Display panels and their manufacturing methods, display devices and splicing display devices

Abstract

The present disclosure provides a display panel and a preparation method thereof, a display device and a spliced ​​display device, which relate to the field of display technology. In order to solve the problem that the frame of the display device is not easy to be narrowed, the display panel includes: a backplane, a plurality of light-emitting devices, a plurality of first electrodes and a plurality of connecting leads. The backplane includes a first main surface and a second main surface relative to each other, and a plurality of side surfaces connecting the first main surface and the second main surface, at least one of the plurality of side surfaces is a selected side surface. A plurality of light-emitting devices and a plurality of first electrodes are arranged on the second main surface of the backplane; the plurality of first electrodes are electrically connected to the plurality of light-emitting devices. A plurality of connecting leads are arranged on the first main surface and the selected side surface of the backplane; each connecting lead passes through the selected side surface in sequence from the first main surface, and is electrically connected to one of the plurality of first electrodes. The above-mentioned display panel is used in a display device.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, a display device, and a spliced ​​display device. Background Art

[0002] Mini LED (mini Organic Light-Emitting Diode) display devices have the advantages of high brightness, clear display image and low power consumption, etc., and have good application prospects. They can be applied to large splicing display devices. In splicing display devices, the size of the splicing seam is an important factor affecting its display effect. Therefore, narrow-frame display devices have become one of the development trends. Summary of the invention

[0003] The present disclosure provides a display panel and a manufacturing method thereof, a display device and a spliced ​​display device, so as to narrow the frame of the display device and improve the display effect.

[0004] In order to achieve the above objectives, the embodiments of the present disclosure adopt the following technical solutions:

[0005] In one aspect, a display panel is provided, comprising: a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connecting leads. The backplane comprises a first main surface and a second main surface opposite to each other, and a plurality of side surfaces connecting the first main surface and the second main surface, at least one of the plurality of side surfaces being a selected side surface.

[0006] A plurality of light-emitting devices are arranged on the second main surface of the backplane. A plurality of first electrodes are arranged on the second main surface of the backplane; the plurality of first electrodes are close to the selected side surface relative to the plurality of light-emitting devices, and the plurality of first electrodes are electrically connected to the plurality of light-emitting devices. A plurality of connecting leads are arranged on the first main surface and the selected side surface of the backplane; each of the plurality of connecting leads includes a first portion located on the first main surface and a second portion located on the selected side surface, and the ratio of the thickness of the first portion to the thickness of the second portion is between 0.6 and 1.6; the connecting lead passes through the selected side surface in sequence from the first main surface and is electrically connected to one of the plurality of first electrodes.

[0007] The display panel provided by the present disclosure has the following effects:

[0008] In the display panel provided by some embodiments of the present disclosure, by setting a plurality of connecting leads on the first main surface and the selected side surface of the backplane, and connecting a plurality of first electrodes on the second main surface of the backplane to the first main surface of the backplane by using the plurality of connecting leads, the binding area of ​​the driver chip can be moved to the first main surface of the backplane, and the plurality of first electrodes can be electrically connected to the driver chip or the flexible circuit board in the display device where the display panel is located through the plurality of connecting leads, so that there is no need to set the binding area at the edge of the display panel, and the frame of the display panel can be reduced. Since the side of the display panel only has a plurality of connecting leads and other structures, the thickness of the structure set on the side surface of the display panel is small, and the thickness is, for example, 1um to 4um, so that an ultra-narrow frame display panel can be obtained. In addition, since the ratio of the thickness of the first part of each connecting lead to the thickness of the second part is between , the uniformity of the film thickness of the plurality of connecting leads can be guaranteed, and effective signal transmission can be achieved.

[0009] In some embodiments, the selected side surface includes a side sub-surface that is perpendicular or substantially perpendicular to the first main surface and the second main surface, and a first transition sub-surface connecting the first main surface and the side sub-surface. In a cross section of the backplane along a direction perpendicular to the first main surface and perpendicular to a backplane boundary where the side sub-surface is located, the angle between a tangent at any point on the first transition sub-surface and the first main surface is greater than 90°, and the angle between a tangent at any point on the first transition sub-surface and the side sub-surface is greater than 90°. The connecting lead passes through the first transition sub-surface and the side sub-surface of the selected side surface in sequence from the first main surface to be electrically connected to one of the plurality of first electrodes.

[0010] In some embodiments, in a direction perpendicular to the first main surface, one end of the plurality of first electrodes close to the selected side surface is flush or substantially flush with a side edge of the second main surface close to the selected side surface. The connecting lead extends from the first main surface through the first transition sub-surface and the side sub-surface of the selected side surface in sequence, to the side edge of the second main surface close to the selected side surface, and is electrically connected to the first electrode.

[0011] In some embodiments, there is a gap between one end of the first electrode close to the selected side surface and the side edge of the second main surface close to the selected side surface. The connecting lead also includes a third portion located on the second main surface, and the ratio of the thickness of the third portion to the thickness of the second portion is between 0.6 and 1.6; the connecting lead extends from the first main surface through the first transition sub-surface and the side sub-surface of the selected side surface in sequence, to the second main surface, and is electrically connected to the first electrode.

[0012] In some embodiments, the selected side surface further includes a second transition sub-surface connecting the side sub-surface and the second main surface. In a cross section of the backplane along a direction perpendicular to the first main surface and perpendicular to the backplane boundary where the side sub-surface is located, the angle between the tangent at any point on the second transition sub-surface and the second main surface is greater than 90°, and the angle between the tangent at any point on the second transition sub-surface and the side sub-surface is greater than 90°. The connecting lead passes through the first transition sub-surface, the side sub-surface and the second transition sub-surface of the selected side surface in sequence from the first main surface to be electrically connected to the first electrode.

[0013] In some embodiments, the first transition sub-surface is a plane or a curved surface. In the case where the selected side surface further includes a second transition sub-surface, the second transition sub-surface is a plane or a curved surface.

[0014] In some embodiments, the display panel further comprises: a plurality of second electrodes disposed on the first main surface; the plurality of second electrodes are configured to be electrically connected to a driving chip or a flexible circuit board; and each of the plurality of connecting leads is electrically connected to one of the plurality of second electrodes.

[0015] In some embodiments, the orthographic projections of the first electrode and the second electrode electrically connected to the same connecting lead on the first major surface at least partially overlap.

[0016] In some embodiments, portions of the plurality of connecting leads located on the first main surface are configured to be bound to a driving chip or a flexible circuit board.

[0017] In some embodiments, the first main surface of the backplane has a binding area; portions of the plurality of connecting leads located on the first main surface extend into the binding area and are configured to bind the driving chip or the flexible circuit board in the binding area.

[0018] In some embodiments, the length of the binding area is equal to or substantially equal to the length of the side edge of the first main surface close to the selected side surface; along the direction from the side edge of the first main surface close to the selected side surface to the binding area, the portions of the plurality of connecting leads located on the first main surface extend into the binding area. Alternatively, the length of the binding area is less than the length of the side edge of the first main surface close to the selected side surface; along the direction from the side edge of the first main surface close to the selected side surface to the binding area, the portions of the plurality of connecting leads located on the first main surface are gathered into the binding area.

[0019] In some embodiments, a plurality of signal lines are provided in the back panel; the plurality of first electrodes are electrically connected to the plurality of light-emitting devices through the plurality of signal lines; the width of the first electrode is the same as or approximately the same as the width of the signal line to which it is electrically connected; when the connecting lead also includes a third portion located on the second main surface, the width of the third portion is the same as or approximately the same as the width of the signal line to which it is electrically connected.

[0020] In some embodiments, the width of the first portion of the connecting lead is the same as or substantially the same as the width of the third portion thereof; the width of the second portion of the connecting lead is greater than the width of the first portion thereof and greater than the width of the third portion thereof.

[0021] In some embodiments, the portions of the multiple connecting leads located on the same selected side surface are arranged at equal intervals along a direction parallel to the backplane boundary where the side sub-surface of the selected side surface is located; and the spacing between two adjacent connecting leads among the multiple connecting leads located on different selected side surfaces is different.

[0022] In some embodiments, the plurality of first electrodes close to the same side sub-surface among the plurality of first electrodes are arranged at equal intervals in a direction parallel to the backplane boundary where the side sub-surface is located. The plurality of connecting leads disposed on the same side surface among the plurality of connecting leads are arranged at equal intervals in a direction parallel to the backplane boundary where the side sub-surface is located. In the case where the display panel further includes a plurality of second electrodes, the plurality of second electrodes close to the same side sub-surface among the plurality of second electrodes are arranged at equal intervals in a direction parallel to the backplane boundary where the side sub-surface is located.

[0023] In some embodiments, the plurality of connecting leads are prepared by a laser etching process, and the display panel further includes an energy absorbing film; the energy absorbing film is disposed between the first main surface of the back panel and the plurality of connecting leads.

[0024] In some embodiments, the material of the energy absorbing film includes at least one of tin dioxide and zinc oxide.

[0025] In some embodiments, each of the plurality of connecting leads includes a first buffer conductive pattern, a main conductive pattern, and a second buffer conductive pattern which are sequentially stacked, and the first buffer conductive pattern is closer to the back plate than the main conductive pattern. The adhesion between the first buffer conductive pattern and the back plate is greater than the adhesion between the main conductive pattern and the back plate; and the oxidation resistance of the second buffer conductive pattern is better than the oxidation resistance of the main conductive pattern.

[0026] In some embodiments, the material of the first buffer conductive pattern is the same as that of the second buffer conductive pattern, and the materials of the first buffer conductive pattern and the second buffer conductive pattern include at least one of titanium, chromium, molybdenum, and molybdenum-niobium alloy.

[0027] In some embodiments, the display panel further includes a first protective adhesive layer, and the first protective adhesive layer covers the plurality of connecting wires.

[0028] In some embodiments, the display panel also includes a second protective adhesive layer disposed on the side of the multiple light-emitting devices facing away from the back panel; the second protective adhesive layer covers the multiple light-emitting devices and the multiple first electrodes, and fills the gap area between the multiple light-emitting devices and the multiple first electrodes.

[0029] In some embodiments, the backplane includes a substrate and a driving circuit layer; the driving circuit layer is disposed on a surface of one side of the substrate close to the multiple light-emitting devices; the driving circuit layer is electrically connected to the multiple light-emitting devices and is configured to drive the multiple light-emitting devices to emit light.

[0030] On the other hand, a display device is provided, comprising: a display panel as described in the above aspect, and a driving chip; the driving chip is arranged on the first main surface of the back plate of the display panel, and the driving chip is electrically connected to multiple first electrodes of the display panel through multiple connecting leads of the display panel.

[0031] In the display device provided by the present disclosure, since a plurality of connecting leads connecting the first main surface and the second main surface of the back plate are provided in the display panel, the binding area can be transferred to the back side of the display panel, and the driving chip can be electrically connected to the front side of the display panel through the plurality of connecting leads to control the display panel for display, thereby reducing the area of ​​the peripheral region of the display panel, reducing the border of the display device, increasing the screen-to-body ratio, and improving the display effect.

[0032] In some embodiments, when the display panel further includes a plurality of second electrodes, the driving chip is electrically connected to the plurality of second electrodes so as to be electrically connected to the plurality of connecting leads through the plurality of second electrodes; or, the driving chip is electrically connected to a portion of the plurality of connecting leads located on the first main surface of the back panel.

[0033] In yet another aspect, a spliced ​​display device is provided, comprising: a plurality of the display devices as described above, wherein the plurality of display devices are spliced ​​and assembled.

[0034] Since the display device provided by the present disclosure is a display device with an ultra-narrow frame, when the multiple display devices are applied to a spliced ​​display device, the seam between two adjacent display devices is small, so that the display screen of the spliced ​​display device is more complete and the display effect is better.

[0035] In another aspect, a method for preparing a display panel is provided, comprising: providing an initial backplane; the initial backplane comprises a first main surface and a second main surface opposite to each other, and a plurality of side surfaces connecting the first main surface and the second main surface; the plurality of side surfaces are perpendicular or substantially perpendicular to the first main surface and the second main surface. A plurality of first electrodes are formed on the second main surface of the initial backplane; the plurality of first electrodes are close to at least one side surface of the plurality of side surfaces, and the at least one side surface is a selected side surface.

[0036] The interface between the first main surface and the selected side surface of the initial backplane is processed to form a first transition sub-surface at the interface, and the selected side surface forms a side sub-surface, thereby obtaining a backplane; the backplane includes a plurality of side surfaces connecting the first main surface and the second main surface, at least one of the plurality of side surfaces is a selected side surface, and the selected side surface includes a side sub-surface that is perpendicular or substantially perpendicular to the first main surface and the second main surface, and a first transition sub-surface that connects the first main surface and the side sub-surface. In a cross section of the backplane along a direction perpendicular to the first main surface and perpendicular to the backplane boundary where the side sub-surface is located, the angle between the tangent at any point on the first transition sub-surface and the first main surface is greater than 90°, and the angle between the tangent at any point on the first transition sub-surface and the side sub-surface is greater than 90°.

[0037] A plurality of connecting leads are formed on the first main surface and the selected side surface of the back plate; each of the plurality of connecting leads includes a first portion located on the first main surface and a second portion located on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is between 0.6 and 1.6; the connecting lead passes through the first transition sub-surface and the side sub-surface of the selected side surface in sequence from the first main surface, and is electrically connected to one of the plurality of first electrodes.

[0038] The beneficial effects that can be achieved by the method for preparing the display panel provided in the present disclosure are the same as the beneficial effects that can be achieved by the display panel provided by the present invention, and will not be elaborated here.

[0039] In some embodiments, a plurality of connecting leads are formed on the first main surface and the at least one side surface of the back plate, including:

[0040] A metal layer is formed on the first main surface and the selected side surface of the back plate, the metal layer is in contact with the plurality of first electrodes. The metal layer is patterned to form a plurality of connecting leads; each of the plurality of connecting leads is electrically connected to one of the plurality of first electrodes by sequentially passing through the first transition sub-surface and the side sub-surface of the selected side surface from the first main surface of the back plate.

[0041] In some embodiments, the plurality of connecting leads include a portion located on the selected side surface of the back plate and a portion located on the first main surface of the back plate, and the plurality of connecting leads are formed on the first main surface and the selected side surface of the back plate, comprising:

[0042] A metal layer is formed on the selected side surface of the back plate, the metal layer being in contact with the plurality of first electrodes, and the metal layer is patterned to obtain a portion where a plurality of connecting leads are located on the selected side surface of the back plate.

[0043] And, a mask is provided on the first main surface of the backplane, the mask being configured to expose the area on the first main surface of the backplane where the plurality of connecting leads need to be provided. Metal is deposited on the first main surface of the backplane to form a metal layer; the mask is removed to form a portion of the plurality of connecting leads located on the first main surface of the backplane, the portion of the plurality of connecting leads located on the first main surface of the backplane being electrically connected to a portion of the plurality of connecting leads located on the selected side surface of the backplane. A plurality of connecting leads are obtained, the plurality of connecting leads including a portion located on the selected side surface of the backplane and a portion located on the first main surface of the backplane; each of the plurality of connecting leads is electrically connected to one of the plurality of first electrodes by sequentially passing through the first transition sub-surface and the side sub-surface of the selected side surface from the first main surface of the backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0045] Figure 1 is a front structural diagram of a display panel according to some embodiments of the present disclosure;

[0046] Figure 2A Based on Figure 1An enlarged view of the front and back of region G of the display panel is shown;

[0047] Figure 2B Based on Figure 1 A schematic diagram of an orthographic projection of a display panel is shown;

[0048] Figure 3 is a front structural diagram of another display panel according to some embodiments of the present disclosure;

[0049] Figure 4A is a structural diagram of a backplane in a display panel according to some embodiments of the present disclosure;

[0050] Figure 4B is another structural diagram of a backplane in a display panel according to some embodiments of the present disclosure;

[0051] Figure 4C is a schematic diagram of an angle of a back plate in a display panel according to some embodiments of the present disclosure;

[0052] Figure 5A is a cross-sectional structural diagram of a display panel according to some embodiments of the present disclosure;

[0053] Figure 5B Based on Figure 5A An enlarged view of a region G' of the display panel is shown;

[0054] Figure 6 Based on Figure 5A A side structural diagram of the display panel shown;

[0055] Fig. 7A is a cross-sectional structural diagram of another display panel according to some embodiments of the present disclosure;

[0056] Figure 7B Based on Fig. 7A A side structural diagram of the display panel shown;

[0057] Fig. 8A is a cross-sectional structural diagram of another display panel according to some embodiments of the present disclosure;

[0058] Figure 8B is a rear structural diagram of another display panel according to some embodiments of the present disclosure;

[0059] Fig. 9A is a cross-sectional structural diagram of another display panel according to some embodiments of the present disclosure;

[0060] Fig. 9B is a cross-sectional structural diagram of another display panel according to some embodiments of the present disclosure;

[0061] Fig. 10A is a rear structural diagram of another display panel according to some embodiments of the present disclosure;

[0062] Fig. 10B is a rear structural diagram of another display panel according to some embodiments of the present disclosure;

[0063] Fig.11A is a front structural diagram of a display panel according to some embodiments of the present disclosure;

[0064] Fig. 11B is another front structural diagram of a display panel according to some embodiments of the present disclosure;

[0065] Fig. 11C is another front structural diagram of a display panel according to some embodiments of the present disclosure;

[0066] Fig. 12A is a structural diagram of a pixel in a display panel according to some embodiments of the present disclosure;

[0067] Fig. 12B A schematic diagram of an array layout structure corresponding to a pixel in a display panel provided in an embodiment of the present disclosure;

[0068] Fig.13 is a structural diagram of connection leads of a display panel according to some embodiments of the present disclosure;

[0069] Fig.14 is a structural diagram of a display device according to some embodiments of the present disclosure;

[0070] Fig.15 is a structural diagram of a spliced ​​display device according to some embodiments of the present disclosure;

[0071] Fig.16A is a flow chart of a method for preparing a display panel according to some embodiments of the present disclosure;

[0072] Fig. 16B is a flow chart of another method for preparing a display panel according to some embodiments of the present disclosure;

[0073] Figures 17A to 17F is a step diagram of a method for preparing a display panel according to some embodiments of the present disclosure;

[0074] Figures 18A to 18F is a step diagram of another method for preparing a display panel according to some embodiments of the present disclosure;

[0075] Fig.19 is another flow chart of a method for preparing a display panel according to some embodiments of the present disclosure;

[0076] Fig. 20 is another flow chart of a method for preparing a display panel according to some embodiments of the present disclosure;

[0077] Fig.21A is a structural diagram of a mask used in a method for preparing a display panel according to some embodiments of the present disclosure;

[0078] Fig. 21B is a structural diagram of another mask used in a method for preparing a display panel according to some embodiments of the present disclosure;

[0079] Fig. 22 is another flow chart of a method for preparing a display panel according to some embodiments of the present disclosure;

[0080] Fig.23 is a structural diagram of another mask used in a method for preparing a display panel according to some embodiments of the present disclosure;

[0081] Fig.24A A diagram showing a step of attaching a protective film in a method for preparing a display panel according to some embodiments of the present disclosure;

[0082] Fig. 24B is another step diagram of attaching a protective film in a method for preparing a display panel according to some embodiments of the present disclosure;

[0083] Fig.25 is a structural diagram of an overall tooling structure in a method for preparing a display panel according to some embodiments of the present disclosure;

[0084] Fig.26A Based on Fig.25 An enlarged view of the area G1 in the overall tooling structure shown;

[0085] Fig.26B Based on Fig.25 Another enlarged view of area G1 in the overall tooling structure is shown. DETAILED DESCRIPTION

[0086] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0087] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0088] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0089] “At least one of A, B and C” has the same meaning as “at least one of A, B or C”, and both include the following combinations: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0090] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0091] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0092] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0093] As used herein, "about" or "approximately" includes the stated value and the average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0094] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0095] The display device includes a display panel and a driver chip. The driver chip is a driver integrated circuit (IC) that drives the display panel to display. The driver chip includes, for example, a gate driver circuit, a source driver circuit, a timing controller, and a power supply circuit. The driver chip is electrically connected to the display panel and is configured to output corresponding signals to control the display panel to display.

