Method and apparatus for detecting flux distribution

Abstract

A kind of detection method and detection equipment of flux distribution condition can be used to show the flux of electronic component surface.For the bump area of electronic component, according to the predetermined thickness of the applied flux, to select the first bump area imaging mode with low angle of light irradiation or the second bump area imaging mode with high angle of light irradiation.The first bump area imaging mode adopts the imaging angle of 80-100 degrees with the carrier plate of the electronic component to obtain the image.The second bump area imaging mode adopts the imaging angle of 60-70 degrees with the carrier plate of the electronic component to obtain the image.For the non-bump area of electronic component, high angle of light irradiation is used and the imaging angle of 80-100 degrees is used to obtain the image.In this way, the flux distribution of bump area and non-bump area can be correctly shown under different detection conditions.

Description

TECHNICAL FIELD

[0001] The present invention relates to a detection method and a detection apparatus, and more particularly, to a detection method and a detection apparatus for visualizing flux distribution in a process of manufacturing a semiconductor package structure. BACKGROUND

[0002] Flux is a commonly used auxiliary material to ensure the smooth progress of the soldering process, and is also commonly used in the process of assembling various electronic components to the substrate. The function of flux can remove the oxide on the surface of the solder and the base material to be welded, so that the metal surface can achieve a certain degree of cleanliness, which also makes the flux have the function of improving the welding quality, and further can affect the connection quality of the electrical connection between the electronic components and the substrate.

[0003] In the process of manufacturing a semiconductor, a semiconductor package structure with a chip has a plurality of bumps respectively coupled to the corresponding contact points of the chip. The area of these bumps needs to be coated with flux so that these bumps can be successfully soldered to the substrate in the subsequent soldering step to complete the bonding between the contact points. With the gradual improvement of the overall manufacturing process capability of the semiconductor, the requirement for packaging accuracy is also becoming more and more strict. When the flux is not coated correctly, it is easy to cause the yield of the manufacturing process to decrease or cause irreversible destructive damage to the chip. Therefore, the coating condition of the flux needs to be effectively detected. SUMMARY

[0004] One of the purposes of the present invention is to visualize the distribution of the flux.

[0005] Another purpose of the present invention is to improve the recognition degree of the flux distribution.

[0006] To achieve the above-mentioned object, the present application provides a method for detecting the distribution of flux on the surface of at least one electronic component in a detection area, the surface of the at least one electronic component being defined as having a bump area and a non-bump area, the method comprising: a bump area imaging step and a non-bump area imaging step. The bump area imaging step is performed by one of a first bump area imaging mode and a second bump area imaging mode. When the predetermined thickness of the applied flux is less than a thickness threshold, the first bump area imaging mode is used, the first bump area imaging mode uses a first type of illumination light having an incident angle of 45-75 degrees with respect to the carrier plate of the electronic component to illuminate the detection area, and a first image is obtained at an imaging angle of 80-100 degrees with respect to the carrier plate of the electronic component. When the predetermined thickness of the applied flux is greater than or equal to the thickness threshold, the second bump area imaging mode is used, the second bump area imaging mode uses a second type of illumination light having an incident angle of 80-90 degrees with respect to the carrier plate of the electronic component to illuminate the detection area, and a second image is obtained at an imaging angle of 60-70 degrees with respect to the carrier plate of the electronic component. The non-bump area imaging step uses the first type of illumination light to illuminate the detection area, and a third image is obtained at an imaging angle of 80-100 degrees with respect to the carrier plate of the electronic component. The first or second image is used to determine the flux distribution area of the bump area, and the third image is used to determine the flux distribution area of the non-bump area.

[0007] In an embodiment of the present application, the thickness threshold can be a value in the range of 1.8-10 (μm).

[0008] According to an embodiment of the present application, the first type of illumination light used in the first bump area imaging mode has a first brightness, and the first type of illumination light used in the non-bump area imaging step has a second brightness, the first brightness can be less than the second brightness.

[0009] According to an embodiment of the present application, the third image includes images of the bump area and the non-bump area, in the non-bump area located at the edge of the detection area, the second brightness can be set to make the pixel gray scale value of the area without flux applied in the image be in the range of 150-254, and the second brightness can also be set to make the pixel gray scale value of the bump area in the image be greater than 254.

[0010] According to an embodiment of the present application, the second type of illumination light in the second bump area imaging mode can be provided by a low-angle light source module arranged above the periphery of the detection area. The second type of illumination light can be a non-ring light. The non-ring light means that a light emitting unit adjacent to one side of the detection area does not provide illumination to the detection area, the side being relative to the imaging side of the second image.

[0011] According to an embodiment of the present application, a full-area imaging step can be further included, in which the detection area is irradiated with second-type irradiation light, and a fourth image is captured at an imaging angle of 80-100 degrees with respect to the carrier plate of the electronic component. The fourth image is used for determining whether there is a foreign object in the bump area and the non-bump area of the electronic component.

[0012] According to an embodiment of the present application, in the first-bump-area imaging mode and the first-type irradiation light in the non-bump-area imaging step can be provided by a surrounding high-angle light source module surrounding above the detection area. The second-type irradiation light in the full-area imaging step can be provided by a surrounding low-angle light source module surrounding above the detection area. The surrounding high-angle light source module is higher than the surrounding low-angle light source module, and the detection area only covers two electronic components side by side on a conveying path.

[0013] According to an embodiment of the present application, in the first-bump-area imaging mode, the first-type irradiation light can be provided by a parallel high-angle light source module above two opposite sides of the detection area. The second-type irradiation light in the full-area imaging step can be provided by a parallel low-angle light source module above two opposite sides of the detection area. The parallel high-angle light source module is higher than the parallel low-angle light source module, and the detection area covers at least three electronic components side by side on a conveying path.

[0014] According to an embodiment of the present application, when the first-bump-area imaging mode is used in the bump-area imaging step, an additional imaging step can be further included before the bump-area imaging step, the non-bump-area imaging step, and the full-area imaging step. The additional imaging step is to irradiate the detection area with the first-type irradiation light or the second-type irradiation light, and to capture a fifth image at an imaging angle of 80-100 degrees with respect to the carrier plate of the electronic component. The fifth image is used for determining whether the detection area covers the bump area and the non-bump area of at least one electronic component, and the detection area only covers part of the surface of the electronic component.

