Display panel and manufacturing method thereof, and display device

Abstract

The present application discloses a display panel, a method for preparing the same, and a display device, and relates to the field of display technology. Since the size of the via hole in the first insulating layer (103) in the display panel (10) is designed to be relatively large, when preparing the signal transmission line (106), the light from the exposure machine will not converge onto the photoresist after being reflected by the reflective material layer (104), thereby preventing overexposure of the photoresist. Thus, the reliability of the signal transmission line (106) in the display panel (104) can be guaranteed, thereby ensuring the yield of the display panel (10).

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] The display panel includes a base substrate, and a stacked connection structure layer, a first insulating layer, a reflective material layer, a second insulating layer, and multiple signal transmission lines located on one side of the base substrate. The reflective material layer and the connection structure layer are connected via vias in the first insulating layer, and the signal transmission lines are used to transmit signals.

[0003] In related art, because the reflective material layer and the connection structure layer are connected through vias in the first insulating layer, the reflective material layer forms a concave mirror structure at the vias. If the orthographic projection of the desired signal transmission line on the substrate overlaps with the orthographic projection of the vias in the first insulating layer on the substrate, when the photoresist is exposed using an exposure machine during fabrication of the signal transmission line, the light from the exposure machine will be focused onto the photoresist by the concave mirror structure formed by the reflective material layer, resulting in overexposure of the photoresist. This can result in the fabricated signal transmission line being too thin or disconnected, affecting the yield of the display panel. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the same, and a display device, which can solve the problem of low yield of display panels in related technologies. The technical solution is as follows:

[0005] In one aspect, a display panel is provided, comprising:

[0006] substrate;

[0007] and, a connection structure layer, a first insulating layer, a reflective material layer, a second insulating layer and a signal transmission line, which are located on one side of the base substrate and are stacked in sequence in a direction away from the base substrate;

[0008] Particularly, the first insulating layer has a via hole, the reflective material layer is connected to the connecting structure layer through the via hole, the length of the opening of the via hole close to the connecting structure layer along the first direction is greater than a length threshold, the signal transmission line extends along the second direction, and the orthographic projection of the signal transmission line on the base substrate at least partially overlaps with the orthographic projection of the via hole on the base substrate, and the second direction intersects with the first direction.

[0009] Optionally, the sidewall of the via hole is a stepped structure.

[0010] Optionally, the sidewall of the via hole has a first plane, a second plane and a third plane connected in sequence, and the first plane is closer to the substrate than the third plane;

[0011] Among them, the first angle between the first plane and the supporting surface of the base substrate, and the second angle between the third plane and the supporting surface of the base substrate are both greater than 50 degrees and less than 70 degrees, and the second plane is parallel to the supporting surface of the base substrate.

[0012] Optionally, a distance w1 between a first target point on the reflective material layer and a second target point on the reflective material layer along the first direction satisfies:

[0013]

[0014] Among them, the first target point is the first inflection point of the reflective material layer in the first plane and the second plane, the first target point is located on the side of the reflective material layer away from the base substrate, the second target point is the second inflection point of the reflective material layer in the third plane and on the side of the first insulating layer away from the base substrate, the second target point is located on the side of the reflective material layer away from the base substrate, the first target point and the second target point are respectively located on both sides of the opening of the via hole close to the base substrate, m is the distance between the second plane and the side of the connecting structure layer close to the reflective material layer, n is the thickness of the first insulating layer along the direction perpendicular to the supporting surface of the base substrate, and α is the first angle.

[0015] Optionally, a distance w3 between the third target point of the reflective material layer and the fourth target point of the reflective material layer along the first direction satisfies:

[0016]

[0017] Among them, the third target point and the fourth target point are both inflection points of the side wall of the via hole and the side of the first insulating layer away from the base substrate, and the third target point and the fourth target point are both located on the side of the reflective material layer away from the base substrate, and the third target point and the fourth target point are respectively located on both sides of the opening of the via hole close to the base substrate, n is the thickness of the first insulating layer along the direction perpendicular to the base substrate, and γ is the third angle between the side wall of the via hole and the supporting surface of the base substrate.

[0018] Optionally, the reflective material layer is made of metal material.

[0019] Optionally, the reflective material layer is the second source and drain electrode layer of the display panel, and the connection structure layer is the first source and drain electrode layer of the display panel.

[0020] Optionally, the reflective material layer is a first source and drain electrode layer of the display panel, and the connection structure layer is an active layer of the display panel.

[0021] Optionally, the material of the signal transmission line is indium tin oxide.

[0022] Optionally, the base substrate has a light-transmitting area, and at least a portion of the orthographic projection of the signal transmission line on the base substrate is located in the light-transmitting area.

