Systems and methods for venting and injecting to repair voids in the adhesive layer

Abstract

The present invention is entitled "System and Method for Voiding Injection Repair of Adhesive Layer Voids." In this example, a method is described. The method includes forming a single hole into a void repair region. The method also includes voiding the void repair region via an adhesive injection device attached to the single hole and an injection channel of the adhesive injection device. The method further includes forcing adhesive through the voided injection channel and into the voided void repair region.

Description

Technical Field

[0001] This disclosure generally relates to adhesive structural components, and more specifically, to injecting adhesive into the gaps in the adhesive layers between structural components. Background Technology

[0002] In aircraft and other environments, adhesives are typically placed between structural components (e.g., composite structures) to bond these structures together. However, in some cases, the adhesive may not be evenly distributed between the structures, creating structural weaknesses between the two structures in the form of adhesive layer voids.

[0003] Existing techniques for repairing voids in adhesive layers involve forming (e.g., drilling) two or more holes in one of the structures to access and repair the voids. For example, adhesive is injected into the void through at least one hole in the structure, and one or more additional holes are used to expel air or adhesive from the void. These existing repair techniques typically also require the use of non-destructive testing to map the void area and determine where the holes should be formed. After mapping the void area using non-destructive testing, multiple holes are typically formed at selected locations near the edge of the void area and on the opposite side of the void area.

[0004] However, these existing repair techniques can be time-consuming and require significant factory space. For example, selecting the locations of multiple holes can be a complex and difficult process. Furthermore, forming multiple holes in each structure to be repaired can take longer than expected. Moreover, when using these existing repair techniques to inject adhesive, air can be trapped in the voids, creating residual voids that persist after the repair. For example, air may be trapped in a corner of a void not near one of the multiple holes, resulting in residual voids. These residual voids can reduce the structural integrity of the repaired adhesive layer or otherwise lead to an undesirable adhesive layer. Therefore, additional time and labor must often be spent re-inspecting the structure to detect and repair residual voids.

[0005] Therefore, when bonding structures, a more time-efficient, less labor-intensive, and more reliable technology is needed for producing high-quality adhesive layers. Furthermore, a more time-efficient, less labor-intensive, and more reliable technology is needed for repairing voids in the adhesive layers. Summary of the Invention

[0006] In this example, a method is described. The method includes forming a single orifice into a bond gap repair region. The method also includes emptying the bond gap repair region and the injection channel of the adhesive injection device via an adhesive injection device attached to the single orifice. The method further includes forcing adhesive through the emptied injection channel and into the emptied bond gap repair region.

[0007] In another example, an adhesive injection apparatus is described. The adhesive injection apparatus includes a delivery channel configured to be fluidly coupled to an adhesive reservoir. The adhesive injection apparatus also includes an injection channel configured to be fluidly coupled to a bonding gap repair area. The adhesive injection apparatus also includes a venting channel configured to be fluidly coupled to a vacuum source. The adhesive injection apparatus further includes a three-way valve disposed between the delivery channel, the injection channel, and the venting channel, and selectively operable to establish fluid communication between the venting channel and the injection channel, between the venting channel and the delivery channel, and between the delivery channel and the injection channel.

[0008] In another example, a method is described. The method includes forming a single orifice into a bonding gap region. The method also includes emptying the bonding gap region and the injection channel of the adhesive injection device via an adhesive injection apparatus attached to the single orifice. The method further includes forcing adhesive through the emptied injection channel and into the emptied bonding gap region.

[0009] The features, functionalities, and advantages already discussed can be implemented independently in various instances or combined in other instances. See the following description and accompanying figures for more details on the examples. Attached Figure Description

[0010] The appended claims set forth novel features that are considered illustrative examples. However, the exemplary examples, preferred modes of use, further objectives, and descriptions will be best understood by referring to the following detailed description of exemplary examples of this disclosure when read in conjunction with the accompanying drawings, wherein:

[0011] Figure 1A illustrates a system for forming the wing of an aircraft, implemented according to an example.

[0012] Figure 1B illustrates an example of an aircraft including a combined wing, implemented according to the example.

[0013] Figure 2 The illustration shows a system, implemented according to an example, with portions of the wing skin connected or integrated to the wing spars, wing ribs, and main spars.

[0014] Figure 3A-3M The illustration shows an example stage of a process for injecting adhesive into the repair area of ​​the joint gap between structural components, implemented according to an example.

[0015] Figure 4 The illustration shows an example stage of a process implemented according to an example, in which adhesive is injected into a bonding gap region between structural components, wherein a sealant bead defines the periphery of the bonding gap region.

[0016] Figure 5 The illustration shows a flowchart of an example method for repairing voids in the adhesive layer, implemented according to an example.

[0017] Figure 6 The diagram illustrates the implementation of the example with... Figure 5 The instance methods used together with the methods for execution Figure 5 The flowchart of the instance method that forces the function.

[0018] Figure 7 The diagram illustrates the implementation of the example for execution. Figure 5 The flowchart shows an example method for the drain function.

[0019] Figure 8 The diagram illustrates the implementation of the example for execution. Figure 6 The flowchart shows an example method for the drain function.

[0020] Figure 9 The diagram illustrates the implementation of the example for execution. Figure 6 The flowchart of the instance method that forces the function.

[0021] Figure 10 The diagram illustrates the implementation of the example for execution. Figure 6 The flowchart of the instance method that forces the function.

[0022] Figure 11 The diagram illustrates the implementation of the example for execution. Figure 5 The flowchart of the method to form a functional instance method.

