Display Substrate, Manufacturing Method Thereof, and Display Device

Abstract

Disclosed are a display substrate, a manufacturing method thereof, and a display device, which relate to the field of display technologies and are used to improve the packaging yield of the display substrate. The display substrate has a display area, an opening area, and a transition area located between the display area and the opening area. The display substrate includes: a substrate, a driving circuit layer, at least one transparent conductive layer, and a metal conductive layer. Among them, the driving circuit layer is located on one side of the substrate; at least one transparent conductive layer is located on the side of the driving circuit layer away from the substrate; the metal conductive layer is located on the side of at least one transparent conductive layer away from the driving circuit layer, and the metal conductive layer includes a partition portion located in the transition area. In the display substrate provided by the present disclosure, by arranging the metal conductive layer including the partition portion on the side of the transparent conductive layer away from the driving circuit layer, the partition portion can be avoided from being etched multiple times, the denseness of the encapsulation layer during deposition on the partition portion can be ensured, and a good wrapping effect on the partition portion can be generated, thereby improving the packaging yield of the display substrate.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a display substrate, a manufacturing method thereof, and a display device. Background Art

[0002] In recent years, there is a demand for facial infrared recognition and front camera compatibility in electronic devices, that is, it is necessary to apply two technologies, namely, an under-screen camera and a front camera, to a display panel.

[0003] However, when the two technologies of the under-screen camera and the front camera are simultaneously applied to a display panel, problems such as poor encapsulation of the display panel are likely to occur. Summary of the Invention

[0004] The purpose of the present disclosure is to provide a display substrate, a manufacturing method thereof, and a display device, which are used to improve the encapsulation yield of the display substrate.

[0005] To achieve the above purpose, the present disclosure provides the following technical solutions:

[0006] On the one hand, some embodiments of the present disclosure provide a display substrate. The substrate has a display area, an opening area, and a transition area located between the display area and the opening area. The display substrate includes: a substrate; a driving circuit layer located on one side of the substrate; at least one transparent conductive layer located on the side of the driving circuit layer away from the substrate; and a metal conductive layer located on the side of the at least one transparent conductive layer away from the driving circuit layer; wherein, the metal conductive layer includes a partition portion, and the partition portion is located in the transition area.

[0007] In some embodiments, the metal conductive layer is a laminated structure, and the laminated structure includes a first laminate, a second laminate, and a third laminate that are sequentially away from the substrate; the partition portion includes: a first portion located in the first laminate; a second portion located in the second laminate; and a third portion located in the third laminate.

[0008] In some embodiments, the edge of the second portion is recessed relative to the first portion and the third portion.

[0009] In some embodiments, the distance by which the edge of the second portion is recessed relative to the first portion and the third portion is: 0.2 μm to 0.4 μm.

[0010] In some embodiments, the thickness of the first portion is less than the thickness of the second portion; the thickness of the third portion is less than the thickness of the second portion.

[0011] In some embodiments, the materials of the first portion and the third portion both include titanium, and the material of the second portion includes aluminum.

[0012] In some embodiments, the partition portion is annular, and the partition portion is disposed around the opening region.

[0013] In some embodiments, the driving circuit layer includes a plurality of film layers, and at least one of the plurality of film layers includes a base layer located in the transition region, and the base layer is located between the partition portion and the substrate.

[0014] In some embodiments, the driving circuit layer includes: a first gate insulating layer located on one side of the substrate; a first gate layer located on a side of the first gate insulating layer away from the substrate; a second gate insulating layer located on a side of the first gate layer away from the first gate insulating layer; an auxiliary gate layer located on a side of the second gate insulating layer away from the first gate layer; and an interlayer dielectric layer located on a side of the auxiliary gate layer away from the second gate insulating layer; wherein a portion of the first gate insulating layer located in the transition region forms a first base layer; a portion of the first gate layer located in the transition region forms a second base layer; a portion of the second gate insulating layer located in the transition region forms a third base layer; a portion of the auxiliary gate layer located in the transition region forms a fourth base layer; a portion of the interlayer dielectric layer located in the transition region forms a fifth base layer; the first base layer, the second base layer, the third base layer, the fourth base layer, and the fifth base layer are all located between the partition portion and the substrate.

[0015] In some embodiments, the display region includes a first display region and a second display region; the driving circuit layer includes a plurality of first pixel circuits and a plurality of second pixel circuits; the plurality of first pixel circuits are located in the first display region; and at least one second pixel circuit is located in the first display region; the display substrate further includes: a light-emitting device layer located on a side of the metal conductive layer away from the substrate; the light-emitting device layer is provided with a plurality of first light-emitting devices and a plurality of second light-emitting devices; the plurality of first light-emitting devices are located in the first display region, and the plurality of second light-emitting devices are located in the second display region; wherein at least one second light-emitting device is electrically connected to the second pixel circuit located in the first display region through at least one transparent conductive layer.

[0016] In another aspect, a method for manufacturing a display substrate is provided. The manufacturing method includes: providing a substrate; forming a driving circuit layer on the substrate; forming at least one transparent conductive layer on a side of the driving circuit layer away from the substrate; and forming a metal conductive layer on a side of the at least one transparent conductive layer away from the driving circuit layer; wherein the display substrate includes a display region, an opening region, and a transition region located between the display region and the opening region; the metal conductive layer includes a partition portion, and the partition portion is located in the transition region.

[0017] On the other hand, a display device is provided. The display device includes the display substrate described in the above embodiments.

[0018] In some embodiments, the display device further includes a first optical component, and the first optical component is located in the opening area of the display substrate.

[0019] In some embodiments, the first optical component includes at least one of a camera, a sensor, and a face recognition module.

