Capacitors

Abstract

A film capacitor (1) comprises a capacitor element, a first bus bar and a second bus bar, a housing, and a filling resin. The first bus bar and the second bus bar respectively have a first overlapping portion and a second overlapping portion, and the first overlapping portion and the second overlapping portion overlap each other with an insulating plate sandwiched therebetween. The first overlapping portion, the second overlapping portion, and the insulating plate include a covering portion covered by the filling resin and an exposed portion exposed from the filling resin, and have a through hole that penetrates in the overlapping direction of the first overlapping portion, the second overlapping portion, and the insulating plate. Furthermore, the through hole is formed to straddle the boundary between the covering portion and the exposed portion.

Description

Technical Field

[0001] The present invention relates to capacitors. Background Art

[0002] Patent document 1 describes a film capacitor, in which the capacitor elements connected to the front busbar and the rear busbar are housed in a housing filled with a filling resin, and the front busbar and the rear busbar each include a third plate portion that overlaps each other with an insulating module sandwiched therebetween, thereby achieving a reduction in ELS (equivalent series inductance). Each third plate portion rises from the second plate portion covered by the filling resin in the housing, and has a covering portion covered by the filling resin and an exposed portion exposed from the filling resin. A plurality of connection terminal portions to which the terminals of an external device are connected are provided at the upper end of each third plate portion.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-112168 Summary of the invention

[0006] -Problems to be solved by the invention-

[0007] The above-mentioned film capacitor can be used in various environments depending on its purpose. For example, when the film capacitor is used in an environment with large temperature changes, due to the difference in the linear expansion coefficient (thermal expansion coefficient) between each third plate portion of the metal front busbar and the rear busbar and the filling resin, stress is generated at the boundary portion between the covered portion and the exposed portion of each third plate to separate the third plate portion and the filling resin that are closely attached to each other, and cracks and peeling are likely to occur between them. Therefore, if the moisture resistance of the filling resin is reduced, the capacitor element covered by the filling resin may have undesirable conditions such as reduced capacity and deteriorated insulation due to contact with moisture.

[0008] In view of this problem, an object of the present invention is to provide a capacitor in which a first bus bar and a second bus bar respectively have a first overlapping portion and a second overlapping portion that overlap with each other with an insulating plate sandwiched therebetween, and when these overlapping portions are configured to be exposed from a filling resin, cracks and peeling are unlikely to occur between these overlapping portions and the filling resin, thereby being able to suppress a reduction in moisture resistance due to the filling resin.

[0009] -Methods for solving the problem-

[0010] The capacitor involved in the main mode of the present invention comprises: a capacitor element; a first bus bar and a second bus bar respectively connected to electrodes at both ends of the capacitor element; a housing that accommodates the capacitor element; and a filling resin filled in the housing. Here, the first bus bar and the second bus bar respectively have a first overlapping portion and a second overlapping portion, and the first overlapping portion and the second overlapping portion overlap each other with an insulating plate sandwiched therebetween. The first overlapping portion, the second overlapping portion, and the insulating plate include a covering portion covered by the filling resin and an exposed portion exposed from the filling resin, and have a through hole that penetrates in the overlapping direction of the first overlapping portion, the second overlapping portion, and the insulating plate. Furthermore, the through hole is formed to cross the boundary between the covering portion and the exposed portion.

[0011] -Effects of the Invention-

[0012] According to the present invention, a capacitor can be provided, in which a first bus bar and a second bus bar respectively have a first overlapping portion and a second overlapping portion that overlap with each other with an insulating plate sandwiched therebetween, and in a structure in which these overlapping portions are exposed from a filling resin, cracks and peeling are unlikely to occur between these overlapping portions and the filling resin, thereby being able to suppress a reduction in moisture resistance based on the filling resin.

[0013] The effects and significance of the present invention will become more apparent through the description of the following embodiments. However, the following embodiments are merely examples of implementing the present invention, and the present invention is not limited to the embodiments described in the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view of a film capacitor according to an embodiment.

[0015] Figure 2 (a) is a perspective view of a capacitor element unit according to an embodiment as viewed from the front, Figure 2 (b) is a perspective view of the capacitor element unit according to the embodiment as viewed from the rear.

[0016] Figure 3 (a) is a perspective view of a first bus bar according to an embodiment, Figure 3 (b) is a perspective view of the second bus bar according to the embodiment.

