Substrate conductive bonding structure and display device including substrate conductive bonding structure

Abstract

The present disclosure relates to a substrate conductive bonding structure including a lower substrate including a connection pad exposed to an outside of the lower substrate, an upper substrate including a transfer pad overlapping the connection pad, exposed to an outside of the upper substrate and including an upper surface, and a slit defined in the transfer pad, overlapping the connection pad and opening at the upper surface of the transfer pad, the slit including an extension part extending along a first direction and having a first slit width along a second direction intersecting the first direction, and an expansion part connected to the extension part and having a second slit width along the second direction greater than the first slit width, and a solder contacting the upper surface of the connection pad, extending to the upper surface of the transfer pad and extending into the slit, and a display apparatus including the same.

Description

Technical Field

[0001] The embodiments relate to a substrate conductive bonding structure. More specifically, the embodiments relate to a substrate conductive bonding structure and a display device including the substrate conductive bonding structure. Background Technology

[0002] Display devices display images to present information in a visual form. Display devices are used in various devices such as smartphones. A display device may include at least one of a touch sensing layer for sensing a user's touch and a digitizer for sensing the touch of a stylus as an input device. As display devices have various functions, they may include sensors such as fingerprint sensors, iris recognition sensors, proximity sensors, etc.

[0003] Digital converters can be applied to display devices using various methods such as electromagnetic resonance (“EMR”), pressure-sensitive methods, and capacitive methods. In the EMR method, since positional information is identified through electromagnetic resonance between the stylus and the electrode pattern of the digital converter, and is independent of the user's hand touch, the user can use the display device more comfortably.

[0004] The digitizer and sensor can be disposed behind or below the display panel in the display device. Accordingly, an opening can be provided in a portion of the digitizer, and the sensor can be disposed in the opening. To reconnect the wiring of the digitizer that is disconnected by the opening, the display device may include a printed circuit board disposed on the opening and covering the sensor. The digitizer can be electrically connected to the printed circuit board via solder. Summary of the Invention

[0005] The embodiment provides a substrate conductive bonding structure for a circuit board with improved reliability.

[0006] An embodiment provides a display device including a substrate conductive bonding structure.

[0007] An embodiment of a substrate conductive bonding structure includes: a lower substrate including connecting pads, an upper substrate including transfer pads that partially overlap with the connecting pads, and solder contacting the upper surfaces of the connecting pads and the transfer pads. The transfer pad includes a slot that overlaps with the connecting pads and receives at least a portion of the solder. The slot includes an extension extending along a first direction and an expansion portion connected to the extension and having a width greater than the width of the extension.

[0008] In one embodiment, the extension may have a circular shape.

[0009] In one embodiment, the extension may have a polygonal shape.

[0010] In one embodiment, the slit may include multiple extensions.

[0011] In one embodiment, the extension may be spaced apart from the distal end of the transfer pad.

[0012] In one embodiment, the upper substrate may further include a support substrate disposed below the transfer pad and a lower contact pad disposed below the support substrate.

[0013] In one embodiment, the slit may pass through the transfer pad and the support substrate. The solder may pass through the slit to contact the lower contact pad.

[0014] In one embodiment, the solder can pass through the slit to contact the upper surface of the support substrate.

[0015] An embodiment of the substrate conductive bonding structure includes: a lower substrate including connecting pads, an upper substrate including transfer pads that partially overlap with the connecting pads, and solder contacting the upper surfaces of the connecting pads and the transfer pads. The transfer pads have a tapered shape in a plan view, such that the width of the distal end of the transfer pads is smaller than the width of the connecting pads.

[0016] An embodiment of the display device includes a display panel, a digitizer disposed below the display panel and including an opening, a sensor disposed in the opening, a connection substrate covering the sensor and electrically connected to the digitizer, and solder bonding the digitizer and the connection substrate together. The digitizer includes a first wiring extending along a first direction and a first connection pad electrically connected to the first wiring. The connection substrate includes a first transfer pad, the first transfer pad including a slit overlapping the first connection pad of the digitizer and receiving at least a portion of the solder. The slit includes an extension extending along the first direction and an extension portion connected to the extension and having a width greater than the width of the extension.

[0017] According to an embodiment, when substrates are bonded together to manufacture electronic devices, bonding reliability and alignment reliability can be improved. Attached Figure Description

[0018] The exemplary, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0019] Figure 1 Here is a plan view of an embodiment of the display device.

[0020] Figure 2A For example Figure 1 Rear view of an embodiment of the display device. Figure 2B for Figure 2AA magnified view of region 'C'.

[0021] Figure 3 For along Figure 2A The sectional view taken by line I-I' in the middle.

[0022] Figure 4A For example Figure 2A A magnified plan view of region 'A'.

[0023] Figure 4B For along Figure 4A The sectional view taken from line II-II'.

[0024] Figure 5 For example Figure 4A A magnified plan view of region 'B'.

[0025] Figure 6 For along Figure 5 The sectional view taken from line III-III'.

[0026] Figure 7 and Figure 8 The following is a plan view illustrating an embodiment of misalignment in the combined structure of a display device.

[0027] Figure 9 Here is a plan view of an embodiment of the combined structure of a display device.

[0028] Figure 10 For along Figure 9 A sectional view taken from line IV-IV'.

[0029] Figure 11 Here is a plan view of an embodiment of the combined structure of a display device.

[0030] Figure 12 For along Figure 11 A sectional view taken by line V-V'.

[0031] Figure 13 Here is a plan view of an embodiment of the combined structure of a display device.

[0032] Figure 14 For along Figure 13 A sectional view taken from line VI-VI'.

[0033] Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 Here is a plan view of an embodiment of the combined structure of a display device.

[0034] Figure 20This is a plan view illustrating an embodiment of the alignment marks and first transfer pads on the first circuit board of a display device. Detailed Implementation

[0035] The invention will now be described more fully below with reference to the accompanying drawings, which illustrate various embodiments. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout refer to the same elements.

[0036] It will be understood that when an element is referred to as being related to another element, such as being “on” another element, it can be directly on the other element or there can be an intermediate element between them. In contrast, when an element is referred to as being related to another element, such as being “directly” on another element, there is no intermediate element.

[0037] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or section from another. Therefore, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of this document.

