An optical module

Abstract

The optical module provided by the present application includes: an upper shell, which is covered with a lower shell; a circuit board, which is located between the upper shell and the lower shell; an optical sub-module, which is located between the upper shell and the lower shell and is electrically connected to the circuit board; wherein the optical sub-module includes: a cavity, which includes a bottom surface and a side wall connected to the bottom surface, thereby forming an opening at the top; a cover plate, which is covered at the opening and forms a receiving cavity with the cavity; an optical chip, which is arranged in the receiving cavity and can emit or receive light; an optical component, which is arranged in the receiving cavity and can transmit light to the optical chip; wherein a first step surface and a second step surface are formed on the upper surface of the cavity side wall, and a cover plate fixing glue groove is arranged between the first step surface and the second step surface; the first step surface is relatively lower than the second step surface; the cover plate abuts against the first step surface to cover the opening; the cover plate fixing glue groove is filled with adhesive material to bond the cover plate.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. In addition, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing.

[0003] In order to improve the transmission rate of optical modules, the transmission channels in the optical modules can be increased. For example, the traditional optical modules including one group of optical transmitting submodules (emitting light of one wavelength) and one group of optical receiving submodules (receiving light of one wavelength) can be improved to include two groups of optical transmitting submodules (each group emitting light of one wavelength) and two groups of optical receiving submodules (each group receiving light of one wavelength). In this way, the volume occupied by the optical transmitting submodule and the optical receiving submodule in the optical module will continue to increase, which is not conducive to the further development of optical modules. Summary of the invention

[0004] The embodiment of the present application provides an optical module, which facilitates the simultaneous transmission of signal lights of multiple wavelengths in a single optical fiber.

[0005] The present application provides an optical module, comprising:

[0006] An upper shell body, covering the lower shell body;

[0007] A circuit board is located between the upper housing and the lower housing;

[0008] An optical sub-module, located between the upper housing and the lower housing, and electrically connected to the circuit board;

[0009] The optical submodule comprises:

[0010] A cavity, comprising a bottom surface and a side wall connected to the bottom surface, thereby forming an upper opening;

[0011] A cover plate, covering the opening and forming a receiving cavity with the cavity;

[0012] An optical chip, disposed in the accommodating cavity, capable of emitting or receiving light;

[0013] An optical component, disposed in the accommodating cavity and capable of transmitting light to the optical chip;

[0014] The upper surface of the side wall of the cavity forms a first step surface and a second step surface, a cover plate fixing rubber groove is provided between the first step surface and the second step surface; the first step surface is relatively lower than the second step surface;

[0015] The cover plate abuts against the first step surface to cover the opening;

[0016] The cover plate fixing adhesive groove is filled with adhesive material to adhere the cover plate.

[0017] The cover plate is covered on the first step surface. The first step surface is set on the upper surface of the side plate so that the cover plate abuts against the first step surface. A second step surface higher than the first step surface is also set on the side plate. A cover plate fixing glue groove is set between the first step surface and the second step surface. The cover plate fixing glue groove is filled with adhesive material to bond the cover plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a schematic diagram of the connection relationship of optical communication terminals;

[0020] Figure 2 is a schematic diagram of the structure of an optical network unit;

[0021] Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0022] Figure 4 Provide a schematic diagram of the decomposed structure of an optical module for the embodiment of the present application;

[0023] Figure 5 A cross-sectional view of an optical module structure provided in an embodiment of the present application;

[0024] Figure 6 A schematic diagram of a structure in which a light transmitting submodule and a light receiving submodule are separated according to an embodiment of the present application;

[0025] Figure 7 A DeMUX working principle diagram provided in an embodiment of the present application;

[0026] Figure 8 A schematic diagram of a structure without a cover plate in a light receiving sub-module provided in an embodiment of the present application;

[0027] Fig. 9 for Figure 8 Partial exploded view at A in the middle;

[0028] Fig.10 A top view of a light receiving sub-module provided in an embodiment of the present application with a cover plate hidden;

[0029] Fig.11 A cross-sectional view of a light receiving sub-module at a light receiving cavity is provided for an embodiment of the present application;

[0030] Fig.12 A partial exploded view of a light receiving sub-module is provided for an embodiment of the present application;

[0031] Fig.13 Another cross-sectional view of a light receiving submodule at a light receiving cavity is provided for an embodiment of the present application. Figure 1 ;

[0032] Fig.14 Another cross-sectional view of a light receiving submodule at a light receiving cavity is provided for an embodiment of the present application. Figure 2 ;

[0033] Fig.15 A schematic diagram of a light receiving cavity is provided for the embodiment of the present application. Figure 1 ;

[0034] Fig.16 A schematic diagram of a light receiving cavity is provided for the embodiment of the present application. Figure 2 ;

[0035] Fig.17 A diagram showing the assembly and use status of a light receiving cavity provided in an embodiment of the present application;

[0036] Fig.18 A cross-sectional view of an assembled and used state of a light receiving cavity provided in an embodiment of the present application;

[0037] Fig.19 A cross-sectional view of a light receiving cavity provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] One of the core links of fiber-optic communication is the conversion between optical and electrical signals. Fiber-optic communication uses optical signals carrying information to transmit in optical fiber / optical waveguide and other information transmission equipment. The passive transmission characteristics of light in optical fiber / optical waveguide can achieve low-cost and low-loss information transmission; while information processing equipment such as computers use electrical signals. In order to establish an information connection between information transmission equipment such as optical fiber / optical waveguide and information processing equipment such as computers, it is necessary to achieve the conversion between electrical and optical signals.

[0040] Optical modules realize the above-mentioned mutual conversion function of optical and electrical signals in the field of optical fiber communication technology. The mutual conversion of optical signals and electrical signals is the core function of optical modules. Optical modules realize electrical connection with external host computers through the gold fingers on their internal circuit boards. The main electrical connections include power supply, I2C signals, data signals and grounding. The electrical connection method realized by gold fingers has become the mainstream connection method in the optical module industry. Based on this, the definition of the pins on the gold fingers has formed a variety of industry protocols / specifications.

[0041] Figure 1 Figure 1 is a schematic diagram of the connection relationship of optical communication terminals. Figure 1 As shown, the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

[0042] One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0043] The optical port of the optical module 200 is connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is connected to the optical network terminal 100 to establish a bidirectional electrical signal connection with the optical network terminal 100; the mutual conversion between the optical signal and the electrical signal is realized inside the optical module, so as to establish an information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.

[0044] The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a bidirectional electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used to access the network cable 103 and establish a bidirectional electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network terminal 100. Specifically, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module. The optical network terminal acts as a host computer of the optical module to monitor the operation of the optical module.

[0045] At this point, the remote server establishes a two-way signal transmission channel with the local information processing device through optical fiber, optical module, optical network terminal and network cable.

[0046] Common information processing equipment includes routers, switches, and electronic computers. The optical network terminal is the host computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module. Other common optical module host computers include optical line terminals.

[0047] Figure 2 Figure 1 is a schematic diagram of the optical network terminal structure. Figure 2 As shown, the optical network terminal 100 has a circuit board 105, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged inside the cage 106 for connecting to the electrical port of the optical module such as the gold finger; a heat sink 107 is arranged on the cage 106, and the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0048] The optical module 200 is inserted into the optical network terminal. Specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .

[0049] The cage 106 is located on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the optical module is inserted into the cage, and the cage fixes the optical module, and the heat generated by the optical module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

[0050] Figure 3 A schematic diagram of an optical module structure provided in an embodiment of the present application is provided. Figure 4 A schematic diagram of the optical module decomposition structure is provided for the embodiment of the present application. Figure 3 , Figure 4 As shown, the optical module 200 provided in the embodiment of the present application includes an upper housing 201 , a lower housing 202 , an unlocking component 203 , a circuit board 300 , an optical transmitting submodule 400 and an optical receiving submodule 500 .

[0051] The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body. Specifically, the lower shell includes a main board and two side panels located on both sides of the main board and perpendicular to the main board; the upper shell includes a cover plate, which is covered on the two side panels of the upper shell to form a wrapping cavity; the upper shell may also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side panels to achieve the upper shell covering the lower shell.

[0052] The two openings can be two end openings (204, 205) in the same direction, or two openings in different directions; one of the openings is an electrical port 204, and the gold finger of the circuit board extends from the electrical port 204 and is inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect the optical transceiver device 400 inside the optical module; the circuit board 300, the optical transceiver device 400 and other optoelectronic devices are located in the package cavity.

[0053] The upper shell and the lower shell are combined to facilitate installation of components such as the circuit board 300 and the optical transceiver device 400 into the shell. The upper shell and the lower shell form the outermost packaging protection shell of the optical module. The upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation. The shell of the optical module is generally not made into an integrated component. In this way, when assembling components such as circuit boards, positioning components, heat dissipation and electromagnetic shielding components cannot be installed, which is not conducive to production automation.

[0054] The unlocking component 203 is located on the outer wall of the cavity / lower shell 202 and is used to achieve a fixed connection between the optical module and the host computer, or to release the fixed connection between the optical module and the host computer.

[0055] The unlocking component 203 has a locking component that matches the cage of the host computer; pulling the end of the unlocking component can make the unlocking component move relatively on the surface of the outer wall; the optical module is inserted into the cage of the host computer, and the locking component of the unlocking component fixes the optical module in the cage of the host computer; by pulling the unlocking component, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module and the host computer, so that the optical module can be pulled out of the cage of the host computer.

[0056] The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.

[0057] The circuit board connects the electrical components in the optical module according to the circuit design through circuit routing to achieve electrical functions such as power supply, electrical signal transmission and grounding.

[0058] The chip on the circuit board 300 can be a multi-functional integrated chip, such as integrating the laser driver chip and the MCU chip into one chip, or integrating the laser driver chip, the limiting amplifier chip and the MCU into one chip. The chip is an integration of circuits, but the functions of each circuit do not disappear due to the integration, but the circuit presentation form changes, and the chip still has the circuit form. Therefore, when three independent chips, MCU, laser driver chip and limiting amplifier chip, are set on the circuit board, this is equivalent to setting a single chip with three functions in one on the circuit board 300.

[0059] Circuit boards are generally rigid circuit boards. Rigid circuit boards can also perform load-bearing functions due to their relatively hard material. For example, rigid circuit boards can stably carry chips. When optical transceivers are located on the circuit boards, rigid circuit boards can also provide stable load-bearing. Rigid circuit boards can also be inserted into electrical connectors in the cage of the host computer. Specifically, metal pins / gold fingers are formed on the end surface of one side of the rigid circuit board for connecting to the electrical connector. These are not easy to achieve with flexible circuit boards.

[0060] Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards. For example, flexible circuit boards can be used to connect rigid circuit boards to optical transceiver devices.

[0061] The optical transmitting submodule and the optical receiving submodule can be collectively referred to as an optical submodule. Figure 4 As shown, the optical module provided in the embodiment of the present application includes an optical transmitting submodule 400 and an optical receiving submodule 500, and the optical transmitting submodule 400 and the optical receiving submodule 500 are located at the edge of the circuit board 300, and the optical transmitting submodule 400 and the optical receiving submodule 500 are stacked up and down. Optionally, the optical transmitting submodule 400 is closer to the upper housing 201 than the optical receiving submodule 500, but it is not limited thereto, and the optical receiving submodule 500 can also be closer to the upper housing 201 than the optical transmitting submodule 400.

[0062] Optionally, the optical transmitting submodule 400 and the optical receiving submodule 500 are physically separated from the circuit board 300 and connected to the circuit board 300 via flexible circuit boards.

[0063] When the optical transmitting submodule 400 is closer to the upper shell 201 than the optical receiving submodule 500, the optical transmitting submodule 400 and the optical receiving submodule 500 are arranged in a wrapping cavity formed by the upper and lower shells, and the lower shell 202 supports the optical receiving submodule 500, and the optical receiving submodule 500 supports the optical transmitting submodule 400.

[0064] Figure 5This is a cross-sectional view of an optical module structure provided in an embodiment of the present application. Figure 5 As shown, the optical module provided in the embodiment of the present application includes a lower housing 202, a circuit board 300, an optical transmitting submodule 400 and an optical receiving submodule 500. A first optical fiber adapter 410 is provided at the end of the optical transmitting submodule 400 away from the circuit board 300, and the first optical fiber adapter 410 is used to transmit the signal light generated by the optical transmitting submodule 400 to the outside of the optical module; a second optical fiber adapter 510 is provided at the end of the optical receiving submodule 500 away from the circuit board 300, and the second optical fiber adapter 510 is used to transmit the signal light from the outside of the optical module to the inside of the optical receiving submodule 500. The circuit board is electrically connected to the optical transmitting submodule 400 and the optical receiving submodule 500 respectively through a flexible circuit board.

[0065] Since the overall size of the optical module must conform to the interface size of the host computer and is restricted by industry standards, and the optical transmitting submodule 400 and the optical receiving submodule 500 are too large to be placed on the circuit board, they are separated from the circuit board and the electrical connection is transferred through a flexible circuit board. Figure 5 As shown, compared with the bottom surface of the lower housing 202, the first optical fiber adapter 410 and the second optical fiber adapter 510 are located at the same height. The first optical fiber adapter and the second optical fiber adapter are respectively used to connect with the optical fiber connector outside the optical module; and the optical fiber connector outside the optical module is a standard part commonly used in the industry. The shape and size of the external optical fiber connector limit the positions of the two optical fiber adapters inside the optical module, so the first optical fiber adapter 410 and the second optical fiber adapter 510 are set at the same height in the product.

[0066] Figure 6 A schematic diagram of a structure in which a light transmitting submodule and a light receiving submodule are separated according to an embodiment of the present application. Figure 6As shown, the optical transmitting submodule and the optical receiving submodule are stacked; the optical receiving submodule 500 provided in the embodiment of the present application also includes an optical receiving cavity 520 and an optical receiving cover plate 520a, and the optical receiving cover plate 520a covers the optical receiving cavity 520 from above. Optical components related to light reception, such as lenses, optical chips (optical receiving chips), and transimpedance amplifiers, are arranged in the optical receiving cavity 520. One end of the optical receiving cavity 520 is connected to the second optical fiber adapter 510, and the signal light from the outside of the optical module is received through the second optical fiber adapter 510, and the received signal light is transmitted to the optical receiving chip through optical devices such as lenses arranged in the optical receiving cavity 520; an opening 521 is arranged on the side wall of the other end of the optical receiving cavity 520 for inserting a flexible circuit board. One end of the flexible circuit board is inserted and fixed in the optical receiving cavity 520 and is electrically connected to electrical devices such as the optical receiving chip and the transimpedance amplifier, and the other end of the flexible circuit board is used to be electrically connected to the circuit board 300. The light receiving cavity 520 and the light receiving cover plate 520a can be made of metal structural parts, such as die-casting or milling metal parts.

