LED display module and die bonding method for LED display module

Abstract

The present invention provides an LED display module and a die bonding method for the same. The LED display module comprises a PCB (printed circuit board) and multiple chip groups, each of which is sequentially arranged on the PCB in a predetermined order. Each chip group comprises a first chip and a second chip, each of which is of different grades. Within each chip group, the first chip is arranged first and the second chip is arranged second in the predetermined order. The technical solution of this application effectively solves the problem of uneven brightness during LED display in the related art.

Description

Technical Field

[0001] The present invention relates to the technical field of LED displays, and in particular to an LED display module and a die bonding method for the LED display module. Background Art

[0002] LEDs possess self-luminous display properties, offering advantages such as full solid-state, long lifespan, high brightness, low power consumption, compact size, ultra-high resolution, and suitability for use in extreme environments such as high temperatures and radiation. Compared to self-luminous OLED technology, LEDs offer not only higher efficiency and longer lifespan, but also relatively stable materials that are less susceptible to environmental influences and avoid image sticking. Because LED-based LCDs surpass traditional LCD and OLED display technologies in various metrics, including brightness, contrast, lifespan, viewing angle, and resolution, many manufacturers are actively developing them as the next generation of display technology.

[0003] Compared with conventional backlights, LED light panels are equipped with a large number of small LED chips. Currently, LED light panels use more blue light chips with a wavelength range of 400-480nm. The chip manufacturer produces 1,000-100,000 chips in a batch, and their wavelength accuracy is controlled within 10nm (such as 6 groups of chips with wavelengths of 450-451.5nm, 451.5-453nm, 453-454.5nm, 454.5-456nm, 456-457.5nm, 457.5-459nm, etc. (2), with an accuracy value of 1.5nm). The chip packaging factory screens and ships multiple groups of chips with different wavelength ranges. Because the wavelength of a single LED chip is fixed, the wavelength of light emitted from the entire LED light panel has a certain range.

[0004] The process of bonding the chips on the PCB of the LED light board is to fix the chips one by one in sequence on the PCB board. This causes the chips with the same wavelength value to be concentrated in the same area. As a result, when the LED light board is lit, stripes and uneven brightness will appear, affecting the display effect. Summary of the Invention

[0005] The main purpose of the present invention is to provide an LED display module and a die bonding method for the LED display module, so as to solve the problem of uneven brightness when the LED light board displays in the related art.

[0006] To achieve the above-mentioned object, according to one aspect of the present invention, there is provided an LED display module, comprising: a PCB board; a plurality of chip groups, each chip group being arranged continuously on the PCB board in a predetermined order; wherein each chip group comprises a first chip and a second chip, the first chip and the second chip being of different grades, and in the direction of the predetermined order, the chips within each chip group are arranged in the order of the first chip first and the second chip later.

[0007] Furthermore, the predetermined sequence includes folding back left and right from a top corner of the PCB board or folding back up and down from a top corner of the PCB board.

[0008] Furthermore, each chip group also includes a third chip and a fourth chip, the third chip is from a different batch than the first chip, and the third chip is of the same grade as the first chip, the fourth chip is from a different batch than the second chip, and the fourth chip is of the same grade as the second chip; the order of arrangement in each chip group is first the first chip, then the third chip, then the second chip, and finally the fourth chip.

[0009] According to another aspect of the present invention, a method for bonding a LED display module is provided. The LED display module is obtained by using the method for bonding a LED display module. The method for bonding a LED display module comprises the following steps: selecting a first chip film and a second chip film, wherein the first chip film is provided with a plurality of first chips of the same grade, and the second chip film is provided with a plurality of second chips of the same grade, and the first chip and the second chip are of different grades; arranging the first chip and the second chip on a PCB board in the order of first selecting the first chip on the first chip film and then selecting the second chip on the second chip film; and repeating the first chip and second chip arrangement process to continuously arrange the plurality of first chips and the plurality of second chips on the PCB board in a predetermined order.

