Haptic feedback system

Abstract

The present disclosure provides a haptic feedback system, including a movable part, a fixed assembly, a driving assembly, and a circuit assembly. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly to generate a feedback force. The circuit assembly is configured to be electrically connected to the driving assembly. The circuit assembly is electrically connected to an external circuit.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a haptic feedback system, and in particular to a haptic feedback system capable of effectively transmitting vibration. BACKGROUND

[0002] With the development of technology, many electronic devices (such as tablet computers or smart phones) nowadays have the function of vibration reminder. Through the vibration module arranged on the electronic device, the electronic device can issue vibration to prompt the user when it performs a specific function. For example, the electronic device can issue vibration to remind the user when it receives information or the user presses the button of the electronic device.

[0003] However, the vibration module of the present cannot meet all the needs of the user. Therefore, how to design a vibration module that can effectively transmit vibration to the button is a problem worth discussing and solving nowadays. SUMMARY

[0004] In view of the above, the present disclosure proposes a haptic feedback system to solve the above problems.

[0005] The present disclosure provides a haptic feedback system, which includes a movable part, a fixed assembly, a driving assembly, and a circuit assembly. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly to generate a feedback force. The circuit assembly is configured to be electrically connected to the driving assembly. The circuit assembly is electrically connected to an external circuit.

[0006] According to some embodiments of the disclosure, a circuit assembly includes a first contact configured to connect to an electronic component, a second contact configured to connect to an external circuit, a third contact configured to connect to the external circuit, a fourth contact configured to connect to the electronic component, and a fifth contact configured to connect to the external circuit. The electronic component is configured to output an input signal. The input signal is transmitted in sequence through the first contact and the second contact to the external circuit. The second contact extends along a first axis. The circuit assembly further includes a first circuit element electrically connected to the first contact and the second contact, a second circuit element electrically connected to the third contact, and a third circuit element electrically connected to the fourth contact and the fifth contact. The first circuit element has a plate-like structure. The thickness of the first circuit element is greater than 0.03 mm. The first circuit element includes a first section, a second section, and a third section. The extension direction of the first section is different from the extension direction of the second section. The extension direction of the second section is different from the extension direction of the third section. The extension direction of the third section is parallel to the extension direction of the first section. The first contact is located at the first section. The second contact is located at the third section. The third contact extends along the first axis. A driving assembly is electrically connected to the third contact. The driving assembly is electrically connected to the external circuit through the second circuit element and the third contact. The second contact and the third contact are arranged along a second axis. The second axis is perpendicular to the first axis. The first contact and the third contact are electrically independent. The fifth contact extends along the first axis. The extension direction of the fifth contact is opposite to the extension direction of the second contact. The electronic component is electrically connected to the fifth contact. The fifth contact and the third contact are electrically independent.

[0007] According to some embodiments of the disclosure, the haptic feedback system has a polygonal structure. The main axis is perpendicular to the first axis. The main axis is perpendicular to the second axis. When viewed along the main axis, the second contact is located at a first side edge of the haptic feedback system. When viewed along the main axis, the third contact is located at the first side edge. When viewed along the main axis, the fifth contact is located at a second side edge of the haptic feedback system. The first contact is exposed on a first surface of the fixing assembly. The fourth contact is exposed on the first surface. The first surface is perpendicular to the main axis. The fixing assembly further includes a top wall having a plate-like structure and being perpendicular to the main axis, a first side wall parallel to the main axis, a second side wall parallel to the main axis, and a base having a plate-like structure and being parallel to the top wall. The first surface is located at the top wall. The first section is disposed on the top wall. At least a portion of the first section is buried and a portion is exposed on the top wall. The second section is disposed on the first side wall. At least a portion of the second section is buried in the first side wall.

[0008] According to some embodiments of the present disclosure, the haptic feedback system further comprises a first conductive element configured to conduct the feedback force to the electronic element, and a second conductive element configured to conduct the feedback force to the electronic element. The first conductive element is configured to be fixedly connected to the electronic element. The first conductive element has a material different from that of the top wall. The first conductive element has a Young's modulus greater than that of the top wall. At least a portion of the first conductive element is embedded and not exposed on the top wall. The first conductive element has a metal material. The top wall has a non-metal material.

