195] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0196] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0197] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0198] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0199] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A motherboard testing method, characterized in that: The method comprises: Get the digital template corresponding to the motherboard to be tested; Determining target supporting holes based on position information of all supporting holes of the digital template; Based on the position information of the target support hole, confirming the position information of the support column corresponding to the target support hole on the carrier plate; Based on the position information of the target support hole and the position information of the support column, placing the motherboard to be tested on the carrying plate; Testing the mainboard to be tested placed on the carrier board; The determining of the target supporting holes based on the position information of all the supporting holes of the digital template comprises: confirming at least one group of candidate supporting holes based on all the supporting holes of the digital template; determining the fitness values ​​corresponding to the at least one group of candidate supporting holes based on the position information of the at least one group of candidate supporting holes; confirming a group of candidate supporting holes with the largest fitness values ​​as the target supporting holes; wherein the fitness values ​​are used to characterize the stability of the mainboard to be tested placed on the carrier board based on the target supporting holes after the candidate supporting holes are used as the target supporting holes; The determining of the fitness value corresponding to the at least one group of candidate supporting holes based on the position information of the at least one group of candidate supporting holes comprises: determining the fitness value corresponding to the at least one group of candidate supporting holes based on the sum of the distances between each supporting hole in the candidate supporting holes and the first position of the motherboard to be tested, and the sum of the distances between any two supporting holes in the candidate supporting holes; wherein the first position is the center point of the minimum circumscribed rectangle of the motherboard to be tested; The method of confirming the position information of the support column on the carrier plate corresponding to the target support hole based on the position information of the target support hole comprises: confirming that the first support hole in the target support hole located at the second position of the motherboard to be tested corresponds to the fixed support column on the carrier plate; determining the position information of the movable support column on the carrier plate based on the position information of the target support hole and the position information of the fixed support column on the carrier plate; wherein the target support hole corresponds to the fixed support column and the movable support column one by one; Based on the position information of the target support hole, confirm the position information of the support column corresponding to the target support hole on the carrier plate, including: based on the relative position information of the first support hole in the target support hole and the second support hole in the target support hole, and the position information of the fixed support column on the carrier plate, determine the position information of the mobile support column corresponding to the second support hole on the carrier plate; the second support hole is the support hole in the target support hole except the first support hole.

2. The method according to claim 1, characterized in that The step of obtaining the digital template corresponding to the motherboard to be tested includes: Determining the model of the motherboard to be tested based on the identification of the motherboard to be tested; Based on the model of the mainboard to be tested, the digital template corresponding to the mainboard to be tested is obtained.

3. The method according to claim 1, characterized in that Before placing the motherboard to be tested on the carrier board based on the position information of the target support hole and the position information of the support column, the method further includes: Confirming the first position information of the motherboard to be tested; Based on the first posture information, moving the motherboard to be tested into the field of view of a local camera; The second position information of the mainboard to be tested is confirmed based on the local camera.

4. The method according to claim 3, characterized in that The step of confirming the first position information of the motherboard to be tested includes: Based on the position information of the component of the first shape on the mainboard to be tested, the first position information of the mainboard to be tested is confirmed.

5. The method according to claim 3, characterized in that: The confirming the second posture information of the mainboard to be tested comprises: The local camera acquires position information of at least one component of a first shape on the mainboard to be tested; Based on the position information of at least one component of the first shape on the mainboard to be tested, confirming the second posture information of the mainboard to be tested; The second posture information is used to place the mainboard to be tested on the carrying board.

6. The method according to claim 1, characterized in that The testing of the motherboard to be tested placed on the carrier board includes: Confirming the position of at least one interface of the motherboard to be tested based on a side camera; connecting at least one data line to the at least one interface based on the location of the at least one interface; The mainboard to be tested is tested based on the at least one data line.

7. The method according to claim 1 or 6, characterized in that: After testing the motherboard to be tested placed on the carrier board, the method further includes: Based on the test results, the motherboard to be tested is moved to a corresponding position.

8. A motherboard testing device, characterized in that: The device comprises: An acquisition unit, used for acquiring a digital template corresponding to the motherboard to be tested; A first determining unit, configured to determine a target supporting hole based on position information of all supporting holes of the digital template; A second determining unit, configured to determine position information of a support column on the carrier plate corresponding to the target support hole based on the position information of the target support hole; A placement unit, used for placing the motherboard to be tested on the carrier board based on the position information of the target support hole and the position information of the support column; A testing unit, used for testing the motherboard to be tested placed on the carrier board; The first determination unit is specifically used to confirm at least one group of candidate support holes based on all the support holes of the digital template; determine the fitness value corresponding to the at least one group of candidate support holes based on the position information of the at least one group of candidate support holes; confirm a group of candidate support holes with the largest fitness value as the target support holes; wherein the fitness value is used to characterize the stability of the mainboard to be tested placed on the carrier board based on the target support holes after the candidate support holes are used as the target support holes; The first determination unit is specifically used to determine the fitness value corresponding to the at least one group of candidate support holes based on the sum of the distances between each support hole in the candidate support holes and the first position of the motherboard to be tested, and the sum of the distances between any two support holes in the candidate support holes; wherein the first position is the center point of the minimum circumscribed rectangle of the motherboard to be tested; The second determination unit is specifically used to confirm that the first support hole located at the second position of the motherboard to be tested in the target support hole corresponds to the fixed support column on the carrier board; based on the position information of the target support hole and the position information of the fixed support column on the carrier board, determine the position information of the movable support column on the carrier board; wherein the target support hole corresponds to the fixed support column and the movable support column one by one; The second determination unit is specifically used to determine the position information of the mobile support column corresponding to the second support hole on the supporting plate based on the relative position information of the first support hole in the target support hole and the second support hole in the target support hole, and the position information of the fixed support column on the supporting plate; the second support hole is the support hole in the target support hole other than the first support hole.

9. An electronic device, characterized in that: The invention comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; the memory is used to store computer programs; and the processor is used to implement the method described in any one of claims 1 to 7 when executing the program stored in the memory.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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