[0010] Furthermore, the order of first selecting the first chip on the first chip film and then selecting the second chip on the second chip film further includes: first selecting the first chip on the first chip film in the order of folding left and right from a top corner of the first chip film or folding up and down from a top corner of the first chip film, and then selecting the second chip on the second chip film in the order of folding left and right from a top corner of the second chip film or folding up and down from a top corner of the second chip film.

[0011] Furthermore, the predetermined sequence includes folding back left and right from a top corner of the PCB board or folding back up and down from a top corner of the PCB board.

[0012] Furthermore, in the step of selecting the first wafer film and the second wafer film, the batch of the first wafer is the same as the batch of the second wafer, and the grade of the first wafer is adjacent to the grade of the second wafer.

[0013] Furthermore, the grades include brightness grades or wavelength grades, and different brightness grades are in a geometric progression, and different wavelength grades are in an arithmetic progression.

[0014] Furthermore, the die bonding method for the LED display module also includes the following steps: after the step of selecting the first chip film and the second chip film, it also includes: further selecting a third chip film and a fourth chip film, a plurality of third chips of the same grade are arranged on the third chip film, and a plurality of fourth chips of the same grade are arranged on the fourth chip film, wherein the third chip film and the first chip film are from different batches, and the third chip and the first chip are of the same grade, and the fourth chip and the second chip are from different batches, and the fourth chip and the second chip are of the same grade; according to the order of first selecting the first chip on the first chip film and then selecting the second chip on the second chip film, it further includes: according to the order of first selecting the first chip on the first chip film, then selecting the third chip on the third chip film, then selecting the second chip on the second chip film, and finally selecting the fourth chip on the fourth chip film; repeating the first chip, second chip, third chip and fourth chip arrangement process to continuously arrange multiple first chips, multiple second chips, multiple third chips and multiple fourth chips on the PCB board in a predetermined order.

[0015] Furthermore, in the steps of first selecting the first chip on the first chip film, then selecting the third chip on the third chip film, then selecting the second chip on the second chip film, and finally selecting the fourth chip on the fourth chip film, the batch of the third chip is adjacent to the batch of the fourth chip.

[0016] Applying the technical solution of the present invention, the LED display module includes: a PCB board and a plurality of chip groups. Each chip group is arranged continuously on the PCB board in a predetermined order. Each chip group includes a first chip and a second chip, and the first chip and the second chip are of different grades. In the direction of the predetermined order, each chip group is arranged in the order of the first chip first and the second chip later. In this way, the first chip and the second chip of different grades are mixed together, so that the LED display module can reduce the brightness difference to a minimum, reduce the possibility of stripes, make the brightness more uniform, and improve the display effect. Therefore, the technical solution of the present application can solve the problem of uneven brightness when the LED light board displays in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 A simplified structural diagram of a first chip film according to a first embodiment of the LED display module of the present invention is shown;

[0019] Figure 2 Shown Figure 1 A simplified structural diagram of the second chip film of the LED display module;

[0020] Figure 3 Shown Figure 1 The structural diagram of the LED display module;

[0021] Figure 4 A simplified structural diagram of a second embodiment of an LED display module according to the present invention is shown;

[0022] Figure 5 A simplified structural diagram of the first wafer film of the third embodiment of the LED display module according to the present invention is shown;

[0023] Figure 6 A simplified structural diagram of the third chip film of the fourth embodiment of the LED display module according to the present invention is shown;

[0024] Figure 7 Shown Figure 6 A simplified structural diagram of the fourth chip film of the LED display module;

[0025] Figure 8 Shown Figure 6 The structural diagram of the LED display module;

[0026] Figure 9 A simplified structural diagram of a fifth embodiment of the LED display module according to the present invention is shown.

