Steam circulation system for cooling components and related methods

Abstract

A vapor cycle system for cooling a component includes a refrigeration circuit through which a mass of refrigerant flows. The refrigeration circuit in turn includes a compressor, a first condenser, a second condenser fluidly coupled to the first condenser in series or in parallel, an expansion valve, and an evaporator. In addition, the system includes a refrigerant filling control device configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit.

Description

Technical Field

[0001] The present disclosure relates generally to systems and methods for cooling components and, more particularly, to a vapor cycle system having a series condenser for cooling components, such as one or more aircraft components, and related methods. Background Art

[0002] In recent years, the number and complexity of electronic equipment within aircraft has increased dramatically. As a result, the power consumption of heat generated by such electronic equipment has also increased significantly. In this regard, air cooling systems are generally unable to provide adequate cooling for aircraft electronics. Therefore, vapor cycle systems have been used in many aircraft to meet the increased cooling requirements of aircraft electronics.

[0003] Typically, vapor cycle systems facilitate the removal of heat to multiple heat sinks simultaneously or independently. For example, such heat sinks may be fuel supplied to an aircraft engine, ram air, and / or air within a bypass duct of an aircraft engine. However, during operation of an aircraft, the availability of heat sinks may vary through different regions of a flight envelope or mission. That is, when one heat sink is available, another heat sink may not be available. Thus, the quality of the refrigerant present in the system may have different effects on the operation of the vapor cycle system, depending on which condenser or condensers are used to remove heat from the electronic equipment.

[0004] Therefore, improved vapor cycle systems and related methods for cooling components, such as aircraft components, would be welcome in the art. Summary of the invention

[0005] Aspects and advantages of the disclosure will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the disclosure.

[0006] In one aspect, the subject matter relates to a vapor cycle system for cooling a component. The system includes a refrigeration circuit through which a mass of refrigerant flows. The refrigeration circuit in turn includes a compressor, a first condenser, a second condenser fluidly coupled in series or in parallel with the first condenser, an expansion valve, and an evaporator. In addition, the system includes a refrigerant fill control device configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit.

[0007] On the other hand, the present subject matter relates to a method for cooling a component using a vapor cycle system. The vapor cycle system includes a refrigeration circuit through which a large amount of refrigerant flows. The refrigeration circuit in turn includes a first condenser and a second condenser fluidly connected in series to the first condenser. In addition, the vapor cycle system includes a refrigerant filling control device, which is configured to increase or decrease the mass of refrigerant flowing through the refrigeration circuit. Therefore, the method includes monitoring the pressure of the refrigerant leaving the second condenser using a computing system. In addition, the method includes monitoring the temperature of the refrigerant leaving the second condenser using a computing system. In addition, the method includes controlling the operation of the refrigerant filling control device using a computing system to adjust the mass of the refrigerant flowing through the refrigeration circuit based on the monitored pressure and the monitored temperature.

[0008] These and other features, aspects and advantages of the present disclosure will become better understood with reference to the following description and appended claims.The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various aspects of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] A complete and enabling disclosure, including the best mode thereof, to one of ordinary skill in the art is set forth in the specification, which relates to the accompanying drawings, in which:

[0010] Figure 1 is a side view of one embodiment of an aircraft;

[0011] Figure 2 is a schematic cross-sectional view of one embodiment of a gas turbine engine for an aircraft;

[0012] Figure 3 is a schematic diagram of one embodiment of a steam cycle system for cooling components;

[0013] Figure 4 is a schematic diagram of another embodiment of a steam circulation system for cooling components;

[0014] Figure 5 is a schematic diagram of another embodiment of a steam circulation system for cooling components;

[0015] Figure 6 is a schematic diagram of another embodiment of a steam circulation system for cooling components;

[0016] Figure 7 is a schematic diagram of another embodiment of a steam circulation system for cooling components;

[0017] Figure 8 is a schematic diagram of another embodiment of a steam circulation system for cooling components;

[0018] Fig. 9 is a schematic diagram of another embodiment of a steam circulation system for cooling components;

[0019] Fig.10 is a schematic diagram of another embodiment of a steam cycle system for cooling components; and

[0020] Fig.11 is a flow chart of one embodiment of a method of cooling a component using a vapor cycle system.

[0021] Repeat use of reference characters in the present specification and drawings is intended to represent same or analogous features or elements of the invention. DETAILED DESCRIPTION

[0022] Reference will now be made in detail to embodiments of the present invention, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation of the present invention rather than by way of limitation. In fact, it will be apparent to those skilled in the art that various modifications and variations may be made to the present invention without departing from the scope or spirit of the present invention. For example, a feature illustrated or described as part of one embodiment may be used together with another embodiment to produce yet another embodiment. Therefore, the present invention is intended to encompass these modifications and variations within the scope of the appended claims and their equivalents.

[0023] As used herein, the terms “first,” “second,” and “third” are used interchangeably to distinguish one component from another and are not intended to indicate the position or importance of a single component.

[0024] In addition, the terms "upstream" and "downstream" refer to relative directions relative to the flow of fluid in a fluid path. For example, "upstream" refers to the direction from which the fluid flows, and "downstream" refers to the direction to which the fluid flows.

[0025] Furthermore, unless otherwise specified, the terms "low", "high" or their respective comparative degrees (e.g., lower, higher, as applicable) refer to relative speeds within the engine. For example, a "low-pressure turbine" operates at a pressure that is generally lower than a "high-pressure turbine". Alternatively, unless otherwise specified, the above terms may be understood to their highest degree. For example, a "low-pressure turbine" may refer to the lowest maximum pressure turbine within a turbine section, while a "high-pressure turbine" may refer to the highest maximum pressure turbine within a turbine section.

[0026] In general, the present subject matter relates to a vapor cycle system for cooling components and related methods. As described below, in some embodiments, the disclosed vapor cycle system can be used to cool one or more components or systems (e.g., one or more electronic devices) of an aircraft. In several embodiments, the vapor cycle system includes a compressor, a first condenser, a second condenser connected in series to the first condenser, an expansion valve, and an evaporator. The term condenser is generally used to describe any heat exchanger that helps transfer heat from a refrigerant to a heat sink. In addition to the condenser, these heat exchangers can be described and / or used as superheaters or subcoolers. In this way, a large amount of refrigerant flows through the vapor cycle system to transfer heat from a low-temperature heat source (e.g., one or more electronic devices of an aircraft, cabin heat, an environmental control system, etc.) to a higher temperature heat sink (e.g., fuel supplied to an aircraft, an anti-icing surface, an engine bypass duct, ram air, etc.). Specifically, during operation, the refrigerant absorbs heat from the component while flowing through the evaporator, and discharges the heat to the fluid while flowing through the condenser.

[0027] In addition, the vapor cycle system includes a refrigerant filling control device, which is configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit. Specifically, when the pressure of the refrigerant leaving the second condenser exceeds the maximum pressure value, the refrigerant filling control device can reduce the mass of the refrigerant flowing through the refrigeration circuit. In addition, when the determined supercooling value of the refrigerant leaving the second condenser drops below the minimum supercooling value, the refrigerant filling control device can increase the mass of the refrigerant flowing through the refrigeration circuit. For example, in several embodiments, the refrigerant filling control device may include a first control valve, a tank and a second control valve in parallel with the refrigeration circuit. In such an embodiment, in order to reduce the mass of the refrigerant in the refrigeration circuit, the first valve is opened to allow a portion of the refrigerant to flow from the refrigeration circuit to the tank. On the contrary, in such an embodiment, the second valve is opened to allow the refrigerant to flow from the tank to the refrigeration circuit, thereby increasing the mass of the refrigerant in the refrigeration circuit. In other embodiments, the refrigerant filling control device includes a cylinder or other storage device that allows refrigerant to be added or removed from the refrigeration circuit.

