Display panel and display device

Abstract

Embodiments of the present application provide a display panel and a display device, and relate to the technical field of display, and are used for improving the reliability of a driving pad in the display panel. The display panel comprises a substrate, and the substrate comprises: a binding area comprising a driving pad; a lead area comprising a first type of lead and a second type of lead; the first type of lead is connected with the driving pad, and the second type of lead is connected with the first type of lead; the second type of lead is located on a side of the first type of lead away from the driving pad, and the second type of lead extends from the first type of lead to an edge of the display panel; the second type of lead is connected with the driving pad through the first type of lead; the second type of lead is connected with the first type of lead through the second type of lead; the first type of lead and the second type of lead are located in different metal layers, and the first type of lead and the second type of lead comprise a first insulating layer therebetween, the first insulating layer comprises a first wire changing hole, and the first type of lead and the second type of lead are connected through the first wire changing hole.

Description

[Technical Field]

[0001] This invention relates to the field of display technology, and more particularly to a display panel and display device. [Background Technology]

[0002] With the continuous development of display technology, consumers' demands for displays are constantly increasing. Currently, various types of displays, including LCD screens and OLED screens, are emerging in large numbers and have developed rapidly. Based on this, display technologies such as 3D display, touch display technology, curved display, ultra-high resolution display, and privacy-protected display are constantly emerging.

[0003] The display panel includes driver pads for receiving signals from the driver chip. These driver pads are typically made of metal, and corrosion from moisture in the external environment can lead to signal transmission abnormalities. Improving the reliability of these driver pads has become a key research focus for technical personnel. [Summary of the Invention]

[0004] In view of this, embodiments of the present invention provide a display panel and a display device to improve the reliability of the driving pads in the display panel.

[0005] On one hand, embodiments of the present invention provide a display panel, comprising: a substrate, the substrate comprising:

[0006] The bonding area includes the drive pads;

[0007] The lead area includes a first type of lead and a second type of lead; the first type of lead is connected to the drive pad, the second type of lead is located on the side of the first type of lead away from the drive pad, and the second type of lead extends from the first type of lead to the edge of the display panel;

[0008] The first type of lead includes a first lead and a second lead connected together, the second lead being connected to the drive pad through the first lead; the second type of lead is connected to the first lead through the second lead; the first lead and the second lead are located in different metal layers, and a first insulating layer is included between the first lead and the second lead, the first insulating layer including a first wire-changing hole, and the first lead and the second lead being connected through the first wire-changing hole.

[0009] On the other hand, embodiments of the present invention provide a display device including the display panel described above.

[0010] The display panel and display device provided in this embodiment of the invention, by providing a first type of lead including at least two metal layers in the display panel, and connecting a second lead of the first type of lead to a drive pad through the first lead, allows moisture to penetrate from the edge of the display panel into the interior of the display panel. After penetrating the second lead, the moisture needs to be transferred to the first lead through a wire-replacement hole, and then from the first lead to the drive pad. This arrangement lengthens the path for moisture to penetrate to the drive pad 1, which helps reduce the possibility of corrosion of the drive pad 1.

[0011] Furthermore, by providing a second type of lead between the first type of lead and the edge of the display panel, and connecting the second type of lead to the first lead, the distance between the drive pad and the edge of the display panel can be increased, extending the path for moisture to invade the drive pad, which is beneficial to further improve the reliability of the drive pad. [Attached Image Description]

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 A top view schematic diagram of a display panel provided in an embodiment of the present invention;

[0014] Figure 2 for Figure 1 An enlarged schematic diagram of region B in the middle;

[0015] Figure 3 This is an enlarged schematic diagram of the non-display area of ​​a display panel during the manufacturing process.

[0016] Figure 4 This is a top view schematic diagram of a lead wire provided in an embodiment of the present invention.

[0017] Figure 5 for Figure 4 A cross-sectional view along CC';

[0018] Figure 6 A schematic cross-sectional view of another lead provided in an embodiment of the present invention;

[0019] Figure 7 for Figure 4 A schematic diagram of a cross-section along DD';

[0020] Figure 8 for Figure 4 A schematic diagram of a cross-section along EE';

[0021] Figure 9 for Figure 4 A schematic diagram of a cross section along FF';

[0022] Figure 10 A schematic cross-sectional view of another lead provided in an embodiment of the present invention;

[0023] Figure 11 A schematic cross-sectional view of another lead provided in an embodiment of the present invention;

[0024] Figure 12 A schematic cross-sectional view of another lead wire provided in an embodiment of the present invention;

[0025] Figure 13 This is a cross-sectional schematic diagram of the display area of ​​a display panel provided in an embodiment of the present invention;

[0026] Figure 14 A schematic cross-sectional view of another lead wire provided in an embodiment of the present invention;

