Laser Processing Method for Round Holes, Device, Computer Equipment and Storage Medium

Abstract

The present invention belongs to the technical field of laser processing, and relates to a method, a device, a computer device and a storage medium for laser processing of circular holes. The method for laser processing of circular holes includes: taking the center of a preset circular hole as the origin O, and establishing a first coordinate system on the processing surface of a workpiece to be processed; rotating the first coordinate system to obtain a second coordinate system; determining whether the second coordinate system coincides with a preset third coordinate system; when the second coordinate system coincides with the preset third coordinate system, processing a circular hole on the processing surface of the workpiece to be processed according to the processing lead line and radius R of the preset circular hole. The method, device, computer device and storage medium for laser processing of circular holes essentially perform multiple transformations on the coordinate system of the laser processing device in a specific manner, so that it falls on the processing surface of the workpiece to be processed, and enables the coordinate system of the processing device to coincide with the preset coordinate system where the preset circular hole is located, so as to accurately process a target circular hole corresponding to the preset circular hole on the processing surface of the workpiece to be processed.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly relates to a method and device for laser processing of circular holes, a computer device, and a storage medium. Background Art

[0002] When processing a spatial circular hole with a three-dimensional five-axis laser processing device, the preset circular hole to be processed can usually only be calculated based on the coordinate system of the machine tool after being imported into the laser processing device. Since the preset circular hole to be processed can be set at any position in space as needed, based on the coordinate system of the machine tool, the relevant coordinate data of the preset circular hole to be processed and the calculations based on this coordinate data will be relatively complicated, and it is easy to have the problem of low accuracy of the processed circular hole. Summary of the Invention

[0003] The purpose of the embodiments of the present invention is to solve the technical problem of low accuracy in processing circular holes by a laser processing device.

[0004] To solve the above technical problem, the embodiments of the present invention provide a method for laser processing of circular holes, and adopt the following technical solutions:

[0005] The method for laser processing of circular holes includes the following steps:

[0006] Take the center of the preset circular hole as the origin O, and establish a first coordinate system XYZ on the processing surface of the workpiece to be processed, with the same directions as those in the coordinate system of the laser processing device in each direction;

[0007] Rotate the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1, so that the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the processing surface of the workpiece to be processed;

[0008] Judge whether the second coordinate system X1Y1Z1 coincides with a preset third coordinate system X2Y2Z2;

[0009] If the second coordinate system X1Y1Z1 does not coincide with the preset third coordinate system X2Y2Z2, then rotate the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2;

[0010] When the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, in the second coordinate system X1Y1Z1 that coincides with the preset third coordinate system X2Y2Z2, control the processing tool in the laser processing device to process a circular hole on the processing surface of the workpiece to be processed according to the processing lead and radius R of the preset circular hole, so as to obtain a target circular hole corresponding to the preset circular hole.

[0011] Optionally, the step of rotating the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1, and the Z1 axis in the second coordinate system X1Y1Z1 being perpendicular to the machining surface of the workpiece to be machined specifically includes:

[0012] Obtain a first angle a and a second angle c, rotate the first coordinate system XYZ around the X axis in the first coordinate system XYZ by the first angle a, and rotate the first coordinate system XYZ around the Z axis in the first coordinate system XYZ by the second angle c to obtain the second coordinate system X1Y1Z1, and the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the machining surface of the workpiece to be machined;

[0013] Alternatively, obtain a first angle a and a second angle c, rotate the first coordinate system XYZ around the Z axis in the first coordinate system XYZ by the second angle c, and rotate the first coordinate system XYZ around the X axis in the first coordinate system XYZ by the first angle a to obtain the second coordinate system X1Y1Z1, and the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the machining surface of the workpiece to be machined.

[0014] Optionally, the step of rotating the second coordinate system X1Y1Z1 to coincide with a preset third coordinate system X2Y2Z2 includes:

[0015] Predict the starting point coordinate A1 of the machining lead in the second coordinate system X1Y1Z1, calculate the first angle α between the extension line OA1 between the starting point coordinate A1 and the origin O and the X1 axis in the second coordinate system X1Y1Z1;

[0016] Obtain the starting point coordinate A2 of the machining lead in the preset third coordinate system X2Y2Z2, calculate the second angle β between the extension line OA2 between the starting point coordinate A2 and the origin O and the X2 axis in the third coordinate system X2Y2Z2;

[0017] Calculate a third angle d according to the first angle α and the second angle β, and rotate the second coordinate system X1Y1Z1 around the Z1 axis in the second coordinate system X1Y1Z1 by the third angle d to make the second coordinate system X1Y1Z1 coincide with the preset third coordinate system X2Y2Z2.

