Layout Determination Method, Device, Electronic Device, and Storage Medium

Abstract

The present disclosure provides a layout determination method, apparatus, electronic device, and storage medium, which relate to the technical field of data processing, and particularly to the field of big data. The specific implementation solution is as follows: repeatedly perform the following operations until a predetermined termination condition is met: determine a first evaluation value for each of the multiple base materials used in the initial layout plan to obtain multiple first evaluation values; select at least two base materials from the multiple base materials used in the initial layout plan according to the multiple first evaluation values to obtain an intermediate layout plan for the at least two base materials; adjust the setting positions of several target products arranged in the at least two base materials in the at least two base materials to obtain an adjusted layout plan for the at least two base materials; and in the case where it is determined that the second evaluation value of the adjusted layout plan is less than the second evaluation value of the intermediate layout plan, update the initial layout plan by using the adjusted layout plan; and determine the updated initial layout plan as the target layout plan.

Description

Technical Field

[0001] The present disclosure relates to the technical field of data processing, and more particularly to the field of big data. More specifically, the present disclosure provides a layout determination method, apparatus, electronic device, storage medium, and computer program product. Background Art

[0002] Substrate cutting is one of the important links in modern industrial production. By cutting the original substrate, manufacturers can obtain substrate parts for further assembly production, such as cabinet panels, wardrobe panels, glass products, etc. In order to pursue higher production effects, such as higher utilization rate, lower number of cutting tools, and cutting rotation direction, etc., it is necessary to design a layout plan of the target product on the substrate. Summary of the Invention

[0003] The present disclosure provides a layout determination method, apparatus, electronic device, storage medium, and computer program product.

[0004] According to one aspect of the present disclosure, there is provided a layout determination method, including: repeatedly performing the following operations until a predetermined termination condition is met: determining a first evaluation value of each of a plurality of substrates used in an initial layout plan to obtain a plurality of first evaluation values; selecting at least two substrates from the plurality of substrates used in the initial layout plan according to the plurality of first evaluation values to obtain an intermediate layout plan for the at least two substrates; adjusting the setting positions of a plurality of target products set in the at least two substrates in the at least two substrates to obtain an adjusted layout plan for the at least two substrates; and in the case where a second evaluation value of the adjusted layout plan is less than a second evaluation value of the intermediate layout plan, updating the initial layout plan with the adjusted layout plan; and determining the updated initial layout plan as the target layout plan.

[0005] According to another aspect of the present disclosure, there is provided a layout determination device, including: a first determination module, a first evaluation value determination module, an intermediate layout scheme determination module, an adjustment module, an update module, and a target layout scheme determination module. The first determination module is configured to determine whether a predetermined termination condition is satisfied; the first evaluation value determination module is configured to determine a first evaluation value for each of a plurality of base materials used in the initial layout scheme, obtaining a plurality of first evaluation values; the intermediate layout scheme determination module is configured to select at least two base materials from the plurality of base materials used in the initial layout scheme according to the plurality of first evaluation values, obtaining an intermediate layout scheme for the at least two base materials; the adjustment module is configured to adjust the setting positions of a plurality of target products arranged in the at least two base materials in the at least two base materials, obtaining an adjusted layout scheme for the at least two base materials; the update module is configured to, when determining that a second evaluation value of the adjusted layout scheme is less than a second evaluation value of the intermediate layout scheme, update the initial layout scheme with the adjusted layout scheme; and the target layout scheme determination module is configured to determine the updated initial layout scheme as the target layout scheme.

[0006] According to another aspect of the present disclosure, there is provided an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method provided by the present disclosure.

[0007] According to another aspect of the present disclosure, there is provided a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to cause a computer to execute the method provided by the present disclosure.

[0008] According to another aspect of the present disclosure, there is provided a computer program product, including a computer program which, when executed by a processor, implements the method provided by the present disclosure.

[0009] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understandable through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings are used to better understand the solution and do not constitute a limitation to the present disclosure. Among them:

[0011] Figure 1 is a schematic diagram of the system architecture of the layout determination method and device according to an embodiment of the present disclosure;

[0012] Figure 2 is a schematic flowchart of the layout determination method according to an embodiment of the present disclosure;

[0013] Figure 3 is a schematic diagram of a layout determination method according to an embodiment of the present disclosure;

[0014] Figure 4 is a schematic flowchart of determining an adjusted layout plan according to an embodiment of the present disclosure;

[0015] Figure 5A is a schematic flowchart of the stacked plate layout stage and the full plate layout stage in the layout determination method according to another embodiment of the present disclosure;

[0016] Figure 5B is a schematic flowchart of the re-layout stage in the layout determination method according to another embodiment of the present disclosure;

[0017] Figure 6 is a structural block diagram of a layout determination device according to an embodiment of the present disclosure; and

[0018] Figure 7 is a structural block diagram of an electronic device for implementing the layout determination method according to an embodiment of the present disclosure. Detailed implementation manners

[0019] The following makes an explanation of exemplary embodiments of the present disclosure with reference to the accompanying drawings. Various details of the embodiments of the present disclosure are included to help understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0020] Figure 1 is a schematic diagram of the system architecture of the layout determination method and device according to an embodiment of the present disclosure.

[0021] It should be noted that Figure 1 The example shown is only an example of the system architecture to which the embodiments of the present disclosure can be applied to help those skilled in the art understand the technical content of the present disclosure, but it does not mean that the embodiments of the present disclosure cannot be used in other devices, systems, environments or scenarios.

[0022] As Figure 1 shown, the system architecture 100 according to this embodiment may include terminal devices 101, 102, 103, a network 104, and a server 105. The network 104 is used to provide a medium for communication links between the terminal devices 101, 102, 103 and the server 105. The network 104 may include various connection types, such as wired and / or wireless communication links, etc.

[0023] Users can use terminal devices 101, 102, and 103 to interact with server 105 via network 104 to receive or send messages, etc. Terminal devices 101, 102, and 103 can be various electronic devices with a display screen and supporting web browsing, including but not limited to smartphones, tablets, laptop computers, and desktop computers, etc.

[0024] Server 105 can be a server providing various services, such as a background management server (only for example) that supports the websites browsed by users using terminal devices 101, 102, and 103. The background management server can analyze and process data such as received user requests, and feedback the processing results (such as the target layout scheme) to the terminal device.