[0038] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “the,” and “at least one” do not indicate a limitation on quantity but are intended to include both singular and plural numbers unless the context clearly indicates otherwise. For example, “an element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms “comprising” or “including,” when used in this specification, expressly indicate the presence of the stated features, areas, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integers, steps, operations, elements, components, and / or groups thereof.

[0039] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” are used herein to describe the relationship between one element and another as shown in the figures. It will be understood that relative terms are intended to cover different orientations of the device beyond those shown in the figures. For example, if the device in one of the figures is flipped, an element described as being “down” to the other element would then be oriented “up” to the other element. The term “down” can therefore cover both “down” and “up” orientations, depending on the specific orientation of the figure. Similarly, if the device in one of the figures is flipped, an element described as being “below” or “under” the other element would then be oriented “above” the other element. The terms “below” or “under” can therefore cover both “up” and “down” orientations.

[0040] As used herein, “about” or “approximately” includes the value and the average of the specific value within an acceptable range of deviations determined by a person skilled in the art considering the measurement under discussion and the errors associated with the measurement of the specific quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations or within ±30%, 20%, 10%, or 5% of the value.

[0041] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant field and in the context of this disclosure, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0042] This document describes embodiments with reference to schematic cross-sectional views illustrating idealized embodiments. Variations in the shape of the figures will be expected, for example, due to manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the areas shown herein, but are intended to include, for example, shape deviations due to manufacturing processes. For example, areas illustrated or described as flat may generally have rough and / or non-linear characteristics. Furthermore, illustrated sharp corners may be rounded. Thus, the areas illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate precise shapes of the areas and are not intended to limit the scope of the claims.

[0043] In the following text, embodiments combining the structure and display device will be explained in detail with reference to the accompanying drawings.

[0044] Figure 1 Here is a plan view of an embodiment of the display device 10.

[0045] See Figure 1The display device 10 may include a display area DA and a non-display area NDA. The display area DA can display an image. The display area DA may have a rectangular shape and have, for example, Figure 1 The corners shown may be rounded or have sharp corners. However, the embodiments are not limited to this. In one embodiment, for example, the display area DA may have various planar shapes, such as circular, elliptical, polygonal, etc.

[0046] The display area DA may include a sensing area SA. The sensing area SA can recognize various information, such as information input to the display device 10 by a user or input tool. In one embodiment, the sensing area SA can recognize a user's fingerprint. Figure 1 As shown, the sensing area SA may have a rectangular shape. However, the embodiments are not limited to this. In one embodiment, for example, the sensing area SA may have various planar shapes such as circular, elliptical, or polygonal shapes.

[0047] The non-display area NDA can be a planar area adjacent to the display area DA that does not display an image. In one embodiment, for example, the non-display area NDA may surround the display area DA. In one embodiment, a driver that provides electrical signals to the display area DA may be disposed in the non-display area NDA.

[0048] Figure 2A For example Figure 1 Rear view of an embodiment of the display device 10. Figure 2B for Figure 2A A magnified view of region 'C'. Figure 3 For along Figure 2A A sectional view taken from line I-I'.

[0049] See Figure 1 , Figure 2A , Figure 2B and Figure 3 The display device 10 may include a display panel 100, a protective window 200, a digital converter 300, a buffer layer 400, a sensor 500, a first circuit board 600, a second circuit board 700, a driving board 800, and a heat dissipation layer 900.

[0050] The display panel 100 can generate and / or display images. The display panel 100 may include driving elements and display elements, both disposed on a substrate.

[0051] In one embodiment, for example, the driving element may include a transistor, a capacitor, wiring, etc.

[0052] The substrate can be a rigid substrate, including glass, or a flexible substrate, including polyimide, etc. In one embodiment, the substrate is a flexible substrate, so that the display panel 100 can be bent, folded, and / or rolled.

[0053] In one embodiment, for example, the display element may include a light-emitting element that generates light. In one embodiment, the light-emitting element may be an organic light-emitting element.

[0054] A protective window 200 may be disposed on the display panel 100. The protective window 200 protects the display panel 100 and allows light emitted from the display panel 100 to be transmitted to the outside of the display device 10. Accordingly, the display device 10 may provide the image generated by the display panel 100 to the outside of the display device 10 through the protective window 200. The protective window 200 may include glass or plastics such as polyimide, polyethylene terephthalate, polyethylene resin, polyester, etc.

[0055] The protective window 200 may overlap with the display panel 100 and may be configured to cover the upper surface of the display panel 100. The protective window 200 may include a black matrix disposed along the edge of the lower surface of the protective window 200. The black matrix may reduce or effectively prevent the identification of components disposed below the protective window 200 through the protective window 200.

[0056] even though Figure 3 Not illustrated, at least one of the input sensing layer and the anti-reflective layer may be disposed between the display panel 100 and the protective window 200. In one embodiment, the input sensing layer and the anti-reflective layer may be configured to cover the upper surface (e.g., the front surface) of the display panel 100. The input sensing layer and the anti-reflective layer may be combined to the display panel 100 and the protective window 200 by means of optically clear adhesive (“OCA”), optically clear resin (“OCR”), etc.

[0057] The digitizer 300 can be disposed below the display panel 100. The digitizer 300 can identify the position information of the input device incident on the upper surface of the display device 10. Therefore, the digitizer 300 can provide input functionality for the display device 10.

[0058] A digitizer 300 may be disposed on the lower surface of the display panel 100. The digitizer 300 can recognize the movement or position of an input device (e.g., a stylus) on the upper surface of the display device 10 and can convert the movement or position into a digital signal.

[0059] The digitizer 300 may include multiple wirings 305 extending along a first direction DR1 and a second direction DR2 intersecting the first direction DR1. A magnetic or electric field emitted from the stylus may have an electromagnetic effect on the wirings 305, and accordingly, the digitizer 300 can detect the position or point of the digitizer 300 closest to the stylus. Furthermore, the wirings 305 may generate a magnetic or electric field by a current input to the wirings 305. The magnetic or electric field emitted from the wirings 305 may have an electromagnetic effect on the stylus, and accordingly, the digitizer 300 and the stylus can communicate with each other to perform various input functions of the display device 10.

