Dipole alignment device, dipole alignment method, and display device manufacturing method

Abstract

A dipole aligning apparatus, a dipole aligning method, and a display device manufacturing method are provided. The dipole aligning apparatus includes an electric field forming unit including a stage and a probe unit for forming an electric field on the stage, an inkjet printing device including at least one inkjet head for injecting ink onto the stage, the ink including dipoles and a solvent in which the dipoles are dispersed, a transport unit including a first moving member for moving the electric field forming unit in at least one direction, and a light irradiation device including a light irradiation unit for irradiating light on the ink injected on the stage.

Description

Technical Field

[0001] The disclosure relates to a dipole alignment apparatus, a dipole alignment method, and a display device manufacturing method. In particular, it relates to a dipole alignment apparatus including an inkjet printing device and a light irradiation device, as well as a dipole alignment method and a display device manufacturing method using the dipole alignment apparatus. Background Technology

[0002] The importance of display devices has steadily increased with the development of multimedia technology. In response, various types of display devices, such as organic light-emitting displays and liquid crystal displays (LCDs), have been developed.

[0003] A display device is a means for displaying images and includes a display panel (such as an organic light-emitting display panel or a liquid crystal display panel). The light-emitting display panel may include light-emitting elements (e.g., light-emitting diodes (LEDs)), and examples of light-emitting diodes include organic light-emitting diodes (OLEDs) that use organic materials as fluorescent materials and inorganic light-emitting diodes that use inorganic materials as fluorescent materials. Summary of the Invention

[0004] Technical issues

[0005] To address the aforementioned issues, the disclosed embodiments provide a dipole alignment device including an inkjet printing apparatus and a light irradiation apparatus.

[0006] It should be noted that, based on the following description, the disclosed aspects are not limited thereto, and other aspects not mentioned herein will be obvious to those skilled in the art.

[0007] Technical solution

[0008] According to the disclosed embodiments, the dipole alignment device includes: an electric field forming unit including a stage and a probe unit, the probe unit forming an electric field on the stage; an inkjet printing device including at least one inkjet head for spraying ink onto the stage, the ink including dipoles and a solvent dispersing the dipoles therein; a transport unit including a first moving member that moves the electric field forming unit in at least one direction; and a light irradiation device including a light irradiation unit that applies light to the ink sprayed onto the stage.

[0009] The light irradiation device can be placed between the inkjet printer and the transport unit, and apply light after the ink is sprayed onto the stage.

[0010] The electric field forming unit can generate an electric field on the stage when light is applied to the ink.

[0011] The electric field forming unit can form an electric field on the stage during the period when light is applied to the ink.

[0012] The light irradiation device can be set in the inkjet printer and apply light to the stage while the ink is being sprayed onto the stage.

[0013] Inkjet printing equipment may also include a head base that moves in one direction, and the inkjet head may be disposed in the head base.

[0014] The light irradiation device may also include a second moving part that moves in one direction, and the light irradiation unit may be disposed in the second moving part.

[0015] The transport unit may include a plurality of supports disposed in the first moving part, and the electric field forming unit may move while being loaded on the supports.

[0016] The light irradiation device can be installed in the transport unit and apply light to the stage of the electric field forming unit while it is being loaded onto the support.

[0017] The electric field forming unit can form an electric field on the stage during the period when light is applied by the light irradiation device.

[0018] The dipole alignment device may also include a heat treatment device that applies heat to the electric field forming unit, wherein the light irradiation device may be disposed between the transport unit and the heat treatment device.

[0019] The light irradiation device can be installed in the heat treatment equipment, and the light irradiation device can apply light to the stage while the heat treatment equipment applies heat to the stage.

[0020] The electric field forming unit can form an electric field on the stage during the period when light is applied by the light irradiation device.

[0021] According to the disclosed embodiments, the dipole alignment method includes: spraying ink onto a target substrate, the ink including dipoles and a solvent therein dispersing the dipoles; applying light onto the target substrate and forming an electric field on the target substrate to align the dipoles on the target substrate using the electric field; and removing the solvent and depositing the dipoles onto the target substrate.

[0022] The step of aligning a dipole on a target substrate may include aligning the dipole such that the orientation of the dipole is aligned by an electric field.

[0023] The step of applying light to the target substrate can be performed during the formation of an electric field on the target substrate.

[0024] Light applied to the target substrate can be applied to the dipole, and the dipole moment of the dipole can be increased.

[0025] The step of applying light to a target substrate may include applying light to a first region defined on the target substrate and applying light to a second region located on one side of the first region.

[0026] The steps of settling the dipole may include moving the target substrate to a heat treatment device with the use of a transport unit, and applying heat to the target substrate through the heat treatment device.

[0027] The step of applying light to the target substrate can be performed before the transport unit moves the target substrate, and the step of forming an electric field on the target substrate can be performed during the transfer of the target substrate by the transport unit.

[0028] The step of applying light to the target substrate can be performed during the transfer of the target substrate by the transport unit.

[0029] The step of applying light to the target substrate can be performed before the heat treatment equipment applies heat to the target substrate, and the step of forming an electric field on the target substrate can be performed during the heat treatment equipment applying heat to the target substrate.

[0030] The step of applying light to the target substrate can be performed while heat is being applied to the target substrate in a heat treatment device.

[0031] The target substrate may include a first electrode and a second electrode, and the step of depositing the dipole may include depositing the dipole onto the first electrode and the second electrode.

[0032] Inkjet printers can be used to perform the step of spraying ink onto a target substrate.

[0033] According to the disclosed embodiments, a method for manufacturing a display device includes: spraying ink onto a target substrate, the ink including a light-emitting element and a solvent therein dispersing the light-emitting element, forming a first electrode and a second electrode on the target substrate; applying light onto the target substrate and forming an electric field on the first electrode and the second electrode; and depositing the light-emitting element onto the first electrode and the second electrode.

[0034] Light applied to the target substrate can be applied to the light-emitting element, and the dipole moment of the light-emitting element increases.

[0035] The first electrode and the second electrode can extend in a first direction and can simultaneously perform the steps of forming an electric field on the first electrode and the second electrode and applying light to the target substrate.

[0036] Details of other embodiments are included in the detailed description and accompanying drawings.

[0037] Beneficial effects

[0038] According to the disclosed embodiments, a dipole alignment apparatus is provided, comprising an inkjet printing device, an electric field forming unit, and a light irradiation device, wherein the dipole moment is changed by applying light to the dipoles sprayed onto a target substrate. When light is applied, the alignment responsiveness of the dipoles can be improved, and the dipoles can be aligned on the target substrate with a high degree of alignment by an electric field.

[0039] The effects of the embodiments are not limited to those illustrated above, and many more effects are included in this disclosure. Attached Figure Description

[0040] Figure 1 This is a schematic plan view of a dipole alignment device according to a disclosed embodiment.

[0041] Figure 2 This is a schematic plan view of an inkjet printing apparatus according to a disclosed embodiment.

[0042] Figure 3 This is a schematic diagram illustrating how ink is ejected from an inkjet head according to a disclosed embodiment.

[0043] Figure 4 This is a schematic diagram illustrating how ink is sprayed onto a target substrate according to a disclosed embodiment.

[0044] Figure 5 This is a schematic diagram illustrating the operation of an inkjet head unit according to a disclosed embodiment.

[0045] Figure 6 This is a schematic plan view of an electric field forming unit according to a disclosed embodiment.

[0046] Figure 7 and Figure 8 This is a schematic diagram illustrating the operation of an electric field forming unit according to a disclosed embodiment.

[0047] Figure 9 This is a schematic diagram illustrating how an electric field is formed on a target substrate by means of a probe unit according to a disclosed embodiment.

[0048] Figure 10 This is a schematic cross-sectional view illustrating the operation of a light irradiation device according to a disclosed embodiment.

[0049] Figure 11 This is a schematic diagram illustrating how light is applied to a dipole according to a disclosed embodiment.

[0050] Figure 12 This is a schematic plan view of a transport unit according to a disclosed embodiment.

[0051] Figure 13 and Figure 14This is a schematic diagram illustrating the operation of a transport unit according to a disclosed embodiment.

[0052] Figure 15 This is a schematic front view of a heat treatment apparatus according to a disclosed embodiment.

[0053] Figure 16 This is a schematic diagram illustrating the operation of a heat treatment apparatus according to a disclosed embodiment.

[0054] Figure 17 This is a schematic diagram of a heat treatment apparatus according to another disclosed embodiment.

[0055] Figure 18 This is a schematic diagram of a heat treatment apparatus according to another disclosed embodiment.

[0056] Figure 19 This is a flowchart illustrating a dipole alignment method according to a disclosed embodiment.

[0057] Figures 20 to 24 This is a schematic diagram illustrating how a dipole alignment device is used to align dipoles according to a disclosed embodiment.

[0058] Figure 25 and Figure 26 This is a plan view of a dipole alignment device according to other embodiments.

[0059] Figure 27 It is shown Figure 26 A schematic diagram of the operation of the light irradiation device of the dipole alignment apparatus.

[0060] Figure 28 This is a schematic plan view of a dipole alignment device according to another disclosed embodiment.

[0061] Figure 29 and Figure 30 It is shown Figure 28 A schematic diagram illustrating the operation of an inkjet printing device and a light irradiation device with a dipole alignment apparatus.

[0062] Figure 31 This is a schematic plan view of a dipole alignment device according to another disclosed embodiment.

[0063] Figure 32 yes Figure 31 A schematic front view of the transport unit of the dipole alignment device.

[0064] Figure 33 It is shown Figure 31 A schematic diagram of the operation of the transport unit and the light irradiation equipment of the dipole alignment device.

[0065] Figure 34This is a schematic plan view of a dipole alignment device according to another disclosed embodiment.

[0066] Figure 35 It is shown Figure 34 A schematic diagram of the operation of the light irradiation device of the dipole alignment apparatus.

[0067] Figure 36 and Figure 37 This is a schematic plan view of a dipole alignment device according to other embodiments.

[0068] Figures 38 to 40 This is a schematic diagram illustrating the operation of a light irradiation device according to other embodiments.

[0069] Figure 41 This is a schematic diagram of a light irradiation device according to another disclosed embodiment.

[0070] Figure 42 It is shown Figure 41 A floor plan showing the operation of the light irradiation equipment.

[0071] Figure 43 This is a schematic diagram of a light-emitting element according to a disclosed embodiment.

[0072] Figure 44 This is a schematic diagram of a light-emitting element according to another disclosed embodiment.

[0073] Figure 45 This is a schematic plan view of a display device according to a disclosed embodiment.

[0074] Figure 46 It is a plan view of the pixels of a display device according to a disclosed embodiment.

[0075] Figure 47 It is along Figure 46 The sectional views taken by lines Xa-Xa', Xb-Xb', and Xc-Xc'. Detailed Implementation

[0076] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0077] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on said other layer or substrate, or an intermediary layer may be present. Throughout the specification, the same reference numerals denote the same components.

[0078] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, the first element discussed below may be referred to as the second element without departing from the teachings of the invention. Similarly, the second element may also be referred to as the first element.

[0079] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0080] Figure 1 This is a schematic plan view of a dipole alignment device according to a disclosed embodiment.

[0081] Reference Figure 1 The dipole alignment device 1000 includes an electric field forming unit 100, an inkjet printing device 300, a light irradiation device 500, and a transport unit 700. The dipole alignment device 1000 also includes a heat treatment device 900.

[0082] The dipole alignment device 1000 may include a printing section PA, a transport section TA, and a heat treatment section HA. The dipole alignment device 1000 can use an inkjet printer 300 disposed in the printing section PA to align (…). Figure 3 The pre-selected ink I was sprayed onto ( Figure 3 The target substrate SUB, on which ink I is sprayed, can be transferred via transport section TA to heat treatment section HA, where particles such as dipoles in ink I can be aligned on the target substrate SUB.

[0083] The target substrate SUB can be disposed on the electric field forming unit 100, which can form an electric field on the target substrate SUB. The electric field can be transmitted to the ink I sprayed onto the target substrate SUB, and particles such as dipoles included in the ink I can be aligned in one direction by the electric field. Here, the light irradiation device 500 included in the dipole alignment device 1000 can apply light to the ink I, and thus improve the alignment responsiveness of the particles with the electric field.

[0084] in addition, Figure 1 A first direction DR1, a second direction DR2, and a third direction DR3 are defined. The first direction DR1 and the second direction DR2 can be located on the same plane and can be orthogonal to each other. The third direction DR3 can be a direction perpendicular to the first direction DR1 and the second direction DR2. Figure 1 In this context, the first direction DR1 can be the width direction, the second direction DR2 can be the length direction, and the third direction DR3 can be the direction from top to bottom.

[0085] Figure 1A schematic plan view of the dipole alignment device 1000 as viewed from above is shown. Figure 1 This is a view used to explain the layout and operation of the elements included in the dipole alignment device 1000, but the structure and layout of the dipole alignment device 1000 are not limited to this. Figure 1 Clearly, the dipole alignment device 1000 can include a ratio of... Figure 1 The components shown are more numerous and can have the same characteristics as those shown. Figure 1 The structures shown are different from the structures described below. (Referring to the following text...) Figure 1 The structure and operation of the dipole alignment device 1000 are described in detail in the accompanying drawings and other figures.

[0086] Figure 2 This is a schematic plan view of an inkjet printing apparatus according to a disclosed embodiment. Figure 2 It is a plan view of the inkjet printing device 300 when viewed on a third-party DR3 (e.g., when viewed from above).

[0087] Reference Figure 2 And further refer to Figure 1 The printing section PA of the dipole alignment device 1000 includes an inkjet printer 300 and a first STA1.

[0088] The first STA1 provides the area in which the electric field forming unit 100 is disposed. The printing portion PA of the dipole alignment device 1000 includes a first track RL1 and a second track RL2 extending in a first direction DR1, and the first STA1 is disposed on the first track RL1 and the second track RL2. The first STA1 can be moved in the first direction DR1 on the first track RL1 and the second track RL2 via separate moving members. When the first STA1 moves, the electric field forming unit 100 can also move in the first direction DR1, and as a result, ink I can be sprayed onto the electric field forming unit 100 during the passage of the electric field forming unit 100 through the inkjet printing device 300.

[0089] The inkjet printing apparatus 300 may include a first support 310 and an inkjet head unit 330. The inkjet printing apparatus 300 may use the inkjet head unit 330, which is connected to a separate ink memory, to spray ink I onto a target substrate SUB disposed on the electric field forming unit 100.

[0090] Additionally, in embodiments, ink I may include a solvent SV and a plurality of dipole DPs included in the solvent SV. In embodiments, ink I may be configured as a solution or a colloid. In one example, the solvent SV may be acetone, water, alcohol, toluene, propylene glycol (PG), or propylene glycol methyl acetate (PGMA), but the disclosure is not limited thereto. The dipole DPs may be included in the solvent SV in a dispersed state and may be supplied to and ejected from the inkjet printing apparatus 300.

[0091] The first support member 310 of the inkjet printing device 300 can extend in the second direction DR2 and can be positioned above the first track RL1 and the second track RL2. Although not specifically stated, the first support member 310 can be connected to the base frame supporting the first support member 310, and the first STA1 can pass under the first support member 310. Figure 2 The shape of the first support member 310 of the inkjet printing device 300 is schematically shown, but the shape of the first support member 310 is not limited to... Figure 2 The shape shown. The first support 310 can have various other structures, or may include, in addition to... Figure 2 Other components besides those shown.