[0025] It should be noted that the layout determination method provided by the embodiments of the present disclosure can generally be executed by server 105. Correspondingly, the layout determination device provided by the embodiments of the present disclosure can generally be set in server 105. The layout determination method provided by the embodiments of the present disclosure can also be executed by a server or a server cluster different from server 105 and capable of communicating with terminal devices 101, 102, and 103 and / or server 105. Correspondingly, the layout determination device provided by the embodiments of the present disclosure can also be set in a server or a server cluster different from server 105 and capable of communicating with terminal devices 101, 102, and 103 and / or server 105.

[0026] It should be understood that Figure 1 the numbers of the terminal devices, networks, and servers in

[0027] Figure 2 are merely illustrative. According to the implementation requirements, there can be any number of terminal devices, networks, and servers.

[0028] As Figure 2 shown, the layout determination method 200 can include a relayout phase, and the relayout phase can include operations S210 to S260. Those skilled in the art can understand that the sequence numbers of the following steps are only used as representations of the steps for description, and should not be regarded as indicating the execution order of the steps. Unless explicitly stated, the steps of the method do not need to be executed exactly in the order shown, or some steps can be executed simultaneously.

[0029] In operation S210, determine the first evaluation value of each substrate among the multiple substrates used for the initial layout scheme, and obtain a plurality of first evaluation values.

[0030] The substrate may include a plate to be cut, such as a plate of materials like steel plate, wood board, glass, etc. The shape of the substrate may be rectangular. By cutting the substrate, target products of a predetermined size can be obtained. The shape of the target products may be rectangular.

[0031] The layout plan represents the cutting plan of the target products on the substrate. By determining the placement positions of multiple target products on multiple substrates, an initial layout plan can be obtained. The initial layout plan includes using multiple substrates, with each substrate corresponding to a single-board layout plan, that is, the initial layout plan includes multiple single-board layout plans.

[0032] The first evaluation value may represent an index of the substrate, and the index of the substrate may include at least one of utilization rate, number of cutting tools, and number of rotations. The utilization rate represents the ratio of the sum of the product areas on the substrate to the area of the substrate. The number of cutting tools represents the number of cutting times required to cut out the target products on the substrate. The number of rotations represents the number of times the substrate needs to be rotated to cut out the target products on the substrate.

[0033] In operation S220, according to multiple first evaluation values, at least two substrates are selected from the multiple substrates used in the initial layout plan to obtain an intermediate layout plan for the at least two substrates.

[0034] In one example, at least two substrates can be randomly selected from the multiple substrates.

[0035] In one example, the first evaluation values of the multiple substrates can be sorted, and then at least two substrates are selected according to the sorting. For example, the substrate with the lowest first evaluation value is selected, or substrates with relatively low first evaluation values are selected.

[0036] In one example, at least two substrates can be selected from the multiple substrates according to the target requirements. For example, if the target requirement is to improve the utilization rate of the substrate, substrates with the lowest or relatively low utilization rate can be selected. For example, if the target requirement is to reduce the number of rotations of the substrate to improve the cutting efficiency, substrates with a relatively large number of rotations can be selected.

[0037] In one example, the at least two substrates include a first substrate and a second substrate. The first evaluation value of the first substrate is the lowest among the multiple first evaluation values, and the first evaluation value of the second substrate meets a predetermined condition. The predetermined condition includes at least one of the first evaluation value being less than the evaluation value threshold and the first evaluation value ranking lower than a predetermined ranking. A relatively low first evaluation value indicates that the index of the substrate is poor, such as a relatively low utilization rate or a relatively large number of rotations. Compared with substrates with relatively high first evaluation values, substrates with the lowest and relatively low first evaluation values have greater optimization space. Therefore, by selecting substrates with the lowest and relatively low first evaluation values from the multiple substrates, a part of the substrates with relatively poor indexes can be optimized targeted, thereby improving the optimization efficiency.

[0038] For example, if the first evaluation value includes the utilization rate, the first substrate can be the substrate with the lowest utilization rate, and the second substrate can be the substrate with a relatively low utilization rate. After selecting these two substrates, in subsequent operations, the target products on the substrate with the lowest utilization rate can be set on other substrates with relatively low utilization rates, thereby reducing the number of substrates used.

[0039] The intermediate layout plan is a part of the initial layout plan, and the intermediate layout plan includes at least two single-board layout plans corresponding to at least two selected substrates.

[0040] In operation S230, adjust the setting positions of several target products set on at least two substrates among the at least two substrates to obtain an adjusted layout plan for the at least two substrates.

[0041] Exemplarily, several target products are arranged on the two selected substrates. Before adjustment, the several products are arranged according to the intermediate layout rules. This operation will change the positions of the target products. For example, some target products are moved from one substrate to another substrate. After adjustment, the target products are arranged according to the adjusted layout plan.

[0042] In operation S240, when it is determined that the second evaluation value of the adjusted layout plan is less than the second evaluation value of the intermediate layout plan, update the initial layout plan with the adjusted layout plan.

[0043] The second evaluation value can represent an index of the substrate, and the index can include at least one of the utilization rate, the number of cutting tools, the number of rotations, and the historical weight. The historical weight is related to the substrate where the target product is located. For example, if a certain target product is located in the substrate with the lowest utilization rate, the historical weight of this target product is relatively large. After this target product is moved to a substrate with a higher utilization rate, the historical weight of this target product is relatively small.

[0044] In one example, the calculation method of the second evaluation value can be the same as that of the first evaluation value. For example, the utilization rate of the intermediate layout plan is used as the first evaluation value, and the utilization rate of the adjusted layout plan is used as the second evaluation value.

[0045] In another example, the calculation method of the second evaluation value can be different from that of the first evaluation value. For example, the utilization rate of the intermediate layout plan is used as the first evaluation value, and a mixed index of the utilization rate and the historical weight of the adjusted layout plan is used as the second evaluation value. The mixed index can be a weighted sum of the utilization rate and the historical weight.