[0027] The above drawings include the following reference numerals:

[0028] 1. PCB board; 2. Chipset; 3. Pixel area; 10. First chip film; 11. First chip; 20. Second chip film; 21. Second chip; 30. Third chip film; 31. Third chip; 40. Fourth chip film; 41. Fourth chip. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0031] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0032] like Figures 1 to 3 As shown, the LED display module of the first embodiment includes: a PCB board 1 and multiple chipsets 2. Each chipset 2 is arranged sequentially on the PCB board 1 in a predetermined order. Each chipset 2 includes a first chip 11 and a second chip 21. The first chip 11 and the second chip 21 are of different grades. In the direction of the predetermined sequence, each chipset 2 is arranged in the order of first chip 11 and then second chip 21.

[0033] Applying the technical solution of embodiment one, the LED display module includes: a PCB board 1 and a plurality of chip groups 2. Each chip group 2 is arranged continuously on the PCB board 1 in a predetermined order. Each chip group 2 includes a first chip 11 and a second chip 21, and the first chip 11 and the second chip 21 are of different grades. In the direction of the predetermined order, each chip group 2 is arranged in the order of the first chip 11 first and the second chip 21 later. In this way, the first chips 11 and the second chips 21 of different grades are mixed together, so that the LED display module can reduce the brightness difference to a minimum, reduce the possibility of stripes, make the brightness more uniform, and improve the display effect. Therefore, the technical solution of embodiment one can solve the problem of uneven brightness when the LED light board displays in the related art.

[0034] It should be noted that different grades refer to different brightness or wavelengths. The first chip 11 and the second chip 21 are both chips of the same color, such as red chips, green chips, or blue chips. Figure 2 In the figure, a dotted box represents a pixel area 3, and the chip group 2 includes a first chip 11 in the first pixel area 3 and a second chip 21 in the second pixel area 3. Each chip group 2 is continuously arranged on the pad of the PCB board 1 in a predetermined order.

[0035] like Figure 1 and Figure 2 As shown, the sequence of first selecting the first chip 11 on the first chip film 10 and then selecting the second chip 21 on the second chip film 20 further includes: first selecting the first chip 11 on the first chip film 10 by folding back left and right from a vertex corner of the first chip film 10, and then selecting the second chip 21 on the second chip film 20 by folding back left and right from a vertex corner of the second chip film 20. A vertex corner of the first chip film 10 or a vertex corner of the second chip film 20 is either the upper left vertex corner. In an embodiment not shown in the figure, a vertex corner of the first chip film or a vertex corner of the second chip film can also be the lower left vertex corner. A vertex corner of the first chip film or a vertex corner of the second chip film can also be the upper right vertex corner. In this case, the predetermined sequence includes folding back right and left from a vertex corner of the first chip film or a vertex corner of the second chip film. A vertex corner of the first chip film or a vertex corner of the second chip film can also be the lower right vertex corner. In this case, the predetermined sequence includes folding back right and left from a vertex corner of the PCB board.

[0036] like Figure 3 As shown, in order to smoothly arrange each chip group 2 on the PCB board 1 in a predetermined order, the predetermined order includes folding back left and right from a top corner of the PCB board 1. One top corner of the PCB board 1 is the upper left corner. In an embodiment not shown in the figure, one top corner of the PCB board can also be the lower left corner. One top corner of the PCB board can also be the upper right corner. In this case, the predetermined order includes folding back right and left from a top corner of the PCB board. One top corner of the PCB board can also be the lower right corner. In this case, the predetermined order includes folding back right and left from a top corner of the PCB board.

[0037] In the second embodiment of the LED display module of the present application, the difference from the first embodiment of the LED display module is the above-mentioned predetermined order. Figure 4As shown, the predetermined sequence includes folding back up and down from a top corner of the PCB board 1. The top corner of the PCB board 1 is the upper left corner. In an embodiment not shown in the figure, the top corner of the PCB board can also be the upper right corner. The top corner of the PCB board can also be the lower left corner. In this case, the predetermined sequence includes folding back up and down from the top corner of the PCB board. The top corner of the PCB board can also be the lower right corner. In this case, the predetermined sequence includes folding back up and down from the top corner of the PCB board.