[0017] Figure 4 (a) is a perspective view of an insulating plate according to an embodiment as viewed from the front, Figure 4 (b) is a perspective view of the insulating plate according to the embodiment as seen from the rear.

[0018] Figure 5(a) and (b) are respectively a perspective view and a top view of the housing according to the embodiment.

[0019] Figure 6 It is a side cross-sectional view of the thin film capacitor according to the embodiment, cut at the position of the second through hole from the left. DETAILED DESCRIPTION

[0020] Hereinafter, a film capacitor 1 as one embodiment of the capacitor of the present invention will be described with reference to the accompanying drawings. For convenience, the directions of front and back, left and right, and up and down are appropriately indicated in each figure. In addition, the directions shown in the figures only represent the relative directions of the film capacitor 1, and do not represent the absolute directions.

[0021] In this embodiment, the film capacitor 1 corresponds to the "capacitor" described in the claims. In addition, the first electrode 410 and the second electrode 420 correspond to the "electrode" described in the claims. Furthermore, the protruding piece 515 corresponds to the "engaged portion" described in the claims. Furthermore, the claw piece 718 corresponds to the "engaging portion" described in the claims.

[0022] However, the above description is only intended to establish correspondence between the configuration of the claims and the configuration of the embodiments, and the invention described in the claims is not limited to the configuration of the embodiments through the above correspondence.

[0023] Figure 1 is a perspective view of the film capacitor 1 .

[0024] The film capacitor 1 includes a capacitor element unit 100, a housing 200, and a filling resin 300. The capacitor element unit 100 is accommodated in the housing 200, and the housing 200 is filled with the filling resin 300. The filling resin 300 is a thermosetting resin, such as an epoxy resin. The housing 200 and the filling resin 300 protect the majority of the capacitor element unit 100 buried in the filling resin 300 from moisture and impact.

[0025] Figure 2 (a) is a perspective view of the capacitor element unit 100 viewed from the front. Figure 2 (b) is a perspective view of the capacitor element unit 100 as viewed from the rear. Figure 3 (a) is a perspective view of the first bus bar 500. Figure 3 (b) is a perspective view of the second bus bar 600 . Figure 4 (a) is a perspective view of the insulating plate 700 viewed from the front. Figure 4 (b) is a perspective view of the insulating plate 700 viewed from the rear.

[0026] The capacitor element unit 100 includes six capacitor elements 400 , a first bus bar 500 , a second bus bar 600 , and an insulating plate 700 .

[0027] The capacitor element 400 is formed by overlapping two metallized films on which aluminum is vapor-deposited on a dielectric film, and winding or stacking the overlapped metallized films and pressing them into a flat shape. On one end face of the capacitor element 400, a first electrode 410 is formed by spraying a metal such as zinc, and on the other end face, a second electrode 420 is formed by spraying a metal such as zinc. The six capacitor elements 400 are arranged in the left-right direction with both end faces facing the front-back direction.

[0028] The first bus bar 500 is formed by appropriately cutting and bending a conductive material, such as a copper plate, and has a structure in which a first main body portion 510 , a first overlapping portion 520 , and three first connection terminal portions 530 are integrated.

[0029] The first main body 510 is long in the left-right direction, and includes: an upper surface portion 510a covering most of the circumference of the six capacitor elements 400, and a front surface portion 510b covering a portion of the first electrode 410 of the six capacitor elements 400. A pair of first electrode terminals 511 having a pin shape are formed at positions corresponding to each of the first electrodes 410 at the lower end of the front surface portion 510b. In the upper surface portion 510a, six oblong flow holes 512 and five circular flow holes 513 are formed to be alternately arranged in the left-right direction. In addition, in the upper surface portion 510a, six square flow holes 514 are formed in front of the six flow holes 512. The front side of each flow hole 514 extends to the front surface portion 510b.

[0030] The first overlapping portion 520 rises upward (in a direction away from the capacitor element 400) from the rear end of the upper surface portion 510a of the first main body portion 510. The first overlapping portion 520 is long in the left-right direction (longer in the left-right direction than in the up-down direction), and the left side portion 520a extends upward further than the central portion 520b, and the central portion 520b extends upward further than the right side portion 520c. In the first overlapping portion 520, cutouts 521, 522, and 523 are formed at the left and right ends of the left side portion 520a and the right end of the central portion 520b, respectively.