[0020] In some embodiments, the display device further includes a second optical component, the second optical component is located on the non-display side of the display substrate, and the orthographic projection of the second optical component on the display substrate is located in the second display area of the display substrate.

[0021] In some embodiments, the second optical component includes at least one of a camera, a sensor, and a face recognition module.

[0022] The display substrate, the manufacturing method thereof, and the display device provided by the present disclosure have the following beneficial effects:

[0023] For the display substrate provided by the present disclosure, by disposing the metal conductive layer on the side of at least one transparent conductive layer away from the driving circuit layer, and the metal conductive layer includes a partition portion, it is possible to avoid the problem that the partition portion is etched multiple times, resulting in a narrow portion of the partition portion and a large step difference, thereby contributing to improving the density when the encapsulation layer is deposited on the partition portion during the subsequent formation of the encapsulation layer, generating a good wrapping effect on the partition portion, further ensuring the effectiveness of the partition portion in truncating the water and oxygen intrusion channels, and being able to improve the encapsulation yield of the display substrate.

[0024] The beneficial effects that can be achieved by the manufacturing method of the display substrate and the display device provided by the present disclosure are the same as those of the display substrate provided by the above technical solution, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the present disclosure, the drawings required for some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure, and those of ordinary skill in the art can also obtain other drawings according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual dimensions of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0026] Figure 1 FIG. is a structural diagram of a display substrate according to some embodiments of the present disclosure;

[0027] Figure 2 is Figure 1 a cross-sectional view of the A-A' section in

[0028] Figures 3A to 3E a process diagram for the mechanism analysis of package failure caused by an overly narrow partition part;

[0029] Figure 4 is a structural diagram of another display substrate according to some embodiments of the present disclosure;

[0030] Figure 5 is a structural diagram of a display substrate provided by some embodiments of the present disclosure;

[0031] Figure 6 is a flowchart of a method for manufacturing a display substrate provided by some embodiments of the present disclosure;

[0032] Figure 7 is a structural diagram of a display device according to some embodiments of the present disclosure;

[0033] Figure 8 is a structural diagram of another display device according to some embodiments of the present disclosure. Detailed Embodiments

[0034] Next, the technical solutions in some embodiments of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings. Apparently, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0035] Unless otherwise required by the context, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular form "comprises" and the present participle form "comprising", are interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples", etc. are intended to indicate that the specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. In addition, the described specific features, structures, materials or characteristics can be included in any one or more embodiments or examples in any appropriate manner.

[0036] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" is two or more.

[0037] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0038] As used herein and depending on the context, the term "if" is optionally construed to mean "when" or "upon" or "in response to determining" or "in response to detecting". Similarly, depending on the context, the phrase "if it is determined that..." or "if [the stated condition or event] is detected" is optionally construed to mean "when it is determined that..." or "in response to determining..." or "when [the stated condition or event] is detected" or "in response to detecting [the stated condition or event]".

[0039] The use of "configured to" herein means open and inclusive language that does not exclude devices that are adapted to or configured to perform additional tasks or steps.

[0040] Additionally, the use of "based on" means open and inclusive because a process, step, calculation, or other action "based on" one or more of the stated conditions or values may in practice be based on additional conditions or values beyond those stated.

[0041] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary figures. In the figures, the thickness of layers and regions is exaggerated for clarity. Accordingly, variations in shape relative to the figures due to, for example, manufacturing techniques and / or tolerances are contemplated. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as rectangular will typically have curved features. Accordingly, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0042] Please refer to Figure 1 , some embodiments of the present disclosure provide a display substrate 100. The display substrate 100 has a display area AA, an opening area H, and a transition area F located between the display area AA and the opening area H.

[0043] Here, the number of the opening region H and the transition region F can both be at least one, and the number of the display region AA can be one, for example. Next, as Figure 1 shown, taking the number of the opening region H and the number of the transition region F both being one as an example, the structure of the display substrate 100 will be schematically described.

[0044] In some examples, the shape of the opening region H is circular, for example, and the region between the opening region H and the display region AA is the transition region F. Among them, the transition region F is disposed around the opening region H.

[0045] It should be noted that the transition region F surrounding the opening region H means that the transition region F is disposed around the opening region H in a circle, and the display region AA surrounds the transition region F and the opening region H. The opening region H can be multiple, and a transition region F is disposed around the outside of each opening region H. The number of the opening regions H can be set as required, and there is no limit here. In addition, the shape of the opening region H is not limited to a circle. For example, it can also be square, triangular or drop-shaped, etc.

[0046] In some embodiments, please refer to Figure 2 , the display substrate 100 includes a substrate 1, a driving circuit layer 2, at least one transparent conductive layer 3 and a metal conductive layer 4.

[0047] Among them, the type of the substrate 1 includes multiple types, and can be selected and set according to actual needs.

[0048] Exemplarily, the substrate 1 can be a rigid substrate. Among them, the rigid substrate can be a glass substrate or a PMMA (Polymethyl methacrylate) substrate, etc.

[0049] Exemplarily, the substrate 1 can be a flexible substrate. Among them, the flexible substrate can be a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylenenaphthalate two formic acid glycol ester) substrate or a PI (Polyimide) substrate, etc. At this time, the display substrate 100 can realize flexible display, for example.

[0050] The driving circuit layer 2 is located on one side of the substrate 1. The driving circuit layer 2 can include a pixel driving circuit 20. The pixel driving circuit 20 is coupled to a gate scan signal line and a data signal line. Under the control of the gate scan signal transmitted by the gate scan signal line, the pixel driving circuit transmits the data signal transmitted by the data signal line to the light-emitting device, so as to drive the light-emitting device to emit light.