[0060] In one embodiment, the wiring 305 may include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. In one embodiment, for example, the wiring 305 may include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), copper (Cu), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), tungsten (W), and tungsten nitride (WN). x Titanium nitride (TiN) x ), Tantalum nitride (TaN) x ), SrRuO x O y ), zinc oxide (ZnO) x Indium tin oxide (“ITO”), tin oxide (SnO) x Indium oxide (InO) x Gallium oxide (GaO) x At least one of zinc indium oxide (“IZO”) and its alloys.

[0061] A first opening OP1 may be defined within a digitizer 300. The inner wall of the digitizer 300 may define the first opening OP1. The first opening OP1 may overlap with or correspond to a sensing area SA (e.g., a sensor opening). Accordingly, in a plan view, the first opening OP1 may be located within a display area DA. Wiring 305 may terminate at the first opening OP1. In one embodiment, the first opening OP1 may be a sensor opening.

[0062] The digital converter 300 may be referred to as the lower substrate or lower plate.

[0063] A buffer layer 400 may be disposed between the display panel 100 and the digitizer 300. The buffer layer 400 can mitigate impacts applied to the display panel 100 from the outside. The buffer layer 400 may include foam or gel. In one embodiment, for example, the buffer layer 400 may include polymer resins such as polyurethane (“PU”), polycarbonate (“PC”), polypropylene (“PP”), polyurethane foam, foam sponge, etc.

[0064] The second opening OP2 may be defined within the buffer layer 400. The inner sidewall of the buffer layer 400 may define the second opening OP2. The second opening OP2 may overlap with or correspond to the first opening OP1. The lower surface of the display panel 100 may be exposed to the outside of the digitizer 300 and the buffer layer 400 through the first opening OP1 and the second opening OP2 aligned with each other.

[0065] Sensor 500 may be disposed in a first opening OP1 and a second opening OP2. Sensor 500 may be exposed to the outside of the digitizer 300 and the buffer layer 400 through the first opening OP1 and the second opening OP2 aligned with each other. In one embodiment, sensor 500 may be a fingerprint recognition sensor using infrared, ultrasonic waves, etc. However, the embodiment is not limited to this. In one embodiment, for example, sensor 500 may be an iris recognition sensor, a proximity sensor, etc.

[0066] In one embodiment, the sensor 500 may be spaced apart from the inner sidewall of the digitizer 300 and / or the inner sidewall of the buffer layer 400 in a direction along the display panel 100. Therefore, the size of the first opening OP1 and the second opening OP2 may be larger than the size of the sensor 500. The size of the first opening OP1 and the second opening OP2 may be defined along a first direction DR1 and / or a second direction DR2, or along a plane defined by the intersecting first direction DR1 and second direction DR2.

[0067] A first circuit board 600 may be disposed below the sensor 500. The first circuit board 600 may contact the lower surface of the digitizer 300 and may cover the sensor 500. The first circuit board 600 may extend across an opening defined together by a first opening OP1 and a second opening OP2. Accordingly, along the same direction, the size of the first circuit board 600 may be larger than the size of the first opening OP1.

[0068] The first circuit board 600 can electrically connect the disconnected portions of the wiring 305 in the digital converter 300 to each other. The first circuit board 600 may be referred to as a connection board, a connecting plate, an upper board, or a capacitor board. The first circuit board 600 will be described in detail below.

[0069] The driver substrate 800 can be electrically connected to the display panel 100. A driver chip for driving the display panel 100 can be mounted on the driver substrate 800. The driver chip can provide electrical signals such as drive signals or control signals to the display panel 100.

[0070] The second circuit board 700 can electrically connect the sensor 500 and the drive board 800 to each other. The second circuit board 700 can extend from one side of the sensor 500 to connect to the drive board 800. The second circuit board 700 can transmit electrical signals, such as sensing signals, generated by the sensor 500 to the drive board 800.

[0071] In one embodiment, the first circuit board 600 and the second circuit board 700 may be flexible printed circuit boards.

[0072] A heat dissipation layer 900 may be disposed below the digitizer 300. The heat dissipation layer 900 can dissipate heat generated from the display panel 100. The heat dissipation layer 900 may include metals such as copper (Cu) and aluminum (Al), graphite, carbon nanotubes, heat pipes, etc.

[0073] Figure 4A For example Figure 2A A magnified plan view of region 'A'. Figure 4B For along Figure 4A The sectional view taken from line II-II'.

[0074] See Figure 4A and Figure 4B In the multiple wirings 305, the digital converter 300 may include multiple first wirings extending along a first direction DR1 and multiple second wirings extending along a second direction DR2. The first wirings may include a first portion 310a and a second portion 310b spaced apart from each other through a first opening OP1. The second wirings may include a first portion 320a and a second portion 320b spaced apart from each other through the first opening OP1.

[0075] The first circuit board 600 can electrically connect the first portion 310a and the second portion 310b of the first wiring to each other. Furthermore, the first circuit board 600 can electrically connect the first portion 320a and the second portion 320b of the second wiring to each other.

[0076] In one embodiment, the digitizer 300 may include a plurality of first connection pads 330a and 330b adjacent to the first opening OP1 and electrically connected to the first wiring. In one embodiment, the first wiring may define the first connection pads 330a and 330b. Furthermore, the digitizer 300 may include a plurality of second connection pads 340a and 340b adjacent to the first opening OP1 and electrically connected to the second wiring. In one embodiment, the second wiring may define the second connection pads 340a and 340b. The digitizer 300 includes: a plurality of first inner sidewalls provided and extending along a first direction DR1 at the first opening OP1 to define a first side of the first opening OP1; and a plurality of second inner sidewalls provided and extending along a second direction DR2 at the first opening OP1 to define a second side of the first opening OP1.

[0077] In one embodiment, for example, the connection pads 330a, 330b, 340a and 340b may comprise the same material as the first wiring and the second wiring.

[0078] In one embodiment, first connection pads 330a and 330b may be arranged along a second direction DR2, and second connection pads 340a and 340b may be arranged along a first direction DR1. In one embodiment, for example, the first connection pads 330a and 330b may be arranged spaced apart from each other along a first side of a first opening OP1, and the second connection pads 340a and 340b may be arranged spaced apart from each other along a second side of the first opening OP1. In one embodiment, the second side may be perpendicular to the first side, but is not limited thereto.

[0079] The first connection pads 330a and 330b and the second connection pads 340a and 340b may be referred to as the first digital converter pads and the second digital converter pads, or as the first lower connection pads and the second lower connection pads, respectively.

