Single head spray head for laser welding

By designing a single-head jetting head for laser welding, and utilizing a material drop control mechanism and a gas path vacuum channel to control the movement and melting of the solder balls, the problem of low welding efficiency and precision of existing equipment has been solved, achieving efficient and precise solder ball jetting welding.

CN114559122BActive Publication Date: 2026-06-26DONGGUAN D TEK TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DONGGUAN D TEK TECH CO LTD
Filing Date
2021-11-23
Publication Date
2026-06-26

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  • Figure CN114559122B_ABST
    Figure CN114559122B_ABST
Patent Text Reader

Abstract

The application discloses a single-head spray head for laser welding, which comprises a spray head body, a longitudinal material dropping channel, a feeding channel communicated with the longitudinal material dropping channel and a longitudinal laser channel formed in the spray head body, an upper feeding channel communicated with the feeding channel formed on the spray head body, and a nozzle arranged on the spray head body; meanwhile, a material dropping control mechanism is arranged on the spray head body and corresponds to the position where the feeding channel is communicated with the longitudinal material dropping channel. The single-head spray head for laser welding can control the rapid movement of the solder ball in the spray head body and orderly spray the molten solder ball, the solder ball and the spray head are not easy to be abraded, the welding efficiency and accuracy are effectively improved, and the single-head spray head for laser welding has the advantages of simple structure, small size and stable operation.
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Description

Technical Field

[0001] This invention relates to the fields of semiconductor, electronic component packaging, and electronic mounting equipment technology, and particularly to a single-head jetting head for laser welding. Background Technology

[0002] Existing equipment for soldering circuit boards, wafers, and chips mainly includes soldering irons and vacuum soldering machines. Soldering irons have large soldering tips, resulting in poor soldering efficiency and precision, which cannot meet the requirements for soldering high-precision products.

[0003] A vacuum soldering machine primarily involves placing solder balls on the edge of a separating tray. A motor drives the tray to rotate at a certain angle, sequentially rotating the solder balls to a nozzle. Air is then used to blow the solder balls from the nozzle onto the surface of the component to be soldered. Laser heating melts the solder balls, completing the soldering process. To prevent the solder balls from shifting during tray rotation, positioning holes are typically created on the edge of the tray, and a cover plate is placed above it. This ensures the solder balls remain within the positioning holes as the motor rotates, accurately guiding them to the nozzle. However, during soldering, the constant rotation of the tray causes relative movement between the tray and the cover plate, leading to wear on the tray and solder balls. This wear alters the solder ball size, affecting soldering accuracy and necessitating frequent tray replacements, resulting in high operating costs.

[0004] Therefore, existing technologies still lack welding equipment that is not easily damaged and has high welding precision and efficiency. Summary of the Invention

[0005] To address the aforementioned shortcomings, the present invention aims to provide a single-head jetting head for laser welding. This single-head jetting head can control the rapid movement of solder balls within the jetting head body and eject the molten solder balls in an orderly manner. The solder balls and the jetting head are not easily worn, effectively improving welding efficiency and accuracy. It has a simple structure, small size, and stable operation.

[0006] The technical solution adopted by the present invention to achieve the above-mentioned objective is as follows: a single-head laser welding nozzle, comprising a nozzle body, wherein a longitudinal material feeding channel, a feeding channel connected to the longitudinal material feeding channel, and a longitudinal laser channel are respectively formed inside the nozzle body, and a feeding channel connected to the feeding channel is formed on the nozzle body; a nozzle is provided on the nozzle body, and the longitudinal material feeding channel and the longitudinal laser channel are respectively connected to the nozzle; simultaneously, a material feeding control mechanism is provided on the nozzle body, the material feeding control mechanism comprising a material feeding control air path, a ventilation channel, and a vacuum channel, wherein the material feeding control air path, the ventilation channel, and the vacuum channel are respectively connected to a first solenoid valve, and the material feeding control air path is connected at the position where the feeding channel and the longitudinal material feeding channel communicate; the nozzle body comprises:

[0007] Lower part: The longitudinal material discharge channel is formed in the lower part, the feeding channel is formed at the upper end of the lower part, and the nozzle is disposed at the lower end of the lower part;

[0008] Upper part: It is located above the lower part, and the ventilation channel, vacuum channel and feeding channel are all formed in the upper part;

[0009] A base block A: It is located between the upper and lower parts, and the material discharge control air passage is formed on the base block A.

