System and method for manufacturing composite structures

Abstract

Systems and methods for manufacturing composite structures are disclosed. A system for manufacturing a composite structure includes a layup carrier including a layup support surface configured to support at least one composite material layup. The system includes a carrier transfer device configured to transfer the layup carrier. The system includes a lamination system configured to selectively apply the at least one composite material layup to the layup support surface of the layup carrier. The system includes a transfer system configured to remove the layup carrier from the carrier transfer device and apply the at least one composite material layup to at least a portion of a forming surface of a forming tool. The system includes a forming system configured to form the at least one composite material layup over the at least a portion of the forming surface of the forming tool.

Description

Technical Field

[0001] This disclosure generally relates to the fabrication of composite structures, and more specifically to systems and methods capable of forming composite structures layer by layer. Background Technology

[0002] Molded composite structures are commonly used in applications requiring lightweight and high strength, such as aircraft and vehicles. These applications typically utilize contoured parts that must be molded and then cured. The conventional formation of composite structures, especially relatively large ones or those with complex contours, requires significant manual labor before curing. For example, composite fiber layups (e.g., pre-impregnated fiber layups or dry fabrics) are placed by hand over a forming tool or mandrel. The part is then typically cured by heating. The resulting part conforms to the shape of the forming tool. However, the manual laying of fiber layups is both time-consuming and labor-intensive.

[0003] Several known composite material manufacturing processes attempt to automate part-forming operations. As an example, the overhang forming process involves heating a laminate of pre-impregnated fiber layups (“composite charge”) and applying pressure around a mandrel using a vacuum bag. However, this approach has limited success with thick laminates or more complex shapes. As another example, a compactor can be used to press the composite charge onto a tooling surface during manufacturing. However, this method typically requires manual forming after compaction once the tooling surface and the resulting structural profile are formed. Therefore, while these methods may be effective for forming relatively small and thin composite structures or those with relatively simple shapes, they can be inefficient when applied to forming large composite structures or those with more complex shapes.

[0004] Therefore, those skilled in the art continue their research and development work in the field of composite material manufacturing, and more specifically, continue to focus on the manufacture of relatively large and / or relatively complex composite structures. Summary of the Invention

[0005] Examples of a system for manufacturing composite structures and a method for manufacturing composite structures are disclosed. The following is a non-exhaustive list of examples that may or may not be claimed based on the subject matter of this disclosure.

[0006] In one example, the system includes a layup carrier comprising a layup support surface configured to support at least one composite layup. The system includes a carrier transfer device configured to convey the layup carrier. The system includes a lamination system configured to selectively apply at least one composite layup to the layup support surface of the layup carrier. The system includes a transfer system configured to remove the layup carrier from the carrier transfer device and apply at least one composite layup to at least a portion of a forming surface of a forming tool. The system includes a forming system configured to form at least one composite layup over at least a portion of the forming surface of the forming tool.

[0007] In another example, the system includes a layup carrier having a layup support surface. The system includes a carrier transfer device configured to support the layup carrier. The system includes a lamination system, a transfer system sequentially associated with the lamination system, and a forming system sequentially associated with the transfer system. The system includes a controller. The controller is programmed to selectively transfer the layup carrier to the lamination system using the carrier transfer device. The controller is programmed to selectively apply at least one composite layup to the layup support surface of the layup carrier using the lamination system. The controller is programmed to selectively transfer the layup carrier from the lamination system to the transfer system using the carrier transfer device. The controller is programmed to remove the layup carrier from the carrier transfer device using the transfer system and apply at least one composite layup to at least a portion of the forming surface of a forming tool. The controller is programmed to form at least one composite layup over at least a portion of the forming surface of the forming tool using the forming system.

[0008] In one example, the method includes the following steps: (1) transferring a layup carrier to a lamination system using a carrier transfer device; (2) selectively applying at least one composite material layup to a layup support surface of the layup carrier using the lamination system; (3) transferring the layup carrier from the lamination system to a transfer system using a carrier transfer device; (4) removing the layup carrier from the carrier transfer device using the transfer system and applying at least one composite material layup to at least a portion of a forming surface of a forming tool; and (5) forming at least one composite material layup over at least a portion of the forming surface of the forming tool using the forming system.

[0009] Other examples of the disclosed systems and methods will become apparent from the following detailed description, the accompanying drawings, and the appended claims. Attached Figure Description

[0010] Figure 1 This is a schematic block diagram of an example of a system for manufacturing composite structures;

[0011] Figure 2This is a schematic diagram of an example of a system used to manufacture composite structures;

[0012] Figure 3 This is a schematic diagram of an example of a system used to manufacture composite structures;

[0013] Figure 4 This is a schematic diagram of an example of a system used to manufacture composite structures;

[0014] Figure 5 This is a schematic perspective view of an example of a layup carrier and carrier transfer device for a system used to manufacture composite structures;

[0015] Figure 6 This is a schematic front view of an example of a layup carrier and carrier transfer device for a system used to manufacture composite structures;

[0016] Figure 7 This is a schematic plan view of an example of a vacuum stage for a carrier transfer device;

[0017] Figure 8 This is a schematic plan view of an example of the base plate of a plywood carrier;

[0018] Figure 9 This is a schematic diagram of an example of a positioning system used to manufacture composite structures and an indexing device of the system;

[0019] Figure 10 This is a schematic flowchart illustrating an example of a system used to manufacture composite structures;

[0020] Figure 11 This is a schematic flowchart illustrating another example of a system for manufacturing composite structures;

[0021] Figure 12 This is a flowchart illustrating an example of a method for manufacturing composite structures;

[0022] Figure 13 It is a schematic diagram of an aircraft that includes at least one composite structure;

[0023] Figure 14 yes Figure 15 A schematic diagram of an example of the wings of the aircraft shown; and

[0024] Figure 15 It is a flowchart of aircraft manufacturing and maintenance methods. Detailed Implementation

[0025] The following detailed description refers to the accompanying drawings, which illustrate specific examples described in this disclosure. Other examples with different structures and operations do not depart from the scope of this disclosure. The same reference numerals may refer to the same features, elements, or components in different drawings. Throughout this disclosure, any one of a plurality of items may be referred to individually as an item, and the plurality of items may be collectively referred to as items and may be represented by the same reference numerals. Furthermore, as used herein, features, elements, components, or steps beginning with the word "a" or "an" should be understood to not exclude multiple features, elements, components, or steps, unless such exclusion is expressly stated.

[0026] The following are illustrative, non-exhaustive examples that may, but are not necessarily, claim protection under the subject matter of this disclosure. References to “example” herein mean that one or more features, structures, elements, components, characteristics, and / or operating steps described in connection with that example are included in at least one aspect, embodiment, and / or implementation of the subject matter of this disclosure. Therefore, the phrases “an example,” “another example,” “one or more examples,” and similar language throughout this disclosure may, but do not necessarily, refer to the same example. Furthermore, the subject matter characterizing any example may, but does not necessarily include the subject matter characterizing any other example. Moreover, the subject matter characterizing any example may, but does not necessarily, be combined with the subject matter characterizing any other example.

[0027] This disclosure recognizes that conventional automated processes, which use automated equipment to flatten the charge (e.g., all layers of CFRP) and then automatically form it, can suffer from tow-related problems. For example, during the forming operation, the fibers may deform, resulting in structural wrinkles and a decrease in strength. This decrease may necessitate the addition of more material to address the structural strength reduction. Consequently, additional inspections may be required, potentially resulting in heavier and less structurally efficient structures, and potentially incurring additional costs. As another example, the lamination and forming cycle times in conventional methods are often different, causing lamination and forming to occur in series. This asynchronous cycle time and serial processing can result in queuing areas between processes and less parallel processing.

[0028] General reference Figures 1-14 By way of example, this disclosure relates to a system for manufacturing a composite structure (referred to herein as "system" 100), a method for manufacturing a composite structure (referred to herein as "method" 1000), and a composite structure 102 manufactured using system 100 or according to method 1000.

[0029] Examples of system 100 and method 1000 enable the automated manufacturing of composite structure 102, and more specifically, the automated manufacturing of at least one composite layup 106 and the formation of at least one composite layup 106 over a forming tool 120 used to manufacture composite structure 102. Automation of the manufacturing process can reduce processing time, labor and costs, and / or reduce process variations (e.g., human error) that could lead to undesirable inconsistencies in the finished composite structure compared to conventional composite manufacturing. System 100 and method 1000 are also capable of applying and forming composite materials ply-by-ply to manufacture composite structure 102. Ply-by-ply forming facilitates the manufacture of large composite structures, thick composite structures, and / or composite structures with complex shapes. Ply-by-ply forming can also reduce buckling or wrinkling of the layups within the composite structure compared to conventional composite manufacturing. As disclosed herein, ply-by-ply forming can also provide structurally more efficient composite structures (e.g., reduced or eliminated wrinkles). As disclosed herein, layer-by-layer forming can also provide improved efficiency by utilizing more efficient concurrent parallel processing in terms of weight, recurring costs and non-recurring costs, as production is scaled up for higher rates.

[0030] Typically, a composite layup comprises a single layer (e.g., a single layer thickness) of a composite material. The composite material can take the form of any of a variety of suitable types of composite materials having any of a variety of layup angles. In one or more examples, composite layup 106 is formed by laminating multiple unidirectional composite strips pre-impregnated with a resin matrix. In this disclosure, unless otherwise expressly stated, the phrase "composite layup" refers to at least one layup of a composite material. Composite layup 106 may also be referred to as a composite patch or composite charge.

[0031] System 100 includes multiple subsystems that facilitate and correspond to different manufacturing operations associated with the manufacture of composite structure 102. The subsystems of system 100 are interconnected and cooperate to automate at least a portion of the manufacturing process. Throughout this disclosure, the subsystems of the disclosed system 100 may be referred to as the "system" itself or as stations in which one or more manufacturing operations occur.

[0032] Examples of the system 100 and method 1000 described herein utilize multiple semi-automatic or automated subsystems to perform ply-by-ply formation and compaction of individual composite plies 106 on a forming tool 120. Ply-by-ply formation refers to laying the composite plies 106 onto the forming tool 120 in a predetermined sequence and / or predetermined ply angle, and compacting the composite plies 106 individually onto the forming tool 120 after laying each composite ply 106 or after laying more than one composite ply 106.

[0033] refer to Figures 1-4 These examples schematically illustrate examples of the disclosed system 100. In one or more examples, system 100 includes a lamination system 112 (e.g., a lamination subsystem or station), a transfer system 116 (e.g., a transfer subsystem or station), and a forming system 122 (e.g., a forming subsystem or station). In one or more examples, system 100 also includes a trimming system 114 (e.g., a trimming subsystem or station) and a waste removal system 142 (e.g., a waste removal subsystem of a station). In one or more examples, system 100 further includes a film removal system 160 (e.g., a film removal subsystem or station). In one or more examples, system 100 additionally includes a carrier preparation system 162 (e.g., a carrier preparation subsystem or station). In one or more examples, system 100 also includes a positioning system 144 (e.g., a positioning subsystem).

[0034] System 100 includes a layup carrier 104. The layup carrier 104 receives a composite layup 106 thereon. For example, the layup carrier 104 includes a layup support surface 108. The layup support surface 108 is configured to support the composite layup 106. Typically, the layup carrier 104 is movable relative to individual subsystems or stations of system 100. Once at least one composite layup 106 is formed on the layup carrier 104, the layup carrier 104 facilitates the sequential transfer of the composite layup 106 to various subsystems or stations of system 100.

[0035] In one or more examples, system 100 includes a carrier transfer device 110. The carrier transfer device 110 is configured to transfer the layup carrier 104. For example, the carrier transfer device 110 includes or takes the form of a moving platform that supports the layup carrier 104 and moves the layup carrier 104 between subsystems of system 100 that perform composite material layup manufacturing operations in the composite material manufacturing process.

[0036] In one or more examples, system 100 includes a tool transfer device 146. The tool transfer device 146 is configured to transfer the forming tool 120. For example, the tool transfer device 146 includes or takes the form of a moving platform that supports the forming tool 120 and moves the forming tool 120 between subsystems of system 100 that perform composite structure manufacturing operations in the composite material manufacturing process.

[0037] Now for reference Figure 5 , Figure 5An example of a layup carrier 104 and a carrier transfer device 110 is schematically shown. In one or more examples, the layup carrier 104 includes a base plate 124 and a film 126 located on the base plate 124. In these examples, the film 126 forms a layup support surface 108. In other examples, the layup carrier 104 may not include the film 126. In these examples, the base plate 124 forms the layup support surface 108.