[0023] In another aspect, a method for preparing a display panel is provided, the method comprising:

[0024] providing a substrate;

[0025] forming a connection structure layer, a first insulating layer, a reflective material layer, a second insulating layer and a signal transmission line in sequence on one side of the base substrate;

[0026] Particularly, the first insulating layer has a via hole, the reflective material layer is connected to the connecting structure layer through the via hole, the length of the opening of the via hole close to the connecting structure layer along the first direction is greater than a length threshold, the signal transmission line extends along the second direction, and the orthographic projection of the signal transmission line on the base substrate at least partially overlaps with the orthographic projection of the via hole on the base substrate, and the second direction intersects with the first direction.

[0027] Optionally, forming a first insulating layer includes:

[0028] forming a first insulating film layer on a side of the connection structure layer away from the base substrate;

[0029] coating a photoresist on a side of the first insulating film layer away from the substrate;

[0030] exposing the photoresist using a half-tone mask;

[0031] developing the photoresist;

[0032] etching the first insulating film layer based on the developed photoresist;

[0033] removing the remaining photoresist to obtain a first insulating layer;

[0034] Wherein, the via hole in the first insulating layer is a step-type structure.

[0035] Optionally, forming a signal transmission line includes:

[0036] forming a signal transmission film layer on a side of the second insulating layer away from the base substrate;

[0037] Coating photoresist on a side of the signal transmission film layer away from the substrate;

[0038] exposing the photoresist using a mask;

[0039] developing the photoresist;

[0040] etching the signal transmission film layer based on the developed photoresist;

[0041] The remaining photoresist is removed to obtain the signal transmission line.

[0042] On the other hand, a display device is provided, comprising: the display panel as described in the above aspect, and a photosensitive element located in a light-transmitting area of ​​a base substrate in the display panel.

[0043] Optionally, the photosensitive element is a camera component.

[0044] The beneficial effects of the technical solution provided by this application include at least:

[0045] The present application provides a display panel, a method for manufacturing the same, and a display device. Because the vias in the first insulating layer of the display panel are designed to be relatively large, when fabricating signal transmission lines, light from an exposure machine, after being reflected by a reflective material layer, does not converge onto the photoresist, preventing overexposure of the photoresist. This ensures the reliability of the signal transmission lines in the display panel and the yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0047] Figure 1 This is a schematic diagram of light used by an exposure machine when forming a signal transmission line in the related art;

[0048] Figure 2 is a schematic diagram of a signal transmission line in the related art;

[0049] Figure 3 is a structural diagram of a display panel provided in an embodiment of the present application;

[0050] Figure 4 This is a schematic diagram of a signal transmission line and a via provided in an embodiment of the present application;

[0051] Figure 5This is a schematic diagram of a signal transmission line, a via, a connection structure layer, and a reflective material layer provided in an embodiment of the present application;

[0052] Figure 6 This is a schematic diagram of light used in an exposure machine when forming a signal transmission line according to an embodiment of the present application;

[0053] Figure 7 is a structural diagram of another display panel provided in an embodiment of the present application;

[0054] Figure 8 This is another light schematic diagram of an exposure machine for forming a signal transmission line provided by an embodiment of the present application;

[0055] Figure 9 This is another light schematic diagram of an exposure machine for forming a signal transmission line provided by an embodiment of the present application;

[0056] Figure 10 This is a schematic diagram of light used in another exposure machine when forming a signal transmission line provided by an embodiment of the present application;

[0057] Figure 11 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0058] Figure 12 It is a structural schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0059] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0060] A display panel in related art includes a base substrate, and a connection structure layer, a first insulating layer, a reflective material layer, a second insulating layer, and a signal transmission line stacked sequentially on one side of the base substrate. The first insulating layer has a via hole, and the reflective material layer and the connection structure layer are connected through the via hole in the first insulating layer. The reflective material layer forms a concave mirror structure at the via hole.

[0061] refer to Figure 1 When fabricating signal transmission lines in a display panel, a signal transmission film layer is first formed on the side of the second insulating layer away from the base substrate, and then the signal transmission film layer is patterned to form the signal transmission line. The patterning process includes: coating a photoresist on the side of the signal transmission film layer away from the base substrate; placing a mask on the side of the photoresist away from the base substrate; using an exposure machine to emit light through an opening in the mask to expose the photoresist; developing the photoresist; etching the signal transmission film layer based on the developed photoresist; and removing the remaining photoresist.

[0062] If the orthographic projection of the prepared signal transmission line on the substrate overlaps with the orthographic projection of the via hole in the first insulating layer on the substrate, then during the exposure process of the photoresist using an exposure machine, the light of the exposure machine will be focused on the photoresist by the concave mirror structure formed by the reflective material layer, resulting in overexposure of the photoresist (overexposure can refer to the exposure of parts of the photoresist that should not be exposed). Figure 2 , which will cause the prepared signal transmission line to be disconnected (or too thin), and the yield of the display panel will be low.

