Chip mounting device and method for manufacturing semiconductor device

Abstract

The present invention provides a technology that can reduce the mutual interference between coaxial illumination and oblique illumination. A chip mounting device includes: a first illumination device that illuminates a bare chip along the optical axis of an imaging device; and a second illumination device, located above the first illumination device, that illuminates the bare chip at a predetermined angle relative to the optical axis. The second illumination device includes a second light-emitting portion and a light path control member that limits the light path of a second illumination light emitted from the second light-emitting portion. The second illumination light, whose light path is limited by the light path control member, passes through the barrel of the first illumination device and illuminates the upper surface of the bare chip.

Description

Technical Field

[0001] The present disclosure relates to a chip mounting device, for example, applicable to a chip mounting machine having a camera for identifying bare chips. Background Art

[0002] Die placement equipment, such as die mounters, uses solder, gold plating, or resin as bonding materials to mount (mount and bond) semiconductor chips (hereinafter simply referred to as bare chips) onto wiring boards, lead frames, and other substrates (hereinafter simply referred to as substrates), or onto already mounted bare chips. For example, in a die mounter that places bare chips on the surface of a substrate, the following actions (operations) are repeated: a suction nozzle called a collet is used to pick up the bare chip from a wafer, transfer it to the substrate, and then apply pressure and heat the bonding material to perform placement.

[0003] For visual inspection (surface inspection) of bare chips before picking them from a wafer to check for damage such as cracks or foreign matter, or for positioning bare chips, a lighting device is used to capture images with a camera. When designing visual inspection or positioning functions within the camera's captured image, the lighting configuration can be either a brightfield mode, which creates a brighter background and a darker image of the desired object, or a darkfield mode, which creates a darker background and a brighter image of the desired object.

[0004] Darkfield inspection is generally more effective when inspecting for minor damage. Since the wafer surface is nearly mirror-like, darkfield inspection uses oblique lighting, which illuminates the subject at an angle relative to the camera's optical axis. In the case of cracks, keeping the angle of incidence of oblique lighting as close to the optical axis as possible (as close to 0 degrees as possible) will make the cracks more visible. Furthermore, during darkfield inspection, the goal is to ensure that the background wafer or bare chip surface reflects the illuminated light and does not enter the camera.

[0005] On the other hand, when checking positioning or visual inspection for foreign objects, bright field is more suitable. In bright field, coaxial epi-illumination or coaxial illumination (hereinafter referred to as coaxial illumination) is used to illuminate the object using the same optical axis as the camera.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2020-13841 Summary of the Invention

[0009] When both oblique lighting and coaxial lighting are provided as an illumination device and only one of them is used, there is a concern that the oblique lighting and the coaxial lighting may interfere with each other.

[0010] An object of the present disclosure is to provide a technology capable of reducing mutual interference between coaxial illumination and oblique illumination.

[0011] The typical outline of the present disclosure is briefly described below.

[0012] Specifically, the die attach device includes: a first lighting device that illuminates the bare chip along the optical axis of an imaging device; and a second lighting device, located above the first lighting device, that illuminates the bare chip at a predetermined angle relative to the optical axis. The second lighting device includes a second light-emitting unit and a light path control member that limits the optical path of second illumination light emitted from the second light-emitting unit. The second illumination light, whose optical path is limited by the light path control member, is configured such that it passes through the barrel of the first lighting device and illuminates the upper surface of the bare chip.

[0013] Effects of the Invention

[0014] According to the die mounting device, the influence of coaxial illumination on oblique illumination can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 (a) is a diagram showing the arrangement of a camera and oblique lighting for bare chip crack inspection. Figure 1 (b) is a diagram showing the configuration of the camera and coaxial lighting for positioning the bare chip.

[0016] Figure 2 This is a diagram showing the optical path of oblique lighting when oblique lighting is arranged above coaxial lighting.

[0017] Figure 3 Yes Figure 2 A diagram showing the optical path of the oblique light illumination through the half mirror, Figure 3 (a) is a diagram showing the irradiation of the crack region. Figure 3 (b) is a diagram in which a region without cracks is irradiated.

[0018] Figure 4 Yes Figure 2 The diagram shows the optical path of the light emitting portion of the coaxial illumination in the optical path of the oblique illumination. Figure 4 (a) is a diagram showing the irradiation of the crack region. Figure 4 (b) is a diagram in which a region without cracks is irradiated.

[0019] Figure 5 This is a diagram showing a composite image of a dark field image and a bright field image.

[0020] Figure 6 This is a diagram showing the arrangement of a camera of a die mounting device and an illumination device for irradiating light for image capture onto a bare chip to be imaged in an embodiment.

[0021] Figure 7 (a) means Figure 2 A diagram showing the light path in a lighting device, Figure 7 (b) means Figure 6 Diagram showing the light path in an illumination device.

[0022] Figure 8 (a) is a perspective view showing a louver attached to a light-emitting portion of oblique lighting. Figure 8 (b) means that Figure 8 (a) is a front view of the light path under oblique light illumination. Figure 8 (c) is a perspective view showing a honeycomb shield attached to a light-emitting portion of oblique lighting. Figure 8 (d) is a perspective view showing a cover attached to a light emitting portion of oblique lighting.

[0023] Figure 9 It means in Figure 6 A diagram showing optical paths when polarizing filters are installed for both oblique illumination and coaxial illumination in the embodiment shown.

[0024] Figure 10 (a) means Figure 6 A top view showing a modification of the coaxial lighting window frame structure in the embodiment shown. Figure 10 (b) is Figure 10 (a) is a cross-sectional view of .

[0025] Figure 11 Yes Figure 6 A cross-sectional view showing a change in the arrangement of the light-emitting section of the coaxial lighting in the embodiment shown.

[0026] Figure 12 It means that Figure 6 This figure shows the arrangement of the lighting device when the coaxial illumination in the embodiment is changed to coaxial illumination within the lens barrel.

[0027] Figure 13 It is a schematic top view showing a configuration example of a die mounter according to an embodiment.

[0028] Figure 14 It means Figure 13 A diagram showing the schematic structure when viewed from the direction of arrow A.

[0029] Figure 15 Yes Figure 13 A schematic cross-sectional view of the main parts of the bare chip supply unit is shown.

[0030] Figure 16 Yes Figure 13 A block diagram showing the schematic configuration of a control system for a die mounter.

[0031] Figure 17 It is an explanation Figure 13 Flowchart of the chip placement process in the chip placement machine. DETAILED DESCRIPTION

[0032] The following describes the embodiments and examples using the accompanying drawings. However, in the following description, identical components may be denoted by the same reference numerals, and duplicate descriptions may be omitted. Furthermore, to clarify the description, the widths, thicknesses, and shapes of various components in the drawings may be schematically illustrated compared to their actual configurations. However, these are merely examples and do not limit the interpretation of the present disclosure.

[0033] use Figures 1 to 5 The following describes techniques studied by the present inventors prior to the present disclosure. Figure 1 (a) is a diagram showing the arrangement of a camera and oblique lighting for bare chip crack inspection. Figure 1 (b) is a diagram showing the configuration of the camera and coaxial lighting for positioning the bare chip.