[0051] Exemplarily, the structure of the pixel driving circuit 20 can include various types, and the present disclosure does not limit this. For example, the structure of the pixel driving circuit 20 can be a structure such as "6T1C", "7T1C", "6T2C", or "7T2C"; among them, "T" represents a thin-film transistor, the number in front of "T" represents the number of thin-film transistors, "C" represents a storage capacitor, and the number in front of "C" represents the number of storage capacitors. Also, for example, the thin-film transistors included in the pixel driving circuit can be thin-film transistors with a bottom-gate structure or thin-film transistors with a top-gate structure.

[0052] At least one transparent conductive layer 3 is located on the side of the driving circuit layer 2 away from the substrate 1.

[0053] Exemplarily, each transparent conductive layer 3 includes at least one light-transmitting wire 31. Part of the pixel driving circuit 20 is electrically connected to the corresponding light-emitting device through the light-transmitting wire 31. That is, one end of the light-transmitting wire is electrically connected to the pixel driving circuit 20; the other end of the light-transmitting wire 31 can be electrically connected to the corresponding light-emitting device. Part of the pixel driving circuit 20 provides a driving voltage to the corresponding light-emitting device through the light-transmitting wire 31 to control the light-emitting state of the corresponding light-emitting device.

[0054] Exemplarily, the number of layers of the transparent conductive layer 3 can be two or three. For example, as Figure 2 shown, the number of layers of the transparent conductive layer 3 is three. Such a design can provide sufficient space for the routing arrangement of the light-transmitting wires 31, thereby preventing interference from being formed between each light-transmitting wire 31.

[0055] It should be noted that since the pixel driving circuit 20 and the corresponding light-emitting device are electrically connected through the light-transmitting wire 31, an insulating layer needs to be provided between the pixel driving circuit 20 and the transparent conductive layer 3, and an insulating layer needs to be provided between the transparent conductive layer 3 and the light-emitting device.

[0056] Exemplarily, at least one planarization layer 5 (i.e., the above-mentioned insulating layer) is provided between the whole of the at least one transparent conductive layer 3 and the pixel driving circuit 20; at least one planarization layer 5 (i.e., the above-mentioned insulating layer) is provided between the whole of the at least one transparent conductive layer 3 and the light-emitting device. Such a design can ensure the flatness and continuity of the transparent conductive layer 3.

[0057] Exemplarily, at least one planarization layer 5 (i.e., the above-mentioned insulating layer) is provided between two adjacent transparent conductive layers 3.

[0058] It should be noted that the number of the above-mentioned planarization layers 5 is related to the total number of layers of the transparent conductive layer 3.

[0059] In some examples, please continue to refer to Figure 2, the total number of transparent conductive layers 3 is three. That is, the light-transmitting wires 31 are distributed on the three layers, and each transparent conductive layer 3 includes at least one light-transmitting wire 31. At least one flat layer 5 is disposed between any two adjacent transparent conductive layers 3.

[0060] In some examples, such as Figure 2 As shown, the flat layer between at least one transparent conductive layer 3 as a whole and the pixel driving circuit 20 is the first flat layer 51; the flat layer between two adjacent transparent conductive layers 3 is the second flat layer 52. When the total number of transparent conductive layers 3 is three, the number of first flat layers 51 is one, and the number of second flat layers 52 is two.

[0061] Exemplarily, the light-transmitting wire 31 may be formed of a conductive material with high light transmittance, such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO).

[0062] The metal conductive layer 4 is located on a side of the at least one transparent conductive layer 3 away from the driving circuit layer 2 .

[0063] The metal conductive layer 4 includes a partition portion 41 ; the partition portion 41 is located in the transition region F.

[0064] For example, Figure 2 As shown, at least one second planarization layer 53 is disposed between the metal conductive layer 4 and the at least one transparent conductive layer 3 .

[0065] Those skilled in the art will appreciate that the partition portion 41 is located in the transition zone F between the display area AA and the opening area H, and is used to isolate the light-emitting layer between the display area AA and the opening area H to prevent water vapor and oxygen from being transmitted along the light-emitting layer to the display area AA, thereby causing display failure of the display substrate 100.

[0066] It should be noted that, in some implementations, the partition portion 41' and the source or drain of the thin film transistor in the pixel driving circuit 20 are formed by the same patterning process; or, a transition portion directly electrically connected to the source and the drain is arranged between at least one transparent conductive layer 3 and the driving circuit layer 2, and the partition portion 41' and the transition portion are formed by the same patterning process.

[0067] After the partition 41' is formed, in the process of forming other film layers (for example, the transparent conductive layer 3') by coating, exposing and developing, the alkaline developer will etch the partition 41' for many times, resulting in a narrower portion in the partition 41'. Figure 3AAs shown; when forming a light-emitting layer or other film layers subsequently, during the glue coating process, the air at the diagonal a' along the glue coating direction in the partition portion 41' cannot be discharged, as Figure 3B shown; after the glue coating is completed, due to the flow of the photoresist (abbreviated as PR glue), the gas rises, but due to the tension of the PR glue, bubbles are finally formed, as Figure 3C shown; when the PR glue is dried under low pressure subsequently, due to the instantaneous drop in the air pressure outside the bubbles, the bubbles burst, as Figure 3D shown; on this basis, when the PR glue is removed subsequently, it is easy to cause PR glue residue, and moreover, some parts of the partition portion 41' are relatively narrow, and a large step difference is formed between the narrow parts in the partition portion 41' and other parts, resulting in problems such as broken glue and poor coating when forming the encapsulation layer subsequently (for example Figure 3E at position C in), thereby causing external impurities and water vapor to enter the display substrate 100, resulting in phenomena such as blackening around and Mura (spots) around; moreover, it will cause electrochemical corrosion to occur under the combined action of a small amount of water vapor and electricity at the edge of the opening area, resulting in GDSH (water vapor oxidation of the opening area caused by defects such as cracks and scratches due to encapsulation or external force).