[0063] Figure 3 This is a schematic diagram of the structure of a display panel provided by an embodiment of the present application. Figure 3 The display panel 10 may include: a base substrate 101, and a connection structure layer 102, a first insulating layer 103, a reflective material layer 104, a second insulating layer 105 and a signal transmission line 106 located on one side of the base substrate 101 and stacked in sequence in a direction away from the base substrate 101.

[0064] The first insulating layer 103 has a via hole, and the reflective material layer 104 is connected to the connection structure layer 102 through the via hole of the first insulating layer 103. The length of the opening of the via hole near the connection structure layer 102 along the first direction A1 is greater than the length threshold.

[0065] refer to Figure 4 and Figure 5 The signal transmission line 106 extends along a second direction A2, and an orthographic projection of the signal transmission line 106 on the base substrate 101 at least partially overlaps with an orthographic projection of the via hole on the base substrate 101. The second direction A2 intersects with the first direction A1. For example, the second direction A2 is perpendicular to the first direction A1. The first direction A1 and the second direction A2 are the pixel row direction and the pixel column direction of the display panel 10, respectively.

[0066] Normally, if the orthographic projection of the signal transmission line 106 on the base substrate 101 overlaps at least partially with the orthographic projection of the via hole on the base substrate 101, then when preparing the signal transmission line 106, after the light from the exposure machine irradiates the reflective material layer 104, the light reflected by the reflective material layer 104 may converge on the photoresist, resulting in overexposure of the photoresist. However, in the embodiment of the present application, since the length of the opening of the via hole near the connecting structure layer 102 along the first direction A1 is greater than the length threshold, the reference Figure 6 This ensures that when forming signal transmission lines 106, after the light from the exposure machine irradiates the reflective material layer 104, the light reflected by the reflective material layer 104 will not converge onto the photoresist, thereby preventing overexposure of the photoresist. Furthermore, the reliability of the formed signal transmission lines 106 can be guaranteed, ensuring the yield of the display panel 10.

[0067] In summary, the embodiments of the present application provide a display panel in which the vias in the first insulating layer are designed to be relatively large. Therefore, when fabricating signal transmission lines, light from an exposure machine, after being reflected by the reflective material layer, does not converge onto the photoresist, thereby preventing overexposure of the photoresist. This ensures the reliability of the signal transmission lines in the display panel and the yield of the display panel.

[0068] In the embodiment of the present application, the display panel 10 may include a plurality of signal transmission lines 106 , and the plurality of signal transmission lines 106 may be made of the same material and manufactured by the same patterning process.

[0069] In an embodiment of the present application, the base substrate 101 may have a light-transmitting area, and the transmittance of the light-transmitting area may be greater than a transmittance threshold (i.e., the transmittance of the light-transmitting area is relatively large). The light-transmitting area can be used to set a photosensitive element. Since the transmittance of the light-transmitting area is relatively large, it will not affect the normal operation of the photosensitive element set in the light-transmitting area. For example, the photosensitive element can be a camera component, which can be used to capture images.

[0070] To ensure the transmittance of the light-transmitting area, the signal transmission line 106 in the light-transmitting area of ​​the display panel 10 can be made of transparent metal, that is, at least part of the orthographic projection of the signal transmission line 106 on the base substrate 101 can be located in the light-transmitting area.

[0071] Optionally, the material of the signal transmission line 106 in the display panel 10 of the embodiment of the present application may be a transparent metal, that is, the signal transmission line 106 may be a transparent metal line. For example, the material of the signal transmission line 106 may be indium tin oxide (ITO).

[0072] In the embodiment of the present application, the reflective material layer 104 may be made of a metal material and may have a high reflectivity, so that the light from the exposure machine will be reflected by the reflective material layer 104 when it is irradiated thereon.

[0073] Optionally, the reflective material layer 104 may be the second source-drain layer of the display panel 10, and the connection structure layer 102 may be the first source-drain layer of the display panel 10. Alternatively, the reflective material layer 104 may be the first source-drain layer of the display panel 10, and the connection structure layer 102 may be the active layer of the display panel 10. The first source-drain layer and the second source-drain layer in the display panel 10 may both be made of metal, and the active layer in the display panel 10 may be made of P-type silicon.

[0074] The embodiment of the present application does not limit what film layers of the display panel the reflective material layer 104 and the connecting structure layer 102 are respectively. It is only necessary that the reflectivity of the reflective material layer 104 is greater than the reflectivity threshold, and the reflective material layer 104 and the connecting structure layer 102 are connected through the via holes of the insulating layer therebetween.