[0028] A refrigerant fill control device provides one or more technical advantages. Specifically, the disclosed vapor cycle system includes a first condenser and a second condenser connected in series. Generally speaking, in some cases one condenser may reject heat from the refrigeration circuit, while in other cases another condenser may reject heat from the refrigeration circuit. However, the mass of refrigerant required for the correct operation of the refrigeration circuit may vary depending on which condenser is used to reject heat from the refrigerant. Therefore, the refrigerant fill control device increases and decreases the mass of the refrigerant within the refrigeration circuit (e.g., based on the temperature and / or pressure of the refrigerant leaving the second condenser) to maintain the correct operation of the vapor cycle system.

[0029] Now referring to the accompanying drawings, Figure 1 is a side view of one embodiment of an aircraft 10. As shown, in several embodiments, the aircraft 10 includes a fuselage 12 and a pair of wings 14 (one shown) extending outwardly from the fuselage 12. In the illustrated embodiment, a gas turbine engine 100 is supported on each wing to propel the aircraft through the air during flight. In addition, as shown, the aircraft 10 includes a vertical stabilizer 16 and a pair of horizontal stabilizers 18 (one shown). However, in alternative embodiments, the aircraft 10 may include any other suitable configuration, such as any other suitable number or type of engines.

[0030] In addition, the aircraft may include a vapor cycle system 200 for cooling one or more components of the aircraft. Specifically, in several embodiments, the vapor cycle system 200 is configured to cool one or more electronic devices of the aircraft, such as one or more navigation devices, communication devices, engine controllers, etc. In such an embodiment, the vapor cycle system 200 is configured to transfer heat from the electronic devices of the aircraft to one or more fluids supporting the operation of the aircraft. Such fluids act as heat sinks and may include fuel supplied to the engine 100, ram air, air flowing through the engine bypass duct of the aircraft, and / or air for pressurizing the cabin of the aircraft. However, in an optional embodiment, the vapor cycle system 200 may be configured to transfer heat between any other component of the aircraft and any other suitable fluid.

[0031] Above and Figure 1 The configuration of the aircraft 10 shown in FIG. 1 is only provided to place the subject matter in an exemplary field of use. Therefore, the subject matter can be easily adapted to any type of aircraft.

[0032] Figure 2 is a schematic cross-sectional view of one embodiment of a gas turbine engine 100. In the illustrated embodiment, the engine 100 is configured as a high bypass turbofan engine. However, in alternative embodiments, the engine 100 may be configured as a propeller engine, a turbojet engine, a turboprop engine, a turboshaft gas turbine engine, or any other suitable type of gas turbine engine.

[0033] In general, the engine 100 extends along an axial centerline 102 and includes a fan 104, a low pressure (LP) spool 106, and a high pressure (HP) spool 108 at least partially surrounded by an annular nacelle 110. Specifically, the fan 104 may include a fan rotor 112 and a plurality of fan blades 114 (one shown) coupled to the fan rotor 112. In this regard, the fan blades 114 are circumferentially spaced and extend radially outward from the fan rotor 112. In addition, the LP and HP spools 106, 108 are positioned downstream of the fan 104 along the axial centerline 102. As shown, the LP spool 106 is rotatably coupled to the fan rotor 112, thereby allowing the LP spool 106 to rotate the fan 114. In addition, a plurality of outlet guide vanes or struts 116 are circumferentially spaced from each other and extend radially between an outer casing 118 surrounding the LP and HP spools 106, 108 and the nacelle 110. As such, the struts 116 support the nacelle 110 relative to the outer shell 118 such that the outer shell 118 and the nacelle 110 define a bypass airflow passage 120 therebetween.

[0034] The outer casing 118 generally surrounds or encloses, in series flow order, a compressor section 122, a combustion section 124, a turbine section 126, and an exhaust section 128. For example, in some embodiments, the compressor section 122 may include a low pressure (LP) compressor 130 of the LP spool 106 and a high pressure (HP) compressor 132 of the HP spool 108, which is positioned downstream of the LP compressor 130 along the axial centerline 102. Each compressor 130, 132 may in turn include one or more rows of stator vanes 134 interleaved with one or more rows of compressor rotor blades 136. Additionally, in some embodiments, the turbine section 126 includes a high pressure (HP) turbine 138 of the HP spool 108 and a low pressure (LP) turbine 140 of the LP spool 106, which is positioned downstream of the HP turbine 138 along the axial centerline 102. Each turbine 138 , 140 may in turn include one or more rows of stator vanes 142 interleaved with one or more rows of turbine rotor blades 144 .

[0035] In addition, the LP spool 106 includes a low pressure (LP) shaft 146, and the HP spool 108 includes a high pressure (HP) shaft 148 positioned concentrically about the LP shaft 146. In such an embodiment, the HP shaft 148 rotatably couples the rotor blades 144 of the HP turbine 138 and the rotor blades 136 of the HP compressor 132, such that rotation of the HP turbine rotor blades 144 rotatably drives the HP compressor rotor blades 136. As shown, the LP shaft 146 is directly coupled to the rotor blades 144 of the LP turbine 140 and the rotor blades 136 of the LP compressor 130. In addition, the LP shaft 146 is coupled to the fan 104 via a gearbox 150. In this regard, rotation of the LP turbine rotor blades 144 rotatably drives the LP compressor rotor blades 136 and the fan blades 114.

[0036] In several embodiments, the engine 100 may generate thrust to propel an aircraft. More specifically, during operation, air (indicated by arrow 152) enters an inlet portion 154 of the engine 100. The fan 104 supplies a first portion of the air 152 (indicated by arrow 156) to the bypass airflow passage 120, and supplies a second portion of the air 152 (indicated by arrow 158) to the compressor section 122. The second portion 158 of the air 152 first flows through the LP compressor 130, where the rotor blades 136 gradually compress the second portion 158 of the air 152. Next, the second portion 158 of the air 152 flows through the HP compressor 132, where the rotor blades 136 continue to gradually compress the second portion 158 of the air 152. The compressed second portion 158 of the air 152 is then delivered to the combustion section 124. In the combustion section 124, the second portion 158 of the air 152 is mixed with fuel and combusted to produce high temperature and high pressure combustion gases 160. Thereafter, the combustion gases 160 flow through the HP turbine 138, wherein the HP turbine rotor blades 144 extract a first portion of kinetic and / or thermal energy therefrom. This energy extraction rotates the HP shaft 148, thereby driving the HP compressor 132. The combustion gases 160 then flow through the LP turbine 140, wherein the LP turbine rotor blades 144 extract a second portion of kinetic and / or thermal energy therefrom. This energy extraction rotates the LP shaft 146, thereby driving the LP compressor 130 and the fan 104 via the gearbox 150. The combustion gases 160 then exit the engine 100 through the exhaust section 128.

[0037] Above and Figure 2 The configuration of the gas turbine engine 100 shown in the figure is only provided to place the subject matter in an exemplary field of use. Therefore, the subject matter can be easily adapted to any manner of gas turbine engine configuration, including other types of aviation gas turbine engines, marine gas turbine engines and / or land / industrial gas turbine engines.

[0038] Figure 32 is a schematic diagram of an embodiment of a vapor cycle system 200 for cooling components. Generally, the vapor cycle system 200 includes a refrigeration circuit 202 and a refrigerant filling control device 204. More specifically, a large amount of refrigerant flows through the refrigeration circuit 202 to transfer heat from one or more components to one or more fluids, thereby cooling the components. As described below, the refrigerant filling control device 204 adjusts the quality of the refrigerant within the refrigeration circuit 202 to maintain the correct operation of the vapor cycle system 200.