[0067] An optical chip is disposed in the accommodating cavity and is capable of emitting or receiving light; an optical component is disposed in the accommodating cavity and is capable of transmitting light to the optical chip;

[0068] An opening 521 is provided on the side wall of the other end of the light receiving cavity 520 , and an electrical connector may also be provided at the opening, such as a metallized circuit composed of a multi-layer substrate, and a flexible circuit board is connected to the electrical connector to achieve electrical connection.

[0069] In the optical module provided in the embodiment of the present application, the optical receiving submodule 500 is used to receive signal lights of multiple different wavelengths. The signal lights of different wavelengths are transmitted to the optical receiving cavity 520 through the second optical fiber adapter 510, and are split by wavelength through reflection and refraction of different optical devices such as lenses in the optical receiving cavity 520. The signal lights after splitting by wavelength are finally transmitted to the photosensitive surface of the optical receiving chip, and the optical receiving chip receives the signal light through its photosensitive surface. Usually, one optical receiving chip is used to receive signal light of one wavelength, and thus the optical receiving submodule 500 provided in the embodiment of the present application includes multiple optical receiving chips. For example, when the optical receiving submodule 500 is used to receive signal lights of 4 different wavelengths, the optical receiving submodule 500 includes 4 optical receiving chips for correspondingly receiving the signal lights of the 4 wavelengths; when the optical receiving submodule 500 is used to receive signal lights of 8 different wavelengths, the optical receiving submodule 500 includes 8 optical receiving chips for correspondingly receiving the signal lights of the 8 wavelengths.

[0070] In the optical receiving submodule provided in the embodiment of the present application, the optical receiving cavity 520 includes optical devices such as a first lens group and a demultiplexing component (DeMUX). The first lens group includes a plurality of lenses, and the signal light transmitted from the second optical fiber adapter 510 to the optical receiving cavity 520 is split according to the wavelength band through the cooperation of the lenses, such as being split into two beams according to the wavelength band. In the embodiment of the present application, the band usually includes multiple wavelengths; for example, the optical receiving submodule 500 is used to receive signal lights of eight different wavelengths, namely, λ1, λ2, λ3, λ4, λ5, λ6, λ7 and λ8; wherein, the wavelengths of λ1, λ2, λ3 and λ4 are relatively close and are located in the same band (recorded as the first band), and the wavelengths of λ5, λ6, λ7 and λ8 are relatively close and are located in the same band (recorded as the second band); then the lenses in the first lens assembly cooperate with each other to divide the signal light into two beams, that is, the lenses in the first lens assembly 530 cooperate with each other to divide the signal light belonging to the first band in the signal light into the first beam of signal light, and the signal light belonging to the second band into the second beam of signal light. Of course, the first lens assembly provided in the embodiment of the present application can also divide the signal light into three beams according to the band, etc. The signal light after being split by the first lens group according to the band is transmitted to the corresponding DeMUX, and the DeMUX splits the split signal light twice according to the wavelength, and finally transmits the signal light split according to the wavelength to the corresponding optical receiving chip.

[0071] Figure 7 The working principle diagram of a DeMUX for splitting a beam of light including four wavelengths (β1, β2, β3 and β4) provided in an embodiment of the present application; wherein the right side of the DeMUX includes an input port for incident signal light of multiple wavelengths, and the left side includes multiple output ports for emitting light, each of which is used to emit signal light of one wavelength. Figure 7 As shown, the signal light enters the DeMUX through the incident light port of the DeMUX, the β1 signal light passes through six different positions of the DeMUX and undergoes six different reflections to reach its light outlet; the β2 signal light passes through four different positions of the DeMUX and undergoes four different reflections to reach its light outlet; the β3 signal light passes through two different positions of the DeMUX and undergoes two different reflections to reach its light outlet; the β4 signal light is directly transmitted to reach its light outlet after being incident on the DeMUX. In this way, the DeMUX is used to realize that signal lights of different wavelengths enter the DeMUX through the same light input port and are output through different light outlets, thereby realizing the splitting of signal lights of different wavelengths. In the embodiment of the present application, the DeMUX is not limited to the splitting of light beams including 4 wavelengths, and can be selected according to actual needs.

[0072] The optical receiving submodule provided in an embodiment of the present application is described in detail below with reference to a specific example. In this embodiment, the optical receiving submodule is used to receive signal lights of 8 different wavelengths, including λ1, λ2, λ3, λ4, λ5, λ6, λ7 and λ8.

[0073] Figure 8 This is a schematic diagram of a structure without a cover plate in a light receiving sub-module provided in an embodiment of the present application. Figure 8 As shown, a first through hole 522 is further provided at one end of the light receiving cavity 520, and the first through hole 522 is used to connect the second optical fiber adapter 510 and the light receiving cavity 520. Figure 8 As shown, a first lens assembly 530, a first DeMUX 540, a second DeMUX 550, a first light receiving assembly 580 and a second light receiving assembly 590 are arranged in the light receiving cavity 520. Taking the case where the received light includes 8 wavelengths of light in two bands as an example, a single band includes 4 wavelengths of light, wherein: the first lens assembly 530 performs the first beam splitting according to the band of the signal light, that is, the signal light is divided into two beams (a first signal light beam and a second signal light beam) according to the band of the signal light; the first signal light beam is transmitted to the first DeMUX 540, and the first DeMUX 540 splits the first signal light beam into a first four-way signal light beam; the second signal light beam is transmitted to the second DeMUX 550, and the first DeMUX 540 splits the second signal light beam into a second four-way signal light beam; the first four-way signal light beam is transmitted to the first light receiving assembly 580, and the second four-way signal light beam is transmitted to the second light receiving assembly 590.

[0074] In the embodiment of the present application, the first light receiving component 580 and the second light receiving component 590 respectively include several light receiving chips, and the light receiving chips are PDs (photodetectors), such as APDs (avalanche diodes) and PIN-PDs (photodiodes), which are used to convert received signal light into photocurrent. Optionally, the light receiving chips in the first light receiving component 580 and the second light receiving component 590 are respectively arranged on the surface of the metallized ceramic, and the circuit pattern is formed on the surface of the metallized ceramic, which can power the light receiving chip, and then the metallized ceramic with the light receiving chip is mounted on the flexible circuit board; or, the light receiving chip is directly mounted on the flexible circuit board. Further, the first light receiving component 580 and the second light receiving component 590 also respectively include a transimpedance amplifier, which is mounted on the flexible circuit board, and the transimpedance amplifier is connected to the corresponding light receiving chip, receives the current signal generated by the light receiving chip and converts the received current signal into a voltage signal. The transimpedance amplifier can also be arranged on an electrical connector, located in the light receiving cavity. Optionally, the transimpedance amplifier is wired to connect the corresponding light receiving chip, such as by a semiconductor bonding gold wire (Gold Wire Bonding).