[0038] A base plate 124 provides a support structure for manufacturing the composite layup 106. Typically, the base plate 124 is relatively thin and substantially flat, or at least has a substantially flat surface to which the film 126 is attached or forms a layup support surface 108. In one or more examples, the base plate 124 is made of a flexible material. In one or more examples, the base plate 124 is made of an elastic material. The base plate 124 facilitates the transfer and application of the composite layup 106 to the forming tool 120. The base plate 124 is capable of deforming during the application (e.g., stamping) of the composite layup 106 to the forming tool 120 and then returning to its original (e.g., substantially flat) shape. Therefore, in production, the base plate 124 can be reused to manufacture and apply multiple composite layups 106, thereby reducing equipment and material costs.

[0039] In one or more examples, the base plate 124 is made of a metallic material. As an example, the base plate 124 comprises a sheet of metal or takes the form of a sheet of metal, such as a spring steel sheet. In other examples, the base plate 124 may be made of any other suitable material. In one or more examples, the base plate 124 is made of a material that is sufficiently flexible and resilient to allow the profile of the base plate 124 to be shaped during the application of the composite layup 106 to the forming tool 120.

[0040] Film 126 provides a contact surface on which composite layup 106 is fabricated. Typically, film 126 is a relatively thin and flexible sheet of material covering base plate 124. Film 126 facilitates the fabrication of composite layup 106 and its application and formation over forming tool 120. Film 126 provides a working surface on which composite layup 106 is formed and temporarily held. Film 126 is deformable during the application and formation of composite layup 106 over forming tool 120. After composite layup 106 is formed over forming tool 120, film 126 is also removeable from composite layup 106.

[0041] Typically, the film 126 has surface properties that allow the composite layup 106 to temporarily adhere to the film 126 via the resin matrix, thereby holding the composite layup 106 on the layup support surface 108, but allowing the film 126 to be removed from the composite layup 106 after formation. The film 126 provides protection for the composite layup 106 during application to and formation of the composite layup 106 over the forming tool 120. The film 126 also provides stability to the composite layup 106.

[0042] In one or more examples, film 126 is made of a plastic material, such as a thermoplastic material. As an example, film 126 includes or takes the form of a polyethylene sheet, such as a yellow polyethylene sheet. In one or more examples, film 126 is made of fluorinated ethylene propylene (FEP) or ethylene tetrafluoroethylene (ETFE). In one or more examples, film 126 is a release film, such as a polyester release film with high modulus and low elongation, which provides a substantially flat contact surface compatible with most resin systems and adhesives. In one or more examples, film 126 is made of metal foil. In other examples, film 126 may be made of any other suitable material.

[0043] Before the composite layup 106 is fabricated, the film 126 is releasably attached to the base plate 124. The film 126 remains attached to the base plate 124 during the fabrication of the composite layup 106, during the transfer of the composite layup 106, and during the application of the composite layup 106 to the forming tool 120. After the composite layup 106 is applied to the forming tool 120, the film 126 is released from the base plate 124. The film 126 can be releasably attached to the base plate 124 via any of a variety of suitable techniques.

[0044] refer to Figures 5-8 , Figures 5-8 Examples of carrier transfer device 110 and layup carrier 104 are schematically illustrated. In one or more examples, film 126 is releasably coupled to base plate 124 via vacuum holding. In these examples, base plate 124 facilitates vacuum movement through layup carrier 104 and engagement of film 126. For example, carrier transfer device 110 includes vacuum stage 130 (e.g., Figures 5-7 And the base plate 124 includes a plurality of vacuum holes 128 (e.g., Figure 8Multiple vacuum holes 128 allow vacuum movement through the base plate 124. With the layup carrier 104 positioned on the carrier transfer device 110, the vacuum stage 130 is in fluid communication with the multiple vacuum holes 128. The vacuum stage 130 includes a perforated top and a vacuum chamber in fluid communication with a vacuum source. The vacuum stage 130 is configured to apply a holding vacuum to the multiple vacuum holes 128 of the base plate 124 to temporarily hold and retain the film 126 on the base plate 124.

[0045] In one or more examples, the carrier transfer device 110 includes parts and components (e.g., vacuum sources, vacuum ports, conduits, actuators, valves, etc.) capable of generating, applying, and selectively controlling a vacuum. The vacuum source (e.g., a vacuum pump) may be a component of system 100 or part of a subsystem of system 100 (e.g., positioning system 144). Alternatively, the vacuum source may be an integral part of the carrier transfer device 110. In production, a vacuum stage 130 provides a maintaining vacuum, which is then applied to the diaphragm 126 through a plurality of vacuum holes 128 formed in a base plate 124.

[0046] In one or more examples, the vacuum stage 130 includes a plurality of vacuum zones 204. Each of the plurality of vacuum zones 204 is controllable to selectively direct vacuum onto a set of corresponding vacuum holes 128 located above the respective vacuum zone 204. Figure 10 Vacuum is applied and removed. For example, each of the plurality of vacuum zones 204 includes a valve 206 that selectively opens or closes to control the application of vacuum to the corresponding vacuum zone 204. Vacuum zones 204 enable vacuum stage 130 to apply vacuum where it is necessary to hold the film 126 on the substrate 124. Vacuum zones 204 also enable vacuum stage 130 to stop applying vacuum to select areas of substrate 124, such as during the removal of waste residue from composite layup 106 after trimming operations. Vacuum stage 130 and a plurality of vacuum holes 128 formed in substrate 124 are arranged to adequately distribute sufficient holding vacuum to hold the film 126 on the surface of substrate 124 during the movement of layup carrier 104 through system 100.

[0047] In one or more examples, the vacuum stage 130 includes a plurality of lip seals 208. Each lip seal 208 is located between adjacent vacuum zones 204. For example, the lip seal 208 forms the outer boundary of the vacuum zones 204 and isolates each of the vacuum zones 204 from its adjacent counterpart. The plurality of lip seals 208 provide a sealing interface with the base plate 124 without affecting the surface flatness of the vacuum stage 130.

[0048] like Figure 5 and Figure 6As shown, in one or more examples, the layup carrier 104 also includes a gasket 136. The gasket 136 is attached to the substrate 124. Typically, the gasket 136 is a relatively thin sheet of material covering the substrate 124. For example, the gasket 136 is attached to and covers the surface of the substrate 124 and is located between the substrate 124 and the film 126. The gasket 136 can be attached to the substrate 124 by any of a variety of techniques, such as via adhesive bonding, mechanical fasteners, etc. In these examples, the film 126 is positioned on the gasket 136, and the gasket 136 provides a contact surface for applying the film 126 thereon.

[0049] In one or more examples, the gasket 136 may be maintained by vacuum permeation. The gasket 136 facilitates the distribution of the maintaining vacuum from the plurality of vacuum holes 128 to the membrane 126. The gasket 136 also prevents the membrane 126 from forming indentations or wrinkles at the plurality of vacuum holes 128 in response to the application of the maintaining vacuum.

[0050] In one or more examples, the gasket 136 is made of a porous plastic material, such as a porous thermoplastic. As one example, the gasket 136 comprises a polypropylene sheet or is in the form of a polypropylene sheet. As another example, the gasket 136 comprises a high-density polyethylene sheet or is in the form of a high-density polyethylene sheet. As yet another example, the gasket 136 is a single sheet. The porous polymer fluidizing medium is commercially available from the Porvair Filtration Group. In other examples, the liner 136 can be made of any other suitable material, such as a flexible material that allows vacuum to pass through the liner itself and can be used as a cutting surface.

[0051] refer to Figure 5 , Figure 7 and Figure 8 In one or more examples, system 100 includes an indexing structure 140. The indexing structure 140 is configured to operatively position the ply carrier 104 at a designated location on the carrier transfer device 110. In one or more examples, the indexing structure 140 includes mating components located on a base plate 124 of the carrier transfer device 110 and the ply carrier 104. For example, the carrier transfer device 110 includes at least one indexing pin 200 (e.g., at least two indexing pins 200), and the base plate 124 includes at least one indexing hole 202 corresponding to the indexing pin 200 (e.g., at least two indexing holes 202). The indexing pin 200 and the indexing hole 202 cooperate to position the ply carrier 104 on the carrier transfer device 110.

[0052] Now for reference Figures 2-4The subsystems of system 100 are typically arranged within a manufacturing environment in a sequence of operation relative to each other. In one or more examples, lamination system 112 is sequentially associated with carrier preparation system 162. In one or more examples, trimming system 114 is sequentially associated with lamination system 112. In one or more examples, waste removal system 142 is sequentially associated with trimming system 114. In one or more examples, transfer system 116 is sequentially associated with waste removal system 142. In one or more examples, forming system 122 is sequentially associated with transfer system 116. In one or more examples, film removal system 160 is sequentially associated with forming system 122.

[0053] It should be recognized that not every subsystem is necessary, or that some subsystems may not be used in every implementation of the disclosed system 100. For example, in some implementations, the carrier preparation system 162, trimming system 114, and / or waste removal system 142 may not be used in the fabrication of the composite structure 102, and therefore may not be included as subsystems within system 100. Thus, in one or more examples, the transfer system 116 is sequentially associated with the lamination system 112.

[0054] It should also be recognized that one or more subsystems may be located in the same area or otherwise share the same operating station of system 100. As an example, trimming system 114 and waste removal system 142 may share a location in the manufacturing environment or be part of the same operating station of system 100. Therefore, it may not be necessary to move the layup carrier 104 from trimming system 114 to waste removal system 142 (e.g., between trimming and waste removal operations), thereby reducing cycle time. As another example, forming system 122 and film removal system 160 may share a location in the manufacturing environment or be part of the same operating station of system 100. Therefore, it may not be necessary to move the forming tool 120 from forming system 122 to film removal system 160 (e.g., between forming and film removal operations), thereby reducing cycle time.

[0055] In one or more examples, carrier transfer device 110 conveys layup carrier 104 to carrier preparation system 162 to prepare layup carrier 104. In one or more examples, carrier transfer device 110 conveys layup carrier 104 from carrier preparation system 162 to lamination system 112 to apply composite layup 106 to layup carrier 104. In one or more examples, carrier transfer device 110 conveys layup carrier 104 and composite layup 106 supported on layup carrier 104 from lamination system 112 to trimming system 114 to cut composite layup 106. In one or more examples, carrier transfer device 110 conveys layup carrier 104 and composite layup 106 supported on layup carrier 104 from trimming system 114 to waste removal system 142 to remove residue (e.g., waste composite) from layup carrier 104 after cutting. In one or more examples, carrier transfer device 110 transfers layup carrier 104 and composite layup 106 supported on layup carrier 104 from trimming system 114 to transfer system 116 to apply composite layup 106 onto forming tool 120.

[0056] Alternatively, in one or more examples, such as when no trimming operation is performed, the carrier transfer device 110 transfers the layup carrier 104 and the composite layup 106 supported on the layup carrier 104 directly from the lamination system 112 to the transfer system 116.

[0057] In one or more examples, tool transfer device 146 conveys forming tool 120 to transfer system 116 to apply composite layup 106 onto forming tool 120. In one or more examples, tool transfer device 146 conveys forming tool 120 and composite layup 106 applied to forming tool 120 from transfer system 116 to forming system 122 to form and compact composite layup 106 over forming tool 120. In one or more examples, tool transfer device 146 conveys forming tool 120 and composite layup 106 formed over forming tool 120 from forming system 122 to film removal system 160 to remove film 126 from composite layup 106.

[0058] Positioning system 144 can be any suitable system that guides carrier transfer device 110 and tool transfer device 146 along a predetermined workflow or path. In one or more examples, positioning system 144 is configured to selectively position carrier transfer device 110 relative to various subsystems or workstations of system 100 (e.g., carrier preparation system 162, lamination system 112, trimming system 114, waste removal system 142, and transfer system 116). In one or more examples, positioning system 144 is configured to selectively position tool transfer device 146 relative to various subsystems or workstations of system 100 (e.g., transfer system 116, forming system 122, and film removal system 160).

[0059] In one or more examples, such as Figures 2-5 As shown, the positioning system 144 includes a rail assembly 168 or similar conveyor assembly that physically guides the carrier transfer device 110 and the tool transfer device 146 through the system 100. In these examples, the carrier transfer device 110 and the tool transfer device 146 may include a trolley, pallet, carrier, or similar platform configured to travel along the rail assembly 168. Thus, in these examples, the positioning system 144, the carrier transfer device 110, and the tool transfer device 146 include cooperating parts and components (e.g., drive motors, tracks, actuators, gears, wheels, sensors, etc.) capable of selectively controlling the transport of the carrier transfer device 110 and the tool transfer device 146 along the positioning system 144.

[0060] In one or more examples, the guide rail assembly 168 includes parts and components (e.g., rack and pinion assemblies, roller tables, gauges, etc.) that allow for precise control of the movement of the carrier transfer device 110 and the tool transfer device 146 by the system 100. Therefore, the positioning system 144 can be configured to index the carrier transfer device 110 and the tool transfer device 146 at multiple predetermined locations relative to respective subsystems or workstations of the system 100.

