Display panel and display panel preparation method

Abstract

The application discloses a display panel and a preparation method thereof. The display panel comprises: a panel body, the panel body having a display area, part of the edge of the display area being provided with a cutting surface and making a functional layer of the panel body exposed outward; a glue layer covering the cutting surface to shield the functional layer; and a water-oxygen barrier layer covering at least one side surface of the glue layer away from the functional layer. The glue layer covers the cutting surface of the panel body to shield the functional layer, protects the functional layer, fills the burrs generated in the cutting of the panel body, provides a flat plane for the water-oxygen barrier layer to adhere, ensures that the water-oxygen barrier layer can stably adhere to and cover the glue layer, blocks external water vapor from entering the panel body through the cutting surface of the panel body by the water-oxygen barrier layer, and thus avoids the problem of progressive black spots caused by the erosion and corrosion of components of the functional layer, and ensures the packaging effect of the panel body and the display effect of the display panel.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic products, and particularly relates to a display panel and a display panel preparation method. BACKGROUND

[0002] Organic light emitting diode (OLED) has been widely used in the field of display technology due to its self-luminous, fast response, wide viewing angle, high brightness, continuous color, low driving voltage, low energy consumption, low cost, thinness and other advantages. With the rapid development and mass production of OLED products, the market demand for display panels of different shapes has also increased accordingly.

[0003] In some special market demands, it may be necessary to cut the display panel with completed thin film packaging in the display area into other product shapes of similar size but different outlines (notch, water drop, punch, etc.). Due to the structure limitation of the existing display panel, the cut of the display panel will be directly exposed to the environment after cutting, and water and oxygen will enter the display panel to cause progressive black spot defects, resulting in product failure.

[0004] Therefore, there is an urgent need for a new display panel and a display panel preparation method. SUMMARY

[0005] The display panel and the display panel preparation method provided by the embodiments of the present application block the water and oxygen in the outside from entering the panel body through the cutting surface of the panel body by the water and oxygen barrier layer, thereby avoiding the problem of progressive black spots caused by the erosion and corrosion of the components in the panel body, and ensuring the packaging effect of the panel body and the display effect of the display panel.

[0006] The display panel provided by the embodiments of the present application comprises a panel body, a glue layer and a water and oxygen barrier layer. The panel body has a display area, and part of the edge of the display area forms a cutting surface and makes the functional layer of the panel body exposed outward. The glue layer covers the cutting surface to shield the functional layer. The water and oxygen barrier layer covers at least one side surface of the glue layer away from the functional layer.

[0007] According to one aspect of the present application, a cover plate is further included, which is arranged on the light-emitting side of the panel body and covers the display area and has an outer edge extending out of the display area. The glue layer covers the cutting surface and the contact gap between the cover plate and the panel body. Preferably, the cover plate extends outward by a predetermined distance relative to the glue layer and the water and oxygen barrier layer.

[0008] According to an aspect of the present application, the functional layer comprises a support layer, an array substrate, a light-emitting layer, an encapsulation layer, a touch layer and an optical film layer which are stacked along the thickness direction of the display panel, and the side surface of the same side of the support layer, the array substrate, the light-emitting layer, the encapsulation layer, the touch layer and the optical film layer forms the cutting surface.

[0009] According to an aspect of the present application, the water-oxygen barrier layer comprises a main body portion and an extension portion, the main body portion covers the side surface of the adhesive layer away from the functional layer, and the extension portion extends from the main body portion to the direction of the panel body to cover part of the side surface of the panel body away from the light-emitting side.

[0010] According to another aspect of the present application, the display panel manufacturing method comprises the following steps: providing a panel body to be processed, the panel body having a display area; cutting the panel body to be processed to form a cutting surface at part of the edge of the display area and to expose the functional layer of the panel body outward; forming an adhesive layer on the cutting surface to shield the functional layer; and forming a water-oxygen barrier layer at least on the side surface of the adhesive layer away from the functional layer.