[0027] Figure 15 A schematic cross-sectional view of another lead wire provided in an embodiment of the present invention;

[0028] Figure 16 A top view schematic diagram of another lead wire provided in an embodiment of the present invention;

[0029] Figure 17 for Figure 16 A schematic diagram of a cross-section along GG';

[0030] Figure 18 A schematic cross-sectional view of another lead wire provided in an embodiment of the present invention;

[0031] Figure 19 A schematic cross-sectional view of another lead wire provided in an embodiment of the present invention;

[0032] Figure 20 This is a top view schematic diagram of another type of lead wire provided in an embodiment of the present invention;

[0033] Figure 21 A schematic diagram of a display device provided in an embodiment of the present invention;

[0034] Figure 22 This is a cross-sectional schematic diagram of a display device provided in an embodiment of the present invention.

Detailed Implementation Methods

[0035] To better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0037] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0038] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0039] It should be understood that although the terms first, second, etc., may be used to describe leads in embodiments of the present invention, these leads should not be limited to these terms. These terms are only used to distinguish leads from each other. For example, a first lead may also be referred to as a second lead without departing from the scope of embodiments of the present invention, and similarly, a second lead may also be referred to as a first lead.

[0040] This invention provides a display panel, such as... Figure 1 As shown, Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of the present invention. The display panel includes a display area AA and a non-display area NA. The display area AA includes a plurality of sub-pixels ( Figure 1 (Not shown). For example, the display panel can be a display panel employing self-emissive technology, that is, the aforementioned sub-pixels can include any one of Organic Light Emitting Diode (OLED), Quantum Dot Light Emitting Diode (QLED), and Micro Light Emitting Diode (Micro-LED). Alternatively, the display panel can also be a Liquid Crystal Display (LCD).

[0041] like Figure 2 As shown, Figure 2 for Figure 1An enlarged schematic diagram of region B shows that the non-display region NA includes a bonding region BA and a lead region LA. The bonding region BA includes multiple driver pads 1. These driver pads 1 can subsequently be bonded to a driver chip or a flexible circuit board. For example, the driver pads 1 include data pads for transmitting data signals, clock pads for transmitting clock signals, and power signal / voltage pads for transmitting power signals. When the display panel has non-display functions such as touch, the driver pads 1 also include functional pads for transmitting signals including touch signals. Figure 2 The diagram illustrates the connection of drive pad 1 to display signal line 21 located in display area AA and control signal line 22 located in non-display area NA. Optionally, the display signal line 21 includes a data line. The control signal line 22 includes a clock signal line.

[0042] like Figure 2 As shown, the lead area LA is located on the side of the bonding area BA away from the display area AA. The lead area LA includes multiple leads 3. The leads 3 are electrically connected to the drive pad 1 and extend from the drive pad 1 to the edge 10 of the display panel.

[0043] For example, when manufacturing this display panel, such as Figure 3 As shown, Figure 3 This is an enlarged schematic diagram of the non-display area of ​​a display panel during the manufacturing process. A test pad 4 is also provided on the side of the lead 3 away from the driver pad 1. After the display panel is manufactured, and before bonding the driver chip (not shown) to the driver pad 1, a test fixture (not shown) can be pressed against the test pad 4 to test the display panel. After the test results show normal operation, the test pad 4 can be cut off, and the driver chip can then be bonded to the driver pad 1. This arrangement avoids pressing the test fixture against the driver pad 1 during display panel testing, preventing damage to the driver pad 1 and ensuring the reliability of the subsequent bonding between the driver chip and the driver pad 1. Furthermore, the specifications of the driver pad 1, including its position and spacing, will differ for display panels of different sizes. If the test fixture is directly pressed against the driver pad 1 during display panel testing, separate test fixtures matching different display panel sizes are required, resulting in higher costs. In this embodiment of the invention, test pads 4 are electrically connected to the drive pads 1. The arrangement of the test pads 4 can differ from that of the drive pads 1. This allows display panels of different specifications to have test pads 4 with the same arrangement. When pressing the test fixture against the test pads 4 to test the display panels, even if the display panels have different specifications, a test fixture with the same specifications can be selected. In other words, multiple display panels of different specifications can share a single test fixture for testing, which helps reduce testing costs.

[0044] like Figure 3 As shown, the display panel has a cutting area CA. After the test results are normal, the test pad 4 can be separated from the drive pad 1 along the cutting area CA to form a structure with the following characteristics: Figure 2 The display panel with the structure shown can be further bonded to the driver pad 1 during the module stage by connecting the driver chip or flexible circuit board.

