An encapsulated antenna system with integrated filtering function and a communication device

Abstract

An encapsulated antenna system with integrated filtering function and a communication device, comprising: a radio frequency chip, a power splitter network connected to the radio frequency chip, a plurality of radio frequency channels connected to the power splitter network, and a phased antenna array connected to the plurality of radio frequency channels; the phased antenna array includes a plurality of antenna units, and some or all of the antenna units in the antenna units include a filtering antenna structure, and the filtering antenna structure is used for band filtering, and the band includes a millimeter wave band. In the encapsulated antenna system provided in this application, a filtering antenna structure for band filtering function is integrated in the phased antenna array, so that the antenna unit has a filtering function. Therefore, the radio frequency channels coupled to the antenna unit no longer need to be externally connected to filters, thereby improving the system integration degree and reducing the packaging volume required for separately designing filters for the radio frequency channels.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and particularly to a packaged antenna system and a communication device. Background Art

[0002] An antenna is an important component required for communication between devices in wireless communication. The basic components of an antenna include a reflector, a radiator, a feeder (used to connect a radio frequency signal to the antenna), and a director, etc. The main indicators of an antenna include bandwidth, gain, polarization mode, etc. Among them, the wider the bandwidth, the more working frequency bands the antenna can support, thus supporting higher channel capacity transmission. In 5G millimeter-wave communication, the 28 GHz band, 39 GHz band, and 60 GHz band will all become standard frequency bands for high-speed wireless communication networks. In these high-frequency bands, the wavelength size of the signal is already smaller than the chip package size, so the antenna size can be made very small, thus making it feasible to directly design an antenna on the package. In order to achieve high-frequency antenna performance, high integration of multi-channel transceiver and reduce link loss, a new antenna technology has been introduced, which is the antenna in package (AiP). An AiP is a chip that includes an independent transceiver and an antenna array.

[0003] The RF leads of the AiP are shorter, so the feeding loss will be smaller. At the same time, since the antenna is directly designed on the package, the overall antenna will be more compact and the system integration will be higher. However, in order to reduce signal spurs and improve anti-blocking performance, a frequency-selective filter needs to be configured for each RF channel outside the AiP. At this time, the number of configured filters needs to be the same as the number of RF channels. Since when setting filters in the circuit board where the RF channels are located, corresponding package pins need to be configured for each filter, when the number of RF channels is large, there are not enough package pins to configure a filter for each time-frequency channel, resulting in a decline in the performance of the RF channels. Moreover, the more filters there are, the less conducive to the miniaturization of the device volume. The most important point is that since a connection line is required to connect between the filter and the RF channel, the path loss between the RF channel and the filter is very large, reducing the communication performance. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a packaged antenna system and a communication device to improve system performance.

[0005] In a first aspect, a packaged antenna system is provided, including:

[0006] A radio frequency chip, a power splitter network connected to the radio frequency chip, a plurality of radio frequency channels connected to the power splitter network, and a phased antenna array connected to the plurality of radio frequency channels; the phased antenna array includes a plurality of antenna units, and some or all of the antenna units include a filtering antenna structure for filtering in a frequency band including a millimeter wave band. Wherein, the radio frequency chip includes an upconverter and a downconverter, the power splitter network includes one or more power splitters, and each radio frequency channel of the plurality of radio frequency channels includes one or more radio frequency front-end devices.

[0007] In the packaged antenna system provided by the present application, a filtering antenna structure for frequency band filtering function is integrated in the phased antenna array, so that the antenna unit has a filtering function. Therefore, the radio frequency channels coupled to the antenna unit no longer need to be externally connected with filters, which can improve the system integration degree and reduce the packaging volume required for separately designing filters for the radio frequency channels.

[0008] In an optional implementation manner, the filtering antenna structure can be used to radiate signals in the millimeter wave band and receive signals in the millimeter wave band; the filtering antenna structure can also perform frequency band filtering on the signals in the millimeter wave band.

[0009] In an optional implementation manner, the filtering antenna structure includes a high-pass filtering structure and a low-pass filtering structure.

[0010] In an optional implementation manner, the antenna unit includes a feeding module and a feeding patch;

[0011] The feeding module includes at least one layer of stacked microstrip resonators, and the microstrip resonator includes at least two differential feeding probes, a microstrip line, and at least one microstrip patch;

[0012] The microstrip line included in the microstrip resonator is connected to the at least one microstrip patch through the at least two differential feeding probes;

[0013] The at least one microstrip patch included in the microstrip resonator is coupled to the feeding patch to form a series capacitor, and the microstrip line and the series capacitor form the high-pass filtering structure.

[0014] In an optional implementation manner, the microstrip resonator includes two differential feeding probes that are perpendicularly connected to each other;

[0015] At least one of the two end points of the differential feeding probe is connected to one of the at least one microstrip patches;

[0016] The number of the at least one microstrip patch is greater than or equal to 1 and less than or equal to 4.

[0017] In an alternative implementation, the feeding module includes a coupled feeding structure; the coupled feeding structure is coupled to the resonator module;

[0018] The coupled feeding structure includes at least one layer of stacked microstrip resonators. The microstrip resonator includes two differentially-fed probes connected perpendicularly to each other, a microstrip line, and at least one microstrip patch. Two end points of the differentially-fed probes are respectively connected to one microstrip patch of the at least one microstrip patch, and the microstrip line is perpendicular to the connection of the two differentially-fed probes.

[0019] In an alternative implementation, the frequency range of the millimeter-wave band includes 24.25 GHz to 29.5 GHz.

[0020] In an alternative implementation, the frequency range of the millimeter-wave band includes 24.25 GHz to 26.5 GHz.

[0021] In an alternative implementation, the frequency range of the millimeter-wave band includes 26.5 GHz to 29.5 GHz.

[0022] In an alternative implementation, the frequency range of the millimeter-wave band includes 27.5 GHz to 28.35 GHz.