[0096] In some embodiments, the display panel includes a display area and a peripheral area located on at least one side of the display area, wherein the peripheral area includes a binding area, and the driver chip is bound to the display panel in the binding area. That is, the binding area is set on the display surface (front) of the display panel, and the driver chip is bound to the front of the display panel. The area of ​​the peripheral area of ​​the display panel cannot be reduced, so that the border of the display device is wider, and an ultra-narrow border cannot be achieved, and the screen-to-body ratio of the display device cannot be increased.

[0097] Based on this, some embodiments of the present disclosure provide a display panel, a display device and a spliced ​​display device. By setting a plurality of connecting leads connecting two opposite main surfaces of a back plate in the display panel, the binding area is transferred to the non-display surface (back side) of the display panel, and the driving chip is bound to the back side of the display panel, thereby reducing the area of ​​the peripheral area of ​​the display panel, reducing the border of the display device, and reducing the width of the splicing seam of the splicing display device using the display device, thereby achieving seamless splicing and improving the display quality.

[0098] The display panel, display device and spliced ​​display device provided by the present disclosure are introduced respectively below.

[0099] In this disclosure, Figure 1 , Figure 3 , Fig.11A and Fig. 11B is a planar structural diagram of the display panel 10, Figure 2A (a) in Figure 1 The front enlarged view of area G of the display panel is shown, Figure 2A (b) in Figure 1 An enlarged view of the back side of area G of the display panel is shown. Figure 5A , Fig. 7A , Fig. 8A , Fig. 9A and Fig. 9B Based on Figure 2A A cross-sectional view of the display panel 10 obtained by taking the cross-sectional line DD' in FIG. Figure 5A The first electrode 3, the light emitting device 2 and the side lead 4 of the display panel are removed to obtain Figure 4A to Figure 4C The back panel 1 is shown.

[0100] Some embodiments of the present disclosure provide a display panel 10, such as Figure 1 , Figure 3 , Fig.11A and Fig. 11B As shown, the display panel 10 includes: an active area AA (hereinafter referred to as the AA area; also referred to as an effective display area) and a peripheral area BB located at least on one side of the AA area.

[0101] In the above-mentioned display panel 10, a plurality of pixels P' and a plurality of signal lines are arranged in the display area AA, and the plurality of signal lines are electrically connected to the plurality of pixels. Exemplarily, each pixel includes at least three-color sub-pixels P, and the plurality of-color sub-pixels P include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, and the first color, the second color, and the third color are three primary colors (e.g., red, green, and blue).

[0102] like Figure 1 to Figure 3 , Figure 5A As shown, in some embodiments, the display panel 10 includes a back plate 1 , a plurality of light emitting devices 2 , a plurality of first electrodes 3 and a plurality of connecting wires 4 .

[0103] See also Figure 4A to Figure 4C As shown, the back plate 1 includes a first main surface 1a and a second main surface 1b opposite to each other, and a plurality of side surfaces 1c connecting the first main surface 1a and the second main surface 1b, at least one of the plurality of side surfaces 1c being a selected side surface 1cc. Figure 1 and Figure 3 As shown, the first main surface 1 a and the second main surface 1 b of the back plate 1 are, for example, rectangular in shape, and the back plate 1 includes four side surfaces 1 c.

[0104] Exemplarily, the back panel 1 includes a substrate and a driving circuit layer arranged on one side of the substrate. The material of the substrate can be selected from rigid materials such as glass, quartz, and plastic. The driving circuit layer includes, for example, a thin film transistor (TFT) and the above-mentioned multiple signal lines and other structures. The driving circuit layer is coupled to the multiple light-emitting devices 2 and is configured to drive the multiple light-emitting devices 2 to emit light.

[0105] like Figure 1 , Figure 3 and Figure 5A As shown, a plurality of light-emitting devices 2 are arranged on the second main surface 1b of the backplane 1. The light-emitting devices 2 include but are not limited to organic light-emitting diodes (OLED), mini organic light-emitting diodes (mini LED), micro organic light-emitting diodes (micro LED), etc. Exemplarily, each sub-pixel P includes at least one light-emitting device 2.

[0106] A plurality of first electrodes 3 are disposed on the second main surface 1b of the back plate 1, the plurality of first electrodes 3 are close to the selected side surface 1cc relative to the plurality of light-emitting devices 2, and the plurality of first electrodes 3 are electrically connected to the plurality of light-emitting devices 2. Exemplarily, the plurality of light-emitting devices 2 are disposed in the display area AA of the display panel 10, and the plurality of first electrodes 3 are disposed in the peripheral area BB of the display panel 10. The plurality of first electrodes 3 are electrically connected to the plurality of light-emitting devices 2 through the driving circuit layer.

[0107] For example, Figure 1 and Figure 3 As shown, the plurality of first electrodes 3 are arranged on the second major surface 1b at a position close to the selected side surface 1cc, that is, the plurality of first electrodes 3 are closer to the side connected to the selected side surface 1cc among the four sides of the first major surface 1a.

[0108] like Figure 5A to Figure 6 As shown, a plurality of connecting leads 4 are arranged on the first main surface 1a and the selected side surface 1cc of the back plate 1. Each of the plurality of connecting leads 4 includes a first portion 41 located on the first main surface 1a and a second portion 42 located on the selected side surface 1cc, and the ratio of the thickness d1 of the first portion 41 to the thickness d2 of the second portion 42 is between 0.6 and 1.6. Each connecting lead passes through the selected side surface 1cc in sequence from the first main surface 1a to be electrically connected to one of the plurality of first electrodes 3.

[0109] like Figure 5BAs shown, the first portion 41 is the portion of the connecting lead 4 located on the first main surface 1a, including the portion of the connecting lead 4 that is directly in contact with the first main surface 1a. In the case where the connecting lead 4 and the second electrode 5 have an overlapping portion, the first portion 41 also includes a portion located on the surface of the second electrode 5 away from the first main surface 1a. The thickness d1 of the first portion 41 refers to the dimension of the first portion 41 in a direction perpendicular to the first main surface 1a. For example, the thickness d1 of the first portion 41 can be the thickness at any position of the first portion 41, for example Figure 5B The thickness d1 at two positions of the first portion 41 is shown. The second portion 42 is the portion of the connecting lead 4 located on the selected side surface 1cc. The thickness d2 of the second portion 42 refers to the dimension of the second portion 42 in a direction parallel to the first main surface 1a (a direction perpendicular to the side sub-surface 1c1 in the selected side surface 1cc). For example, the thickness d2 of the second portion 42 can be the thickness at any position of the second portion 42. For example Figure 5B The thickness d2 at two locations of the second portion 42 is illustrated.

[0110] The ratio of the thickness d1 of the first part 41 of each connecting lead 4 to the thickness d2 of the second part 42 is between 0.6 and 1.6, that is, in some embodiments, the thickness d2 of the second part 42 may be greater than the thickness d1 of the first part 41, and the difference between the thickness d2 of the second part 42 and the thickness d1 of the first part 41 is within a certain range. It should be noted that in each connecting lead 4, the ratio of the thickness d1 at any position of the first part 41 to the thickness d2 at any position of the second part 42 satisfies the above range, for example, the ratio of the maximum thickness d2 of the second part 42 to the minimum thickness d1 of the first part 41 is 0.6, which can ensure the uniformity of the film thickness of the connecting lead 4, make the thickness difference between the first part 41 and the second part 42 of the connecting lead 4 small, improve the connection stability of multiple connecting leads, and achieve effective signal transmission.

[0111] Exemplarily, the ratio of the thickness d1 of the first portion 41 of each connecting lead 4 to the thickness d2 of the second portion 42 is 0.6, 0.8 or 0.9, 1.1, etc. For example, the thickness d2 of the second portion 42 is greater than or equal to 900nm and less than or equal to 1100nm, and the thickness d1 of the first portion 41 is greater than or equal to 660nm and less than 900nm. For example, the thickness d2 of the second portion 42 is 1100nm, and the thickness d1 of the first portion 41 is 660nm, or the thickness d2 of the second portion 42 is 1020nm, and the thickness d1 of the first portion 41 is 816nm, or the thickness d2 of the second portion 42 is 1000nm, and the thickness d1 of the first portion 41 is 850nm.

[0112] The number of multiple connecting leads 4 is equal to the number of multiple first electrodes 3. Each connecting lead 4 is electrically connected to a first electrode 3 from the first main surface 1a through the selected side surface 1cc, thereby electrically connecting the first electrode 3 from the second main surface 1b of the back panel 1 to the opposite first main surface 1a.

[0113] In the display panel 10 provided in some embodiments of the present disclosure, a plurality of connecting leads 4 are arranged on the first main surface 1a and the selected side surface 1cc of the back plate 1, and a plurality of first electrodes 3 located on the second main surface 1b of the back plate 1 are connected to the first main surface 1a of the back plate 1 by using the plurality of connecting leads 4, so that the binding area of ​​the driving chip can be moved to the first main surface 1a of the back plate 1 (i.e., the back side of the display panel 10), and the plurality of first electrodes 3 can be electrically connected to the driving chip or the flexible circuit board in the display device 100 where the display panel 10 is located through the plurality of connecting leads 4. In this way, there is no need to set a binding area at the edge of the display panel 10, and the border of the display panel 10 is reduced. Since the side of the display panel 10 only has structures such as the plurality of connecting leads 4, the thickness of the structure arranged on the side surface 1c of the display panel 10 is relatively small, and the thickness is, for example, 1um to 4um, so that an ultra-narrow border display panel 10 can be obtained. Furthermore, since the ratio of the thickness d1 of the first portion 41 to the thickness d2 of the second portion 42 of each connecting lead 4 is between 0.6 and 1.6, the uniformity of the film thickness of the plurality of connecting leads 4 can be ensured, and effective signal transmission can be achieved.

[0114] In some embodiments, see Figure 4A to Figure 4C At least one side surface 1c of the multiple side surfaces 1c of the back panel 1 is a selected side surface 1cc, and the selected side surface 1cc includes a side sub-surface 1c1 that is perpendicular or approximately perpendicular to the first main surface 1a and the second main surface 1b, and a first transition sub-surface 1c2 connecting the first main surface 1a and the side sub-surface 1c1.

[0115] The present disclosure does not limit the structure of other side surfaces 1c among the multiple side surfaces 1c. Figure 1 As shown, the four side surfaces 1c of the back plate 1 are all selected side surfaces 1cc. Figure 3 As shown, one of the four side surfaces 1c of the back plate 12 has a side surface 1c ( Figure 3 The side surface 1c) to which the plurality of first electrodes 3 are close is the selected side surface 1cc, and the structures of the other three side surfaces 1c are not limited.

[0116] In a cross section of the back panel 1 along a direction perpendicular to the first main surface 1a and perpendicular to the back panel boundary where the side sub-surface 1c1 is located, the angle between the tangent at any point on the first transition sub-surface 1c2 and the first main surface 1a is greater than 90°, and the angle between the tangent and the side sub-surface 1c1 is greater than 90°.

[0117] It should be noted that the backplane boundary refers to the boundary of the orthographic projection of the backplane 1 on the plane where the first main surface 1a or the second main surface 1b of the backplane is located. For example, Figure 2B for Figure 1 The orthographic projection of the back panel 1 shown on the plane where the first main surface 1a is located includes four boundaries B1, B2, B3, and B4. For the back panel boundary of the back panel 1 including the first transition sub-surface 1c2, it refers to the edge of the side sub-surface 1c2 of the selected side surface 1cc of the back panel 1 adjacent to its first transition sub-surface 1c2, for example Figure 4A to Figure 4C Based on Figure 2A A cross-sectional view of the display panel 10 taken along the middle section line DD′ ( Figure 5A ) is a schematic diagram of the backplane 1, it can be seen Figure 4A to Figure 4C The backplane boundary where the side sub-surface 1c1 of the backplane 1 is located is the boundary B4, and the cross section of the backplane 1 perpendicular to the first main surface 1a and perpendicular to the backplane boundary (boundary B4) where the side sub-surface 1c1 is located is Figure 4A to Figure 4C Cross section shown.

[0118] In this disclosure, Figure 4A to Figure 4C As shown, the angle θ2 between the tangent at any point on the first transition sub-surface 1c2 and the first main surface 1a, and the angle θ1 between the tangent at any point on the first transition sub-surface 1c2 and the side sub-surface 1c1, both refer to the angles toward the inside of the back panel 1.

[0119] In the above-mentioned backplane 1, since the angle between the tangent at any point on the first transition sub-surface 1c2 of the backplane 1 and the first main surface 1a is greater than 90°, and the angle between the tangent at any point on the first transition sub-surface 1c2 and the side sub-surface 1c1 is greater than 90°, the first main surface 1a can be smoothly transitioned from the first transition sub-surface 1c2 to the side sub-surface 1c1, or the side sub-surface 1c1 can be smoothly transitioned from the first transition sub-surface 1c2 to the first main surface 1a, compared with the side surface 1c including the side sub-surface 1c1 but not including the first transition sub-surface 1c2, the first In the case where the main surface 1a is directly connected to the side sub-surface 1c1 (in this case, the angle between the first main surface 1a and the side sub-surface 1c1 is 90°), in the present disclosure, multiple connecting leads 4 are arranged on the first main surface 1a, the first transition sub-surface 1c2 and the side sub-surface 1c1 of the back panel 1, and each connecting lead 4 is subjected to less stress at the corner, thereby reducing the problem of wire breakage caused by excessive stress concentration. In this way, the multiple connecting leads 4 are not easy to break at the corner, ensuring that the multiple connecting leads 4 can stably connect the two opposite main surfaces of the back panel 1, thereby enhancing the reliability of the display panel 10.

[0120] In some embodiments, Figure 4A to Figure 4CAs shown, the selected side surface 1cc among the plurality of side surfaces 1c includes a second transition sub-surface 1c3 on the basis of the first transition sub-surface 1c2 and the side sub-surface 1c1; the second transition sub-surface 1c3 connects the side sub-surface 1c1 with the second main surface 1b.

[0121] In a cross section of the back plate 1 along a direction perpendicular to the first main surface 1a and perpendicular to the back plate boundary where the side sub-surface 1c1 is located, the angle θ4 between the tangent at any point on the second transition sub-surface 1c3 and the second main surface 1b is greater than 90°, and the angle θ3 between the tangent at any point on the second transition sub-surface 1c3 and the side sub-surface 1c1 is greater than 90°. Here, the angle between the tangent at any point on the second transition sub-surface 1c3 and the second main surface 1b, and the angle between the tangent at any point on the second transition sub-surface 1c3 and the side sub-surface 1c1, both refer to the angles toward the inside of the back plate 1.

[0122] like Figure 5A As shown, each connecting lead 4 passes through the first transition sub-surface 1c2, the side sub-surface 1c1 and the second transition sub-surface 1c3 from the first main surface 1a in sequence to be electrically connected to the first electrode 3.