[0046] It should be noted that since both the intermediate layout plan and the adjusted layout plan are for at least two substrates, if the second evaluation value includes the utilization rate, the second evaluation values of the intermediate layout plan and the adjusted layout plan can be compared according to the number of substrates used in the layout plan and the minimum veneer utilization rate. For example, the intermediate layout plan includes using two substrates, with the utilization rate of one substrate being 80% and the utilization rate of the other substrate being 30%, while the adjusted layout plan includes using two substrates, with the utilization rate of one substrate being 95% and the utilization rate of the other substrate being 15%. It can be seen that the number of substrates used in both is the same, but the minimum veneer utilization rate of the adjusted layout plan is 15%, which is lower than the minimum veneer utilization rate of the intermediate layout plan. Therefore, for the utilization rate index, the adjusted layout plan is superior to the intermediate layout plan.

[0047] In one example, a smaller second evaluation value indicates a better layout plan. The so-called "better" here can include at least one of higher utilization rate, fewer rotation times, and fewer cutting tool numbers.

[0048] In one example, when the second evaluation value of the adjusted layout plan is less than the second evaluation value of the intermediate layout plan, it indicates that the adjusted layout plan is superior to the intermediate layout plan. Therefore, the initial layout plan can be updated using the adjusted layout plan. For example, for the initial layout plan for multiple substrates, the layout plans of some of the multiple substrates are adjusted to the adjusted layout plan, and the layout plans of the remaining substrates are not adjusted. The adjusted layout plan can be combined with the veneer layout plans of the remaining substrates to obtain the updated initial layout plan.

[0049] In one example, when the second evaluation value of the adjusted layout plan is greater than or equal to the second evaluation value of the intermediate layout plan, it indicates that the intermediate layout plan is superior to the adjusted layout plan. In this case, the initial layout plan can be retained without updating the initial layout plan.

[0050] In operation S250, it is determined whether a predetermined termination condition is satisfied.

[0051] In one example, the predetermined termination condition may include that the second evaluation value of the updated initial layout plan reaches a threshold. For example, when the utilization rate is used as the second evaluation value and the utilization rate is higher than 95%.

[0052] In one example, the predetermined termination condition includes that the execution times of the above operation S230 reach a threshold, such as reaching 10,000 times.

[0053] If it is determined that the predetermined termination condition is not satisfied, operation S220 can be returned. If it is determined that the predetermined termination condition is satisfied, operation S260 can be entered.

[0054] In operation S260, the updated initial layout plan is determined as the target layout plan.

[0055] Exemplarily, operations S210 to S250 above can be repeated multiple times. When a predetermined termination condition is met, the last updated initial layout plan is determined as the target layout plan.

[0056] In one technical solution, the target products can be simply arranged to obtain an initial layout plan, and the initial layout plan can be used as the cutting plan. Compared with this technical solution, in the technical solution provided by the embodiments of the present disclosure, after obtaining the initial layout plan, the target products on at least two substrates used in the initial layout plan are rearranged. If the second evaluation value decreases after rearrangement, the initial layout plan is updated using the adjusted layout plan, so that the current initial layout plan is better than the previous one, and the initial layout plan is continuously updated in the above manner. Therefore, when the predetermined termination condition is met, the target layout plan is the same as the last updated initial layout plan, and this target layout plan is better than the initial layout plan before the update, thereby improving the performance indicators of the substrate, such as improving the utilization rate and reducing the number of rotations.

[0057] Figure 3 It is a schematic principle diagram of the layout determination method according to the embodiments of the present disclosure.

[0058] As Figure 3 shown, at least two substrates are selected from the initial layout plan 310, and an intermediate layout plan 320 for the at least two substrates can be obtained. Then an adjustment operation is performed, for example, the target products on the at least two substrates are rearranged on the at least two substrates, and an adjusted layout plan 330 can be obtained. Then the second evaluation value fit1 340 of the intermediate layout plan 320 and the second evaluation value fit2 350 of the adjusted layout plan 330 are calculated respectively, and when fit2 350 is less than fit1 340, the initial layout plan 310 is updated, and the updated initial layout plan can be used as the target layout plan 360.

[0059] Figure 4 It is a schematic flowchart for determining the adjusted layout plan according to the embodiments of the present disclosure.

[0060] As Figure 4 shown, the operation of adjusting the setting positions of a plurality of target products set in at least two substrates in the at least two substrates to obtain an adjusted layout plan for the at least two substrates may include operations S431 to S432.

[0061] In operation S431, according to the transformation method, the target product sequence of the plurality of target products is determined.

[0062] In operation S432, according to the order of the target products in the target product sequence, determine the adjusted layout plan.

[0063] For the above operation S431, exemplarily, multiple target products can be sorted first to obtain an initial product sequence. For example, the multiple target products can be sorted according to size, such as in a decreasing or increasing order of size, and the size can include any one of length, width, and area. Alternatively, the multiple target products can be randomly sorted. Then, use transformation methods to adjust the order of the target products in the initial product sequence multiple times to obtain multiple target product sequences.

[0064] In one example, the transformation method includes a merging method. The merging method includes assembling the mergable target products included in several target products into a merged part. For example, several rectangular target products with the same side length are merged into one merged part. When arranging, the relative positional relationship of the several rectangular target products can remain unchanged.

[0065] After assembling several target products into a merged part, the merged part can participate in the sequence arrangement as an integral product. In the product sequence, several target products correspond to one serial number. Compared with the case where each target product corresponds to one serial number separately, the merging method can reduce the length of the target product sequence. It should be understood that the determination time of the layout plan is related to the number of target products in the product sequence. Reducing the length of the target product sequence can reduce the calculation amount during the determination of the layout plan, thereby improving the calculation efficiency.

[0066] In one example, the transformation method includes a splitting method. The splitting method includes splitting the merged parts included in several target products into split parts. The splitting method will split some merged merged parts back into several unmerged target products, so that the several split target products participate in the sequence arrangement separately.

[0067] During the nesting process, there will be some narrow slit areas. If the merged part cannot be placed in the narrow slit area due to its large size, it will cause the slit area to be idle, thereby reducing the utilization rate of the substrate. In this example, the merged part is split into several target products with smaller sizes, so as to facilitate placing the target products in the narrow slit area, achieving the effect of improving the substrate utilization rate.

[0068] After the target products are merged and cannot be placed in the narrow slit area, splitting processing is required to facilitate placing the target products in the narrow slit area.