[0023] In an alternative implementation, the frequency range of the millimeter-wave band includes 24.25 GHz to 27.5 GHz.

[0024] In an alternative implementation, the frequency range of the millimeter-wave band includes 27.5 GHz to 29.5 GHz.

[0025] In an alternative implementation, the operating frequency of the antenna unit is within Frequency Range 2 of the technical specifications of the 3rd Generation Partnership Project 3GPP New Radio NR.

[0026] In an alternative implementation, the antenna unit further includes a radiator, a resonator module coupled to the radiator, and the resonator is connected to the feeding module;

[0027] The resonator module includes a parasitic loop resonator and a feeding patch;

[0028] The parasitic loop resonator is located between the radiator and the feeding patch and is respectively coupled to the radiator and the feeding patch, or the feeding patch is located between the radiator and the parasitic loop resonator and is respectively coupled to the radiator and the parasitic loop resonator.

[0029] In an alternative implementation, the radiator is a metal patch with a symmetric shape.

[0030] In an alternative implementation, the resonator module includes a parasitic loop resonator and a feeding patch;

[0031] The parasitic loop resonator is located between the radiator and the feeding patch and is coupled to the radiator and the feeding patch respectively, or the feeding patch is located between the radiator and the parasitic loop resonator and is coupled to the radiator and the parasitic loop resonator respectively.

[0032] In an alternative implementation, the parasitic loop resonator is a square-loop-shaped metal patch, or a circular-loop-shaped metal patch, or a double-I-shaped metal patch.

[0033] In an alternative implementation, the feeding patch is a metal patch with a symmetric shape, and a feeding opening with a symmetric shape is included in the middle of the feeding patch.

[0034] In an alternative implementation, the shape of the feeding opening is square, circular or double-I-shaped.

[0035] When the coupled feeding structure has at least two layers of microstrip resonators, adjacent two layers of the at least two stacked microstrip resonators are connected through at least one metal via provided in the microstrip patch.

[0036] In an alternative implementation, the shape of the microstrip patch is square, circular or rhombic.

[0037] In an alternative implementation, at least one parasitic grounding hole is included in the middle and the vacant positions around the microstrip resonator.

[0038] In a second aspect, the present application provides a communication device, including: a baseband chip and any one of the above-mentioned packaged antenna systems. The baseband chip and the packaged antenna system.

[0039] The communication device may further include a memory, and the baseband chip may be coupled to the memory.

[0040] The memory is used for storing instructions, the baseband chip is used for executing the instructions stored in the memory, and processing the signals obtained through the packaged antenna system, or sending signals through the packaged antenna system.

[0041] The communication device may further include modules such as an application processor, a display screen, etc.

[0042] It should be understood that the communication device provided in the embodiments of the present application may be a wireless communication device or some components in a wireless communication device, such as an integrated circuit product like a system-on-chip (SoC) or a communication chip. The wireless communication device may be a computer device supporting wireless communication functions.

[0043] Specifically, the wireless communication device may be a terminal such as a smart phone or a radio access network device such as a base station. The system-on-chip may also be referred to as a system on chip (SoC) or simply an SoC chip for short. The communication chip may include a baseband chip and a radio frequency processor. The baseband chip is sometimes also referred to as a modem or a baseband processor. The radio frequency processor is sometimes also referred to as a radio frequency transceiver or a radio frequency chip. In a physical implementation, some or all of the chips in the communication chip may be integrated inside the SoC chip. For example, the baseband chip is integrated in the SoC chip, and the radio frequency processor is not integrated with the SoC chip. Description of the Drawings

[0044] Figure 1 Schematic structural diagram of a packaged antenna system provided in the embodiments of the present application;

[0045] Figure 2 Principle block diagram of an antenna unit provided in the embodiments of the present application;

[0046] Figure 3 Schematic structural diagram of an antenna unit provided in the embodiments of the present application;

[0047] Figure 4 Schematic diagram of a radiator provided in the embodiments of the present application;

[0048] Figure 5 Another schematic diagram of a radiator provided in the embodiments of the present application;

[0049] Figure 6 Another schematic diagram of a radiator provided in the embodiments of the present application;

[0050] Figure 7 Another schematic diagram of a radiator provided in the embodiments of the present application;

[0051] Figure 8 Schematic diagram of a parasitic loop resonator provided in the embodiments of the present application;

[0052] Figure 9 Another schematic diagram of a parasitic loop resonator provided in the embodiments of the present application;

[0053] Figure 10 Another schematic diagram of a parasitic loop resonator provided in the embodiments of the present application;

[0054] Figure 11 Schematic diagram of a feeding patch provided by an embodiment of the present application;

[0055] Figure 12 Another schematic diagram of a feeding patch provided by an embodiment of the present application;

[0056] Figure 13 Another schematic diagram of a feeding patch provided by an embodiment of the present application;

[0057] Figure 14 Another schematic diagram of a feeding patch provided by an embodiment of the present application;

[0058] Figure 15 Another schematic diagram of a feeding patch provided by an embodiment of the present application;

[0059] Figure 16 Schematic diagram of a coupled feeding structure provided by an embodiment of the present application;

[0060] Figure 17 Schematic diagram of another coupled feeding structure provided by an embodiment of the present application;

[0061] Figure 18 Schematic diagram of another coupled feeding structure provided by an embodiment of the present application;

[0062] Figure 19 Schematic diagram of another coupled feeding structure provided by an embodiment of the present application;

[0063] Figure 20 Schematic diagram of another coupled feeding structure provided by an embodiment of the present application;

[0064] Figure 21 Schematic diagram of a feeding network provided by an embodiment of the present application;

[0065] Figure 22 Schematic diagram of the performance simulation of an antenna unit provided by an embodiment of the present application;

[0066] Figure 23 Another schematic diagram of the performance simulation of an antenna unit provided by an embodiment of the present application;

[0067] Figure 24 Another schematic diagram of the performance simulation of an antenna unit provided by an embodiment of the present application;

[0068] Figure 25 Schematic diagram of an AiP structure provided by an embodiment of the present application. Detailed implementation manners

[0069] The embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0070] The following is a further description of the technical solution provided by this application in conjunction with the accompanying drawings and by way of examples. It should be understood that the system structure and service scenarios provided in the embodiments of this application are mainly for explaining some possible implementation manners of the technical solution of this application, and should not be construed as a unique limitation on the technical solution of this application. Those of ordinary skill in the art can understand that with the evolution of the system and the emergence of updated service scenarios, the technical solution provided by this application is still applicable to the same or similar technical problems.