[0061] refer to Figure 9In one or more examples, system 100 includes an indexing device 148. For example, system 100 may include a plurality of indexing devices 148 positioned along positioning system 144. As an example, at least one indexing device 148 is located at each of the subsystems or workstations of system 100 along guide assembly 168. In one or more examples, the indexing device 148 is configured to operatively position carrier transfer device 110 at a plurality of designated locations, for example, relative to at least one of carrier preparation system 162, lamination system 112, trimming system 114, waste removal system 142, and transfer system 116. In one or more examples, the indexing device 148 is configured to operatively position tool transfer device 146 at a plurality of designated locations, for example, relative to at least one of transfer system 116, forming system 122, and film removal system 160.

[0062] In one example, the indexing device 148 includes parts and components (e.g., actuators, indexing pins, sensors, etc.) that enable the indexing device 148 to automatically detect and index the carrier transfer device 110 and the tool transfer device 146.

[0063] refer to Figure 10 In one or more examples, the positioning system 144 includes a linear carrier guide 150. The linear carrier guide 150 is configured to operatively translate the carrier transfer device 110 through a subsystem or workstation of the system 100, for example, along a linear workflow path. For example, a portion of the guide rail assembly 168 dedicated to conveying the carrier transfer device 110 is a linear segment with discrete ends. In these examples, the positioning system 144 is configured to selectively move the carrier transfer device 110 along the X-axis.

[0064] In one or more examples, during operation, the carrier transfer device 110 moves along the linear carrier guide 150 in a first direction from the carrier preparation system 162 to the lamination system 112. The carrier transfer device 110 then moves along the linear carrier guide 150 in the first direction from the lamination system 112 to the trimming system 114 and the waste removal system 142. The carrier transfer device 110 then moves along the linear carrier guide 150 in the first direction from the waste removal system 142 to the transfer system 116. Alternatively, as described above, for example when the trimming system 114 and the waste removal system 142 are not used or included in system 100, the carrier transfer device 110 moves directly along the linear carrier guide 150 in the first direction from the lamination system 112 to the transfer system 116. After the composite layup 106 is applied to the forming tool 120, and after the layup carrier 104 is returned to the carrier transfer device 110, the carrier transfer device 110 then moves from the transfer system 116 to the carrier preparation system 162 along the linear carrier guide 150 in a second direction opposite to the first direction, through the waste removal system 142, the trimming system 114 and the lamination system 112, wherein the process is repeated to manufacture and transfer the subsequent composite layup 106.

[0065] In one or more examples, the positioning system 144 includes a linear tool guide 152. The linear tool guide 152 is configured to operatively translate the tool transfer device 146 through a subsystem or workstation of system 100, for example, along a linear workflow path. For example, a portion of the guide rail assembly 168 dedicated to conveying the tool transfer device 146 is a linear segment with discrete ends. In these examples, the positioning system 144 is configured to selectively move the tool transfer device 146 along an X-axis.

[0066] In one or more examples, during operation, the tool transfer device 146 moves along the linear tool guide 152 in a first direction to the transfer system 116. The tool transfer device 146 then moves along the linear tool guide 152 in the first direction from the transfer system 116 to the forming system 122. The tool transfer device 146 then moves along the linear tool guide 152 in the first direction from the forming system 122 to the film removal system 160. The tool transfer device 146 then moves along the linear tool guide 152 in a second direction opposite to the first direction from the film removal system 160 back to the transfer system 116 via the forming system 122, wherein the process is repeated to apply and form subsequent composite material layups 106.

[0067] refer to Figure 11In one or more examples, the positioning system 144 includes a closed-loop carrier guide 154. The closed-loop carrier guide 154 is configured to operatively circulate the carrier transfer device 110, for example, along a continuous workflow path through a subsystem or workstation of system 100. For example, a portion of the guide rail assembly 168 dedicated to conveying the carrier transfer device 110 is a continuous loop. In these examples, the positioning system 144 is configured to selectively move the carrier transfer device 110 along the X-axis and Y-axis.

[0068] In one or more examples, during operation, the carrier transfer device 110 moves from the carrier preparation system 162 to the lamination system 112 along the closed-loop carrier guide 154 in a first direction. The carrier transfer device 110 then moves from the lamination system 112 to the trimming system 114 and the waste removal system 142 along the closed-loop carrier guide 154 in the first direction. The carrier transfer device 110 then moves from the waste removal system 142 to the transfer system 116 along the closed-loop carrier guide 154 in the first direction. Alternatively, as described above, for example when the trimming system 114 and the waste removal system 142 are not used or are included in system 100, the carrier transfer device 110 moves directly from the lamination system 112 to the transfer system 116 along the closed-loop carrier guide 154 in the first direction. After the composite layup 106 is applied to the forming tool 120, and after the layup carrier 104 is returned to the carrier transfer device 110, the carrier transfer device 110 is then moved from the transfer system 116 back to the carrier preparation system 162 along the closed-loop carrier guide 154 in the first direction, wherein the process is repeated to manufacture and transfer the subsequent composite layup 106.

[0069] In one or more examples, positioning system 144 includes a closed-loop tool guide 156. The closed-loop tool guide 156 is configured to operatively circulate the tool transfer device 146, for example, along a continuous workflow path through a subsystem or workstation of system 100. For example, a portion of the guide rail assembly 168 dedicated to conveying the tool transfer device 146 is a continuous loop. In these examples, positioning system 144 is configured to selectively move the tool transfer device 146 along the X-axis and Y-axis.

[0070] In one or more examples, during operation, the tool transfer device 146 moves along the closed-loop tool guide 156 in a first direction to the transfer system 116. The tool transfer device 146 then moves along the closed-loop tool guide 156 in the first direction from the transfer system 116 to the forming system 122. The tool transfer device 146 then moves along the closed-loop tool guide 156 in the first direction from the forming system 122 to the film removal system 160. The tool transfer device 146 then moves along the closed-loop tool guide 156 in the first direction from the film removal system 160 back to the transfer system 116, wherein the process is repeated to apply and form subsequent composite material layups 106.

[0071] In any example configuration of the positioning system 144 described above (e.g., using a translational workflow or a continuous workflow), the positioning system 144 includes an access area capable of loading and unloading the carrier transfer device 110 and the tool transfer device 146.

[0072] In one or more examples, system 100 utilizes a plurality of carrier transfer devices 110. Each of the plurality of carrier transfer devices 110 transfers a corresponding one of a plurality of plywood carriers 104 through system 100. Therefore, in production, multiple operations can be performed simultaneously on different plywood carriers among the plurality of plywood carriers 104, thereby reducing cycle time. Similarly, in one or more examples, system 100 utilizes a plurality of tool transfer devices 146. Each of the plurality of tool transfer devices 146 transfers a corresponding one of a plurality of forming tools 120 through system 100. Therefore, in production, multiple operations can be performed simultaneously on different forming tools among the plurality of forming tools 120, thereby reducing cycle time.

[0073] Refer again Figures 2-4 In one or more examples, the carrier preparation system 162 is configured to prepare the layup carrier 104, and more specifically, to prepare the layup support surface 108 to receive the composite layup 106. For example, in production, the carrier transfer device 110 positions the layup carrier 104 relative to the carrier preparation system 162, which automatically applies a film 126 to the substrate 124 or to a pad 136 covering the substrate 124 to prepare the layup support surface 108.

[0074] In one or more examples, the carrier preparation system 162 includes at least one preparation device 172. The preparation device 172 is configured to interact with the layup carrier 104. The preparation device 172 can be any suitable machine or apparatus capable of manipulating the film 126 and properly positioning the film 126 on the substrate 124 or the pad 136. In one or more examples, the preparation device 172 includes or takes the form of a robotic end effector. The preparation device 172 includes parts and components (e.g., drive motors, actuators, grippers, cutters, rollers, sensors, etc.) that enable the preparation device 172 to automatically apply the film 126 to the substrate 124 or the pad 136. As an example, the preparation device 172 is configured to remove the film 126 from a supply roller, cut the film 126 to a predetermined size and shape, and apply the film 126.

[0075] The fabrication apparatus 172 is movable relative to the layup carrier 104. For example, the fabrication apparatus 172 operates in a three-dimensional X, Y, Z coordinate system. In one or more examples, the carrier fabrication system 162 includes a support platform 170 configured to selectively move and position the fabrication apparatus 172 relative to the carrier transfer device 110, and thus move and position the layup carrier 104. The support platform 170 can be any suitable machine capable of automatically driving and controlling the movement of the fabrication apparatus 172, such as a robot, robotic arm, or overhead gantry.

[0076] Furthermore, the carrier preparation system 162 is configured to automatically position the substrate 124 on the carrier transfer device 110. For example, the preparation device 172 is configured to manipulate the substrate 124 using the indexing structure 140 and position the substrate 124 at the appropriate location on the carrier transfer device 110.

[0077] Alternatively, the preparation of the layup carrier 104 can be carried out manually or semi-automatically with manual assistance.

[0078] In one or more examples, the lamination system 112 is configured to selectively apply composite layup 106 to the layup support surface 108 of the layup carrier 104. For example, in production, the carrier transfer device 110 positions the layup carrier 104 relative to the lamination system 112, which automatically manufactures the composite layup 106 on the layup support surface 108 of the layup carrier 104.

[0079] In one or more examples, the lamination system 112 includes at least one lamination device 174. The lamination device 174 is configured to lay and laminate composite material layups 106. The lamination device 174 can be any suitable machine or apparatus capable of manipulating the composite material to lay the composite material layup 106 onto a layup support surface 108. For example, the lamination device 174 is configured to lay and laminate multiple layers (e.g., continuous or discontinuous layers) of unidirectional composite tape in an edge-to-edge relationship. The lamination device 174 includes parts and components (e.g., drive motors, actuators, cutters, rollers, belt control modules, sensors, etc.) that enable the lamination device 174 to automatically manufacture the composite material layup 106. In one example, when the lamination system 112 includes multiple lamination devices 174, each lamination device 174 operates to lay material in one or more specific orientations. As an example, the laminating device 174 is configured to lay, cut, add and compact composite material (e.g., composite tape) onto the ply support surface 108 or a previously laid composite ply 106.

[0080] The laminating device 174 is movable relative to the layup carrier 104. For example, the laminating device 174 operates in a three-dimensional X, Y, Z coordinate system. In these examples, the X-axis may correspond to the length of the composite layup 106, the Y-axis may correspond to the width of the composite layup 106, and the Z-axis extends substantially perpendicular to the XY plane. In one or more examples, the laminating system 112 includes a support platform 176 configured to selectively move and position the laminating device 174 relative to the carrier transfer device 110, and thus move and position the layup carrier 104. The support platform 176 can be any suitable machine capable of automatically driving and controlling the movement of the laminating device 174, such as a robot, robotic arm, or overhead gantry.

[0081] In one or more examples, the composite layup 106 includes a layer of thickness (e.g., a layup of composite material). For example, a layer of composite tape is laminated onto a layup support surface 108 to form a composite layup 106. In one or more examples, the composite layup 106 includes multiple layers of thickness (e.g., multiple layups of composite material). For example, a layer of composite tape is laminated onto a previously laid layup to form an additional composite layup 106.

[0082] The lamination system 112 is configured to lay composite plies 106 with any desired fiber orientation, for example, based on a predetermined ply plan or ply sequence. The lamination system 112 may be particularly suitable for laying relatively long and narrow composite plies 106 (e.g., relatively long relative to width), such as for ply-by-ply fabrication of composite spars and longitudinal beams used in the aerospace industry.

[0083] In one or more examples, the lamination system 112 manufactures and supplies composite plies 106 as needed and on demand, for example, according to a predetermined ply laying sequence. This eliminates the need for ply sequencing, sorting, and storage of prefabricated plies, thereby reducing manual labor and the chance of errors during ply laying. In one or more examples, each composite ply 106 in the ply laying sequence may differ from one another in at least one parameter, such as, but not limited to, fiber orientation, weave pattern, ply laying orientation, ply laying location, and overall ply shape.

[0084] In one or more examples, the lamination system 112 may include more than one lamination device 174. In these examples, the multiple lamination devices 174 are configured to simultaneously produce multiple composite material layups 106 that can be supplied to multiple forming tools 120, thereby reducing cycle time.

[0085] In one or more examples, the trimming system 114 is configured to selectively cut the composite layup 106 into a predetermined shape. For example, in production, a carrier transfer device 110 positions the layup carrier 104 relative to the trimming system 114, which automatically cuts the composite layup 106 into a predetermined shape on the layup support surface 108 of the layup carrier 104. The predetermined shape may be based on the type of composite structure 102 being manufactured, the shape or profile of the forming surface 118, the layup sequence, the layup location, and the overall layup shape, as well as compensating for the transition from a flat state to a profiled shape when applied to and formed on the forming tool 120.