[0009] According to some embodiments of the present disclosure, the first conductive element has a plate structure. The first conductive element comprises a fourth segment and a fifth segment. The fourth segment overlaps at least a portion of the first segment when viewed along the direction of the vertical main axis. At least a portion of the fourth segment is embedded and not exposed on the top wall. The fourth segment has an extension direction parallel to that of the first segment. The fourth segment has an area greater than that of the first segment when viewed along the main axis. The first conductive element has a thickness same as that of the first circuit element. The first conductive element is electrically independent of the first circuit element. The fifth segment is located at the first side edge when viewed along the main axis. An outer side surface of the second segment and an outer side surface of the fifth segment face in the same direction and do not overlap with each other when viewed along the second axis. The second segment and the fifth segment do not overlap when viewed along the second axis.

[0010] According to some embodiments of the present disclosure, the haptic feedback system further comprises a first elastic element, wherein the movable portion is movably connected to the fixed component via the first elastic element, and a second elastic element, wherein the movable portion is movably connected to the fixed component via the second elastic element. The first elastic element comprises a first fixed end fixedly connected to the movable portion, a second fixed end fixedly connected to the first conductive element, and a first elastic portion having flexibility, via which the first fixed end is movable relative to the second fixed end. The second fixed end is movable relative to the fixed component. The second fixed end is located between the fifth segment and the first side wall. The first side wall has an opening structure configured to expose the second fixed end or the fifth segment. The haptic feedback system further comprises a first conductive point located between the first elastic element and the first conductive element, and a second conductive point located between the second elastic element and the second conductive element. The movable portion is located between the first conductive point and the second conductive point when viewed along the main axis. The line connecting the first conductive point and the second conductive point passes through the movable portion when viewed along the main axis.

[0011] According to some embodiments of the disclosure, the second circuit element includes a sixth section. The drive assembly is electrically connected to the third contact via the sixth section. The first section does not overlap the sixth section when viewed along the second axis. The movable portion is between the first section and the sixth section when viewed along the second axis. The first section overlaps a portion of the movable portion when viewed along the major axis. The sixth section overlaps a portion of the movable portion when viewed along the major axis.

[0012] According to some embodiments of the disclosure, the first conductive element includes a first conductive portion fixedly connected to the electronic element. The first conductive portion connects the fourth section to the fifth section. The first conductive portion extends in a direction different from the fourth section. The first conductive portion extends in a direction parallel to the major axis.

[0013] According to some embodiments of the disclosure, the electronic element is fixedly disposed on the fixed assembly. The electronic element is fixedly disposed on the first surface. The haptic feedback system further includes an adhesive element configured to secure the electronic element and the fixed assembly. The adhesive element surrounds the first contact when viewed along a direction perpendicular to the first surface. The adhesive element directly contacts the fixed assembly. The adhesive element directly contacts the first surface. The adhesive element directly contacts the electronic element. The adhesive element has a Young's modulus greater than 0.2 GPa.

[0014] According to some embodiments of the disclosure, the haptic feedback system is configured to be disposed in an electronic device. A device surface of the electronic device has a feedback portion corresponding to a portion of the electronic element. The electronic element includes a first outer surface and a second outer surface. The first outer surface and the second outer surface face in the same direction. At least a portion of the first outer surface is exposed by the feedback portion. The device surface overlaps at least a portion of the second outer surface when viewed along a direction perpendicular to the device surface. There is a gap between the first outer surface and the second outer surface in the direction perpendicular to the device surface. The haptic feedback system further includes a sealing element disposed in the gap. The sealing element directly contacts the electronic device. The device surface overlaps at least a portion of the sealing element when viewed along the direction perpendicular to the device surface. The electronic element further includes a third outer surface, and the third outer surface faces in the same direction as the first outer surface. The third outer surface is between the first outer surface and the second outer surface in a direction parallel to the device surface. The device surface overlaps the third outer surface when viewed along the direction perpendicular to the device surface. The second outer surface is between the first outer surface and the third outer surface when viewed along the direction perpendicular to the device surface.