[0023] Figure 12 The diagram illustrates the implementation of the example for execution. Figure 5 The flowchart of the method to form a functional instance method.

[0024] Figure 13 The diagram illustrates the implementation of the example for execution. Figure 12 The flowchart of the method to form a functional instance method.

[0025] Figure 14 The diagram illustrates the implementation of the example for execution. Figure 5 The flowchart of the instance method that forces the function.

[0026] Figure 15 The diagram illustrates the implementation of the example with... Figure 5 A flowchart of instance methods used together with the methods.

[0027] Figure 16 The diagram illustrates the implementation of the example with... Figure 5 A flowchart of instance methods used together with the methods.

[0028] Figure 17 The diagram illustrates the implementation of the example with... Figure 5 A flowchart of instance methods used together with the methods.

[0029] Figure 18 The diagram illustrates the implementation of the example with... Figure 17 A flowchart of instance methods used together with the methods.

[0030] Figure 19 The illustration shows a flowchart of another example method for filling a bonding gap region with an adhesive, according to an exemplary embodiment.

[0031] Figure 20 The diagram illustrates the implementation of the example with... Figure 19 A flowchart of instance methods used together with the methods. Detailed Implementation

[0032] Examples of the disclosure will now be described more fully below with reference to the accompanying drawings, which illustrate some, but not all, of the disclosed examples. In fact, several different examples may be described and should not be construed as limited to those set forth herein. Rather, these examples are described to make this disclosure thorough and complete, and to fully convey the scope of this disclosure to those skilled in the art.

[0033] The terms “substantially,” “approximately,” “approximately,” and “close to” as used herein indicate that the exact implementation of the stated feature, parameter, or value is not required, but rather deviations or variations, including, for example, tolerances, measurement errors, measurement accuracy limitations, and other factors known to those skilled in the art, which may occur in quantities that do not preclude the effect that the feature is intended to provide.

[0034] Unless otherwise specified, the elements depicted in the accompanying drawings are not necessarily drawn to scale.

[0035] The disclosed methods and systems will be discussed primarily in the context of combined structures (e.g., longitudinal beams and skin) of aircraft; however, they can also be implemented for other types of combined structures besides aircraft. In the context of aircraft, the disclosed methods and systems can be used in the production process of aircraft, such as during the production of combined structures (e.g., the combined wings of an aircraft). Additionally or optionally, the disclosed methods and systems can be used during structural maintenance of aircraft structures, such as to address structural damage to the wings or other components of the aircraft.

[0036] In this example, the present invention describes a method for injecting adhesive into a gap repair area between two bonded structures (i.e., a first structure bonded to a second structure), particularly by purging the gap repair area via a single orifice and injecting the adhesive into the gap repair area through the same orifice. Furthermore, the present invention describes an adhesive injection apparatus for repairing gap repair areas according to the disclosed method. The disclosed method and adhesive injection apparatus are used in the context of repairing voids in the adhesive layer. The disclosed method and adhesive injection apparatus are also used for purposes other than repairing voids in the adhesive layer. For example, after two structures are fastened together and the matching edges of these structures are sealed (e.g., with caulking compound), the disclosed method and adhesive injection apparatus can be used to fill the resulting gap area with adhesive and produce a desired, strong adhesive layer.

[0037] In this example, a single hole is formed to enter the bond gap repair area, and an adhesive injection device is attached to this single hole. The single hole can be formed in one of two structures or created in some other way to provide access to the bond gap repair area. The bond gap repair area and the injection channel of the adhesive injection device are then emptied by the adhesive injection device. Once the bond gap repair area and the injection channel of the adhesive injection device are emptied, adhesive is forced through the emptied injection channel and into the emptied bond gap repair area.

[0038] To facilitate this process, the adhesive injection device includes three channels and a three-way valve. Specifically, the adhesive injection device includes a delivery channel configured for fluid connection to an adhesive reservoir, an injection channel configured for fluid connection to a bond gap repair area, and a vent channel configured for fluid connection to a vacuum source. The three-way valve is positioned between the delivery channel, injection channel, and vent channel and is selectively operable to establish fluid communication between the vent channel and injection channel, between the vent channel and delivery channel, and between the delivery channel and injection channel.

[0039] To purge the joint gap repair area, a three-way valve is positioned to establish fluid communication between the purging channel and the injection channel, and a vacuum source is used to remove air from the joint gap repair area before injecting the adhesive. Then, a three-way valve is positioned to establish fluid communication between the purging channel and the delivery channel, and a vacuum source is used to remove air from the delivery channel. Finally, a three-way valve is positioned to establish fluid communication between the delivery channel and the injection channel, forcing the adhesive out of the adhesive reservoir, through the delivery channel and the injection channel, and into the joint gap repair area.

[0040] Because air is removed from the delivery channel and the bond gap repair area before adhesive injection, fewer or no air molecules remain in the delivery channel and the bond gap repair area, preventing the adhesive from filling the bond gap repair area. As a result, the frequency of residual voids in the bond gap repair area can be reduced, which can reduce or eliminate the need for additional time and manpower to re-inspect and re-repair the bonded structure. Therefore, the disclosed method and apparatus can efficiently produce the desired adhesive layer with the desired structural capability. Furthermore, using a single orifice reduces the time and labor spent preparing to fill the bond gap or for adhesive layer repair compared to multiple orifices. Moreover, the adhesive injection device can be used as a single unit for both purging and injection, which reduces or eliminates the need for additional, separate devices for performing purging and injection.