[0031] In the first overlapping portion 520, five square first holes 524 are formed at the lower end so as to be arranged in the longitudinal direction, that is, the left-right direction. The upper and lower dimensions of the first hole 524 at the right end are smaller than those of the other first holes 524. The lower side of each first hole 524 extends to the upper surface portion 510a of the first main body portion 510. In the upper surface portion 510a, square protrusion pieces 515 protruding backward are formed at the lower edges of the first and fourth first holes 524 from the left.

[0032] The three first connection terminal portions 530 have a square shape and are arranged at predetermined intervals in the left-right direction at the upper end of the left side portion 520a of the first overlapping portion 520. A circular mounting hole 531 is formed in each of the first connection terminal portions 530.

[0033] The second bus bar 600 is formed by appropriately cutting and bending a conductive material, such as a copper plate, and has a structure in which a second main body portion 610 , a second overlapping portion 620 , and a second connection terminal portion 630 are integrated.

[0034] The second main body 610 is long in the left-right direction and includes an upper surface 610a covering a portion of the peripheral surface of the six capacitor elements 400 and a rear surface 610b covering a portion of the second electrodes 420 of the six capacitor elements 400. A pair of second electrode terminals 611 having a pin shape are formed at positions corresponding to the second electrodes 420 at the lower end of the rear surface 610b. In addition, a square engagement hole 612 is formed at the left and right ends of the rear surface 610b.

[0035] The second overlapping portion 620 rises upward (in a direction away from the capacitor element 400) from the front end of the upper surface portion 610a of the second main body portion 610. The second overlapping portion 620 is long in the left-right direction (longer in the left-right direction than in the up-down direction), and the left side portion 620a extends further upward than the central portion 620b, and the central portion 620b extends further upward than the right side portion 620c. In the second overlapping portion 620, cutouts 621, 622, and 623 are formed at the left and right ends of the left side portion 620a and the right end of the central portion 620b, respectively.

[0036] Five square second holes 624 are formed at the lower end of the second overlapping portion 620 so as to be arranged in the longitudinal direction, that is, the left-right direction. The upper and lower dimensions of the second hole 624 at the right end are smaller than those of the other second holes 624. The lower side of each second hole 624 extends to the rear surface portion 610b of the second main body portion 610.

[0037] The three second connection terminal portions 630 have a square shape and are arranged at predetermined intervals in the left-right direction at the upper end of the left side portion 620a of the second overlapping portion 620. A circular mounting hole 631 is formed in each of the second connection terminal portions 630.

[0038] The insulating plate 700 is formed of a resin such as polyphenylene sulfide (PPS) and has insulating properties. The insulating plate 700 includes a first insulating portion 710 and a second insulating portion 720 .

[0039] The first insulating portion 710 is a long strip in the left-right direction (longer in the left-right direction than in the up-down direction), and includes a left side portion 710a, a central portion 710b, and a right side portion 710c corresponding to the left side portions 520a, 620a, the central portions 520b, 620b, and the right side portions 520c, 620c of the first overlapping portion 520 of the first bus bar 500 and the second overlapping portion 620 of the second bus bar 600, respectively.

[0040] Hook-shaped engagement pieces 711, 712, and 713 are formed on the left and right ends of the left side portion 710a and the right end of the center portion 710b on the front surface side of the first insulating portion 710. The engagement piece 711 is connected to a rib 711a below, and the engagement piece 713 is connected to a rib 713a above.

[0041] On the rear surface side of the first insulating portion 710, hook-shaped engaging pieces 714, 715, and 716 are formed at the left and right ends of the left side portion 710a and the right end of the central portion 710b. The engaging piece 714 is connected to a rib 714a below, the engaging piece 715 is connected to a rib 715a below, and the engaging piece 716 is connected to a rib 716a above.

[0042] Five third holes 717 of square shape are formed at the lower end of the first insulating portion 710 so as to be arranged in the longitudinal direction, i.e., the left-right direction. The vertical dimension of the third hole 717 at the right end is smaller than that of the other third holes 717. Each third hole 717 is formed at a position corresponding to each first hole 524 and each second hole 624.

[0043] In the first insulating portion 710, claw pieces 718 extending downward are formed at the upper edges of the first and fourth third holes 717 from the left. At the front end of the claw piece 718, a claw 718a is provided.