[0034] As described above, when inspecting the surface cracks in the bare chip D, it is preferable to maintain the state of not becoming a bright field, and Figure 1 As shown in (a), an oblique light illumination 102 is used with an incident angle (θ) with respect to the optical axis of the camera 101 as close to 0 degrees as possible, thereby suppressing uneven brightness in the inspection area.

[0035] On the other hand, the chip mounting device needs lighting for positioning the bare chip D in addition to lighting for crack inspection. In order to be robust against the deflection or warping of the bare chip surface, such as Figure 1 As shown in (b), the illumination range is preferably larger than the field of view of the camera 101, and the light emitting unit 103a uses a coaxial illumination 103 composed of a surface-emitting light source. In addition to the light emitting unit 103a, the coaxial illumination 103 is composed of a lens barrel 103c having a half-reflective mirror (semi-transmissive mirror) 103b inside.

[0036] When it is desired to set the oblique light illumination 102 in an optical system having a coaxial illumination 103 for positioning a bare chip so that the incident angle is as close to 0 degrees as possible, as shown in FIG. Figure 1As shown in (b), when the oblique light source 102 is placed below the coaxial light source 103, a light-shielding area LSA is formed where the light emitted by the coaxial light source 103 is blocked by the oblique light source 102. This narrows the illumination area of the coaxial light source 103, impairing the robustness against warpage of the bare chip D. Therefore, it is preferable to place the oblique light source 102 above the coaxial light source 103.

[0037] use Figures 2 to 5 The following describes the problem of arranging oblique lighting above coaxial lighting. Figure 2 This is a diagram showing the optical path of oblique lighting when oblique lighting is arranged above coaxial lighting. Figure 3 Yes Figure 2 A diagram showing the optical path of the oblique light illumination through the half mirror, Figure 3 (a) is a diagram showing the irradiation of the crack region. Figure 3 (b) is a diagram in which a region without cracks is irradiated. Figure 4 Yes Figure 2 The diagram shows the optical path of the light emitting portion of the coaxial illumination in the optical path of the oblique illumination. Figure 4 (a) is a diagram showing the irradiation of the crack region. Figure 4 (b) is a diagram in which a region without cracks is irradiated. Figure 5 This is a diagram showing a composite image of a dark field image and a bright field image.

[0038] Figure 2 The lighting device shown has Figure 1 The oblique light illumination 102 shown in (b) is arranged above the coaxial illumination 103, Figure 1 The same structure as the lighting device of (b). In addition, the oblique light illumination 102 and Figure 1 (a) is similarly configured near the camera 101.

[0039] Even if a cannonball-shaped LED is used as the parallel light source for the oblique illumination 102, light leakage may occur outside the illumination angle. Furthermore, the oblique illumination 102 used for crack detection needs to suppress uneven brightness of the light source and the LED illumination used, so a diffuser is sometimes used, for example.

[0040] In addition, the light-emitting surface of the light-emitting portion 103a of the coaxial lighting 103 sometimes reflects or diffuses light from the outside and irradiates it toward the half-reflecting mirror 103b. Coaxial lighting is not only for the purpose of preventing uneven brightness, but also for the purpose of clearly photographing the object (bare chip) and making the diffused light effective. For this purpose, a diffusion plate is sometimes provided in front of the surface-emitting light source. The diffusion plate itself does not emit light, but can be regarded as a virtual light-emitting surface. In addition to the transmission type such as acrylic, the reflection type with a diffuse reflection surface is also the same in the structure of the diffusion plate. The diffusion plate has a tendency to easily cause virtual light emission by using light from other light sources, but in addition to the diffusion plate, sometimes a color filter for the purpose of wavelength cutoff, etc. is used to achieve a phenomenon similar to that of the diffusion plate.

[0041] like Figure 2 As shown, when the oblique light 102 is set above the coaxial light 103, when only the oblique light 102 is turned on, the optical path of the irradiation light from the light emitting portion 102a of the oblique light 102 is as follows: Figure 2 As shown by the arrows, it is diffused by light leakage or a diffuser. Light from light-emitting section 102a passes through half-mirror 103b and illuminates bare chip D, reaches the inner surface of lens barrel 103c, and reaches light-emitting section 103a. In this specification, light traveling in a direction different from the intended direction is referred to as stray light, and light reaching light-emitting section 103a is referred to as stray light. Lens barrel 103c is a cylindrical molded article designed to prevent the intrusion of light from outside the designated area and reflection of light on the inner surface. Therefore, light reaching the inner surface of lens barrel 103c is not reflected except for minor diffuse reflections.

[0042] exist Figure 2 The light passing through the light path indicated by the arrow, from the oblique light illumination 102 is transmitted through the half mirror 103b, as shown in FIG. Figure 3 As shown in (a), when the light irradiating the bare chip D irradiates the crack CR at an angle relative to the optical axis, the reflected light along the optical axis among the light scattered in the crack CR enters the camera 101, thereby illuminating the crack area. Figure 3 As shown in (b), when the area without cracks is illuminated obliquely relative to the optical axis, the reflected light symmetrically reflected relative to the optical axis does not enter the camera 101, thereby becoming a dark field illumination in which the normal area is photographed darkly.

[0043] By using Figure 2 Among the light paths indicated by the middle arrows, the light (stray light) from the oblique illumination 102 irradiating the light emitting portion 103a in the coaxial illumination 103 is as shown in FIG. Figure 4 (a) and Figure 4As shown in (b), the light is scattered in the light emitting portion 103a. The light reflected at right angles (horizontally) to the optical axis in the scattered light is reflected by the half mirror 103b and irradiates the bare chip D along the optical axis. Figure 4 As shown in (a), the light irradiated to the crack CR is scattered, and the reflected light along the optical axis disappears and does not enter the camera 101, so the crack CR becomes dark. Figure 4 As shown in (b), the light irradiated to the area without cracks is reflected along the optical axis and enters the camera 101, thereby becoming a bright field illumination that brightens the normal area.

[0044] like Figure 5 As shown in (a), in the dark field based on oblique illumination, the brightness difference between the brightness of the crack CR and the brightness of the surface of the bare chip D is large. Figure 4 The stray light described in the above is the bright field of the light source based on coaxial illumination, such as Figure 5 As shown in (b), the brightness difference between the brightness of the crack CR in the bright field and the brightness of the surface of the bare chip D is smaller than the brightness difference in the dark field, which corresponds to the brightness difference caused by the diffusion and reflection process. Figure 5 (a) shows the illumination and formation of the dark field Figure 5 (b) shows the bright field illumination, as Figure 5 As shown in (c), an image is obtained in which the brightness difference between the crack CR (crack region) and the surface (normal region) of the bare chip D decreases. Therefore, it is difficult to detect cracks with a small brightness difference or accurately measure the crack length.

[0045] Therefore, in the embodiment, a pre-illumination device is provided as a light path control member that limits the light path of the oblique lighting light so that the lighting light from the oblique lighting light emitting unit does not illuminate the light emitting surface of the coaxial lighting light emitting unit to reduce stray light.