[0041] The disclosed method for repairing voids in the adhesive layer is less time-consuming, less labor-intensive, and more reliable than conventional repair techniques for voids in the adhesive layer, and can help enable high-speed production of bonded structures.

[0042] These and other improvements will be described in more detail below. The implementations described below are for illustrative purposes. Other improvements may also be provided for the implementations described below and other implementations.

[0043] Figure 1A illustrates a system 100 for forming a combined wing 102 of an aircraft 104 according to an example implementation. Figure 1B illustrates an example of an aircraft 104 including the combined wing 102.

[0044] System 100 includes a plurality of spars 106 held in place by a plurality of fixed arms 108. The fixed arms 108 are not included in the assembled wing but are provided for assembly purposes. Other securing devices or tools may be used to hold various aspects of system 100 in place during assembly. System 100 also includes a plurality of ribs 110 attached between the spars 106. System 100 also includes a plurality of spars 112 (also referred to in some instances as “longitudinal spars”) that travel parallel to the spars 106 and provide interfaces between the ribs 110 and other aspects of system 100. The spars 112 can provide flexibility and strength to system 100.

[0045] The spar 106 can collectively form part of the wing box 114, which provides the lateral structure for the system 100 and defines the general shape and dimensions of the system 100. Furthermore, additional components of the system 100 can be attached to the wing box 114. Therefore, the dimensions of the spar 106 can strictly conform to the design of the wing 102. For similar reasons, the holes in the spar 106 can be tight tolerance holes, and thus allow for the assembly of appropriate fasteners at a given level of precision (e.g., within 1% of the fastener diameter).

[0046] Figure 2 The illustration shows a system 100 implemented according to an example, in which a portion of the wing skin 116 is attached or integrated to a spars 106, a rib 110, and a spars 112. By attaching the wing skin 116 to the wing components (e.g., spars 106, ribs 110, and spars 112), an integrated wing 102 is formed.

[0047] Figure 3A-3M The illustration shows an example stage of the process of injecting adhesive into the bonding gap repair region 118 between the first structure 120 and the second structure 122, according to an example implementation. Figure 3A-3M This involves injecting adhesive into the bonding gap repair area 118 to repair the voids in the adhesive layer.

[0048] In order to show the components involved in the implementation process, Figure 3A First, a cross-sectional view of the intermediate stage of the process is illustrated, namely the stage where the adhesive is forced into the bond gap repair region 118. Specifically, Figure 3A The illustration shows a cross-sectional view (cut along line AA) of the first structure 120, the second structure 122, and the adhesive injection device 200 during an intermediate stage of the repair process. Then, Figure 3B-3M The diagram illustrates an example phase of the process, from... Figure 3B The initial phase shown in the diagram begins.

[0049] Specifically, Figure 3A The illustration shows a first structure 120, a second structure 122, and an adhesive injection device 200. Examples of the first structure 120 may include components of the wing 102 of an aircraft 104, such as a spars 106, a rib 110, or a spars 112. In an example, the first structure 120 may be a longitudinal spars of the aircraft 104. Examples of the second structure 122 may include the wing skin 116 of the wing 102 or another structure of the aircraft 104. The first and second structures may include other components of the wing 102 or other components of the aircraft 104. Furthermore, the first structure 120 and the second structure 122 may be structures in another type of vehicle or structures of a type used in environments other than vehicles.

[0050] The adhesive injection apparatus 200 includes a delivery channel 202 configured to be fluidly coupled to an adhesive reservoir 204 containing adhesive 205. The adhesive injection apparatus 200 optionally includes the adhesive reservoir 204. In some instances, the adhesive 205 is a degassed adhesive (e.g., an adhesive paste that removes air bubbles or air), although other types of adhesives may be used in other instances.

[0051] The adhesive injection apparatus 200 also includes an injection channel 206 configured to be fluidly coupled to the bonding gap repair region 118. The adhesive injection apparatus 200 also includes a venting channel 208 configured to be fluidly coupled to a vacuum source 209. Furthermore, the adhesive injection apparatus 200 includes a three-way valve 210 disposed between the delivery channel 202, the injection channel 206, and the venting channel 208. The three-way valve 210 is selectively operable to establish fluid communication between the venting channel 208 and the injection channel 206, between the venting channel 208 and the delivery channel 202, and between the delivery channel 202 and the injection channel 206. Further, the adhesive injection apparatus 200 includes a fragile seal 212 located adjacent to and separating the adhesive reservoir 204 from the delivery channel 202. The fragile seal 212 prevents air from entering the adhesive reservoir 204.

[0052] The injection channel 206 terminates at an injection tip 214, which can be inserted into a single hole 216 formed in the first structure 120 to facilitate fluid coupling of the injection channel 206 to the bonding gap repair region 118. Optionally, the injection tip 214 may be placed on or otherwise attached to the single hole 216. In alternative embodiments, other methods and structures may be used to fluidly couple the adhesive injection device 200 to the bonding gap repair region 118.

[0053] A single hole 216 may be drilled or otherwise formed through the first structure 120. As described above, the single hole 216 serves to drain the joint gap repair area 118 and force the adhesive 205 into the joint gap repair area 118. In alternative embodiments, the single hole 216 may be formed in the joint gap repair area 118 in other ways, such as by forming the single hole 216 in the second structure 122 instead of the first structure 120. And in other alternative embodiments, the single hole 216 may be formed in an adhesive, sealant, or other material that defines the periphery of the joint gap repair area 118.

