A signal adapter plate and method of connecting the same

Abstract

The application relates to a signal adapter plate and a connecting method thereof, which comprises an adapter plate body and a plurality of coaxial cable connecting pads, a plurality of connector connecting pads and a plurality of connectors arranged on the adapter plate body; the adapter plate body adopts a multilayer plate structure composed of a plurality of signal connecting layers; each coaxial cable connecting pad is connected with a corresponding signal connecting layer in a preset order, is used for welding coaxial cables of Dy8 signals and Dy5 signals led by all PMTs on one side of a plastic scintillator array detector of a dark matter particle detection satellite, and makes Dy8 signals and Dy5 signals led by each PMT distributed on different signal connecting layers; one end of each connector is welded on each connector connecting pad and is connected with each signal connecting layer through the connector connecting pad; and the other end of each connector is connected with each corresponding ASIC chip in a front-end electronic circuit board. The application can be widely applied in the field of satellite detectors.

Description

Technical Field

[0001] This invention belongs to the field of satellite technology, specifically relating to the connection technology of signal extraction from photomultiplier tubes of large detectors on satellites and front-end electronics. More particularly, it relates to a signal adapter board and its connection method, especially a signal adapter board and its connection method for a plastic scintillator array detector of a dark matter particle detection satellite. Background Technology

[0002] The plastic scintillator array detector of the Dark Matter Particle Explorer (DMP) satellite uses a photomultiplier tube (PMT) of model R4443. To cover the full dynamic range, this PMT is designed with a dual-stage readout method, where the 5th stage (Dy5) measures the large signal and the 8th stage (Dy8) measures the small signal. Since the gain of Dy8 is tens of times that of Dy5, the signal amplitudes differ significantly. Therefore, even slight fluctuations in the Dy8 signal can interfere with the Dy5 signal, necessitating a method to address the crosstalk problem.

[0003] Furthermore, the Dark Matter Particle Explorer (DMP) SCR array detector has a four-sided symmetrical structure, with each face containing 41 PMTs (Programmable Modules). Signals need to be connected to a front-end electronics circuit board of the DMP array detector via 82 coaxial cables. After the DMP array detector is fully assembled, the front-end electronics circuit board still requires various tests and program updates. To simplify the large-scale cable connections between the front-end electronics circuit board and the detector's PMT signal outputs, while simultaneously meeting the independent installation and testing requirements of both the front-end electronics circuit board and the PMTs in the detector, a new method for connecting the detector readout signals to the front-end electronics is needed to solve these problems. Summary of the Invention

[0004] To address the aforementioned problems, the present invention aims to provide a signal adapter board and its connection method. This signal adapter board is used for connecting the large-scale PM and front-end electronics circuit board of the plastic scintillator array detector of the Dark Matter Particle Explorer satellite. While simplifying the large-scale cable connection between the PMT and the front-end electronics, it can effectively solve the crosstalk problem between the two electrodes.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, the present invention provides a signal adapter board, comprising:

[0007] The adapter board body, and a number of coaxial cable connection pads, a number of connector connection pads, and a number of connectors disposed on the adapter board body.

[0008] The adapter board body adopts a multi-layer board structure composed of several signal connection layers;

[0009] Each of the coaxial cable connection pads is connected to the corresponding signal connection layer in a preset order to solder the coaxial cables of all the Dy8 and Dy5 signals led out from one side of the plastic scintillator array detector of the dark matter particle detection satellite, so that the Dy8 and Dy5 signals led out from each PMT are distributed on different signal connection layers.

[0010] Each connector is connected to the corresponding signal connection layer via the connector connection pad, and the other end of each connector is connected to the corresponding ASIC chip in the front-end electronics circuit board.

[0011] Furthermore, each of the aforementioned signal connection layers includes a signal layer and a ground layer arranged sequentially from top to bottom.