[0038] In the second embodiment, the chip set 2 includes a first chip 11 in a first pixel region 3 and a second chip 21 in a second pixel region 3 located above and below it.

[0039] In the third embodiment of the LED display module of the present application, the difference from the first embodiment of the LED display module is that the first chip is selected on the first chip film first and the second chip is selected on the second chip film. Figure 5 As shown, in Example 3, the first chip 11 is selected on the first chip film 10 by first folding up and down at a vertex corner of the first chip film 10, and then the second chip 21 is selected on the second chip film 20 by folding up and down at a vertex corner of the second chip film 20. A vertex corner of the first chip film 10 or a vertex corner of the second chip film 20 is either the upper left vertex corner. In an embodiment not shown in the figure, a vertex corner of the first chip film or a vertex corner of the second chip film can also be the upper right vertex corner. A vertex corner of the first chip film or a vertex corner of the second chip film can also be the lower left vertex corner. In this case, the predetermined sequence includes folding up and down at a vertex corner of the first chip film or a vertex corner of the second chip film. A vertex corner of the first chip film or a vertex corner of the second chip film can also be the lower right vertex corner. In this case, the predetermined sequence includes folding up and down at a vertex corner of the first chip film or a vertex corner of the second chip film.

[0040] In the fourth embodiment of the LED display module of the present application, the difference from the first embodiment of the LED display module is the number of each chip group. In the fourth embodiment, Figures 6 to 8As shown, each chip set 2 also includes a third chip 31 and a fourth chip 41. The third chip 31 is from a different batch than the first chip 11 and is of the same grade as the first chip 11. The fourth chip 41 is from a different batch than the second chip 21 and is of the same grade as the second chip 21. Within each chip set 2, the first chip 11 is arranged first, followed by the third chip 31, then the second chip 21, and finally the fourth chip 41. In this way, the third chip 31, which is from a different batch than the first chip 11 and is of the same grade as the first chip 11, and the fourth chip 41, which is from a different batch than the second chip 21 and is of the same grade as the second chip 21, are mixed together. This minimizes brightness differences in the LED display module, reduces the likelihood of streaks, and achieves more uniform brightness, improving the display quality. Therefore, the technical solution of Example 1 can solve the problem of uneven brightness and darkening during LED light panel display in the related art. Furthermore, with current correction methods, the LED display module can be corrected and adjusted to a uniform level, thereby achieving near-perfect brightness.

[0041] In the fourth embodiment, Figure 8 As shown, the chip group 2 includes a first chip 11 in the first pixel area 3, a third chip 31 in the second pixel area 3 in sequence from left to right, a second chip 21 in the second pixel area 3 in sequence from left to right, and a fourth chip 41 in the fourth pixel area 3 in sequence from left to right.

[0042] In the fifth embodiment of the LED display module of the present application, the difference from the fourth embodiment of the LED display module is the position of the first chip 11, the second chip 21, the third chip 31 and the fourth chip 41 on the PCB board. In the fifth embodiment, as shown in FIG. Figure 9 As shown, the chip group 2 on the PCB board 1 includes a first chip 11 in the first pixel area 3, a third chip 31 in the second pixel area 3 in sequence from top to bottom, a second chip 21 in the second pixel area 3 in sequence from top to bottom, and a fourth chip 41 in the fourth pixel area 3 in sequence from top to bottom.

[0043] In the embodiment 1 of the die bonding method of the LED display module of the present application, the above-mentioned LED display module is obtained by using the die bonding method of the LED display module, such as Figures 1 to 2As shown, the die bonding method for an LED display module includes the following steps: selecting a first wafer film 10 and a second wafer film 20, wherein the first wafer film 10 is provided with a plurality of first wafers 11 of the same grade, and the second wafer film 20 is provided with a plurality of second wafers 21 of the same grade, wherein the first wafers 11 and the second wafers 21 are of different grades; arranging the first wafers 11 and the second wafers 21 on a PCB board 1 in the order of first selecting the first wafer 11 on the first wafer film 10 and then selecting the second wafer 21 on the second wafer film 20; and repeating the arrangement process of the first wafers 11 and the second wafers 21 to continuously arrange the plurality of first wafers 11 and the plurality of second wafers 21 on the PCB board 1 in a predetermined order. In this way, the first wafers 11 and the second wafers 21 of different grades are mixed together, so that the LED display module can minimize the brightness difference, reduce the possibility of streaks, make the brightness more uniform, and improve the display effect. Therefore, the technical solution of Example 1 can solve the problem of uneven brightness when displaying LED light panels in the related art.