[0018] Optionally, before the step of controlling the machining tool in the laser machining equipment to machine a circular hole on the machining surface of the workpiece to be machined according to the machining lead and the radius R of the preset circular hole in the second coordinate system X1Y1Z1 after it coincides with the third coordinate system X2Y2Z2, it further includes:

[0019] Obtain and parse the type index parameter input by the user;

[0020] When the type indication parameter is a positive number, obtain the non-closed length L1 of the preset circular hole, and calculate the central angle θ corresponding to the non-closed length L1 with respect to the origin O based on the non-closed length L1: θ = L1 / (2πR); set the coordinates of the machining end point as (R * cosθ, R * sinθ); or, when the type indication parameter is a negative number, obtain the repeated cutting length L2 of the preset circular hole, and calculate the central angle γ corresponding to the repeated cutting length L2 with respect to the origin O based on the repeated cutting length L2: γ = -L2 / (2πR); set the coordinates of the machining end point D2 as (R * cosγ, R * sinγ).

[0021] Optionally, the step of calculating the first angle α between the extension line OA1 between the starting point A1 of the machining lead of the preset circular hole in the second coordinate system X1Y1Z1 and the origin O and the X1 axis in the second coordinate system X1Y1Z1 specifically includes:

[0022] Obtain the coordinates (x1, y1) of the starting point A1 of the machining lead of the preset circular hole in the second coordinate system X1Y1Z1;

[0023] Calculate the first angle α based on the coordinates (x1, y1) of the starting point A1: α = Arctan(y1 / x1), where in the X1OY1 plane of the second coordinate system X1Y1Z1, if the first angle α is above the X1 axis, the first angle α is a positive value; if the first angle α is below the X1 axis, the first angle α is a negative value.

[0024] Optionally, the machining lead includes a straight lead and an arc lead, the length of the straight lead is l, the radius of the arc lead is r, and the length of the arc lead is r; the step of calculating the second angle β between the extension line between the starting coordinate of the machining lead in the third coordinate system X2Y2Z2 and the origin O and the X2 axis in the third coordinate system X2Y2Z2 specifically includes:

[0025] Based on the radius R of the preset circular hole, the length l of the straight lead, and the radius r of the arc lead, determine that the starting coordinate of the straight lead is (R - l - r, r);

[0026] Calculate the second angle β based on the radius r of the arc lead and the coordinates (R - l - r, r) of the starting point A2: β = Arctan(r / (R - l - r)), where the second angle β is a positive value.

[0027] Optionally, the step of calculating the third angle d according to the first included angle α and the second included angle β specifically includes:

[0028] Calculating the third angle d according to the first included angle α and the second included angle β: d = (α - β).

[0029] An embodiment of the present invention further provides a laser processing device for performing the above-mentioned laser processing circular hole method, including:

[0030] A coordinate system reconstruction module, configured to use the center of a preset circular hole as the origin O, and establish a first coordinate system XYZ on the processing surface of the workpiece to be processed, which has the same directions as those in the coordinate system of the laser processing device;

[0031] A coordinate system first rotation module, configured to rotate the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1, so that the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the processing surface of the workpiece to be processed;

[0032] A coordinate system coincidence determination module, configured to determine whether the second coordinate system X1Y1Z1 coincides with a preset third coordinate system X2Y2Z2;

[0033] A coordinate system second rotation module, configured to, when the second coordinate system X1Y1Z1 does not coincide with the preset third coordinate system X2Y2Z2, rotate the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2;

[0034] A control module, configured to, when the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, in the second coordinate system X1Y1Z1 that coincides with the third coordinate system X2Y2Z2, control a processing tool in the laser processing device to process a circular hole on the processing surface of the workpiece to be processed, so as to obtain a target circular hole corresponding to the preset circular hole.

[0035] An embodiment of the present invention further provides a computer device, including a memory and a processor, where a computer program is stored in the memory, and when the processor executes the computer program, the steps of the above-mentioned laser processing circular hole method are implemented.

[0036] An embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above-mentioned laser processing circular hole method are implemented.

