Headphone earmuffs with absorbent material

Abstract

The present invention discloses a headphone earmuff, which includes: a frame, which defines a sound cavity acoustically connected to a driver; an earmuff cushion, which is connected to the frame and surrounds the sound cavity; and an adsorbent member, which is acoustically connected to the sound cavity to cause acoustic expansion of the sound cavity.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is a non-provisional application of co-pending U.S. Provisional Patent Application 63 / 079,389 filed on September 16, 2020, and is incorporated herein by reference. Technical Field

[0003] One aspect of the present disclosure is directed to a headphone earmuff, and more particularly to a headphone earmuff having an absorbent material to acoustically expand the acoustic cavity of the earmuff. Other aspects are also described and claimed. Background Art

[0004] Whether listening to a portable media player while traveling or listening to a stereo or theater system at home, consumers often choose headphones. Headphones typically include a pair of earmuffs that surround the user's ears and are held together by a headband. Based on the design of the earmuffs, headphones can be divided into two categories, namely closed-back earmuffs or open-back earmuffs. Closed-back earmuffs surround the user's ears and the back of the closed-back earmuffs is sealed. Open-back earmuffs also surround the user's ears, but the back of the open-back earmuffs is open to the surrounding environment around the earmuffs.

[0005] Both closed-back and open-back designs have their own acoustic advantages and disadvantages. For example, closed-back earmuffs can have good sound isolation because they are sealed from ambient noise. In addition, the size and clamping force of the earmuffs can also be modified to further increase sound isolation. Features of closed-back designs such as the sealed back, size, and clamping force of the earmuffs allow the design to mechanically or passively attenuate ambient noise. However, due to the closed design of closed-back earmuffs, they can have stronger resonances. For example, standing waves can accumulate in the earmuffs. These standing waves can reduce the sound quality and reduce the sense of openness that users typically expect. On the other hand, open-back earmuffs may feel more open to the user, but may not be ideal in noisy environments because their passive attenuation may not be as good as that of closed-back designs. Summary of the invention

[0006] One aspect of the present disclosure may include a headphone earmuff that includes an adsorbent material for acoustically expanding an acoustic cavity (e.g., a front volume chamber) of the earmuff. An acoustic cavity may be a cavity that receives sound output from an associated driver and surrounds a user's ear. For example, an adsorbent material may be incorporated into the earmuff and coupled to the acoustic cavity to simulate a larger acoustic cavity (e.g., a larger front volume chamber) and / or maximize the damping characteristics of the acoustic cavity. Acoustic enlargement and / or damping may then improve downlink response and passive attenuation at high frequencies. The adsorbent material may be any adsorbent material that can provide damping without occupying as much space as other damping materials (e.g., foam). For example, the adsorbent material may be any adsorbent material that can adsorb gas during sound emission. In some aspects, the adsorbent material may be embedded in an earmuff cushion (e.g., a ring of material surrounding a user's ear) or integrated into an earmuff frame. For example, the adsorbent material may be integrated into the foam within the earmuff cushion. The adsorbent material may include a module that is assembled externally and inserted into the earmuff frame or otherwise as part of the module. For example, the adsorbent material may be contained in a module housing having at least one opening to the acoustic cavity. For example, the module may be a module housing having rigid or sound-impermeable sidewalls (e.g., plastic sidewalls) and at least one sound-permeable wall (e.g., mesh sidewalls) providing an opening to the acoustic cavity. On the other hand, the module may be a flexible shell, such as a shell made of sound-permeable fabric, in which the adsorbent material may be contained and compressed to a desired size / shape. In some aspects, the adsorbent material acts as a tuning knob by increasing the acoustic cavity (e.g., front volume chamber) and damping characteristics, which will have an effect on passive attenuation. The adsorbent material may be any type of adsorbent material that can cause simulated acoustic expansion of the acoustic volume or cavity to which it is connected. In some aspects, the adsorbent material may include adsorbent particles that adsorb gas during sound emission. For example, the adsorbent material may include, but is not limited to, microporous materials, such as zeolites. Zeolites are microporous minerals, typically aluminosilicate minerals. For example, the adsorbent material may include unbound particles, such as a granular composition of one or more of a zeolite material and / or an activated carbon material. In further examples, the adsorbent material may be a zeolite material including zeolite particles having a specific silicon to aluminum mass ratio.

