Image sensors and electronic devices

Abstract

The embodiment of the present application discloses an image sensor and an electronic device, belonging to the field of terminal device technology, wherein the image sensor includes: a photosensitive element layer, a microlens layer, a filter layer and a driving mechanism, the filter layer is arranged between the photosensitive element layer and the microlens layer, and the filter layer is connected to the microlens layer; at least one of the filter layer and the microlens layer is connected to the driving mechanism, and the driving mechanism is used to drive the filter layer and the microlens layer to move relative to the photosensitive element layer.

Description

Technical Field

[0001] The present application belongs to the technical field of terminal devices, and specifically relates to an image sensor and an electronic device. Background Art

[0002] With the popularity of mobile terminals such as mobile phones in people's lives, people have also put forward higher requirements for the images they take. In addition to taking clearer and more beautiful images, they also want to achieve higher resolutions.

[0003] In related technologies, the resolution of captured images is mostly improved by increasing the number of pixels of the photosensitive sensor. However, due to limitations of processing technology, the number of pixels of the photosensitive sensor cannot be increased indefinitely at the same size; at the same time, if the size of the photosensitive sensor is increased, this is contrary to the requirements of power consumption and thickness of electronic equipment, resulting in failure to meet the current requirements for low power consumption and thinness of electronic equipment. Summary of the invention

[0004] The present application aims to provide an image sensor and an electronic device, which solve the problem that the number of pixels of the existing image sensors cannot be increased and the image resolution is low when the size of the photosensitive chip is limited.

[0005] In a first aspect, an embodiment of the present application provides an image sensor. The image sensor comprises:

[0006] Photosensitive element layer;

[0007] Microlens layer;

[0008] A filter layer, wherein the filter layer is disposed between the photosensitive element layer and the microlens layer, and the filter layer is connected to the microlens layer; and

[0009] A driving mechanism, at least one of the filter layer and the microlens layer is connected to the driving mechanism, and the driving mechanism is used to drive the filter layer and the microlens layer to move relative to the photosensitive element layer.

[0010] In a second aspect, an embodiment of the present application provides an electronic device, wherein the electronic device includes the image sensor as described above.

[0011] In an embodiment of the present application, a solution for improving the resolution of an image sensor is provided, wherein a driving mechanism is used to stably drive the filter layer and the microlens layer to move a set pixel (such as 1 pixel) relative to the photosensitive element layer, thereby improving the resolution without increasing the number of pixels and the size of the photosensitive chip.

[0012] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0014] Figure 1 is one of the structural schematic diagrams of the image sensor provided according to the embodiment of the present application;

[0015] Figure 2 is a second structural schematic diagram of an image sensor provided according to an embodiment of the present application;

[0016] Figure 3 is a schematic structural diagram of a driving component of an image sensor provided according to an embodiment of the present application;

[0017] Figure 4 is a comparison diagram of the image sensor provided in the embodiment of the present application before and after processing an image;

[0018] Figure 5 It is a schematic diagram of the pattern arrangement of the existing RGB photosensitive chip sensor;

[0019] Figure 6 yes Figure 5 Schematic diagram of cross section;

[0020] Figure 7 is a schematic diagram of a pattern arrangement of an image sensor provided in an embodiment of the present application;

[0021] Figure 8 This is a schematic diagram of two results obtained on the same photosensitive element layer before and after the image sensor provided by an embodiment of the present application moves.

[0022] Reference numerals:

[0023] 1. Photosensitive element layer; 2. Microlens layer; 3. Filter layer; 4. Driving mechanism; 5. First accommodating space; 6. Support structure; 7. Second accommodating space; 8. Circuit board; 9. Heat conducting element; 10. Lens; 11. Bracket; 12. Infrared filter;

[0024] 41, first driving part; 411, first bearing part; 412, first driving assembly; 4121, first electrode plate; 4122, second electrode plate;

[0025] 42, second driving part; 421, second bearing part; 422, second driving assembly; 4221, third electrode plate; 4222, fourth electrode plate. DETAILED DESCRIPTION

[0026] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0027] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] Combine the following Figures 1 to 8 , the image sensor and electronic device provided in the embodiments of the present application are described in detail through specific embodiments and their application scenarios.