[0037] Compared with the prior art, the laser processing circular hole method, device, computer device and storage medium provided by the embodiments of the present invention mainly have the following beneficial effects:

[0038] The method for laser machining a circular hole mainly involves first establishing a first coordinate system on the workpiece to be machined with the center of the preset circular hole as the origin, where the directions of the first coordinate system are the same as those in the coordinate system of the laser machining device. Then, the first coordinate system is rotated to obtain a second coordinate system, and the Z1 axis of the second coordinate system is perpendicular to the machining surface of the workpiece to be machined. Since the preset circular hole is machined in a preset third coordinate system, it is necessary to determine whether the second coordinate system coincides with the preset third coordinate system. If the second coordinate system already coincides with the preset third coordinate system, the workpiece to be machined can be continuously machined to obtain a target circular hole corresponding to the preset circular hole based on this second coordinate system. If the second coordinate system does not coincide with the preset third coordinate system, the second coordinate system needs to be rotated to coincide with the preset third coordinate system first, and then the workpiece to be machined is machined on the second coordinate system to obtain a target circular hole corresponding to the preset circular hole. That is to say, the method for laser machining a circular hole provided by the embodiments of the present invention for machining a circular hole on the workpiece to be machined is essentially to perform multiple transformations on the coordinate system of the laser machining device in a specific manner, so that it falls on the machining surface of the workpiece to be machined, and the coordinate system of the machining device can coincide with the preset coordinate system where the preset circular hole is located, so as to accurately machine a target circular hole corresponding to the preset circular hole on the machining surface of the workpiece to be machined. Description of the Drawings

[0039] In order to more clearly illustrate the solutions in the present invention, the following will briefly introduce the drawings required for the description of the embodiments of the present invention. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0040] Figure 1 is a flowchart of an embodiment of the method for laser machining a circular hole according to the present invention;

[0041] Figure 2 is Figure 1 a flowchart of a specific implementation manner of step S200 in

[0042] Figure 3 is Figure 1 a flowchart of a specific implementation manner of step S500 in

[0043] Figure 4 is Figure 1 a flowchart of a specific implementation manner of step S400 in

[0044] Figure 5 is Figure 1 a schematic diagram of the effect before performing step S100 in

[0045] Figure 6 is Figure 1Schematic diagram of the effect of step S100;

[0046] Figure 7 is Figure 1 Schematic diagram of the effect of step S200;

[0047] Figure 8 is Figure 1 Schematic diagram of the effect of step S400;

[0048] Figure 9 is Figure 7 Front view of the X2OY2 plane;

[0049] Figure 10 is Figure 4 Schematic diagram of the effect of step S410;

[0050] Figure 11 is Figure 4 Schematic diagram of the effect of step S420;

[0051] Figure 12 is Figure 3 Schematic diagram of the effect of step S500a;

[0052] Figure 13 is Figure 3 Schematic diagram of the effect of step S500b;

[0053] Figure 14 Schematic diagram of the structure of an embodiment of a computer device according to the present invention.

[0054] Reference numerals:

[0055] 1, Processing round holes;

[0056] 2, Processing leads; 21, Straight leads; 22, Arc leads. Detailed implementation manners

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this invention belongs; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" and any variations thereof in the specification and claims of the present invention or the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of the present invention or the above drawings are used to distinguish different objects and not to describe a specific order.

[0058] References to "embodiments" in this specification mean that specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the invention. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0059] To enable those skilled in the art to better understand the solution of the present invention, the following will describe the technical solutions in the embodiments of the present invention clearly and completely in conjunction with the appended Figures 1 to 13 ,.

[0060] As Figure 1 shown, a method for laser machining a circular hole includes the following steps:

[0061] Step S100: Take the center of a preset circular hole as the origin O, and establish a first coordinate system XYZ on the machining surface of the workpiece to be machined, with the same directions as those in the coordinate system of the laser machining device in all directions;

[0062] Specifically, as Figure 5 shown, in the coordinate system X0Y0Z0 of the initial laser machining equipment, there is a preset circular hole with the center O, and the machining lead 2 of this preset circular hole is A0B0 and B0C0 in the coordinate system X0Y0Z0. It can be understood that, as Figure 6 shown, step S100 is to directly set the origin of the coordinate system X0Y0Z0 of the laser machining equipment at the center O of the preset circular hole.

[0063] Step S200: Rotate the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1, so that the Z1 axis in this second coordinate system X1Y1Z1 can be perpendicular to the machining surface of the workpiece to be machined;

[0064] Specifically, as Figure 7 shown, after rotating the first coordinate system XYZ, the X1OY1 plane in the obtained second coordinate system X1Y1Z1 can be located on the machining surface of the workpiece to be machined, so that the relevant coordinates of the preset circular hole can fall on the machining surface of the workpiece to be machined.

[0065] Step S300: Determine whether the second coordinate system X1Y1Z1 coincides with a preset third coordinate system X2Y2Z2;

[0066] If the second coordinate system X1Y1Z1 does not coincide with the preset third coordinate system X2Y2Z2, then execute step S400: Rotate the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2;

[0067] Step S600: If the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, then in the second coordinate system X1Y1Z1 that coincides with the preset third coordinate system X2Y2Z2, according to the processing lead 2 and radius R of the preset round hole, control the processing tool in the laser processing device to process a round hole 1 on the processing surface of the workpiece to be processed, so as to obtain a target round hole corresponding to the preset round hole.