[0080] In one embodiment, the first circuit board 600 may include a first connection wiring 630 and a second connection wiring 640. In one embodiment, the first connection wiring 630 may extend along a first direction DR1, and the second connection wiring 640 may extend along a second direction DR2 to intersect the first connection wiring 630. The first connection wiring 630 may be electrically connected to a first wiring of the digitizer 300, and the second connection wiring 640 may be electrically connected to a second wiring of the digitizer 300.

[0081] In one embodiment, the first circuit board 600 may include first transfer pads 610a and 610b respectively connected to the opposite ends of the first connection wiring 630, and second transfer pads 620a and 620b respectively connected to the opposite ends of the second connection wiring 640. The first transfer pads 610a and 610b and the second transfer pads 620a and 620b may be referred to as first connection board pads and second connection board pads, or as first upper connection pads and second upper connection pads, respectively.

[0082] The first circuit board 600 may further include a support substrate 602, a first protective layer 660, a second protective layer 670, an electromagnetic shielding layer 680, and a third protective layer 690. A first connection wiring 630 may be exposed outside the first circuit board 600 to define first transfer pads 610a and 610b. A second connection wiring 640 may be exposed outside the first circuit board 600 to define second transfer pads 620a and 620b.

[0083] In one embodiment, first transfer pads 610a and 610b, second transfer pads 620a and 620b, and a first connection wiring 630 may be disposed on the upper surface 602a of the support substrate 602. A second connection wiring 640 may be disposed on the lower surface 602b of the support substrate 602 and may be electrically connected to the second transfer pads 620a and 620b via conductive vias passing through the thickness of the support substrate 602. The lower surface 602b of the support substrate may be opposite to the upper surface 602a of the support substrate.

[0084] In one embodiment, the first circuit board 600 may further include lower contact pads 612 and 622 disposed on the lower surface 602b of the support substrate 602. The lower contact pads 612 and 622 can be electrically connected to transfer pads 610a, 610b, 620a, and 620b or connection wiring via conductive vias passing through the thickness of the support substrate 602. That is, the transfer pads 610a, 610b, 620a, and 620b or connection wiring may be exposed outside the first circuit board 600 to define the lower contact pads 612 and 622. The lower contact pads 612 and 622 may electrically contact the connection pads 330a, 330b, 340a, and 340b of the digitizer 300 or the conductive solder that bonds the first circuit board 600 to the digitizer 300, thereby increasing the electrical path and improving the reliability of the electrical connection between the first circuit board 600 and the digitizer 300.

[0085] Transfer pads 610a, 610b, 620a, and 620b, as well as lower contact pads 612 and 622, may be exposed on the exterior of the first circuit board 600 on the opposite side of the first circuit board 600. Figure 4BFor example, the upper surface and outer sidewall of each of transfer pads 610a, 610b, 620a, and 620b are exposed to the outside of the first circuit board 600. Additionally, the lower surface and outer sidewall of each of lower contact pads 612 and 622 are exposed to the outside of the first circuit board 600. The first connection wiring 630, the second connection wiring 640, the transfer pads 610a, 610b, 620a, and 620b, and the lower contact pads 612 and 622 may include conductive material.

[0086] The first protective layer 660 can cover the upper surface 602a of the support substrate 602 and the first connection wiring 630. The second protective layer 670 can cover the lower surface 602b of the support substrate 602 and the second connection wiring 640.

[0087] An electromagnetic shielding layer 680 may be disposed on the first protective layer 660. The electromagnetic shielding layer 680 can block electrical or magnetic interference to the sensor 500 or the first circuit board 600. A third protective layer 690 may cover the electromagnetic shielding layer 680. Along a third direction (e.g., along each of the first direction DR1 and the second direction DR2) intersecting... Figure 4B (Vertical direction in the middle), the third protective layer 690, the electromagnetic shielding layer 680, the first protective layer 660, the support substrate 602 and the second protective layer 670 may be arranged in sequence in the direction toward the digital converter 300 and / or the sensor 500, but are not limited thereto.

[0088] The embodiments are not limited to the configurations illustrated above. In one embodiment, for example, the electromagnetic shielding layer 680 may be disposed on the second protective layer 670 according to the position of the sensor 500, and the third protective layer 690 may be disposed below the electromagnetic shielding layer 680.

[0089] The support substrate 602 and the first protective layer 660, the second protective layer 670, and the third protective layer 690 may all comprise polymer materials. In one embodiment, for example, the support substrate 602 and the first protective layer 660, the second protective layer 670, and the third protective layer 690 may all comprise polyimide, polyamide, polyolefin, polycarbonate, polyethylene terephthalate, or combinations thereof.

[0090] The first transfer pads 610a and 610b of the first circuit board 600 can be electrically connected to the first connection pads 330a and 330b of the digital converter 300, respectively. The second transfer pads 620a and 620b of the first circuit board 600 can be electrically connected to the second connection pads 340a and 340b of the digital converter 300, respectively.

[0091] See Figure 4AFor example, first transfer pads 610a and 610b may be arranged along a second direction DR2 along a first side of a first opening OP1, respectively, to overlap with or face the first connection pads 330a and 330b corresponding to the first transfer pads 610a and 610b, respectively. Second transfer pads 620a and 620b may be arranged along a first direction DR1 along a second side of a first opening OP1, respectively, to overlap with or face the second connection pads 340a and 340b corresponding to the second transfer pads 620a and 620b, respectively. The first transfer pads 610a and 610b and the second transfer pads 620a and 620b may be electrically connected to the first connection pads 330a and 330b and the second connection pads 340a and 340b via solder SL (e.g., solder pattern).

[0092] Solder SL can electrically connect and bond transfer pads 610a, 610b, 620a, and 620b to connection pads 330a, 330b, 340a, and 340b, respectively. The substrate conductive bonding structure may include: a lower substrate including an end and a connection pad, the connection pad being exposed outside the lower substrate at an end and including an upper surface; an upper substrate including an end overlapping the end of the lower substrate, a transfer pad, and a slot defined in the transfer pad, the transfer pad overlapping the connection pad of the lower substrate, being exposed outside the upper substrate at an end and including an upper surface furthest from the lower substrate; and solder SL, contacting the upper surface of the connection pad, extending to the upper surface of the transfer pad, and extending to the slot 616 defined in the transfer pad (e.g., see...). Figure 9 In one embodiment, the substrate conductive bonding structure may include: a first solder that contacts a first connection pad 330a of the digital converter 300, extends to a first transfer pad 610a of the bonding substrate, and extends into a slit 616 defined in the first transfer pad 610a to bond the digital converter 300 to the bonding substrate; and a second solder that contacts a second connection pad 340a of the digital converter 300, and extends to a second transfer pad 620a of the bonding substrate to bond the digital converter 300 to the bonding substrate.