[0011] According to another aspect of the present application, between the step of providing the panel body to be processed and the step of forming the adhesive layer on the cutting surface, the method further comprises: forming an optical adhesive layer on the light-emitting side of the panel body to be processed; and adhering a cover plate to the side of the optical adhesive layer away from the panel body to be processed, the cover plate covering the display area and having an outer edge extending out of the display area.

[0012] According to another aspect of the present application, the step of forming the water-oxygen barrier layer at least on the side surface of the adhesive layer away from the functional layer comprises: the formed water-oxygen barrier layer is in contact with the side surface of the cover plate facing the panel body.

[0013] According to another aspect of the present application, between the step of providing the panel body to be processed, cutting the panel body to be processed to form a cutting surface at the display area, and the step of forming an optical adhesive layer on the light-emitting side of the panel body to be processed, the method further comprises: polishing the cutting surface.

[0014] According to another aspect of the present application, in the step of forming the water-oxygen barrier layer on the side surface of the adhesive layer away from the functional layer, the method comprises: forming the water-oxygen barrier layer on the side surface of the adhesive layer away from the panel body to be processed by a plasma-enhanced chemical vapor deposition or atomic layer deposition process; or, the method comprises: providing a water-oxygen barrier material film; and adhering the water-oxygen barrier material film to the side surface of the adhesive layer away from the panel body to be processed to form the water-oxygen barrier layer.

[0015] According to another aspect of the present application, in the step of forming the glue layer on the cutting surface, comprising: coating a first glue solution with a viscosity greater than 1000 centipoise·second on the cutting surface; curing the first glue solution; coating a second glue solution with a viscosity less than 100 centipoise·second on the cured first glue solution; curing the second glue solution, the cured first glue solution and the second glue solution form the glue layer.

[0016] Compared with the prior art, the display panel provided by the embodiment of the present application comprises a panel body, a glue layer and a water and oxygen barrier layer. After the panel body of the display panel is subjected to a non-conventional cutting process in a display area, the encapsulation of the non-display area of the display panel is removed, and the functional layer of the panel body is exposed outward. For example, the functional layer can comprise an array substrate, a light-emitting layer, a touch layer and the like, which are film layers of elements having circuit, wiring or light-emitting elements. The exposure of the functional layer to the outside will cause the elements to be exposed to the external water and oxygen. In order to avoid the water vapor from eroding and damaging the elements inside the panel body, in the embodiment, the glue layer is covered on the cutting surface of the panel body to shield the functional layer and protect the functional layer. The glue layer can also fill the burrs generated during the cutting of the panel body. At the same time, the glue layer can provide a flat plane for the water and oxygen barrier layer to adhere to, so as to ensure that the water and oxygen barrier layer can stably adhere to and cover the glue layer. That is, the water and oxygen barrier layer covers at least one side surface of the glue layer away from the functional layer. The water and oxygen barrier layer blocks the external water vapor from entering the panel body through the cutting surface of the panel body, thereby avoiding the problem of progressive black spots caused by the erosion and corrosion of the elements of the functional layer, and ensuring the encapsulation effect of the panel body and the display effect of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0018] Figure 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application;

[0019] Figure 2 is Figure 1 is a film layer structure diagram at B-B in

[0020] Figure 3 is a flow chart of a display panel preparation method provided by an embodiment of the present application;

[0021] Figure 4 is a structural schematic diagram in the preparation process of a display panel provided by an embodiment of the present application;

[0022] Figure 5 is Figure 4 a film layer structure diagram at C-C in the middle;

[0023] Figure 6 is a structural schematic diagram in the preparation process of the display panel provided by another embodiment of the present application;

[0024] Figure 7 is Figure 6 a film layer structure diagram provided by one embodiment at D-D;

[0025] Figure 8 is a film layer structure diagram in the preparation process of the display panel provided by one embodiment of the present application;

[0026] Figure 9 is a film layer structure diagram in the preparation process of the display panel provided by another embodiment of the present application.