[0068] Specifically, if after step S200, the second coordinate system X1Y1Z1 directly coincides with the preset third coordinate system X2Y2Z2, then the round hole processing can be directly performed on the workpiece to be processed in this second coordinate system X1Y1Z1, and step S600 can be directly executed. It can be understood that since the coordinate data of each point of the preset round hole is set based on the preset third coordinate X2Y2Z2, when the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, the processing can be performed on the surface of the workpiece to be processed according to the coordinate data of each point of the preset round hole in the preset third coordinate system X2Y2Z2.

[0069] In summary, compared with the prior art, the laser processing round hole method has at least the following beneficial effects:

[0070] The laser processing round hole method provided by the embodiment of the present invention processes the round hole on the workpiece to be processed. Substantially, the coordinate system of the laser processing device is transformed multiple times in a specific manner so that it falls on the processing surface of the workpiece to be processed, and the coordinate system of the processing device can coincide with the preset coordinate system where the preset round hole is located, so as to accurately process a target round hole corresponding to the preset round hole on the processing surface of the workpiece to be processed. It can perform accurate round hole processing on the workpiece to be processed according to the real-time spatial position information of the workpiece to be processed, and can directly control the laser processing device to process a target round hole corresponding to the preset round hole on the workpiece to be processed by editing the parameters of the preset round hole to be processed and calling the relevant processing trajectory calculation program.

[0071] In some optional implementation manners of this embodiment, such as Figure 2 and Figure 7 shown, step S200: Rotate the first coordinate system XYZ to obtain the second coordinate system X1Y1Z1, and the step that the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the processing surface of the workpiece to be processed specifically includes:

[0072] Again, as Figure 2 shown, as the first optional implementation manner of step S200:

[0073] Step 200a: Obtain the first angle a and the second angle c. Rotate the first coordinate system XYZ around the X-axis in the first coordinate system XYZ by the first angle a, and then rotate the first coordinate system XYZ around the Z-axis in the first coordinate system XYZ by the second angle c to obtain the second coordinate system X1Y1Z1, where the Z1-axis in the second coordinate system X1Y1Z1 is perpendicular to the machining surface of the workpiece to be machined.

[0074] For another example Figure 2 As shown in the figure, as the second alternative implementation manner of step S200:

[0075] Step 200b: Obtain the first angle a and the second angle c. First, rotate the first coordinate system XYZ around the Z-axis in the first coordinate system XYZ by the second angle c, and then rotate the first coordinate system XYZ around the X-axis in the first coordinate system XYZ by the first angle a to obtain the second coordinate system X1Y1Z1, and the Z1-axis in the second coordinate system X1Y1Z1 is perpendicular to the machining surface of the workpiece to be machined.

[0076] It should be noted that, first, if the process of the laser machining circular hole method in the embodiment of the present invention is calculated through teaching programming, the first angle a and the second angle c can be directly obtained; if it is calculated through software programming, the first angle a and the second angle c are obtained through presetting.

[0077] Second, rotating the first coordinate system XYZ around the Z-axis in the first coordinate system XYZ by the second angle c, and rotating the first coordinate system XYZ around the X-axis in the first coordinate system XYZ by the first angle a are aimed at making the Z1-axis in the second coordinate system X1Y1Z1 obtained after rotation perpendicular to the machining surface of the workpiece to be machined, that is, making the X1OY1 plane in the second coordinate system X1Y1Z1 located on the machining surface of the workpiece to be machined.

[0078] In some alternative implementation manners of this embodiment, as shown in Figure 4 , Figure 8 , Figure 10 and Figure 11 The step of rotating the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2, that is, step S400 specifically includes:

[0079] Step S410: Predict the starting point coordinate A1 of the machining lead 2 in the second coordinate system X1Y1Z1, and calculate the first included angle α between the extension line OA1 between the starting point coordinate A1 and the origin O and the X1-axis in the second coordinate system X1Y1Z1.

[0080] Step S420: Obtain the starting coordinate A2 of the processing lead 2 in the preset third coordinate system X2Y2Z2, and calculate the second angle β between the extension line OA2 between the starting coordinate A2 and the origin O and the X2 axis in the third coordinate system X2Y2Z2;

[0081] Step S430: Calculate the third angle d based on the first angle α and the second angle β, and rotate the second coordinate system X1Y1Z1 around the Z1 axis in the second coordinate system X1Y1Z1 by the third angle d so that the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2.