[0031] According to an embodiment of the present application, an image sensor is provided, which can obtain a high-resolution image through a series of low-resolution images, that is, super-resolution reconstruction. Specifically: The image sensor provided in the embodiment of the present application can obtain a high-resolution image without increasing the size of the photosensitive chip or the number of pixels.

[0032] The image sensor provided in the embodiment of the present application is shown in FIG. Figure 1 The image sensor comprises: a photosensitive element layer 1, a microlens layer 2 and a filter layer 3, wherein the filter layer 3 is arranged between the photosensitive element layer 1 and the microlens layer 2, and the filter layer 3 is connected to the microlens layer 2; the image sensor further comprises a driving mechanism 4, wherein at least one of the filter layer 3 and the microlens layer 2 is connected to the driving mechanism 4, and the driving mechanism 4 is used to drive the filter layer 3 and the microlens layer 2 to move relative to the photosensitive element layer 1.

[0033] The photosensitive element layer 1 includes, for example, a plurality of photosensitive units, namely, photodiodes (PDs). The plurality of photosensitive units can be arranged in a set array to form a specific photosensitive plane, and those skilled in the art can flexibly set the specific arrangement of the plurality of photosensitive units as required, and the embodiments of the present application do not impose specific restrictions thereon. The plurality of photosensitive units can sense light of different wavelengths and convert light signals into sensing electrical signals.

[0034] The micro-lens layer 2 (Micro-LENS) covers the filter layer 3, and the micro-lens layer 2 can be used to converge light. The filter layer 3 and the micro-lens layer 2 are connected together, and the filter layer 3 and the photosensitive element layer 1 are separated. In this way, the filter layer 3 and the micro-lens layer 2 can move relative to the photosensitive element layer 1 under the drive of the drive mechanism 4.

[0035] That is to say, in the embodiment of the present application, the driving mechanism 4 is used to drive the color filter 3 (CF) and the micro-lens layer 2 (Micro-LENS) to move together, while the photosensitive element layer 1 located below the two does not move together with the color filter 3 and the micro-lens layer 2, that is, the position of the photosensitive element layer 1 is fixed, which brings a technical effect that, for example, auxiliary parts such as heat sinks can be attached to the bottom of the photosensitive element layer 1 (i.e., the side away from the color filter 3), and the attached heat sinks help improve the heat dissipation performance of the image sensor. In addition, the phenomenon of increased junction temperature of the image sensor during operation is avoided, which is very beneficial to improving the image quality.

[0036] For example, see Figure 5 and Figure 6 The conventional RGB style design shown is as follows:

[0037] Figure 5 and Figure 6 The figure shows the most common arrangement of RGB at present. Each pixel is composed of a micro-lens (Micro-LENS), a color filter (CF) and a photodiode (PD), and each pixel will present a color information. Pixels with three different color filters are set on the spatial plane. After the signal is collected, it is processed by "demosaicing" to form a color pixel. However, the disadvantages of this arrangement are also obvious, because each pixel can only capture one color. If a normal color is to be presented, it must be completed by four pixels RGGB. If high resolution and high color reproduction are to be achieved, it is necessary to continuously reduce the size of the RGGB arrangement, and the small pixel size (pixel size) will be limited by the process, or increase the size of the image sensor, but the sensor with a large pixel size (pixel size) must require a thicker electronic device size, which is contrary to the current requirement for thin and light electronic devices. Therefore, a new design is needed.