[0007] Representatively, in one aspect, the headset includes two headset earmuffs, each headset earmuff including: a frame defining a driver front volume chamber; and an adsorbent member including zeolite, the adsorbent member being acoustically coupled to the driver front volume chamber to cause acoustic expansion of the driver front volume chamber. The headset may also include an earmuff cushion coupled to the frame and surrounding the driver front volume chamber. The adsorbent member may be positioned within the earmuff cushion. The earmuff cushion may define an opening that couples the adsorbent member to the driver front volume chamber. In some aspects, the earmuff cushion may include foam, and the adsorbent member may be integrated into the foam. The adsorbent member may be positioned inside the frame, and the frame includes an opening to acoustically couple the adsorbent member to the driver front volume chamber. The adsorbent member may include an adsorbent material enclosed in a housing that is coupled to the frame or to an earmuff cushion coupled to the frame. The housing may include a plurality of acoustically impermeable sidewalls and at least one acoustically permeable sidewall to acoustically couple the adsorbent material to the driver front volume chamber. The housing may include an acoustically transparent mesh.The sorbent member may include a first sorbent member coupled to the frame and a second sorbent member coupled to an ear cup cushion coupled to the frame.

[0008] In another aspect, a headphone earmuff includes: a frame defining an acoustic cavity acoustically coupled to a sound output side of a driver; an earmuff cushion coupled to the frame and sized to surround the acoustic cavity; and an acoustic sorbent module comprising zeolite acoustically coupled to the acoustic cavity. The zeolite may be enclosed within a module housing. The module housing may include an acoustically transparent mesh material encapsulating the zeolite. The module housing may be formed in part of an acoustically transparent fabric. The module housing may compress the zeolite into a volume that is smaller than if the zeolite were not enclosed within the module housing. The module housing may include at least one plastic sidewall defining an opening to the zeolite. The acoustic sorbent module may be positioned within the earmuff cushion. The acoustic sorbent module may be integrated into the frame. The acoustic sorbent module may be formed separately from the frame and the earmuff cushion. The zeolite may cause simulated acoustic enlargement of the acoustic cavity and suppress standing waves within the acoustic cavity.

[0009] The above summary does not include an exhaustive list of all aspects of the present disclosure. It is contemplated that the present disclosure includes all systems and methods that can be implemented by all suitable combinations of the various aspects summarized above and disclosed in the detailed description below and specifically pointed out in the claims filed with this patent application. Such combinations have specific advantages not specifically recited in the above summary. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Several aspects are shown by way of example and not limitation in the figures of the accompanying drawings, in which like reference numerals indicate similar elements. It should be noted that reference to "one" or "an" aspect in the present disclosure is not necessarily the same aspect, and it means at least one.

[0011] Figure 1 A schematic diagram showing a cross-sectional view of one aspect of a headphone ear cup structure.

[0012] Figure 2 A schematic diagram showing a cross-sectional view of one aspect of a headphone ear cup structure.

[0013] Figure 3 Shows Figure 1 Schematic diagram of an enlarged cross-sectional view of an adsorbent component of a headphone earmuff structure.

[0014] Figure 4 Shows Figure 1 Schematic diagram of an enlarged cross-sectional view of an adsorbent component of a headphone earmuff structure.

[0015] Figure 5 A simplified schematic diagram showing one aspect of an electronic device in which a headphone ear cup structure may be implemented. DETAILED DESCRIPTION

[0016] The following description shows many specific details. However, it should be understood that aspects of the present disclosure can be practiced without these specific details. In other cases, well-known circuits, structures, and techniques are not shown in detail to avoid obscuring the understanding of this description.