[0039] The vapor cycle system 200 may be used to transfer heat from any suitable component to any suitable fluid. For example, in several embodiments, the vapor cycle system 200 may be configured to transfer heat from one or more components of the aircraft 10 (e.g., one or more electronic devices) to one or more fluids that support the operation of the aircraft 10 (e.g., fuel and / or ram air supplied to the engine 100). However, in alternative embodiments, the vapor cycle system 200 may be configured to transfer heat from any other suitable component of the aircraft to any suitable fluid that supports the operation of the aircraft. Moreover, in further embodiments, the vapor cycle system 200 may be configured to transfer heat from any suitable non-aircraft / aviation component to any suitable non-aircraft / aviation fluid.

[0040] The refrigeration circuit 202 may include any suitable components configured to absorb heat and subsequently discharge the heat. In several embodiments, the refrigeration circuit 202 includes one or more evaporators 206, 208; a compressor 210; a plurality of condensers 212, 214 connected in series or in parallel; and one or more expansion valves 216, 218. Specifically, as shown in the figure, in the illustrated embodiment, the refrigeration circuit 202 includes a first evaporator 206 and a second evaporator 208 connected in parallel to each other and a compressor 210 fluidly coupled to the evaporators 206, 208 and connected in series with the evaporators. In addition, in the illustrated embodiment, the refrigeration circuit 202 includes a first condenser 212 fluidly coupled to the compressor 210 and connected in series with the compressor 210 and a second condenser 214 fluidly coupled to the first condenser and connected in series with the first condenser 212. In addition, in the illustrated embodiment, the refrigeration circuit 202 includes a first expansion valve 216 and a second expansion valve 218 connected in parallel to each other and connected in series with the second condenser 214. In addition, the refrigeration circuit 202 includes suitable pipes, hoses, tubes or other conduits to fluidly connect the above-mentioned components of the circuit 202. However, in alternative embodiments, the refrigeration circuit 202 can have any other suitable configuration. For example, the refrigeration circuit 202 can include three or more condensers connected in series with each other. In addition, the refrigeration circuit 202 can include one or three or more evaporators and one or three or more expansion valves.

[0041] In operation, a large amount of refrigerant flows through the refrigeration circuit 202 to transfer heat from one or more components to one or more fluids, thereby cooling these components. More specifically, in the illustrated embodiment, the refrigerant absorbs heat from the components while flowing through the evaporators 206, 208. This heat absorption causes the refrigerant to evaporate. The compressor 210 then pressurizes the gaseous refrigerant and supplies the pressurized gaseous refrigerant to the condensers 212, 214. The condensers 212, 214 in turn transfer the heat absorbed by the refrigerant in the evaporators 206, 208 to the fluid, thereby discharging heat from the refrigeration circuit 202. This heat discharge liquefies the refrigerant. Thereafter, the refrigerant flows through the expansion valves 216, 218, where the refrigerant is throttled, which reduces the pressure and the associated saturation temperature, so that heat can be absorbed by the evaporation of the refrigerant in the evaporators 206, 208. After leaving the evaporators 206, 208, the refrigerant travels to the compressor 210 as a low-temperature, low-pressure gas.

[0042] In some cases, the first condenser 212 may reject heat from the refrigeration circuit 202, while in other cases, the second condenser 214 may reject heat from the refrigeration circuit 202. More specifically, in several embodiments, the first condenser 212 may be configured to transfer heat from the refrigerant to the fuel supplied to the engine 100 of the aircraft 10. In addition, in these embodiments, the second condenser 214 may be configured to transfer heat from the refrigerant to the air in the engine bypass duct. For example, when the engine 100 of the aircraft is operating at a high load (e.g., when traveling at supersonic speed), the fan bypass duct air may be too hot to transfer heat from the refrigerant to it. However, in this case, the large amount of fuel supplied to the engine 100 allows the first condenser 212 to provide heat rejection. In contrast, when the aircraft is cruising at high altitudes and lower speeds, the amount of fuel supplied to the engine 100 may be too small to provide heat rejection. However, in this case, the fan bypass duct air temperature may allow the second condenser 214 to provide heat rejection. However, in alternative embodiments, the first condenser 212 and the second condenser 214 may be configured to transfer heat from the refrigerant to any other suitable fluid or heat sink, and may operate simultaneously.

[0043] Any suitable refrigerant may flow through the refrigeration circuit 202 to support its operation. For example, in some embodiments, the refrigerant may be 1,1,1,2-tetrafluoroethane, commonly referred to as R-134a.

[0044] As described above, the vapor cycle system 200 includes a refrigerant filling control device 204 for regulating the quality of the refrigerant flowing through the refrigeration circuit 202. More specifically, the quality of the refrigerant supporting the proper operation of the refrigeration circuit 200 may vary depending on which condenser 212, 214 is used to reject heat from the refrigeration circuit 200. As described below, the temperature and / or pressure of the refrigerant after leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) depends on which condenser 212, 214 is used to reject heat from the refrigeration circuit 202. In this regard, based on the temperature and / or pressure of the refrigerant after leaving the second condenser 214, the refrigerant filling control device 204 can add or remove refrigerant from the refrigeration circuit 202.

[0045] As shown, in several embodiments, the refrigerant filling control device 204 includes a first control valve 220, a tank 222, and a second control valve 224. More specifically, in such an embodiment, the refrigerant filling control device 204 is fluidly coupled to the refrigeration circuit 202 so that the refrigerant filling control device 204 is in parallel with the first expansion valve 216. In this regard, the first control valve 220 is fluidly coupled to the refrigeration circuit 202 at a position between the outlet (not shown) of the second condenser 214 and the expansion valves 216, 218. In addition, the tank 222 is fluidly coupled to the first control valve 220 and is in series with the first control valve 220. In addition, the second control valve 224 is fluidly coupled to the tank 222 and is in series with the tank 222. Therefore, in order to reduce the mass of the refrigerant in the refrigeration circuit 202, the first control valve 220 is opened and the second control valve 224 is closed. The second control valve 224 can be placed in a drain position to better promote the migration of refrigerant into the tank 222. In this case, a portion of the refrigerant flows from the refrigeration circuit 202 into the tank 222 through the first control valve 220, thereby reducing the mass of the refrigerant present in the refrigeration circuit 202. Conversely, in order to increase the mass of the refrigerant in the refrigeration circuit 202, the first control valve 220 is closed and the second control valve 224 is opened. In this case, the refrigerant stored in the tank 222 flows into the refrigeration circuit 202 through the second control valve 224, thereby increasing the mass of the refrigerant in the refrigeration circuit 202.

[0046] In some embodiments, the refrigerant filling control device 204 does not require a pump to remove refrigerant from or add refrigerant to the refrigeration circuit 202. Specifically, when the first control valve 220 is open and the second control valve 224 is closed, the pressure of the refrigerant in the refrigeration circuit 202 causes a portion of the refrigerant to flow through the first control valve 220 and into the tank 222. Similarly, when the first control valve 220 is closed and the second control valve 224 is open, the pressure of the refrigerant in the tank 222 causes a portion of the refrigerant to flow through the second control valve 224 and into the refrigeration circuit 202.

[0047] Additionally, in several embodiments, the vapor cycle system 200 includes a pressure sensor 226. Typically, the pressure sensor 226 is configured to capture data indicating the pressure of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218). Thus, the pressure sensor 226 can be fluidly coupled to the refrigeration circuit 202 adjacent to an outlet (not shown) of the second condenser 214. The pressure sensor 226 can correspond to any suitable device for capturing data indicating the pressure of the refrigerant, such as a piezoresistive strain gauge, an electromagnetic pressure sensor, and the like.