[0092] The inkjet head unit 330 can be disposed in the first support member 310. The inkjet head unit 330 can be connected to the ink memory and can be supplied with ink I. Then, the inkjet head unit 330 can spray ink I onto the target substrate SUB via the inkjet head 335, which will be described later. There are no particular limitations on the method of disposing of the inkjet head unit 330 in the first support member 310. The inkjet head unit 330 is shown as being directly disposed on the first support member 310, but the inkjet head unit 330 can be coupled to the first support member 310 via a separate component or mounted on the first support member 310. Optionally, the inkjet head unit 330 can be directly coupled to the first support member 310.

[0093] The inkjet head unit 330 may include a head base 331 and an inkjet head 335, the inkjet head 335 being disposed on the surface of the head base 331 and including a plurality of nozzles NZ.

[0094] The head base 331 of the inkjet head unit 330 can be mounted on the first support 310. In one example, the head base 331 can extend in a second direction DR2. The head base 331 can be separated from the first STA1 passing under the first support 310 by a predetermined distance. In one embodiment, the head base 331 may also include a movable member and thus be movable in one direction above the first support 310.

[0095] The inkjet head 335 is disposed on the surface of the head base 331, for example, on the bottom surface of the head base 331 in a third direction DR3. Multiple inkjet heads 335 may be arranged in one row or more rows in one direction. The inkjet heads 335 are shown arranged in two rows in an interlaced manner, but the disclosure is not limited thereto. The inkjet heads 335 may be arranged in more than two rows in an aligned manner rather than in an interlaced manner. The shape of the inkjet head 335 is not particularly limited. In one example, the inkjet head 335 may have a rectangular shape.

[0096] At least one inkjet head 335 (e.g., two inkjet heads 335) can be grouped together and can be configured to be adjacent to each other. However, there is no particular limitation on the number of inkjet heads 335 included in a group. In one example, one to five inkjet heads 335 can be included in a group.

[0097] Furthermore, the inkjet head unit 330 is shown having four inkjet heads 335 disposed therein, but the number of inkjet heads 335 is not particularly limited. In one embodiment, the number of inkjet heads 335 included in one inkjet head unit 330 can be from 128 to 1800.

[0098] Each of the inkjet heads 335 may include multiple nozzles and can therefore spray ink I onto a target substrate SUB by receiving ink I from the head base 331. Nozzles NZ at the bottom surface of each of the inkjet heads 335 can be connected to the inner tube IP of the corresponding inkjet head 335. Ink I can move from the head base 331 to each of the inkjet heads 335, flow along the inner tube IP of each of the inkjet heads 335, and then be ejected through the nozzles NZ of each of the inkjet heads 335.

[0099] Figure 3 This is a schematic diagram illustrating how ink is ejected from an inkjet head according to a disclosed embodiment. Figure 4 This is a schematic diagram illustrating how ink is sprayed onto a target substrate according to a disclosed embodiment.

[0100] Reference Figure 3 and Figure 4 The inkjet head 335 may include an inner tube IP to which ink I is delivered and a plurality of nozzles NZ through which ink I is ejected, the ink I being ejected through the nozzles NZ and thus being sprayed onto a target substrate SUB. The amount of ink I ejected through the nozzles NZ can be controlled according to the voltage applied to each of the nozzles NZ. In one embodiment, the amount of ink ejected at one time through each of the nozzles NZ may be, but is not limited to, 1 picoliter (pl) to 50 picoliters (pl).

[0101] The ink I ejected from the inkjet head 335 may include multiple dipoles DP and solvent SV, and the dipoles DP may be ejected together with the solvent SV through the nozzle NZ. The dipoles DP may be supplied to the inkjet head 335 in a dispersed state within the solvent SV. Figure 4 Multiple dipole DPs are shown dispersed in a random orientation within ink I ejected from inkjet head 335. As described later, the dipole DPs can extend in one direction and can be oriented in a specific direction by an electric field formed by electric field forming unit 100. The dipole DPs can settle or be positioned on the target substrate SUB in an oriented state by the electric field. The solvent SV evaporates through a subsequent process, leaving only the dipole DPs. This will be described later.

[0102] In one embodiment, the inkjet head unit 330 can move on the first support 310 in one direction (e.g., in the second direction DR2).

[0103] Figure 5 This is a schematic diagram illustrating the operation of an inkjet head unit according to a disclosed embodiment. Figure 5 The inkjet head unit 330 and the electric field forming unit 100 mounted on the first STA1 are shown when viewed from the front.

[0104] Reference Figure 2 and Figure 5 The inkjet head unit 330 can move in the direction along which the first support member 310 extends (i.e., in the second direction DR2) and can spray ink I onto the target substrate SUB. In some embodiments, the width of the target substrate SUB in the second direction DR2 can be larger than the width of the inkjet head unit 330. In this case, the inkjet head unit 330 can spray ink I onto the entire surface of the target substrate SUB during its movement along the second direction DR2. Furthermore, multiple target substrates SUB can be disposed on the electric field forming unit 100, and the inkjet head unit 330 can spray ink I onto multiple target substrates SUB during its movement along the second direction DR2.

[0105] However, the disclosure is not limited to this. Optionally, the inkjet head unit 330 can be positioned outside the first track RL1 and the second track RL2, and then can move in the second direction DR2 to spray ink I. With the first STA1 moved in the first direction DR1 to be positioned below the first support 310, the inkjet head unit 330 can move between the first track RL1 and the second track RL2 to spray ink I. The operation of the inkjet head unit 330 can be varied. In one example, the inkjet head unit 330 can be mounted on the first support 310 and then can move in the second direction DR2 via a separate moving member. In another example, the inkjet head unit 330 can be incorporated into a groove formed in the first support 310 and can perform the above operations. The operation of the inkjet head unit 330 is not limited to these examples, and detailed descriptions of these examples will be omitted.

[0106] In the printing section PA of the dipole alignment apparatus 1000, an electric field forming unit 100 can be provided on the first STA1. The electric field forming unit 100 can provide a space in which the target substrate SUB can be prepared, and when ink I is sprayed onto the target substrate SUB, the electric field forming unit 100 can form an electric field on the target substrate SUB. Due to the electric field, the dipoles included in ink I can be oriented in one direction.

[0107] Figure 6 This is a schematic plan view of an electric field forming unit according to a disclosed embodiment.

[0108] Reference Figure 1 and Figure 6 The electric field forming unit 100 may include a sub-stage 110, a probe support 130, a probe unit 150, and an aligner 180.

[0109] In the printing section PA, the electric field forming unit 100 can be mounted on the first STA1 and can move along the first direction DR1 via the first STA1. The electric field forming unit 100, which is equipped with the target substrate SUB, can form an electric field on the target substrate SUB during movement along the printing section PA, the transport section TA, and the heat treatment section HA.

[0110] Substage 110 provides space in which the target substrate SUB can be disposed. Furthermore, probe support 130, probe unit 150, and aligner 180 can be disposed on substage 110. The shape of substage 110 is not particularly limited. In one example, such as... Figure 6As shown, the sub-stage 110 can have a rectangular shape, with two sides extending in a first direction DR1 and a second direction DR2. The planar shape of the sub-stage 110 can be varied depending on the planar shape of the target base SUB. In one example, if the target base SUB has a rectangular shape, the sub-stage 110 can also have a rectangular shape. In another example, if the target base SUB has a circular shape, the sub-stage 110 can also have a circular shape.

[0111] One or more aligners 180 may be disposed on the substage 110. The aligners 180 may be disposed on the side of the substage 110, and the area surrounded by the aligners 180 may be an area in which the target substrate SUB may be disposed. Figure 6 Two aligners 180 are shown positioned on each side of the substage 110, spaced apart from each other, for a total of eight aligners 180 positioned on the substage 110, but the disclosure is not limited thereto. That is, the number and arrangement of the aligners 180 can be varied depending on the shape or type of the target substrate SUB.

[0112] Probe support 130 and probe unit 150 are disposed on substage 110. Probe support 130 can provide space on substage 110 in which probe unit 150 can be disposed. Specifically, probe support 130 can be disposed on one or more sides of substage 110 and can extend in the same direction as the corresponding side of substage 110. In one example, such as... Figure 6 As shown, the probe support 130 can be disposed on the upper and lower sides of the sub-stage 110 to extend in the first direction DR1, but the disclosure is not limited thereto. In another example, more than two probe supports 130 can be disposed, and the probe supports 130 can also be disposed on the left and right sides of the sub-stage 110. That is, the structure of the probe support 130 can be changed according to the number, layout and structure of the probe units 150 included in the electric field forming unit 100.

[0113] The probe unit 150 can be disposed on the probe support 130 and can form an electric field on the target substrate SUB prepared on the substage 110. The probe unit 150 can extend in the same direction as the probe support 130 (e.g., in the first direction DR1), and the probe unit 150 can extend long enough to cover the entire target substrate SUB. That is, the size and shape of the probe support 130 and the probe unit 150 can be determined by the target substrate SUB.

[0114] In one embodiment, each of the probe units 150 may include a probe driver 153, a probe holder 151, and a probe pad (or “soldering pad”) 158, the probe driver 153 being disposed on one of the probe supports 130, the probe holder 151 being disposed on the probe driver 153 to receive electrical signals, and the probe pad 158 being connected to the probe holder 151 to transmit electrical signals to the target substrate SUB.

[0115] A probe driver 153 may be disposed on one of the probe supports 130 and may move the probe clamp 151 and the probe pad 158. In one embodiment, the probe driver 153 may move the probe clamp 151 in both horizontal and vertical directions (e.g., in a second direction DR2 and a third direction DR3, respectively). The probe pad 158 may be driven by the probe driver 153 to connect to or disconnect from the target substrate SUB. During operation of the dipole alignment device 1000, the probe driver 153 may be driven in the step of forming an electric field on the target substrate SUB to connect the probe pad 158 to the target substrate SUB, and may be driven again in other steps to disconnect the probe pad 158 from the target substrate SUB. This will be described later in conjunction with other figures.

[0116] The probe pad 158 can generate an electric field on the target substrate SUB using an electrical signal transmitted from the probe holder 151. The probe pad 158 can be connected to the target substrate SUB to transmit electrical signals, thereby generating an electric field on the target substrate SUB. In one example, the probe pad 158 can contact an electrode or power pad of the target substrate SUB, and an electrical signal from the probe holder 151 can be transmitted to the electrode or power pad. The electrical signal transmitted to the target substrate SUB can generate an electric field on the target substrate SUB.

[0117] However, the disclosure is not limited thereto. The probe pad 158 can be a component for forming an electric field via an electrical signal transmitted from the probe holder 151. That is, in the case where the probe pad 158 forms an electric field by receiving an electrical signal, the probe pad 158 may not be connected to the target substrate SUB.

[0118] The shape of the probe pad 158 is not particularly limited. In one embodiment, the probe pad 158 may extend in one direction to cover the entire target substrate SUB.

[0119] The probe holder 151 can be connected to the probe pad 158 and to a separate voltage application device. The probe holder 151 can transmit an electrical signal applied to it from the voltage application device to the probe pad 158, and thus can form an electric field on the target substrate SUB. The electrical signal transmitted to the probe holder 151 can be a voltage (e.g., an alternating current voltage) used to form the electric field.

[0120] Each of the probe units 150 may include a plurality of probe holders 151, and there is no particular limitation on the number of probe holders 151 included in each of the probe units 150. Figure 6 Three probe holders 151 and three probe drivers 153 are shown disposed in each of the probe units 150, but each of the probe units 150 may include more than three probe holders 151 and more than three probe drivers 153, and thus it is possible to form an electric field with a higher density on the target substrate SUB.

[0121] The probe unit 150 is not limited to this. Figure 6 The probe unit 150 is shown disposed on the probe support 130 (i.e., in the electric field forming unit 100), but in some embodiments, the probe unit 150 may be configured as a separate device. The structure and layout of the electric field forming unit 100 are not particularly limited, as long as the electric field forming unit includes means capable of forming an electric field and thus capable of forming an electric field on the target substrate SUB.

[0122] Figure 7 and Figure 8 This is a schematic diagram illustrating the operation of an electric field forming unit according to a disclosed embodiment.

[0123] As mentioned above, the probe driver 153 of each of the probe units 150 can be driven according to the operation of the dipole alignment device 1000. (See also...) Figure 7 and Figure 8 In the first state where no electric field is formed in the electric field forming unit 100, the probe unit 150 can be disposed on the probe support 130 and can be spaced apart from the target substrate SUB. The probe driver 153 of each of the probe units 150 can be driven in a second direction DR2 as the horizontal direction and a third direction DR3 as the vertical direction to separate the probe pad 158 from the target substrate SUB.

[0124] Subsequently, with an electric field formed on the target substrate SUB, the probe driver 153 of each of the probe units 150 can be driven to connect the probe pad 158 to the target substrate SUB. The probe driver 153 can be driven in a third direction DR3 (vertical) and a second direction DR2 (horizontal) to position the probe pad 158 in contact with the target substrate SUB. The probe clamp 151 of each of the probe units 150 can transmit an electrical signal to the probe pad 158, thereby forming an electric field on the target substrate SUB.

[0125] Figure 7 and Figure 8Two probe units 150 are shown, each positioned on either side of the electric field forming unit 100 and simultaneously connected to the target substrate SUB, but the disclosure is not limited thereto. Optionally, the probe units 150 can be driven separately. In one example, when the target substrate SUB is prepared on the substage 110 and ink I is sprayed, any first probe unit 150 can first form an electric field on the target substrate SUB, and the second probe unit 150 may not be connected to the target substrate SUB. Subsequently, the first probe unit 150 can be detached from the target substrate SUB, and the second probe unit 150 can be connected to the target substrate SUB to form an electric field. That is, multiple probe units 150 can be driven simultaneously to form an electric field, or they can be driven one after another to form an electric field one after another.

[0126] Figure 9 This is a schematic diagram illustrating how an electric field is formed on a target substrate by means of a probe unit according to a disclosed embodiment.

[0127] As mentioned above, an electric field can be formed on the target substrate SUB, and the ink I sprayed onto the target substrate SUB can include dipoles DP. The dipoles DP can be oriented in one direction by the electric field formed on the target substrate SUB.

[0128] Each of the dipoles (DPs) can be an entity having a first polarity at its first end and a second polarity at its second end, different from the first polarity. In one example, the first end of the dipole DP can have a positive polarity, and the second end of the dipole DP can have a negative polarity. When placed in a predetermined electric field, the dipoles (DPs) with different polarities at their two ends can receive electric current (i.e., attractive or repulsive forces), and therefore, the orientation of the dipoles can be controlled.

[0129] Reference Figure 9 The ink I may include a dipole DP and may be ejected from the nozzle NZ of each of the inkjet heads 335. The ink I ejected from the nozzle NZ may be sprayed onto the target substrate SUB. If an electric field IEL is formed on the target substrate SUB, the dipole DP having a first polarity and a second polarity may continue to receive electricity until or even after the ink I from the nozzle NZ has settled onto the target substrate SUB. The dipole DP may be electrically oriented, and the orientation of the dipole DP may be, for example, the direction pointed to by the electric field IEL.