[0017] In the following description, reference is made to the accompanying drawings that illustrate several aspects of the present disclosure. It should be understood that other aspects may also be utilized, and that mechanical composition changes, structural changes, electrical changes, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be construed in a limiting sense, and the scope of the aspects of the present disclosure is limited only by the claims of the issued patents.

[0018] The terms used herein are only for describing specific aspects and are not intended to limit the present disclosure. Spatially related terms, such as "under ... ", "below ... ", "below", "above ... ", "on ", etc. can be used for convenience of description in this article to describe the relationship between an element or feature and another one or more elements or one or more feature parts, as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to cover different orientations during the use or operation of the device other than the orientation shown in the accompanying drawings. For example, if the device in the figure is turned over, the element described as "below" or "below" other elements or features can then be oriented to "above" other elements or features. Therefore, the exemplary term "below ... " can cover these two orientations above ... and below .... The device can be oriented in other ways (for example, rotated 90 degrees or at other orientations), and the spatially related descriptors used in this article are interpreted accordingly.

[0019] As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms "include", "comprise", and "comprising" define the presence of the features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof.

[0020] The terms "or" and "and / or" as used herein should be interpreted as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C." An exception to this definition will only occur if a combination of elements, functions, steps or actions are inherently mutually exclusive in some way.

[0021] Figure 1 Schematic diagram of a cross-sectional view of one aspect of a headphone earmuff structure. It should be understood that the figure shows only one of a pair of left and right earmuffs of the headphone 100, which may be connected by a headband (not shown). Therefore, reference is made to Figure 1 Each of the features described for the illustrated ear cup of the headset 100 should be understood to apply to another ear cup of the headset 100. The ear cup of the headset 100 includes a frame 102 that forms a housing sized to surround a user's ear 106 and form an acoustic cavity 104 around the user's ear. The acoustic cavity 104 may surround the ear 106 when the ear cup of the headset 100 is positioned on the user's head, and may be open to the surrounding environment when not positioned against the user's head.

[0022] A driver 108 for outputting sound (S) (e.g., a music signal) in the direction of the ear 106 may be mounted to the frame 102. For example, the driver 108 may have a sound output side that is open to the acoustic cavity 104, so that the sound (S) is output to the acoustic cavity 104. Therefore, the acoustic cavity 104 may also be considered to be a front volume chamber of the driver 108 or form a part of the front volume chamber because the acoustic cavity is open to the surrounding environment. The driver 108 can be any type of electroacoustic transducer (e.g., a loudspeaker) having a pressure-sensitive diaphragm and a circuit configured to generate sound in response to an audio electrical signal input. The audio electrical signal can be a music signal input to the driver 108 by a sound source 110. The sound source 110 can be any type of audio device capable of outputting an audio signal, for example, an audio electronic device such as a smart phone, a portable music player, a home stereo system, or a home theater system capable of outputting an audio signal.

[0023] The earmuffs of the headset 100 may also include earmuff pads or cushions 112. The earmuff cushions 112 may be attached to the side or surface of the frame 102 facing the ear 106 and forming the acoustic cavity 104. In some cases, the earmuff cushions 112 may form a part of the acoustic cavity 104 and help to form a seal between the acoustic cavity 104 and the user's ear 106. The earmuff cushions 112 may be a donut or other similar circular, racetrack-shaped or oval structure that surrounds the acoustic cavity 104 and can be sealed around or to the user's head or ear 106. When pressed against the user's head and / or ears, the earmuff cushions 112 may be compressible and conform to the user's head and / or ears 106, thereby improving user comfort. For example, the earmuff cushions 112 may be made of a compressible foam material 114 contained in a cushion cover 116. In some aspects, the ear cup cushion 112 may also include an opening 118 through the cover 116 so that the foam material 114 is acoustically open to the acoustic cavity 104. In this aspect, the foam material 114 may help suppress standing waves within the acoustic cavity 104. For example, Figure 1 As shown, as sound (S) is output upward (or otherwise away from the driver) by the driver 108, the waves also propagate outward and cause standing waves 105A, 105B in different areas of the acoustic cavity 104. For example, there may be a standing wave 105A within the portion of the cavity defined by the rigid frame 102, and there may be a standing wave 105B within the portion of the cavity defined by the flexible earmuff cushion 112. The foam material 114 within the earmuff cushion 112 may help suppress the standing wave 105B.