[0048] In addition, in several embodiments, the vapor cycle system 200 includes a temperature sensor 228. Generally, the temperature sensor 228 is configured to capture data indicating the temperature of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218). Therefore, the temperature sensor 228 can be fluidly coupled to the refrigeration circuit 202 adjacent to the outlet (not shown) of the second condenser 214. The temperature sensor 228 can correspond to any suitable device for capturing data indicating the temperature of the refrigerant, such as a thermistor, a thermocouple, etc.

[0049] In addition, in several embodiments, the vapor cycle system 200 includes a computing system 230 that is communicatively coupled to one or more components of the vapor cycle system 200 to allow the computing system 230 to electronically or automatically control the operation of these components. For example, the computing system 230 can be communicatively coupled to the pressure and temperature sensors 226, 228 via a communication link 232. In this regard, the computing system 230 can be configured to receive data indicating the temperature and / or pressure of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218). In addition, the computing system 230 can be communicatively coupled to the first control valve 220 and the second control valve 224 via the communication link 232. In this way, the computing system 230 can be configured to control the operation of the first valve 220 and the second valve 224 based on the received pressure and / or temperature sensor data to adjust the quality of the refrigerant within the refrigeration circuit 202. In addition, the computing system 230 can be communicatively coupled to any other suitable components of the vapor cycle system via the communication link 232.

[0050] In general, the computing system 230 may include one or more processor-based devices, such as a given controller or computing device or any appropriate combination of controllers or computing devices. Therefore, in several embodiments, the computing system 230 may include one or more processors 234 and associated memory devices 236 configured to perform various computer-implemented functions. As used herein, the term "processor" refers not only to the integrated circuit included in the computer in the art, but also to controllers, microcontrollers, microcomputers, programmable logic circuits (PLCs), application-specific integrated circuits, and other programmable circuits. In addition, the memory device 236 of the computing system 230 may generally include a memory element, which includes but is not limited to a computer-readable medium (e.g., random access storage RAM), a computer-readable non-volatile medium (e.g., flash memory), a floppy disk, a read-only compact disk (CD-ROM), a magneto-optical disk (MOD), a digital versatile disk (DVD), and / or other suitable memory elements. Such a memory device 236 may generally be configured to store appropriate computer-readable instructions, which, when implemented by the processor 234, configure the computing system 230 to perform various computer-implemented functions, such as one or more aspects of the methods and algorithms described herein. In addition, computing system 230 may also include various other suitable components, such as communication circuits or modules, one or more input / output channels, a data / control bus, and the like.

[0051] The various functions of computing system 230 may be performed by a single processor-based device, or may be distributed across any number of processor-based devices. In such cases, such processor-based devices may form part of computing system 230. For example, the functions of computing system 230 may be distributed across multiple application-specific controllers, such as an engine controller, a navigation controller, a communication controller, etc.

[0052] In several embodiments, the computing system 230 is configured to monitor the pressure and / or temperature of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218). More specifically, during operation of the vapor cycle system 200, the computing system 230 is configured to receive data captured by the pressure and / or temperature sensors 226, 228 (e.g., via the communication link 232). The computing system 230 is configured to process / analyze the received sensor data to determine the pressure and / or temperature of the refrigerant leaving the second condenser 214. For example, the computing system 230 may include an appropriate lookup table stored in its memory device 112 that associates the received pressure and temperature data with the pressure and / or temperature of the refrigerant leaving the second condenser 214, respectively.

[0053] In addition, in several embodiments, the computing system 230 is configured to determine a subcooling value of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) based on the monitored temperature and pressure. In general, the subcooling value is the number of degrees that the monitored temperature is below the saturation temperature of the refrigerant. As such, the computing system 230 may include an appropriate lookup table or mathematical formula stored in its memory device 112 that relates the monitored temperature and pressure to the subcooling value.

[0054] In addition, in several embodiments, the computing system 230 is configured to control the operation of the refrigerant filling control device 204 based on the monitored pressure to adjust the quality of the refrigerant flowing through the refrigeration circuit 230. More specifically, when the pressure of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) becomes too high, the compressor 210 may experience high wear, damage, or stall. In this case, the condensers 212, 214 that use the current heat rejection from the refrigeration circuit 202 may require a smaller mass of refrigerant in the refrigeration circuit 202 to operate correctly. In this regard, the computing system 230 can be configured to compare the monitored pressure with a maximum pressure value. Thereafter, when the monitored pressure exceeds the maximum pressure value (thereby indicating that the pressure of the refrigerant in the refrigeration circuit 202 is too high), the computing system 230 controls the operation of the refrigerant filling control device 204 so that the quality of the refrigerant in the refrigeration circuit 202 is reduced. For example, in this case, the computing system 230 can be configured to control the operation of the refrigerant filling control device 204 so that the first control valve 220 is opened and the second control valve 224 is closed or placed in a weeping position. As described above, when the first control valve 220 is opened and the second control valve 224 is closed, a portion of the refrigerant flows from the refrigeration circuit 202 into the tank 222, thereby reducing the mass of the refrigerant in the refrigeration circuit 202.

[0055] In addition, in several embodiments, the computing system 230 is configured to control the operation of the refrigerant charge control device 204 to adjust the mass of refrigerant flowing through the refrigeration circuit 230 based on the monitored temperature and pressure. More specifically, when the subcooling value of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) becomes too low, the evaporated refrigerant may flow through the expansion valves 216, 218, causing the valves 216, 218 to catch or become overly restricted. In this case, the condensers 212, 214 that use the current heat rejection from the refrigeration circuit 202 may require a larger mass of refrigerant within the refrigeration circuit 202 to operate correctly. In this regard, the computing system 230 can be configured to compare the determined subcooling value with a minimum subcooling value. Thereafter, when the determined subcooling value exceeds the minimum subcooling value (thereby indicating that the subcooling value of the refrigerant in the refrigeration circuit 202 is too low), the computing system 230 controls the operation of the refrigerant filling control device 204 so that the mass of the refrigerant in the refrigeration circuit 202 increases. For example, in this case, the computing system 230 may be configured to control the operation of the refrigerant filling control device 204 so that the first control valve 220 is closed and the second control valve 224 is opened. As described above, when the first control valve 220 is closed and the second control valve 224 is opened, a portion of the refrigerant flows from the tank 222 into the refrigeration circuit 202, thereby increasing the mass of the refrigerant in the refrigeration circuit 202.

[0056] The first control valve 220 and the second control valve 224 may be controlled in any suitable manner to increase and / or decrease the mass of refrigerant within the refrigeration circuit 202 as described above. For example, in one embodiment, when removing refrigerant from the refrigeration circuit 202, the second control valve 224 may be initially opened to minimize the pressure within the tank 222. Thereafter, the second control valve 224 is closed and the first control valve 220 is subsequently opened to allow refrigerant to flow from the refrigeration circuit 202 into the tank 222. Reducing the pressure within the tank 222 before opening the first control valve 220 may generally promote better migration of refrigerant from the refrigeration circuit 202 into the tank 222.

[0057] Figure 4 is a schematic diagram of another embodiment of a steam cycle system 200 for cooling components. Figure 3 The embodiment of the steam cycle system 200 shown, Figure 4 The vapor cycle system 200 shown includes a refrigeration circuit 202 having a first evaporator 206 and a second evaporator 208; a compressor 210; a first condenser 214; a second condenser 216 connected in series with the first condenser 214; and first and second expansion valves 216, 218. Figure 3 The embodiment of the steam cycle system 200 shown is similar. Figure 4 The illustrated vapor cycle system 200 also includes a refrigerant filling control device 204 having a first valve 220 , a tank 224 , and a second valve 226 .