[0015] The present disclosure provides a haptic feedback system, which includes a movable part, a fixed assembly, a driving assembly, and a circuit assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly to generate a feedback force. The circuit assembly can include a plurality of first circuit elements and a third circuit element, which are embedded in a housing of the fixed assembly. The ends (contacts) of the first circuit elements and the third circuit element can be exposed by a top wall of the housing, so that electronic components can be connected to the contacts (first and fourth contacts) by soldering, so that the electronic components can be fixed on the housing.

[0016] In addition, the haptic feedback system further has a first conductive element and a second conductive element made of metal, which are connected to the movable part by a first elastic element and a second elastic element, respectively. Therefore, when the movable part repeatedly moves along the first axis, the feedback force generated can be effectively conducted to the electronic components through the first conductive element and the second conductive element, providing a good touch feedback experience for the user. BRIEF DESCRIPTION OF DRAWINGS

[0017] The present disclosure can be clearly understood through the following detailed description in conjunction with the accompanying drawings. It is emphasized that various features are not drawn to scale and are only intended for illustrative purposes. In fact, the dimensions of various features can be arbitrarily enlarged or reduced in order to clearly illustrate.

[0018] Figure 1 A perspective view of a haptic feedback system 100 and an electronic component 200 according to an embodiment of the present disclosure.

[0019] Figure 2 An exploded view of the haptic feedback system 100 according to an embodiment of the present disclosure.

[0020] Figure 3 A bottom view of a partial structure of the haptic feedback system 100 according to an embodiment of the present disclosure.

[0021] Figure 4 A perspective view of the haptic feedback system 100 according to an embodiment of the present disclosure.

[0022] Figure 5 A top view of the haptic feedback system 100 according to an embodiment of the present disclosure.

[0023] Figure 6 A side view of the haptic feedback system 100 and the electronic component 200 according to an embodiment of the present disclosure.

[0024] Figure 7 A bottom view of the haptic feedback system 100 according to an embodiment of the present disclosure.

[0025] Figure 8A cross-sectional view of the haptic feedback system 100 and the electronic component 200 along the YZ plane according to another embodiment of the present disclosure.

[0026] Figure 9 A cross-sectional view of the haptic feedback system 100 and the electronic component 200 along the YZ plane according to another embodiment of the present disclosure.

[0027] Figure 10 A cross-sectional view of the haptic feedback system 100 and the electronic component 200 installed in the electronic device 50 according to an embodiment of the present disclosure.

