Optical element driving mechanism

Abstract

The present invention discloses an optical element drive mechanism, which includes a base, a motor, an anti-shake device, and multiple second coil groups. The motor includes a housing, a carrier, and a frame. The housing is connected to the top surface of the base, while the frame is mounted within the housing and has a center hole. The frame is also provided with multiple sets of magnets. The carrier is movably mounted within the center hole of the frame, and a lens can be mounted on the carrier. The carrier is provided with a first coil group. The anti-shake device includes an anti-shake platform and an elastic member. The anti-shake platform is movably mounted within the housing and located between the base and the frame. An imaging chip is also mounted on the anti-shake platform. The elastic member is connected to the anti-shake platform and surrounds the exterior of the housing. The bottom of the elastic member is mounted on the top surface of the base. Multiple second coil groups are disposed on the anti-shake platform. The multiple second coil groups can cooperate with the magnets on the frame to drive the anti-shake platform and the elastic member to move in a direction perpendicular to the optical axis. The elastic member is configured to be rebounded by the housing and drive the anti-shake platform to reset.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical driving, in particular to an optical element driving mechanism. BACKGROUND

[0002] With the development of technology, many electronic devices nowadays have the function of taking photos or recording videos. These electronic devices are increasingly popular and are developing towards the direction of convenience and thinness, providing users with more choices.

[0003] In practice, in order to adapt to various scenes for taking photos, the lens needs to be continuously focused. In addition, during the focusing or photo taking process, the lens needs to be prevented from shaking to avoid the phenomenon that the lens and the imaging chip deviate and cannot be positioned for imaging. The optical element driving mechanism in the prior art mainly achieves focusing and anti-shake by driving the lens to move. The movement direction of the lens includes the direction along the optical axis and the two perpendicular directions perpendicular to the optical axis. The movement of the lens along the optical axis is mainly used for focusing, and the movement of the lens along the direction perpendicular to the optical axis is used for anti-shake. The existing optical element driving mechanism includes a housing, a frame, a carrier, an upper spring sheet, a lower spring sheet, a plurality of suspension wires and a base. The housing and the base cooperate to provide a containing space for mounting the frame and the carrier. The frame is provided with a plurality of magnets and internal circuits, and has a hollow structure for mounting the carrier. The carrier is used for mounting the lens and can be movably mounted in the hollow structure of the frame. The carrier is provided with a set of coils for cooperating with the magnets on the frame to drive the carrier and the lens to move along the optical axis. The upper spring sheet connects the top of the frame and the carrier, and the lower spring sheet connects the bottom of the frame and the carrier. The upper spring sheet and the lower spring sheet movably connect the frame and the carrier. In addition, the upper spring sheet and the lower spring sheet also connect the internal circuits of the frame, and the lower spring sheet also connects the carrier coils. The plurality of suspension wires connect the internal circuits of the base and the upper spring sheet, and are used for transmitting current on the base to the upper spring sheet. External current can be transmitted from the internal circuits of the base, the suspension wires, the upper spring sheet, the internal circuits of the frame, the lower spring sheet to the coils on the carrier in turn. In addition, the base is provided with another two sets of coils, which can cooperate with the magnets on the frame to drive the carrier and the lens to move along the direction perpendicular to the optical axis. When the lens shakes, i.e. the lens deviates from the imaging chip, the two sets of coils cooperate with the magnets of the frame to drive the carrier and the lens to move along the direction perpendicular to the optical axis, and make the lens align with the imaging chip along the optical axis, facilitating positioning imaging.

[0004] The prior art drives the carrier and the frame to move along the direction perpendicular to the optical axis to prevent the lens from shaking. The frame, the carrier and the lens are relatively elastically connected. During the process of driving the frame, the carrier and the lens to move, it is not easy to control the displacement of the lens movement, and it is difficult to achieve precise anti-shake. SUMMARY

[0005] The present application aims to provide an optical element driving mechanism to solve the problems in the prior art.