[0045] When cutting the display panel, to avoid affecting the drive pad 1, a certain distance can be maintained between the cutting area CA and the drive pad 1. For example... Figure 2 As shown, a portion of the lead 3 connecting the drive pad 1 and the test pad 4 can be retained in the cut display panel. Since the structure at the edge 10 of the display panel is exposed to air, it is susceptible to corrosion from moisture and other media in the air. This embodiment of the invention, by having the cutting area CA pass through the lead 3, retains a portion of the lead 3 in the cut display panel. Compared to completely removing the lead 3 and the test pad 4 together, this increases the distance between the drive pad 1 and the cutting area CA (i.e., the edge 10 of the cut display panel), reducing the possibility of corrosion of the drive pad 1.

[0046] When setting lead 3, as follows Figure 4 As shown, Figure 4 This is a top view schematic diagram of a lead wire provided in an embodiment of the present invention. Based on the distance between the lead wire 3 and the edge 10 of the display panel, the lead wire 3 can be divided into a first type of lead wire 31 and a second type of lead wire 32. Specifically, the first type of lead wire 31 has a larger distance from the edge 10 of the display panel, while the second type of lead wire 32 has a smaller distance. That is, the first type of lead wire 31 is the portion of the lead wire 3 that is close to and connected to the driving pad 1. The second type of lead wire 32 is the portion of the lead wire 3 that extends to the edge 10 of the display panel. The second type of lead wire 32 is connected to the driving pad 1 through the first type of lead wire 31.

[0047] In embodiments of the present invention, such as Figure 4 and Figure 5 As shown, Figure 5 for Figure 4In a cross-sectional view along CC', first type leads 31 and second type leads 32 are formed on the same side of substrate 20. The first type leads 31 include interconnected first leads 311 and second leads 312. Exemplarily, the first lead 311 can be directly connected to the drive pad 1. Direct connection between the first lead 311 and the drive pad 1 means that the first lead 311 and at least a portion of the film layer in the drive pad 1 are disposed in the same layer, and there is no distance between the film layer in the drive pad 1 disposed in the same layer as the first lead 311 and the first lead 311; they are integrally formed during fabrication. In this embodiment of the invention, the second lead 312 is electrically connected to the drive pad 1 through the first lead 311, that is, the second lead 312 and the drive pad 1 are not directly connected. Figure 5 As shown, when the second lead 312 is disposed in the same layer as a portion of the conductive film layer in the drive pad 1, the shortest distance d1 between the conductive film layer disposed in the same layer as the second lead 312 in the drive pad 1 and the second lead 312 is greater than 0.

[0048] In this embodiment of the invention, the first lead 311 and the second lead 312 are located in different metal layers. For example... Figure 5 As shown, a first insulating layer 51 is included between the first lead 311 and the second lead 312. The first insulating layer 51 includes a first wire replacement hole 510, and the first lead 311 and the second lead 312 are connected through the first wire replacement hole 510 formed in the first insulating layer 51.

[0049] The second type of lead 32 is located on the side of the first type of lead 31 away from the drive pad 1, and extends from the first type of lead 31 to the edge 10 of the display panel. The second type of lead 32 is the lead 3 that passes through... Figure 3 The portion of the cutting region CA shown is included. In the case of a section with... Figure 3 When the display panel with the structure shown is cut to remove the test pad 4, the part of the lead 3 that is passed through by the cutting tool is the second type of lead 32.

[0050] In this embodiment of the invention, the second type of lead 32 is located on the side of the second lead 312 away from the first lead 311. The second type of lead 32 is connected to the first lead 311 through the second lead 312. That is, the second type of lead 32 and the first lead 311 are not directly connected, and when the second type of lead 32 and the first lead 311 are arranged in the same layer, the shortest distance between the second type of lead 32 and the first lead 311 is greater than 0.

[0051] In terms of having Figure 3 The display panel with the structure shown is cut to obtain a shape as shown. Figure 2Behind the display panel with the structure shown, the cross-section of the second type of lead 32 is flush with the edge 10 of the display panel. If there is moisture in the environment where the display panel is located, during the process of moisture traveling into the interior of the display panel, it will sequentially invade inward along the second type of lead 32, the second lead 312, and the first lead 311.

[0052] This embodiment of the invention provides a first type of lead 31 comprising at least two metal layers, and connects a second lead 312 within the first type of lead 31 to the drive pad 1 via a first lead 311. During the process of moisture intruding from the edge 10 of the display panel into the interior of the display panel, after intruding to the second lead 312, the moisture needs to be transferred through a first wire exchange hole 510 to the first lead 311, and then from the first lead 311 to the drive pad 1. This arrangement lengthens the path for moisture to intrude to the drive pad 1, which helps reduce the possibility of corrosion of the drive pad 1.

