RF module and corresponding device control circuit

Abstract

The present invention provides a radio frequency module, which is used to receive radio signals and send wired electrical signals. The radio frequency module includes a radio frequency circuit, which is provided with a radio frequency signal line, a radio frequency control chip and an antenna. The radio frequency signal line is used for bidirectional transmission of radio frequency signals between the antenna and the control chip, and the radio frequency signal line has a characteristic impedance. Based on different circuit structures, the structure of the radio frequency signal line is a microstrip line structure, a coplanar waveguide structure or a microstrip line combined with a coplanar waveguide structure. The radio frequency module is applied to a device control circuit.

Description

[0001] This application is a divisional application of the patent application with patent application number "202110351016.7", application date "March 31, 2021", and name "Device Control Circuit". Technical Field

[0002] The present invention relates to the field of integrated circuits, and in particular to a device control circuit. Background Art

[0003] In the current integrated circuit field, the characteristic impedance of the transmission line is the most important factor affecting the signal quality. During the signal propagation process, the propagation intervals of adjacent signals are prone to differences, or the characteristic impedance of the transmission line is prone to change. Since the characteristic impedance of the transmission line is prone to change, part of the energy in the signal will be reflected back. The integrity of the signal transmission is affected, and the signal quality of the signal line transmission is poor. Therefore, the existing transmission line has the technical problem that the characteristic impedance is prone to change.

[0004] Therefore, it is necessary to provide a radio frequency module and a corresponding device control circuit to solve the above technical problems. Summary of the invention

[0005] The present invention provides a radio frequency module and a corresponding device control circuit, wherein the radio frequency signal line of the device control circuit has a characteristic impedance. The device control circuit can be based on different circuit structures, and the radio frequency signal line structure of the device control circuit can be set to a microstrip line structure, a coplanar waveguide structure, or a microstrip line combined with a coplanar waveguide structure. The technical problem that the characteristic impedance of the existing transmission line is easy to change is effectively solved.

[0006] The present invention provides a radio frequency module, comprising:

[0007] A radio frequency module, used for receiving radio signals and sending wired electrical signals; the radio frequency module includes a radio frequency circuit, the radio frequency circuit is provided with a radio frequency signal line, a radio frequency control chip and an antenna, the radio frequency signal line is used for bidirectional transmission of radio frequency signals between the antenna and the control chip, the radio frequency signal line has a characteristic impedance, and based on different circuit structures, the structure of the radio frequency signal line is a microstrip line structure, a coplanar waveguide structure or a microstrip line combined with a coplanar waveguide structure;

[0008] When two groups of RF signal lines transmit signals, the microstrip line combined with the coplanar waveguide structure is a three-layer PCB board structure, which includes a coplanar waveguide and a microstrip line, and the coplanar waveguide includes a third RF signal line and a second ground line. The third RF signal line is arranged in the middle of the first layer of the microstrip line combined with the coplanar waveguide structure, and the second ground line is arranged at both ends of the third RF signal line. The distance between the second ground line and the third RF signal line is the ground clearance;

[0009] The microstrip line is arranged on the second layer and the third layer, the microstrip line includes a fourth radio frequency signal line, a second ground hole, a second ground layer, and a power layer, the fourth radio frequency signal line is arranged on the second layer of the microstrip line combined with the coplanar waveguide structure, the second ground layer is arranged on the third layer of the microstrip line combined with the coplanar waveguide structure, the second ground hole is arranged between the fourth radio frequency signal line and the second ground layer, the horizontal distance between the second ground hole and the fourth radio frequency signal line is at least twice the line width of the third radio frequency signal line, and the distance between the third radio frequency signal line and the second ground layer is the height of the reference ground plane;

[0010] When two groups of RF signal lines transmit signals and shield the interference of power supply, the microstrip line combined with coplanar waveguide structure is a four-layer PCB board structure, which includes a coplanar waveguide and a microstrip line, and the coplanar waveguide includes a fifth RF signal line and a third ground line. The fifth RF signal line is arranged in the middle of the first layer of the microstrip line combined with coplanar waveguide structure, and the third ground line is arranged at both ends of the fifth RF signal line. The distance between the third ground line and the fifth RF signal line is the ground clearance;

[0011] The microstrip line is arranged on the second layer, the third layer, and the fourth layer. The microstrip line includes a sixth radio frequency signal line, a third ground hole, a third ground layer, and a power layer. The sixth radio frequency signal line is arranged on the second layer of the microstrip line combined with a coplanar waveguide structure. The third ground layer is arranged on the third layer or the fourth layer of the microstrip line combined with a coplanar waveguide structure. The power layer is arranged on the third layer or the fourth layer of the microstrip line combined with a coplanar waveguide structure. The second ground hole is arranged between the sixth radio frequency signal line and the third ground layer. The horizontal spacing between the third ground hole and the sixth radio frequency signal line is at least twice the line width of the fifth radio frequency signal line. The distance between the fifth radio frequency signal line and the third ground layer is the height of the reference ground plane.

[0012] The coplanar waveguide includes a groove, which is arranged at the lower ends of the fifth RF signal line and the third ground line and between the first layer and the second layer. The groove includes a first side and a second side. The length of the first side is greater than the length of the second side. The bottom of the groove is stepped or arc-shaped. The arc of the arc is a minor arc, and the minor arc protrudes or is recessed in the groove.

[0013] In the radio frequency module described in the present invention, the microstrip line structure is a two-layer PCB board microstrip line structure, and the two-layer PCB board microstrip line structure includes a first ground hole, a first radio frequency signal line, and a first ground layer. The first ground layer is arranged on the second layer of the two-layer PCB board microstrip line structure, and the first radio frequency signal line is arranged in the middle of the first layer of the two-layer PCB board microstrip line structure. The first ground hole is arranged between the first radio frequency signal line and the first ground layer. The horizontal spacing between the first ground hole and the first radio frequency signal line is at least twice the line width of the first radio frequency signal line, and the distance between the first radio frequency signal line and the first ground layer is the height of the reference ground plane.

[0014] In the RF module described in the present invention, the coplanar waveguide structure includes a two-layer PCB coplanar waveguide structure, the two-layer PCB coplanar waveguide structure includes a first ground wire, a second RF signal wire, and a reference ground, the second RF signal wire is arranged in the middle of the first layer of the two-layer PCB coplanar waveguide structure, the reference ground is arranged in the second layer of the two-layer PCB coplanar waveguide structure, the first ground wire is arranged at both ends of the second RF signal wire, the distance between the first ground wire and the second RF signal line is the ground clearance, and the distance between the first ground wire and the reference ground is the height of the reference ground plane.

[0015] A device control circuit, comprising:

[0016] Any of the above mentioned radio frequency modules;

[0017] A control chip, connected to the radio frequency module, for receiving data, processing data and sending data;

[0018] The power supply module is connected to the control chip and the radio frequency module, and is used to provide the control chip and the radio frequency module with operating voltage.

[0019] In the device control circuit described in the present invention, the device control circuit with a radio frequency module also includes a camera module, the camera module is connected to the control chip, the camera module is used to transmit video data and image data to the control chip, and the camera module is also connected to the power supply module, and the power supply module is used to provide the working voltage of the camera module.

[0020] In the device control circuit described in the present invention, the camera module includes a camera interface circuit, and the camera interface circuit includes a clock connection line and a data connection line, a camera interface, and a camera control chip. The clock connection line is used for the camera interface to transmit a clock signal to the camera control chip, and the data connection line is used for the camera interface to transmit a data signal to the camera control chip; the clock connection line and the data connection line are both high-speed signal lines with set characteristic impedance and are differential signal lines. The line lengths of the clock connection line and the data connection line are first set values, at least two of the data connection lines constitute the data connection lines of the same video component, the length difference of the data connection lines of the same video component is a second set value, and the length difference of the data connection lines between different video components is a third set value.

[0021] In the device control circuit described in the present invention, the camera interface circuit includes an analog part power supply and a digital part power supply, and the analog part power supply and the digital part power supply are respectively powered by different low voltage difference linear regulators.

[0022] In the device control circuit described in the present invention, the device control circuit with a radio frequency module also includes an audio module, the audio module is connected to the control chip, the audio module is used to transmit audio data to the control chip and receive audio data from the control chip, the audio module is also connected to the power supply module, and the power supply module is used to connect the working voltage of the audio module.