[0044] The second insulating portion 720 is formed at the lower end of the first insulating portion 710, extending in the front-to-back direction, extending greatly to the front side, and slightly extending to the rear side. The second insulating portion 720 has claw pieces 721 extending downwardly formed at the left and right ends of the rear side. A claw 721a is provided at the front end of the claw piece 721.

[0045] When assembling the capacitor element unit 100, first, the first bus bar 500 is assembled on the front side of the insulating plate 700. During assembly, the engaging pieces 711, 712, 713 corresponding to the three cutouts 521, 522, 523 pass through the three cutouts 521, 522, 523, so that the first overlapping portion 520 of the first bus bar 500 is pressed against the front surface of the first insulating portion 710 of the insulating plate 700 and then pressed down. The claw piece 718 of the first insulating portion 710 is elastically deformed backward and moved to the bottom of the claw piece 718, so that the protruding piece 515 of the first main body 510 of the first bus bar 500 is engaged with the claw piece 718 in the vertical direction. In addition, the left and right engaging pieces 711 and 712 of the left side portion 710a of the first insulating portion 710 engage with the left and right ends of the left side portion 520a of the first overlapping portion 520, and the engaging piece 713 of the central portion 710b of the first insulating portion 710 engages with the right end of the central portion 520b of the first overlapping portion 520. Thus, the first bus bar 500 is positioned and fixed relative to the insulating plate 700 so as not to move in the front-rear, left-right, and up-down directions.

[0046] Similarly, the second bus bar 600 is assembled to the rear side of the insulating plate 700. During assembly, the engaging pieces 714, 715, 716 corresponding to the three cutouts 621, 622, 623 pass through the three cutouts 621, 622, 623, so that the second overlapping portion 620 of the second bus bar 600 is pressed against the rear surface of the first insulating portion 710 of the insulating plate 700 and then pressed down. The rear surface portion 610b of the second main body portion 610 of the second bus bar 600 causes the claw piece 721 of the second insulating portion 720 to elastically deform forward and move downward, and the engaging hole 612 of the rear surface portion 610b engages with the claw piece 721 in the vertical direction. In addition, the left and right engaging pieces 714 and 715 of the left side portion 710a of the first insulating portion 710 engage with the left and right ends of the left side portion 620a of the second overlapping portion 620, and the engaging piece 716 of the central portion 710b of the first insulating portion 710 engages with the right end of the central portion 620b of the second overlapping portion 620. Thus, the second bus bar 600 is positioned and fixed relative to the insulating plate 700 so as not to move in the front-rear, left-right, and up-down directions.

[0047] The first hole 524 of the first overlapping portion 520, the second hole 624 of the second overlapping portion 620, and the third hole 717 of the first insulating portion 710 are overlapped in the front-to-back direction, thereby forming a through hole 110 that penetrates the first overlapping portion 520, the second overlapping portion 620, and the first insulating portion 710 in the front-to-back direction of these overlaps. In addition, the three first connection terminal portions 530 of the first bus bar 500 and the second connection terminal portions 630 of the second bus bar 600 are alternately arranged in the left-right direction.

[0048] Next, the first bus bar 500 and the second bus bar 600 are connected to the six capacitor elements 400. That is, each first electrode terminal 511 of the first main body 510 of the first bus bar 500 is joined to the first electrode 410 of each capacitor element 400 by a joining method such as welding. Thus, the first bus bar 500 is electrically connected to each first electrode 410 of the six capacitor elements 400. Similarly, each second electrode terminal 611 of the second main body 610 of the second bus bar 600 is joined to the second electrode 420 of each capacitor element 400 by a joining method such as welding. Thus, the second bus bar 600 is electrically connected to each second electrode 420 of the six capacitor elements 400. In this way, as Figure 2 As shown in (a) and (b), the capacitor element unit 100 is completed.

[0049] The first overlapping portion 520 of the first bus bar 500 and the second overlapping portion 620 of the second bus bar 600 overlap front and back with the first insulating portion 710 of the insulating plate 700 interposed therebetween. Thus, the ESL (equivalent series inductance) of the first bus bar 500 and the second bus bar 600 can be reduced. In addition, the insulation between the first overlapping portion 520 and the second overlapping portion 620 can be ensured by the first insulating portion 710. In particular, since the third hole 717 is smaller than the first hole 524 and the second hole 624 and converges within the opening area of ​​the first hole 524 and the second hole 624, the creepage distance between the first overlapping portion 520 and the second overlapping portion 620 can be increased, and the insulation can be fully ensured. Furthermore, the insulation between the first overlapping portion 520 and the second electrodes 420 of the six capacitor elements 400 can be ensured by the second insulating portion 720.