[0046] use Figure 6 The configuration of the die mounting device in the embodiment will be described. Figure 6 This is a diagram showing the arrangement of a camera of a die mounting device and an illumination device for irradiating light for image capture onto a bare chip to be imaged in an embodiment.

[0047] The die mounting device 100 in the embodiment includes a camera 101 , a coaxial lighting device 103 as a first lighting device, an oblique lighting device 102 as a second lighting device, and a control device 110 .

[0048] The camera 101 has an objective lens 101a mounted on its front end, and is configured to capture an image of the main surface of the bare chip D through the objective lens 101a. An oblique light 102 such as a ring light or a strip light is mounted near the periphery of the objective lens 101a. The oblique light 102 is used for crack inspection.

[0049] A coaxial lighting 103 is arranged between the camera 101 and the bare chip D, which is composed of a light-emitting portion 103a as a first light-emitting portion having a surface-emitting light source and a lens barrel 103c having a half-reflective mirror (semi-transmissive mirror) 103b. Here, the surface-emitting light source is a light source that uses a surface-shaped light-emitting surface to uniformly illuminate, and has a structure that uses a thin flat light source or a diffuser plate of a surface-mounted chip LED to uniformize the irradiation light. The irradiation light from the light-emitting portion 103a as the first irradiation light is reflected by the half-reflective mirror 103b along the same optical axis as the camera 101 and irradiates the bare chip D. The scattered light irradiated to the bare chip D along the same optical axis as the camera 101 is reflected by the bare chip D, and the regular reflected light therein is transmitted through the half-reflective mirror 103b and reaches the camera 101, forming an image of the bare chip D. Therefore, when the coaxial lighting 103 is used and the camera 101 is used to shoot, the surface of the bare chip D becomes a bright field relative to the crack.

[0050] Furthermore, the light-emitting unit 103a may include a diffuser plate on the surface of the half-mirror 103b side of the surface-emitting light source. The diffuser plate is a plate-shaped component, such as a milky white, that diffuses the light emitted from the light source and reduces uneven illumination. In this case, light from the surface-emitting light source passes through the diffuser plate and becomes scattered light. This scattered light is reflected by the half-mirror 103b along the same optical axis as the camera 101 and then illuminates the bare chip D.

[0051] As described above, in this embodiment, the main surface of the bare chip D is illuminated by the surface-emitting illumination light, which itself increases the illumination area. Therefore, the illumination light from the surface-emitting light source can be irradiated onto an area larger than the main surface of the bare chip D. As a result, the regular reflected light reflected by the bare chip D and traveling within the lens barrel 103 c is incident on the camera 101 over a wide area. This prevents the image of the bare chip D from being partially blurred, making it easy to determine whether the bare chip D being picked up is accurately positioned at the pickup position.

[0052] Oblique illumination 102 is installed so that light is directed onto the surface of bare chip D at a predetermined angle relative to the optical axis of camera 101. When imaging with camera 101 using oblique illumination 102, the surface of bare chip D becomes dark relative to the crack, resulting in a different reflectivity and improved contrast (brightness difference). The closer the incident angle of oblique illumination 102 is to the vertical, the greater the contrast between the crack and the background, facilitating image classification (binarization, etc.), resulting in improved detection sensitivity.

[0053] The incident angle of the oblique light illuminator 102 is made close to the vertical direction. Therefore, the oblique light illuminator 102 is installed above the coaxial light illuminator 103 and close to the camera 101. The irradiation light from the oblique light illuminator 102, which serves as the second irradiation light, passes through the lens barrel 103c and irradiates the bare chip D. Here, the light path control member 104 is attached to the light emitting surface of the light emitting portion 102a, which serves as the second light emitting portion of the oblique light illuminator 102.

[0054] use Figure 7 The effects of the lighting device in the embodiment will be described. Figure 7 (a) means Figure 2 A diagram showing the light path in a lighting device, Figure 7 (b) means Figure 6 Diagram showing the light path in an illumination device.

[0055] By providing the light path control member 104, it is possible to prevent Figure 7 (a) shows the kind of omnidirectional diffuse light, such as Figure 7 As shown in (b), most of the light emitted from the oblique light source 102 passes through the half mirror 103b and directly illuminates the bare chip D.

[0056] By installing an oblique illumination system above the coaxial illumination system and illuminating only the oblique illumination system, stray light from the oblique illumination system hitting the light-emitting surface within the coaxial illumination system can be suppressed. This reduces the generation of stray light from the coaxial illumination system, which uses the coaxial illumination system as a light source. By making the background darker, the desired image is captured even darker, resulting in a more pronounced contrast and facilitating crack detection. Furthermore, this prevents minor diffuse reflections from other lens barrel sides.

[0057] use Figure 8 A specific example of the light path control member 104 will be described. Figure 8 (a) is a perspective view showing a shielding plate attached to a light-emitting portion for oblique lighting. Figure 8 (b) means that Figure 8 (a) is a front view of the light path under oblique light illumination. Figure 8 (c) is a perspective view showing a honeycomb shield attached to the light-emitting portion of oblique lighting. Figure 8(d) is a perspective view showing a cover mounted on the light emitting portion of the oblique lighting. In addition, the light path control member 104 can be mounted not only on the light emitting portion 102a of the oblique lighting 102 but also on the light emitting portion 103a of the coaxial lighting 103, or on both.

[0058] (a) Field of view control film (filter)

[0059] Viewing angle control films, also known as privacy films, anti-peeping films, and light path control films, are used for displays on personal computers and other devices. For example, viewing angle control films are attached to the light-emitting surface of the light-emitting unit 102a of the oblique light source 102 by adhesive bonding or other means. This component saves space and prevents stray light from entering in any direction.

[0060] (b) Shading plate

[0061] like Figure 8 As shown in (a), a shield 104a composed of a plurality of flat plate-shaped members arranged in parallel at predetermined intervals is vertically provided on the light emitting surface 102b of the light emitting portion 102a. Figure 8 As shown in (b), the irradiation angle of the diffused light is limited. By using a metal light shielding plate, the environmental resistance can be improved. Figure 8 In addition to the shield composed of a plurality of flat plate-shaped members as shown in (a), a shield composed of a plurality of members having a polygonal or circular cross section can also be used. Figure 8 As shown in (c), a honeycomb shield 104b composed of a plurality of hexagonal column members (the entire shield presents a honeycomb pattern) can be used. In addition, the area between the shield members can be filled with a light-transmitting material.

[0062] (c) Fiber optic board

[0063] Fiber optic plates prevent incident light or images from being directed directly to the output surface in optical devices that bundle fine (several μm) optical fibers. A fiber optic plate is attached to the light-emitting surface of the light-emitting unit 102a of the oblique light illuminator 102. This saves space and prevents stray light caused by omnidirectional diffused light.

[0064] (d) Optical lens

[0065] An optical lens is an optical element used to refract and diverge or focus light. Mounted on the light-emitting surface of the light-emitting portion 102a of the oblique lighting 102, this lens focuses light by refraction, thereby narrowing the direction of the light. This allows the oblique lighting to be focused, preventing stray light and increasing the brightness of the oblique lighting.