[0015] To achieve the above object, the present application also provides a solder flux distribution detection device for performing the above-mentioned detection method using the first bump area imaging mode. The detection device is arranged above a support table defining a space for placing at least one electronic component. The detection device is used to make the solder flux on the surface of the at least one electronic component in a detection area appear and obtain corresponding image data for subsequent determination of the solder flux distribution area. The surface of the at least one electronic component defines a bump area and a non-bump area. The support table defines the detection area. The detection device comprises a first imaging module, a high-angle light source module, and a low-angle light source module. The first imaging module can be arranged above the detection area. The first imaging module is configured to obtain images at an imaging angle of 80-100 degrees with the support table of the electronic component. The high-angle light source module is configured to provide a first type of irradiation light at an incident angle of 45-75 degrees with the support table of the electronic component to irradiate the detection area. The low-angle light source module is configured to provide a second type of irradiation light at an incident angle of 80-90 degrees with the support table of the electronic component to irradiate the detection area. For imaging the bump area, the low-angle light source module is turned off, and the high-angle light source module is configured to generate the first type of irradiation light with a first brightness. For imaging the non-bump area, the low-angle light source module is turned off, and the high-angle light source module is configured to generate the first type of irradiation light with a second brightness. The first brightness can be less than the second brightness. The second brightness makes the pixel gray scale value of the area without solder flux in the non-bump area at the edge of the detection area in the image obtained by the first imaging module be between 150-254, and the second brightness makes the pixel gray scale value of the bump area in the image obtained by the first imaging module be greater than 254.

[0016] According to an embodiment of the present application, the second type of irradiation light generated by the low-angle light source module can be used to make the foreign matter on the surface of the at least one electronic component in the detection area appear, and the high-angle light source module is configured to be turned off.

[0017] According to an embodiment of the present application, the high-angle light source module and the low-angle light source module can each be arranged in a manner surrounding above the detection area. The high-angle light source module is higher than the low-angle light source module. The detection area is configured to cover only two electronic components arranged in parallel in a group on a conveying path.

[0018] According to an embodiment of the present application, the high-angle light source module and the low-angle light source module can each be arranged in a manner that two light source devices above two opposite sides of the detection area are parallel to each other. The high-angle light source module is higher than the low-angle light source module. The detection area is configured to cover at least three electronic components arranged in parallel in a group on a conveying path. The parallel arrangement direction of the at least three electronic components is parallel to each light source device, and the conveying direction of the conveying path is perpendicular to each light source device.

[0019] According to an embodiment of the present application, the low-angle light source module and the high-angle light source module each include a plurality of light emitting units, and the half-power angle can adopt a light emitting unit less than 30 degrees.

[0020] To achieve the above-mentioned object, the present application also provides a flux distribution detection device for performing the detection method of taking images in the second bump area as described above. The detection device is arranged above a support table defined with a support table for placing at least one electronic component. The detection device is used to make the surface of at least one electronic component appear and obtain corresponding image data for subsequent determination of the flux distribution area. The surface of at least one electronic component is defined with a bump area and a non-bump area, and the support table is defined with a detection area. The detection device includes a first image taking module, a second image taking module, a high-angle light source module and a low-angle light source module. The first image taking module is arranged above the detection area, and the first image taking module is configured to take images at an angle of 80-100 degrees with the support table of the electronic component. The second image taking module is arranged above the first outer side area of the detection area, and the second image taking module is configured to take images at an angle of 60-70 degrees with the support table of the electronic component. The high-angle light source module is configured to provide a first type of irradiation light with an incident angle of 45-75 degrees to the support table of the electronic component to irradiate the electronic component. The low-angle light source module is configured to provide a second type of irradiation light with an incident angle of 80-90 degrees to the support table of the electronic component to irradiate the electronic component. Wherein, the operation of the low-angle light source module and the second image taking module is used to obtain a second image for determining the flux distribution area of the bump area, and the operation of the high-angle light source module and the first image taking module is used to obtain a third image for determining the flux distribution area of the non-bump area.

[0021] According to an embodiment of the present application, the low-angle light source module can include a first low-angle light source device, a second low-angle light source device, a third low-angle light source device and a fourth low-angle light source device adjacent to the first outer side area, the second outer side area, the third outer side area and the fourth outer side area of the detection area, respectively. The second type of irradiation light is formed by the irradiation light of the first low-angle light source device, the third low-angle light source device and the fourth low-angle light source device, and the first outer side area and the second outer side area are located on opposite sides of the detection area, and the third outer side area and the fourth outer side area are located on opposite sides of the detection area.

[0022] The low-angle light source module and the high-angle light source module each include a plurality of light emitting units, and the half-power angle can adopt a light emitting unit less than 30 degrees.

[0023] The above technical content is aimed at the bump area of the electronic component, and uses the predetermined thickness of the applied flux as the distinguishing criterion, uses the matching bump area imaging mode, and uses the same non-bump area imaging step to obtain the corresponding image data, and then determines the flux distribution of the bump area and the non-bump area. The above technical content can make the obtained image have the characteristics of low interference and high contrast, thereby providing correct sampling images for the subsequent determination of whether the flux distribution area is correct, even the determination of whether there is foreign matter attached or generated. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a schematic diagram of a detection method according to an embodiment of the present application;

[0025] Figure 2 is a schematic diagram of a detection environment configuration according to Figure 1 an embodiment under a first bump area imaging mode;

[0026] Figure 3 is a schematic diagram of a detection environment configuration according to Figure 1 an embodiment under a second bump area imaging mode;

[0027] Figure 4 is a schematic diagram of a detection environment configuration according to another embodiment of the present application under a first bump area imaging mode;

[0028] Figure 5 is a schematic diagram of a detection device configuration according to a first embodiment of the present application under a first bump area imaging mode;

[0029] Figure 6 is a schematic diagram of a detection device configuration according to a second embodiment of the present application under a first bump area imaging mode;

[0030] Figure 7 is a schematic diagram of a detection device configuration according to a first embodiment of the present application under a second bump area imaging mode. DETAILED DESCRIPTION

[0031] In order to fully understand the purposes, features and effects of the present application, the following specific embodiments are used in conjunction with the accompanying drawings to make a detailed description of the present application, as follows:

[0032] In this application, the terms "a" or "an" are used to describe units, components, structures, devices, modules, systems, parts or regions, etc. This is only for the convenience of description and provides a general meaning for the scope of the present application. Therefore, unless it is explicitly indicated otherwise, such description should be understood as including one or at least one, and the singular also includes the plural.

[0033] In the present application, the terms "comprising", "including", "containing", "have" or other any similar phrases means not only the listed elements but also other elements not explicitly listed but inherently inherent to the unit, component, structure, device, module, system, part or region.

[0034] In the present application, the terms "first" or "second" or similar ordinal terms are used to distinguish or refer to the same or similar elements, structures, parts or regions, and do not necessarily imply the spatial order of such elements, structures, parts or regions. It should be understood that in some cases or configurations, the ordinal terms can be used interchangeably without affecting the implementation of the present application.

