Ultrasonic endoscope

Abstract

Provided is an ultrasonic endoscope having, at a distal end portion, an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged; a shield cable having a plurality of signal lines and a plurality of shield members made of metal disposed outside the signal lines; a wiring portion having a plurality of connection portions that respectively electrically connect the plurality of signal lines to the plurality of ultrasonic transducers; a ground line portion that is electrically connected to the plurality of shield members and has thermal conductivity; a sheet-shaped first thermal conductive member disposed on a side surface of the ultrasonic transducer array; and a second thermal conductive member that thermally connects the first thermal conductive member to the ground line portion. Thus, an ultrasonic endoscope that can improve the accuracy of diagnosis in ultrasonic diagnosis is provided.

Description

[0001] This application is a divisional application of the invention patent application filed on April 12, 2017, with national application number 201780039789.3 (international application number PCT / JP2017 / 014989) and entitled "Ultrasonic Endoscope and Manufacturing Method Thereof". Technical Field

[0002] This invention relates to an ultrasonic endoscope, and more particularly to an ultrasonic endoscope having a heat dissipation structure at its anterior end for dissipating heat generated in an ultra-miniature ultrasonic transducer used in an ultrasonic endoscope inserted into a body cavity. Background Technology

[0003] Ultrasound diagnostic devices that use ultrasound imaging typically include surface ultrasound probes for contact with the patient or intracavitary ultrasound probes for insertion into the patient's body cavity. Furthermore, in recent years, ultrasonic endoscopes have been developed that combine an endoscope for optical observation of the patient's body with an intracavitary ultrasound probe.

[0004] An ultrasonic probe is used to send an ultrasonic beam to a subject such as a human body. If the ultrasonic echo generated in the subject is received, ultrasonic image information is obtained.

[0005] Based on the ultrasound image information, the ultrasound image of the object present in the patient's body (e.g., internal organs or diseased tissue) is displayed on the display section of the main body of the ultrasound endoscope device connected to the ultrasound endoscope.

[0006] As an ultrasonic transducer (ultrasonic transducer array) for transmitting and receiving ultrasonic waves, it typically uses multiple ultrasonic transducers (piezoelectric transducers) with electrodes formed on both sides of a material (piezoelectric body) that produces the piezoelectric effect.

[0007] If a voltage is applied to the electrodes of these ultrasonic transducers, ultrasonic waves are generated by the expansion and contraction of the piezoelectric body through the piezoelectric effect. By arranging multiple ultrasonic transducers in a one-dimensional or two-dimensional configuration as an ultrasonic transducer array, and by sequentially driving multiple ultrasonic transducers, an ultrasonic beam can be formed that is transmitted in the desired direction.

[0008] Furthermore, the ultrasonic transducer expands and contracts upon receiving the propagating ultrasonic waves to generate an electrical signal. This electrical signal is used as the detection signal for the ultrasonic waves.

[0009] Ultrasonic endoscopes equipped with multiple ultrasonic transducers are primarily used for observing the gallbladder or pancreas through the digestive tract, and an ultrasonic observation section is provided at the front end of the endoscope. Similar to conventional endoscopes without an ultrasonic observation section, the front end of the ultrasonic endoscope also includes an optical sensor, illumination, air inlet, water inlet, and suction port, in addition to the ultrasonic observation section. Therefore, in order to reduce the burden on the patient's body when using ultrasonic endoscopes inserted into the body cavities, especially the upper digestive tract or bronchi, it is necessary to minimize the diameter of the insertion section and the size of the front end, particularly the ultrasonic observation section.

[0010] Furthermore, the front end of an ultrasonic endoscope contains major heat-generating factors such as the ultrasonic transducer and the endoscope's light source. However, since the insertion part of the ultrasonic endoscope, especially the front end, comes into direct contact with the interior of biological organisms such as the human body, for safety reasons such as preventing low-temperature burns, the surface temperature of the insertion part must be set below a specified temperature.

[0011] Therefore, there is a need for ultrasonic endoscopes that maintain a small front end and have a mechanism for reducing the surface temperature of the front end. In recent years, various solutions have been proposed for cooling the front end of the ultrasonic endoscope, which is the source of heat (see Patent Document 1).

[0012] Patent Document 1 discloses an ultrasonic endoscope comprising an insertion portion with a curved section, the insertion portion having: a backing material having a front surface on which a plurality of ultrasonic transducers are disposed; an outer casing accommodating the plurality of ultrasonic transducers at the end of the insertion portion; and a heat-conducting component disposed within the outer casing and in contact with the back surface of the backing material and the inner surface of the outer casing. According to this structure, heat generated in the ultrasonic transducers and transferred to the backing material, and heat generated in the backing material from receiving ultrasonic waves from the ultrasonic transducers, are transferred via the backing material to the heat-conducting component, and further transferred via the heat-conducting component to the outer casing, thereby dissipating heat from the outer casing to the outside of the ultrasonic endoscope. Therefore, in Patent Document 1, heat dissipation from the ultrasonic transducer section to the outside is promoted.

[0013] Previous technical documents

[0014] Patent documents

[0015] Patent Document 1: Japanese Patent No. 5329065 Summary of the Invention

[0016] The technical problem to be solved by the invention

[0017] In the ultrasonic endoscope disclosed in Patent Document 1, only the heat dissipation path of heat generated in the ultrasonic transducer and backing material layer to the outer component via a heat-conducting component is considered. Therefore, there is a problem that further improvement in heat dissipation effect cannot be expected. Moreover, in the technology disclosed in Patent Document 1, heat is not retained in the ultrasonic transducer and backing material layer, but is dissipated to the outer component, thus resulting in heat dissipation into the body cavity near the front end of the ultrasonic endoscope. Here, since the heat diffuses from the outer component, the temperature rise is suppressed to a certain extent, but there is a problem that the temperature of the outer component at the front end of the ultrasonic endoscope and the temperature around the front end rise.

[0018] Currently, in ultrasonic endoscopy, to improve diagnostic accuracy, ultrasonic transducers (oscillators) are stacked to increase the transmission power of ultrasonic waves or the number of ultrasonic transducers is increased to improve the receiving sensitivity.

[0019] As a result, the heat dissipation from the ultrasonic transducer increases, and there is a possibility that the temperature of the insertion part, especially the front end of the ultrasonic transducer, which is in contact with the inner wall of the body cavity, may rise due to the heat generated by the ultrasonic transducer.

[0020] Furthermore, in ultrasonic endoscopy, improving the quality of the acquired ultrasonic images can enhance diagnostic accuracy. Therefore, in addition to increasing the receiving sensitivity, it is also necessary to consider increasing the driving voltage of the ultrasonic transducer. However, increasing the driving voltage may cause further temperature rise due to the heating of the ultrasonic transducer.

[0021] Thus, in order to improve diagnostic accuracy by increasing the image quality of ultrasound images, the technology disclosed in Patent Document 1 has a problem that, in cases where the number of ultrasound transducers is increased, the driving voltage of the ultrasound transducers is increased, or the transmission power of the ultrasound is increased, the temperature around the front end and external components of the ultrasound endoscope, which are in direct contact with the interior of a living organism such as a human body, rises above the allowable temperature.

[0022] Therefore, it is necessary to maintain the small diameter of the insertion part and the miniaturization of the front end, and to suppress heat generation and temperature rise. In particular, how to dissipate the heat generated by the oscillator has become an important issue.

[0023] The purpose of this invention is to provide an ultrasonic endoscope that solves the problems of the prior art, maintains the insertion part with a small diameter and the front end with a small size, and has a heat dissipation structure that can effectively dissipate the heat generated in the ultrasonic transducer, thereby improving the diagnostic accuracy in ultrasonic diagnosis.

[0024] means for solving technical problems

[0025] To achieve the above objectives, the present invention provides an ultrasonic endoscope, characterized in that it has the following at its front end: an ultrasonic transducer array consisting of a plurality of ultrasonic transducers arranged in a plurality of arrays; a shielded cable having a plurality of signal lines and a plurality of shielding components made of metal disposed outside the signal lines; a wiring portion having a plurality of connecting portions electrically connecting the plurality of signal lines to the plurality of ultrasonic transducers respectively; a thermally conductive ground portion electrically connected to the plurality of shielding components; a sheet-like first thermally conductive component disposed on the side of the ultrasonic transducer array; and a second thermally conductive component thermally connecting the first thermally conductive component to the ground portion. The ultrasonic endoscope also has a backing material layer, which is stacked on top of... The back side of the ultrasonic transducer array supports the plurality of ultrasonic transducers. The first thermally conductive member is disposed on the side of the laminate containing the ultrasonic transducer array and the backing material layer, and extends to the lower side of the backing material layer, which is opposite to the side of the ultrasonic transducer array. The second thermally conductive member is pre-integrated with the first thermally conductive member at the lower end of the first thermally conductive member, which is opposite to the side of the ultrasonic transducer array. The plurality of shielding members constitute the ground wire portion and are respectively connected to the second thermally conductive member integrated with the first thermally conductive member. The first thermally conductive member integrated with the second thermally conductive member is attached to the plurality of ultrasonic transducers.

[0026] Furthermore, the shielded cable is preferably at least one of a plurality of coaxial cables and a non-coaxial cable, wherein the plurality of coaxial cables each have a signal line on the center side and a shielding component on the outer periphery side of the signal line, and the non-coaxial cable is a cable that combines the plurality of signal lines and a plurality of lead-in lines that serve as the plurality of shielding components, or a cable that has the plurality of signal lines arranged on the center side and a plurality of conductors that serve as the plurality of shielding components arranged around the plurality of signal lines.

[0027] Furthermore, preferably, in the first heat-conducting component, the lower end of the first heat-conducting component located on the side opposite to the ultrasonic transducer array side is connected to the second heat-conducting component facing the upper side that is the ultrasonic transducer array side, and the upper end of the first heat-conducting component is folded back towards the side of the laminate and attached to the plurality of ultrasonic transducers.

[0028] Furthermore, preferably, the first and second heat-conducting components are conductive components. The plurality of connection portions of the wiring section are electrically connected to the plurality of signal lines and the plurality of ultrasonic transducers respectively using the first solder. The plurality of shielding components are connected to the second heat-conducting component using the first solder. The first heat-conducting component is connected to the second heat-conducting component using at least one of the following: a second solder with a melting point lower than the first solder, silver paste, and conductive adhesive.

[0029] Furthermore, the second heat-conducting component is preferably a ground terminal.

[0030] Furthermore, the second heat-conducting component is preferably a wiring board with a ground terminal, and the first heat-conducting component is connected to the wiring board that is electrically connected to the ground terminal.

[0031] Furthermore, preferably, the ground wire is a common ground wire connected to the plurality of shielding components, and the second heat-conducting component thermally connects the common ground wire to the first heat-conducting component.

[0032] Furthermore, the second heat-conducting component is preferably a cable thicker than the signal line or a deformable metal braided mesh component.