[0006] To solve the above problems, according to one aspect of the present application, an optical element driving mechanism is provided, comprising:

[0007] a base;

[0008] a motor, the motor comprising a housing, a carrier and a frame, the housing being connected to the top surface of the base; the frame being installed in the housing and having a central hole, the frame being further provided with a plurality of sets of magnets; the carrier being movably installed in the central hole of the frame, and the carrier being provided with a first set of coils, the first set of coils being used to cooperate with the magnets to drive the carrier to move along the optical axis direction, the carrier being used to install a lens;

[0009] a vibration isolation device, the vibration isolation device comprising a vibration isolation platform and an elastic member, the vibration isolation platform being installed with an imaging chip, the vibration isolation platform being movably installed in the housing and located between the base and the frame, the imaging chip being used to image the light rays coming from the lens; the elastic member being connected to the vibration isolation platform and surrounding the outside of the housing, the bottom of the elastic member being installed on the top surface of the base; and

[0010] a plurality of second sets of coils, the second sets of coils being provided on the vibration isolation platform and cooperating with the magnets to drive the vibration isolation platform and the elastic member to move along a direction perpendicular to the optical axis direction, the elastic member being arranged to be bounced by the housing and drive the vibration isolation platform to reset.

[0011] In one embodiment, the elastic member is provided with an internal circuit, the internal circuit being electrically connected to the second sets of coils and the imaging chip, the internal circuit having a current input end, the current input end being used to connect an external power source.

[0012] In one embodiment, the frame is provided with a metal frame, the metal frame being electrically connected to the first set of coils and the internal circuit of the elastic member.

[0013] In one embodiment, the vibration isolation platform is rectangular, and the imaging chip is located at the center of the vibration isolation platform.

[0014] In one embodiment, the vibration isolation device further comprises a driving circuit board, the driving circuit board being annular and connected to the top surface of the vibration isolation platform, the central hole of the driving circuit board and the central hole of the frame being aligned along the optical axis direction.

[0015] The second sets of coils are installed on the driving circuit board.

[0016] In one embodiment, the driving circuit board is also rectangular.

[0017] The number of the second group of coils is four, and the four second group of coils are respectively located at four corners of the driving circuit board.

[0018] In one embodiment, a plurality of position sensors are further provided on the driving circuit board for sensing the displacement of the anti-shake platform along a direction perpendicular to the optical axis.

[0019] In one embodiment, the second set of coils is mounted on top of the driving circuit board.

[0020] In one embodiment, a plurality of first ball mounting grooves are provided at the bottom of the anti-shake platform;

[0021] A plurality of second ball mounting grooves are provided on the top of the base;

[0022] The optical element driving mechanism further comprises:

[0023] a housing connected to a top surface of the base and cooperating with the base to form a receiving space for receiving the motor, the driving circuit board, and the anti-shake device;

[0024] a plurality of balls, wherein the plurality of balls are respectively installed between the plurality of first ball installation grooves and the plurality of second ball installation grooves;

[0025] A bottom spring, a portion of which is connected to the base, and another portion of which is connected to the anti-shake platform, such that the anti-shake platform and the base are movably connected.

[0026] In one embodiment, the bottom reed comprises:

[0027] a spring wire having elasticity;

[0028] an inner ring connected to the spring wire and the anti-shake platform;

[0029] An outer ring is connected to the spring wire and the base.

[0030] In one embodiment, a recessed portion is provided on the top of the base, the bottom spring is mounted in the recessed portion, and the outer ring is connected to the recessed portion.

[0031] The optical element drive mechanism of the present invention drives the anti-shake platform to move in a direction perpendicular to the optical axis, which can drive the imaging chip on the anti-shake platform to move in a direction perpendicular to the optical axis. If lens shake occurs during photography, the imaging chip can be driven to move and align the imaging chip with the lens along the optical axis, thus avoiding the problem of image positioning failure caused by lens shake. Moreover, the imaging chip is relatively small, making it easier to accurately control the distance between the imaging chip and the lens along the optical axis, thereby ensuring imaging stability. In addition, the base and bottom spring wire of the present invention can ensure the stability of the anti-shake platform in the direction perpendicular to the optical axis and can also assist in resetting the anti-shake platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 FIG. 4 is an exploded view of an optical element driving mechanism according to an embodiment of the present invention.

[0033] Figure 2 yes Figure 1 Exploded view of the motor of the illustrated embodiment.

[0034] Figure 3 yes Figure 1 Assembly diagram of the motor and base of the illustrated embodiment.

[0035] Figure 4 yes Figure 1 Assembly diagram of the anti-shake device, second set of coils and base of the illustrated embodiment.

[0036] Figure 5 yes Figure 1 Exploded view of the motor of the illustrated embodiment.

[0037] Figure 6 yes Figure 1 Assembly diagram of the frame, lower spring, and carrier of the illustrated embodiment.

[0038] Figure 7 yes Figure 1 A cross-sectional view of the optical element driving mechanism of the illustrated embodiment along the optical axis.