[0044] It should be noted that repeating the process of arranging the first wafer 11 and the second wafer 21 refers to repeatedly arranging the first wafer 11 and the second wafer 21 on the PCB board 1 in the order of first selecting the first wafer 11 on the first wafer film 10 and then selecting the second wafer 21 on the second wafer film 20. Multiple first wafers 11 and multiple second wafers 21 are continuously arranged on the pads of the PCB board 1 in a predetermined order.

[0045] like Figure 1 and Figure 2 As shown, in order to smoothly arrange each chip group 2 on the PCB board 1 in a predetermined order, the order of first selecting the first chip 11 on the first chip film 10 and then selecting the second chip 21 on the second chip film 20 further includes: first selecting the first chip 11 on the first chip film 10 in an order of folding left and right from a vertex corner of the first chip film 10 or folding up and down from a vertex corner of the first chip film 10, and then selecting the second chip 21 on the second chip film 20 in an order of folding left and right from a vertex corner of the second chip film 20 or folding up and down from a vertex corner of the second chip film 20.

[0046] like Figure 3As shown, in order to smoothly arrange each chip group 2 on the PCB board 1 in a predetermined order, the predetermined order includes folding back left and right from a top corner of the PCB board 1. One top corner of the PCB board 1 is the upper left corner. In an embodiment not shown in the figure, one top corner of the PCB board can also be the lower left corner. One top corner of the PCB board can also be the upper right corner. In this case, the predetermined order includes folding back right and left from a top corner of the PCB board. One top corner of the PCB board can also be the lower right corner. In this case, the predetermined order includes folding back right and left from a top corner of the PCB board.

[0047] like Figure 1 and Figure 2 As shown, in the step of selecting the first wafer film 10 and the second wafer film 20, the batch of the first wafer 11 and the batch of the second wafer 21 are the same, and the grade of the first wafer 11 and the grade of the second wafer 21 are adjacent. In this way, the first wafer 11 and the second wafer 21 of adjacent grades are mixed together, so that the brightness difference of the LED display module can be further minimized. For example, the brightness grades of the first wafer 11 are adjacent within the range of 1:1.2, and the brightness grades of the second wafer 21 are within the range of 1:1.3.

[0048] It should be noted that the step of selecting the first chip film 10 and the second chip film 20 refers to the step of selecting the first chip film 10 and the second chip film 20, wherein the first chip film 10 is provided with a plurality of first chips 11 of the same grade, the second chip film 20 is provided with a plurality of second chips 21 of the same grade, and the grades of the first chip 11 and the second chip 21 are different.

[0049] like Figure 1 and Figure 2 As shown, the levels include brightness levels or wavelength levels. Different brightness levels are in a geometric progression, and different wavelength levels are in an arithmetic progression. For example, the brightness levels in a geometric progression can be 1:1.1, 1:1.2, and 1:1.3. For example, the wavelength levels in an arithmetic progression can be 450-451.5nm, 451.5-453nm, 453-454.5nm, 454.5-456nm, 456-457.5nm, and 457.5-459nm.