[0038] In view of the problems existing in the conventional RGB design, in the embodiment of the present application, the design improves the resolution by moving the microlens layer 2 and the filter layer 3, thereby achieving super-resolution. Specifically:

[0039] Before moving the microlens layer 2 and the filter layer 3, exposure is started first. Figure 8 The photosensitive element layer 1 shown in the figure includes, for example, 6 photosensitive units (1#PD to 6#PD), each of which can obtain a color information, for example, the #1 photosensitive unit (PD) obtains red color information, the 2# photosensitive unit (PD) obtains green color information, the 3# photosensitive unit (PD) obtains green color information, etc.;

[0040] Then, the microlens layer 2 and the filter layer 3 can be driven by the driving mechanism 4 to Figure 8The right side shown in the figure moves 1 pixel. At this time, the photosensitive element layer 1 at the bottom remains in place; thus, after exposure, the #1 photosensitive unit (PD) obtains blue color information, the 2# photosensitive unit (PD) obtains red color information, and the 3# photosensitive unit (PD) obtains blue color information. It can be seen that each time the microlens layer 2 and the filter layer 3 move (one pixel each time), a photosensitive unit (PD) on the photosensitive element layer 1 can obtain different color information. In this way, through three movements, the same photosensitive unit (PD) can obtain four color information (including one color information before the movement and the other three color information obtained by moving three times), thus forming the complete color information of RGGB. Then, through the software algorithm for synthesis, a 4-fold image resolution can be obtained, thereby achieving the effect of eliminating false colors and improving resolution.

[0041] Among them, the software algorithm synthesis method: by shifting the same photosensitive unit (PD) three times, four color information software algorithms can be obtained, from the previous: black level correction - lens shading correction - bad pixel correction - color difference - automatic white balance - color correction, etc., to: black level correction - lens shading correction - bad pixel correction - color aliasing - automatic white balance - color correction, etc. The difference is that the color interpolation of the conventional algorithm is not required, but color aliasing is used instead, that is, the complete four color information obtained are fused.

[0042] The image sensor provided in the embodiment of the present application can realize super-resolution reconstruction of images, which does not require mosaic processing and has low power consumption. It can improve resolution and reduce moiré patterns on the screen, thereby obtaining more realistic color data.

[0043] In an embodiment of the present application, a solution for improving the resolution is provided for an image sensor, wherein the filter layer 3 and the microlens layer 2 are stably driven by a driving mechanism 4 to move a set pixel (such as 1 pixel) relative to the photosensitive element layer 1, thereby improving the resolution without increasing the number of pixels and the size of the photosensitive chip.

[0044] Among them, the filter layer 3 and the microlens layer 2 are movable, and the photosensitive element layer 1 located at the bottom is fixed, so that a position can be reserved on the bottom surface of the photosensitive element layer 1 for installing a heat conductor, which can achieve better heat dissipation performance and avoid the situation where the picture quality is reduced due to high temperature.

[0045] In some examples of this application, see Figure 1 The driving mechanism 4 and the filter layer 3 form a containing space, and the photosensitive element layer 1 is arranged in the containing space.

[0046] In the embodiment of the present application, the position of the driving mechanism 4 is reasonably set, so that the driving mechanism and 4 can not only directly drive the filter layer 3 and the microlens layer 2 to move, but also form an accommodation space with the filter layer 3, and the photosensitive element layer 1 can be installed in the space, so that the inner cavity of the image sensor is arranged more reasonably and the space is effectively utilized.

[0047] In some examples of this application, see Figure 7 and Figure 8 , the photosensitive element layer 1 includes a plurality of photosensitive units, the microlens layer 2 includes a plurality of microlens units, and the filter layer 3 includes a plurality of filter units; wherein the microlens units and the filter units are arranged in a one-to-one correspondence;

[0048] During the process of moving the filter layer 3 and the microlens layer 2 , one of the filter units may be moved from being opposite to one of the light emitting units to being opposite to another of the light emitting units.