[0066] (e) Fresnel lens

[0067] The Fresnel lens, for example, replaces the curved surface of the optical lens (d) above with a series of concentric grooves. These grooves act as refractive surfaces, bending the optical path of parallel light rays and focusing the light at a predetermined focal position. As a result, the Fresnel lens can have a very thin shape in physical dimensions and can focus light to a point in the same way as an optical lens. A Fresnel lens that uses refraction to collect light and narrow the direction of light is installed on the light-emitting surface of the light-emitting portion 102a of the oblique lighting 102. In this way, the light of the oblique lighting 102 can be concentrated and stray light can be prevented. In addition, the brightness of the oblique lighting 102 can be increased. In addition, the grooves are parallel straight lines, and the light can be set as a linear Fresnel lens that collects light on a straight line.

[0068] (f) Lighting cover

[0069] like Figure 8 As shown in (d), a cover having a light-diffusion shielding structure is attached to the light-emitting surface 102b of the light-emitting unit 102a. This reduces the irradiation on the light-emitting surface in the coaxial lighting 103 without reducing the brightness of the oblique lighting.

[0070] use Figure 9 The optical path control member attached to both the oblique illumination 102 and the coaxial illumination 103 will be described. Figure 9 It means in Figure 6 A diagram showing optical paths when polarizing filters are installed for both oblique illumination and coaxial illumination in the embodiment shown.

[0071] (g) Polarizing filter

[0072] A polarizing filter 105a, serving as a first optical path control member, is attached to the light-emitting surface of the light-emitting unit 102a of the oblique illumination 102, while a polarizing filter 105b, serving as a second optical path control member, is attached to the light-emitting surface of the light-emitting unit 103a of the coaxial illumination 103. Polarizing filters 105a and 105b are linear, circular, or elliptical polarization filters, with their polarization directions orthogonal to each other. This prevents the coaxial illumination light, which uses stray light as a source, from being oblique without narrowing the illumination area of the oblique illumination 102.

[0073] The light path control member 104 may not be installed on the light emitting portion 102 a , and the scattered light of the oblique illumination 102 may be shielded by utilizing the structure of the coaxial illumination 103 and the like to control the light path of the irradiation light of the oblique illumination 102 .

[0074] (h) Shading panel

[0075] The light-shielding shield described in (b) above or the cover described in (f) above is mounted on the light-emitting surface of the light-emitting section 103a of the coaxial lighting 103, so that the light from the oblique lighting 102 is not irradiated onto the light-emitting surface of the light-emitting section 103a of the coaxial lighting 103. This prevents stray light from the oblique lighting 102 from reaching the light-emitting surface of the light-emitting section 103a of the coaxial lighting 103 without reducing the brightness of the oblique lighting 102.

[0076] (i) Window frame structure

[0077] use Figure 10 illustrate Figure 6 A modification of the structure of the coaxial illumination 103 in the embodiment shown. Figure 10 (a) means Figure 6 A top view showing a change in the window frame structure of the coaxial lighting 103 in the embodiment shown, Figure 10 (b) is Figure 10 (a) is a cross-sectional view of .

[0078] like Figure 10 As shown in (a), the size of the window 103e (or the window frame portion) provided on the top 103d of the upper surface of the coaxial lighting 103 is adjusted, and the top 103d blocks the light diffusion. Here, the window 103e transmits the irradiation light of the oblique light 102 and the light incident on the camera 101. Figure 10 As shown in (b), the optical path indicated by the dotted arrow disappears, preventing the light from the oblique illumination 102 from irradiating the light-emitting surface of the light-emitting unit 103a of the coaxial illumination 103. The top portion 103d functions as a light-path control member that limits the optical path of the irradiated light from the light-emitting unit 102a. This reduces the number of components and enables cost reduction.

[0079] (j) Adjustment of the position of the light emitting portion (retraction)

[0080] use Figure 11 illustrate Figure 6 A modification of the structure of the coaxial illumination 103 in the embodiment shown. Figure 11 Yes Figure 6 A cross-sectional view showing a change in the arrangement of the light emitting units of the coaxial illumination 103 in the embodiment shown.

[0081] like Figure 11 As shown in FIG. 1 , the light emitting portion 103a of the coaxial lighting 103 is arranged away from the half mirror 103b. As a result, the light diffusion is blocked by the top portion 103d. Figure 11As shown, the light from the oblique illumination 102 can be prevented from irradiating the light emitting surface of the light emitting unit 103a of the coaxial illumination 103. The top portion 103d functions as a light path control member that limits the light path of the irradiated light from the light emitting unit 102a. This reduces the number of components and enables cost reduction.

[0082] (k) Configuration of the light-emitting surface

[0083] The use of a liquid crystal panel for the light-emitting surface of the coaxial lighting 103 significantly increases the brightness difference between the reflected light when the coaxial lighting 103 is off and the emitted light when it is on. This prevents the coaxial lighting light, which uses stray light as a light source, from being emitted without reducing the illumination area of the oblique lighting 102.

[0084] (l) Coaxial illumination within the lens barrel

[0085] use Figure 12 Description Replacement Figure 6 In the embodiment shown, the coaxial illumination is used as an example in which coaxial illumination is employed within a lens barrel. Figure 12 This is a diagram showing the arrangement of an illumination device when coaxial illumination within a lens barrel is used.

[0086] A coaxial illumination lens 106, which includes a light source unit 106a comprising a surface-emitting light source, a half-silvered mirror 106b, and a telecentric lens within a lens barrel 106c, is mounted below the camera 101. Light emitted from the light source 106a is reflected by the half-silvered mirror 106b along the same optical axis as the camera 101 and irradiates the bare chip D. The scattered light irradiating the bare chip D along the same optical axis as the camera 101 is reflected by the bare chip D, and the specularly reflected light therefrom passes through the half-silvered mirror 106b and reaches the camera 101, forming an image of the bare chip D.

[0087] The illumination range of the coaxial illumination of the coaxial illumination lens 106 becomes narrower than that of the coaxial illumination 103. Generally, when the illumination range of the coaxial illumination becomes narrower, the warping of the bare chip becomes weaker. However, as far as the durability against warping is concerned, the illumination angle seen from the light source is almost not a problem, and it depends on the field angle (size) of the light-emitting surface of the light source seen from the subject. The main light of the telecentric lens is usually parallel to the optical axis in the image space and or the subject space. When viewed from the subject, perfect parallel light is a point light source, and a point-shaped light source is visible inside the lens. In contrast, by setting a surface-emitting light source with a size larger than the point light source in the light source inside the telecentric lens, it is possible to receive parallel light (with a light-emitting surface) with a large field angle when viewed from the subject. Therefore, the coaxial illumination lens 106 can have the same durability against warping as the coaxial illumination 103.

[0088] The oblique illumination 102 is located near the coaxial illumination lens 106 and is positioned so as not to block the light emitted by the coaxial illumination. Therefore, the oblique illumination is placed above the coaxial illumination, and the light emitted by the shielding illumination does not pass through the lens barrel of the coaxial illumination. Therefore, stray light that hits the light-emitting surface of the coaxial illumination can be completely eliminated.