[0050] exist Figure 3In the figure, a dotted box represents a pixel area 3. The arrangement process of the first chip 11 and the second chip 21 is repeated to continuously arrange multiple first chips 11 and multiple second chips 21 on the PCB board 1 in a predetermined order. Specifically, the first chip 11 is arranged at the red light position of the first pixel area 3 starting from the upper left corner of the PCB board 1, and then the second chip 21 is arranged at the red light position of the second pixel area 3 in the order of the left and right return arrows, and the first chip 11 is continued to be arranged at the red light position of the third pixel area 3 in the order of the left and right return arrows, and the second chip 21 is continued to be arranged at the red light position of the third pixel area 3 in the order of the left and right return arrows, and the process is repeated until all red light positions of the entire PCB board are covered. Similarly, the green first chip 11 and the second chip 21 are used to cover all green light positions of the entire PCB board, and similarly, the blue first chip 11 and the second chip 21 are used to cover all blue light positions of the entire PCB board.

[0051] In the second embodiment of the die bonding method for the LED display module of the present application, the difference from the first embodiment of the die bonding method for the LED display module is the above-mentioned predetermined sequence. In the second embodiment, as Figure 4 As shown, the predetermined sequence includes folding back up and down from a top corner of the PCB board 1. The top corner of the PCB board 1 is the upper left corner. In an embodiment not shown in the figure, the top corner of the PCB board can also be the upper right corner. The top corner of the PCB board can also be the lower left corner. In this case, the predetermined sequence includes folding back up and down from the top corner of the PCB board. The top corner of the PCB board can also be the lower right corner. In this case, the predetermined sequence includes folding back up and down from the top corner of the PCB board.

[0052] In the third embodiment of the die bonding method for the LED display module of the present application, the difference from the first embodiment of the die bonding method for the LED display module is that the first die is selected on the first die film first and the second die is selected on the second die film second. Figure 5As shown, in Example 3, the first chip 11 is selected on the first chip film 10 by first folding up and down at a vertex corner of the first chip film 10, and then the second chip 21 is selected on the second chip film 20 by folding up and down at a vertex corner of the second chip film 20. A vertex corner of the first chip film 10 or a vertex corner of the second chip film 20 is either the upper left vertex corner. In an embodiment not shown in the figure, a vertex corner of the first chip film or a vertex corner of the second chip film can also be the upper right vertex corner. A vertex corner of the first chip film or a vertex corner of the second chip film can also be the lower left vertex corner. In this case, the predetermined sequence includes folding up and down at a vertex corner of the first chip film or a vertex corner of the second chip film. A vertex corner of the first chip film or a vertex corner of the second chip film can also be the lower right vertex corner. In this case, the predetermined sequence includes folding up and down at a vertex corner of the first chip film or a vertex corner of the second chip film.

[0053] In the fourth embodiment of the method for bonding a crystal of an LED display module of the present application, the difference from the first embodiment of the method for bonding a crystal of an LED display module is that the order of selecting the first crystal on the first crystal film first and then selecting the second crystal on the second crystal film is followed. In the fourth embodiment, the LED bonding method further includes the following steps: after the step of selecting the first crystal film 10 and the second crystal film 20, it also includes: further selecting a third crystal film 30 and a fourth crystal film 40, a plurality of third crystals 31 of the same grade are provided on the third crystal film 30, and a plurality of fourth crystals 41 of the same grade are provided on the fourth crystal film 40, wherein the third crystal film 30 is from a different batch than the first crystal film 10, and the third crystal 31 is of the same grade as the first crystal 11, the fourth crystal 41 is from a different batch than the second crystal 21, and the fourth crystal 41 is of the same grade as the second crystal 21; according to the first step of bonding a crystal on the first crystal film 10 The order of selecting the first chip 11 on the first chip film 10 and then selecting the second chip 21 on the second chip film 20 further includes: first selecting the first chip 11 on the first chip film 10, then selecting the third chip 31 on the third chip film 30, then selecting the second chip 21 on the second chip film 20, and finally selecting the fourth chip 41 on the fourth chip film 40; repeating the arrangement process of the first chip 11, the second chip 21, the third chip 31, and the fourth chip 41, so as to continuously arrange the plurality of first chips 11, the plurality of second chips 21, the plurality of third chips 31, and the plurality of fourth chips 41 on the PCB board 1 in a predetermined order. Specifically, the plurality of first chips 11, the plurality of second chips 21, the plurality of third chips 31, and the plurality of fourth chips 41 are continuously arranged on the pads of the PCB board 1 in a predetermined order.