[0058] However, with Figure 3 The embodiments shown are different. Figure 4 The illustrated vapor cycle system 200 includes a hot gas injection line 237. Generally, the hot gas injection line 237 supplies hot gaseous refrigerant that has been compressed by the compressor 210 (and before such refrigerant has been compressed) to the tank 222. In this regard, when the second control valve 224 is opened and the first control valve 220 is closed (i.e., when the mass of the refrigerant in the refrigeration circuit 202 increases), the hot gaseous refrigerant helps transfer the refrigerant stored in the tank 222 to the refrigeration circuit 202. Specifically, when the pressure within the refrigerant charge control device 204 is too low, the hot gaseous refrigerant forces the refrigerant to leave the tank 222. Therefore, the hot gas injection line 237 extends from the refrigeration circuit 202 to the tank 222.

[0059] Figure 5 is a schematic diagram of another embodiment of a steam cycle system 200 for cooling components. Figure 3 and 4 The embodiment of the steam cycle system 200 shown in FIG. Figure 5 The vapor cycle system 200 shown includes a refrigeration circuit 202 having a first evaporator 206 and a second evaporator 208; a compressor 210; a first condenser 214; a second condenser 216 connected in series with the first condenser 214; and first and second expansion valves 216 and 218. Figure 3 and 4 Similar to the embodiment of the steam cycle system 200 shown in FIG. Figure 5 The illustrated vapor cycle system 200 further includes a refrigerant filling control device 204 having a first valve 220 , a tank 224 , a second valve 226 , and a hot gas injection line 237 .

[0060] However, with Figure 3 and 4 Different from the embodiment shown in Figure 5 In the illustrated vapor cycle system 200, the refrigerant charge control device 204 is coupled to the refrigeration circuit 202 so that the refrigerant added to the refrigeration circuit 202 from the tank 222 bypasses the evaporators 206, 208. That is, when the second control valve 224 is open and the first control valve 220 is closed, the refrigerant from the tank 222 enters the refrigeration circuit 202 downstream of the evaporators 206, 208 and upstream of the compressor 210. Figure 5 The embodiment of the steam cycle system 200 shown in FIG. Figure 3 and 4 The embodiment of the vapor cycle system 200 shown in FIG. 1 is inefficient because the added refrigerant is allowed to bypass the evaporators 206, 208, thereby increasing the mass of refrigerant that the compressor 210 must compress. Figure 3 and 4 Compared to the embodiment of the steam cycle system 200 shown in FIG. Figure 5 The embodiment of the vapor cycle system 200 shown in FIG. 2 provides better protection for the compressor 210 because allowing the added refrigerant to bypass the evaporators 206 , 208 cools the refrigerant entering the compressor 210 .

[0061] Figure 6 is a schematic diagram of another embodiment of a steam cycle system 200 for cooling components. Figure 3-5 The embodiment of the steam cycle system 200 shown in FIG. Figure 6 The vapor cycle system 200 shown includes a refrigeration circuit 202 having a first evaporator 206 and a second evaporator 208; a compressor 210; a first condenser 214; a second condenser 216 connected in series with the first condenser 214; and first and second expansion valves 216, 218. Figure 3-5 Similar to the embodiment of the steam cycle system 200 shown in FIG. Figure 6 The illustrated vapor cycle system 200 also includes a refrigerant filling control device 204 having a first valve 220 , a tank 224 , and a second valve 226 .

[0062] However, with Figure 3-5 Different from the embodiment shown in Figure 6 The illustrated vapor cycle system 200 includes a suction line heat exchanger 238. Generally, the suction line heat exchanger 238 is configured to transfer heat from the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) to the refrigerant entering the compressor 210. In this regard, as shown in FIG. Figure 6 As shown, the suction line heat exchanger 238 is located within the refrigeration circuit 202 so that the refrigerant leaving the second condenser 214 flows through the suction line heat exchanger 238 before reaching the refrigerant charge control device 204 and the expansion valves 216, 218. Figure 6 As shown, the suction line heat exchanger 238 is located within the refrigeration circuit 202 such that the refrigerant exiting the first evaporator 206 and the second evaporator 208 flows through the suction line heat exchanger 238 before reaching the compressor 210 .

[0063] Figure 7 is a schematic diagram of another embodiment of a steam cycle system 200 for cooling components. Figure 3-6 The embodiment of the steam cycle system 200 shown in FIG. Figure 7 The vapor cycle system 200 shown includes a refrigeration circuit 202 having a first evaporator 206 and a second evaporator 208; a compressor 210; a first condenser 214; a second condenser 216 connected in series with the first condenser 214; and first and second expansion valves 216, 218. Figure 3-6 Similar to the embodiment of the vapor cycle system 200 shown in , the vapor cycle system 200 further includes a refrigerant filling control device 204 having a first valve 220 , a tank 224 , and a second valve 226 .

[0064] However, with Figure 3-6 Different from the embodiment shown in Figure 7 The illustrated vapor cycle system 200 includes a bypass loop 240 in fluid communication with the refrigeration circuit 202. Generally, the bypass loop 240 is configured to allow a portion of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) to bypass the expansion valves 216, 218 and the evaporators 206, 208 and flow directly to the compressor 210. In addition, as shown, the bypass loop 240 includes an economizer heat exchanger 242 and a third control valve 244, which is configured to control the flow of refrigerant from the refrigeration circuit 202 into the bypass loop 240. Thus, in operation, the refrigerant leaving the second condenser 214 flows through the economizer heat exchanger 242. The third control valve 244 can be opened (e.g., based on a control signal transmitted from the computing system 230 to the valve 224 via the communication link 232) to allow a portion of the refrigerant leaving the economizer heat exchanger 242 to flow into the bypass loop 240. Then, the refrigerant in the bypass loop 240 flows back through the economizer heat exchanger 242 so that heat is transferred from the refrigerant leaving the second condenser 214 to the refrigerant flowing through the bypass loop 240. Thereafter, the refrigerant in the bypass loop 240 flows to the compressor 210.

[0065] Figure 8 is a schematic diagram of another embodiment of a steam cycle system 200 for cooling components. Figure 3-7 The embodiment of the steam cycle system 200 shown in FIG. Figure 8 The vapor cycle system 200 shown includes a refrigeration circuit 202 having a first evaporator 206 and a second evaporator 208; a compressor 210; a first condenser 214; a second condenser 216 connected in series with the first condenser 214; and first and second expansion valves 216, 218. Figure 3-7 Similar to the embodiment of the steam cycle system 200 shown in FIG. Figure 8The illustrated vapor cycle system 200 also includes a refrigerant charge control device 204 .

[0066] However, with Figure 3-7 Different from the embodiment shown in Figure 8 The refrigerant filling control device 204 shown corresponds to a control valve 246 that is fluidly coupled in series with the refrigeration circuit 202. Specifically, as shown in FIG. Figure 8 As shown, in the illustrated embodiment, the control valve 246 is positioned so that the refrigerant leaving the compressor 210 flows through the control valve 246 before entering the first condenser 212 (or the first condenser through which the refrigerant flows after leaving the compressor 210). In addition, the control valve 246 can be communicatively coupled to the computing system 230 (e.g., via the communication link 232) so that the computing system 230 can control the operation of the control valve 246. However, in an alternative embodiment, the second condenser 214 can be bypassed via the control valve 246.

[0067] In addition, Figure 8 In the illustrated embodiment, the vapor cycle system 200 includes a bypass circuit 248 in fluid communication with the refrigeration circuit 202. Generally, the bypass circuit 248 is configured to allow refrigerant to bypass the first condenser 212. Therefore, the bypass circuit 248 can be fluidly coupled to the control valve 246 and extend from the control valve 246 to a position between the first condenser 212 and the second condenser 214 on the refrigeration circuit 202. In such an embodiment, the control valve 246 is configured to selectively allow refrigerant from the refrigeration circuit 202 to flow into the bypass circuit 248. In this regard, when the control valve 246 is in a first position, the control valve 246 can direct the flow of refrigerant through the refrigeration circuit 202 to the first condenser 212 and block the flow of refrigerant to the bypass circuit 248. Conversely, when the control valve 246 is in a second position, the control valve 246 can direct the flow of refrigerant through the refrigeration circuit 202 to the bypass circuit 248 and block the flow of refrigerant to the first condenser 212.