[0130] Figure 9The diagram illustrates how the probe unit 150 forms an electric field IEL when ink I is sprayed from the nozzle NZ. Therefore, the dipole DP can continuously receive forces from the electric field IEL until ink I is ejected from the nozzle NZ and reaches the target substrate SUB. However, the disclosure is not limited thereto. Optionally, the probe unit 150 can form the electric field IEL after ink I has been sprayed onto the target substrate SUB. In this case, the dipole DP can be sprayed onto the target substrate SUB in a random orientation and can later be aligned in one direction within the sprayed ink I by the electric field IEL.

[0131] also, Figure 9 The diagram illustrates the formation of an electric field on the target substrate SUB by the probe unit 150 when ink I is sprayed onto the target substrate SUB, but the disclosure is not limited thereto. Optionally, in a subsequent step, after the electric field forming unit 100 moves to the heat treatment apparatus 900, the probe unit 150 may form an electric field IEL. That is, the probe unit 150 may form an electric field when ink I is sprayed or when the solvent SV of ink I is removed.

[0132] Furthermore, there is no particular limitation on the time at which the electric field forming unit 100 forms the electric field IEL on the target substrate SUB. In some embodiments, as will be described later, the electric field forming unit 100 may form the electric field IEL when or after ink I is sprayed from the inkjet head unit 330 or when or after light is applied by the light irradiation device 500. Additionally, the electric field forming unit 100 may form the electric field when placed in an area other than the printing portion of the dipole alignment device 1000, and this will be described later.

[0133] Although not specifically shown, in some embodiments, an electric field forming member may be further provided on the sub-stage 110. The electric field forming member can form an electric field on the target substrate SUB on the sub-stage 110 (i.e., on the third-direction DR3). In one embodiment, the electric field forming member may be an antenna element or a device including multiple electrodes.

[0134] The ink I sprayed onto the target substrate SUB comprises dipoles DP, which can receive electricity from the electric field IEL generated by the electric field forming unit 100 and thus can be oriented in one direction. In some embodiments, the dipoles DP may comprise a semiconductor material with a high specific gravity, and the solvent SV of the ink I may be a high-viscosity solution, allowing the high-specific-gravity dipoles DP to be dispersed for a long time. In this case, even if the electric field forming unit 100 generates the electric field IEL, the dipoles DP may not be properly oriented.

[0135] To improve the orientation of the dipole DP through the electric field IEL, the dipole alignment device 1000 may include an illumination device 500 for illuminating light. When light is applied to the ink I before the electric field IEL is formed by the electric field forming unit 100, the dipole moment of the dipole DP increases, allowing the dipole DP to receive a stronger force even from the same electric field IEL. In other words, the alignment responsiveness of the dipole DP relative to the electric field IEL can be increased. The illumination device 500 will be described below with reference to other figures.

[0136] Figure 10 This is a schematic cross-sectional view illustrating the operation of a light irradiation device according to a disclosed embodiment. Figure 10 This is a schematic plan view of the time-illuminating device 500 when viewed from the front.

[0137] The dipole alignment device 1000 may include a light irradiation device 500. The light irradiation device 500 may be disposed in the printing section PA, between the inkjet printing device 300 and the transport unit 700, but the disclosure is not limited thereto. The light irradiation device 500 may be located elsewhere. Various embodiments of the light irradiation device 500 will be described later with reference to other accompanying drawings.

[0138] The light illumination device 500 may include a second support member 510 and a light illumination unit 530. The light illumination device 500 may also include a sensing unit 590.

[0139] The second support member 510 may extend in the second direction DR2 and may be positioned above the first STA1 of the printing section PA. Although not specifically shown, the second support member 510 may be connected to the base frame supporting the second support member 510, and the first STA1 may pass under the second support member 510. Figure 10 The shape of the second support member 510 of the light irradiation device 500 is schematically shown, but the shape of the second support member 510 of the light irradiation device 500 is not limited to... Figure 10 The shape shown is correct. The second support 510 can have various other structures, or may include, in addition to the shape shown. Figure 10 Other components besides those shown.

[0140] The sensing unit 590 can be disposed on the second support 510 of the light irradiation device 500, and can control the position of the light irradiation unit 530. The light irradiation device 500 can apply light hv to the electric field forming unit 100, and the sensing unit 590 can sense the position of the light irradiation device 500, thus allowing the light irradiation device 500 to apply light hv to a precise position. However, the disclosure is not limited thereto, and the sensing unit 590 may not be provided.

[0141] The light irradiation unit 530 can be mounted on the second support member 510. The light irradiation unit 530 can apply light hv to the electric field forming unit 100 mounted on the first STA1. There are no particular restrictions on the method of mounting the light irradiation unit 530 on the second support member 510. Figure 10 The light irradiation unit 530 is shown to be directly disposed on the second support member 510. However, alternatively, the light irradiation unit 530 may be coupled to the second support member 510 via a separate component or mounted on the second support member 510. Alternatively, the light irradiation unit 530 may be directly coupled to the second support member 510.

[0142] There is no particular limitation on the type of light irradiation unit 530. In some embodiments, the light irradiation unit 530 may include a mercury lamp, an Fe-based metal halide series, a Ga-based metal halide series, or a semiconductor light-emitting element, but the disclosure is not limited thereto.

[0143] The light irradiation device 500 can improve the alignment responsiveness of dipoles DP relative to an electric field IEL by applying light hv to ink I sprayed onto a target substrate SUB. The dipole DP may include a first end having a first polarity and a second end having a second polarity, and thus may have a dipole moment. The dipole DP with a dipole moment can receive a predetermined power from the electric field IEL formed by the electric field forming unit 100, and thus can be oriented in one direction. Here, when the light irradiation device 500 applies light hv, a portion of the polarity can be further formed in the dipole DP, such that the dipole moment of the dipole DP can be further increased, and the power from the electric field IEL can be further strengthened. Therefore, the alignment responsiveness of the dipoles DP dispersed in the ink I can be increased, and the dipoles DP can be oriented on the target substrate SUB with a high degree of alignment.

[0144] Figure 11 This is a schematic diagram illustrating how light is applied to a dipole according to a disclosed embodiment.

[0145] Reference Figure 11 Dipole DP is sprayed onto a target substrate SUB prepared on an electric field forming unit 100, and light irradiation device 500 can apply light hv to ink I sprayed onto the target substrate SUB. Here, a first region AA1 to which light hv is applied and a second region AA2 to which light hv is not applied can be defined on the target substrate SUB, and a first dipole DP1 and a second dipole DP2 can exist among the dipole DP dispersed in ink I. The first dipole DP1 is located in the first region AA1 and is therefore irradiated by light hv, while the second dipole DP2 is located in the second region AA2 and is therefore not irradiated by light hv.

[0146] The dipole moment of the first dipole DP1, irradiated by light hv, can become larger than that of the second dipole DP2, which is not irradiated by light hv. Electrons in the dipole DP, and thus possessing polarity, can respond to the light hv applied by the light irradiation device 500, further increasing the dipole moment between the first and second polarities of the dipole DP. Because the dipole DP has a large dipole moment, it can receive stronger electric current from the same electric field IEL, resulting in more uniform alignment of the dipole DP on the target substrate SUB.

[0147] like Figure 11 As shown, dipoles DP sprayed onto the target substrate SUB can receive forces from the electric field and thus can be oriented in a specific direction. Here, the first dipole DP1, irradiated by light hv, can receive a first force Fa and thus be oriented in one direction, while the second dipole DP2 can receive a second force Fb and thus be oriented in one direction. Since the dipole moment of the first dipole DP1 is larger than that of the second dipole DP2, the first force Fa can be stronger than the second force Fb. The dipoles DP can rotate or move in one direction from their initial positions (as marked by dashed lines) by receiving the first force Fa and the second force Fb. Since the second dipole DP2, oriented by the second force Fb, receives a relatively weak force, the second dipole DP2 can rotate or move a relatively small width or can be oriented unevenly or insufficiently. Conversely, since the first dipole DP1, oriented by the first force Fa, receives a relatively strong force, the first dipole DP1 can rotate or move a relatively large width or can be oriented relatively uniformly. The dipole alignment device 1000 includes a light irradiation device 500 that applies light hv to the dipole DP when the electric field IEL is formed by the electric field forming unit 100, and thus can improve the alignment and orientation of the dipole DP. As will be described later, it is possible to include the dipole DP in ( Figure 45 The alignment of the dipole DP is improved during the manufacturing of the display device 1.

[0148] Additionally, in some embodiments, the center wavelength range of the light hv applied by the light irradiation device 500 is not particularly limited. The light hv can vary depending on the type of dipole DP. As described later, the dipole DP can be a light-emitting element 30 comprising semiconductor material (see [link to relevant documentation]). Figure 43 The center wavelength range of the light hv applied by the light irradiation device 500 can be determined according to the active layer 33 included in the light-emitting element 30 (see...). Figure 43The wavelength range of the light emitted from the active layer 33 of the light-emitting element 30 can be changed. In one embodiment, when the light emitted from the active layer 33 of the light-emitting element 30 has a first wavelength range, the center wavelength range of the light hv applied by the light irradiation device 500 can be the first wavelength range. In one example, when the active layer 33 of the light-emitting element 30 emits blue light with a wavelength range of about 450 nm, the light hv applied by the light irradiation device 500 can have a wavelength range of about 450 nm. Similarly, when the active layer 33 of the light-emitting element 30 emits green light with a wavelength range of about 550 nm, the light hv applied by the light irradiation device 500 can have a wavelength range of about 550 nm, and when the active layer 33 of the light-emitting element 30 emits red light with a wavelength range of about 780 nm, the light hv applied by the light irradiation device 500 can have a wavelength range of about 780 nm. However, the disclosure is not limited to this example.

[0149] Once ink I is sprayed onto the target substrate SUB, the electric field forming unit 100 can be moved to the transport section TA of the dipole alignment device 1000. The transport section TA may include the transport unit 700, and thus can be used to transfer the electric field forming unit 100 to other areas such as the heat treatment section HA.

[0150] Figure 12 This is a schematic plan view of a transport unit according to a disclosed embodiment. Figure 12 This is a top view of the transport unit 700 when viewed from a third-party perspective on DR3 (e.g., when viewed from above).

[0151] Reference Figure 12 And further refer to Figure 1 The transport section TA of the dipole alignment device 1000 includes a transport unit 700.

[0152] The transport unit 700 can transfer the electric field forming unit 100 from the printing portion PA of the dipole alignment device 1000 to the heat treatment portion HA. Although not specifically shown, the dipole alignment device 1000 can transfer the electric field forming unit 100 to a region other than the heat treatment portion HA (such as a region adjacent to the transport portion TA), but the disclosure is not limited thereto. Once the dipole DP is aligned on the target substrate SUB that has passed through the heat treatment portion HA, the transport unit 700 can transfer the target substrate SUB to another region.

[0153] The transport unit 700 includes a first moving component 710, a second main body 720, and multiple support members 760 and 770. The transport section TA of the dipole alignment device 1000 includes a third track RL3 and a fourth track RL4 extending in a first direction DR1, and the transport unit 700 is disposed on the third track RL3 and the fourth track RL4. The transport unit 700 can move along the third track RL3 and the fourth track RL4 in the first direction DR1 via separate moving components. When the transport unit 700 moves, the electric field forming unit 100 can move in the first direction DR1 and can therefore be placed in the heat treatment section HA.

[0154] The first moving part 710 of the transport unit 700 can be positioned on the third track RL3 and the fourth track RL4. Although not specifically shown, the first moving part 710 can move on the third track RL3 and the fourth track RL4 in a first direction DR1 or a second direction DR2 via a moving member. The first moving part 710 of the transport unit 700 may include a drive capable of rotation in one direction. Figure 12 As shown, the supports 760 and 770 of the transport unit 700 can be oriented toward one side of the first direction DR1 (e.g., the area where the printed portion PA is located). Since the first moving part 710 of the transport unit 700 includes a driver and is therefore capable of rotating in one direction, the supports 760 and 770 can be positioned to be oriented toward the second direction DR2 or toward the other side of the first direction DR1 (i.e., the heat treatment portion HA). As will be described later, the electric field forming unit 100 placed on the supports 760 and 770 can be moved to another area via the transport unit 700.

[0155] The first moving part 710 may have a shape having a long side extending in the second direction DR2 and a short side extending in the first direction DR1, but the disclosure is not limited thereto. Figure 12 The shape of the first moving part 710 of the transport unit 700 is schematically shown. However, the first moving part 710 may have various other structures, or may include, in addition to, other components. Figure 12 Other components besides those shown.

[0156] The second body 720 of the transport unit 700 may be disposed in the first moving part 710. There are no particular restrictions on the method of disposing of the second body 720 in the first moving part 710. Figure 12 The second body 720 is shown to be directly disposed on the first movable member 710; however, alternatively, the second body 720 may be coupled to or mounted on the first movable member 710 via a separate component. Alternatively, the second body 720 may be directly coupled to the first movable member 710.

[0157] The transport unit 700 may include supports 760 and 770 disposed within the second body 720. Supports 760 and 770 include a first support 760 and a second support 770 spaced apart from each other and extending in one direction. The first support 760 and the second support 770 may support the electric field forming unit 100 to transfer the electric field forming unit 100 from the printed portion PA to another area. The electric field forming unit 100 may be disposed on the first support 760 and the second support 770 of the transport unit 700, and therefore may be movable.

[0158] Figure 13 and Figure 14 This is a schematic diagram illustrating the operation of a transport unit according to a disclosed embodiment.

[0159] The following will refer to Figure 13 and Figure 14 Describe the operation of transport unit 700. First, refer to... Figure 13 The electric field forming unit 100, mounted on the first STA1, is placed on the first support 760 and the second support 770 of the transport unit 700. The first STA1 may include a plurality of push rods P, which can protrude from the top surface of the first STA1 to lift the electric field forming unit 100. When the push rods P protrude, the electric field forming unit 100 can be spaced apart from the top surface of the first STA1, and a space can be formed between the electric field forming unit 100 and the top surface of the first STA1.

[0160] Subsequently, the first moving part 710 of the transport unit 700 moves, and the first support 760 and the second support 770 are inserted between the top surface of the first STA1 and the bottom surface of the electric field forming unit 100. Once the first support 760 and the second support 770 are inserted into the space formed by the top rod P, the second body 720 or the first support 760 and the second support 770 can move on the third direction DR3 to further lift the electric field forming unit 100. As a result of the operation of the transport unit 700, the electric field forming unit 100 is separated from the first STA1 and placed on the first support 760 and the second support 770.

[0161] Subsequently, refer to Figure 14 The first moving part 710 of the transport unit 700 rotates, thereby positioning the electric field forming unit 100 facing the heat treatment section HA. The transport unit 700 can move in a first direction DR1 or a second direction DR2 or rotate in one direction, and thus can transfer the electric field forming unit 100 and the target substrate SUB to the desired area.

[0162] in addition, Figure 13The diagram shows the probe unit 150 of the electric field forming unit 100 separated from the target substrate SUB, and no electric field IEL is formed on the probe unit 150; however, the disclosure is not limited thereto. In some embodiments, even when the electric field forming unit 100 is transferred from the printing portion PA to another region via the transport unit 700, the electric field forming unit 100 can still form an electric field on the target substrate SUB, while the light irradiation device 500 can apply light hv to the target substrate SUB during the period when the electric field forming unit 100 is placed in a region other than the printing portion PA (e.g., in the transport portion TA) and transferred. This will be described later in conjunction with other disclosed embodiments.