[0010] As a further improvement of the present invention, the material feeding control mechanism further includes a buffer control air path formed on the base block A and connected to the feeding channel. The buffer control air path, the vacuum channel and the ventilation channel are respectively connected to a second solenoid valve, which is located on the upper part.

[0011] As a further improvement of the present invention, the material feeding control mechanism further includes an air blowing passage formed on the base block A and connected to the feeding channel. The air blowing passage and the air passage are respectively connected to a third solenoid valve, which is located on the upper part.

[0012] As a further improvement of the present invention, the material discharge control air path has a first vent corresponding to the position where the longitudinal material discharge channel and the feed channel are connected; the buffer control air path has a second vent corresponding to the feed channel.

[0013] As a further improvement of the present invention, a first bend is formed at one end of the material feeding control air passage near the first vent, and the width of the first bend gradually decreases from the bend to the first vent; a second bend is formed at one end of the buffer control air passage near the second vent, and the width of the second bend gradually decreases from the bend to the second vent.

[0014] As a further improvement of the present invention, the main body of the injection head further includes a base block B, which is disposed between the base block A and the lower part. The feeding channel is formed on the base block B, and a discharge port corresponding to the longitudinal discharge channel is formed on the feeding channel. The first vent is connected to the discharge port, and the second vent is connected to the feeding channel position near the discharge port. The longitudinal laser channel runs through the upper part, base block A, base block B and the lower part from top to bottom. The base block B includes an upper base block B and a lower base block B located below the upper base block B. The feeding channel is formed on the upper base block B, and a lower channel located below the feeding channel is formed on the lower base block B. The lower channel extends along the length direction of the feeding channel and is connected to the discharge port. The width of the lower channel is smaller than the width of the feeding channel.

[0015] As a further improvement of the present invention, a first connecting hole connecting the first solenoid valve and the material discharge control air path, a second connecting hole connecting the second solenoid valve and the buffer control air path, and a third connecting hole connecting the third solenoid valve and the blowing air channel are respectively formed on the upper part; a feeding pipe connected to the feeding channel and a lens connected to the longitudinal material discharge channel are also provided on the upper part.

[0016] As a further improvement of the present invention, a feeding accumulation groove is formed on the blowing air path and below the feeding channel, which cooperates with the lower end of the feeding channel. The cross-section of the feeding accumulation groove has an elliptical structure, and the end of the feeding channel extends to the lower part of the feeding accumulation groove and coincides with the long axis of the feeding accumulation groove.

[0017] As a further improvement of the present invention, the angle formed between the longitudinal laser channel and the longitudinal material feeding channel is 2°-15°.

[0018] As a further improvement of the present invention, a pressure detection channel connected to the longitudinal laser channel is formed in the lower part.

[0019] As a further improvement of the present invention, a cavity is formed inside the nozzle, and a spray port communicating with the cavity is formed at the lower end of the nozzle, wherein the width of the spray port is smaller than the diameter of the solder ball.

[0020] The beneficial effects of the single-head laser welding nozzle of this invention are as follows: By setting a connecting channel within the nozzle body, consisting of a feeding channel, a feed channel, and a longitudinal dropping channel, for the movement of solder balls, and by setting a dropping control mechanism to control the process of solder balls falling from the feed channel into the longitudinal dropping channel, the solder balls are allowed to fall sequentially, accurately, and quickly. After being heated and melted in the nozzle, they are ejected from the nozzle, improving the accuracy and efficiency of laser welding. The solder balls and nozzle are less prone to wear, the structure is simple, and the overall size is small. In the dropping control mechanism, the dropping control air path, the ventilation channel, and the vacuum channel are isolated from each other, connected only by a first solenoid valve, preventing air leakage and cross-contamination, thus facilitating precise control of the solder balls. Furthermore, by controlling the switching frequency of the solenoid valve, the solder balls can be quickly picked up and blown off, allowing for rapid completion even when performing large-area ball placement. It can precisely control the placement of solder balls with a particle size of 0.06mm or larger, preventing solder ball accumulation and missed placement. The processing cost is low, and the operation is stable.