[0082] It can be understood that when the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, all the coordinate data of the preset round hole and the processing lead 2 of the preset round hole in the preset third coordinate system X2Y2Z2 can be directly applied to the second coordinate system X1Y1Z1 at this time, without recalculating the coordinates of each part of the preset round hole and the coordinates of each part of the processing lead 2, that is, effectively reducing the coordinate calculation steps, and enabling processing based on relatively accurate data to improve the accuracy of laser processing the round hole 1.

[0083] When the second coordinate system X1Y1Z1 does not coincide with the preset third coordinate system X2Y2Z2, by rotating the second coordinate system X1Y1Z1, the second coordinate system X1Y1Z1 can be made to coincide with the preset third coordinate system X2Y2Z2, and then subsequent processing steps can be carried out.

[0084] In some optional implementation manners of this embodiment, step S410: The step of calculating the first angle α between the extension line OA1 between the starting point A1 of the processing lead 2 of the preset round hole in the second coordinate system X1Y1Z1 and the origin O and the X1 axis in the second coordinate system X1Y1Z1 specifically includes:

[0085] As Figure 10 shown, obtain the coordinates (x1, y1) of the starting point A1 of the processing lead 2 of the preset round hole in the second coordinate system X1Y1Z1;

[0086] Calculate the first angle α based on the coordinates (x1, y1) of the starting point A1: α = Arctan(y1 / x1).

[0087] Among them, in the X1OY1 plane of the second coordinate system X1Y1Z1, as an optional implementation manner of the value range of the first angle α, if the first angle α is above the X1 axis, the first angle α is a positive value; as another optional implementation manner of the value range of the first angle α, if the first angle α is below the X1 axis, the first angle α is a negative value.

[0088] In some alternative implementation manners of this embodiment, the processing lead 2 includes a straight lead 21 and an arc lead 22. Among them, the straight lead 21 is Figure 6 the straight line AB shown, Figure 7 the straight line A1B1 shown, Figure 8 the straight line A2B2 shown; the arc lead 22 is Figure 6 the arc BC shown, Figure 7 the arc B1C1 shown, Figure 8 the arc B2C2 shown. The length of the straight lead 21 is l, the radius of the arc lead 22 is r, and the length of the arc lead 22 is r; Step S420, the step of calculating the second included angle β between the extension line between the starting coordinate of the processing lead 2 and the origin O in the third coordinate system X2Y2Z2 and the X2 axis in the third coordinate system X2Y2Z2 specifically includes:

[0089] Based on the radius R of the preset circular hole, the length l of the straight lead 21, and the radius r of the arc lead 22, it is determined that the starting coordinate of the straight lead 21 is (R - l - r, r);

[0090] According to the radius r of the preset arc lead 22 and the coordinate (R - l - r, r) of the starting point A2, calculate the second included angle β (as Figure 11 shown): β = Arctan(r / R - l - r), where the second included angle β is always a positive value.

[0091] It should be noted that the starting point of the straight lead 21 is the starting point of the processing lead 2. The end point of the straight lead 21 coincides with the starting point of the arc lead 22 to form a connection point. The end point of the arc lead 22 is the end point of the processing lead 2, that is, the processing starting point of the preset processing circular hole 1; Based on this, the starting point of the processing lead 2 corresponds to A, A1, and A2 in the first coordinate system XYZ, the second coordinate system X1Y1Z1, and the third coordinate system X2Y2ZY2 respectively. The connection point corresponds to B, B1, and B2 in the first coordinate system XYZ, the second coordinate system X1Y1Z1, and the third coordinate system X2Y2ZY2 respectively. The end point of the processing lead 2 corresponds to C, C1, and C2 in the first coordinate system XYZ, the second coordinate system X1Y1Z1, and the third coordinate system X2Y2ZY2 respectively.

[0092] In some alternative implementation manners of this embodiment, Step S430, the step of calculating the third angle d according to the first included angle α and the second included angle β specifically includes:

[0093] Calculate the third angle d according to the first included angle α and the second included angle β: d = (α - β).

[0094] It should be noted that when the third angle d is positive, the second coordinate system X1Y1Z1 rotates clockwise around the Z1 axis; when the third angle d is negative, the second coordinate system X1Y1Z1 rotates counterclockwise around the Z1 axis.

