Camera module and manufacturing method thereof

Abstract

The present invention provides a camera module and a method for manufacturing the same. The method comprises: providing a substrate, dispensing glue on the substrate, adhering a plurality of chip bodies to the substrate in an intermittent arrangement, coating the gaps between the plurality of chip bodies with glue, cutting the substrate to form a plurality of chips, each of the plurality of chip bodies being surrounded by a glue layer after cutting, and assembling the plurality of chips with a plurality of cameras to form a plurality of camera modules. During the camera module manufacturing process, the size of the chip can be increased by increasing the size of the glue layer surrounding the chip body, so that the chip can be connected to cameras of different sizes to form a camera module, thereby improving the compatibility between the chip and the camera and enriching the variety of camera modules formed thereby.

Description

Technical Field

[0001] The present invention relates to the field of camera module manufacturing, and in particular to a camera module and a manufacturing method thereof. Background Art

[0002] In the field of CMOS image sensors (CIS), chip-scale packaged image sensor chips (CSP) offer excellent characteristics, such as small size, thinness, good heat dissipation, large capacity, high pixel integration, anti-interference and anti-noise performance, and high reliability. Therefore, CMOS image sensor camera module optical components are widely used in products such as digital cameras, camcorders, laptops, tablets, mobile phones, automotive and surveillance equipment.

[0003] When assembling existing camera modules, the bonding glue is usually dispensed on the chip surface, and then the camera and chip are bonded together. Figure 1a and Figure 1b As shown, a general chip 1 includes a pixel area A and a logic circuit area B surrounding the pixel area A. The chip 1 has enough space to bond with the camera 2 to form a pixel head module. However, when the camera bonded to the chip is relatively large, or when the chip's pixel area is relatively large and the peripheral area is relatively small, the chip does not have enough area to bond with the camera. Please refer to Figure 2a and Figure 2b As shown, the pixel area A of the chip 1 almost covers the entire chip 1 , and the chip 1 does not have enough area to be bonded with the camera 2 .

[0004] Therefore, the chip of the prior art is limited by size and has a low degree of compatibility with the camera. Summary of the Invention

[0005] The purpose of the present invention is to provide a camera module and a manufacturing method thereof, which increases the size of the chip during the manufacturing process, so that the same chip can match cameras of various sizes, improves the matching degree between the chip and the camera, and enriches the types of camera modules.

[0006] To achieve the above object, the present invention provides a method for manufacturing a camera module, comprising the following steps:

[0007] Providing a substrate, and dispensing glue on the substrate;

[0008] Arranging a plurality of chip bodies at intervals and bonding them to the substrate;

[0009] Filling the gaps between the chip bodies with glue;

[0010] Cutting the substrate bonded with the plurality of chip bodies to form a plurality of chips, wherein the plurality of chip bodies after being cut are surrounded by a glue layer;

[0011] The plurality of chips are respectively assembled with a plurality of cameras to form a plurality of camera modules.

[0012] Optionally, in the method for manufacturing the camera module, the thickness of the glue layer is equal to the thickness of the chip body.

[0013] Optionally, in the method for manufacturing the camera module, after cutting the substrate and before assembling the substrate with the camera, the method further comprises:

[0014] A portion of the substrate above the chip body is removed, and the remaining substrate covers the adhesive layer and a portion of the chip body and serves as a connection portion with the camera.

[0015] Optionally, in the method for manufacturing the camera module, after cutting the substrate and before assembling the substrate with the camera, the method further comprises:

[0016] The substrate above the chip body and corresponding to the area of ​​the chip body is removed, and the remaining substrate covers the glue layer and serves as a connection portion with the camera.

[0017] Optionally, in the method for manufacturing the camera module, the side of the chip bonded to the substrate is connected to the camera.

[0018] Correspondingly, the present invention also provides a camera module, which is manufactured using the above-mentioned method for manufacturing the camera module.

[0019] Accordingly, the present invention also provides a method for manufacturing a camera module, comprising the following steps:

[0020] Providing a substrate, and dispensing glue on the substrate;

[0021] Arranging a plurality of chip bodies at intervals and bonding them to the substrate;

[0022] Filling the gaps between the chip bodies with glue;

[0023] Assembling the substrate bonded with the plurality of chip bodies and a camera array, wherein the cameras in the camera array correspond one to one with the chip bodies;

[0024] The camera array assembled with the plurality of chip bodies is cut to form a plurality of camera modules, and the chip body in each camera module is surrounded by a glue layer.