[0086] In one or more examples, the trimming system 114 includes at least one cutting device 178. The cutting device 178 is configured to cut the composite layup 106. The cutting device 178 can be any suitable cutter capable of cutting through the composite layup 106. For example, the cutting device 178 includes or is in the form of an ultrasonic cutter. In other examples, the cutting device 178 includes or is in the form of a blade, laser cutter, etc. When the layup carrier 104 includes a liner 136, the liner 136 protects the surface of the base plate 124 from damage during the cutting and shaping of the composite layup 106.

[0087] The cutting device 178 is movable relative to the layup carrier 104. For example, the cutting device 178 operates in a three-dimensional X, Y, Z coordinate system. In one or more examples, the trimming system 114 includes a support platform 180 configured to selectively move and position the cutting device 178 relative to the carrier transfer device 110, and thus move and position the layup carrier 104. The support platform 180 can be any suitable machine capable of automatically driving and controlling the movement of the cutting device 178, such as a robot, robotic arm, and overhead gantry.

[0088] It should be recognized that in some embodiments of system 100, depending on the overall layup shape of the composite layup 106 after lamination and the type of composite structure 102 being manufactured, trimming and waste removal operations may not be required. In such an example, the composite layup 106 is supplied directly from the lamination system 112 to the transfer system 116.

[0089] In one or more examples, after the composite layup 106 is cut into a predetermined shape by the trimming system 114, the waste removal system 142 is configured to remove residues of the composite layup 106 (e.g., waste cut from it) from the layup support surface 108. For example, in production, the carrier transfer device 110 positions the layup carrier 104 relative to the waste removal system 142, which automatically separates from the layup support surface 108 of the layup carrier 104 and removes the residues of the composite layup 106.

[0090] As described above, in one or more examples, a vacuum can be selectively removed from a designated portion of the film 126 to enable the removal of residues from the layup support surface 108. For example, a selected vacuum region 204 corresponding to the portion of the film 126 where the residues are located (e.g., as...) Figure 7 The vacuum provided (as shown) can be selectively shut off during the removal of residue.

[0091] In one or more examples, the waste removal system 142 includes at least one waste removal device 182. The waste removal device 182 is configured to position, engage, and remove residues from the composite layup 106. The waste removal device 182 can be any machine or device capable of manipulating and removing the residues from the layup carrier 104. In one or more examples, the waste removal device 182 includes or takes the form of a robotic end effector. The waste removal device 182 includes parts and components (e.g., drive motors, actuators, grippers, sensors, etc.) that enable the waste removal device 182 to automatically remove residues. For example, the waste removal device 182 can be a pick-and-place gripper. As another example, the waste removal device 182 can be a vacuum gripper or a vacuum roller.

[0092] Waste removal device 182 is movable relative to the layup carrier 104. For example, waste removal device 182 operates in a three-dimensional X, Y, Z coordinate system. In one or more examples, waste removal system 142 includes a support platform 184 configured to selectively move and position waste removal device 182 relative to carrier transfer device 110 and thus move and position layup carrier 104. Support platform 184 can be any suitable machine capable of automatically driving and controlling the movement of waste removal device 182, such as a robot, robotic arm, and overhead gantry. In one or more examples, waste removal device 182 can be configured to automatically place waste residue into a waste container for subsequent removal.

[0093] In one or more examples, the trimming system 114 and the waste removal system 142 can be integrated into a single workstation. In these examples, the cutting device 178 and the waste removal device 182 can share the same support platform.

[0094] In one or more examples, the transfer system 116 is configured to remove the layup carrier 104 from the carrier transfer device 110. The transfer system 116 is configured to apply the composite layup 106 to at least a portion of the forming surface 118 of the forming tool 120. The transfer system 116 is further configured to release the film 126 from the base plate 124 while retaining the base plate 124 after applying the composite layup 106 to at least a portion of the forming surface 118 of the forming tool 120. The transfer system 116 is configured to return the base plate 124 to the carrier transfer device 110 after applying the composite layup 106 to at least a portion of the forming surface 118 of the forming tool 120. For example, in production, carrier transfer device 110 positions the layup carrier 104 and tool transfer device 146 positions the forming tool 120 relative to transfer system 116. Transfer system 116 automatically removes the layup carrier 104 from carrier transfer device 110, applies composite layup 106 to forming tool 120, and returns layup carrier 104 to carrier transfer device 110.

[0095] In one or more examples, the transfer system 116 applies multiple composite layups 106 one at a time to the forming tool 120 according to the layup sequence. The transfer system 116 is capable of providing composite layups 106 at different locations on the forming tool 120. Therefore, technicians do not need to retrieve individual layups from the workstation and then manually position each layup to its layup position on the forming tool according to the layup sequence.

[0096] In one or more examples, the transfer system 116 includes at least one transfer device 186. The transfer device 186 is configured to manipulate the layup carrier 104. The transfer device 186 can be any suitable machine or apparatus capable of removing the layup carrier 104 from the carrier transfer device 110 and applying (e.g., stamping) the composite layup 106 to the forming tool 120. In one or more examples, the transfer device 186 includes or takes the form of a robotic end effector. The transfer device 186 includes parts and components (e.g., drive motors, actuators, grippers, bearings, sensors, etc.) that enable the transfer device 186 to automatically apply the composite layup 106 to the forming tool 120.

[0097] In one or more examples, the transfer device 186 is configured to remove the layup carrier 104 from the carrier transfer device 110. In one or more examples, the transfer device 186 is configured to orient the layup carrier 104 relative to the forming tool 120. In one or more examples, the transfer device 186 is configured to press the layup carrier 104 against the forming surface 118 to apply the composite layup 106 to the forming tool 120. In one or more examples, the transfer device 186 is configured to remove the layup carrier 104 from the forming surface 118, thereby leaving the composite layup 106 (e.g., pinned) on the forming tool 120.

[0098] In one or more examples, the transfer system 116 is configured to reorient the layup carrier (e.g., flip the layup carrier or rotate the layup carrier 104 180 degrees about a horizontal axis) before applying the composite layup 106 to at least a portion of the forming surface 118 of the forming tool 120. For example, in production, the layup carrier 104 is introduced into the transfer system 116 via the carrier transfer device 110 with the composite layup 106 facing upwards. The transfer system 116 reorients (e.g., flips) the layup carrier 104 such that the composite layup 106 faces the forming surface 118 of the forming tool 120 (e.g., with the base surface facing downwards).

[0099] like Figures 2-4 As shown, in one or more examples, the transfer system 116 includes a plurality of transfer devices 186. For example, the transfer system 116 includes a first of the transfer devices 186 associated with a first stage of the transfer operation and a second of the transfer devices 186 associated with a second stage of the transfer operation.

[0100] In one or more examples, the first of the transfer devices 186 is configured to engage the ply carrier 104 and remove the ply carrier 104 from the carrier transfer device 110. For example, the ply carrier 104 is located in a first stage of the transfer system 116, and the first of the transfer devices 186 is in place to remove the ply carrier 104 from the carrier transfer device 110. The first of the transfer devices 186 is configured to support and retain the composite ply 106 on the ply support surface 108 of the ply carrier 104 after the ply carrier 104 has been removed from the carrier transfer device 110.

[0101] In one or more examples, such as Figure 3 As shown, the first of the transfer devices 186 is configured to then reorient (e.g., flip) the layup carrier 104 for transfer to the second of the transfer devices 186. The first of the transfer devices 186 can also be configured to position (e.g., move) the layup carrier 104 for transfer to the second of the transfer devices 186. For example, the layup carrier 104 is removed from the carrier transfer device 110 and reoriented and repositioned for transfer to the second of the transfer devices 186. The first of the transfer devices 186 is configured to support and hold the composite layup 106 on the layup support surface 108 of the layup carrier 104 during and after the reorientation of the layup carrier 104. For example, the first of the transfer devices 186 may physically contact the composite layup 106 or otherwise clamp the composite layup 106 between the first of the transfer devices 186 and the layup carrier 104.

[0102] The second of transfer devices 186 is configured to remove the layup carrier 104 from the first of transfer devices 186. The second of transfer devices 186 is configured to support and hold the composite layup 106 on the layup support surface 108 of the layup carrier 104 after removal from the first of transfer devices 186. For example, as described above, the film 126 and thus the composite layup 106 are held on the base plate 124 via vacuum holding. The second of transfer devices 186 is configured to maintain a vacuum in the plurality of vacuum holes 128 of the base plate 124 after removal of the layup carrier 104 from the carrier transfer device 110 to hold the film 126 on the base plate 124. In one or more examples, the second of transfer devices 186 includes a vacuum stage 190. Figure 3 With the layup carrier 104 positioned on the second of the transfer devices 186, the vacuum stage 190 is in fluid communication with a plurality of vacuum holes 128 on the base plate 124. The vacuum stage 190 is configured to apply a holding vacuum to the plurality of vacuum holes 128 to hold the film 126 on the base plate 124.

[0103] The second of the transfer devices 186 is configured to press (e.g., stamp) the layup carrier 104 against the forming tool 120, thereby applying the composite layup 106 onto the forming surface 118 of the forming tool 120. The second of the transfer devices 186 is also configured to release the film 126 from the base plate 124 and remove the base plate 124 from the forming tool 120, thereby leaving the composite layup 106 and the film 126 attached to the composite layup 106 on the forming tool 120. For example, the second of the transfer devices 186 is configured to selectively remove the vacuum maintained to release the film 126 from the base plate 124.

[0104] The second of transfer devices 186 is configured to then position (e.g., move) the layup carrier 104 to transfer it back to the first of transfer devices 186. The first of transfer devices 186 is configured to remove the base plate 124 from the second of transfer devices 186. For example, as Figure 4 As shown, Figure 4 The layup carrier 104 (e.g., a substrate 124 without the film 126) is shown being transferred back to the first of the transfer devices 186. The first of the transfer devices 186 is configured to then return the substrate 124 to the carrier transfer device 110.

[0105] The transfer device 186 is movable relative to the carrier transfer device 110 and the forming tool 120. For example, the transfer device 186 operates in a three-dimensional X, Y, Z coordinate system. As an example, the first of the transfer devices 186 is movable relative to the ply carrier 104 before and after the ply carrier 104 is removed from the carrier transfer device 110. The second of the transfer devices 186 is movable relative to the forming tool 120. Additionally or alternatively, the forming tool 120 is movable relative to the transfer device 186. In either example, the transfer device 186 can be positioned at different locations along the forming tool 120 to facilitate the streamlining of the ply laying workflow.

[0106] In one or more examples, the transfer system 116 includes a support platform 188 configured to selectively move and position the transfer device 186 relative to the carrier transfer device 110 and the forming tool 120. The support platform 188 can be any suitable machine capable of automatically driving and controlling the movement of the transfer device 186, such as a robot, robotic arm, or overhead gantry. In one or more examples, the first and second transfer devices 186 share the same support platform 188.

[0107] In one or more examples, the forming system 122 is configured to form a composite material layup 106 over at least a portion of the forming surface 118 of the forming tool 120. For example, in production, a tool transfer device 146 positions the forming tool 120 relative to the forming system 122, which automatically forms the composite material layup 106 over the forming surface 118 of the forming tool 120.

[0108] In one or more examples, the forming system 122 includes at least one forming device 192. The forming device 192 is configured to compress the composite material layup 106 and form the composite material layup 106 over the forming surface 118 of the forming tool 120. The forming device 192 can be any suitable machine or apparatus capable of forming the composite material layup 106 into the shape of the forming surface 118 of the forming tool 120. In one or more examples, the forming device 192 includes or takes the form of a robotic end effector. The forming device 192 includes parts and components (e.g., drive motors, actuators, bearings, rollers, sensors, etc.) capable of automatically forming the composite material layup 106 over the forming tool 120.

[0109] In one or more examples, at least a portion of the forming tool 120 or the forming surface 118 has a complex geometry and forms a profile along one or more planes. In operation, the forming device 192 moves through the forming surface 118 of the forming tool 120 to form and compact the composite layup 106 on the forming tool 120. Therefore, the forming system 122 has a dynamic adjustment capability to accommodate changes in the shape, taper, and / or profile of the forming tool 120 and helps maintain parallelism with the profile forming surface 118 of the forming tool 120. Thus, the composite structure 102 formed using the forming system 122 can have reduced layup wrinkles, thereby reducing manufacturing process interruptions and the production of defective parts.

[0110] The forming device 192 is movable relative to the forming tool 120. For example, the forming device 192 operates in a three-dimensional X, Y, Z coordinate system. In one or more examples, the forming system 122 includes a support platform 194 configured to selectively move and position the forming device 192 relative to the forming tool 120. The support platform 194 can be any suitable machine capable of automatically driving and controlling the movement of the forming device 192, such as a robot, robotic arm, and overhead gantry.