[0053] Furthermore, by providing a second type of lead 32 between the first type of lead 31 and the edge 10 of the display panel, and connecting the second type of lead 32 to the first lead 311 via the second lead 312, the distance between the drive pad 1 and the edge 10 of the display panel can be increased, which can further extend the path for moisture to invade the drive pad 1, thus improving the reliability of the drive pad 1.

[0054] For example, such as Figure 5 As shown, the driving pad 1 includes a first conductive portion 11 and a second conductive portion 12 stacked together, with the first conductive portion 11 located on the side of the second conductive portion 12 closer to the substrate 20. For example, the first conductive portion 11 can be disposed on the same layer as a portion of the traces located in the display area AA. The arrangement of the second conductive portion 12 allows for a larger distance between the upper surface of the driving pad 1 and the substrate 20, facilitating the subsequent bonding and connection of the driving pad 1 to the driving chip during the module assembly stage.

[0055] When the driving pad 1 includes a first conductive part 11 and a second conductive part 12, the first lead 311 can be on the same layer as one of the first conductive part 11 and the second conductive part 12, and the second lead 312 can be on the same layer as the other of the first conductive part 11 and the second conductive part 12, so as to simplify the manufacturing process of the display panel.

[0056] like Figure 5 As shown, Figure 5This diagram illustrates a scenario where the first conductive portion 11 and the first lead 311 are disposed on the same layer, and the second conductive portion 12 and the second lead 312 are disposed on the same layer. The shortest distance d1 between the second lead 312 and the second conductive portion 12 of the drive pad 1 is greater than 0. The second lead 312 and the first conductive portion 11 of the drive pad 1 are not directly connected, nor are the second lead 312 and the second conductive portion 12 of the drive pad 1 directly connected.

[0057] like Figure 6 As shown, Figure 6 This is a cross-sectional schematic diagram of another lead provided in an embodiment of the present invention. In this embodiment, the first lead 311 and the second conductive portion 12 can also be disposed in the same layer, and the second lead 312 and the first conductive portion 11 can also be disposed in the same layer. The shortest distance d1 between the second lead 312 and the first conductive portion 11 of the driving pad 1 is greater than 0. The second lead 312 and the first conductive portion 11 of the driving pad 1 are not directly connected, nor are the second lead 312 and the second conductive portion 12 of the driving pad 1 directly connected.

[0058] In this embodiment of the invention, the resistivity of the second type of lead 32 is less than or equal to the resistivity of the first type of lead 31. Specifically, the resistivity of the second type of lead 32 is less than or equal to the resistivity of the first type of lead 311, and the resistivity of the second type of lead 32 is less than or equal to the resistivity of the second type of lead 312. With this configuration, while satisfying the resistance requirement of the second type of lead 32 to reduce the transmission voltage drop of the signal in the second type of lead 32, the cross-sectional area of ​​the second type of lead 32 can be made less than or equal to the cross-sectional area of ​​the first type of lead 31. When considering leads with... Figure 3 When the display panel with the structure shown is cut to remove the test pad 4, this embodiment of the invention reduces the cross-sectional area of ​​the second type of lead 32 by making it smaller. After cutting, the area of ​​the second type of lead 32 exposed to air is reduced, thereby decreasing the area of ​​the metal cross-section in contact with moisture (i.e., the cut surface of the second type of lead 32) in the display panel, which is beneficial to improving the reliability of the display panel. Moreover, by reducing the cross-sectional area of ​​the second type of lead 32, the spacing between two adjacent second type of lead 32 can be increased within a certain space, which reduces the probability of corrosion and also reduces short circuit problems caused by carbonization during cutting. In addition, by reducing the cross-sectional area of ​​the second type of lead 32 during cutting, this embodiment of the invention also reduces the cutting difficulty and the probability of cracks caused by cutting.

[0059] In embodiments of the present invention, such as Figure 7 , Figure 8 and Figure 9 As shown, Figure 7 for Figure 4 A schematic diagram of a cross-section along DD'. Figure 8 for Figure 4 A schematic diagram of a cross-section along EE'. Figure 9 for Figure 4 A cross-sectional view along FF' shows a first lead 311 having a first cross-section 3110, a second lead 312 having a second cross-sectional area 3120, and a second lead 32 having a third cross-section 3200. The area of ​​the first cross-section 3110 is greater than or equal to the area of ​​the third cross-section 3200. The area of ​​the second cross-section 3120 is greater than or equal to the area of ​​the third cross-section 3200. The first cross-section 3110, the second cross-section 3120, and the third cross-section 3200 are perpendicular to the plane of the display panel. Specifically, the first cross-section 3110 is perpendicular to the extension direction of the first lead 311, the second cross-section 3120 is perpendicular to the extension direction of the second lead 312, and the third cross-section 3200 is perpendicular to the extension direction of the second lead 32. Optionally, such as... Figure 7 , Figure 8 and Figure 9 As shown, in this embodiment of the invention, the thicknesses of the first cross-section 3110, the second cross-section 3120, and the third cross-section 3200 can all be equal to d0, the width d2 of the first cross-section 3110 can be greater than or equal to the width d4 of the third cross-section 3200, and the width d3 of the second cross-section 3120 can be greater than or equal to the width d4 of the third cross-section 3200, so that the third cross-section 3200 has a smaller area.