[0075] Fig. 9 for Figure 8 The local exploded view of A in the figure. Fig. 9 As shown, the first optical receiving component 580 includes a first ceramic substrate 581 and a first transimpedance amplifier 582, and the first transimpedance amplifier 582 is arranged on one side of the first ceramic substrate 581; wherein, four optical receiving chips 583 are arranged on the first ceramic substrate 581, and the first ceramic substrate 581 facilitates the installation of the optical receiving chip 583. The first ceramic substrate 581 is wired to connect the first transimpedance amplifier 582 to achieve the connection between the optical receiving chip 583 and the first transimpedance amplifier 582. However, when the wire length is longer, the inductance generated by the wire is greater, the signal mismatch will also be greater, and the signal output by the optical receiving chip 583 is a small signal, which will cause the signal quality to decrease. Therefore, the optical receiving chip 583 is as close to the first transimpedance amplifier 582 as possible, the wire length is reduced, and the signal transmission quality is ensured, and then the first transimpedance amplifier 582 is arranged on one side of the first ceramic substrate 581, and the first ceramic substrate 581 is as close to the first transimpedance amplifier 582 as possible. Furthermore, the first ceramic substrate 581 is also used to raise the light receiving chip 583 so that the electrodes of the light receiving chip 583 and the pins on the first transimpedance amplifier 582 are on the same plane, ensuring that the wire bonding between the light receiving chip 583 and the first transimpedance amplifier 582 is as short as possible.

[0076] Correspondingly, such as Fig. 9 As shown, the second optical receiving component 590 includes a second ceramic substrate 591 and a second transimpedance amplifier 592, and the second transimpedance amplifier 592 is arranged on one side of the second ceramic substrate 591; wherein, four optical receiving chips 593 are arranged on the second ceramic substrate 591, and the second ceramic substrate 591 facilitates the arrangement and installation of the optical receiving chip 593. The second ceramic substrate 591 is wired to connect the second transimpedance amplifier 592 to achieve the connection between the optical receiving chip 593 and the second transimpedance amplifier 592. Similar to the first ceramic substrate 581, the second ceramic substrate 591 is as close to the second transimpedance amplifier 592 as possible to reduce the length of the wire bonding; at the same time, the second ceramic substrate 591 also raises the optical receiving chip 593 so that the electrode of the optical receiving chip 593 and the pin on the second transimpedance amplifier 592 are on the same plane, ensuring that the wire bonding between the optical receiving chip 593 and the second transimpedance amplifier 592 is as short as possible.

[0077] In the embodiment of the present application, if the pins of the transimpedance amplifier are sufficient, the first transimpedance amplifier 582 and the second transimpedance amplifier 592 can use one transimpedance amplifier chip. Furthermore, the four optical receiving chips 583 and the four optical receiving chips 593 can be arranged on one ceramic substrate.

[0078] In an embodiment of the present application, a second lens assembly 560 and a third lens assembly 570 are also provided in the optical receiving cavity 520; wherein the second lens assembly 560 is used for adjusting the optical path during the transmission of the first four-way signal light to the first optical receiving assembly 580, and the third lens assembly 570 is used for adjusting the optical path during the transmission of the second four-way signal light to the second optical receiving assembly 590.

[0079] Usually, the optical axes of the first four-way signal light and the second four-way signal light are parallel to the bottom surface of the light receiving cavity 520, and the photosensitive surfaces of the light receiving chip 583 and the light receiving chip 593 are also parallel to the bottom surface of the light receiving cavity 520. Therefore, in order to ensure that the light receiving chip 583 and the light receiving chip 593 receive the signal light normally, as shown in FIG. Fig. 9 As shown, the second lens assembly 560 includes a first reflecting prism 561, and the third lens assembly 570 includes a second reflecting prism 571. The first reflecting prism 561 is arranged above the first ceramic substrate 581, covering the four light receiving chips 583 arranged on the first ceramic substrate 581, and the optical axis direction of the first four-way signal light is changed by the reflecting surface of the first reflecting prism 561, so that the optical axis of the first four-way signal light is converted from being parallel to the bottom surface of the light receiving cavity 520 to being perpendicular to the bottom surface of the light receiving cavity 520, thereby making the first four-way signal light vertically incident on the photosensitive surface of the corresponding light receiving chip 583. Correspondingly, the second reflecting prism 571 is arranged above the second ceramic substrate 591, covering the four light receiving chips 593 arranged on the second ceramic substrate 591, and the optical axis direction of the second four-way signal light is changed through the reflecting surface of the second reflecting prism 571, so that the optical axis of the second four-way signal light is converted from being parallel to the bottom surface of the light receiving cavity 520 to being perpendicular to the bottom surface of the light receiving cavity 520, thereby making the second four-way signal light vertically incident on the photosensitive surface of the corresponding light receiving chip 593.

[0080] In the embodiment of the present application, the first reflecting prism 561 and the second reflecting prism 571 are both 45° reflecting prisms 571, that is, the first reflecting prism 561 and the second reflecting prism 571 respectively include a 45° reflecting surface; the 45° reflecting surface of the first reflecting prism 561 covers the four light receiving chips 583 set on the first ceramic substrate 581, and the 45° reflecting surface of the second reflecting prism 571 covers the four light receiving chips 593 set on the second ceramic substrate 591.

[0081] The first lens assembly 530 includes a plurality of lenses arranged in combination, and the signal light is divided into a first signal light beam according to λ1, λ2, λ3 and λ4, and a second signal light beam according to λ5, λ6, λ7 and λ8 through the cooperation of the lenses. Optionally, the first lens assembly 530 includes four lenses arranged in sequence, and the surfaces of the lenses are coated to realize reflection or refraction of the signal light of each wavelength band, thereby achieving the signal light splitting according to the wavelength band.

[0082] Fig.10 This is a top view of a light receiving submodule provided in an embodiment of the present application with the cover plate hidden. Fig.10 As shown, the first lens assembly 530 includes a first lens 531, a second lens 532, a third lens 533 and a fourth lens 534 arranged in sequence. The wavelengths of the signal light transmitted to the optical receiving cavity 520 through the second optical fiber adapter 510 include λ1, λ2, λ3, λ4, λ5, λ6, λ7 and λ8. The signal light of eight wavelengths is transmitted to the second surface of the first lens 531. The signal light is completely reflected on the surface of the first lens 531. The first lens 531 changes the transmission direction of the signal light.

[0083] The signal light redirected by the first lens 531 is transmitted to the second lens 532 and incident on the second lens 532. The signal light incident on the second lens 532 is refracted once on the first surface of the second lens 532 and the second surface of the second lens 532 in sequence.