[0089] In addition, when more than one strip lighting is used as the oblique light illumination 102, a pair of strip lighting may be used in which one strip lighting illuminates one direction and the other strip lighting illuminates another direction, or four strip lighting may be used in which four different directions are illuminated.

[0090] [Example]

[0091] Figure 13 It is a schematic top view showing the configuration of the die mounter according to the embodiment. Figure 14 It means Figure 13 A diagram showing the schematic structure when viewed from the direction of arrow A.

[0092] The die mounter 10 generally comprises a bare chip supply unit 1, a pickup unit 2, an intermediate stage unit 3, a placement unit 4, a transport unit 5, a substrate supply unit 6, a substrate unloading unit 7, and a control unit 8 that monitors and controls the operation of each unit. The bare chip supply unit 1 supplies bare chips D to be mounted on a substrate S printed with one or more product areas that will ultimately become a package (hereinafter referred to as the package area P). The Y-axis direction is the front-to-back direction of the die mounter 10, and the X-axis direction is the left-to-right direction. The bare chip supply unit 1 is located near the front of the die mounter 10, and the placement unit 4 is located inside.

[0093] First, the bare chip supply unit 1 supplies bare chips D to be mounted on the packaging area P of the substrate S. The bare chip supply unit 1 includes a wafer holding table 12 that holds a wafer 11 and a push-up unit 13 (shown in dashed lines) that pushes the bare chips D from the wafer 11. The bare chip supply unit 1 moves in the XY directions via a drive mechanism (not shown) to move the bare chips D to be picked up to the position of the push-up unit 13.

[0094] The pickup unit 2 includes a pickup head 21 for picking up the bare chip D, a Y drive unit 23 for moving the pickup head 21 in the Y direction, and various drive units (not shown) for lifting, rotating, and moving the collet 22 in the X direction. The pickup head 21 includes a collet 22 (also see FIG. 1 ) for sucking and holding the pushed bare chip D at its front end. Figure 14 ), picks up a bare chip D from the bare chip supply unit 1 and places it on the intermediate stage 31. The pickup head 21 has various driving units (not shown) that lift, rotate, and move the collet 22 in the X direction.

[0095] The intermediate stage unit 3 includes an intermediate stage 31 on which the bare chip D is temporarily placed, and a stage recognition camera 32 for recognizing the bare chip D on the intermediate stage 31 .

[0096] The placement unit 4 picks up the bare chip D from the intermediate stage 31 and places it on the package area P of the conveyed substrate S, or places it in the form of stacking on the bare chip already placed on the package area P of the substrate S. The placement unit 4 has a collet 42 (see also) that is provided with a collet 42 for sucking and holding the bare chip D at the front end, similar to the pickup head 21. Figure 14 ) of the intermediate stage 31, a Y drive unit 43 that moves the placement head 41 in the Y direction, and a substrate recognition camera 44 that images the position recognition mark (not shown) of the package area P of the substrate S to identify the placement position. With this structure, the placement head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the bare chip D from the intermediate stage 31, and mounts the bare chip D on the substrate S based on the imaging data of the substrate recognition camera 44.

[0097] The transport unit 5 includes a substrate transport claw 51 that picks up and transports a substrate S, and a transport channel 52 that moves the substrate S. The substrate S is moved by a ball screw (not shown) provided along the transport channel 52, which drives a nut (not shown) provided on the substrate transport claw 51 of the transport channel 52. With this structure, the substrate S moves from the substrate supply unit 6 along the transport channel 52 to the placement position. After placement, the substrate S moves to the substrate unloading unit 7, where it is delivered to the substrate unloading unit 7.

[0098] The control unit 8 includes a memory storing a program (software) for monitoring and controlling the operation of each unit of the die mounter 10 and a central processing unit (CPU) executing the program stored in the memory.

[0099] Next, use Figure 15 The configuration of the bare chip supply unit 1 will be described. Figure 15 Yes Figure 13 A schematic cross-sectional view of the main parts of the bare chip supply unit is shown.

[0100] The bare chip supply unit 1 includes a wafer holding table 12 that moves horizontally (in the XY direction) and a push-up unit 13 that moves vertically. The wafer holding table 12 includes an expansion ring 15 that holds a wafer ring 14, and a support ring 17 that horizontally positions a dicing tape 16 held by the wafer ring 14 and to which a plurality of bare chips D are bonded. The push-up unit 13 is located inside the support ring 17.

[0101] When the bare chip supply unit 1 pushes up the bare chip D, it lowers the expansion ring 15 holding the wafer ring 14. As a result, the dicing tape 16 held by the wafer ring 14 is stretched, the spacing between the bare chips D is widened, and the bare chip D is pushed up from below by the push-up unit 13, thereby improving the pick-up efficiency of the bare chip D. In addition, as the thinning process progresses, the adhesive that adheres the bare chip to the substrate has changed from liquid to film, and a film-like adhesive material called a bare chip adhesive film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. In the case of the wafer 11 having the bare chip adhesive film 18, dicing is performed on the wafer 11 and the bare chip adhesive film 18. Therefore, in the peeling process, the wafer 11 and the bare chip adhesive film 18 are peeled off from the dicing tape 16.

[0102] The die mounter 10 includes a wafer recognition camera 24 for recognizing the posture and position of a bare chip D on a wafer 11, a stage recognition camera 32 for recognizing the posture and position of a bare chip D placed on an intermediate stage 31, and a substrate recognition camera 44 for recognizing the mounting position on a mounting table BS. Correction of posture misalignment between the recognition cameras is required for the stage recognition camera 32, which is associated with pickup by the mounting head 41, and the substrate recognition camera 44, which is associated with placement of the die to the mounting position by the mounting head 41. In this embodiment, the coaxial illumination 103 and oblique illumination 102 of the embodiment are used in conjunction with the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 to perform positioning and surface inspection of the bare chip D.

[0103] Next, use Figure 16 The control unit 8 will be described. Figure 16 Yes Figure 13 A block diagram showing the schematic configuration of a control system for a die mounter.

[0104] The control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 generally comprises a control / calculation device 81, primarily composed of a CPU; a storage device 82; an input / output device 83; a bus 84; and a power supply 85. The storage device 82 includes a main storage device 82a, composed of a RAM that stores processing programs and the like; and an auxiliary storage device 82b, composed of an HDD or SSD, that stores control data and image data required for control. The input / output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting operator instructions, a mouse 83c for operating the monitor, and an image acquisition device 83d for acquiring image data from the optical system 88. The input / output device 83 also includes a motor control unit 83e that controls the drive unit 86 for the XY stage (not shown) of the bare chip supply unit 1, the ZY drive axes of the placement head stage, and the XY drive axes of the substrate recognition camera. It also includes an I / O signal control unit 83f that receives or controls signals from a signal unit 87 such as various sensor signals or switches of lighting devices. The optical system 88 includes the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44. The control / calculation unit 81 acquires and performs calculations on required data via the bus 84, controls the pickup head 21, and transmits information to the monitor 83a.

