Electronic equipment and antenna device

Abstract

The present invention discloses an electronic device and an antenna device. The disclosed antenna device includes a rigid circuit board and a feeding structure part. The rigid circuit board includes a first metal layer, an insulating medium layer and a second metal layer, wherein: the first metal layer, the insulating medium layer and the second metal layer are stacked in sequence, and the first metal layer and the second metal layer are insulated by the insulating medium layer; the first metal layer is the antenna part of the antenna device, the second metal layer is the first grounding layer of the antenna device, the first end of the feeding structure part is electrically connected to the first metal layer, the second end of the feeding structure part passes through the insulating medium layer and the second metal layer, and the feeding structure part is insulated from the second metal layer.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment design, and in particular to an electronic equipment and an antenna device. Background Art

[0002] With the development of communication technology, users have put forward higher requirements for the convenience and intelligence of electronic devices. Among them, it has become a trend for electronic devices to locate and find objects through wireless communication technology.

[0003] In the related art, wireless communication technology usually uses a flexible circuit board to set up multiple antenna units on the back shell of the electronic device. According to the characteristics of the flexible circuit board, the substrate required is usually a liquid crystal polymer, and the dielectric constant of the liquid crystal polymer is relatively small. During the design, since the dielectric constant of the liquid crystal polymer is relatively small, in order to increase the angle measurement of wireless communication, the designer usually increases the area of ​​the antenna unit, which will cause the antenna device to occupy a larger area. Summary of the invention

[0004] The invention discloses an electronic device and an antenna device, so as to solve the problem that a flexible circuit board is used in wireless communication in the related art and occupies a large space.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, the present application discloses an antenna device, comprising a rigid circuit board and a feeding structure, wherein the rigid circuit board comprises a first metal layer, an insulating medium layer, and a second metal layer, wherein:

[0007] The first metal layer, the insulating medium layer and the second metal layer are stacked in sequence, and the first metal layer and the second metal layer are insulated by the insulating medium layer;

[0008] The first metal layer is the antenna part of the antenna device, the second metal layer is the first ground layer of the antenna device, the first end of the feeding structure part is electrically connected to the first metal layer, the second end of the feeding structure part passes through the insulating medium layer and the second metal layer, and the feeding structure part is insulated from the second metal layer.

[0009] In a second aspect, the present application further discloses an electronic device, comprising a device mainboard and the antenna device described in the first aspect, the device mainboard comprising an antenna chip, the second end of the feeding structure portion being electrically connected to the antenna chip, and the feeding structure portion being electrically connected to the first metal layer and the antenna chip.

[0010] The technical solution adopted by the present invention can achieve the following technical effects:

[0011] The embodiment of the present application forms an antenna device by configuring the antenna device to include a rigid circuit board and a feeding structure part, and the rigid circuit board includes a first metal layer, an insulating dielectric layer, and a second metal layer, so that the first metal layer, the insulating dielectric layer, and the second metal layer are stacked in sequence, and the first metal layer and the second metal layer are insulated by the insulating dielectric layer, so that the first metal layer can be used as the antenna part, the second metal layer can be used as the first grounding layer, and the first end of the feeding structure part is electrically connected to the first metal layer, the second end of the feeding structure part passes through the insulating dielectric layer and the second metal layer, and is exposed in the second metal layer, and the feeding structure part is insulated from the second metal layer, thereby forming an antenna device.

[0012] Since the antenna device adopts a structure including a rigid circuit board, the manufacturing process of the rigid circuit board enables the insulating dielectric layer to select materials with different dielectric constants according to actual needs, and the range of dielectric constants that can be selected is relatively large, so it can be suitable for more application environments, thereby solving the problem that when a flexible circuit board is used as an antenna device, only materials with a smaller dielectric constant can be selected, resulting in certain limitations in application. Moreover, the antenna device is configured to include a rigid circuit board, and a material with a larger dielectric constant than that of the flexible circuit board can be further selected as the insulating dielectric layer. Therefore, when it is necessary to increase the angle measurement of wireless communication, the occupied area of ​​the antenna device can be smaller, so that it can be better applied to small electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic structural diagram of a first antenna device disclosed in an embodiment of the present invention;

[0014] Figure 2 A schematic diagram of the structure of a second antenna device disclosed in an embodiment of the present invention;

[0015] Figure 3 A schematic diagram of the structure of the second metal layer disclosed in an embodiment of the present invention;