[0027] In the drawings:

[0028] 1 - panel body; 11 - support layer; 12 - array substrate; 13 - light-emitting layer; 14 - encapsulation layer; 15 - touch layer; 16 - optical film layer; 2 - adhesive layer; 3 - water-oxygen barrier layer; 4 - cover plate; AA - display area; NA - non-display area. DETAILED DESCRIPTION

[0029] The features and exemplary embodiments of various aspects of the present application will be described in detail below, in order to make the purposes, technical solutions and advantages of the present application clearer and more apparent, the present application will be further described in detail below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are configured only to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by showing examples of the present application.

[0030] It should be noted that, in this document, the terms such as first and second, etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between such entities or operations. In addition, the terms "comprising", "containing", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or apparatus that includes a list of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent in such process, method, article, or apparatus. Without more limitations, the elements defined by the statement "comprising" do not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the elements.

[0031] It should be understood that, when describing the structure of a component, when one layer, one region is referred to as being "on" or "above" another layer, another region, it can mean being directly on or above the other layer, another region, or other layers or regions are included therebetween. And if the component is turned over, the layer, the region will be "under" or "below" the other layer, another region.

[0032] Various modifications and changes can be made to the present application in matters of form and detail without departing from the spirit and scope of the application. Thus, the present application is intended to cover the modifications and variations of this application that come within the scope of the corresponding claims (technical solutions claimed) and their equivalents. It should be noted that the embodiments provided by the embodiments of the present application can be combined with each other without contradiction.

[0033] The embodiments of the present application provide a display panel and a display panel preparation method, which will be described below with reference to the accompanying drawings Figures 1 to 9 The embodiments of the display panel and the display panel preparation method are described.

[0034] Please refer to Figures 1 to 2 , Figure 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application; Figure 2 is Figure 1 a film layer structure diagram at B-B in

[0035] The display panel provided by the embodiments of the present application comprises a panel body 1, the panel body 1 has a display area AA, part of the edges of the display area AA is formed with a cutting surface and makes the functional layer of the panel body 1 exposed outward; a glue layer 2 covers the cutting surface to shield the functional layer; a water and oxygen barrier layer 3 covers at least one side surface of the glue layer 2 away from the functional layer.

[0036] The display panel provided by the embodiment of the present application comprises a panel body 1, a glue layer 2 and a water-oxygen barrier layer 3. After the panel body 1 of the display panel is subjected to a non-conventional cutting process in the display area AA, the packaging of the non-display area NA of the display panel is removed, the functional layer of the panel body 1 is exposed outward, for example, the functional layer can comprise an array substrate 12, a light-emitting layer 13, a touch layer 15 and the like, which are film layers of elements with circuit, wire or light-emitting elements, and the exposure of the functional layer of the panel body 1 to the outside will cause the elements to be exposed to the external water and oxygen. In order to avoid the water vapor from eroding and damaging the elements inside the panel body 1, in the embodiment, the glue layer 2 is covered on the cutting surface of the panel body 1 to shield the functional layer and protect the functional layer, and the glue layer 2 can also fill the burrs generated in the cutting of the panel body 1. At the same time, the glue layer 2 can also provide a flat surface for the water-oxygen barrier layer 3 to adhere, so as to ensure that the water-oxygen barrier layer 3 can stably adhere to the glue layer 2, that is, the water-oxygen barrier layer 3 covers at least one side surface of the glue layer 2 away from the functional layer. The water-oxygen barrier layer 3 blocks the external water vapor from entering the panel body 1 through the cutting surface of the panel body 1, thereby avoiding the problem of progressive black spots caused by the erosion and corrosion of the elements of the functional layer, and ensuring the packaging effect of the panel body 1 and the display effect of the display panel.