[0071] It should be understood that for the technical solution provided in the embodiments of this application, in the following introduction of specific embodiments, some repeated parts may not be elaborated again, but it should be regarded that there are mutual references between these specific embodiments and they can be combined with each other.

[0072] The packaged antenna system provided in the embodiments of this application can be applied to various communication devices, such as terminal devices, network devices, etc. Among them, the terminal device can be a device with wireless transceiver functions or a chip that can be set in any device, and can also be called a user equipment (UE), access terminal, user unit, user station, mobile station, mobile platform, remote station, remote terminal, mobile device, user terminal, wireless communication device, user agent or user device. The terminal device in the embodiments of this application can be a mobile phone, a tablet computer (Pad), a computer with wireless transceiver functions, a virtual reality (VR) terminal, an augmented reality (AR) terminal, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, and so on.

[0073] A network device can be a wireless access device under various standards, such as an evolved Node B (eNB), a radio network controller (RNC), a Node B (NB), a base station controller (BSC), a base transceiver station (BTS), a home base station (e.g., home evolved NodeB, or home Node B, HNB), a baseband unit (BBU), an access point (AP) in a wireless fidelity (WIFI) system, a wireless relay node, a wireless backhaul node, a transmission and reception point (TRP or transmission point, TP), etc. It can also be a gNB or a transmission point (TRP or TP) in a 5G (NR) system, one or a group (including multiple antenna panels) of antenna panels of a base station in a 5G system, or a network node that constitutes a gNB or a transmission point, such as a baseband unit (BBU), or a DU in a central unit - distributed (CU - DU) architecture.

[0074] The network architecture and service scenarios described in the embodiments of this application are to more clearly illustrate the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. Those of ordinary skill in the art can understand that with the evolution of the network architecture and the emergence of new service scenarios, the technical solutions provided by the embodiments of this application are equally applicable to similar technical problems.

[0075] As Figure 1 shown, it is a schematic structural diagram of a packaged antenna system provided by an embodiment of this application. Figure 1 The packaged antenna system shown therein includes a phased antenna array composed of at least one antenna unit 110. Each antenna unit 110 is connected to a power splitter network through a radio frequency channel, and the power splitter network includes one or more power splitters.

[0076] Among them, the radio frequency channel can also be called a transmit / receive (TX / RX) chain, and the power splitter can also be called a splitter / combiner (S / C).

[0077] In the embodiments of the present application, some or all of the antenna elements in the antenna unit include a filtering antenna structure for band filtering. Different from the traditional wireless packaged antenna system with a lumped filtering structure, in the embodiments of the present application, the filtering antenna structure is integrated with the antenna unit design, so that the antenna unit has the function of band filtering, thus eliminating the need to externally connect a filter in the RF channel, improving the system integration and reducing the system loss.

[0078] It should be noted that the operating frequency of the antenna unit provided in the embodiments of the present application can be in the millimeter-wave band. Among them, the frequency range of the millimeter-wave band can include one or more of the following: 24.25 to 29.5 GHz; 24.25 GHz to 26.5 GHz; 26.5 GHz to 29.5 GHz; 27.5 GHz to 28.35 GHz; 24.25 GHz to 27.5 GHz; 27.5 GHz to 29.5 GHz.

[0079] Of course, the antenna unit provided in the embodiments of the present application can also operate at other frequencies, which will not be elaborated one by one here.

[0080] It should be noted that Figure 1 Regarding the specific structure of the RF channel in, the embodiments of the present application do not limit it. For example, in one possible implementation, the RF channel may include one or more RF front-end devices, such as a switch, a power amplifier (PA), a low-noise amplifier (LNA), and a phase shifter (PS), etc.

[0081] Figure 1 In, each RF channel is connected to the RF chip through a power divider network. The RF chip may include a transmitter 140 and a receiver 150. For example, Figure 1 In, the RF channel 120 is connected to the transmitter 140 and the receiver 150 through the power dividers 130, 132, and 134 in the power divider network.

[0082] Among them, the transmitter 140 may include modules such as a digital-to-analog converter (DAC) and an upconverter. The transmitter 140 can be used to convert the obtained baseband signal into a radio frequency signal and radiate it outward through the antenna elements in the phased antenna array. For example, after the baseband signal becomes an analog signal through the DAC, the analog signal undergoes upconversion processing by the upconverter to become a radio frequency signal. The radio frequency signal undergoes signal amplification and other processing by the PA, and finally, through the selection of the antenna switch, it is radiated outward from the selected antenna element.

[0083] In the transmitter 140, there may be other processing procedures for the baseband signal, which will not be elaborated here.

[0084] The receiver 150 may include modules such as a downconverter and an analog to digital converter (ADC). The receiver 150 can convert the radio frequency signal received through the antenna elements in the phased antenna array into a baseband signal and provide it to the baseband processor for processing. For example, after the receiver 150 receives the radio frequency signal input by the antenna elements in the phased antenna array, since the received radio frequency signal is usually very weak, it can be amplified by a low noise amplifier. The amplified signal is first subjected to downconversion processing by the downconverter and then converted into a baseband signal by the ADC and provided to the baseband processor for processing.

[0085] The above are only examples. The specific implementation manners and functions of the transmitter 140 and the receiver 150 are not limited in the embodiments of the present application and will not be elaborated here.