[0075] Optionally, when the reflective material layer 104 is the second source and drain layer of the display panel 10 and the connecting structure layer 102 is the first source and drain layer of the display panel 10, the first insulating layer 103 can be the first planarization layer (PLN) in the display panel 10, and the second insulating layer 105 can be the second planarization layer of the display panel 10.

[0076] As a first optional implementation, refer to Figure 7 The sidewall of the via hole in the first insulating layer 103 may be a stepped structure. Accordingly, the orthographic projection of the reflective material layer 104 in the via hole on the reference plane may also be stepped. The reference plane is perpendicular to the supporting surface of the base substrate 101.

[0077] Since the sidewall of the via hole in the first insulating layer 103 is a step-type structure, the concave mirror structure of the reflective material layer 104 located in the via hole can be destroyed. Figure 8 When fabricating the signal transmission line 106, the light from the exposure machine is reflected by the reflective material layer 104 and does not converge onto the photoresist, thus preventing overexposure of the photoresist. This ensures the reliability of the fabricated signal transmission line 106 and the yield of the display panel 10.

[0078] refer to Figure 7 The sidewall of the via has a first plane c1, a second plane c2, and a third plane c3, which are connected in sequence. The first plane c1 is closer to the base substrate 101 than the third plane c3. The first angle α between the first plane c1 and the supporting surface of the base substrate 101, and the second angle β between the third plane c3 and the supporting surface of the base substrate 101, are both greater than 50 degrees and less than 70 degrees. For example, the first angle α and the second angle β can both be 60 degrees. In addition, the second plane c2 can be parallel to the supporting surface of the base substrate 101.

[0079] Optionally, the first angle α and the second angle β may be the same or different, and this embodiment of the present application does not limit this.

[0080] refer to Figure 9 In the case where the sidewall of the via hole in the first insulating layer 103 is a step-type structure, it is only necessary to ensure that the light of the exposure machine is irradiated to the first target point B1 of the reflective material layer 104 (the first target point B1 includes B11 or B12, Figure 9Taking irradiation to B11 as an example, when it is only reflected by the portion of the reflective material layer 104 located on the bottom surface of the via hole, and will not be reflected again by the portion of the reflective material layer 104 located on the side wall of the via hole, so as to ensure that the light irradiated by the exposure machine to the reflective material layer 104 does not converge to the photoresist.

[0081] The first target point B1 (eg Figure 9 B11 in FIG) and a second target point B2 of the reflective material layer 104 (e.g. Figure 9 The distance w1 along the first direction A1 in B21) may satisfy:

[0082]

[0083] The first target point B11 is the first inflection point of the reflective material layer 104 between the first plane c1 and the second plane c2, and the first target point B11 is located on the side of the reflective material layer 104 away from the base substrate 101. The second target point B21 is the second inflection point of the reflective material layer 104 between the third plane c3 and the side of the first insulating layer 103 away from the base substrate 101, and the second target point B21 is located on the side of the reflective material layer 104 away from the base substrate 101.

[0084] refer to Figure 9 The first target point B11 and the second target point B21 are located on either side of the opening of the via hole close to the base substrate 101. m is the distance between the second plane c2 and a surface of the connection structure layer 102 close to the reflective material layer 104. n is the thickness of the first insulating layer 103 in a direction perpendicular to the supporting surface of the base substrate 101. α is the first angle.

[0085] Accordingly, the distance w2 between the first target point B12 of the reflective material layer 104 and the second target point B22 of the reflective material layer 104 along the first direction A1 satisfies: The first target point B12 and the second target point B22 are respectively located on two sides of the opening of the via hole close to the base substrate 101 .

[0086] In the embodiment of the present application, taking the first target point B11 and the second target point B21 as an example, it is assumed that the thickness of the reflective material layer 104 in the direction perpendicular to the supporting surface of the base substrate 101 is the same in each area. In addition, since the light from the exposure machine is irradiated to the first target point B11 and can eventually be emitted through the second target point B21, the distance between the first target point B11 and the second target point B21 along the first direction A1 is the minimum distance. Therefore, the minimum distance can be calculated first, and the distance w1 between the first target point B11 and the second target point B21 along the first direction A1 can be greater than or equal to the minimum distance. The derivation process of the above formula (1) is as follows:

[0087] Since the first angle is α, after the light from the exposure machine irradiates the first target point B11, the angle between the light reflected by the first target point B11 and the supporting surface of the substrate 101 can be α / 2. Therefore, the triangle ABC can satisfy:

[0088]

[0089] Wherein, t can be the thickness of the reflective material layer 104 along the direction perpendicular to the supporting surface of the base substrate 101. In the above formula (2), w11 is the distance along the first direction A1 between the first target point B11 and the reflection point where the light is reflected by the reflective material layer 104 near the bottom surface of the via hole.