[0049] That is, see, for example, Figure 8 , taking the filter unit and the microlens unit corresponding to the photosensitive unit #1 as an example: the corresponding filter unit and the microlens unit correspond to the photosensitive unit #1 before moving, and correspond to the photosensitive unit #2 after moving one pixel, and the photosensitive unit #1 and the photosensitive unit #2 are adjacently arranged.

[0050] Optionally, see Figure 1 and Figure 2 The driving mechanism 4 includes a first driving unit 41 and a second driving unit 42; at least one of the filter layer 3 and the microlens layer 2 is connected to the first driving unit 41, and the first driving unit 41 is connected to the filter layer 3 and the microlens layer 2, so that the first driving unit 41 drives the filter layer 3 and the microlens layer 2 to move in a first direction relative to the photosensitive element layer 1; the second driving unit 42 is connected to the first driving unit 41, so as to drive the first driving unit 41 to drive the filter layer 3 and the microlens layer 2 to move in a second direction relative to the photosensitive element layer 1, and the first direction and the second direction are set to be perpendicular to each other and parallel to the photosensitive element layer 1.

[0051] The photosensitive element layer 1 forms a photosensitive plane. The movement of the filter layer 3 and the microlens layer 2 is parallel to the photosensitive plane. In other words, the filter layer 3 and the microlens layer 2 move up, down, left, and right on a plane parallel to the photosensitive plane.

[0052] In the embodiment of the present application, the driving mechanism 4 is divided into two parts, namely the first driving part 41 and the second driving part 42 , which can be used to drive the combined filter layer 3 and the microlens layer 2 to move in different directions.

[0053] For example, see Figure 2 , the first direction is set to the horizontal direction on the horizontal plane (such as the X-axis direction), then the first driving unit 41 can drive the filter layer 3 and the microlens layer 2 to move left and right, that is, move 1 pixel to the left or 1 pixel to the right. Please continue to refer to Figure 2 , the second direction is set as the longitudinal direction on the horizontal plane, which is perpendicular to the first direction, then the second driving unit 42 can drive the filter layer 3 and the microlens layer 2 to move up and down, that is, move up 1 pixel or move down 1 pixel.

[0054] In some examples of this application, see Figure 2 and Figure 3 As shown, the driving mechanism 4 includes a first driving part 41 and a second driving part 42;

[0055] The first driving portion 41 includes a first bearing portion 411 and a first driving assembly 412 , and the second driving portion 42 includes a second bearing portion 421 and a second driving assembly 422 , wherein the second bearing portion 421 is disposed around the outer periphery of the first bearing portion 411 ;

[0056] The first bearing portion 411 is provided with a first accommodating space 5, a supporting structure 6 is provided in the first accommodating space 5, the supporting structure 6 can be bent and moved, the filter layer 3 and the microlens layer 2 are provided on the supporting structure 6, the first driving component 412 is provided in the first accommodating space 5, and is respectively connected to the first bearing portion 411, the filter layer 3 and the microlens layer 2, and the first driving component 412 can drive the filter layer 3 and the microlens layer 2 to move relative to the photosensitive element layer 1 in a first direction;

[0057] A second accommodating space 7 is formed between the first carrying portion 411 and the second carrying portion 421. The second driving component 422 is disposed in the second accommodating space 7 and is respectively connected to the first carrying portion 411 and the second carrying portion 421. The second driving component 422 drives the first carrying portion 411 to drive the filter layer 3 and the microlens layer 2 to move in the second direction relative to the photosensitive element layer 1.

[0058] Among them, see Figure 2The first bearing part 411 is, for example, an annular structure, and the first bearing part 411 is disposed around the filter layer 3 and the microlens layer 2. The second bearing part 421 is, for example, also an annular structure, and the second bearing part 421 is disposed around the first bearing part 411. In this way, the first bearing part 411 can be equivalent to the inner ring support structure, and the second bearing part 421 can be equivalent to the outer ring support structure.