[0024] The earmuff headset 100 may also include an adsorbent member 120 coupled to the acoustic cavity 104 to suppress standing waves and cause simulated acoustic expansion of the acoustic cavity 104. In other words, the adsorbent member 120 may make the volume of the acoustic cavity 104 appear larger than the actual volume, which in turn may improve acoustic performance. As previously described, the acoustic cavity 104 may form or be part of a driver front volume chamber, and therefore its size may affect the overall acoustic performance of the earmuff. For example, maximizing the volume of the acoustic cavity 104 may improve acoustic performance and enhance user experience and / or comfort. However, increasing the cavity volume of the earmuff is often challenging because it may also be desirable to maintain a relatively thin profile, and thus a compact footprint, so that the headset is not too bulky. Therefore, the adsorbent member 120 may simulate an acoustic expansion of the volume of the acoustic cavity 104 without affecting the overall footprint and / or size of the headset earmuff. In this aspect, the sorbent member 120 may include a sorbent material that may have damping properties and occupy minimal space within the earmuff. For example, the sorbent material may include, but is not limited to, a zeolite material or a combination of sorbent materials including activated carbon materials and zeolite materials. The sorbent member 120 may, for example, occupy less space or volume than the foam material 118 while still providing damping properties and simulating the acoustic enlargement of the cavity 104.

[0025] In one aspect, the sorbent member 120 may be positioned within the earmuff cushion 112. In this position, the sorbent member 120 may help suppress the standing waves 105B within the cushion area of ​​the cavity 104. Representatively, the sorbent member 120 may be incorporated into the foam material 120 of the earmuff cushion 112. For example, the sorbent member 120 may be positioned within a portion of the foam material 114 adjacent to the opening 118 of the earmuff cushion 112, such that the sorbent member is exposed to the acoustic cavity 104. Representatively, the sorbent member 120 may be an sorbent material (e.g., zeolite) embedded within the foam material 120. In further aspects, the sorbent member 120 may include a module encapsulating the sorbent material, and the module may be embedded or encapsulated within the foam material 120. For example, the module in which the sorbent material is encapsulated may be mounted (or otherwise attached) to an end of the frame 102 to which the earmuff cushion 112 is also attached. Loading portions of the module or foam material with an adsorbent material may involve injecting the adsorbent material (and in some cases in combination with an adhesive material) directly into the module or foam material or mold to achieve a preform, and then loading the preform into the desired mold or material within the cushion 112. The adsorbent member 120 is then positioned within the foam material 114 inside the cushion cover 116. Although the adsorbent member 120 is shown as being attached to an end of the frame 102, it should be understood that the adsorbent member 120 may be attached to the earmuff cushion 112 or any portion of the frame 102 that acoustically couples it to the acoustic cavity 104. In addition, the adsorbent member 120 may be an annular member that extends completely around the earmuff cushion 112, or formed as a discrete unit positioned within the portion of the earmuff cushion 112 that surrounds the cavity 104. Reference will be made to Figure 3 to Figure 4 A representative module configuration of the sorbent member 120 is described in more detail.

[0026] See now Figure 2 , Figure 2 Another aspect is shown in which a sorbent member 120 is attached to the headphone earmuff 100. In this aspect, the sorbent member 120 is shown as being attached or otherwise mounted to a portion of the frame 102. Representatively, the sorbent member 120 may be attached to a sidewall 202 of the frame 102 that defines a portion of the acoustic cavity 104. For example, the sorbent member 120 may be attached to an interior sidewall 202 (e.g., a sidewall that defines the cavity 104). In some aspects, the sorbent member 120 is positioned inside the frame 102, positioned between the interior sidewall 202 and the exterior sidewall 206 that define the frame 102, as shown. In this aspect, the sorbent member 120 does not occupy or otherwise reduce the available volume of the acoustic cavity 104. The frame sidewall 202 may include an opening 204 to the sorbent member 120, such that the sorbent member is acoustically open to the acoustic cavity 104.