[0033] Furthermore, the second heat-conducting component is preferably an insulating heat-conducting component.

[0034] Furthermore, the first heat-conducting component is preferably a metal foil with both electrical and thermal conductivity.

[0035] Furthermore, the metal foil is preferably copper foil, aluminum foil, or gold foil.

[0036] Invention Effects

[0037] According to the present invention, an ultrasonic endoscope is provided that maintains the insertion portion as small in diameter and the front end portion as small in size, and has a heat dissipation structure that can effectively dissipate heat generated in the ultrasonic transducer, thereby improving the diagnostic accuracy in ultrasonic diagnosis.

[0038] That is, according to the present invention, for example, a first heat-conducting component such as copper foil is attached to a plurality of ultrasonic transducers, and the first heat-conducting component is connected to a ground wire portion such as a ground terminal or a combined ground wire via a second heat-conducting component. This effectively dissipates heat generated in the plurality of ultrasonic transducers and transmitted to the first heat-conducting component to the plurality of coaxial cables connected to the ground wire portion via the ground portion, thereby effectively dissipating heat to the outside of the subject. Furthermore, in the present invention, connecting the first heat-conducting component to the ground portion via the second heat-conducting component means that when the ground terminal also serves as a ground portion and the second heat-conducting component, the first heat-conducting component is directly connected to the ground terminal; when the combined ground wire is a ground portion, the first heat-conducting component is connected to the combined ground wire via the second heat-conducting component. Attached Figure Description

[0039] Figure 1 This is a schematic structural diagram illustrating an example of the structure of an ultrasonic examination system using an ultrasonic endoscope.

[0040] Figure 2 It means Figure 1 The image shows a magnified top view of the anterior endoscope.

[0041] Figure 3 yes Figure 2 The view shown along line III-III is schematic. Figure 2 The image shows a partial longitudinal sectional view of the anterior end of an ultrasonic endoscope.

[0042] Figure 4 It is a schematic representation Figure 2 A partially enlarged cross-sectional view of the ultrasonic observation section at the anterior end of the ultrasonic endoscope shown.

[0043] Figure 5 yes Figure 3 The VV-line view shown is schematic. Figure 3 A cross-sectional view of an example of the ultrasonic observation section at the anterior end of an ultrasonic endoscope.

[0044] Figure 6 It is a schematic representation Figure 3 A cross-sectional view of the structure of the coaxial cable used in the ultrasonic observation section at the front end of the ultrasonic endoscope shown.

[0045] Figure 7 It is a schematic representation of the... Figure 3 A cross-sectional view of the shielded cable consisting of multiple coaxial cables used in the ultrasonic observation section at the front end of the ultrasonic endoscope shown.

[0046] Figure 8 yes Figure 4 A schematic front view of the integrated component of the copper foil and ground terminal in the ultrasonic observation section shown.

[0047] Figure 9 yes Figure 8 A schematic side view of the integrated component of the copper foil and ground terminal shown.

[0048] Figure 10 It is a schematic representation Figure 9 A side view showing the connection status of the ground terminal of the integrated component and the shielding component of the coaxial cable.

[0049] Figure 11 This is an explanatory diagram schematically showing the heat dissipation structure of the ultrasonic observation section at the front end of an ultrasonic endoscope according to an embodiment of the present invention.

[0050] Figure 12 yes Figure 9 A schematic side view of another embodiment of the integrated component shown.

[0051] Figure 13 It is a schematic representation Figure 12 A side view showing the connection status of the ground terminal of the integrated component and the shielding component of the coaxial cable.

[0052] Figure 14 This is an explanatory diagram schematically illustrating the heat dissipation structure of an ultrasonic endoscope according to another embodiment of the present invention.

[0053] Figure 15 This is an explanatory diagram illustrating a manufacturing process of a heat dissipation structure for an ultrasonic endoscope according to another embodiment of the present invention.

[0054] Figure 16 This is an explanatory diagram schematically illustrating the heat dissipation structure of an ultrasonic endoscope according to another embodiment of the present invention.

[0055] Figure 17 This is an explanatory diagram illustrating a manufacturing process of a heat dissipation structure for an ultrasonic endoscope according to another embodiment of the present invention.

[0056] Figure 18 This is an explanatory diagram illustrating another manufacturing process of the heat dissipation structure of an ultrasonic endoscope according to another embodiment of the present invention.

[0057] Figure 19 This is an explanatory diagram schematically illustrating the heat dissipation structure of an ultrasonic endoscope according to another embodiment of the present invention.

[0058] Figure 20 This is a partial cross-sectional view schematically showing the anterior end of an ultrasonic endoscope according to another embodiment of the present invention.

[0059] Figure 21 This is a partially enlarged top view schematically showing the front end of the insertion portion of an ultrasonic endoscope according to another embodiment of the present invention.

[0060] Figure 22 yes Figure 21 The XX-line view shown is Figure 21 A partial longitudinal sectional view of the front end of the insertion section of the ultrasonic endoscope shown.

[0061] Figure 23 This is a partial cross-sectional view schematically showing the front end of the insertion portion of an ultrasonic endoscope according to another embodiment of the present invention. Detailed Implementation

[0062] The ultrasonic endoscope and its manufacturing method according to the present invention will be described in detail with reference to the preferred embodiments shown in the accompanying drawings.

[0063] (First Embodiment)

[0064] Figure 1 This is a schematic structural diagram illustrating an example of the structure of an ultrasonic examination system using an ultrasonic endoscope according to the first embodiment of the present invention.

[0065] Figure 1 The ultrasound examination system 10 shown can observe organs such as the gallbladder or pancreas, which are difficult to examine through ultrasound examinations of the patient's body cavity, such as the esophagus, stomach, duodenum, small intestine, and large intestine. It is equipped with the ultrasound transducer unit of the present invention, and inserts the ultrasound endoscope of the present invention, which has an ultrasound observation section for acquiring ultrasound tomographic images (hereinafter referred to as ultrasound images) and an endoscope observation section for acquiring endoscopic optical images (hereinafter referred to as endoscopic images), into the body cavity of the patient. While observing the endoscopic images of the patient, it acquires ultrasound images of the observed parts of the patient.

[0066] like Figure 1 As shown, the ultrasonic examination system 10 is configured to include an ultrasonic endoscope 12 of the first embodiment of the present invention having a heat dissipation structure at its front end, an ultrasonic processor device 14 for generating ultrasonic images, an endoscope processor device 16 for generating endoscope images, a light source device 18 for supplying illumination light into the body cavity to the ultrasonic endoscope 12, and a display 20 for displaying ultrasonic images and / or endoscope images.

[0067] Furthermore, the ultrasonic examination system 10 also includes a water tank 21a for storing cleaning water and the like, and a suction pump 21b for suctioning the aspirate (including the supplied cleaning water and the like) from the body cavity. In addition, although not shown, the ultrasonic examination system 10 may also include a supply pump for supplying cleaning water or gas such as external air from the water tank 21a to the ultrasonic endoscope 12 through a conduit (not shown).

[0068] First, the ultrasonic endoscope 12 of the present invention has a heat dissipation structure (70: reference) at its front end, which is a feature of the present invention. Figures 3-5 The ultrasound observation section 36 and the endoscope observation section 38 of the device acquire ultrasound images (echo signals) and endoscope images (image signals) respectively by taking pictures of the body cavity of the subject.

[0069] The ultrasonic endoscope 12 has an ultrasonic observation section 36 and an endoscope observation section 38 at its front end, and consists of an insertion section 22 inserted into the body cavity of the subject, an operation section 24 connected to the base end of the insertion section 22 and used by surgeons and technicians to perform operations, and a universal plug rope 26 connected at one end to the operation section 24.

[0070] The operation unit 24 is provided with an air supply and water supply button 28a for opening and closing the air supply and water supply pipeline (not shown) from the water supply tank 21a and a suction button 28b for opening and closing the suction pipeline (not shown) of the self-suction pump 21b, and is also provided with a pair of bend buttons 29, 29 and a treatment tool insertion port (clamping port) 30.

[0071] Here, the water tank 21a is used to store cleaning water and the like supplied to the air and water supply lines inside the ultrasonic endoscope 12 for cleaning the endoscope viewing section 38 and the like. Additionally, the air and water supply button 28a is used to eject air and other gases, as well as cleaning water and the like supplied from the water tank 21a through the air and water supply lines, from the endoscope viewing section 38 at the end of the insertion section 22.

[0072] Furthermore, the suction pump 21b aspirates the suction tubing (not shown) to aspirate the aspirate (including the supplied cleaning water, etc.) from the distal end of the ultrasonic endoscope 12. The suction button 28b is used to aspirate the aspirate from the distal end of the insertion part 22 by the suction force of the suction pump 21b.

[0073] Furthermore, the instrument insertion port 30 is used to insert instruments such as forceps, puncture needles, and high-frequency knives.

[0074] At the other end of the universal plug rope 26 are provided an ultrasonic connector 32a for connection to the ultrasonic processor device 14, an endoscope connector 32b for connection to the endoscope processor device 16, and a light source connector 32c for connection to the light source device 18. The ultrasonic endoscope 12 is detachably connected to the ultrasonic processor device 14, the endoscope processor device 16, and the light source device 18 via these connectors 32a, 32b, and 32c, respectively. Furthermore, the light source connector 32c is connected to an air and water supply hose 34a for connection to the water supply tank 21a and a suction hose 34b for connection to the suction pump 21b.

[0075] The insertion part 22 is composed of, from the end side, a front end (end rigid part) 40 formed by a rigid member and having an ultrasonic observation part 36 and an endoscope observation part 38, a flexible bending part 42 connected to the base end side of the front end 40 and connected to a plurality of bending blocks, and a flexible, elongated soft part 43 connecting the base end side of the bending part 42 and the end side of the operation part 24.

[0076] The bending portion 42 is remotely bent by rotating a pair of bend knobs 29, 29 provided on the operating portion 24. As a result, the front end portion 40 can be oriented in the desired direction.

[0077] Furthermore, at the front end 40, a balloon filled with an ultrasonic transmission medium (e.g., water, oil, etc.) can be detachably installed inside to cover the ultrasonic observation section 36. Since ultrasonic waves and echo signals attenuate significantly in air, the balloon is inflated by injecting the ultrasonic transmission medium and brought into contact with the observation area, thereby transmitting ultrasonic waves from the ultrasonic transducer array (50: reference) of the ultrasonic observation section 36. Figures 2-5Air is expelled between the ultrasonic wave and the object being observed, thus preventing the attenuation of ultrasonic and echo signals.

[0078] Additionally, the ultrasonic processor device 14 generates and supplies an ultrasonic transducer array (50: reference) to the ultrasonic observation section 36 at the front end 40 of the insertion section 22 of the ultrasonic endoscope 12. Figures 2-5 The ultrasonic wave signal (data) is generated by the ultrasonic transducer array (50). The ultrasonic transducer processor 14 is used to generate an ultrasonic image on the display 20, which is received and acquired by the ultrasonic transducer array (50) and reflected from the part of the object being irradiated by the ultrasonic wave.