[0069] In another example, the transformation method includes a one-by-one random exchange method. That is, randomly exchange the positions of two target products in the target product sequence to obtain a new target product sequence.

[0070] In another example, the transformation method includes a local swapping method. To consider large-scale changes and make up for the defect of the relatively small change range of the one-to-one random swapping method, two subsequences can be randomly selected from the target product sequence according to the transformation method in this example. The lengths of the subsequences are random, and then the positions of the two subsequences are swapped as a whole to obtain a new target product sequence.

[0071] In another example, the transformation method includes a local reverse order method. For example, a subsequence with a random length is randomly selected from the target product sequence, and the elements inside it are reversed to obtain a new target product sequence.

[0072] It should be understood that the above methods for adjusting the order of the target product sequence can also be combined with each other. For example, first use the method in one of the above examples to adjust the first target product sequence to obtain the order of the second target product sequence, and then use the method in another of the above examples to adjust the second target product sequence to obtain the order of the third target product sequence.

[0073] Exemplarily, the transformation method includes a merging method and a splitting method. In practical applications, target products with the same length or width can be extracted and combined into several merged parts, which are then placed in a merged part list. Then, some of the merged parts can be split, and some of the merged parts can be retained, so that the multiple target products corresponding to the target product sequence include both merged parts and split parts.

[0074] In practical applications, the sequence can be changed by executing a meta-heuristic algorithm, such as the simulated annealing algorithm. The simulated annealing algorithm is executed multiple times to arrange the target products on the same substrate multiple times, so as to obtain a better layout scheme. Compared with the greedy algorithm, the simulated annealing algorithm can accept relatively poor solutions with a certain probability. The principle and steps of the simulated annealing algorithm can be referred to the prior art and will not be elaborated here.

[0075] During actual operation, the simulated annealing algorithm can first generate a truncated list according to the currently available target products. The substrate of the bar-shaped area mentioned below can be used as the truncation. The truncation is a type of merged part, which can improve the substrate utilization rate and reduce the calculation time. During the arrangement process, each truncation placed on the substrate can be moved as a whole. And several truncations are randomly placed, such as 0 to 2 truncations.

[0076] For example, for a certain substrate, the sorting of the target product sequence is adjusted n times using the simulated annealing algorithm, where n is an integer greater than or equal to 1, and n single-board layout schemes for this substrate are determined. Then, the sorting of the target product sequence is adjusted again. When arranging the target products for the (n + 1)th time, some truncations are randomly selected from the previous n times and placed in this substrate as part of the layout in the (n + 1)th layout scheme.

[0077] For the above operation S432, illustratively, a sequential single plate mapping method may be used to implement the process of setting the target product on the substrate. The sequential single plate mapping method is described in detail below.

[0078] According to another embodiment of the present disclosure, the layout determination method may further include the following operations: after obtaining an adjusted layout scheme for at least two substrates, when it is determined that the number of target products used in the adjusted layout scheme is less than the number of target products, repeatedly performing an operation of adjusting the setting positions of the several target products set in the at least two substrates in the at least two substrates until the several target products are all set in the at least two substrates.

[0079] It should be understood that when a plurality of target products disposed in at least two substrates are rearranged in at least two substrates, if the number of target products located in the at least two substrates after the arrangement is reduced compared to before the arrangement, it means that the at least two substrates cannot accommodate the plurality of target products, and a new substrate is needed to place the target products not placed in the at least two substrates. For example, the intermediate layout scheme includes using two substrates, and due to the high utilization rate of the two substrates or other reasons, after rearranging the plurality of target products on the selected two substrates, the adjusted layout scheme uses three substrates.

[0080] It can be seen that when the above situation occurs, since a new substrate is needed to place the target product, the utilization rate of the adjusted layout plan is lower than that of the intermediate layout plan. If the adjusted layout plan is further iterated based on, the probability of obtaining a better layout plan is small. In this example, after the above situation occurs, the setting positions of several target products set in at least two substrates are readjusted in at least two substrates to avoid subsequent iteration of the poor adjusted layout plan, thereby saving computing resources.

[0081] According to another embodiment of the present disclosure, the layout determination method may further include the following operations.

[0082] After obtaining the adjusted layout scheme for at least two substrates, after each predetermined number of adjustment operations are performed, the following operations are performed: determining the difference between the second evaluation value of the adjusted layout scheme and the second evaluation value of the updated initial layout scheme, and then, when the difference is greater than or equal to a difference threshold, returning to the operation of selecting at least two substrates from the multiple substrates used in the initial layout scheme based on the multiple first evaluation values.

[0083] Exemplarily, counting may be performed after the adjustment operation is performed, and when it is determined that the counting result is an integer multiple of a predetermined number of times, the difference between the second evaluation value of the adjusted layout solution and the second evaluation value of the updated initial layout solution is calculated.

[0084] If the difference is large, it indicates that the currently obtained adjusted layout plan is poor. For example, the utilization rate of this adjusted layout plan is low. If continuing to iterate based on this adjusted layout plan, the probability of obtaining a better layout plan is small. Therefore, it is possible to roll back to the initial layout plan updated last time, that is, roll back to the historically optimal layout plan. The currently obtained adjusted layout plan can be deleted, and then the base material is selected again from the initial layout plan updated last time for re-layout of the target product, so as to avoid continuing to calculate for a poor adjusted layout plan, thereby saving computing resources.

[0085] According to another embodiment of the present disclosure, the layout determination method may further include a stacked plate layout stage, and the stacked plate layout stage may be executed before the re-layout stage. The stacked plate layout stage may include the following operations: determining a stacked plate layout plan according to the sizes of M target products, where the stacked plate layout plan includes using N target products, 0 ≤ N ≤ M, and both N and M are integers. The initial layout plan includes using the remaining multiple target products, and the remaining multiple target products include the target products other than the N target products among the M target products.

[0086] Exemplarily, stacking plates means that several base materials have the same layout plan, and several base materials can be stacked together for cutting. In this example, first determine the stacked plate layout plan, and then determine the initial layout plan for the target products not used in the stacked plate layout plan. Since multiple base materials with the same stacked plate layout plan can be stacked and cut, there is no need to cut each single base material one by one. Therefore, the cutting efficiency can be improved and the cutting time can be shortened.