[0016] Figure 4 A side view of the antenna device disclosed in an embodiment of the present invention;

[0017] Figure 5 It is a side view of the antenna device disclosed in the embodiment of the present invention after the insulating dielectric layer is hidden;

[0018] Figure 6 A schematic diagram of the structure of a first electronic device disclosed in an embodiment of the present invention;

[0019] Figure 7 for Figure 6 Schematic diagram of the structure after hiding the motherboard bracket;

[0020] Figure 8 for Figure 7 Schematic diagram of the structure after the antenna device is hidden;

[0021] Fig. 9 for Figure 8 A partial enlarged view of

[0022] Fig.10 This is a schematic diagram of the first structure of the mainboard bracket;

[0023] Fig.11 This is a second structural schematic diagram of the mainboard bracket;

[0024] Fig.12 is a schematic diagram of the structure of the electronic device at a first viewing angle;

[0025] Fig.13 It is a schematic diagram of the structure of the electronic device at a second viewing angle.

[0026] Description of reference numerals:

[0027] 100-antenna device,

[0028] 200-first metal layer, 210-antenna unit,

[0029] 300-insulating dielectric layer,

[0030] 400-second metal layer, 410-mounting protrusion, 411-mounting hole,

[0031] 500-feed structure,

[0032] 600 - third metal layer, 610 - grounding hole, 611 - grounding connection part,

[0033] 700-electronic device, 710-equipment motherboard, 711-antenna chip, 720-shrapnel, 730-motherboard bracket, 731-accommodation space, 732-groove, 733-avoidance hole, 740-threaded hole,

[0034] 800- ground bolt,

[0035] 910-shielding cover, 920-display, 930-equipment housing, 940-camera module,

[0036] A-Gap. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0038] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0039] Please refer to Figures 1 to 13 The embodiment of the present invention discloses an antenna device 100, and the disclosed antenna device 100 includes a rigid circuit board and a feeding structure 500. The rigid circuit board includes a first metal layer 200, an insulating dielectric layer 300, and a second metal layer 400. The first metal layer 200, the insulating dielectric layer 300, and the second metal layer 400 are stacked in sequence, and the first metal layer 200 and the second metal layer 400 are insulated by the insulating dielectric layer 300.

[0040] The first metal layer 200 is the antenna part of the antenna device 100, and the antenna part can be a transmitting antenna or a receiving antenna, or the antenna part is both a transmitting antenna and a receiving antenna. The second metal layer 400 is the first grounding layer of the antenna device 100. The second metal layer 400 can be connected to the ground of the device mainboard 710 or the ground of the device housing 930. The first end of the feeding structure part 500 is electrically connected to the first metal layer 200, and the second end of the feeding structure part 500 passes through the insulating medium layer 300 and the second metal layer 400, so that the second end of the feeding structure part 500 is exposed to the second metal layer 400, and the feeding structure part 500 is insulated from the second metal layer 400. The second end of the feeding structure part 500 can be connected to the antenna chip 711 of the electronic device 700, and the feeding structure part 500 is used to feed the signal of the antenna part to the antenna chip 711.

[0041] The first metal layer 200 may be a patch antenna, which is implemented by a printed circuit board multilayer process. The second metal layer 400 may be implemented by copper plating on a printed circuit board. The edge of the second metal layer 400 may be provided with a plurality of mounting protrusions 410, and the plurality of mounting protrusions 410 may be a grounding structure of the second metal layer 400. The feed structure 500 may be disposed on the second metal layer 400 and insulated from the second metal layer 400.

[0042] In the embodiment of the present application, an antenna device 100 is provided to include a rigid circuit board and a feeding structure part 500, and the rigid circuit board includes a first metal layer 200, an insulating dielectric layer 300 and a second metal layer 400, so that the first metal layer 200, the insulating dielectric layer 300 and the second metal layer 400 are stacked in sequence, and the first metal layer 200 and the second metal layer 400 are insulated by the insulating dielectric layer 300, so that the first metal layer 200 can be used as an antenna part, and the second metal layer 400 can be used as a first grounding layer, and the first end of the feeding structure part 500 is electrically connected to the first metal layer 200, and the second end of the feeding structure part 500 passes through the insulating dielectric layer 300 and the second metal layer 400 and is exposed in the second metal layer 400, and the feeding structure part 500 is insulated from the second metal layer 400, thereby forming the antenna device 100.