[0068] In several embodiments, the control valve 246 is used to regulate the quality of the refrigerant flowing through the refrigeration circuit 202. More specifically, as described above, the quality of the refrigerant flowing through the refrigeration circuit 202 can be regulated based on the pressure and / or temperature of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218). In this regard, when the monitored pressure of the refrigerant exceeds a maximum pressure value (and the first condenser 212 is not being used to reject heat from the refrigeration circuit 202), the computing system 230 can be configured to control the operation of the control valve 246 so that the control valve 246 moves to the second position. In this case, the refrigerant within the refrigeration circuit 202 flows into the bypass circuit 248. Once the refrigerant bypasses the first condenser 212 and re-enters the refrigeration circuit 202, a portion of the refrigerant flows back to the outlet (not shown) of the first condenser 212, thereby backfilling the first condenser 212. This backfilling reduces the mass of refrigerant flowing through the second condenser 214, the expansion valves 216, 218, the evaporators 206, 208, and the compressor 210. In order to effectively backfill, it may be necessary to provide a small amount of heat sink to the first condenser 212 to liquefy the stagnant mass of the refrigerant. In contrast, when the determined subcooling value of the refrigerant is lower than the minimum subcooling value, the computing system 230 may be configured to control the operation of the control valve 246 so that the control valve 246 moves to the first position. In this case, the refrigerant leaving the compressor 210 flows into the inlet (not shown) of the first condenser 212 and is blocked from entering the bypass loop 248. The flow of refrigerant through the first condenser 212 causes any refrigerant stored in the first condenser 212 due to the backfilling to leave the first condenser 212 and flow into the second condenser 214. This in turn increases the mass of refrigerant flowing through the second condenser 214, the expansion valves 216, 218, the evaporators 206, 208, and the compressor 210.

[0069] In addition, in some embodiments, the vapor cycle system 200 includes an additional flow control valve. Specifically, in these embodiments, the additional flow control valve is fluidly coupled to the additional bypass conduit, wherein the additional bypass conduit outlet is located between the first condenser outlet and the check valve, and the conduit inlet is located at the direct outlet of the second condenser 214. Therefore, the additional flow control valve combined with the flow check valve can be used to adjust the amount of refrigerant filling the first condenser 212.

[0070] Fig. 9 is a schematic diagram of another embodiment of a steam cycle system 200 for cooling components. Figure 3-8 The embodiment of the steam cycle system 200 shown in FIG. Fig. 9The vapor cycle system 200 shown includes a refrigeration circuit 202 having a first evaporator 206 and a second evaporator 208; a compressor 210; a first condenser 214; a second condenser 216 connected in series with the first condenser 214; and first and second expansion valves 216, 218. Figure 3-8 Similar to the embodiment of the steam cycle system 200 shown in FIG. Fig. 9 The illustrated vapor cycle system 200 also includes a refrigerant charge control device 204 .

[0071] However, with Figure 3-8 Different from the embodiment shown in Fig. 9 The refrigerant filling control device 204 shown corresponds to the storage device 250. Specifically, as Fig. 9 As shown, in the illustrated embodiment, the storage device 250 includes a cylinder 252 defining a first chamber 254 and a second chamber 256. In addition, the storage device 250 includes a piston or diaphragm 258, which is positioned within the cylinder 252 to separate the first chamber 254 and the second chamber 256. The piston 258 can also move within the cylinder 252, so that the size of the first chamber 254 and the second chamber 256 can be changed. In addition, the first chamber 254 is connected in series with the refrigeration circuit 202, so that the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) flows through the first chamber 254 before reaching the expansion valves 216, 218. In addition, the second chamber 256 is filled with a fluid at a predetermined pressure (e.g., compressed air, hydraulic oil, etc.). However, in alternative embodiments, the storage device 250 may correspond to any other suitable device for storing refrigerant, such as a bladder, a welded bellows, a piston, etc.

[0072] In operation, Fig. 9The illustrated storage device 250 passively controls the mass of refrigerant flowing through the refrigeration circuit 202. More specifically, as described above, the second chamber 256 of the cylinder 252 is filled with a fluid at a predetermined pressure. In this regard, when the pressure of the refrigerant leaving the second condenser 214 is greater than the pressure of the fluid within the second chamber 256 (thereby indicating that the pressure of the refrigerant within the refrigeration circuit 202 is too high), the piston 258 moves within the cylinder 252, causing the size of the first chamber 254 to increase and the size of the second chamber 256 to decrease. This increase in the size of the first chamber 254 allows more refrigerant to be stored within the first chamber 254, thereby reducing the mass of refrigerant flowing through the refrigeration circuit 202 (i.e., the condensers 212, 214; the expansion valves 216, 218; the evaporators 206, 208; and the compressor 210). Conversely, when the pressure of the refrigerant leaving the second condenser 214 is less than the pressure of the fluid within the second chamber 256 (thereby indicating that the pressure of the refrigerant within the refrigeration circuit 202 is too low), the piston 258 moves within the cylinder 252, causing the size of the first chamber 254 to decrease and the size of the second chamber 256 to increase. The reduction in the size of the first chamber 254 allows less refrigerant to be stored within the first chamber 254, thereby increasing the mass of refrigerant flowing through the refrigeration circuit 202 (i.e., the condensers 212, 214; the expansion valves 216, 218; the evaporators 206, 208; and the compressor 210).

[0073] Fig.10 FIG. 2 is a schematic diagram of another embodiment of a steam cycle system 200 for cooling components. Fig. 9 The embodiment of the steam cycle system 200 shown is similar. Fig.10 The vapor cycle system 200 shown includes a refrigeration circuit 202 having a first evaporator 206 and a second evaporator 208; a compressor 210; a first condenser 214; a second condenser 216 connected in series with the first condenser 214; and first and second expansion valves 216, 218. Fig. 9 The embodiment of the steam cycle system 200 shown is similar. Fig.10 The illustrated vapor cycle system 200 also includes a refrigerant charge control device 204 having a storage device 250. The storage device 250 in turn includes a cylinder 252 defining a first chamber 254 and a second chamber 256 separated by a piston or diaphragm 258.

[0074] However, with Fig. 9 The embodiments shown are different. Fig.10The refrigerant filling control device 204 shown also includes a pressure source 260 (e.g., a pump, a pressurizing chamber, etc.) and a control valve 262. More specifically, as shown, the pressure source 260 and the control valve 262 are in fluid communication with the second chamber 256. Therefore, the pressure source 260 is configured to produce and / or store a pressurized fluid (e.g., air, hydraulic oil, fuel, etc.). In addition, the control valve 262 is configured to control the flow of the pressurized fluid from the pressure source 260 to the second chamber 256. In addition, the control valve 262 may allow the fluid to be removed from the second chamber 256 and transferred to a reservoir (not shown). In addition, in some embodiments, the control valve 262 may be communicatively coupled to the computing system 230 (e.g., via a communication link 232) so that the computing system 230 can control the operation of the control valve 262.