[0050] Figure 5 (a) and (b) are respectively a three-dimensional view and a top view of the housing 200.

[0051] The housing 200 is made of resin, for example, formed by polyphenylene sulfide (PPS) as a thermoplastic resin. The housing 200 is formed in a substantially rectangular box shape that is long in the left-right direction, and has an opening on the upper surface. At the four corners of the housing 200, a storage recess 210 is formed on the upper inner side. In addition, mounting tabs 220 are provided on the outer surface of the bottom, left and right sides of the housing 200. A through hole 221 is formed in each mounting tab 220. In the through hole 221, a metal collar 222 is embedded to increase the strength of the hole. In addition, positioning pins 223 protruding forward are formed on the front surface of the left and right mounting tabs 220. When the film capacitor 1 is set in the setting portion of the external device, after positioning based on the positioning pins 223, the mounting tabs 220 are fixed to the setting portion by screws or the like.

[0052] The capacitor element unit 100 is received in the housing 200 through the opening 201. The left and right ends of the front surface portion 510b of the first main body portion 510 of the first bus bar 500 are received in the left and right receiving recesses 210 on the front side, and the left and right ends of the rear surface portion 610b of the second main body portion 610 of the second bus bar 600 are received in the left and right receiving recesses 210 on the rear side. Thus, the capacitor element unit 100 is positioned relative to the housing 200.

[0053] The filling resin 300 is injected into the housing 200 that accommodates the capacitor element unit 100 in a liquid state. At this time, the filling resin 300 in a liquid state passes through the flow holes 512, 513, and 514 provided in the first bus bar 500. In addition, the filling resin 300 in a liquid state passes through the through hole 110. As a result, the housing 200 is smoothly filled with the filling resin 300. The filling resin 300 is filled to a position near the opening 201 of the housing 200. Then, if the housing 200 is heated, the filling resin 300 is cured. In this way, Figure 1 As shown, the film capacitor 1 is completed.

[0054] If the film capacitor 1 is mounted on an external device, the three first connecting terminal portions 530 of the first bus bar 500 are fixed by threads using the mounting holes 531 and connected to the external terminals of the external device corresponding to them, and the second connecting terminal portion 630 of the second bus bar 600 is fixed by threads using the mounting holes 631 and connected to the external terminals of the external device corresponding to them.

[0055] Figure 6 FIG. 1 is a side cross-sectional view of the film capacitor 1 cut at the position of the second through hole 110 from the left. Figure 6 In FIG. 1 , for convenience, only the portion of the injection molding surface (the surface exposed to the outside) filled with the resin 300 is indicated by a dotted line.

[0056] like Figure 6 As shown, in the capacitor element unit 100, the first overlapping portion 520 of the first bus bar 500, the second overlapping portion 620 of the second bus bar 600, and the first insulating portion 710 of the insulating plate 700 include a covering portion covered by the filling resin 300 and an exposed portion exposed from the filling resin 300, and the through hole 110 is formed to span the boundary BL between the covering portion and the exposed portion.

[0057] When the thin film capacitor 1 is used in an environment with large temperature changes, due to the difference in linear expansion coefficients (thermal expansion coefficients) between the first overlapping portion 520 and the filling resin 300 and between the second overlapping portion 620 and the filling resin 300, stress is easily generated in the boundary BL to separate the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 that are closely attached to each other.

[0058] In the present embodiment, at the boundary BL, since the number of the plurality of (five) through holes 110 is reduced in the portion where the first overlapping portion 520 and the filling resin 300 are in close contact with each other and the portion where the second overlapping portion 620 and the filling resin 300 are in close contact with each other, the stress to separate the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 as a whole is reduced. In addition, since the filling resin 300 in contact with the first overlapping portion 520 and the filling resin 300 in contact with the second overlapping portion 620 are connected through the through holes 110, the resistance to the above stress is increased compared to the case where the filling resin 300 is interrupted by the first insulating portion 710 of the insulating plate 700, and the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 are difficult to separate. Thus, cracks and peeling are less likely to occur between the first overlapping portion 520 and the filling resin 300 and between the second overlapping portion 620 and the filling resin 300 , and therefore moisture is less likely to intrude into the filling resin 300 from between these portions.