[0043] Since the antenna device 100 adopts a structure including a rigid circuit board, the manufacturing process of the rigid circuit board enables the insulating dielectric layer 300 to select materials with different dielectric constants according to actual needs, and the range of dielectric constants that can be selected is relatively large, so that it can be applicable to more application environments, thereby solving the problem that when a flexible circuit board is used as the antenna device 100, only materials with a smaller dielectric constant can be selected, resulting in certain limitations in application. Moreover, the antenna device 100 is configured to include a rigid circuit board, and a material with a larger dielectric constant than the flexible circuit board can be further selected as the insulating dielectric layer 300, so that when it is necessary to increase the angle measurement of wireless communication, the occupied area of ​​the antenna device 100 can be smaller, so that it can be better applied to small electronic devices 700.

[0044] In addition, since the use of flexible circuit boards can be avoided, the use of liquid crystal polymers for preparing flexible circuit boards can be avoided. Liquid crystal polymers are relatively expensive, so rigid circuit boards are lower in cost than flexible circuit boards. Therefore, the use of rigid circuit boards can also improve economic efficiency.

[0045] In an optional solution, the antenna portion may be composed of a plurality of antenna units 210. Specifically, the first metal layer 200 may include a plurality of sub-regions distributed at intervals, each sub-region being an antenna unit 210. The antenna portion includes a plurality of antenna units 210. There are a plurality of feeding structures 500, and each antenna unit 210 is electrically connected to the first end of the corresponding feeding structure 500 in a one-to-one correspondence. By providing a plurality of antenna units 210, the receiving and transmitting signal performance of the antenna device 100 can be effectively enhanced. Specifically, each antenna unit 210 is electrically connected to the first end of a feeding structure 500.

[0046] When multiple antenna units 210 receive or transmit signals at the same time, there will be interference between the multiple antenna units 210. In order to reduce the interference between the antennas, the antenna device 100 may optionally include a third metal layer 600, which may be arranged at the same layer as the first metal layer 200, and the third metal layer 600 is arranged in the gap A formed between the multiple antenna units 210, and any two antenna units 210 are isolated by the third metal layer 600, and the third metal layer 600 is a second ground layer. The second ground layer may be connected to the ground of the device mainboard 710 or the ground of the device housing 930.

[0047] By setting the third metal layer 600, the third metal layer 600 is set as the second ground layer on the same layer as the first metal layer 200, and is set in the gap A formed between multiple antenna units 210, so that any two antenna units 210 are isolated by the third metal layer 600, so that an isolation wall is formed between any two antenna units 210 through the second ground layer, thereby improving the isolation between the antenna units 210, reducing the interference between the antenna units 210, thereby improving the directivity of each antenna unit 210, and improving the performance of wireless communication.

[0048] Since the second metal layer 400 and the third metal layer 600 are the first grounding layer and the second grounding layer respectively, and both are used for grounding, in order to further optimize the overall structure of the antenna device 100, optionally, the antenna device 100 can be provided with a grounding hole 610, and the first port of the grounding hole 610 is provided on the third metal layer 600, and the grounding hole 610 passes through the insulating medium layer 300 to the second metal layer 400 from the first port, and a grounding connection part 611 is provided in the grounding hole 610, and the grounding connection part 611 electrically connects the third metal layer 600 and the second metal layer 400.

[0049] The antenna device 100 is provided with a grounding hole 610, so that the first port of the grounding hole 610 is arranged on the third metal layer 600, and the grounding hole 610 penetrates the insulating medium layer 300 to the second metal layer 400 from the first port, so that a grounding connection portion 611 can be arranged in the grounding hole 610, and the grounding connection portion 611 electrically connects the third metal layer 600 and the second metal layer 400, so that as long as one of the third metal layer 600 and the second metal layer 400 is grounded, the other will be indirectly grounded, so that the grounding method of the antenna device 100 is more reasonable, and the grounding hole 610 can also serve as a heat dissipation portion, thereby increasing the heat dissipation area, thereby improving the heat dissipation performance of the antenna device 100, and the grounding hole 610 can also reduce the weight of the antenna device 100.