[0086] The principle block diagram of the antenna element including the filtering antenna structure provided by the embodiments of the present application can be as Figure 2 shown. In the embodiments of the present application, the antenna element may include a radiator, a resonator module coupled to the radiator, and a feeding module connected to the resonator; wherein, the feeding module includes a filtering antenna structure, so that the antenna element can have a frequency band filtering function. The frequency band filtering may refer to a combination of high-pass filtering and low-pass filtering, or may refer to band-pass filtering. Further, a parasitic structure may be added between the resonator module and the radiator to improve the sideband suppression effect.

[0087] Combined with Figure 2 , as Figure 3 shown, it is a schematic structural diagram of an antenna element provided by the embodiments of the present application. Figure 3 The shown antenna element includes a radiator 301, a parasitic ring resonator 302, a feeding patch 303, a metallized feeding via 305, a coupling feeding structure 304, a feeding network 306, etc.

[0088] Among them, Figure 2 the radiator in can correspond to the radiator 301; Figure 2 the resonator module in can correspond to the parasitic ring resonator 302 and the feeding patch 303, that is, the resonator module includes the parasitic ring resonator 302 and the feeding patch 303; Figure 2 the feeding module in can correspond to the coupling feeding structure 304, the metallized feeding via 305, and the feeding network 306, that is, the feeding module includes the coupling feeding structure 304, the metallized feeding via 305, and the feeding network 306.

[0089] In the embodiments of the present application, the feeding module may include a high-pass filtering structure for implementing a high-pass filtering function and a low-pass filtering structure for implementing a low-pass filtering function.

[0090] For example, in a possible implementation, the antenna unit includes a feeding module and a feeding patch; the feeding module includes at least one layer of stacked microstrip resonators, the microstrip resonators include at least two differential feeding probes, microstrip lines, and at least one microstrip patch; the microstrip lines included in the microstrip resonators are connected to the at least one microstrip patch through the at least one differential feeding probe; the at least one microstrip patch included in the microstrip resonators is coupled to the feeding patch to form a series capacitor. The microstrip line part can be equivalent to a parallel inductor, so the series capacitor formed by the microstrip line and the at least one microstrip patch constitutes a high-pass filtering structure, so that the antenna unit has a high-pass filtering function.

[0091] Exemplarily, the microstrip resonator includes two differential feeding probes that are perpendicular to each other; at least one of the two end points of the differential feeding probe is connected to one of the at least one microstrip patches; therefore, the number of the at least one microstrip patch can be greater than or equal to 1 and less than or equal to 4.

[0092] Exemplarily, both of the two end points of the two differential feeding probes of the microstrip resonator are connected to one microstrip patch.

[0093] The number of microstrip patches can be determined according to the actual situation. The number of microstrip patches can affect the size of the capacitor formed with the feeding patch, thereby affecting the filtering bandwidth of the high-pass filtering.

[0094] Furthermore, the feeding network 306 in the feeding module is electrically connected to the coupling feeding structure 304 through the metallized feeding via 305. When the feeding network 306 is a differential feeding network, it may include two polarized strip lines, namely a first polarized strip line and a second polarized strip line. When the feeding network 306 is a single-ended feeding network, it may include one polarized strip line.

[0095] At least one open stub resonator can be loaded on the polarized strip line of the feeding network 306, and the at least one open stub resonator constitutes a low-pass filtering structure, so that the antenna unit has a low-pass filtering function.

[0096] As can be seen from the above description, at least one microstrip patch included in the coupling feeding structure 304 in the feeding module and the microstrip line form a structure with high-pass filtering characteristics. At the same time, the polarized strip line of the feeding network 306 in the feeding module has a low-pass filtering structure, which enables the antenna unit to have a band filtering function. Therefore, the antenna unit provided in the embodiment of the present application is different from the distributed filtering structure wireless packaging antenna system with a traditional lumped filtering structure, integrates the filter and the antenna in design, improves the system integration degree, and reduces the system loss.

[0097] The feeding module further includes a coupling feeding structure 304 that can be coupled with the feeding patch 303. Among them, Figure 3 It includes 4 cylindrical metallized feeding vias. The metallized feeding vias are perpendicular to the substrate. The point where the metallized feeding via 305 is connected to the coupling feeding structure 304 can be called the metallized feeding via feeding point.

[0098] Further, in the embodiment of the present application, the coupling feeding structure 304 includes at least one layer of stacked microstrip resonators. The microstrip resonator includes two differentially-fed probes that are perpendicular to each other, a microstrip line, and four microstrip patches. Two end points of the differentially-fed probe are respectively connected to one of the four microstrip patches, and the microstrip line is perpendicular to the connection of the two differentially-fed probes.

[0099] The four microstrip patches included in the microstrip resonator are coupled with the feeding patch to form a series capacitor. The microstrip line part of the microstrip resonator is arranged below the feeding opening of the feeding patch 303 to avoid coupling with the feeding patch 303. Further, due to the effect of differential excitation, the middle position of the microstrip line is equivalently short-circuited. Therefore, the microstrip line part can be equivalently a parallel inductor. Therefore, the microstrip line of the microstrip resonator and the series capacitor formed by the microstrip patches of the microstrip resonator form a high-pass filtering structure, so that the antenna unit has a high-pass filtering function.

[0100] The feeding network 306 is electrically connected to the coupling feeding structure 304 through the metallized feeding via 305. When the feeding network 306 is a differential feeding network, it can include two polarized strip lines, namely the first polarized strip line and the second polarized strip line. When the feeding network 306 is a single-ended feeding network, it can include one polarized strip line. As mentioned above, at least one open-ended stub resonator that constitutes a low-pass filtering structure is loaded on the polarized strip line of the feeding network 306, so that the antenna unit has a low-pass filtering function.

[0101] The above are only examples. In the feeding module of the antenna unit, the filtering antenna structure can also be realized in other ways, and no further examples will be given one by one here.