[0012] Furthermore, each of the coaxial cable connection pads includes a signal pad and a ground pad, and the signal pad is connected to the corresponding signal layer for soldering the core wire of the coaxial cable with Dy8 or Dy5 signal led out from each PMT; the ground pad is connected to the ground layer for soldering the ground wire of the coaxial cable with Dy8 or Dy5 signal led out from each PMT.

[0013] Furthermore, the number of coaxial cable connection pads is 84, of which 2 coaxial cable connection pads are used to solder temperature probes to test the temperature of the front-end electronics circuit board, and the remaining 82 coaxial cable connection pads are arranged in sequence according to the Dy8 and Dy5 signals of all PMTs on each side of the Dark Matter Particle Explorer (DMP) detector, and are used to solder the coaxial cables led out from the Dy8 and Dy5 signals of each PMT.

[0014] Furthermore, the 84 coaxial cable connection pads are arranged in several groups at intervals on the adapter board body, with each group containing 6-8 coaxial cable connection pads.

[0015] Furthermore, mechanical mounting holes are provided between the coaxial cable connection pads of each group for fixing the adapter plate body.

[0016] Furthermore, each of the coaxial cable connection pads has a coaxial cable binding hole on one side for binding the coaxial cable welded to each of the coaxial cable connection pads.

[0017] Furthermore, each of the connector connection pads is located in the middle of one side of the adapter board body, so that each of the connectors soldered thereon can be connected to the coaxial cables of the Dy8 and Dy5 signals led out from the PMT via the signal connection layer and the coaxial connection pads.

[0018] Furthermore, each of the connectors is provided with connector mounting holes on both sides of the connector pad for fixing the connector to the adapter board body.

[0019] Secondly, the present invention provides a method for connecting a signal adapter board, which includes the following steps:

[0020] The number of signal connection layers is determined according to the wiring requirements, and they are combined to form the adapter board body;

[0021] On the adapter board, the coaxial cable connection pads are arranged in the order of the Dy8 and Dy5 signals of each PMT in the plastic scintillator array detector of the Dark Matter Particle Explorer satellite, and each coaxial cable connection pad is connected to the corresponding signal connection layer.

[0022] Connector pads are arranged on one side of the middle part of the adapter board body, and each connector pad is connected to the corresponding signal connection layer.

[0023] The coaxial cables leading out from the Dy8 and Dy5 signals of each PMT in the Plastic Scintillator Array (PSA) of the Dark Matter Particle Explorer (DMP) satellite are soldered to the corresponding coaxial cable connection pads, so that the Dy8 and Dy5 signals of each PMT are distributed on different signal connection layers.

[0024] Solder each connector to its respective connector pad and connect it to the corresponding ASIC chip on the front-end electronics circuit board to complete the connection between the PMT output signals in the plastic scintillator array detector of the dark matter particle detection satellite and the front-end electronics circuit board.

[0025] The present invention has the following advantages due to the adoption of the above technical solutions:

[0026] 1. The adapter board proposed in this invention can be matched with the structure of the plastic scintillator array detector of the Dark Matter Particle Explorer satellite, so as to connect the 82 coaxial cables of the detector's PMT signal to the detector's front-end electronic circuit board, ensuring that the detector's front-end electronic circuit board and the detector's PMT can be installed and tested independently.

[0027] 2. The problem of crosstalk between channels of the front-end electronics ASIC chip caused by signals with different gains has been solved.

[0028] A novel design approach was adopted, simplifying the large-scale cable connections between the front-end electronics circuit board and the detector's PMT signal output. This ensures the stable performance of the detector's front-end electronics and meets the independent installation and testing requirements of both the front-end electronics circuit board and the detector's PMT. Different connectors are used to connect the Dy8 and Dy5 signals to different chips, avoiding crosstalk between channels of the front-end electronics ASIC chip caused by signals of different gains. This connection method provides structural stability, and the on-board product has withstood the harsh mechanical environment of launch and the complex on-orbit operating environment. This provides a concrete solution and valuable experience for designing and manufacturing large-scale cable connections between the front-end electronics circuit board and the detector's PMT signal output of a plastic scintillator array detector.