[0068] It should be noted that the "lithography process" mentioned in the present disclosure includes processes such as depositing a film layer, coating photoresist, mask exposure, development, etching, and stripping photoresist.

[0069] In some embodiments of the present disclosure, by disposing the metal conductive layer 4 on the side of at least one transparent conductive layer 3 away from the driving circuit layer 2, and at the same time, the metal conductive layer 4 includes a partition portion 41 located in the transition region F, it is possible to avoid the problem that the partition portion 41 is etched multiple times when forming at least one transparent conductive layer, resulting in some parts of the partition portion 41 being relatively narrow and having a large step difference. Thereby, it helps to improve the denseness of the encapsulation layer when the encapsulation layer is deposited on the partition portion 41 subsequently, and can have a good wrapping effect on the partition portion 41, further ensuring the effectiveness of the partition portion 41 in truncating the water and oxygen intrusion channels, and improving the encapsulation yield of the display substrate 100.

[0070] In some embodiments, please continue to refer to Figure 2 , the metal conductive layer 4 is a stacked structure, and the stacked structure includes a first stack 401, a second stack 402, and a third stack 403 that are sequentially away from the substrate 1.

[0071] The partition part 41 includes: a first part 411 located in the first stack 401; a second part 412 located in the second stack 402; and a third part 413 located in the third stack 403. That is, the first part 411 is arranged on the same layer as the first stack 401; the second part 412 is arranged on the same layer as the second stack 402; the third part 413 is arranged on the same layer as the third stack 403.

[0072] It is easy to understand that the "same layer" mentioned in the embodiments of the present disclosure refers to a layer structure formed by using the same film-forming process to form a film layer for forming a specific pattern, and then using the same mask through a single patterning process. Depending on the different specific patterns, the single patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0073] The partition part 41 is mainly formed by an etching process. By making the partition part 41 include: a first part 411, a second part 412 and a third part 413, at least the width of the top of the partition part 41 (that is, the width of the first part 411) can be made greater than the width of the bottom of the partition part 41 (that is, the width of the second part 412 or the width of the third part 413), and the light-emitting layer can be blocked by the wider part at the top, so that a good partition of the light-emitting layer can be formed, and then the water and oxygen intrusion channels can be blocked; moreover, by making the metal conductive layer 4 a stacked structure, when forming the first stack 401, the second stack 402 and the third stack 403 of the stacked structure, the first part 411, the second part 412 and the third part 413 in the partition part 41 are formed simultaneously, and no other film layers need to be added, thus simplifying the manufacturing process.

[0074] In some embodiments, please continue to refer to Figure 2 , the edge of the second part 412 in the partition part 41 is retracted relative to the first part 411 and the third part 413.

[0075] By making the edge of the second part 412 in the partition part 41 retracted relative to the first part 411 and the third part 413, an I-shaped structure can be formed, as Figure 2 shown. This I-shaped structure is a structure with convexities on the top and bottom and a concavity in the middle, also known as an Undercut structure. The partition part 41 of this Undercut structure can ensure that when the light-emitting layer turns vertically from the first part 411 to the side of the second part 412, it is disconnected at the groove, having a better isolation effect.

[0076] In some embodiments, the distance h by which the edge of the second part 412 is recessed relative to the first part 411 and the third part 413 is: 0.2 μm to 0.4 μm. For example, the distance h by which the edge of the second part 412 is recessed relative to the first part 411 and the third part 413 can be 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, or 0.4 μm, etc.

[0077] It should be noted that the distance by which the edge of the second part 412 is recessed relative to the first part 411 and the distance by which the edge of the second part 412 is recessed relative to the third part 413 can be the same or different.

[0078] In some examples, the distance by which the edge of the second part 412 is recessed relative to the first part 411 is 0.2 μm, and the distance by which the edge of the second part 412 is recessed relative to the third part 413 is 0.3 μm or 0.4 μm. In still other examples, the distance by which the edge of the second part 412 is recessed relative to the first part 411 and the distance by which the edge of the second part 412 is recessed relative to the third part 413 are both 0.3 μm or 0.4 μm.

[0079] In this embodiment, the distance h by which the edge of the second part 412 is recessed relative to the first part 411 and the third part 413 is: 0.2 μm to 0.4 μm. After the partition part 41 is formed, when applying PR glue on the partition part 41 to form the encapsulation layer, since the distance h by which the second part 412 is recessed relative to the first part 411 and the third part 413 is small, when forming the encapsulation layer subsequently, problems such as glue breakage and poor coating are not likely to occur, and it can produce a good wrapping effect on the partition part 41, effectively improving the encapsulation yield of the display substrate 100 and ensuring the effectiveness of the partition part 41 in truncating the water and oxygen intrusion channels.

[0080] In some embodiments, please continue to refer to Figure 2 , the thickness of the first part 411 is less than the thickness of the second part 412; the thickness of the third part 413 is less than the thickness of the second part 412.

[0081] Among them, the thickness of the first part 411 and the thickness of the third part 413 can be the same or different.

[0082] In this embodiment, by making the thickness of the first part 411 smaller than that of the second part 412 and the thickness of the third part 413 smaller than that of the second part 412, it is possible to improve the problem that when the thickness of the second part 412 is small, the groove formed by the second part 412 relative to the first part 411 and the third part 413 is small, and when the light-emitting layer is formed, the light-emitting layer accumulates too much at the groove, resulting in the disconnection failure of the light-emitting layer at the groove, incomplete disconnection, and allowing external impurities and water vapor to enter the inside of the display substrate 100 along the light-emitting layer, causing blackening and Mura (spots) around the perimeter.