[0050] The grounding connection part 611 may be a metal plating formed on the inner surface of the grounding hole 610, or may be a conductive column located at the center of the grounding hole 610. No specific limitation is imposed on the grounding connection part 611. The antenna device 100 may have a plurality of grounding holes 610 arranged at intervals, wherein the first ports of the plurality of grounding holes 610 are all arranged on the third metal layer 600, and the plurality of grounding holes 610 penetrate the insulating medium layer 300 to the second metal layer 400 from the first ports, and the plurality of grounding holes 610 are all provided with a grounding connection part 611, and the grounding connection part 611 electrically connects the third metal layer 600 and the second metal layer 400.

[0051] Of course, the antenna device 100 may not have the grounding hole 610 , and the second metal layer 400 and the third metal layer 600 may be electrically connected at the edge through metal plating so that the second metal layer 400 and the third metal layer 600 are grounded together.

[0052] In an optional embodiment, the antenna device may be a UWB (Ultra Wideband) antenna device. The UWB antenna device uses UWB technology for communication. As the UWB technology is an existing technology, it will not be described in detail here.

[0053] The present application also discloses an electronic device 700, which may be provided with a wireless circuit, and the wireless circuit may be used to support wireless communications in multiple wireless communication frequency bands. The communication frequency bands processed by the wireless communication circuit may include satellite navigation system communication frequency bands, cellular phone communication frequency bands, wireless local area network communication frequency bands, near field communication frequency bands, ultra-wideband communication frequency bands, or other wireless communication frequency bands. The electronic device 700 may be a portable electronic device or other suitable electronic device.

[0054] The disclosed electronic device 700 includes a device mainboard 710 and the antenna device 100 disclosed in the above embodiment. The device mainboard 710 includes an antenna chip 711, the second end of the feed structure 500 is electrically connected to the antenna chip 711, and the feed structure 500 is electrically connected to the first metal layer 200 and the antenna chip 711.

[0055] The electronic device 700 may further include a mainboard bracket 730, which may be made of metal. The device mainboard 710 is arranged on one side of the mainboard bracket 730, and at least part of the antenna device 100 is arranged on the side of the mainboard bracket 730 away from the device mainboard 710. By providing the mainboard bracket 730, the antenna device 100 and the device mainboard 710 share the same mainboard bracket 730, so that the structure of the electronic device 700 is more compact. Moreover, the reserved gap between the two opposite sides of the mainboard bracket 730 and the device housing 930 is limited. The antenna device 100 and the device mainboard 710 are respectively arranged on the two opposite sides of the mainboard bracket 730, so as to avoid crowding caused by arranging the antenna device 100 and the device mainboard 710 on the same side of the mainboard bracket 730, and can also reduce the interference between the antenna device 100 and the device mainboard 710. Moreover, the separate arrangement of the antenna device 100 and the device mainboard 710 is also conducive to heat dissipation.

[0056] In some embodiments, the antenna device 100 may also be disposed inside the mainboard bracket 730 . For example, the mainboard bracket 730 is provided with a penetrating accommodation space 731 , and the antenna device 100 is located in the accommodation space 731 .

[0057] In some thin and light electronic devices 700, the installation space of the antenna device 100 is limited. In order to reasonably install the antenna device 100, optionally, a concave accommodation space 731 may be provided on the side of the mainboard bracket 730 away from the device mainboard 710, and the antenna device 100 may be arranged in the accommodation space 731. By providing the concave accommodation space 731 on the side of the mainboard bracket 730 away from the device mainboard 710, the antenna device 100 may be arranged in the accommodation space 731, so that the antenna device 100 and the mainboard bracket 730 form a relatively thin structure, and the accommodation space 731 can also reduce the weight of the mainboard bracket 730, so that it can be better suitable for the thin and light electronic device 700.

[0058] In some embodiments, the mainboard bracket 730 is directly grounded, and the second metal layer 400 can be electrically connected to the mainboard bracket 730 to achieve grounding. In order to better ground the second metal layer 400, optionally, the accommodating space 731 can be a groove 732, and the bottom wall of the groove 732 can be provided with an avoidance hole 733. The antenna device 100 can be arranged in the groove 732, and the second metal layer 400 is in contact with the bottom wall of the groove 732. The device mainboard 710 can be provided with a spring clip 720, and the spring clip 720 can pass through the avoidance hole 733 to electrically connect to the second end of the feeding structure part 500, and the spring clip 720 is electrically connected to the antenna chip 711.

