Optical module cold plate type liquid cooling assembly and network switching equipment

Abstract

The utility model provides an optical module cold plate type liquid cooling assembly and network switching equipment, and relates to the technical field of network equipment heat dissipation. The optical module cold plate type liquid cooling assembly comprises a cold plate main body which extends along a first direction and comprises a first side and a second side which are opposite to each other; the floating heat conduction blocks are connected to the first side of the cold plate body and can float in the second direction perpendicular to the first direction; the floating heat conduction blocks are arranged at intervals in the first direction and are used for making contact with the optical modules sequentially arranged in the first direction. The heat conduction pad is arranged between the cold plate main body and the floating heat conduction block and is in contact with the cold plate main body and the floating heat conduction block; and the at least one liquid cooling pipe is arranged on the second side of the cold plate main body. The optical module cold plate type liquid cooling assembly is in close contact with the optical module inserted into the connector of the network switching equipment, heat generated during operation of the optical module can be smoothly and timely led out, the heat dissipation efficiency is high, and the heat dissipation effect is good.

Description

Technical Field

[0001] This application relates to the technical field of network device heat dissipation, and particularly to a cold plate liquid cooling component for an optical module and a network switching device. Background Art

[0002] An optical module is an optoelectronic device that performs optoelectronic and electro-optical conversions and is an important component of 4G / 5G communication devices and data centers. With the continuous growth of communication speed and load, the power consumption and installation quantity of optical modules are also increasing continuously, making the heat dissipation of optical modules particularly important.

[0003] In related technologies, air cooling is usually used to dissipate heat from optical modules. By installing the optical module in an optical module connector and opening a window at the top of the optical module connector, the optical module is partially in contact with the radiator. Heat is conducted from the optical module to the heat dissipation fins of the radiator, and the heat is dissipated to the external environment by the air flow flowing through the surface of the heat dissipation fins.

[0004] However, when dissipating heat from optical modules by air cooling, the heat dissipation efficiency is low and the heat dissipation effect is poor. Summary of the Utility Model

[0005] This application provides a cold plate liquid cooling component for an optical module and a network switching device. The cold plate liquid cooling component for an optical module is in close contact with the optical module inserted into the connector of the network switching device, and can smoothly and timely export the heat generated by the optical module during operation, with high heat dissipation efficiency and good heat dissipation effect.

[0006] One aspect of this application provides a cold plate liquid cooling component for an optical module, including:

[0007] A cold plate main body extending along a first direction, including a first side and a second side facing away from each other;

[0008] A plurality of floating heat conduction blocks connected to the first side of the cold plate main body and floating along a second direction perpendicular to the first direction; each floating heat conduction block is arranged at intervals along the first direction and is used to contact each optical module arranged in sequence along the first direction;

[0009] A heat conduction pad arranged between the cold plate main body and the floating heat conduction block and in contact with the cold plate main body and the floating heat conduction block;

[0010] At least one liquid cooling pipe arranged on the second side of the cold plate main body.

[0011] The cold plate liquid cooling component for the optical module provided by this application includes a cold plate main body, a plurality of floating heat conduction blocks, heat conduction pads, and at least one liquid cooling pipe. The cold plate main body extends along a first direction. Each floating heat conduction block is arranged on the first side of the cold plate main body and is spaced along the first direction. The heat conduction pads are attached between the floating heat conduction blocks and the cold plate main body. The liquid cooling pipe is arranged on the second side of the cold plate main body. The heat generated by the optical module is conducted to the cold plate main body through the floating heat conduction blocks and the heat conduction pads by contacting each floating heat conduction block with each optical module, and the heat is taken away by the cooling liquid in the liquid cooling pipe to dissipate heat from the optical module. Among them, the floating heat conduction block can float along a second direction perpendicular to the first direction, and the heat conduction pad can deform as the floating heat conduction block moves and always closely adheres to the floating heat conduction block and the cold plate main body. In this way, on the basis of using the liquid cooling method to dissipate heat from the optical module, it can be ensured that the floating heat conduction block is always in close contact with the optical module, reducing the contact thermal resistance between the cold plate liquid cooling component for the optical module and the optical module, and improving the heat dissipation efficiency and heat dissipation effect.

[0012] In a possible implementation manner, the cold plate liquid cooling component for the optical module further includes:

[0013] An elastic member, connected between each floating heat conduction block and the cold plate main body, and can expand and contract along the second direction.

[0014] By arranging an elastic member between the floating heat conduction block and the cold plate main body, the floating heat conduction block is driven to float along the second direction by relying on the elastic member. The elastic force of the elastic member is large and the elastic deformation ability is strong, which can reliably drive the floating heat conduction block to move, and can increase the pressure between the floating heat conduction block and the optical module to ensure close contact between the floating heat conduction block and the optical module.

[0015] In a possible implementation manner, two elastic members are connected between the floating heat conduction block and the cold plate main body. The two elastic members are respectively located at both ends of the floating heat conduction block, and the heat conduction pad is located between the two elastic members.

[0016] By connecting two elastic members at both ends of the floating heat conduction block, the elastic force generated by the elastic members on the floating heat conduction block is large and balanced, which can ensure good contact between the floating heat conduction block and the cold plate main body. Moreover, by arranging the heat conduction pad between the two elastic members, it can ensure that the heat conduction pad occupies sufficient space and the main area of the heat conduction pad adheres to the floating heat conduction block to improve the heat conduction efficiency and heat conduction effect of the heat conduction pad.

[0017] In a possible implementation manner, the cold plate main body includes:

[0018] A main support plate, extending along the first direction; the floating heat conduction block is located on the first side of the support plate, and the liquid cooling pipe is located on the second side of the main support plate;

[0019] The stop assembly is connected to the outer side of the main support plate and jointly encloses a floating groove with the main support plate; the floating grooves are located on both sides of the main support plate, and the openings of the floating grooves on both sides face each other, and both ends of the floating heat conducting block are inserted into the floating grooves on both sides.

[0020] By arranging the stop assembly and the main support plate to jointly form the cold plate body, the floating groove formed therebetween forms the installation basis for the floating heat conducting block, the floating heat conducting block can be fixed on the cold plate body, and the moving stroke of the floating heat conducting block can be limited. Moreover, it is convenient for the processing design of the main support plate and the assembly of the liquid cooling plate, and the costs of processes such as processing and assembling the liquid cooling plate can be reduced.

[0021] In a possible implementation manner, the stop assembly includes stop members connected to the opposite sides of the main support plate, and the second side of the main support plate is exposed.

[0022] By arranging stop members on the opposite sides of the main support plate, the two stop members and the main support plate jointly enclose the floating grooves on both sides to fix and limit the floating heat conducting block. Moreover, by exposing the second side of the main support plate, it is convenient for the installation of the liquid cooling pipe, and the overall heat conduction path of the liquid cooling assembly is short and the heat conduction efficiency is high.

[0023] In a possible implementation manner, the stop member includes a main body portion and a stop portion connected to each other, the main body portion is connected to the main support plate, and the stop portion blocks the end of the floating heat conducting block.

[0024] In a possible implementation manner, a plurality of stop members are arranged at intervals along the first direction, and each stop member stops at least one floating heat conducting block.

[0025] In a possible implementation manner, the number of the liquid cooling pipes is one, and the liquid cooling pipe penetrates through both ends of the cold plate body along the first direction.

[0026] In a possible implementation manner, the liquid cooling pipe extends from one end of the cold plate body to the other end of the liquid cooling plate along a wavy line.