[0102] In the embodiment of the present application, the connection relationship between the structures included in the antenna unit can be referred toFigure 3 as shown Figure 3 The antenna unit shown has a multi-layer substrate Figure 3 Taking a 4-layer substrate as an example for description Figure 3 The antenna unit shown may include five layers of substrates, which are the first layer substrate to the fifth layer substrate from top to bottom, and the thicknesses are H1, H2, H3, H4, and H5 respectively

[0103] It should be noted that the embodiments of the present application do not limit the material of the substrate. Exemplarily, the dielectric constant of the substrate can be 3.19, and the dielectric tangent loss can be 0.003

[0104] A radiator 301 is arranged on the first layer substrate. The radiator 301 can be used to radiate signals. The radiator may also have other names, such as parasitic patches, etc. The embodiments of the present application do not limit the implementation manner of the radiator. For example Figure 1 in, the radiator 301 includes four sub-patches, and the shape and size of each sub-patch among the four sub-patches are the same, and the distance between adjacent sub-patches is also the same

[0105] Exemplarily, the radiator 301 can be printed on the upper surface of the first layer substrate

[0106] A parasitic ring resonator 302 and a feeding patch 303 are arranged on the second layer substrate. The parasitic ring resonator 302 can be a ring-shaped metal patch, or can be a metal patch of other shapes. The feeding patch 303 can be a metal patch with a symmetric shape

[0107] Exemplarily, the parasitic ring resonator 302 can be printed on the upper surface of the second layer substrate, and the feeding patch 303 can be printed on the lower surface of the second layer substrate. In this case, the parasitic ring resonator 302 is located between the radiator 301 and the feeding patch 303, and is coupled to the radiator 301 and the feeding patch 303 respectively

[0108] Exemplarily, the parasitic ring resonator 302 can also be printed on the lower surface of the second layer substrate. Correspondingly, the feeding patch 303 is printed on the upper surface of the second layer substrate. In this case, the feeding patch 303 is located between the radiator 301 and the parasitic ring resonator 302, and the feeding patch 303 is coupled to the radiator 301 and the parasitic ring resonator 302 respectively

[0109] In the embodiments of the present application, the parasitic ring resonator 302 has the function of enhancing the edge roll-off of filtering. When the parasitic ring resonator 302 is loaded above the feeding patch 303 and is coupled to the feeding patch 303, a radiation suppression zero point can be additionally introduced, and the edge frequency selectivity of the passband can be strengthened

[0110] A coupling feed structure 304 is disposed on the third-layer substrate. The coupling feed structure may have other names, such as a "π"-type coupling feed structure, etc. The embodiments of the present application are not limited thereto. The coupling feed structure 304 is printed on the lower surface of the third-layer substrate and is connected downward to a feed network 306 through at least one metallized feed via 305. At the same time, the coupling feed structure 304 is coupled to the feed patch 303. Among them, Figure 3 it includes 4 cylindrical metallized feed vias. The metallized feed vias are perpendicular to the substrate. The point where the metallized feed via 305 is connected to the coupling feed structure 304 may be referred to as the feed point of the metallized feed via.

[0111] The coupling feed structure 304 includes at least one layer of stacked microstrip resonators. The four microstrip patches included in the microstrip resonator are coupled to the feed patch to form a series capacitor. The microstrip line portion of the microstrip resonator is disposed below the feed opening of the feed patch 303 to avoid coupling with the feed patch 303.

[0112] A feed network 306 is disposed on the fourth-layer substrate. The feed network 306 is electrically connected to the coupling feed structure 304 through the metallized feed via 305. When the feed network 306 is a differential feed network, it may include two polarized strip lines, namely a first polarized strip line and a second polarized strip line. When the feed network 306 is a single-ended feed network, it may include one polarized strip line.

[0113] At least one open stub resonator is loaded on the polarized strip line of the feed network 306. The at least one open stub resonator forms a low-pass filter structure, so that the filtering antenna has a low-pass filtering function.

[0114] On the fifth-layer substrate, it may refer to a port connected to the feed network, etc.

[0115] As can be seen from the above description, the filtering antenna provided by the embodiments of the present application includes a coupling feed structure with high-pass filtering characteristics, a parasitic ring resonator for enhancing the edge roll-off of filtering, and a feed network with low-pass filtering characteristics, which can enable the filtering antenna to have a filtering function and achieve a band-pass filtering characteristic with high roll-off and wide stopband. At the same time, a radiator is disposed in the filtering antenna to improve the sideband suppression effect. Therefore, the filtering antenna provided by the embodiments of the present application is different from the distributed filtering structure wireless transceiver system of the traditional lumped filtering structure, integrates the filter and the antenna design, improves the system integration degree, and reduces the system loss.

[0116] Furthermore, the possible implementation manners of each component of the antenna unit will be described in detail below.

[0117] Radiator:

[0118] In the embodiments of the present application, the radiator 301 is a metal patch with a symmetric shape, and the shape of the radiator 301 can be a symmetric shape such as a square, a circle, or a rhombus.

[0119] For example, as Figure 4 shown, it is a schematic diagram of a radiator provided by an embodiment of the present application. Figure 4 The shape of the radiator in Figure 4 is a square. This is just an example, and other cases will not be exemplified one by one.

[0120] Exemplarily, in the embodiments of the present application, an opening may also be included in the middle of the radiator 301. By providing an opening in the radiator 301, out-of-band radiation can be introduced into the radiator and null points can be suppressed.

[0121] Exemplarily, when an opening is included in the middle of the radiator 301, the shape of the opening can be symmetric.

[0122] For example, in one possible implementation, the radiator 301 including an opening can be as Figure 5 shown. Figure 5 The shape of the radiator in Figure 5 is a square, and the shape of the opening in the radiator is also a square. Of course

[0123] This is just an example, and the shape of the opening in the radiator can also be a circle or other shapes, and will not be exemplified one by one here.