[0059] For example, the first bearing portion 411 and the second bearing portion 421 are both rectangular ring structures.

[0060] The first driving component 412 is arranged on the first bearing part 411 located in the inner circle, and the filter layer 3 and the microlens layer 2 are accommodated in the internal space of the first bearing part 411 and are connected to the first driving component 412. The first driving component 412 is used to drive the filter layer 3 and the microlens layer 2 to move left or right relative to the photosensitive element layer 1.

[0061] The second driving component 422 is connected between the first bearing part 411 located in the inner circle and the second bearing part 421 located in the outer circle. The second driving component 422 does not directly drive the filter layer 3 and the microlens layer 2 to move up and down, but drives the first bearing part 411 directly connected thereto to move accordingly, and then the first bearing part 411 synchronously drives the filter layer 3 and the microlens layer 2 to move up and down.

[0062] In the embodiment of the present application, the left-right movement and the up-down movement of the filter layer 3 and the microlens layer 2 are controlled separately, which makes the driving control more convenient and more stable.

[0063] The supporting structure 6 is, for example, flexible and can be bent when driven.

[0064] The first driving component 412 and the second driving component 422 are both MEMS capacitive driving devices, for example.

[0065] Compared with the current type of camera movement actuators, MEMS (Micro-Electro-Mechanical System) has the characteristics of small size and high precision, and can achieve high-precision movement.

[0066] The MEMS structure selected in the embodiment of the present application can achieve higher precision and more stable control, and compared with other motor solutions, it has lower power consumption, improved super-resolution performance, and improved picture effects.

[0067] In some examples of this application, see Figure 3, the first driving component 412 is provided with multiple; the first driving component 412 includes a first electrode plate 4121 and a second electrode plate 4122 which are arranged in parallel and staggered, the first electrode plate 4121 is connected to the first bearing part 411, and the second electrode plate 4122 is connected to the supporting structure 6; when the first driving component 412 is powered on, the second electrode plate 4122 drives the filter layer 3 and the microlens layer 2 to move in the first direction relative to the photosensitive element layer 1.

[0068] The first electrode plate 4121 is connected to the first bearing part 411, and the first electrode plate 4121 is fixed on the first bearing part 411, and can be used as a fixed electrode plate. The second electrode plate 4122 is connected to the support structure 6, and the support structure 6 supports the filter layer 3 and the microlens layer 2. The second electrode plate 4122 needs to drive the filter layer 3 and the microlens layer 2 to move, so the second electrode plate 4122 is designed as a movable electrode plate (it moves relative to the first electrode plate 4121).

[0069] Wherein, when the driving force generated by the first driving component 412 is balanced with the bending stress of the supporting structure 6 , the filter layer 3 and the microlens layer 2 stay at the target position.

[0070] It should be noted that, when the first electrode plate 4121 and the second electrode plate 4122 are both powered on, an electrostatic force can be generated between the first electrode plate 4121 and the second electrode plate 4122. When the electrostatic force between the two electrodes is balanced with the bending stress of the supporting structure 6, the filter layer 3 and the microlens layer 2 can be stably stayed and fixed at the target position.

[0071] In some examples of this application, see Figure 2 and Figure 3 The first electrode plate 4121 includes a plurality of first comb teeth, and the second electrode plate 4122 includes a plurality of second comb teeth; the plurality of first comb teeth and the plurality of second comb teeth are parallel to each other and staggered.

[0072] It can be understood that both the first electrode plate 4121 and the second electrode plate 4122 have a comb-tooth structure, see Figure 2 and Figure 3 .

[0073] The working principle of the first driving component 412 is as follows:

[0074] The parallel plate actuator can generate a driving force in a specific direction, and the control mass can move along a specific direction. Figure 3As shown, the electrostatic force generated by the two parallel plates in the x direction is:

[0075]

[0076]

[0077] In formula (1) and formula (2): dielectric constant ε0 = 8.854 × 10 -12 F / m, V is the voltage applied between the first electrode 4121 and the second electrode 4122, y0 is the spacing between the comb teeth of the two plates (remains unchanged), and x0 is the width of the plates (constant).