[0163] Additionally, the dipole alignment device 1000 can evaporate ink I sprayed onto the target substrate SUB. The electric field forming unit 100 on the transport unit 700 can be transferred to the heat treatment section HA of the dipole alignment device 1000. The heat treatment apparatus 900 provided in the heat treatment section HA of the dipole alignment device 1000 will be described in detail below.

[0164] Figure 15 This is a schematic front view of a heat treatment apparatus according to a disclosed embodiment. Figure 15 This is a front view of the heat treatment equipment 900 when viewed in the first direction DR1 (e.g., when viewed from the front).

[0165] Reference Figure 1 and Figure 15 The heat treatment section HA of the dipole alignment device 1000 includes heat treatment equipment 900 and a second STA2.

[0166] The second STA2 can provide an area in which the electric field forming unit 100 is disposed, and the target substrate SUB is prepared on the electric field forming unit 100. Although not specifically shown, the second STA2 can move in the first direction DR1 via a separate moving member. When the second STA2 moves, the electric field forming unit 100 can also move in the first direction DR1 and can pass through the heat treatment equipment 900, thereby drying the ink I.

[0167] The heat treatment apparatus 900 may include a third support 910, a third body 930, and a heat treatment unit 950. The heat treatment unit 950 may be disposed on the bottom surface of the third body 930 mounted on the third support 910. The heat treatment apparatus 900 may remove solvent SV from ink I sprayed onto the target substrate SUB by applying heat or infrared light via the heat treatment unit 950. Dipole DP may remain on the target substrate SUB that has passed through the heat treatment apparatus 900.

[0168] The third support member 910 of the heat treatment equipment 900 can extend in the second direction DR2 and can be positioned above the second STA2. Although not specifically shown, the third support member 910 can be connected to the base frame supporting the third support member 910, and the second STA2 can pass under the third support member 910. Figure 15 The shape of the third support member 910 of the heat treatment equipment 900 is schematically shown, but the shape of the third support member 910 is not limited to... Figure 15 The shape shown is correct. The third support 910 can have various other structures, or may include, in addition to the shape shown. Figure 15 Other components besides those shown.

[0169] A third body 930 is disposed on the third support 910. The third body 930 may extend in the second direction DR2 and may provide space in which a heat treatment unit 950 may be disposed. The third body 930 may cover one side of the target substrate SUB (e.g., the side of the target substrate SUB that extends in the second direction DR2). That is, the length of the third body 930 in the second direction DR2 may be at least greater than the length of the side of the target substrate SUB that extends in the second direction DR2. Therefore, the heat treatment unit 950 disposed on the bottom surface of the third body 930 may also extend in the second direction DR2 and may cover the entire side of the target substrate SUB.

[0170] The heat treatment unit 950 can be disposed on the bottom surface of the third body 930 and can be separated from the target substrate SUB by a predetermined distance. The heat treatment unit 950 can be spaced apart from the target substrate SUB so that the components disposed on the target substrate SUB are not damaged by the heat or infrared light applied by the heat treatment unit 950. The distance between the heat treatment unit 950 and the target substrate SUB can be varied depending on the length of the heat treatment unit 950 or the third body 930 in the third direction DR3. There are no particular limitations on the type of heat treatment unit 950. In one example, the heat treatment unit 950 can be an IR irradiation device. In another example, a shielding device can also be disposed on the bottom surface of the heat treatment unit 950. The shielding device can partially block the heat or infrared light applied by the heat treatment unit 950 without damaging the target substrate SUB.

[0171] The heat treatment unit 950 can be mounted on the third body 930. The electric field forming unit 100 mounted on the second STA2 moves below the bottom surface of the heat treatment equipment 900 in the first direction DR1, and the heat treatment unit 950 can apply heat or infrared light over the entire length of the target substrate SUB in the second direction DR2.

[0172] In one embodiment, the heat treatment apparatus 900 can apply heat or infrared light to the area superimposed with the heat treatment unit 950, thereby removing the solvent SV from the ink I in the area superimposed with the heat treatment unit 950. That is, when the electric field forming unit 100 moves in one direction (e.g., in the first direction DR1), the solvent SV on the target substrate SUB can be removed sequentially along the direction along which the electric field forming unit 100 moves.

[0173] Figure 16 This is a schematic diagram illustrating the operation of a heat treatment apparatus according to a disclosed embodiment.

[0174] Reference Figure 16 The heat treatment equipment 900 can apply heat H to the area below the heat treatment equipment 900 that is stacked with the heat treatment unit 950. For example... Figure 16 As shown, heat H is applied only to the region of the target substrate SUB that overlaps with the heat treatment unit 950. In the region overlapped with the heat treatment unit 950, heat H can be applied simultaneously to some of the ink I sprayed onto the target substrate SUB. Conversely, heat H can be applied sequentially to the ink I that is separated from the heat treatment unit 950 in the first direction DR1 and therefore not overlapped with it. As the electric field forming unit 100 moves in the first direction DR1 and passes through the heat treatment apparatus 900, the solvent SV in the ink I sprayed onto the target substrate SUB can be removed sequentially. Figure 16 As shown, heat H can be applied to solvent SV on the target substrate SUB in the region superimposed with heat treatment unit 950, and solvent SV can be removed so that only dipole DP can remain in the region that has passed through heat treatment unit 950 (as marked by dashed lines).

[0175] Although not specifically shown, the electric field forming unit 100 may also include a control device for sensing and controlling the temperature on the target substrate SUB. If the temperature of the target substrate SUB rises above a certain level due to heat applied by the heat treatment unit 950 or infrared light, the target substrate SUB can be cooled by the control device.

[0176] Furthermore, the structure of the heat treatment apparatus 900 is not limited to... Figure 15 and Figure 16 The structure shown is described. In some embodiments, the heat treatment portion HA of the dipole alignment device 1000 can form a sealed space with the third body 930 of the heat treatment equipment 900, and can have a structure in which the heat treatment unit 950 is disposed in the space formed by the third body 930.

[0177] Figure 17 This is a schematic diagram of a heat treatment apparatus according to another disclosed embodiment.

[0178] Reference Figure 17 The heat treatment equipment 900, the second STA2 can be installed in the space formed by the third main body 930, and the heat treatment unit 950 can be installed on the inner side of the third main body 930. For example... Figure 17 As shown, the heat treatment unit 950 can be disposed on the upper side wall, left side wall, and right side wall of the third body 930, but the disclosure is not limited thereto. In this case, the second STA2 can move in different directions, and the electric field forming unit 100 transferred from the transport unit 700 can be placed on the second STA2. Heat can be applied to the space formed by the third body 930 through the heat treatment unit 950, and the ink on the target substrate SUB can be dried.

[0179] Furthermore, the heat treatment equipment 900 may be equipped with a pump capable of creating a vacuum within the space formed by the third body 930. The pump can create a vacuum within the space formed by the third body 930, and the ink I sprayed onto the target substrate SUB can be dried effectively. Furthermore, during the drying of the ink I, impurities can be prevented from adhering to the target substrate SUB.

[0180] Alternatively, the heat treatment unit 950 may not need to be housed in the third main body 930. Optionally, the heat treatment unit 950 may be embedded in a second STA2 that is equipped with the electric field forming unit 100.

[0181] Figure 18 This is a schematic diagram of a heat treatment apparatus according to another disclosed embodiment.

[0182] Reference Figure 18 The heat treatment unit 950 can be embedded in the second STA2 located in the heat treatment section HA of the dipole alignment device 1000, and the third body 930 can form a sealed space above the second STA2. In this case, the target substrate SUB can receive heat from the heat treatment unit 950 located below the electric field forming unit 100, and the solvent SV in the ink I can be removed. However, the disclosure is not limited thereto, and the structure and configuration of the heat treatment device 900 can be changed.

[0183] The dipole alignment device 1000 may include an electric field forming unit 100, an inkjet printing device 300, an optical irradiation device 500, a transport unit 700, and a heat treatment device 900, and is capable of orienting the dipole DP in one direction on the target substrate SUB. The dipole alignment device 1000 may use the optical irradiation device 500 to increase the dipole moment of the dipole DP, and may improve the alignment responsiveness of the dipole DP with the electric field IEL formed by the electric field forming unit 100.

[0184] Therefore, during the manufacture of a display device using the dipole alignment device 1000, the alignment degree of the dipoles DP on the target substrate SUB can be improved by performing the step of applying light using the light irradiation device 500. The method of aligning the dipoles DP using the dipole alignment device 1000 will be described in detail below.

[0185] Figure 19 This is a flowchart illustrating a dipole alignment method according to a disclosed embodiment. Figures 20 to 24 This is a schematic diagram illustrating how a dipole alignment device is used to align dipoles according to a disclosed embodiment.

[0186] Reference Figure 1 as well as Figures 19 to 24 The dipole (DP) alignment method may include the following steps: spraying ink I onto a target substrate SUB, ink I including a solvent SV in which dipoles DP are dispersed (S100); applying light to the target substrate SUB and forming an electric field on the target substrate SUB to align the dipoles DP on the target substrate SUB (S200); and removing the solvent SV and allowing the dipoles DP to settle on the target substrate SUB (S300).

[0187] The dipole (DP) alignment method can use the above reference. Figure 1 The described dipole alignment device 1000 may include the step of increasing the dipole moment of the dipole DP by applying light and forming an electric field IEL.

[0188] First refer to Figure 20 Prepare the target substrate SUB. In one embodiment, a first electrode 21 and a second electrode 22 may be disposed on the target substrate SUB. Figure 20 A pair of electrodes is shown. However, alternatively, multiple pairs of electrodes can be provided on the target substrate SUB, and multiple inkjet heads 335 can spray ink I onto each of the multiple pairs of electrodes in the same manner.

[0189] Subsequently, refer to Figure 21 Ink I, including solvent SV, is sprayed onto the target substrate SUB (S100), where solvent SV disperses dipoles DP. Ink I can be ejected from the inkjet print head 335 of the inkjet printing device 300 and can be sprayed onto the first electrode 21 and the second electrode 22 disposed on the target substrate SUB. This has already been described above, so its detailed description will be omitted.

[0190] Subsequently, refer to Figure 22 Light hv is applied to ink I sprayed onto the target substrate SUB. When the light irradiation device 500 applies light hv to ink I, electrons, including those in the dipole DP, can react to the light hv, causing the dipole moment of the dipole DP to increase (see...). Figure 22 The force received by the dipole DP' with an increased dipole moment from the electric field IEL formed by the electric field forming unit 100 can be made stronger in subsequent processes, and the dipole DP' can be aligned between the first electrode 21 and the second electrode 22. Here, the light irradiation device 500 can apply light hv to the dipole DP to increase the dipole moment of the dipole DP. As an example, Figure 22 The illustration shows the light irradiation device 500 applying light hv to a target substrate SUB, but the disclosure is not limited thereto. As described above, in some embodiments, the light irradiation device 500 may apply light hv to the target substrate SUB, or may apply light hv as ink I is ejected from the inkjet head 335, but the disclosure is not limited thereto.

[0191] Subsequently, refer to Figure 23 The dipole DP is aligned by forming an electric field IEL on the target substrate SUB (S200). The dipole DP can be placed between the first electrode 21 and the second electrode 22 by dielectrophoresis.

[0192] Specifically, an electrical signal is applied from probe unit 150 to the first electrode 21 and the second electrode 22. Probe unit 150 can be connected to a predetermined pad (not shown) disposed on the target substrate SUB, and can apply an electrical signal to the first electrode 21 and the second electrode 22 connected to the pad. In one embodiment, the electrical signal can be an AC voltage, which can be ±10V to ±50V, or can have a frequency of 10kHz to 1MHz. When the AC voltage is applied to the first electrode 21 and the second electrode 22, an electric field IEL is formed between the first electrode 21 and the second electrode 22, and the dielectrophoretic force from the electric field IEL can act on the dipole DP'. Due to the dielectrophoretic force, the dipole DP' can be positioned on the first electrode 21 and the second electrode 22 with changes in their orientation and position.

[0193] In some embodiments, the electric field forming unit 100 can form an electric field IEL on the target substrate SUB during the period when light hv is applied by the light irradiation device 500. The electric field forming unit 100 can be moved to the printing section PA, transport section TA, and heat treatment section HA of the dipole alignment device 1000, and the light irradiation device 500 can be disposed in one of the printing section PA, transport section TA, and heat treatment section HA. As described above, the dipole moment of the dipole DP' is increased by the light hv from the light irradiation device 500, and as a result, the dipole DP' can receive a stronger force from the electric field IEL. Therefore, in order to properly align the dipoles on the target substrate SUB, the electric field forming unit 100 can form the electric field IEL during the period when light is applied by the light irradiation device 500, but the disclosure is not limited thereto. Optionally, as described above, the electric field forming unit 100 can form the electric field IEL during the period when no light is applied.

[0194] Subsequently, refer to Figure 24 The solvent SV (S300) in the ink I sprayed onto the target substrate SUB is removed. Solvent SV removal can be performed by a heat treatment device 900, which applies heat H or infrared light to the target substrate SUB, causing the solvent SV to evaporate or volatilize. The method for applying heat H or infrared light by the heat treatment device 900 is as described above. Figure 16 Described.

[0195] When the solvent SV is removed from the ink I sprayed onto the target substrate SUB, the flow of the dipole DP is prevented, and the bonding force with respect to electrodes 21 and 22 is improved. Therefore, the dipole DP can be aligned on the first electrode 21 and the second electrode 22.

[0196] In this manner, the dipole alignment device 1000 can align the dipole DP on the target substrate SUB. The dipole alignment device 1000 includes a light irradiation device 500, which can improve the alignment responsiveness of the dipole DP.

[0197] Various embodiments of the dipole alignment device 1000 will be described below.

[0198] In one embodiment, the light irradiation device 500 may not be located in the printing section PA of the dipole alignment device 1000, but may be located in another area such as the transport section TA or the heat treatment section HA.

[0199] Figure 25 and Figure 26 This is a plan view of a dipole alignment device according to other embodiments.

[0200] Reference Figure 25The dipole alignment device 1000_1 and the light irradiation device 500_1 can be installed in the transport section TA. This embodiment is similar to... Figure 1 The difference in this embodiment is that the light irradiation device 500_1 is disposed in the transport section TA. This embodiment will be described below, focusing primarily on... Figure 1 Differences in the implementation examples.

[0201] exist Figure 25 In the dipole alignment device 1000_1, the light irradiation device 500_1 can be disposed in the transport section TA, so that light hv can be applied to the target substrate SUB before the electric field forming unit 100 is placed in the heat treatment device 900. The position of the light irradiation device 500 is not particularly limited when an electric field IEL is formed on the target substrate SUB by the probe unit 150 of the electric field forming unit 100, as long as the light irradiation device 500 can apply light hv before or during the formation of the electric field IEL by the electric field forming unit 100. If the light irradiation device 500_1 is disposed in the transport section TA, the target substrate SUB with ink I sprayed onto it in the printing section PA can be irradiated with light together with the electric field forming unit 100 after transfer via the transport unit 700. The light irradiation device 500_1 is shown disposed between the transport unit 700 and the heat treatment device 900, but the disclosure is not limited thereto. In some embodiments, the light irradiation device 500_1 can be disposed between the transport unit 700 and the inkjet printing device 300.