[0037] It should be noted that, in the conventional cutting process of the panel body 1, the non-display area NA of the panel body 1 is cut, which does not have too much impact on the overall packaging of the panel body 1. However, in the embodiment of the present application, due to certain special market demand, the display area AA of the panel body 1 needs to be cut to cut the panel body 1 into other products with similar sizes but different outlines (notch, water drop, punch hole, etc.), that is, the above-mentioned non-conventional cutting process. The technical solution provided by the embodiment of the present application is to repackage the cutting surface of the panel body 1 by using the glue layer 2 and the water-oxygen barrier layer 3 when the original frame packaging of the panel body 1 is cut off and loses the water-oxygen blocking ability after the cutting process of the display area AA, so as to improve the packaging reliability of the panel body 1.

[0038] In some optional embodiments, the display panel further comprises a cover plate 4 arranged on the light-emitting side of the panel body 1, the cover plate 4 covers the display area AA and has an outer edge extending out of the display area AA, and the glue layer 2 covers the cutting surface and the contact gap between the cover plate 4 and the panel body.

[0039] It should be noted that, in order to ensure the structural strength of the cover plate 4 and the bonding effect between the cover plate 4 and the panel body 1, the cover plate 4 needs to be bonded to the panel body 1 after the panel body 1 is cut, that is, the cover plate 4 will not be cut together with the panel body 1, the cover plate 4 covers the display area AA and has an outer edge extending out of the display area AA, and after the cover plate 4 and the panel body 1 are bonded, there may be a contact gap between the cover plate 4 and the panel body 1 due to the outer edge of the cover plate 4 extending out of the display area AA. In this embodiment, the adhesive layer 2 can be covered on the cutting surface and the contact gap between the cover plate 4 and the panel body to further improve the packaging effect of the display panel.

[0040] Optionally, the cover plate 4 extends outward by a predetermined distance relative to the adhesive layer 2 and the water and oxygen barrier layer 3 to protect the adhesive layer 2 and the water and oxygen barrier layer 3 from external collisions and other adverse effects.

[0041] In some optional embodiments, the water and oxygen barrier layer 3 includes a main body portion and an extension portion that are connected, the main body portion covers the side surface of the adhesive layer 2 away from the functional layer, and the extension portion extends from the main body portion in the direction of the panel body 1 to cover part of the side surface of the panel body 1 away from the light emitting side.

[0042] It should be noted that in this embodiment, the main body portion and the extension portion are continuous, and the cooperation of the main body portion and the extension portion can semi-enclose the edge portion of the panel body 1 close to the adhesive layer 2 to increase the coverage range of the water and oxygen barrier layer 3, improve the water and oxygen blocking effect of the water and oxygen barrier layer 3, and prevent external water and oxygen from entering the panel body 1.

[0043] In some optional embodiments, along the thickness direction of the display panel, the functional layer includes a support layer 11, an array substrate 12, a light emitting layer 13, an encapsulation layer 14, a touch layer 15, and an optical film layer 16 which are stacked, and the side surface of the support layer 11, the array substrate 12, the light emitting layer 13, the encapsulation layer 14, the touch layer 15, and the optical film layer 16 on the same side forms a cutting surface.

[0044] It can be understood that when the panel body 1 of the display area AA is cut, the encapsulation layer 14 of the original frame portion of the panel body 1 will also be cut off, and the side surface of the light emitting layer 13 provided with the light emitting element which is cut is directly exposed to the air, and the side surface of the support layer 11, the array substrate 12, the light emitting layer 13, the encapsulation layer 14, the touch layer 15, and the optical film layer 16 on the same side which are cut together forms a cutting surface, and the cutting surface is packaged by the adhesive layer 2 and the water and oxygen barrier layer 3 to avoid the exposure of the light emitting layer 13 or the touch layer 15 and other film layers which are easily eroded by water and oxygen, thereby ensuring the reliability of the packaging of the panel body 1 at the cutting surface.