[0079] The endoscope processor device 16 is used to generate an endoscope image signal (data) that is received and acquired by the endoscope observation section 38 at the front end 40 of the insertion section 22 of the ultrasonic endoscope 12, which is illuminated by the illumination light from the light source device 18, and performs various signal (data) processing and image processing on the acquired image signal and displays it on the display 20.

[0080] In addition, these processor devices 14 and 16 can be composed of processors such as PCs (personal computers).

[0081] In order to acquire image signals by photographing the observation area inside the body cavity through the endoscope observation section 38 of the ultrasonic endoscope 12, the light source device 18 generates illumination light, such as white light composed of the three primary colors of light (red, green, and blue) or light of a specific wavelength, and supplies it to the ultrasonic endoscope 12. The light source device 18 transmits the illumination light through the light guide tube (not shown) inside the ultrasonic endoscope 12 and is emitted from the endoscope observation section 38 at the front end 40 of the insertion section 22 of the ultrasonic endoscope 12 to illuminate the observation area inside the body cavity.

[0082] The display 20 receives video signals generated by the ultrasound processor 14 and the endoscope processor 16 and displays ultrasound images or endoscope images. Regarding the display of these ultrasound images or endoscope images, it is possible to appropriately switch between images from either side and display them on the display 20, or to display both images simultaneously. Alternatively, separate displays for displaying ultrasound images and endoscope images can be provided, or these ultrasound images and endoscope images can be displayed in any other arbitrary manner.

[0083] Next, refer to Figures 2-4 The structure of the front end of the insertion section of the ultrasonic endoscope is described in detail.

[0084] Figure 2 It means Figure 1A magnified top view of the front end and surrounding area of ​​the ultrasonic endoscope shown. Figure 3 yes Figure 2 The III-III line view shown is a view of... Figure 2 The diagram shows a schematic longitudinal sectional view of the anterior endoscope cut along the centerline of its long side. Figure 4 yes Figure 3 A schematic, partially enlarged longitudinal sectional view of the ultrasonic observation section at the anterior end of the ultrasonic endoscope shown. Figure 5 yes Figure 2 The VV-line view shown is Figure 2 A schematic cross-sectional view of the arc structure of the ultrasonic transducer array of the ultrasonic observation section at the front end of the ultrasonic endoscope, cut along the center line.

[0085] like Figure 2 and Figure 3 As shown, at the front end 40 of the ultrasonic endoscope 12, an ultrasonic observation section 36 for acquiring ultrasonic images is provided at the end side, and an endoscope observation section 38 for acquiring endoscope images is provided at the base side. A treatment device outlet 44 is provided between them, and both are installed and held on an external component 41 made of rigid parts such as rigid resin, which forms the front end body of the front end 40 of the ultrasonic endoscope 12.

[0086] exist Figure 2 In the example shown, the treatment device outlet 44 is located between the ultrasonic observation section 36 and the endoscope observation section 38. However, the present invention is not particularly limited to the example shown in the figure. It can be located inside the endoscope observation section 38 or located further from the endoscope observation section 38 on the base side (the side of the curved section 42).

[0087] like Figures 2-4 As shown, the ultrasonic observation unit 36 ​​consists of an ultrasonic transducer unit 46 and an external component 41 that mounts and holds the ultrasonic transducer unit 46.

[0088] The ultrasonic transducer unit 46 includes: an ultrasonic transducer array 50 composed of multiple ultrasonic transducers (transducers) 48; an electrode section 52 disposed on the outer or inner side of the ultrasonic transducer array 50 and having multiple individual electrodes 52a connected to the multiple ultrasonic transducers 48; a backing material layer 54 supporting each ultrasonic transducer 48 of the ultrasonic transducer array 50 from the lower surface side; a cable wiring section 56 electrically connected to the multiple individual electrodes 52a of the electrode section 52 and having multiple connection sections 56a for wiring signal lines 58a of multiple coaxial cables 58; a ground terminal 60 disposed on the lower side of the backing material layer 54 on the side opposite to the ultrasonic transducer array 50 and having shielding members 58c connected to the multiple coaxial cables 58; and a copper foil 62 attached to the entire outer surface of both the multiple ultrasonic transducers 48 and the backing material layer 54, and extending to the lower side of the backing material layer 54 on the side opposite to the ultrasonic transducer array 50 and connected to the ground terminal 60.

[0089] In the first embodiment of the present invention, the ground terminal 60 and the copper foil 62 are pre-integrated and shield the plurality of ultrasonic transducers 48, forming a heat dissipation structure 70, a feature of the present invention, that dissipates heat generated in the plurality of ultrasonic transducers 48 and the backing material layer 54 to the shielding member 58c of the plurality of coaxial cables 58. Details of this heat dissipation structure 70 will be described later.

[0090] Thus, through the heat dissipation structure 70, a feature of the present invention, the heat generated in the plurality of ultrasonic transducers 48 and the backing material layer 54 is dissipated to the test body via the shielding member 58c of the plurality of coaxial cables 58 and the insertion part 22.

[0091] Furthermore, the ultrasonic transducer unit 46 also has an acoustic matching layer 64 stacked above the ultrasonic transducer array 50 and an acoustic lens 66 stacked on the acoustic matching layer 64. That is, the ultrasonic transducer unit 46 is composed of a stack 68 of the acoustic lens 66, the acoustic matching layer 64, the ultrasonic transducer array 50 and the backing material layer 54.

[0092] The acoustic matching layer 64 is used to achieve acoustic impedance coupling between the test subject, such as the human body, and the ultrasonic transducer 48.

[0093] The acoustic lens 66, mounted on the acoustic matching layer 64, is used to converge the ultrasonic waves emitted from the ultrasonic transducer array 50 toward the object being observed. The acoustic lens 66 is made of, for example, silicone resins (mixed silicone rubber (HTV rubber), liquid silicone rubber (RTV rubber), etc.), butadiene resins, and polyurethane resins. To achieve acoustic impedance coupling between the object being examined and the ultrasonic transducer 48 and to improve the transmittance of the ultrasonic waves, titanium dioxide, aluminum oxide, and silica powders are mixed into the acoustic lens 66 as needed.

[0094] The ultrasonic transducer array 50 is an array of multiple channels, such as 48 to 192 channels (CH), consisting of multiple, for example, 48 to 192 cuboid-shaped ultrasonic transducers (transducers) 48 arranged in an arc shape and facing outward.

[0095] That is, regarding the ultrasonic transducer array 50, multiple ultrasonic transducers 48 are arranged in a one-dimensional array at a predetermined interval, as shown in the figure. Thus, each ultrasonic transducer 48 constituting the ultrasonic transducer array 50 is arranged at equal intervals in a convex curved shape along the axial direction of the front end 40 (the direction of the long side axis of the insertion portion 22), and is sequentially driven according to the drive signal input from the ultrasonic processor device 14. Therefore, the array of transducers... Figure 2 The range of the ultrasonic transducer 48 shown is used as the scanning range for convex electronic scanning.

[0096] Regarding the ultrasonic transducer array 50, compared to the direction parallel to the bottom surface of the backing material layer 54 (AZ (lateral) direction), the long side (EL (elevation) direction) of the ultrasonic transducer 48, which is orthogonal to the AZ direction, is shorter, and it is configured to extend at an angle towards the rear end. For example... Figure 5 As shown, the ultrasonic transducer 48 has, for example, a structure in which electrodes are formed on the bottom surface of a piezoelectric thick film such as PZT (lead zirconate titanate) or PVDF (polyvinylidene fluoride). One side electrode becomes an individual electrode 52a, independent for each ultrasonic transducer 48, and the other side electrode becomes a common electrode (e.g., a ground electrode) 52b common to all ultrasonic transducers 48. In the example shown, multiple individual electrodes 52a are respectively provided on the lower surface inside multiple ultrasonic transducers 48 and are electrically connected to multiple wirings (not shown) of the cable wiring section 56. In addition, in the cable wiring section 56, multiple wirings (not shown) are electrically connected to multiple connection portions 56a. On the other hand, in the example shown, the common electrode 52b is provided on the upper surface of the end of the ultrasonic transducer 48 and is connected to the ground terminal 60. These multiple individual electrodes 52a and the common electrode 52b constitute the electrode section 52.

[0097] In addition, although the illustration is omitted, the gap between two adjacent ultrasonic transducers 48 is filled with a filler material such as epoxy resin.

[0098] In the ultrasonic transducer unit 46 of the ultrasonic observation section 36, if each ultrasonic transducer 48 of the ultrasonic transducer array 50 is driven and a voltage is applied to the two electrodes of the ultrasonic transducer 48, the piezoelectric element vibrates and sequentially generates ultrasonic waves, which are then directed toward the observation area of ​​the subject. Furthermore, by sequentially driving multiple ultrasonic transducers 48 using an electronic switch such as a multiplexer, ultrasonic waves are scanned within a scanning range along the curved surface on which the ultrasonic transducer array 50 is arranged, for example, from the center of curvature of the surface to approximately tens of millimeters. As a result, each ultrasonic transducer 48 of the ultrasonic transducer array 50 generates heat when generating ultrasonic waves, and the backing material layer 54 also heats up due to the action of the ultrasonic waves.

[0099] Furthermore, if an echo signal (ultrasonic echo) reflected from the observed object is received, the piezoelectric element vibrates to generate a voltage, which is output to the ultrasonic processor device 14 as an electrical signal (ultrasonic detection signal) corresponding to the ultrasonic echo that received the voltage. Moreover, after various signal processing is performed in the ultrasonic processor device 14, the ultrasonic image is displayed on the display 20.

[0100] like Figure 3 and Figure 4 As shown, the electrode portion 52 is arranged in an arc shape on the inner lower surface of the ultrasonic transducer array 50 (each ultrasonic transducer 48), which is perpendicular to the arc-shaped surface formed by the arrangement of a plurality of (48 to 192) ultrasonic transducers 48, and is composed of a plurality of (48 to 192) individual electrodes 52a, each of which is conductive to the plurality of (48 to 192) ultrasonic transducers 48. Additionally, the electrode portion 52 may include a common electrode of the plurality of ultrasonic transducers 48. In this invention, perpendicularity is not limited to 90 degrees, and may also include approximately perpendicularity. For example, an angle ranging from 90 degrees ± 5 degrees, i.e., 85 degrees to 95 degrees.

[0101] In addition, Figure 3 and Figure 4 In the middle, the multiple individual electrodes 52a arranged in an arc shape and the electrode portion 52 formed by them are blocked by the backing material layer 54 and cannot be seen, but are represented by dashed lines for ease of understanding.