[0028] Symbol explanation

[0029] 50: Electronic device

[0030] 50B: Main circuit board

[0031] 51: Housing

[0032] 52: Device surface

[0033] 53: Feedback portion

[0034] 60: Sealing element

[0035] 100: Haptic feedback system

[0036] 102: Outer shell

[0037] 102H: Opening structure

[0038] 102S1: First surface

[0039] 1023: Accommodation space

[0040] 106: First elastic element

[0041] 1061: First fixed end

[0042] 1062: Second fixed end

[0043] 1063: First elastic portion

[0044] 107: Second elastic element

[0045] 108: Movable portion

[0046] 112: Base

[0047] 1121: Electrical contact

[0048] 113: First circuit element

[0049] 114: Second circuit element

[0050] 115: Third circuit element

[0051] 121: First conductive element

[0052] 1211: First Conduction Section

[0053] 122: Second conductive element

[0054] 1221: Second Conduction Section

[0055] 200: Electronic components

[0056] 201: First outer surface

[0057] 202: Second outer surface

[0058] 203: Third outer surface

[0059] AD: Next component

[0060] AX: Spindle

[0061] AX1: First axis

[0062] AX2: Second axis

[0063] CA: Circuit Components

[0064] CL: Drive coil

[0065] CP1: First contact point

[0066] CP2: Second Socket

[0067] CP3: Third Node

[0068] CP4: Fourth Node

[0069] CP5: The Fifth Node

[0070] DA: Driver Component

[0071] FA: Fixed component

[0072] GP: gap

[0073] MA: Activity Component

[0074] MG: Magnet

[0075] SG1: First Section

[0076] SG2: Second section

[0077] SG21: Outer side

[0078] SG3: Third Section

[0079] SG4: Section 4

[0080] SG5: Fifth Section

[0081] SG51: Outer side

[0082] SG6: Sixth Section

[0083] SG7: Seventh Section

[0084] SS1: First side

[0085] SS2: Second side

[0086] SW1: First sidewall

[0087] SW2: Second sidewall

[0088] TP1: First conduction point

[0089] TP2: Second conduction point

[0090] TW: Top Wall

[0091] X: X-axis

[0092] Y: Y-axis

[0093] Z: Z-axis Detailed Implementation

[0094] The following discloses many different implementations or examples to implement different features of the provided object. Specific embodiments of elements and their arrangements are described below to illustrate this disclosure. Of course, these embodiments are merely illustrative and do not limit the scope of this disclosure. For example, the specification mentions that a first feature is formed on a second feature. This may include embodiments where the first and second feature are in direct contact, or embodiments where there are other features between the first and second feature; in other words, the first and second feature are not in direct contact.

[0095] Moreover, repeated use of the phrases "this" and "that" does not imply that a specific relationship exists between logically adjacent objects. Moreover, spatially relative terms, such as "vertical", "horizontal", "up", "down", "bottom", "top", and the like, merely describe one element's or feature's relationship to another element or feature as the spatially relative terms are interpreted in light of the priority document's

[0096] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an overly literal or overly formal sense unless expressly so defined herein.

[0097] Furthermore, the use of the terms "first", "second", and the like do not imply any particular order, but are used for naming purposes only. Moreover, the use of the terms "first", "second", etc., are used herein to modify two elements or claims, for example, a first element and a second element. In the use of this phrase, the first element is identified as being distinct from the second element, and the second element is distinct from the first element. However, it is to be understood that these terms "first" and "second" are used in the context of the claims only to identify two distinct elements or claims, and are not to be construed as indicating a particular order or sequence among the elements or claims.

[0098] In addition, the use of the terms "connected", "coupled", etc., are intended to mean a direct connection or coupling between two elements, unless otherwise noted. In addition, the use of the terms "connected", "coupled", etc., are also intended to mean that two elements are connected or coupled indirectly through one or more additional elements, unless otherwise noted.

[0099] Reference is made to Figures 1 to 3 , Reference is made to Figure 1 Reference is made to Figure 2 Reference is made to Figure 3The image shows a partial structural view of a haptic feedback system 100 according to an embodiment of the present disclosure. The haptic feedback system 100 may be a vibration module mounted on a main circuit board 50B of an electronic device 50, and an electronic component 200 is disposed on the haptic feedback system 100. The electronic component 200 may be, for example, a button, but is not limited thereto. In other embodiments, the electronic component 200 may also be a fingerprint reader, a screen, or a speaker, etc. When the electronic component 200 is touched by a user, the haptic feedback system 100 is configured to provide vibration feedback to the electronic component 200 to provide haptic feedback to the user.

[0100] In this embodiment, the haptic feedback system 100 may include a fixed component FA, a movable component MA, a driving component DA, and a circuit component CA. The movable component MA may include a movable part 108, and the movable part 108 is movable relative to the fixed component FA. The driving component DA is configured to drive the movable part 108 to move relative to the fixed component FA to generate a feedback force. The circuit component CA is configured to be electrically connected to the driving component DA, and the circuit component CA is electrically connected to an external circuit. The external circuit is, for example, a main circuit board 50B.

[0101] In this embodiment, as Figure 2 As shown, the fixing component FA includes a housing 102 and a base 112. The housing 102 is disposed on the base 112, and the housing 102 and the base 112 are arranged along a main axis AX. The housing 102 has a hollow structure and can form an accommodating space 1023 with the base 112. Figure 3 ), used to house the active component MA and the driving component DA.

[0102] like Figure 2 and Figure 3 As shown, the movable component MA may further include a first elastic element 106 and a second elastic element 107. The movable part 108 is movably connected to the fixed component FA via the first elastic element 106, and the movable part 108 is movably connected to the fixed component FA via the second elastic element 107. In this embodiment, the first elastic element 106 and the second elastic element 107 are respectively connected to opposite sides of the movable part 108, so that the movable part 108 can be suspended within the accommodating space 1023.