[0202] Therefore, before or during the formation of the electric field IEL by the electric field forming unit 100, the light irradiation device 500_1 can apply light hv to the target substrate SUB in the transport section TA.

[0203] Subsequently, refer to Figure 26 The dipole alignment device 1000_2 and the light irradiation device 500_2 can be installed in the heat treatment section HA. This embodiment is similar to... Figure 1 The difference in this embodiment is that the light irradiation device 500_1 is disposed in the heat treatment section HA. This embodiment will be described below, focusing primarily on... Figure 1 Differences in the implementation examples.

[0204] exist Figure 26 In the dipole alignment device 1000_2, the light irradiation device 500_2 can be installed in the heat treatment section HA, so that light hv can be applied to the target substrate SUB when the electric field forming unit 100 is installed in the heat treatment device 900 or the second STA2. If the light irradiation device 500_2 is installed in the heat treatment section HA, the light can be applied after it has been transferred from the electric field forming unit 100 to the heat treatment section HA via the transport unit 700.

[0205] Figure 27 It is shown Figure 26 A schematic diagram of the operation of the light irradiation device of the dipole alignment apparatus. Figure 27 The light irradiation device 500_2 is shown to be installed in the heat treatment device 900_2.

[0206] Reference Figure 27 The light irradiation device 500_2 can be installed in the heat treatment device 900_2, and the electric field forming unit 100 can form an electric field IEL on the target substrate SUB during the period when the light irradiation device 500_2 applies light hv. Although not specifically shown, the light irradiation device 500_2 can apply light to the target substrate SUB during the period when the heat treatment device 900_2 applies heat to the target substrate SUB.

[0207] In this configuration, when light is applied to the dipoles (DPs) in the ink (I) sprayed onto the target substrate (SUB), the alignment reactivity of the dipoles (DPs) can be improved. The dipoles (DPs) can be aligned by the electric field (IEL), while the solvent (SV) can be removed. Optionally, since the light irradiation device (500_2) is located within the heat treatment device (900_2), the electric field (IEL) can be formed during the application of light (hv) to the target substrate (SUB), while the solvent (SV) can be removed. As a result, even slight movement of the dipoles (DPs) during solvent (SV) removal can be prevented.

[0208] The light irradiation device 500 can be attached to the inkjet printing device 300 and the transport unit 700, and is therefore able to apply light to the target substrate SUB while moving together with the inkjet printing device 300 and the transport unit 700.

[0209] Figure 28 This is a schematic plan view of a dipole alignment device according to another disclosed embodiment. Figure 29 and Figure 30 It is shown Figure 28 A schematic diagram illustrating the operation of an inkjet printing device and a light irradiation device with a dipole alignment apparatus.

[0210] Reference Figures 28 to 30 The dipole alignment device 1000_3 and the light irradiation device 500_3 can be installed in the inkjet printing device 300. This embodiment is similar to... Figure 1 The difference in this embodiment is that the light irradiation device 500_3 is disposed within the inkjet printing device 300. This embodiment will be described below, focusing primarily on... Figure 1 Differences in the implementation examples.

[0211] Reference Figures 28 to 30The light irradiation device 500_3 can be disposed in the inkjet printing apparatus 300 and can move in one direction. The inkjet head unit 330_3 of the inkjet printing apparatus 300 can move in one direction and can spray ink I onto the target substrate SUB during the movement in one direction. In this regard, the light irradiation device 500_3 can move together with the inkjet head unit 330_3 in one direction and can apply light hv onto the target substrate SUB during the movement in one direction. In one embodiment, the light irradiation device 500_3 can apply light hv onto the target substrate SUB during the period when ink I is sprayed onto the target substrate SUB.

[0212] The inkjet head unit 330_3 or the light irradiation device 500_3 can spray ink I onto the target substrate SUB or apply light hv onto the target substrate SUB during movement along the second direction DR2. Although not specifically shown, in some embodiments, the electric field forming unit 100 can form an electric field on the target substrate SUB during the period when light is applied to the ink I. Other features of each of the inkjet printing device 300 and the light irradiation device 500_3 are the same as described above, and therefore their detailed description will be omitted.

[0213] Figure 31 This is a schematic plan view of a dipole alignment device according to another disclosed embodiment. Figure 32 yes Figure 31 A schematic front view of the transport unit of the dipole alignment device. Figure 33 It is shown Figure 31 A schematic diagram of the operation of the transport unit and the light irradiation equipment of the dipole alignment device.

[0214] Reference Figures 31 to 33 The dipole alignment device 1000_4 and the light irradiation device 500_4 can be installed in the transport unit 700. This embodiment is similar to... Figure 1 The difference in this embodiment is that the light irradiation device 500_4 is disposed in the transport unit 700. This embodiment will be described below, focusing primarily on... Figure 1 Differences in the implementation examples.

[0215] Reference Figures 31 to 33 The light irradiation device 500_4 can be installed in the transport unit 700, and can apply light hv to the target substrate SUB when the electric field forming unit 100 is placed on the first support 760 and the second support 770. Figures 31 to 33As shown, the light irradiation device 500_4 can be disposed in the second body 720_4 of the transport unit 700 and can move along with the first moving member 710_4. The light irradiation device 500_4 can be disposed on the surface of the second body 720_4 on which multiple supports 760 and 770 are provided, and can apply light hv to the supports 760 and 770. When the electric field forming unit 100 is transferred from the printing part PA to the transport part TA, the electric field forming unit 100 can be placed on the first support 760 and the second support 770, and at the same time, the light irradiation device 500_4 can apply light hv to the target substrate SUB.

[0216] In some embodiments, the light irradiation device 500_4 can apply light hv to an electric field forming unit 100 placed on supports 760 and 770, and the electric field forming unit 100 can form an electric field IEL on the target substrate SUB during the application of light by the light irradiation device 500_4. Figure 33 As shown, when the electric field forming unit 100 is moved while being mounted on supports 760 and 770, the light irradiation device 500_4 or the electric field forming unit 100 can apply light hv to the target substrate SUB or form an electric field IEL. Other features of each of the transport unit 700 and the light irradiation device 500_4 are the same as described above, and therefore their detailed description will be omitted.

[0217] Additionally, the light irradiation device 500 may also include a separate moving part, and thus be able to apply light while moving over the target substrate SUB in one direction.

[0218] Figure 34 This is a schematic plan view of a dipole alignment device according to another disclosed embodiment. Figure 35 It is shown Figure 34 A schematic diagram of the operation of the light irradiation device of the dipole alignment apparatus.

[0219] Reference Figure 34 and Figure 35 The dipole alignment device 1000_5 may further include a second moving member that moves the light irradiation device 500_5 in one direction, and the light irradiation unit 530 may be disposed in the second moving member. Although not specifically shown, even if the light irradiation device 500_5 is disposed in another component (such as the inkjet head unit 330 of the inkjet printing device 300 or the first moving member 710 or the second body 720 of the transport unit 700), the light irradiation device 500_5 can still move in one direction due to the separate second moving member. This embodiment is similar to... Figure 1 The difference in the embodiments is that the light irradiation device 500_5 includes a separate moving part and is therefore movable.

[0220] like Figure 35 As shown, the light irradiation device 500_5 can move in one direction (e.g., in the second direction DR2) and can apply light hv to the target substrate SUB. The light irradiation device 500_5 can apply light hv to one region of the target substrate SUB and then to another region on one side of said one region. The electric field forming unit 100 can form an electric field IEL on the target substrate SUB during the application of light hv by the light irradiation device 500_5. In this case, if the light irradiation device 500_5 applies light hv to said one region, the alignment reactivity of the dipoles DP dispersed in said one region can be oriented with a high degree of alignment; if the light irradiation device 500_5 applies light hv to said other region, the alignment reactivity of the dipoles DP dispersed in said other region can be oriented with a high degree of alignment. Descriptions of features or elements already described above in the embodiments will be omitted.

[0221] Figure 36 and Figure 37 This is a schematic plan view of a dipole alignment device according to other embodiments.

[0222] Reference Figure 36 The dipole alignment device 1000_6 and the light irradiation device 500_6 may further include a second moving part that moves in one direction. The light irradiation device 500_6 may be disposed in the transport section TA. (See reference...) Figure 37 The dipole alignment device 1000_7 and the light irradiation device 500_7 may also include a second moving part that moves in one direction. The light irradiation device 500_7 may be disposed in the heat treatment section HA. Figure 36 and Figure 37 Implementation examples and Figure 34 The difference in the embodiments is that the light irradiation devices 500_6 and 500_7 are respectively installed in the transport section TA and the heat treatment section HA. (The remaining text will be omitted.) Figure 36 and Figure 37 The description of each of the features or elements already described above in the embodiments.

[0223] Furthermore, the light irradiation device 500 is not limited to being fixed to any component. In some embodiments, the structure of the light irradiation device 500 can be changed.

[0224] Figures 38 to 40 This is a schematic diagram illustrating the operation of a light irradiation device according to other embodiments.

[0225] First refer to Figure 38The light irradiation device 500_8 can be mounted on the base frame and can move in one direction within the base frame. That is, the light irradiation device 500_8 can have a sliding structure within the base frame.

[0226] In one example, the light irradiation device 500_8 is set in the printing section (e.g.) Figure 1 As shown in the diagram, the light irradiation device 500_8 can be located inside the substrate frame until the electric field forming unit 100 reaches the area where the light irradiation device 500_8 is located. When the first STA1 moves, ink I can be sprayed onto the target substrate SUB on the electric field forming unit 100. Then, when the electric field forming unit 100 reaches the area where the light irradiation device 500_8 is located, the light irradiation device 500_8 can move in one direction to be exposed from the substrate frame and can apply light hv onto the target substrate SUB on the electric field forming unit 100.

[0227] Reference Figure 39 The light irradiation device 500_9 can be set in a base frame and can rotate about an axis within the base frame. That is, the light irradiation device 500_9 can be set in a base frame with a folded structure. Figure 39 Implementation examples and Figure 38 The difference in this embodiment is that the light irradiation device 500_9 is disposed within the base frame of the folded structure. Descriptions of the features or elements already described above in the embodiments will be omitted.

[0228] Reference Figure 40 The light irradiation device 500_10 can be positioned below the electric field forming unit 100_10. This embodiment is similar to... Figure 1 The difference in this embodiment is that the light irradiation device 500_10 is positioned in the area where the first STA1 is located. Descriptions of the features or elements already described above for this embodiment will be omitted.

[0229] like Figure 40As shown, the light irradiation device 500_10 can be disposed in the area of ​​the first STA1 pre-positioned with the printing portion PA. The light irradiation device 500_10 may include a movable component (such as the first STA1) and thus be movable in one direction, but the disclosure is not limited thereto. The light irradiation device 500_10 can be disposed below the electric field forming unit 100_10, and the light irradiation device 500_10 is superimposed on the area where the inkjet printing device 300_10 is positioned. The light irradiation device 500_10 can apply light hv in an upward direction from below the electric field forming unit 100_10. In some embodiments, the sub-stage 110_10 of the electric field forming unit 100_10 can be formed of a transparent material, and the light hv applied by the light irradiation device 500_10 can reach the target substrate SUB.

[0230] Additionally, the light irradiation device 500 may include a second moving part, and thus can move in the first direction DR1 and the second direction DR2.

[0231] Figure 41 This is a schematic diagram of a light irradiation device according to another disclosed embodiment. Figure 42 It is shown Figure 41 A floor plan showing the operation of the light irradiation equipment.

[0232] Reference Figure 41 and Figure 42 The light irradiation device 500_11 may further include a second movable member 520_11 movable in the first direction DR1 and the second direction DR2. When the second support member 510_11 is connected to the second movable member 520_11, the light irradiation unit 530_11 can move on the target substrate SUB in the first direction DR1 and the second direction DR2 according to the movement of the second movable member 520_11. This embodiment is similar to... Figure 1 The difference in this embodiment is that the light irradiation device 500_11 further includes a second moving part 520_11. This embodiment will be described below, focusing primarily on... Figure 1 Differences in the implementation examples.

[0233] like Figure 41 As shown, when the light irradiation device 500_11 includes a second moving member 520_11, the light irradiation device 500_11 can move on the target substrate SUB in a first direction DR1 and a second direction DR2. In some embodiments, if the size of the target substrate SUB is larger than the size of the light irradiation unit 530_11 of the light irradiation device 500_11, or if multiple target substrates SUB are disposed on the electric field forming unit 100, the light irradiation device 500_11 can uniformly apply light hv to the entire surface of the target substrate SUB during the movement of the second moving member 520_11.

[0234] Furthermore, in some embodiments, the light irradiation unit 530_11 of the light irradiation device 500_11 can be disposed on the side surface of the second support 510_11, and can apply light hv to the target substrate SUB below the light irradiation device 500_11. For example... Figure 42 As shown, when the light irradiation unit 530_11 of the light irradiation device 500_11 is disposed on the side surface of the second support member 510_11, the target substrate SUB can be configured to be stacked with the light irradiation unit 530_11. The second support member 510_11 and the second moving member 520_11 of the light irradiation device 500_11 can be configured not to be stacked with the electric field forming unit 100. The second moving member 520_11 can move in the first direction DR1 and the second direction DR2, and the light irradiation unit 530_11 can apply light hv to the entire surface of the target substrate SUB. Descriptions of the features or elements already described above in the embodiments will be omitted.

[0235] Alternatively, the dipole DP can be a light-emitting element that includes a conductive semiconductor. In one embodiment, a display device including a light-emitting element can be manufactured using a dipole alignment device 1000.

[0236] Figure 43 This is a schematic diagram of a light-emitting element according to a disclosed embodiment.

[0237] The light-emitting element 30 can be a light-emitting diode (LED), and more particularly, an inorganic LED (ILED) having a size of a few micrometers or nanometers and formed of inorganic materials. If an electric field is formed in a specific direction between two opposing electrodes, the ILED can be aligned between the two electrodes forming the polarity. The light-emitting element 30 can be aligned by the electric field formed between the two electrodes.

[0238] The light-emitting element 30 may have a shape extending in one direction. The light-emitting element 30 may have a rod, wire, or tube shape. In one embodiment, the light-emitting element 30 may have a cylindrical or rod shape. However, the shape of the light-emitting element 30 is not particularly limited to these. Optionally, the light-emitting element 30 may have a polygonal prism shape (such as a cube, cuboid, or hexagonal prism), or it may have a shape extending in one direction with its outer surface partially inclined. Multiple semiconductors included in the light-emitting element 30 may be sequentially arranged or stacked along the direction in which the light-emitting element 30 extends.

[0239] The light-emitting element 30 may include a semiconductor layer doped with impurities of any conductivity type (e.g., p-type or n-type). The semiconductor layer can receive electrical signals from an external power source to emit light within a specific wavelength range.

[0240] Reference Figure 43The light-emitting element 30 may include a first semiconductor layer 31, a second semiconductor layer 32, an active layer 33, an electrode layer 37, and an insulating film 38.