[0039] Figure numerals: 100, optical element driving mechanism; 1, base; 11, second ball mounting groove; 12, recessed portion; 2, motor; 21, housing; 22, frame; 221, magnet; 222, metal frame; 23, carrier; 24, upper spring; 25, lower spring; 3, anti-shake device; 31, anti-shake platform; 311, imaging chip; 312, current input terminal; 32, elastic member; 33, driving circuit board; 34, first ball mounting groove; 4, second set of coils; 6, housing; 7, ball; 8, bottom spring; 81, outer ring; 82, spring wire; 83, inner ring. DETAILED DESCRIPTION

[0040] The preferred embodiments of the present application will be described in detail below with reference to the attached drawings. It should be understood that the embodiments shown in the drawings are merely for illustrating the essential spirit of the present application, and are not intended to limit the scope of the present application.

[0041] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. It will be appreciated, however, that embodiments can be practiced without including or

[0042] Reference throughout this specification to "an embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0043] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. It will be appreciated, however, that embodiments can be practiced without including or

[0044] The present application relates to an optical element driving mechanism 100, which as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the optical element driving mechanism 100 comprises a base 1, a motor 2, an anti-shake device 3 and a plurality of second group coils 4. The motor 2 comprises a shell 21, a carrier 23 and a frame 22, the shell 21 is connected to the top surface of the base 1, the frame 22 is installed in the shell 21 and has a central hole, and a plurality of magnets 221 are arranged on the frame 22. The carrier 23 is movably installed in the central hole of the frame 22, and a lens can be installed on the carrier 23. In addition, a first group coil is arranged on the carrier 23, and the first group coil can drive the carrier 23 to move along the optical axis direction in cooperation with the magnets 221 on the frame 22, so as to adjust the focal length of the lens. The anti-shake device 3 comprises an anti-shake platform 31 and a resilient member 32. The anti-shake platform 31 is movably installed in the shell 21 and located between the base 1 and the frame 22, and an imaging chip 311 is installed on the anti-shake platform 31. The imaging chip 311 is used for sensing light of the lens and imaging the light, so the imaging chip 311 needs to be aligned with the lens along the optical axis direction. The resilient member 32 is connected to the anti-shake platform 31 and arranged around the outside of the shell 21, and the bottom of the resilient member 32 is installed on the top surface of the base 1. A plurality of second group coils 4 are arranged on the anti-shake platform 31, and the second group coils 4 can drive the anti-shake platform 31 and the resilient member 32 to move along the direction perpendicular to the optical axis in cooperation with the magnets 221 on the frame 22. After the resilient member 32 moves along the optical axis direction, it will touch the shell 21 and be bounced back by the shell 21, so as to drive the anti-shake platform 31 to reset. The optical element driving mechanism 100 of the present application can drive the imaging chip 311 on the anti-shake platform 31 to move along the direction perpendicular to the optical axis by driving the anti-shake platform 31 to move along the direction perpendicular to the optical axis. When the lens shakes during the shooting process, the imaging chip 311 can be driven to move and align with the lens along the optical axis direction, so as to avoid the problem that the lens cannot be positioned for imaging due to shaking. In addition, the imaging chip 311 has a small volume, so it is easier to accurately control the distance between the imaging chip 311 and the lens along the optical axis direction, and the stability of imaging is ensured.

[0045] Optionally, the resilient member 32 is provided with an internal circuit, and the internal circuit is electrically connected to the second group coils 4 and the imaging chip 311. The internal circuit has a current input end 312 for connecting an external power supply. The current of the external power supply can flow through the current input end 312, the internal circuit, the second group coils 4 or the imaging chip 311 in sequence. The resilient member 32 functions as a flexible circuit board, and can supply power to the second group coils 4 and the imaging chip 311. Further, the anti-shake platform 31 can also be replaced by a circuit board, and a plurality of chips such as sensors can also be arranged on the anti-shake platform 31. The internal circuit of the resilient member 32 is electrically connected to the anti-shake platform 31 and supplies power to the anti-shake platform 31 and the plurality of chips. By arranging the internal circuit on the resilient member 32 and directly electrically connecting the second group coils 4 and the imaging chip 311, the circuit path can be reduced, and the risk of circuit breakage can be reduced.