[0023] In the device control circuit described in the present invention, the audio module includes an electret microphone circuit and a headphone circuit, the electret microphone circuit is connected in parallel with the headphone circuit, the electret microphone circuit includes a microphone input end, a first filter capacitor and a second filter capacitor, the first filter capacitor and the second filter capacitor are used to filter out radio frequency interference, the first filter capacitor is connected in parallel with the electret microphone circuit, the second filter capacitor is connected in parallel with the electret microphone circuit, the distance between the first filter capacitor and the microphone input end is smaller than the distance between the first filter capacitor and the control chip, and the distance between the second filter capacitor and the microphone input end is smaller than the distance between the second filter capacitor and the control chip; the headphone circuit includes a headphone interface and a third filter capacitor, the third filter capacitor is used to filter out radio frequency interference, the third filter capacitor is connected in parallel with the headphone circuit, and the distance between the third filter capacitor and the headphone interface is smaller than the distance between the third filter capacitor and the control chip.

[0024] In the device control circuit of the present invention, a magnetic bead is connected in series to the headphone circuit, and the distance between the magnetic bead and the headphone interface is smaller than the distance between the magnetic bead and the control chip.

[0025] Compared with the prior art, the present invention has the following beneficial effects: the present invention provides a device control circuit, and the radio frequency signal line of the device control circuit has a characteristic impedance. The device control circuit can be based on different circuit structures, and the radio frequency signal line structure of the device control circuit can be set to a microstrip line structure, a coplanar waveguide structure, or a microstrip line combined with a coplanar waveguide structure, which effectively solves the technical problem that the characteristic impedance of the existing transmission line is easy to change.

[0026] The microstrip line combined with the coplanar waveguide structure includes a groove, which is arranged at the lower ends of the fifth radio frequency signal line and the third ground line, and is located between the first layer and the second layer of the microstrip line combined with the coplanar waveguide structure. The bottom of the groove is stepped or arc-shaped, and the groove can reduce the transmission loss. At the same time, the groove with a stepped or arc-shaped bottom can ensure that the microstrip line combined with the coplanar waveguide structure has a high strength.

[0027] The camera interface circuit is provided with a clock connection line and a data connection line, and the clock connection line and the data connection line are both high-speed signal lines with characteristic impedance and are differential signal lines. The line lengths of the clock connection line and the data connection line are a first set value, and the first set value is 100mm-305mm. At least two data connection lines constitute the data connection lines of the same video component, and the length difference of the data connection lines of the same video component is a second set value, and the second set value is 0-1.5mm. The length difference of the data connection lines between different video components is a third set value, and the third set value is 0.3.3mm. The noise interference signal will be loaded onto the differential signal line with equal value and at the same time, so the difference of the noise interference signal is zero, and the noise interference signal has no effect on the logical meaning of the data signal. The differential signal line can be used to reduce the impact of the noise interference signal.

[0028] The audio module includes an electret microphone circuit and a headphone circuit, and the electret microphone circuit is provided with a first filter capacitor and a second filter capacitor. The distance between the first filter capacitor and the microphone input terminal is smaller than the distance between the first filter capacitor and the control chip, and the distance between the second filter capacitor and the microphone input terminal is smaller than the distance between the second filter capacitor and the control chip. The headphone circuit is provided with a third filter capacitor, and the distance between the third filter capacitor and the headphone interface is smaller than the distance between the third filter capacitor and the control chip. The first filter capacitor, the second filter capacitor, and the third filter capacitor better filter out radio frequency interference. Magnetic beads are connected in series on the headphone circuit, and the distance between the magnetic beads and the headphone interface is smaller than the distance between the magnetic beads and the control chip, so that the magnetic beads better suppress noise interference on the headphone circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1is a block diagram of an embodiment of a device control circuit of the present invention;

[0030] Figure 2 A circuit diagram of a camera module of an embodiment of a device control circuit of the present invention;

[0031] Figure 3 A circuit diagram of an electret microphone circuit of an earphone module of an embodiment of a device control circuit of the present invention;

[0032] Figure 4 A circuit diagram of an earphone circuit of an earphone module of an embodiment of a device control circuit of the present invention;

[0033] Figure 5 A circuit diagram of a radio frequency module of an embodiment of a device control circuit of the present invention;

[0034] Figure 6 A schematic diagram of a microstrip line structure of an embodiment of a device control circuit of the present invention;

[0035] Figure 7 A schematic diagram of a coplanar waveguide structure of an embodiment of a device control circuit of the present invention;

[0036] Figure 8 It is a schematic diagram of a first embodiment of a microstrip line combined with a coplanar waveguide structure of a device control circuit of the present invention.

[0037] Fig. 9 A schematic diagram of a second embodiment of a microstrip line combined with a coplanar waveguide structure of a device control circuit of the present invention;

[0038] Fig.10 A schematic diagram of a third embodiment of a microstrip line combined with a coplanar waveguide structure of a device control circuit of the present invention;

[0039] Fig.11 The second schematic diagram of the second embodiment of the microstrip line combined with the coplanar waveguide structure of the device control circuit of the present invention;

[0040] Fig.12 A third schematic diagram of a second embodiment of a microstrip line combined with a coplanar waveguide structure of an embodiment of a device control circuit of the present invention;

[0041] Fig.13 A fourth schematic diagram of a second embodiment of a microstrip line combined with a coplanar waveguide structure of an embodiment of a device control circuit of the present invention;

[0042] In the figure, 10, device control circuit; 11, control chip; 12, camera module; 121, camera interface; 122, clock connection line; 123, data connection line; 13, audio module; 131, electret microphone circuit; 1311 microphone input terminal; 132, headphone circuit; 1321, headphone detection circuit; 1322, microphone interface circuit; 1323, headphone interface circuit; 14, RF module; 141, RF control chip; 142, RF signal Line; 1421, microstrip line structure; 14211, first RF signal line; 14212, first ground layer; 14213, first ground hole; 1422, coplanar waveguide structure; 14221, first ground line; 14222, second RF signal line; 14223, reference ground; 1423, microstrip line combined with coplanar waveguide structure; 14231, third RF signal line; 14232, second ground line; 14233, fourth RF signal line; 14234, second ground layer; 14235, second ground hole; 1424, microstrip line combined with coplanar waveguide structure; 14241, fifth RF signal line; 14242, third ground line; 14243, sixth RF signal line; 14244, third ground layer; 14245, power layer; 14246, third ground hole; 1425, microstrip line combined with coplanar waveguide structure; 14251, fifth RF signal line; 14252, third ground line; 14253, sixth RF signal line; 14254, third ground layer; 14255, power layer; 14256, third ground hole; 1426, microstrip line combined with coplanar waveguide structure; 14261, stepped groove; 1427, microstrip line combined with coplanar waveguide structure; 14271, first groove; 1428, microstrip line combined with coplanar waveguide structure; 14281, second groove; 143. Antenna; 15. Power supply module. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0044] The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", "top" and "bottom", are only for reference to the orientation of the drawings. The directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0045] The terms "first", "second", etc. in the present invention are used for descriptive purposes only and should not be understood as indicating or implying relative importance, and should not be used as a limitation on the order of precedence.

[0046] Please refer to Figure 1 to Figure 2 , Figure 1 is a block diagram of an embodiment of a device control circuit of the present invention, Figure 2 A circuit diagram of a camera module according to an embodiment of the device control circuit of the present invention.

[0047] In the figures, structurally similar elements are denoted by the same reference numerals.

[0048] Please refer to Figure 1 to Figure 2 The present invention provides a device control circuit 10, which includes a control chip 11, a camera module 12, an audio module 13, a radio frequency module 14 and a power supply module 15. The power supply module 15 is used to provide working voltages for the control chip 11, the camera module 12, the audio module 13 and the radio frequency module 14 respectively. The power line of the power supply module 15 and the signal line of the audio module 13 need to cross each other, and the power line of the power supply module 15 needs to be away from the signal line of the audio module 13.

[0049] Please refer to Figure 1 to Figure 2 , the camera module 12 is connected to the control chip 11, and the camera module 12 transmits video data and image data to the control chip 11. The camera module 12 includes a camera interface circuit, and the camera interface circuit includes a clock connection line 122 and a data connection line 123, a camera interface 121, and a camera control chip J9. The camera interface 121 is connected to the camera control chip J9 through a signal line, and the ground pin of the camera control chip J9 is grounded. The clock connection line 122 is used for the camera interface 121 to transmit the clock signal to the camera control chip J9, and the data connection line 123 is used for the camera interface 121 to transmit the data signal to the camera control chip J9. The clock connection line 122 and the data connection line 123 are both high-speed signal lines with set characteristic impedance and are differential signal lines. The differential signal line can be used to reduce the influence of noise interference signals. The set characteristic impedance is 95omh-105ohm. The transmission rates of the clock connection line 122 and the data connection line 123 are both within 2.5Gbps. Controlling the characteristic impedance of the clock connection line 122 can effectively reduce the reflection of the clock signal and the distortion of the clock signal. Controlling the characteristic impedance of the data connection line 123 can effectively reduce the reflection of the data signal and the distortion of the data signal.