[0021] The above is an overview of the invention's technical solution. The invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0022] Figure 1 This is an exploded view of the single-head jet head for laser welding of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the single-head jet head for laser welding of the present invention;

[0024] Figure 3 for Figure 2 A magnified view of a portion of position D in the middle;

[0025] Figure 4 This is a cross-sectional view of a single-head jet head for laser welding according to the present invention at one position;

[0026] Figure 5 for Figure 4 A magnified view of a portion of position E in the middle;

[0027] Figure 6 This is a schematic diagram of the connection structure of the main body of the laser welding single-head jet head below base block A in the present invention;

[0028] Figure 7 This is a schematic diagram of the internal structure of the upper part of the single-head jet head for laser welding of the present invention;

[0029] Figure 8 This is a schematic diagram of the bottom structure of the base block A in the single-head laser welding head of the present invention, and a partially enlarged view of position F;

[0030] Figure 9This is a schematic diagram of the structure of the base block B in the single-head laser welding head of the present invention, and a partially enlarged view of the position G.

[0031] Figure 10 This is an exploded view of block B in the single-head laser welding head of the present invention;

[0032] Figure 11 This is a schematic diagram of the bottom structure of the upper part of the single-head laser welding head of the present invention;

[0033] Figure 12 This is a top view and a cross-sectional view along the AA direction of the single-head jet head for laser welding of the present invention.

[0034] Figure 13 This is a top view and a cross-sectional view along the BB direction of the lower part of the single-head jet head for laser welding of the present invention;

[0035] Figure 14 This is a schematic diagram of the nozzle structure in the single-head jet head for laser welding of the present invention. Detailed Implementation

[0036] To further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the specific implementation of the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0037] Please refer to Figures 1 to 4 This invention provides a single-head laser welding nozzle, comprising a nozzle body 1, inside which are formed a longitudinal material dropping channel 2, a feeding channel 3 connected to the longitudinal material dropping channel 2, and a longitudinal laser channel 10. A feeding channel 4 connected to the feeding channel 3 is also formed on the nozzle body 1. A nozzle 5 is disposed on the nozzle body 1, and the longitudinal material dropping channel 2 and the longitudinal laser channel 10 are respectively connected to the nozzle 5. Simultaneously, a material dropping control mechanism is disposed on the nozzle body 1, corresponding to the position where the longitudinal material dropping channel 2 connects to the feeding channel 3.

[0038] Solder balls are fed through feeding channel 4 and then sequentially enter feeding channel 3. They then fall sequentially into longitudinal feeding channel 2 and, under their own gravity, drop along longitudinal feeding channel 2 to nozzle 5. Then, laser light irradiates the solder balls along longitudinal laser channel 10, causing the solder balls to melt. Finally, they are ejected from nozzle 5 and fall onto the surface of the component. This method can precisely control the movement of solder balls with a particle size of 0.06mm or larger inside the ejector head body 1, eliminating the problem of solder ball adsorption and accumulation, and improving the accuracy and efficiency of ball placement.

[0039] In the above process, by setting up a material dropping control mechanism, the process of the solder balls falling from the feeding channel 3 into the longitudinal material dropping channel 2 is controlled, so that the solder balls fall one by one in sequence, accurately and quickly. Moreover, the time for each solder ball to fall into the longitudinal material dropping channel 2 can be controlled, so that only one solder ball is at the nozzle 5 at a time, which facilitates the improvement of the accuracy and speed of spray soldering.

[0040] Specifically, such as Figure 1 , Figure 2 , Figure 6 and Figure 7 As shown, the material discharge control mechanism includes a material discharge control air passage 61, an air passage 71, and a vacuum passage 72. The material discharge control air passage 61, the air passage 71, and the vacuum passage 72 are respectively connected to a first solenoid valve 81. The material discharge control air passage 61 is connected to the position where the feed passage 3 and the longitudinal material discharge passage 2 are connected, i.e., the material discharge port 31 mentioned below.

[0041] The ventilation channel 71 is connected to external compressed gas, and the vacuum channel 72 is connected to an external vacuum pump.

[0042] To prevent oxidation of the solder balls, an inert gas is introduced into the ventilation channel 71. In this embodiment, nitrogen is introduced into the ventilation channel 71.