[0123] Since the angle θ4 between the tangent at any point on the second transition sub-surface 1c3 and the second main surface 1b is greater than 90°, and the angle θ3 between the tangent at any point on the second transition sub-surface 1c3 and the side sub-surface 1c1 is greater than 90°, the second main surface 1b can be smoothly transitioned from the second transition sub-surface 1c3 to the side sub-surface 1c1, or the side sub-surface 1c1 can be smoothly transitioned from the second transition sub-surface 1c3 to the second main surface 1b, and multiple connecting leads 4 are arranged on the first main surface 1a, the first transition sub-surface 1c2, the side sub-surface 1c1 and the second transition sub-surface 1c3 of the back panel 1. Each connecting lead 4 is subjected to less stress at the corner, reducing the problem of wire breakage caused by excessive stress concentration. In this way, the multiple connecting leads 4 are not easy to break at the corner, further ensuring that the multiple connecting leads 4 can stably connect the two opposite main surfaces of the back panel 1, further enhancing the reliability of the display panel 10.

[0124] In some embodiments, Figure 4A to Figure 4C As shown, the first transition sub-surface 1c2 included in the side surface 1c is a plane or a curved surface. In the case where the side surface 1c further includes a second transition sub-surface 1c3, the second transition sub-surface 1c3 is a plane or a curved surface.

[0125] In the case where the first transition sub-surface 1c2 and the second transition sub-surface 1c3 are planes, the first transition sub-surface 1c2 is referred to as the chamfer of the first main surface 1a and the side sub-surface 1c1, and the second transition sub-surface 1c3 is referred to as the chamfer of the second main surface 1b and the side sub-surface 1c1. Figure 4AAs shown, the chamfer width d is 30um, and the accuracy of the chamfer is controlled at 20um to 30um, for example, the chamfer width d = 30±20um. The angle θ2 between the first transition sub-surface 1c2 and the first main surface 1a is greater than 90°, for example, θ2 is 135°, the angle θ1 between the first transition sub-surface 1c2 and the side sub-surface 1c1 is greater than 90°, for example, θ1 is 135°, the angle θ4 between the second transition sub-surface 1c3 and the second main surface 1b is greater than 90°, for example, θ4 is 135°, and the angle θ3 between the second transition sub-surface 1c3 and the side sub-surface 1c1 is greater than 90°, for example, θ3 is 135°.

[0126] When the first transition sub-surface 1c2 and the second transition sub-surface 1c3 are arc surfaces, the first transition sub-surface 1c2 is referred to as the rounded corner of the first main surface 1a and the side sub-surface 1c1, and the second transition sub-surface 1c3 is referred to as the rounded corner of the second main surface 1b and the side sub-surface 1c1. Figure 4B and Figure 4C As shown, a tangent is made at a point in the middle of the first transition sub-surface 1c2 (arc surface), and the angle θ2 between the tangent and the first main surface 1a is 135°, and the angle θ1 between the tangent and the side sub-surface 1c1 is 135°. A tangent is made at a point in the middle of the second transition sub-surface 1c3 (arc surface), and the angle θ4 between the tangent and the second main surface 1b is 135°, and the angle θ3 between the tangent and the side sub-surface 1c1 is 135°. Multiple connecting leads 4 are arranged on the arc surface, which can further disperse stress and further avoid the problem of wire breakage caused by excessive stress concentration.

[0127] In some embodiments, at least one side surface 1c of the multiple side surfaces 1c of the back panel 1 includes a first transition sub-surface 1c2 and a side sub-surface 1c1 (or also includes a second transition sub-surface 1c3), and the at least one side surface 1c is a selected side surface 1cc, and multiple connecting leads 4 are arranged on the selected side surface 1cc. The other side surfaces 1c may, for example, only include the side sub-surface 1c1, and the side sub-surface 1c1 is perpendicular or approximately perpendicular to the first main surface 1a and the second main surface 1b.

[0128] For example, Figure 1As shown, the four side surfaces 1c of the back panel 1 are all selected side surfaces 1cc, and each side surface 1c includes a first transition sub-surface 1c2 and a side sub-surface 1c1, or also includes a second transition sub-surface 1c3; a plurality of first electrodes 3 are distributed on the second main surface 1b near the four side edges of the second main surface 1b, for example, a plurality of first electrodes 3 are arranged on the second main surface 1b of the back panel 1 near the four side edges of the second main surface 1b; a plurality of connecting leads 4 correspond to and are connected to the plurality of first electrodes one by one, and are arranged on the four side surfaces 1c of the back panel 1, and each connecting lead 4 passes through the first transition sub-surface 1c2 and the side sub-surface 1c1 of the side surface 1c in sequence, and is electrically connected to one of the plurality of first electrodes 3.

[0129] For example, Figure 3 As shown, two of the four side surfaces 1c of the back plate 1 are selected side surfaces 1cc, for example, these two side surfaces are two opposite side surfaces, each side surface 1c includes a first transition sub-surface 1c2 and a side sub-surface 1c1, or also includes a second transition sub-surface 1c3, and a plurality of first electrodes 3 are distributed on the second main surface 1b near two opposite side edges of the second main surface 1b (the two side edges correspond to the two selected side surfaces 1cc). Each connecting lead 4 passes through the first transition sub-surface 1c2 and the side sub-surface 1c1 of the selected side surface 1cc in sequence from the first main surface 1a, and is electrically connected to one of the plurality of first electrodes 3. The other two side surfaces 1c of the four side surfaces 1c may, for example, include a side sub-surface 1c1, which is perpendicular or substantially perpendicular to the first main surface 1a and the second main surface 1b, and no connecting lead 4 is provided on the other two side surfaces 1c.

[0130] Exemplarily, one side surface 1c of the four side surfaces 1c of the back panel 1 is a selected side surface 1cc, or three side surfaces 1c of the four side surfaces 1c of the back panel 1 are selected side surfaces 1cc. For the case where the back panel 1 includes one selected side surface 1cc or three selected side surfaces 1cc, please refer to the above description of the back panel 1 including four selected side surfaces 1cc, which will not be repeated here.

[0131] In some embodiments of the present disclosure, the plurality of first electrodes 3 are arranged in the following manners.

[0132] In some embodiments, Figures 7A to 8AAs shown, in the direction perpendicular to the first main surface 1a, one end of the plurality of first electrodes 3 close to the side sub-surface 1c1 is flush or substantially flush with the side edge of the second main surface 1b close to the side sub-surface 1c1. The distance between one end of each first electrode 3 close to the side sub-surface 1c1 and the side edge of the second main surface 1b close to the side sub-surface 1c1 is zero or substantially zero, so that the positions of the plurality of first electrodes 3 are as close as possible to the side edge of the second main surface 1b, so that the area of ​​the display region of the display panel 10 can be expanded as much as possible.

[0133] Each of the plurality of connecting leads 4 extends from the first main surface 1a through the first transition sub-surface 1c2 and the side sub-surface 1c1 in sequence, to the side edge of the second main surface 1b close to the side sub-surface 1c1, and is electrically connected to the first electrode 3. Alternatively, each of the plurality of connecting leads 4 extends from the first main surface 1a through the first transition sub-surface 1c2, the side sub-surface 1c1 and the second transition sub-surface 1c3 in sequence, to the side edge of the second main surface 1b close to the side sub-surface 1c1, and is electrically connected to the first electrode 3. Fig. 7A and Fig. 8A As shown, in the cross section of the display panel 10 , each connecting lead 4 is L-shaped.

[0134] In some examples, such as Fig. 7A and Fig. 8A As shown, the electrical connection method between each connecting lead 4 and the first electrode 3 is that each connecting lead 4 extends to the side of the second main surface 1b close to the side sub-surface 1c1, contacts with one end of the first electrode 3 close to the side sub-surface 1c1, and realizes electrical connection, and there is no overlapping part between the connecting lead 4 and the first electrode 3.

[0135] In other embodiments, Figure 1 , Figure 2A , Figure 3 and Figure 5A As shown, there is a gap between one end of each of the plurality of first electrodes 3 close to the side sub-surface 1c1 and the side edge of the second main surface 1b close to the side sub-surface 1c1. In order to ensure the area of ​​the display region of the display panel 10, the gap between one end of each first electrode 3 close to the side sub-surface 1c1 and the side edge of the second main surface 1b close to the side sub-surface 1c1 is small, for example, Figure 2A and Figure 5A As shown, the spacing A1 between one end of each first electrode 3 close to the side sub-surface 1c1 and the side edge of the second main surface 1b close to the selected side surface 1cc is equal, for example, the spacing A1 is 30 μm to 50 μm.

[0136] like Figure 5AAs shown, each of the plurality of connecting leads 4 further includes a third portion 43 located on the second main surface 1b, and each connecting lead 4 extends from the first main surface 1a through the first transition sub-surface 1c2 and the side sub-surface 1c1 in sequence to the second main surface 1b, and is electrically connected to the first electrode 3, that is, each connecting lead 4 includes four portions located on the first main surface 1a, the first transition sub-surface 1c2, the side sub-surface 1c1, and the second main surface 1b. Alternatively, as Figure 5A and Figure 6 As shown, in the case where the side surface 1c of the back plate 1 also includes the second transition sub-surface 1c3, each of the plurality of connecting leads 4 extends from the first main surface 1a through the first transition sub-surface 1c2, the side sub-surface 1c1 and the second transition sub-surface 1c3 in sequence to the second main surface 1b and is electrically connected to the first electrode 3, that is, each connecting lead 4 includes five parts located on the first main surface 1a, the first transition sub-surface 1c2, the side sub-surface 1c1, the second transition sub-surface 1c3 and the second main surface 1b. Figure 5A As shown, in the cross section of the display panel 10 , the plurality of connecting leads 4 are in a U-shape.

[0137] In some examples, such as Figure 1 He Ru Figure 5A As shown, the electrical connection method between each connecting lead 4 and the first electrode 3 is that the orthographic projection of the portion of each connecting lead 4 located on the second main surface 1b on the second main surface 1b at least partially overlaps with the orthographic projection of the first electrode 3 electrically connected to the connecting lead 4 on the second main surface 1b, that is, the connecting lead 4 covers a portion of the first electrode 3 corresponding to it, thereby realizing electrical connection. In this way, each connecting lead 4 has a larger contact area with the first electrode 3 corresponding to it, so that the connecting lead 4 can fully contact with the first electrode 3, which is beneficial to signal transmission.

[0138] Or, if Figure 3 As shown, the portion of each connecting lead 4 extending to the second main surface 1 b contacts an end surface of the corresponding first electrode 3 close to the side sub-surface 1 c 1 to achieve electrical connection, and there is no overlapping portion between the connecting lead 4 and the first electrode 3 .

[0139] like Figure 5BAs shown, the third portion 43 is the portion of the connecting lead 4 located on the second main surface 1b, including the portion of the connecting lead 4 that is directly in contact with the second main surface 1b. In the case where there is an overlapping portion between the connecting lead 4 and the first electrode 3, the first portion 41 also includes a portion located on the surface of the second electrode 5 away from the first main surface 1a. In some embodiments, the ratio of the thickness d3 of the third portion 43 of each connecting lead 4 to the thickness d2 of the second portion 42 thereof is between 0.6 and 1.6. The thickness d3 of the third portion 43 mentioned above refers to the dimension of the first portion 41 in a direction perpendicular to the first main surface 1a. For example, the thickness d3 of the third portion 43 can be the thickness at any position of the first portion 41, for example Figure 5B The thickness d3 at two locations of the third portion 43 is illustrated.

[0140] See also Figure 5B , the thickness d2 of the second portion 42 of each connecting lead 4 is greater than the thickness d3 of the third portion 43, and the difference between the thickness d2 of the second portion 42 and the thickness d3 of the third portion 43 is within a certain range. It should be noted that, in each connecting lead 4, the ratio of the thickness d3 at any position of the third portion 43 to the thickness d2 at any position of the second portion 42 satisfies the above range. For example, the ratio of the maximum thickness d2 of the second portion 42 to the minimum thickness d3 of the third portion 43 is 60%. In this way, Figure 5B As shown, the difference in thickness between the first part 41, the second part 42 and the third part 43 of each connecting lead is within a certain range, which can further ensure the uniformity of the film thickness of the connecting lead 4, make the thickness difference between the first part 41 and the second part 42 of the connecting lead 4 smaller, further improve the connection stability of multiple connecting leads, and realize effective signal transmission.

[0141] Exemplarily, the ratio of the thickness d3 of the third portion 43 of each connecting lead 4 to the thickness d2 of the second portion 42 is 60%, 80% or 90%, etc. For example, the thickness d2 of the second portion 42 is greater than or equal to 900nm and less than or equal to 1100nm, and the thickness d3 of the third portion 43 is greater than or equal to 660nm and less than 900nm. For example, the thickness d2 of the second portion 42 is 1100nm, and the thickness d3 of the third portion 43 is 660nm, or the thickness d2 of the second portion 42 is 1020nm, and the thickness d3 of the third portion 43 is 816nm, or the thickness d2 of the second portion 42 is 1000nm, and the thickness d3 of the third portion 43 is 850nm.

[0142] As a possible design, the ratio of the thickness d1 of the first part 41 of each connecting lead 4 to the thickness d2 of the second part 42 is between 0.6-1.6; the ratio of the thickness d3 of the third part 43 to the thickness d2 of the second part 42 is between 0.6-1.6, and the difference between the thickness d3 of the third part 43 and the thickness d1 of the first part 41 is within 100nm. For example, the thickness d1 of the first part 41 of each connecting lead 4 is 816nm, the thickness d2 of the second part 42 is 1000nm, and the thickness d3 of the third part 43 is 850nm, so that the thickness of each part of each connecting lead 4 is relatively uniform, and the uniformity of the film thickness of multiple connecting leads is further improved, which is conducive to improving the connection stability of multiple connecting leads 4 and improving the stability of signal transmission.

[0143] In some embodiments, Figure 5A , Fig. 7A , Fig. 8A and Figure 8B As shown, the display panel 10 further includes: a plurality of second electrodes 5 disposed on the first major surface 1a. The plurality of second electrodes 5 are configured to be electrically connected to the driving chip or the flexible circuit board. A connecting lead 4 is electrically connected to one of the plurality of second electrodes 5.

[0144] The plurality of second electrodes 5 are disposed on the first main surface 1a of the back plate 1 and are configured to be electrically connected to the driver chip or the flexible circuit board, that is, the plurality of second electrodes 5 are used to bind the driver chip or the flexible circuit board. In some examples, the first main surface 1a of the back plate 1 has a binding area, at least a portion of the plurality of second electrodes 5 is located in the binding area, and the plurality of second electrodes 5 are bound to the driver chip or the flexible circuit board in the binding area. In other examples, such as Figure 8B As shown, the plurality of second electrodes are electrically connected to the binding area CC through the connection line 10, and are bound to the driving chip or the flexible circuit board through the connection line 10. Thus, the driving chip or the flexible circuit board can be arranged on the back of the display panel 10, and electrically connected to the front of the display panel 10 through the plurality of second electrodes 5, the plurality of first leads and the plurality of first electrodes 3, thereby controlling the light emitting device 2 to emit light and realize display.

[0145] The number of the multiple second electrodes 5 is consistent with the number of the multiple connecting leads 4. One end of each connecting lead 4 is electrically connected to the first electrode 3, and the other end is electrically connected to the second electrode 5. Through the multiple connecting leads 4, the multiple first electrodes 3 and the multiple second electrodes 5 can be connected one by one to achieve signal transmission.

[0146] In some embodiments, Figure 2A and Figure 5AAs shown, there is a gap between one end of the second electrode 5 close to the side sub-surface 1c1 and the side edge of the first main surface 1a close to the side sub-surface 1c1. Exemplarily, the gap A2 between one end of each first electrode 3 close to the side sub-surface 1c1 and the side edge of the second main surface 1b close to the side sub-surface 1c1 is equal, for example, the gap A2 is 400μm to 600μm.

[0147] like Figure 5A As shown, in some embodiments, the orthographic projection of the portion of each connecting lead 4 located on the first main surface 1a on the first main surface 1a at least partially overlaps with the orthographic projection of the second electrode 5 electrically connected to the connecting lead 4 on the first main surface 1a. In other words, the connecting lead 4 covers a portion of the second electrode 5 corresponding to it, so that each connecting lead 4 has a large contact area with the second electrode 5, so that the connecting lead 4 can fully contact with the second electrode 5, which is beneficial to signal transmission.

[0148] In some embodiments, Figures 9A to 10B As shown, the portion where the plurality of connecting leads 4 are located on the first main surface 1a of the back plate 1 is configured to bind a driving chip or a flexible circuit board. That is, the display panel 10 does not include a plurality of second electrodes 5, and the driving chip and the flexible circuit board in the display device 100 are directly bound to the portion where the plurality of connecting leads 4 are located on the first main surface 1a of the back plate 1, so that the driving chip or the flexible circuit board can be arranged on the back of the display panel 10, and electrically connected to the front of the display panel 10 through the plurality of first leads and the plurality of first electrodes 3, so as to control the light emitting device 2 to emit light and realize display.

[0149] The above-mentioned solution of directly binding the driving chip or the flexible circuit board with multiple connecting leads 4 can save the production of multiple second electrodes 5, simplify the preparation process of the display panel 10, improve the preparation efficiency, and avoid the contact resistance between the multiple second electrodes and the multiple connecting leads, which is beneficial to the transmission of electrical signals.

[0150] In some embodiments, the first main surface 1a of the back plate 1 has a binding area. Parts of the plurality of connecting leads 4 located on the first main surface 1a of the back plate 1 extend into the binding area and are configured to bind the driver chip or the flexible circuit board in the binding area.

[0151] In some examples, such as Fig. 10A As shown, the length k2 of the binding area CC is equal to or approximately equal to the length k1 of the side of the first main surface 1a close to the side sub-surface 1c1, and along the direction X pointing from the side of the first main surface 1a close to the side sub-surface 1c1 to the binding area, the portions of the multiple connecting leads 4 located on the first main surface 1a extend into the binding area CC.