[0035] Electronic components with semiconductor package structure can include chips and carrier boards carrying the chips, such as flip chips or other semiconductor structures using bumps to lead out the electrodes of semiconductor dies. The surface of the electronic components can be divided into a bump area where bumps are distributed and a non-bump area where no bumps are distributed, which is determined by the design of the semiconductor package structure. According to the design of the semiconductor package structure, the solder paste is applied to the bump area by the coating device (the bump area can be concentrated in a block or composed of multiple small blocks). Therefore, it is obviously impossible to accurately and comprehensively detect each of these electronic components by manual sampling visual inspection, resulting in various problems such as poor electrical connection, appearance defects, etc. when the solder paste application is incorrect.

[0036] Because the solder paste itself has the property of transmitting light and the surface curvature is easy to be inconsistent, plus the bumps under the solder paste in the bump area are also metal or contain metal material, and the flat surface of the carrier board under the solder paste, etc. make it difficult to correctly distinguish whether the reflected light is from the bumps, the carrier board or the solder paste under the general optical detection light and imaging conditions, causing difficulties in subsequent determination of the distribution of the solder paste.

[0037] In addition, according to the embodiment of the present application, the coating thickness of the flux can be configured according to the detection method. The electronic component to be detected has a predetermined specification of the flux coating thickness (not the actual thickness value), and the predetermined thickness of the flux mentioned in the embodiment of the present application includes but is not limited to the actual thickness of the flux on the electronic component, in addition to the predetermined thickness of the flux to be achieved under the predetermined coating condition. The predetermined specification of the flux coating thickness is matched with the corresponding detection method, which can effectively display the flux distribution in the bump area, thereby improving the recognition degree. Further, for the flux distribution in the non-bump area, another corresponding detection step is used, which also aims to effectively display the flux, thereby improving the recognition degree. Therefore, according to the embodiment of the present application, the subsequent determination of the flux distribution is easier and more correct, which has a significant effect.

[0038] Please refer to Figure 1 , which is a schematic diagram of the detection method according to an embodiment of the present application. The surface of the electronic component is imaged by matching the light and imaging conditions, so as to solve the problem that the flux distribution is difficult to be displayed. Figure 1 It is shown that the bump area imaging step S100 is performed first, and then the non-bump area imaging step S200 is performed, but this is only an example, and the order of the two steps can be changed and other steps can be added between the two steps.

[0039] In the bump area imaging step S100, the detection method is the first bump area imaging method or the second bump area imaging method. One of the two bump area imaging methods is the imaging step adopted in the embodiment of the present application for the bump area. The aforementioned predetermined thickness of the flux is regarded as a thickness threshold value, and the first bump area imaging method is used when the thickness is less than the thickness threshold value, and the second bump area imaging method is used when the thickness is greater than or equal to the thickness threshold value. In summary, the second bump area imaging method is used for the electronic component with thicker flux thickness, and the first bump area imaging method is used for the electronic component with thinner flux thickness.

[0040] The first image is obtained by the first bump area imaging method, and the second image is obtained by the second bump area imaging method. The first image or the second image is used for judging the flux distribution of the bump area. In the bump area imaging step S100, the flux distribution of the bump area is displayed. The first bump area imaging method uses the first type of illumination light L1 (bright field illumination) with a high angle and a detection environment with a high angle of imaging to obtain the image (the first image) of the flux distribution of the bump area. The second bump area imaging method uses the second type of illumination light L2 (dark field illumination) with a low angle and a detection environment with a low angle of imaging to obtain the image (the second image) of the flux distribution of the bump area. The configurations of the detection devices of the two methods will be described later.

[0041] In the non-bump area imaging step S200, the first type of illumination light L1 (bright field illumination) with a high angle and a detection environment with a high angle of imaging are used to obtain the image (the third image) of the flux distribution of the non-bump area, regardless of the first bump area imaging method or the second bump area imaging method.

[0042] In the bump area imaging step S100 and the non-bump area imaging step S200, the imaging range is not limited to only the bump area or only the non-bump area. For example, the imaging range in the bump area imaging step S100 can include the bump area and the non-bump area. However, for the analysis of the flux distribution, the first image or the second image obtained in the bump area imaging step S100 is suitable for judging the flux distribution in the bump area. In other words, the flux in the bump area can have a more significant display condition in the first image or the second image, and it is easy to judge the flux distribution in the bump area. On the other hand, the flux in the non-bump area can have a more significant display condition in the third image, and it is easy to judge the flux distribution in the non-bump area.

[0043] Next, please refer to Figure 1 and Figure 2 , Figure 2 according to Figure 1The first bump area imaging method is used to configure the detection environment. In the first bump area imaging method of the bump area imaging step S100, the first type of illumination light L1 having an incident angle of 45-75 degrees is used to illuminate the electronic component 200. The incident angle is defined with respect to the normal line of the substrate surface of the electronic component 200 or the normal line of the substrate center plane of the substrate. In addition, if the normal line is defined as positive on one side and negative on the other side, the first type of illumination light L1 having an incident angle of 45-75 degrees can include 45-75 degrees and -45-75 degrees with respect to the normal line.

[0044] Figure 2 The detection environment is shown. The detection area A for placing the electronic component 200 is defined on the carrier table 100. The high-angle light source module 411 for illuminating the detection area A and the first imaging module 311 for imaging the detection area A are arranged above the carrier table 100. One or more electronic components can be placed on the carrier table 100. The detection environment can also be a detection station in a production line. The carrier table 100 can be a continuous conveyor belt or a part of a conveyor belt.

[0045] Please refer to Figure 2 The high-angle light source module 411 provides illumination light to illuminate the electronic component 200. At this time, the illumination light provided by the high-angle light source module 411 has an incident angle θ1 of 40-75 degrees (for example, 40-60 degrees, 60-70 degrees, or 45-75 degrees) with respect to the electronic component 200 to form the first type of illumination light L1. The illumination light provided by the high-angle light source module 411 can have an incident angle of 45-75 degrees. For the case of thin solder paste coating, the incident angle can be further defined as 60-70 degrees. In the illumination light provided by the high-angle light source module 411, the incident angle θ1 of the illumination light incident to the electronic component 200 can be defined based on the angle relationship between the central beam or optical axis (such as Figure 2 The L1 arrow shown) of the light beam generated by the high-angle light source module 411 and the normal line of the substrate center plane of the substrate of the electronic component 200. In other embodiments, the incident angle θ1 of the illumination light incident to the electronic component 200 can be defined based on the angle relationship between all the light beams generated by the high-angle light source module 411 and the normal line of the substrate center plane of the substrate of the electronic component 200. In other embodiments, the incident angle θ1 of the illumination light incident to the electronic component 200 can be defined based on the range of the half-power angle (or beam angle) of the light-emitting unit in the high-angle light source module 411. That is, in this way, all the light beams in the half-power angle need to meet the specification that the incident angle θ1 is between 45-75 degrees.