[0027] Another aspect of the present application provides a network switching device, including:

[0028] At least one board card;

[0029] At least one connector group, each connector group includes a plurality of connectors arranged in sequence along the first direction, and each connector is electrically connected to the board card; wherein, each connector in at least one connector group has a contact window, and the contact window is located on the installation side of the connector group;

[0030] At least one optical module cold plate type liquid cooling assembly as described above, the optical module cold plate type liquid cooling assembly is arranged on the installation side of the connector group, and each floating heat conducting block of the optical module cold plate type liquid cooling assembly is used to pass through the contact window and contact with the optical module inserted in the connector.

[0031] The network switching device provided by this application includes at least one board, at least one connector group, and at least one cold plate type liquid cooling component for optical modules. Each connector in the connector group is arranged in sequence along a first direction and is electrically connected to the board. Each connector in at least one connector group has a contact window on the installation side, and the cold plate type liquid cooling component for optical modules is arranged on the installation side of the connector group. The cold plate type liquid cooling component for optical modules includes a cold plate body, a plurality of floating heat conducting blocks, a heat conducting pad, and at least one liquid cooling pipe. The cold plate body extends along the first direction. Each floating heat conducting block is arranged on the first side of the cold plate body and is spaced along the first direction. The heat conducting pad is attached between the floating heat conducting block and the cold plate body. The liquid cooling pipe is arranged on the second side of the cold plate body. By passing each floating heat conducting block through the contact window of each connector to contact each optical module, the heat generated by the optical module is conducted to the cold plate body through the floating heat conducting block and the heat conducting pad, and the heat is taken away by the coolant in the liquid cooling pipe to dissipate heat from the optical module. Among them, the floating heat conducting block can float along a second direction perpendicular to the first direction, and the heat conducting pad can deform as the floating heat conducting block moves and always closely adheres to the floating heat conducting block and the cold plate body. In this way, on the basis of using liquid cooling to dissipate heat from the optical module, it can be ensured that the floating heat conducting block always closely contacts the optical module, reducing the contact thermal resistance between the cold plate type liquid cooling component for optical modules and the optical module, and improving the heat dissipation efficiency and heat dissipation effect.

[0032] In a possible implementation manner, at least two connector groups are spaced along a second direction perpendicular to the first direction. Each connector in each connector group has a contact window, and each connector group is correspondingly provided with a cold plate type liquid cooling component for optical modules.

[0033] When at least two connector groups are spaced along the second direction, by providing a cold plate type liquid cooling component for each connector group and providing a contact window for each connector in each connector group, the liquid cooling component passes through the contact windows of the connectors in the corresponding connector group and contacts the optical modules inserted in the connectors. In this way, the heat of all optical modules can be taken away in a timely and rapid manner, and each optical module has a good heat dissipation effect.

[0034] In a possible implementation manner, the number of boards is one. The connector group includes two inner connector groups and two outer connector groups. The two inner connector groups are respectively connected to the two side surfaces of the board. The two outer connector groups are respectively located on the side of the two inner connector groups away from the board, and both outer connector groups are electrically connected to the board;

[0035] The number of cold plate type liquid cooling components for optical modules is four, and each cold plate type liquid cooling component for optical modules is respectively arranged on the installation side of each connector group.

[0036] By electrically connecting four connector groups to a board, the number of connectors provided in the optoelectronic connection module is relatively large, and the number of optical modules that can be plugged in is relatively large, which can improve the capacity and transmission power of the optoelectronic connection module. Moreover, since there is only one board, the control mode of the optoelectronic connection module is simpler and the signal transmission efficiency is higher.

[0037] In a possible implementation manner, the installation side of each connector group is the side of the connector group facing away from the board, and the optoelectronic module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies;

[0038] The two inner liquid cooling assemblies are respectively located between the inner connector group and the outer connector group on each side, and the inner liquid cooling plate is used to contact the optical modules inserted in the inner connector group; the two outer liquid cooling assemblies are respectively located on the side of the outer connector group on each side facing away from the board, and the outer liquid cooling assembly is used to contact the optical modules inserted in the outer connector group.

[0039] By taking the side of each connector group facing away from the board as the installation side of the connector group, the contact windows of each connector are all located on the side of the connector group facing away from the board, and each liquid cooling assembly is arranged on the side of the corresponding connector group facing away from the board, the board will not interfere with the contact windows of the connectors and the installation space of the liquid cooling assemblies, and it can ensure the stable contact between the liquid cooling assembly and the optical modules inserted in the connectors.

[0040] Moreover, the two inner liquid cooling assemblies are respectively clamped between the inner connector group and the outer connector group on each side, and the two outer liquid cooling assemblies are respectively located on the relatively outer sides of the outer connector groups on both sides. Each liquid cooling assembly generates a pressure towards the board, which can ensure the reliable contact between the liquid cooling assembly and the optical modules inserted in the connector group, and the pressures generated by the liquid cooling assemblies on both sides are balanced with each other, which can ensure the force balance of the entire optoelectronic connection module.

[0041] In a possible implementation manner, each connector of the outer connector group has a bracket, the bracket extends towards the board and is connected to the board, and the outer liquid cooling assembly covers at least a part of the bracket.

[0042] Each connector in the outer connector group is connected to the board through a bracket, and the bracket increases the surface area of each connector in the outer connector group. By making the outer liquid cooling assembly cover at least a part of the bracket, the heat conduction area of the outer liquid cooling assembly is larger, the heat dissipation efficiency is higher and the heat dissipation effect is better. Moreover, the contact area between the outer liquid cooling assembly and the outer connector group is larger, and the pressure of the outer liquid cooling assembly on the outer connector group is greater, which can improve the overall stability and reliability of the optoelectronic connection module.

[0043] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions, and the beneficial effects brought by the technical features of these technical solutions, other technical problems that can be solved by the network switching device provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0045] Figure 1 Structural schematic diagram of the network switching device provided by the embodiments of the present application;

[0046] Figure 2 For Figure 1 exploded view of the network switching device in

[0047] Figure 3 For Figure 1 partial structural diagram of the network switching device in

[0048] Figure 4 Structural schematic diagram of the optical and electrical connection module provided by the embodiments of the present application;

[0049] Figure 5 Structural schematic diagram of the optical and electrical connection module provided by the embodiments of the present application after removing the mounting bracket;

[0050] Figure 6 For Figure 5 exploded view of the optical and electrical connection module in

[0051] Figure 7 For Figure 5 another exploded view of the optical and electrical connection module in

[0052] Figure 8 Structural schematic diagram of an outer layer liquid cooling component provided by the embodiments of the present application from one perspective;

[0053] Figure 9 For Figure 8 structural schematic diagram of the outer layer liquid cooling component in

[0054] Figure 10 For Figure 8 partial sectional view of the outer layer liquid cooling component in

[0055] Figure 11 It is a schematic structural diagram of an inner liquid cooling component provided by an embodiment of the present application from a perspective;

[0056] Figure 12 It is Figure 11 a schematic structural diagram of another perspective of the inner liquid cooling component in ;

[0057] Figure 13 It is Figure 11 a partial sectional view structure diagram of the inner liquid cooling component in .

[0058] Explanation of the reference numerals:

[0059] 10 - Network switching device;

[0060] 100 - Chassis;

[0061] 110 - Installation port;

[0062] 200 - Optoelectronic connection module;

[0063] 210 - Circuit board; 220 - Connector group; 220a - Inner connector group; 220b - Outer connector group; 230 - Liquid cooling component; 230a - Inner liquid cooling component; 230b - Outer liquid cooling component; 240 - Mounting rack;

[0064] 221 - Connector; 231 - Liquid cooling pipe; 232 - Cold plate main body; 233 - Floating heat conduction block; 234 - Heat conduction pad; 235 - Elastic member; 241 - Main frame; 242 - Front frame;

[0065] 2211 - Contact window; 2212 - Bracket; 2321 - Main support plate; 2322 - Stopping component; 2322a - Stopping piece; 2323 - Floating groove; 2421 - Holding part;

[0066] 23221 - Main body part; 23222 - Stopping part;

[0067] 300 - Control module;

[0068] 310 - Control board; 320 - Baseboard Management Controller; 330 - Bus bar;

[0069] 400 - Heat dissipation module;

[0070] 410 - Fan. Specific embodiments

[0071] The terms used in the embodiment part of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0072] An optical module consists of optoelectronic devices, functional circuits, optical interfaces, etc., and is a device for optoelectronic and electro-optical conversion. The optical module includes a transmitting part and a receiving part. The transmitting end converts an electrical signal into an optical signal, and after being transmitted through an optical fiber, the receiving end then converts the optical signal back into an electrical signal.