[0084] The light beam refracted by the second lens 532 is transmitted to the first surface of the third lens 533, and the signal light of the first wavelength band in the signal light is reflected on the first surface of the third lens 533, and the first signal light beam is separated; the signal light of the second wavelength band is incident on the third lens 533 and refracted on the first surface of the third lens 533, and the second signal light beam is separated;

[0085] The first signal light beam reflected by the first surface of the third lens 533 is retransmitted to the second surface of the second lens 532 , and is reflected by the second surface of the second lens 532 to the light entrance of the first DeMUX 540 ;

[0086] The second signal light beam refracted by the first surface of the third lens 533 is incident into the third lens 533 and is refracted out of the third lens 533 at the second surface of the third lens 533 through the third lens 533; the second signal light beam refracted out of the third lens 533 is transmitted to the fourth lens 534, and then reflected by the first surface of the fourth lens 534 to the light entrance of the second DeMUX550.

[0087] The first surface and the second surface of the lens are only used to distinguish the main working surfaces on both sides of the lens. Fig.10 In the orientation presented in the figure, the surface of the lens close to / facing downward is the first surface, and the surface of the lens close to / facing upward opposite to the first surface is the second surface.

[0088] In the embodiments of the present application, Fig.10In the orientation presented in the figure, the signal light is usually incident into the light receiving cavity 520 along the left and right length direction of the light receiving cavity 520. In order to control the length of the light receiving cavity 520 and thus complete the first beam splitting of the signal light in a shorter length space of the light receiving cavity 520, the first lens 531 is mainly used to change the transmission direction of the signal light incident into the light receiving cavity 520, and convert the transmission direction of the signal light from along the length direction of the light receiving cavity 520 to along the upper and lower width direction of the light receiving cavity 520; the second lens 532 is used to transmit the signal light of the first band and the signal light of the second band in the positive direction and reflect the signal light of the first band in the reverse direction; the third lens 533 is used to reflect the signal light of the first band in the positive direction and transmit the signal light of the second band in the positive direction; the fourth lens 533 is used to reflect the signal light of the second band in the positive direction. Thus, the first lens assembly 530 provided in the embodiment of the present application, in combination with the first lens 531, the second lens 532, the third lens 533 and the fourth lens 534, realizes the first beam splitting according to the wavelength band of the signal light, and transmits the split signal light along the length direction of the optical receiving cavity 520 to the corresponding DeMUX.

[0089] Optionally, the angle between the normal line of the second surface of the first lens 531 and the transmission direction (the direction is denoted as r) incident to the light receiving cavity 520 is 45°, the angle between the normal line of the second surface of the first lens 531 and the normal line of the first plane of the second lens 532 is 90°, that is, the angle between the normal line of the first plane of the second lens 532 and r is 135°; the angle between the normal line of the second plane of the first lens 531 and the normal line of the first plane of the third lens 533 is 37°, that is, the angle between the normal line of the first plane of the third lens 533 and r is 82°; the angle between the normal line of the second plane of the first lens 531 and the normal line of the first plane of the fourth lens 534 is 180°, that is, the angle between the normal line of the first plane of the fourth lens 534 is 45°. At the same time, by selecting and controlling the coating on the second plane of the second lens 532 and the coating on the first plane of the third lens 533, the first band signal light and the second band signal light in the signal are split.

[0090] In the embodiments of the present application, Fig.10 As shown, the second lens assembly 560 further includes four focusing lenses 562 , each of which is correspondingly disposed in the output light path of the first DeMUX 540 and is correspondingly used to focus the signal light in the corresponding light path onto the first reflecting prism 561 .

[0091] Further, if Fig.10 As shown, the third lens assembly 570 further includes four focusing lenses 572 , each of which is correspondingly disposed in the output optical path of the second DeMUX 550 and is correspondingly used to focus the signal light in the corresponding optical path onto the second reflecting prism 571 .

[0092] Fig.11 A cross-sectional view of a light receiving submodule at a light receiving cavity is provided for an embodiment of the present application. Fig.11 As shown, the signal light of the first wavelength band transmitted to the first DeMUX540 is transmitted to the corresponding focusing lens 562 after being branched by wavelength by the first DeMUX540, and is transmitted to the first reflecting prism 561 after being focused by the focusing lens 562. When the branched signal light is transmitted to the reflecting surface of the first reflecting prism 561, the transmission direction is changed from parallel to the length direction of the light receiving cavity to perpendicular to the length direction of the light receiving cavity after being reflected by the reflecting surface of the first reflecting prism 561, and then is transmitted to the corresponding light receiving chip on the first ceramic substrate 581 located below the reflecting surface of the first reflecting prism 561.

[0093] Further, if Fig.11 As shown, a plane light window 523 is arranged in the first through hole 522, and the plane light window 523 is arranged obliquely in the first through hole 522. The signal light transmitted to the first through hole 522 through the second optical fiber adapter passes through the plane light window 523, and is transmitted to the second surface of the first lens 531 through the plane light window 523; however, when the signal light is transmitted to the second surface of the first lens 531, there may be a part of the signal light that transmits the second surface of the first lens 531 and is transmitted to the first surface of the first lens 531, and then the part of the signal light is reflected by the first surface of the first lens 531 and refracted by the second surface of the first lens 531 and will be transmitted to the first through hole 522 again. The inclined plane light window 523 effectively prevents the signal light transmitted to the first through hole 522 again from causing contamination to the signal light transmitted to the first through hole 522 through the second optical fiber adapter. Optionally, the inclination angle of the plane light window 523 is 4-6°, so that the purpose of shielding the signal light transmitted to the first through hole 522 again can be achieved, and the excessive deviation of the signal light transmitted to the first through hole 522 by the second optical fiber adapter can be effectively avoided. At the same time, the planar light window 523 can also be used to seal the first through hole 522 , which facilitates the sealing of the light receiving cavity 520 to a certain extent.

[0094] In order to meet the requirements of the optical module specification, the first optical fiber adapter 410 and the second optical fiber adapter 510 are located at the same height, and in the embodiment of the present application, the optical transmission submodule 400 and the optical receiving submodule 500 are stacked up and down, and thus it is necessary to adjust the transmission height of the signal light transmitted by the second optical fiber adapter 510 or adjust the height of the signal light output from the optical transmission submodule 400 to the first optical fiber adapter 410. Optionally, Figure 8 As shown, the optical receiving submodule 500 further includes a displacement component 524, and the displacement component 525 includes a displacement prism, which is used to adjust the optical path height of the signal light transmitted through the second optical fiber adapter 510. Figure 8In the embodiment, the optical path of the signal light transmitted by the second optical fiber adapter 510 is higher than the height of the preset optical path in the optical receiving cavity 520. The optical path of the signal light transmitted by the second optical fiber adapter 510 is lowered by the displacement prism, so that the signal light can be transmitted from the second optical fiber adapter 510 which is in a relatively higher position to the optical receiving cavity 520 which is in a relatively lower position.

[0095] Fig.12 A partial exploded view of a light receiving submodule is provided for an embodiment of the present application. In some embodiments, Fig.12 As shown, the displacement assembly 524 includes a displacement prism 524a; the displacement prism 524a transfers the signal light transmitted at one height to another height through two or more reflections. Optionally, in this embodiment, the displacement prism 524a uses a displacement prism including two 45° reflection surfaces, and transfers the signal light transmitted at a relatively high height to another lower height through two reflections.