[0046] like Figure 2 As shown, the first image-capturing module 311 is positioned above the detection area A and configured to acquire the first image C1 at an image-capturing angle between 80 and 100 degrees. The image-capturing angle of the first image-capturing module 311 refers to the angle between the optical axis of the first image-capturing module 311 (such as the optical axis of a camera lens) and the carrier plate of the electronic component 200 (different from the aforementioned angle of incidence). This angle is, for example, the angle between the center plane of the carrier plate of the electronic component 200 and the optical axis of the first image-capturing module 311. For electronic components coated with a thin layer of flux, the high-angle illumination and high-angle image capture allow for bright-field illumination of the electronic component 200, which helps to reveal the flux in the bump area. This allows the presence or absence of flux to be determined by the improved contrast.

[0047] Within the bump area, there are areas coated with flux. Thinner and thicker flux layers exhibit different sensitivities to illumination and imaging angles. Although areas within the bump area are coated with flux, the areas between bumps on the carrier board of electronic component 200 are filled with flux, resulting in a flatter surface and increased reflectivity (uncoated surfaces have low reflectivity, making it difficult for reflected light to enter the first imaging module 311). However, in this embodiment, for thinner flux layers, a detection environment with high-angle illumination and high-angle imaging allows for more effective visualization of the flux coating. The presence or absence of flux in the image presents a higher contrast, allowing direct determination of flux application based on areas with higher grayscale values ​​(i.e., brighter) within the bump area of ​​the image. Conversely, for thicker flux coatings, under the same high-angle illumination and imaging conditions, the uneven curvature of the thick flux surface can cause strong reflections, interfering with the inspection. This results in a lower grayscale difference between areas with and without flux coating, insufficient for effective display. Setting a dividing point based on flux thickness will more effectively reveal the flux coating.

[0048] Accordingly, the predetermined thickness of the flux is matched with the corresponding detection environment, which helps to improve the accuracy of the detection of the flux. In the embodiment, the predetermined thickness is regarded as a thickness threshold, which is preferably defined as one of 1.8-10 (μm), more preferably, for example, one of 2.1, 2.2, 2.3, 2.4 (μm), or for example, one of 5.7, 5.8, 5.9, 6.0, 6.1, 6.2 (μm), or for example, one of 8, 9, 10 (μm). When the predetermined thickness of the flux is less than the thickness threshold, the first bump area imaging mode is used to establish the detection environment in the bump area imaging step S100; and when the predetermined thickness of the flux is greater than or equal to the thickness threshold, the second bump area imaging mode is used to establish the detection environment in the bump area imaging step S100.

[0049] Therefore, in the detection environment of the first bump area imaging mode, the area coated with flux in the first image C1 has a significantly increased brightness, which can be clearly distinguished from the lower brightness of the area without flux, which helps to improve the recognition of the distribution of the flux in the bump area, and further helps the analysis and determination of the back end.

[0050] Please also refer to Figure 1 and Figure 2 The imaging conditions of the non-bump area imaging step S200 are also in the bright field illumination mode, which uses the first type of illumination light L1 provided by the high angle light source module 411, and uses the first imaging module 311 to take the third image C3 at an imaging angle of 80-100 degrees. In the non-bump area imaging step S200, the light incident angle of the illumination light is between 45-75 degrees. The light incident angle here, as described above, can be defined with respect to the normal of the carrier plate surface of the electronic component 200.

[0051] In a further embodiment, the brightness of the first type of illumination light L1 used in the first bump area imaging mode of the bump area imaging step S100 is set to a first brightness, and the brightness of the first type of illumination light L1 used in the non-bump area imaging step S200 is set to a second brightness. The first brightness is less than the second brightness.

[0052] For thinner flux coating layers, the gray scale contrast in the image can be further enhanced by fine-tuning the brightness of the light source. The first type of illumination light L1 at the second brightness must satisfy the following general condition: in the non-bump area of the third image C3, the pixel gray scale value of the area without flux coating should be close to 255, for example, between 245 and 254. In addition, the pixel gray scale value of the bump area of the third image C3 should be greater than 254. In combination with the condition that the first brightness is less than the second brightness, the distribution of the flux on the electronic component 200 with a predetermined coating thickness less than the thickness threshold can be more clearly revealed in this detection environment, thereby improving the recognition of the flux distribution.

[0053] The aforementioned general condition refers to the circuit board exposed in the non-bump area being a circuit board without patterned lines on the surface. However, when the circuit board exposed in the non-bump area is a circuit board with patterned lines on the surface, in the non-bump area of the third image C3, the pixel gray scale value of the area without flux coating should be close to 150 or more, for example, between 150 and 180, 170 and 200, 190 and 220, 210 and 240, or preferably between 170 and 180. The pixel gray scale value of the bump area of the third image C3 should also be greater than 254.

[0054] Next, please refer to Figure 3 which is a schematic diagram of the detection environment configuration under the second bump area imaging mode according to the Figure 1 embodiment. The imaging condition of the second bump area imaging mode is a dark field illumination mode. In step S100, the second type of illumination light L2 with an illumination angle of 80-90 degrees is incident on the electronic component 200. Here, the illumination angle is defined with respect to the normal of the surface of the carrier board of the electronic component 200 or the normal of the center plane of the board. In addition, if one side of the normal is defined as positive and the opposite side as negative, the second type of illumination light L2 with an illumination angle of 80-90 degrees can include 80-90 degrees and -80--90 degrees with respect to the normal.

[0055] Please refer to Figure 3The low-angle light source module 412 provides illumination light to light the surface of the electronic component 200. The incident angle θ2 of the illumination light provided by the low-angle light source module 412 on the carrier plate of the electronic component 200 is between 80 and 90 degrees, forming a second type of illumination light L2. More preferably, it is between 85 and 90 degrees, close to the so-called 0-degree incident light. The incident angle of the illumination light provided by the low-angle light source module 412 can be defined based on the center beam of the beam generated by the low-angle light source module 412 and the center plane of the carrier plate of the electronic component 200. In other embodiments, it can also be defined based on all beams in the beam generated by the low-angle light source module 412 and the center plane of the carrier plate of the electronic component 200, all beams must conform to the specification of an incident angle between 80 and 90 degrees. In other implementations, the beam angle can be defined based on the range of the half-power angle (or beam angle) of the light-emitting unit in the low-angle light source module 412. That is, in this way, all beams within the half-power angle must meet the specification that the incident angle is between 80 and 90 degrees.