[0124] Exemplarily, in the embodiments of the present application, when the shape of the radiator 301 is a square, the four corners of the radiator 301 may also have notches of the same shape. By providing notches at the four corners of the radiator 301, the impedance bandwidth of the radiator can be improved. Figure 6 shown. Figure 6 This is just an example, and the shape of the notches provided at the four corners of the radiator can also be other shapes, and will not be exemplified one by one here.

[0125] Exemplarily, in the embodiments of the present application, the radiator 301 may also include a plurality of sub-patches. For example, as Figure 7 shown, the radiator 301 includes four sub-patches, and the shape formed by the four sub-patches is symmetric. The shape and size of each of the four sub-patches are the same, and the distance between adjacent sub-patches is also the same.

[0126] Figure 7 In Figure 7 , the side length of the radiator 301 is W2, each sub-patch included in the radiator 301 is a square and has a side length of W1, and the distance between adjacent sub-patches is WS. The specific values of WS, W1, and W2 can be determined according to the operating frequency band of the antenna unit.

[0127] Figure 7 These are only examples. The radiator 301 can also be composed of 9 sub-patches with the same shape and size, or can be composed of 16 sub-patches with the same shape and size, etc. The embodiments of the present application do not limit the number of sub-patches, and no further examples will be given one by one here.

[0128] Parasitic ring resonator:

[0129] In the embodiments of the present application, the parasitic ring resonator 302 in the antenna unit has the function of enhancing the edge roll-off of filtering. When the parasitic ring resonator 302 is coupled with the feeding patch 303, an additional radiation suppression zero point can be introduced, and the frequency selectivity at the edge of the passband can be strengthened.

[0130] In the embodiments of the present application, Figure 3 the shape of the shown parasitic ring resonator 302 is a square ring. For a clearer description, reference can be specifically made to Figure 8 shown. Figure 8 The shape of the shown parasitic ring resonator is a square ring, and the width of each side is WL.

[0131] The above are only examples. The shape of the parasitic ring resonator 302 is not limited and can be a ring structure of any shape.

[0132] For example, as Figure 9 shown, Figure 9 the shape of the shown parasitic ring resonator is a circular ring.

[0133] For another example, as Figure 10 shown, Figure 10 the shape of the shown parasitic ring resonator is a double I-shaped.

[0134] Figures 8 to 10 These are only examples, and other shapes of the parasitic ring resonator will not be further exemplified one by one.

[0135] Feeding patch:

[0136] In the embodiments of the present application, the feeding patch 303 can control the frequency of the low-frequency radiation suppression zero point. The feeding patch 303 is a metal patch with a symmetric shape, and the middle of the feeding patch 303 includes a feeding opening with a symmetric shape. In the embodiments of the present application, Figure 3 the shape of the feeding opening in the shown feeding patch 303 is square. For a clearer description, reference can be specifically made to Figure 11 shown. Figure 11 The shown feeding patch is Figure 3 the same as the shape of the feeding patch in Figure 11 shown, and the shape of the feeding opening in the shown feeding patch is square.

[0137] When the feeding patch 303 and the parasitic loop resonator 302 are attached to a layer of substrate, reference can be made to Figure 12 as shown Figure 12 In, the feeding patch 303 and the parasitic loop resonator 302 are respectively located on the upper surface and the lower surface of a layer of substrate, and the four corners of the parasitic loop resonator 302 are respectively located at the middle positions of the four sides of the feeding patch 303. The parasitic loop resonator 302 is a square loop, and the width of each side is WL. Figure 12 In, the feeding patch 303 is square, the side length of the feeding patch is W3, the feeding opening in the feeding patch is square, and the side length of the feeding opening is W4.

[0138] It should be noted that in the embodiments of the present application, the frequency of the radiation suppression zero point can be adjusted by changing the size of the feeding opening in the feeding patch and the size of the microstrip resonator in the coupled feeding structure. For example, when the shape of the feeding opening in the feeding patch is square, the side length of the feeding opening is equal to one-eighth of the wavelength of the low-frequency zero-point frequency signal, and at the same time, the length of the microstrip line of the microstrip resonator in the coupled feeding structure is equal to the side length of the feeding opening. At this time, by adjusting the size of the microstrip patch in the microstrip resonator, the zero-point position and impedance matching can be further controlled.

[0139] In the embodiments of the present application, the shape of the feeding opening on the feeding patch 303 can also be other symmetric shapes, including but not limited to square, circular, diamond-shaped, double-I-shaped, etc.

[0140] For example, as Figure 13 shown Figure 13 the feeding patch 303 in includes a circular feeding opening.

[0141] For another example, as Figure 14 shown Figure 14 the feeding patch 303 in includes a diamond-shaped feeding opening.

[0142] For another example, as Figure 15 shown Figure 15 the feeding patch 303 in includes a double-I-shaped feeding opening.

[0143] Figures 11 to 15 These are just examples, and other situations will not be exemplified one by one.

[0144] Coupled feeding structure:

[0145] In the embodiments of the present application, the coupled feeding structure 304 has a high-pass filtering function, is coupled with the feeding patch 303, and is electrically connected to the feeding network 306 through the metallized feeding via 305.

[0146] Figure 16The coupled feeding structure 304 shown includes a microstrip resonator. Figure 16 In Figure 16 , the microstrip resonator includes two mutually perpendicular differential feeding probes, a microstrip line, and four microstrip patches. Among them, the two end points of each differential feeding probe are respectively connected to one of the four microstrip patches. The coupled feeding structure 304 with this structure can achieve the differential excitation effect.

[0147] Furthermore, Figure 16 In Figure 16 , the intersection of the two mutually perpendicular differential feeding probes is connected to the microstrip line. The microstrip line is a metal line with a specific length, perpendicular to the connection of the two differential feeding probes. The length of the microstrip line can be equal to the side length of the feeding opening in the feeding patch.