[0093] even though Figure 4AExamples show first transfer pads 610a and 610b and second transfer pads 620a and 620b arranged along different sides of the first opening OP1, but the embodiment is not limited to this. In one embodiment, for example, the first transfer pads 610a and 610b and the second transfer pads 620a and 620b of the first circuit board 600 may be arranged on the same side of the first circuit board 600. In this case, the first connection pads 330a and 330b and the second connection pads 340a and 340b of the digitizer 300 may be arranged on the same side of the digitizer 300, with the first transfer pads 610a and 610b and the second transfer pads 620a and 620b arranged along that same side. Therefore, the first portion 320a and the second portion 320b of the second wiring of the digital converter 300 and the second connection wiring 640 of the first circuit board 600 can be bent or folded to connect to the transfer pads 610a, 610b, 620a and 620b, which are all on the same side of each other, and the connection pads 330a, 330b, 340a and 340b.

[0094] The first circuit board 600 may further include alignment marks AM adjacent to transfer pads 610a, 610b, 620a, and 620b. During the combination of the first circuit board 600 and the digitizer 300, the alignment marks AM can be used to identify and adjust the position of the digitizer 300 relative to the first circuit board 600 or the position of the first circuit board 600 relative to the digitizer 300.

[0095] The following section will explain in detail the substrate conductive bonding structure that can improve bonding and alignment reliability by using solder SL to bond the connection pads and transfer pads.

[0096] Figure 5 For example Figure 4A An enlarged plan view of an embodiment of region 'B'. Figure 6 For along Figure 5 The sectional view taken from line III-III'. Figure 7 and Figure 8 This is a plan view illustrating an embodiment of the misaligned joint structure of the display device 10.

[0097] See Figure 5 and Figure 6A first transfer pad 610a of the first circuit board 600 is disposed on a first connection pad 330a of the digitizer 300. The first transfer pad 610a may partially overlap with the first connection pad 330a. When overlapping, the first transfer pad 610a may face the first connection pad 330a along the thickness direction (e.g., a third direction). A similar configuration can be understood, wherein the first transfer pad 610b, the second transfer pad 620a, and the second transfer pad 620b of the first circuit board 600 are disposed on (or face) the first connection pad 330b, the second connection pad 340a, and the second connection pad 340b of the digitizer 300, respectively.

[0098] Solder SL is disposed on the upper surfaces of the first transfer pad 610a and the first connection pad 330a. Solder SL extends along the outer sidewall of the first circuit board 600 from the upper surface of the first transfer pad 610a to the upper surface of the first connection pad 330a. Solder SL contacts each of the outer sidewalls of the first transfer pad 610a and the lower contact pad 612 exposed outside the first circuit board 600. Therefore, the first transfer pad 610a can be electrically connected to the first connection pad 330a through the contact between the lower contact pad 612 and the first connection pad 330a, and further through the solder SL in contact with it. Upon contact, the components can form an interface between them.

[0099] In one embodiment, the solder SL may be provided or formed by a spray soldering method. In one embodiment of the method of providing the display device 10, the digitizer 300 and the first circuit board 600 are configured to face each other and partially overlap each other. Molten solder is provided on the exposed upper surfaces of the first transfer pad 610a and the first connection pad 330a. The solder SL may comprise a metal having a relatively low melting point. In one embodiment, for example, the solder SL may comprise copper, tin, gold, silver, lead, nickel, or a combination thereof. However, the embodiments are not limited thereto, and the solder SL may comprise a variety of soldering materials known in the art.

[0100] like Figure 6 As shown, for example, after the solder ball SB (e.g., pre-solder) is placed at the outlet of the capillary CP, the laser ( Figure 6 A laser (in the image) can be irradiated onto the solder ball SB to melt it. Subsequently, nitrogen gas (...) Figure 6 A pressurized gas (N2) can be applied to the molten solder ball SB, thereby applying force to move the molten solder ball SB from the capillary CP to the first transfer pad 610a and the first connection pad 330a. The solder ball SB can be repeatedly supplied as needed.

[0101] The first connection pad 330a may be disposed on the support structure 302 and exposed to the outside of the digital converter 300. The support structure 302 may have a multi-layer structure, including an insulating layer for insulating the electrodes of the digital converter 300, a protective layer for protecting the electrodes, an adhesive layer, etc.

[0102] The lower contact pad 612 may be disposed below the support substrate 602. The lower contact pad 612 may overlap with the first transfer pad 610a in a plan view. The lower contact pad 612 may have a planar shape substantially the same as or different from the first transfer pad 610a. A similar structure may be applied to the lower contact pad 622.

[0103] The lower contact pad 612 of the first circuit board 600 can contact the first connection pad 330a of the digital converter 300. The lower contact pad 612 can be electrically connected to the first transfer pad 610a through conductive vias provided or formed through the support substrate 602. Therefore, the resistance of the bonding structure can be reduced and the contact area of ​​the bonding structure can be increased. Therefore, the connection reliability of the bonding structure can be improved.

[0104] See Figure 5 The first transfer pad 610a of the first circuit board 600 and the first connection pad 330a of the digitizer 300 may have a larger dimension (e.g., length) along a first direction and a smaller dimension (e.g., width) along a second direction DR2. In one embodiment, the first transfer pad 610a may have a planar shape with a tapered width along the first direction DR1. In one embodiment, for example, the first width Wa of the first transfer pad 610a adjacent to the first end of the first connection pad 330a may be smaller than the second width Wb of the second end opposite to the first end and furthest from the first connection pad 330a. In one embodiment, the first width Wa of the first end of the first transfer pad 610a may be smaller than the third width Wp of the first connection pad 330a.

[0105] A first circuit board 600 combined with the digital converter 300 may define a misalignment between the first circuit board 600 and the digital converter 300. In one embodiment, for example, the first circuit board 600 and / or the digital converter 300 may be offset from an alignment position along a first direction DR1 or along a second direction DR2. Furthermore, the side of the first circuit board 600 that is not parallel to one side of the digital converter 300 may be misaligned due to tilting.