[0090] Furthermore, the angle between the light reflected by the portion of the reflective material layer 104 located at the bottom surface of the via hole and the supporting surface of the base substrate 101 is α / 2. Therefore, the triangle A′B′C can satisfy:

[0091]

[0092] Among them, in the above formula (3), w12 is the distance along the first direction A1 between the reflection point where the light is reflected by the reflective material layer 104 near the bottom surface of the via hole and the second target point B21 .

[0093] Therefore, the minimum distance w1 between the first target point B11 and the second target point B21 along the first direction A1 can be: That is, the distance w1 between the first target point B11 and the second target point B21 along the first direction A1 is greater than or equal to the minimum distance (i.e., satisfies the above formula (1)), which can ensure that the light from the exposure machine will not converge on the photoresist, thereby ensuring the reliability of the signal transmission line 106 in the display panel 10.

[0094] For example, assuming that the first angle α is 60 degrees, the distance m between the second plane c2 and the side of the connecting structure layer 102 close to the reflective material layer 104 is 0.3 μm (micrometer), and the thickness n of the first insulating layer 103 along the direction perpendicular to the supporting surface of the base substrate 101 is 1.5 μm.

[0095] Therefore, the distance w1 between the first target point B11 and the second target point B21 along the first direction A1 satisfies:

[0096] As a second optional implementation, refer to Figure 10The opening of the via in the first insulating layer 103 on the side closest to the base substrate 101 is designed to be larger, and the sidewalls of the via are not stepped. In this case, it is only necessary to ensure that when the light from the exposure machine reaches the third target point B3 of the reflective material layer 104, it is reflected only by the portion of the reflective material layer 104 located at the bottom surface of the via, and not further reflected by the portion of the reflective material layer 104 located at the sidewalls of the via, to ensure that the light from the exposure machine irradiating the reflective material layer 104 does not converge onto the photoresist.

[0097] Correspondingly, when the light from the exposure machine is irradiated to the third target point B3 of the reflective material layer 104, it is only reflected by the part of the reflective material layer 104 located on the bottom surface of the via hole, and will not be reflected again by the part of the reflective material layer 104 located on the side wall of the via hole. When the light from the exposure machine is irradiated to the fourth target point B4 of the reflective material layer 104, it may also be only reflected by the part of the reflective material layer 104 located on the bottom surface of the via hole, and will not be reflected again by the part of the reflective material layer 104 located on the side wall of the via hole.

[0098] A distance w3 between the third target point B3 of the reflective material layer 104 and the fourth target point B4 of the reflective material layer 104 along the first direction A1 may satisfy:

[0099]

[0100] The third target point B3 and the fourth target point B4 are both inflection points between the sidewall of the via hole and the surface of the first insulating layer 103 away from the base substrate 101. Both the third target point B3 and the fourth target point B4 are located on the side of the reflective material layer 104 away from the base substrate 101. The third target point B3 and the fourth target point B4 are located on either side of the opening of the via hole close to the base substrate 101. n is the thickness of the first insulating layer 103 in a direction perpendicular to the base substrate 101, and γ is the third angle between the sidewall of the via hole and the supporting surface of the base substrate 101.

[0101] In the embodiment of the present application, taking the case where light is irradiated to the third target point B3 as an example, it is assumed that the thickness of the reflective material layer 104 in the direction perpendicular to the supporting surface of the base substrate 101 is the same in all regions. In addition, since the light from the exposure machine is irradiated to the third target point B3 and can eventually be emitted through the fourth target point B4, the distance w3 between the third target point B3 and the fourth target point B4 along the first direction A1 can be the minimum distance. Therefore, the minimum distance can be calculated first, and the distance w3 between the third target point B3 and the fourth target point B4 along the first direction A1 can be greater than or equal to the minimum distance. The derivation process of the above formula (4) is as follows:

[0102] Since the third angle is γ, after the light from the exposure machine is irradiated to the third target point B3, the angle between the light reflected by the third target point B3 and the supporting surface of the substrate 101 can be γ / 2. Therefore, the triangle DEF can satisfy:

[0103]

[0104] Wherein, t is the thickness of the reflective material layer 104 in the direction perpendicular to the supporting surface of the base substrate 101. In the above formula (5), w31 is the distance along the first direction A1 between the third target point B3 and the reflection point where the light is reflected by the reflective material layer 104 near the bottom surface of the via hole.