[0045] Optionally, the adhesive layer 2 comprises a solvent-free component polymer adhesive, for example, the polymer adhesive is ultraviolet curing adhesive or optically clear adhesive. Specifically, the ultraviolet curing adhesive (UV adhesive) is a single-component, solvent-free, ultraviolet and visible light curing adhesive and sealant. The photoinitiator in the ultraviolet curing adhesive rapidly decomposes into free radicals or cations under the irradiation of ultraviolet light of appropriate wavelength and light intensity, thereby initiating the polymerization of unsaturated bonds and allowing the material to cure. In addition to filling the burrs generated during the cutting and edging of the panel body 1, the ultraviolet curing adhesive can also form a smooth surface, providing a good adhesion plane for the water and oxygen barrier layer 3, thereby avoiding the problem that the water and oxygen barrier layer 3 cannot be attached or easily falls off due to the rough cutting surface and burrs.

[0046] The optically clear adhesive (OCA adhesive) has the characteristics of colorless transparency, light transmittance of more than 95%, good adhesive strength, curing at room temperature or medium temperature, and small curing shrinkage, and can also meet the requirements of the adhesive layer 2 for adhesion and curing. Of course, the adhesive layer 2 can also use other types of curing adhesives, not limited to these two types, and all "solvent-free component" "polymer adhesives" can be applied to the adhesive layer 2.

[0047] Please refer to Figures 3 to 9 , Figure 3 is a flowchart of a display panel preparation method provided by an embodiment of the present application; Figure 4 is a structural schematic diagram in the preparation process of a display panel provided by an embodiment of the present application; Figure 5 is a film layer structure diagram at C-C in Figure 4 ; Figure 6 is a structural schematic diagram in the preparation process of a display panel provided by another embodiment of the present application; Figure 7 is a film layer structure diagram provided by an embodiment at D-D in Figure 6 ; Figure 8 is a film layer structure diagram in the preparation process of a display panel provided by an embodiment of the present application; Figure 9 is a film layer structure diagram in the preparation process of a display panel provided by another embodiment of the present application.

[0048] The present application also provides a display panel preparation method, and the display panel has a display area AA, comprising the following steps:

[0049] S110: providing a panel body 1 to be processed, the panel body 1 having a display area AA, cutting the panel body 1 to be processed to form a cutting surface on part of the edges of the display area AA and expose the functional layer of the panel body 1 outward, as shown in Figures 4 to 7 , wherein Figure 4 and Figure 5The structure schematic diagram and the film layer structure diagram of the panel body 1 before cutting, Figure 6 and Figure 7 The structure schematic diagram and the film layer structure diagram of the panel body 1 after cutting, by comparison, the encapsulation layer 14 of the panel body 1 in the non-display area NA and the film layer located in the display area AA are all removed after cutting.

[0050] S120: forming a glue layer 2 on the cutting surface to shield the functional layer, as shown in Figure 9 ;

[0051] S130: forming a water and oxygen barrier layer 3 at least on the surface of the glue layer 2 away from the functional layer, as shown in Figure 2 .

[0052] The display panel preparation method provided by the embodiment of the application forms a glue layer 2 and a water and oxygen barrier layer 3 on the cutting surface of the part of the edge of the display area AA of the panel body 1 to be processed, covers the cutting surface of the panel body 1 with the glue layer 2 to shield the functional layer and protect the functional layer, and also fills the burrs generated by cutting of the panel body 1, at the same time, the glue layer 2 can provide a flat plane for the water and oxygen barrier layer 3 to ensure that the water and oxygen barrier layer 3 can stably adhere to and cover the glue layer 2, that is, the water and oxygen barrier layer 3 covers at least the surface of the glue layer 2 away from the functional layer, and the water and oxygen barrier layer 3 blocks the external water vapor from entering the panel body 1 through the cutting surface of the panel body 1, thereby avoiding the problem of progressive black spots caused by the erosion and corrosion of the components of the functional layer, and ensuring the encapsulation effect of the panel body 1 and the display effect of the display panel.