[0241] The first semiconductor layer 31 may include, for example, an n-type semiconductor having a first conductivity type. In one example, where the light-emitting element 30 emits light in the blue wavelength range, the first semiconductor layer 31 may include the semiconductor material Al. x Ga y In 1-x-y N (where 0 ≤ x ≤ 1, 0 ≤ y ≤ 1, and 0 ≤ x + y ≤ 1). Semiconductor material Al x Ga y In 1-x-y N can be at least one of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with an n-type dopant. The first semiconductor layer 31 can be doped with a dopant of a first conductivity type, such as Si, Ge, Se, or Sn. In one embodiment, the first semiconductor layer 31 can be n-GaN doped with n-type Si. The first semiconductor layer 31 can have a length of 1.5 μm to 5 μm, but the disclosure is not limited thereto.

[0242] A second semiconductor layer 32 is disposed on the active layer 33. The second semiconductor layer 32 may include, for example, a p-type semiconductor having a second conductivity type. In one example, where the light-emitting element 30 emits light in the blue or green wavelength range, the second semiconductor layer 32 may include the semiconductor material Al. x Ga y In 1-x-y N (where 0 ≤ x ≤ 1, 0 ≤ y ≤ 1, and 0 ≤ x + y ≤ 1). In one example, the semiconductor material Al x Ga y In 1-x-y N can be at least one of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with a dopant of a second conductivity type. In one example, the second semiconductor layer 32 can be doped with a dopant of a second conductivity type, and the p-type dopant can be, for example, Mg, Zn, Ca, or Ba. In one embodiment, the second semiconductor layer 32 can be p-GaN doped with p-type Mg. The second semiconductor layer 32 can have a length of 0.05 μm to 0.10 μm, but the disclosure is not limited thereto.

[0243] Figure 43The first semiconductor layer 31 and the second semiconductor layer 32 are shown to be formed as a single layer film, but the disclosure is not limited thereto. Optionally, depending on the material of the active layer 33, each of the first semiconductor layer 31 and the second semiconductor layer 32 may include more than one layer (such as a capping layer or a tensile strain barrier reduction (TSBR) layer). This will be described later with reference to other figures.

[0244] An active layer 33 is disposed between a first semiconductor layer 31 and a second semiconductor layer 32. The active layer 33 may comprise a single quantum well structure material or a multi-quantum well structure material. When the active layer 33 comprises a material with a multi-quantum well structure, the active layer 33 may have a structure in which multiple quantum layers and multiple well layers are alternately stacked. The active layer 33 can emit light by causing electron-hole pairs to recombine according to an electrical signal applied to it via the first semiconductor layer 31 and the second semiconductor layer 32. In one example, when the active layer 33 emits light in the blue wavelength range, the quantum layer may comprise a material such as AlGaN or AlGaInN. Specifically, when the active layer 33 has a multi-quantum well structure in which multiple quantum layers and multiple well layers are alternately stacked, the quantum layers may comprise a material such as AlGaN or AlGaInN, and the well layers may comprise a material such as GaN or AlInN. In one embodiment, when the active layer 33 comprises AlGaInN as its quantum layer and AlInN as its well layer, the active layer 33 may emit blue light with a center wavelength range of 450 nm to 495 nm.

[0245] However, the disclosure is not limited thereto. Optionally, depending on the wavelength of the light to be emitted, the active layer 33 may have a structure in which semiconductor materials with large band gaps and semiconductor materials with small band gaps are stacked alternately, or may include group III or group V semiconductor materials. There is no particular limitation on the type of light emitted by the active layer 33. The active layer 33 may emit light in the red or green wavelength range as needed, instead of blue light. The active layer 33 may have a length of 0.05 μm to 0.10 μm, but the disclosure is not limited thereto.

[0246] Light can be emitted not only from the outer peripheral surface of the light-emitting element 30 along its length, but also from both sides of the light-emitting element 30. The directionality of the light emitted from the active layer 33 is not particularly limited.

[0247] Electrode layer 37 may be an ohmic contact electrode, but the disclosure is not limited thereto. Optionally, electrode layer 37 may be a Schottky contact electrode. Light-emitting element 30 may include at least one electrode layer 37. Figure 43The illustration shows a light-emitting element 30 including an electrode layer 37, but the disclosure is not limited thereto. Optionally, the light-emitting element 30 may include more than one electrode layer 37, or may not have an electrode layer 37. However, the following description of the light-emitting element 30 can also be directly applied to light-emitting elements 30 having more than one electrode layer 37 or in conjunction with... Figure 43 The light-emitting element 30 has a different structure.

[0248] In the display device 1, when the light-emitting element 30 is electrically connected to an electrode (or contact electrode), the electrode layer 37 can reduce the resistance between the light-emitting element 30 and the electrode (or contact electrode). The electrode layer 37 may include a conductive metal. In one example, the electrode layer 37 may include at least one of Al, Ti, In, Au, Ag, ITO, IZO, and ITZO. Furthermore, the electrode layer 37 may include a semiconductor material doped with an n-type dopant or a p-type dopant. The electrode layer 37 may include the same material or different materials, but the disclosure is not limited thereto.

[0249] An insulating film 38 is configured to surround the first semiconductor layer 31, the second semiconductor layer 32, and the electrode layer 37. In one embodiment, the insulating film 38 may be configured to at least surround the active layer 33 and may extend in the direction along which the light-emitting element 30 extends. The insulating film 38 may protect the first semiconductor layer 31, the active layer 33, the second semiconductor layer 32, and the electrode layer 37. In one example, the insulating film 38 may be formed around the sides of the first semiconductor layer 31, the active layer 33, the second semiconductor layer 32, and the electrode layer 37, but expose the two ends of the light-emitting element 30 in the longitudinal direction.

[0250] Figure 43 The diagram shows an insulating film 38 formed extending along the length of the light-emitting element 30 and covering the sides of the first semiconductor layer 31, the active layer 33, the second semiconductor layer 32, and the electrode layer 37, but the disclosure is not limited thereto. The insulating film 38 may cover only the sides of the active layer 33 and some of the first semiconductor layer 31 and the second semiconductor layer 32, or it may cover only a portion of the sides of the electrode layer 37, such that the sides of the electrode layer 37 are partially exposed. The insulating film 38 may be formed as a circle in cross-sectional view in a region adjacent to at least one end of the light-emitting element 30.

[0251] The insulating film 38 may have a thickness of 10 nm to 1.0 μm, but the disclosure is not limited thereto. Preferably, the insulating film 38 may have a thickness of about 40 nm.

[0252] The insulating film 38 may include a material with insulating properties, such as SiO2. x SiN x SiO x Ny For example, AlN or Al2O3. Therefore, the insulating film 38 can prevent any short circuits that may occur when the active layer 33 is placed in direct contact with the electrodes that directly transmit electrical signals to the light-emitting element 30. In addition, since the insulating film 38 protects the outer surface of the light-emitting element 30, including the active layer 33, any degradation of the luminous efficiency of the light-emitting element 30 can be prevented.

[0253] In some embodiments, the outer surface of the insulating film 38 may undergo a surface treatment. During the manufacture of the display device 1, the light-emitting element 30 may be sprayed onto the electrode while being dispersed in a predetermined ink. Here, the surface of the insulating film 38 may be treated with a hydrophobic or hydrophilic method to keep the light-emitting element 30 dispersed in the ink and prevent it from agglomerating with other adjacent light-emitting elements 30.

[0254] The length h of the light-emitting element 30 can be in the range of 1 μm to 10 μm or 2 μm to 6 μm, preferably in the range of 3 μm to 5 μm. The light-emitting element 30 can have a diameter of 30 nm to 700 nm and an aspect ratio of 1.2 to 100, but the disclosure is not limited thereto. Depending on the composition of its respective active layers 33, different light-emitting elements 30 included in the display device 1 can have different diameters. Preferably, the light-emitting element 30 can have a diameter of about 500 nm.

[0255] The light-emitting element 30 may extend in one direction. The light-emitting element 30 may have the shape of a nanorod, nanowire, or nanotube. In one embodiment, the light-emitting element 30 may have a cylindrical or rod shape. However, there is no particular limitation on the shape of the light-emitting element 30, and the light-emitting element 30 may have various other shapes such as a cube, cuboid, or hexagonal prism.

[0256] Furthermore, the structure of the light-emitting element 30 is not limited to... Figure 43 As shown in the diagram, the light-emitting element 30 can have various other structures.

[0257] Figure 44 This is a schematic diagram of a light-emitting element according to another disclosed embodiment.

[0258] Reference Figure 44 The light-emitting element 30' can extend in one direction and can be partially tilted. That is, the light-emitting element 30' can partially have a conical shape.

[0259] In the light-emitting element 30', multiple layers can be formed to surround each other, rather than being stacked in one direction. Figure 44The light-emitting element 30' can be formed such that multiple semiconductor layers can surround at least a portion of the outer surface of another layer. The light-emitting element 30 may include a semiconductor core extending in one direction and an insulating film 38' formed around the semiconductor core. The semiconductor core may include a first semiconductor layer 31', an active layer 33', a second semiconductor layer 32', and an electrode layer 37'. Figure 44 The light-emitting element 30', apart from the shape of its layer, is similar to... Figure 43 The light-emitting element 30 is the same as that of the light-emitting element 30. In the following description, the light-emitting element 30' will focus mainly on the differences from the light-emitting element 30.

[0260] In one embodiment, the first semiconductor layer 31' may extend in one direction and may be tilted toward the center of the light-emitting element 30' at both ends. Figure 44 The first semiconductor layer 31' may include a main body portion and an upper end portion and a lower end portion. The main body portion has a rod shape or a cylindrical shape, and the upper end portion and the lower end portion are formed as inclined at the top and bottom of the main body portion. The upper end portion may be steeper than the lower end portion.

[0261] The active layer 33' is configured to surround the outer surface of the main body of the first semiconductor layer 31'. The active layer 33' may have an annular shape extending in one direction. The active layer 33' may not be formed on the upper and lower ends of the first semiconductor layer 31'. The active layer 33' may be formed only on the non-tilted side surface of the first semiconductor layer 31', but the disclosure is not limited thereto. Therefore, light emitted from the active layer 33' can be output not only through both ends of the light-emitting element 30' in the length direction, but also through the side surface of the light-emitting element 30'. Figure 44 The light-emitting element 30' can have a higher density than... Figure 43 The light-emitting element 30 has a wide active layer 33', and therefore can emit more light than the active layer 33'. Figure 43 The light-emitting element has a large light output of 30.

[0262] The second semiconductor layer 32' is configured to surround the outer surface of the active layer 33' and the upper end of the first semiconductor layer 31'. The second semiconductor layer 32' may include a main body and an upper end, the main body having an annular shape extending in one direction, and the upper end being formed as an inclination. That is, the second semiconductor layer 32' may be in direct contact with the side surface of the active layer 33' and the upper end of the first semiconductor layer 31'. However, the second semiconductor layer 32' may not be formed on the lower end of the first semiconductor layer 31'.

[0263] The electrode layer 37' is configured to surround the outer surface of the second semiconductor layer 32'. That is, the shape of the electrode layer 37' can be substantially the same as that of the second semiconductor layer 32'. In other words, the electrode layer 37' can contact the entire outer surface of the second semiconductor layer 32'.

[0264] The insulating film 38' can be configured to surround the outer surface of each of the electrode layer 37' and the first semiconductor layer 31'. The insulating film 38' can not only be in direct contact with the electrode layer 37', but also in direct contact with the lower end of the first semiconductor layer 31' and the exposed lower ends of the active layer 33' and the second semiconductor layer 32'.

[0265] In one embodiment, the dipole alignment device 1000 can... Figure 43 The light-emitting element 30 or Figure 44 The light-emitting element 30' is dispersed in ink I, and the ink I can be sprayed or jetted onto the target substrate SUB, thereby forming a display device 1 including the light-emitting element 30.

[0266] Figure 45 This is a schematic plan view of a display device according to a disclosed embodiment.

[0267] Reference Figure 45 Display device 1 displays moving or still images. Display device 1 can refer to almost any type of electronic device that provides a display screen. Examples of display device 1 may include televisions (TV), laptop computers, monitors, billboards, Internet of Things (IoT) devices, mobile phones, smartphones, tablet PCs, electronic watches, smartwatches, watch phones, head-mounted displays, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, game consoles, digital cameras, camcorders, etc.

[0268] The shape of the display device 1 can be changed. In one example, the display device 1 can have a rectangular shape that extends longer in the horizontal direction than in the vertical direction, a rectangular shape that extends longer in the vertical direction than in the horizontal direction, a square shape, a square shape with rounded corners, a non-square polygonal shape, or a circular shape. The shape of the display area DA of the display device 1 can be similar to the shape of the display device 1. Figure 1 The display device 1 and the display area DA are shown to have rectangular shapes that extend in the horizontal direction (fourth direction DR4).

[0269] Display device 1 may include a display area DA and a non-display area NDA. The display area DA may be the area where a screen is displayed, and the non-display area NDA may be the area where a screen is not displayed. The display area DA may also be referred to as the active area, and the non-display area NDA may also be referred to as the inactive area.

[0270] The display area DA may occupy the central portion of the display device 1. The display area DA may include a plurality of pixels PX. The pixels PX may be arranged in both row and column directions. The pixels PX may have a rectangular or square shape in a planar view, but the disclosure is not limited thereto. Optionally, the pixels PX may have a rhombus shape, with sides slanted relative to a particular direction. Each of the pixels PX may include one or more light-emitting elements 30 that emit light within a specific wavelength range, thus enabling the display of a specific color.

[0271] Figure 46 It is a plan view of the pixels of a display device according to a disclosed embodiment.

[0272] Reference Figure 46 Each pixel PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The first sub-pixel PX1 may emit light of a first color, the second sub-pixel PX2 may emit light of a second color, and the third sub-pixel PX3 may emit light of a third color. The first, second, and third colors may be blue, green, and red, respectively, but the disclosure is not limited thereto. Optionally, all sub-pixels PXn may emit light of the same color. Figure 46 It is shown that a pixel PX may include three sub-pixels PXn, but the disclosure is not limited thereto. Optionally, each of the pixels PX may include more than three sub-pixels PXn.

[0273] Each of the sub-pixels PXn in the display device 1 may include a region defined as an emission region EMA. The first sub-pixel PX1 may include a first emission region EMA1, the second sub-pixel PX2 may include a second emission region EMA2, and the third sub-pixel PX3 may include a third emission region EMA3. The emission region EMA may be defined as an area where the light-emitting element 30 of the display device is disposed and emits light within a specific wavelength range.

[0274] Although not specifically shown, each of the sub-pixels PXn of the display device 1 may also include a non-emissive region defined as the area outside the emitting region EMA. The non-emissive region may be an area where the light-emitting element 30 is not provided, so that light emitted by the light-emitting element 30 does not reach and therefore does not output.

[0275] Each of the pixels PXn in the display device 1 may include a plurality of electrodes 21 and 22, a light-emitting element 30, a plurality of contact electrodes 26, and a plurality of diaphragms. Figure 46 and Figure 47 (41, 42 and 43) and one or more insulating layers ( Figure 47 (51, 52 and 55).

[0276] Electrodes 21 and 22 may be electrically connected to the light-emitting element 30 and may receive a predetermined voltage to cause the light-emitting element 30 to emit light. At least some of electrodes 21 and 22 may be used to form an electric field in each of the sub-pixels PXn.