[0078] From the above formula, we can know that the electrostatic force F X The size of is proportional to the square of the added value.

[0079] By applying different voltages, the electrostatic force F is changed X Since the movable second electrode plate 4122 is connected to the support structure 6 (bendable), when the voltage increases, the electrostatic force F X The second electrode plate 4122 is also enlarged, pushing the movable second electrode plate 4122 to move. When the electrostatic force is balanced with the bending stress of the support structure 6, the second electrode plate 4122 is stationary, thereby changing the distance between the two electrodes. By reasonably designing the above design values, a stable um-level drive can be achieved.

[0080] In some examples of this application, see Figure 2 , the second driving component 422 is provided with multiple; the second driving component 422 includes a third pole plate 4221 and a fourth pole plate 4222 which are arranged in parallel and staggered, the third pole plate 4221 is connected to the second bearing part 421, and the fourth pole plate 4222 is connected to the first bearing part 411; when the second driving component 422 is powered on, the fourth pole plate 4222 drives the filter layer 3 and the microlens layer 2 to move in the second direction relative to the photosensitive element layer 1.

[0081] Optionally, the third electrode plate 4221 includes a plurality of third comb teeth, and the fourth electrode plate 4222 includes a plurality of fourth comb teeth; the plurality of third comb teeth and the plurality of fourth comb teeth are parallel to each other and staggered.

[0082] The first driving component 412 and the second driving component 422 provided in the embodiment of the present application can achieve an accuracy of less than 1 pixel when driving the filter layer 3 and the microlens layer 2 to move together, and can provide a very stable fixed accuracy, such as 0.5 pixel. The step of each movement will not fluctuate, thereby improving the super resolution.

[0083] In some examples of this application, see Figure 1 The image sensor also includes a circuit board 8 and a heat conductor 9. The photosensitive element layer 1 and the driving mechanism 4 are both arranged on the circuit board 8 and electrically connected to the circuit board 8. The heat conductor 9 is arranged on the side of the circuit board 8 away from the photosensitive element layer 1.

[0084] The circuit board 8 is a flexible circuit board and can be bent.

[0085] The circuit board 8 can realize electrical conduction between the photosensitive element layer 1 and the driving mechanism 4 and an external circuit so that they can work normally.

[0086] In the image sensor provided in the embodiment of the present application, the photosensitive element layer 1, the flexible printed circuit board (FPC) and the heat conductor 9 can be in direct contact with each other. The heat can be directly conducted to other hardware parts of the electronic device through the heat conductor 9, which is conducive to better heat dissipation performance.

[0087] Optionally, the heat conducting member 9 is a metal sheet.

[0088] Furthermore, the heat conducting member 9 is a steel sheet.

[0089] See also Figure 1 The image sensor also includes a lens assembly, which includes a lens 10, a bracket 11 and an infrared filter 12. The lens 10 and the infrared filter 12 are arranged on the bracket 11, and the infrared filter 12 is arranged opposite to the lens 10.

[0090] See also Figure 4 , which shows a comparison of the same image before and after being processed by the image sensor provided by the embodiment of the present application. It can be clearly seen from the comparison that the image on the right has been reconstructed with super resolution, and the image quality level has been significantly improved.

[0091] According to another embodiment of the present application, an electronic device is provided.

[0092] The electronic device includes the image sensor as described above.

[0093] See also Figure 1 The image sensor can be assembled into a hardware part of an electronic device such as a mobile phone, for example, a middle frame of the mobile phone.

[0094] In addition, a pyrolytic graphite sheet (PGS) is provided in the mobile phone, which is a thin film for heat dissipation, and the image sensor is mounted thereon, that is, the photosensitive element layer 1 of the image sensor is provided on the pyrolytic graphite sheet.