[0053] In step S110, due to certain special market demand, the cutting process of the display area AA of the panel body 1 to be processed is needed to cut the panel body 1 to be processed into other products with similar size but different outlines (notch, water drop, punch, etc.), which can be cut by laser cutting or other cutting processes.

[0054] In step S120, the glue layer 2 can be directly coated on the cutting surface by hand or dispensing machine, the glue layer 2 can be UV glue or OCA glue, etc., the glue layer 2 is formed to fill the burrs generated by cutting and edge grinding of the panel body 1 to be processed, and the glue layer 2 is cured by ultraviolet or other specific light, and the process is preferably carried out in a nitrogen atmosphere to avoid oxygen interference, but if the product demand is low, it can also be completed in an atmospheric environment.

[0055] In step S130, the water-oxygen barrier layer 3 is arranged to reseal the cut panel body 1 to avoid the light emitting element of the panel body 1 being directly exposed to the water-oxygen environment outside due to the cutting surface formed in the display area AA, and the water-oxygen barrier layer 3 blocks the water-oxygen outside from entering the panel body 1 through the cutting surface, thereby ensuring the sealing effect of the panel body 1 and the display effect of the display panel.

[0056] Please refer to Figure 8 , Figure 8 is a film layer structure diagram in the preparation process of the display panel provided by an embodiment of the present application.

[0057] In some optional embodiments, between the steps of providing the panel body 1 to be processed and forming the adhesive layer 2 on the cutting surface, the steps further include: forming an optical adhesive layer on the light-emitting side of the panel body 1 to be processed; and adhering the cover plate 4 to the side of the optical adhesive layer away from the panel body 1 to be processed, the cover plate 4 covering the display area AA and having an outer edge extending out of the display area AA.

[0058] It should be noted that, in order to prevent the panel body 1 to be processed from being curled due to the excessively high temperature in the process of forming the water-oxygen barrier layer 3, and thus the cover plate 4 cannot be adhered, in the present embodiment, the cover plate 4 adhering process is performed before the steps of forming the adhesive layer 2 and the water-oxygen barrier layer 3 on the cutting surface, so as to ensure the adhering effect, and also to avoid the problems such as overflow of the adhesive layer 2 or the water-oxygen barrier layer 3, thereby affecting the adhering effect of the cover plate 4 and the panel body 1 to be processed. The optical adhesive layer can be OCA adhesive, and the cover plate 4 covers the display area AA and has an outer edge extending out of the display area AA, so as to protect the panel body 1 to be processed.

[0059] Optionally, after the adhesive layer 2 is formed on the cutting surface, in order to avoid the excessively high temperature in the process of forming the water-oxygen barrier layer 3 affecting the signal transmission of the FPC (Flexible Printed Circuit) and IC (Integrated Circuit Chip) part of the panel body 1 to be processed, a high-temperature adhesive tape can be used to protect the circuit board and the signal input area part of the panel body 1 to be processed.

[0060] In some optional embodiments, the step of forming the water-oxygen barrier layer on the side surface of the adhesive layer away from the functional layer includes: the formed water-oxygen barrier layer 3 is in contact with the side surface of the cover plate 4 facing the panel body 1.

[0061] It can be understood that after the cover plate 4 is attached, the water and oxygen barrier layer 3 needs to be in contact with the side surface of the cover plate 4 facing the panel body 1 to avoid water and oxygen entering from the contact gap between the cover plate 4 and the panel body 1, further improving the re-encapsulation effect of the display panel.