[0152] Exemplarily, in the case where the backplane 1 includes a selected side surface 1cc, a plurality of connecting leads 4 are disposed on the selected side surface 1cc and the first main surface 1a, and are electrically connected to the plurality of first electrodes 3, and portions of the plurality of connecting leads 4 located on the first main surface 1a correspond one-to-one to the positions of the plurality of first electrodes 3. For example, the plurality of connecting leads 4 are parallel to each other and are disposed at equal intervals, and the plurality of connecting leads 4 extend from the selected side surface 1cc to the first main surface 1a, and then extend to the binding region CC of the first main surface 1a.

[0153] As a possible design, Fig. 10A As shown, the size setting of the parts of the multiple connecting leads 4 located on the first main surface 1a can be, for example: the width e2 of the first part 41 of each connecting lead 4 located on the first main surface 1a is 300μm~440μm, the spacing e1 between the parts of adjacent connecting leads 4 located on the first main surface 1a is 40μm~50μm, and the length e3 of the first part 41 of each connecting lead 4 located on the first main surface 1a is 800μm~150μm. The sizes of the parts of the multiple connecting leads 4 located on the first main surface 1a are set within a suitable range. In this way, the driving chip or the flexible circuit board can be firmly bound to the multiple connecting leads 4, and at the same time, the sizes of the parts of the multiple connecting leads 4 located on the first main surface 1a will not be too large, and the difficulty of the preparation process of the multiple connecting leads 4 will not be too great.

[0154] In the above embodiment, the display panel 10 can be matched with a flexible circuit board or a driver chip of a corresponding size. For example, the length of the flexible circuit board is equal to or approximately equal to the length of the side of the first main surface 1a of the back panel 1 close to the side sub-surface 1c1. In this case, the size of the flexible circuit board is larger, and the size of the portion where the above-mentioned multiple connecting leads 4 are located on the first main surface 1a can be set according to the size of the driver chip or flexible circuit board to be bound.

[0155] In other examples, such as Fig. 10B As shown, the length k3 of the binding area CC is smaller than the length k1 of the side of the first main surface 1a close to the side sub-surface 1c1; along the direction X from the side of the first main surface 1a close to the side sub-surface 1c1 pointing to the binding area, the parts of the multiple connecting leads 4 located on the first main surface 1a are gathered in the binding area CC.

[0156] Exemplarily, in the case where the backplane 1 includes a selected side surface 1cc, a plurality of connection leads 4 are disposed on the selected side surface 1cc and the first main surface 1a. The portions of the plurality of connection leads 4 located on the first main surface 1a include a first sub-portion, a second sub-portion, and a third sub-portion. The first portion 41 of each connection lead 4 located on the first main surface 1a includes a first sub-portion 41a, a second sub-portion 41b, and a third sub-portion 41c. Among them, the second sub-portion 41b of each connection lead 4 connects its first sub-portion 41a and its third sub-portion 41c. The first sub-portion 41a is closer to the side of the selected side surface 1cc of the first main surface 1a, and the third sub-portion 41c is located within the bonding region CC. The third sub-portion 41c of each connection lead 4 converges inward relative to its first sub-portion 41a, so that the portions of the plurality of connection leads 4 located on the first main surface 1a show a tendency to converge as a whole toward the bonding region CC.

[0157] As a possible design, the portions of the plurality of connection leads 4 located on the selected side surface 1cc are arranged parallel to each other and at equal intervals. Thus, the first sub-portions 41a of the portions of the plurality of connection leads 4 located on the first main surface 1a are arranged parallel to each other and at equal intervals, and the third sub-portions 41c of the portions of the plurality of connection leads 4 located on the first main surface 1a are arranged parallel to each other and at equal intervals. And the distance e8 between the third sub-portions 41c of two adjacent connection leads 4 located on the first main surface 1a is less than the distance e5 between the first sub-portions 41a of the two adjacent connection leads 4 located on the first main surface 1a, so that the portions of the plurality of connection leads 4 located on the first main surface 1a are converged within the bonding region CC.

[0158] Exemplarily, as Fig. 10B shown, the dimensional settings of the portions of the plurality of connection leads 4 located on the first main surface 1a can be, for example: the width e4 of the first sub-portion 41a of the first portion 41 of each connection lead 4 located on the first main surface 1a is 150 μm to 400 μm, the distance e5 between the first sub-portions 41a of the first portions 41 of two adjacent connection leads 4 is 140 μm to 300 μm, the width e7 of the third sub-portion 41c of the first portion 41 of each connection lead 4 is greater than 80 μm, the distance e8 between the third sub-portions 41c of two adjacent connection leads 4 is greater than 50 μm, e7 + e8 ≥ 130 um, and e7 < e4, e8 < e5. Along the direction X, the vertical distance e6 of the first portion 41 of each connection lead 4 located on the first main surface 1a is 1 mm to 2 mm.

[0159] In the above embodiment, the display panel 10 can be matched with a flexible circuit board or a driver chip of a corresponding size, for example, it can be suitable for a flexible circuit board of a smaller size, and the relevant size of the portion of the above-mentioned multiple connecting leads 4 located on the first main surface 1a can be set according to the size of the driver chip or flexible circuit board to be bound.

[0160] In some embodiments, Figure 1 and Figure 3 As shown, the multiple first electrodes 3 close to the same side sub-surface 1c1 among the multiple first electrodes 3 extend in a direction perpendicular to the backplane boundary where the side sub-surface 1c1 is located, and are arranged at equal intervals in a direction parallel to the backplane boundary where the side sub-surface 1c1 is located.

[0161] like Figure 6 and Figure 7B As shown, among the plurality of connection leads 4 , the plurality of connection leads 4 disposed on the same side surface 1 c are arranged at equal intervals in a direction parallel to the boundary of the backplane where the side sub-surface 1 c 1 is located.

[0162] In the case where the display panel 10 also includes multiple second electrodes 5, multiple second electrodes 5 close to the same side sub-surface 1c1 among the multiple second electrodes 5 extend in a direction perpendicular to the back panel boundary where the side sub-surface 1c1 is located, and are arranged at equal intervals in a direction parallel to the back panel boundary where the side sub-surface 1c1 is located.

[0163] By designing the multiple first electrodes 3 , the multiple connecting leads 4 and the multiple second electrodes 5 to be equally spaced, the multiple first electrodes 3 , the multiple connecting leads 4 and the multiple second electrodes 5 can be evenly distributed on the back panel, which is beneficial to the refined design of the structure of the display panel 10 .

[0164] In some embodiments, Figures 11A to 11C As shown, the display panel 10 includes a display area AA and a peripheral area BB. A plurality of pixels P' and a plurality of signal lines are arranged in the display area AA. The plurality of signal lines are electrically connected to the plurality of pixels. The structure and connection relationship of the plurality of pixels P' and the plurality of signal lines are introduced below.

[0165] In some embodiments, multiple pixels P' are arranged in an array. For example, multiple pixels P' are arranged into N rows and M columns. The multiple signal lines include multiple data lines D1~DM extending along the column direction Y1, multiple first positive signal lines H11~HM1, multiple second positive signal lines H12~HM2 and multiple reference signal lines V1~VM, and multiple scanning signal lines S1~SN extending along the row direction X1. The multiple signal lines also include multiple scanning signal switching lines C1~CN extending along the column direction Y1. Each scanning signal switching line Cn is electrically connected to a scanning signal line Sn, so that a scanning signal can be provided to the corresponding scanning signal line Sn through the scanning signal switching line Cn, so that the signal source for providing the scanning signal can be set at both ends of the scanning signal switching line Cn.

[0166] Exemplarily, each row of pixels P' is electrically connected to the same scanning signal line Sn, and each column of pixels P' is electrically connected to a data signal line Dm, a reference signal line Vm, a first positive signal line Hm1 and a second positive signal line Hm2, so as to achieve reasonable wiring and transmit corresponding signals to the pixels P' through multiple signal lines.

[0167] like Fig. 12A and Fig. 12B As shown, each pixel P' among the multiple pixels P' includes: sub-pixels P of at least three colors and a pixel driving chip 02 for driving each sub-pixel P to emit light. Each sub-pixel P includes at least one light-emitting device 2, and the light-emitting device 2 may be, for example, an inorganic light-emitting diode. The following is an example in which each pixel P' includes three sub-pixels P, and each sub-pixel P includes two light-emitting devices 2. The six light-emitting devices 2 in the figure are arranged in three rows and two columns, and the three rows of light-emitting devices 2 are, from top to bottom, the first color light-emitting device 2, the second color light-emitting device 2, and the third color light-emitting device 2.

[0168] The pixel driving chip 02 is electrically connected to the cathode of the light emitting device 2 in each sub-pixel 01 driven by the pixel driving chip 02, at least one data signal line Dm among the plurality of data lines, at least one scanning signal line Sn among the plurality of scanning lines, and at least one reference signal line Vm among the plurality of reference signal lines. The pixel driving chip 02 is configured to write the signal of the data signal line Dm into the sub-pixels P of different colors in a time-sharing manner under the control of the scanning signal line Sn, wherein the reference signal line Vm is used to provide a cathode signal to the pixel driving chip 02, so that a current path is formed between the pixel driving chip 02 and the light emitting device 2.

[0169] For specific implementation, see Fig. 12A and Fig. 12B, the pixel driving chip 02 has a first signal terminal O1, a second signal terminal O2, a third signal terminal O3, a fourth signal terminal O4, a fifth signal terminal O5 and a sixth signal terminal O6. Among them, the first signal terminal O1 is connected to the cathode R- of the first color light emitting device 2, the second signal terminal O2 is connected to the cathode G- of the second color light emitting device 2, the third signal terminal O3 is connected to the cathode B- of the third color light emitting device 2, the fourth signal terminal O4 is electrically connected to the data signal line Dm through the via P1, the fifth signal terminal O5 is connected to the scanning signal line Sn, and the sixth signal terminal O6 is connected to the reference signal line Vm through the via P2. The anode R+ of the first color light emitting device 2 is connected to the first anode signal line Hm1 through the via P5, the anode G+ of the second color light emitting device 2 is connected to the second anode signal line Hm2 through the via P4, and the anode B+ of the third color light emitting device 2 is connected to the second anode signal line Hm2 through the via P4. The scanning signal line Sn is connected to the scanning signal switching line Cn through the via P3.

[0170] See also Figures 11A to 11C , a plurality of first electrodes 3 are arranged on the second main surface 1b of the back plate 1 near two side edges, hereinafter referred to as the first side edge (located on the upper side of the back plate 1) and the second side edge (located on the lower side of the back plate 1), the first side edge and the second side edge are arranged opposite to each other in the column direction Y1, it can be understood that, Figures 11A to 11C The display panel 10 shown is Figure 3 Corresponding to the display panel 10 shown, the back plate 1 includes two selected side surfaces 1cc arranged opposite to each other. Figures 11A to 11C The example in which one end of the plurality of first electrodes 3 close to the selected side surface 1cc is flush or substantially flush with the side edge of the second main surface 1b close to the selected side surface 1cc is used for illustration, and therefore the third portion 43 of the connecting lead 4 is not drawn in the figure.

[0171] The plurality of first electrodes 3 are electrically connected to the plurality of light emitting devices 2 through the plurality of signal lines, and each of the plurality of first electrodes 3 is electrically connected to a signal line extending along the column direction Y1. Fig.11A and Fig. 11B As shown, a portion of the plurality of first electrodes 3 is disposed at a first side position close to the second main surface 1b of the back plate 1, and each of the first electrodes 3 in the portion is electrically connected to a plurality of second positive signal lines H12 to HM2 and a signal line in a plurality of reference signal lines V1 to VM. Another portion of the plurality of first electrodes 3 is disposed at a second side position close to the second main surface 1b of the back plate 1, and each of the first electrodes 3 in the portion is electrically connected to a signal line in a plurality of data lines D1 to DM, a plurality of first positive signal lines H11 to HM1, and a plurality of scanning signal switching lines C1 to CN.

[0172] Taking the arrangement of multiple pixels P' in N rows and M columns as an example, in some embodiments, there is the following rule for the position setting of multiple first electrodes 3. The number of multiple first electrodes 3 electrically connected to one pixel column is at least four. These four first electrodes 3 at least include the first electrodes 3 respectively electrically connected to the first positive signal line Hm1, the second positive signal line Hm2, the data line Dm, and the reference signal line Vm. Then the number of multiple first electrodes 3 electrically connected to multiple first positive signal lines Hm1, multiple second positive signal lines H12 - HM2, multiple data lines D1 - DM, and multiple reference signal lines V1 - VM is 4×M. The number of multiple scan signal transfer lines C1 - CN is equal to the number of scan signal lines S1 - SN, both being N. Then the number of multiple first electrodes 3 electrically connected to multiple scan signal transfer lines C1 - CN is N.

[0173] Optionally, as Fig.11A shown, when the number N of pixel rows in the display area AA is the same as the number M of pixel columns, that is, in the case of N = M, one scan signal transfer line Cn is correspondingly arranged on one side of each pixel column, and only one scan signal transfer line Cn is arranged between every two adjacent pixel columns. For example, a scan signal transfer line C2 electrically connected to the scan signal line S2 is arranged on the right side of the second column of pixels, and a first electrode 3 electrically connected to the scan signal transfer line C2 is arranged at the position in the peripheral area BB corresponding to the second column of pixels. In this way, the number of multiple first electrodes corresponding to each pixel column is 5.

[0174] Optionally, as Fig. 11B shown, when the number N of pixel rows in the display area AA is less than the number M of pixel columns, that is, in the case of N < M, one scan signal transfer line Cn is correspondingly arranged on one side of some pixel columns, and the number of these pixel columns is N. There is no scan signal transfer line Cn on one side of some other pixel columns, and the number of these pixel columns is (M - N). And at this time, there is no scan signal transfer line Cn between every two adjacent pixel columns among these pixel columns. For example, no scan signal transfer line is arranged on the right side of the second column of pixels, and the scan signal transfer line C2 electrically connected to the scan signal line S2 is arranged on one side of other pixel columns. Then no first electrode 3 is arranged at the position in the peripheral area BB corresponding to the second column of pixels. In this way, the number of multiple first electrodes corresponding to some pixel columns (such as the first column of pixels and the third column of pixels) is 5, and the number of multiple first electrodes corresponding to some other pixel columns (such as the second column of pixels) is 4.

[0175] Optionally, as Fig. 11CAs shown, when the number of pixel rows N in the display area AA is less than the number of pixel columns M, that is, when N>M, at least one scanning signal transfer line Cn is correspondingly arranged on one side of each pixel column, one scanning signal transfer line Cn is correspondingly arranged on one side of some pixel columns, and no scanning signal transfer line Cn is arranged on one side of other pixel columns, and two scanning signal transfer lines Cn are arranged between two adjacent pixel columns. For example, a scanning signal transfer line C2 electrically connected to the scanning signal line S2 and a scanning signal transfer line C20 electrically connected to the scanning signal line S20 are arranged on the right side of the second column of pixels, and a first electrode 3 electrically connected to the scanning signal transfer line C2 and another first electrode 3 electrically connected to the scanning signal transfer line C20 are arranged at the position corresponding to the second column of pixels in the peripheral area BB. In this way, the number of the plurality of first electrodes corresponding to some pixel columns (for example, the first column of pixels and the third column of pixels) is 5, and the number of the plurality of first electrodes corresponding to other pixel columns (for example, the second column of pixels) is 6.

[0176] Understandably, Figures 11A to 11C The multiple first electrodes in the display area AA can be further moved toward the inside of the display area AA, for example, arranged between two adjacent pixels P' in a row of pixels P' closest to the selected side surface 1cc, thereby further narrowing the size of the peripheral area BB and making the non-display area of ​​the display panel narrower.

[0177] See also Fig. 12B In some embodiments, the signal lines connected to a pixel P' have different line widths because they provide different signals. The width of the first electrode 3 is the same or approximately the same as the width of the signal line to which it is electrically connected. The width of the signal line refers to the width of the signal line perpendicular to its main extension direction (e.g., column direction Y1), that is, the size of the signal line along the row direction X1. The width of the first electrode 3 refers to the size of the first electrode 3 in the row direction X1. For example, the first electrode electrically connected to the reference signal line Vm has the same width as the reference signal line Vm, or the width of the first electrode 3 is slightly larger than the width of the reference signal line Vm. Fig. 12B As shown, the width L1 of the reference signal line Vm is greater than the width L2 of the data line Dm, and the width of the first electrode 3 electrically connected to the reference signal line Vm is greater than the width of the first electrode 3 electrically connected to the data line Dm. Figure 3 , Fig.11A and Fig. 11B As shown, the widths of the plurality of first electrodes 3 are different, and the width of each first electrode 3 corresponds to the width of the signal line electrically connected thereto, and the first electrodes 3 electrically connected to signal lines of different widths have different widths.

[0178] For further information, see Figure 3In the case where each connecting lead 4 further includes a third portion 43 located on the second main surface 1b of the back plate 1, the width of the third portion 43 is the same or substantially the same as the width of the signal line electrically connected thereto, and the third portion 43 refers to its size in the row direction X1. That is, the widths of the signal line, the first electrode 3 and the third portion 43 of the connecting lead 4 electrically connected in sequence are in a corresponding relationship.

[0179] In the above embodiment, the distance between two adjacent first electrodes 3 is designed based on the principle of preventing signal crosstalk, which is not limited in the present disclosure.