[0087] In the stacked plate layout stage, first, the maximum number of stacked plates can be determined according to the thickness of the base material and the thickness that can be cut by the cutting tool at one time, and then the maximum number of stacked plates is gradually reduced until the number of stacked plates is 2.

[0088] In one example, the stackable products can be determined according to the number of products with the same size included in the M target products. For example, the current number of stacked plates is m, indicating that m base materials are stacked together for cutting. The number of products of the same size is n. Calculate the ratio of n to m and round down to obtain the number of stackable products. Then arrange the stackable products on the base material to obtain the stacked plate layout plan.

[0089] Exemplarily, the stacked plate layout plan can be determined based on the sequence single plate mapping method.

[0090] Optionally, the utilization rate of the stacked plate layout plan can be calculated. If the utilization rate is lower than a threshold, for example, lower than 95%, it can be processed according to the non-stacked plate layout plan.

[0091] The embodiments of the present disclosure consider arranging the target products into a stacked plate layout plan, thereby increasing the stacking rate and further improving the cutting efficiency.

[0092] According to another embodiment of the present disclosure, the layout determination method may further include a full-board layout stage, which may be executed after the stacked-board layout stage or before the re-layout stage. The full-board layout stage may include the following operations.

[0093] First, repeat the following operations until the target product set is an empty set: determine the target product set according to a plurality of target products to be laid out; set at least a part of the target products in the target product set on a substrate to obtain a single-board layout plan for one substrate; and delete the target products included in the single-board layout plan from the target product set. Then, determine an initial layout plan according to the obtained single-board layout plans.

[0094] For example, the number of target products is 300. The 300 target products are arranged on the first substrate multiple times to obtain multiple layout plans for the first substrate, and then one of the layout plans is selected as the single-board layout plan for the first substrate. Then, the products on the first substrate are deleted from the 300 target products, and the remaining target products are arranged on the second substrate multiple times, and one of the layout plans is selected as the single-board layout plan for the second substrate. Repeat the above operations until all 300 target products are arranged in the substrates. The multiple single-board layout plans obtained by the above operations are determined as the initial layout plan.

[0095] Exemplarily, the sequence single-board mapping method may be used to determine the single-board layout plan.

[0096] In a technical solution, the target products may be first set on a substrate. When the remaining products cannot be placed on the first substrate, a new substrate may be added until all the target products are arranged on multiple substrates to obtain a full-board layout plan. Then, repeat the operations to obtain multiple full-board layout plans, and then select one of the plans as the initial layout plan.

[0097] Compared with the above technical solution, the technical solution provided by the embodiment of the present disclosure determines only the single-board layout plan for one substrate each time, and then the arranged target products may be deleted from the product sequence. Therefore, each time a single-board layout plan is determined, the length of the target product sequence may be reduced, and further the calculation amount for determining the next single-board layout plan may be reduced, thereby improving the calculation efficiency and the nesting efficiency.

[0098] Another embodiment of the present disclosure also provides an embodiment for determining a single-board layout plan according to a target product sequence. The sequence single-board mapping method will be described in detail below.

[0099] The target product may have a rotatable mark. If the rotatable mark of the target product is T, it means that the target product can be rotated or not when placed. If the rotatable mark of the target product is F, it means that the target product cannot be rotated when placed. The rotatable mark can be specified in advance.

[0100] The target product may have a three - order stackable mark. For the sake of easy understanding, first - order stacking, second - order stacking, and third - order stacking are described. Among the two connected side lengths of the rectangular substrate, one is parallel to the x - direction and the other is parallel to the y - direction. For a layout scheme that satisfies the "one - cut" constraint, the scheme may include a plurality of strip - shaped regions distributed in sequence along the x - direction in the substrate, and the side lengths of the plurality of strip - shaped regions in the y - direction are equal. A target product can be placed in a strip - shaped region, and the strip - shaped region can also be secondarily divided into a plurality of sub - regions distributed in sequence along the y - direction. The side lengths of the plurality of sub - regions in the same strip - shaped region in the x - direction are equal. A target product can be placed in a sub - region, and the sub - region can also be further divided into at least two gap regions distributed in sequence along the x - direction. The side lengths of the plurality of gap regions in the same sub - region in the y - direction are equal. A target product can be placed in the gap region. In the above - mentioned layout scheme, first - order stacking of the target product means setting the target product in the strip - shaped region. Second - order stacking of the target product means setting the target product in the sub - region. Third - order stacking of the target product means setting the target product in the gap region.

[0101] During the cutting process, the substrate can be first divided into two parts along the x - direction. For example, one is the left - hand strip - shaped region and the other is the remaining region on the right. Then, keeping the cutting direction of the tool unchanged, rotate the substrate corresponding to the left - hand strip - shaped region, and the tool performs secondary cutting on the substrate corresponding to the left - hand strip - shaped region to divide the sub - regions inside the left - hand strip - shaped region. Then, keeping the cutting direction of the tool unchanged, rotate the cut - out sub - region, and the tool performs secondary cutting on the divided sub - region to divide the sub - region into at least two gap regions. Thus, the target product is cut out from the strip - shaped region, sub - region, and gap region.

[0102] The placement position of the target product can be determined according to the rotatable mark and three - order stackable mark of the target product. The specific operation is as follows.

[0103] First, determine the target product sequence. Then, according to the order of the target products in the target product sequence, set the target products on a substrate in sequence.

[0104] If there is no target product placed on the substrate and the rotatable mark of the first target product to be placed on this substrate is T, then it can be considered to rotate the target product so that the target product matches the substrate. Matching means that the long side of the target product is parallel to the long side of the substrate, and the short side of the target product is parallel to the short side of the substrate.

[0105] If the target product can be second-order stacked, or the rotatable mark of the target product is T and it can be second-order stacked after rotation, perform second-order stacking on the target product.

[0106] If the target product can be first-order stacked, place the target product in the bar-shaped area of the substrate. If the rotatable mark of the target product is T, the target product can be rotated.

[0107] If, after the target product is second-order stacked, the difference between the side length of the target product in the x direction and the side length of the bar-shaped area where the target product is located in the x direction is greater than the side length threshold, it means that after the target product is placed in the sub-region, there is still a possibility of placing other target products in the sub-region. Then record the remaining space in the sub-region except for the target product to the record space.