[0027] When Figure 2When positioned in the frame 102 as shown, the sorbent member 120 can help suppress the standing waves 105A generated in this area of ​​the cavity 104 and result in simulated acoustic expansion of the acoustic cavity 104. Although the sorbent member 120 is shown as being attached to the side wall 202, it should be understood that the sorbent member 120 can be attached to any side wall or portion of the frame 102 that acoustically couples it to the acoustic cavity 104. In addition, the sorbent member 120 can extend completely around the frame 102 (e.g., an annular structure), or it can be composed of discrete units positioned within a portion of the frame 102. Further, it should be understood that any number of sorbent members 120 can be used within the earmuff housing 100. For example, the earmuff housing 100 may include, for example, Figure 1 The absorbent member 120 in the earmuff cushion shown and the Figure 2 Both sorbent members 120 are shown in the frame.

[0028] See now Figure 3 to Figure 4 , Figure 3 to Figure 4 A cross-sectional view of a representative sorbent member that may be integrated into a headphone earmuff 100 is shown. Figure 3 The sorbent member 120 is shown with the sorbent material 302 enclosed within a module housing or shell 304. The module housing or shell 304 may include a plurality of sidewalls 306, 308, 310, 312 that enclose or otherwise contain the sorbent material 302. For example, the shell 302 may include a plurality of relatively rigid and / or acoustically impermeable sidewalls 306-310 and at least one acoustically permeable sidewall 312. The acoustically permeable sidewall 312 may be positioned above an opening 314 defined by the sidewalls 306 and 310. The acoustically permeable sidewall 312 includes an opening 316 so that the sorbent material 302 is open to the acoustic cavity and may result in acoustic amplification, as previously described. For example, the acoustically permeable sidewall may be made of a fabric, mesh, or other similar material having openings to allow acoustic transmission between the acoustic cavity and the sorbent material 302.

[0029] See now Figure 4 , Figure 4 Another aspect of a sorbent member that may be integrated into the headphone earmuff 100 is shown. Representatively, the sorbent member 120 may include a sorbent material 402 encapsulated or otherwise contained within a module housing or shell 404. The housing or shell 404 may include sidewalls 406, 408, which are similar to those previously described with reference to FIG. Figure 3Module discussed. However, in this aspect, the side walls 406 and 408 can be made of a relatively flexible and acoustically transparent material including openings 416 so that they allow acoustic transmission between the sorbent material 402 enclosed therein and the acoustic cavity, as previously described. For example, the side walls 406, 408 can be made of sheets of acoustically transparent fabric or mesh material attached together around their edges so that the sorbent material 402 is completely enclosed between the side walls 406, 408. In some aspects, the sorbent material 402 can be compressed or otherwise shaped as desired so that the sorbent member 120 occupies minimal space within the ear cup.

[0030] Any of the module housings or enclosures 304, 404 discussed previously may be integrated into the previously referenced Figure 1 to Figure 2 100. Representatively, in some aspects, the module housing or shell 304, 404 can be formed separately from the headset earmuff 100 and then attached to the frame 102 or earmuff cushion 112 during assembly. In one aspect, the module can be mechanically attached to the headset earmuff 100. For example, one or more of the side walls of the module housing or shell 304, 404 can include an interlocking member that interlocks with the side walls of the frame 102 so that the module is attached to the frame 102 or earmuff cushion 112 in a snap-fit ​​arrangement. In other aspects, the module housing or shell 304, 404 can be mounted to the frame 102 or earmuff cushion 112 according to any other suitable fastening mechanism (e.g., molding, adhesive, etc.).