[0096] In some embodiments of the present application, the displacement assembly 524 further includes a prism cavity 524b and a prism cover plate 524c. The prism cavity 524b is used to facilitate the installation and fixation of the displacement prism 524a and to facilitate the connection between the second optical fiber adapter 510 and the light receiving cavity 520. The prism cover plate 524c covers the prism cavity 524d. In this embodiment, a prism accommodating cavity 524d is provided inside the prism cavity 524b, and the prism accommodating cavity 524d is connected to the second optical fiber adapter 510 and the first through hole 522; the displacement prism 524a is provided in the prism accommodating cavity 524d, and the prism cover plate 524c covers the prism accommodating cavity 524d, and the displacement prism 524a is fixed in the prism accommodating cavity 524d. The prism accommodating cavity 524d facilitates improving the installation accuracy of the displacement prism 524a. Optionally, a support step is provided in the prism accommodating cavity 524d, and the limited displacement prism 524a can be supported by the support step; a cover plate groove is also provided in the prism accommodating cavity 524d, which is used to facilitate fixing the prism cover plate 524c on the prism cavity 524b. The prism cover plate 524c can be fixedly connected to the prism cavity 524b by glue.

[0097] In order to facilitate the connection between the displacement assembly 524 and the light receiving cavity 520, a displacement assembly connector 525 is provided on the light receiving cavity 520, and the displacement assembly connector 525 is engaged and connected to the displacement assembly 524. In some embodiments, the displacement assembly connector 525 includes a first connecting plate 525a and a second connecting plate 525b, and the inner side surface of the first connecting plate 525a and the inner side surface of the second connecting plate 525b are respectively used to connect the outer wall of the prism cavity 524b, and then the prism cavity 524b is engaged and fixed between the first connecting plate 525a and the second connecting plate 525b. Among them, the first connecting plate 525a and the second connecting plate 525b can be two ridge structures formed on the outer wall of the light receiving cavity 520, and are usually formed integrally with the light receiving cavity 520. In order to ensure the shear strength of the first connecting plate 525a or the second connecting plate 525b, a supporting structure can be correspondingly set on the side of the first connecting plate 525a or the second connecting plate 525b, and the supporting area between the first connecting plate 525a or the second connecting plate 525b and the outer wall of the light receiving cavity 520 is correspondingly increased through the supporting structure.

[0098] Fig.13 Another cross-sectional view of a light receiving submodule at a light receiving cavity is provided for an embodiment of the present application. Figure 1 In some embodiments, Fig.13 As shown, an adapter connecting portion 511 is provided at the end of the second optical fiber adapter 510, and an adapter connecting hole 524e is provided on the prism cavity 524b, and the adapter connecting hole 524e is connected to the prism accommodating cavity 524d; the adapter connecting portion 511 is embedded in the adapter connecting hole 524e. Further, a lens 512 is also provided at the end of the second optical fiber adapter 510, and the lens 512 is used to collimate the signal light transmitted through the second optical fiber adapter 510.

[0099] like Fig.13 As shown, the displacement prism 524a is disposed in the prism accommodation cavity 524d, the prism cover plate 524c is sealed on the upper part of the edge of the prism accommodation cavity 524d, and the lower part of the edge of the prism accommodation cavity 524d forms a second through hole 524f, which is connected to the first through hole 522. Fig.13As shown, assuming that the optical axis of the signal light transmitted from the outside of the optical module to the second optical fiber adapter 511 is horizontal, the signal light with the horizontal optical axis is transmitted to the lens 512 of the second optical fiber adapter 510, and is collimated by the lens 512 and transmitted to the first reflection surface of the displacement prism 524a; the first reflection occurs at the first reflection surface of the displacement prism 524a, and the optical axis of the signal light is converted from horizontal to vertical; the signal light with the vertical optical axis is transmitted to the second reflection surface of the displacement prism 524a, and the second reflection occurs at the second reflection surface of the displacement prism 524a, and the optical axis of the signal light is converted from vertical to horizontal; the signal light with the horizontal optical axis is transmitted to the first through hole 522 through the second through hole 524f again, and the light-transmitting plane light window 523 is transmitted to the light receiving cavity 520. Furthermore, in the embodiment of the present application, the displacement prism 524a is used to ensure the direction of the optical axis of the signal light while realizing the adjustment of the height of the optical axis of the signal light, thereby facilitating the realization of the structure of stacking the optical transmitting component 400 and the optical receiving component 500 up and down.

[0100] Fig.14 Another cross-sectional view of a light receiving submodule at a light receiving cavity is provided for an embodiment of the present application. Figure 2 .like Fig.14 As shown, a support protrusion 524e-1 is provided in the adapter connection hole 524e, and the support protrusion 524e-1 is used to support the end surface of the contact adapter connection part 511; the support protrusion 524e-1 and the side wall of the adapter connection hole 524e form a connection groove 524e-2. On the one hand, the connection groove 524e-2 is provided to facilitate the processing and forming of the support protrusion 524e-1, such as facilitating the backing of the tool when turning the support protrusion 524e-1; on the other hand, when the second optical fiber adapter 510 is glued to the prism cavity 524b, the excess glue can flow into the connection groove 524e-2, thereby preventing the glue from affecting the lens 512, etc.

[0101] Fig.15 A schematic diagram of a light receiving cavity is provided for the embodiment of the present application. Figure 1 .like Fig.15 As shown, a support structure 525c is disposed on the side of the second connecting plate 525b, and the support structure 525c is used to increase the shear strength of the second connecting plate 525b and ensure the connection strength between the prism cavity 524b and the light receiving cavity 520.

[0102] like Fig.15As shown, the cavity (light receiving cavity) includes a bottom plate and a side plate connected around the bottom plate, thereby forming an opening at the top, and the bottom plate and the side plate surround to form a cavity structure for accommodating optical devices and electrical devices in the light receiving module 500. Among them, the upper surface of the cavity side plate forms a first step surface 526ab and a second step surface 526ac, and a cover plate fixing glue groove 526a is provided between the first step surface 526ab and the second step surface 526ac; the first step surface 526ab is relatively lower than the second step surface 526ac; the upper surface of the cavity side wall also includes a third step surface 526b, the third step surface 526b and the bottom surface of the cover plate fixing glue groove 526a are in the same plane, the first step surface is provided with a fracture 526ab, and the third step surface 526b is located in the fracture 526ab of the first step surface.

[0103] The cover plate is covered at the opening to form a receiving cavity with the cavity; the cover plate abuts against the first step surface to cover the opening; the cover plate fixing glue groove is filled with adhesive material to bond the cover plate, and the adhesive material can be glue.

[0104] The cover plate covers the cover plate fixing rubber groove, or the cover plate is flush with the edge of the first step surface and does not cover the cover plate fixing rubber groove;

[0105] like Fig.15 As shown, a cover plate fixing glue groove 526a is provided on the upper surface of the side plate of the light receiving cavity 520, and then the cover plate 520a can be fixedly connected to the light receiving cavity 520 by glue.