[0103] In this embodiment, the drive assembly DA may include a magnet MG and a drive coil CL. The magnet MG is configured to be fixedly mounted on the bottom of the movable part 108, and the drive coil CL is fixedly disposed on the base 112. The base 112 is provided with two electrical contacts 1121, configured to connect to two leads (not shown) of the drive coil CL, so that the drive coil CL is electrically connected to the circuit assembly CA.

[0104] The drive coil CL is, for example, a wire coil whose winding axis can be parallel to the main axis AX. When the drive coil CL is energized, an electromagnetic force can be generated with the magnet MG to drive the movable part 108 to repeatedly move back and forth along a first axis AX1 relative to the fixed assembly FA to generate the feedback force.

[0105] Next, please refer to Figures 1 to 5 , Figure 4 is a perspective view of a haptic feedback system 100 according to an embodiment of the present disclosure, and Figure 5 is a top view of the haptic feedback system 100 according to an embodiment of the present disclosure. In this embodiment, the circuit assembly CA can include a first contact CP1, a second contact CP2, a third contact CP3, a fourth contact CP4, and a fifth contact CP5.

[0106] The first contact CP1 is configured to be connected to the electronic element 200, the second contact CP2 is configured to be connected to an external circuit. Further, the third contact CP3 is configured to be connected to the external circuit, the fourth contact CP4 is configured to be connected to the electronic element 200, and the fifth contact CP5 is configured to be connected to the external circuit.

[0107] The electronic element 200 is configured to output an input signal, and the input signal is transmitted in sequence to the external circuit via the first contact CP1 and the second contact CP2. In addition, as shown, the second contact CP2, the third contact CP3, and the fifth contact CP5 respectively extend along the first axis AX1.

[0108] In addition, the circuit assembly CA can further include a plurality of circuit elements which can be connected to the housing 102 by insert molding. For example, the housing 102 can have a non-metallic material, such as being made of a plastic material, and the circuit elements can have a metallic material.

[0109] In this embodiment, the circuit assembly CA can further include three first circuit elements 113, and each first circuit element 113 is electrically connected to a corresponding first contact CP1 and second contact CP2. Specifically, the first contact CP1 and the second contact CP2 are part of the first circuit element 113.

[0110] In addition, the circuit assembly CA can also include three third circuit elements 115, and each third circuit element 115 is electrically connected to a corresponding fourth contact CP4 and fifth contact CP5. Specifically, the fourth contact CP4 and the fifth contact CP5 are part of the third circuit element 115. Furthermore, the circuit assembly CA can further include two second circuit elements 114 which are electrically connected to the third contact CP3. Specifically, the third contact CP3 is part of the second circuit element 114.

[0111] As Figure 4 With Figure 5 the first circuit element 113 has a plate-like structure, and the thickness of the first circuit element 113 is greater than 0.03 mm. The first circuit element 113 can include a first segment SG1, a second segment SG2, and a third segment SG3. The extending direction of the first segment SG1 is different from the extending direction of the second segment SG2, the extending direction of the second segment SG2 is different from the extending direction of the third segment SG3, and the extending direction of the third segment SG3 is parallel to the extending direction of the first segment SG1.

[0112] The first contact point CP1 is located at the first segment SG1, and the second contact point CP2 is located at the third segment SG3. In addition, the third contact point CP3 extends along the first axis AX1, and the driving assembly DA is electrically connected to the third contact point CP3. Specifically, the driving assembly DA is electrically connected to the external circuit via the electrical contact 1121, the second circuit element 114, and the third contact point CP3.

[0113] As Figure 4 shown, the second contact point CP2 and the third contact point CP3 are arranged along a second axis AX2, and the second axis AX2 is perpendicular to the first axis AX1. The first contact point CP1 is electrically independent of the third contact point CP3, and the second contact point CP2 is electrically independent of the third contact point CP3.

[0114] As Figure 5 shown, the fifth contact point CP5 extends along the first axis AX1, but the extending direction of the fifth contact point CP5 is opposite to that of the second contact point CP2. Specifically, the fifth contact point CP5 extends along the +Y-axis direction, while the second contact point CP2 extends along the -Y-axis direction. In this embodiment, the electronic element 200 is electrically connected to the fifth contact point CP5, the fifth contact point CP5 is electrically independent of the third contact point CP3, and the fourth contact point CP4 is also electrically independent of the third contact point CP3.