[0054] like Figure 3A As further shown, the vacuum sealing tape 218 may optionally be used to attach the adhesive injection device 200 to a single orifice 216. The vacuum sealing tape 218 provides additional assistance in facilitating the evacuation of all air from the joint gap repair area 118. In this example, the vacuum sealing tape 218 is attached before evacuating the joint gap repair area 118 and the injection channel 206.

[0055] Figure 3BThe illustration shows a perspective view of the initial stage of the process. In the initial stage, the bonding gap repair area 118 is located. As mentioned above, in some cases, the bonding gap repair area 118 is the adhesive layer void repaired using this process. Various methods can be used to locate the bonding gap repair area 118, such as non-destructive evaluation (e.g., ultrasonic testing). Figure 3B and 3C In the diagram, a portion of the first structure 120 is transparent, which is used to combine with the gap repair area 118.

[0056] Figure 3C and Figure 3D The perspective view and cross-sectional view of the next stage are shown respectively (along...). Figure 3A The diagram shows an AA cutout, in which a single hole 216 is formed in the first structure 120 to access the bonding gap repair region 118 between the first structure 120 and the second structure 122. In this example, the single hole 216 is formed at a location near the geometric center 217 of the bonding gap repair region 118 to help the adhesive 205 completely fill the bonding gap repair region 118. The geometric center can be plotted and estimated using non-destructive evaluation or other techniques. Selecting the location of a single hole and forming a single hole is less complex and time-consuming compared to conventional methods that involve selecting the locations of multiple holes and forming multiple holes.

[0057] Figure 3E-3L The diagram illustrates the following: along Figure 3A The cross-sectional view of the first structure 120 and the second structure 122 taken by line AA is shown.

[0058] Figure 3E The illustration shows a cross-sectional view of the next stage, in which the adhesive injection device 200 is attached to a single hole 216. As described above, a vacuum sealing tape 218 can be used to assist in attaching the adhesive injection device 200 to the single hole 216.

[0059] Figure 3F The diagram illustrates a cross-sectional view of the next stage, showing the use of adhesive injection device 200 to empty the bond gap repair area 118 and the injection channel 206 of the adhesive injection device 200. To facilitate this, one can refer to... Figure 3F The three-way valve 210 is positioned to establish fluid communication between the vent channel 208 and the injection channel 206, thereby allowing the vacuum source 209 to be opened and used to vent the injection channel 206 and the joint gap repair area 118. Arrows are shown to illustrate the air extracted from the injection channel 206 and the joint gap repair area 118. In one example, the position of the three-way valve 210 can be manually changed by a human operator. In another example, the position of the three-way valve 210 can be changed by a robotic device.

[0060] Figure 3GThe diagram illustrates a cross-sectional view of the next stage, in which the delivery channel 202 of the adhesive injection device 200 is emptied using the adhesive injection device 200. To facilitate this, after emptying the bonding gap repair area 118, then as follows... Figure 3G The positioning three-way valve 210 is shown to establish fluid communication between the vent channel 208 and the transfer channel 202, and the vacuum source 209 can be opened to vent the transfer channel 202. Arrows are shown to illustrate the air drawn from the transfer channel 206.

[0061] Optionally, the three-way valve 210 can be positioned (i.e., from...). Figure 3G The position shown is rotated counterclockwise by approximately 90 degrees to establish fluid communication between the evacuation channel 208, the injection channel 206, and the transfer channel 202, thereby allowing the vacuum source 209 to be opened and used to evacuate the injection channel 206, the transfer channel 202, and the bonding gap repair area 118 substantially simultaneously.

[0062] Figure 3H The diagram shows a cross-sectional view of the next stage, in which the adhesive injection device 200 is prepared to establish fluid communication between the emptied delivery channel 202 and the emptied injection channel 206 via a positioning three-way valve 210, and the adhesive 205 is injected into the bond gap repair area 118.

[0063] Figure 3I The diagram illustrates a cross-sectional view of the next stage, in which adhesive 205 is forced out of adhesive reservoir 204, breaking the fragile seal 212, entering the emptied transfer channel 202, and then into the emptied injection channel 206. Figure 3I-3K Arrows are shown to illustrate the pressure applied to adhesive reservoir 204, thereby forcing adhesive 205 out of adhesive reservoir 204. In one instance, the pressure is applied manually by a human operator. In another instance, the pressure is applied by a robotic device.

[0064] Figure 3J The diagram illustrates a cross-sectional view of the next stage, in which adhesive 205 enters the emptied bond gap repair area 118 and begins to fill the emptied bond gap repair area 118.

[0065] Figure 3K The diagram illustrates a cross-sectional view of the next stage, where adhesive 205 fills the vacated gap repair region 118. Adhesive 205 contains no air, and when adhesive 205 is injected into the vacated gap repair region 118, no voids or trapped air bubbles are present because there is no air in the vacated gap repair region 118 to prevent the adhesive 205 from filling it. For example, the resulting adhesive layer is a void-free adhesive layer.

[0066] Figure 3L The diagram shows a cross-sectional view of the next stage, in which the adhesive injection device 200 has been removed from the single hole 216, the remaining portion of the adhesive 205 protruding from the single hole 216 (if any such portion remains) has been removed, and the adhesive 205 has been cured to form an adhesive layer in the bond gap repair area 118.

[0067] In one example, the action of curing the adhesive 205 is performed while the adhesive injection device 200 is still attached to the single hole 216. In another example, the action of curing the adhesive 205 is performed after the adhesive injection device 200 has been removed from the single hole 216. To promote the curing of the adhesive 205, the adhesive 205 is heated. Various forms of heating can be used to cure the adhesive 205, including but not limited to conductive heating of the adhesive 205 with a resistance heating blanket (not shown), radiant heating of the adhesive 205 with a heating lamp (not shown), convection heating of the adhesive 205 with forced air (not shown), and / or inductive heating of the adhesive 205 with a metal element (not shown) embedded in at least the first structure 120. Optionally, the adhesive 205 may be an adhesive that cures at room temperature, and therefore may not require another heating / curing technique.