[0148] The microstrip patches at the two end points of a differential feeding probe and the microstrip line can form a stepped impedance resonator structure. Since the microstrip patches are arranged below the metal part in the feeding patch 303, capacitive coupling is formed, introducing a series capacitance component; the microstrip line is arranged below the feeding opening in the middle of the feeding patch 303 to avoid coupling with the feeding patch 303. Due to the differential excitation effect, the middle position of the microstrip line is equivalent to a short circuit. Therefore, the microstrip line part can be equivalent to a parallel inductor, and together with the series capacitance provided by the previous microstrip patches, it forms an equivalent high-pass filter circuit, which can effectively suppress the radiation in the low-frequency band of the antenna. In addition, at the resonant frequency of the microstrip resonator, the current flowing along the notch edge on the feeding patch and the current distributed on the microstrip resonator form a loop, so that the current on the feeding patch is concentrated in the middle area and does not radiate to the edge, thereby introducing a radiation suppression zero point on the lower side of the working frequency band of the gain curve, improving the edge roll-off effect of filtering, and the frequency of the radiation suppression zero point can be adjusted by changing the size of the feeding opening in the feeding patch 303 and the size of the microstrip resonator structure.

[0149] Figure 16 In Figure 16 , the two end points of each differential feeding probe also include metallized feed via feed points. As mentioned above, the metallized feed via feed points are the connection points of the metallized feed via 305 and the coupled feeding structure 304.

[0150] Figure 16 In Figure 16 , the shape of the microstrip patch is square, and the shape of the microstrip patch can also be other symmetric shapes, such as circular or rhombic, etc.

[0151] For example, as Figure 17 shown, Figure 17 In Figure 17 , the shape of the microstrip patch is circular.

[0152] For another example, as Figure 18 shown, Figure 18 In Figure 18 , the shape of the microstrip patch is rhombic.

[0153] Optionally, Figure 16 in

[0153] , the free space around the two mutually perpendicular differential feeding probes includes at least one parasitic grounding hole, so as to improve the quality factor of the microstrip resonator and make the edge of the gain curve drop more steeply.

[0154] Optionally, the parasitic grounding holes can also be distributed around the differential feeding probes in other ways. For example, they can be as shown in Figure 19 .

[0155] In the embodiments of the present application, the coupled feeding structure 304 can also include multiple layers of microstrip resonators, and adjacent two layers of microstrip resonators are connected through at least one metal via disposed in the microstrip patch. Combining Figure 19 , the metal via can be located in the microstrip patch, and each microstrip patch can include multiple metal vias. As shown in Figure 20 , it is a 3D view of the coupled feeding structure 304 including 3 layers of microstrip resonators.

[0156] Feeding network:

[0157] Figure 21 The feeding network 306 shown in is a differential feeding network, including a first polarization strip line 3061 and a second polarization strip line 3062. The feeding network 306 can also be a single-ended feeding network, which is not shown here.

[0158] Further, after one end of each polarization strip line in the feeding network 306 is connected to a differential feeding probe of the coupled feeding structure 304 through a metallized feeding via 305, and then extended by a certain length, it is connected to the other end of the differential feeding probe. The extended length is half of the wavelength at the center frequency of the operating frequency band of the antenna element, that is, Figure 21 L13 in Figure 21 . The connection point between the polarization strip line and the metallized feeding via 305 can be called the metallized feeding via feed point. The distance between the two metallized feeding via feed points connected by the first polarization strip line 3061 is L11, and the distance between the two metallized feeding via feed points connected by the second polarization strip line 3062 is L12.

[0159] Figure 21 In Figure 21 , the widths of the first polarization strip line 3061 and the second polarization strip line 3062 are WF. At least one open stub type resonator is respectively loaded on the first polarization strip line 3061 and the second polarization strip line 3062. By loading multiple open stub type resonators on the polarization strip line, it has a wide stopband low-pass filtering effect and the introduced insertion loss is small. Figure 21 In Figure 21 , taking the example of loading 4 open stub type resonators on each polarization strip line for description, the lengths of these 4 open stub type resonators are L10, L8, L6, and L4 respectively, as shown in Figure 21As shown, the distances between these four open stub resonators are L9, L7, and L5 respectively. The specific values of the above WF and those from L4 to L13 can be determined according to the operating frequency band of the antenna element.

[0160] Optionally, around the connection point of the polarization strip line and the metallized feed via 305, there is at least one parasitic grounding via. The parasitic grounding via connects the upper and lower metal floors, which can enhance the isolation between ports and reduce the insertion loss brought by the metallized feed via 305.

[0161] Furthermore, when the operating frequency band of the antenna element provided by the embodiment of the present application is 24 - 30 GHz, as Figures 3 to 21 the specific values of the dimensions marked can be as follows:

[0162] W1 = 10mm, W2 = 3.53mm, W3 = 2.35mm, W4 = 0.8mm, W5 = 0.31mm, W6 = 0.31mm, WL = 2.0mm, L1 = 0.42mm, L2 = 0.42mm, L3 = 0.86mm, L4 = 1mm, L5 = 0.5mm, L6 = 1.2mm, L7 = 0.5mm, L8 = 0.85mm, L9 = 0.4mm, L10 = 0.7mm, L11 = L12 = 0.96mm, L13 = 0.8mm, H1 = 0.69mm, H2 = 0.05mm, H3 = 0.25mm, H4 = 0.2mm, H5 = 0.2mm, WS = 0.17mm, WF = 0.1mm.

[0163] The above are just examples, and the specific dimensions of the antenna element can be adjusted to adapt to the receiving and transmitting devices in wireless communication systems with different frequency bands.