[0180] In some embodiments, the width of the first portion 41 of each connecting lead 4 is the same or substantially the same as the width of the third portion 43 thereof. Figure 8B , Fig. 10A and Fig. 10B , the width of the first portion 41 refers to its size in the row direction X1.

[0181] Furthermore, the orthographic projections of the first portion 41 of each connecting lead 4 and the third portion thereof on the first main surface 1a of the back plate 1 have an overlapping area. Figure 8B As shown, the first portion 41 of each connecting lead 4 and the orthographic projection of the third portion thereof on the first main surface 1a of the back plate 1 are substantially coincident, as shown in FIG. Fig. 10A As shown, the first portion 41 of each connecting lead 4 and the orthographic projection of the third portion thereof on the first main surface 1a of the back plate 1 are substantially coincident, as shown in FIG. Fig. 10B As shown, the first sub-portion 41a of the first portion 41 of each connecting lead 4 and the orthographic projection of the third portion thereof on the first main surface 1a of the back plate 1 are substantially coincident. That is, the width of the first portion 41 of each connecting lead 4 is the same or substantially the same as the width of the third portion 43 thereof, and the positions of the first portion 41 of each connecting lead 4 and the third portion 43 thereof on the two opposite main surfaces of the back plate correspond.

[0182] In some embodiments, the width of the second portion 42 of each connecting lead 4 is greater than the width of the first portion 41 thereof, and greater than the width of the third portion 43 thereof.

[0183] In some other embodiments, the width of the second portion 42 of each connecting lead 4 is equal to or substantially equal to the width of the first portion 41 thereof, and is equal to or substantially equal to the width of the third portion 43 thereof.

[0184] As a possible design, Figure 6 and Figure 7BAs shown, the second portions 42 of the plurality of connecting leads 4 located on the same selected side surface 1cc are arranged at equal intervals along a direction parallel to the backplane boundary where the side sub-surface of the selected side surface 1cc is located, but the line width of the second portion 42 of each connecting lead 4 is not necessarily the same. For example, the spacing between the second portions 42 of each adjacent two connecting leads 4 is d4, and the line width of the second portion 42 of each connecting lead 4 is substantially proportional to the width of the third portion 43 thereof.

[0185] In some examples, the portions of the multiple connecting leads 4 located on the first main surface 1a, the portions located on the selected side surface 1cc, and the portions located on the second main surface 1b are prepared separately through different processes. For example, the portions of the multiple connecting leads 4 located on the selected side surface 1cc can be obtained by sputtering a metal layer on the selected side surface 1cc and laser etching the metal layer. In this case, the metal layer can be cut into multiple parts by laser etching to obtain multiple second parts 42. When the accuracy of laser etching is set to a specific value, such as d4, the portions of the multiple connecting leads located on the selected side surface 1cc arranged at equal intervals can be obtained. This is conducive to controlling the process accuracy and reducing the difficulty of preparation.

[0186] As another possible design, the distance between the second portions 42 of every two adjacent connecting leads 4 may also be different, for example, may be consistent with the distance between the first portions 41 of every two adjacent connecting leads 4 .

[0187] In some embodiments, the spacing between two adjacent connection leads 4 among the plurality of connection leads 4 located on different selected side surfaces 1cc is different. Since the first portion 41, the second portion 42, and the third portion 42 of each connection lead 4 are connected to each other and have corresponding positions, and the width of the third portion 43 is related to the width of the first electrode 3 to which it is electrically connected, and the spacing between adjacent third portions 43 is related to the spacing between the first electrodes 3 to which it is electrically connected, when the widths and spacings of the plurality of first electrodes 3 corresponding to different selected side surfaces 1cc are different, the spacing between two adjacent connection leads 4 among the plurality of connection leads 4 located on different selected side surfaces 1cc is different.

[0188] In some embodiments, the plurality of connecting leads 4 may be prepared, for example, by electroplating, evaporation, pad printing of silver paste, or the like; or may be formed by sputtering a metal layer onto the first main surface 1a and the selected side surface 1cc of the backplane 1, and forming a pattern by an etching process to obtain the plurality of connecting leads 4. The etching process may be, for example, wet etching or laser etching. In the case of obtaining the plurality of connecting leads 4 by a laser etching process, there may be a situation where the power of the laser etching is too high, the energy is too large, and other structures of the display panel 10 are adversely affected, especially when etching the portion of the metal layer located on the first main surface 1a of the backplane 1, if the laser energy is too high, the laser will penetrate the backplane 1, and may cause bulging of the structure on the second main surface 1b of the backplane 1.

[0189] Based on this, Fig. 9B As shown, the display panel 10 further includes an energy absorbing film 7. The energy absorbing film 7 is arranged on a side of the first main surface 1a close to the back plate 1 relative to the plurality of connecting leads 4, and specifically can be in direct contact with the first main surface 1a, that is, the energy absorbing film 7 is formed on the first main surface 1a of the back plate 1 before the metal layer is formed.

[0190] The energy absorption film 7 is configured to absorb at least a portion of the laser energy during the laser etching process. In this way, in the process of obtaining multiple connecting leads 4 through the laser etching process, especially when etching the portion of the metal layer located on the first main surface 1a of the back panel 1, the energy absorption film 7 can absorb a portion of the laser energy to avoid the situation where the structure on the second main surface 1b of the back panel 1 due to excessive laser energy causes bulging, thereby reducing the adverse effects of laser etching on the second main surface 1b of the back panel 1.

[0191] As a possible design, an energy absorption film may be provided between the second main surface 1b of the back panel 1 and the plurality of connecting leads 4, or an energy absorption film may be provided between the selected side surface 1cc of the back panel 1 and the plurality of connecting leads 4, so as to reduce the adverse effects on other structures of the back panel 1 that may be caused in the process of forming the plurality of connecting leads 4 by laser etching.

[0192] In some examples, the material of the energy absorption film is selected from inorganic materials that can absorb laser energy. For example, the material of the energy absorption film includes at least one of tin dioxide (SnO2) and zinc oxide (ZnO). The material of the energy absorption film is SnO2, ZnO, or a mixture of SnO2 and ZnO.

[0193] In some embodiments, Fig.13As shown, each connection lead 4 includes a first buffer conductive pattern 4a, a main conductive pattern 4b, and a second buffer conductive pattern 4c which are stacked in sequence, and the first buffer conductive pattern 4a is closer to the back plate 1 than the main conductive pattern 4b. The adhesion between the first buffer conductive pattern 4a and the back plate 1 is greater than the adhesion between the main conductive pattern 4b and the back plate 1; the oxidation resistance of the second buffer conductive pattern 4c is better than that of the main conductive pattern 4b.

[0194] Among them, the first buffer conductive pattern 4a, the main conductive pattern 4b and the second buffer conductive pattern 4c are all conductive, the main conductive pattern 4b has strong conductivity and low resistivity, and the material of the main conductive pattern 4b is, for example, copper (Cu). On the basis of ensuring that the multiple connecting leads 4 have strong conductivity and low signal loss and realizing stable signal transmission, by arranging the first buffer conductive pattern 4a and the second buffer conductive pattern 4c on both sides of the main conductive pattern 4b of each connecting lead 4, the adhesion between the multiple connecting leads 4 and the back plate 1 is enhanced, so that the multiple connecting leads 4 are not easy to fall off, and the oxidation resistance of the multiple connecting leads 4 is enhanced, so that the multiple connecting leads 4 are not easily corroded by water and oxygen, and the service life is extended.

[0195] In some examples, the material of the first buffer conductive pattern 4a is selected from a material with strong adhesion, such as a material with strong bonding force with glass, and the material of the second buffer conductive pattern 4c is selected from a material with strong oxidation resistance. Exemplarily, the material of the first buffer conductive pattern 4a is the same as the material of the second buffer conductive pattern 4c, and the materials of the first buffer conductive pattern 4a and the second buffer conductive pattern 4c include at least one of titanium (Ti), chromium (Ge), molybdenum (Mo) and molybdenum-niobium alloy (MoNb). For example, the materials of the first buffer conductive pattern 4a and the second buffer conductive pattern 4c are Ti, Ge, Mo, Monb, or a mixed material of Ti and Ge, a mixed material of Ti, Ge and Mo, etc.

[0196] In some embodiments, Figure 5A , Fig. 7A , Figures 8A to 9BAs shown, the display panel 10 also includes a first protective adhesive layer 6, which covers the multiple connecting leads 4. The first protective adhesive layer 6 is arranged on the side of the multiple connecting leads 4 away from the back plate 1. Exemplarily, the first protective adhesive layer 6 can fill the gap area of ​​the multiple connecting leads 4 and cover the surface of the multiple connecting leads 4. It can be understood that if the multiple connecting leads 4 located on the first main surface 1a of the back plate 1 need to be exposed for binding connection with the driving chip 20, then the first protective adhesive layer 6 needs to avoid covering the part of the connecting leads 4 to be connected to the driving chip 20; in addition, the first protective adhesive layer 6 is usually equal to or greater than the orthographic projection of the connecting leads 4 on any surface of the display panel. As Figure 5A , Fig. 9A and Fig. 9B As shown, in the cross section of the display panel 10, the plurality of connecting leads 4 are in a U-shape, and the first protective adhesive layer 6 is also in a U-shape. Fig. 7A and Fig. 8A As shown, in the cross section of the display panel 10 , the plurality of connecting leads 4 are in an L-shape, and the first protective adhesive layer 6 is also in an L-shape.

[0197] The first protective adhesive layer 6 is configured to protect the plurality of connecting leads 4 and play the role of electrical insulation and water-proof oxygen corrosion, thereby preventing the plurality of connecting leads 4 from being damaged by the outside world, causing problems such as peeling, disconnection, oxidation, etc.

[0198] In some examples, the material of the first protective adhesive layer 6 is an insulating material with high corrosion resistance and adhesion. For example, the first protective adhesive layer 6 is OC (over coating) adhesive. For example, the material of the first protective adhesive layer 6 may include dark OC adhesive or dark ink layer. The ink has high hardness and good corrosion resistance and can protect multiple connection leads.

[0199] In some embodiments, Figure 5B As shown, in the direction perpendicular to the side sub-surface 1c1 of the selected side surface 1cc, the thickness d5 of the first protective glue layer 6 is greater than or equal to 1 μm and less than or equal to 4.6 μm, for example, the thickness d5 of the first protective glue layer is 1.5 μm, 2 μm or 3 μm. Figure 5B In the cross section of the display panel shown in FIG. 1 , the thickness d5 of the first protective adhesive layer is not uniform everywhere. Figure 1 and Figure 3 In the front view of the display panel 1 shown, the first protective adhesive layer is disposed on the selected side surface 1cc of the back plate 1 and covers a plurality of connecting leads 4. Figure 3Taking the first protective adhesive layer corresponding to the selected side surface 1cc of the back plate 1 shown above as an example, along the row direction X1, the thickness of the middle position of the first protective adhesive layer 6 is greater than the thickness of the two sides thereof, and the first protective adhesive layer 6 is thicker in the middle and thinner on the two sides. For example, the thickness of the middle position of the first protective adhesive layer 6 is 4.58 μm, and the thickness of the two sides may be, for example, 1.5 μm, 3.31 μm, or 3.56 μm.

[0200] It should be noted that the above uneven thickness phenomenon is caused by the preparation process of the first protective adhesive layer (such as spraying process, deposition process, etc.), and does not affect the function of the first protective adhesive layer 6, as long as the first protective adhesive layer can cover the multiple connecting leads 4, and the thickness of the first protective adhesive layer 6 is sufficient to enable the first protective adhesive layer 6 to effectively protect the multiple connecting leads 4. When the process conditions permit, the thickness of the first protective adhesive layer is preferably uniform everywhere.

[0201] As a possible design, Fig. 9B As shown, in the case where the first protective adhesive layer 6 is a dark ink layer, the display panel 10 further includes a silicon nitride film layer 8 disposed between the plurality of connecting leads 4 and the first protective adhesive layer 6. After being formed into a film, the silicon nitride material has a high density and a high anti-oxidation performance. By simultaneously arranging the silicon nitride film layer 8 and the dark ink layer on the side of the plurality of connecting leads 4 facing away from the back plate 1, the plurality of connecting leads 4 can be further protected to prevent the plurality of connecting leads 4 from being corroded. Moreover, arranging the dark ink layer on the outside can ensure that the first protective adhesive layer 6 has sufficient hardness to prevent it from falling off due to being bumped, thereby enhancing the protective effect on the plurality of connecting leads 4.

[0202] In some embodiments, Fig. 7A and Fig. 8A As shown, the display panel 10 further includes a second protective adhesive layer 9 disposed on the side of the plurality of light emitting devices 2 facing away from the back plate 1. The second protective adhesive layer 9 includes a portion 91 covering the plurality of light emitting devices 2 and a portion 92 filling the gap region of the plurality of light emitting devices 2. Fig. 8A As shown, the portion 92 filling the gap area of ​​the multiple light-emitting devices 2 is a dark-colored glue, thereby preventing the external ambient light from being reflected after irradiating the display panel and causing a decrease in contrast; and the portion 91 covering the multiple light-emitting devices 2 is a highly light-transmitting glue material, thereby preventing the multiple light-emitting devices 2 from being damaged in subsequent process steps while ensuring the light output efficiency of the multiple light-emitting devices 2.

[0203] In some embodiments, Fig. 7AWhen the light-emitting device 2 is an inorganic light-emitting diode, the second protective adhesive layer 9 can use the same material and color of adhesive in the portion 91 covering the multiple light-emitting devices 2 and the portion 92 filling the gap area of ​​the multiple light-emitting devices 2, because the light output brightness of the inorganic light-emitting diode is very strong, and the thickness of the second protective adhesive layer in the portion covering the multiple light-emitting devices 2 is less than the thickness of the portion filling the gap area of ​​the multiple light-emitting devices 2, so that it can also not affect the display effect and ensure high contrast. Exemplarily, the material of the second protective adhesive layer 9 can be black silicone or black resin, etc. For example, black silicone can be applied to the side of the multiple light-emitting devices 2 facing away from the back panel 1, covering the multiple light-emitting devices 2, and the surface of the black silicone is smoothed to ensure the uniformity and light transmittance of the second protective adhesive layer 9.

[0204] In some examples, such as Fig. 7A and Fig. 8A As shown, the second protective adhesive layer 9 also includes a portion 93 covering the plurality of first electrodes 3. Exemplarily, when the connecting lead 4 covers a portion of the first electrode 3 corresponding thereto to achieve electrical connection, the second protective adhesive layer 9 covers another portion of each of the plurality of first electrodes 3, and the first protective adhesive layer 6 and the second protective adhesive layer 9 may be in contact. Exemplarily, as Fig. 7A and Fig. 8A As shown, when there is no overlapping portion between the connecting lead 4 and the first electrode 3 to which it is electrically connected, the second protective adhesive layer 9 covers the multiple first electrodes 3, and the second protective adhesive layer 9 is flush or approximately flush with the side of the second main surface 1b of the back plate 1. The connecting lead 4 can extend to the end surface of the second protective adhesive layer 9 that is flush with the side of the second main surface 1b of the back plate 1, so that the connecting lead 4 can be in more sufficient contact with the first electrode 3, and the first protective adhesive layer 6 and the second protective adhesive layer 9 are not in contact.

[0205] Some embodiments of the present disclosure further provide a display device 100, such as Figure 5A , Fig. 7A , Fig. 8A , Fig. 9A , Fig. 9B , Fig.14 As shown, the display device 100 includes: a display panel 10 and a driving chip 20 .

[0206] The driving chip 20 is disposed on the first main surface 1a of the back plate 1 of the display panel 10, and the driving chip 20 is electrically connected to the plurality of first electrodes 3 of the display panel 10 through the plurality of connecting leads 4 of the display panel 10. In some embodiments, Figure 5A , Fig. 7A and Fig. 8AAs shown, in the case where the display panel 10 further includes a plurality of second electrodes 5, the plurality of second electrodes 5 are electrically connected to the plurality of connection leads 4 respectively; the driving chip 20 is electrically connected to the plurality of second electrodes 5, so as to be electrically connected to the plurality of connection leads 4 through the plurality of second electrodes 5. It can be understood that the thickness of the second electrode 5 at the position where it is bound to the driving chip 20 can be the same as the thickness of the second electrode 5 at other positions; the thickness of the second electrode 5 at the position where it is bound to the driving chip 20 can also be less than the thickness of the second electrode 5 at other positions.

[0207] In other embodiments, Fig. 9A and Fig. 9B As shown, in the case where the display panel 10 does not include a plurality of second electrodes 5, the driving chip 20 is directly electrically connected to the portion of the plurality of connecting leads 4 located on the first main surface 1a of the back plate 1. It can be understood that the thickness of the connecting lead 4 at the position where it is bound to the driving chip 20 can be the same as the thickness of the connecting lead 45 at other positions; the thickness of the connecting lead 4 at the position where it is bound to the driving chip 20 can also be less than the thickness of the connecting lead 4 at other positions.

[0208] In the display device 100 provided by the present disclosure, since a plurality of connecting leads 4 connecting the first main surface 1a and the second main surface 1b of the back plate 1 are provided in the display panel 10, the binding area can be transferred to the back side of the display panel 10, and the driving chip 20 is electrically connected to the front side of the display panel 10 through the plurality of connecting leads 4, so as to control the display panel 10 for display, thereby reducing the area of ​​the peripheral region of the display panel 10, reducing the frame of the display device 100, increasing the screen-to-body ratio, and improving the display effect.

[0209] like Fig.14 As shown, the display device 100 has a narrow frame. Exemplarily, in the display panel 10, the overall thickness of the structure (including multiple connecting leads 4 and a first protective adhesive layer 6, etc.) arranged on the selected side surface 1cc of the back plate 1 is 1μm to 4μm, and the size of the frame of the display device 100 is much smaller than 1mm.