[0108] If the third-order stacking mark of the target product is T, and the remaining space in the record space can accommodate the target product, then place the target product in a remaining space for third-order stacking.

[0109] If the current substrate cannot accommodate the remaining target products in the target product sequence, stop the layout, and then calculate the first evaluation value of the substrate.

[0110] Through the above solution, a one-dimensional target product sequence can be mapped to a layout plan on a single substrate.

[0111] Figures 5A to 5B is a flowchart of a layout determination method according to another embodiment of the present disclosure.

[0112] As Figure 5A and Figure 5B shown, the layout determination method 500 may include a stacked plate layout stage, a full plate layout stage, and a re-layout stage. The stacked plate layout stage may include operations S511 to S515, the full plate layout stage may include operations S521 to S524, and the re-layout stage may include operations S5301 to S5312.

[0113] In operation S511, obtain the initial number of stackable plates. The number of stackable plates is represented by op in the figure and can be determined according to the sum of the substrates and the cutting depth of the tool.

[0114] In operation S512, determine whether the number of stackable plates is greater than or equal to 2. If so, proceed to operation S513. If not, proceed to operation S521.

[0115] In operation S513, screen the stackable target products from the current product set. For example, the stackable target products can be screened according to the number of products with the same size.

[0116] In operation S514, determine the stacked board layout scheme. For example, use the sequential single-board mapping method mentioned above to determine the stacked board layout scheme.

[0117] In operation S515, save the stacked board layout scheme, delete the used target products from the current product set, reduce the current stackable quantity by one, and then return to operation S512.

[0118] In operation S521, determine whether all the target products in the current product set are set on the substrate. If not, enter operation S522. If so, enter operation S524.

[0119] In operation S522, determine the single-board layout scheme and the first evaluation value for one substrate. For example, use the sequential single-board mapping method mentioned above to determine the single-board layout scheme.

[0120] In operation S523, save the single-board layout scheme, delete the target products included in the single-board layout scheme from the target product set, and then return to operation S521.

[0121] In operation S524, determine the initial layout scheme. For example, determine the saved multiple single-board layout schemes as the initial layout scheme for multiple substrates.

[0122] In operation S5301, determine whether a predetermined termination condition is met. For example, the number of iterations reaches a threshold, or the second evaluation value reaches a threshold.

[0123] In operation S5302, select at least two substrates from the multiple substrates used in the initial layout scheme according to the first evaluation value to obtain an intermediate layout scheme for at least two substrates. For example, the selected at least two substrates include the substrate with the lowest utilization rate, and also include randomly selecting one substrate from some substrates with lower utilization rate rankings.

[0124] In operation S5303, update the current product set with the multiple target products on at least two substrates. For example, determine the multiple products on the selected substrates as the products in the current product set.

[0125] In operation S5304, determine whether all the target products in the current product set are set on the existing substrates. If not, enter operation S5305. If so, enter operation S5306. Exemplarily, the existing substrates represent the selected at least two substrates, and may not include the substrates not used in the initial layout scheme.

[0126] In operation S5305, perform an adjustment operation, determine the adjusted layout scheme for at least two substrates, and then return to operation S5304. For example, use the sequential single-board mapping method mentioned above to determine the adjusted layout scheme.

[0127] In operation S5306, calculate the second evaluation value of the adjusted layout scheme.

[0128] In operation S5307, determine whether a predetermined number of adjustment operations have been performed. If so, proceed to operation S5308. If not, proceed to operation S5309.

[0129] In operation S5308, calculate the difference between the second evaluation value of the adjusted layout scheme and the second evaluation value of the intermediate layout scheme, and determine whether the difference is greater than or equal to the difference threshold. If so, perform a rollback, that is, return to operation S5302. If not, proceed to operation S5309. In the figure, fit2 represents the second evaluation value of the adjusted layout scheme, fit1 represents the second evaluation value of the intermediate layout scheme, and diff represents the difference threshold.

[0130] In operation S5309, determine whether the second evaluation value of the adjusted layout scheme is less than the second evaluation value of the intermediate layout scheme. If not, proceed to operation S5310. If so, proceed to operation S5311.

[0131] In operation S5310, retain the current initial layout scheme. That is, do not update the initial layout scheme with the adjusted layout scheme.

[0132] In operation S5311, update the initial layout scheme with the adjusted layout scheme.

[0133] In operation S5312, output the updated initial layout scheme. For example, output the last updated initial layout scheme and use it as the target layout scheme.

[0134] Figure 6 It is a structural block diagram of a layout determination device according to an embodiment of the present disclosure.

[0135] As Figure 6 shown, the layout determination device 600 may include a first evaluation value determination module 610, an intermediate layout scheme determination module 620, an adjustment module 630, an update module 640, a first determination module 650, and a target layout scheme determination module 660.

[0136] The first evaluation value determination module 610 is configured to determine the first evaluation value of each of the multiple base materials used in the initial layout scheme, and obtain a plurality of first evaluation values.

[0137] The intermediate layout scheme determination module 620 is configured to select at least two base materials from the multiple base materials used in the initial layout scheme according to the plurality of first evaluation values, and obtain an intermediate layout scheme for the at least two base materials.

[0138] The adjustment module 630 is configured to adjust the setting positions of a plurality of target products provided in at least two substrates in the at least two substrates, so as to obtain an adjusted layout plan for the at least two substrates.

[0139] The update module 640 is configured to update the initial layout plan with the adjusted layout plan when it is determined that the second evaluation value of the adjusted layout plan is less than the second evaluation value of the intermediate layout plan.

[0140] The first determination module 650 is configured to determine whether a predetermined termination condition is satisfied.

[0141] The target layout plan 660 determination module is configured to determine the updated initial layout plan as the target layout plan.

[0142] According to another disclosed embodiment of the present disclosure, the layout determination device further includes a second determination module, a difference determination module, and a return module. The second determination module is configured to determine whether a predetermined number of adjustment operations are performed after obtaining the adjusted layout plan for the at least two substrates. The difference determination module is configured to determine the difference between the second evaluation value of the adjusted layout plan and the second evaluation value of the updated initial layout plan when the determination result of the second determination module is yes. The return module is configured to return the operations performed by the intermediate layout plan determination module when the difference is greater than or equal to the difference threshold.