[0164] Combined with the above dimensions, when the operating frequency band of the antenna element is 24 - 30 GHz, the simulation schematic diagram of the antenna performance can be as Figures 22 to 24 shown. As Figure 22 shown, it is the low - frequency side - band gain curve graph of the embodiment of the present application under different conditions. Figure 22 The simulation result diagrams in four different cases are given in it. These four cases are as follows: 1. The antenna element does not load the parasitic ring resonator, and the coupled feed structure of the antenna element does not load the parasitic grounding via; 2. The antenna element loads the parasitic ring resonator, but the coupled feed structure of the antenna element does not load the parasitic grounding via; 3. The antenna element does not load the parasitic ring resonator, but the middle and the vacant positions around the coupled feed structure of the antenna element load the parasitic grounding via; 4. The antenna element loads the parasitic ring resonator, and the middle and the vacant positions around the coupled feed structure of the antenna element load the parasitic grounding via.

[0165] From Figure 22It can be seen that when the parasitic loop resonator is loaded on the antenna element, and parasitic ground vias are loaded at the middle and the vacant positions around the coupled feeding structure, the edge roll-off effect of filtering can be improved. By adopting two methods to improve the edge roll-off simultaneously, the suppression ability at 22.5 GHz can be increased by 14 dB without introducing additional insertion loss.

[0166] As Figure 23 shown, it is the simulation result diagram of the reflection coefficient of the antenna element provided by the embodiment of the present application. When the operating frequency band of the antenna element is 24 - 30 GHz, good impedance matching can be achieved.

[0167] As Figure 24 shown, it is the simulation result diagram of the gain curve of the antenna element provided by the embodiment of the present application. When the operating frequency band of the antenna element is within 24 - 30 GHz, the antenna gain is stable, all above 5.8 dBi, achieving a relative bandwidth of 22%; high roll-off filtering characteristics are presented on both sides of the passband, and filtering suppression exceeding 25 dB from 0 - 22.5 GHz and wide-stopband filtering suppression exceeding 25 dB from 34 - 60 GHz are realized. Compared with the antenna element without loading the parasitic loop resonator, the low-frequency sideband roll-off is significantly improved when the parasitic loop resonator is loaded on the antenna element.

[0168] As Figure 25 shown, the embodiment of the present application also provides an AiP. Figure 25 The AiP in Figure 25 integrates a 4x4 phased antenna array, which includes a total of 16 antenna elements. The specific implementation of each antenna element can refer to the previous description. It should be noted that

[0169] Figure 25 in, the phased antenna array in the AiP can be connected to the radio frequency chip. For the specific connection method, it can refer to the previous description and will not be elaborated here. Figure 25 The AiP in

[0170] also includes other structures. For the specific structures, it can refer to the description of AiP in the prior art and will not be elaborated here.

[0171] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application is also intended to include these modifications and variations.

Claims

1. An encapsulated antenna system, characterized in that, Comprising: A radio frequency chip, a power divider network connected to the radio frequency chip, a plurality of radio frequency channels connected to the power divider network, and a phased antenna array connected to the plurality of radio frequency channels; Wherein, the radio frequency chip includes an upconverter and a downconverter, the power divider network includes one or more power dividers, and each radio frequency channel of the plurality of radio frequency channels includes one or more radio frequency front-end devices; The phased antenna array includes a plurality of antenna elements, and some or all of the antenna elements include a filtering antenna structure for band filtering, and the band includes a millimeter wave band; wherein, the filtering antenna structure includes a high-pass filtering structure, and the antenna element includes a feeding module and a feeding patch; the feeding module includes at least one layer of stacked microstrip resonators, and the microstrip resonator includes at least two differential feeding probes, a microstrip line, and at least one microstrip patch; the microstrip line included in the microstrip resonator is connected to the at least one microstrip patch through at least one differential feeding probe; the at least one microstrip patch included in the microstrip resonator is coupled to the feeding patch to form a series capacitor, and the microstrip line and the series capacitor form the high-pass filtering structure.

2. The encapsulated antenna system according to claim 1, wherein The filtering antenna structure further includes a low-pass filtering structure.

3. The encapsulated antenna system according to claim 1 or 2, characterized in that, The microstrip resonator includes two mutually perpendicular differential feeding probes. At least one of the two end points of the differential feeding probe is connected to one of the at least one microstrip patches. The number of the at least one microstrip patch is greater than or equal to 1 and less than or equal to 4.

4. The encapsulated antenna system according to claim 2, wherein The antenna element includes a feeding network. At least one open-ended stub resonator is loaded on the polarization strip line of the feeding network, and the at least one open-ended stub resonator forms the low-pass filtering structure.

5. The encapsulated antenna system according to claim 3, wherein The microstrip line included in the microstrip resonator is perpendicular to the connection of the two differential feeding probes included in the microstrip resonator.

6. The packaged antenna system according to any one of claims 1 to 2, characterized in that The frequency range of the millimeter wave band includes 24.25 GHz to 29.5 GHz.

7. The encapsulated antenna system according to any one of claims 1 to 2, characterized in that, The antenna element further includes a radiator, a resonator module coupled to the radiator, and the resonator is connected to the feeding module; The resonator module includes a parasitic loop resonator and a feeding patch; The parasitic loop resonator is located between the radiator and the feeding patch and is respectively coupled to the radiator and the feeding patch, or the feeding patch is located between the radiator and the parasitic loop resonator and is respectively coupled to the radiator and the parasitic loop resonator.

8. The encapsulated antenna system according to claim 7, wherein The parasitic loop resonator is a square-ring-shaped metal patch, or a circular-ring-shaped metal patch, or a double-I-shaped metal patch.

9. The encapsulated antenna system according to claim 7, wherein The feeding patch is a metal patch with a symmetric shape, and a feeding opening with a symmetric shape is included in the middle of the feeding patch.

10. The encapsulated antenna system according to claim 1, characterized in that, At least one parasitic grounding hole is included in the middle and the vacant positions around the microstrip resonator.

11. A communication device, characterized in that, Comprising: A baseband chip and a packaged antenna system as described in any one of claims 1 to 10.

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