[0111] Additionally or alternatively, the forming tool 120 may be movable relative to the forming device 192. In either example, the forming device 192 may be positioned at different locations along the forming tool 120 to facilitate the streamlining of the layup compaction workflow.

[0112] In one or more examples, the film removal system 160 is configured to remove the film 126 from the composite layup 106 after it has been formed over at least a portion of the forming surface 118 of the forming tool 120. For example, in production, the tool transfer device 146 positions the forming tool 120 relative to the film removal system 160, which automatically pulls the film 126 from the composite layup 106.

[0113] In one or more examples, the film removal system 160 includes at least one film removal device 196. The film removal device 196 is configured to engage the film 126 and remove the film 126 from the composite layup 106. The film removal device 196 can be any machine or apparatus capable of manipulating the film 126 and removing it from the composite layup 106. In one or more examples, the film removal device 196 includes or takes the form of a robotic end effector. The film removal device 196 includes parts and components (e.g., drive motors, actuators, grippers, sensors, etc.) that enable the film removal device 196 to automatically remove the film 126. For example, the film removal device 196 is a vacuum gripper or a vacuum roller.

[0114] In one or more examples, the film removal device 196 is configured to peel the film 126 from the composite layup 106 according to one or more predefined peeling parameters. For example, the film removal device 196 is configured to peel the film 126 from the composite layup 106 in a predetermined peeling direction relative to the fiber orientation of the composite layup (such as a direction parallel to the fibers of the composite layup 106). As another example, the film removal device 196 is configured to peel the film 126 from the composite layup 106 at a predetermined peeling angle. As an example, the film removal device 196 is configured to initiate the peeling of the film 126 at a predetermined peeling initiation region.

[0115] The film removal device 196 is movable relative to the forming tool 120. For example, the film removal device 196 operates in a three-dimensional X, Y, Z coordinate system. In one or more examples, the film removal system 160 includes a support platform 198 configured to selectively move and position the film removal device 196 relative to the forming tool 120 and thus move and position the composite material layup 106. The support platform 198 can be any suitable machine capable of automatically driving and controlling the movement of the film removal device 196, such as a robot, robotic arm, or overhead gantry.

[0116] In one or more examples, the forming system 122 and the film removal system 160 may be integrated within a single workstation. In these examples, the forming device 192 and the film removal device 196 may share the same support platform.

[0117] Now for reference Figure 12 , Figure 12 The system 100 (e.g., is shown) is used. Figures 1-11 An example of a method 1000 for manufacturing composite structure 102 (shown in the figure).

[0118] In one or more examples, method 1000 includes the step of preparing a layup carrier 104 (block 1002). In one or more examples, a carrier transfer device 110 is provided to a carrier preparation system 162 to prepare the layup carrier 104. For example, the carrier transfer device 110 is transferred to the carrier preparation system 162 using a positioning system 144. In one or more examples, a base plate 124 is coupled to the carrier transfer device 110 and indexed relative to the carrier transfer device 110 using an indexing structure 140. In one or more examples, a film 126 is applied to the base plate 124 to form a layup support surface 108.

[0119] In one or more examples, method 1000 includes the step of selectively applying a holding vacuum using carrier transfer device 110 to hold the film 126 on substrate 124 (block 1004). For example, the holding vacuum is applied to the layup carrier 104 via vacuum stage 130.

[0120] In one or more examples, method 1000 includes the step of transferring the layup carrier 104 to the lamination system 112 using carrier transfer device 110 (block 1006). For example, carrier transfer device 110 is moved along positioning system 144 to a predefined position relative to lamination system 112. In one or more examples, indexing device 148 is used to index carrier transfer device 110 relative to lamination system 112 and thus index layup carrier 104.

[0121] In one or more examples, method 1000 includes the step of selectively applying a composite layup 106 to a layup support surface 108 of a layup carrier 104 using a lamination system 112 (block 1008). The lamination system 112 can be operated according to programmed instructions to lay up and laminate the composite material on the layup support surface 108. For example, the lamination system 112 can be operated according to a predetermined layup sequence, such that the manufactured composite layup 106 corresponds to the next composite layup 106 to be applied to the forming tool 120. After the manufacture of the composite layup 106, the composite layup 106 is adhered (e.g., pinned) to a film 126 via its resin matrix.

[0122] In one or more examples, method 1000 includes the step of transferring a layup carrier 104 from lamination system 112 to trimming system 114 using carrier transfer device 110 (block 1010). For example, carrier transfer device 110 is moved along positioning system 144 to a predefined position relative to trimming system 114. In one or more examples, indexing device 148 is used to index carrier transfer device 110 relative to trimming system 114, and thus index layup carrier 104 and composite layup 106.

[0123] In one or more examples, method 1000 includes the step of selectively cutting composite layup 106 into a predetermined shape using trimming system 114 (box 1012). Trimming system 114 can operate according to programming instructions that define the predetermined shape to be cut in composite layup 106.

[0124] In one or more examples, method 1000 includes, after the step of selectively cutting at least one composite layup 106 (block 1012), the step of removing residue of at least one composite layup 106 from the layup support surface 108 using a waste removal system 142 (block 1014). For example, carrier transfer device 110 is conveyed along positioning system 144 to a predefined position relative to waste removal system 142. In one or more examples, indexing device 148 is used to index carrier transfer device 110 relative to waste removal system 142, and thus index layup carrier 104 and composite layup 106.

[0125] In one or more examples, method 1000 includes the step of selectively removing a retaining vacuum from selected areas of the film 126 using a carrier transfer device 110. For example, the retaining vacuum is removed from areas of the film 126 corresponding to the residue to be removed from the layup carrier 104.

[0126] In one or more examples, method 1000 further includes the step of transferring the layup carrier 104 from trimming system 114 to transfer system 116 using carrier transfer device 110 (block 1016). For example, carrier transfer device 110 is moved along positioning system 144 to a predefined position relative to transfer system 116. In one or more examples, indexing device 148 is used to index carrier transfer device 110 relative to transfer system 116, and thus index layup carrier 104 and composite layup 106.

[0127] In one or more examples, method 1000 includes the steps of removing the layup carrier 104 from the carrier transfer device 110 (box 1018) and reorienting (e.g., rotating) the layup carrier 104 using the transfer system 116 (box 1022). In one or more examples, method 1000 includes the step of maintaining a vacuum using the transfer system 116 to hold the film 126 on the substrate 124 (box 1020). The step of maintaining a vacuum (box 1020) is performed during and after the steps of removing the layup carrier 104 (box 1018) and reorienting the layup carrier 104 (box 1022). For example, via the vacuum stage 190 of the transfer device 186 (box 190) Figure 4 A vacuum is applied to the layup carrier 104 to maintain the vacuum.

[0128] In one or more examples, method 1000 includes the step of transferring forming tool 120 to transfer system 116 using tool transfer device 146 (block 1024). For example, tool transfer device 146 is moved along positioning system 144 to a predefined position relative to transfer system 116. In one or more examples, tool transfer device 146 is indexed relative to transfer system 116 using indexing device 148.

[0129] In one or more examples, method 1000 includes the step of applying a composite layup 106 to at least a portion of a forming surface 118 of a forming tool 120 using a transfer system 116 (block 1026). For example, a layup carrier 104 is positioned at a predefined location along the forming tool 120 according to a predetermined layup sequence. The layup carrier 104 is oriented such that the composite layup 106 is parallel to at least a portion of the forming surface 118 of the forming tool 120. The layup carrier 104 is pressed against the forming tool 120 to compress the composite layup 106 against a portion of the forming surface 118 of the forming tool 120. In one or more examples, the layup carrier 104 may deform when pressed against the forming tool 120, thereby allowing the composite layup 106 to be applied to a larger portion of the contour forming surface 118.

[0130] In one or more examples, method 1000 includes, after the step of applying composite layup 106 to at least a portion of the forming surface 118 of forming tool 120 (block 1026), the steps of releasing film 126 from base plate 124 and removing layup carrier 104 (e.g., base plate 124) from forming tool 120 using transfer system 116. For example, method 1000 includes, for instance, the step of selectively removing holding vacuum to release film 126 from base plate 124 while holding base plate 124 using transfer system 116 (block 1028). After composite layup 106 is applied to forming tool 120, composite layup 106 is coupled (e.g., adhered or pinned) to forming surface 118 and film 126 is held coupled (e.g., adhered or pinned) to composite layup 106 by the resin matrix of composite layup 106.

[0131] In one or more examples, method 1000 includes the step of transferring forming tool 120 from transfer system 116 to forming system 122 using tool transfer device 146 (block 1030). For example, tool transfer device 146 is moved along positioning system 144 to a predefined position relative to forming system 122. In one or more examples, tool transfer device 146 and composite layup 106 are indexed relative to forming system 122 using indexing device 148.

[0132] In one or more examples, method 1000 includes the step of forming a composite material layup 106 over at least a portion of the forming surface 118 of forming tool 120 using forming system 122 (block 1032). In one or more examples, during the formation of composite material layup 106 over forming tool 120, film 126 provides a protective barrier between forming system 122 and composite material layup 106.

[0133] In one or more examples, method 1000 includes the step of removing a film 126 from the composite layup 106 using a film removal system 160 (box 1034). The step of removing the film 126 (box 1034) is performed after the step of forming the composite layup 106 (box 1032).

[0134] In one or more examples, method 1000 includes the step of returning the layup carrier 104 (e.g., base plate 124) to the carrier transfer device 110 using transfer system 116 (box 1036). The step of returning the layup carrier 104 is performed after the step of applying the composite layup 106 to the forming tool 120 (box 1026) (box 1036).

[0135] In one or more examples, the above operations are repeated multiple times to fully form the composite structure 102 (box 1038), at which point the process terminates. In one or more examples, multiple composite material layups 106 are sequentially fabricated and applied to and formed over the forming tool 120 according to a layup-by-layup sequence. For example, a first layer of the multiple composite material layups 106 is applied to and formed over a first portion of the forming tool 120. During a second iteration of the above process, a second layer of the multiple composite material layups 106 is applied to and formed over a second portion of the forming tool 120. This iterative process is repeated until the composite structure 102 is formed.

[0136] In one or more examples, the forming tool 120 may be located simultaneously at both the transfer system 116 and the forming system 122. For example, a first portion of the forming tool 120 may be transferred to the transfer system 116 to apply a first layer of a plurality of composite layups 106. While a second portion of the forming tool 120 is being transferred to the transfer system 116, the first portion of the forming tool 120 may then be transferred to the forming system 122. While the first layer of the composite layup 106 is being formed over the forming tool 120, a second layer of the composite layup 106 may be applied to the second portion of the forming tool 120. Thus, by simultaneously performing the step of applying the second layer of the composite layup 106 (box 1026) and the step of forming the first layer of the composite layup 106 (box 1032), cycle time is reduced.

[0137] In one or more examples, the step of transferring the layup carrier (e.g., frames 1006, 1010, and 1016) includes the step of operatively translating the carrier transfer device 110 between the carrier preparation system 162, the lamination system 112, the trimming system 114 (where applicable), the waste removal system 142 (where applicable), and the transfer system 116, as shown below. Figure 10 As shown.

[0138] In one or more examples, the step of transferring the layup carrier (e.g., boxes 1006, 1010, and 1016) includes the step of operatively circulating the carrier transfer device 110 through the carrier preparation system 162, the lamination system 112, the trimming system 114 (where applicable), the waste removal system 142 (where applicable), and the transfer system 116, as follows: Figure 11 As shown.

[0139] In one or more examples, the step of transferring the forming tool 120 (e.g., frames 1024 and 1030) includes the step of operatively translating the tool transfer device 146 between the transfer system 116, the forming system 122, and the film removal system 160, for example, as Figure 10 As shown.

[0140] In one or more examples, the step of transferring the forming tool 120 (e.g., frames 1024 and 1030) includes the step of operatively circulating the tool transfer device 146 through the transfer system 116, the forming system 122, and the film removal system 160, for example, as Figure 11 As shown.

[0141] In one or more examples, method 1000 includes the step of selectively positioning carrier transfer device 110 at multiple designated locations relative to each of carrier preparation system 162, lamination system 112, trimming system 114 (where applicable), waste removal system 142 (where applicable), and transfer system 116 using indexing device 148.

[0142] In one or more examples, method 1000 includes the step of selectively positioning tool transfer device 146 at multiple designated locations relative to each of transfer system 116, forming system 122 and film removal system 160 using indexing device 148.

[0143] refer to Figure 1 In one or more examples, system 100 includes controller 158. In one or more examples, controller 158 is configured to control the operation of system 100 and / or implement the operational steps of method 1000.