[0106] According to one embodiment, the first transfer pad 610a has a tapered planar shape. Therefore, even when the first circuit board 600 or the digital converter 300 respectively... Figure 7 and Figure 8As shown, when offset or tilted in the horizontal direction (e.g., along the second direction DR2), the first transfer pad 610a and the first connection pad 330a can overlap within a certain range. Therefore, the overlapping planar area of ​​the first transfer pad 610a and the first connection pad 330a can be within a certain range to provide a reliable electrical connection therebetween.

[0107] Within the first circuit board 600, the lower contact pad 612 may have a rectangular planar shape, or it may have a tapered planar shape similar to the first transfer pad 610a.

[0108] Figure 9 Here is a plan view of an embodiment of the combined structure of the display device 10. Figure 10 For along Figure 9 A sectional view taken from line IV-IV'.

[0109] See Figure 9 and Figure 10 The first transfer pad 610a of the first circuit board 600 is configured to face the first connection pad 330a of the digital converter 300. The first transfer pad 610a may partially overlap with the first connection pad 330a. Solder SL is disposed on the upper surfaces of the first transfer pad 610a and the first connection pad 330a. Therefore, the first transfer pad 610a is electrically connected to the first connection pad 330a.

[0110] In one embodiment, the first circuit board 600 may include slits 616 extending through each layer of the first circuit board 600, providing or defining openings in the first circuit board 600. The slits 616 may open at an outer sidewall of the first circuit board 600 to the outside of the first circuit board 600. The slits 616 may open at the upper surface of a corresponding transfer pad. In one embodiment, the slit 616, opening at the upper surface of a transfer pad (e.g., the first transfer pad 610a), passes through the transfer pad and the support substrate 602, exposing the lower contact pad 612 to the outside of the upper substrate (e.g., the first circuit board 600).

[0111] In one embodiment, for example, the slit 616 may sequentially include an extension 616a extending from the end of the first circuit board 600 (i.e., toward the first opening OP1) from the outer sidewall along a first direction DR1 (e.g., along the length of the first transfer pad 610a) and an extension 616b connected to the extension 616a. Each of the extension 616a and the extension 616b has a length along the first direction DR1 and a width along a second direction DR2. The slit 616 may have a second slit width W2 at the extension 616b that is greater than the first slit width W1 at the extension 616a.

[0112] In one embodiment, for example, an extension 616a may extend from the distal end of the first transfer pad 610a and may open at the distal end. An inner end of the extension 616a, opposite to the outer end at the distal end of the first transfer pad 610a, may be connected to an extension 616b to provide a slit 616 as a single opening in each layer of the first circuit board 600.

[0113] In one embodiment, the slit 616 may extend through the entire thickness of the first circuit board 600 along its thickness direction. Furthermore, solder SL may extend from the upper surface of the first circuit board 600 into the slit 616. The upper surface of the first connection pad 330a may be exposed to the outside of the first circuit board 600 at the slit 616. Therefore, the solder SL can contact the upper surface of the first connection pad 330a through the slit 616.

[0114] In one embodiment, for example, the extension 616b may have a circular shape in a planar view. However, the embodiments are not limited thereto. In one embodiment, for example, the extension 616b may have various planar shapes, including elliptical shapes, or polygonal shapes including triangular shapes, rectangular shapes, rhomboid shapes, etc.

[0115] In one embodiment, since the upper surface of the first connecting pad 330a is further exposed to the outside of the first circuit board 600 at the slit 616, the contact area between the solder SL and the first connecting pad 330a can be increased. Furthermore, since the slit 616 includes an extension 616b having a width greater than that of the extension 616a, the contact area between the solder SL and the first connecting pad 330a can be further increased. Therefore, the bonding reliability between the first connecting pad 330a and the first transfer pad 610a can be increased, and resistance can be reduced. Moreover, since the volume or space for receiving the solder SL is increased through the slit 616, the maximum height of the solder SL can be reduced. Therefore, the overall thickness of the display device 10 including the bonding structure can be reduced, and electrical short circuits between the solder SL and another conductive component can be prevented or reduced.

[0116] Figure 11 Here is a plan view of an embodiment of the combined structure of the display device 10. Figure 12 For along Figure 11 A sectional view taken by line V-V'. Figure 13 Here is a plan view of an embodiment of the combined structure of the display device 10. Figure 14 For along Figure 13 A sectional view taken from line VI-VI'.

[0117] See Figure 11 and Figure 12The first transfer pad 610a of the first circuit board 600 is configured to face the first connection pad 330a of the digital converter 300. The first transfer pad 610a may partially overlap with the first connection pad 330a. Solder SL is disposed on the upper surface of the first transfer pad 610a and extends to the upper surface of the first connection pad 330a at the outer sidewall of the first circuit board 600. Therefore, the first transfer pad 610a is electrically connected to the first connection pad 330a.

[0118] In one embodiment, the first transfer pad 610a may include a slit 616 that provides or defines an opening in the first circuit board 600. In one embodiment, for example, the slit 616 may include an extension 616a extending along a first direction DR1 and an extension 616b connected to the extension 616a and having a second slit width W2 greater than the first slit width W1 of the extension 616a.

[0119] In one embodiment, the slit 616 may extend only through the first transfer pad 610a to expose the upper surface of the support substrate 602 disposed below the first transfer pad 610a. Therefore, solder SL may extend into the slit 616 and contact the upper surface of the support substrate 602 exposed to the outside of the first circuit board 600 through the slit 616. At the slit 616, the solder SL may contact the inner sidewall of the defining opening of the first transfer pad 610a to provide increased electrical contact with the first circuit board 600.

[0120] See Figure 13 and Figure 14 The first circuit board 600 includes a slit 616 that passes through at least a first transfer pad 610a and receives at least a portion of solder SL. In one embodiment, the slit 616 may extend through the thickness of both the first transfer pad 610a and the support substrate 602 disposed below the first transfer pad 610a, to expose the upper surface of the lower contact pad 612 disposed below the support substrate 602 to the outside of the first circuit board 600. The solder SL extending into the slit 616 contacts the lower contact pad 612 exposed to the outside of the upper substrate (e.g., the first circuit board 600) through the slit 616. Thus, the solder SL may contact the upper surface of the lower contact pad 612 exposed to the outside of the first circuit board 600 at the slit 616. At the slit 616, the solder SL may contact the inner sidewalls defining the openings of both the first transfer pad 610a and the support substrate 602 to provide increased electrical contact with the first circuit board 600.