[0050] Please refer to Figure 1 to Figure 2, the differential signal line is two signal lines, both of which transmit differential signals, and the two differential signals have the same amplitude and opposite phase. The differential signal is detected by a differential amplifier at the receiving end, and the differential amplifier only amplifies the difference between the two input signals. The noise interference signal is often a common-mode signal, which is a pair of signals of equal magnitude and polarity acting on the differential signal line. During the signal transmission process, the noise interference signal will be loaded onto the differential signal line at the same value and at the same time, so the difference of the noise interference signal is zero, and the noise interference signal has no effect on the logical meaning of the data signal. The differential signal line can be used to reduce the impact of the noise interference signal. Moreover, the differential signal lines are close together and the signal amplitudes are equal, and the amplitudes of the coupled electromagnetic fields between the differential signal line and the ground line are also equal. Because the signals on the differential signal line have opposite polarities, their electromagnetic fields will cancel each other out, so the differential signal line can also effectively suppress electromagnetic interference.

[0051] Please refer to Figure 1 to Figure 2 , the lengths of the clock connection line 122 and the data connection line 123 are the first set value, and the first set value is 100mm-305mm. Since the camera interface circuit is an integrated circuit, the lengths of the clock connection line 122 and the data connection line 123 are 100mm-305mm, which can facilitate the integration of the camera interface circuit. At least two data connection lines 123 constitute the data connection lines 123 of the same video component. The length difference of the data connection lines 123 of the same video component is the second set value, and the second set value is 0-1.5mm. Since the second set value is 0-1.5mm, the data connection line 123 transmits the data of the same video component, so the transmission speed of the data of the same video component is consistent, and the consistent transmission data speed can reduce the error between the data of the same component. The length difference of the data connection lines 123 between different video components is the third set value, and the third set value is 0-3.3mm. Since the third set value is 0-3.3mm, the transmission speeds of the data connection lines 123 of different video components are consistent, which effectively improves the transmission efficiency of the data connection lines 123.

[0052] Please refer to Figure 1 to Figure 2 , the spacing between different clock connection lines 122 is 1.45-1.55 times the line width of the clock connection line 122. Since the mutual inductance and mutual capacitance between different clock connection lines 122 may cause noise on the line, setting the spacing between different clock connection lines 122 can reduce noise interference and prevent crosstalk between different clock connection lines 122. The spacing between different data connection lines 123 is 1.45-1.55 times the line width of the data connection line 123. Since the mutual inductance and mutual capacitance between different data connection lines 123 may cause noise on the line, setting the spacing between different data connection lines 123 can reduce noise interference and prevent crosstalk between different data connection lines 123.

[0053] Please refer to Figure 1 to Figure 2 The camera interface circuit also includes an analog power supply VCAMA_PMU, a digital power supply VCAMD_PMU, an input / output power supply VCAM_IO_PMU, and an external device power supply VLADO28_PMU. The analog power supply VCAMA_PMU supplies power to the analog circuit of the camera interface circuit, and the digital power supply VCAMD_PMU supplies power to the digital circuit of the camera interface circuit. The input / output power supply VCAM_IO_PMU supplies power to the input / output circuit of the camera interface circuit, and the external device power supply VLADO28_PMU is used for the camera control chip to provide the working voltage of the external device. The analog power supply VCAMA_PMU and the digital power supply VCAMD_PMU are powered by different low voltage difference linear regulators. Since the signal output by the digital power supply VCAMD_PMU has high-frequency pulsation noise, and the analog device is sensitive to the high-frequency pulsation noise of the power supply, the high-frequency pulsation noise can easily affect the normal operation of the analog device. Therefore, the analog part power supply VCAMA_PMU and the digital part power supply VCAMD_PMU are respectively powered by different low voltage difference linear regulators, which can prevent the analog part circuit VCAMA_PMU from being interfered by the noise of the digital part power supply VCAMD_PMU.

[0054] Please refer to Figure 1 to Figure 2, the camera interface circuit includes a first bypass capacitor and a second bypass capacitor. The first bypass capacitor includes a first bypass capacitor C27, a first bypass capacitor C15, a first bypass capacitor C14, and a first bypass capacitor C22. The second bypass capacitor includes a second bypass capacitor C26, a second bypass capacitor C25, a second bypass capacitor C24, and a second bypass capacitor C23. The first bypass capacitor C22 and the second bypass capacitor C23 are connected between the digital part power supply VCAMD_PMU and the ground terminal. The first bypass capacitor C14 and the second bypass capacitor C24 are connected between the input / output power supply VCAM_IO_PMU and the ground terminal, and the first bypass capacitor C15 and the second bypass capacitor C25 are connected between the external device power supply VLADO28_PMU and the ground terminal. The first bypass capacitor C27 and the second bypass capacitor C26 are connected between the analog part power supply VCAMA_PMU and the ground terminal. The capacitive reactance of the first bypass capacitor is 4.65μF-4.75μF, and the capacitive reactance of the second bypass capacitor is 99.5NF-100.5NF. The first bypass capacitor C27 is connected in parallel with the second bypass capacitor C26, and the first bypass capacitor C15 is connected in parallel with the second bypass capacitor C25. The first bypass capacitor C14 is connected in parallel with the second bypass capacitor C24, and the first bypass capacitor C22 is connected in parallel with the second bypass capacitor C23. The first bypass capacitor and the second bypass capacitor can filter out high-frequency clutter in the camera interface circuit.

[0055] Please refer to Figure 1 to Figure 2 The camera interface circuit is also provided with an electrostatic resistor, which includes an electrostatic resistor ESD1, an electrostatic resistor ESD2 and an electrostatic resistor ESD3. The electrostatic resistor ESD1 is connected in parallel with the clock data line 123, the electrostatic resistor ESD2 is connected in parallel with the data connection line 123, and the electrostatic resistor ESD3 is connected in parallel with the data connection line 123. A TVS diode is provided inside the electrostatic resistor, and the parasitic capacitance of the TVS diode is 0.5-1.0pF. The electrostatic resistor is used for electrostatic protection. Since static electricity is generated in the camera interface circuit, sensitive electronic components in the circuit are easily affected by electrostatic discharge. The electrostatic resistor has a fast reaction speed and a low capacitance value. The electrostatic resistor can prevent sensitive electronic components from being affected by electrostatic discharge.

[0056] Please refer to Figure 3 and Figure 4 , Figure 3 is a circuit diagram of an electret microphone circuit of an earphone module of an embodiment of a device control circuit of the present invention, Figure 4 The circuit diagram is a headphone circuit of a headphone module according to an embodiment of the device control circuit of the present invention.

[0057] exist Figure 1 Based on Figure 3. The audio module 13 includes an electret microphone circuit 131 and an earphone circuit 132. The electret microphone circuit 131 is connected in parallel with the earphone circuit 132, and the electronic components of the audio module 13 are connected through a signal line. The electret microphone circuit 131 is provided with a microphone input terminal 1311, and the microphone input terminal 1311 includes a microphone input positive electrode AU_VIN_P and a microphone input negative electrode AU_VIN_N. A first capacitor C3 is connected between the microphone input positive electrode AU_VIN_P and the microphone input negative electrode AU_VIN_P, and the capacitive reactance of the first capacitor C3 is 99.5-100.5pF. An electret microphone MIC is connected in series between the microphone input positive electrode AU_VIN_P and the microphone input negative electrode AU_VIN_P, and the electret microphone MIC is used for sound-to-electric conversion. The electret microphone circuit 131 generates an electrical signal through sound-to-electric conversion, and the electrical signal flows to the earphone control chip J4 through the microphone interface HP_MIC of the earphone circuit 132. A first coupling capacitor C1 and a first inductor L1 are connected in series between the microphone input positive terminal AU_VIN_P and the electret microphone MIC. The capacitive reactance of the first coupling capacitor is 0.95μF-1.05μF. The first coupling capacitor C1 is used to transmit AC signals. A second coupling capacitor C2 and a second inductor L2 are connected in series between the microphone input negative terminal AU_VIN_N and the electret microphone MIC. The capacitive reactance of the second coupling capacitor C2 is 0.95μF-1.05μF. The second coupling capacitor C2 is used to transmit AC signals. A first TVS diode ED2 is connected in parallel between the microphone input positive terminal AU_VIN_P and the electret microphone MIC. A second TVS diode ED1 is connected in parallel between the microphone input negative terminal AU_VIN_N and the electret microphone MIC. The first TVS diode ED2 and the second TVS diode ED1 are used to provide fast overvoltage protection for the circuit elements of the electret microphone circuit 131. The signal line of the electret microphone circuit 131 needs to be grounded. The signal line can shield interference signals through grounding. Grounding means that a ground line is arranged around the entire signal line.