[0095] In some alternative implementation manners of this embodiment, as Figure 3 and Figure 9 shown, before step S600: in the second coordinate system X1Y1Z1 that coincides with the third coordinate system X2Y2Z2, according to the processing lead line 2 and radius R of the preset round hole, controlling the processing tool in the laser processing equipment to process the round hole 1 on the processing surface of the workpiece to be processed, further includes:

[0096] Step S500: Obtain and parse the type index parameter input by the user;

[0097] Step S500a: When the type indication parameter is zero, set the coordinates of the processing end point D2 to coincide with those of the end point C2, that is, both are (R, 0). That is to say, it is set that on the processing surface of the workpiece to be processed, starting from the end point C2 (R, 0) of the processing lead line 2, after a circular trajectory with a radius of R, continue to stop processing at the end point C2 (R, 0) of the processing lead line 2 to obtain the required target round hole, and this target round hole is a closed round hole (as Figure 9 shown).

[0098] Of course, when step S500a is omitted, it can be defaulted that the processing trajectory is a perfect circular trajectory, that is, the same as the effect processed by step S500a.

[0099] Step S500b: When the type indication parameter is positive, obtain the non-closed length L1 of the preset round hole, and calculate the central angle θ corresponding to the non-closed length L1 with respect to the origin O: θ = L1 / 2πR; set the coordinates of the processing end point D2 to be (R * cosθ, R * sinθ).

[0100] As Figure 12 shown, it is set that on the processing surface of the workpiece to be processed, starting from the end point C2 (R, 0) of the processing lead line 2, stop processing after a non-closed length L1 with a radius of R to obtain the required target round hole. Since the processing end point D2 has not reached the end point C2 (R, 0) of the processing lead line 2, that is, this target round hole is a non-closed round hole.

[0101] Step S500c: When the type indication parameter is negative, obtain the repeated cutting length L2 of the preset round hole and calculate the central angle γ corresponding to the repeated cutting length L2 with respect to the origin O: γ = -L2 / 2πR; set the coordinates of the processing end point D2 to be (R * cosγ, R * sinγ).

[0102] AsFigure 13 As shown in the figure, it is set to machine on the machining surface of the workpiece to be machined. Starting from the end point C2(R, 0) of the machining lead 2, machining is carried out and stopped after a repeated cutting length L2 with a radius of R. At this time, the machining end point D2 has passed a certain distance from the end point C2(R, 0) of the machining lead 2 to obtain the required target circular hole. This target circular hole is a closed circular hole, but the machining tool continues to machine for a certain distance along the trajectory of this closed circular hole after machining out this closed circular hole.

[0103] In some alternative implementation manners of this embodiment, as Figure 9 shown, step S600: In the second coordinate system X1Y1Z1 that coincides with the preset third coordinate system X2Y2Z2, according to the machining lead 2 and the radius R of the preset circular hole, controlling the machining tool in the laser machining device to machine a circular hole 1 on the machining surface of the workpiece to be machined to obtain the target circular hole corresponding to the preset circular hole specifically includes:

[0104] In the second coordinate system X1Y1Z1 that coincides with the third coordinate system X2Y2Z2, controlling the machining tool such as a laser cutting head to move a distance l along the straight lead 21 from the starting point A2(R - l - r, r) of the machining lead 2 to the connection point B2(R - r, r), and then move along the arc lead 22 with the center o2 at (R - r, 0) and a radius of r to the end point C2(R, 0) of the machining lead 2, so that the laser cutting head contacts the machining surface of the workpiece to be machined, and machine a target circular hole with the origin O as the center and a radius of R on the machining surface of the workpiece to be machined in the clockwise direction.

[0105] To solve the above technical problems, an embodiment of the present invention further provides a laser machining device for performing the above laser machining circular hole method. This laser machining equipment includes:

[0106] A coordinate system reconstruction module for taking the center of the preset circular hole as the origin O and establishing a first coordinate system XYZ on the machining surface of the workpiece to be machined, with the same directions as those in the coordinate system of the laser machining device in all directions;

[0107] A first coordinate system rotation module for rotating the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1, so that the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the machining surface of the workpiece to be machined, that is, the X1OY1 plane in the second coordinate system X1Y1Z1 can be located on the machining surface of the workpiece to be machined, so that the relevant coordinates of the preset circular hole can fall on the machining surface of the workpiece to be machined;

[0108] A coordinate system coincidence determination module for determining whether the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2;

[0109] The second rotation module of the coordinate system is used to rotate the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2 when the second coordinate system X1Y1Z1 does not coincide with the preset third coordinate system X2Y2Z2;

[0110] The control module is used to, when the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, in the second coordinate system X1Y1Z1 that coincides with the third coordinate system X2Y2Z2, control the processing tool in the laser processing device according to the processing lead 2 and radius R of the preset round hole, such as controlling the laser cutting head in the laser processing device to process a round hole 1 on the processing surface of the workpiece to be processed, so as to obtain a target round hole corresponding to the preset round hole.