[0060] For example, in embodiments of the present invention, the second type of lead 32 can be disposed in a different layer from both the second lead 312 and the first lead 311. Figure 5 As shown, a second insulating layer 52 is also included between the second type of lead 32 and the second lead 312. The second type of lead 32 and the second lead 312 are connected through a wire-changing hole 520 formed in the second insulating layer 52. With this configuration, on the one hand, a material with a lower resistivity can be selected to make the second type of lead 32; on the other hand, during the process of external moisture intruding into the drive pad 1, the moisture needs to pass through the second type of lead 32 first, then through the second lead 312 and the first lead 311, which can increase the number of wire changes in the lead 3, further reducing the probability of the drive pad 1 being corroded by water and oxygen in the external environment, and thus improving the reliability of the drive pad 1.

[0061] Optionally, embodiments of the present invention may further arrange the second type of lead 32 in the same layer as the film layer with lower resistivity in the first lead 311 and the second lead 312, thereby reducing the number of film layers in the lead region LA, thinning the film layer thickness in the lead region LA, and reducing the complexity of the fabrication process. For example, when the resistivity of the first lead 311 is low, embodiments of the present invention may arrange the second type of lead 32 in the same layer as the first lead 311. Figure 10 As shown, Figure 10This is a cross-sectional schematic diagram of another lead wire provided in an embodiment of the present invention, wherein the second type of lead wire 32 is disposed in the same layer as the first lead wire 311. In addition to the first wire replacement hole 510, the first insulating layer 51 also includes a second wire replacement hole 511, and the second type of lead wire 32 and the second lead wire 312 are electrically connected through the second wire replacement hole 511. Figure 10 As shown, the second type of lead 32 is connected to the first lead 311 via the second lead 312, and the shortest distance d5 between the second type of lead 32 and the first lead 311 is greater than 0. This configuration allows the second type of lead 32 to have a lower resistivity. Furthermore, during the intrusion of external moisture into the drive pad 1, the moisture must first pass through the second type of lead 32, then through the second lead 312 and the first lead 311, increasing the number of wire changes in the lead 3. This further reduces the probability of the drive pad 1 being corroded by water and oxygen in the external environment, thus improving the reliability of the drive pad 1.

[0062] It should be noted that, Figure 10 The arrangement shown, where the first lead 311 and the first conductive portion 11 are disposed on the same layer, and the second lead 312 and the second conductive portion 12 are disposed on the same layer, is merely illustrative. As mentioned above, embodiments of the present invention may also arrange the second lead 312 and the first conductive portion 11 on the same layer, and the first lead 311 and the second conductive portion 12 on the same layer, such as... Figure 11 As shown, Figure 11 This is a cross-sectional schematic diagram of another lead provided in an embodiment of the present invention. When the first lead 311 and the second conductive part 12 are disposed in the same layer, if the resistivity of the first lead 311 is less than the resistivity of the second lead 312, the second type of lead 32 and the first lead 311 can still be disposed in the same layer in this embodiment of the present invention. Figure 11 As shown, the second type of lead 32 is connected to the first lead 311 through the second lead 312, and the shortest distance d6 between the second type of lead 32 and the first lead 311 is greater than 0.

[0063] Optionally, when the resistivity of the second lead 312 is low, embodiments of the present invention can arrange the second type of lead 32 and the second lead 312 in the same layer. For example... Figure 12 As shown, Figure 12 This is a cross-sectional schematic diagram of another type of lead provided in an embodiment of the present invention. In this case, the second type of lead 32 and the second lead 312 can be formed in the same process, and there is no interface between them. The second type of lead 32 is connected to the first lead 311 through the second lead 312.

[0064] Thin-film transistors (TFTs) are incorporated into the display panel. These TFTs can be used to construct pixel driving circuits or peripheral circuits, such as shift register circuits and gating circuits. Taking an organic light-emitting diode (OLED) display panel as an example... Figure 13 As shown, Figure 13 This is a cross-sectional schematic diagram of the display area of ​​a display panel according to an embodiment of the present invention. The display panel includes a first metal layer M1, a second metal layer M2, a third metal layer M3, a fourth metal layer M4, and a fifth metal layer M5. The display panel also includes insulating layers such as a buffer layer 61, a gate insulating layer 62, a first interlayer insulating layer 63, a second interlayer insulating layer 64, a passivation layer 65, a planarization layer 66, and a pixel definition layer 67. Exemplarily, the first metal layer M1 can be used to form the gate of a thin-film transistor. The second metal layer M2 can be used to form a reference voltage line. The third metal layer M3 can be used to form the source and drain of the thin-film transistor. The fourth metal layer M4 can be used to form the anode of a light-emitting element. The fifth metal layer M5 can be used to form the cathode of a light-emitting element.