[0046] Optionally, a metal frame 222 is arranged in the frame 22, and the metal frame 222 is electrically connected to the first group of coils and the internal circuit of the elastic member 32. That is, the internal circuit of the elastic member 32 can also transmit electric current to the metal frame 222 and the first group of coils in the frame 22, thereby avoiding the phenomenon of open circuit in the prior art in which the metal frame 222 and the first group of coils in the frame 22 are powered by the suspension wire. In addition, a sensor can also be arranged on the frame 22 or the carrier 23, and the sensor is electrically connected to the metal frame 222 in the frame 22. The sensor can be used to sense the position of the carrier 23.

[0047] Optionally, the anti-shake platform 31 is rectangular, and the imaging chip 311 is located at the center of the anti-shake platform 31. The imaging chip 311 needs to be aligned with the lens along the optical axis direction, and in the embodiment of the present application, the anti-shake platform 31 is arranged on the frame 22, and the anti-shake platform 31 is arranged to be movable along the direction perpendicular to the optical axis direction. Therefore, the imaging chip 311 can be kept aligned with the lens along the optical axis direction even if the lens shakes. Figure 1 Figure 3 In the embodiments of the present application, the frame 22 is also rectangular, the hollow structure of the frame 22 is also located at the center of the frame 22, the lens is located at the center of the frame 22, and the size of the anti-shake platform 31 along the direction perpendicular to the optical axis direction is substantially the same as the size of the frame 22 along the optical axis direction. The imaging chip 311 and the lens are respectively located at the center of the frame 22 and the anti-shake platform 31, which can ensure that the imaging chip 311 and the lens are aligned along the optical axis direction. Even if the lens shakes, the imaging chip 311 is offset, and the imaging chip 311 can keep the consistency with the lens along the optical axis direction by moving a small distance. After the lens is reset, the imaging chip 311 can also be driven to reset by the anti-shake platform 31, and the consistency with the lens along the optical axis direction can be kept again. However, it should be understood that the shape of the anti-shake platform 31 and the shape of the frame 22 can also be set to other shapes according to the needs, as long as the shapes along the optical axis direction are consistent.

[0048] Optionally, the top surface of the anti-shake platform 31 is also provided with a driving circuit board 33, and the driving circuit board 33 is annular and connected to the top surface of the anti-shake platform 31. The center hole of the driving circuit board 33 and the center hole of the frame 22 are aligned along the optical axis direction, so as to prevent the light from the lens from being blocked and transmitted to the imaging chip 311. It should be understood that the driving circuit board 33 can also be installed on the bottom of the anti-shake platform 31, in which case the position of the center hole of the driving circuit board 33 does not need to be limited, and the center hole can also not be provided. In addition, the second group of coils 4 is installed on the driving circuit board 33, and the anti-shake platform 31 is driven to move along the direction perpendicular to the optical axis direction by the driving circuit board 33. It should be understood that the second group of coils 4 can also be directly arranged on the anti-shake platform 31, as long as the anti-shake platform 31 can be driven to move along the direction perpendicular to the optical axis direction, and the connection relationship between the second group of coils 4 and the anti-shake platform 31 is not limited.

[0049] Further, as shown in Figure 1 Figure 4 ​​As shown, the driving circuit board 33 is also rectangular, and the driving circuit board 33 is positioned and connected to the anti-shake platform 31 along the direction perpendicular to the optical axis, and the size of the driving circuit board 33 is consistent with the size of the anti-shake platform 31. It should be understood that the driving circuit board 33 can also be circular or multiple pieces, and is not limited to Figure 1 and Figure 4 The number of the second group of coils 4 is four, and the four second group of coils 4 are respectively located at the four corners of the driving circuit board 33. The positions of the second group of coils 4 need to correspond to the positions of the multiple magnets 221 of the frame 22, and in the embodiment shown in Figure 2 , the four magnets 221 of the frame 22 are located at the four corners of the frame 22, and correspond to the positions of the four second group of coils 4, which facilitates the driving of the anti-shake platform 31 to move along the direction perpendicular to the optical axis. It should be understood that the four magnets 221 and the four second group of coils 4 can also be installed on the four sides of the frame 22 and the driving circuit board 33, as long as the positions of the magnets 221 and the second group of coils 4 correspond.

[0050] Optionally, the driving circuit board 33 is also provided with multiple position sensors for sensing the displacement of the anti-shake platform 31 moving along the direction perpendicular to the optical axis. The position sensors are at least two, and are respectively used for sensing the anti-shake platform 31 moving along the X direction or the Y direction perpendicular to the optical axis, and the X direction and the Y direction are perpendicular to each other.