[0105] Furthermore, the angle between the light reflected by the portion of the reflective material layer 104 located at the bottom surface of the via hole and the supporting surface of the base substrate 101 is γ / 2. Therefore, the triangle D′E′F can satisfy:

[0106]

[0107] Among them, in the above formula (6), w32 is the distance along the first direction A1 between the reflection point where the light is reflected by the reflective material layer 104 near the bottom surface of the via hole and the fourth target point B4 .

[0108] Therefore, the minimum distance w3 between the third target point B3 and the fourth target point B4 along the first direction A1 can be: That is, the distance w3 between the third target point B3 and the fourth target point B4 along the first direction A1 is greater than or equal to the minimum distance (i.e., satisfies the above formula (4)), which can ensure that the light from the exposure machine will not converge on the photoresist, thereby ensuring the reliability of the signal transmission line 106 in the display panel 10.

[0109] For example, assuming that the third angle γ is 60 degrees and the thickness n of the first insulating layer 103 along the direction perpendicular to the supporting surface of the base substrate 101 is 1.5 μm, the distance w3 between the third target point B3 and the fourth target point B4 along the first direction A1 satisfies:

[0110] For the two aforementioned embodiments, when the thickness n of the first insulating layer 103 along a direction perpendicular to the supporting surface of the base substrate 101 is a fixed value, the distance between the first target point and the second target point along the first direction A1 is necessarily smaller than the distance between the third target point and the fourth target point along the first direction A1. In other words, when both the first and second implementations ensure that the light from the exposure machine does not converge onto the photoresist, the first implementation is more convenient for reducing the size of the via hole than the second implementation, thereby saving space in the via hole design.

[0111] In summary, the embodiments of the present application provide a display panel in which the vias in the first insulating layer are designed to be relatively large. Therefore, when fabricating signal transmission lines, light from an exposure machine, after being reflected by the reflective material layer, does not converge onto the photoresist, thereby preventing overexposure of the photoresist. This ensures the reliability of the signal transmission lines in the display panel and the yield of the display panel.

[0112] Figure 11 Flowchart of a method for manufacturing a display panel provided in an embodiment of the present application. This method can be used to manufacture the display panel provided in the above embodiment. Figure 11 , the method may include:

[0113] Step 201: Provide a base substrate.

[0114] In the embodiment of the present application, when forming a display panel, a base substrate 101 may be obtained first. The base substrate 101 may be a glass substrate.

[0115] Step 202: forming a connection structure layer on one side of the base substrate.

[0116] In the embodiment of the present application, after obtaining the base substrate 101, a connection structure layer 102 may be formed on one side of the base substrate 101. The process of forming the connection structure layer 102 may include: forming a connection structure film layer on one side of the base substrate 101, and then patterning the connection structure film layer to obtain the connection structure layer 102.

[0117] The process of patterning the connection structure film layer includes: coating photoresist on the side of the connection structure film layer away from the base substrate 101; exposing the photoresist using a mask; developing the photoresist; etching the connection structure film layer based on the developed photoresist; and removing the remaining photoresist.

[0118] Step 203: forming a first insulating layer on a side of the connection structure layer away from the base substrate.

[0119] In the embodiment of the present application, after forming the connection structure layer 102, a first insulating layer 103 may be formed on a side of the connection structure layer 102 away from the base substrate 101. The process of forming the first insulating layer 103 may include: forming a first insulating film layer on a side of the connection structure layer 102 away from the base substrate 101, and then patterning the first insulating film layer to obtain the first insulating layer 103.

[0120] The first insulating layer 103 may have a via hole, and the purpose of patterning the first insulating film layer is to form the via hole. The length of the opening of the via hole near the connecting structure layer 102 along the first direction A1 is greater than the length threshold.

[0121] for Figure 7 In the display panel 10 shown, the process of patterning the first insulating film layer may include: coating a photoresist on a side of the first insulating film layer away from the base substrate 101; exposing the photoresist using a half-tone mask; developing the photoresist; etching the first insulating film layer based on the developed photoresist; and removing the remaining photoresist.

[0122] The purpose of using a half-tone mask to expose the photoresist is to make the via hole formed in the first insulating layer 103 have a step-type structure.

[0123] for Figure 3 For the display panel 10 shown, the process of patterning the first insulating film layer may include: coating photoresist on the side of the first insulating film layer away from the base substrate 101, exposing the photoresist using a mask; developing the photoresist; etching the first insulating film layer based on the developed photoresist; and removing the remaining photoresist.

[0124] Step 204 : forming a reflective material layer on a side of the first insulating layer away from the base substrate.

[0125] In the embodiment of the present application, after forming the first insulating layer 103 , a reflective material film layer may be formed on a side of the first insulating layer 103 away from the base substrate 101 , and then the reflective material film layer may be patterned to obtain the reflective material layer 104 .