[0073] As described in the related art, currently, the air-cooling method is usually adopted to dissipate heat from the optical module. Windows are opened at the top of the optical module connector set on the switch, so that the part of the optical module inserted into the optical module connector is in contact with the radiator locally, so that the heat of the optical module is conducted to the heat dissipation fins of the radiator, and the heat is dissipated to the external environment by the air flowing through the surface of the heat dissipation fins.

[0074] However, with the continuous increase in the power consumption and installation quantity of the optical module, the air-cooling method with the overall thermal resistance performance approaching the limit has gradually been unable to meet the heat dissipation requirements of the optical module. Moreover, since the optical module and the radiator are in a fixed cooperation mode and the contact area between the two is small, the thermal resistance between the optical module and the radiator is large, and there is a temperature rise phenomenon. In addition, when the number of optical modules is large and the installation space is relatively compact, especially for the optical modules arranged in multiple rows, the installation space of the radiator is limited, and the heat dissipation efficiency is low and the heat dissipation effect is poor.

[0075] In view of this, the embodiments of the present application provide an optical module cold plate liquid cooling assembly and a network switching device. The optical module cold plate liquid cooling assembly includes a cold plate main body, a plurality of floating heat conduction blocks, a heat conduction pad, and at least one liquid cooling tube. The cold plate main body extends along a first direction, and each floating heat conduction block is arranged on the first side of the cold plate main body and is spaced along the first direction. The heat conduction pad is attached between the floating heat conduction block and the cold plate main body, and the liquid cooling tube is arranged on the second side of the cold plate main body. The heat generated by the optical module is conducted to the cold plate main body through the floating heat conduction block and the heat conduction pad by contacting each floating heat conduction block with each optical module, and the heat is taken away by the coolant in the liquid cooling tube to dissipate heat from the optical module. Among them, the floating heat conduction block can float along a second direction perpendicular to the first direction, and the heat conduction pad can deform with the movement of the floating heat conduction block and always be in close contact with the floating heat conduction block and the cold plate main body. In this way, on the basis of using the liquid cooling method to dissipate heat from the optical module, it can be ensured that the floating heat conduction block is always in close contact with the optical module, reducing the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical module, and improving the heat dissipation efficiency and heat dissipation effect.

[0076] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0077] An embodiment of the present application provides a network switching device, which can be any type of switch, such as an access layer switch, an aggregation layer switch, or a core layer switch. Exemplarily, the network switching device can be a switch with a height dimension of 4U. Here, U is a unit representing the external dimension, 1U is equal to 4.445 cm, and 4U is equal to 17.78 cm. In addition, the network switching device in the embodiment of the present application can be applied to any scenario requiring a network system, for example, it can be applied to a data center.

[0078] Taking the network switching device as an aggregation layer switch applied to a data center as an example, the network switching device and the optical module cold plate liquid cooling component in the embodiment of the present application will be described in detail below.

[0079] Figure 1 It is a schematic structural diagram of the network switching device provided by the embodiment of the present application. Figure 2 is Figure 1 the exploded structural diagram of the network switching device in Figure 3 is Figure 1 a partial structural diagram of the network switching device in

[0080] Referring to Figure 1 and Figure 2 As shown, the network switching device 10 in the embodiment of the present application may include a chassis 100 and an optical and electrical connection module 200. The chassis 100 serves as an installation basis, and other components of the network switching device 10 can be installed on the chassis 100 to assemble the network switching device 10 into a whole through the chassis 100, facilitating the movement and placement of the network switching device 10 in the data center. The optical and electrical connection module 200 is installed on the chassis 100 and is used to connect an optical module (not shown in the figure) to the network switching device 10 to achieve data transmission between the network switching device 10 and other network devices (such as servers or transceivers).

[0081] Among them, the optical and electrical connection module 200 includes at least one board 210 and a plurality of connectors 221. The plurality of connectors 221 are all arranged on the surface of the board 210. The connectors 221 are used for the optical module to be plugged in to realize connecting the optical module to the network switching device 10. The board 210 serves as a bearing basis for the connectors 221, is used to fix the connectors 221, and also provides electrical signals for the connectors 221. One end of the connector 221 facing outside the chassis 100 is its interface end, and the optical module is inserted into the interface end of the connector 221 to realize the electrical connection between the optical module and the optical and electrical connection module 200.

[0082] On the board 210, there may be chips provided and electrical channels laid out. The electrical channels are electrically connected to the chips, and each connector 221 provided on the board 210 is electrically connected to the electrical channels. In this way, signals can be transmitted between the chips and each connector 221 through the electrical channels. When the optical module is inserted into the connector 221, signals can be transmitted between the optical module and the optical and electrical connection module 200.

[0083] Exemplarily, the optical and electrical connection module 200 may include a board 210, and the plurality of connectors 221 are all provided on the board 210, and the electrical channels connected to the plurality of connectors 221 are all laid out on the board 210. Or, the optical and electrical connection module 200 may include more than two boards 210, and the plurality of connectors 221 are respectively provided on each board 210, and the electrical channels connected to each connector 221 are respectively laid out on the corresponding board 210.

[0084] The board 210 may be a printed circuit board (Printed Circuit Board, abbreviated as PCB). A metal conductive layer may be laid out in the printed circuit board, and the metal conductive layer forms an electrical channel connecting between the chip and the connector 221. Among them, the metal conductive layer includes but is not limited to being formed by conductive materials such as copper, aluminum, copper alloy, and aluminum alloy. This embodiment does not make specific limitations on this.

[0085] Refer to Figure 2 As shown, in this embodiment, the optical and electrical connection module 200 can be configured as a Removable Switch Module (abbreviated as RSM). The optical and electrical connection module 200 as a whole can be used as an independent module and is installed in the chassis 100 in a detachable manner. With such a setting, the network switching device 10 can design a general chassis 100 and adapt to different types of optical and electrical connection modules 200. Different optical and electrical connection modules 200 can be replaced for the network switching device 10 according to different application scenarios, without the need to additionally design and produce other chassis 100, which can reduce the costs of designing, producing, testing, etc. of the chassis 100.

[0086] Among them, different types of optical and electrical connection modules 200 may refer to differences in the number, model, etc. of the connectors 221 of the optical and electrical connection module 200, and different optical and electrical connection modules 200 may have different transmission powers.

[0087] One end of the chassis 100 can be open, and an installation port 110 for the optical and electrical connection module 200 is formed at this end of the chassis 100. The optical and electrical connection module 200 can be installed in the chassis 100 through this installation port 110, and the interface ends of the connectors 221 on the optical and electrical connection module 200 are exposed outside the chassis 100, so as to facilitate the insertion of the optical module into the interface ends of the connectors 221. Taking the chassis 100 as a cuboid structure as an example, the installation port 110 of the chassis 100 can be located at one end in the length direction of the chassis 100, and the optical and electrical connection module 200 can be installed at one end in the length direction of the chassis 100.