[0031] Figure 5 1 shows a simplified schematic diagram of one aspect of an electronic device in which the headphone earmuffs disclosed herein may be implemented. For example, the headphone 100 is an example of a system that may include some or all of the circuits illustrated by the electronic device 500. The electronic device 500 may include, for example, a power supply 502, a storage device 504, a signal processor 506, a memory 508, a processor 510, a communication circuit 512, and an input / output circuit 514. In some aspects, the electronic device 500 may include more than one of each circuit component, but for simplicity, only the circuit components are shown in FIG. Figure 5 In addition, it should be understood by those skilled in the art that the functions of certain components may be combined or omitted, and the functions not shown in the figure may be combined or omitted. Figures 1 to 4 Additional components or fewer components than those shown in FIG. 1 may be included in, for example, headset 100 .

[0032] The power supply 502 can provide power to the components of the electronic device 500. In some aspects, the power supply 502 can be connected to an electrical grid, such as, for example, a wall outlet. In some aspects, the power supply 502 can include one or more batteries for powering the headset or other types of electronic devices associated with the headset. For another example, the power supply 502 can be configured to generate electricity from a natural source (e.g., solar energy using a solar cell).

[0033] The storage device 504 may include, for example, a hard drive, a flash memory, a cache, a ROM, and / or a RAM. In addition, the storage device 504 may be local and / or remote from the electronic device 500. For example, the storage device 504 may include an integrated storage medium, a removable storage medium, a storage space on a remote server, a wireless storage medium, or any combination thereof. In addition, the storage device 504 may store data, such as, for example, system data, user profile data, and any other relevant data.

[0034] The signal processor 506 may be, for example, a digital signal processor for real-time processing of a digital signal that is converted from an analog signal by, for example, the input / output circuit 514. After the processing of the digital signal has been completed, the digital signal may then be converted back to an analog signal. For example, the signal processor 506 may be used to analyze a digitized audio signal received from an ambient or error microphone to determine how much of the audio signal is ambient noise or earmuff noise and how much of the audio signal is, for example, a music signal.

[0035] Memory 508 may include any form of temporary storage such as RAM, buffer, and / or cache. Memory 508 may also be used to store data used to operate electronic device applications (eg, operating system instructions).

[0036] In addition to the signal processor 506, the electronic device 500 may further include a general purpose processor 510. The processor 510 is capable of interpreting system instructions and processing data. For example, the processor 510 is capable of executing instructions or programs, such as system applications, firmware applications, and / or any other applications. In addition, the processor 510 has the ability to execute instructions to communicate with any or all components of the electronic device 500. For example, the processor 510 may execute instructions stored in the memory 508 to enable or disable ANC, or execute instructions to open or close a passive control assembly valve.

[0037] The communication circuit 512 may be any suitable communication circuit that operates to initiate a communication request, connect to a communication network, and / or transmit communication data to one or more servers or devices within the communication network. For example, the communication circuit 512 may support Wi-Fi (e.g., 802.11 protocol), One or more of high frequency systems, infrared, GSM, GSM plus EDGE, CDMA, or any other communication protocols, and / or any combination thereof.

[0038] Input / output circuit 514 can convert (and, if necessary, encode / decode) analog signals and other signals (e.g., physical contact input, physical movement, analog audio signals, etc.) into digital data. Input / output circuit 514 can also convert digital data into any other type of signal. Digital data can be provided to processor 510, storage device 504, memory 508, signal processor 506, or any other component of electronic device 500, and can be received from the above components. Input / output circuit 514 can be used to interact with any suitable input or output device. In addition, electronic device 500 may include a dedicated input circuit associated with an input device, such as, for example, one or more proximity sensors, accelerometers, etc. Electronic device 500 may also include a dedicated output circuit associated with an output device, such as, for example, one or more speakers, headphones, etc.