[0058] exist Figure 1 Based on Figure 3. The electret microphone circuit 131 includes a first filter capacitor, and the capacitive reactance of the first filter capacitor is 32.5-34.5pF. The first filter capacitor is connected in parallel with the electret microphone circuit 131, and the first filter capacitor is used to filter out radio frequency interference. The first filter capacitor includes a first filter capacitor C5 and a first filter capacitor C6, and the distance between the first filter capacitor and the microphone input terminal 1311 is smaller than the distance between the first filter capacitor and the control chip 11. The first filter capacitor is used to filter out high-frequency interference when operating at a frequency of 900MHz. A shorter wiring is required between the first filter capacitor and the microphone input terminal 1311, so the signal first passes through the first filter capacitor and then to other points, so the first filter capacitor can better filter out high-frequency interference. Since there is a radio frequency interference signal on the electret microphone circuit 131, the first filter capacitor can be used to filter out the radio frequency interference signal.

[0059] exist Figure 1 Based on Figure 3 . The electret microphone interface circuit includes a power supply MICBIASO, which is used to provide an operating voltage for the electret microphone circuit 131. A first resistor R1 and a second resistor R2 are arranged between the power supply MICBIASO and the microphone input terminal 1311, and the first resistor R1 and the second resistor R2 are connected in series. The resistance of the first resistor R1 is 0.95-1.05 kΩ, and the resistance of the second resistor R2 is 1.45-1.55 kΩ. A third resistor R3 and a fourth resistor R4 are arranged between the microphone input terminal 1311 and the ground terminal, and the third resistor R3 and the fourth resistor R4 are connected in series. The resistance of the third resistor R3 is 1.45-1.55 kΩ, and the resistance of the fourth resistor R4 is 0.95-1.05 kΩ. The electret microphone circuit 131 includes a second filter capacitor C2, which is arranged between the power supply MICBIASO and the ground terminal, and the capacitive reactance of the second filter capacitor C2 is 9.5-10.5 pF. The distance between the second filter capacitor C2 and the microphone input terminal 1311 is smaller than the distance between the second filter capacitor C2 and the control chip 11, and the second filter capacitor C2 is used to filter out high-frequency interference when operating at a frequency of 1800MHz. A shorter wiring is required between the second filter capacitor C2 and the microphone input terminal 1311, so the signal first passes through the second filter capacitor C2 and then to other points, so the first filter capacitor can better filter out high-frequency interference. Since there is a radio frequency interference signal on the electret microphone circuit 131, the second filter capacitor C2 can be used to filter out the radio frequency interference signal. The impact of the radio frequency interference signal usually depends on different designs. The circuit can select the required filter capacitor according to the test results, or even the circuit does not need to select the filter capacitor.

[0060] exist Figure 1 Based on Figure 4. The earphone circuit 132 includes an earphone control chip J4, an earphone interface circuit 1323, a microphone interface circuit 1322, an earphone detection circuit 1321, and an earphone antenna input terminal FM_ANT. The earphone control chip J4 is respectively connected to the earphone interface circuit 1323, the microphone interface circuit 1322, the earphone detection circuit 1321, and the earphone antenna input terminal FM_ANT. The earphone detection circuit 1321 is used to detect the insertion and removal of the earphone, and the earphone detection circuit 1321 includes an earphone detection interface HP_ACCDET, a first magnetic bead B6, and a fifth resistor R9. The first magnetic bead B6 is connected in series between the earphone detection interface HP_ACCDET and the earphone control chip J4, and the fifth resistor R9 is connected in series between the earphone detection interface HP_ACCDET and the earphone control chip J4. The microphone interface circuit 1323 includes a microphone interface HP_MIC and a second magnetic bead B8, and the second magnetic bead B8 is connected in series between the microphone interface HP_MIC and the earphone control chip J4. The first magnetic bead B6 and the second magnetic bead B8 can suppress high-frequency interference and spike interference on the signal line, and the first magnetic bead B6 and the second magnetic bead B8 can also suppress electromagnetic interference on the signal line. A third inductor L3 is arranged between the headphone antenna input terminal FM_ANT and the ground terminal, and the inductance of the third inductor L3 is 99.5-100.5NH.

[0061] exist Figure 1 Based on Figure 4 . The headphone interface circuit 1323 includes a headphone interface and a third filter capacitor, and the third filter capacitor includes a third filter capacitor C32 and a third filter capacitor C31. The third filter capacitor is connected in parallel with the headphone circuit 132, and the distance between the third filter capacitor and the headphone interface is smaller than the distance between the third filter capacitor and the control chip 11. The capacitive reactance of the third capacitor is 32.5-33.5pF, and the third filter capacitor can be used to better filter out radio frequency interference. Since there is a radio frequency interference signal on the headphone circuit, the third filter capacitor can be used to filter out the radio frequency interference signal. The third filter capacitor can be selected according to the test results, and in some cases the third filter capacitor does not need to be selected.

[0062] exist Figure 1 Based on Figure 4, the headphone interface circuit includes a headphone interface and a magnetic bead. The headphone interface includes a headphone left channel interface AU_HPL and a headphone right channel interface AU_HPR. The distance between the magnetic bead and the headphone interface is less than the distance between the magnetic bead and the control chip 11, and the magnetic bead can be used to better suppress noise interference on the headphone circuit. The magnetic beads include a third magnetic bead B9, a fourth magnetic bead B10, a fifth magnetic bead B12, and a sixth magnetic bead B13. The third magnetic bead B9 and the fourth magnetic bead B10 are connected in series between the headphone left channel interface AU_HPL and the headphone control chip J4, and the fifth magnetic bead B12 and the sixth magnetic bead B13 are connected in series between the headphone right channel interface AU_HPR and the headphone control chip J4. The third magnetic bead B9 and the fourth magnetic bead B10 can suppress high-frequency interference and spike interference on the signal line, and the third magnetic bead B9 and the fourth magnetic bead B10 can also suppress electromagnetic interference on the signal line. The fifth magnetic bead B12 and the sixth magnetic bead B13 can suppress high-frequency interference and spike interference on the signal line. The fifth magnetic bead B12 and the sixth magnetic bead B13 can also suppress electromagnetic interference on the signal line.

[0063] exist Figure 1 Based on Figure 4 , the earphone module includes a third TVS diode VR7, a fourth TVS diode VR4, a fifth TVS diode VR5, and a sixth TVS diode VR6. The third TVS diode VR7 is connected in parallel to the earphone detection circuit 1321, and the fourth TVS diode VR4 is connected in parallel to the microphone interface circuit 1322. The fifth TVS diode VR5 is connected in parallel to the earphone interface circuit 1323, and the sixth TVS diode VR6 is connected in parallel to the earphone interface circuit 1323. Among them, the third TVS diode VR7 is used to perform rapid overvoltage protection on the circuit elements of the earphone detection circuit 1321. The fourth TVS diode VR4 is used to perform rapid overvoltage protection on the circuit elements of the microphone interface circuit 1322, and the fifth TVS diode VR5 and the sixth TVS diode VR6 are used to perform rapid overvoltage protection on the circuit elements of the earphone interface circuit 1323. A sixth resistor R10 is connected between the earphone interface circuit 132 and the ground terminal, and a seventh resistor R11 is connected between the earphone interface circuit 132 and the ground terminal, and the sixth resistor R10 is connected in parallel with the seventh resistor R11.

[0064] Please refer to Figure 5 , Figure 5 It is a circuit diagram of a radio frequency module of an embodiment of the device control circuit of the present invention.

[0065] exist Figure 1 Based on Figure 5, the RF module 14 is connected to the control chip 11. The RF module 14 is used to receive radio signals transmitted to the control chip 11, and the RF module 14 is used to send wired electrical signals from the control chip 11. The RF module 14 includes a RF circuit, and the RF circuit is provided with a RF signal line 142, a RF control chip 141 and an antenna 143. The RF signal line 142 is used for bidirectional transmission of RF signals between the antenna 143 and the RF control chip 141. A first π matching circuit is connected between the RF control chip 141 and the antenna Main, and the circuit elements of the first π matching circuit are the fifth resistor R7, the second capacitor C7, and the third capacitor C8. A second π matching circuit is connected between the RF control chip and the antenna DRX, and the circuit elements of the second π matching circuit are the sixth resistor R8, the fourth capacitor C9, and the fifth capacitor C10. The π matching circuit can suppress harmonic components and interference outside the operating frequency of the antenna 143, the π matching circuit can be used for impedance matching, and the π matching circuit can transmit signal power to the antenna. The antenna 143 needs to be far away from the audio module 13 . The far distance between the antenna 143 and the audio module 13 can reduce the radiation interference of the antenna 143 to the audio module 13 .