[0075] In operation, Fig.10 The illustrated refrigerant charge control device 204 actively controls the mass of refrigerant flowing through the refrigeration circuit 202. More specifically, as described above, the mass of refrigerant within the refrigeration circuit 202 can be regulated based on the pressure and / or temperature of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218). In this regard, when the monitored refrigerant pressure exceeds a maximum pressure value, the computing system 230 can be configured to control the operation of the control valve 262 so that the control valve 262 allows the fluid to leave the second chamber 256 and flow to a storage device (not shown). In this case, the size of the first chamber 254 increases and the size of the second chamber 256 decreases. This increase in the size of the first chamber 254 allows more refrigerant to be stored in the first chamber 254, thereby reducing the mass of refrigerant flowing through the refrigeration circuit 202 (i.e., the condensers 212, 214; the expansion valves 216, 218; the evaporators 206, 208; and the compressor 210). In contrast, when the determined subcooling value of the refrigerant is below the minimum subcooling value, the computing system 230 may be configured to control the operation of the control valve 262 such that the control valve 262 opens to allow the pressurized fluid from the pressure source to flow into the second chamber 256 of the cylinder 252. In this case, the size of the first chamber 254 is reduced and the size of the second chamber 256 is increased. The reduction in the size of the first chamber 254 allows less refrigerant to be stored in the first chamber 254, thereby increasing the mass of the refrigerant flowing through the refrigeration circuit 202 (i.e., the condensers 212, 214; the expansion valves 216, 218; the evaporators 206, 208; and the compressor 210).

[0076] Fig.11 is a flow chart of one embodiment of a method 300 for cooling a component using a vapor cycle system. Figure 3-10The method 300 is described with reference to the system 200 shown in FIG. However, the disclosed method 300 may be implemented in any system having any other suitable system configuration. In addition, although for the purposes of illustration and discussion, Fig.11 The steps performed in a particular order are depicted, but the methods discussed herein are not limited to any particular order or arrangement. It will be appreciated by those skilled in the art that, using the disclosure provided herein, the various steps of the methods disclosed herein may be omitted, rearranged, combined and / or adapted in various ways without departing from the scope of the present disclosure.

[0077] like Fig.11 As shown, in (302), the method 300 includes monitoring, using a computing system, the pressure of the refrigerant leaving the second condenser of the refrigeration circuit of the vapor cycle system. For example, as described above, the computing system 230 may be configured to monitor the pressure of the refrigerant leaving the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) of the refrigeration circuit 202 of the vapor cycle system 200 based on the data captured by the pressure sensor 226.

[0078] Additionally, at (304), the method 300 may include monitoring, using the computing system, the temperature of the refrigerant exiting the second condenser. For example, as described above, the computing system 230 may be configured to monitor the temperature of the refrigerant exiting the second condenser 214 (or the last condenser through which the refrigerant flows before reaching the expansion valves 216, 218) based on data captured by the temperature sensor 228.

[0079] In addition, if Fig.11 As shown, at (306), the method 300 may include controlling the operation of the refrigerant filling control device based on the monitored pressure and the monitored temperature using the computing system to adjust the quality of the refrigerant flowing through the refrigeration circuit. For example, as described above, the computing system 230 may be configured to control the operation of the refrigerant filling control device 204 of the vapor cycle system 200 based on the monitored pressure and the monitored temperature to adjust the quality of the refrigerant flowing through the refrigeration circuit 202.

[0080] This written description uses examples to disclose the invention, including the best mode, and also to enable those skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. These other examples are intended to be within the scope of the claims if they include structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements that do not differ much from the literal language of the claims.

[0081] Further aspects of the invention are provided by the subject matter of the following clauses:

[0082] A vapor circulation system for cooling a component, the system comprising: a refrigeration circuit through which a large amount of refrigerant flows, the refrigeration circuit comprising: a compressor; a first condenser; a second condenser fluidly connected to the first condenser in series or in parallel; an expansion valve; and an evaporator; and a refrigerant filling control device, the refrigerant filling control device being configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit.

[0083] A system of one or more of these clauses wherein the refrigerant charge control device is connected in parallel with the expansion valve.

[0084] The system of one or more of these clauses, wherein the refrigerant charge control device comprises a control valve.

[0085] A system of one or more of these clauses, wherein: the control valve corresponds to a first control valve; the refrigerant filling control device further includes a tank connected in series with the first control valve and a second control valve connected in series with the tank; when the first control valve is opened, a portion of the refrigerant flows from the refrigeration circuit into the tank; and when the second control valve is opened, a portion of the refrigerant flows from the tank into the refrigeration circuit.

[0086] A system of one or more of these clauses, wherein a portion of the refrigerant passively flows from the tank into the refrigeration circuit when the second control valve is opened.

[0087] A system of one or more of these clauses, wherein the refrigeration circuit further includes a suction line heat exchanger configured to transfer heat between a portion of the refrigerant flowing from the second condenser to the expansion valve and a portion of the refrigerant flowing from the evaporator to the compressor.

[0088] The system of one or more of these clauses further comprises: a bypass circuit fluidly connected to the refrigeration circuit, the bypass circuit being configured to allow a portion of the refrigerant leaving the second condenser to bypass the expansion valve and the evaporator and flow directly to the compressor, the bypass circuit comprising an economizer heat exchanger and a third control expansion valve, the third control expansion valve being configured to control the flow of refrigerant from the refrigeration circuit into the bypass circuit.

[0089] The system of one or more of these clauses further includes a bypass circuit in fluid communication with the refrigeration circuit, the bypass circuit being configured to allow refrigerant to bypass the first condenser or the second condenser, wherein the control valve is configured to selectively allow refrigerant from the refrigeration circuit to flow into the bypass circuit.

[0090] The system of one or more of these clauses, wherein the first condenser is configured to be backfilled with a portion of the refrigerant that bypasses the first condenser.

[0091] The system of one or more of these clauses, wherein the refrigerant fill control device includes a storage device.

[0092] The system of one or more of these clauses, wherein the storage device is configured to passively control the quality of refrigerant flowing through the refrigeration circuit.

[0093] The system of one or more of these clauses, wherein the storage device is configured to actively control the quality of refrigerant flowing through the refrigeration circuit.

[0094] The system of one or more of these clauses, wherein the storage device comprises: a cylinder defining a first chamber and a second chamber; and a piston separating the first chamber and the second chamber

[0095] A system of one or more of these clauses wherein the storage device is connected in series with the refrigeration circuit.

[0096] A system of one or more of these items, further comprising: a pressure sensor, the pressure sensor being configured to capture data indicating the pressure of the refrigerant leaving the second condenser; a temperature sensor, the temperature sensor being configured to capture data indicating the temperature of the refrigerant leaving the second condenser; a computing system, the computing system being communicatively coupled to the pressure sensor and the temperature sensor, the computing system being configured to: monitor the pressure of the refrigerant leaving the second condenser based on the data captured by the pressure sensor; monitor the temperature of the refrigerant leaving the second condenser based on the data captured by the temperature sensor; and control the operation of the refrigerant fill control device based on the monitored pressure and the monitored temperature to regulate the quality of the refrigerant flowing through the refrigeration circuit.

[0097] A system of one or more of these clauses, wherein, when controlling the operation of a refrigerant fill control device, the computing system is further configured to: compare the monitored pressure with a maximum pressure value; and when the monitored pressure exceeds the maximum pressure value, control the operation of the refrigerant fill control device so that the mass of refrigerant flowing through the refrigeration circuit is reduced.

[0098] A system of one or more of these clauses, wherein, when controlling the operation of the refrigerant fill control device, the computing system is further configured to: determine a subcooling value of the refrigerant leaving the second condenser based on the monitored temperature; compare the determined subcooling value with a minimum subcooling value; and when the determined subcooling value is lower than the minimum subcooling value, control the operation of the refrigerant fill control device such that the mass of the refrigerant flowing through the refrigeration circuit increases.