[0068] The action of removing the remainder of the adhesive 205 protruding from the single hole 216 is optional and can be performed, for example, by trimming or grinding any adhesive 205 protruding from the single hole 216 using a blade or a sander. In some instances, the action of curing the adhesive 205 is also optional.

[0069] In some cases, once the gap repair area 118 is filled, the adhesive 205 may begin to push the injection tip 214 out of the individual hole 216.

[0070] Figure 3M The illustration shows a perspective view of a first structure 120 and a second structure 122 having an adhesive layer formed through the process described above. In some instances, non-destructive testing, such as ultrasonic testing or thermal imaging, can be used to ensure complete void filling.

[0071] In some instances, such as Figure 3A-3MAs illustrated, the bonding gap repair area 118 between the first structure 120 and the second structure 122 has a periphery defined by an adhesive (e.g., an adhesive of the same or a different type as adhesive 205). In this example, the bonding gap repair area 118 can be considered as the bonding gap region. In other examples, the periphery of the bonding gap region is defined by sealant beads placed around the periphery of the first structure 120 and / or the second structure 122 to seal the bonding gap region. As a more specific example, the first structure 120 can be fastened to the second structure 122, and then sealant beads can be placed around the periphery of the first structure 120 to seal the bonding gap region using an injection nozzle or other applicator. Other examples are also possible.

[0072] Figure 4 The illustration depicts a representative example stage in a process similar to the one described above, where the bonding gap region 118' is emptied and subsequently the adhesive 205 is forced into the bonding gap region 118', particularly in the case where the sealant bead 220 defines the periphery of the bonding gap region 118'. More specifically, Figure 4 The illustration shows the stage where the bonding gap region 118' is emptied substantially simultaneously with the injection channel 206 and the delivery channel 202, as indicated by the arrows and the positioning of the three-way valve 210. To facilitate this, as further shown, the adhesive injection device 200 is attached via a fastener 222 to a single hole 216 formed in the first structure 120, the fastener 222 including a through-hole allowing access to the bonding gap region 118'. Alternatively, in some cases, the fastener may be absent and the adhesive injection device 200 may be attached to the single hole 216 in another manner. After the injection channel 206, the delivery channel 202, and the bonding gap region 118' are emptied, the adhesive 205 can be forced out of the adhesive reservoir 204, through the emptied delivery channel 202 and the emptied injection channel 206, and into the bonding gap region 118' to fill the bonding gap region 118' defined by the periphery of the sealant bead 220.

[0073] Figure 5 A flowchart illustrating an example of a method 500 that can be used with the system 100 or its components shown in Figures 1-2 is provided. Furthermore, for example, regarding... Figure 5 The described functions can be derived from the above regarding Figure 3A-3M The described functions and stages can be supplemented, replaced, or combined. Furthermore, devices or systems can be used or configured to perform this function. Figure 5 The logical functions presented in the diagram. Method 500 may include one or more operations, functions, or actions as illustrated in one or more diagrams in boxes 502-506.

[0074] In frame 502, method 500 includes forming a single hole 216 into the joint gap repair region 118.

[0075] In block 504, method 500 includes emptying the bond gap repair region 118 and the injection channel 206 of the adhesive injection device 200 via an adhesive injection device 200 attached to a single hole 216.

[0076] In frame 506, method 500 includes forcing adhesive 205 through the emptied injection channel 206 and into the emptied bond gap repair area 118.

[0077] It should be understood that Figure 3A-3M and Figure 4 The adhesive injection device 200 shown is illustrated as an example device that can be used to perform at least the operations described in blocks 504 and 506, and other devices and / or technologies may optionally be used to perform at least those operations.

[0078] Figure 6 A flowchart of an example method used with method 500 is shown. In block 508, the function includes draining the transfer channel 202, which is fluidly connected to the adhesive reservoir 204 of the adhesive injection device 200. Figure 6 A flowchart of an example method for performing the forcing as shown in block 506 is also shown. In block 510, the function includes forcing adhesive 205 through an empty delivery channel 202 to an empty injection channel 206 and into an empty bond gap repair area 118.

[0079] Figure 7 A flowchart is shown for an example method of performing evacuation as shown in block 504, particularly in the case where the adhesive injection apparatus 200 includes a three-way valve 210 fluidly connected to a delivery channel 202, an injection channel 206, and an evacuation channel 208, the injection channel 206 being connected to a bonding gap repair region 118, and the evacuation channel 208 being connected to a vacuum source 209. In block 512, the function includes positioning the three-way valve 210 to establish fluid communication between the evacuation channel 208 and the injection channel 206.

[0080] Figure 8 A flowchart is shown for an example method of performing venting as shown in block 508. In block 514, the function includes positioning a three-way valve 210 to establish fluid communication between the venting channel 208 and the transfer channel 202 after venting the venting connection gap repair area 118.

[0081] Figure 9 A flowchart is shown for performing an example method of forcing as shown in block 510. In block 516, the function includes positioning a three-way valve 210 to establish fluid communication between an emptied delivery channel 202 and an emptied injection channel 206.