[0111] To solve the above technical problems, as Figure 14 shown, an embodiment of the present invention further provides a computer device, including a memory and a processor. A computer program is stored in the memory, and when the processor executes the computer program, the steps of the method for laser processing a round hole as described above are implemented.

[0112] The computer device 6 includes a memory 61, a processor 62, and a network interface 63 that are communicatively connected to each other through a system bus. It should be noted that only the computer device 6 with components 61-63 is shown in the figure, but it should be understood that it is not required to implement all the shown components, and more or fewer components can be alternatively implemented. Among them, those skilled in the art of the present technology can understand that the computer device here is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to microprocessors, application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0113] The computer device can be a computing device such as a desktop computer, a notebook, a palm computer, and a cloud server. The computer device can perform human-computer interaction with the user through a keyboard, a mouse, a remote control, a touchpad, or a voice control device, etc.

[0114] The memory at least includes one type of readable storage medium, which includes flash memory, hard disk, multimedia card, card-type memory (such as SD or DX memory, etc.), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disc, etc. In some embodiments, the memory may be an internal storage unit of the computer device, such as the hard disk or memory of the computer device. In other embodiments, the memory may also be an external storage device of the computer device, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, Flash Card, etc. equipped on the computer device. Of course, the memory may also include both the internal storage unit and the external storage device of the computer device. In this embodiment, the memory is generally used to store the operating system and various application software installed on the computer device, such as the program code of the method for laser processing circular holes. In addition, the memory may also be used to temporarily store various data that have been output or will be output.

[0115] In some embodiments, the processor may be a central processing unit (CPU), controller, microcontroller, microprocessor, or other data processing chip. The processor is generally used to control the overall operation of the computer device. In this embodiment, the processor is used to run the program code stored in the memory or process data, such as running the program code of the method for laser processing circular holes.

[0116] The network interface may include a wireless network interface or a wired network interface, which is generally used to establish a communication connection between the computer device and other electronic devices.

[0117] To solve the above technical problems, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the method for laser processing circular holes as described above are implemented.

[0118] Through the description of the above embodiments, those skilled in the art can clearly understand that the above method of the embodiment can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases, the former is a better implementation. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions for causing a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in various embodiments of the present invention.

[0119] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present invention in other related technical fields is similarly within the scope of the patent protection of the present invention.

Claims

1. A method for laser processing a circular hole, characterized in that, it includes the following steps: Taking the center of the preset circular hole as the origin O, a first coordinate system XYZ in the same directions as those in the coordinate system of the laser processing device is established on the processing surface of the workpiece to be processed; Rotating the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1 so that the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the processing surface of the workpiece to be processed; Judging whether the second coordinate system X1Y1Z1 coincides with a preset third coordinate system X2Y2Z2; If the second coordinate system X1Y1Z1 does not coincide with the preset third coordinate system X2Y2Z2, then rotating the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2; When the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, in the second coordinate system X1Y1Z1 after coinciding with the preset third coordinate system X2Y2Z2, according to the processing lead line and radius R of the preset circular hole, controlling the processing tool in the laser processing device to process a circular hole on the processing surface of the workpiece to be processed, so as to obtain a target circular hole corresponding to the preset circular hole; The step of rotating the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2 includes: Predicting the starting point coordinate A1 of the processing lead line in the second coordinate system X1Y1Z1, and calculating the first angle α between the extension line OA1 between the starting point coordinate A1 and the origin O and the X1 axis in the second coordinate system X1Y1Z1; Obtaining the starting point coordinate A2 of the processing lead line in the preset third coordinate system X2Y2Z2, and calculating the second angle β between the extension line OA2 between the starting point coordinate A2 and the origin O and the X2 axis in the third coordinate system X2Y2Z2; Calculating a third angle d according to the first angle α and the second angle β, and rotating the second coordinate system X1Y1Z1 around the Z1 axis in the second coordinate system X1Y1Z1 by the third angle d so that the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2.

2. The method for laser processing a circular hole according to claim 1, characterized in that, the step of rotating the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1, and the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the processing surface of the workpiece to be processed specifically includes: Obtaining a first angle a and a second angle c, rotating the first coordinate system XYZ around the X axis in the first coordinate system XYZ by the first angle a, and rotating the first coordinate system XYZ around the Z axis in the first coordinate system XYZ by the second angle c to obtain the second coordinate system X1Y1Z1, and the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the processing surface of the workpiece to be processed; Alternatively, obtain the first angle a and the second angle c, rotate the first coordinate system XYZ about the Z axis in the first coordinate system XYZ by the second angle c, and rotate the first coordinate system XYZ about the X axis in the first coordinate system XYZ by the first angle a to obtain the second coordinate system X1Y1Z1, wherein the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the machining surface of the workpiece to be machined.