[0083] In some embodiments, the materials of both the first part 411 and the third part 413 include titanium, and the material of the second part 412 includes aluminum.

[0084] With this material, it can be ensured that when the second part 412 is subjected to side etching, the first part 411 and the third part 413 are less affected by etching, and thus the above-mentioned I-shaped structure can be formed. Those skilled in the art can also select other materials as long as the above technical effects can be achieved, and the present disclosure does not limit this.

[0085] In some embodiments, the partition portion 41 is annular and the partition portion 41 surrounds the opening region H.

[0086] It should be noted that the above-mentioned partition portion 41 is annular, and for example, it can be a square ring, an oval ring, a circular ring, etc.

[0087] In this embodiment, by making the partition portion 41 annular and the partition portion 41 surrounding the opening region H, it is ensured that the light-emitting layer around the opening region H is blocked by the partition portion 41, and further, it is possible to prevent water vapor and oxygen from being transmitted to the display area AA along the light-emitting layer, thereby causing the display failure of the display substrate 100.

[0088] In some embodiments, please continue to refer to Figure 2 , the driving circuit layer 2 includes a plurality of film layers 21, and at least one of the plurality of film layers 21 includes a base layer 6 located in the transition region F, and the base layer 6 is located between the partition portion 41 and the substrate 1. That is, the base layer 6 and the plurality of film layers of the driving circuit layer are formed by a single mask process.

[0089] Exemplarily, please continue to refer to Figure 2 , the base layer 6 is disconnected from the other parts of the plurality of film layers 21 located in the display area AA, avoiding excessive accumulation of the light-emitting layer between the film layer in the display area AA and the partition portion 41, further avoiding the disconnection failure of the light-emitting layer at the partition portion 41, and ensuring that the partition portion 41 can better block the light-emitting layer.

[0090] In some embodiments, please continue to refer to Figure 2, the driving circuit layer 2 includes a first gate insulating layer 211, a first gate layer 212, a second gate insulating layer 213, an auxiliary gate layer 214, and an interlayer dielectric layer 215.

[0091] Among them, the first gate insulating layer 211 is located on one side of the substrate 1; the first gate layer 212 is located on the side of the first gate insulating layer 211 away from the substrate 1; the second gate insulating layer 213 is located on the side of the first gate layer 212 away from the first gate insulating layer 211; the auxiliary gate layer 214 is located on the side of the second gate insulating layer 213 away from the first gate layer 212; the interlayer dielectric layer 215 is located on the side of the auxiliary gate layer 214 away from the second gate insulating layer 213.

[0092] The part of the first gate insulating layer 211 located in the transition region H forms a first base layer 61; the part of the first gate layer 212 located in the transition region H forms a second base layer 62; the part of the second gate insulating layer 213 located in the transition region H forms a third base layer 63; the part of the auxiliary gate layer 214 located in the transition region H forms a fourth base layer 64; the part of the interlayer dielectric layer 215 located in the transition region H forms a fifth base layer 65. The first base layer 61, the second base layer 62, the third base layer 63, the fourth base layer 64, and the fifth base layer 65 are all located between the partition portion 41 and the substrate 1. That is, the first base layer 61 and the first gate insulating layer 211 are arranged in the same layer; the second base layer 62 and the first gate layer 212 are arranged in the same layer; the third base layer 63 and the second gate insulating layer 213 are arranged in the same layer; the fourth base layer 64 and the auxiliary gate layer 214 are arranged in the same layer; the fifth base layer 65 and the interlayer dielectric layer 215 are arranged in the same layer.

[0093] In this way, the first base layer 61, the second base layer 62, the third base layer 63, the fourth base layer 64, and the fifth base layer 65 can be used to further avoid the disconnection failure of the light-emitting layer at the partition portion 41, ensure that the partition portion 41 effectively blocks the light-emitting layer, and at the same time when forming the first gate insulating layer 211, the first gate layer 212, the second gate insulating layer 213, the auxiliary gate layer 214, and the interlayer dielectric layer 215 of the driving circuit layer 2, the first base layer 61, the second base layer 62, the third base layer 63, the fourth base layer 64, and the fifth base layer 65 are formed, without the need to add other mask plates (Mask), thereby simplifying the manufacturing process.

[0094] In some embodiments, please refer to Figure 1 , the display area AA includes a first display area A1 and a second display area A2. For example, the area of the first display area A1 may be larger than the area of the second display area A2.

[0095] It should be noted that the number of the second display area A2 can be one or multiple, and can be specifically set according to actual needs. The positional relationship between the above-mentioned first display area A1 and the second display area A2 includes various types, and can be set according to actual needs.

[0096] In some examples, please continue to refer to Figure 1 , the first display area A1 can be located around the second display area A2, that is, the first display area A1 surrounds the second display area A2. At this time, the shape of the second display area A2 can be, for example, circular, oval or rectangular, etc.

[0097] In other examples, the second display area A2 is located beside the first display area A1, that is, a part of the boundary of the second display area A2 overlaps with a part of the boundary of the first display area A1. At this time, the shape of the second display area A2 can be, for example, rectangular, rounded rectangular, water droplet-shaped or semi-circular, etc.

[0098] In some embodiments, please refer to Figure 4 , the driving circuit layer 2 includes a plurality of first pixel circuits 21 and a plurality of second pixel circuits 22; the plurality of first pixel circuits 21 are located in the first display area A1; and at least one second pixel circuit 22 is located in the first display area A1.

[0099] It should be noted that the above-mentioned "at least one second pixel circuit 22 is located in the first display area A1" includes: all the second pixel circuits 22 are located in the first display area A1; and, a part of the second pixel circuits 22 are located in the first display area A1, and the other part of the second pixel circuits 22 are located in other areas, such as the second display area A2 in two cases.