[0082] Figure 10A flowchart is shown for an example method of performing the forcing as shown in block 510, particularly in the case where the adhesive injection apparatus 200 also includes an adhesive reservoir 204 fluidly connected to the delivery channel 202 and containing adhesive 205. In block 518, the function includes applying pressure to the adhesive reservoir 204 to force the adhesive 205 through the drained delivery channel 202 to the drained injection channel 206 and into the drained bond gap repair region 118. In some embodiments, the function of applying pressure is performed in addition to positioning the three-way valve 210 as shown in block 516 to establish fluid communication (e.g., subsequently) between the drained delivery channel 202 and the drained injection channel 206.

[0083] Figure 11 A flowchart is shown for an example method of performing the formation as shown in block 502. In block 520, the function includes forming a single hole 216 at a location near the geometric center 217 of the joint gap repair region 118.

[0084] Figure 12 A flowchart is shown for an example method of performing the formation as shown in block 502. In block 522, the function includes forming a single hole 216 into a joint gap repair region 118 of the two joined structures. In the example, the two joined structures are a first structure 120 and a second structure 122.

[0085] Figure 13 A flowchart is shown for an example method of performing the formation as shown in block 522. In block 524, the function includes a single hole 216 forming a joint gap repair area 118 between a longitudinal beam entering the wing 102 of the aircraft 104 and the wing skin 116 of the wing 102 of the aircraft 104. In the example, the longitudinal beam is one of the beams 112 shown in FIG. 1A.

[0086] Figure 14 A flowchart is shown for performing an example method of forcing as shown in block 506. In block 526, the function includes forcing the degassed adhesive through the emptied injection channel 206 and into the emptied bond gap repair region 118.

[0087] Figure 15 A flowchart of an example method used with method 500 is shown. In block 528, the function includes attaching the adhesive injection device 200 to a single hole 216 having a vacuum sealing strip 218 before emptying the venting channel 206 of the adhesive injection device 200 and the venting area 118 of the bonding gap repair region.

[0088] Figure 16A flowchart of an example method used with method 500 is shown. In block 530, the function includes curing adhesive 205 to form an adhesive layer in the bond gap repair area 118 when adhesive injection device 200 is attached to a single hole 216.

[0089] Figure 17 A flowchart of an example method used with method 500 is shown. In block 532, the function includes, after forcing adhesive 205 through the emptied injection channel 206 and into the emptied bond gap repair area 118, removing the adhesive injection device 200 from the single hole 216 and removing any remaining portion of adhesive 205 protruding from the single hole 216.

[0090] Figure 18 A flowchart of an example method used with method 500 is shown, particularly the function shown in block 532. In block 534, the function includes curing adhesive 205 to form an adhesive layer in the bond gap repair area 118.

[0091] Figure 19 A flowchart illustrating an example of a method 600 that can be used with the system 100 or its components shown in Figures 1-2 is provided. Furthermore, for example, regarding... Figure 6 The described functions can be derived from the above regarding Figure 3A-3M and Figure 4 The described functions and stages can be supplemented, replaced, or combined. Furthermore, devices or systems can be used or configured to perform this function. Figure 19 The logical functions presented in the diagram. Method 600 may include one or more operations, functions, or actions as shown in one or more of boxes 602-606.

[0092] In frame 602, the function includes forming a single hole 216 into the engagement gap region 118'.

[0093] In frame 604, the function includes emptying the bonding gap region 118' via an adhesive injection device 200 attached to a single hole 216 and the injection channel 206 of the adhesive injection device 200.

[0094] In frame 606, the function includes forcing adhesive 205 through the emptied injection channel 206 and into the emptied bonding gap region 118'.

[0095] Figure 20 A flowchart of an example method used with method 600 is shown, specifically where the joint gap region 118' is the joint gap region between the first structure 120 and the second structure 122. In block 608, the function includes placing a sealant bead 220 around the periphery of the first structure 120 to seal the joint gap region 118'.

[0096] In some cases, components of an apparatus and / or system can be configured to perform functions, such that the components are actually configured and structured (using hardware and / or software) to achieve such performance. In other instances, components of an apparatus and / or system can be arranged to be adapted, capable of, or suited to perform functions, such as when operating in a particular manner. Methods 500 and 600 each include one or more operations, functions, or actions as illustrated in one or more of blocks 502-506 and 602-606, respectively. Furthermore, performance can be carried out according to one or more of blocks 502-506. Figure 6-18 The boxes, and perform according to one or more of boxes 602-606. Figure 20 The boxes are illustrated in a sequential order, but these boxes can also be executed in parallel, and / or in a different order than those described herein. Furthermore, various boxes can be combined into fewer boxes, split into additional boxes, and / or removed based on desired implementation methods.

[0097] In the examples, one or more blocks of method 500 or method 600 may be represented by program code or circuitry for controlling a robotic mechanism to perform void injection repair of adhesive layer voids and / or to fill bond gap areas with adhesive (e.g., during the assembly of bonded structures and / or wings comprising multiple bonds). While method 500 or method 600 and its variations may be performed automatically using one or more robotic armatures, for example, controlled by program code operating according to method 500 or method 600, some tasks may be performed manually. Thus, in the examples, some functions described with respect to method 500 and method 600 may be performed automatically, while others may be performed manually. Optionally, all blocks of method 500 or method 600 may be performed automatically or all blocks of method 500 or method 600 may be performed manually.

[0098] The various instances of systems, apparatuses, and methods disclosed herein include a variety of components, features, and functions. It should be understood that the various instances of systems, apparatuses, and methods disclosed herein may include any components, features, and functions of any other instances of systems, apparatuses, and methods disclosed herein in any combination or subcombination, and all such possibilities are intended to be within the scope of this disclosure.