[0088] Referring to Figure 3 As shown, the network switching device 10 may further include a control module 300, and the control module 300 can be arranged in the chassis 100. The optical and electrical connection module 200 can be electrically connected to the control module 300 to control the operation of the optical and electrical connection module 200 through the control module 300. The board 210 of the optical and electrical connection module 200 can be electrically connected to the control module 300, and the signal transmission between the control module 300 and each connector 221 is realized through the board 210. Among them, the control module 300 may include a control board 310 and devices such as a Baseboard Management Controller (BMC) 320 and a bus bar 330 arranged on the control board 310. The control board 310 is, for example, a printed circuit board.

[0089] In addition, the network switching device 10 may further include a heat dissipation module 400. The heat dissipation module 400 is mainly used to dissipate heat from the heat-generating components in the chassis 100, and can also be used to dissipate heat from the optical and electrical connection module 200 to ensure the normal operation of the network switching device 10. Exemplarily, the heat dissipation module 400 may include at least one fan 410. Figure 3 Taking the example shown in

[0090] The heat dissipation module 400 can be arranged close to the edge of the chassis 100, or in other words, the heat dissipation module 400 can be arranged on the side of the chassis 100. In this way, it is convenient for the heat dissipation module 400 to communicate with the outside to dissipate the heat of the network switching device 10 to the outside. And, since the heat dissipation module 400 is located in the edge area of the chassis 100, a relatively large space can be left inside the chassis 100, which is convenient for the layout setting inside the chassis 100. Exemplarily, the heat dissipation module 400 can be arranged opposite to the optical and electrical connection module 200, and the heat dissipation module 400 and the optical and electrical connection module 200 are respectively located at both ends of the chassis 100.

[0091] Figure 4 It is a schematic structural diagram of the optical and electrical connection module provided by the embodiment of the present application. Referring toFigure 4 As shown, in the optical and electrical connection module 200 of this embodiment, the connectors 221 are regularly arranged in the form of a connector group 220. The optical and electrical connection module 200 includes at least one connector group 220. Each connector group 220 includes a plurality of connectors 221 arranged in sequence along the first direction (the Y direction in the figure), and each connector 221 is electrically connected to the board 210. When the optical and electrical connection module 200 includes more than two connector groups 220, the connector groups 220 are arranged at intervals along the second direction (the Z direction in the figure), and the second direction is perpendicular to the first direction.

[0092] Taking the example that the optical and electrical connection module 200 is installed at one end of the length direction of the chassis 100, the first direction in which the connectors 221 in each connector group 220 are arranged in sequence can be the width direction of the chassis 100, and the second direction in which the connector groups 220 are arranged at intervals can be the height direction of the chassis 100.

[0093] When there are multiple connector groups 220 arranged at intervals along the second direction in the optical and electrical connection module 200, only one board 210 can be provided in the optical and electrical connection module 200, and all the connector groups 220 are connected to this board 210; or, two or more boards 210 can also be provided in the optical and electrical connection module 200, and all the connector groups 220 are respectively connected to different boards 210.

[0094] Continue to refer to Figure 4 As shown, in order for the optical and electrical connection module 200 to form an independent detachable module, the optical and electrical connection module 200 can further include a mounting frame 240. The aforementioned board 210 can be fixedly connected to the mounting frame 240, and the board 210, the connectors 221 on the board 210, and the mounting frame 240 are jointly assembled into the optical and electrical connection module 200. By providing the mounting frame 240, the optical and electrical connection module 200 can be assembled into an independent structure. Especially when the optical and electrical connection module 200 includes multiple boards 210, the mounting frame 240 can assemble the multiple boards 210 into a whole.

[0095] Moreover, the assembly of the optical and electrical connection module 200 and the chassis 100 can also be realized through the mounting frame 240. In other words, by connecting the mounting frame 240 to the mounting port 110 of the chassis 100, the optical and electrical connection module 200 is installed on the chassis 100 to assemble and form the network switching device 10.

[0096] Exemplarily, a holding portion 2421 can be provided on the mounting frame 240. The holding portion 2421 protrudes, for example, on the surface of the optical and electrical connection module 200 facing away from the inside of the chassis 100. The operator can hold the holding portion 2421 on the mounting frame 240 to move the optical and electrical connection module 200, so as to facilitate the installation and disassembly of the optical and electrical connection module 200 on the chassis 100.

[0097] For example, the mounting bracket 240 may include a main frame 241 and a front frame 242. The main frame 241 may be provided corresponding to the board 210, and the board 210 may be fixedly connected to the main frame 241. When the optoelectronic connection module 200 includes a plurality of boards 210, the main frame 241 fixes the plurality of boards 210 together to form an integral structure. The front frame 242 may be connected to a side of the main frame 241 facing away from the inside of the chassis 100, and the front frame 242 may be exposed in the mounting opening 110 of the chassis 100. The interface ends of the connectors 221 may extend out of the front end of the board 210 and be received in a mounting groove (not shown in the figure) formed on the front frame 242. The front frame 242 may be disposed in front of the board 210 to protect the board 210, and the front frame 242 surrounds the outer periphery of the interface ends of the connectors 221, which can shield and protect the interface ends of the connectors 221 and improve the appearance effect of the optoelectronic connection module 200. Among them, the holding portion 2421 may be provided on the front frame 242.

[0098] Figure 5 FIG. is a schematic structural diagram of the optoelectronic connection module provided by the embodiment of the present application after removing the mounting bracket. Figure 6 is Figure 5 an exploded structural diagram of the optoelectronic connection module in one perspective in Figure 7 is Figure 5 an exploded structural diagram of the optoelectronic connection module in another perspective in

[0099] Referring to Figure 5 shown, in order to enable the optical module to have a suitable operating temperature, on the basis that the heat dissipation module 400 is installed in the chassis 100, this embodiment also uses a liquid cooling method to dissipate heat from the optical module, so as to take away the heat generated by the optical module and maintain the operating temperature of the optical module within a suitable range. Using the liquid cooling method to dissipate heat from the optical module means that when the optical module is inserted into the connector 221 of the optoelectronic connection module 200, the coolant is used to take away the heat generated by the optical module to dissipate heat and cool down the optical module.

[0100] Specifically, the optoelectronic connection module 200 further includes at least one optical module cold plate liquid cooling component (hereinafter referred to as the liquid cooling component), and the liquid cooling component 230 is provided corresponding to the connector group 220 to dissipate heat from each connector 221 in the corresponding connector group 220 through the liquid cooling component 230. For the connector group 220 provided with the liquid cooling component 230, when the optical module is inserted into the connector 221 of the connector group 220, the liquid cooling component 230 can contact the optical module, and the heat generated by the optical module is conducted to the liquid cooling component 230, and the heat is taken away by the coolant flowing in the liquid cooling component 230 to dissipate heat from the optical module.

[0101] Among them, the liquid cooling component 230 is arranged on one side in the extending direction of the connector group 220, and the liquid cooling component 230 can extend along the extending direction of the connector group 220. When the connectors 221 in the connector group 220 are arranged in sequence in the first direction, it is equivalent to the connector group 220 extending in the first direction. At this time, the liquid cooling component 230 can also extend in the first direction. Taking the optoelectronic connection module 200 being arranged at one end in the length direction of the chassis 100 as an example, when the connector group 220 extends along the width direction of the chassis 100, the liquid cooling component 230 can also extend along the width direction of the chassis 100, and the liquid cooling component 230 is arranged on one side of the connector group 220 in the height direction of the chassis 100.

[0102] It should be noted that, in order to reserve sufficient installation space for the liquid cooling component 230 and ensure that the liquid cooling component 230 can be arranged on one side of the connector group 220, in this embodiment, the connectors 221 can be mounted on the board 210 along the board surface direction of the board 210. In other words, the extending direction of the connectors 221 can be parallel to the board surface of the board 210, and the plugging and unplugging direction of the optical module is parallel to the board surface of the board 210. In this way, the board 210 does not limit the space on both sides of the connector group 220, and there is sufficient space on the side of the connector group 220 to install the liquid cooling component 230.