[0059] By setting the accommodating space 731 as a groove 732, the antenna device 100 can be set in the groove 732, and the second metal layer 400 is in contact with the bottom wall of the groove 732, so that the second metal layer 400 and the mainboard bracket 730 can be better grounded, and the radiation of the edge field of the antenna device 100 can be reduced, thereby improving the directivity of the antenna device 100. By opening an avoidance hole 733 on the bottom wall of the groove 732, the spring clip 720 can pass through the avoidance hole 733 to electrically connect to the second end of the feeding structure part 500, and the spring clip 720 is electrically connected to the antenna chip 711, so that the first metal layer 200 is electrically connected to the antenna chip 711 through the feeding structure part 500 and the spring clip 720 in sequence, and the avoidance hole 733 can also limit the spring clip 720. When the spring clip 720 is fixedly set on the device mainboard 710, the device mainboard 710 can also be limited, so that the device mainboard 710 is more stably set on the mainboard bracket 730.

[0060] In order to further optimize the grounding scheme of the antenna device 100, optionally, a plurality of mounting protrusions 410 can be set on the edge of the second metal layer 400, and the plurality of mounting protrusions 410 are each provided with a mounting hole 411. A plurality of threaded holes 740 can be provided on the mainboard bracket 730. The electronic device 700 can also include a plurality of grounding bolts 800, and the plurality of grounding bolts 800 pass through the plurality of mounting holes 411 one by one and are connected to the corresponding threaded holes 740, so that the antenna device 100 is installed on the mainboard bracket 730. The mainboard bracket 730 and the second metal layer 400 are both grounded through the grounding bolts 800, and the mounting protrusions 410 protrude beyond the corresponding edges of the insulating medium layer 300 and the first metal layer 200.

[0061] By providing a plurality of mounting protrusions 410 on the edge of the second metal layer 400, each of the plurality of mounting protrusions 410 is provided with a mounting hole 411, and a plurality of threaded holes 740 are provided on the mainboard bracket 730, so that the grounding bolts 800 can pass through the plurality of mounting holes 411 one by one and be connected to the corresponding threaded holes 740, so that the antenna device 100 can be installed on the mainboard bracket 730, and the mainboard bracket 730 and the second metal layer 400 can be grounded through the grounding bolts 800, so that the mainboard bracket 730 and the second metal layer 400 can be grounded separately, so that the structure of the electronic device 700 can be more compact. In addition, the mounting protrusions 410 protrude from the corresponding edges of the insulating medium layer 300 and the first metal layer 200, so that the mounting holes 411 are not blocked, and it is easier to assemble the grounding bolts 800 in the mounting holes 411.

[0062] In some embodiments, the mainboard bracket 730 may be provided with a receiving space 731, the threaded hole 740 on the mainboard bracket 730 may be provided at the outer edge of the receiving space 731, the threaded hole 740 may be recessed in the surface between the mainboards, lower than the plane of the mainboard bracket 730, and a plurality of grounding bolts 800 pass through a plurality of mounting holes 411 one by one and are connected to the corresponding threaded holes 740, so that the antenna device 100 is mounted on the mainboard bracket 730, and the antenna device 100 may be mounted in the receiving space 731 of the mainboard bracket 730. The receiving space 731 may be a receiving hole, and the receiving hole may be a through hole.

[0063] The antenna device 100, as a device for receiving and sending signals, should reduce the interference of other components to the antenna device 100 as much as possible, and the device mainboard 710 is the main component that causes interference to the antenna device 100. In order to reduce the interference of the device mainboard 710 to the antenna device 100, the electronic device 700 may optionally further include a shielding cover 910. The shielding cover 910 may be provided on the device mainboard 710 and between the device mainboard 710 and the antenna device 100. The shielding cover 910 may be provided opposite to the antenna device 100. By providing the shielding cover 910 between the antenna device 100 and the device mainboard 710, the interference of the device mainboard 710 to the antenna device 100 may be effectively reduced, thereby improving the directivity of the antenna device 100.

[0064] In an optional embodiment, the electronic device 700 further includes a device housing 930 and a display 920, wherein the display 920 is disposed on the device housing 930, and the display 920 and the device housing 930 enclose an inner cavity, and the antenna device 100 and the device mainboard 710 are both disposed in the inner cavity. The display 920 may be a touch screen that is combined with a capacitive touch electrode or may be touch-sensitive.