[0025] Optionally, in the method for manufacturing the camera module, the substrate is a glass substrate.

[0026] Optionally, in the method for manufacturing the camera module, the thickness of the glue layer is equal to the thickness of the chip body.

[0027] Correspondingly, the present invention also provides a camera module, which is manufactured using the above-mentioned method for manufacturing the camera module.

[0028] Compared with the prior art, the present invention provides a camera module and a manufacturing method thereof, first providing a substrate, and dispensing glue on the substrate, and then arranging a plurality of chip bodies at intervals and adhering them to the substrate, and then coating the gaps between the plurality of chip bodies with glue, and then cutting the substrate with the plurality of chip bodies adhering thereto, and the plurality of chip bodies after cutting are surrounded by a glue layer, and then assembling the plurality of chips with a plurality of cameras respectively to form a plurality of camera modules; or after coating the gaps between the plurality of chip bodies with glue, first assembling the substrate with the plurality of chip bodies adhering thereto with a camera array, and the cameras in the camera array correspond one-to-one to the chip bodies, and then cutting the camera array assembled with the plurality of chip bodies to form a plurality of camera modules, and the chip body in each camera module is surrounded by a glue layer. During the manufacturing process, both methods can increase the size of the adhesive layer surrounding the chip body by increasing the distance between adjacent chip bodies bonded on the substrate, thereby increasing the size of the chip, so that the chip can be connected to cameras of different sizes to form a camera module, improving the matching degree between the chip and the camera, and enriching the types of camera modules formed thereby. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1a This is a cross-sectional view of a chip in the prior art.

[0030] Figure 1b for Figure 1a The schematic diagram of the structure of the camera module formed by the chip shown.

[0031] Figure 2a This is a cross-sectional view of a chip in the prior art.

[0032] Figure 2b for Figure 2a The schematic diagram of the structure of the camera module formed by the chip shown.

[0033] Figure 3 This is a flow chart of a method for manufacturing a camera module provided by one embodiment of the present invention.

[0034] Figures 4 to 13The present invention provides a schematic structural diagram of each step of a method for manufacturing a camera module according to an embodiment of the present invention.

[0035] Figure 14 This is a flow chart of a method for manufacturing a camera module provided by another embodiment of the present invention.

[0036] Figure 15 This is a schematic structural diagram of a camera module after assembly in a method for manufacturing the camera module provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0037] To make the content of the present invention more clear and understandable, the content of the present invention is further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the scope of protection of the present invention.

[0038] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Secondly, the present invention is described in detail using schematic diagrams. When describing the examples of the present invention in detail, for the sake of convenience, the schematic diagrams are not enlarged according to the general scale, and this should not be regarded as a limitation of the present invention.

[0039] Figure 3 This is a flow chart of a method for manufacturing a camera module provided by one embodiment of the present invention. Figures 4 to 13 The following is a schematic diagram of the steps of the method for manufacturing a camera module according to an embodiment of the present invention. Figure 3 and Figures 4 to 13 Each step of the method for manufacturing the camera module in this embodiment is described in detail.

[0040] In step S100, please refer to Figure 4 As shown, a substrate 10 is provided, and glue is dispensed on the substrate 10 .

[0041] The substrate 10 is preferably a glass substrate, and may also be other substrates known to those skilled in the art, which is not limited in the present invention. Glue is dispensed on the substrate 10 to form an adhesive layer 11 .

[0042] In step S200, please continue to refer to Figure 4 and Figure 5 As shown, a plurality of chip bodies 20 are arranged at intervals and bonded to the substrate 10 .

[0043] The chip body 20 can be a conventional chip, on which corresponding device layers can be formed. The chip body 20 has a glass surface, i.e., a connection surface for connecting to the camera. The glass surface of the chip body 20 is bonded to the bonding layer 11, that is, the connection surface of the chip body 20 originally connected to the camera is bonded to the substrate 10.

[0044] Please refer to Figure 4 and Figure 5 As shown, the adhesive layer 11 is located on the substrate 10 at a position intended for bonding the chip body 20. In this embodiment, the adhesive layer 11 is formed by dispensing glue and then heated and baked to cure the adhesive layer 11, thereby securing the chip body 20 to the substrate 10. Furthermore, since the adhesive layer 11 serves only to bond the chip body 20 to the substrate 10 and has no other effect on the subsequently formed chip and camera module, it is not shown in the subsequent figures.