[0105] The control unit 8 stores image data captured by the wafer recognition camera 24, stage recognition camera 32, and substrate recognition camera 44 in the storage device 82 via the image acquisition device 83d. Using software programmed based on the stored image data, the control / computing unit 81 performs positioning of the bare chip D and the packaging area P of the substrate S, as well as surface inspection of the bare chip D and substrate S. Based on the positions of the bare chip D and the packaging area P of the substrate S calculated by the control / computing unit 81, the software drives the drive unit 86 via the motor control unit 83e. This process positions the bare chip on the wafer, activates the pickup unit 2 and the placement unit 4 drive units, and places the bare chip D on the packaging area P of the substrate S. The wafer recognition camera 24, stage recognition camera 32, and substrate recognition camera 44 are used in grayscale, color, or other formats, and quantizes light intensity.

[0106] Next, use Figure 17 The die attach process (semiconductor device manufacturing method) will be described. Figure 17 It is an explanation Figure 13 Flowchart showing the die placement process in the die placement machine.

[0107] In the die attach process of the embodiment, first, a wafer ring 14 holding dicing tape 16 attached to bare chips D separated from a wafer 11 is stored in a wafer cassette (not shown) and loaded into a die attach machine 10. Separately, a substrate S is prepared and loaded into the die attach machine 10.

[0108] (Wafer loading: process P1)

[0109] The control unit 8 removes the wafer ring 14 holding the wafer 11 from the wafer cassette and places it on the wafer holding table 12, then moves the wafer holding table 12 to the reference position for picking up the bare chip D. Next, the control unit 8 performs fine adjustments (alignment) based on the image captured by the wafer recognition camera 24 so that the arrangement position of the wafer 11 accurately matches its reference position.

[0110] (Bare chip transport: process P2)

[0111] Next, the control unit 8 moves the wafer holding table 12 carrying the wafer 11 at a predetermined pitch and holds it horizontally, thereby arranging the bare chip D picked up initially at the pickup position. In addition, the pickup position of the bare chip D is also the recognition position of the bare chip D based on the wafer recognition camera 24. The wafer 11 is inspected in advance for each bare chip using an inspection device such as a probe, and a data table indicating good or bad is generated for each bare chip and stored in the storage device 82 of the control unit 8. The determination of whether the bare chip D to be picked up is a good or bad product is made using the data table. If the bare chip D is a bad product, the control unit 8 moves the wafer holding table 12 carrying the wafer 11 at a predetermined pitch, arranges the bare chip D picked up next at the pickup position, and skips the bad bare chip D.

[0112] (Bare chip positioning: process P3)

[0113] Next, the control unit 8 sets the lighting device of the wafer recognition camera 24 to the lighting device for bare chip positioning. For example, the control unit 8 turns on the coaxial lighting 103 for positioning in the embodiment and turns off the oblique lighting 102 for bare chip crack inspection. The control unit 8 uses the wafer recognition camera 24 to capture the main surface (upper surface) of the bare chip D to be picked up, and obtains an image. From the acquired image, the position offset of the bare chip D relative to the above-mentioned pickup position is calculated, and the position of the bare chip D is measured. The control unit 8 moves the wafer holding table 12 carrying the wafer 11 based on this position offset, and accurately arranges the bare chip D to be picked up at the pickup position.

[0114] (Bare chip surface inspection: process P4)

[0115] Next, the control unit 8 uses the image captured by the wafer recognition camera 24 to perform a surface inspection of the bare chip D to be picked up. If the control unit 8 determines that there are no problems with the surface of the bare chip D, it proceeds to the next step (step P9, described below) after the bare chip crack inspection, described below. However, if it determines that there are problems, it skips the process or stops the process in error. Skipping the process means skipping the processes after step P9 for the bare chip D and moving to step P2.

[0116] The control unit 8 changes the lighting device of the wafer recognition camera 24 to a lighting device for bare chip crack inspection. For example, the control unit 8 turns off the coaxial lighting 103 for positioning in the embodiment and turns on the oblique lighting 102 for bare chip crack inspection. The control unit 8 uses the wafer recognition camera 24 to capture the main surface of the bare chip D that is the object of the pick-up, obtains an image, and performs a bare chip crack inspection. Here, if the control unit 8 determines that there is no problem with the surface of the bare chip D, it proceeds to the next process (process P9 described later), but if it is determined that there is a problem, it skips the process or stops the process in error. Skipping the process means skipping the process after process P9 for the bare chip D and moving to process P2.

[0117] (Substrate loading: step P5, substrate transport: step P6)

[0118] The control unit 8 causes the substrate supply unit 6 to place the substrate S on the transport path 52. The control unit 8 causes the substrate transport claw 51 that picks up and transports the substrate S to move to the mounting position.

[0119] (Substrate positioning: process P7)

[0120] Next, the control unit 8 moves the substrate recognition camera 44 to the imaging position (label imaging position) of the packaging area P of the mounting object. The control unit 8 sets the lighting device of the substrate recognition camera 44 to the lighting device for substrate positioning. For example, the control unit 8 turns on the coaxial lighting 103 for positioning in the embodiment and turns off the oblique light lighting 102 for bare chip crack inspection. The control unit 8 uses the substrate recognition camera 44 to photograph the substrate S and acquire an image. The position offset of the packaging area P of the substrate S is calculated from the acquired image and the position is measured. The control unit 8 moves the substrate S based on the position offset to accurately position the packaging area P of the mounting object at the mounting position.

[0121] (Substrate surface inspection: process P8)

[0122] Next, the control unit 8 uses the image captured by the substrate recognition camera 44 to perform a surface inspection of the packaging area P of the substrate S. Here, the control unit 8 determines whether there are any problems with the surface inspection. If it is determined that there are no problems with the surface of the packaging area P of the substrate S, the control unit 8 proceeds to the next process (step P9 described below). If it is determined that there are problems, the control unit 8 visually confirms the surface image, or further performs a high-sensitivity inspection, or changes the lighting conditions. If it is determined that there are problems, the process is skipped. If there are no problems, the process proceeds to the next process. The skipping process skips the processing after step P13 for the corresponding label of the packaging area P of the substrate S, and registers information indicating that the surface of the packaging area P is defective in the substrate start processing information.

[0123] (Bare chip handling: step P9, intermediate stage placement: step P10)

[0124] After the bare chip supply unit 1 accurately arranges the bare chip D to be picked up at the pickup position, the control unit 8 picks up the bare chip D from the dicing tape 16 using the pickup head 21 including the collet 22 and places it on the intermediate stage 31 .

[0125] (Bare chip position inspection: process P11)

[0126] The control unit 8 uses the stage recognition camera 32 to detect posture deviation (rotational deviation) of the bare chip placed on the intermediate stage 31. If posture deviation exists, the control unit 8 uses a rotation drive device (not shown) provided on the intermediate stage 31 to rotate the intermediate stage 31 on a surface parallel to the mounting surface having the mounting position to correct the posture deviation.

[0127] (Bare chip surface inspection: process P12)

[0128] The control unit 8 uses the image captured by the stage recognition camera 32 to inspect the surface of the bare chip D. If the control unit 8 determines that there are no problems with the surface of the bare chip D, it proceeds to the next step (step P13, described later) after the bare chip crack inspection. However, if it determines that there are problems, it skips the process or stops the process with an error. The skipping process involves placing the bare chip on a defective product tray (not shown), skipping the processing after step P13 for the bare chip D, and moving to step P2.