[0043] When the first solenoid valve 81 connects to the ventilation channel 71 and disconnects from the vacuum channel 72, gas is introduced into the material dropping control air path 61 through the ventilation channel 71, and air is blown into the longitudinal material dropping channel 2 through the material dropping control air path 61. This allows the solder balls that enter the material dropping port 31 from the feeding channel 3 to be quickly and accurately blown into the longitudinal material dropping channel 2. Compared with the solder balls falling down by their own weight, the blowing method significantly increases the falling speed of the solder balls and improves work efficiency.

[0044] Next, the next solder ball moves to the discharge port 31; at the same time, the first solenoid valve 81 shuts off the connection with the ventilation channel 71, and connects the discharge control air path 61 and the vacuum channel 72. The vacuum channel 72 performs vacuum adsorption on the discharge control air path 61, so that the solder ball entering the discharge port 31 from the feeding channel 3 stops falling into the longitudinal discharge channel 2 until the previous solder ball melts and is ejected from the nozzle 5.

[0045] Then repeat the above process, switching from vacuum mode to air blowing mode, controlling the solder balls to fall one by one into the longitudinal feeding channel 2, melt in the nozzle 5 and then be sprayed out one by one. The solder balls and the spray head are not easily worn, effectively improving the accuracy of spray welding. The solder balls can be quickly picked up and blown down by controlling the switching frequency of the solenoid valve. When performing large-area welding, it can also be completed quickly.

[0046] In this embodiment, the injection head body 1 includes:

[0047] Lower part 11: The longitudinal material discharge channel 2 is formed within the lower part 11, the feed channel 2 is formed at the upper end of the lower part 11, and the nozzle 5 is disposed at the lower end of the lower part 11, as shown below. Figure 1 and Figure 4 As shown;

[0048] Upper part 12: Located above lower part 11, the ventilation channel 71, vacuum channel 72, and feeding channel 4 are all formed in upper part 12, such as Figure 1 , Figure 4 and Figure 7 As shown;

[0049] A base block A13: located between the upper part 12 and the lower part 11, the material feeding control air passage 61 is formed on the base block A13, such as Figure 1 and Figure 6 As shown.

[0050] In this way, the material feeding control air path 61, the ventilation channel 71 and the vacuum channel 72 are isolated from each other and connected only through the first solenoid valve 81. There will be no cross-flow of air, which is conducive to the precise control of the solder balls by the material feeding control mechanism. This allows the solder balls to enter the longitudinal material feeding channel 2 one by one in an orderly manner, effectively improving the accuracy of solder ball placement. The structure is simple, the size is small, the processing cost is low and the operation is stable.

[0051] As can be seen from the above process, when the solder ball at the connection position between the longitudinal feeding channel 2 and the feeding channel 3 is vacuum-adsorbed, in order to prevent the next solder ball from colliding with the adsorbed solder ball due to moving forward too quickly and affecting the vacuum adsorption, in this embodiment, as follows: Figure 1 , Figure 2 and Figure 6As shown, the material feeding control mechanism also includes a buffer control air passage 62 formed on the base block A13 and connected to the feeding channel 3. The buffer control air passage 62, the vacuum channel 72 and the ventilation channel 71 are respectively connected to a second solenoid valve 82, which is located on the upper part 12. When the second solenoid valve 81 connects the buffer control air path 62 and the vacuum channel 72, a vacuum is created through these two channels, causing the solder balls behind the discharge port 31 to be vacuum-adsorbed and preventing them from moving towards the discharge port 31. When a solder ball on the discharge port 31 is blown into the longitudinal discharge channel 2, the second solenoid valve 82 disconnects the buffer control air path 62 from the vacuum channel 72 and connects the buffer control air path 62 to the ventilation channel 71, causing the solder ball behind the discharge port 31 to be blown off. Simultaneously, the first solenoid valve 81 connects the discharge control air path 61 to the ventilation channel 71, creating a vacuum adsorption state, thus adsorbing the blown-off solder ball back to the discharge port 31. This allows the solder balls to move forward sequentially without interference, ensuring a stable and orderly process and improving the accuracy and efficiency of the spray soldering.

[0052] In this embodiment, as Figure 1 , Figure 2 and Figure 6 As shown, in order to enable the solder balls on the feeding channel 3 to move smoothly and sequentially toward the dropping port 31, the dropping control mechanism also includes an air blowing passage 63 formed on the base block A13 and connected to the feeding channel 4. The air blowing passage 63 and the air passage 71 are respectively connected to a third solenoid valve 83, which is located on the upper part 11.