[0039] Finally, bus 516 may provide a data transmission path for transmitting data to, from, or between processor 510, storage device 504, memory 508, communication circuit 512, and any other components included in electronic device 500. Although bus 516 may be used in a variety of applications, such as in the example of FIG. Figure 5 Although shown as a single component, those skilled in the art will appreciate that the electronic device 500 may include one or more components.

[0040] Although certain aspects have been described and illustrated in the accompanying drawings, it is to be understood that such aspects are merely illustrative of the broad disclosure and not limiting, and that the disclosure is not limited to the specific constructions and arrangements shown and described, as various other modifications may occur to one of ordinary skill in the art. Accordingly, the description is to be regarded as illustrative and not limiting. Furthermore, to assist the Patent Office and any reader of any patent issued by this application in interpreting the appended claims, applicants wish to point out that they do not intend any appended claim or claim element to invoke 35 U.S.C. 112(f) unless the phrase "means for" or "step for" is expressly used in a particular claim.

Claims

1. A headset, comprising: Two headphone ear cups, each headphone ear cup includes: a rigid frame having an outer wall and an inner wall defining a driver front volume chamber around a driver mounted on the rigid frame; and A zeolite-containing adsorbent member is positioned within the frame between the outer wall and the inner wall and acoustically coupled to the driver pre-volume chamber through an opening in the inner wall to cause acoustic enlargement of the driver pre-volume chamber.

2. The headphone of claim 1 further comprising an ear cup cushion coupled to the frame and surrounding the driver front volume chamber.

3. The headphone of claim 2, wherein the sorbent member is a first sorbent member and a second sorbent member is positioned within the ear cup cushion.

4. The headphone of claim 3, wherein the ear cup cushion defines an opening coupling the second sorbent member to the driver pre-volume chamber.

5. The headphone of claim 1 , further comprising an ear cup cushion coupled to the frame and surrounding the driver front volume chamber, and wherein the ear cup cushion comprises foam, and the sorbent member is a first sorbent member, and a second sorbent member is integrated into the foam.

6. The headset of claim 1, wherein the sorbent member comprises a sorbent material within a housing, and the housing comprises an interlocking member for coupling the housing to the inner wall.

7. The headset of claim 1, wherein the sorbent member comprises a sorbent material enclosed within a housing, the housing coupled to the frame.

8. The headphone of claim 7, wherein the housing comprises a plurality of acoustically impermeable sidewalls and at least one acoustically permeable sidewall to acoustically couple the sorbent material to the driver pre-volume chamber.

9. The headphone of claim 7, wherein the housing comprises an acoustically transparent mesh.

10. A headphone earmuff, the headphone earmuff comprising: a frame defining an acoustic cavity acoustically coupled to a sound output side of the driver; an earmuff cushion comprising a foam material coupled to the frame and sized to surround the acoustic cavity; and An acoustic sorbent module includes a plurality of side walls encapsulating a zeolite material and at least one opening acoustically coupling the encapsulated zeolite material to the acoustic cavity.

11. The headphone earmuff of claim 10, wherein the plurality of side walls separate the zeolite material from the foam material.

12. The headphone earmuff of claim 11, wherein the plurality of side walls comprises an acoustically transparent mesh material encapsulating the zeolite material.

13. The headphone earmuff of claim 11, wherein the plurality of side walls are formed in part from an acoustically transparent fabric.

14. The headphone earmuff of claim 13, wherein the acoustically transparent fabric comprises the zeolite material encapsulated therein.

15. The headphone earmuff of claim 11, wherein at least one sidewall of the plurality of sidewalls is a plastic sidewall defining the opening to the zeolite material.

16. The headphone earmuff of claim 10, wherein the acoustic sorbent module is positioned within the earmuff cushion.

17. The headphone earmuff of claim 10, wherein the acoustic sorbent module is integrated into the frame.

18. The headphone earmuff of claim 10, wherein the acoustic sorbent module is formed separately from the frame and the earmuff cushion.

19. The headphone earmuff of claim 10, wherein the zeolite material causes simulated acoustic enlargement of the acoustic cavity and suppresses standing waves within the acoustic cavity.

Images