[0059] <Effects of Implementation Methods>

[0060] As described above, according to this embodiment, the following effects are achieved.

[0061] The first bus bar 500 and the second bus bar 600 of the film capacitor 1 respectively have a first overlapping portion 520 and a second overlapping portion 620 that overlap each other with the insulating plate 700 interposed therebetween. Furthermore, the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 include a covering portion covered by the filling resin 300 and an exposed portion exposed from the filling resin 300, and have a through hole 110 that penetrates in the overlapping direction (front-rear direction) in which the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 overlap. Furthermore, the through hole 110 is formed to straddle a boundary BL between the covering portion and the exposed portion.

[0062] Through this structure, in order to achieve the reduction of ELS, the first bus bar 500 and the second bus bar 600 of the film capacitor 1 respectively have a first overlapping portion 520 and a second overlapping portion 620 that overlap with each other by sandwiching an insulating plate 700. When the structure is set to be exposed from the filling resin 300 in these overlapping portions 520, 620, it is difficult for cracks and peeling to occur between these overlapping portions 520, 620 and the filling resin 300 even when used in an environment with large temperature changes. Therefore, it is difficult for moisture to penetrate from between them into the interior of the filling resin 300, and the reduction in moisture resistance based on the filling resin 300 can be suppressed.

[0063] In addition, the first hole 524, the second hole 624, and the third hole 717 are formed in the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700, respectively, and the through hole 110 is formed by overlapping these holes 524, 624, and 717. The third hole 717 is smaller than the first hole 524 and the second hole 624, and is contained within the opening area of ​​the first hole 524 and the second hole 624.

[0064] With this structure, the creeping distance between the first overlapping portion 520 and the second overlapping portion 620 can be increased in the through hole 110 , so that insulation between them can be easily ensured.

[0065] Furthermore, a plurality (6) of capacitor elements 400 are arranged and stored in a predetermined direction (left-right direction) in the housing 200. Furthermore, the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 are formed to be long in the predetermined direction, and a plurality (5) of through holes 110 are provided so as to be arranged in the predetermined direction.

[0066] Through this structure, even if the first overlapping portion 520 and the second overlapping portion 620 are formed into long strips in the direction in which the plurality of capacitor elements 400 are arranged in order to easily reduce ELS, it is possible to arrange the plurality of through holes 110 in the direction of the long strips, thereby making it difficult for cracks and peeling to occur between the first overlapping portion 520 and the second overlapping portion 620 and the filling resin 300, thereby suppressing the reduction in moisture resistance based on the filling resin 300.

[0067] Furthermore, the insulating plate 700 is provided with a claw piece 718 extending from the edge of the third hole 717 in a direction perpendicular to the overlapping direction of the first overlapping portion 520 , the second overlapping portion 620 and the insulating plate 700 (downward direction), and the first bus bar 500 is provided with a protruding piece 515 engaged with the claw piece 718 .

[0068] With this configuration, the first bus bar 500 can be positioned relative to the insulating plate 700 using the third hole 717 formed in the insulating plate 700 to form the through hole 110 .

[0069] As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Moreover, application examples of this invention can also be variously changed other than the said embodiment.

[0070] For example, in the above-mentioned embodiment, the first overlapping portion 520 of the first bus bar 500, the second overlapping portion 620 of the second bus bar 600, and the first insulating portion 710 of the insulating plate 700 are formed to be long strips in the arrangement direction (left-right direction) of the capacitor elements 400, and a plurality of through holes 110 are provided so as to be arranged in the long strip direction. However, the first overlapping portion 520, the second overlapping portion 620, and the first insulating portion 710 may not be long strips in the arrangement direction of the capacitor elements 400, in which case only one through hole 110 may be provided.

[0071] Furthermore, in the above-described embodiment, the second bus bar 600 is positioned in the vertical direction relative to the insulating plate 700 by engaging the claw piece 721 provided on the second insulating portion 720 of the insulating plate 700 with the engaging hole 612 provided on the second bus bar 600. However, claw pieces for the second bus bar 600 may be provided in the third hole 717 of the first insulating portion 710 of the insulating plate 700 where the claw piece 718 for the first bus bar 500 is not provided, and protruding pieces may be provided on the upper surface portion 610a of the second main body portion 610 of the second bus bar 600, and the second bus bar 600 may be positioned in the vertical direction relative to the insulating plate 700 by engaging these claw pieces with the protruding pieces.