[0100] In order to be able to provide sufficient space for the setting of the second pixel circuit 22 without reducing the number of the first pixel circuits 21 in the first display area A1, the first pixel circuits 21 in the first display area A1 can be compressed along the first direction X so as to place the second pixel circuits 22 in the first display area A1.

[0101] In some embodiments, please refer to Figure 5 , the display substrate 100 further includes: a light-emitting device layer 7. The light-emitting device layer 7 is located on the side of the metal conductive layer 4 away from the substrate 1.

[0102] In some examples, please continue to refer to Figure 5 , the light-emitting device layer 7 includes an anode layer 701, a light-emitting functional layer 702 and a cathode layer 703 which are sequentially stacked along the direction away from the substrate 1.

[0103] The light-emitting functional layer 702 includes at least a light-emitting layer. In some examples, in addition to the light-emitting layer, the light-emitting functional layer 702 further includes at least one of an electron transport layer, an electron injection layer, a hole transport layer, and a hole injection layer.

[0104] Exemplarily, the light-emitting device layer 7 can be divided into a plurality of light-emitting devices, each light-emitting device including an anode, a light-emitting part, and a cathode which are stacked. Among them, please refer to Figure 5 , a plurality of anodes form the anode layer 701, a plurality of light-emitting parts are located in the light-emitting functional layer 702, and a plurality of cathodes are located in the cathode layer 703.

[0105] One light-emitting device in the light-emitting device layer 7 is located in one sub-pixel region P, and one light-emitting device is coupled to a pixel circuit. The pixel circuit is configured to drive the light-emitting device coupled thereto to emit light, thereby realizing a picture display. For example, the anode of the light-emitting device can be coupled to the source or drain of the driving transistor T in the above pixel circuit, and the cathode of the light-emitting device can be coupled to the common voltage signal line, so that the driving current can flow through the light-emitting device to drive the light-emitting device to emit light.

[0106] Exemplarily, please continue to refer to Figure 5 , the light-emitting device layer 7 further includes a pixel defining layer 704. The pixel defining layer 704 has openings for accommodating the above-mentioned plurality of light-emitting devices.

[0107] In some examples, the above light-emitting device layer 7 can include a plurality of first light-emitting devices 71 and a plurality of second light-emitting devices 72. As Figure 4 shown, a plurality of first light-emitting devices 71 are located in the first display area A1, and a plurality of second light-emitting devices 72 are located in the second display area A2. Among them, the structures of the first light-emitting device 71 and the second light-emitting device 72 can be the same, for example.

[0108] Exemplarily, as Figure 4 shown, one first pixel circuit 21 can be electrically connected to one first light-emitting device 71. For example, the first pixel circuit 21 and the first light-emitting device 71 are arranged in one-to-one correspondence. The first pixel circuit 21 can provide a driving signal for the corresponding first light-emitting device 71 to drive the first light-emitting device 31 to emit light.

[0109] Exemplarily, as Figure 4 shown, one second pixel circuit 22 can be electrically connected to one second light-emitting device 72. For example, the second pixel circuit 22 and the second light-emitting device 72 are arranged in one-to-one correspondence. The second pixel circuit 22 can provide a driving signal for the corresponding second light-emitting device 72 to drive the second light-emitting device 32 to emit light. At least one second light-emitting device 72 is electrically connected to the second pixel circuit 22 located in the first display area A1 through at least one transparent conductive layer 3.

[0110] Thus, the light emitted by the multiple first light-emitting devices 71 and the multiple second light-emitting devices 72 cooperate with each other, enabling the display substrate 100 to achieve image display.

[0111] Those skilled in the art can understand that at least one second light-emitting device 72 is electrically connected to the second pixel circuit 22 located in the first display area A1 through at least one transparent conductive layer 3, that is, at least one second light-emitting device 72 is electrically connected to the second pixel circuit 22 located in the first display area A1 through the transparent wire 31 on at least one transparent conductive layer 3, as Figure 4 shown.

[0112] In some examples, the distribution density of the multiple first light-emitting devices 71 is the same as the distribution density of the multiple second light-emitting devices 72. This can not only enable the display substrate 100 to achieve full-screen display, but also help ensure that the display substrate 100 has good image display quality.

[0113] Exemplarily, the distribution density of the multiple second light-emitting devices 72 is less than the distribution density of the multiple first light-emitting devices 71. This can increase the distance between any two adjacent second light-emitting devices 72, reduce the occlusion of external light by the second light-emitting devices 72, and increase the area of the light-transmitting part in the portion of the display substrate 100 located in the second display area A2, thereby further increasing the amount of external light that can pass through the portion of the display substrate 100 located in the second display area A2.

[0114] In some embodiments of the present disclosure, after the second pixel circuit 22 that provides a driving signal for the second light-emitting device 72 is disposed in the first display area A1, the structure in the second display area A2 that can block light is reduced. External light can then pass through the gap between any two adjacent second light-emitting devices 72 from one side (e.g., the light-emitting side) of the portion of the display substrate 100 located in the second display area A2 and exit from the other side (e.g., the non-light-emitting side) of the portion of the display substrate 100 located in the second display area A2, such that the portion of the display substrate 100 located in the second display area A2 has a high transmittance, improving the imaging effect of the under-screen camera for acquiring images through the second display area A2 to ensure high-quality camera shooting or photography of the camera. At the same time, at least one transparent conductive layer 3 that electrically connects the second light-emitting device 72 and the second pixel circuit 22 is disposed on the side of the metal conductive layer 4 close to the driving circuit layer 2, which can avoid the problem that the partition portion 41 included in the metal conductive layer 4 is etched multiple times, resulting in a narrow portion and a large step difference in the partition portion 41, thereby contributing to improving the density of the encapsulation layer when the encapsulation layer is deposited on the partition portion 41 during subsequent formation of the encapsulation layer. Thus, on the basis of ensuring the encapsulation yield of the display substrate 100, the two technologies of the under-screen camera and the front camera are simultaneously applied to the display substrate 100, thereby realizing facial infrared recognition and front camera compatibility.