[0066] Please refer to Figure 6 , Figure 6 FIG. 1 is a schematic diagram of a microstrip line structure of an embodiment of a device control circuit of the present invention.

[0067] Please refer to Figure 6 The microstrip line structure 1421 is a two-layer PCB microstrip line structure, and the microstrip line structure 1421 can be used to control the characteristic impedance of the RF signal line 142. The microstrip line structure 1421 includes a first ground hole 14213, a first RF signal line 14211, a first ground layer 14212, and a prepreg. The first ground layer 14212 is arranged on the second layer of the two-layer PCB microstrip line structure. The first RF signal line 14211 is arranged in the middle of the first layer of the microstrip line structure 1421, and the prepreg is arranged between the first RF signal line and the first ground layer. The prepreg is mainly composed of resin and reinforcing material, and the prepreg is an insulating material. The first ground hole 14213 is arranged between the first RF signal line 14211 and the first ground layer 14212, and the first ground hole 14213 can improve the RF performance of the microstrip line structure 1421. The horizontal distance between the first ground hole 14213 and the first RF signal line 14211 is at least twice the line width of the first RF signal line 14211, and the distance between the first RF signal line 14211 and the first grounding layer 14212 is the height of the reference ground plane, and the microstrip line structure 1421 can effectively transmit high-frequency signals. The microstrip line structure 1421 can control the thickness and width of the first RF signal line 14211, and the microstrip line structure 1421 can also control the distance between the first RF signal line 14211 and the first grounding layer 14212, so the characteristic impedance of the microstrip line structure 1421 can also be controlled to remain unchanged.

[0068] Please refer to Figure 7 , Figure 7 FIG. 1 is a schematic diagram of a coplanar waveguide structure of an embodiment of a device control circuit of the present invention.

[0069] Please refer to Figure 7 , the coplanar waveguide structure 1422 is a coplanar waveguide structure of two layers of PCB boards, and the coplanar waveguide structure 1422 can control the characteristic impedance of the RF signal line 142. The coplanar waveguide structure 1422 includes a first ground line 14221, a second RF signal line 14222, a reference ground 14223, and a prepreg. The second RF signal line is arranged in the middle of the first layer of the coplanar waveguide structure of the two layers of PCB boards. The reference ground is arranged in the second layer of the coplanar waveguide structure of the two layers of PCB boards, and the prepreg is arranged between the first RF signal line and the first ground layer. The prepreg is mainly composed of resin and reinforcing material, and the prepreg is an insulating material. The first ground line 14221 is arranged at both ends of the second RF signal line 14222, and the distance between the first ground line 14221 and the second RF signal line 14222 is the ground clearance, and the distance between the first ground line 14221 and the reference ground 14223 is the height of the reference ground plane. The first ground line 14221 can be used to shield interference, and the coplanar waveguide structure 1422 can control the impedance of the circuit by adjusting the distance between the second RF signal line 14222 and the first ground line 14221. The coplanar waveguide structure 1422 can control the impedance of the circuit by adjusting the line width of the second RF signal line 14222, and the coplanar waveguide structure 1422 can control the impedance of the circuit by adjusting the distance between the second RF signal line 14222 and the reference ground 14223. Therefore, the characteristic impedance of the coplanar waveguide structure 1422 can also be controlled to remain unchanged.

[0070] Figure 8 It is a schematic diagram of a first embodiment of a microstrip line combined with a coplanar waveguide structure of a device control circuit of the present invention.

[0071] When two groups of RF signal lines transmit signals, the microstrip line combined with the coplanar waveguide structure 1423 can be set as a three-layer PCB board structure. The microstrip line combined with the coplanar waveguide structure 1423 includes a coplanar waveguide and a microstrip line, and the coplanar waveguide includes a third RF signal line 14231 and a second ground line 14232. The third RF signal line 14231 is arranged in the middle of the first layer of the microstrip line combined with the coplanar waveguide structure 1423, and the second ground line 14232 is arranged at both ends of the third RF signal line 14231, and the distance between the second ground line 14232 and the third RF signal line 14231 is set as a ground clearance. The microstrip line combined with the coplanar waveguide structure 1423 can control the impedance of the circuit by adjusting the distance between the third RF signal line 14231 and the second ground line 14232. The microstrip line combined with the coplanar waveguide structure 1423 can control the impedance of the circuit by adjusting the line width of the third radio frequency signal line 14231, and the microstrip line combined with the coplanar waveguide structure can control the characteristic impedance of the circuit by adjusting the distance between the third radio frequency signal line 14231 and the second ground line 14232. The microstrip line combined with the coplanar waveguide structure 1423 can also adjust the distance between the third radio frequency signal line 14231 and the second ground layer 14234 to control the characteristic impedance of the circuit.

[0072] The microstrip line is arranged on the second layer and the third layer, and the microstrip line includes a fourth RF signal line 14233, a second ground hole 14236, a second ground layer 14234, and a second ground hole 14235. The fourth RF signal line 14233 is arranged on the second layer of the microstrip line combined with the coplanar waveguide structure 1423, and the second ground layer 14234 is arranged on the third layer of the microstrip line combined with the coplanar waveguide structure 1423. The second ground hole 14235 is arranged between the fourth RF signal line 14233 and the second ground layer 14234, and the horizontal spacing between the second ground hole 14235 and the fourth RF signal line 14233 is at least twice the line width of the third RF signal line 14231, and the distance between the third RF signal line 14231 and the second ground layer 14234 is the height of the reference ground plane. The RF signal is transmitted through the coplanar waveguide, and the RF signal can be shielded from interference through the ground line. The RF signal can also be transmitted through the microstrip line and the RF signal is shielded from interference through the ground hole. The microstrip line combined with the coplanar waveguide structure 1423 can control the thickness and width of the fourth radio frequency signal line 14233, and the microstrip line combined with the coplanar waveguide structure 1423 can also control the distance between the fourth radio frequency signal line 14233 and the second ground layer 14234. Because the characteristic impedance of the circuit is related to the thickness and width of the fourth radio frequency signal line 14233, and the characteristic impedance of the circuit is also related to the distance between the fourth radio frequency signal line 1423 and the second ground layer 14234, the characteristic impedance of the microstrip line combined with the coplanar waveguide structure 1423 can also be controlled to remain unchanged.

[0073] Please refer to Fig. 9 , Fig. 9It is a schematic diagram of a second embodiment of a microstrip line combined with a coplanar waveguide structure of a device control circuit of the present invention.

[0074] Please refer to Fig. 9 , when two groups of RF signal lines transmit signals and the RF signal lines need to be shielded from interference from the power supply, the microstrip line combined with the coplanar waveguide structure 1424 is a four-layer PCB board structure. The microstrip line combined with the coplanar waveguide structure includes a coplanar waveguide and a microstrip line. The coplanar waveguide is arranged on the first layer of the microstrip line combined with the coplanar waveguide structure 1424, and the coplanar waveguide includes a fifth RF signal line 14241 and a third ground line 14242. The fifth RF signal line 14241 is arranged in the middle of the first layer of the microstrip line combined with the coplanar waveguide structure 1424, and the third ground line 14242 is arranged at both ends of the fifth RF signal line 14241, and the distance between the third ground line 14242 and the fifth RF signal line 14241 is the ground clearance. The microstrip line combined with the coplanar waveguide structure 1424 can control the impedance of the circuit by adjusting the distance between the fifth RF signal line 14241 and the third ground line 14242. The microstrip line combined with the coplanar waveguide structure 1424 can control the impedance of the circuit by adjusting the line width of the third radio frequency signal line 14241, and the microstrip line combined with the coplanar waveguide structure 1424 can control the characteristic impedance of the circuit by adjusting the distance between the fifth radio frequency signal line 14241 and the third ground line 14242. The microstrip line combined with the coplanar waveguide structure 1424 can also control the characteristic impedance of the circuit by adjusting the distance between the fifth radio frequency signal line 14241 and the third ground layer 14244.