[0045] The position where the chip body 20 is bonded to the substrate 10 is determined based on the required increase in size of the chip body 20. Specifically, multiple chip bodies 20 are bonded to the substrate 10 in a regular pattern. The distance between adjacent chip bodies 20 and the distance between a chip body 20 and the edge of the substrate 10 are both determined by the required increase in size of the chip body 20. For example, if the edge of a chip body 20 needs to increase by a dimension a to connect to a camera, the distance between adjacent chip bodies 20 should be greater than or equal to 2a. If subsequent cutting does not affect the substrate 10 and the subsequently formed adhesive layer, the distance between adjacent chip bodies 20 is equal to 2a. If subsequent cutting affects the substrate 10 and the subsequently formed adhesive layer, such as causing the substrate 10 or adhesive layer to lose a dimension b, the distance between adjacent chip bodies 20 is equal to 2a + b. When a chip body 20 is located at the edge of the substrate 10, the distance between the chip body 20 and the adjacent chip body 20 is as described above, and the distance from the chip body 20 to the edge of the substrate 10 is a. The chip bodies 20 can be arranged regularly on the substrate 10 according to this rule. Of course, the present invention is not limited to the above rule. It is only necessary that the distance between adjacent chip bodies 20 is greater than 2a, and the distance from the chip body 20 to the edge of the substrate 10 is greater than a. The chip size a that needs to be increased can be obtained through the subsequent cutting step.

[0046] After the plurality of chip bodies 20 are arranged at intervals and bonded to the substrate 10 , gaps are formed between the chip bodies 20 and between the chip bodies 20 and the edge of the substrate, and the gaps expose a portion of the substrate 10 .

[0047] In step S300, please refer to Figure 6 As shown, the gaps between the plurality of chip bodies 20 are filled with glue, and the glue layer 21 covers the exposed substrate 10 and connects the adjacent chip bodies 20 .

[0048] Specifically, the glue layer 21 can be formed by dispensing glue in the gaps between the chip bodies 20 and the gaps between the chip bodies 20 and the edges of the substrate 10, and then heated and baked to solidify the glue layer 21. At this time, the glue layer 21 covers the exposed substrate 10 and connects the multiple chip bodies 20 together. The glue layer 21 can completely fill the gaps between the chip bodies 20, or of course, it can also partially fill the gaps between the chip bodies 20. Preferably, the glue layer 21 completely fills the gaps between the chip bodies 20, that is, the thickness of the glue layer 21 is equal to the thickness of the chip bodies 20, so that a chip with a relatively regular shape can be obtained.

[0049] In step S400, please refer to Figure 7 As shown, the substrate 10 bonded with the plurality of chip bodies 20 is cut to form a plurality of chips 100 , and the plurality of chip bodies 20 after cutting are all surrounded by a glue layer 21 .

[0050] Specifically, the substrate 10 and the adhesive layer 21 are cut according to the designed size to obtain Figure 8 The chip 100 shown in FIG. The chip 100 includes a chip body 20, an adhesive layer 21 surrounding the periphery of the chip body 20, and a substrate 10 covering the chip body 20 and the adhesive layer 21. The size of the chip 100 can be controlled by primarily controlling the size of the adhesive layer 21.

[0051] In step S500, the plurality of chips 100 are assembled with the plurality of cameras 200 to form a Figure 9 The camera module shown in FIG. 1 includes a camera 200 and a chip 100 . The camera 200 is connected to the substrate 10 . The substrate 10 covers the adhesive layer 21 and the chip body 20 .

[0052] In this embodiment, when manufacturing the chip, the size of the adhesive layer surrounding the chip body can be increased by increasing the distance between adjacent chip bodies adhered to the substrate, thereby increasing the size of the chip. That is, the chip body with the same function can obtain chips of different sizes through the method described in this embodiment, and thus be connected to cameras of different sizes to form a camera module, thereby improving the matching degree between the chip and the camera, and enriching the types of camera modules obtained thereby.