[0106] Optionally, the cover plate fixing glue groove 526a forms a closed loop structure at the top of the side plate of the light receiving cavity 520, thereby increasing the adhesive area of ​​the cover plate 520a at the top of the side plate of the light receiving cavity 520, and fully ensuring the packaging reliability of the cover plate 520a and the top of the side plate of the light receiving cavity 520. Further, a third step surface 526b is also provided at the top of the side plate of the light receiving cavity 520, and the third step surface 526b is provided at the top edge of the side plate of the light receiving cavity 520, and the third step surface 526b is connected to the cover plate fixing glue groove 526a. When the cover plate 520a and the light receiving cavity 520 need to be reworked after the light receiving cavity 520 is packaged, the cover plate 520a can be disassembled from the light receiving cavity 520 through the third step surface 526b, thereby realizing the removal of the cover plate 520a without damaging the cover plate 520a or the light receiving cavity 520, thereby reducing the difficulty and cost of rework.

[0107] In some embodiments, Fig.15 As shown, a lens mounting column 527 is disposed on the bottom plate of the light receiving cavity 520 . Fig.16 A schematic diagram of a light receiving cavity is provided for the embodiment of the present application. Figure 2 .like Fig.15 and 16As shown, the lens mounting column 527 is a straight prism structure, such as a triangular prism structure; the lens mounting column 527 includes a first lens supporting surface 527a and a second lens supporting surface 527b, and there is an angle between the first lens supporting surface 527a and the second lens supporting surface 527b that satisfies the installation setting of the first lens 531 and the second lens 532; the first lens supporting surface 527a is used to limit and fix the first lens 531, and the second lens supporting surface 527b is used to limit and fix the second lens 532. In this embodiment, the lens mounting column 527 including the first lens supporting surface 527a and the second lens supporting surface 527b is provided to facilitate the passive coupling installation of the first lens 531 and the second lens 532, and to improve the installation efficiency and installation accuracy of the first lens 531 and the second lens 532.

[0108] Further, in the embodiment of the application, a lens groove 527c is further provided on the bottom plate of the light receiving cavity 520, and the lens groove 527c is provided on the side of the first lens supporting surface 527a and the second lens supporting surface 527b of the lens mounting column 527, and contacts the first lens supporting surface 527a and the second lens supporting surface 527b. On the one hand, the lens groove 527c facilitates the processing and forming of the first lens supporting surface 527a and the second lens supporting surface 527b on the lens mounting column 527, such as facilitating the tool withdrawal during the lathe processing of the lens mounting column 527; on the other hand, it ensures that the first lens 531 and the second lens 532 are fully in contact with the first lens supporting surface 527a and the second lens supporting surface 527b respectively; on the other hand, when the first lens 531 and the second lens 532 are glued to the bottom plate of the light receiving cavity 520, the excess glue can flow into the lens groove 527c, thereby preventing the glue from affecting the installation accuracy of the first lens 531 and the second lens 532.

[0109] In some embodiments, Fig.15 and 16 As shown, a demultiplexing assembly (DeMUX) mounting column 502 is also provided on the bottom plate of the optical receiving cavity 520, and is a straight prism structure, such as a quadrangular prism structure; the DeMUX mounting column 502 includes a first DeMUX mounting surface 502a and a second DeMUX mounting surface 502b, and the first DeMUX mounting surface 502a is parallel to the first DeMUX mounting surface 502b; the first DeMUX mounting surface 502a is used for limiting and fixing the first DeMUX 540, and the second DeMUX mounting surface 502b is used for limiting and fixing the second DeMUX 550. In this embodiment, the DeMUX mounting column 502 including the first DeMUX mounting surface 502a and the second DeMUX mounting surface 502b is provided to facilitate the passive coupling installation of the first DeMUX 540 and the second DeMUX 550, and to improve the installation efficiency and installation accuracy of the first DeMUX 540 and the second DeMUX 550.

[0110] Furthermore, in the application embodiment, a first DeMUX groove 502c is provided on the side of the first DeMUX mounting surface 502a, and the first DeMUX groove 502c contacts the first DeMUX mounting surface 502a; a second DeMUX groove 502d is provided on the side of the second DeMUX mounting surface 502b, and the second DeMUX groove 502d contacts the second DeMUX mounting surface 502b. On the one hand, the first DeMUX groove 502c and the second DeMUX groove 502d facilitate the processing and forming of the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b on the DeMUX mounting column 502, such as facilitating the tool withdrawal during the turning processing of the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b; on the other hand, it avoids the occurrence of arc chamfers at the contact points between the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b and the bottom plate of the light receiving cavity 520, which may cause the first DeMUX 540 and the second DeMUX 540 to be formed. X550 cannot fully contact the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b respectively, which affects the installation accuracy of the first DeMUX540 and the second DeMUX550; on the other hand, when the first DeMUX540 and the second DeMUX550 are glued to the bottom plate DeMUX mounting column 502 of the optical receiving cavity 520, excess glue can flow into the first DeMUX groove 502c and the second DeMUX groove 502d, thereby avoiding the glue affecting the installation accuracy of the first DeMUX540 and the second DeMUX550.

[0111] In some embodiments, Fig.15 As shown, a first DeMUX fixing glue groove 528 and a second DeMUX fixing glue groove 529 are also provided on the bottom plate of the light receiving cavity 520, and the first DeMUX fixing glue groove 528 and the second DeMUX fixing glue groove 529 are used to hold glue. For example, when it is necessary to fix the first DeMUX 540 and the second DeMUX 550, glue is dispensed in the first DeMUX fixing glue groove 528 and the second DeMUX fixing glue groove 529, and then the first DeMUX 540 and the second DeMUX 550 are respectively installed and placed on the first DeMUX fixing glue groove 528 and the second DeMUX fixing glue groove 529, and the glue solidifies to complete the fixation of the first DeMUX 540 and the second DeMUX 550 on the bottom plate.

[0112] Further, if Fig.16As shown, the first DeMUX fixed glue groove 528 includes a first glue dispensing groove 528a and a first glue overflow groove 528b, which can be generally formed by sinking the top surface of the bottom plate of the light receiving cavity 520, and the first glue dispensing groove 528a and the first glue overflow groove 528b are separated by a side wall. Optionally, the first glue dispensing groove 528a is a circular structure, and the first glue overflow groove 528b is a circular ring structure surrounding the side of the first glue dispensing groove 528a, but the present application is not limited to this structural form. In specific use, glue is applied to the first glue dispensing groove 528a. The glue application should be sufficient, and the first glue dispensing groove 528a will usually overflow. The first DeMUX540 is placed on top of the first glue dispensing groove 528a, and the excess glue in the first glue dispensing groove 528a will overflow to the first overflow glue groove 528b, thereby effectively preventing insufficient glue from affecting the firmness of the first DeMUX540, and preventing excessive glue from overflowing everywhere and causing insufficient installation accuracy of the first DeMUX540.

[0113] Correspondingly, such as Fig.16 As shown, the second DeMUX fixed glue groove 529 includes a second glue dispensing groove 529a and a second glue overflow groove 529b. The second glue dispensing groove 529a and the second glue overflow groove 529b can usually be formed by sinking the top surface of the bottom plate of the light receiving cavity 520, and the second glue dispensing groove 529a and the second glue overflow groove 529b are separated by the side wall. Optionally, the second glue dispensing groove 529a is a circular structure, and the second glue overflow groove 529b is a circular ring structure surrounding the side of the second glue dispensing groove 529a, but the present application is not limited to this structural form. The specific use of the second DeMUX fixed glue groove 529 can refer to the first DeMUX fixed glue groove 528.