[0054] exist Figure 8In the figure, a dotted box represents a pixel area 3, and the arrangement process of the first chip 11, the second chip 21, the third chip 31 and the fourth chip 41 is repeated to arrange multiple first chips 11, multiple second chips 21, multiple third chips 31 and multiple fourth chips 41 in a predetermined order on the PCB board 1. Specifically, the first chip 11 is arranged at the red light position of the first pixel area 3 starting from the upper left corner of the PCB board 1, and the third chip 31 is arranged at the red light position of the second pixel area 3 in the order of the left and right return arrows, and the second chip 21 is arranged at the red light position of the second pixel area 3 in the order of the left and right return arrows, and the fourth chip 41 is arranged at the red light position of the fourth pixel area 3 in the order of the left and right return arrows, and repeated until all red light positions of the entire PCB board are covered. Similarly, the green first chip 11, the second chip 21, the third chip film 30 and the fourth chip film 40 are used to cover all the green light positions of the entire PCB board, and similarly, the blue first chip 11, the second chip 21, the third chip film 30 and the fourth chip film 40 are used to cover all the blue light positions of the entire PCB board.

[0055] It should be noted that different grades refer to different brightness or wavelengths. The first chip 11, the second chip 21, the third chip 31, and the fourth chip 41 are all chips of the same color, such as red chips, green chips, or blue chips. Different batches refer to different production dates.

[0056] like Figures 6 to 8 As shown, in the steps of first selecting the first wafer 11 on the first wafer film 10, then selecting the third wafer 31 on the third wafer film 30, then selecting the second wafer 21 on the second wafer film 20, and finally selecting the fourth wafer 41 on the fourth wafer film 40, the batch of the third wafer 31 is adjacent to the batch of the fourth wafer 41. In this way, the first wafer 11, second wafer 21, third wafer 31, and fourth wafer 41 of adjacent grades are mixed together, so that the brightness difference of the LED display module can be further minimized. For example, the batch of the third wafer 31 is 2021.10.1, and the batch of the fourth wafer 41 is 2021.10.2.

[0057] In the fifth embodiment of the die bonding method of the LED display module of the present application, the difference from the fourth embodiment of the LED display module is the arrangement order of the first chip 11, the second chip 21, the third chip 31 and the fourth chip 41 on the PCB board. In the fifth embodiment, as shown in FIG. Figure 9 As shown, the chip group 2 on the PCB board 1 includes a first chip 11 in the first pixel area 3, a third chip 31 in the second pixel area 3 in sequence from top to bottom, a second chip 21 in the second pixel area 3 in sequence from top to bottom, and a fourth chip 41 in the fourth pixel area 3 in sequence from top to bottom.

[0058] Of course, in an embodiment not shown in the figure, the position of each first chip on the first chip film is coordinated, and the position of each second chip on the second chip film is coordinated, and the first chip and the second chip are picked up in a non-interference manner and arranged on the solder pads of the PCB board.

[0059] In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0060] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0061] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0062] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. An LED display module, characterized in that: include: PCB board (1); A plurality of chip groups (2), each of the chip groups (2) being arranged continuously on the PCB board (1) in a predetermined order; Each chip group (2) comprises a first chip (11) and a second chip (21), the first chip (11) and the second chip (21) are of different grades, and in the direction of the predetermined sequence, each chip group (2) is arranged in the order of the first chip (11) first and the second chip (21) second; Each chip group (2) further comprises a third chip (31) and a fourth chip (41), wherein the third chip (31) and the first chip (11) are from different batches and are of the same grade as the first chip (11), and the fourth chip (41) and the second chip (21) are from different batches and are of the same grade as the second chip (21); and the first chip (11) and the third chip (31) are arranged in the order of first, then, then, then, then, then, then, and finally, the fourth chip (41).