[0099] A method for cooling a component using a vapor cycle system, the vapor cycle system comprising a refrigeration circuit, a large amount of refrigerant flowing through the refrigeration circuit, the refrigeration circuit comprising a first condenser and a second condenser fluidly connected in series to the first condenser, the vapor cycle system further comprising a refrigerant filling control device, the refrigerant filling control device being configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit, the method comprising: using a computing system to monitor the pressure of the refrigerant leaving the second condenser; using a computing system to monitor the temperature of the refrigerant leaving the second condenser; and using the computing system to control the operation of the refrigerant filling control device based on the monitored pressure and the monitored temperature to adjust the mass of the refrigerant flowing through the refrigeration circuit.

[0100] A method according to item 18, wherein controlling the operation of the refrigerant filling control device includes: using a computing system to compare the monitored pressure with a maximum pressure value; and when the monitored pressure exceeds the maximum pressure value, using the computing system to control the operation of the refrigerant filling control device so that the mass of the refrigerant flowing through the refrigeration circuit is reduced.

[0101] A system according to item 18, wherein controlling the operation of the refrigerant filling control device includes: using a computing system to determine a subcooling value of the refrigerant leaving the second condenser based on the monitored temperature; using the computing system to compare the determined subcooling value with a minimum subcooling value; and when the determined subcooling value is lower than the minimum subcooling value, using the computing system to control the operation of the refrigerant filling control device so that the mass of the refrigerant flowing through the refrigeration circuit increases.

Claims

1. A steam circulation system for cooling components, characterized in that: The system comprises: A refrigeration circuit through which a large amount of refrigerant flows, the refrigeration circuit comprising: compressor; First condenser; a second condenser fluidly coupled in series to the first condenser; expansion valve; and Evaporator; and a refrigerant fill control device configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit; the refrigerant fill control device comprising a control valve, wherein the control valve is positioned so that the refrigerant leaving the compressor flows through the control valve before entering the first condenser, the first condenser being the first condenser through which the refrigerant flows after leaving the compressor; The system further comprises: a bypass circuit in fluid communication with the refrigeration circuit, the bypass circuit being configured to allow the refrigerant to bypass the first condenser, wherein the control valve is configured to selectively allow the refrigerant from the refrigeration circuit to flow into the bypass circuit, wherein the bypass circuit is fluidly coupled to the control valve and extends from the control valve to a position between the first condenser and the second condenser on the refrigeration circuit.

2. The system according to claim 1, characterized in that: The refrigerant filling control device includes a first control valve; The refrigerant filling control device further includes a tank connected in series with the first control valve and a second control valve connected in series with the tank; When the first control valve is opened, a portion of the refrigerant flows from the refrigeration circuit into the tank; and When the second control valve is opened, a portion of the refrigerant flows from the tank into the refrigeration circuit.

3. The system according to claim 2, characterized in that When the second control valve is opened, the portion of the refrigerant passively flows from the tank into the refrigeration circuit.

4. The system according to claim 2, characterized in that The refrigeration circuit further includes a suction line heat exchanger configured to transfer heat between a portion of the refrigerant flowing from the second condenser to the expansion valve and a portion of the refrigerant flowing from the evaporator to the compressor.

5. The system according to claim 2, characterized in that Further including: A bypass circuit is fluidly connected to the refrigeration circuit, the bypass circuit being configured to allow a portion of the refrigerant leaving the second condenser to bypass the expansion valve and the evaporator and flow directly to the compressor, the bypass circuit comprising an economizer heat exchanger and a third control expansion valve, the third control expansion valve being configured to control the refrigerant to flow from the refrigeration circuit into the bypass circuit.

6. The system according to claim 1, characterized in that The first condenser is configured to be backfilled with a portion of the refrigerant that bypasses the first condenser.

7. The system according to claim 1, characterized in that The refrigerant filling control device includes a storage device.

8. The system according to claim 7, characterized in that The storage device is configured to passively control a mass of the refrigerant flowing through the refrigeration circuit.

9. The system according to claim 7, characterized in that The storage device is configured to actively control a mass of the refrigerant flowing through the refrigeration circuit.

10. The system according to claim 7, characterized in that The storage device comprises: a cylinder defining a first chamber and a second chamber; and A piston separates the first chamber and the second chamber.

11. The system according to claim 7, characterized in that The storage device is connected in series with the refrigeration circuit.

12. The system according to claim 1, characterized in that Further including: a pressure sensor configured to capture data indicative of a pressure of the refrigerant exiting the second condenser; a temperature sensor configured to capture data indicative of a temperature of the refrigerant exiting the second condenser; a computing system communicatively coupled to the pressure sensor and the temperature sensor, the computing system configured to: monitoring a pressure of the refrigerant exiting the second condenser based on data captured by the pressure sensor; monitoring a temperature of the refrigerant exiting the second condenser based on data captured by the temperature sensor; and Operation of the refrigerant charge control device is controlled based on the monitored pressure and the monitored temperature to regulate the quality of the refrigerant flowing through the refrigeration circuit.

13. The system according to claim 12, characterized in that When controlling the operation of the refrigerant charge control device, the computing system is further configured to: comparing the monitored pressure to a maximum pressure value; and When the monitored pressure exceeds the maximum pressure value, the operation of the refrigerant charge control device is controlled so that the mass of the refrigerant flowing through the refrigeration circuit is reduced.

14. The system according to claim 12, characterized in that When controlling the operation of the refrigerant charge control device, the computing system is further configured to: determining a subcooling value of the refrigerant exiting the second condenser based on the monitored temperature; comparing the determined subcooling value to a minimum subcooling value; and When the determined subcooling value is lower than the minimum subcooling value, the operation of the refrigerant charge control device is controlled so that the mass of the refrigerant flowing through the refrigeration circuit increases.

15. A method for cooling a component using a steam circulation system, characterized in that: The vapor cycle system includes a refrigeration circuit through which a mass of refrigerant flows, the refrigeration circuit including a first condenser and a second condenser fluidly coupled in series to the first condenser and a compressor, the vapor cycle system further including a refrigerant fill control device configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit, the refrigerant fill control device including a control valve, wherein the control valve is positioned so that the refrigerant leaving the compressor flows through the control valve before entering the first condenser, the first condenser being the first condenser through which the refrigerant flows after leaving the compressor; the system further includes: a bypass circuit in fluid communication with the refrigeration circuit, the bypass circuit being configured to allow the refrigerant to bypass the first condenser, wherein the control valve is configured to selectively allow the refrigerant from the refrigeration circuit to flow into the bypass circuit, wherein the bypass circuit is fluidly coupled to and extends from the control valve to a location between the first condenser and the second condenser on the refrigeration circuit; The method comprises: monitoring, using a computing system, a pressure of the refrigerant exiting the second condenser; monitoring, using the computing system, a temperature of the refrigerant exiting the second condenser; and The operation of the refrigerant charge control device is controlled using the computing system based on the monitored pressure and the monitored temperature to regulate the quality of the refrigerant flowing through the refrigeration circuit.

16. The method according to claim 15, characterized in that Controlling the operation of the refrigerant filling control device includes: using the computing system, comparing the monitored pressure to a maximum pressure value; and When the monitored pressure exceeds the maximum pressure value, the operation of the refrigerant charge control device is controlled using the computing system such that the mass of the refrigerant flowing through the refrigeration circuit is reduced.

17. The method according to claim 15, characterized in that Controlling the operation of the refrigerant filling control device includes: determining, using the computing system, a subcooling value of the refrigerant exiting the second condenser based on the monitored temperature; using the computing system, comparing the determined subcooling value to a minimum subcooling value; and When the determined subcooling value is lower than the minimum subcooling value, the operation of the refrigerant charge control device is controlled using the computing system so that the mass of the refrigerant flowing through the refrigeration circuit increases.

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