[0053] When in use, the nozzle body 1 can be tilted downward at a certain angle near the end of the longitudinal feeding channel 2. In this way, the feeding channel 3 has a certain slope, and the solder ball rolls forward under its own weight after entering the feeding channel 3.

[0054] In this embodiment, as Figure 4 , Figure 5 and Figure 8 As shown, the material discharge control air passage 61 has a first vent 611 corresponding to the position where the longitudinal material discharge channel 2 connects with the feed channel 3; the buffer control air passage 62 has a second vent 621 corresponding to the feed channel 3. Thus, the material discharge control air passage 61 is connected to the longitudinal material discharge channel 2, and the buffer control air passage 62 is connected to the feed channel 3.

[0055] Meanwhile, the distance between the position of the first vent 611 acting on the longitudinal feeding channel 2 and the position of the second vent 621 acting on the feeding channel 3 is greater than the diameter of the solder ball but less than the sum of the diameters of the two solder balls. This avoids the solder balls getting stuck between the first vent 611 and the second vent 621, and better controls the solder balls to enter the longitudinal feeding channel 2 one by one.

[0056] like Figure 6 As shown, the end of the material drop control air passage 61 near the first vent 611 forms a first bend 612, the width of which gradually decreases from the bend to the first vent 611. The material drop control air passage 61 is designed in a bend shape, and the end connected to the longitudinal material drop channel 2 has a pointed tip structure. This allows for a stable airflow within the material drop control air passage 61 when it is connected to the vent 71, and a stable vacuum state when it is connected to the vacuum channel 72. The pointed tip structure at the end connected to the longitudinal material drop channel 2 increases the intensity of air blowing and suction through the first vent 611, effectively lifting and blowing away the solder balls, thus improving the accuracy and speed of solder ball placement.

[0057] Similarly, a second bend 622 is formed at one end of the buffer control air passage 62 near the second vent 621. The width of the second bend 622 gradually decreases from the bend to the second vent 621. This facilitates the formation of a stable airflow or a stable vacuum state within the buffer control air passage 62. At the same time, it increases the intensity of blowing and sucking air from the second vent 621 onto the solder ball, thereby achieving precise control of the solder ball.

[0058] like Figure 1 , Figure 9 As shown, for ease of processing, the main body 1 of the spray head also includes a base block B14, which is disposed between the base block A13 and the lower part 11. The feeding channel 3 is formed on the base block B14, and a discharge port 31 corresponding to the longitudinal discharge channel 2 is formed on the feeding channel 3. The first vent 611 is connected to the discharge port 31, and the second vent 621 is connected to the feeding channel 3 near the discharge port 31. The longitudinal laser channel 10 runs from top to bottom through the upper part 12, the base block A13, the base block B14, and the lower part 11.

[0059] like Figure 10As shown, the base block B14 includes an upper base block B141 and a lower base block B142 located below the upper base block B141. The feeding channel 3 is formed on the upper base block B141, and a lower channel 1421 located below the feeding channel 3 is formed on the lower base block B142. The lower channel 1421 extends along the length direction of the feeding channel 3 and communicates with the discharge port 31. The width of the lower channel 1421 is smaller than the width of the feeding channel 3. Specifically, the width of the feeding channel 3 is greater than the diameter of the solder ball and less than the sum of the diameters of the two solder balls. The width of the lower channel 1421 is less than the diameter of the solder ball. At the same time, the depth of the feeding channel 3 is greater than the diameter of the solder ball and less than the sum of the diameters of the two solder balls. In this way, only one solder ball can be accommodated at each position of the feeding channel 3, preventing solder ball accumulation and blockage. At the same time, when the air blowing passage 63 blows air and moves the solder ball along the feeding channel 3, the lower channel 1421 guides the movement of the solder ball, causing it to move in a straight line within the feeding channel 3. Furthermore, the outer periphery of the solder ball is filled with gas, suspending the solder ball in the gas and reducing the friction generated by the solder ball contacting the feeding channel 3. As a result, the solder ball can move forward faster and more smoothly, further reducing the time the solder ball moves inside the spray head body 1 and improving the spray welding efficiency.