[0144] The controller 158 is connected to and programmed to control the operation of at least one of the carrier transfer device 110, tool transfer device 146, positioning system 144, carrier preparation system 162, lamination system 112, trimming system 114, waste removal system 142, transfer system 116, forming system 122, and film removal system 160. In one or more examples, the on-demand fabrication, transfer, application, and formation of the composite material layup 106 is facilitated by the controller 158. The controller 158 can be any device capable of facilitating communication between itself and the various subsystems of system 100. For example, the controller 158 can be a computer workstation, a programmable logic controller (PLC), a mobile device, or other electronic controller.

[0145] In one or more examples, controller 158 includes a user interface. An operator can use the user interface to facilitate semi-autonomous operation of system 100, such as by triggering movement of carrier transfer device 110 and tool transfer device 146, or by triggering various subsystems of system 100 to execute the next step of the layup forming process. For example, the operation of system 100 can be semi-autonomously controlled at various stages of the manufacturing process based on triggering events, such as commands received from the operator.

[0146] Alternatively, one or more triggering events may be automatically provided by controller 158 to help reduce operator workload. For example, one or more subsystems of system 100 may include at least one sensor communicating with controller 158. The sensor is configured to monitor the conditions of the corresponding subsystem or parameters of the corresponding operational phase and transmit a signal indicating that the corresponding operation has been completed to controller 158. This signal provides controller 158 with an indication that the next operational step in the manufacturing process can be performed and that the next subsystem in the manufacturing sequence is ready.

[0147] In one or more examples, the transfer of the carrier transfer device 110 and / or the tool transfer device 146 is controlled under the guidance of the controller 158. For example, the carrier transfer device 110 and / or the tool transfer device 146 moves along the positioning system 144 under the guidance of the controller 158.

[0148] In one or more examples, controller 158 is programmed to selectively transfer the layup carrier 104 to carrier preparation system 162 using carrier transfer device 110 and positioning system 144. Controller 158 is programmed to prepare the layup carrier 104 using carrier preparation system 162.

[0149] In one or more examples, controller 158 is programmed to selectively transfer layup carrier 104 to lamination system 112 using carrier transfer device 110 and positioning system 144. Controller 158 is programmed to lay up composite layup 106 using lamination system 112. For example, controller 158 is programmed to selectively apply composite layup 106 to layup support surface 108 of layup carrier 104 using lamination system 112.

[0150] In one or more examples, controller 158 is programmed to selectively transfer layup carrier 104 to trimming system 114 using carrier transfer device 110 and positioning system 144. Controller 158 is also programmed to selectively cut composite layup 106 into predetermined shapes using trimming system 114.

[0151] In one or more examples, controller 158 is programmed to selectively transfer ply carrier 104 to waste removal system 142 using carrier transfer device 110 and positioning system 144. Controller 158 is programmed to remove residue of composite ply 106 from ply support surface 108 using waste removal system 142 after the composite ply 106 has been cut into a predetermined shape.

[0152] In one or more examples, controller 158 is programmed to selectively transfer forming tool 120 to transfer system 116 using tool transfer device 146 and positioning system 144. Controller 158 is programmed to selectively transfer layup carrier 104 to transfer system 116 using carrier transfer device 110 and positioning system 144. Controller 158 is programmed to transfer composite layup 106 to forming tool 120 using transfer system 116. For example, controller 158 is programmed to remove layup carrier 104 from carrier transfer device 110 before applying composite layup 106, reorient (e.g., flip) layup carrier 104, and apply composite layup 106 to at least a portion of forming surface 118 of forming tool 120 using transfer system 116.

[0153] In one or more examples, controller 158 is programmed to selectively transfer forming tool 120 to forming system 122 using tool transfer device 146 and positioning system 144. Controller 158 is programmed to form composite material layup 106 over forming tool 120 using forming system 122.

[0154] In one or more examples, controller 158 is programmed to selectively transfer forming tool 120 to film removal system 160 using tool transfer device 146 and positioning system 144. Controller 158 is programmed to remove film 126 from composite layup 106 using film removal system 160 after composite layup 106 has been formed over forming tool 120.

[0155] In one or more examples, controller 158 is programmed to return layup carrier 104 (e.g., base plate 124) to carrier transfer device 110 using transfer system 116 after composite layup 106 is applied to forming tool 120.

[0156] In one or more examples, the controller 158 is programmed to selectively transfer the layup carrier 104 back to the carrier preparation system 162 using the carrier transfer device 110 and the positioning system 144.

[0157] In one or more examples, the controller 158 is programmed to selectively apply a holding vacuum to a plurality of vacuum holes 128 of the base plate 124 of the layup carrier 104 using the carrier transfer device 110 to hold the film 126 on the base plate 124.

[0158] In one or more examples, controller 158 is programmed to use transfer system 116 to maintain a holding vacuum to a plurality of vacuum holes 128 to hold film 126 on substrate 124 after the layup carrier 104 is removed from carrier transfer device 110.

[0159] In one or more examples, the controller 158 is programmed to selectively remove the holding vacuum from a plurality of vacuum holes 128 to release the film 126 from the base plate 124 after at least one composite material layup 106 has been applied to at least a portion of the forming surface 118 of the forming tool 120.

[0160] In one or more examples, controller 158 is programmed to selectively position carrier transfer device 110 relative to each of carrier preparation system 162, lamination system 112, trimming system 114 (where applicable), waste removal system 142 (where applicable), and transfer system 116 using positioning system 144. In one or more examples, controller 158 is programmed to operatively translate carrier transfer device 110. In one or more examples, controller 158 is further programmed to operatively cycle carrier transfer device 110.

[0161] In one or more examples, controller 158 is programmed to selectively position tool transfer device 146 relative to transfer system 116, forming system 122, and film removal system 160 using positioning system 144. In one or more examples, controller 158 is programmed to operatively translate tool transfer device 146. In one or more examples, controller 158 is programmed to operatively cycle tool transfer device 146.

[0162] In one or more examples, the controller 158 is programmed to use the indexing device 148 to selectively position the carrier transfer device 110 at multiple designated locations relative to each of the carrier preparation system 162, lamination system 112, trimming system 114 (where applicable), waste removal system 142 (where applicable), and transfer system 116.

[0163] In one or more examples, the controller 158 is programmed to use the indexing device 148 to selectively position the tool transfer device 146 at multiple designated locations relative to each of the transfer system 116, the forming system 122, and the film removal system 160.

[0164] In one or more examples, one or more components, devices, or subsystems of system 100 may include a dedicated controller that communicates with and receives instructions from controller 158.

[0165] In one or more examples, controller 158 is programmed to track multiple composite material layups 106 manufactured during the fabrication of composite structure 102. For example, controller 158 tracks which of the multiple composite material layups 106 is manufactured, applied, and formed during the composite structure fabrication process according to the layup sequence. In one or more examples, controller 158 is programmed to track multiple layup carriers 104 and / or carrier transfer devices 110 flowing through system 100. In one or more examples, controller 158 is programmed to track multiple forming tools 120 and / or tool transfer devices 146 flowing through system 100.

[0166] In one or more examples, system 100 is configured to perform multiple operations substantially simultaneously or concurrently. For example, while transferring and applying a second composite layup 106 onto a forming tool 120 (e.g., the same forming tool in a translational workflow or different forming tools in a continuous workflow), a third composite layup 106 may be cut, and a fourth composite layup 106 may be laid, a first composite layup 106 may be formed over the forming tool 120. Thus, more than one carrier transfer device 110 and therefore more than one composite layup 106 can be moved through system 100 simultaneously, and more than one forming tool 120 and therefore more than one composite structure 102 can be moved through system 100 simultaneously.

[0167] In one or more examples, controller 158 is programmed to control more than one subsystem and therefore perform more than one operation simultaneously or in parallel. In one or more examples, controller 158 is programmed to control all subsystems and therefore perform all operations simultaneously or in parallel.

[0168] Now for reference Figures 13-15 Examples of system 100 and method 1000 can be compared with aircraft manufacturing and maintenance method 1100 (e.g.) Figure 15 (as shown in the flowchart) and aircraft 700 (such as Figure 13 (Illustratively shown) Used in connection with or in the context of this invention. The composite structure 102 manufactured using system 100 or according to method 1000 can be any of the structure, component, sub-component, part, component, or any other part of the aircraft 700, such as the airframe, interior, and one or more advanced systems. For example, the composite structure 102 can be any of the aircraft spars, wing sections, fuselage sections, internal panels, external skin panels, etc.

[0169] Figure 13An example of an aircraft 700 is schematically shown. The aircraft 700 includes multiple advanced systems 800. Examples of advanced systems 800 include one or more of a propulsion system 810, an electrical system 802, a hydraulic system 804, and an environmental control (“Environment”) system 806. In other examples, the aircraft 700 may include any number of other types of systems, such as communication systems, flight control systems, guidance systems, weapon systems, etc.

[0170] The aircraft 700 includes at least one composite structure 102. The composite structure 102 is manufactured at least in part using system 100 and / or method 1000. The aircraft 700 may include multiple components, including fuselage 710, airframe 720, airframe tube 730, interior 808, wing 740 and / or stabilizer 750.

[0171] In one or more examples, the composite structure 102 includes at least one composite material layup 106, such as multiple composite material layups 106. The composite structure 102 can form a composite part or portion of any suitable component of the aircraft 700. As an example, and as... Figure 13 As shown, the aircraft 700 includes a skin segment 790 that covers and / or forms the outer surface of any suitable part of the aircraft 700 and / or a plurality of longitudinal beams 770 that, together with a plurality of frames, can support the inner surface of the skin segment 790.

[0172] Figure 14 An example of a wing 740 is schematically shown. In one or more examples, the wing 740 includes a plurality of wing spars 742 that may extend along the length of the wing 740. The wing 740 may also include a plurality of spars 744, which may also be referred to herein as ribs. The wing spars 742 and spars 744 may together form and / or define at least a portion of an internal support structure 746 for the wing 740, which may support the inner surface 748 of a skin section 790 covering the wing 740. The skin section 790 may also be referred to herein as a wing skin section.

[0173] Within the scope of this disclosure, skin segments 790 (e.g., wing skin or fuselage skin), longitudinal beams 770 (e.g., fuselage longitudinal beams), frames (e.g., multi-piece frames or one-piece frames), wing longitudinal beams 742, wing spars 744, internal support structures 746, floor beams, internal panels, or various other components may be formed at least partially or even entirely of composite material layups and / or may be composite parts that can be formed using the system 100 and / or method 1000 disclosed herein.

[0174] refer to Figure 15During pre-production, method 1100 includes the specification and design of aircraft 700 (box 1102) and material procurement (box 1104). During the production of aircraft 700, the manufacturing of components and sub-assemblies of aircraft 700 (box 1106) and system integration (box 1108) are carried out. Subsequently, aircraft 700 is certified and delivered (box 1110) for service (box 1112). Routine maintenance and overhaul (box 1114) includes modification, reconfiguration, refurbishment, etc., of one or more systems of aircraft 700. For example, the composite structure 102 manufactured according to method 1000 can be produced during material procurement (box 1104), component and sub-assembly manufacturing (box 1106), and / or maintenance and overhaul (box 1114).

[0175] Figure 15 Each process of method 1100 shown may be performed or implemented by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this specification, a system integrator may include, but is not limited to, any number of spacecraft manufacturers and major system subcontractors; a third party may include, but is not limited to, any number of distributors, subcontractors, and suppliers; and an operator may be an airline, leasing company, military entity, service organization, etc.

[0176] Examples of the aircraft 700, composite structure 102, system 100, and method 1000 shown and described herein can be found in Figure 15 The disclosed system 100 and method 1000 are employed during any one or more stages of the manufacturing and maintenance method 1100 shown in the flowchart. In one example, embodiments of system 100 and / or method 1000 may form part of component and sub-component manufacturing (block 1106) and / or system integration (block 1108). For example, a composite structure 102 manufactured using embodiments of the disclosed system 100 and method 1000 may correspond to component and sub-component manufacturing (block 1106) and may be used in a manner similar to that of a component or sub-component prepared when the aircraft 700 is put into service (block 1112). Moreover, embodiments of the disclosed system 100 and method 1000 may be used during system integration (block 1108) and certification and delivery (block 1110). Similarly, embodiments of the disclosed system 100 and method 1000 may be utilized, for example, but not limited to, when the aircraft 700 is put into service (block 1112) and during maintenance and overhaul (block 1114).

[0177] Therefore, refer to Figures 1-12 It also disclosed a method for manufacturing aircraft 700 using system 100. Figure 13 A method is disclosed as part of method 1000. A portion of an aircraft 700 manufactured according to method 1000 is also disclosed.

[0178] Although aerospace examples are shown, the examples and principles disclosed herein can be applied to other industries, such as the automotive, aerospace, construction, and other design and manufacturing sectors. Therefore, in addition to aircraft, the examples and principles disclosed herein can also be applied to systems for disinfecting the interiors of other types of transportation (e.g., land vehicles, marine vehicles, space vehicles, etc.) and freestanding structures.