[0210] Some embodiments of the present disclosure further provide a spliced ​​display device 1000, such as Fig.15 As shown, the spliced ​​display device 1000 includes a plurality of display devices 100 as provided in the embodiments of the present disclosure, and the plurality of display devices 100 are spliced ​​and assembled. Since the frame size of each display device 100 used for splicing is very small, the splicing seam between two adjacent display devices 100 is difficult to be detected by the naked eye within the viewing distance when the spliced ​​display device 1000 is actually viewed, and a better display effect can be presented.

[0211] Since the display device provided by the present disclosure is a display device with an ultra-narrow frame, when the multiple display devices are applied to a spliced ​​display device, the seam between two adjacent display devices is small, so that the display screen of the spliced ​​display device is more complete and the display effect is better.

[0212] In some embodiments, the width of the seam between two adjacent display devices is 0.4 mm to 0.9 mm, so that when the spliced ​​display device is displaying, it is difficult to find the existence of the splicing seam when viewed with the naked eye, thereby improving the display quality of the spliced ​​display device.

[0213] Some embodiments of the present disclosure also provide a method for preparing a display panel, which is used to prepare the display panel described above in the present disclosure. Fig.16A and Fig. 16B As shown, the preparation method comprises:

[0214] S1, provide an initial backplane 1 ', such as Fig.17A As shown, the initial backplane 1' includes a first main surface 1a and a second main surface 1b opposite to each other, and a plurality of side surfaces 1c' connecting the first main surface 1a and the second main surface 1b; the plurality of side surfaces 1c' are perpendicular or substantially perpendicular to the first main surface 1a and the second main surface 1b.

[0215] The initial backplane 1' is a substrate with a driving circuit layer. For example, the initial backplane 1' includes a substrate and a driving circuit layer disposed on a surface 1c of the substrate. The surface of the driving circuit layer away from the substrate is the second main surface 1b of the initial backplane 1'. The substrate is, for example, a glass substrate.

[0216] S2, such as Fig. 17B As shown, a plurality of first electrodes 3 are formed on the second main surface 1b of the initial back plate 1'; the plurality of first electrodes 3 are close to at least one side surface 1c' of the plurality of side surfaces 1c', and the at least one side surface 1c' is a selected side surface 1c'.

[0217] The at least one side surface 1c' is a side surface 1c' used to set a plurality of connecting leads 4 in a subsequent step, and the at least one side surface 1c' is called a selected side surface 1c', and the plurality of first electrodes 3 are close to the side edges of the second main surface 1b and connected to the selected side surface 1c'. Exemplarily, the initial back plate 1' has four side surfaces 1c', and one side surface 1c', two side surfaces 1c', or three side surfaces 1c' of the four side surfaces 1c' may be selected side surfaces 1c', or all four side surfaces 1c' are selected side surfaces 1c', and a plurality of first electrodes 3 are formed on the second main surface 1b of the initial back plate 1' at a position close to the selected side surface 1c'.

[0218] Exemplarily, a first preset distance A3 is provided between one end of each first electrode 3 close to the selected side surface 1c' and the side edge of the second main surface 1b of the initial backplane 1' close to the selected side surface 1c'. The first preset distance A3 needs to be considered to ensure the area of ​​the display area of ​​the display panel finally formed. The preset distance should not be too large, and space for subsequent chamfering or rounding needs to be reserved, such as Fig. 17B As shown, for example, the first preset distance A3 is 50 μm to 80 μm.

[0219] In some embodiments, the plurality of first electrodes 3 can be manufactured with the driving circuit layer located on the second main surface 1 b by using the same film forming process or the same patterning process.

[0220] S3, such as Fig. 17C and Fig.17D As shown, the boundary edge between the first main surface 1a of the initial backplane 1' and the selected side surface 1c' is processed to form a first transition sub-surface 1c2 at the boundary edge, and the selected side surface 1c' forms a side sub-surface 1c1, thereby obtaining the backplane 1. The backplane 1 includes a plurality of side surfaces 1c connecting the first main surface 1a and the second main surface 1b, at least one side surface 1c of the plurality of side surfaces 1c is a selected side surface 1cc, and the selected side surface 1cc includes a side sub-surface 1c1 that is perpendicular or substantially perpendicular to the first main surface 1a and the second main surface 1b, and a first transition sub-surface 1c2 that connects the side sub-surface 1c1 and the first main surface 1a, and the at least one side surface 1c is referred to as the selected side surface 1cc. The first main surface 1a and the second main surface 1b of the initial backplane 1' are the first main surface 1a and the second main surface 1b of the backplane 1.

[0221] In a cross section of the back panel 1 along a direction perpendicular to the first main surface 1a and perpendicular to the back panel boundary where the side sub-surface 1c1 is located, the angle between the tangent at any point on the first transition sub-surface 1c2 and the first main surface 1a is greater than 90°, and the angle between the tangent and the side sub-surface 1c1 is greater than 90°.

[0222] In some embodiments, Fig. 16B , Fig. 17C and Fig.17DAs shown, S3 also includes: processing the boundary edge between the second main surface 1b of the initial backplane 1' and the selected side surface 1c' to form a second transition sub-surface 1c3 connecting the second main surface 1b and the selected side surface 1c', thereby obtaining a backplane. The selected side surface 1c among the multiple side surfaces 1c of the backplane also includes a second transition sub-surface 1c3, and in a cross section of the backplane along a direction perpendicular to the second main surface 1b and perpendicular to the backplane boundary where the side sub-surface 1c1 is located, the angle between the tangent at any point on the second transition sub-surface 1c3 and the second main surface 1b is greater than 90°, and the angle between the tangent at any point on the second transition sub-surface 1c3 and the side sub-surface 1c1 is greater than 90°.

[0223] In some examples, a chamfering process is used to grind the interface between the first main surface 1a of the initial back panel 1' and the selected side 1c' to form a first transition sub-surface 1c2, or, at the same time, the interface between the second main surface 1b of the initial back panel 1' and the selected side 1c' is ground to form a second transition sub-surface 1c3.

[0224] Exemplarily, the first transition sub-surface 1c2 and the second transition sub-surface 1c3 are planes or arc surfaces.

[0225] In the process of chamfering, there may be pits, burrs and other defects. For example, there are multiple pits on the first transition sub-surface 1c2 and the second transition sub-surface 1c3. The diameter or diagonal length of each pit is within 10um. The influence of the multiple pits on the overall flatness of the first transition sub-surface 1c2 and the second transition sub-surface 1c3 is negligible.

[0226] In some embodiments, after S3, a step of surface cleaning the formed backplane is also included to remove debris and oil on the surface of the backplane after grinding. Exemplarily, the cleaning method may be wet cleaning, ion source cleaning, ozone cleaning, etc. For example, in the case of wet cleaning, a 5% weak alkaline KOH solution may be used to clean the surface of the backplane, so that while removing the oil, the surface activity of the backplane can also be improved, and the adhesion between the metal layer and the backplane in the subsequent process (for example, the adhesion between the metal and the glass substrate) can be improved.

[0227] S4, such as Fig.17E As shown, a plurality of connecting leads 4 are formed on the first main surface 1a and the at least one side surface 1c of the back plate. Each of the plurality of connecting leads 4 is electrically connected to one of the plurality of first electrodes 3 by sequentially passing through the first transition sub-surface 1c2 and the side sub-surface 1c1 of the side surface 1c from the first main surface 1a of the back plate.

[0228] In some embodiments, a plurality of connection leads 4 may be disposed on the second main surface 1 b of the back plate in addition to being formed on the first main surface 1 a and the selected side surfaces 1 cc of the back plate.

[0229] When the selected side surface 1cc of the backplane also includes a second transition sub-surface 1c3, each of the multiple connecting leads 4 is electrically connected to one of the multiple first electrodes 3 from the first main surface 1a of the backplane through the first transition sub-surface 1c2, the side sub-surface 1c1 and the second transition sub-surface 1c3 of the side surface 1c in sequence.

[0230] In some embodiments, Fig.19 As shown, the step of forming a plurality of connecting leads 4 in S4 includes:

[0231] S41 . Form a metal layer on the first main surface 1 a and the selected side surface 1 cc of the back plate, the metal layer being in contact with the plurality of first electrodes 3 .

[0232] For example, a metal layer is formed on the first main surface 1a of the back plate, the first transition sub-surface 1c2 of the selected side surface 1cc, and the side sub-surface 1c1. Alternatively, a metal layer is formed on the first main surface 1a of the back plate, the first transition sub-surface 1c2 of the side surface 1c, the side sub-surface 1c1, and the second transition sub-surface 1c3.

[0233] In the case where there is a gap between one end of the first electrode 3 close to the side sub-surface 1c1 and the side edge of the second main surface 1b close to the side sub-surface 1c1, a metal layer is also formed on the second main surface 1b of the back plate so that the metal layer is in electrical contact with the plurality of first electrodes 3. Exemplarily, the metal layer can cover the plurality of first electrodes 3 so that the two have a larger contact area.

[0234] In a direction perpendicular to the first main surface 1a, when one end of the first electrode 3 close to the side sub-surface 1c1 is flush or approximately flush with the side edge of the second main surface 1b close to the side sub-surface 1c1, the metal layer is only formed on the first main surface 1a and at least one side surface 1c of the back plate, and is not formed on the second main surface 1b of the back plate.

[0235] Exemplarily, the metal layer can be deposited by electroplating, evaporation, pad printing of silver paste, sputtering (such as multi-arc magnetron sputtering), etc. to form a metal layer on the first main surface 1a and the at least one side surface 1c of the backplane.

[0236] In some embodiments, the metal layer includes a first metal layer, a second metal layer and a third metal layer, and the first metal layer, the second metal layer and the third metal layer are deposited in sequence using the above process to obtain three metal layers stacked, and the first metal layer is closer to the backplane than the second metal layer. Exemplarily, the thickness of the first metal layer and the second metal layer is 30nm to 100nm.

[0237] The adhesion between the first metal layer and the backplane is greater than the adhesion between the second metal layer and the backplane; the oxidation resistance of the third metal layer is better than that of the second metal layer. Exemplarily, the material of the first metal layer is the same as the material of the third metal layer, and the materials of the first metal layer and the third metal layer include at least one of Ti, Ge, Mo and Monb. The material of the second metal layer has strong electrical conductivity, for example, the material of the second metal layer is Cu.

[0238] S42, patterning the metal layer to obtain a plurality of connecting leads 4; each connecting lead 4 of the plurality of connecting leads 4 passes through the first main surface 1a of the backplane in sequence through the first transition sub-surface 1c2 and the side sub-surface 1c1 of the selected side surface 1cc, and is electrically connected to one of the plurality of first electrodes 3.

[0239] In some examples, a laser etching process with relatively high process precision is used to pattern the metal layer to obtain a plurality of connecting leads 4 .

[0240] In some embodiments, for the above-mentioned method of patterning the metal layer by laser etching process, before S41, it also includes: S40: forming an energy absorption film on the first main surface 1a of the backplane, illustratively, the energy absorption film is formed by a deposition process, and the material of the energy absorption film may include at least one of SnO2 and ZnO. The energy absorption film can absorb at least a part of the laser energy in the laser etching process to avoid the situation that the structure on the second main surface 1b of the backplane is bulged due to excessive laser energy, and reduce the adverse effects of laser etching on the second main surface 1b of the backplane.

[0241] In other examples, a wet etching process is used to pattern the metal layer to obtain a plurality of connecting leads 4 .

[0242] Exemplarily, a pad printing process is used to pad print insulating ink on the surface of the metal layer to form a protective layer with a pattern to protect the parts of the metal layer that do not need to be etched. Automatic optical inspection equipment is used to observe and adjust to ensure that the protective layer formed by the insulating ink is aligned with the multiple first electrodes. The metal layer is etched to retain the parts of the metal layer covered by the insulating ink to form multiple connecting leads 4.

[0243] In some examples, an energy absorbing film may also be formed on selected side surfaces 1 cc of the back plate to prevent the laser etching process from affecting other structures of the back plate.

[0244] In some cases, such as Figures 18A to 18F , the preparation method of the display panel can be, before S2, that is, before forming a plurality of first electrodes 3 on the second main surface 1b of the initial backplane 1', first forming a metal layer 4' on the first main surface 1a, the second main surface 1b and the selected side 1c' of the initial backplane 1', the metal layer 4' covers the surface of the selected side 1c' of the initial backplane 1', and covers a part of the surface of the first main surface 1a and the second main surface 1b of the initial backplane 1' close to the selected side 1c'; then S2 is performed: forming a plurality of first electrodes 3 on the second main surface 1b of the initial backplane 1', the plurality of first electrodes 3 are close to the selected side 1c' among the plurality of side 1c', and the plurality of first electrodes 3 are in contact with the metal layer. Exemplarily, the plurality of first electrodes 3 can cover a part of the metal layer so that the two have a larger contact area, that is, the plurality of first electrodes 3 are located on the side of the metal layer away from the initial backplane 1'. In some examples, the plurality of first electrodes 3 can be made with the driving circuit layer located on the second main surface 1b by the same film forming process or the same patterning process.

[0245] In some embodiments, when the display panel further includes a plurality of second electrodes 5 disposed on the first main surface 1a of the backplane 1, before forming the plurality of second electrodes 5, a metal layer 4' is formed on the first main surface 1a, the second main surface 1b and the selected side surface 1c' of the initial backplane 1', and after forming the metal layer, S2' is performed: a plurality of second electrodes 5 are formed on the first main surface 1a of the initial backplane 1'; the plurality of second electrodes 5 are close to at least one side surface 1c' of the plurality of side surfaces 1c', and in a direction perpendicular to the first main surface 1a, the positions of the plurality of second electrodes 5 correspond one-to-one to the positions of the plurality of first electrodes 3, and the plurality of second electrodes 5 are in contact with the metal layer. Exemplarily, the plurality of second electrodes 5 may cover a portion of the metal layer so that the two have a larger contact area, that is, the plurality of second electrodes 5 are located on the side of the metal layer away from the initial backplane 1'.

[0246] In some embodiments, Fig.18B and Fig.18C As shown, before forming the metal layer 4', it also includes S3, processing the interface between the first main surface 1a of the initial backplane 1' and the selected side surface 1c', forming a first transition sub-surface 1c2 at the interface, and forming a side sub-surface 1c1 on the selected side surface 1c', thereby obtaining the backplane 1. Thus, the metal layer 4' is formed on the first main surface 1a, the second main surface 1b and the selected side surface 1cc of the backplane 1.

[0247] After obtaining a plurality of first electrodes 3 and a plurality of second electrodes 5, S42 is performed to pattern the metal layer 4' to obtain a plurality of connecting leads 4; each of the plurality of connecting leads 4 is electrically connected to one of the plurality of first electrodes 3 by sequentially passing through the first transition sub-surface 1c2 and the side sub-surface 1c1 of the selected side surface 1cc from the first main surface 1a of the back plate 1. Alternatively, each connecting lead 4 is also electrically connected to a second electrode 5. The method of patterning the metal layer 4' can adopt the laser etching method or the wet etching method described above, which will not be described in detail here.

[0248] For example, see Fig.18E and Fig.18F , using the above method, in the obtained display panel, each first electrode 3 is located on the side of the connecting lead 4 to which it is electrically connected away from the back plate 1, and each second electrode 5 is located on the side of the connecting lead 4 to which it is electrically connected away from the back plate 1. In some embodiments, the display panel also includes a first protective adhesive layer 6 covering the multiple connecting leads 4. The first protective adhesive layer 6 is arranged on the side of the multiple connecting leads 4 away from the back plate 1. Exemplarily, the first protective adhesive layer 6 can fill the gap area of ​​the multiple connecting leads 4 and cover the surface of the multiple connecting leads 4. In some embodiments, the first protective adhesive layer 6 can also cover the second electrode 5 and the surface of the first electrode 3, except for the area that needs to be exposed for binding and connection with the driving chip 20.

[0249] It can be understood that in some cases, among the multiple first electrodes 3 located on the second main surface 1b of the display panel and the multiple second electrodes 5 located on the first main surface 1a, one of them may be located on the side of the connecting lead 4 to which it is electrically connected away from the back panel 1, and the other is located on the side of the connecting lead 4 to which it is electrically connected close to the back panel 1.

[0250] In other embodiments, Fig. 20 As shown, the step of forming multiple connecting leads 4 in S4 includes: the step of forming portions of the multiple connecting leads 4 located on the selected side surface of the back panel 1 and the step of forming portions of the multiple connecting leads 4 located on the first main surface 1a (and the second main surface 1b) of the back panel 1.

[0251] The step of forming the portions of the plurality of connecting leads 4 located on the selected side surface of the back plate comprises:

[0252] S41 ′: forming a metal layer on the selected side surface 1 cc of the back plate.

[0253] S42 ′, patterning the metal layer to obtain portions of the plurality of connecting leads 4 located on the selected side surface 1 cc of the back plate 1 .

[0254] For the specific implementation of S41' and S42', reference may be made to the above description of S41 and S42, which will not be repeated here.

[0255] The steps of forming the portions of the plurality of connecting leads 4 located on the first main surface 1a (and the second main surface 1b) of the back plate 1 include:

[0256] S41 ”: a mask is arranged on the first main surface 1 a of the back plate, wherein the mask is configured to expose an area on the first main surface 1 a of the back plate where a plurality of connecting leads 4 need to be arranged.