[0060] like Figure 11 and Figure 12 As shown, a first connecting hole 121 connecting the first solenoid valve 81 and the material discharge control air passage 61, a second connecting hole 122 connecting the second solenoid valve 82 and the buffer control air passage 62, and a third connecting hole 123 connecting the third solenoid valve 83 and the air blowing passage 63 are respectively formed on the upper part 12, so that the material discharge control air passage 61 is connected to the ventilation passage 71 and the vacuum passage 72 respectively, and the buffer control air passage 62 is connected to the ventilation passage 71 and the vacuum passage 72 respectively.

[0061] In this embodiment, a feeding pipe 9 connected to the feeding channel 4 and a lens 101 connected to the longitudinal laser channel 10 are respectively provided on the upper part 12. The feeding pipe 9 is used for feeding, and at the same time, the laser passes through the lens 101 and accurately irradiates the solder ball along the longitudinal laser channel 10, so that the solder ball is heated and melted.

[0062] Of course, for ease of processing, a base block C (not shown in the attached drawings) can also be provided between the upper part 12 and the base block A13, and the first connecting hole 121, the first connecting hole 122 and the third connecting hole 123 are all provided on the base block C.

[0063] like Figure 4 and Figure 6As shown, a loading accumulation groove 631 is formed on the air blowing path 63 and below the loading channel 4, which mates with the lower end of the loading channel 4. The loading accumulation groove 631 has an elliptical cross-section, and the end of the feeding channel 3 extends below the loading accumulation groove 631 and coincides with the long axis of the loading accumulation groove 631. When the air blowing path 63 blows air onto the loading accumulation groove 631, the sidewalls of the elliptical loading accumulation groove 631 guide the airflow, causing the gas to flow along the sidewalls. In this way, airflow is formed in the middle and on both sides of the loading accumulation groove 631, thereby effectively blowing air onto the solder balls, which helps to disperse the accumulated solder balls and smoothly enter the feeding channel 3, thereby improving the efficiency of spray soldering.

[0064] like Figure 4 As shown, the angle formed between the longitudinal laser channel 10 and the longitudinal material dropping channel 2 is 2°-15°; preferably, the angle formed between the longitudinal laser channel 10 and the longitudinal material dropping channel 2 is 5°-10°; more preferably, the angle formed between the longitudinal laser channel 10 and the longitudinal material dropping channel 2 is 7.5°. Using an angle range of 2°-15° is the optimal angle range for allowing the solder balls to quickly and smoothly enter the longitudinal spray channel 111, which is beneficial for improving the speed of solder ball falling and spraying.

[0065] In this embodiment, as Figure 13 As shown, a pressure detection channel 112 connected to the longitudinal laser channel 10 is formed in the lower part 11. By installing a pressure sensor in this pressure detection channel, changes in air pressure within the longitudinal laser channel 10 can be detected, thereby determining whether there are solder balls in the spray head 5. The solder balls can then be controlled by the material dropping control mechanism to improve the accuracy of spray soldering.

[0066] like Figure 14 As shown, a cavity 51 is formed inside the nozzle 5, and a spray port 52 is formed at the lower end of the nozzle 5, communicating with the cavity. The width of the spray port 52 is smaller than the diameter of the solder ball. Thus, after the solder ball enters the nozzle 5 through the longitudinal feeding channel 2, it is stuck at the spray port 52 until the laser heats and melts the solder ball. Then, it is ejected from the spray port 52 by the air pressure from the longitudinal feeding channel 2, allowing the spray soldering to proceed smoothly. Simultaneously, an annular groove 53 is formed at the upper end of the nozzle and on the outer periphery of the cavity 51. This facilitates a tight connection between the nozzle 5 and the spray head body 1, preventing air leakage at the connection point and allowing the solder ball to move smoothly within the spray head body 1, thus improving the accuracy of the spray soldering.

[0067] To improve the compactness of the single-head ball-planting equipment structure and reduce manufacturing costs, such as Figure 4As shown, the ventilation channel 71 and the vacuum channel 72 are arranged side by side in the upper part 11 and extend along the direction of the feeding channel 3. A first insertion hole group 124 for the first solenoid valve 81 to be inserted, a second insertion hole group 125 for the second solenoid valve 82 to be inserted, and a third insertion hole group 126 for the third solenoid valve 83 to be inserted are formed on the upper part 12. The third insertion hole group 126 is close to one end of the feeding channel 4, and the first insertion hole group 124 is close to one end of the longitudinal discharge channel 2.