[0051] Optionally, as shown in Figure 4 , the four second group of coils 4 are installed on the top of the driving circuit board 33, and the four second group of coils 4 respectively correspond to the positions of the four magnets 221 of the frame 22 along the optical axis.

[0052] Optionally, the bottom of the anti-shake platform 31 is provided with multiple first ball mounting grooves 34, and the top of the base 1 is provided with multiple second ball mounting grooves 11, and the second ball mounting grooves 11 correspond to the first ball mounting grooves 34 along the optical axis.

[0053] The optical element driving mechanism 100 further comprises a housing 6, a plurality of balls 7 and a bottom spring 8, wherein the housing 6 is connected to the top surface of the base 1 and cooperates with the base 1 to form a containing space for containing the motor 2, the driving circuit board 33 and the anti-shake device 3. The plurality of balls 7 are respectively and simultaneously installed between the plurality of first ball installation grooves 34 and the plurality of second ball installation grooves 11, each ball 7 is located between a first ball installation groove 34 and a second ball installation groove 11, and the anti-shake platform 31 can slide along the direction perpendicular to the optical axis by driving the balls 7, that is, the anti-shake platform 31 can be slidably connected to the base 1 by the balls 7, the base 1 provides support for the movement of the anti-shake platform 31 along the direction perpendicular to the optical axis, and the stability of the movement of the anti-shake platform 31 is ensured. The bottom spring 8 has elasticity, and a part of the bottom spring 8 is connected to the base 1 and the other part is connected to the anti-shake platform 31, and the anti-shake platform 31 and the base 1 are movably connected. The bottom spring 8 has two functions, on the one hand, the bottom spring 8 can exert a spring force on the bottom spring 8 towards the base 1, and the anti-shake platform 31 can prevent the first ball installation groove 34 from being separated from the ball 7 during movement, and on the other hand, the spring force of the bottom spring 8 on the anti-shake platform 31 after the movement of the anti-shake platform 31 can reset the anti-shake platform 31, that is, the bottom spring 8 assists the elastic member 32 to stably reset the anti-shake platform 31, and ensures that the imaging chip 311 on the anti-shake platform 31 and the lens are aligned along the optical axis.

[0054] Further, the bottom spring 8 comprises a spring wire 82, an inner ring 83 and an outer ring 81, the spring wire 82 has elasticity and is respectively connected to the inner ring 83 and the outer ring 81, the inner ring 83 is used to connect the bottom surface of the anti-shake platform 31, and the outer ring 81 is used to connect the top surface of the base 1, and the spring wire 82 can make the inner ring 83 and the outer ring 81 close to each other, thereby driving the anti-shake platform 31 to reset.

[0055] Optionally, the top of the base 1 is provided with a recess 12, the bottom spring 8 is installed in the recess 12, and the outer ring 81 is connected to the recess 12, the outer ring 81 extends out of the recess 12 and is connected to the bottom surface of the anti-shake platform 31. Since the outer ring 81 of the bottom spring 8 is located in the recess 12, the distance between the outer ring 81 and the inner ring 83 can be increased, and the spring force of the spring wire 82 on the anti-shake platform 31 can be improved. In addition, during the movement of the anti-shake platform 31 along the direction perpendicular to the optical axis, the outer ring 81 located in the recess 12 can reduce the blocking or limitation of the movement of the anti-shake platform 31.

[0056] It should be noted that the motor 2 of the present application further comprises an upper spring 24 and a lower spring 25, as shown in Figure 5 、 Figure 6 and Figure 7The upper spring 24 is connected to the top of the frame 22 and the carrier 23, and the lower spring 25 is connected to the bottom of the frame 22 and the carrier 23. The upper spring 24 and the lower spring 25 can elastically connect the carrier 23 and the frame 22. After the first group of coils on the carrier 23 and the magnets 221 of the frame 22 are matched to move along the optical axis direction for focusing, the upper spring 24 and the lower spring 25 can be matched to reset the carrier 23. In addition, the upper spring 24 is also electrically connected to the metal frame 222 in the frame 22 and the coils of the carrier 23. The metal frame 222 is connected to the internal circuit of the elastic member 32. The internal circuit is connected to the external power supply. The circuit of the external power supply flows into the coils of the carrier 23 through the internal circuit of the elastic member 32, the metal frame 222 and the upper spring 24 in turn, and supplies power to the coils of the carrier 23.