[0102] exist Figure 5In the example shown, the electrode portion 52 is arranged in two rows on the inner lower surface of the ultrasonic transducer array 50, which is perpendicular to the arrangement plane of the plurality of ultrasonic transducers 48. However, when the number of ultrasonic transducers 48 is small, it can be only one row. When the arrangement of the plurality of ultrasonic transducers 48 extends in multiple rows along the long side direction, it can be more than two rows. In addition, the electrode portion 52 can not only be provided on the inner lower surface of the ultrasonic transducer array 50, but also on the two outer sides of the ultrasonic transducer array 50 in the long side direction, or on one outer side. It can also be provided in more than one row on the inner lower surface of the ultrasonic transducer array 50, or on one or both outer sides.

[0103] In addition, it is preferable to have a larger number of ultrasonic transducers 48, so multiple individual electrodes 52a are preferably arranged in multiple rows on the inner lower surface of the ultrasonic transducer array 50, or on its two outer surfaces, or both.

[0104] In addition, Figure 5 In the example shown, multiple individual electrodes 52a are constituted by individual electrodes disposed on the end face side in the long side direction of each ultrasonic transducer 48. However, the present invention is not limited to this. As long as the individual electrodes 52a of the ultrasonic transducer 48 are conductive, they can be constituted by other electrodes connected from the individual electrodes through wiring. Furthermore, the electrode section 52 may directly include a common electrode, but it may also include electrodes connected from the common electrode 52b through wiring.

[0105] The multiple individual electrodes 52a and common electrode 52b of the electrode section 52 are preferably provided as electrode pads.

[0106] Next, as Figures 3-5 As shown, the backing material layer 54 is composed of a backing material disposed on the back (lower surface) of the ultrasonic transducer array 50, which is the inner side of the arrangement surface of the plurality of ultrasonic transducers 48, and is a layer that supports the plurality of ultrasonic transducers 48 arranged in an array. The upper surface (upper side) of the backing material layer 54 is formed into a convex arc shape in cross section.

[0107] In addition, Figure 5 In the example shown, the backing material layer 54 is a structure in which multiple wirings (not shown) of the cable wiring section 56, which are respectively connected to multiple individual electrodes 52a of the electrode section 52, are embedded inside. In addition, multiple connection portions 56a of the cable wiring section 56 are exposed on the underside of the backing material layer 54.

[0108] The backing material that constitutes the backing material layer 54 functions as a buffer material that flexibly supports each ultrasonic transducer 48 of the ultrasonic transducer array 50. Therefore, the backing material is made of a rigid material such as hard rubber, and ultrasonic attenuation components (ferrite, ceramic, etc.) are added as needed.

[0109] Therefore, in the example shown, the ultrasonic transducer array 50 has multiple cuboid ultrasonic transducers 48 arranged at equal intervals on the arc-shaped outer surface of the upper surface of the backing material layer 54, which is formed into a convex arc shape in cross section. That is, the multiple ultrasonic transducers 48 are arranged in an arc shape and facing outward.

[0110] The cable wiring section 56 has multiple wirings (not shown) that are electrically connected to multiple individual electrodes 52a of the electrode section 52, and multiple connection sections 56a that are connected to the multiple wirings (not shown) and to multiple coaxial cables 58 respectively.

[0111] The cable wiring section 56 may have multiple connecting portions 56a at the ends of multiple wirings (not shown) that are electrically connected to multiple individual electrodes 52a of the electrode section 52.

[0112] However, considering the ease of connecting the multiple individual electrodes 52a of the electrode section 52, the cable wiring section 56 is preferably constructed from a wiring substrate such as a flexible printed wiring board (hereinafter referred to as FPC), a printed circuit board (hereinafter referred to as PCB), or a printed wire board (hereinafter referred to as PWB), etc. Figure 3 and Figure 4 As shown, it is preferable to have multiple (48-192) wirings for electrically connecting to multiple (48-192) individual electrodes 52a of the electrode section 52 respectively, and multiple connection portions 56a for connecting to the multiple (48-192) wirings respectively.

[0113] In this case, the cable wiring section 56 can be composed of a single wiring board, such as a flexible wiring board like an FPC, or a rigid wiring board like a PCB or PWB. Furthermore, it can also be composed of a multilayer board where the flexible wiring board (FPC) and the rigid wiring board (PCB or PWB) are integrated. For example, as the cable wiring section 56, an FPC having multiple (48-192) wirings for electrically connecting to multiple (48-192) individual electrodes 52a of the electrode section 52 and a rigid wiring board having multiple (48-192) connection portions 56a for wiring to connect multiple coaxial cables 58 can be integrated in such a way that the multiple (48-192) wirings are connected to the multiple (48-192) connection portions 56a respectively.

[0114] Therefore, it is possible to easily electrically connect the multiple wires of the cable wiring section 56 to the multiple individual electrodes 52a of the electrode section 52 of the ultrasonic transducer array 50.

[0115] Here, the electrical connection between the plurality of wires of the cable wiring section 56 and the plurality of individual electrodes (electrode pads) 52a of the electrode section 52 of the ultrasonic transducer array 50 can be made using anisotropic conductive sheets or anisotropic conductive adhesives, or it can be made by thermal fusion. Furthermore, these electrical connections are not limited to these connection methods; any method can be used as long as it does not impede the operability of the wiring and the operation is not difficult, including known methods such as soldering.

[0116] Therefore, this invention provides an ultrasonic endoscope that simplifies, improves efficiency, and enhances operability in ultrasonic transducer wiring operations; is miniaturized; and uses an ultrasonic transducer unit with a wiring structure that provides good operability, low difficulty of operation, low risk of cable breakage, and minimal load application to the cables when wiring the electrodes and multiple cables of the ultrasonic transducer array.

[0117] like Figure 6 As shown, the coaxial cable 58 used in this invention has a signal line 58a at its center, a first insulating layer 58b around the signal line 58a, a shielding member 58c around the first insulating layer 58b, and a second insulating layer 58d around the shielding member 58c. In other words, the coaxial cable 58 has the signal line 58a, the first insulating layer 58b, the shielding member 58c, and the second insulating layer 58d stacked concentrically from the center side.

[0118] Here, in this invention, as Figure 7 As shown, multiple coaxial cables 58 are used as a single shielded cable 72 that wraps the multiple coaxial cables 58 inside with the outermost sheath 72a.

[0119] Furthermore, the shielded cable used in this invention is not limited to a shielded cable 72 that wraps multiple coaxial cables 58 with an outer sheath 72a. It can be a non-coaxial cable in which multiple signal lines wrapped with an insulating layer such as a dielectric layer around the periphery of the central conductor and multiple lead-in lines that function as shielding components are randomly mixed together to form a single cable unit. Alternatively, it can be a non-coaxial cable in which multiple signal lines wrapped with an insulating layer such as a dielectric layer around the periphery of the central conductor are arranged on the central side, and multiple external conductors that function as shielding components are arranged around the multiple signal lines, and the whole is wrapped with shielding material to form a single cable unit.

[0120] like Figure 3 As shown, the ground terminal 60 constitutes a heat dissipation structure 70 and is used for the shielding components 58c of a plurality of coaxial cables 58 that are electrically and thermally connected to a shielded cable 72.

[0121] Here, the two components, namely the electrical connection ground terminal 60 and the shielding component 58c, are fixed by direct contact or by joining with solder or conductive adhesive to allow current to flow smoothly between the two components.

[0122] Furthermore, the two components, namely the thermally connected ground terminal 60 and the shielding component 58c, are directly contacted and fixed or joined and fixed with solder or thermally conductive adhesive, so as to generate good heat transfer between the two components and to transfer heat well from one component to the other component.

[0123] The ground terminal 60 can be any ground terminal, such as any shielding component 58c that can electrically connect multiple coaxial cables 58 by solder or the like, as long as it is a conventionally known ground terminal used in ultrasonic endoscopes.

[0124] In addition, when making electrical connections to the ground terminals 60 of the multiple shielding components 58c and to the multiple connection portions 56a of the cable wiring portions 56 of the multiple signal lines 58a, the outer sheath 72a of the end side of one shielded cable 72 is stripped off, multiple coaxial cables 58 are taken out, the second insulation layer 58d of the end side of the taken out multiple coaxial cables 58 is stripped off, the multiple shielding components 58c are exposed to the outside, the multiple shielding components 58c exposed to the outside are left on the base end side, the shielding component 58c at the front end is cut off and the second insulation layer 58d is stripped off to expose the multiple signal lines 58a to the outside.

[0125] Thus, the multiple shielding components 58c remaining in a state exposed to the outside of multiple coaxial cables 58 are electrically connected to the ground terminal 60 by solder or the like.

[0126] Furthermore, multiple signal lines 58a exposed on the outside of the ends of multiple coaxial cables 58 are electrically connected to multiple connection parts 56a of the cable wiring section 56 via solder or the like.

[0127] Copper foil 62 is disposed on the outer surface of the plurality of ultrasonic transducers 48 of the ultrasonic transducer array 50, and serves as a shielding and heat dissipation agent. Copper foil 62 and ground terminal 60 together form heat dissipation structure 70, and are attached to the plurality of ultrasonic transducers 48 of the ultrasonic transducer array 50, and are disposed at least on the side surface of the ultrasonic transducer array 50, that is, the outer surface of the laminate 68, specifically, on the outer surface of the ultrasonic transducer array 50 and the backing material layer 54.

[0128] Here, in the heat dissipation structure 70 of the ultrasonic observation section 36 of the front end 40 of the ultrasonic endoscope 12 of the first embodiment of the present invention, the copper foil 62 and the ground terminal 60, which functions as the second heat-conducting component of the present invention, are used after being integrated in advance. However, in the present invention, it functions as the sheet-like first heat-conducting component of the present invention disposed on the side of the ultrasonic transducer array 50.

[0129] The copper foil 62 is not limited to a foil shape, but is preferably a mesh shape or a sheet shape that can fully conduct heat from the sides of the ultrasonic transducer array 50 and the backing material layer 54 in the width direction.

[0130] In addition, copper foil 62 is used as the sheet-like first heat-conducting component of the present invention, but the present invention is not limited to this. As long as it is a thin plate with good thermal conductivity, it can be any heat-conducting component, such as a metal foil such as silver foil, or a thin metal plate.

[0131] On the other hand, the ground terminal 60 functions as a ground wire connected to the signal line 58a of the multiple coaxial cables 58 that are electrically connected to the multiple individual electrodes 52a of the electrode section 52, and is electrically connected to the multiple shielding components 58c of the multiple coaxial cables 58 so that the potential of the ground wire is set to the potential of the multiple shielding components 58c.

[0132] Furthermore, the ground terminal 60 is made of, for example, metal and is conductive, and therefore also thermally conductive. Thus, the ground terminal 60 is thermally and electrically connected to the first thermally conductive component of the present invention, namely the copper foil 62, and connects the copper foil 62 to a plurality of shielding components 58c. Therefore, it also functions as the second thermally conductive component of the present invention, thermally connecting the first thermally conductive component of the present invention, namely the copper foil 62, to the ground portion.