[0103] For ease of description, in this embodiment, the side where the liquid cooling component 230 is located is defined as the installation side of the connector group 220. Refer to Figure 6 or Figure 7 As shown, for the connector group 220 provided with the liquid cooling component 230, in order to enable the liquid cooling component 230 to contact the optical module inserted into the connector 221, each connector 221 in the connector group 220 can have a contact window 2211. The contact window 2211 is located on the installation side of the connector group 220, and the liquid cooling component 230 passes through the contact windows 2211 of each connector 221 and contacts the optical module inserted in the connector 221.

[0104] When the optoelectronic connection module 200 has multiple connector groups 220, a liquid cooling component 230 can be provided corresponding to each connector group 220, and each liquid cooling component 230 contacts the optical module inserted in each connector group 220. In this way, all the optical modules inserted into the optoelectronic connection module 200 have the liquid cooling component 230 directly contacting them, and the heat of the optical module can be taken away in a timely and rapid manner, and each optical module has a good heat dissipation effect.

[0105] Specifically, when there are more than two connector groups 220 arranged at intervals along the second direction in the optical and electrical connection module 200, a liquid cooling component 230 is provided on the installation side of each connector group 220. Each connector 221 in each connector group 220 has a contact window 2211, and the contact window 2211 is located on the installation side of the connector group 220. The liquid cooling component 230 passes through the contact windows 2211 of the connectors 221 and contacts the optical modules inserted in the connectors 221.

[0106] Continue to refer to Figure 6 or Figure 7 , as a specific implementation manner, in the optical and electrical connection module 200, the number of the circuit boards 210 can be one, and the number of the connector groups 220 can be four. Among them, the four connector groups 220 can include two inner connector groups 220a and two outer connector groups 220b. The two inner connector groups 220a are respectively connected to the two side surfaces of the circuit board 210, and the two outer connector groups 220b are respectively located on one side of the two inner connector groups 220a away from the circuit board 210, and both of the two outer connector groups 220b are electrically connected to the circuit board 210.

[0107] By electrically connecting four connector groups 220 to one circuit board 210, a relatively large number of connectors 221 can be arranged in the optical and electrical connection module 200. The number of optical modules that can be plugged into the optical and electrical connection module 200 is relatively large, and the capacity and transmission power of the optical and electrical connection module 200 can be improved. Moreover, since there is only one circuit board 210, only by electrically connecting the circuit board 210 to the control module 300 in the chassis 100, the control module 300 can control the optical and electrical connection module 200. The control method is simple and the signal transmission efficiency is high.

[0108] Since the outer connector group 220b is located on the side of the inner connector group 220a away from the circuit board 210, in order to realize the connection between the outer connector group 220b and the circuit board 210, the outer connector group 220b can be connected to the circuit board 210 through a bracket 2212. Among them, each connector 221 in the outer connector group 220b has a bracket 2212. The bracket 2212 of the connector 221 extends towards the circuit board 210, and the connector 221 is connected to the circuit board 210 by relying on the bracket 2212.

[0109] Since the end of the connector 221 extending outside the board 210 is its interface end, in order to prevent the bracket 2212 from blocking the interface end of the connector 221, the bracket 2212 can be connected to the end of the connector 221 facing the board 210. At this time, when a liquid cooling component 230 is provided between the outer connector group 220b and the inner connector group 220a, the liquid cooling component 230 can be provided at the front end of the bracket 2212 of each connector 221 in the outer connector group 220b, so that the liquid cooling component 230 can correspond to the main body part of the connector 221 and ensure that the liquid cooling component 230 contacts the optical module inserted in the connector 221.

[0110] Corresponding to the connector group 220, the number of the liquid cooling components 230 can be four. Each liquid cooling component 230 is respectively provided on the installation side of each connector group 220, and the liquid cooling component 230 can be closely attached to the corresponding connector group 220, so that the liquid cooling component 230 can contact the optical module inserted in each connector 221 of the connector group 220. Among them, for the connector group 220 on one side of the board 210, there is a gap between the outer connector group 220b and the inner connector group 220a, so as to facilitate the setting of the liquid cooling component 230 between the outer connector group 220b and the inner connector group 220a.

[0111] In some examples, the installation side of each connector group 220 can be the side of the connector group 220 facing away from the board 210, that is to say, the contact windows 2211 on the connectors 221 in each connector group 220 are all located on the side of the connector group 220 facing away from the board 210.

[0112] Among them, the orientations of the contact windows 2211 on the connectors 221 of the two inner connector groups 220a are opposite to each other, and are all located on the side of the connector group 220 facing away from the board 210. In this way, the liquid cooling components 230 corresponding to the two inner connector groups 220a can be respectively provided on both sides of the board 210. The board 210 will not interfere with the liquid cooling components 230, and enough space can be reserved between the inner connector group 220a and the outer connector group 220b on the same side to set the liquid cooling components 230. Moreover, the board 210 will not interfere with the contact windows 2211 on the connectors 221 of the inner connector group 220a, and the contact windows 2211 are completely exposed on the side of the connector 221 facing away from the board 210, which can ensure the stable contact between the liquid cooling component 230 and the optical module inserted in the connector 221.

[0113] The orientations of the contact windows 2211 on the connectors 221 of the two outer connector groups 220b face away from each other. The contact windows 2211 on the connectors 221 of the outer connector group 220b have the same orientation as the contact windows 2211 on the connectors 221 of the inner connector group 220a on the same side. In this way, the liquid cooling assemblies 230 provided corresponding to the two outer connector groups 220b can be respectively arranged on the side of each outer connector group 220b away from the circuit board 210.

[0114] For ease of description, in this embodiment, the liquid cooling assembly 230 provided corresponding to the inner connector group 220a is defined as the inner liquid cooling assembly 230a, and the inner liquid cooling assembly 230a is located between the inner connector group 220a and the outer connector group 220b arranged on the same side. The liquid cooling assembly 230 provided corresponding to the outer connector group 220b is defined as the outer liquid cooling assembly 230b, and the outer liquid cooling assembly 230b is located on the side of the outer connector group 220b away from the inner connector group 220a on the same side.

[0115] With such an arrangement, the two inner liquid cooling assemblies 230a are respectively clamped between the inner connector groups 220a and the outer connector groups 220b on each side, and the two outer liquid cooling assemblies 230b are respectively located on the relatively outer sides of the outer connector groups 220b on both sides. The inner liquid cooling assembly 230a can be clamped between the inner connector group 220a and the outer connector group 220b on the same side, and the outer liquid cooling assembly 230b can be in close contact with the outer connector group 220b. The inner liquid cooling assembly 230a and the outer liquid cooling assembly 230b on the same side both generate pressures towards the circuit board 210, which can ensure reliable contact between the liquid cooling assembly 230 and the optical modules inserted in the corresponding connector group 220. Moreover, the pressures generated by the liquid cooling assemblies 230 on both sides are balanced with each other, which can ensure the force balance of the entire optical and electrical connection module 200 and improve the stability and reliability of the optical and electrical connection module 200.

[0116] Among them, when each connector 221 in the outer connector group 220b is connected to the board 210 through the bracket 2212, the outer liquid cooling component 230b can cover at least a part of the bracket 2212. Since the bracket 2212 is an additional part added to the connector 221, the bracket 2212 increases the surface area of each connector 221 in the outer connector group 220b. Therefore, the area of the outer liquid cooling component 230b can be larger than the area of the inner liquid cooling component 230a. In this way, the heat conduction area of the outer liquid cooling component 230b is larger, and the heat dissipation efficiency is higher and the heat dissipation effect is better. Moreover, for the outer liquid cooling component 230b arranged on the outermost layer, the contact area between the outer liquid cooling component 230b and the outer connector group 220b is larger, the pressure of the outer liquid cooling component 230b on the outer connector group 220b is also larger, the outer liquid cooling component 230b is in closer contact with the optical module inserted in the connector 221, and the overall stability and reliability of the optical and electrical connection module 200 are better.