[0121] See Figure 15The first circuit board 600 (e.g., an upper substrate) includes a slit 616 that passes through at least a first transfer pad 610a and receives at least a portion of solder SL. The slit 616 may include an extension 616a extending along a first direction DR1 and an extension 616b connected to the extension 616a and having a second slit width W2 greater than the first slit width W1 of the extension 616a. In one embodiment, the first transfer pad 610a may include a distal end furthest from the first opening OP1, and the extension 616a may be spaced apart from the distal end of the first transfer pad 610a. The slit 616 may close at the distal end of the first transfer pad 610a. In one embodiment, the transfer pad includes a distal end closest to the end of the upper substrate, and the extension 616a is spaced apart from the distal end of the transfer pad.

[0122] See Figure 16 The first circuit board 600 includes a slit 616 that passes through at least a first transfer pad 610a and receives at least a portion of solder SL. The slit 616 may include an extension 616a extending along a first direction DR1 and an extension 616b connected to the extension 616a and having a second slit width W2 greater than the first slit width W1 of the extension 616a. In one embodiment, the extension 616b may have a rectangular planar shape.

[0123] See Figure 17 The first circuit board 600 includes a slit 616 that passes through at least a first transfer pad 610a and receives at least a portion of solder SL. The slit 616 may include an extension 616a extending along a first direction DR1 and a plurality of extensions 616b' and 616b', each connected to the extension 616a and having a second slit width W2 greater than the first slit width W1 of the extension 616a. The plurality of extensions 616b' and 616b', each having a second slit width W2, may be arranged along the length of the slit 616, i.e., along the first direction DR1. In other words, the slit 616 includes a plurality of extensions, which include a plurality of extensions 616b' and 616b arranged along the first direction DR1.

[0124] See Figure 18 The first circuit board 600 includes a slit 616 that passes through at least a first transfer pad 610a and receives at least a portion of solder SL. The slit 616 may extend along a first direction DR1 and may have a width such as that consistent with a first slit width W1. The first slit width W1 may be positioned along the entire slit 616.

[0125] As explained in the above embodiments, the slit 616 for receiving solder can have various shapes.

[0126] In one embodiment, the slit structure may be applied to a first transfer pad 610a of the first circuit board 600. However, the embodiment is not limited thereto. In one embodiment, for example, the slit structure may be applied to a second transfer pad 620a or to both the first transfer pad 610a and the second transfer pad 620a.

[0127] In the following text, reference will be made to Figure 19 and Figure 20 Explain the pad design used to reduce or prevent bonding failures caused by misalignment between the first circuit board 600 and the digital converter 300.

[0128] In one embodiment, the width of the first transfer pad 610a of the first circuit board 600 and the width of the first connection pad 330a of the digital converter 300 can satisfy the following inequality.

[0129] Wc≤[P-(Tt-Ta)] / 2

[0130] Wd≥[P+(Tt-Ta)] / 2

[0131] In the above inequalities, Wc is the width of the transfer pad 610a, Wd is the width of the connection pad 330a, P is the pad pitch (e.g., pad pitch), Ta is the alignment tolerance (e.g., alignment tolerance), and Tt is equal to (Ta 2 +Tb 2 +Tc 2 ) 1 / 2 The total difference, where Tb is the difference caused by pad manufacturing (e.g., pad machining tolerance) and Tc is the difference caused by cutting (e.g., alignment mark tolerance).

[0132] The alignment tolerance Ta can be the maximum permissible difference along the second direction DR2 during the alignment process. The alignment tolerance Ta can vary depending on the alignment device, alignment conditions, etc. The difference Tb caused by pad manufacturing can be the maximum difference between the designed width of the pad and the actual width of the manufactured pad. The difference Tc caused by cutting can be the maximum difference between the designed distance and the actual distance between the alignment mark AM and the outer end (e.g., the cutting line) of the first circuit board 600.

[0133] For example, when the pitch P is 480 micrometers (μm), when the pitch P is the same as the sum of the width Wd of the first connecting pad 330a and the width Wc of the first transfer pad 610a (P = Wd + Wc), and when the difference Tb caused by pad manufacturing is 0, the width Wc of the first transfer pad can be equal to or less than about 214 μm, and the width Wd of the first connecting pad can be equal to or greater than about 266 μm, so that the alignment tolerance Ta can be about 70 μm and the difference Tc caused by cutting can be about 100 μm.

[0134] According to one embodiment, pads can be designed to reduce or effectively prevent bonding failures, taking into account misalignment factors such as alignment tolerance difference Ta, difference Tb caused by pad manufacturing, and difference Tc caused by cutting.

[0135] In one embodiment, the above pad design can be applied to the first transfer pad 610a of the first circuit board 600 and the first connection pad 330a of the digitizer 300. However, the embodiment is not limited thereto. In one embodiment, for example, the pad design can be applied to the second transfer pad 620a of the first circuit board 600 and the second connection pad 340a of the digitizer 300. Furthermore, the pad design can be applied to one or more of the first transfer pad 610a, first transfer pad 610b, second transfer pad 620a, second transfer pad 620b, first connection pad 330a, first connection pad 330b, second connection pad 340a, and second connection pad 340b, respectively.

[0136] In addition, pad design can be applied to, for example Figure 5 The diagram shows a transfer pad with a tapered shape. The pad design may include a width that increases in the direction away from the distal end to define the tapered shape of the transfer pad in a plan view. In this case, the transfer pad width Wc in the inequality may be the first width Wa at the distal end of the transfer pad.

[0137] See Figure 19 and Figure 20 In one embodiment, the inner end of the slit 616, which is furthest from the outer end of the first circuit board 600, may have a sharp corner. However, the embodiments are not limited to this. In one embodiment, for example, the inner end of the slit 616 may have a rounded shape, such as a semi-circular shape or an arc shape, or it may have a rounded corner or a chamfer.

[0138] As explained above, one or more embodiments of the bonding structure can be used to connect the digital converter 300 to the circuit board. However, the embodiments are not limited to this and may include various bonding structures formed by spray soldering for connecting various components of the display device 10 to each other.