[0133] Next, the manufacturing method of the ultrasonic endoscope according to the first embodiment of the present invention will be described. Here, as a manufacturing method of the ultrasonic endoscope, the manufacturing process of the heat dissipation structure 70 of the ultrasonic transducer unit 46 of the ultrasonic observation section at the front end of the ultrasonic endoscope will be described in detail, but it is assumed that the manufacturing of each component and part of the ultrasonic transducer unit 46 has been carried out.

[0134] Furthermore, refer to Figures 8-11 The manufacturing method of the ultrasonic endoscope 12 of the present invention will be described, but... Figures 8-11 It does not represent the actual constituent elements and components, but only records the parts required in the description and omits the parts not used in the description for illustrative purposes.

[0135] In the ultrasonic endoscope of the first embodiment of the present invention, such as Figures 8-11The schematic diagram shows a heat dissipation structure 70 for manufacturing the ultrasonic transducer unit 46 of the ultrasonic observation section.

[0136] First, such as Figure 8 and Figure 9 As shown, the ground terminal 60 is pre-installed and connected to the lower side of the copper foil 62 to form an integrated component 76, which is prepared to integrate the copper foil 62 and the ground terminal 60.

[0137] Next, as Figure 10 As shown, in Figure 8 and Figure 9 The ground terminal 60 of the integrated component 76 shown is connected to the shielding component 58c of the coaxial cable 58 by conventional solder, such as high-temperature solder or high-melting-point solder used in conventional soldering. Additionally, in Figure 10 Only the shielding component 58c of one coaxial cable 58 connected to the ground terminal 60 of the integrated component 76 is shown, but it is self-evident that the shielding components 58c of multiple coaxial cables 58, which is equivalent to the number of channels required, are connected to the ground terminal 60 of the integrated component 76.

[0138] Next, as Figure 11 As shown, similar to the connection of the shielding component 58c described above, the signal lines 58a of the plurality of coaxial cables 58 to which the shielding component 58c is connected in the ground terminal 60 of the integrated component 76 are respectively connected to the connection portions 56a of the corresponding cable wiring portions 56 by solder or the like. Furthermore, although not shown, the plurality of connection portions 56a of the cable wiring portions 56 are electrically connected to the plurality of individual electrodes 52a of the electrode portions 52 of the corresponding ultrasonic transducer array 50.

[0139] Furthermore, simultaneously or sequentially, the copper foil 62 of the integrated component 76 is attached to the outer surface of the plurality of ultrasonic transducers 48 and the backing material layer 54, i.e., the outer surface of the laminate 68. At this time, it is preferable to arrange the copper foil 62 such that it is bent in the portion abutting the bottom surface of the backing material layer 54 of the laminate 68, so that it runs along the outer surface of the laminate 68. Furthermore, the attachment of the copper foil 62 is preferably performed using at least one conductive component such as solder, silver paste, or conductive adhesive, or a silicone-based non-conductive adhesive.

[0140] In this way, it is possible to manufacture the ultrasonic transducer unit 46 of the ultrasonic endoscope 12 with a heat dissipation structure 70.

[0141] In addition, Figure 11 In the ultrasonic transducer unit 46 shown, the heat dissipation structure 70 with copper foil 62 is only provided on one side of the two outer surfaces of the laminate 68 (multiple ultrasonic transducers 48 and backing material layer 54). However, in this invention, as... Figure 5As shown, it can be disposed on both outer surfaces of the laminate 68. Furthermore, the heat dissipation structure 70 is simplified for emphasis. Figure 5 The ultrasonic endoscope 12 shown is schematically represented Figure 11 It goes without saying that the ultrasonic endoscope 12 shown has the same structure as the heat dissipation structure 70, except that it is located on one side.

[0142] Conventionally, when connecting copper foil to a ground terminal connected to multiple coaxial cables, soldering can damage the signal lines of the coaxial cables due to the heat of the solder, potentially resulting in damage to the signal lines. However, in the ultrasonic endoscope 12 of this first embodiment, the copper foil 62 and the ground terminal 60 are integrated into a single component 76. The shielding components 58c of multiple coaxial cables 58 are connected to the ground terminal 60 of this integrated component 76. Then, the signal lines 58a of the multiple coaxial cables 58 are connected to the multiple connection portions 56a of the cable wiring portion 56, and the copper foil 62 of the integrated component 76 is disposed on the outer surface of the laminate 68. Therefore, soldering is not required, and a heat dissipation structure 70 can be manufactured, thereby dissipating the heat generated from the ultrasonic transducer 48 through the heat dissipation structure 70.

[0143] In this way, the component parts, such as the signal lines connected to the miniature ultrasonic transducer, will not be damaged, and the cost will not increase, thus enabling the reliable and stable manufacture of the ultrasonic endoscope of the present invention.

[0144] Here, as Figure 5 As shown, when the ultrasonic transducer unit 46 is installed on the outer component 41 of the front end portion 40 of the ultrasonic endoscope 12 of the present invention, the gap (space) between the backing material layer 54 of the laminate 68 of the ultrasonic transducer unit 46 and the cable wiring portion 56; the gap (space) between the copper foil 62 and the ground terminal 60 and the plurality of coaxial cables 58 (signal lines 58a, shielding components 58c, etc.); and the gap (space) between the laminate 68, the copper foil 62, the ground terminal 60, the plurality of coaxial cables 58 and the backing material layer 54 and the outer component 41 are preferably filled with a filling material with good heat dissipation and set as a filling material layer 74.

[0145] This filler material layer 74 is provided to fill the gap between the ultrasonic transducer unit 46 and the outer component 41, especially the gap between the backing material layer 54 and the outer component 41. It also secures the cable wiring section 56, the wiring portions of the plurality of coaxial cables 58, and a portion of the extension portions, thereby preventing poor connection of the signal lines 58a of the coaxial cables 58 in the plurality of connection portions 56a of the cable wiring section 56, poor connection of the shielding component 58c of the coaxial cables 58 in the ground terminal 60, and breakage of the coaxial cables 58, etc. Thus, by covering the cable wiring section 56 and at least a portion of the plurality of coaxial cables 58 with a filler material with good heat dissipation to form the filler material layer 74, protection can be provided for the ultrasonic transducer unit 46 of the front end 40 of the ultrasonic endoscope 12 of the present invention and portions of the plurality of coaxial cables 58 when assembling the ultrasonic observation section 36.

[0146] Furthermore, the filler material layer 74 is preferably coupled with the acoustic impedance of the backing material layer 54 so that the ultrasonic waves oscillating from the ultrasonic transducer array 50 and propagating to its underside are not reflected at the boundary with the backing material layer 54, and the ultrasonic waves oscillating from the ultrasonic transducer array 50 are sufficiently attenuated by being reflected at the object under observation or its periphery. Therefore, when the acoustic impedance of the filler material layer 74 is set to Zp (kg / m²), 2 s), and the acoustic impedance of the backing material layer 54 is set to Zb (kg / m 2 When s), the acoustic impedance reflectivity Q (%) of the filling material layer 74 and the backing material layer 54, as expressed by the following formula (1), is preferably 50% or less.

[0147] Q=100×|Zp-Zb| / (Zp+Zb)……(1)

[0148] The acoustic impedance reflectivity Q is an index representing the ease with which ultrasonic waves (sound beams) are reflected at the boundary between the filling material layer 74 and the backing material layer 54. Specifically, the closer the value is to 0%, the more coupled the acoustic impedance of the filling material layer 74 is to the acoustic impedance of the backing material layer 54. If the acoustic impedance reflectivity is approximately 50% or less, it is possible to ensure that noise caused by ultrasonic waves propagating to the underside of the ultrasonic transducer array 50 does not cause problems in the ultrasonic image generated in the ultrasonic processor device 14 using the ultrasonic signals received in the ultrasonic transducer array 50.

[0149] Furthermore, when ultrasonic waves oscillate from the ultrasonic transducer array 50 of the ultrasonic transducer unit 46, the drive signal transmitted from the ultrasonic processor device 14 to the ultrasonic transducer array 50 becomes heat energy, and the ultrasonic transducer array 50 generates heat. Therefore, the filling material layer 74 preferably has heat dissipation properties. Thus, the thermal conductivity of the filling material layer 74 is preferably 1.0 W / mK or higher.

[0150] The ultrasonic observation section 36 of the front end portion 40 of the ultrasonic endoscope 12 of the present invention is configured in the manner described above.

[0151] Next, the endoscope observation section 38 consists of an observation window 78, an objective lens 80, a solid-state imaging element 82, an illumination window 84, a cleaning nozzle 86, and a wiring cable 88.

[0152] The observation window 78 is mounted at an angle upward toward the front end 40. Reflected light from the object being observed, incident through the observation window 78, is imaged onto the imaging surface of the solid-state imaging element 82 via the objective lens 80. The solid-state imaging element 82 performs photoelectric conversion on the reflected light from the object being observed, which is transmitted through the observation window 78 and the objective lens 80 and imaged onto the imaging surface, and outputs an imaging signal. Examples of solid-state imaging elements 82 include CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor). The image signal output from the solid-state imaging element 82 is transmitted to the endoscope processor device 16 via a wiring cable 88 extending from the insertion part 22 to the operation part 24 and via a universal plug cord 26. The endoscope processor device 16 performs various signal processing and image processing on the transmitted imaging signal and displays it as an endoscope optical image on the display 20.

[0153] Illumination windows 84 are disposed on both sides, separated from observation windows 78. An exit end of a light guide (not shown) is connected to the illumination window 84. The light guide extends from the insertion part 22 to the operation part 24, and its entrance end is connected to a light source device 18 connected via a universal plug cord 26. Illumination light emitted by the light source device 18 travels along the light guide from the illumination window 84 to the observed area.

[0154] Furthermore, the cleaning nozzle 86 sprays air or cleaning water from the water tank 21a through the air and water supply lines inside the ultrasonic endoscope 12 to the observation window 78 and the lighting window 84 in order to clean their surfaces.

[0155] Furthermore, a treatment device outlet 44 is provided at the front end 40. The treatment device outlet 44 is connected to the treatment device channel 45 inside the insertion part 22. The treatment device inserted into the treatment device insertion port 30 is introduced into the body cavity through the treatment device channel 45 and the treatment device outlet 44. In addition, the treatment device outlet 44 is located between the ultrasound observation part 36 and the endoscope observation part 38, but when it is necessary to confirm the movement of the treatment device introduced into the body cavity through the treatment device outlet 44 by ultrasound imaging, it is preferable to place it close to the ultrasound observation part 36.

[0156] Although not shown, an erecting platform can be provided inside the treatment device outlet 44 to change the exit direction of the treatment device introduced into the body cavity from the treatment device outlet 44. A steel wire (not shown) is installed in the erecting platform, and the erecting angle of the erecting platform changes by a push-pull operation based on the erecting rod (not shown) of the operating unit 24, thereby allowing the treatment device to be exited in the desired direction.