[0072] Furthermore, in the above-described embodiment, six capacitor elements 400 are included in capacitor element unit 100. However, the number of capacitor element 400 may be one, and can be changed as appropriate.

[0073] Furthermore, in the above-mentioned embodiment, the capacitor element 400 is formed by a metallized film on which aluminum is evaporated on a dielectric film, but in addition, it can also be formed by a metallized film on which other metals such as zinc and magnesium are evaporated. Alternatively, the capacitor element 400 can also be formed by a metallized film on which a plurality of metals among these metals are evaporated, or by a metallized film on which alloys of these metals are evaporated. In addition, in the above-mentioned embodiment, the capacitor element 400 is formed by overlapping two metallized films on which aluminum is evaporated on a dielectric film and winding or stacking the overlapping metallized films, but in addition, it is also possible to overlap metallized films and insulating films on both sides of a dielectric film and wind or stack them, thereby forming these capacitor elements 400.

[0074] Furthermore, in the above-described embodiment, the film capacitor 1 is described as an example of the capacitor of the present invention. However, the present invention is also applicable to capacitors other than the film capacitor 1.

[0075] In addition, various modifications can be appropriately made to the embodiments of the present invention within the scope of the technical concept shown in the claims.

[0076] In the description of the above embodiments, terms indicating directions such as “above” and “below” indicate relative directions that depend only on the relative positional relationship of structural members, and do not indicate absolute directions such as vertical directions and horizontal directions.

[0077] Industrial Applicability

[0078] The present invention is useful for capacitors used in various electronic devices, electrical equipment, industrial equipment, vehicle electrical equipment, and the like.

[0079] -Explanation of symbols-

[0080] 1 Film capacitor (capacitor)

[0081] 100 Capacitor Element Units

[0082] 110 Through hole

[0083] 200 Shell

[0084] 300 Filling Resin

[0085] 400 Capacitor Elements

[0086] 410 1st electrode (electrode)

[0087] 420 2nd electrode (electrode)

[0088] 500 Bus Bar 1

[0089] 515 protruding piece (engaged portion)

[0090] 520 1st overlapping part

[0091] 524 Hole 1

[0092] 600 Bus Bar 2

[0093] 620 The second overlapping part

[0094] 624 Hole 2

[0095] 700 Insulation Board

[0096] 717 Hole 3

[0097] 718 claw piece (engaging part)

[0098] BL boundary.

Claims

1. A capacitor having: Capacitor elements; A first bus bar and a second bus bar are connected to electrodes at both ends of the capacitor element, respectively; a housing for housing the capacitor element; and A filling resin is filled in the housing. The first bus bar and the second bus bar have a first overlapping portion and a second overlapping portion, respectively. The first overlapping portion and the second overlapping portion overlap each other with an insulating plate interposed therebetween. The first overlapping portion, the second overlapping portion, and the insulating plate include a covered portion covered by the filling resin and an exposed portion exposed from the filling resin, and have a through hole penetrating in an overlapping direction in which the first overlapping portion, the second overlapping portion, and the insulating plate overlap. The through hole is formed so as to straddle a boundary between the cover portion and the exposed portion.

2. The capacitor according to claim 1, wherein: A first hole, a second hole, and a third hole are formed in the first overlapping portion, the second overlapping portion, and the insulating plate, respectively. The first hole, the second hole, and the third hole overlap each other, thereby forming the through hole.

3. The capacitor according to claim 2, wherein: The third hole is smaller than the first hole and the second hole, and is contained within the opening regions of the first hole and the second hole.

4. The capacitor according to any one of claims 1 to 3, wherein: In the housing, a plurality of capacitor elements including the capacitor element are arranged in a predetermined direction and accommodated. The first overlapping portion, the second overlapping portion, and the insulating plate are elongated in the predetermined direction. A plurality of through holes including the through hole are provided so as to be aligned in the predetermined direction.

5. The capacitor according to claim 2 or 3, wherein: The insulating plate is provided with an engaging portion extending from an edge of the third hole in a direction perpendicular to the overlapping direction. The first bus bar is provided with an engaged portion that engages with the engaging portion.

Images