[0075] The microstrip line is arranged on the second layer, the third layer, and the fourth layer, and the microstrip line includes the sixth RF signal line 14243, the third ground hole 14246, the third ground layer 14244, and the power layer 14245. A prepreg is arranged between each layer, and the prepreg is mainly composed of resin and reinforcing material, and the prepreg is an insulating material. The sixth RF signal line 14243 is arranged on the second layer of the microstrip line combined with the coplanar waveguide structure 1424, and the third ground layer 14244 is arranged on the third layer of the microstrip line combined with the coplanar waveguide structure 1424. The power layer 14235 is arranged on the fourth layer of the microstrip line combined with the coplanar waveguide structure 1423, and the third ground hole 14236 is arranged between the sixth RF signal line 14243 and the third ground layer 14244. The horizontal spacing between the third ground hole 14246 and the sixth RF signal line 14243 is at least twice the line width of the fifth RF signal line 14241, and the distance between the sixth RF signal line 14243 and the third ground layer 14244 is the height of the reference ground plane. The RF signal can be transmitted through the coplanar waveguide, and the RF signal can be shielded from interference through the ground line. Or the RF signal can be transmitted through the microstrip line, and the RF signal can be shielded from interference through the ground hole. The microstrip line combined with the coplanar waveguide structure 1424 can control the thickness and width of the sixth RF signal line 14243, and the microstrip line combined with the coplanar waveguide structure 1424 can also control the distance between the sixth RF signal line 14243 and the third ground layer 14244. Because the characteristic impedance of the circuit is related to the thickness and width of the sixth RF signal line 14243, and the characteristic impedance of the circuit is also related to the distance between the sixth RF signal line 14243 and the third ground layer 14244, the characteristic impedance of the microstrip line combined with the coplanar waveguide structure 1424 can also be controlled unchanged. Since the power layer 14245 is disposed inside the four-layer PCB board, the power layer 14245 is far away from the fifth RF signal line 14241 and the sixth RF signal line 14243, and a prepreg with an insulating structure is disposed between the power layer and the fifth RF signal line 14241 and the sixth RF signal line 14243. Therefore, the microstrip line combined with the coplanar waveguide structure 1424 can effectively shield the interference of the power supply to the RF signal line.

[0076] Fig.10 It is a schematic diagram of a third embodiment of a microstrip line combined with a coplanar waveguide structure of a device control circuit of the present invention.

[0077] Please refer to Fig.10, when two groups of RF signal lines transmit signals and the RF signal lines need to be shielded from interference from the power supply, the microstrip line combined with the coplanar waveguide structure 1425 is a four-layer PCB board structure. The microstrip line combined with the coplanar waveguide structure includes a coplanar waveguide and a microstrip line. The coplanar waveguide is arranged on the first layer of the microstrip line combined with the coplanar waveguide structure 1425, and the coplanar waveguide includes a fifth RF signal line 14251 and a third ground line 14252. The fifth RF signal line 14251 is arranged in the middle of the first layer of the microstrip line combined with the coplanar waveguide structure 1425, and the third ground line 14252 is arranged at both ends of the fifth RF signal line 14251, and the distance between the third ground line 14252 and the fifth RF signal line 14251 is the ground clearance. The microstrip line combined with the coplanar waveguide structure 1423 can control the impedance of the circuit by adjusting the distance between the fifth RF signal line 14251 and the third ground line 14252. The microstrip line combined with the coplanar waveguide structure 1425 can control the impedance of the circuit by adjusting the line width of the fifth radio frequency signal line 14251, and the microstrip line combined with the coplanar waveguide structure 1425 can control the impedance of the circuit by adjusting the distance between the fifth radio frequency signal line 14251 and the third ground layer 14254. The microstrip line combined with the coplanar waveguide structure 1423 can also control the characteristic impedance of the circuit by adjusting the distance between the fifth radio frequency signal line 14253 and the third ground layer 14254.

[0078] The microstrip line is arranged on the second layer, the third layer, and the fourth layer, and the microstrip line includes a sixth radio frequency signal line 14253, a third ground hole 14256, a third ground layer 14254, and a power layer 14255. A prepreg is arranged between each layer, and the prepreg is mainly composed of resin and reinforcing material, and the prepreg can be used for the insulation of the signal line. The sixth radio frequency signal line 14253 is arranged on the second layer of the microstrip line combined with the coplanar waveguide structure 1425, and the third ground layer 14254 is arranged on the fourth layer of the microstrip line combined with the coplanar waveguide structure 1425. The power layer 14255 is arranged on the third layer of the microstrip line combined with the coplanar waveguide structure 1425. Since the power layer is arranged on the third layer of the microstrip line combined with the coplanar waveguide structure 1425, and the radio frequency signal line is located on the first layer and the second layer of the microstrip line combined with the coplanar waveguide structure 1425, the power layer is convenient for providing the working voltage of the four-layer PCB board. The third ground hole 14256 is disposed between the fourth RF signal line and the third ground layer 14254. The horizontal spacing between the third ground hole 14256 and the sixth RF signal line 14253 is at least twice the line width of the fifth RF signal line 14251, and the distance between the sixth RF signal line 14253 and the third ground layer 14254 is the height of the reference ground plane. The RF signal can be transmitted through the coplanar waveguide, and the RF signal can be shielded from interference through the ground line. Alternatively, the RF signal can be transmitted through the microstrip line, and the RF signal can be shielded from interference through the ground hole. The microstrip line combined with the coplanar waveguide structure 1425 can control the thickness and width of the sixth RF signal line 14253. The microstrip line combined with the coplanar waveguide structure 1425 can also control the distance between the sixth RF signal line 14253 and the third ground layer 14254. Because the characteristic impedance of the circuit is related to the thickness and width of the sixth RF signal line 14253, and the characteristic impedance of the circuit is also related to the distance between the sixth RF signal line 14253 and the third ground layer 14254, the characteristic impedance of the microstrip line combined with the coplanar waveguide structure 1425 can also be controlled unchanged. Since the power supply layer 14255 is arranged inside the four-layer PCB board, a semi-cured sheet with an insulating structure is arranged between the power supply layer and the fifth RF signal line 14251 and the sixth RF signal line 14253. Therefore, the microstrip line combined with the coplanar waveguide structure 1425 can effectively shield the interference of the power supply to the RF signal line.

[0079] Please refer to Figures 8 to 10, the microstrip line combined with the coplanar waveguide structure includes a coplanar waveguide and a microstrip line. Coplanar waveguide and microstrip line can transmit two signals at the same time. Compared with the coplanar waveguide, the dispersion of the microstrip line is higher, and compared with the coplanar waveguide, the radiation loss of the microstrip line is higher. If the transmitted signal requires lower dispersion or the transmitted signal requires less loss, the signal should be transmitted using a coplanar waveguide. Since the coplanar waveguide has a thicker dielectric layer and the thermal conductivity of the coplanar waveguide is poor, the coplanar waveguide is not conducive to the realization of a high-power amplifier. The microstrip line combined with the coplanar waveguide structure includes a microstrip line and a coplanar waveguide. Microstrip lines can be used for the RF signal lines 142 in the high-power amplifier, and coplanar waveguides can be used for the remaining RF signal lines 142.

[0080] Fig.11 The second schematic diagram of the second embodiment of the present invention is a microstrip line combined with a groove of a coplanar waveguide structure of a device control circuit.

[0081] Please refer to Fig.11 , the microstrip line combined with coplanar waveguide structure 1426 includes a groove. The groove includes a first side and a second side, and the groove is designed so that the length of the first side is greater than the length of the second side. The bottom of the groove may be stepped, and the groove is a stepped groove 14261. The stepped groove 14261 is arranged at the lower ends of the fifth RF signal line 14241 and the third ground line 14242, and the stepped groove 14261 is located between the first layer and the second layer. Since there is dielectric loss in the coplanar waveguide, the provision of a groove on the prepreg can reduce the dielectric loss caused by the prepreg, and the quality of the coplanar waveguide transmission signal is better. Since the groove is provided on the prepreg, the mechanical strength of the microstrip line combined with the coplanar waveguide will be reduced, and the microstrip line combined with the coplanar waveguide will be easily damaged. The deeper the depth of the groove, the lower the mechanical strength of the microstrip line combined with the coplanar waveguide. Therefore, if a deeper groove needs to be designed, the mechanical strength of the microstrip line combined with the coplanar waveguide will be lower. The larger the width of the groove, the lower the mechanical strength of the microstrip line combined with the coplanar waveguide. Therefore, if a wider groove is required to be designed, the mechanical strength of the microstrip line combined with the coplanar waveguide will be lower. The stepped groove 14261 can reduce the transmission loss of the coplanar waveguide, and at the same time, the stepped groove 14261 can ensure that the strength of the microstrip line combined with the coplanar waveguide structure is high.

[0082] Fig.12 The third schematic diagram of the second embodiment of the present invention is a microstrip line combined with a groove of a coplanar waveguide structure of a device control circuit.