[0029] Therefore, this invention can be widely applied in the field of signal extraction from photomultiplier tubes and front-end electronics connection technology for large detectors on satellites. Attached Figure Description

[0030] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts. In the drawings:

[0031] Figure 1 This is a schematic diagram of the signal adapter board structure provided in an embodiment of the present invention;

[0032] The labels for the attached figures are as follows:

[0033] 1. Adapter board body; 2. Coaxial cable connection pad; 3. First connector; 4. Second connector; 5. Third connector; 6. Fourth connector; 7. Mechanical mounting hole; 8. Connector fixing mounting hole; 9. Coaxial cable binding hole. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention are within the scope of protection of the present invention.

[0035] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0036] This embodiment provides a signal adapter board for the plastic scintillator array detector of a dark matter particle detection satellite. On one hand, by using connectors on the signal adapter board to connect to the front-end electronics circuit board, independent testing and installation of the front-end electronics circuit board can be ensured. On the other hand, by connecting the Dy8 and Dy5 signals to different ASIC chips via connectors, crosstalk between channels of the front-end electronics ASIC chips caused by signals of different gains is avoided. A multi-layer board is used, distributing signals of different gains across different layers and separating them with ground planes to avoid crosstalk between layers. Pseudo-coaxial cable design is used for signal traces on the same layer to avoid crosstalk between signals on the same layer.

[0037] Correspondingly, some other embodiments of the present invention also provide a connection method for a signal adapter board for the plastic scintillator array detector of a dark matter particle detection satellite.

[0038] Example 1

[0039] like Figure 1 As shown, this embodiment provides a signal adapter board, which includes: an adapter board body 1 and several coaxial cable connection pads 2, several connector connection pads (not shown in the figure), and several connectors 3 to 6 disposed on the adapter board body 1. The adapter board body 1 adopts a multilayer board structure composed of several signal connection layers; each coaxial cable connection pad 2 is connected to the corresponding signal connection layer in a preset order, used to solder the coaxial cables leading out of all PMTs (Plastic Scintillator) on one side of the Dark Matter Particle Explorer (DMP) satellite's plastic scintillator array detector (PSA) for Dy8 or Dy5 signals, such that the Dy8 and Dy5 signals leading out of each PMT are distributed on different signal connection layers; the connectors 3 to 6 are connected to each signal connection layer via their respective connector connection pads, and the other end of each connector is connected to the corresponding ASIC chip in the front-end electronics circuit board.

[0040] In the above embodiments, preferably, each signal connection layer includes a signal layer and a ground layer, with the signal layer positioned on top for connecting to the core wire of the coaxial cable leading to the Dy8 or Dy5 signal from each PMT via coaxial cable connection pads; the ground layer is positioned below the signal layer for connecting to the ground wire of the coaxial cable leading to the Dy8 or Dy5 signal from each PMT via coaxial cable connection pads. The spacing between the signal layer and ground layer within the signal adapter board in this embodiment effectively avoids mutual induction of signals between layers.

[0041] In the above embodiments, preferably, each coaxial cable connection pad 2 includes a signal pad and a ground pad, and the signal pad is connected to the corresponding signal layer for soldering the core wire of the coaxial cable with Dy8 signal or Dy5 signal led out from each PMT; the ground pad is connected to the ground layer below the signal layer for soldering the ground wire of the coaxial cable with Dy8 signal or Dy5 signal led out from each PMT.

[0042] In the above embodiments, preferably, the number of coaxial cable connection pads is determined according to the number of PMTs to be connected.

[0043] For example, in this embodiment, each face of the plastic scintillator array detector of the Dark Matter Particle Explorer (DMP) satellite has 41 PMTs, and each PMT has two output signals: Dy8 signal and Dy5 signal. Therefore, in this embodiment, a total of 84 coaxial cable connection pads are set. Two of these coaxial cable connection pads are used to solder temperature probes to test the temperature of the front-end electronics circuit board. The remaining 82 coaxial cable connection pads are arranged in sequence according to the order of the Dy8 and Dy5 signals of all PMTs on each face of the DMP satellite's plastic scintillator array detector, and are used to solder the coaxial cables led out from the Dy8 and Dy5 signals of each PMT.