[0117] The liquid cooling component 230 in the optical and electrical connection module 200 will be described in detail below.

[0118] Figure 8 It is a schematic structural diagram of an outer liquid cooling component provided by an embodiment of the present application from one perspective. Figure 9 is Figure 8 A schematic structural diagram of the outer liquid cooling component from another perspective in Figure 10 is Figure 8 A partial cross-sectional structural diagram of the outer liquid cooling component in

[0119] Combined with Figure 8 and Figure 9 As shown, the outer liquid cooling component 230b includes a liquid cooling plate and at least one liquid cooling tube 231. One side surface of the liquid cooling plate faces the corresponding outer connector group 220b, and this side surface of the liquid cooling plate is used to contact the optical modules inserted in the connectors 221 in the outer connector group 220b. The liquid cooling tube 231 is arranged on the other side surface of the liquid cooling plate, and the liquid cooling tube 231 is used to provide a flow space for the coolant. The heat generated by the optical module is conducted to the liquid cooling plate, the liquid cooling plate conducts the heat to the liquid cooling tube 231, and the coolant in the liquid cooling tube 231 exchanges heat with the liquid cooling plate, and the coolant absorbs the heat to achieve heat dissipation for the optical module.

[0120] Referring to Figure 9 As shown, in some embodiments, the outer liquid cooling component 230b may include one liquid cooling tube 231, and this liquid cooling tube 231 may extend along the first direction in which the liquid cooling plate extends and penetrate through both ends of the liquid cooling plate. In this way, the liquid cooling tube 231 passes through each area in the extending direction of the liquid cooling plate, and the heat of each area of the liquid cooling plate can be quickly conducted to the liquid cooling tube 231. The heat dissipation efficiency of the liquid cooling component 230 can be improved, and the heat dissipation uniformity of the liquid cooling component 230 can be ensured.

[0121] Exemplarily, in the first direction in which the liquid cooling plate extends, from one end of the liquid cooling plate to the other end, the liquid cooling tube 231 may extend along a wavy line. In this way, the extension length of the liquid cooling tube 231 on the liquid cooling plate is greater, and the liquid cooling tube 231 can uniformly cover the center and edge of the liquid cooling plate. The heat transfer efficiency and uniformity between the liquid cooling plate and the liquid cooling tube 231 are higher, and the heat dissipation efficiency and effect of the outer liquid cooling assembly 230b can be improved.

[0122] In other embodiments, the outer liquid cooling assembly 230b may include more than two liquid cooling tubes 231, and the liquid cooling tubes 231 may be arranged in sequence so that all the liquid cooling tubes 231 can cover each area in the first direction in which the liquid cooling plate extends, ensuring the heat dissipation effect of the outer liquid cooling assembly 230b.

[0123] Referring to Figure 10 As shown, the liquid cooling plate includes a cold plate main body 232, a plurality of floating heat conducting blocks 233 and a heat conducting pad 234. The cold plate main body 232 is the main supporting structure of the liquid cooling plate. The cold plate main body 232 extends along the first direction, that is, the extending direction of the connector group 220. The two sides in the thickness direction of the cold plate main body 232 are the first side and the second side respectively. The plurality of floating heat conducting blocks 233 are all arranged on the first side of the cold plate main body 232, and the floating heat conducting blocks 233 are arranged at intervals along the first direction. Each floating heat conducting block 233 corresponds to each connector 221 in the connector group 220. The floating heat conducting block 233 is used to pass through the contact window 2211 of the connector 221 and contact the optical module inserted in the connector 221. The heat conducting pad 234 is arranged between the cold plate main body 232 and the floating heat conducting block 233, and the two side surfaces of the heat conducting pad 234 are respectively in contact with the cold plate main body 232 and the floating heat conducting block 233. The liquid cooling tube 231 is arranged on the second side of the cold plate main body 232.

[0124] Among them, the floating heat conducting block 233 can float along the second direction, which is perpendicular to the aforementioned first direction, and the second direction can be the thickness direction of the liquid cooling plate. The heat conducting pad 234 arranged between the floating heat conducting block 233 and the cold plate main body 232 has elasticity, and the heat conducting pad 234 can be deformed as the floating heat conducting block 233 moves, so that the two sides of the heat conducting pad 234 are always in close contact with the cold plate main body 232 and the floating heat conducting block 233.

[0125] With such a setting, a large pressure is generated between the floating heat conducting block 233 and the optical module inserted in the connector 221, which can ensure the close contact between the floating heat conducting block 233 and the optical module, reduce the contact thermal resistance between the liquid cooling plate and the optical module, and improve the heat dissipation efficiency and effect of the liquid cooling assembly 230. Moreover, since the floating heat conducting block 233 can float up and down, the liquid cooling plate can match optical modules of different models and sizes, which can expand the application range of the liquid cooling assembly 230 and enhance the versatility of the liquid cooling assembly 230.

[0126] In addition, by providing a compressible thermal conductive pad 234 between the floating thermal conductive block 233 and the cold plate body 232, the floating thermal conductive block 233, the thermal conductive pad 234, and the cold plate body 232 are in close contact with each other in sequence, and the three can form a stable and reliable heat conduction path, which can ensure that the heat generated by the optical module can be conducted to the cold plate body 232 through the floating thermal conductive block 233 and the thermal conductive pad 234 in sequence, and then conducted from the cold plate body 232 to the liquid cooling pipe 231, and finally the heat is taken away by the coolant in the liquid cooling pipe 231.

[0127] By arranging the floating thermal conductive block 233 to contact the optical module in the connector 221 and providing the thermal conductive pad 234 between the cold plate body 232 and the floating thermal conductive block 233, the floating thermal conductive block 233 has high structural strength. Even if the optical module is repeatedly plugged and unplugged for a long time, it will not affect the floating thermal conductive block 233, and it can ensure stable and reliable contact between the floating thermal conductive block 233 and the optical module. Moreover, the cold plate body 232 and the floating thermal conductive block 233 enclose the thermal conductive pad 234, which can protect the thermal conductive pad 234 and extend the service life of the thermal conductive pad 234.

[0128] As an implementation manner, the liquid cooling plate may include an integral thermal conductive pad 234, and all the floating thermal conductive blocks 233 are in contact with the thermal conductive pad 234. Each floating thermal conductive block 233 moves, causing deformation of the corresponding part of the thermal conductive pad 234. As another implementation manner, the liquid cooling plate may include a plurality of thermal conductive pads 234. Each thermal conductive pad 234 corresponds to each floating thermal conductive block 233, for example, and a thermal conductive pad 234 is provided between each floating thermal conductive block 233 and the cold plate body 232.

[0129] In this embodiment, both the cold plate body 232 and the floating thermal conductive block 233 can be metal parts to ensure the heat conduction performance of the cold plate body 232 and the floating thermal conductive block 233, and can also meet the structural strength requirements of the overall liquid cooling plate to ensure the reliability of the liquid cooling plate. Exemplarily, the cold plate body 232 can be made of metal materials such as aluminum, aluminum alloy, titanium, titanium alloy, or alloy steel. The floating thermal conductive block 233 can be made of metal materials such as copper or aluminum. The floating thermal conductive block 233 is, for example, a copper plate, which can improve the heat conduction performance of the floating thermal conductive block 233.

[0130] The liquid cooling pipe 231 can also be made of metal materials to improve the heat conduction efficiency between the cold plate body 232 and the liquid cooling pipe 231, and the liquid cooling pipe 231 has high structural strength and good reliability. Exemplarily, the liquid cooling pipe 231 can be a metal pipe such as a copper pipe or an aluminum pipe.