[0157] When observing the body cavity through the ultrasonic endoscope 12, firstly, the insertion part 22 is inserted into the body cavity, and the endoscope optical image acquired in the endoscope observation part 38 is viewed on the display 20 while searching for the observation target area.

[0158] Next, if the front end 40 reaches the observation site and issues a command to acquire an ultrasonic tomographic image, a drive control signal is input from the ultrasonic processor device 14 through the coaxial cable 58, cable wiring section 56, and electrode section 52 within the ultrasonic endoscope 12 to the ultrasonic transducer 48. When the drive control signal is input, a predetermined voltage is applied to the two electrodes of the ultrasonic transducer 48. Furthermore, the piezoelectric element of the ultrasonic transducer 48 is excited, and ultrasonic waves are emitted to the observation site via the acoustic lens 66.

[0159] In addition, at this time, the ultrasonic transducer 48 and the backing material layer 54 generate heat, but the heat generated is effectively transferred to the copper foil 62 that constitutes the heat dissipation structure 70. The heat transferred to the copper foil 62 is effectively transferred to the shielding component 58c of the multiple coaxial cables 58 via the ground terminal 60 integrally connected to the copper foil 62, and is effectively dissipated to the outside of the body cavity of the subject. Therefore, the temperature rise of the front end 40 of the ultrasonic endoscope 12 is suppressed, so as not to cause low-temperature burns or other damage to the body cavity surface that the front end 40 contacts.

[0160] As described above, after ultrasonic waves are irradiated, the ultrasonic transducer 48 receives the echo signal from the object of observation. The ultrasonic irradiation and echo signal reception are repeated simultaneously by switching the driven ultrasonic transducer 48 off via an electronic switch such as a multiplexer. Thus, the object of observation is scanned by ultrasonic waves. In the ultrasonic processor device 14, an ultrasonic tomographic image is generated based on the detection signal output from the ultrasonic transducer 48 according to the received echo signal. The generated ultrasonic tomographic image is displayed on the display 20.

[0161] The ultrasonic endoscope of the first embodiment of the present invention is basically constructed in the manner described above.

[0162] The following is for reference. Figures 12-19 The ultrasonic endoscopes and their manufacturing methods according to the second to fourth embodiments of the present invention will be described here. Figures 12-19 and Figures 8-11Similarly, this is a schematic diagram showing the detailed structure of the ultrasonic transducer unit to emphasize the heat dissipation structure of the ultrasonic observation section at the front end of the ultrasonic endoscope. It does not represent the actual components and parts, but only shows the parts required for the description and omits the parts not used in the description.

[0163] (Second Implementation)

[0164] Figure 12 and Figure 13 This is a schematic diagram illustrating the manufacturing process of the heat dissipation structure of the ultrasonic transducer unit of the ultrasonic endoscope according to the second embodiment of the present invention. Figure 14 This is an explanatory diagram schematically illustrating the heat dissipation structure of the ultrasonic transducer unit of the ultrasonic endoscope according to the second embodiment of the present invention.

[0165] In the ultrasonic endoscope of the second embodiment of the present invention, such as Figures 12-14 The schematic diagram shows a heat dissipation structure 70a that can be used to manufacture the ultrasonic transducer unit 46a.

[0166] First, the ground terminal 60 is pre-installed and connected to the lower side of the copper foil 62 to achieve integration, preparing the copper foil 62 and the ground terminal 60 to become one unit. Figure 9 The integrated component 76 shown is, for example Figure 12 As shown, the copper foil 62 and the ground terminal 60 are reversed so that the copper foil 62 is led out to the side opposite to the ultrasonic transducer 48.

[0167] Next, as Figure 13 As shown, using conventional solder, etc. Figure 12 The shielding component 58c of multiple coaxial cables 58 is connected to the ground terminal 60 of the integrated component 76 shown.

[0168] Next, as Figure 11 As shown, signal lines 58a of multiple coaxial cables 58, to which shielding components 58c are connected in the ground terminal 60 of the integrated component 76, are respectively connected to the connection portion 56a of the cable wiring portion 56, which is electrically connected to multiple individual electrodes 52a of the electrode portion 52 of the corresponding ultrasonic transducer array 50, by means of conventional solder or the like.

[0169] Then, the copper foil 62, which is led out from the integrated component 76 to the side opposite to the ultrasonic transducer 48, is folded back towards the ultrasonic transducer 48 and attached to the outer surface of the laminate 68 (multiple ultrasonic transducers 48 and backing material layer 54). This allows the manufacture of the ultrasonic transducer unit 46a of the ultrasonic endoscope of this embodiment, which has a heat dissipation structure 70a with a structure of folded-back copper foil 62. That is, the heat dissipation structure 70a of the ultrasonic transducer unit 46a of the ultrasonic endoscope of this embodiment is only located relative to the ultrasonic transducer 48. Figure 11 The ultrasonic transducer unit 46 shown is different in that its heat dissipation structure 70 is designed with a folded-back copper foil 62.

[0170] The heat dissipation structure 70a of this embodiment is designed with the copper foil 62 folded back, so the wiring space can be reduced compared with the heat dissipation structure 70 of the first embodiment, thereby saving space.

[0171] Furthermore, in the ultrasonic transducer unit 46a of this embodiment, similar to the ultrasonic transducer unit 46 of the first embodiment, it is self-evident that the heat dissipation structure 70a can be provided not only on one side of the outer surface of the laminate 68, but also on both outer surfaces of the laminate 68.

[0172] (Third Implementation)

[0173] The first and second embodiments described above integrate the copper foil and the ground terminal in advance, but the present invention is not limited to this and may not be integrated in advance.

[0174] Figure 15 This is a schematic diagram illustrating the manufacturing process of the heat dissipation structure of the ultrasonic transducer unit of the ultrasonic endoscope according to the third embodiment of the present invention. Figure 16 This is an explanatory diagram schematically illustrating the heat dissipation structure of the ultrasonic transducer unit of the ultrasonic endoscope according to the third embodiment of the present invention.

[0175] like Figure 15 As shown, firstly, the shielding component 58c of multiple coaxial cables 58 is connected to the ground terminal 60 using conventional solder or the like, and then the signal lines 58a of the multiple coaxial cables 58 are respectively connected to the connection portion 56a of the cable wiring portion 56, which is electrically connected to the multiple individual electrodes 52a of the electrode portion 52 of the corresponding ultrasonic transducer array 50, using conventional solder or the like.

[0176] Furthermore, copper foil 62 is attached to the outer surface of the laminate 68 (multiple ultrasonic transducers 48 and backing material layer 54).

[0177] Then, as Figure 16As shown, the copper foil 62 is folded back and the ground terminal 60 is connected using at least one of the following: low-temperature solder, low-melting-point solder, silver paste, and conductive adhesive, which can be soldered at temperatures lower than those of conventional solders.

[0178] Thus, it is possible to manufacture the ultrasonic transducer unit 46b of the ultrasonic endoscope of this embodiment, which has the heat dissipation structure 70b of this embodiment.

[0179] Furthermore, in the ultrasonic transducer unit 46b of this embodiment, it is self-evident that the heat dissipation structure 70b can be provided not only on both outer surfaces of the laminate 68, but also on one side of the outer surface of the laminate 68.

[0180] Furthermore, in the heat dissipation structure 70b of this embodiment, the ground terminal 60 and the copper foil 62 are not integrated. Therefore, after connecting the signal line 58a to the connection part 56a of the cable wiring part 56 using conventional solder, it is necessary to connect the ground terminal 60 and the copper foil 62. However, in the connection between the ground terminal 60 and the copper foil 62, a low-temperature solder or the like that can be soldered at a temperature lower than that of conventional solder is used. Therefore, similar to the first and second embodiments, damage to the signal line 58a can be eliminated.

[0181] (Fourth implementation)

[0182] Figure 17 and Figure 18 This is a schematic diagram illustrating the manufacturing process of the heat dissipation structure of the ultrasonic transducer unit of the ultrasonic endoscope according to the fourth embodiment of the present invention. Figure 19 This is an explanatory diagram schematically showing the heat dissipation structure of the ultrasonic transducer unit of the ultrasonic endoscope according to the fourth embodiment of the present invention.

[0183] first, Figure 19 The heat dissipation structure 70c of the ultrasonic transducer unit 46c of the ultrasonic endoscope shown in this embodiment differs from the heat dissipation structures of the first to third embodiments in that it uses a wiring board 90 that has a portion that serves as a ground terminal 60 and a portion that serves as a cable wiring portion 56 having multiple connection portions 56a for connecting multiple coaxial cables 58. This improves the operability of connecting to each individual electrode 52a of the multiple ultrasonic transducers 48 of the electrode portion 52 of the ultrasonic transducer array 50.

[0184] like Figure 17As shown, a wiring board 90 with a portion serving as a ground terminal 60 is prepared, and a copper foil 62 is connected to the wiring board 90, which is electrically connected to the ground terminal 60, in a manner that leads to the lower side of the figure opposite to the side where the ultrasonic transducer array 50 is disposed. In this case, the connection portion of the copper foil 62 to the wiring board 90 does not need to be directly connected to the ground terminal 60, but only electrically connected, thus increasing the flexibility in the layout of the copper foil 62. In the example shown, the copper foil 62 is connected to the wiring board 90 at a position away from the ground terminal 60.

[0185] Here, the wiring board 90 can be a flexible wiring board such as an FPC, as described above, or a rigid wiring board such as a PCB or PWB.

[0186] exist Figure 17 In the example shown, a pair (2) of integrated components 92 are prepared in advance, which integrate the copper foil 62 with the wiring board 90.

[0187] Next, as Figure 18 As shown, multiple connection portions 56a of the wiring board 90 of a pair (2) integrated components 92 are respectively connected to multiple wiring 94 that are connected to each individual electrode 52a of the multiple ultrasonic transducers 48 of the corresponding ultrasonic transducer array 50 electrode portion 52.

[0188] Next, as Figure 19 As shown, the copper foil 62, which is led out from the integrated component 92 to the side opposite to the ultrasonic transducer 48, is folded back towards the ultrasonic transducer 48 and attached to the outer surface of the laminate 68 (multiple ultrasonic transducers 48 and backing material layer 54). This allows the manufacture of an ultrasonic transducer unit 46c of the ultrasonic endoscope of this embodiment, which has a heat dissipation structure 70c with a structure of folded-back copper foil 62.

[0189] In addition, although not in Figure 19 As shown in the heat dissipation structure 70c, it is self-evident that the shielding component 58c of multiple coaxial cables 58 is connected to the ground terminal 60 of the integrated component 92 by conventional solder, and the signal lines 58a of multiple connection portions 56a of the cable wiring portion 56 of the integrated component 92 are respectively connected to multiple coaxial cables 58 by conventional solder.

[0190] Furthermore, in the ultrasonic transducer unit 46c of this embodiment, it goes without saying that the heat dissipation structure 70c can be provided not only on both outer surfaces of the laminate 68, but also on one side of the outer surface of the laminate 68.