[0044] In the above embodiments, preferably, for ease of differentiation and connection, all coaxial cable connection pads are divided into several groups, with each group containing 6-8 coaxial cable connection pads. For example, in this embodiment, all coaxial cable connection pads are divided into 12 groups, with each group containing 7 coaxial cable connection pads.

[0045] In the above embodiments, preferably, a coaxial cable binding hole 7 is provided on one side of each coaxial cable connecting pad 2, which is used to bind the coaxial cable welded on each coaxial cable connecting pad 2, so as to avoid the coaxial cable being pulled by vibration during satellite launch and causing the coaxial cable to break at the weld.

[0046] In the above embodiments, preferably, mechanical mounting holes 8 are also provided between each group of coaxial cable connecting pads for fixing the signal adapter board to the corresponding mechanical structure on the detector.

[0047] In the above embodiments, preferably, the signal traces on the same layer adopt a pseudo-coaxial cable design to avoid crosstalk between signals.

[0048] In the above embodiments, preferably, each connector connection pad is located in the middle of one side of the adapter board body, so that each connector soldered thereon can be connected to the coaxial cable of Dy8 signal and Dy5 signal led out from PMT via the signal connection layer and coaxial connection pad, so as to avoid the circuit board wiring being too long and crossing each other.

[0049] For example, assuming there are four signal connection layers (four signal layers and four ground layers), and the Dy8 signal is distributed in the first and second signal connection layers, while the Dy5 signal is distributed in the third and fourth signal connection layers, then the core wires of the coaxial cables for the Dy8 signal led out from each PMT in the first and second signal connection layers are connected to the first connector 3; the core wires of the coaxial cables for the Dy8 signal led out from the PMT in the second and third signal connection layers are connected to the third connector 5; the core wires of the coaxial cables for the Dy5 signal led out from the PMT in the first and fourth signal connection layers are connected to the second connector 4; and the core wires of the coaxial cables for the Dy5 signal led out from the PMT in the second and third signal connection layers are connected to the fourth connector 7. The Dy8 and Dy5 signals from each PMT are connected to the corresponding ASIC chips through connectors to avoid Dy8 and Dy5 signals with different gains being connected to the same ASIC chip, which would cause crosstalk between the large and small signals of each channel.

[0050] In the above embodiments, preferably, each connector connection pad is further provided with connector fixing mounting holes 9 on both sides for fixing the connector to the adapter board body.

[0051] Example 2

[0052] Based on the signal adapter board provided in Embodiment 1, this embodiment provides a connection method for the signal adapter board, which includes the following steps:

[0053] 1) Determine the number of signal connection layers according to the wiring requirements, and assemble them to form the adapter board body;

[0054] 2) Arrange the coaxial cable connection pads on the adapter board body in the order of the Dy8 and Dy5 signals of each PMT in the plastic scintillator array detector of the Dark Matter Particle Explorer satellite, and make each coaxial cable connection pad connect to the corresponding signal connection layer.

[0055] 3) Arrange the connector connection pads on one side of the middle part of the adapter board body, and make each connector connection pad connect to the corresponding signal connection layer.

[0056] 4) Solder the coaxial cables leading out from the Dy8 and Dy5 signals of each PMT in the Plastic Scintillator Array (PSA) of the Dark Matter Particle Explorer (DMP) satellite to the corresponding coaxial cable connection pads, so that the Dy8 and Dy5 signals of each PMT are distributed on different signal connection layers.

[0057] 5) Solder each connector to its respective connector pad and connect it to the corresponding ASIC chip on the front-end electronics circuit board to complete the connection between the PMT output signals in the plastic scintillator array detector of the dark matter particle detection satellite and the front-end electronics circuit board.