[0277] Electrodes 21 and 22 may include a first electrode 21 and a second electrode 22. In one embodiment, the first electrode 21 may be a separate pixel electrode for each sub-pixel PXn, and the second electrode 22 may be a common electrode along each common connection in the sub-pixels PXn. One of the first electrode 21 and the second electrode 22 may be the anode electrode of the light-emitting element 30, and the other electrode may be the cathode electrode of the light-emitting element 30. However, the disclosure is not limited thereto. Optionally, one of the first electrode 21 and the second electrode 22 may be the cathode electrode of the light-emitting element 30, and the other electrode may be the anode electrode of the light-emitting element 30.

[0278] The first electrode 21 and the second electrode 22 may include electrode trunks 21S and 22S and electrode branches 21B and 22B. The electrode trunks 21S and 22S extend in a fourth direction DR4, and the electrode branches 21B and 22B extend in a fifth direction DR5 that intersects the fourth direction DR4 and branch from the electrode trunks 21S and 22S.

[0279] The first electrode 21 may include a first electrode trunk 21S and one or more first electrode branches 21B, the first electrode trunk 21S extending in the fourth direction DR4, and one or more first electrode branches 21B branching from the first electrode trunk 21S to extend in the fifth direction DR5.

[0280] The first electrode backbone 21S of any pixel is spaced apart and terminates between the sub-pixels PXn of any pixel (e.g., in the fourth direction DR4). The first electrode backbones 21S of a pair of adjacent sub-pixels in the same row can fall substantially on the same straight line. Since the first electrode backbones 21S of the sub-pixels PXn are spaced apart from each other, different electrical signals can be applied to the first electrode backbones 21S of the sub-pixels PXn, and multiple sets of first electrode branches 21B of the sub-pixels PXn can be driven separately.

[0281] The first electrode branch 21B of the first electrode 21 may branch from at least a portion of the first electrode trunk 21S, may extend in the fifth direction DR5, and may terminate in a state spaced apart from the second electrode trunk 22S facing the first electrode trunk 21S.

[0282] The second electrode 22 may include a second electrode trunk 22S and a second electrode branch 22B. The second electrode trunk 22S extends in the fourth direction DR4 and is spaced apart from and faces the first electrode trunk 21S in the fifth direction DR5. The second electrode branch 22B branches from the second electrode trunk 22S and extends in the fifth direction DR5. A second end of the second electrode trunk 22S may be connected to the second electrode trunk 22S of an adjacent sub-pixel PXn in the fourth direction DR4. That is, unlike the first electrode trunk 21S, the second electrode trunk 22S may extend in the fourth direction DR4 across each of the sub-pixels PXn. The second electrode trunk 22S extending across each of the sub-pixels PXn may be connected to an outer portion of the display area DA or a portion of the non-display area NDA extending in one direction.

[0283] The second electrode branch 22B can be spaced apart from and face the first electrode branch 21B, and can terminate in a state spaced apart from the first electrode trunk 21S. The second electrode branch 22B can be connected to the second electrode trunk 22S, and the end of the second electrode branch 22B can be set in the corresponding sub-pixel PXn in a state spaced apart from the first electrode trunk 21S.

[0284] The first electrode 21 and the second electrode 22 can be electrically connected to the circuit element layer (not shown) of the display device 1 through contact holes (e.g., through the first electrode contact hole CNTD and the second electrode contact hole CNTS). Figure 46 It is shown that a first electrode contact hole CNTD is formed in each of the first electrode trunks 21S of the sub-pixel PXn, while only one second electrode contact hole CNTS is formed in a second electrode trunk 22 extending across each of the sub-pixels PXn, but the disclosure is not limited thereto. Optionally, the second electrode contact hole CNTS may also be formed in each of the sub-pixels PXn.

[0285] Dikes 41, 42, and 43 may include an outer dike 43 and a plurality of inner dikes 41 and 42, the outer dike 43 being disposed along the boundary of each of the sub-pixels PXn, and the plurality of inner dikes 41 and 42 being disposed near the center of each of the sub-pixels PXn on the underside of electrodes 21 and 22. Inner dikes 41 and 42 are not shown, but a first inner dike 41 and a second inner dike 42 may be provided, the first inner dike 41 being disposed below the first electrode branch 21B, and the second inner dike 42 being disposed below the second electrode branch 22B.

[0286] The outer embankment 43 can be disposed along the boundary of each of the sub-pixels PXn. Multiple first electrode trunks 21S can be spaced apart and terminated by the outer embankment 43. The outer embankment 43 can extend in the fifth direction DR5 and can be disposed along the boundary of each of the sub-pixels PXn arranged in the fourth direction DR4, but the disclosure is not limited thereto. Furthermore, the outer embankment 43 can extend in the fourth direction DR4 and can be disposed along the boundary of each of the sub-pixels PXn arranged in the fifth direction DR5. The outer embankment 43 can comprise the same material as the inner embankments 41 and 42 and can be formed simultaneously with the inner embankments 41 and 42 by a single process.

[0287] The light-emitting element 30 can be disposed between the first electrode 21 and the second electrode 22. A first end of the light-emitting element 30 can be electrically connected to the first electrode 21, and a second end of the light-emitting element 30 can be electrically connected to the second electrode 22. The light-emitting element 30 can be electrically connected to the first electrode 21 and the second electrode 22 via the contact electrode 26, which will be described later.

[0288] The light-emitting elements 30 can be configured to be spaced apart from each other substantially parallel to each other. The distance between the light-emitting elements 30 is not particularly limited. Multiple light-emitting elements 30 can be arranged adjacent to each other to form a group, and multiple other light-emitting elements 30 can be grouped together for a predetermined distance between them and can be oriented and aligned in a non-uniform density in one direction. Furthermore, in one embodiment, the light-emitting elements 30 can extend in one direction, and the direction in which the electrodes (e.g., the first electrode branch 21B and the second electrode branch 22B) extend can be substantially perpendicular to the direction in which the light-emitting elements 30 extend. However, the disclosure is not limited thereto. Optionally, the light-emitting elements 30 can be arranged obliquely relative to the direction in which they extend, rather than perpendicularly.

[0289] The light-emitting element 30 may include an active layer 33 comprising different materials, and thus may emit light in different wavelength ranges. In the display device 1, the light-emitting element 30 of the first sub-pixel PX1 may emit first light having a first wavelength as its center wavelength range, the light-emitting element 30 of the second sub-pixel PX2 may emit second light having a second wavelength as its center wavelength range, and the light-emitting element 30 of the third sub-pixel PX3 may emit third light having a third wavelength as its center wavelength range. Therefore, the first sub-pixel PX1 may emit first light, the second sub-pixel PX2 may emit second light, and the third sub-pixel PX3 may emit third light. In some embodiments, the first light may be blue light having a center wavelength range of 450 nm to 495 nm, the second light may be green light having a center wavelength range of 495 nm to 570 nm, and the third light may be red light having a center wavelength range of 620 nm to 750 nm. However, the disclosure is not limited thereto. The light hv applied by the light irradiation device 500 may be controlled according to the center wavelength range of the light emitted by the light-emitting element 30. This has been described above, and therefore its detailed description will be omitted.

[0290] Despite Figure 46 Although not specifically shown, the display device 1 may include a first insulating layer 51 covering portions of the first electrode 21 and the second electrode 22.

[0291] A first insulating layer 51 may be disposed in each of the sub-pixels PXn of the display device 1. The first insulating layer 51 may be configured to substantially cover the entire surface of the sub-pixel PXn, and may be configured to extend even between each pair of adjacent sub-pixels PXn. The first insulating layer 51 may be configured to cover at least a portion of the first electrode 21 and the second electrode 22. Although in Figure 46 Not specifically shown, but the first insulating layer 51 may be configured to expose portions of the first electrode 21 and the second electrode 22, particularly portions of the first electrode branch 21 and the second electrode branch 22B.

[0292] The contact electrode 26 may extend at least partially in one direction. The contact electrode 26 may contact the light-emitting element 30 and the electrodes 21 and 22, and the light-emitting element 30 may receive electrical signals from the first electrode 21 and the second electrode 22 through the contact electrode 26.

[0293] The contact electrode 26 may include a first contact electrode 26a and a second contact electrode 26b. The first contact electrode 26a and the second contact electrode 26b may be respectively disposed on the first electrode branch 21B and the second electrode branch 22B.

[0294] The first contact electrode 26a may be disposed on the first electrode 21 or the first electrode branch 21B to extend in the fifth direction DR5. The first contact electrode 26a may contact the first end of the light-emitting element 30. Furthermore, the first contact electrode 26a may contact the portion of the first electrode 21 exposed due to the absence of the first insulating layer 51 thereon. Therefore, the light-emitting element 30 can be electrically connected to the first electrode 21 through the first contact electrode 26a.

[0295] The second contact electrode 26b can be disposed on the second electrode 22 or the second electrode branch 22B, extending in the fifth direction DR5. The second contact electrode 26b can be spaced apart from the first contact electrode 26a in the fourth direction DR4. The second contact electrode 26b can contact the second end of the light-emitting element 30. Furthermore, the second contact electrode 26b can contact the portion of the second electrode 22 exposed due to the absence of the first insulating layer 51 thereon. Therefore, the light-emitting element 30 can be electrically connected to the second electrode 22 via the second contact electrode 26b. Figure 46 Two first contact electrodes 26a and one second contact electrode 26b are shown disposed in each of the sub-pixels PXn, but the disclosure is not limited thereto. The number of first contact electrodes 26a and second contact electrodes 26b can be varied depending on the number of first electrodes 21 and second electrodes 22 in each of the sub-pixels PXn or the number of first electrode branches 21B and second electrode branches 22B in each of the sub-pixels PXn.

[0296] In some embodiments, the width of the first contact electrode 26a and the second contact electrode 26b in one direction may be larger than the width of the first electrode branch 21B and the second electrode branch 22B in one direction, but the disclosure is not limited thereto. Optionally, the first contact electrode 26a and the second contact electrode 26b may be configured to cover only the sides of the first electrode branch 21B and the second electrode branch 22B.

[0297] In addition to the first insulating layer 51, the display device 1 may also include a circuit element layer and ( Figure 47 The second insulating layer 52 and ( Figure 47 The passivation layer 55 and the circuit element layer are positioned below the electrodes 21 and 22. The second insulating layer 52 and the passivation layer 55 are configured to cover at least a portion of the electrodes 21 and 22 and the light-emitting element 30. Reference will be made below. Figure 47 Describe the structure of display device 1.

[0298] Figure 47 It is along Figure 46 The sectional views taken by lines Xa-Xa', Xb-Xb', and Xc-Xc'.

[0299] Figure 47A cross-sectional view of the first sub-pixel PX1 is shown, which can also be directly applied to other pixels PX or other sub-pixels PXn. Figure 47 A cross-sectional view is shown, taken from one end to the other of one of the light-emitting elements 30 disposed in the first sub-pixel PX1.

[0300] In addition, although Figure 47 Not specifically shown, but the display device 1 may also include a circuit element layer positioned below electrodes 21 and 22. The circuit element layer may include multiple semiconductor layers and multiple conductive patterns, and therefore may include at least one transistor and a power line, but a detailed description thereof will be omitted.

[0301] Reference Figure 47 And further refer to Figure 46 The display device 1 may include a via layer 20, electrodes 21 and 22 disposed on the via layer 20, and a light-emitting element 30. A circuit element layer (not shown) may also be disposed below the via layer 20. The via layer 20 may include an organic insulating material, and thus can perform a surface planarization function.

[0302] Dikes 41, 42 and 43, electrodes 21 and 22 and light-emitting element 30 can be disposed on via layer 20.

[0303] Dikes 41, 42 and 43 may include inner dikes 41 and 42 and outer dike 43, with inner dikes 41 and 42 being spaced apart from each other in each of the sub-pixels PXn, and outer dike 43 being set along the boundary between each pair of adjacent sub-pixels PXn.

[0304] The outer dike 43 may extend in the fifth direction DR5 and may be set along the boundary of each of the sub-pixels PXn arranged in the fourth direction DR4, but the disclosure is not limited thereto. Furthermore, the outer dike 43 may extend in the fourth direction DR4 and may be arranged along the boundary of each of the sub-pixels PXn arranged in the fifth direction DR5. That is, the outer dike 43 may define the boundary of each of the sub-pixels PXn.

[0305] When used during the manufacturing of display device 1 Figure 1 When the dipole alignment device 1000 sprays ink, the outer dike 43 can prevent ink with light-emitting elements 30 dispersed therein from overflowing the boundary of each of the sub-pixels PXn. The outer dike 43 can separate ink with light-emitting elements 30 for different groups of different sub-pixels PXn, so that the ink does not mix together, but the disclosure is not limited thereto.

[0306] Inner embankments 41 and 42 may include a first inner embankment 41 and a second inner embankment 42 that are configured to be adjacent to the center of each of the sub-pixels PXn.

[0307] The first inner bank 41 and the second inner bank 42 can be configured to be spaced apart from each other and facing each other. The first electrode 21 can be disposed on the first inner bank 41, and the second electrode 22 can be disposed on the second inner bank 42. (Refer to...) Figure 46 and Figure 47 It is understandable that the first electrode branch 21B and the second electrode branch 22B are respectively disposed on the first inner dam 41 and the second inner dam 42.

[0308] The first inner dam 41 and the second inner dam 42 may be disposed in each of the sub-pixels PXn to extend in the fifth direction DR5, but the disclosure is not limited thereto. The first inner dam 41 and the second inner dam 42 may be disposed in each of the sub-pixels PXn to form a pattern on the entire surface of the display device 1. Dams 41, 42 and 43 may comprise polyimide (PI), but the disclosure is not limited thereto.

[0309] The first inner dam 41 and the second inner dam 42 can protrude at least partially from the via layer 20. The first inner dam 41 and the second inner dam 42 can protrude upward from the plane on which the light-emitting element 30 is disposed, and each of the protrusions of the first inner dam 41 and the second inner dam 42 can have an inclined side surface. Since the inner dams 41 and 42 protrude from the via layer 20 and therefore both have inclined side surfaces, light emitted by the light-emitting element 30 can be reflected by the inclined side surfaces of each of the inner dams 41 and 42. As will be described later, if the electrodes 21 and 22 disposed on the inner dams 41 and 42 comprise a material with high reflectivity, light emitted by the light-emitting element 30 can be reflected by the electrodes 21 and 22 and thus travel upward from the via layer 20.

[0310] As mentioned above, the dikes 41, 42, and 43 can comprise the same material and therefore can be formed using the same process. The outer dike 43 can be set along the boundary of each of the sub-pixels PXn to form a grid pattern, but the inner dikes 41 and 42 can be set in each of the sub-pixels PXn to extend in one direction.

[0311] Electrodes 21 and 22 can be disposed on the via layer 20 and the inner embankments 41 and 42. As mentioned above, electrodes 21 and 22 include electrode trunks 21S and 22S and electrode branches 21B and 22B.