[0257] The mask is, for example, a magnetron sputtering mask, and the material of the mask includes polyimide or Teflon material. The pattern of the mask can shield the area on the first main surface 1a of the backplane where the metal layer does not need to be formed. The mask can be attached to the first main surface 1a of the backplane, and the area exposed on the first main surface 1a is the area where the multiple connecting leads 4 are subsequently formed. The area exposed on the first main surface 1a corresponds to the portion of the multiple connecting leads 4 located on the selected side surface of the backplane.

[0258] S42”: depositing metal on the first main surface 1a of the back plate to form a metal layer.

[0259] Exemplarily, the metal layer can be deposited by electroplating, evaporation, pad printing of silver paste, sputtering (for example, a multi-arc magnetron sputtering) or the like to form a metal layer on the first main surface 1a of the back panel, and the metal layer covers the area of ​​the first main surface 1a of the back panel exposed by the mask.

[0260] For example, Fig.21A and Fig. 21B The structures of the two mask plates 11 are schematically shown. The mask plate 11 has a plurality of openings 11a. The plurality of openings 11a expose the areas on the first main surface 1a of the back plate where metal needs to be deposited. Fig.21A The mask 11 shown does not have a frame 11b. Fig. 21B The mask plate 11 shown has a frame 11b. When the metal layer is formed by a sputtering process in S42″, Fig.21A The mask 11 shown can be applied to various sputtering angles. Fig.21A The mask plate 11 shown can be suitable for the case where the back plate 1 is placed horizontally and then sputtered with metal. At the same time, the mask plate 11 with the frame 11a helps to improve the overall flatness of the formed metal layer.

[0261] It can be understood that the shape of the opening 11a of the mask plate 11 is the shape of the pattern of the portion where the plurality of connecting leads 4 are located on the first main surface 1a of the back plate 1. Fig.21A and Fig. 21BThe two mask plates 11 shown schematically have the same pattern as the metal layer. Fig. 10B The portions of the plurality of connecting leads 4 shown are located on the first main surface 1 a of the back plate 1 and have the same pattern.

[0262] In some embodiments, the metal layer includes a first metal layer, a second metal layer and a third metal layer. For details, please refer to the above description and will not be repeated here.

[0263] S43 ”: remove the mask plate 11 to form a portion where a plurality of connecting leads 4 are located on the first main surface 1 a of the back plate 1 .

[0264] In some embodiments, when the plurality of connecting leads 4 also include a portion disposed on the second main surface 1b of the back panel, a mask plate having a corresponding pattern may be disposed on the second main surface 1b of the back panel, and metal may be deposited to form the plurality of connecting leads 4 located on the second main surface 1b of the back panel 1. For the specific steps, please refer to the description of S41", S42" and S43" above, which will not be repeated here.

[0265] It should be noted that the order of the above-mentioned S41' and S42', S41", S42" and S43" is not limited. For example, S41' (forming a metal layer on at least one side surface 1c (selected side surface) of the backplane) and S42" (depositing metal on the first main surface 1a of the backplane to form a metal layer) can be carried out simultaneously to improve the preparation efficiency.

[0266] Finally, the formed portions of the plurality of connecting leads 4 located on the selected side surface 1cc of the back plate 1 are in contact with the portions of the plurality of connecting leads 4 located on the first main surface 1a of the back plate 1, and are also in contact with the portions of the plurality of connecting leads 4 located on the second main surface 1b of the back plate 1, thereby obtaining a plurality of connecting leads. Each connecting lead 4 of the plurality of connecting leads 4 is electrically connected to one of the plurality of first electrodes 3 by sequentially passing through the first transition sub-surface 1c2 of the side surface 1c and the side sub-surface 1c1 from the first main surface 1a of the back plate.

[0267] The above-mentioned method of using a mask template to form the portion of the first main surface 1a (and the second main surface 1b) of the back panel 1 where multiple connecting leads 4 are located does not require the use of a laser etching process. This can avoid the adverse effects of excessive laser energy on the structures on the second main surface 1b and the first main surface 1a of the back panel when using the laser etching process.

[0268] In other embodiments, Fig. 22 As shown, the step of forming a plurality of connecting leads 4 in S4 includes:

[0269] S4 - 1 : A flexible mask 12 is disposed on the first main surface 1 a and the selected side surface 1 cc of the back plate 1 , wherein the flexible mask 12 is configured to expose areas on the first main surface 1 a and the selected side surface 1 cc of the back plate where a plurality of connecting leads 4 need to be disposed.

[0270] like Fig.23 As shown, the flexible mask 12 includes a first portion P1, a second portion P2 and a third portion P3, and the flexible mask 12 can be attached to the surface of the backplane 1. Exemplarily, the first portion P1 is arranged on the first main surface 1a of the backplane 1, the second portion P2 is arranged on the first main surface 1a of the backplane 1 and the at least one side surface 1c (for example, the two opposite side surfaces 1c of the backplane), and the third portion P3 is arranged on the second main surface 1b of the backplane 1. The second portion P2 can be bent, so that the second portion P2 can be attached to the first main surface 1a of the backplane 1, the first transition sub-surface 1c2 of the selected side surface 1cc and the side sub-surface 1c1 (or also attached to the second transition sub-surface 1c3 of the selected side surface 1cc), and the third portion P3 can be attached to the second main surface 1b of the backplane. The second portion P2 has a plurality of openings 12a, and the plurality of openings 12a expose the areas on the first main surface 1a of the backplane and the at least one side surface 1c where metal needs to be deposited.

[0271] S4-2: Deposit metal on the first main surface 1a and selected side surfaces 1cc of the back plate to form a metal layer.

[0272] Exemplarily, the metal layer can be deposited by electroplating, evaporation, pad printing of silver paste, sputtering (for example, a multi-arc magnetron sputtering) or the like to simultaneously form a metal layer on the first main surface 1a and the at least one side surface 1c of the back panel, and the metal layer covers the area of ​​the first main surface 1a of the back panel and the at least one side surface 1c exposed by the flexible mask 12.

[0273] In some embodiments, the metal layer includes a first metal layer, a second metal layer and a third metal layer. For details, please refer to the above description and will not be repeated here.

[0274] S4-3: Remove the flexible mask to form a plurality of connecting leads 4. Each of the formed plurality of connecting leads 4 is electrically connected to one of the plurality of first electrodes 3 by sequentially passing through the first transition sub-surface 1c2 and the side sub-surface 1c1 of the selected side surface 1cc from the first main surface 1a of the backplane.

[0275] For example, the flexible mask plate is irradiated with a UV lamp to reduce the viscosity of the material bonding the flexible mask plate 12 to the back plate 1 , thereby removing the flexible mask plate 12 from the back plate 1 .

[0276] In some embodiments, when the plurality of connecting leads 4 also include a portion disposed on the second main surface 1b of the backplane, the flexible mask 12 is further configured to expose the area on the second main surface 1b of the backplane where the plurality of connecting leads 4 need to be disposed. For example, the second portion P2 of the flexible mask 12 can be attached to the first main surface 1a, the second main surface 1b, the first transition sub-surface 1c2 and the side sub-surface 1c1 of the selected side surface 1cc of the backplane 1, and the plurality of openings 12a expose the area on the first main surface 1a, the at least one side surface 1c and the second main surface 1b of the backplane where metal needs to be deposited. Thus, each of the plurality of connecting leads 4 formed extends from the first main surface 1a of the backplane through the first transition sub-surface 1c2 and the side sub-surface 1c1 of the side surface 1c in sequence, to the second main surface 1b of the backplane 1, and is electrically connected to one of the plurality of first electrodes 3.

[0277] The above-mentioned method of forming multiple connecting leads 4 using a flexible mask plate does not require the use of a laser etching process, thus avoiding the adverse effects of excessive laser energy on the second main surface 1b and the structure on the first main surface 1a of the back panel when using the laser etching process. In addition, since the flexible mask plate is bendable and can be attached to the selected side surface 1cc of the back panel, it is possible to form multiple connecting leads 4 located on the first main surface 1a of the back panel, at least one side surface 1c and the second main surface 1b at one time, thereby improving the preparation efficiency.

[0278] In some embodiments, Fig.16A and Fig. 16B As shown, the method for preparing the display panel further includes:

[0279] S5: Test whether the formed multiple connecting leads 4 are short-circuited or open-circuited. If a short-circuit occurs, remove the excess metal layer that causes the connecting lead 4 to short-circuit. For example, a laser etching process can be used to remove the excess metal layer. If an open circuit occurs, add metal at the location where the open circuit occurs to connect the connecting lead 4. For example, silver printing can be used to repair the open circuit connecting lead 4.

[0280] S6: Fig.17F As shown, a first protective adhesive layer 6 is formed on the side of the plurality of connecting leads 4 facing away from the back plate, and the first protective adhesive layer 6 covers the plurality of connecting leads 4 .

[0281] The first protective adhesive layer 6 is configured to protect the plurality of connecting leads 4 and to provide electrical insulation and water-proof oxygen corrosion. In some examples, the material of the first protective adhesive layer 6 is an insulating material with high corrosion resistance and adhesion. For example, the first protective adhesive layer 66 is an OC (over coating) adhesive or an ink layer. In some examples, the first protective adhesive layer 6 can be formed by a spraying process, a deposition process, or the like.

[0282] In some embodiments, Figure 5A , Fig. 7A and Fig. 8A As shown, the display panel further includes a plurality of second electrodes 5 arranged on the first main surface 1a of the back plate. Based on this, as shown in FIG. Fig. 16B As shown, the preparation method of the above-mentioned display panel also includes: before S3, S2': forming a plurality of second electrodes 5 on the first main surface 1a of the initial back panel 1'; the plurality of second electrodes 5 are close to at least one side 1c' among the plurality of side surfaces 1c', and in the direction perpendicular to the first main surface 1a, the positions of the plurality of second electrodes 5 correspond one-to-one to the positions of the plurality of first electrodes 3.

[0283] Exemplarily, one of the four side surfaces 1c' of the initial back plate 1' is a selected side surface 1c', and the plurality of first electrodes 3 and the plurality of second electrodes 5 are close to the selected side surface 1cc, that is, the plurality of second electrodes 5 are formed at positions close to the selected side surface 1c' on the first main surface 1a of the initial back plate 1'. The orthographic projection of each first electrode 3 on the first main surface 1a at least partially overlaps with the orthographic projection of the corresponding second electrode 5 on the first main surface 1a.

[0284] For example, Fig. 17BAs shown, a second preset distance A4 is provided between one end of each second electrode 5 close to the selected side surface 1c' and the side edge of the second main surface 1b of the initial back plate 1' close to the selected side surface 1c'. Since the second electrode 5 is arranged on the second main surface 1b of the initial back plate 1', that is, arranged on the back side of the prepared display panel, the plurality of second electrodes 5 are configured to bind the driving chip or the flexible circuit board, and there is no need to consider the influence of the positions of the plurality of second electrodes 5 on the area of ​​the display area of ​​the display panel. Therefore, the distance between the plurality of second electrodes 5 and the side edge of the second main surface 1b can be designed to be longer. For example, the second preset distance A4 between one end of each second electrode 5 close to the selected side surface 1c' and the side edge of the second main surface 1b of the initial back plate 1' close to the selected side surface 1c' is 400μm to 600μm. In some cases, in a direction perpendicular to the first main surface 1a of the back panel 1, the positions of the multiple second electrodes 5 and the multiple first electrodes 3 basically correspond one to one, and the second preset distance A4 can be equal to or approximately equal to the first preset distance A3, for example, the second preset distance A4 is 50μm to 80μm.

[0285] In the case where a plurality of second electrodes 5 are formed on the first main surface 1a of the initial backplane 1', in the step of forming a plurality of connecting leads 4 in S4, S41 includes: forming a metal layer on the first main surface 1a and the at least one side surface 1c of the backplane, the metal layer being in contact with the plurality of first electrodes 3 and the plurality of second electrodes 5. S42' includes: forming a metal layer on the first main surface 1a and the at least one side surface 1c of the backplane, and on the surface of the shielding layer, the metal layer being in contact with the plurality of first electrodes 3 and the plurality of second electrodes 5. Fig.17E As shown, each of the multiple connecting leads 4 finally formed is also electrically connected to a second electrode 5 .

[0286] It should be noted that the step of forming a plurality of first electrodes 3 in S2 and the step of forming a plurality of second electrodes 5 in S2 ′ are not limited in order.

[0287] The following introduces the preparation of multiple light-emitting devices in a display panel, taking the multiple light-emitting devices as mini light-emitting diodes as an example, which are usually called mini LED chips.

[0288] In some embodiments, the preparation sequence of the plurality of light-emitting devices is after the preparation sequence of the plurality of side 1c' leads, that is, after forming the plurality of connecting leads 4 on the first main surface 1a and at least one side surface 1c of the backplane, the plurality of light-emitting devices are formed on the second main surface 1b of the backplane, and the plurality of light-emitting devices are electrically connected to the plurality of first electrodes 3, for example, the plurality of mini LED chips are transferred to the second main surface 1b of the backplane. In this way, possible damage to the plurality of light-emitting devices in the process of forming the plurality of connecting leads 4 can be avoided.

[0289] In other embodiments, the preparation order of the plurality of light-emitting devices is before the preparation order of the plurality of side 1c' leads. For example, before S3 (hereinafter referred to as S3 is the chamfering step), a plurality of light-emitting devices are formed on the second main surface 1b of the initial back panel 1', and the plurality of light-emitting devices are electrically connected to the plurality of first electrodes 3.

[0290] In this case, the manufacturing process of the display panel further includes: forming a second protective adhesive layer 9 on a side of the plurality of first electrodes 3 and the plurality of light-emitting devices that faces away from the initial back plate 1 ′.

[0291] For example, the above-mentioned method of forming the second protective adhesive layer 9 is: coating the material of the second protective adhesive layer on the second main surface 1b of the initial backplane 1', and grinding the surface of the formed second protective adhesive layer 9, so that the second protective adhesive layer 9 is formed on the entire surface of the second main surface 1b of the initial backplane 1', and the second protective adhesive layer 9 covers the multiple light-emitting devices 2 and the multiple first electrodes 3, and fills the gap area between the multiple light-emitting devices 2, and fills the gap area between the multiple first electrodes 3. Alternatively, attach a whole second protective adhesive layer 9 to the second main surface 1b of the initial backplane 1', and grind the surface of the second protective adhesive layer, so that the second protective adhesive layer 9 covers the multiple light-emitting devices 2 and the multiple first electrodes 3, and fills the gap area between the multiple light-emitting devices 2, and fills the gap area between the multiple first electrodes 3. Fig. 7A and Fig. 8A As shown, the second protective adhesive layer 9 can protect the multiple light-emitting devices 2 and the multiple first electrodes 3, and prevent the multiple light-emitting devices 2 and the multiple first electrodes 3 from being damaged in the subsequent process. For example, the chamber where the second protective layer is prepared is not the same chamber as the chamber where the second protective layer is cut. The second protective adhesive layer 9 can prevent the multiple light-emitting devices 2 and the multiple first electrodes 3 from being damaged during the chamber transfer process, and prevent the multiple light-emitting devices 2 from being damaged during the process of forming the multiple connecting leads 4.

[0292] When forming a plurality of connecting leads 4 in S4, the formed plurality of connecting leads 4 need to be electrically connected to the plurality of first electrodes 3, so before S4, the second protective adhesive layer needs to be cut to expose a portion of the plurality of first electrodes 3. Exemplarily, in the case where the initial backplane 1' has a process edge, the initial backplane 1' and the second protective adhesive layer 9 are cut along the position of one end of the plurality of first electrodes 3 facing the selected side 1c of the initial backplane 1' to remove the process edge of the initial backplane 1' and expose one end of the plurality of first electrodes 3 facing the selected side 1c of the initial backplane 1', at which time, the exposed ends of the plurality of first electrodes 3 are flush or substantially flush with the second protective adhesive layer, and at the same time, the exposed ends of the plurality of first electrodes 3 are flush or substantially flush with the side edge of the initial backplane 1' after cutting. In the case where the initial backplane 1' does not have a process edge, the second protective adhesive layer 9 is cut to expose one end of the plurality of first electrodes 3 facing the selected side 1c of the initial backplane 1'.

[0293] In some embodiments, a black adhesive material can be selected to be coated on the gap areas between the multiple light-emitting devices 2, and a highly light-transmitting adhesive material can be selected to be coated on the surface of the multiple light-emitting devices 2 facing away from the back panel 1 to form a second protective adhesive layer 9. This can prevent the multiple light-emitting devices 2 from being damaged in subsequent process steps, improve the contrast of the display panel, and ensure the light output efficiency of the multiple light-emitting devices 2.

[0294] Alternatively, the material of the second protective rubber layer 9 can be black silicone or black resin. For example, the black silicone is coated on the side of the multiple light-emitting devices 2 and the multiple first electrodes 3 facing away from the back panel 1, so that the black silicone covers the multiple light-emitting devices 2 and the multiple first electrodes 3, and the surface of the black silicone is smoothed, and the part of the black silicone covering the surface of the multiple light-emitting devices 2 is ground to be very thin, for example, less than 1 mm, so that the black silicone can protect the multiple light-emitting devices 2 and the multiple first electrodes 3, and can also ensure the light transmittance of the part covering the surface of the multiple light-emitting devices 2, thereby not affecting the light emission effect of the light-emitting devices 2.