[0129] The control unit 8 changes the lighting device of the stage recognition camera 32 to a lighting device for bare chip crack inspection. For example, the control unit 8 turns off the coaxial lighting 103 for positioning in the embodiment and turns on the oblique lighting 102 for bare chip crack inspection. The control unit 8 uses the stage recognition camera 32 to capture the main surface of the bare chip D placed on the intermediate stage 31, obtains an image, and performs a bare chip crack inspection. Here, if the control unit 8 determines that there is no problem with the surface of the bare chip D, it proceeds to the next process (process P13 described later). However, if it is determined that there is a problem, the process is skipped or an error is stopped. Skipping the process means skipping the process after process P13 for the bare chip D and moving to process P2.

[0130] (Bare chip attachment: process P13)

[0131] The control unit 8 picks up the bare chip D from the intermediate stage 31 using the placement head 41 including the collet 42 , and performs die placement on the packaging area P of the substrate S or on the bare chip already placed on the packaging area P of the substrate S.

[0132] (Inspecting the relative position of the bare chip and substrate: Process P14)

[0133] Next, the control unit 8 sets the lighting device of the substrate recognition camera 44 to the lighting device for bare chip positioning. For example, the control unit 8 turns on the coaxial lighting 103 for positioning in the embodiment and turns off the oblique lighting 102 for bare chip crack inspection. The control unit 8 uses the substrate recognition camera 44 to capture the bare chip D and obtain an image. The position of the bare chip D is determined from the acquired image. After the bare chip D is mounted, the control unit 8 checks whether the mounting position is accurate. At this time, similar to the bare chip alignment, the center of the bare chip and the center of the label are determined to check whether the relative positions are correct.

[0134] (Surface inspection of bare chips and substrates: process P15)

[0135] The control unit 8 uses the image captured by the substrate recognition camera 44 to inspect the surface of the bare chip D. If the control unit 8 determines that there are no problems with the surface of the bare chip D, it proceeds to the next step (step P2). However, if it determines that there are problems, it skips the process or stops the process in an error state. During the skip process, information indicating that the surface of the package area P is defective is registered in the substrate start processing information, and the process proceeds to step P2.

[0136] Next, the control unit 8 sets the lighting device of the substrate recognition camera 44 to the oblique light illumination for bare chip crack inspection. For example, the control unit 8 turns off the coaxial lighting 103 for positioning in the embodiment and turns on the oblique light illumination 102 for bare chip crack inspection. The control unit 8 photographs the bare chip D through the substrate recognition camera 44, obtains an image, and performs a bare chip crack inspection. Here, the control unit 8 advances to the next process (process P2) if it is determined that there is no problem with the surface of the bare chip D, but skips the processing or stops in error if it is determined that there is a problem. In the skipping process, information indicating that the surface of the package area P is defective is logged in the substrate start processing information, and moves to process P2.

[0137] (Substrate transport: step P16, substrate unloading: step P17)

[0138] Thereafter, the bare chips D are mounted one by one in the same order on the package area P of the substrate S. When mounting of one substrate is completed, the substrate S is moved to the substrate unloading section 7 by the substrate transport claws 51 and delivered to the substrate unloading section 7 .

[0139] (Wafer unloading: process P18)

[0140] Thereafter, for example, the bare chips D are peeled one by one from the dicing tape 16 (step P9). When all bare chips D except defective ones are picked up, the dicing tape 16 and wafer ring 14 holding the bare chips D by the outer shape of the wafer 11 are unloaded into the wafer cassette.

[0141] As described above, the bare chip D is mounted on the substrate S via the bare chip adhesive film 18, and the bare chip D is unloaded from the chip mounter. Thereafter, in the wire mounting process, it is electrically connected to the electrodes of the substrate S via the Au wire. In the case of a stacked product, the substrate S with the bare chip D mounted thereon is then moved back into the chip mounter, and a second bare chip D is stacked on the bare chip D mounted on the substrate S with the help of the bare chip adhesive film 18. After being unloaded from the chip mounter, it is electrically connected to the electrodes of the substrate S via the Au wire in the wire mounting process. After the second bare chip D is peeled off from the dicing tape 16 using the above method, it is transported and stacked on the bare chip D in the mounting process. After repeating the above process a predetermined number of times, the substrate S is transported to the injection molding process, and the plurality of bare chips D and the Au wire are sealed with an injection resin (not shown), thereby completing the stacked package.

[0142] The surface inspection for cracks can be performed at least at one of the bare chip supply section, the intermediate stage, and the mounting station where the bare chip position identification is performed, but it is more preferable to perform it at all locations. If it is performed at the bare chip supply section, cracks can be detected earlier. If it is performed at the intermediate stage, cracks that cannot be detected at the bare chip supply section or cracks that occur after the picking process (cracks that are not noticeable before the mounting process) can be detected before mounting. In addition, if it is performed at the mounting station, cracks that cannot be detected at the bare chip supply section and the intermediate stage (cracks that are not noticeable before the mounting process) or cracks that occur after the mounting process can be detected before the next bare chip is stacked or before the substrate is discharged.

[0143] As mentioned above, the disclosure proposed by the present inventors has been specifically described based on the embodiments and examples. However, the present disclosure is not limited to the above-mentioned embodiments and examples, and various modifications are possible, of course.

[0144] For example, in the embodiment, the bare chip appearance inspection recognition is performed after the bare chip position recognition, but the bare chip position recognition may be performed after the bare chip appearance inspection recognition.

[0145] In addition, in the embodiment, DAF is attached to the back surface of the wafer, but DAF does not need to be attached.

[0146] In addition, in the embodiment, there is a pickup head and a placement head, but there may be two or more. In addition, in the embodiment, there is an intermediate stage, but there may not be an intermediate stage. In this case, the pickup head and the placement head can be used together.

[0147] In the embodiment, the bare chip is placed with its front surface facing up. However, after picking up the bare chip, it can also be placed with its front and back facing up. In this case, the intermediate stage can be omitted. This device is a flip-chip placement machine.

[0148] While the embodiment includes a placement head, it is not necessary to have one. In this case, the picked-up bare chips are placed in a container, etc. This device is referred to as a pick-up device. Furthermore, in this case, surface inspection for cracks can also be performed using the container, etc., that holds the picked-up bare chips.

[0149] A pre-finished product camera (pre-inspection camera) can also be installed while the substrate S is being moved from the substrate supply unit 6 along the transport channel 52 to the placement position. This pre-inspection camera can inspect the surface of the bare chip (foreign matter and cracks) after placement, after the second step of stacking the product. Crack inspection uses oblique lighting. All other appearance inspections use coaxial lighting.

[0150] Furthermore, a post-inspection camera can be installed while the substrate S is being moved from the placement position along the transport channel 52 to the substrate unloading section 7. This post-inspection camera can inspect the surface of the bare chip after placement, independent of the placement cycle. Crack inspection uses oblique lighting. Other visual inspections use coaxial lighting. This improves productivity.