[0126] The reflective material layer 104 may be connected to the connection structure layer 102 through a via hole in the first insulating layer 103 . In other words, the reflective material layer 104 may be located in the via hole in the first insulating layer 103 .

[0127] The process of patterning the reflective material film layer may include: coating photoresist on the side of the reflective material film layer away from the base substrate 101; exposing the photoresist using a mask; developing the photoresist; etching the reflective material film layer based on the developed photoresist; and removing the remaining photoresist.

[0128] Optionally, the reflective material layer 104 may be made of a metal material. The reflectivity of the reflective material layer 104 may be relatively high, so that the light from the exposure machine will be reflected by the reflective material layer 104 when it is irradiated onto the reflective material layer 104 .

[0129] Step 205 : forming a second insulating layer on a side of the reflective material layer away from the base substrate.

[0130] In the embodiment of the present application, after forming the reflective material layer 104, a second insulating layer 105 can be formed on a side of the reflective material layer 104 away from the base substrate 101. The second insulating layer 105 can entirely cover the base substrate 101, i.e., it is not necessary to perform a patterning process to form the second insulating layer 105. The second insulating layer 105 can be used to insulate the reflective material layer 104 from the subsequently formed signal transmission line 106.

[0131] Step 206: forming a signal transmission line on a side of the second insulating layer away from the base substrate.

[0132] In the embodiment of the present application, after forming the second insulating layer 105, a signal transmission line 106 may be formed on a side of the second insulating layer 105 away from the base substrate 101. The process of forming the signal transmission line 106 may include: forming a signal transmission film layer on a side of the second insulating layer 105 away from the base substrate 101, and then patterning the signal transmission film layer to obtain the signal transmission line 106.

[0133] The process of patterning the signal transmission film layer may include: coating photoresist on the side of the signal transmission film layer away from the base substrate 101; exposing the photoresist using a mask; developing the photoresist; etching the signal transmission film layer based on the developed photoresist; and removing the remaining photoresist.

[0134] The signal transmission line 106 extends along the second direction A2, and the orthographic projection of the signal transmission line 106 on the base substrate 101 at least partially overlaps with the orthographic projection of the via hole on the base substrate 101. The second direction A2 intersects the first direction A1.

[0135] Normally, if the orthographic projection of the signal transmission line 106 on the base substrate 101 at least partially overlaps with the orthographic projection of the via hole of the first insulating layer 103 on the base substrate 101, then when preparing the signal transmission line 106, after the light of the exposure machine is irradiated to the reflective material layer 104, the light reflected by the reflective material layer 104 may converge to the photoresist, resulting in overexposure of the photoresist. However, in the embodiment of the present application, since the length of the opening along the first direction A1 of the side of the via hole close to the connecting structure layer 102 is greater than the length threshold, it is possible that when preparing the signal transmission line 106, after the light of the exposure machine is irradiated to the reflective material layer 104, the light reflected by the reflective material layer 104 will not converge to the photoresist, and will not cause overexposure of the photoresist. Furthermore, the reliability of the formed signal transmission line 106 can be guaranteed, and the yield of the display panel 10 can be ensured.

[0136] Optionally, the material of the signal transmission line 106 may be a transparent metal, for example, the material of the signal transmission line 106 may be ITO.

[0137] In summary, the embodiments of the present application provide a method for fabricating a display panel. Because the vias in the first insulating layer of the fabricated display panel are designed to be larger in size, when fabricating signal transmission lines, light from an exposure machine, after being reflected by the reflective material layer, does not converge onto the photoresist, preventing overexposure of the photoresist. This ensures the reliability of the fabricated signal transmission lines and the yield of the display panel.

[0138] Figure 12 Schematic diagram of a display device provided by an embodiment of the present application. Figure 12 The display device may include: a display panel 10, and a photosensitive element 30 located in a light-transmitting area of ​​a base substrate 101 in the display panel 10. The photosensitive element 30 may be a camera component, which may be used to capture images.