[0099] Furthermore, this disclosure includes implementations according to the following provisions:

[0100] Clause 1. Method (500) includes:

[0101] (502) A single hole (216) is formed to enter the joint gap repair area (118);

[0102] (504) The bonding gap repair area (118) and the injection channel (206) of the adhesive injection device (200) are emptied via an adhesive injection device (200) attached to the single hole (216); and

[0103] (506) Force the adhesive (205) through the emptied injection channel (206) and into the emptied bond gap repair area (118).

[0104] Clause 2. The method (500) described in accordance with Clause 1 further includes:

[0105] (508) Drain the transfer channel (202) that is fluidly connected to the adhesive reservoir (204) of the adhesive injection device (200).

[0106] The process of (506) forcing the adhesive (205) through the empty injection channel (206) and into the empty bond gap repair area (118) includes (510) forcing the adhesive (205) through the empty transfer channel (202) to the empty injection channel (206) and into the empty bond gap repair area (118).

[0107] Clause 3. The method (500) described in Clause 2, wherein:

[0108] The adhesive injection device (200) includes a three-way valve (210) fluidly connected to the delivery channel (202), the injection channel (206), and the vent channel (208), the injection channel (206) being connected to the bonding gap repair area (118), and the vent channel (208) being connected to a vacuum source.

[0109] (504) Draining the joint gap repair area (118) includes (512) positioning the three-way valve (210) to establish fluid communication between the drain channel (208) and the injection channel (206).

[0110] Clause 4. The method (500) according to Clause 3, wherein (504) emptying the transfer channel (202) includes (514) positioning the three-way valve (210) to establish fluid communication between the emptied channel (208) and the transfer channel (202) after emptying the joint gap repair area (118).

[0111] Clause 5. The method (500) according to Clause 4, wherein (506) forcing the adhesive (205) through the emptied delivery channel (202) to the emptied injection channel (206) and into the emptied bond gap repair area (118) includes (516) positioning the three-way valve (210) to establish fluid communication between the emptied delivery channel (202) and the emptied injection channel (206).

[0112] Clause 6. The method (500) described in accordance with Clause 5, wherein:

[0113] The adhesive injection device (200) further includes an adhesive reservoir (204) fluidly connected to the delivery channel (202) and containing the adhesive (205), and

[0114] (506) Forcing the adhesive (205) through the emptied transfer channel (202) to the emptied injection channel (206) and into the emptied bond gap repair area (118) further includes (518) applying pressure to the adhesive reservoir (204) to force the adhesive (205) through the emptied transfer channel (202) to the emptied injection channel (206) and into the emptied bond gap repair area (118).

[0115] Clause 7. The method (500) according to any one of Clauses 1 to 6, wherein (502) forming the single hole (216) into the joint gap repair region (118) includes (520) forming the single hole (216) at a location near the geometric center (217) of the joint gap repair region (118).

[0116] Clause 8. The method (500) according to any one of Clauses 1 to 7, wherein (502) forming the single hole (216) into the joint gap repair region (118) includes (522) forming the single hole (216) into the joint gap repair region (118) of the two joint structures (120, 122).

[0117] Clause 9. The method (500) according to Clause 8, wherein (502) forming a single hole (216) in the joint gap repair region (118) of the two joint structures (120, 122) includes (524) forming a single hole (216) in the joint gap repair region (118) between the longitudinal beam (112) of the wing (102) of the aircraft (104) and the wing skin (116) of the wing (102) of the aircraft (104).

[0118] Clause 10. The method (500) according to any one of Clauses 1 to 9, wherein (506) forcing the adhesive (205) through the emptied injection channel (206) and into the emptied bond gap repair region (118) comprises (526) forcing the degassed adhesive (205) through the emptied injection channel (206) and into the emptied bond gap repair region (118).

[0119] Clause 11. The method (500) according to any one of Clauses 1 to 10 further includes:

[0120] Before emptying the gap repair area (118) and the venting channel (206) of the adhesive injection device (200), (528) the adhesive injection device (200) is attached to the single hole (216) with a vacuum sealing strip (218).

[0121] Clause 12. The method (500) according to any one of Clauses 1 to 11 further includes:

[0122] When the adhesive injection device (200) is attached to the single hole (216), (530) the adhesive (205) is cured to form an adhesive layer in the bonding gap repair area (118).

[0123] Clause 13. The method (500) according to any one of Clauses 1 to 11 further includes:

[0124] (532) After forcing the adhesive (205) through the emptied injection channel (206) and into the emptied bond gap repair area (118):

[0125] Remove the adhesive injection device (200) from the single orifice (216); and

[0126] Remove any remaining portion of the adhesive (205) protruding from the single hole (216).

[0127] Clause 14. The method (500) described in accordance with Clause 13 further includes:

[0128] (534) Curing the adhesive (205) to form an adhesive layer in the bond gap repair area (118).

[0129] Clause 15. Adhesive layer voids repaired by the method (500) according to any one of Clauses 1 to 14.

[0130] Clause 16. Adhesive injection equipment (200), comprising:

[0131] A delivery channel (202) configured to be fluidly connected to an adhesive reservoir (204);

[0132] An injection channel (206) is configured to be fluidly connected to the interstitial gap repair region (118);

[0133] An evacuation channel (208) configured to be fluidly connected to a vacuum source; and

[0134] A three-way valve (210) is disposed between the delivery channel (202), the injection channel (206), and the drain channel (208) and is selectively operable to establish fluid communication between the drain channel (208) and the injection channel (206), between the drain channel (208) and the delivery channel (202), and between the delivery channel (202) and the injection channel (206).