[0068] The above description is merely a preferred embodiment of the present invention and does not constitute any limitation on the technical scope of the present invention. Therefore, other structures obtained by using the same or similar technical features as the above embodiments of the present invention are all within the protection scope of the present invention.

Claims

1. A single-head laser welding nozzle, comprising a nozzle body, wherein a longitudinal material feeding channel, a feed channel connected to the longitudinal material feeding channel, and a longitudinal laser channel are respectively formed inside the nozzle body, and a feeding channel connected to the feed channel is formed on the nozzle body; a nozzle is disposed on the nozzle body, and the longitudinal material feeding channel and the longitudinal laser channel are respectively connected to the nozzle; simultaneously, a material feeding control mechanism is disposed on the nozzle body, the material feeding control mechanism comprising a material feeding control air path, a ventilation channel, and a vacuum channel, wherein the material feeding control air path, the ventilation channel, and the vacuum channel are respectively connected to a first solenoid valve, and the material feeding control air path is connected at the position where the feed channel and the longitudinal material feeding channel communicate, characterized in that, The main body of the injection head includes: Lower part: The longitudinal material discharge channel is formed in the lower part, the feeding channel is formed at the upper end of the lower part, and the nozzle is disposed at the lower end of the lower part; Upper part: It is located above the lower part, and the ventilation channel, vacuum channel and feeding channel are all formed in the upper part; A base block A: It is located between the upper and lower parts, and the material discharge control air passage is formed on the base block A; The material feeding control mechanism also includes a buffer control air path formed on the base block A and connected to the feeding channel. The buffer control air path, the vacuum channel and the ventilation channel are respectively connected to a second solenoid valve, which is located on the upper part. The material discharge control air path has a first vent corresponding to the position where the longitudinal material discharge channel and the feed channel are connected; the buffer control air path has a second vent corresponding to the feed channel; the end of the material discharge control air path near the first vent forms a first bend, the width of which gradually decreases from the bend to the first vent; the end of the buffer control air path near the second vent forms a second bend, the width of which gradually decreases from the bend to the second vent. The main body of the injection head also includes a base block B, which is disposed between the base block A and the lower part. The feeding channel is formed on the base block B, and a discharge port corresponding to the longitudinal discharge channel is formed on the feeding channel. The first vent is connected to the discharge port, and the second vent is connected to the feeding channel position near the discharge port. The longitudinal laser channel runs from top to bottom through the upper part, base block A, base block B, and lower part. The base block B includes an upper base block B and a lower base block B located below the upper base block B. The feeding channel is formed on the upper base block B, and a lower channel located below the feeding channel is formed on the lower base block B. The lower channel extends along the length direction of the feeding channel and is connected to the discharge port. The width of the lower channel is smaller than the width of the feeding channel.

2. The single-head jetting head for laser welding according to claim 1, characterized in that, The material feeding control mechanism also includes an air blowing passage formed on the base block A and connected to the feeding channel. The air blowing passage and the air passage are respectively connected to a third solenoid valve, which is located on the upper part.

3. The single-head jetting head for laser welding according to claim 2, characterized in that, The upper part has a first connecting hole connecting the first solenoid valve to the material discharge control air path, a second connecting hole connecting the second solenoid valve to the buffer control air path, and a third connecting hole connecting the third solenoid valve to the blowing air path; the upper part is also provided with a feeding pipe connected to the feeding channel and a lens connected to the longitudinal material discharge channel.

4. The single-head jetting head for laser welding according to claim 2, characterized in that, A feeding accumulation trough is formed on the air blowing path and below the feeding channel, which is matched with the lower end of the feeding channel. The cross-section of the feeding accumulation trough has an elliptical structure, and the end of the feeding channel extends to the lower part of the feeding accumulation trough and coincides with the long axis of the feeding accumulation trough.

5. The single-head jetting head for laser welding according to claim 1, characterized in that, The angle between the longitudinal laser channel and the longitudinal material feeding channel is 2°-15°.

6. The single-head jetting head for laser welding according to claim 1, characterized in that, A pressure detection channel is formed in the lower part, which is connected to the longitudinal laser channel.

7. The single-head jetting head for laser welding according to claim 1, characterized in that, A cavity is formed inside the nozzle, and a spray port connected to the cavity is formed at the lower end of the nozzle, wherein the width of the spray port is smaller than the diameter of the solder ball.