[0179] As used herein, a system, device, apparatus, structure, article, element, component, or hardware "constructed to" perform a specified function is indeed capable of performing the specified function without any changes, rather than merely having the potential to perform the specified function after further modification. In other words, a system, device, apparatus, structure, article, element, component, or hardware "constructed to" perform the specified function is specifically selected, created, implemented, utilized, programmed, and / or designed for the purpose of performing the specified function. As used herein, "constructed to" indicate existing characteristics of the system, device, structure, article, element, component, or hardware that enable the system, device, structure, article, element, component, or hardware to perform the specified function without further modification. For the purposes of this disclosure, a system, device, apparatus, structure, article, element, component, or hardware described as "constructed to" perform a particular function may additionally or alternatively be described as "adapted" and / or "operable to" perform that function.

[0180] Unless otherwise stated, the terms “first,” “second,” “third,” etc., are used merely as identifiers in this document and are not intended to impose any order, position, or hierarchy requirements on the items referred to by these terms. Furthermore, references to items such as “second” do not require or exclude the existence of items such as “first” or lower-numbered items and / or items such as “third” or higher-numbered items.

[0181] As used herein, the phrase “at least one” when used with a list of items means that different combinations of one or more of the listed items may be used, and it may be necessary to have only one of each item in the list. For example, “at least one of items A, B, and C” may include, but is not limited to, item A or items A and B. This example may also include items A, B, and C, or items B and C. In other examples, “at least one” may be, for example, but not limited to, two items from item A, one item from item B, and ten items from item C; four items from item B and seven items from item C; and other suitable combinations.

[0182] For the purposes of this disclosure, the terms "coupled," "coupling," and similar terms mean that which are connected, linked, fastened, attached, joined, placed in communication, or otherwise associated with each other (e.g., mechanically, electrically, fluidly, optically, electromagnetically). In various examples, elements may be associated directly or indirectly. As one example, element A may be directly associated with element B. As another example, element A may be indirectly associated with element B, for example, via another element C. It is understood that not all associations between the various disclosed elements must be represented. Therefore, connections other than those shown in the figures may also exist.

[0183] As used herein, the term "about" means or indicates a condition that is close to, but not exactly, the condition that still performs the desired function or achieves the desired result. As an example, the term "about" means a condition within an acceptable predetermined tolerance or accuracy, such as a condition within 10% of the stated condition. However, the term "about" does not exclude a condition that is exactly the stated condition. As used herein, the term "substantially" means a condition that is substantially the condition that performs the desired function or achieves the desired result.

[0184] The above-mentioned Figure 1 , Figure 10 and Figure 11 In this text, boxes may represent functional elements, features, or components thereof, and the lines connecting the boxes do not necessarily imply any specific structure. Therefore, the illustrated structures can be modified, added to, and / or omitted. Furthermore, those skilled in the art will understand that, not only those mentioned above... Figures 1-11 , Figure 13 and Figure 14 All elements, features, and / or components described and illustrated herein must be included in each example, and not all elements, features, and / or components not described herein must be described in every illustrative example. Therefore, Figures 1-11 , Figure 13 and Figure 14 Some of the elements, features, and / or components described and illustrated herein may be combined in various ways without needing to include Figures 1-11 , Figure 13 and Figure 14 Other features described and illustrated in the accompanying drawings and / or disclosures, even if one or more such combinations are not expressly stated herein. Similarly, additional features, not limited to the examples presented, may be combined with some or all of the features shown and described herein. Unless otherwise expressly stated, the features mentioned above... Figures 1-11 , Figure 13 and Figure 14The schematic diagrams depicting the examples are not intended to imply structural limitations regarding the illustrative examples. On the contrary, while an illustrative structure is indicated, it should be understood that this structure can be modified where appropriate. Therefore, modifications, additions, and / or omissions can be made to the illustrated structures. Furthermore, in Figures 1-11 , Figure 13 and Figure 14 In each of these, elements, features, and / or components used for similar or at least substantially similar purposes are labeled with the same number, and these elements, features, and / or components may be referred to herein without reference. Figures 1-11 , Figure 13 and Figure 14 Let's discuss each of them in detail. Similarly, in... Figures 1-11 , Figure 13 and Figure 14 Each of these may not label all elements, features, and / or parts, but for consistency, the accompanying figures may be used.

[0185] The above-mentioned Figure 12 and 15 In this context, boxes may represent operations, steps, and / or parts thereof, and the lines connecting the boxes do not imply any particular order or dependency between the operations or their parts. It is understood that it is not necessary to represent all dependencies between the various publicly disclosed operations. Figure 12 and 15 The accompanying disclosure describing the operations of the methods set forth herein should not be construed as requiring a specific sequence of operations to be performed. Rather, while an illustrative order is indicated, it should be understood that the sequence of operations can be modified where appropriate. Therefore, the operations shown can be modified, added to, and / or omitted, and some operations can be performed in a different order or simultaneously. Furthermore, those skilled in the art will understand that not all described operations need to be performed.

[0186] Furthermore, references to features, advantages, or similar language used throughout this specification do not imply that all features and advantages achievable through the examples disclosed herein should be or are present in any single example. Rather, references to features and advantages are to be understood as meaning that a particular feature, advantage, or characteristic described in conjunction with an example is included in at least one example. Therefore, the discussion of features, advantages, and similar language used throughout this disclosure may, but does not necessarily, refer to the same example.

[0187] Although the scope of protection is defined by the appended claims, this disclosure can be implemented in various ways, including but not limited to those pursuant to the following provisions:

[0188] Clause 1. A system (100) for manufacturing a composite structure (102), said system (100) comprising:

[0189] A layup carrier (104) includes a layup support surface (108) configured to support at least one composite material layup (106);

[0190] A carrier transfer device (110) configured to transfer the layup carrier (104);

[0191] A lamination system (112) configured to selectively apply the at least one composite material layup (106) to the layup support surface (108) of the layup carrier (104);

[0192] A transfer system (116) configured to remove the layup carrier (104) from the carrier transfer device (110) and apply the at least one composite layup (106) to at least a portion of the forming surface (118) of the forming tool (120); and

[0193] A forming system (122) configured to form the at least one composite material layup (106) over the at least portion of the forming surface (118) of the forming tool (120).

[0194] Clause 2. The system (100) according to Clause 1 further includes a trimming system (114) configured to selectively cut the at least one composite material layup (106) into a predetermined shape.

[0195] Clause 3. The system (100) according to Clause 1 or 2 further includes a waste removal system (142) configured to remove residues of the at least one composite layup (106) from the layup support surface (108) after the at least one composite layup (106) has been cut into the predetermined shape.

[0196] Clause 4. The system (100) according to any one of Clauses 1-3, wherein the layup carrier (104) further comprises:

[0197] Base plate (124); and

[0198] A thin film (126) is located on the base plate (124), wherein the thin film (126) forms the layup support surface (108).

[0199] Clause 5. The system (100) according to Clause 4 further includes a carrier preparation system (162) configured to apply the thin film (126) to the substrate (124).

[0200] Clause 6. The system (100) pursuant to Clause 4, wherein:

[0201] The base plate (124) includes a plurality of vacuum holes (128); and

[0202] The carrier transfer device (110) includes a vacuum stage (130) in fluid communication with the plurality of vacuum holes (128) and configured to apply a holding vacuum to the plurality of vacuum holes (128) to hold the film (126) on the base plate (124).

[0203] Clause 7. The system (100) pursuant to Clause 6, wherein:

[0204] The base plate (124) comprises spring steel sheet; and

[0205] The film (126) comprises a polyethylene sheet.

[0206] Clause 8. The system (100) as described in Clause 6, wherein:

[0207] The layup carrier (104) further includes a gasket (136) connected to the base plate (124); and

[0208] The gasket (136) can be maintained by vacuum permeation.

[0209] Clause 9. The system (100) according to Clause 8, wherein the gasket (136) comprises a polypropylene sheet.

[0210] Clause 10. The system (100) according to Clause 8, wherein the gasket (136) comprises a high-density polyethylene sheet.

[0211] Clause 11. The system (100) according to any one of Clauses 6-10, wherein the transfer system (116) is further configured as follows:

[0212] After the layup carrier (104) is removed from the carrier transfer device (110), the maintaining vacuum at the plurality of vacuum holes (128) is maintained to hold the film (126) on the substrate (124); and

[0213] Before applying the at least one composite material layup (106) to the at least portion of the forming surface (118) of the forming tool (120), the layup carrier (104) is rotated 180 degrees about the horizontal direction.

[0214] Clause 12. The system (100) according to Clause 11, wherein the transfer system (116) is further configured to release the film (126) from the base plate (124) while retaining the base plate (124) after the at least one composite material layup (106) has been applied to the at least portion of the forming surface (118) of the forming tool (120).

[0215] Clause 13. The system (100) according to Clause 12, wherein the transfer system (116) is further configured to return the base plate (124) to the carrier transfer device (110).

[0216] Clause 14. The system (100) according to any one of Clauses 4-13 further includes a film removal system (160) configured to remove the film (126) from the at least one composite layup after the at least one composite layup (106) has been formed over the at least portion of the forming surface (118) of the forming tool (120).

[0217] Clause 15. The system (100) according to any one of Clauses 1-14 further includes an indexing structure (140) configured to operatively position the layup carrier (104) at a designated location on the carrier transfer device (110).

[0218] Clause 16. The system (100) according to any one of Clauses 1-15 further includes a positioning system (144) configured to selectively position the carrier transfer device (110) relative to the lamination system (112) and the transfer system (116).

[0219] Clause 17. The system (100) according to Clause 16, wherein the positioning system (144) includes a linear carrier guide (150) configured to operatively translate the carrier transfer device (110) between the lamination system (112) and the transfer system (116).

[0220] Clause 18. The system (100) according to Clause 16, wherein the positioning system (144) includes a closed-loop carrier guide (154) configured to allow the carrier transfer device (110) to operatively circulate through the lamination system (112) and the transfer system (116).

[0221] Clause 19. The system (100) according to any one of Clauses 16-18 further includes a tool transfer device (146) configured to transfer the forming tool (120).

[0222] The positioning system (144) is further configured to selectively position the tool transfer device (146) relative to the transfer system (116) and the forming system (122).

[0223] Clause 20. The system (100) according to Clause 19, wherein the positioning system (144) includes a linear tool guide (152) configured to operatively translate the tool transfer device (146) between the transfer system (116) and the forming system (122).

[0224] Clause 21. The system (100) according to Clause 19, wherein the positioning system (144) includes a closed-loop tool guide (156) configured to allow the tool transfer device (146) to operatively circulate through the transfer system (116) and the forming system (122).

[0225] Clause 22. The system (100) according to any one of Clauses 19-21 further includes an indexing device (148), wherein the indexing device (148) is configured to:

[0226] The carrier transfer device (110) is operably positioned at a plurality of designated locations relative to each of the lamination system (112) and the transfer system (116); and

[0227] The tool transfer device (146) is operably positioned at a plurality of designated locations relative to each of the transfer system (116) and the forming system (122).

[0228] Clause 23. The system (100) according to any one of Clauses 1-22 further includes a controller (158) programmed to control the operation of at least one of the following: the carrier transfer device (110), the lamination system (112) and the transfer system (116), and the forming system (122).

[0229] Clause 24. A system (100) for manufacturing a composite structure (102), said system (100) comprising:

[0230] A ply carrier (104) including a ply support surface (108);

[0231] A carrier transfer device (110) configured to support the ply substrate (104);

[0232] Lamination system (112);

[0233] The transfer system (116) is sequentially associated with the lamination system (112);

[0234] The forming system (122) sequentially associated with the transfer system (116); and

[0235] Controller (158), the controller (158) being programmed to:

[0236] The carrier transfer device (110) is used to selectively transfer the layup carrier (104) to the lamination system (112);

[0237] At least one composite layup (106) is selectively applied to the layup support surface (108) of the layup carrier (104) using the lamination system (112);

[0238] The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the transfer system (116);

[0239] The transfer system (116) is used to remove the layup carrier (104) from the carrier transfer device (110) and apply the at least one composite material layup (106) to at least a portion (116) of the forming surface (118) of the forming tool (120); and

[0240] The forming system (122) is used to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120).

[0241] Clause 25. The system (100) according to Clause 24 further includes a trimming system (114) sequentially associated between the lamination system (112) and the transfer system (116).

[0242] The controller (158) is further programmed to:

[0243] The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the trimming system (114);

[0244] The trimming system (114) is used to selectively cut the at least one composite material layup (106) into a predetermined shape; and

[0245] The carrier transfer device (110) is used to selectively transfer the layup carrier (104) from the trimming system (114) to the transfer system (116).

[0246] Clause 26. The system (100) described in Clause 24 or 25 further includes a waste removal system (142).