[0083] The microstrip line combined with the coplanar waveguide structure 1427 includes a groove, and the bottom of the groove may be arc-shaped. The arc of the arc is a minor arc, and the minor arc is recessed in the groove, and the groove is a first groove 14271. The first groove 14271 is arranged at the lower ends of the fifth RF signal line 14241 and the third ground line 14242, and the first groove 14271 is located between the first layer and the second layer of the microstrip line combined with the coplanar waveguide structure 1427. The first groove 14271 can reduce the transmission loss of the coplanar waveguide, and at the same time, the first groove 14271 can ensure that the microstrip line combined with the coplanar waveguide structure 1427 has a high strength.

[0084] Fig.13 The fourth schematic diagram of the second embodiment of the present invention is a microstrip line combined with a groove of a coplanar waveguide structure of a device control circuit.

[0085] The coplanar waveguide of the microstrip line combined with the coplanar waveguide structure 1428 includes a groove, and the bottom of the groove may be arc-shaped. The arc of the arc is a minor arc, and the minor arc protrudes from the groove, and the groove is a second groove 14281. The second groove 14281 is arranged at the lower ends of the fifth RF signal line 14241 and the third ground line 14242, and the second groove 14281 is located between the first layer and the second layer of the microstrip line combined with the coplanar waveguide structure 1428. The second groove 14281 can reduce the transmission loss of the coplanar waveguide, and at the same time, the second groove can ensure that the microstrip line combined with the coplanar waveguide structure 1428 has a high strength.

[0086] Please refer to Figures 10 to 13 Compared with the arc-shaped groove, the stepped groove 14261 is easier to manufacture, so the manufacturing cost of the stepped groove 14261 is lower. Compared with the first groove 14271, the second groove 14281 is easier to manufacture. When the microstrip line combined with the coplanar waveguide structure is subjected to external force, the force on the first groove 14271 is more uniform. Therefore, compared with the stepped groove 14261 and the second groove 14281, the first groove 14271 can ensure the strength of the microstrip line combined with the coplanar waveguide structure better.

[0087] The working principle of the present invention is as follows: when the control circuit 10 of the device is working, the power supply module 15 provides working voltages for the control chip 11, the camera module 12, the audio module 13, and the radio frequency module 14. When the camera module 12 is working, the camera interface 121 transmits signals to the camera control chip J9 through the signal line. The clock connection line 122 is used for the camera interface 121 to transmit clock signals to the camera control chip J9, and the data connection line 123 is used for the camera interface to transmit data signals to the camera control chip J9.

[0088] In order to reduce the influence of noise interference signals, the clock connection line 122 and the data connection line 123 are both set as differential signal lines. At least two data connection lines 123 constitute the data connection line 123 of the same video component. The length difference of the data connection line 123 of the same video component is a second set value, and the second set value is 0-1.5mm. The length difference of the data connection line 123 between different video components is a third set value, and the third set value is 0-3.3mm. Since the clock connection line 122 and the data connection line 123 are both high-speed signal lines with characteristic impedance. The line length of the clock connection line 122 and the data connection line 123 is a first set value, and the first set value is 100-305mm. In order to control the characteristic impedance of the clock connection line 122 and the data connection line 123, the characteristic impedance of the clock connection line 122 and the data connection line 123 is 95omh-105ohm. To prevent crosstalk between different clock connection lines 122, the spacing between different clock connection lines 122 is 1.45-1.55 times the line width of the clock connection line 122. To prevent crosstalk between different data connection lines 123, the spacing between different data connection lines 123 is 1.45-1.55 times the line width of the data connection line 123.

[0089] In order to provide electrostatic protection for the camera interface circuit, an electrostatic resistor is provided on the camera interface circuit, and a TVS diode is provided inside the electrostatic resistor. In order to prevent the analog circuit VCAMA_PUM from being interfered by the noise of the digital power supply VCAMD_PUM, the analog power supply VCAMA_PUM and the digital power supply VCAMD_PUM are powered by different low voltage difference linear regulators. After the camera control chip J9 performs analog-to-digital conversion on the received signal, the camera control chip J9 then transmits the video data and image data to the control chip 11.

[0090] When the audio module 13 is working, the microphone input terminal 1311 of the electret microphone circuit 131 inputs audio data, and the audio data flows to the control chip 11 through the signal line. Due to the radio frequency interference of the electret microphone circuit 131, the electret microphone circuit 131 is provided with a first filter capacitor and a second filter capacitor C2. The distance between the first filter capacitor and the microphone input terminal 1311 is smaller than the distance between the first filter capacitor and the control chip 11, and the distance between the second filter capacitor C2 and the microphone input terminal 1311 is smaller than the distance between the second filter capacitor C2 and the control chip 11. The first filter capacitor and the second filter capacitor C2 are used to filter out radio frequency interference. Subsequently, the control chip 11 receives the audio data.

[0091] When the audio module 13 is working, the control chip 11 transmits audio data to the earphone circuit 132. The audio data flows to the earphone interface through the earphone circuit. Since the earphone circuit 132 has radio frequency interference, a third filter capacitor is provided on the earphone circuit 132. The distance between the third filter capacitor and the earphone interface is smaller than the distance between the third filter capacitor and the control chip 11, and the third filter capacitor can be used to filter out radio frequency interference. In order to suppress noise interference on the earphone circuit 132, a magnetic bead is connected in series on the earphone circuit 132, and the distance between the magnetic bead and the earphone interface is smaller than the distance between the magnetic bead and the control chip 11. Then, the earphone circuit 132 converts the received audio signal into sound and electricity, and then the earphone emits sound.

[0092] When the RF module 14 is working, the antenna 143 receives wireless signals. The received signal flows to the RF control chip 141 through the RF signal line 142, and then the RF control chip 141 transmits the signal to the control chip 11. The RF control chip 141 receives the wired signal of the control chip 11, and the received signal flows to the antenna 143 through the RF signal line 142, and the antenna 143 sends out a signal. In order to control the characteristic impedance of the RF signal line 142 to be 49.5-50.5Ω. The structure of the RF signal line 142 can be a microstrip line structure 1421, a coplanar waveguide structure 1422, or a microstrip line combined with a coplanar waveguide structure. The microstrip line combined with the coplanar waveguide structure includes a coplanar waveguide and a microstrip line, and the RF signal can be transmitted through the coplanar waveguide, and the RF signal is shielded from interference by the ground wire. Or the RF signal is transmitted through the microstrip line, and the RF signal is shielded from interference by the ground hole.

[0093] In order to reduce transmission loss and ensure high strength of the microstrip line combined with the coplanar waveguide structure, the coplanar waveguide is provided with a groove. The groove is arranged at the lower end of the third ground line 14242 and the fifth RF signal line 14241, and the groove is located between the first layer and the second layer of the microstrip line combined with the coplanar waveguide structure. The length of the first side of the groove is greater than the length of the second side thereof, and the bottom of the groove is stepped or the bottom of the groove is arc-shaped. The arc-shaped circular arc is a minor arc, which protrudes from the groove or is recessed in the groove. The groove with a stepped bottom is a stepped groove 14261, and the groove with an arc-shaped bottom is a first groove 14271 and a second groove 14281.

[0094] Compared with the prior art, the present invention has the following beneficial effects: the present invention provides a device control circuit 10, and the radio frequency signal line 142 of the device control circuit 10 has a characteristic impedance. The device control circuit 10 is based on different circuit structures, and the structure of the radio frequency signal line 142 of the device control circuit 10 can be set as a microstrip line structure 1421, a coplanar waveguide structure 1422, or a microstrip line combined with a coplanar waveguide structure, which effectively solves the technical problem that the impedance of the existing transmission line is easy to change.

[0095] The microstrip line combined with the coplanar waveguide structure includes a groove, which is arranged at the lower end of the fifth RF signal line and the second ground line, and the groove is located between the first layer and the second layer of the microstrip line combined with the coplanar waveguide structure. The bottom of the groove is stepped or arc-shaped, and the groove can reduce transmission loss. At the same time, the stepped groove 14261 can ensure that the microstrip line combined with the coplanar waveguide structure has a high strength, and the arc-shaped first groove 14271 and second groove 14281 can also ensure that the microstrip line combined with the coplanar waveguide structure has a high strength.

[0096] The camera interface circuit is provided with a clock connection line 122 and a data connection line 123, and the clock connection line 122 and the data connection line 123 are both high-speed signal lines with characteristic impedance and are differential signal lines. The line lengths of the clock connection line 122 and the data connection line 123 are the first set value, and the first set value is 100-305mm. At least two data connection lines 123 constitute the data connection lines 123 of the same video component, and the length difference of the data connection lines 123 of the same video component is the second set value, and the second set value is 0-1.5mm. The length difference of the data connection lines 123 between different video components is the third set value, and the third set value is 0-3.3mm. The noise interference signal will be loaded onto the differential signal line with equal value and at the same time, so the difference of the noise interference signal is zero, and the noise interference signal has no effect on the logical meaning of the data signal. The differential signal line can be used to reduce the impact of the noise interference signal.