[0115] In some embodiments, the display substrate 100 further includes an encapsulation layer 8. The encapsulation layer 8 can be an encapsulation thin film (Thin Film Encapsulation, abbreviated as TFE) or an encapsulation substrate. The encapsulation layer 130 is configured to encapsulate the pixel driving circuit and the plurality of light-emitting devices on the substrate 1 to block water and oxygen and prevent water and oxygen from eroding the light-emitting devices, thereby affecting the light-emitting efficiency and service life of the light-emitting devices.

[0116] Exemplarily, the encapsulation layer 8 can include: a first inorganic layer, an organic layer disposed on the side of the first inorganic layer away from the substrate, and a second inorganic layer disposed on the side of the organic layer away from the substrate 1. The first inorganic layer and / or the second inorganic layer can be made of an inorganic insulating material, for example, and can be formed by a deposition process; the organic layer can be made of an organic insulating material, for example, and can be formed by an inkjet printing process.

[0117] Please refer to Figure 6 , the present disclosure further provides a method for manufacturing a display substrate 100 for manufacturing the above-mentioned display substrate 100. The method for manufacturing the display substrate 100 includes steps S1 to S4.

[0118] S1: Provide a substrate 1.

[0119] Wherein, the substrate 1 can be formed as a single layer, a double layer or a multi-layer, and can specifically refer to the description in the above-mentioned some embodiments, which will not be elaborated here.

[0120] S2: Form a driving circuit layer 2 on the substrate 1.

[0121] Among them, the driving circuit layer 2 may include a plurality of first pixel circuits 21 and a plurality of second pixel circuits 22. For specific details, reference may be made to the descriptions in some of the above embodiments, which will not be elaborated here.

[0122] S3: Form at least one transparent conductive layer 3 on a side of the driving circuit layer 2 away from the substrate 1.

[0123] Among them, the number of layers of the transparent conductive layer 3 may be two or three. For specific details, reference may be made to the descriptions in some of the above embodiments, which will not be elaborated here.

[0124] S4: Form a metal conductive layer 4 on a side of the at least one transparent conductive layer 3 away from the driving circuit layer 2.

[0125] Among them, the display substrate 100 has a display area AA, an opening area H, and a transition area F located between the display area AA and the opening area H. The metal conductive layer 4 includes a partition portion 41; the partition portion 41 is located in the transition area F.

[0126] The manufacturing method of the display substrate 100 provided by some embodiments of the present disclosure can be used to manufacture the display substrate 100 in any of the above embodiments. In this manufacturing method, by forming a metal conductive layer 3 including a partition portion 41 after forming at least one transparent conductive layer 3, it is possible to avoid the problem that some parts of the partition portion 41 are narrow and the step difference is large due to the partition portion 41 being etched multiple times. Thereby, it helps to improve the compactness when the encapsulation layer is deposited on the partition portion 41 during the subsequent formation of the encapsulation layer, can produce a good wrapping effect on the partition portion 41, further ensure the effectiveness of the partition portion 41 in truncating the water and oxygen intrusion channels, and can improve the encapsulation yield of the display substrate 100.

[0127] The present disclosure also provides a display device 1000, as Figure 7 and Figure 8 shown. The display device 1000 includes the display substrate 100 described in any one of the above.

[0128] In some examples, the display device 1000 can be any device that displays whether it is moving (e.g., video) or stationary (e.g., still image), and whether it is text or image. More specifically, it is expected that the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal digital assistants (PDAs), handheld or portable computers, global positioning system (GPS) receivers / navigators, cameras, Moving Picture Experts Group 4 (MP4) video players, camcorders, game consoles, watches, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photos, electronic billboards or signs, projectors, architectural structures, packages, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0129] Exemplarily, the above display device 1000 may further include a frame, a source driver chip, an FPC (Flexible Printed Circuit), a PCB (Printed Circuit Board), or other electronic accessories, etc.

[0130] The beneficial effects that the display device 1000 provided by the present disclosure can achieve are the same as those that the display substrate 100 provided by the above technical solution can achieve, and will not be elaborated here.

[0131] In some embodiments, please refer to Figure 8 , the display device 1000 further includes: a first optical component 200, and the first optical component 200 is located in the opening area H of the display substrate 100.

[0132] Exemplarily, the first optical component 200 may include a camera, a sensor, a face recognition module, an infrared lens, a floodlight sensing element, an ambient light sensor, or a dot projector, etc. Thus, the applicable range is wide, and it can collect light through the screen, so that the light collection effect of the optical device is good and the use performance of the optical device is enhanced.

[0133] In some embodiments, please refer to Figure 8The display device 1000 also includes: a second optical component 300, the second optical component 300 is located on the non-display side of the display substrate 100, and the orthographic projection of the second optical component 300 on the display substrate 100 is located in the second display area A2 of the display substrate 100.