[0139] Optionally, the display device may be an organic light emitting diode display device, a liquid crystal display device, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0140] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; and, a connection structure layer, a first insulating layer, a reflective material layer, a second insulating layer and a signal transmission line, which are located on one side of the base substrate and are stacked in sequence in a direction away from the base substrate; The first insulating layer has a via hole, the reflective material layer is connected to the connection structure layer through the via hole, the length of the opening of the via hole close to the connection structure layer along the first direction is greater than a length threshold, the signal transmission line extends along the second direction, and the orthographic projection of the signal transmission line on the base substrate at least partially overlaps with the orthographic projection of the via hole on the base substrate, and the second direction intersects the first direction; The sidewall of the via hole is a stepped structure, and the orthographic projection of the reflective material layer in the via hole on a reference plane is stepped, and the reference plane is perpendicular to the supporting surface of the substrate; the sidewall of the via hole has a first plane, a second plane, and a third plane connected in sequence, and the first plane is closer to the substrate than the third plane; Wherein, a first angle between the first plane and the supporting surface of the base substrate, and a second angle between the third plane and the supporting surface of the base substrate are both greater than 50 degrees and less than 70 degrees, and the second plane is parallel to the supporting surface of the base substrate; A distance w1 between a first target point of the reflective material layer and a second target point of the reflective material layer along the first direction satisfies: Among them, the first target point is the first inflection point of the reflective material layer in the first plane and the second plane, the first target point is located on the side of the reflective material layer away from the base substrate, the second target point is the second inflection point of the reflective material layer in the third plane and on the side of the first insulating layer away from the base substrate, the second target point is located on the side of the reflective material layer away from the base substrate, the first target point and the second target point are respectively located on both sides of the opening of the via hole close to the base substrate, m is the distance between the second plane and the side of the connecting structure layer close to the reflective material layer, n is the thickness of the first insulating layer along the direction perpendicular to the supporting surface of the base substrate, and α is the first angle.

2. The display panel according to claim 1, wherein: The reflective material layer is made of metal.

3. The display panel according to claim 2, wherein: The reflective material layer is the second source and drain electrode layer of the display panel, and the connection structure layer is the first source and drain electrode layer of the display panel.

4. The display panel according to claim 2, wherein: The reflective material layer is the first source and drain electrode layer of the display panel, and the connection structure layer is the active layer of the display panel.

5. The display panel according to any one of claims 1 to 4, characterized in that: The material of the signal transmission line is indium tin oxide.

6. The display panel according to claim 5, wherein: The base substrate has a light-transmitting area, and at least a portion of the orthographic projection of the signal transmission line on the base substrate is located in the light-transmitting area.

7. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; forming a connection structure layer, a first insulating layer, a reflective material layer, a second insulating layer and a signal transmission line in sequence on one side of the base substrate; The first insulating layer has a via hole, the reflective material layer is connected to the connection structure layer through the via hole, the length of the opening of the via hole close to the connection structure layer along the first direction is greater than a length threshold, the signal transmission line extends along the second direction, and the orthographic projection of the signal transmission line on the base substrate at least partially overlaps with the orthographic projection of the via hole on the base substrate, and the second direction intersects the first direction; The sidewall of the via hole is a stepped structure, and the orthographic projection of the reflective material layer in the via hole on a reference plane is stepped, and the reference plane is perpendicular to the supporting surface of the substrate; the sidewall of the via hole has a first plane, a second plane, and a third plane connected in sequence, and the first plane is closer to the substrate than the third plane; Wherein, a first angle between the first plane and the supporting surface of the base substrate, and a second angle between the third plane and the supporting surface of the base substrate are both greater than 50 degrees and less than 70 degrees, and the second plane is parallel to the supporting surface of the base substrate; A distance w1 between a first target point of the reflective material layer and a second target point of the reflective material layer along the first direction satisfies: Among them, the first target point is the first inflection point of the reflective material layer in the first plane and the second plane, the first target point is located on the side of the reflective material layer away from the base substrate, the second target point is the second inflection point of the reflective material layer in the third plane and on the side of the first insulating layer away from the base substrate, the second target point is located on the side of the reflective material layer away from the base substrate, the first target point and the second target point are respectively located on both sides of the opening of the via hole close to the base substrate, m is the distance between the second plane and the side of the connecting structure layer close to the reflective material layer, n is the thickness of the first insulating layer along the direction perpendicular to the supporting surface of the base substrate, and α is the first angle.

8. The method according to claim 7, characterized in that forming a first insulating layer, comprising: forming a first insulating film layer on a side of the connection structure layer away from the base substrate; coating a photoresist on a side of the first insulating film layer away from the substrate; exposing the photoresist using a half-tone mask; developing the photoresist; etching the first insulating film layer based on the developed photoresist; The remaining photoresist is removed to obtain a first insulating layer.

9. The method according to claim 7, characterized in that Forming a signal transmission line, including: forming a signal transmission film layer on a side of the second insulating layer away from the base substrate; Coating photoresist on a side of the signal transmission film layer away from the substrate; exposing the photoresist using a mask; developing the photoresist; etching the signal transmission film layer based on the developed photoresist; The remaining photoresist is removed to obtain the signal transmission line.

10. A display device, characterized in that: The display device comprises: a display panel according to any one of claims 1 to 6, and a photosensitive element located in a light-transmitting area of ​​a base substrate in the display panel.

11. The display device according to claim 10, wherein: The photosensitive element is a camera component.

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