[0151] Description of Reference Numerals

[0152] 100 Chip Mounting Device

[0153] 101 Camera (Camera)

[0154] 102 oblique lighting (second lighting device)

[0155] 102a Light-emitting unit (second light-emitting unit)

[0156] 103 Coaxial lighting (first lighting device)

[0157] 103a Light-emitting unit (first light-emitting unit)

[0158] 103b Half-reflective mirror (half-transmissive mirror)

[0159] 103c lens barrel

[0160] 104 optical path control components

[0161] 110 Control Device

[0162] D Bare chip.

Claims

1. A chip mounting device, characterized in that: have: a camera device for photographing bare chips; a first lighting device for irradiating light onto the bare chip along the optical axis of the camera device; a second lighting device, located above the first lighting device, irradiating light to the bare chip at a specified angle relative to the optical axis; as well as a control device for controlling the camera device, the first lighting device, and the second lighting device, The first lighting device includes, in a tube, a first light emitting portion having a surface-emitting light source, and a semi-transparent mirror for irradiating the upper surface of the bare chip with first irradiation light emitted from the first light emitting portion. The second lighting device includes a second light emitting portion and a light path control member that limits the light path of the second irradiation light emitted from the second light emitting portion, and is configured to allow the second irradiation light, whose light path is limited by the light path control member, to pass through the cylinder and irradiate the upper surface of the bare chip. The control device is configured to turn off the first lighting device and turn on the second lighting device when inspecting the bare chip for cracks, so that the second lighting device irradiates the upper surface of the bare chip with the second irradiation light.

2. The chip mounting device according to claim 1, wherein: The light path control component is a light path control film, a light shielding plate, a fiber optic plate, an optical lens, a Fresnel lens or a lighting cover.

3. The chip mounting device according to claim 1, wherein: The first lighting device further includes a first light path control member that is attached to the semi-transparent mirror side of the first light emitting portion and restricts the light path of the second irradiation light from the second lighting device.

4. The chip mounting device according to claim 3, wherein: The first light path control component is a light shielding plate, a lighting cover or a light path control film.

5. The chip mounting device according to claim 3, wherein: The first light path control member is a first polarization filter, and the second light path control member is a second polarization filter whose transmission axis is orthogonal to the first polarization filter.

6. A chip mounting device, characterized in that: have: a camera device for photographing bare chips; a first lighting device for irradiating light onto the bare chip along the optical axis of the camera device; a second lighting device, located above the first lighting device, irradiating light to the bare chip at a specified angle relative to the optical axis; as well as a control device for controlling the camera device, the first lighting device, and the second lighting device, The first lighting device includes, in a tube, a first light emitting portion having a surface-emitting light source, and a semi-transparent mirror for irradiating the upper surface of the bare chip with first irradiation light emitted from the first light emitting portion. The second lighting device includes a second light emitting portion and is configured to allow the second irradiation light emitted from the second light emitting portion to pass through the cylinder and illuminate the upper surface of the bare chip. The first lighting device further includes a light shielding portion that shields a portion of the second illumination light emitted from the second light emitting portion or a first light path limiting member that limits the light path of the second illumination light emitted from the second light emitting portion. The control device is configured to turn off the first lighting device and turn on the second lighting device when inspecting the bare chip for cracks, so that the second lighting device irradiates the upper surface of the bare chip with the second irradiation light.

7. The chip mounting device according to claim 6, wherein: The light shielding portion is a light shielding plate, a lighting cover or a light path control film installed on one side of the semi-transparent mirror of the first light emitting portion.

8. The chip mounting device according to claim 6, wherein: The cylinder has a top with a window, The light shielding portion is the top portion having the window formed so as to prevent the second irradiation light irradiated from the second light emitting portion from entering the first light emitting portion.

9. The chip mounting device according to claim 6, wherein: The cylinder has a top with a window, The light shielding portion is the top portion, The first light emitting portion is arranged at a position where the second irradiation light emitted from the second light emitting portion is not incident.

10. A chip mounting device, characterized in that: have: a camera device for photographing bare chips; a first lighting device for irradiating light onto the bare chip along the optical axis of the camera device; a second lighting device, located above a lower end of the first lighting device and irradiating light to the bare chip at a predetermined angle relative to the optical axis; as well as a control device for controlling the camera device, the first lighting device, and the second lighting device, The first lighting device includes, in a tube, a lens, a first light emitting unit having a surface-emitting light source, and a semi-transparent mirror for irradiating the upper surface of the bare chip with first irradiation light emitted from the first light emitting unit. The second lighting device includes a second light emitting portion, and is configured so that the second irradiation light emitted from the second light emitting portion does not pass through the tube and is irradiated onto the upper surface of the bare chip, and the predetermined angle is close to 0 degrees. The control device is configured to turn off the first lighting device and turn on the second lighting device, and to irradiate the second irradiation light from the second lighting device onto the upper surface of the bare chip, thereby detecting cracks in the bare chip.

11. The chip mounting device according to any one of claims 1 to 10, characterized in that: The device further comprises a bare chip supply unit having a wafer ring holder for holding a dicing tape to which the bare chip is attached. The control device is configured to use the imaging device, the first lighting device, and the second lighting device to image the bare chip attached to the dicing tape.

12. The chip mounting device according to any one of claims 1 to 10, characterized in that: It also has a placement head for placing the bare chip on a substrate or an already placed bare chip. The control device is configured to use the imaging device, the first lighting device, and the second lighting device to capture an image of the bare chip mounted on the substrate or the bare chip already mounted on the substrate.

13. The chip mounting device according to any one of claims 1 to 10, characterized in that: Also features: a pickup head for picking up the bare chip; and an intermediate stage for placing the picked-up bare chip, The control device is configured to use the imaging device, the first lighting device, and the second lighting device to image the bare chip mounted on the intermediate stage.

14. A method for manufacturing a semiconductor device, characterized in that: include: (a) step of loading a substrate into the die mounting apparatus according to any one of claims 1 to 10; (b) In the step of loading a wafer ring holder holding a dicing tape with a bare chip attached thereto; (c) step of picking up the bare chip; and (d) Step of mounting the picked-up bare chip on the substrate or on a bare chip already mounted on the substrate.

15. The method for manufacturing a semiconductor device according to claim 14, wherein: The step (c) includes placing the picked-up bare chip on an intermediate stage. The step (d) includes picking up the bare chip placed on the intermediate stage.

16. The method for manufacturing a semiconductor device according to claim 14, wherein: In the step (c), the bare chip mounted on the dicing tape is photographed using the imaging device, the first lighting device, and the second lighting device.

17. The method for manufacturing a semiconductor device according to claim 14, wherein: The step (d) includes the step of using the imaging device, the first lighting device, and the second lighting device to capture an image of the bare chip mounted on the substrate or the bare chip already mounted on the substrate.

18. The method for manufacturing a semiconductor device according to claim 15, wherein: The step (d) includes the step of capturing an image of the bare chip mounted on the intermediate stage using the imaging device, the first lighting device, and the second lighting device.

Images