[0135] Clause 17. The adhesive injection device (200) according to Clause 16 further includes:

[0136] Adhesive reservoir (204).

[0137] Clause 18. The adhesive injection device (200) according to Clause 17, wherein the adhesive reservoir (204) contains degassed adhesive (205).

[0138] Clause 19. The adhesive injection device (200) as described in Clause 17 or Clause 18 further includes:

[0139] A fragile seal (212) separates the adhesive reservoir (204) from the delivery channel (202).

[0140] Clause 20. An adhesive injection device (200) according to any one of Clauses 16 to 19, wherein the injection channel (206) is configured to be fluidly coupled to the bonding gap repair region (118) via a single hole (216) formed in the bonding gap repair region (118).

[0141] Clause 21. A method (600) comprising:

[0142] (602) A single hole (216) is formed to enter the joint gap region (118');

[0143] (604) The bonding gap region (118') and the injection channel (206) of the adhesive injection device (200) are emptied via an adhesive injection device (200) attached to the single hole (216); and

[0144] (606) Force the adhesive (205) through the emptied injection channel (206) and into the emptied bonding gap region (118').

[0145] Clause 22. The method (600) according to Clause 21, wherein the bonding gap region (118') is the bonding gap region (118') between the first structure (120) and the second structure (122), the method (600) further comprising:

[0146] (608) Place sealant beads (220) around the periphery of the first structure (120) to seal the joint gap area (118').

[0147] Descriptions of various advantageous arrangements have been presented for illustrative and descriptive purposes, and are not intended to be exhaustive or limiting of examples of the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. Furthermore, different advantageous examples may describe different advantages compared to other advantageous examples. The selection and description of one or more examples are for the purpose of best explaining the principles and practical applications of the examples, and enabling others skilled in the art to understand the disclosure of various examples with various modifications suitable for particular purposes.

Claims

1. A method (500) comprising: A single hole (216) is formed to enter the joint gap repair area (118); The bonding gap repair area (118) and the injection channel (206) of the adhesive injection device (200) are emptied via the adhesive injection device (200) attached to the single hole (216); and The adhesive (205) is forced through the emptied injection channel (206) and into the emptied bond gap repair area (118).

2. The method (500) according to claim 1, further comprising: Drain the transfer channel (202) that is fluidly connected to the adhesive reservoir (204) of the adhesive injection device (200). The process of forcing the adhesive (205) through the empty injection channel (206) and into the empty bond gap repair area (118) includes forcing the adhesive (205) through the empty transfer channel (202) to the empty injection channel (206) and into the empty bond gap repair area (118).

3. The method (500) according to claim 2, wherein: The adhesive injection device (200) includes a three-way valve (210) fluidly connected to the delivery channel (202), the injection channel (206), and the vent channel (208), the injection channel (206) being connected to the bonding gap repair area (118), and the vent channel (208) being connected to a vacuum source. Draining the joint gap repair area (118) includes positioning the three-way valve (210) to establish fluid communication between the drain channel (208) and the injection channel (206).

4. The method (500) according to claim 3, wherein emptying the transmission channel (202) includes positioning the three-way valve (210) to establish fluid communication between the emptying channel (208) and the transmission channel (202) after emptying the joint gap repair area (118).

5. The method (500) according to claim 4, wherein forcing the adhesive (205) through the emptied delivery channel (202) to the emptied injection channel (206) and into the emptied bond gap repair area (118) includes positioning the three-way valve (210) to establish fluid communication between the emptied delivery channel (202) and the emptied injection channel (206).

6. The method (500) according to claim 5, wherein: The adhesive injection device (200) further includes an adhesive reservoir (204) fluidly connected to the delivery channel (202) and containing adhesive (205), and Forcing the adhesive (205) through the emptied transfer channel (202) to the emptied injection channel (206) and into the emptied bond gap repair area (118) further includes applying pressure to the adhesive reservoir (204) to force the adhesive (205) through the emptied transfer channel (202) to the emptied injection channel (206) and into the emptied bond gap repair area (118).

7. The method (500) according to any one of claims 1 to 6, wherein forming the single hole (216) into the joint gap repair region (118) includes forming the single hole (216) at a location near the geometric center (217) of the joint gap repair region (118).

8. The method (500) according to any one of claims 1 to 6, wherein forming a single hole (216) into the joint gap repair region (118) comprises forming a single hole (216) in the joint gap repair region (118) into the two joint structures (120, 122).

9. The method (500) according to any one of claims 1 to 6, wherein forcing the adhesive (205) through the emptied injection channel (206) and into the emptied bond gap repair region (118) comprises (526) forcing the degassed adhesive (205) through the emptied injection channel (206) and into the emptied bond gap repair region (118).

10. Adhesive layer voids repaired by the method (500) according to any one of claims 1 to 6.

11. An adhesive injection apparatus (200), comprising: A delivery channel (202) configured to be fluidly connected to an adhesive reservoir (204); An injection channel (206) is configured to be fluidly connected to the interstitial gap repair region (118); An evacuation channel (208) is configured to be fluidly connected to a vacuum source; and A three-way valve (210) is disposed between the delivery channel (202), the injection channel (206), and the drain channel (208) and is selectively operable to establish fluid communication between the drain channel (208) and the injection channel (206), between the drain channel (208) and the delivery channel (202), and between the delivery channel (202) and the injection channel (206).

12. The adhesive injection apparatus (200) according to claim 11, further comprising: Adhesive reservoir (204).

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