[0056] like Figure 3 As shown, in the second convex area imaging mode of the convex area imaging step S100, and under the illumination of the second type of illumination light L2, the second imaging module 312 captures an image at an imaging angle between 60 and 70 degrees to obtain the second image C2. The imaging angle of the second imaging module 312 refers to the angle between the optical axis of the second imaging module 312 (such as the optical axis of a camera lens) and the carrier plate of the electronic component 200 (different from the aforementioned incident angle). This angle is, for example, the angle between the center plane of the carrier plate of the electronic component 200 and the optical axis of the second imaging module 312. For electronic components coated with a thicker layer of flux, the low-angle illumination light and the low-angle imaging angle can form a dark field illumination method for imaging the electronic component, which helps to reveal the flux in the convex area.

[0057] Under the detection environment of type II illumination light L2 and low-angle oblique imaging, in the bump area, the areas coated with flux appear darker in the image because the transparent flux has a different reflectivity than the bump and substrate surface, and the light path of type II illumination light L2 within the transparent flux is longer. On the other hand, in the bump area, the areas without flux coating appear brighter in the image because they retain the reflection of the metal (bump location) and even the reflection of the substrate surface (relatively flat). Therefore, the brightness of the image in the areas coated with flux is significantly reduced, which can be clearly distinguished from the higher brightness of the areas without flux coating, helping to improve the recognition of flux distribution and thus benefiting the subsequent analysis and judgment.

[0058] Further, the second type of illumination light L2 can not include the generated illumination light located at the opposite side of the second image capturing module 312. That is, as shown in FIG. 4, the opposite side of the low angle light source module 412 does not provide illumination light (no light source module can be provided or a light source module can be provided but not illuminated). This can also help to identify the flux distribution. Figure 3 As shown, the second image capturing module 312 is located above one side of the detection area A, which is the image capturing side. The opposite side of the detection area A does not provide illumination light, as shown in FIG. 3. Figure 3 As shown, the opposite side of the low angle light source module 412 does not provide illumination light (no light source module can be provided or a light source module can be provided but not illuminated). This can also help to identify the flux distribution.

[0059] In the second image C2, image data of non-bump areas can be included. However, the analysis and determination in the back end can be performed on image data of bump areas in the second image C2, and image data in the bump areas required for analysis can be determined in the second image C2 according to design information of the semiconductor package structure.

[0060] Please also refer to Figure 1 and Figure 3 The image capturing condition of the non-bump area image capturing step S200 is the bright field illumination method, as described above. The first type of illumination light L1 provided by the high angle light source module 411 and the first image capturing module 311 with an image capturing angle of 80-100 degrees are used to obtain the third image C3. In step S200, the illumination light has an incident angle of 45-75 degrees with respect to the normal of the carrier plate surface of the electronic component 200. The incident angle of the light can be defined with respect to the normal of the carrier plate surface of the electronic component 200, as described above.

[0061] In step S200, the first image capturing module 311 captures the third image C3 under the illumination of the first type of illumination light L1 with an image capturing angle of 80-100 degrees. Preferably, the third image C3 is captured (front shot) with an image capturing angle of 85-95 degrees. The image capturing angle of the first image capturing module 311 refers to the angle between the optical axis of the first image capturing module 311 (e.g., the optical axis of the lens of a camera) and the carrier plate of the electronic component 200. For example, the angle between the center plane of the carrier plate of the electronic component 200 and the optical axis of the first image capturing module 311. For non-bump areas without bumps, under the illumination of high angle light and high angle image capturing, the electronic component can be imaged in the bright field illumination method, which helps to reveal the flux in the non-bump areas.

[0062] Typically, flux is applied to the bump area and a certain distance beyond it. In the non-bump area, due to the absence of bump interference and the difference in reflectivity between the substrate surface and the flux surface, under the first type of illumination light L1 and high-angle imaging conditions, the relatively flat substrate may exhibit a darker grayscale brightness in areas with flux application. Conversely, areas in the non-bump area without flux application may appear brighter in the image. Therefore, the brightness of the image in areas with flux application is significantly reduced, clearly distinguishing it from the higher brightness of areas without flux application. This helps improve the recognition of flux distribution, and consequently, the third image C3 aids in the analysis and determination of the flux distribution area in the non-bump area.

[0063] exist Figure 1 and Figure 3 In the example, for a thicker flux coating layer, the combination of two special conditions further increases the degree of grayscale difference, enabling the flux distribution on electronic components to be effectively identified. This overcomes the disadvantage of the high reflectivity of the carrier board and bumps making it difficult to correctly identify the flux. Furthermore, based on the increased degree of difference, the flux detection action can also be automated.

[0064] In addition to the aforementioned steps S100 and S200, a full-area image acquisition step may also be included. Figure 1 (Not shown), the order of these three steps is not limited and can be performed individually in any order. In the full-area imaging step, under the illumination of the second type of illumination light L2, the first imaging module 311 captures an image at an imaging angle between 80 and 100 degrees to obtain the fourth image C4. The configuration of the first imaging module 311 is the same as the configuration described above, and will not be repeated here. The fourth image C4 is used to determine whether there are foreign objects in the protrusion area and non-protrusion area of ​​the electronic component 200.

[0065] Please refer to Figure 4 This is a schematic diagram of the detection environment configuration under the first convex area imaging method according to another embodiment of the present invention. Figure 4 The detection environment under the first convex area imaging method is used as an example. The detection environment under the second convex area imaging method (which already has the first imaging module 311 and the low-angle light source module 412) is also applicable.

[0066] In the detection environment of high angle image capturing (by the first image capturing module 311) and low angle light irradiation (by the low angle light source module 412 while the high angle light source module 411 is turned off), most of the light reflected from the surface of the electronic component will be reflected out of the high angle image capturing system. However, if the surface of the electronic component is contaminated with foreign matter or other foreign matter generating conditions, a protruding condition will be formed on the surface of the electronic component, and low angle light irradiation will be reflected back to the high angle image capturing system at the protruding position, so that the gray scale brightness at the protruding position can be higher than the gray scale brightness of the bump, the flux and the carrier plate, thereby detecting whether there is foreign matter (such as dust or other foreign matter).

[0067] Further, Figure 4 The low angle light source module 412 in the example of the present application can be used to generate annular light irradiated towards the detection area A, that is, the low angle light source module 412 is arranged above the detection area A around the detection area A. As shown in the view angle, low angle irradiation light (second type irradiation light L2) is provided at two opposite sides of the detection area A. In addition, due to Figure 4 the limitation of the view angle, the irradiation light at the other two opposite sides of the detection area A is not shown in Figure 4 , and the second type irradiation light L2 (here configured as annular light) surrounding the detection area A is formed by the light source above the periphery of the detection area A. Figure 4 Figure 7

[0068] Next, please refer to Figure 5 , which is a schematic diagram of the detection device according to the first embodiment of the present application in the first bump area image capturing mode. The detection device comprises a first image capturing module 311, a high angle light source module 411 and a low angle light source module 412.