2. The LED display module according to claim 1, characterized in that: The predetermined sequence includes folding back left and right from a top corner of the PCB board (1) or folding back up and down from a top corner of the PCB board (1).

3. A die bonding method for an LED display module, characterized in that: The LED display module according to any one of claims 1 to 2 is obtained by using a die-bonding method for an LED display module, wherein the die-bonding method for the LED display module comprises the following steps: A first chip film (10) and a second chip film (20) are selected, wherein a plurality of first chips (11) of the same grade are arranged on the first chip film (10), and a plurality of second chips (21) of the same grade are arranged on the second chip film (20), and the grades of the first chips (11) and the second chips (21) are different; Arranging the first chip (11) and the second chip (21) on the PCB board (1) in the order of first selecting the first chip (11) on the first chip film (10) and then selecting the second chip (21) on the second chip film (20); The process of arranging the first chip (11) and the second chip (21) is repeated to continuously arrange a plurality of the first chips (11) and a plurality of the second chips (21) on the PCB board (1) in a predetermined order.

4. The die bonding method for an LED display module according to claim 3, wherein: The order of first selecting the first chip (11) on the first chip film (10) and then selecting the second chip (21) on the second chip film (20) further includes: first selecting the first chip (11) on the first chip film (10) in the order of folding left and right from a top corner of the first chip film (10) or folding up and down from a top corner of the first chip film (10), and then selecting the second chip (21) on the second chip film (20) in the order of folding left and right from a top corner of the second chip film (20) or folding up and down from a top corner of the second chip film (20).

5. The die bonding method for an LED display module according to claim 3, wherein: The predetermined sequence includes folding back left and right from a top corner of the PCB board (1) or folding back up and down from a top corner of the PCB board (1).

6. The die bonding method for an LED display module according to claim 3, wherein: In the step of selecting the first chip film (10) and the second chip film (20), the batch of the first chip (11) and the batch of the second chip (21) are the same, and the grade of the first chip (11) and the grade of the second chip (21) are adjacent.

7. The die bonding method for an LED display module according to claim 3, wherein: The grades include brightness grades or wavelength grades, and different brightness grades are in a geometric progression, and different wavelength grades are in an arithmetic progression.

8. The die bonding method for an LED display module according to claim 3, wherein: The die bonding method for the LED display module further comprises the following steps: After the step of selecting the first chip film (10) and the second chip film (20), the method further includes: selecting a third chip film (30) and a fourth chip film (40), wherein a plurality of third chips (31) of the same grade are provided on the third chip film (30), and a plurality of fourth chips (41) of the same grade are provided on the fourth chip film (40), wherein the third chip film (30) and the first chip film (10) are from different batches, and the third chips (31) and the first chip (11) are of the same grade, and the fourth chip (41) and the second chip (21) are from different batches, and the fourth chip (41) and the second chip (21) are of the same grade; The sequence of first selecting the first chip (11) on the first chip film (10) and then selecting the second chip (21) on the second chip film (20) further includes: first selecting the first chip (11) on the first chip film (10), then selecting the third chip (31) on the third chip film (30), then selecting the second chip (21) on the second chip film (20), and finally selecting the fourth chip (41) on the fourth chip film (40); The arrangement process of the first chip (11), the second chip (21), the third chip (31) and the fourth chip (41) is repeated to continuously arrange a plurality of the first chips (11), a plurality of the second chips (21), a plurality of the third chips (31) and a plurality of the fourth chips (41) on the PCB board (1) in the predetermined order.

9. The die bonding method for an LED display module according to claim 8, wherein: In the steps of first selecting the first chip (11) on the first chip film (10), then selecting the third chip (31) on the third chip film (30), then selecting the second chip (21) on the second chip film (20), and finally selecting the fourth chip (41) on the fourth chip film (40), the batch of the third chip (31) is adjacent to the batch of the fourth chip (41).

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