3. The method for laser machining a circular hole according to claim 1, wherein, before the step of controlling the machining tool in the laser machining device to machine a circular hole on the machining surface of the workpiece to be machined according to the machining lead and the radius R of the preset circular hole in the second coordinate system X1Y1Z1 that coincides with the third coordinate system X2Y2Z2, further comprising: obtaining and parsing the type index parameter input by the user; when the type indication parameter is a positive number, obtain the non-closed length L1 of the preset circular hole, calculate the central angle θ corresponding to the non-closed length L1 with respect to the origin O based on the non-closed length L1: θ = L1 / 2πR; set the coordinates of the machining end point to (R * cosθ, R * sinθ); or, when the type indication parameter is a negative number, obtain the repeated cutting length L2 of the preset circular hole, calculate the central angle γ corresponding to the repeated cutting length L2 with respect to the origin O based on the repeated cutting length L2: γ = -L2 / 2πR; set the coordinates of the machining end point D2 to (R * cosγ, R * sinγ).

4. The method for laser machining a circular hole according to claim 1, wherein, the step of calculating the first angle α between the extension line OA1 between the starting point A1 of the machining lead in the second coordinate system X1Y1Z1 and the origin O and the X1 axis in the second coordinate system X1Y1Z1 according to the machining lead of the preset circular hole specifically comprises: obtaining the coordinates (x1, y1) of the starting point A1 of the machining lead of the preset circular hole in the second coordinate system X1Y1Z1; calculating the first angle α according to the coordinates (x1, y1) of the starting point A1: α = Arctan(y1 / x1), wherein, in the X1OY1 plane of the second coordinate system X1Y1Z1, if the first angle α is above the X1 axis, the first angle α is a positive value; if the first angle α is below the X1 axis, the first angle α is a negative value.

5. The method for laser machining a circular hole according to claim 1, wherein, the machining lead includes a straight lead and an arc lead, the length of the straight lead is l, the radius of the arc lead is r, and the length of the arc lead is r; the step of calculating the second angle β between the extension line between the starting coordinate of the machining lead in the third coordinate system X2Y2Z2 and the origin O and the X2 axis in the third coordinate system X2Y2Z2 specifically comprises: Based on the radius R of the preset circular hole, the length of the straight lead wire being l, and the radius of the arc lead wire being r, determine that the starting coordinate of the straight lead wire is (R - l - r, r); Calculate the second included angle β according to the radius of the arc lead wire being r and the coordinate (R - l - r, r) of the starting point A2: β = Arctan(r / R - l - r), where the second included angle β is a positive value.

6. The method for laser machining a circular hole according to claim 1, wherein, the step of calculating the third angle d according to the first included angle α and the second included angle β specifically includes: Calculate the third angle d according to the first included angle α and the second included angle β: d = (α - β).

7. A laser machining device for performing the method for laser machining a circular hole according to any one of claims 1 to 6, wherein, it includes: A coordinate system reconstruction module for taking the center of the preset circular hole as the origin O and establishing a first coordinate system XYZ on the machining surface of the workpiece to be machined, with the same directions as those in the coordinate system of the laser machining device in all directions; A coordinate system first rotation module for rotating the first coordinate system XYZ to obtain a second coordinate system X1Y1Z1, so that the Z1 axis in the second coordinate system X1Y1Z1 is perpendicular to the machining surface of the workpiece to be machined; A coordinate system coincidence determination module for determining whether the second coordinate system X1Y1Z1 coincides with a preset third coordinate system X2Y2Z2; A coordinate system second rotation module for, when the second coordinate system X1Y1Z1 does not coincide with the preset third coordinate system X2Y2Z2, rotating the second coordinate system X1Y1Z1 to coincide with the preset third coordinate system X2Y2Z2; A control module for, when the second coordinate system X1Y1Z1 coincides with the preset third coordinate system X2Y2Z2, in the second coordinate system X1Y1Z1 after coinciding with the third coordinate system X2Y2Z2, controlling the machining tool in the laser machining device to machine a circular hole on the machining surface of the workpiece to be machined according to the machining lead wire and the radius R of the preset circular hole, so as to obtain a target circular hole corresponding to the preset circular hole.

8. A computer device, wherein, it includes a memory and a processor, and a computer program is stored in the memory. When the processor executes the computer program, the steps of the method for laser machining a circular hole according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium, wherein, a computer program is stored on the computer-readable storage medium. When the computer program is executed by a processor, the steps of the method for laser machining a circular hole according to any one of claims 1 to 6 are implemented.

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