[0069] The first image capturing module 311 is arranged above the detection area A, and the first image capturing module 311 is configured to capture images at an angle of 80-100 degrees with the carrier plate of the electronic component. The first image capturing module 311 is used to capture the first image C1 (see Figure 2 ) in the first bump area image capturing mode in the bump area image capturing step S100. At this time, the low angle light source module 412 is turned off, only the high angle light source module 411 is turned on, and the first type irradiation light L1 with the first brightness is generated. The first image capturing module 311 is used to capture the third image C3 (see Figure 2 ) in the non-bump area image capturing step S200. At this time, the low angle light source module 412 is also turned off, only the high angle light source module 411 is turned on, and the first type irradiation light L1 with the second brightness is generated.

[0070] ​​The high-angle light source module 411 is configured to provide a first type of illumination light L1 with an incident angle of 45-75 degrees on the carrier plate of the electronic component 200 to illuminate the detection area A. The low-angle light source module 412 is configured to provide a second type of illumination light L2 with an incident angle of 80-90 degrees on the carrier plate of the electronic component 200 to illuminate the detection area A.

[0071] When the first type of illumination light L1 is operated in the first convex area imaging mode within the convex area imaging step S100, a first brightness is used. When the first type of illumination light L1 is operated in the non-convex area imaging step S200, a second brightness is used. As mentioned above, the first brightness is less than the second brightness. The second brightness can be defined as allowing the uncoated flux area in the non-convex area located at the edge of the detection area A to present a pixel grayscale value between 150 and 254 in the third image C3 obtained by the first imaging module 311. Furthermore, the second brightness can allow the convex area to present a pixel grayscale value greater than 254 in the third image C3 obtained by the first imaging module 311. Specifically, when the circuit board exposed in the non-bump area is a circuit board without patterned lines on its surface, the second brightness must make the pixel grayscale value of the uncoated flux area close to 255, for example, between 245 and 254; on the other hand, when the circuit board exposed in the non-bump area is a circuit board with patterned lines on its surface, the second brightness must make the pixel grayscale value of the uncoated flux area close to or above 150, for example, between 150-180, 170-200, 190-220, 210-240, etc., preferably between 170-180.

[0072] like Figure 5 For example, to facilitate illustration, the area where image capture will occur in the detection area A below the first image acquisition module 311 is marked as area A' on the carrier stage 100, which serves as the transport channel. Figure 5 In the example, two electronic components 200 are arranged side-by-side on the conveyor (being detected together) and sequentially arranged backward on the conveyor. The label F indicates the conveying direction of the conveyor.

[0073] Furthermore, with the compact light source module configuration, the detection area A can cover only a portion of the electronic components 200 (although the flux distribution can still be detected using the detection method disclosed in this embodiment). The high-angle light source module 411 and the low-angle light source module 412 are each configured to surround the detection area A, forming a surrounding high-angle light source module and a surrounding low-angle light source module, respectively, and each provides annular illumination light to the detection area A. The high-angle light source module 411 is configured to be higher than the low-angle light source module 412.

[0074] Next, please refer to Figure 6Fig. 2 shows a schematic diagram of a detection apparatus according to the second embodiment of the present application in the first bump area imaging mode. The detection apparatus comprises a first imaging module 311, a high-angle light source module 411, and a low-angle light source module 412. Unlike the first embodiment, the high-angle light source module 411 and the low-angle light source module 412 are arranged on the opposite sides of the detection area A. Figure 5 Fig. 3 shows an example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of three or more electronic components 200. Figure 6 Fig. 4 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of five electronic components 200.

[0075] Fig. 5 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of three or more electronic components 200. Figure 6 In the example shown in Fig. 5, the high-angle light source module 411 and the low-angle light source module 412 are arranged on the opposite sides of the detection area A with two light source devices on each side.

[0076] Fig. 6 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of five electronic components 200. Figure 5 Fig. 7 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of three or more electronic components 200. 6 Fig. 8 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of five electronic components 200. Fig. 9 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of three or more electronic components 200.

[0077] Fig. 10 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of five electronic components 200. Figure 6 Fig. 11 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of three or more electronic components 200. Fig. 12 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of five electronic components 200.

[0078] Fig. 13 shows another example of the electronic components 200 on the conveying path. The electronic components 200 are arranged on the conveying path in a group of three or more electronic components 200. Figure 7A schematic diagram of a detection apparatus according to the first embodiment of the present application in the second bump area imaging mode is shown. The detection apparatus can be installed on a production line, and can be used to inspect electronic components one by one as they pass through the detection area A below. In addition, Figure 7 The first imaging module 311 shown includes two groups of cameras, which are used to cover the area of the electronic components passing through the production line (corresponding to the detection area A). This is merely an example, and is not intended to be limiting in any way.

[0079] Figure 7 The detection apparatus shown includes the first imaging module 311, the second imaging module 312, the low-angle light source module (including 412a-412d), the high-angle light source module 411, and the reflection module 313. The reflection module 313 can be used to direct light (e.g., reflected light) from the surface of the electronic components in the detection area A into the second imaging module 312, which can further reduce the installation space required by the detection apparatus. In other embodiments, the reflection module 313 can not be present, and the detection apparatus can be configured as shown in Figure 3 The second imaging module 312 is configured as shown. The reflection module 313 is, for example, a combination of a mirror and a fixed seat.

[0080] The low-angle light source module 412 is configured adjacent to the detection area A. Above the first outer side area P1 of the detection area A is the first low-angle light source device 412a, above the second outer side area P2 of the detection area A is the second low-angle light source device 412b, above the third outer side area P3 of the detection area A is the third low-angle light source device 412c, and above the fourth outer side area P4 of the detection area A is the fourth low-angle light source device 412d. Further, when the four low-angle light source devices (412a-412d) are all turned on, a ring-shaped light source group can be formed around the detection area A. The various outer sides of the detection area A refer to the associated areas adjacent to the detection area A in the extension plane of the detection area A. In other embodiments, the low-angle light source module 412 can be configured as shown in Figure 7 The adjacent areas (P1, P2, P3, P4) of the four sides of the detection area A shown are examples of rectangular detection areas.