[0062] Since burrs or many fine cracks are generated on the cutting surface when the panel body 1 to be processed is cut by a cutting method such as laser, it is not conducive to the subsequent formation of the glue layer 2 and the water and oxygen barrier layer 3. In order to improve the above problems, in some optional embodiments, after providing the panel body 1 to be processed, the panel body 1 to be processed is cut to form a cutting surface in the display area AA and the step of attaching the cover plate 4 to the light exit side of the panel body 1 to be processed between the steps of providing the panel body 1 to be processed and cutting the panel body 1 to be processed further comprises: polishing the cutting surface.

[0063] The cutting surface can be polished by mechanical grinding to prevent the cracks from breaking due to collision during subsequent circulation, and at the same time, remove cutting slag to avoid short circuit caused by slag.

[0064] Of course, the polishing process can also not be performed. The purpose of the polishing process is to remove carbonization, prevent short circuit in the display area, and provide a flat surface for gluing and re-encapsulation after cutting. It has been verified by experiments that the polishing step can be replaced by a "cutting laser of a specific wavelength" in the step of "cutting the panel body 1 to be processed", and the effect is better and the precision is higher.

[0065] In order to form the water and oxygen barrier layer 3, in some optional embodiments, in the step of forming the water and oxygen barrier layer 3 on the side surface of the glue layer 2 away from the functional layer, it comprises: forming the water and oxygen barrier layer 3 on the side surface of the glue layer 2 away from the panel body 1 to be processed by plasma enhanced chemical vapor deposition or atomic layer deposition process.

[0066] It should be noted that the panel body 1 to be processed after forming the glue layer 2 is placed in a PECVD (Plasma Enhanced Chemical Vapor Deposition) or ALD (Atomic Layer Deposition) machine for re-encapsulation process to form the water and oxygen barrier layer 3. Specifically, a furnace type PECVD or hot ALD can be used, and the temperature is below 110°C to ensure the film forming effect of the water and oxygen barrier layer 3.

[0067] In addition to forming the water-oxygen barrier layer 3 in the machine by the PECVD and ALD processes described above, the dense barrier film formed by PECVD or ALD can be replaced by an adherent barrier film. Specifically, in some alternative embodiments, the step of forming the water-oxygen barrier layer 3 on the side surface of the adhesive layer 2 away from the functional layer includes: providing a water-oxygen barrier material film; and attaching the water-oxygen barrier material film to the side surface of the adhesive layer 2 away from the panel body 1 to be processed to form the water-oxygen barrier layer 3.

[0068] It can be understood that the embodiment is to obtain a shaped water-oxygen barrier material film first, and then directly attach the water-oxygen barrier material film to the side surface of the adhesive layer 2 away from the panel body 1 to be processed, which is simple and convenient in process and easy to operate.

[0069] In some alternative embodiments, to ensure that the adhesive layer 2 is coated without bubbles and pinholes, the step of forming the adhesive layer 2 on the cutting surface includes: coating a first adhesive liquid with a viscosity greater than 1000 centipoise·seconds on the cutting surface; solidifying the first adhesive liquid; coating a second adhesive liquid with a viscosity less than 100 centipoise·seconds on the solidified first adhesive liquid; and solidifying the second adhesive liquid, the solidified first adhesive liquid and the second adhesive liquid forming the adhesive layer 2. The first adhesive liquid with a viscosity of 1000 centipoise·seconds or more is coated on the cutting surface to bond the cut, and then the second adhesive liquid is coated to form a flat plane. Of course, the viscosity of the first adhesive liquid and the second adhesive liquid is not limited to the above values, and can be selected according to actual needs.

[0070] The display panel provided by the embodiments of the present application can be applied to a mobile phone, and can also be any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interaction terminal, etc. The embodiments of the present application do not make special limitations on this.

[0071] The above is only a specific implementation of the present application, and those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the foregoing method embodiments, which will not be described here. It should be understood that the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application.

[0072] It is also important to note that the examples mentioned in the present application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the steps mentioned above, that is, the steps can be performed in the order mentioned in the examples, or in an order different from the examples, or several steps can be performed simultaneously.