[0191] Furthermore, in Figures 17-19In the example shown, an integrated component 92 is used, in which the copper foil 62 and the wiring board 90 are pre-integrated. However, this embodiment is not limited to this. The copper foil 62 can be connected to the wiring board 90 after the multiple connection portions 56a of the wiring board 90 are connected to the corresponding multiple wirings 94. Alternatively, the copper foil 62 can be connected to the wiring board 90 after the signal lines 58a of the multiple coaxial cables 58 are connected to the multiple connection portions 56a, and / or after the shielding components 58c of the multiple coaxial cables 58 are connected to the ground terminal 60.

[0192] (Fifth Embodiment)

[0193] Figure 20 This is a partial cross-sectional view schematically showing the front end of the ultrasonic endoscope according to the fifth embodiment of the present invention.

[0194] Figure 20 The front end 40a of the ultrasonic endoscope 12a shown is used in addition to replacing Figure 3 and Figure 4 The ultrasonic endoscope 12 shown has the same structure except that its front end 40 and ground terminal 60 have a grounding wire 96 and the copper foil 62 disposed on the outer side of the laminate 68 (multiple ultrasonic transducers 48 and backing material layer 54) is thermally connected to the grounding wire 96 via the second heat-conducting member 98. Therefore, the same reference numerals are used to mark the same components and their descriptions are omitted.

[0195] Figure 20 The ultrasonic transducer unit 46d of the front end portion 40a of the ultrasonic endoscope 12a shown has a heat dissipation structure 70d comprising a ground wire 96 which serves as the ground wire of the present invention, a first heat-conducting component of the present invention, namely a copper foil 62, and a second heat-conducting component 98 that thermally connects the copper foil 62 to the ground wire 96.

[0196] The grounding wire 96 is the part that tightly attaches the shielding components 58c of the multiple coaxial cables 58 of the shielded cable 72 and is bound together with a metal ring, and all shielding components 58c and the metal ring are both electrically and thermally connected.

[0197] In addition, in the grounding wire 96, the shielding component 58c of the multiple coaxial cables 58 becomes the outer surface, and the ends connected to the multiple connecting parts 56a of the cable wiring part 56 only become signal lines 58a. Between the grounding wire 96 and the multiple connecting parts 56a, the first insulation layer 58b becomes the outer surface, and the signal lines 58a are covered by the first insulation layer 58b. The multiple signal lines 58a are insulated from each other.

[0198] The second heat-conducting component 98 is not particularly limited as long as it can transfer the heat generated and transferred to the copper foil 62 in the plurality of ultrasonic transducers 48 and the backing material layer 54 to the grounding wire 96. It can be any heat-conducting component as long as it is thermally conductive and can be flexibly accommodated in the narrow space of the front end 40a of the ultrasonic endoscope 12a. Since the second heat-conducting component 98 needs to be thermally conductive and flexibly accommodated in a narrow space, examples include thermally conductive cables such as cables with core wires, thermally conductive wires such as metal wires, thermally conductive meshes such as metal mesh components, or heat-conducting components that extend a portion of the first heat-conducting component, i.e., the copper foil 62, as a wire.

[0199] As the second heat-conducting component 98, when using these heat-conducting components, in order to improve heat transfer efficiency, it is preferable to use a cable with a core wire thicker than the signal line 58a of the coaxial cable 58 or a metal wire thicker than the signal line 58a.

[0200] Furthermore, as the second heat-conducting component 98, when flexibility that can be accommodated in a narrow space is required, a metal-woven mesh component is preferred.

[0201] Furthermore, by using an insulating thermally conductive component, the noise immunity can be improved as the second thermally conductive component 98. For example, a heat-dissipating silicone rubber or a heat sink can be used as the insulating thermally conductive component.

[0202] The ultrasonic endoscopes with heat dissipation structures at the front end in the first to fifth embodiments of the present invention described above are all convex ultrasonic endoscopes with convex ultrasonic probes. However, the present invention is not limited to this and may be radial ultrasonic endoscopes with radial ultrasonic probes having heat dissipation structures at the front end.

[0203] (Sixth Embodiment)

[0204] Figure 21 This is a partially enlarged top view schematically showing the front end of the insertion portion of the ultrasonic endoscope according to this embodiment. Furthermore, Figure 22 yes Figure 21 The XX-line view shown is Figure 21 A partial longitudinal sectional view of the front end of the insertion section of the ultrasonic endoscope shown.

[0205] in addition, Figure 21 and Figure 22 The ultrasonic endoscope 100 of the sixth embodiment shown, in addition to replacing the one equipped with Figures 1 to 7The front end portion 40 of the ultrasonic endoscope 12, the convex ultrasonic observation section 36, and the endoscope observation section 38 shown in the first embodiment have the same structure except that they have the front end portion 102 of the radial ultrasonic observation section 104 and the endoscope observation section 106. Therefore, the same reference numerals are used to mark the same components, and detailed descriptions are omitted.

[0206] like Figure 21 and Figure 22 As shown, the ultrasonic endoscope 100 of this embodiment has a front end portion 102 comprising a radial ultrasonic observation section 104 and an endoscopic observation section 106, and acquires ultrasonic images (echo signals) and endoscopic images (image signals) respectively by imaging the body cavity of the subject. Although not shown in Figure 21 and Figure 22 The diagram in the middle, but with Figure 1 Similar to the ultrasonic endoscope 12 shown, the ultrasonic endoscope 100, in addition to the front end portion 102, also has an insertion portion (22) with a curved portion (42) and a flexible portion (43), an operating portion (24), and a universal plug cord (26).

[0207] Here, in Figure 21 and Figure 22 In the example shown, the ultrasonic observation section 104 is disposed closer to the end end of the ultrasonic endoscope 100 than the endoscopic observation section 106. However, the present invention is not limited to this. It may be disposed closer to the base end than the endoscopic observation section 106, or it may be disposed closer to the end end than some of the components of the endoscopic observation section 106 and closer to the base end than the remaining components.

[0208] Furthermore, the ultrasonic endoscope 100 of this embodiment and Figures 1 to 7 The ultrasonic endoscope 12 of the first embodiment shown can also include a mechanism for dispensing instruments such as forceps, puncture needles, and high-frequency knives. Furthermore, the dispensing port (44 (reference) for dispensing these instruments... Figure 3 It can be located further from the base of the ultrasonic observation section 104, for example, between the ultrasonic observation section 104 and the endoscopic observation section 106, or it can be located at the end of the ultrasonic endoscope 100, for example, at the very end.

[0209] Furthermore, the endoscopic observation section 106 of the ultrasonic endoscope 100 of this embodiment has a similar... Figure 2 and Figure 3 The endoscope observation section 38 of the ultrasonic endoscope 12 of the first embodiment shown has the same structure, and it is self-evident that it has an observation section (78), an objective lens (80), a solid imaging element (82), an illumination window (84), a cleaning nozzle (86), and a wiring cable (88).

[0210] like Figure 21 and Figure 22 As shown, the ultrasonic observation unit 104 of this embodiment is composed of an ultrasonic transducer unit 108, a cylindrical outer casing 110 for mounting and holding the ultrasonic transducer unit 108, and multiple coaxial cables 58 connected to the shielded cable 72 of the ultrasonic transducer unit 108.

[0211] like Figure 22 As shown, the ultrasonic transducer unit 108 includes an ultrasonic transducer array 114 in which multiple ultrasonic transducers 112 are arranged in a cylindrical shape, an electrode portion 116 connected to the ultrasonic transducer array 114, a backing material layer 118 supporting each ultrasonic transducer 112 from the surface of the ultrasonic transducer unit 108 (the surface inside the ultrasonic transducer 112), an acoustic matching layer 120 stacked on the opposite side of the backing material layer 118 relative to the ultrasonic transducer array 114 (the outer side of the ultrasonic transducer array 114), and an acoustic lens 122 stacked on the opposite side of the ultrasonic transducer array 114 relative to the acoustic matching layer 120 (the outer side of the acoustic matching layer 120). As described above, the ultrasonic transducer unit 108 has a laminate 124 composed of the acoustic lens 122, the acoustic matching layer 120, the ultrasonic transducer array 114, and the backing material layer 118.

[0212] Here, the electrode section 116 has individual electrodes 116a for each of the plurality of ultrasonic transducers 112 in the ultrasonic transducer array 114 and a common electrode 116b for the plurality of ultrasonic transducers 112.

[0213] Furthermore, the backing material layer 118 is supported by a cylindrical member 126 having a flange 126a disposed on the central side.

[0214] Furthermore, the ultrasonic transducer 112, ultrasonic transducer array 114, electrode portion 116, backing material layer 118, acoustic matching layer 120, acoustic lens 122, and laminate 124 in this embodiment are similar in shape to... Figures 1 to 7 The ultrasonic transducer 48, ultrasonic transducer array 50, electrode part 52, backing material layer 54, acoustic matching layer 64, acoustic lens 66 and laminate 68 shown in the first embodiment are different, but their structures and functions are the same, so their descriptions are omitted.

[0215] Furthermore, the ultrasonic transducer unit 108 has a flexible wiring board (FPC) 128 that is electrically connected to a plurality of individual electrodes 116a of the electrode section 116 and has a plurality of connection portions 128a for wiring connection of signal lines 58a of a plurality of coaxial cables 58, a ground terminal 130 disposed on the FPC 128 and electrically connected to a common electrode 116b of the electrode section 116, and a copper foil 132 disposed between the FPC 128 and the backing material layer 118 and attached along the side end face (end face on the end face of the endoscope observation section 106) of the cylindrical backing material layer 118 and the outer peripheral surface adjacent to the side end face.

[0216] Here, signal lines 58a of multiple coaxial cables 58 are electrically connected to multiple connection parts 128a of FPC128, and each individual electrode 116a of multiple ultrasonic transducers 112 is electrically connected to the signal lines 58a of multiple coaxial cables 58.

[0217] On the other hand, the shielding components 58c of multiple coaxial cables 58 are electrically connected to the ground terminal 130, and the common electrode 116b of multiple ultrasonic transducers 112 is electrically connected to the shielding components 58c of multiple coaxial cables 58.

[0218] Furthermore, in the cylindrical component 126, one or more slits 126b are opened near the end of the laminate 124 on the base side, penetrating both the inside and outside of the cylindrical component 126. Multiple coaxial cables 58, their signal lines 58a, and shielding components 58c are led out from the inside of the cylindrical component 126 to the outside through the slits 126b, and are respectively connected to multiple connection portions 128a and ground terminals 130 of the FPC 128. In addition, the slits 126b can be one or multiple, as long as they can allow multiple coaxial cables 58, their signal lines 58a, and shielding components 58c to pass through.

[0219] Furthermore, the copper foil 132 is thermally connected to the ground terminal 130, and is thermally connected to the shielding component 58c of the multiple coaxial cables 58 via the ground terminal 130.