[0247] The controller (158) is further programmed to use the waste removal system (142) to remove the residue of the at least one composite layup (106) from the layup support surface (108) after the at least one composite layup (106) has been cut into the predetermined shape.

[0248] Clause 27. The system (100) according to any one of Clauses 24-26, wherein:

[0249] The layup carrier (104) further includes:

[0250] A base plate (124) including multiple vacuum holes (128); and

[0251] A thin film (126) located on the base plate (124) and forming the ply support surface (108); and

[0252] The controller (158) is further programmed to selectively apply a holding vacuum to the plurality of vacuum holes (128) to hold the film (126) on the base plate (124) using the carrier transfer device (110).

[0253] Clause 28. The system (100) according to Clause 27, wherein the controller (158) is further programmed to:

[0254] After the layup carrier (104) is removed from the carrier transfer device (110), the transfer system (116) is used to maintain the holding vacuum at the plurality of vacuum holes (128) to hold the film (126) on the substrate (124); and

[0255] Before applying the at least one composite material layup (106) to the at least portion of the forming surface (118) of the forming tool (120), the layup carrier (104) is rotated 180 degrees about the horizontal axis using the transfer system (116).

[0256] Clause 29. The system (100) according to Clause 28, wherein the controller (158) is further programmed to selectively remove the holding vacuum from the plurality of vacuum holes (128) to release the film (126) from the base plate (124) after the at least one composite material layup (106) has been applied to the at least portion of the forming surface (118) of the forming tool (120), while using the transfer system (116) to hold the base plate (124).

[0257] Clause 30. The system (100) described in Clause 29 further includes a film removal system (160).

[0258] The controller (158) is further programmed to remove the film (126) from the at least one composite material layup (106) using the film removal system (160) after the at least one composite material layup (106) is formed over the at least one portion of the forming surface (118) of the forming tool (120).

[0259] Clause 31. The system (100) according to Clause 29, wherein the controller (158) is further programmed to use the transfer system (116) to return the base plate (124) to the carrier transfer device (110).

[0260] Clause 32. The system (100) according to any one of Clauses 24-31 further includes a positioning system (144) configured to guide the carrier transfer device (110).

[0261] The controller (158) is further programmed to selectively position the carrier transfer device (110) relative to the lamination system (112) and the transfer system (116) using the positioning system (144).

[0262] Clause 33. The system (100) according to Clause 32, wherein the controller (158) is further programmed to operatively translate the carrier transfer device (110) between the lamination system (112) and the transfer system (116) using the positioning system (144).

[0263] Clause 34. The system (100) according to Clause 32, wherein the controller (158) is further programmed to use the positioning system (144) to operatively cycle the carrier transfer device (110) through the lamination system (112) and the transfer system (116).

[0264] Clause 35. The system (100) according to Clause 32 further includes a tool transfer device (146) configured to support the forming tool (120).

[0265] The controller (158) is further programmed to selectively position the tool transfer device (146) relative to the transfer system (116) and the forming system (122) using the positioning system (144).

[0266] Clause 36. The system (100) according to Clause 35, wherein the controller (158) is further programmed to operatively translate the tool transfer device (146) between the transfer system (116) and the forming system (122) using the positioning system (144).

[0267] Clause 37. The system (100) according to Clause 35, wherein the controller (158) is further programmed to use the positioning system (144) to operatively cycle the tool transfer device (146) through the transfer system (116) and the forming system (122).

[0268] Clause 38. The system (100) according to Clause 35 further includes an indexing device (148) configured to operatively position the carrier transfer device (110).

[0269] The controller (158) is further programmed to use the indexing device (148) to selectively position the carrier transfer device (110) at a plurality of designated locations relative to each of the lamination system (112) and the transfer system (116).

[0270] Clause 39. The system (100) according to Clause 38, wherein the controller (158) is further programmed to use the indexing device (148) to selectively position the tool transfer device (146) at a plurality of designated locations relative to each of the transfer system (116) and the forming system (122).

[0271] Clause 40. A method (1000) for manufacturing a composite structure (102), the method (1000) comprising the following steps:

[0272] The layup carrier (104) is transferred to the lamination system (112) using the carrier transfer device (110);

[0273] At least one composite layup (106) is selectively applied to the layup support surface (108) of the layup carrier (104) using the lamination system (112);

[0274] The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the transfer system (116);

[0275] The transfer system (116) is used to remove the layup carrier (104) from the carrier transfer device (110) and to apply the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120); and

[0276] The forming system (122) is used to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120).

[0277] Clause 41. The method (1000) described in accordance with Clause 40 further includes:

[0278] The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the trimming system (114);

[0279] The trimming system (114) is used to selectively cut the at least one composite material layup (106) into a predetermined shape; and

[0280] The carrier transfer device (110) is used to transfer the layup carrier (104) from the trimming system (114) to the transfer system (116).

[0281] Clause 42. The method (1000) according to Clause 41 further includes, after the step of selectively cutting the at least one composite layup (106) into a predetermined shape using the trimming system (114), removing the residue of the at least one composite layup (106) from the layup support surface (108) using a waste removal system (142).

[0282] Clause 43. The method (1000) described pursuant to Clause 40 or 41, wherein:

[0283] The layup carrier (104) further includes a base plate (124) and a thin film (126) located on the base plate (124) and forming the layup support surface (108); and

[0284] The method (1000) further includes selectively applying a holding vacuum using the carrier transfer device (110) to hold the film (126) on the substrate (124).

[0285] Clause 44. The method (1000) described in accordance with Clause 43 further includes:

[0286] After the step of removing the layup carrier (104) from the carrier transfer device (110), the transfer system (116) is used to maintain the holding vacuum to hold the film (126) on the substrate (124); and

[0287] Prior to the step of applying the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120), the layup carrier (104) is rotated 180 degrees about the horizontal axis using the transfer system (116).

[0288] Clause 45. The method (1000) according to Clause 44 further includes, after the step of applying the at least one composite material layup (106) to the at least portion of the forming surface (118) of the forming tool (120), selectively removing the holding vacuum to release the film (126) from the base plate (124) while using the transfer system (116) to hold the base plate (124).

[0289] Clause 46. The method (1000) according to Clause 45 further includes, after the step of applying the at least one composite material layup (106) to the at least portion of the forming surface (118) of the forming tool (120), returning the base plate (124) to the carrier transfer device (110) using the transfer system (116).

[0290] Clause 47. The method (1000) according to any one of Clauses 43-46 further comprises, after the step of forming the at least one composite material layup (106) over the at least portion of the forming surface (118) of the forming tool (120), removing the film (126) from the at least one composite material layup (106) using a film removal system (142).

[0291] Clause 48. The method (1000) according to any one of Clauses 40-47 further includes operably translating the carrier transfer device (110) between the lamination system (112) and the transfer system (116).

[0292] Clause 49. The method (1000) according to any one of Clauses 40-48 further includes operatively circulating the carrier transfer device (110) through the lamination system (112) and the transfer system (116).

[0293] Clause 50. The method (1000) according to any one of Clauses 40-49 further includes using a tool transfer device (146) to transfer the forming tool (120) to the transfer system (116) and the forming system (122).

[0294] Clause 51. The method (1000) according to Clause 50 further includes operably translating the tool transfer device (146) between the transfer system (116) and the forming system (122).

[0295] Clause 52. The method (1000) according to Clause 50 or 51 further includes operably circulating the tool transfer device (146) through the transfer system (116) and the forming system (122).

[0296] Clause 53. The method (1000) according to any one of Clauses 50-52 further includes using an indexing device (148) to selectively position the carrier transfer device (110) at a plurality of designated locations relative to each of the lamination system (112) and the transfer system (116).

[0297] Clause 54. The method (1000) according to Clause 53 further includes using the indexing device (148) to selectively position the tool transfer device (146) at a plurality of designated locations relative to each of the transfer system (116) and the forming system (122).

[0298] The features, advantages, and characteristics described in one example can be combined in any suitable manner in one or more other examples. Those skilled in the art will recognize that the examples described herein can be practiced without the presence of one or more specific features or advantages in a particular example. In other instances, additional features and advantages that may not be present in all examples may be recognized in certain examples. Furthermore, while various examples of system 100 and method 1000 have been shown and described, modifications will occur to those skilled in the art upon reading the specification. This application includes all such modifications and is limited only by the scope of the appended claims.

Claims

1. A system (100) for manufacturing a composite structure (102), the system (100) comprising: A layup carrier (104) includes a layup support surface (108) configured to support at least one composite material layup (106). Carrier transfer device (110), the carrier transfer device (110) is configured to transfer the layup carrier (104). A lamination system (112) is configured to selectively apply the at least one composite layup (106) to the layup support surface (108) of the layup carrier (104). A transfer system (116) configured to remove the layup carrier (104) from the carrier transfer device (110) and apply the at least one composite layup (106) to at least a portion of the forming surface (118) of the forming tool (120); and A forming system (122) configured to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120). The layup carrier (104) further includes: Base plate (124); and A thin film (126) is located on the base plate (124), wherein the thin film (126) forms the layup support surface (108). The base plate (124) includes a plurality of vacuum holes (128); and the carrier transfer device (110) includes a vacuum stage (130) in fluid communication with the plurality of vacuum holes (128) and configured to apply a holding vacuum to the plurality of vacuum holes (128) to hold the film (126) on the base plate (124).

2. The system (100) according to claim 1 further includes a trimming system (114) configured to selectively cut the at least one composite material layup (106) into a predetermined shape.

3. The system (100) according to claim 2, further comprising a waste removal system (142) configured to remove residues of the at least one composite layup (106) from the layup support surface (108) after the at least one composite layup (106) has been cut into the predetermined shape.

4. The system (100) according to claim 1 further includes a carrier preparation system (162) configured to apply the thin film (126) to the substrate (124).

5. The system (100) according to claim 1 or 2 further includes an indexing structure (140) configured to operatively position the layup carrier (104) at a designated location on the carrier transfer device (110).

6. The system (100) according to claim 1 or 2 further includes a positioning system (144) configured to selectively position the carrier transfer device (110) relative to the lamination system (112) and the transfer system (116).

7. The system (100) according to claim 1 or 2 further includes a controller (158) programmed to control the operation of at least one of the following: the carrier transfer device (110), the lamination system (112) and the transfer system (116) and the forming system (122).

8. The system (100) according to claim 1 or 2, further comprising a controller (158) programmed to: The carrier transfer device (110) is used to selectively transfer the layup carrier (104) to the lamination system (112). At least one composite layup (106) is selectively applied to the layup support surface (108) of the layup carrier (104) using the lamination system (112); The carrier transfer device (110) is used to selectively transfer the layup carrier (104) from the lamination system (112) to the transfer system (116). The transfer system (116) is used to remove the layup carrier (104) from the carrier transfer device (110) and apply the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120); as well as The forming system (122) is used to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120).

9. A method (1000) for manufacturing a composite structure (102), the method (1000) comprising the following steps: The layup carrier (104) is transferred to the lamination system (112) using the carrier transfer device (110). At least one composite layup (106) is selectively applied to the layup support surface (108) of the layup carrier (104) using the lamination system (112); The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the transfer system (116). The transfer system (116) is used to remove the layup carrier (104) from the carrier transfer device (110) and apply the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120); as well as The forming system (122) is used to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120). in: The layup carrier (104) further includes a base plate (124) and a thin film (126) located on the base plate (124) and forming the layup support surface (108). The base plate (124) includes a plurality of vacuum holes (128), and the carrier transfer device (110) includes a vacuum stage (130) in fluid communication with the plurality of vacuum holes (128). The method (1000) further includes selectively applying a holding vacuum using the carrier transfer device (110) to hold the film (126) on the substrate (124); After the step of removing the layup carrier (104) from the carrier transfer device (110), the transfer system (116) is used to maintain the holding vacuum to hold the film (126) on the substrate (124); and Prior to the step of applying the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120), the layup carrier (104) is rotated 180 degrees about the horizontal axis using the transfer system (116).

10. The method (1000) according to claim 9, further comprising: The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the trimming system (114). The trimming system (114) is used to selectively cut the at least one composite material layup (106) into a predetermined shape; and The carrier transfer device (110) is used to transfer the layup carrier (104) from the trimming system (114) to the transfer system (116).

11. The method (1000) of claim 10, further comprising, after the step of selectively cutting the at least one composite layup (106) into a predetermined shape using the trimming system (114), removing the residue of the at least one composite layup (106) from the layup support surface (108) using a waste removal system (142).

12. The method (1000) according to claim 9 or 10, further comprising: operably translating the carrier transfer device (110) between the lamination system (112) and the transfer system (116); operably circulating the carrier transfer device (110) through the lamination system (112) and the transfer system (116); and using a tool transfer device (146) to transfer the forming tool (120) to the transfer system (116) and the forming system (122).

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