[0053] In another embodiment of the present invention, after cutting the substrate 10 and before connecting the chip 100 to the camera 200, the process further includes: removing the substrate 10 corresponding to the area of ​​the chip body 20, and retaining the substrate 10 corresponding to the area of ​​the adhesive layer 21 as a connection portion with the camera. Figure 10 As shown, the chip 100 includes: a chip body 20 , an adhesive layer 21 , the adhesive layer 21 surrounding the periphery of the chip body 20 , and a substrate 10 , the substrate 10 covering the adhesive layer 21 .

[0054] Finally, the chip 100 is connected to the camera 200 to form a Figure 11 The camera module shown in FIG. 1 includes a camera 200 and a chip 100 . The camera 200 is connected to the substrate 10 , and the substrate 10 only covers the adhesive layer 21 .

[0055] In another embodiment of the present invention, part of the substrate 10 above the chip body 20 may be removed, and the remaining substrate 10 covers the adhesive layer 11 and part of the chip body 20 and serves as a connection area with the camera. Figure 8 and Figure 12 As shown, part of the substrate 10 on the chip body 20 is removed, that is, the substrate 10 on the central area of ​​the chip body 20 is removed, and the remaining substrate 10 on the edge area of ​​the chip body 20 and the substrate 10 on the adhesive layer 21 are formed as a whole to form a connection portion. Figure 12 As shown, the chip 100 includes a chip body 20, an adhesive layer 21 surrounding the periphery of the chip body 20, and a substrate 10 covering the adhesive layer 21 and a portion of the chip body 20. The size of the remaining substrate 10 can be determined based on the size of the camera connection area and actual process conditions, and is not limited in this embodiment.

[0056] Will Figure 12 The chip 100 is connected to the camera 200 to form a Figure 13 The camera module shown in FIG. The camera module includes: a camera 200 and a chip 100 , wherein the camera 200 is connected to the substrate 10 , and the substrate 10 covers the adhesive layer 21 and a portion of the chip body 20 .

[0057] Figure 14 This is a flow chart of a method for manufacturing a camera module provided by another embodiment of the present invention. Figure 15 This is a schematic diagram of the structure of the camera module after assembly in the manufacturing method of another embodiment of the present invention. Figure 14 and Figures 4 to 6 、 Figure 9 、 Figure 15 Each step of the method for manufacturing the camera module in this embodiment is described in detail.

[0058] In step S100, please refer to Figure 4 As shown, a substrate 10 is provided, and glue is dispensed on the substrate 10 .

[0059] In step S200, please refer to Figure 4 and Figure 5 As shown, a plurality of chip bodies 20 are arranged at intervals and bonded to the substrate 10 .

[0060] In step S300, please refer to Figure 6 As shown, the gaps between the plurality of chip bodies 20 are filled with glue, and the glue layer 21 covers the exposed substrate 10 and connects the adjacent chip bodies 20 .

[0061] Since the above three steps are the same as those in the previous embodiment, reference may be made to the above description and no further details will be given here.

[0062] In step S400, please refer to Figure 15 As shown, the substrate 10 bonded with a plurality of the chip bodies 20 is assembled with a camera array 200 ′, and the cameras in the camera array 200 ′ correspond one-to-one to the chip bodies 20 .

[0063] Specifically, a camera array 200' is provided, wherein the camera array 200' comprises a plurality of cameras arranged regularly. The substrate 10 and the camera array 200' are assembled, and the chip body 20 corresponds to the cameras one by one. Figure 15 As shown, a substrate 10 with multiple chip bodies 20 attached and filled with an adhesive layer 21 is assembled with a camera array 200′ having multiple cameras. The chip bodies 20 and the cameras are in a one-to-one correspondence. The camera array 200′ is connected to the substrate 10, and the connection area corresponds to the adhesive layer 21, or the connection area corresponds to the adhesive layer 21 and a portion of the edge of the chip body 20 near the adhesive layer 21.

[0064] In step S500, please refer to Figure 15 and Figure 9 As shown, the camera array 200 ′ assembled with a plurality of the chip bodies 20 is cut to form a plurality of camera modules, and the chip body 20 in each camera module is surrounded by a glue layer 21 .

[0065] Please refer to Figure 9As shown, the camera module 200 includes a chip 100 and a camera 200 connected to the chip 100. The chip 100 includes: a chip body 20, an adhesive layer 21 and a substrate 10. The adhesive layer 21 surrounds the periphery of the chip body 20, and the substrate 10 covers the chip body 20 and the adhesive layer 21. The camera 200 is connected to the substrate 10.