[0065] When setting the first lead 311 and the second lead 312, the embodiments of the present invention can make the first lead 311 and the second lead 312 co-layered with any two of the first metal layers M1 to the sixth metal layers M6 in the display panel, and select the film layer with the lower resistivity among the first metal layers M1 to the sixth metal layers M6 to make the second type of lead 32, so as to simplify the manufacturing process of the display panel.

[0066] Optionally, in this embodiment of the invention, a first metal layer M1 can be selected to form the first lead 311, that is, the first lead 311 is disposed on the same layer as the gate of the thin-film transistor. A third metal layer M3 can be selected to form the second lead 312, that is, the second lead 312 is disposed on the same layer as the source of the thin-film transistor. Currently, the material of the first metal layer M1 is typically Mo. The material of the third metal layer M3 is typically TiAlTi. The sheet resistance of the first metal layer M1 is approximately 0.45 Ω / □, and the sheet resistance of the third metal layer M3 is approximately 0.042 Ω / □. It can be seen that the sheet resistance of the first metal layer M1 is approximately ten times that of the third metal layer M3. In this case, in this embodiment of the invention, the second type of lead 32 can be disposed on the same layer as the second lead 312, that is, the third metal layer M3 is selected to fabricate the second type of lead 32, so that the first type of lead 31 and the second type of lead 32 have the following properties: Figure 12 The structure shown allows the second type of lead 32 to have a smaller cross-sectional area, thereby reducing the corrosion area, lowering the difficulty of cutting, and reducing the risk of short circuits caused by carbonization during cutting.

[0067] For example, in embodiments of the present invention, such as Figure 14 and Figure 15 As shown, Figure 14 and Figure 15These are cross-sectional schematic diagrams of two other types of leads provided in the embodiments of the present invention. The first type of lead 31 includes at least two second leads 312. Any two adjacent second leads 312 are disposed in two different metal layers, and any two adjacent second leads 312 are connected through a wire replacement hole. Figure 14 and Figure 15 The two second leads 312 are shown.

[0068] like Figure 14 As shown, a third insulating layer 53 is included between the two second leads 312. The third insulating layer 53 includes a third wire-replacing hole 530 through which the two second leads 312 are electrically connected.

[0069] like Figure 15 As shown, one of the two second leads 312, the one furthest from the first lead 311, is disposed in the same layer as the first lead 311. That is, in addition to the first wire-changing hole 510, the first insulating layer 51 also includes a fourth wire-changing hole 514. For the second lead 312 closer to the first lead 311, the second lead 312 is connected to the first lead 311 through the first wire-changing hole 510, and the second lead 312 is connected to the other second lead 312 through the fourth wire-changing hole 514. This arrangement increases the number of wire changes in the leads, further extending the path for moisture to invade the drive pad 1.

[0070] It should be noted that, in Figure 14 and Figure 15 The illustrations all take the second type of lead 32 and one of the second leads 312 as being on the same layer. As mentioned above, when the resistivity of the second lead 312 is large, the embodiments of the present invention can also make the second type of lead 32 and the second lead 312 not be on the same layer, which will not be repeated here.

[0071] Optional, such as Figure 16 and Figure 17 As shown, Figure 16 This is a top view schematic diagram of another lead wire provided in an embodiment of the present invention. Figure 17 for Figure 16 A cross-sectional view along GG' shows that the first lead 311 is connected to a second lead 312 through at least two first wire replacement holes 510 to improve the conductivity of the leads where the first lead 311 and the second lead 312 are located and reduce the attenuation during signal transmission.

[0072] like Figure 18 As shown, Figure 18This is a cross-sectional schematic diagram of another lead provided in an embodiment of the present invention. When the thickness of the insulating layer between the first conductive portion 11 and the second conductive portion 12 is large, and the film thickness of the second conductive portion 12 is small, the portion of the second conductive portion 12 that contacts the first conductive portion 11 can be formed as a recessed structure relative to other portions. Similarly, the portion of the second lead 312 that contacts the first lead 311 can be formed as a recessed structure relative to other portions of the second lead 312.