[0143] According to another disclosed embodiment of the present disclosure, the layout determination device further includes a loop processing module, configured to, after obtaining the adjusted layout plan for the at least two substrates, repeat the operation of adjusting the setting positions of the plurality of target products provided in the at least two substrates in the at least two substrates until all the plurality of target products are provided in the at least two substrates when it is determined that the number of target products used in the adjusted layout plan is less than the number of the plurality of target products.

[0144] According to another disclosed embodiment of the present disclosure, the at least two substrates include a first substrate and a second substrate. The first evaluation value of the first substrate is the lowest among a plurality of first evaluation values, and the first evaluation value of the second substrate satisfies a predetermined condition, where the predetermined condition includes at least one of the first evaluation value being less than the evaluation value threshold and the first evaluation value ranking lower than a predetermined ranking.

[0145] According to another disclosed embodiment of the present disclosure, the predetermined termination condition includes that the number of executions of the adjustment operation reaches a threshold.

[0146] According to another disclosed embodiment of the present disclosure, the adjustment module includes a sequence determination sub-module and an adjusted layout plan determination sub-module. The sequence determination sub-module is configured to determine a target product sequence of a plurality of target products according to at least one of a merging method and a splitting method. The adjusted layout plan determination sub-module is configured to determine an adjusted layout plan according to the order of the target products in the target product sequence. The merging method includes merging mergeable target products included in the plurality of target products into a merged part, and the splitting method includes splitting the merged part included in the plurality of target products into split parts.

[0147] According to another disclosed embodiment of the present disclosure, the layout determination device further includes a stacking module, configured to determine a stacking layout plan according to the sizes of M target products, where the stacking layout plan includes using N target products, 0≤N≤M, and both N and M are integers. The initial layout plan includes using the remaining plurality of target products, and the remaining plurality of target products includes the target products other than the N target products among the M target products.

[0148] According to another disclosed embodiment of the present disclosure, the layout determination device further includes a third determination module, a target product set determination module, a single-board layout plan determination module, a deletion module, and an initial layout plan determination module. The third determination module is configured to determine whether the target product set is an empty set. The target product set determination module is configured to determine a target product set according to a plurality of target products to be laid out. The single-board layout plan determination module is configured to arrange at least a part of the target products in the target product set on a substrate to obtain a single-board layout plan for one substrate. The deletion module is configured to delete the target products included in the single-board layout plan from the target product set. The initial layout plan determination module is configured to determine an initial layout plan according to the obtained single-board layout plan.

[0149] According to an embodiment of the present disclosure, the present disclosure further provides an electronic device, a readable storage medium, and a computer program product.

[0150] Figure 7 FIG. shows a schematic block diagram of an exemplary electronic device 700 that can be used to implement the embodiments of the present disclosure. The electronic device is intended to represent various forms of digital computers, such as, a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely exemplary and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0151] As Figure 7As shown, device 700 includes a computing unit 701, which can perform various appropriate actions and processes according to computer programs stored in a read-only memory (ROM) 702 or computer programs loaded from a storage unit 708 into a random access memory (RAM) 703. In the RAM 703, various programs and data required for the operation of device 700 can also be stored. The computing unit 701, the ROM 702, and the RAM 703 are connected to each other via a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0152] Multiple components in device 700 are connected to the I / O interface 705, including: an input unit 706, such as a keyboard, a mouse, etc.; an output unit 707, such as various types of displays, speakers, etc.; a storage unit 708, such as a magnetic disk, an optical disc, etc.; and a communication unit 709, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 709 allows device 700 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0153] The computing unit 701 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 701 include but are not limited to a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The computing unit 701 executes the various methods and processes described above, such as the layout determination method. For example, in some embodiments, the layout determination method can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as the storage unit 708. In some embodiments, part or all of the computer program can be loaded and / or installed onto device 700 via the ROM 702 and / or the communication unit 709. When the computer program is loaded into the RAM 703 and executed by the computing unit 701, one or more steps of the layout determination method described above can be executed. Alternatively, in other embodiments, the computing unit 701 can be configured to execute the layout determination method by any other appropriate means (e.g., by means of firmware).

[0154] The various embodiments of the systems and techniques described above in this specification can be implemented in digital electronic circuitry, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on a chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be a special-purpose or general-purpose programmable processor that receives data and instructions from, and transmits data and instructions to, a storage system, at least one input device, and at least one output device.

[0155] The program code for implementing the methods of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the program codes, when executed by the processor or controller, cause the functions / operations specified in the flowchart and / or block diagram to be implemented. The program code may execute entirely on the machine, partly on the machine, as a stand-alone software package partly on the machine and partly on a remote machine or entirely on the remote machine or server.

[0156] In the context of the present disclosure, a machine-readable medium may be a tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0157] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and a pointing device (e.g., a mouse or a trackball) through which the user can provide input to the computer. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, speech input, or tactile input).

[0158] The systems and techniques described herein can be implemented in a computing system including backend components (e.g., as a data server), or a computing system including middleware components (e.g., an application server), or a computing system including frontend components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system including any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local area network (LAN), wide area network (WAN), and the Internet.

[0159] A computer system can include a client and a server. The client and the server are generally remote from each other and typically interact through a communication network. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other.

[0160] In the technical solution of the present disclosure, the processing of data collection, storage, use, processing, transmission, provision, and disclosure, etc., all comply with the provisions of relevant laws and regulations and do not violate public order and good customs.

[0161] It should be understood that various forms of the processes shown above can be used, steps can be reordered, added, or deleted. For example, the steps recited in the present disclosure can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in the present disclosure can be achieved, and no limitation is imposed herein.

[0162] The above specific embodiments do not constitute a limitation on the protection scope of the present disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

1. A layout determination method, including: Repeatedly perform the following operations until a predetermined termination condition is met: Determine the first evaluation value of each of the multiple substrates used in the initial layout plan to obtain multiple first evaluation values; Select at least two substrates from the multiple substrates used in the initial layout plan according to the multiple first evaluation values to obtain an intermediate layout plan for the at least two substrates; Adjust the setting positions of several target products arranged on the at least two substrates in the at least two substrates to obtain an adjusted layout plan for the at least two substrates, including: determining the target product sequence of the several target products according to at least one of a merging method and a splitting method; and determining the adjusted layout plan according to the order of the target products in the target product sequence; wherein, the merging method includes merging the mergeable target products included in the several target products into a merged part, and the splitting method includes splitting the merged part included in the several target products into split parts; and In the case where it is determined that the second evaluation value of the adjusted layout plan is less than the second evaluation value of the intermediate layout plan, update the initial layout plan with the adjusted layout plan; and Determine the updated initial layout plan as the target layout plan.