Claims

1. A display panel, characterized by, The display panel comprises: a panel body having a display area, a part of the edge of the display area is formed with a cutting surface and the functional layer of the panel body is exposed outward, along the thickness direction of the display panel, the functional layer comprises a support layer, an array substrate, a light-emitting layer, an encapsulation layer, a touch layer and an optical film layer arranged in a stack, the side surface of the same side of the support layer, the array substrate, the light-emitting layer, the encapsulation layer, the touch layer and the optical film layer forms the cutting surface; a glue layer covering the cutting surface to shield the functional layer; a water and oxygen barrier layer covering at least the side surface of the glue layer away from the functional layer, the water and oxygen barrier layer comprises a main body portion and an extension portion, the main body portion covers the side surface of the glue layer away from the functional layer, and the extension portion extends from the main body portion to the direction of the panel body to cover part of the side surface of the panel body away from the light-emitting side.

2. The display panel of claim 1, wherein, Further comprising a cover plate, the cover plate is arranged on the light-emitting side of the panel body, the cover plate covers the display area and has an outer edge extending out of the display area; the glue layer covers the cutting surface and the contact seam between the cover plate and the panel body.

3. The display panel of claim 2, wherein, The cover plate extends outward relative to the glue layer and the water and oxygen barrier layer by a predetermined distance.

4. A display panel manufacturing method for manufacturing the display panel according to any one of claims 1 to 3, characterized by, The method comprises the following steps: providing a panel body to be processed, the panel body having a display area, cutting the panel body to be processed to form a cutting surface on a part of the edge of the display area and expose the functional layer of the panel body outward; forming a glue layer on the cutting surface to shield the functional layer; forming a water and oxygen barrier layer on at least the side surface of the glue layer away from the functional layer, the water and oxygen barrier layer comprises a main body portion and an extension portion, the main body portion covers the side surface of the glue layer away from the functional layer, and the extension portion extends from the main body portion to the direction of the panel body to cover part of the side surface of the panel body away from the light-emitting side.

5. The display panel manufacturing method according to claim 4, wherein Further comprising, between the step of providing the panel body to be processed and the step of forming the glue layer on the cutting surface: forming an optical glue layer on the light-emitting side of the panel body to be processed; attaching a cover plate to the side of the optical glue layer away from the panel body to be processed, the cover plate covering the display area and having an outer edge extending out of the display area.

6. The display panel manufacturing method according to claim 5, wherein In the step of forming the water and oxygen barrier layer on at least the side surface of the glue layer away from the functional layer, it comprises: the formed water and oxygen barrier layer is in contact with the side surface of the cover plate facing the panel body.

7. The display panel manufacturing method according to claim 5, wherein Further comprising, between the step of providing the panel body to be processed and the step of cutting the panel body to be processed to form a cutting surface on the display area and the step of forming an optical glue layer on the light-emitting side of the panel body to be processed: polishing the cutting surface.

8. The display panel manufacturing method of claim 4, wherein, In the step of forming the water and oxygen barrier layer on the side surface of the glue layer away from the functional layer, it comprises: forming the water and oxygen barrier layer on the side surface of the glue layer away from the panel body to be processed by a plasma-enhanced chemical vapor deposition or atomic layer deposition process; or, comprising: A water-oxygen barrier material film is provided; The water-oxygen barrier material film is attached to the side surface of the adhesive layer away from the main body of the panel to be processed to form the water-oxygen barrier layer.

9. The display panel manufacturing method of claim 4, wherein, In the step of forming an adhesive layer on the cutting surface, comprising: A first adhesive solution with a viscosity greater than 1000 centipoise·second is applied on the cutting surface; The first adhesive solution is cured; A second adhesive solution with a viscosity less than 100 centipoise·second is applied on the cured first adhesive solution; The second adhesive solution is cured, and the cured first adhesive solution and the second adhesive solution form the adhesive layer.

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