[0073] Optionally, the first type of lead 31 and / or the second type of lead 32 described above include a undulating structure. The undulating structure has at least two locations at different distances from the substrate 20. Specifically, "the first type of lead 31 includes a undulating structure" means that the first lead 311 and / or the second lead 312 of the first type of lead 31 include a undulating structure. Figure 19 As shown, Figure 19 This is a cross-sectional schematic diagram of another lead provided in an embodiment of the present invention, wherein the second lead 312 includes an undulating structure 30 as an illustration. Compared with a flat structure, the undulating structure 30 can further extend the path of moisture intrusion to the drive pad 1, which helps to reduce the possibility of corrosion of the drive pad 1.

[0074] For example, such as Figure 19 As shown, when the second lead 312 is disposed on the side of the first lead 311 away from the first insulating layer 51, the embodiment of the present invention can provide an undulating structure 30 in the second lead 312. The first insulating layer 51 located below the second lead 312 includes a plurality of openings 500, and the second lead 312 covers the openings 500. Figure 19 As shown, a portion of the second lead 312 is located inside the opening 500, and another portion of the second lead 312 is located outside the opening 500. The combination of the second lead 312 being located inside the opening 500 and outside the opening 500 forms the aforementioned undulating structure 30.

[0075] In making something like Figure 19 In constructing the display panel with the structure shown, firstly, a metal layer containing the first lead 311 is fabricated and etched to form the first lead 311. Then, a first insulating layer 51 is fabricated to cover the first lead 311. Next, the aforementioned first transponder hole 510 and opening 500 are formed in the first insulating layer 51. The first transponder hole 510 exposes the first lead 311. Then, a metal layer containing the second lead 312 is fabricated and etched to form the second lead 312, which fills the first transponder hole 510 and opening 500. At the location of the first transponder hole 510, the second lead 312 is connected to the first lead 311 through the first transponder hole 510. At the bottom, sidewalls, and outside the opening 500, the second lead 312 forms the aforementioned undulating structure 30.

[0076] For example, the material of the first insulating layer 51 includes an inorganic material. In this embodiment of the invention, by forming an opening 500 in the first insulating layer 51 corresponding to the undulating structure 30, and filling the opening 500 with a second lead 312, stress can be released and crack propagation can be blocked.

[0077] For example, the width c1 at the bottom of the opening 500 satisfies 10μm≤c1≤14μm; the maximum distance c2 between two adjacent openings 500 satisfies 10μm≤c2≤14μm.

[0078] Optional, such as Figure 5 , Figure 6 , Figure 10 , Figure 11 , Figure 12 , Figure 14 , Figure 15 , Figure 18 and 19 As shown, the lead region LA further includes a protective layer 50, which is located on the side of the first type of lead 31 away from the substrate 20 and covers the first type of lead 31. The protective layer 50 reduces the risk of the first type of lead 31 being damaged by pressure. Optionally, the protective layer 50 includes... Figure 13 The passivation layer 65 and / or planarization layer 66 are shown.

[0079] For example, such as Figure 20 As shown, Figure 20 This is a top view schematic diagram of another type of lead provided in an embodiment of the present invention. The orthographic projection of the first type of lead 31 onto the plane where the display panel is located includes a broken line segment 310. The broken line segment 310 can further extend the path of moisture intrusion to the drive pad 1. In this embodiment of the present invention, the orthographic projection of the first type of lead 31 onto the plane where the display panel is located including the broken line segment 310 includes the following cases: the orthographic projection of the first lead 311 onto the plane where the display panel is located includes the broken line segment 310; the orthographic projection of the second lead 312 onto the plane where the display panel is located includes the broken line segment 310; and both the orthographic projections of the first lead 311 and the second lead 312 onto the plane where the display panel is located include the broken line segment 310.

[0080] Optional, such as Figure 20 As shown, the distance h1 between the two endpoints of the broken line segment 310 satisfies 80μm≤h1≤120μm.

[0081] For example, such as Figure 20As shown, the orthographic projection of the second type of lead 32 onto the plane of the display panel includes a straight line segment 320. The straight line segment 320 is located on the side of the second type of lead 32 away from the first type of lead 31. In this embodiment of the invention, the orthographic projection of the lead near the edge 10 of the display panel onto the plane of the display panel is set as a straight line. When the display panel is cut, the heating of the lead near the cutting position is more uniform, which can avoid short circuit problems caused by carbonization during cutting. For example, as... Figure 20 As shown, the length h2 of the straight line segment 320 satisfies 80μm≤h2≤120μm.

[0082] This invention also provides a display device, such as... Figure 21 As shown, Figure 21 This is a schematic diagram of a display device provided in an embodiment of the present invention. The display device includes the display panel 100 described above. The specific structure of the display panel 100 has been described in detail in the above embodiments and will not be repeated here. Of course, Figure 21 The display device shown is for illustrative purposes only. The display device can be any electronic device with display function, such as a mobile phone, tablet computer, laptop computer, e-reader or television.