[0295] As a possible design, in some embodiments of the present disclosure, for the method of forming a metal layer by depositing metal in the manner of forming a plurality of connecting leads 4 in S4, the present disclosure provides a high-efficiency metal deposition method, which is suitable for Fig.19 S41 in Fig. 20 S41' and S42" in Fig. 22S4-2 in the embodiment. The method for preparing a display panel further includes forming a plurality of second electrodes 5 on the first main surface 1a of the initial backplane 1', and the finally formed display panel further includes a plurality of second electrodes 5 as an example for description. For the convenience of description, the backplane 1, the plurality of first electrodes 3 and the plurality of second electrodes 5 are taken as a whole, referred to as the backplane whole 21, and the first main surface 1a and the second main surface 1b of the backplane whole 21 are respectively the first main surface 1a and the second main surface 1b of the backplane 1. The high-efficiency preparation method of the plurality of connecting leads 4 includes:

[0296] S411, such as Fig.24A and Fig. 24B As shown, the first protective film 22 and the second protective film 23 are respectively attached to the first main surface 1a and the second main surface 1b of the back panel as a whole 21, and the first protective film 22 and the second protective film 23 are cut so that the first protective film 22 covers a portion of the plurality of second electrodes 5, and a portion of the plurality of second electrodes 5 close to the selected side surface 1cc is exposed, and the second protective film 23 covers a portion of the plurality of first electrodes 3, and a portion or one end of the plurality of first electrodes 3 close to the selected side surface 1cc is exposed.

[0297] The lengths of the exposed portions of the first electrode 3 and the second electrode 5 can be designed according to actual conditions. In some examples, for example, Fig. 20 As shown, 2 / 3 of the length of the first electrode 3 and the second electrode 5 are both blocked, and the other 1 / 3 of the length is exposed.

[0298] In the preparation process of the display panel described above, the preparation order of the multiple light-emitting devices is before the preparation order of the multiple side 1c' leads, that is, before S3 (chamfering step), a plurality of light-emitting devices are formed on the second main surface 1b of the initial back panel 1', and the plurality of light-emitting devices are electrically connected to the plurality of first electrodes 3.

[0299] In this case, as mentioned above, the manufacturing process of the display panel further includes: forming a second protective adhesive layer 9 on the side of the plurality of first electrodes 3 and the plurality of light-emitting devices facing away from the initial back plate 1', for example, the second protective adhesive layer 9 is a black resin. Fig. 24B As shown, the second protective adhesive layer 9 can be reused as the second protective film 23, and there is no need to re-attach the second protective film. Fig. 24B In the embodiment, for example, a portion of 2 / 3 of the length of the first electrode 3 is shielded, and a portion of another 1 / 3 of the length is exposed, and only the end surface of the second electrode 5 facing the selected side surface 1c' of the back plate is exposed.

[0300] It should be noted that Fig.24A and Fig. 24BIn the figure, there is a gap between the first protective film 22 and the back plate, and there is a gap between the second protective film 23 and the back plate 1. In fact, the thickness of the multiple first electrodes 3 and the multiple second electrodes 5 is very small, and the first protective film 22 and the second protective film 23 are both in contact with the back plate and attached to the surface of the back plate.

[0301] By setting the first protective film 22 and the second protective film 23, a portion of the multiple second electrodes 5 near the selected side surface 1cc is exposed, as well as a portion of the multiple first electrodes 3 near the selected side surface 1cc. In this way, in the subsequent process of depositing the metal layer, the metal layer can cover the exposed portions of the first electrode 3 and the second electrode 5 to form an electrical contact, thereby preventing excess metal from covering a large area of ​​the multiple first electrodes 3 and the multiple second electrodes 5 to cause problems such as short circuits.

[0302] S412, designing a layer structure for the back panel 21 with the first protective film 22 and the second protective film 23 attached thereto to form a single tooling module 27. For example, Figure 25 to Figure 26B As shown, the lower cover plate 25 is arranged on the side of the second protective film 23 away from the back plate as a whole 21, and the upper cover plate 24 is arranged on the side of the first protective film 22 away from the back plate as a whole 21, so that the first protective film 22, the second protective film 23, the back plate as a whole 21, the upper cover plate 24 and the lower cover plate 25 form a single tooling module 27.

[0303] For example, Fig.26A and Fig.26B for Fig.25 A partial enlarged view of the region G1 of a single tooling module 27, as shown in FIG. Fig.26A As shown, the lower cover plate 25 is kept substantially flush with the second protective film 23. The upper cover plate 24 is retracted inwardly by 0.5 mm to 1 mm relative to the first protective film 22. Fig.26B As shown, when the second protective adhesive layer 9 (for example, black resin) is reused as the second protective film 23, the lower cover plate 25 extends outward by 1mm to 2mm relative to the second protective film 22, and the upper cover plate 24 retracts inward by 0.5mm to 1mm relative to the first protective film 22. This design can ensure that the metal layer formed in the subsequent step of sputtering the metal layer has a certain thickness, and can also prevent metal ions from entering the tiny gap between the backplane 21 and the first protective film 22 or the second protective film 23 to cause a short circuit.

[0304] S413 , assembling multiple single tooling modules 27 into an integral tooling module 28 , and sputtering a metal layer on the integral tooling module 28 .

[0305] For example, Fig.25As shown, multiple single tooling modules 27 are assembled by positioning columns 26 to form an integral tooling module 28, and the integral tooling module 28 is placed on a turntable 31, so that the integral tooling module 28 rotates under the action of the turntable 31, and metal is sputtered on the integral tooling module 28. Exemplarily, the metal target is located at the side of the integral tooling module 28, and during the process of metal sputtering of the metal target, the integral tooling module is in rotation, so that a metal layer is simultaneously formed on the selected side surface 1cc of the back plate in multiple single tooling modules and the exposed area of ​​the first main surface 1a, and the thickness of the metal layer formed on the surface of the back plate 1 in multiple single tooling modules is substantially the same.

[0306] Since the metal target is located at the side of the overall tooling module 28, the metal sputtered to the selected side surface 1cc of the back plate 1 is relatively large, and the metal layer formed on the selected side surface 1cc of the back plate is thicker. In order to improve the uniformity of the overall thickness of the metal layer, the relative position of the metal target and the overall tooling module can be adjusted to improve the uniformity of the thickness of the formed metal layer. For example, the ratio of the thickness of the metal layer formed on the exposed area on the first main surface 1a of the back plate to the thickness of the metal layer formed on the selected side surface 1cc of the back plate is set between 0.6 and 1.6, so that the thickness difference at different positions is not too large.

[0307] In some embodiments, if a metal layer needs to be formed on only one or two side surfaces 1c of the back panel, that is, the display panel formed only includes one or two selected side surfaces 1cc, before sputtering the metal layer on the overall tooling module, the other side surfaces 1c of the back panel need to be blocked to avoid the other side surfaces 1c being covered by the metal layer.

[0308] After obtaining the display panel by the display panel preparation method introduced in some embodiments of the present disclosure, a driving chip or a flexible circuit board is bound to the first main surface of the backplane to obtain a display device with an ultra-narrow frame.

[0309] Exemplarily, the driving chip or flexible circuit board can be set on the back of the display panel by binding the driving chip or flexible circuit board to multiple second electrodes, or binding the driving chip or flexible circuit board to the portion of multiple connecting leads located on the first main surface of the back panel.

[0310] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display panel, comprising: A back plate, the back plate comprising a first main surface and a second main surface opposite to each other, and a plurality of side surfaces connecting the first main surface and the second main surface; At least one side surface among the plurality of side surfaces is a selected side surface; A plurality of light emitting devices are disposed on the second main surface of the back plate, wherein the light emitting devices are light emitting diodes; A plurality of first electrodes are disposed on the second main surface of the back plate; the plurality of first electrodes are close to the selected side surface relative to the plurality of light-emitting devices, and the plurality of first electrodes are electrically connected to the plurality of light-emitting devices; A plurality of connecting leads are arranged on the first main surface and the selected side surface of the back plate; each of the plurality of connecting leads includes a first portion located on the first main surface and a second portion located on the selected side surface, and the ratio of the thickness of the first portion to the thickness of the second portion is between 0.6 and 1.6; the connecting lead passes through the selected side surface in sequence from the first main surface and is electrically connected to one of the plurality of first electrodes.

2. The display panel according to claim 1, wherein: The selected side surface includes a side sub-surface perpendicular or substantially perpendicular to the first main surface and the second main surface, and a first transition sub-surface connecting the first main surface and the side sub-surface; In a cross section of the backboard along a direction perpendicular to the first main surface and perpendicular to the boundary of the backboard where the side sub-surface is located, an angle between a tangent line at any point on the first transition sub-surface and the first main surface is greater than 90°, and an angle between a tangent line and the side sub-surface is greater than 90°; The connecting lead is electrically connected to one of the plurality of first electrodes by sequentially passing through the first transition sub-surface and the side sub-surface of the selected side surface from the first main surface.

3. The display panel according to claim 2, wherein: In a direction perpendicular to the first main surface, one end of the first electrode close to the selected side surface is flush or substantially flush with a side edge of the second main surface close to the selected side surface; The connecting lead extends from the first main surface through the first transition sub-surface and the side sub-surface of the selected side surface in sequence, to the side edge of the second main surface close to the selected side surface, and is electrically connected to the first electrode.

4. The display panel according to claim 2, wherein: There is a gap between one end of the first electrode close to the selected side surface and the side edge of the second main surface close to the selected side surface; The connecting lead further includes a third portion located on the second main surface, and a ratio of a thickness of the third portion to a thickness of the second portion is between 0.6 and 1.6; The connecting lead extends from the first main surface through the first transition sub-surface and the side sub-surface of the selected side surface in sequence to the second main surface, and is electrically connected to the first electrode.

5. The display panel according to claim 2, wherein: The selected side surface further includes a second transition subsurface connecting the side subsurface and the second major surface; In a cross section of the back plate along a direction perpendicular to the first main surface and perpendicular to the boundary of the back plate where the side sub-surface is located, the angle between a tangent line at any point on the second transition sub-surface and the second main surface is greater than 90°, and the angle between a tangent line and the side sub-surface is greater than 90°; The connecting lead passes through the first transition sub-surface, the side sub-surface and the second transition sub-surface of the selected side surface in sequence from the first main surface to be electrically connected to the first electrode.

6. The display panel according to claim 5, wherein: The first transition sub-surface is a plane or a curved surface; the second transition sub-surface is a plane or a curved surface.

7. The display panel according to any one of claims 1 to 6, further comprising: a plurality of second electrodes disposed on the first major surface; The plurality of second electrodes are configured to be electrically connected to a driving chip or a flexible circuit board; Each of the plurality of connection leads is electrically connected to one of the plurality of second electrodes.

8. The display panel according to claim 7, wherein: The orthographic projections of the first electrode and the second electrode electrically connected to the same connecting lead on the first major surface at least partially overlap.

9. The display panel according to any one of claims 1 to 6, wherein: Portions of the plurality of connection leads located on the first main surface are configured to be bound to a driving chip or a flexible circuit board.

10. The display panel according to claim 9, wherein: The first main surface of the backplane has a binding area; parts of the plurality of connecting leads located on the first main surface extend into the binding area and are configured to bind the driving chip or the flexible circuit board in the binding area.

11. The display panel according to claim 10, wherein: The length of the binding area is equal to or substantially equal to the length of the side edge of the first major surface adjacent to the selected side surface; Along a direction from a side edge of the first main surface close to the selected side surface to the binding area, portions of the plurality of connecting leads located on the first main surface extend into the binding area; Alternatively, the length of the binding area is smaller than the length of the side edge of the first main surface close to the selected side surface; Along a direction from a side edge of the first main surface close to the selected side surface toward the binding area, portions of the plurality of connecting leads located on the first main surface are gathered within the binding area.

12. The display panel according to any one of claims 1 to 6, wherein: The backplane is provided with a plurality of signal lines; the plurality of first electrodes are electrically connected to the plurality of light-emitting devices through the plurality of signal lines; The width of the first electrode is the same as or substantially the same as the width of the signal line electrically connected thereto; In a case where the connecting lead further includes a third portion located on the second main surface, a width of the third portion is the same as or substantially the same as a width of a signal line electrically connected thereto.

13. The display panel according to claim 12, wherein: The width of the first portion of the connecting lead is the same or substantially the same as the width of the third portion thereof; The width of the second portion of the connecting lead is greater than the width of the first portion thereof, and greater than the width of the third portion thereof.

14. The display panel according to claim 13, wherein: Parts of the plurality of connecting leads located on the same selected side surface are arranged at equal intervals along a direction parallel to a backplane boundary where a side sub-surface of the selected side surface is located; The intervals between two adjacent connecting leads among the plurality of connecting leads located on different selected side surfaces are different.

15. The display panel according to any one of claims 1 to 6, wherein: The plurality of connecting leads are prepared by a laser etching process, and the display panel further comprises an energy absorbing film; the energy absorbing film is arranged between the back plate and the plurality of connecting leads.

16. The display panel according to claim 15, wherein: The material of the energy absorption film includes at least one of tin dioxide and zinc oxide.

17. The display panel according to any one of claims 1 to 6, wherein: Each of the plurality of connecting leads comprises a first buffer conductive pattern, a main conductive pattern, and a second buffer conductive pattern which are sequentially stacked, wherein the first buffer conductive pattern is closer to the back plate than the main conductive pattern; The adhesion between the first buffer conductive pattern and the back plate is greater than the adhesion between the main conductive pattern and the back plate; The second buffer conductive pattern has a better anti-oxidation property than the main conductive pattern.

18. The display panel according to claim 17, wherein: The material of the first buffer conductive pattern is the same as that of the second buffer conductive pattern, and the materials of the first buffer conductive pattern and the second buffer conductive pattern include at least one of titanium, chromium, molybdenum, and molybdenum-niobium alloy.

19. The display panel according to any one of claims 1 to 6, wherein: The display panel further includes a first protective adhesive layer, and the first protective adhesive layer covers the plurality of connecting leads.

20. The display panel according to any one of claims 1 to 6, wherein: The display panel further comprises a second protective adhesive layer disposed on a side of the plurality of light emitting devices facing away from the back plate; The second protective glue layer covers the plurality of light emitting devices and the plurality of first electrodes, and fills the gap regions between the plurality of light emitting devices and the plurality of first electrodes.

21. A display device, comprising: The display panel according to any one of claims 1 to 20; and A driving chip; the driving chip is arranged on the first main surface of the back plate of the display panel, and the driving chip is electrically connected to the multiple first electrodes of the display panel through the multiple connecting leads of the display panel.

22. The display device according to claim 21, wherein: In the case where the display panel further includes a plurality of second electrodes, the driving chip is electrically connected to the plurality of second electrodes, so as to be electrically connected to the plurality of connection leads through the plurality of second electrodes; Alternatively, the driving chip is electrically connected to portions of the plurality of connecting leads located on the first main surface of the back plate.

23. A splicing display device, comprising: A plurality of display devices as described in claim 21 or 22, wherein the plurality of display devices are spliced ​​and assembled.

24. A method for preparing a display panel, comprising: Provide initial backing plate; The initial backplane comprises a first main surface and a second main surface opposite to each other, and a plurality of side surfaces connecting the first main surface and the second main surface; the plurality of side surfaces are perpendicular or substantially perpendicular to the first main surface and the second main surface; A plurality of first electrodes are formed on the second main surface of the initial back plate; the plurality of first electrodes are adjacent to at least one side surface of the plurality of side surfaces, the at least one side surface being a selected side surface; The interface between the first main surface and the selected side surface of the initial backplane is processed to form a first transition sub-surface at the interface, and the selected side surface forms a side sub-surface, so as to obtain a backplane; the backplane comprises a plurality of side surfaces connecting the first main surface and the second main surface, at least one side surface of the plurality of side surfaces is a selected side surface, and the selected side surface comprises a side sub-surface perpendicular or substantially perpendicular to the first main surface and the second main surface, and a first transition sub-surface connecting the first main surface and the side sub-surface; in a cross section of the backplane along a direction perpendicular to the first main surface and perpendicular to a backplane boundary where the side sub-surface is located, an angle between a tangent at any point on the first transition sub-surface and the first main surface is greater than 90°, and an angle between a tangent at any point on the first transition sub-surface and the side sub-surface is greater than 90°; A plurality of connecting leads are formed on the first main surface and the selected side surface of the back plate; each of the plurality of connecting leads includes a first portion located on the first main surface and a second portion located on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is between 0.6 and 1.6; the connecting lead passes through the first transition sub-surface and the side sub-surface of the selected side surface in sequence from the first main surface, and is electrically connected to one of the plurality of first electrodes.

25. The preparation method according to claim 24, wherein: A plurality of connecting leads are formed on the first main surface and selected side surfaces of the back plate, including: forming a metal layer on the first major surface and the selected side surfaces, the metal layer being in contact with the plurality of first electrodes; The metal layer is patterned to form a plurality of connecting leads; each of the plurality of connecting leads sequentially passes through the first transition sub-surface and the side sub-surface of the selected side surface from the first main surface to be electrically connected to a first electrode among the plurality of first electrodes.

26. The preparation method according to claim 24, wherein: The plurality of connecting leads include a portion located on the selected side surface and a portion located on the first main surface, and a plurality of connecting leads are formed on the first main surface and the selected side surface of the back plate, including: forming a metal layer on the selected side surface; Patterning the metal layer to obtain portions of the plurality of connecting leads located on the selected side surface; as well as, Disposing a mask plate on the first main surface, wherein the mask plate is configured to expose an area on the first main surface where the plurality of connecting leads need to be disposed; Depositing metal on the first main surface to form a metal layer; The mask is removed to form a portion of the plurality of connecting leads located on the first main surface; the portion of the plurality of connecting leads located on the first main surface is electrically connected to a portion of the plurality of connecting leads located on the selected side surface; A plurality of connecting leads are obtained, the plurality of connecting leads including a portion located on the selected side surface and a portion located on the first main surface; each connecting lead of the plurality of connecting leads passes through the first transition sub-surface and the side sub-surface of the selected side surface in sequence from the first main surface to be electrically connected to a first electrode of the plurality of first electrodes.

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