[0131] Since the thermal conductive pad 234 needs to be elastic and compressible, the thermal conductive pad 234 can be a flexible pad and can be made of a flexible material. For example, the material for making the thermal conductive pad 234 can be polyamide (PA for short) or polypropylene (PP for short).

[0132] Continue to refer to Figure 10 , on the basis of providing the thermal conductive pad 234 between the floating heat sink 233 and the cold plate body 232, the liquid cooling plate may further include an elastic member 235, and the elastic member 235 is connected between each floating heat sink 233 and the cold plate body 232. The elastic member 235 can expand and contract along the aforementioned second direction to drive the floating heat sink 233 to float along the second direction. The elastic member 235 has a large elastic force and a strong elastic deformation ability. Taking the elastic member 235 as the main driving structure, it can reliably drive the floating heat sink 233 to float. Moreover, the elastic force of the elastic member 235 acts on the optical module through the floating heat sink 233, which can increase the pressure between the floating heat sink 233 and the optical module, ensure close contact between the floating heat sink 233 and the optical module, reduce the contact thermal resistance between the floating heat sink 233 and the optical module, and improve the heat dissipation efficiency and heat dissipation effect of the liquid cooling component 230.

[0133] In some examples, two elastic members 235 may be connected between the floating heat sink 233 and the cold plate body 232, and the two elastic members 235 are respectively located at both ends of the floating heat sink 233. In this way, the two elastic members 235 can generate a large elastic force on the floating heat sink 233, increase the pressure between the floating heat sink 233 and the optical module, and ensure close contact between the floating heat sink 233 and the optical module. Moreover, the two elastic members 235 respectively generate pressure on both ends of the floating heat sink 233, which can ensure the balance of the floating heat sink 233 and ensure good contact between the floating heat sink 233 and the optical module.

[0134] At this time, the thermal conductive pad 234 can be arranged between the two elastic members 235. The space between the two elastic members 235 located at both ends of the floating heat sink 233 is relatively large, which can reserve enough space for the thermal conductive pad 234 to ensure that the thermal conductive pad 234 has a sufficient surface area. Moreover, the thermal conductive pad 234 fits the main area of the floating heat sink 233. In this way, the thermal conductive pad 234 can quickly and completely conduct the heat on the floating heat sink 233 to the cold plate body 232.

[0135] Continue to refer to Figure 10, in some embodiments, the cold plate body 232 may include a main support plate 2321 and a stop assembly 2322. The main support plate 2321 is the main structural body of the cold plate body 232. The main support plate 2321 may extend along the aforementioned first direction. The floating heat conduction block 233 is located on the first side of the main support plate 2321, and the liquid cooling pipe 231 is located on the second side of the main support plate 2321. The stop assembly 2322 is connected to the outside of the main support plate 2321. The stop assembly 2322 and the main support plate 2321 together enclose a floating groove 2323. The floating groove 2323 may be located on both sides of the main support plate 2321, and the openings of the floating grooves 2323 on both sides are opposite. The two ends of the floating heat conduction block 233 are inserted into the floating grooves 2323 on both sides to limit the moving stroke of the floating heat conduction block 233.

[0136] By providing the stop assembly 2322 and the main support plate 2321 together to form the cold plate body 232, the floating groove 2323 enclosed therebetween forms the installation foundation of the floating heat conduction block 233, the floating heat conduction block 233 can be fixed on the cold plate body 232, and the moving stroke of the floating heat conduction block 233 can be limited. In this way, the main support plate 2321 can be generally in a flat plate shape, which is convenient for the production and processing of the main support plate 2321. Moreover, it is convenient for the assembly of the liquid cooling plate, and the costs of processes such as the processing and assembly of the liquid cooling plate can be reduced.

[0137] The stop assembly 2322 may include stop members 2322a connected to opposite sides of the main support plate 2321. The stop assembly 2322 does not cover the second side of the main support plate 2321, and the second side of the main support plate 2321 is exposed. In this way, the stop members 2322a on both sides and the main support plate 2321 together enclose the floating grooves 2323 on both sides, so that the two ends of the floating heat conduction block 233 are inserted into the floating grooves 2323 on both sides. Moreover, it is convenient to install the liquid cooling pipe 231 on the second side of the main support plate 2321, and the overall heat conduction path of the liquid cooling assembly 230 is shorter and the heat conduction efficiency is higher.

[0138] Exemplarily, taking the stop member 2322a on one side of the main support plate 2321 as an example, along the first direction in which the main support plate 2321 extends, a plurality of stop members 2322a may be arranged at intervals (see Figure 8 shown), and each stop member 2322a corresponds to at least one floating heat conduction block 233. In the first direction in which the main support plate 2321 extends, a plurality of stop members 2322a may be provided to support and fix all the floating heat conduction blocks 233, and one stop member 2322a only corresponds to a part of the floating heat conduction blocks 233. In this way, it is convenient to assemble the floating heat conduction blocks 233 and the stop members 2322a on the main support plate 2321, and it is also convenient for the disassembly and replacement of each floating heat conduction block 233.

[0139] Among them, referring to Figure 10The stopper 2322a may include a main body 23221 and a stopper 23222 connected to each other. The main body 23221 is the main structure of the stopper 2322a, and the stopper 2322a is connected to the main support plate 2321 by the main body 23221. The stopper 23222 may be located at the end of the main body 23221, and there is a gap between the stopper 23222 and the main support plate 2321. The stopper 23222, the main body 23221 and the main support plate 2321 together form a floating groove 2323, and the stopper 23222 is arranged at the end of the floating heat conductive block 233.

[0140] As for the outer layer liquid cooling assembly 230b, since the area of ​​the liquid cooling plate of the outer layer liquid cooling assembly 230b is larger, specifically, the width of the liquid cooling plate is larger, the side of the main support plate 2321 facing the board 210 can extend outside the floating heat conductive block 233. At this time, the stopper 2322a located on the side of the main support plate 2321 away from the board 210 can be connected to the side wall of the main support plate 2321, and the main body 23221 of the stopper 2322a extends along the side wall of the main support plate 2321, and the stopper 23222 of the stopper 2322a can be perpendicular to the main body 23221. The stopper 2322a located on the side of the main support plate 2321 facing the board 210 can be connected to the board surface of the main support plate 2321, the main body 23221 of the stopper 2322a extends along the board surface of the main support plate 2321, and the stopper 23222 of the stopper 2322a can be parallel to the main body 23221.

[0141] Figure 11 A schematic structural diagram of an inner layer liquid cooling assembly from one perspective provided in an embodiment of the present application. Figure 12 for Figure 11 A schematic diagram of the structure of the inner liquid cooling component from another perspective. Figure 13 for Figure 11 A partial cross-sectional structural diagram of the inner liquid cooling component.

[0142] Combination Figure 11 and Figure 12 As shown, similar to the outer layer liquid cooling assembly 230b, the inner layer liquid cooling assembly 230a may also include a liquid cooling plate and at least one liquid cooling tube 231. One side surface of the liquid cooling plate faces the corresponding inner layer connector group 220a, and the side surface of the liquid cooling plate is used to contact the optical module inserted in each connector 221 in the inner layer connector group 220a. The liquid cooling tube 231 is arranged on the other side surface of the liquid cooling plate, and the liquid cooling tube 231 is used to provide a flow space for the cooling liquid.