[0083] The display device provided in this embodiment of the invention, by providing a first type of lead comprising at least two metal layers in the display panel, and connecting a second lead of the first type of lead to a drive pad via the first lead, allows moisture to penetrate from the edge of the display panel into the interior of the display panel. After penetrating the second lead, the moisture needs to be transferred to the first lead through a wire-replacement hole, and then from the first lead to the drive pad. This arrangement lengthens the path for moisture to penetrate to the drive pad 1, which helps reduce the possibility of corrosion of the drive pad 1.

[0084] Furthermore, by providing a second type of lead between the first type of lead and the edge of the display panel, and connecting the second type of lead to the first lead, the distance between the drive pad and the edge of the display panel can be increased, extending the path for moisture to invade the drive pad, which is beneficial to further improve the reliability of the drive pad.

[0085] For example, such as Figure 22 As shown, Figure 22 This is a cross-sectional schematic diagram of a display device according to an embodiment of the present invention. The display device further includes a driver chip 200, which is bonded to a driver pad 1 in the display panel 100. When the display panel 100 is in operation, the driver chip 200 provides various drive signals for driving the display panel 100. The drive signals are transmitted to the display panel 100 through the driver pad 1.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that, include: The substrate includes a display area and a non-display area, the non-display area comprising: The bonding area includes the drive pads; The lead area includes a first type of lead and a second type of lead; the first type of lead is connected to the drive pad, the second type of lead is located on the side of the first type of lead away from the drive pad, and the second type of lead extends from the first type of lead to the edge of the display panel; The first type of lead includes a first lead and a second lead connected together, the second lead being connected to the drive pad through the first lead; the second type of lead is connected to the first lead through the second lead; the first lead and the second lead are located in different metal layers, a first insulating layer is included between the first lead and the second lead, the first insulating layer includes a first wire-changing hole, and the first lead and the second lead are connected through the first wire-changing hole; The resistivity of the first lead is greater than that of the second lead, and the second type of lead is disposed in the same layer as the second lead; or, The resistivity of the first lead is less than that of the second lead, and the second type of lead is disposed in the same layer as the first lead.

2. The display panel according to claim 1, characterized in that, The resistivity of the second type of lead is less than or equal to the resistivity of the first type of lead; The resistivity of the second type of lead is less than or equal to the resistivity of the second lead.

3. The display panel according to claim 1, characterized in that, The first lead has a first cross-section, the second lead has a second cross-section, and the second type of lead has a third cross-section; The area of ​​the first cross-section is greater than or equal to the area of ​​the third cross-section; the area of ​​the second cross-section is greater than or equal to the area of ​​the third cross-section; Wherein, the first cross section, the second cross section, and the third cross section are all perpendicular to the plane where the display panel is located, and the first cross section is perpendicular to the extension direction of the first lead, the second cross section is perpendicular to the extension direction of the second lead, and the third cross section is perpendicular to the extension direction of the second type of lead.

4. The display panel according to claim 1, characterized in that, The first type of lead includes at least two second leads, any two adjacent second leads are located in different metal layers, and any two adjacent second leads are connected through a wire replacement hole.

5. The display panel according to claim 1, characterized in that, One of the first leads is connected to one of the second leads through at least two of the first wire replacement holes.

6. The display panel according to claim 1, characterized in that, The first lead and / or the second lead includes an undulating structure having at least two locations at different distances from the substrate.

7. The display panel according to claim 6, characterized in that, The second lead is located on the side of the first lead away from the first insulating layer; The second lead includes an undulating structure, and the first insulating layer includes a plurality of openings, the second lead covering the openings.

8. The display panel according to claim 1, characterized in that, The lead area also includes a protective layer located on the side of the first type of lead away from the substrate, and the protective layer covers the first type of lead.

9. The display panel according to claim 1, characterized in that, The orthographic projection of the first type of lead onto the plane where the display panel is located includes a broken line segment.

10. The display panel according to claim 9, characterized in that, The orthographic projection of the second type of lead onto the plane where the display panel is located includes a straight line segment, which is located on the side of the second type of lead away from the first type of lead.

11. The display panel according to claim 1, characterized in that, The driving pad includes a first conductive portion and a second conductive portion stacked together. The first conductive portion is disposed in the same layer as one of the first lead and the second lead, and the second conductive portion is disposed in the same layer as the other of the first lead and the second lead.

12. The display panel according to claim 1, characterized in that, The display panel further includes a thin-film transistor, wherein one of the first lead and the second lead is disposed on the same layer as the gate of the thin-film transistor, and the other of the first lead and the second lead is disposed on the same layer as the source of the thin-film transistor.

13. A display device, characterized in that, Includes the display panel as described in any one of claims 1-12.

14. The display device according to claim 13, characterized in that, It also includes a driver chip, which is bonded to the driver pad.

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