[0097] The audio module 13 includes an electret microphone circuit 131 and an earphone circuit 132. The electret microphone circuit 131 is provided with a first filter capacitor and a second filter capacitor C2. The distance between the first filter capacitor and the microphone input terminal 1311 is less than the distance between the first filter capacitor and the control chip 11, and the distance between the second filter capacitor C2 and the microphone input terminal 1311 is less than the distance between the second filter capacitor C2 and the control chip 11. The earphone circuit 132 is provided with a third filter capacitor, and the distance between the third filter capacitor and the earphone interface is less than the distance between the third filter capacitor and the control chip 11. The first filter capacitor, the second filter capacitor C2, and the third filter capacitor can better filter out radio frequency interference. Magnetic beads are connected in series on the earphone circuit, and the distance between the magnetic beads and the earphone interface is less than the distance between the magnetic beads and the control chip 11. The magnetic beads can better suppress noise interference on the earphone circuit 132.

[0098] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A radio frequency module, characterized in that: Used to receive radio signals and send wired electrical signals, it includes a radio frequency circuit, the radio frequency circuit is provided with a radio frequency signal line, a radio frequency control chip and an antenna, the radio frequency signal line is used for bidirectional transmission of radio frequency signals between the antenna and the radio frequency control chip, the radio frequency signal line has a characteristic impedance, and based on different circuit structures, the structure of the radio frequency signal line is a microstrip line structure, a coplanar waveguide structure or a microstrip line combined with a coplanar waveguide structure; When two groups of RF signal lines transmit signals, the microstrip line combined with the coplanar waveguide structure is a three-layer PCB board structure, which includes a coplanar waveguide and a microstrip line, and the coplanar waveguide includes a third RF signal line and a second ground line. The third RF signal line is arranged in the middle of the first layer of the microstrip line combined with the coplanar waveguide structure, and the second ground line is arranged at both ends of the third RF signal line. The distance between the second ground line and the third RF signal line is the ground clearance; The microstrip line is arranged on the second layer and the third layer, the microstrip line includes a fourth radio frequency signal line, a second ground hole, a second ground layer, and a power layer, the fourth radio frequency signal line is arranged on the second layer of the microstrip line combined with the coplanar waveguide structure, the second ground layer is arranged on the third layer of the microstrip line combined with the coplanar waveguide structure, the second ground hole is arranged between the fourth radio frequency signal line and the second ground layer, the horizontal distance between the second ground hole and the fourth radio frequency signal line is at least twice the line width of the third radio frequency signal line, and the distance between the third radio frequency signal line and the second ground layer is the height of the reference ground plane; When two groups of RF signal lines transmit signals and shield the interference of power supply, the microstrip line combined with coplanar waveguide structure is a four-layer PCB board structure, which includes a coplanar waveguide and a microstrip line, and the coplanar waveguide includes a fifth RF signal line and a third ground line. The fifth RF signal line is arranged in the middle of the first layer of the microstrip line combined with coplanar waveguide structure, and the third ground line is arranged at both ends of the fifth RF signal line. The distance between the third ground line and the fifth RF signal line is the ground clearance; The microstrip line is arranged on the second layer, the third layer, and the fourth layer. The microstrip line includes a sixth radio frequency signal line, a third ground hole, a third ground layer, and a power layer. The sixth radio frequency signal line is arranged on the second layer of the microstrip line combined with a coplanar waveguide structure. The third ground layer is arranged on the third layer or the fourth layer of the microstrip line combined with a coplanar waveguide structure. The power layer is arranged on the third layer or the fourth layer of the microstrip line combined with a coplanar waveguide structure. The second ground hole is arranged between the sixth radio frequency signal line and the third ground layer. The horizontal spacing between the third ground hole and the sixth radio frequency signal line is at least twice the line width of the fifth radio frequency signal line. The distance between the fifth radio frequency signal line and the third ground layer is the height of the reference ground plane. The coplanar waveguide includes a groove, which is arranged at the lower ends of the fifth RF signal line and the third ground line and between the first layer and the second layer. The groove includes a first side and a second side. The length of the first side is greater than the length of the second side. The bottom of the groove is stepped or arc-shaped. The arc of the arc is a minor arc, and the minor arc protrudes or is recessed in the groove.

2. The radio frequency module according to claim 1, characterized in that: The microstrip line structure is a two-layer PCB board microstrip line structure, and the two-layer PCB board microstrip line structure includes a first ground hole, a first radio frequency signal line, and a first ground layer. The first ground layer is arranged on the second layer of the two-layer PCB board microstrip line structure, and the first radio frequency signal line is arranged in the middle of the first layer of the two-layer PCB board microstrip line structure. The first ground hole is arranged between the first radio frequency signal line and the first ground layer. The horizontal spacing between the first ground hole and the first radio frequency signal line is at least twice the line width of the first radio frequency signal line, and the distance between the first radio frequency signal line and the first ground layer is the height of the reference ground plane.

3. The radio frequency module according to claim 1, characterized in that: The coplanar waveguide structure includes a two-layer PCB coplanar waveguide structure, the two-layer PCB coplanar waveguide structure includes a first ground line, a second radio frequency signal line, and a reference ground, the second radio frequency signal line is arranged in the middle of the first layer of the two-layer PCB coplanar waveguide structure, the reference ground is arranged in the second layer of the two-layer PCB coplanar waveguide structure, the first ground line is arranged at both ends of the second radio frequency signal line, the distance between the first ground line and the second radio frequency signal line is the ground clearance, and the distance between the first ground line and the reference ground is the height of the reference ground plane.

4. A device control circuit, characterized in that: It includes: The radio frequency module according to any one of claims 1 to 3; A control chip, connected to the radio frequency module, for receiving data, processing data and sending data; The power supply module is connected to the control chip and the radio frequency module, and is used to provide the control chip and the radio frequency module with operating voltage.

5. The device control circuit according to claim 4, characterized in that: The device control circuit also includes a camera module, which is connected to the control chip and used to transmit video data and image data to the control chip. The camera module is also connected to the power supply module, and the power supply module is used to provide the operating voltage of the camera module.

6. The device control circuit according to claim 5, characterized in that: The camera module includes a camera interface circuit, which includes a clock connection line and a data connection line, a camera interface, and a camera control chip. The clock connection line is used for the camera interface to transmit a clock signal to the camera control chip, and the data connection line is used for the camera interface to transmit a data signal to the camera control chip; the clock connection line and the data connection line are both high-speed signal lines with set characteristic impedance and are differential signal lines. The lengths of the clock connection line and the data connection line are first set values, at least two of the data connection lines constitute the data connection lines of the same video component, the length difference of the data connection lines of the same video component is a second set value, and the length difference of the data connection lines between different video components is a third set value.

7. The device control circuit according to claim 6, characterized in that: The camera interface circuit includes an analog part power supply and a digital part power supply, and the analog part power supply and the digital part power supply are respectively powered by different low voltage difference linear regulators.

8. The device control circuit according to claim 4, characterized in that: The device control circuit also includes an audio module, which is connected to the control chip and used to transmit audio data to the control chip and receive audio data from the control chip. The audio module is also connected to the power supply module and used to connect the working voltage of the audio module.

9. The device control circuit according to claim 8, characterized in that: The audio module includes an electret microphone circuit and an earphone circuit, the electret microphone circuit is connected in parallel with the earphone circuit, the electret microphone circuit includes a microphone input end, a first filter capacitor and a second filter capacitor, the first filter capacitor and the second filter capacitor are used to filter out radio frequency interference, the first filter capacitor is connected in parallel with the electret microphone circuit, the second filter capacitor is connected in parallel with the electret microphone circuit, the distance between the first filter capacitor and the microphone input end is smaller than the distance between the first filter capacitor and the control chip, and the distance between the second filter capacitor and the microphone input end is smaller than the distance between the second filter capacitor and the control chip; the earphone circuit includes an earphone interface and a third filter capacitor, the third filter capacitor is used to filter out radio frequency interference, the third filter capacitor is connected in parallel with the earphone circuit, and the distance between the third filter capacitor and the earphone interface is smaller than the distance between the third filter capacitor and the control chip.

10. The device control circuit according to claim 9, characterized in that: A magnetic bead is connected in series to the earphone circuit, and a distance between the magnetic bead and the earphone interface is smaller than a distance between the magnetic bead and the control chip.

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