[0057] The optical element driving mechanism 100 of the present application can drive the imaging chip 311 on the anti-shake platform 31 to move along the direction perpendicular to the optical axis by driving the anti-shake platform 31 to move along the direction perpendicular to the optical axis. When the lens shakes during the photographing process, the imaging chip 311 can be driven to move and align with the lens along the optical axis direction, which can avoid the problem of being unable to position the imaging caused by the lens shaking. In addition, the imaging chip 311 has a small volume, which is more easily to accurately control the distance between the imaging chip 311 and the lens along the optical axis direction, and ensure the stability of the imaging. In addition, the base 1 and the bottom spring wire 82 can ensure the stability of the anti-shake platform 31 moving along the direction perpendicular to the optical axis, and also assist the anti-shake platform 31 to reset.

[0058] The preferred embodiments of the present application have been described in detail above, but it should be understood that various modifications or changes can be made by those skilled in the art after reading the above description of the present application. These equivalent forms also fall within the scope of the appended claims of the present application.

Claims

1. An optical element driving mechanism, characterized in that: include: base; A motor comprising a housing, a carrier, and a frame, wherein the housing is connected to the top surface of the base; the frame is mounted within the housing and has a center hole, and the frame is further provided with multiple sets of magnets; the carrier is movably mounted within the center hole of the frame and is provided with a first set of coils, the first set of coils being configured to cooperate with the magnets to drive the carrier to move along the optical axis, and the carrier being configured to mount a lens; an anti-shake device, the anti-shake device comprising an anti-shake platform and an elastic member, the anti-shake platform being mounted with an imaging chip, the anti-shake platform being movably mounted within the housing and located between the base and the frame, the imaging chip being configured to sense light transmitted from the lens for imaging, the elastic member being connected to the anti-shake platform and surrounding the exterior of the housing, the bottom of the elastic member being mounted to the top surface of the base; as well as a plurality of second coils, the second coils being disposed on the anti-shake platform and cooperating with the magnet to drive the anti-shake platform and the elastic member to move in a direction perpendicular to the optical axis, the elastic member being configured to be rebounded by the housing and to drive the anti-shake platform to reset; A plurality of first ball mounting grooves are provided at the bottom of the anti-shake platform; A plurality of second ball mounting grooves are provided on the top of the base; The optical element driving mechanism further comprises: a plurality of balls, wherein the plurality of balls are respectively installed between the plurality of first ball installation grooves and the plurality of second ball installation grooves; a bottom spring, a portion of which is connected to the base and another portion of which is connected to the anti-shake platform, so that the anti-shake platform and the base are movably connected; The bottom reed comprises: a spring wire having elasticity; An inner ring is connected to the spring wire and the anti-shake platform; and an outer ring is connected to the spring wire and the base.

2. The optical element driving mechanism according to claim 1, wherein: The elastic member is provided with an internal circuit, the internal circuit is electrically connected to the second group of coils and the imaging chip, and the internal circuit has a current input end, and the current input end is used to connect to an external power supply.

3. The optical element driving mechanism according to claim 2, wherein: A metal frame is provided in the frame, and the metal frame is electrically connected to the first group of coils and the internal circuit of the elastic member.

4. The optical element driving mechanism according to claim 2, wherein: The anti-shake platform is rectangular, and the imaging chip is located at the center of the anti-shake platform.

5. The optical element driving mechanism according to claim 4, wherein: The anti-shake device further includes a driving circuit board, which is annular and connected to the top surface of the anti-shake platform, and the center hole of the driving circuit board is aligned with the center hole of the frame along the optical axis; The second group of coils is mounted on the driving circuit board.

6. The optical element driving mechanism according to claim 5, wherein: The driving circuit board is also rectangular; The number of the second group of coils is four, and the four second group of coils are respectively located at four corners of the driving circuit board.

7. The optical element driving mechanism according to claim 5, wherein: The driving circuit board is further provided with a plurality of position sensors for sensing the displacement of the anti-shake platform moving in a direction perpendicular to the optical axis.

8. The optical element driving mechanism according to claim 5, wherein: The second set of coils is mounted on the top of the driving circuit board.

9. The optical element driving mechanism according to claim 5, wherein: The optical element driving mechanism further comprises: The housing is connected to the top surface of the base and cooperates with the base to form a receiving space, and the receiving space is used to receive the motor, the driving circuit board and the anti-shake device.

10. The optical element driving mechanism according to claim 1, wherein: A recessed portion is provided on the top of the base, the bottom spring is mounted on the recessed portion, and the outer ring is connected to the recessed portion.

Images