[0095] It should be noted that the electronic device may be a terminal or other device other than a terminal. Exemplarily, the electronic device may be, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited here.

[0096] Other structures and operations of the electronic device according to the embodiments of the present application are known to those skilled in the art and will not be described in detail here.

[0097] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0098] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An image sensor, characterized in that: include: Photosensitive element layer; Microlens layer; A filter layer, the filter layer is disposed between the photosensitive element layer and the microlens layer, and the filter layer is connected to the microlens layer; as well as A driving mechanism, at least one of the filter layer and the microlens layer is connected to the driving mechanism, and the driving mechanism is used to drive the filter layer and the microlens layer to move relative to the photosensitive element layer; The driving mechanism comprises a first driving part and a second driving part; The first driving part includes a first bearing part and a first driving assembly, the second driving part includes a second bearing part and a second driving assembly, and the second bearing part is arranged around the outer periphery of the first bearing part; A first accommodating space is formed in the first bearing portion, a supporting structure is disposed in the first accommodating space, the supporting structure is bendable and movable, the filter layer and the microlens layer are disposed on the supporting structure, the first driving component is disposed in the first accommodating space, and is respectively connected to the first bearing portion, the filter layer and the microlens layer, and the first driving component can drive the filter layer and the microlens layer to move relative to the photosensitive element layer in a first direction; A second accommodating space is formed between the first carrying part and the second carrying part, the second driving component is disposed in the second accommodating space and is connected to the first carrying part and the second carrying part respectively, and the second driving component drives the first carrying part to drive the filter layer and the microlens layer to move relative to the photosensitive element layer in a second direction; When the driving force generated by the first driving component is balanced with the bending stress of the supporting structure, the filter layer and the microlens layer stay at the target position.

2. The image sensor according to claim 1, characterized in that The driving mechanism and the filter layer enclose a containing space, and the photosensitive element layer is arranged in the containing space.

3. The image sensor according to claim 1, characterized in that The photosensitive element layer includes a plurality of photosensitive units, the microlens layer includes a plurality of microlens units, and the filter layer includes a plurality of filter units; Wherein, the microlens unit and the filter unit are arranged in a one-to-one correspondence; During the process of moving the filter layer and the microlens layer, one of the filter units may be moved from being opposite to one light emitting unit to being opposite to another light emitting unit.

4. The image sensor according to claim 1, characterized in that The first drive assembly is provided in plurality; The first driving assembly includes a first electrode plate and a second electrode plate which are arranged in parallel and staggered, the first electrode plate is connected to the first bearing portion, and the second electrode plate is connected to the supporting structure; When the first driving component is powered on, the second electrode plate therein drives the filter layer and the microlens layer to move in the first direction relative to the photosensitive element layer.

5. The image sensor according to claim 4, characterized in that: The first electrode plate includes a plurality of first comb teeth, and the second electrode plate includes a plurality of second comb teeth; The plurality of first comb teeth and the plurality of second comb teeth are parallel to each other and staggered.

6. The image sensor according to claim 1, characterized in that: The second drive assembly is provided in plurality; The second driving assembly comprises a third electrode plate and a fourth electrode plate which are arranged in parallel and staggered, the third electrode plate is connected to the second bearing part, and the fourth electrode plate is connected to the first bearing part; When the second driving component is powered on, the fourth electrode plate therein drives the filter layer and the microlens layer to move in the second direction relative to the photosensitive element layer.

7. The image sensor according to any one of claims 1 to 6, characterized in that: It also includes a circuit board and a heat conductor, the photosensitive element layer and the driving mechanism are both arranged on the circuit board and electrically connected to the circuit board; The heat conducting member is arranged on a side of the circuit board away from the photosensitive element layer.

8. An electronic device, characterized in that: Comprising the image sensor as claimed in any one of claims 1-7.

Images