[0058] The above embodiments are only used to illustrate the present invention. The structure, connection method and manufacturing process of each component can be varied. All equivalent transformations and improvements made on the basis of the technical solution of the present invention should not be excluded from the protection scope of the present invention.

Claims

1. A signal adapter board, characterized in that, include: The adapter board body, and a number of coaxial cable connection pads, a number of connector connection pads, and a number of connectors disposed on the adapter board body. The adapter board body adopts a multi-layer board structure composed of several signal connection layers; Each of the coaxial cable connection pads is connected to the corresponding signal connection layer in a preset order to solder the coaxial cables of all the Dy8 and Dy5 signals led out from one side of the plastic scintillator array detector of the dark matter particle detection satellite, so that the Dy8 and Dy5 signals led out from each PMT are distributed on different signal connection layers. One end of each connector is soldered to the connector connection pad and connected to the corresponding signal connection layer via the connector connection pad; the other end of each connector is connected to the corresponding ASIC chip in the front-end electronics circuit board. Each of the aforementioned signal connection layers includes a signal layer and a ground layer arranged sequentially from top to bottom; Each of the coaxial cable connection pads includes a signal pad and a ground pad. The signal pad is connected to the corresponding signal layer and is used to solder the core wire of the coaxial cable for the Dy8 signal or Dy5 signal led out from each PMT. The ground pad is connected to the ground layer and is used to solder the ground wire of the coaxial cable for the Dy8 signal or Dy5 signal led out from each PMT.

2. The signal adapter board as described in claim 1, characterized in that, The number of coaxial cable connection pads is 84. Two of the coaxial cable connection pads are used to solder temperature probes to test the temperature of the front-end electronics circuit board. The remaining 82 coaxial cable connection pads are arranged in sequence according to the Dy8 and Dy5 signal order of all PMTs on this side of the Dark Matter Particle Explorer (DMP) detector, and are used to solder the coaxial cables led out from the Dy8 and Dy5 signals of each PMT.

3. A signal adapter board as described in claim 2, characterized in that, The 84 coaxial cable connection pads are arranged in several groups at intervals on the adapter board body, with 6-8 coaxial cable connection pads in each group.

4. A signal adapter board as described in claim 3, characterized in that, Mechanical mounting holes are also provided between the coaxial cable connection pads of each group for fixing the adapter plate body.

5. A signal adapter board as described in claim 1, characterized in that, Each of the coaxial cable connection pads has a coaxial cable binding hole on one side for binding the coaxial cable soldered on each of the coaxial cable connection pads.

6. A signal adapter board as described in claim 1, characterized in that, Each of the connector connection pads is located in the middle of one side of the adapter board body, so that each of the connectors soldered thereon can be connected to the coaxial cables of the Dy8 and Dy5 signals led out from the PMT via the signal connection layer and the coaxial cable connection pads.

7. A signal adapter board as described in claim 1, characterized in that, Each connector has connector mounting holes on both sides of its connecting pad for fixing the connector to the adapter board body.

8. A connection method for a signal adapter board as described in any one of claims 1 to 7, characterized in that... Includes the following steps: The number of signal connection layers is determined according to the wiring requirements, and they are combined to form the adapter board body; On the adapter board, the coaxial cable connection pads are arranged in the order of the Dy8 and Dy5 signals of each PMT in the plastic scintillator array detector of the Dark Matter Particle Explorer satellite, and each coaxial cable connection pad is connected to the corresponding signal connection layer. Connector pads are arranged on one side of the middle part of the adapter board body, and each connector pad is connected to the corresponding signal connection layer. The coaxial cables leading out from the Dy8 and Dy5 signals of each PMT in the Plastic Scintillator Array detector of the Dark Matter Particle Explorer satellite are soldered to the corresponding coaxial cable connection pads, so that the Dy8 and Dy5 signals of each PMT are distributed on different signal connection layers. Solder each connector to its respective connector pad and connect it to the corresponding ASIC chip on the front-end electronics circuit board to complete the connection between the PMT output signals in the plastic scintillator array detector of the dark matter particle detection satellite and the front-end electronics circuit board.

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