[0134] Since the light transmittance of the second display area A2 is greater than the light transmittance of the first display area A1, after the display substrate 100 is assembled into a display device, the second optical component 300 can collect light through the screen, so that the optical device has a good lighting effect and enhances the performance of the optical device. Thus, the second display area A2 integrates the functions of image acquisition and imaging while realizing the display of the picture, thereby improving the user experience; and when the display device 1000 includes the first optical component 200 and the second optical component 300 at the same time, by setting the metal conductive layer 4 on the side of at least one transparent conductive layer 3 away from the driving circuit layer 2, and the metal conductive layer 4 includes a The partition portion 41 in the transition area F can prevent the partition portion 41 from being etched multiple times, which would result in some parts of the partition portion 41 being narrower and having larger step differences. This helps to improve the density of the encapsulation layer when it is deposited on the partition portion 41 when a subsequent encapsulation layer is formed, and can produce a good wrapping effect on the partition portion 41, further ensuring the effectiveness of the partition portion 41 in cutting off the water and oxygen intrusion channel, thereby improving the packaging yield of the display substrate 100. On this basis, the two technologies of under-screen camera and front camera are simultaneously applied to the display substrate 100, achieving compatibility between facial infrared recognition and front camera.

[0135] Exemplarily, the second optical component 300 includes a camera, a sensor, a facial recognition module, an infrared lens, a floodlight sensing element, an ambient light sensor or a dot projector, etc. Thus, it has a wide range of applications and can be used to collect light through the screen, so that the optical device has a good lighting effect and enhances the performance of the optical device.

[0136] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display substrate, characterized in that, It has a display area, an opening area, and a transition area located between the display area and the opening area; The display substrate includes: A substrate; A driving circuit layer located on one side of the substrate; At least one transparent conductive layer located on the side of the driving circuit layer away from the substrate; and, A metal conductive layer located on the side of the at least one transparent conductive layer away from the driving circuit layer; wherein, the metal conductive layer includes a partition portion located in the transition area; the metal conductive layer is a laminated structure, and the laminated structure includes a first laminate, a second laminate, and a third laminate sequentially away from the substrate; the partition portion includes: a first portion located in the first laminate, a second portion located in the second laminate, and a third portion located in the third laminate.

2. The display substrate according to claim 1, wherein, The edge of the second portion is recessed relative to the first portion and the third portion.

3. The display substrate according to claim 1, wherein, The distance by which the edge of the second portion is recessed relative to the first portion and the third portion is: 0.2 μm to 0.4 μm.

4. The display substrate according to claim 1, wherein, The thickness of the first portion is less than the thickness of the second portion; the thickness of the third portion is less than the thickness of the second portion.

5. The display substrate according to claim 1, wherein, The materials of the first portion and the third portion both include titanium, and the material of the second portion includes aluminum.

6. The display substrate according to any one of claims 1 to 5, wherein, The partition portion is annular and the partition portion is arranged around the opening area.

7. The display substrate according to any one of claims 1 to 5, wherein, The driving circuit layer includes a plurality of film layers, and at least one of the plurality of film layers includes a base layer located in the transition area, and the base layer is located between the partition portion and the substrate.

8. The display substrate according to claim 7, wherein The driving circuit layer includes: A first gate insulating layer located on one side of the substrate; A first gate layer located on the side of the first gate insulating layer away from the substrate; A second gate insulating layer located on the side of the first gate layer away from the first gate insulating layer; An auxiliary gate layer located on the side of the second gate insulating layer away from the first gate layer; and, An interlayer dielectric layer located on the side of the auxiliary gate layer away from the second gate insulating layer; Wherein, the portion of the first gate insulating layer located in the transition area forms a first base layer; the portion of the first gate layer located in the transition area forms a second base layer; the portion of the second gate insulating layer located in the transition area forms a third base layer; the portion of the auxiliary gate layer located in the transition area forms a fourth base layer; the portion of the interlayer dielectric layer located in the transition area forms a fifth base layer; The first base layer, the second base layer, the third base layer, the fourth base layer, and the fifth base layer are all located between the partition portion and the substrate.

9. The display substrate according to any one of claims 1 to 5, characterized in that, The display area includes a first display area and a second display area; The driving circuit layer includes a plurality of first pixel circuits and a plurality of second pixel circuits; the plurality of first pixel circuits are located in the first display area; and at least one second pixel circuit is located in the first display area; The display substrate further includes: A light-emitting device layer, located on a side of the metal conductive layer away from the substrate; the light-emitting device layer is provided with a plurality of first light-emitting devices and a plurality of second light-emitting devices; the plurality of first light-emitting devices are located in the first display area, and the plurality of second light-emitting devices are located in the second display area; Wherein, at least one second light-emitting device is electrically connected to the second pixel circuit located in the first display area through at least one transparent conductive layer.

10. A method for manufacturing a display substrate, characterized in that, Comprising: Providing a substrate; Forming a driving circuit layer on the substrate; Forming at least one transparent conductive layer on a side of the driving circuit layer away from the substrate; And, Forming a metal conductive layer on a side of the at least one transparent conductive layer away from the driving circuit layer; Wherein, the display substrate includes a display area, an opening area, and a transition area located between the display area and the opening area; the metal conductive layer includes a partition portion, and the partition portion is located in the transition area; the metal conductive layer is a stacked structure, and the stacked structure includes a first stack, a second stack, and a third stack sequentially away from the substrate; the partition portion includes: a first portion located in the first stack, a second portion located in the second stack, and a third portion located in the third stack.

11. A display device, characterized in that, Comprising: The display substrate according to any one of claims 1 to 9.

12. The display device according to claim 11, wherein Further includes: A first optical component, and the first optical component is located in the opening area of the display substrate.

13. The display device according to claim 12, wherein The first optical component includes at least one of a camera, a sensor, and a face recognition module.

14. The display device according to claim 11, characterized in that, Further includes: A second optical component, and the second optical component is located on a non-display side of the display substrate, and a positive projection of the second optical component on the display substrate is located in the second display area of the display substrate.

15. The display device according to claim 14, wherein The second optical component includes at least one of a camera, a sensor, and a face recognition module.

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