[0081] The low-angle light source module (including 412a-412d) and the second imaging module 312 are used to obtain the second image C2. The second image C2 can be used to determine the flux distribution area of the bump area of the electronic component. The high-angle light source module 411 and the first imaging module 311 are used to obtain the third image C3. The third image C3 can be used to determine the flux distribution area of the non-bump area of the electronic component. The low-angle light source module (including 412a-412d) and the first imaging module 311 are used to obtain the fourth image C4, which can be used to determine whether there are foreign objects in the bump area and the non-bump area of the electronic component.

[0082] The illumination light used to form the aforementioned second image C2 is the second type of illumination light L2 (see also Figure 3 ), and the second type of illumination light L2 is preferably formed by the illumination light of the first low-angle light source device 412a, the third low-angle light source device 412c, and the fourth low-angle light source device 412d. Obviously, the second type of illumination light L2 is a non-ring-shaped light of low-angle illumination. The non-ring-shaped light means that the light-emitting units of the low-angle light source module (including 412a-412d) adjacent to one side of the detection area A are controlled not to provide illumination to the detection area A, and the one side refers to the imaging side of the second image C2 (i.e., at 412b).

[0083] The illumination light used to form the aforementioned third image C3 is the first type of illumination light L1 (see also Figure 3 ), and the first type of illumination light L1 is formed by the high-angle light source module 411. As shown in Figure 7 , the high-angle light source module 411 can also be composed of four groups of light source devices arranged above the detection area A. When all the four groups of light source devices of the high-angle light source module 411 are turned on, a ring-shaped light illuminating the detection area A can also be formed.

[0084] In the example shown in Figure 7 , the illumination light used to form the aforementioned fourth image C4 is the second type of illumination light L2 (see also Figure 4 ), and the second type of illumination light L2 is formed by the illumination light of the first low-angle light source device 412a, the second low-angle light source device 412b, the third low-angle light source device 412c, and the fourth low-angle light source device 412d. Obviously, the second type of illumination light L2 used to form the aforementioned fourth image C4 is a ring-shaped light of low-angle illumination.

[0085] In the above-mentioned various light source devices, a single or multiple light-emitting units (such as light-emitting diodes) can be included, and each light-emitting unit can adopt a light-emitting unit with a half-power angle less than 30 degrees, which can further improve the accuracy of the concentration and angle matching degree of the light.

[0086] In summary, by applying specific detection conditions (including illumination conditions and imaging conditions) to electronic components, the correct display of the distribution of flux in the bump area and the non-bump area can be achieved. The predetermined thickness of the coated flux is used to select the first bump area imaging mode with low-angle illumination light or the second bump area imaging mode with high-angle illumination light, so that the image data has low interference and high contrast characteristics, and further provides correct sampling images for subsequent determination of whether the flux distribution area is correct, or even whether there is foreign matter attached or generated.

[0087] The present application discloses preferred embodiments above, but those skilled in the art should understand that the embodiments herein are only used to describe the present application, and should not be interpreted as limiting the scope of the present application. It should be noted that all equivalent changes and substitutions with the embodiments should be understood as falling within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

[0088] Reference signs

[0089] 100 supporting table

[0090] 200 electronic element

[0091] 311 first image capturing module

[0092] 312 second image capturing module

[0093] 313 reflection module

[0094] 411 high-angle light source module

[0095] 412 low-angle light source module

[0096] 412a first low-angle light source device

[0097] 412b second low-angle light source device

[0098] 412c third low-angle light source device

[0099] 412d fourth low-angle light source device

[0100] θ1 incident angle of first type of illumination light

[0101] θ2 incident angle of second type of illumination light

[0102] A detection area

[0103] A' region (corresponding to the detection area A)

[0104] P1 first outer region

[0105] P2 second outer region

[0106] P3 third outer region

[0107] P4 fourth outer region

[0108] C1 first image

[0109] C2 second image

[0110] C3 third image

[0111] C4 fourth image

[0112] L1 first type of illumination light

[0113] L2 second type of illumination light

[0114] F conveying direction of the conveying path

[0115] S100-S200 steps

Claims

1. A method for detecting a flux distribution condition of a surface of at least one electronic component in a detection area, the surface of the at least one electronic component defining a bump area and a non-bump area, the method comprising: The bump area is imaged in one of a first bump area imaging mode and a second bump area imaging mode, wherein when a predetermined thickness of the applied flux is less than a thickness threshold, performing a first bump area imaging mode, the first bump area imaging mode using a first type of illumination light having an incident angle of 45-75 degrees with respect to a board of the electronic component to illuminate the detection area, and acquiring a first image at an imaging angle of 80-100 degrees with respect to the board of the electronic component, wherein when the predetermined thickness of the applied flux is greater than or equal to the thickness threshold, performing a second bump area imaging mode, the second bump area imaging mode using a second type of illumination light having an incident angle of 80-90 degrees with respect to the board of the electronic component to illuminate the detection area, and acquiring a second image at an imaging angle of 60-70 degrees with respect to the board of the electronic component; and a non-bump area imaging step, using the first type of illumination light to illuminate the detection area, and acquiring a third image at an imaging angle of 80-100 degrees with respect to the board of the electronic component, wherein the acquired first image or the acquired second image is used for determining a flux distribution area of the bump area, and the acquired third image is used for determining a flux distribution area of the non-bump area, the incident angle refers to an angle between an incident light and a normal line of a surface of the board of the electronic component or a normal line of a center plane of the board, and the imaging angle refers to an angle between an optical axis of an imaging module and the board of the electronic component.

2. The detection method of claim 1, wherein, The thickness threshold is a value in a range of 1.8-10 μm.

3. The detection method of claim 1, wherein, A brightness of the first type of illumination light used in the first bump area imaging mode is a first brightness, and a brightness of the first type of illumination light used in the non-bump area imaging step is a second brightness, the first brightness being less than the second brightness.

4. The detection method of claim 3, wherein, The third image includes images of the bump area and the non-bump area, in the non-bump area located at an edge of the detection area, the second brightness is set to make a pixel gray scale value of a region with the applied flux in the image to be in a range of 150-254, and the second brightness is set to make a pixel gray scale value of the bump area in the image to be greater than 254.

5. The detection method of claim 1, wherein, The second type of illumination light in the second bump area imaging mode is provided by a low-angle light source module surrounding above a periphery of the detection area, the second type of illumination light being non-ring light, the non-ring light referring to a light emitting unit adjacent to one side of the detection area not providing illumination to the detection area, the side being relative to an imaging side of the second image.

6. The detection method according to any one of claims 1 to 5, wherein The full-area imaging step further comprises illuminating the detection area with the second type of illumination light, and capturing a fourth image at an imaging angle of 80-100 degrees with respect to the carrier plate of the electronic component, wherein the fourth image is used for determining whether the bump area and the non-bump area of the electronic component exist or not.