[0139] The embodiments are not limited to the display device 10 that includes an organic light-emitting display panel. In one embodiment, for example, the embodiment may include various display devices, such as inorganic electroluminescent display panels, micro light-emitting diode (“LED”) display panels, etc.

[0140] The embodiments can be used to form a combination structure for various electronic devices including the display device 10.

[0141] The foregoing is illustrative of embodiments and should not be construed as limiting them. Although embodiments have been described, those skilled in the art will readily understand that many modifications may be made to the embodiments without substantially departing from the novel teachings and aspects of the invention. Accordingly, all such modifications are intended to be included within the scope of the invention. Therefore, it should be understood that the foregoing is illustrative of various embodiments and should not be construed as limiting to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the invention as set forth in the appended claims and their equivalents.

Claims

1. A substrate conductive bonding structure, comprising: A lower substrate including an end and a connecting pad, the connecting pad being exposed to the outside of the lower substrate at the said end and including an upper surface; Upper substrate, including: The end that overlaps with the end of the lower substrate. A transfer pad, which overlaps with the connection pad of the lower substrate, is exposed outside the upper substrate at the end of the upper substrate, and includes the upper surface furthest from the lower substrate. A slit, defined within the transfer pad, overlapping the connection pad of the lower substrate, and opening at the upper surface of the transfer pad, the slit sequentially comprising from the end of the upper substrate: An extension, which extends along a first direction and has a first slit width along a second direction intersecting the first direction; and An extension portion, connected to the extension portion, and having a second slit width along the second direction that is greater than the first slit width of the extension portion; and The solder contacts the upper surface of the connecting pad, extends to the upper surface of the transfer pad, and extends into the slit defined in the transfer pad.

2. The substrate conductive bonding structure according to claim 1, wherein the extension portion of the slit has a circular shape.

3. The substrate conductive bonding structure according to claim 1, wherein the extension portion of the slit has a polygonal shape.

4. The substrate conductive bonding structure according to claim 1, wherein the extension is provided in a plurality of portions, including a plurality of extensions arranged along the first direction.

5. The substrate conductive bonding structure according to claim 1, wherein... The transfer pad includes the distal end closest to the end of the upper substrate, and The extension is spaced apart from the distal end of the transfer pad.

6. The substrate conductive bonding structure according to claim 1, wherein the upper substrate comprises, in sequence toward the lower substrate: The transfer pad; Support substrate; and The lower contact pad is connected to the transfer pad and exposed to the outside of the upper substrate at the end of the upper substrate.

7. The substrate conductive bonding structure according to claim 6, wherein... Within the upper substrate, the slit opening at the upper surface of the transfer pad passes through the transfer pad and the support substrate, exposing the lower contact pad to the outside of the upper substrate. The solder contact extending into the slit is exposed to the lower contact pad outside the upper substrate through the slit.

8. The substrate conductive bonding structure according to claim 6, wherein... Within the upper substrate, the slit opening at the upper surface of the transfer pad exposes the upper surface of the support substrate to the outside of the upper substrate, and The solder contact extending into the slit is exposed to the upper surface of the support substrate outside the upper substrate through the slit.

9. A display device, comprising: Display panel; The digital converter facing the display panel includes: The first wiring extending along the first direction, The inner wall defining the sensor opening in the digital converter; and A first connection pad defined by the first wiring is exposed to the outside of the digital converter at the inner sidewall; The sensor is located in the sensor opening; A connecting substrate, facing the display panel with both the digitizer and the sensor located between the display panel and the connecting substrate, the connecting substrate covering the sensor in the sensor opening and electrically connected to the digitizer, the connecting substrate comprising: A first transfer pad, which is exposed on the outside of the connection substrate and connected to the digital converter at the first connection pad, and A slit, defined within the first transfer pad, overlapping the first connection pad of the digital converter and opening in a direction away from the digital converter, the slit opening toward the sensor sequentially comprising: An extension that extends along the first direction and has a first slit width along a second direction intersecting the first direction; and An extension portion, connected to the extension portion, and having a second slit width along the second direction that is greater than the first slit width of the extension portion; and A first solder contacts the first connection pad of the digital converter, extends to the first transfer pad of the connection substrate, and extends into the slit defined in the first transfer pad to bond the digital converter to the connection substrate.

10. The display device of claim 9, wherein the extension of the slit defined in the first transfer pad of the connecting substrate has a circular shape.

11. The display device of claim 9, wherein the extension of the slit defined in the first transfer pad of the connecting substrate has a polygonal shape.

12. The display device of claim 9, wherein the extension is provided in a plurality of portions, including a plurality of extensions arranged along the first direction.

13. The display device according to claim 9, wherein The first transfer pad of the connecting substrate includes the farthest end from the sensor opening, and The extension of the slit defined in the first transfer pad of the connecting substrate is spaced apart from the distal end of the first transfer pad.

14. The display device according to claim 9, wherein the connecting substrate comprises, in sequence toward the digital converter: The first transfer pad; Support substrate; and The lower contact pad is connected to the first transfer pad and exposed to the outside of the connection substrate.

15. The display device according to claim 14, wherein Within the connection substrate, the slit passes through the first transfer pad and the support substrate, exposing the lower contact pad to the outside of the connection substrate. The first solder contact extending into the slit is exposed to the lower contact pad outside the connection substrate.

16. The display device according to claim 14, wherein Within the connecting substrate, the slit exposes the upper surface of the supporting substrate to the outside of the connecting substrate, and The first solder contact extending into the slit is exposed on the upper surface of the support substrate outside the connecting substrate.

17. The display device according to claim 9, wherein The digital converter further includes: The second wiring extending along the second direction, and A second connection pad defined by the second wiring, the second connection pad being exposed to the outside of the digital converter at the inner sidewall of the digital converter. The connection substrate further includes a second transfer pad, which is exposed on the outside of the connection substrate and connected to the digital converter at the second connection pad. The display device further includes a second solder that contacts the second connection pad of the digital converter and extends to the second transfer pad of the connection substrate to bond the digital converter to the connection substrate.

18. The display device according to claim 17, wherein within the connecting substrate: The first transfer pads are provided in multiple forms, including multiple first transfer pads arranged along the second direction, and The second transfer pad is provided in multiple forms, including multiple second transfer pads arranged along the first direction.

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