[0114] In some embodiments, Fig.15As shown, the bottom plate of the light receiving cavity 520 is also provided with a first prism mounting column 503a, a second prism mounting column 503b and a third prism mounting column 503c, and the first prism mounting column 503a, the second prism mounting column 503b and the third prism mounting column 503c are arranged at intervals. In which: on the one hand, the first prism mounting column 503a, the second prism mounting column 503b and the third prism mounting column 503c are used for the installation and positioning of the first reflecting prism 561 and the second reflecting prism 571; on the other hand, the first prism mounting column 503a and the second prism mounting column 503b are used to fix the side of the first reflecting prism 561, and the second prism mounting column 503b and the third prism mounting column 503c are used to fix the side of the second reflecting prism 571. Optionally, a first reflecting prism mounting surface 503d is set between the first prism mounting column 503a and the second prism mounting column 503b, and the first reflecting prism mounting surface 503d is used to support the bottom surface of the first reflecting prism 561; a second reflecting prism mounting surface 503e is set between the second prism mounting column 503b and the third prism mounting column 503c, and the second reflecting prism mounting surface 503e is used to support the bottom surface of the second reflecting prism 571.

[0115] In some embodiments, Fig.15 As shown, the bottom plate of the light receiving cavity 520 includes a first bottom surface 501a and a second bottom surface 501b, and a step surface 501c is formed between the first bottom surface 501a and the second bottom surface 501b. The first bottom surface 501a is provided with a lens mounting column 527, a DeMUX mounting column 502, a first DeMUX fixing adhesive groove 528 and a second DeMUX fixing adhesive groove 529, etc., and the second bottom surface 501b is used to carry a flexible circuit board extending into the light receiving cavity 520. The step surface 501c realizes the division of the height of the bottom surface of the light receiving cavity 520; on the one hand, the step surface 501c is formed between the first bottom surface 501a and the second bottom surface 501b, and the first bottom surface 501a can relatively raise the height of the first reflecting prism mounting surface 503d and the second reflecting prism mounting surface 503e, thereby raising the height of the first reflecting prism 561 and the second reflecting prism 571, so as to facilitate the assembly of the first reflecting prism 561 and the second reflecting prism 571 with the first light receiving component 580 and the second light receiving component 590; on the other hand, the step surface 501c can also be used to limit the flexible circuit board extending into the light receiving cavity 520.

[0116] Fig.17 A diagram of the assembly and use state of a light receiving cavity provided in an embodiment of the present application, Fig.17 The figure shows the use status of the lens mounting column 527, the DeMUX mounting column 502, the first DeMUX fixing glue groove 528 and the second DeMUX fixing glue groove 529. Fig.17As shown, the side surface of the first lens 531 is in contact with the first lens supporting surface 527a of the lens mounting column 527, and the side surface of the second lens 532 is in contact with the second lens supporting surface 527b of the lens mounting column 527; the side surface of the first DeMUX 540 is in contact with the first DeMUX mounting surface 502a of the DeMUX mounting column 502, and the first DeMUX 540 covers the first DeMUX fixing glue groove 528; the side surface of the second DeMUX 550 is in contact with the second DeMUX mounting surface 502b of the DeMUX mounting column 502, and the second DeMUX 550 covers the second DeMUX fixing glue groove 529; the first reflecting prism 561 is clamped between the first prism mounting column 503a and the second prism mounting column 503b, and the second reflecting prism 571 is clamped between the second prism mounting column 503b and the third prism mounting column 503c.

[0117] Fig.18 A cross-sectional view of an assembled and used state of a light receiving cavity provided in an embodiment of the present application. Fig.18 As shown, when the side of the second lens 532 is fixed against the second lens support surface 527b of the lens mounting column 527, the second lens 532 covers the lens groove 527c; when the first DeMUX 540 is assembled to the bottom plate of the light receiving cavity 520, the first DeMUX 540 covers the first glue dispensing groove 528a and the first glue overflow groove 528b of the first DeMUX fixing glue groove 528; the first bottom surface 501a raises the first DeMUX 540, so that there is a certain height difference between the bottom of the first DeMUX 540 and the second bottom surface 501b, which is convenient for the installation and setting of the device in the first light receiving assembly 580; the end surface of the flexible circuit board contacts the step surface 501c, and the step surface 501c is used to limit the end surface of the flexible circuit board. In the embodiment of the present application, the flexible circuit board extending into the light receiving cavity 520 can be fixed to the second bottom surface 501b by thermal conductive glue or the like.

[0118] Fig.19 A cross-sectional view of a light receiving cavity provided in an embodiment of the present application. Fig.19 As shown, a cover plate fixing glue groove 526a is provided on the top of the light receiving cavity 520, and a cover plate protrusion 520b is provided at the edge of the cover plate 520a and the corresponding position of the cover plate fixing glue groove 526a, and the cover plate protrusion 520b is arranged in the cover plate fixing glue groove 526a. In this way, when glue is used to fix the light receiving cavity 520 and the cover plate 520a, the cover plate fixing glue groove 526a cooperates with the cover plate protrusion 520b to increase the glue area, thereby enabling the cover plate 520a and the light receiving cavity 520 to be fully sealed.

[0119] Further, if Fig.19As shown, a third through hole 526c is further provided on the side wall of the light receiving cavity 520, and the third through hole 526c is connected to the inner cavity of the light receiving cavity 520; a sealing plug 526d is provided in the third through hole 526c, and the sealing plug 526d is used to seal the third through hole 526c. During the production process of the light receiving component 500, heating and baking are usually required, and the third through hole 526c is provided to facilitate air circulation in the light receiving cavity 520. After the heating and baking is completed, the sealing plug 526d is used to seal the third through hole 526c to prevent the external air of the light receiving cavity 520 from entering the inner cavity of the light receiving cavity 520 through the third through hole 526c.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that: include An upper shell body, covering the lower shell body; A circuit board is located between the upper housing and the lower housing; An optical sub-module, located between the upper housing and the lower housing, and electrically connected to the circuit board; The optical submodule comprises: A cavity, comprising a bottom surface and a side wall connected to the bottom surface, thereby forming an upper opening; A cover plate, which has no protruding structure, covers the opening and forms a receiving cavity with the cavity; An optical chip, disposed in the accommodating cavity, capable of emitting or receiving light; An optical component, disposed in the accommodating cavity and capable of transmitting light to the optical chip; The upper surface of the side wall of the cavity forms a first step surface and a second step surface, a cover plate fixing rubber groove is provided between the first step surface and the second step surface; the first step surface is relatively lower than the second step surface; The cover plate abuts against the first step surface and covers the cover plate fixing rubber groove; or the cover plate is flush with the edge of the first step surface and does not cover the cover plate fixing rubber groove to cover the opening; The cover plate fixing adhesive groove is filled with adhesive material to bond the cover plate; The third step surface is located on the upper surface of the side wall of the cavity and is in the same plane as the bottom surface of the cover plate fixing glue groove, and the third step surface is not covered with glue.

2. The optical module according to claim 1, characterized in that: The second step surface is provided with a fracture, and the third step surface is located in the fracture of the second step surface.

Images