7. The detection method of claim 6, wherein, The first type of illumination light in the first bump area imaging mode and the non-bump area imaging step is provided by a surrounding high-angle light source module surrounding above the detection area, and the second type of illumination light in the full-area imaging step is provided by a surrounding low-angle light source module surrounding above the detection area, wherein the surrounding high-angle light source module is higher than the surrounding low-angle light source module, and the detection area only covers two electronic components side by side on a conveying path.

8. The detection method of claim 6, wherein, The first type of illumination light in the first bump area imaging mode is provided by a parallel high-angle light source module above two opposite sides of the detection area, and the second type of illumination light in the full-area imaging step is provided by a parallel low-angle light source module above two opposite sides of the detection area, wherein the parallel high-angle light source module is higher than the parallel low-angle light source module, and the detection area covers at least three electronic components side by side on a conveying path.

9. The detection method of claim 6, wherein, In the condition that the first bump area imaging mode is used in the bump area imaging step, an additional imaging step is further included before the bump area imaging step, the non-bump area imaging step, and the full-area imaging step, wherein the additional imaging step comprises illuminating the detection area with the first type of illumination light or the second type of illumination light, and capturing a fifth image at an imaging angle of 80-100 degrees with respect to the carrier plate of the electronic component, wherein the fifth image is used for determining whether the detection area covers the bump area and the non-bump area of the at least one electronic component, and the detection area only covers part of the surface of the electronic component. 10.A solder distribution condition detection device for performing the detection method using the first bump area imaging mode according to any one of claims 1-4 and 6-9, wherein the detection device is arranged above a carrier table defined with a placement area for at least one electronic component, and is used for exposing the solder on the surface of the at least one electronic component in a detection area and capturing corresponding image data for subsequent determination of the solder distribution area, wherein the surface of the at least one electronic component is defined with a bump area and a non-bump area, the carrier table is defined with the detection area, and the detection device comprises: a first imaging module arranged above the detection area, wherein the first imaging module is configured to capture an image at an imaging angle of 80-100 degrees with respect to the carrier plate of the electronic component; a high-angle light source module configured to provide a first type of illumination light with an incident angle of 45-75 degrees with respect to the carrier plate of the electronic component to illuminate the detection area; and a low-angle light source module configured to provide a second type of illumination light with an incident angle of 0-45 degrees with respect to the carrier plate of the electronic component to illuminate the detection area. a low-angle light source module configured to provide a second type of irradiation light having an incident angle of 80-90 degrees with respect to a surface of a carrier plate of the electronic component to irradiate the detection area, wherein for taking an image of the bump area, the low-angle light source module is turned off, and the high-angle light source module is configured to generate the first type of irradiation light having a first brightness, wherein for taking an image of the non-bump area, the low-angle light source module is turned off, and the high-angle light source module is configured to generate the first type of irradiation light having a second brightness, wherein the first brightness is less than the second brightness, and the second brightness causes a pixel gray scale value of an area in the non-bump area located at an edge of the detection area, which is not coated with flux, to be between 150-254 in the image taken by the first image taking module, and the second brightness causes a pixel gray scale value of the bump area to be greater than 254 in the image taken by the first image taking module, wherein the incident angle refers to an angle between an incident light and a normal line of a surface of a carrier plate of the electronic component or a normal line of a center plane of a plate body of the carrier plate, and the image taking angle refers to an angle between an optical axis of the first image taking module and the carrier plate of the electronic component.

11. The detection device of claim 10, wherein, The second type of irradiation light generated by the low-angle light source module is used to make foreign matter on a surface of the at least one electronic component in the detection area appear, and the high-angle light source module is configured to be turned off.

12. The detection device of claim 10, wherein, The high-angle light source module and the low-angle light source module are each configured in a manner of surrounding above the detection area, the high-angle light source module is higher than the low-angle light source module, and the detection area is configured to cover only two electronic components arranged in parallel in a group on a conveying path.

13. The detection device of claim 10, wherein, The high-angle light source module and the low-angle light source module are each configured in a manner of having two light source devices parallel to each other above two opposite sides of the detection area, the high-angle light source module is higher than the low-angle light source module, and the detection area is configured to cover at least three electronic components arranged in parallel in a group on a conveying path, a parallel arrangement direction of the at least three electronic components is parallel to each of the light source devices, and a conveying direction of the conveying path is perpendicular to each of the light source devices.

14. The detection device of claim 10, wherein, The low-angle light source module and the high-angle light source module each include a plurality of light emitting units, and a half-power angle of each of the light emitting units is less than 30 degrees.

15. A flux distribution condition detection device for performing the detection method using the second bump area image taking mode according to claim 1 or 5, the detection device is configured to be arranged above a carrier table defined to have at least one electronic component placed thereon, the detection device is used to make flux on a surface of the at least one electronic component in a detection area appear and obtain corresponding image data for subsequent determination of a flux distribution area, the surface of the at least one electronic component is defined to have a bump area and a non-bump area, the carrier table is defined to have the detection area thereon, and the detection device comprises: a first image capturing module disposed above the detection area, the first image capturing module configured to capture an image at an image capturing angle of 80-100 degrees with respect to the board of the electronic component; a second image capturing module disposed above a first outer side area of the detection area, the second image capturing module configured to capture an image at an image capturing angle of 60-70 degrees with respect to the board of the electronic component; a high-angle light source module configured to provide a first type of illumination light at an incident angle of 45-75 degrees with respect to the board of the electronic component to illuminate the electronic component; and a low-angle light source module configured to provide a second type of illumination light at an incident angle of 80-90 degrees with respect to the board of the electronic component to illuminate the electronic component, wherein the low-angle light source module and the second image capturing module are operated to capture a second image for determining a flux distribution area of the bump area, and the high-angle light source module and the first image capturing module are operated to capture a third image for determining a flux distribution area of the non-bump area, wherein the incident angle refers to an angle between incident light and a normal line of a surface of the board of the electronic component or a normal line of a center plane of the board, and the image capturing angle refers to an angle between an optical axis of the first image capturing module and the second image capturing module and the board of the electronic component.

16. The detection device of claim 15, wherein, The low-angle light source module includes first, second, third and fourth low-angle light source devices adjacent to first, second, third and fourth outer side areas of the detection area, respectively, the second type of illumination light is formed by illumination light of the first, third and fourth low-angle light source devices, and the first and second outer side areas are located on opposite sides of the detection area, and the third and fourth outer side areas are located on opposite sides of the detection area.

17. The detection device of claim 15, wherein, The low-angle light source module and the high-angle light source module each include a plurality of light emitting units, and a half-power angle of each light emitting unit is less than 30 degrees.

Images