[0220] Here, the copper foil 132 and the ground terminal 130 shield the plurality of ultrasonic transducers 112 and form a heat dissipation structure 134, which is a feature of the present invention, to dissipate the heat generated in the plurality of ultrasonic transducers 112 and the backing material layer 118 to the shielding component 58c of the plurality of coaxial cables 58.

[0221] Thus, through the heat dissipation structure 134, a feature of the present invention, the heat generated in the plurality of ultrasonic transducers 112 and the backing material layer 118 is dissipated to the test body via the shielding member 58c of the plurality of coaxial cables 58 and the insertion part (22).

[0222] In this embodiment, as in the first, second and fourth embodiments described above, the copper foil 62 and the ground terminal 60, the copper foil 132 and the ground terminal 130 can be integrated in advance. As in the third and fourth embodiments described above, the copper foil 62 and the ground terminal 60 can also be connected electrically and thermally to the signal lines 58a of multiple coaxial cables 58 before being integrated in advance.

[0223] In addition, Figure 21 and Figure 22 In the example shown, as in the second embodiment described above, the copper foil 132 is folded back and connected to the ground terminal 130, but the present invention is not limited to this.

[0224] Furthermore, in Figure 21 and Figure 22 In the example shown, the FPC128, ground terminal 130 and copper foil 132 are disposed on the endoscope viewing section 38 side of the backing material layer 118. However, the present invention is not limited to this. They can be disposed on the end side of the front end 102, or any one of them can be disposed on one side (e.g., the endoscope viewing section 38 side) and the rest can be disposed on the other side (e.g., the end side of the front end 102).

[0225] (Seventh Embodiment)

[0226] Figure 23 This is a partial cross-sectional view schematically showing the front end of the insertion portion of the ultrasonic endoscope of this embodiment.

[0227] in addition, Figure 23 The front end portion 102a of the ultrasonic endoscope 100a shown in the seventh embodiment, except for replacing Figure 22 The ultrasonic endoscope 100 shown has the same structure as the front end 102 and its ground terminal 130 having a ground wire 96, and the copper foil 132 disposed on the side end face of the backing material layer 118 is thermally connected to the ground wire 96 via the second heat-conducting member 136. Therefore, the same reference numerals are used to mark the same components, and their descriptions are omitted.

[0228] Figure 23 The ultrasonic transducer unit 108a of the front end 40a of the ultrasonic endoscope 100a shown has a heat dissipation structure 134a that includes a ground wire 96 used in the fifth embodiment of the present invention, a first heat-conducting component of the present invention, namely copper foil 132, and a second heat-conducting component 136 that thermally connects the copper foil 132 to the ground wire 96.

[0229] Here, the multiple coaxial cables 58 and their signal lines 58a are connected to the multiple connection portions 128a of the FPC 128 respectively, passing through one or more slits 126b of the cylindrical member 126 and extending from the inside of the cylindrical member 126 to the outside.

[0230] Furthermore, the second heat-conducting component 136 connected to the copper foil 132 is also connected to the ground wire 96 through one or more slits 126b of the cylindrical component 126 and introduced from the outside of the cylindrical component 126 into the inside.

[0231] In addition, the multiple coaxial cables 58 are in the grounding wire 96, and the shielding component 58c is the outer surface of the grounding wire 96. The ends connected to the multiple connectors 128a of the FPC 128 are only signal lines 58a. Between the grounding wire 96 and the multiple connectors 128a, the first insulation layer 58b is the outer surface. The signal lines 58a are covered by the first insulation layer 58b, and the multiple signal lines 58a are insulated from each other.

[0232] The second heat-conducting component 136 and Figure 20 Similar to the second heat-conducting component 98 shown, there are no particular limitations as long as it can conduct the heat generated in the plurality of ultrasonic transducers 112 and the backing material layer 118 and transferred to the copper foil 132 to the ground wire 96. Any heat-conducting component can be used as long as it is thermally conductive and can be flexibly accommodated in the narrow space of the front end portion 102a of the ultrasonic endoscope 100a. As the second heat-conducting component 136, the same heat-conducting component as the second heat-conducting component 98 used in the fifth embodiment of the present invention can be used.

[0233] In addition, Figure 22 The front end 102 of the ultrasonic endoscope 100 shown and Figure 23 The front end portion 102a of the ultrasonic endoscope 100a shown preferably includes a connection portion of a plurality of coaxial cables 58 and their signal lines 58a that branch off from the shielded cable 72, and the wiring portion and the outer component 41 are filled with filler material.

[0234] As for the filler material used at this time, any non-conductive filler material such as epoxy resin or silicone resin can be used.

[0235] The ultrasonic endoscope and its manufacturing method involved in the present invention have been described above. However, the present invention is not limited to the above examples. It is self-evident that various modifications or variations can be made without departing from the spirit of the present invention.

[0236] Symbol Explanation

[0237] 10 - Ultrasonic examination system; 12, 12a, 100, 100a - Ultrasonic endoscope; 14 - Ultrasonic processor; 16 - Endoscopic processor; 18 - Light source; 20 - Display; 21a - Water tank; 21b - Suction pump; 22 - Insertion section; 24 - Operating section; 26 - Universal plug rope; 28a - Air / water supply button; 28b - Suction button; 29 - Bent-angle button; 30 - Instrument insertion port (forceps port); 32a - Ultrasonic connector; 32b - Endoscopic connector; 32c - Light source connector; 34 a- Air and water supply hose; 34b- Suction hose; 36, 104- Ultrasonic observation section; 38, 106- Endoscopic observation section; 40, 40a, 102, 102a- Front end; 41, 110- External components; 42- Bending section; 43- Flexible section; 44- Treatment instrument outlet; 45- Treatment instrument channel; 46, 46a, 46b, 46c, 46d, 108, 108a- Ultrasonic transducer unit; 48, 112- Ultrasonic transducer; 50, 114- Ultrasonic transducer array; 52, 116- Electrode section; 52a... 116a - Individual electrode; 52b, 116b - Common electrode; 54, 118 - Backing material layer; 56 - Cable wiring section; 56a, 128a - Connector; 58 - Coaxial cable; 58a - Signal line; 58b - First insulation layer; 58c - Shielding component; 58d - Second insulation layer; 60, 130 - Ground terminal; 62, 132 - Copper foil; 64, 120 - Acoustic matching layer; 66, 122 - Acoustic lens; 68, 124 - Laminated structure; 70, 70a, 70b, 70c, 70d, 134, 134a - Heat dissipation structure; 7 2-Shielded cable, 72a-Outer sheath, 74-Filling material layer, 76, 92-Integrated component, 78-Observation window, 80-Objective lens, 82-Solid-state imaging element, 84-Illumination window, 86-Cleaning nozzle, 88-Wiring cable, 90-Wiring board, 94-Wiring, 96-Grounding wire, 98-Second heat-conducting component, 126-Cylindrical component, 126a-Flange, 126b-Slit, 128-Flexible wiring board (FPC), 136-Second heat-conducting component, EL-Long side direction (elevation direction), AZ-Parallel direction (lateral direction).

Claims

1. An ultrasonic endoscope, characterized in that, It has the following at the front end: An ultrasonic transducer array consisting of multiple ultrasonic transducers arranged in a row; A shielded cable having multiple signal lines and multiple shielding components made of metal disposed on the outside of the signal lines; The wiring section includes multiple connection sections that electrically connect the plurality of signal lines to the plurality of ultrasonic transducers respectively; A thermally conductive ground wire is electrically connected to the plurality of shielding components; A sheet-like first heat-conducting component is disposed on the side of the ultrasonic transducer array; and The second heat-conducting component is thermally connected to the first heat-conducting component. The ultrasonic endoscope also has a backing material layer, which is stacked on the back side of the ultrasonic transducer array and supports the plurality of ultrasonic transducers. The first thermally conductive component is disposed on the side of the laminate comprising the ultrasonic transducer array and the backing material layer, and extends to the underside of the backing material layer on the side opposite to the ultrasonic transducer array side. The second heat-conducting component is pre-integrated with the first heat-conducting component at its lower end, which is on the side opposite to the ultrasonic transducer array side. The plurality of shielding components are connected to the second heat-conducting component, which constitutes the ground wire portion and is integral with the first heat-conducting component. The first heat-conducting component, which is integrated with the second heat-conducting component, is attached to the plurality of ultrasonic transducers. The wiring section is obtained by integrating a flexible printed wiring board having multiple wirings for electrical connection to the multiple ultrasonic transducers and a rigid wiring board having multiple connection portions for connecting the multiple signal lines, such that the multiple wirings and the multiple connection portions are connected separately. In the first heat-conducting component, the lower end of the first heat-conducting component located on the side opposite to the ultrasonic transducer array side is connected to the second heat-conducting component facing the upper side that is the ultrasonic transducer array side, and the upper end of the first heat-conducting component is folded back towards the side of the laminate and attached to the plurality of ultrasonic transducers.

2. The ultrasonic endoscope according to claim 1, wherein, The shielded cable is at least one of a plurality of coaxial cables and non-coaxial cables. The plurality of coaxial cables each have a signal line on their center side, and a shielding component on the outer periphery of the signal line. The non-coaxial cable is a cable that combines the plurality of signal lines and the plurality of lead wires that serve as the plurality of shielding components, or a cable in which the plurality of signal lines are arranged on the center side and the plurality of conductors that serve as the plurality of shielding components are arranged around the plurality of signal lines.

3. The ultrasonic endoscope according to claim 1 or 2, wherein, The first and second thermally conductive components are conductive components. The plurality of connection portions of the wiring section are respectively electrically connected to the plurality of signal lines and the plurality of ultrasonic transducers using a first solder. The plurality of shielding components are respectively connected to the second heat-conducting component using the first solder. The first thermally conductive component is connected to the second thermally conductive component using at least one of a second solder with a melting point lower than that of the first solder, silver paste, and a conductive adhesive.

4. The ultrasonic endoscope according to claim 1 or 2, wherein, The second heat-conducting component is a ground terminal.

5. The ultrasonic endoscope according to claim 1 or 2, wherein, The second heat-conducting component is a wiring board with a ground terminal. The first heat-conducting component is connected to the wiring board that is electrically connected to the ground terminal.

6. The ultrasonic endoscope according to claim 1 or 2, wherein, The grounding section is a common grounding wire connected to the plurality of shielding components. The second heat-conducting component is thermally connected to the ground wire and the first heat-conducting component.

7. The ultrasonic endoscope according to claim 6, wherein, The second heat-conducting component is a cable thicker than the signal line or a deformable metal braided mesh component.

8. The ultrasonic endoscope according to claim 6, wherein, The second heat-conducting component is an insulating heat-conducting component.

9. The ultrasonic endoscope according to claim 1 or 2, wherein, The first heat-conducting component is a metal foil that is both electrically and thermally conductive.

10. The ultrasonic endoscope according to claim 9, wherein, The metal foil is copper foil, aluminum foil, or gold foil.

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