2. The method according to claim 1, further including: After obtaining the adjusted layout plan for the at least two substrates, After performing the adjustment operation a predetermined number of times, perform the following operations: Determine the difference between the second evaluation value of the adjusted layout plan and the second evaluation value of the updated initial layout plan; and In the case where the difference is greater than or equal to a difference threshold, return to the operation of selecting at least two substrates from the multiple substrates used in the initial layout plan according to the multiple first evaluation values.

3. The method according to claim 1, further including: After obtaining the adjusted layout plan for the at least two substrates, In the case where it is determined that the number of target products used in the adjusted layout plan is less than the number of the several target products, repeatedly perform the operation of adjusting the setting positions of the several target products arranged on the at least two substrates in the at least two substrates until all the several target products are arranged on the at least two substrates.

4. The method according to claim 1, wherein, The at least two substrates include a first substrate and a second substrate. The first evaluation value of the first substrate is the lowest among the multiple first evaluation values, and the first evaluation value of the second substrate meets a predetermined condition, and the predetermined condition includes at least one of the first evaluation value being less than an evaluation value threshold and the first evaluation value ranking lower than a predetermined ranking.

5. The method according to claim 1, wherein, The predetermined termination condition includes that the number of executions of the adjustment operation reaches a threshold.

6. The method according to claim 1, further including: Determine a stacked plate layout plan according to the sizes of M target products, and the stacked plate layout plan includes using N target products, 0≤N≤M, and both N and M are integers; Among them, the initial layout plan includes using the remaining multiple target products, and the remaining multiple target products include the target products among the M target products except the N target products.

7. The method according to claim 1, further comprises: Repeating the following operations until the target product set is an empty set: Determining a target product set according to the multiple target products to be laid out; Setting at least a part of the target products in the target product set on a substrate to obtain a single-board layout plan for the one substrate; and Deleting the target products included in the single-board layout plan from the target product set; and Determining the initial layout plan according to the obtained single-board layout plan.

8. A layout determination device, comprises: A first evaluation value determination module, configured to determine a first evaluation value of each substrate among the multiple substrates used in the initial layout plan, and obtain multiple first evaluation values; An intermediate layout plan determination module, configured to select at least two substrates from the multiple substrates used in the initial layout plan according to the multiple first evaluation values to obtain an intermediate layout plan for the at least two substrates; An adjustment module, configured to adjust the setting positions of several target products set in the at least two substrates in the at least two substrates to obtain an adjusted layout plan for the at least two substrates; An update module, configured to update the initial layout plan with the adjusted layout plan when it is determined that the second evaluation value of the adjusted layout plan is less than the second evaluation value of the intermediate layout plan; A first determination module, configured to determine whether a predetermined termination condition is satisfied; and A target layout plan determination module, configured to determine the updated initial layout plan as the target layout plan; Among them, the adjustment module includes: A sequence determination sub-module, configured to determine a target product sequence of the several target products according to at least one of a merging method and a splitting method; and An adjusted layout plan determination sub-module, configured to determine the adjusted layout plan according to the order of the target products in the target product sequence; Among them, the merging method includes merging the mergable target products included in the several target products into a merged part, and the splitting method includes splitting the merged part included in the several target products into split parts.

9. The device according to claim 8, further comprises: A second determination module, configured to determine whether to perform a predetermined number of adjustment operations after obtaining the adjusted layout plan for the at least two substrates; A difference determination module, configured to determine the difference between the second evaluation value of the adjusted layout plan and the second evaluation value of the updated initial layout plan when the determination result of the second determination module is yes; and A return module, configured to return the operations performed by the intermediate layout plan determination module when the difference is greater than or equal to a difference threshold.

10. The device according to claim 8, further comprises: A loop processing module, configured to, after obtaining an adjusted layout plan for the at least two substrates, repeatedly perform an operation of adjusting the setting positions of a plurality of target products provided in the at least two substrates in the at least two substrates when it is determined that the number of target products used in the adjusted layout plan is less than the number of the plurality of target products, until all the plurality of target products are provided in the at least two substrates.

11. The apparatus according to claim 8, wherein, the at least two substrates include a first substrate and a second substrate, the first evaluation value of the first substrate is the lowest among the plurality of first evaluation values, and the first evaluation value of the second substrate satisfies a predetermined condition, and the predetermined condition includes at least one of the first evaluation value being less than an evaluation value threshold and the ranking of the first evaluation value being lower than a predetermined ranking.

12. The apparatus according to claim 8, wherein, the predetermined termination condition includes that the number of executions of the adjustment operation reaches a threshold.

13. The apparatus according to claim 8, further comprising: a stacking module, configured to determine a stacking layout plan according to the sizes of M target products, where the stacking layout plan includes using N target products, 0 ≤ N ≤ M, and both N and M are integers; wherein, the initial layout plan includes using the remaining plurality of target products, and the remaining plurality of target products include the target products other than the N target products among the M target products.

14. The apparatus according to claim 8, further comprising: a third determination module, configured to determine whether the target product set is an empty set; a target product set determination module, configured to determine a target product set according to a plurality of target products to be laid out; a single-board layout plan determination module, configured to arrange at least a part of the target products in the target product set on one substrate to obtain a single-board layout plan for the one substrate; and a deletion module, configured to delete the target products included in the single-board layout plan from the target product set; and an initial layout plan determination module, configured to determine the initial layout plan according to the obtained single-board layout plan.

15. An electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method according to any one of claims 1 to 7.

16. A non-transitory computer-readable storage medium storing computer instructions, wherein, the computer instructions are used to cause the computer to execute the method according to any one of claims 1 to 7.

17. A computer program product, comprising a computer program which, when executed by a processor, implements the method according to any one of claims 1 to 7.

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