[0143] Reference Figure 13As shown, similar to the liquid cooling plate of the outer liquid cooling component 230b, the liquid cooling plate of the inner liquid cooling component 230a may also include a cold plate body 232, a plurality of floating heat conduction blocks 233, and a heat conduction pad 234. The plurality of floating heat conduction blocks 233 are all arranged on the first side of the cold plate body 232, and the floating heat conduction blocks 233 are arranged at intervals along the first direction. Each of the floating heat conduction blocks 233 corresponds to each connector 221 in the connector group 220, and the floating heat conduction block 233 is used to pass through the contact window 2211 of the connector 221 and contact the optical module inserted in the connector 221. The heat conduction pad 234 is arranged between the cold plate body 232 and the floating heat conduction block 233, and the two side surfaces of the heat conduction pad 234 are respectively in contact with the cold plate body 232 and the floating heat conduction block 233. The liquid cooling pipe 231 is arranged on the second side of the cold plate body 232.

[0144] The floating heat conduction block 233 can float along the second direction. The heat conduction pad 234 arranged between the floating heat conduction block 233 and the cold plate body 232 is elastic, and the heat conduction pad 234 can be deformed as the floating heat conduction block 233 moves, so that the two sides of the heat conduction pad 234 always closely adhere to the cold plate body 232 and the floating heat conduction block 233.

[0145] Moreover, the liquid cooling plate of the inner liquid cooling component 230a may also include an elastic member 235, which is connected between each floating heat conduction block 233 and the cold plate body 232. Exemplarily, two elastic members 235 may be connected between the floating heat conduction block 233 and the cold plate body 232, and the two elastic members 235 are respectively located at both ends of the floating heat conduction block 233, and the heat conduction pad 234 may be arranged between the two elastic members 235. Details are not described herein again.

[0146] In addition, continue to refer to Figure 13 ., similar to the cold plate body 232 of the outer liquid cooling component 230b, the cold plate body 232 of the inner liquid cooling component 230a may also include a main support plate 2321 and a stop component 2322. The stop component 2322 is connected to the outside of the main support plate 2321, and the stop component 2322 and the main support plate 2321 jointly enclose a floating groove 2323. The stop component 2322 may include stop members 2322a connected to opposite sides of the main support plate 2321, and the second side of the main support plate 2321 is exposed. Taking the stop member 2322a on one side of the main support plate 2321 as an example, a plurality of stop members 2322a may be arranged at intervals along the first direction extending along the main support plate 2321 (see Figure 11 shown), and each stop member 2322a corresponds to at least one floating heat conduction block 233. Among them, the stop member 2322a may include a main body portion 23221 and a stop portion 23222 connected to each other. The stop portion 23222, the main body portion 23221, and the main support plate 2321 jointly enclose the floating groove 2323, and the stop portion 23222 is arranged at the end of the floating heat conduction block 233.

[0147] Different from the outer liquid cooling component 230b, since the area of the liquid cooling plate of the inner liquid cooling component 230a is smaller, specifically, the width of the liquid cooling plate is smaller, the width of the main support plate 2321 and the width of the floating heat conduction block 233 can be approximately the same. At this time, the stoppers 2322a located on both sides of the main support plate 2321 can be connected to the side walls of the main support plate 2321. The main body portions 23221 of the stoppers 2322a on both sides can extend along the corresponding side walls of the main support plate 2321, and the stopper portions 23222 of the stoppers 2322a on both sides can be perpendicular to the main body portions 23221.

[0148] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0149] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily need to be limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products, or devices.

[0150] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and are not intended to limit them. Although the technical solutions of the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module cold plate liquid cooling assembly, characterized in that: include: A cold plate body extending along a first direction and comprising a first side and a second side opposite to each other; A plurality of floating heat-conducting blocks are connected to a first side of the cold plate body and can float along a second direction perpendicular to the first direction; each of the floating heat-conducting blocks is arranged at intervals along the first direction and is used to contact each of the optical modules arranged in sequence along the first direction; A thermal pad, disposed between the cold plate body and the floating thermal block, and in contact with the cold plate body and the floating thermal block; At least one liquid cooling tube is disposed on the second side of the cold plate body.

2. The optical module cold plate liquid cooling assembly according to claim 1, characterized in that: Also includes: The elastic member is connected between each of the floating heat-conducting blocks and the cold plate body and can be extended and retracted along the second direction.

3. The optical module cold plate liquid cooling assembly according to claim 2, characterized in that: Two elastic members are connected between the floating heat-conducting block and the cold plate body. The two elastic members are respectively located at two ends of the floating heat-conducting block, and the thermal pad is located between the two elastic members.

4. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, characterized in that: The cold plate body comprises: A main support plate extending along the first direction; the floating heat conductive block is located on a first side of the support plate, and the liquid cooling pipe is located on a second side of the main support plate; The stopper assembly is connected to the outer side of the main support plate and forms a floating groove together with the main support plate; the floating groove is located on both sides of the main support plate, and the notches of the floating grooves on both sides are opposite, and the two ends of the floating heat conductive block are inserted into the floating grooves on both sides.

5. The optical module cold plate liquid cooling assembly according to claim 4, characterized in that: The stopper assembly includes stoppers connected to opposite sides of the main support plate, and the second side of the main support plate is exposed to the outside.

6. The optical module cold plate liquid cooling assembly according to claim 5, characterized in that: The stopper comprises a main body portion and a stopper portion which are connected to each other, the main body portion is connected to the main support plate, and the stopper portion is disposed at an end portion of the floating heat conductive block.

7. The optical module cold plate liquid cooling assembly according to claim 5, characterized in that: A plurality of the stoppers are arranged at intervals along the first direction, and each of the stoppers stops at least one of the floating heat conductive blocks.

8. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, characterized in that: The number of the liquid cooling tube is one, and the liquid cooling tube passes through both ends of the cold plate body along the first direction.

9. The optical module cold plate liquid cooling assembly according to claim 8, characterized in that: The liquid cooling pipe extends from one end of the cold plate body along a wavy line to the other end of the cold plate body.

10. A network switching device, characterized in that: include: At least one board; At least one connector group, each of the connector groups includes a plurality of connectors arranged in sequence along a first direction, each of the connectors is electrically connected to the board; wherein each of the connectors in at least one of the connector groups has a contact window, and the contact window is located at the installation side of the connector group; At least one optical module cold plate liquid cooling assembly as described in any one of claims 1 to 9, wherein the optical module cold plate liquid cooling assembly is arranged on the installation side of the connector group, and each floating heat conductive block of the optical module cold plate liquid cooling assembly is used to pass through the contact window and contact with the optical module inserted in the connector.

11. The network switching device according to claim 10, characterized in that: At least two connector groups are arranged at intervals along a second direction perpendicular to the first direction, each connector in each connector group has a contact window, and each connector group is correspondingly provided with one optical module cold plate liquid cooling assembly.

12. The network switching device according to claim 11, characterized in that: The number of the board is one, the connector group includes two inner connector groups and two outer connector groups, the two inner connector groups are respectively connected to the two side surfaces of the board, the two outer connector groups are respectively located on the side of the two inner connector groups away from the board, and the two outer connector groups are both electrically connected to the board; The number of the optical module cold plate liquid cooling components is four, and each of the optical module cold plate liquid cooling components is respectively arranged on the installation side of each of the connector groups.

13. The network switching device according to claim 12, characterized in that: The installation side of each connector group is the side of the connector group away from the board, and the optical module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies; The two inner layer liquid cooling components are respectively located between the inner layer connector group and the outer layer connector group on each side, and the inner layer liquid cooling components are used to contact the optical module inserted in the inner layer connector group; the two outer layer liquid cooling components are respectively located on the side of the outer layer connector group on each side away from the board, and the outer layer liquid cooling components are used to contact the optical module inserted in the outer layer connector group.

14. The network switching device according to claim 13, characterized in that: Each connector of the outer layer connector group has a bracket, the bracket extends toward the board and is connected to the board, and the outer layer liquid cooling component covers at least a portion of the bracket.

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