[0312] Parts of the first electrode 21 and the second electrode 22 can be disposed on the via layer 20, and parts of the first electrode 21 and the second electrode 22 can be disposed on the first inner dam 41 and the second inner dam 42. As described above, the first electrode backbone 21S of the first electrode 21 and the second electrode backbone 22S of the second electrode 22 can extend in the fourth direction DR4, and the first inner dam 41 and the second inner dam 42 can extend in the fifth direction DR5 and are therefore disposed in each pair of adjacent sub-pixels PXn in the fifth direction DR5.

[0313] A first electrode contact hole CNTD, exposing a portion of the circuit element layer through via layer 20, can be formed in the first electrode backbone 21S of the first electrode 21. The first electrode 21 can be electrically connected to the transistor of the circuit element layer through the first electrode contact hole CNTD. The first electrode 21 can receive a predetermined electrical signal from the transistor.

[0314] The second electrode backbone 22S of the second electrode 22 can extend in one direction and can therefore be located even in a non-emitting area where the light-emitting element 30 is not located. A second electrode contact hole CNTS, exposing a portion of the circuit element layer through the via layer 20, can be formed in the second electrode backbone 22S. The second electrode 22 can be electrically connected to the power supply electrode through the second electrode contact hole CNTS. The second electrode 22 can receive a predetermined electrical signal from the power supply electrode.

[0315] A portion of the first electrode 21 and the second electrode 22 (e.g., the first electrode branch 21B and the second electrode branch 22B) may be disposed on the first inner dam 41 and the second inner dam 42. The light-emitting element 30 may be disposed in the gap between the first electrode 21 and the second electrode 22, that is, in the gap where the first electrode branch 21B and the second electrode branch 22B are spaced apart from each other and face each other.

[0316] Electrodes 21 and 22 may comprise a transparent conductive material. In one example, electrodes 21 and 22 may comprise materials such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO), but the disclosure is not limited thereto. In some embodiments, electrodes 21 and 22 may comprise a conductive material with high reflectivity. For example, electrodes 21 and 22 may comprise a material with high reflectivity, i.e., a metal such as silver (Ag), copper (Cu), or aluminum (Al). In this case, electrodes 21 and 22 may reflect incident light onto them and may emit light in the upward direction in each of the sub-pixels PXn.

[0317] Furthermore, electrodes 21 and 22 may have a structure consisting of one or more layers of transparent conductive material and a metal stack with high reflectivity, or may be formed as a single layer comprising transparent conductive material and metal. In one embodiment, electrodes 21 and 22 may have a stack of ITO / Ag / ITO / IZO, or may comprise an alloy comprising Al, nickel (Ni), or lanthanum (La), but the disclosure is not limited thereto.

[0318] A first insulating layer 51 is disposed on the via layer 20 and on the first electrode 21 and the second electrode 22. The first insulating layer 51 is configured to cover portions of the first electrode 21 and the second electrode 22. The first insulating layer 51 may be configured to cover most of the top surfaces of the first electrode 21 and the second electrode 22, and may expose portions of the first electrode 21 and the second electrode 22. The first insulating layer 51 may be configured to expose portions of the top surfaces of the first electrode 21 and the second electrode 22, for example, the top surface of the first electrode branch 21B on the first inner bank 41 and the top surface of the second electrode branch 22B on the second inner bank 42. That is, the first insulating layer 51 may be formed substantially on the entire surface of the via layer 20 and may include openings that expose portions of the first electrode 21 and the second electrode 22.

[0319] In one embodiment, the first insulating layer 51 may be formed to be partially recessed on its top surface between the first electrode 21 and the second electrode 22. In some embodiments, the first insulating layer 51 may comprise an inorganic insulating material, and the portion of the top surface of the first insulating layer 51 configured to cover the first electrode 21 and the second electrode 22 may be recessed due to a step difference formed by the underlying members. A light-emitting element 30 disposed on the first insulating layer 51 between the first electrode 21 and the second electrode 22 may form an empty space in the recessed portion of the top surface of the first insulating layer 51. The light-emitting element 30 may be configured to be partially spaced from the top surface of the first insulating layer 51, and the space may be filled with the material of the second insulating layer 52, which will be described later. However, the disclosure is not limited thereto. Optionally, the first insulating layer 51 may be formed with a flat top surface, such that the light-emitting element 30 may be disposed on the top surface of the first insulating layer 51.

[0320] The first insulating layer 51 protects the first electrode 21 and the second electrode 22 while simultaneously insulating them. Furthermore, the first insulating layer 51 prevents the light-emitting element 30 disposed on the first insulating layer 51 from directly contacting other components and thus being damaged by them. However, the shape and structure of the first insulating layer 51 are not particularly limited.

[0321] The light-emitting element 30 may be disposed on the first insulating layer 51 between electrodes 21 and 22. In one example, at least one light-emitting element 30 may be disposed on the first insulating layer 51 between electrode branches 21B and 22B, but the disclosure is not limited thereto. Although not specifically shown, at least some of the light-emitting elements 30 disposed in each of the sub-pixels PXn may be arranged in a region other than the region between electrode branches 21B and 22B. The light-emitting element 30 may be disposed on the mutually facing ends of the first electrode branch 21B and the second electrode branch 22B, and may be electrically connected to electrodes 21 and 22 via contact electrode 26.

[0322] In each of the light-emitting elements 30, multiple layers can be arranged in a horizontal direction relative to the via layer 20. The light-emitting element 30 of the display device 1 can extend in one direction and can have a structure in which multiple semiconductor layers are arranged sequentially in one direction. As mentioned above, in each of the light-emitting elements 30, the first semiconductor layer 31, the active layer 33, the second semiconductor layer 32, and the electrode layer 37 can be arranged sequentially along one direction, and the outer surfaces of the first semiconductor layer 31, the active layer 33, the second semiconductor layer 32, and the electrode layer 37 can be surrounded by an insulating film 38. The light-emitting element 30 disposed in the display device 1 can be arranged such that the direction in which the light-emitting element 30 extends can be parallel to the via layer 20, and the multiple semiconductor layers included in each of the light-emitting elements 30 can be arranged sequentially in a direction parallel to the top surface of the via layer 20. However, the disclosure is not limited thereto. Optionally, when the light-emitting element 30 has different structures, multiple layers can be arranged in each of the light-emitting elements 30 in a direction perpendicular to the via layer 20.

[0323] A first end of the light-emitting element 30 may contact the first contact electrode 26a, and a second end of the light-emitting element 30 may contact the second contact electrode 26b. In one embodiment, since the insulating film 38 is not formed on the two end surfaces of each of the light-emitting elements 30, the two end surfaces of each of the light-emitting elements 30 are exposed, and therefore the light-emitting element 30 may contact the first contact electrode 26a and the second contact electrode 26b at its two exposed end surfaces. However, the disclosure is not limited thereto. Optionally, at least a portion of the insulating film 38 may be removed, such that the sides of the two ends of each of the light-emitting elements 30 may be partially exposed.

[0324] The second insulating layer 52 may be partially disposed on the light-emitting element 30, which is disposed between the first electrode 21 and the second electrode 22. The second insulating layer 52 may be configured to surround a portion of the outer surface of the light-emitting element 30. During the manufacture of the display device 1, the second insulating layer 52 can protect and simultaneously fix the light-emitting element 30. Furthermore, in one embodiment, some of the material of the second insulating layer 52 may be disposed between the bottom surface of the light-emitting element 30 and the first insulating layer 51. As mentioned above, during the manufacture of the display device 1, the second insulating layer 52 may be formed to fill the gap formed between the first insulating layer 51 and the light-emitting element 30. Therefore, the second insulating layer 52 may be formed to surround the outer surface of the light-emitting element 30, but the disclosure is not limited thereto.

[0325] The second insulating layer 52 can be configured to extend in the fifth direction DR5 between the first electrode branch 21B and the second electrode branch 22B in a planar view. In one example, the second insulating layer 52 can have an island shape or a line shape above the via layer 20 in a planar view. In one embodiment, the second insulating layer 52 can be disposed on the light-emitting element 30.

[0326] The first contact electrode 26a and the second contact electrode 26b can be disposed on electrodes 21 and 22 and on the second insulating layer 52. The first contact electrode 26a and the second contact electrode 26b can be disposed on the second insulating layer 52 and spaced apart from each other. The second insulating layer 52 can insulate the first contact electrode 26a and the second contact electrode 26b, so that the first contact electrode 26a and the second contact electrode 26b do not directly contact each other.

[0327] The first contact electrode 26a can contact the exposed portion of the first electrode 21 on the first inner dam 41, and the second contact electrode 26b can contact the exposed portion of the second electrode 22 on the second inner dam 42. The first contact electrode 26a and the second contact electrode 26b can transmit the electrical signals transmitted from electrodes 21 and 22 to them to the light-emitting element 30.

[0328] Contact electrode 26 may include a conductive material. For example, contact electrode 26 may include ITO, IZO, ITZO or Al, but the disclosure is not limited thereto.

[0329] A passivation layer 55 may be disposed on the contact electrode 26 and the second insulating layer 52. The passivation layer 55 can protect the components disposed on the via layer 20 from the influence of the external environment.

[0330] Each of the first insulating layer 51, the second insulating layer 52, and the passivation layer 55 may comprise an inorganic insulating material or an organic insulating material. In one embodiment, the first insulating layer 51, the second insulating layer 52, and the passivation layer 55 may comprise materials such as silicon oxide (SiO2).x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y Inorganic insulating materials such as aluminum oxide (Al2O3) or aluminum nitride (AlN) are permitted. Furthermore, the first insulating layer 51, the second insulating layer 52, and the passivation layer 55 may comprise organic insulating materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, benzocyclobutene, cardo resin, siloxane resin, silsesquioxane resin, polymethyl methacrylate, polycarbonate, and polymethyl methacrylate-polycarbonate synthetic resin, but the disclosure is not limited thereto.

[0331] In summarizing the detailed description, those skilled in the art will appreciate that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the preferred embodiments of the invention disclosed are used only in a general and descriptive sense and not for limiting purposes.

Claims

1. A dipole alignment device, the dipole alignment device comprising: An electric field forming unit includes a stage and a probe unit, wherein the probe unit forms an electric field on the stage; An inkjet printing apparatus, comprising at least one inkjet head for spraying ink onto the stage, the ink comprising dipoles and a solvent therein dispersing the dipoles; The transport unit includes a first moving component that causes the electric field forming unit to move in at least one direction; as well as A light irradiation device includes a light irradiation unit that applies light to the ink sprayed onto the stage, thereby increasing the dipole moment of the dipoles in the ink.

2. The dipole alignment device according to claim 1, wherein, The light irradiation device is positioned between the inkjet printer and the transport unit, and applies the light after the ink is sprayed onto the stage.

3. The dipole alignment device according to claim 2, wherein, The electric field forming unit forms the electric field on the stage when the light is applied to the ink.

4. The dipole alignment device according to claim 3, wherein, The electric field forming unit forms the electric field on the stage during the period when the light is applied to the ink.

5. The dipole alignment device according to claim 2, wherein, The light irradiation device is disposed in the inkjet printing equipment and applies the light to the stage during the period when the ink is sprayed onto the stage.

6. The dipole alignment device according to claim 5, wherein, The inkjet printing device also includes a head base that moves in one direction, and The inkjet head is disposed in the head base.

7. The dipole alignment device according to claim 6, wherein, The light irradiation device further includes a second moving component that moves in the one direction, and The light irradiation unit is disposed in the second moving component.

8. The dipole alignment device according to claim 1, wherein, The transport unit includes multiple support members disposed in the first moving component, and The electric field forming unit moves while being mounted on the support.

9. The dipole alignment device according to claim 8, wherein, The light irradiation device is disposed in the transport unit and applies the light to the stage of the electric field forming unit while being loaded on the support.

10. The dipole alignment device according to claim 9, wherein, The electric field forming unit forms the electric field on the platform during the period when the light is applied by the light irradiation device.

11. The dipole alignment device according to claim 1, further comprising: The heat treatment equipment applies heat to the electric field forming unit. The light irradiation device is disposed between the transport unit and the heat treatment device.

12. The dipole alignment device according to claim 11, wherein, The light irradiation device is installed in the heat treatment equipment, and The light irradiation device applies light to the stage during the period when the heat treatment device applies heat to the stage.

13. The dipole alignment device according to claim 12, wherein, The electric field forming unit forms the electric field on the platform during the period when the light is applied by the light irradiation device.

14. A dipole alignment method, the dipole alignment method comprising: Ink is sprayed onto a target substrate, the ink comprising dipoles and a solvent therein dispersing the dipoles; Light is applied to the target substrate to increase the dipole moment of the dipole in the ink and to form an electric field on the target substrate so as to align the dipole on the target substrate with the electric field; as well as The solvent is removed and the dipoles are deposited onto the target substrate. The wavelength range of the light applied to the target substrate corresponds to the wavelength range of the light emitted from the dipole.

15. The dipole alignment method according to claim 14, wherein, The step of aligning the dipole on the target substrate includes aligning the dipole such that the orientation of the dipole is aligned by the electric field.

16. The dipole alignment method according to claim 15, wherein, The step of applying light to the target substrate is performed during the formation of the electric field on the target substrate.

17. The dipole alignment method according to claim 16, wherein, The light applied to the target substrate is applied to the dipole.

18. The dipole alignment method according to claim 15, wherein, The step of applying the light to the target substrate includes applying the light to a first region defined on the target substrate and applying the light to a second region located on one side of the first region.

19. The dipole alignment method according to claim 14, wherein, The step of settling the dipole includes moving the target substrate to a heat treatment device with the use of a transport unit, and applying heat to the target substrate through the heat treatment device.

20. The dipole alignment method according to claim 19, wherein, The step of applying light to the target substrate is performed before the transport unit moves the target substrate, and The step of forming the electric field on the target substrate is performed during the transfer of the target substrate by the transport unit.

21. The dipole alignment method according to claim 20, wherein, The step of applying light to the target substrate is performed during the transfer of the target substrate by the transport unit.

22. The dipole alignment method according to claim 19, wherein, The step of applying light to the target substrate is performed before the heat treatment equipment applies heat to the target substrate, and The step of forming the electric field on the target substrate is performed during the heat treatment equipment when the heat is applied to the target substrate.

23. The dipole alignment method according to claim 22, wherein, The step of applying light to the target substrate is performed during the heat treatment process in which heat is applied to the target substrate.

24. The dipole alignment method according to claim 14, wherein, The target substrate includes a first electrode and a second electrode, and The step of depositing the dipole includes depositing the dipole onto the first electrode and the second electrode.

25. The dipole alignment method according to claim 24, wherein, An inkjet printer is used to perform the step of spraying the ink onto the target substrate.

26. A method of manufacturing a display device, the method comprising: Ink is sprayed onto a target substrate, the ink comprising a light-emitting element and a solvent therein for dispersing the light-emitting element, and a first electrode and a second electrode are formed on the target substrate; Applying light to the target substrate increases the dipole moment of the light-emitting element in the ink and creates an electric field on the first electrode and the second electrode; as well as The light-emitting element is deposited on the first electrode and the second electrode. The wavelength range of the light applied to the target substrate corresponds to the wavelength range of the light emitted from the light-emitting element.

27. The method according to claim 26, wherein, The light applied to the target substrate is applied to the light-emitting element.

28. The method according to claim 27, wherein, The first electrode and the second electrode extend in a first direction, and Simultaneously, the steps of forming the electric field on the first electrode and the second electrode and applying the light to the target substrate are performed.

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