[0065] In an optional embodiment, the electronic device 700 may further include a camera module 940. The device housing 930 may be provided with a light-transmitting hole. The camera module 940 may be disposed in the inner cavity and arranged opposite to the light-transmitting hole, so that the camera module 940 can take pictures through the light-transmitting hole, thereby ultimately ensuring the shooting performance of the electronic device 700.

[0066] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0067] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. An electronic device, characterized in that: The invention comprises a device mainboard (710), a mainboard bracket (730) and an antenna device (100), wherein the antenna device (100) comprises a rigid circuit board and a feeding structure (500), and the rigid circuit board comprises a first metal layer (200), an insulating medium layer (300) and a second metal layer (400), wherein: The first metal layer (200), the insulating medium layer (300) and the second metal layer (400) are stacked in sequence, and the first metal layer (200) and the second metal layer (400) are insulated by the insulating medium layer (300); The first metal layer (200) is the antenna part of the antenna device (100), the second metal layer (400) is the first ground layer of the antenna device (100), the first end of the feeding structure part (500) is electrically connected to the first metal layer (200), the second end of the feeding structure part (500) passes through the insulating medium layer (300) and the second metal layer (400), and the feeding structure part (500) is insulated from the second metal layer (400); The device mainboard (710) comprises an antenna chip (711), the second end of the feeding structure (500) is electrically connected to the antenna chip (711), and the feeding structure (500) is electrically connected to the first metal layer (200) and the antenna chip (711); The mainboard bracket (730) has a groove (732) on a side facing away from the device mainboard (710), and the bottom wall of the groove (732) is provided with an avoidance hole (733). The antenna device (100) is arranged in the groove (732), and the second metal layer (400) is in contact with the bottom wall of the groove (732). The device mainboard (710) is provided with a spring sheet (720), and the spring sheet (720) passes through the avoidance hole (733) and is electrically connected to the second end of the feeding structure (500), and the spring sheet (720) is electrically connected to the antenna chip (711); The mainboard bracket (730) is grounded, and the avoidance hole (733) limits the spring sheet (720); The electronic device (700) further comprises a shielding cover (910), wherein the shielding cover (910) is arranged on the device mainboard (710) and is located between the device mainboard (710) and the antenna device (100), and the shielding cover (910) and the antenna device (100) are arranged opposite to each other.

2. The electronic device according to claim 1, characterized in that: The antenna portion comprises a plurality of antenna units (210), the feeding structure portions (500) are multiple, and each of the antenna units (210) is electrically connected to the first end of the corresponding feeding structure portion (500) in a one-to-one correspondence.

3. The electronic device according to claim 2, characterized in that: The antenna device (100) comprises a third metal layer (600), the third metal layer (600) being arranged in the same layer as the first metal layer (200), and the third metal layer (600) being arranged in a gap (A) formed between the plurality of antenna units (210), any two of the antenna units (210) being isolated by the third metal layer (600), and the third metal layer (600) being a second ground layer.

4. The electronic device according to claim 3, characterized in that: The antenna device (100) is provided with a grounding hole (610), a first port of the grounding hole (610) is provided on the third metal layer (600), the grounding hole (610) passes through the insulating medium layer (300) to the second metal layer (400) from the first port, a grounding connection portion (611) is provided in the grounding hole (610), and the grounding connection portion (611) electrically connects the third metal layer (600) and the second metal layer (400).

5. The electronic device according to claim 1, characterized in that: The antenna device is a UWB antenna device.

6. The electronic device according to claim 1, characterized in that: The device mainboard (710) is arranged on one side of the mainboard bracket (730), and at least a part of the antenna device (100) is arranged on a side of the mainboard bracket (730) facing away from the device mainboard (710).

7. The electronic device according to claim 1, characterized in that: A plurality of mounting protrusions (410) are arranged on the edge of the second metal layer (400), and each of the plurality of mounting protrusions (410) is provided with a mounting hole (411). The mainboard bracket (730) is provided with a plurality of threaded holes (740). The electronic device (700) further comprises a plurality of grounding bolts (800), and each of the plurality of grounding bolts (800) passes through the plurality of mounting holes (411) in a one-to-one correspondence and is connected to the corresponding threaded holes (740) so that the antenna device (100) is mounted on the mainboard bracket (730). The mainboard bracket (730) and the second metal layer (400) are both grounded through the grounding bolts (800), and the mounting protrusions (410) protrude beyond the corresponding edges of the insulating medium layer (300) and the first metal layer (200).

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