[0066] By adopting the method described in this embodiment, multiple chips can be connected to multiple cameras at the same time, saving process steps and improving production efficiency.

[0067] Correspondingly, the embodiment of the present invention further provides a camera module, which is manufactured using the manufacturing method of the camera module as described above. Figure 9 As shown, the camera module includes:

[0068] Chip body 20;

[0069] An adhesive layer 21 surrounds the periphery of the chip body 20;

[0070] a substrate 10, the substrate 10 covering the adhesive layer 21 and the substrate 10; and

[0071] The camera 200 is connected to the base 10 .

[0072] To sum up, in the camera module and manufacturing method provided by the present invention, first, a substrate is provided, and glue is dispensed on the substrate, and multiple chip bodies are arranged at intervals and bonded to the substrate, and then the gaps between the multiple chip bodies are filled with glue, and then the substrate with the multiple chip bodies bonded thereto is cut, and the multiple chip bodies after cutting are surrounded by a glue layer, and then the multiple chips are respectively assembled with multiple cameras to form multiple camera modules; or after the gaps between the multiple chip bodies are filled with glue, the substrate with the multiple chip bodies bonded thereto is first assembled with a camera array, and the cameras in the camera array correspond one-to-one to the chip bodies, and then the camera array assembled with the multiple chip bodies is cut to form multiple camera modules, and the chip body in each camera module is surrounded by a glue layer. During the manufacturing process, both methods can increase the size of the adhesive layer surrounding the chip body by increasing the distance between adjacent chip bodies bonded on the substrate, thereby increasing the size of the chip, so that the chip can be connected to cameras of different sizes to form a camera module, improving the matching degree between the chip and the camera, and enriching the types of camera modules formed thereby.

[0073] The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A method for manufacturing a camera module, characterized in that: The production method comprises the following steps: Providing a substrate, and dispensing glue on the substrate; Arranging a plurality of chip bodies at intervals and bonding them to the substrate; Filling the gaps between the chip bodies with glue; Cutting the substrate bonded with the plurality of chip bodies to form a plurality of chips, wherein the plurality of chip bodies after being cut are surrounded by a glue layer, and the thickness of the glue layer is equal to the thickness of the chip body; Assembling the plurality of chips with a plurality of cameras respectively, and connecting the side of the chip bonded with the substrate to the camera to form a plurality of camera modules; The size of the adhesive layer surrounding the chip body is increased by increasing the distance between adjacent chip bodies adhered to the substrate, so as to connect with cameras of different sizes to form a camera module.

2. The method for manufacturing a camera module according to claim 1, wherein: After cutting the substrate and before assembling the substrate with the camera, the manufacturing method further includes: A portion of the substrate above the chip body is removed, and the remaining substrate covers the adhesive layer and a portion of the chip body and serves as a connection portion with the camera.

3. The method for manufacturing a camera module according to claim 1, wherein: After cutting the substrate and before assembling the substrate with the camera, the manufacturing method further includes: The substrate above the chip body and corresponding to the area of ​​the chip body is removed, and the remaining substrate covers the glue layer and serves as a connection portion with the camera.

4. A method for manufacturing a camera module, characterized in that: The production method comprises the following steps: Providing a substrate, and dispensing glue on the substrate; Arranging a plurality of chip bodies at intervals and bonding them to the substrate; Filling the gaps between the chip bodies with glue; Assembling the substrate bonded with the plurality of chip bodies and a camera array, wherein the cameras in the camera array correspond one to one with the chip bodies; Cutting the camera array assembled with the plurality of chip bodies to form a plurality of camera modules, wherein the chip body in each camera module is surrounded by a glue layer, and the thickness of the glue layer is equal to the thickness of the chip body; The size of the adhesive layer surrounding the chip body is increased by increasing the distance between adjacent chip bodies adhered to the substrate, so as to connect with cameras of different sizes to form a camera module.

5. The method for manufacturing a camera module according to claim 1 or 4, wherein: The substrate is a glass substrate.

6. A camera module, characterized in that: A camera module manufactured using the manufacturing method according to any one of claims 1 to 3.

7. A camera module, characterized in that: A camera module manufactured using the manufacturing method according to any one of claims 4 to 5.

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