[0115] As Figure 5 shown, the haptic feedback system 100 has a polygonal structure when viewed along the principal axis AX. For example, the haptic feedback system 100 has a rectangular structure. In this case, the principal axis AX is perpendicular to the first axis AX1, and the principal axis AX is perpendicular to the second axis AX2.

[0116] The second contact point CP2 is located at a first side SS1 of the haptic feedback system 100 when viewed along the principal axis AX. The third contact point CP3 is located at the first side SS1 when viewed along the principal axis AX. The fifth contact point CP5 is located at a second side SS2 of the haptic feedback system 100 when viewed along the principal axis AX.

[0117] In addition, as Figure 4As shown, the first contact CP1 is exposed on a first surface 102S1 of the housing 102 of the fixing component FA, the fourth contact CP4 is exposed on the first surface 102S1, and the first surface 102S1 is perpendicular to the spindle AX.

[0118] like Figure 4 and Figure 5 As shown, the housing 102 of the fixing assembly FA includes a top wall TW, a first side wall SW1, and a second side wall SW2. The top wall TW has a plate-like structure and is perpendicular to the main axis AX. The first side wall SW1 is parallel to the main axis AX, and the second side wall SW2 is also parallel to the main axis AX. Additionally, the base 112 has a plate-like structure and is parallel to the top wall TW.

[0119] The first surface 102S1 is located on the top wall TW. A first segment SG1 is disposed on the top wall TW, and at least a portion of the first segment SG1 is embedded in the top wall TW and a portion is exposed on the top wall TW. A second segment SG2 is disposed on the first side wall SW1, and at least a portion of the second segment SG2 is embedded in the first side wall SW1.

[0120] In this embodiment, the haptic feedback system 100 may further include a first conductive element 121 and a second conductive element 122. The first conductive element 121 is configured to conduct the feedback force to the electronic element 200, and the second conductive element 122 is configured to conduct the feedback force to the electronic element 200.

[0121] The first conductive element 121 and the second conductive element 122 can be fixedly connected to the electronic component 200 in an indirect or direct manner. The material of the first conductive element 121 is different from the material of the top wall TW. For example, the first conductive element 121 is made of metal, while the top wall TW is made of non-metallic material, such as plastic.

[0122] In this embodiment, the Young's coefficient of the first conductive element 121 is greater than that of the top wall TW. Furthermore, at least a portion of the first conductive element 121 is embedded and not exposed in the top wall TW. Therefore, the first conductive element 121 and the second conductive element 122 can also be considered as part of the fixing assembly FA. It should be noted that the first conductive element 121 and the second conductive element 122 are symmetrically arranged.

[0123] Please refer to Figures 4 to 6 , Figure 6 This is a side view of a haptic feedback system 100 and electronic component 200 according to an embodiment of the present disclosure. The first conductive element 121 has a plate-like structure and may include a fourth segment SG4 and a fifth segment SG5. When viewed along a direction perpendicular to the main axis AX, as... Figure 6 As shown, the fourth segment SG4 overlaps at least a portion of the first segment SG1.

[0124] As shown in Figure 4 , at least a portion of the fourth segment SG4 is buried and not exposed on the top wall TW. The extending direction of the fourth segment SG4 is parallel to the extending direction of the first segment SG1. Specifically, both the fourth segment SG4 and the first segment SG1 extend along the first axis AX1. In addition, as shown in Figure 5 , the area of the fourth segment SG4 is larger than the area of the first segment SG1 when viewed along the main axis AX.

[0125] In this embodiment, the thickness of the first conductive element 121 and the thickness of the first circuit element 113 can be the same, and the first conductive element 121 and the first circuit element 113 are electrically independent. For example, the first conductive element 121 can be electrically grounded. In this embodiment, the fourth segment SG4 is connected to the fifth segment SG5, and the fourth segment SG4 and the fifth segment SG5 can be integrally formed. Furthermore, as shown in Figure 5 , the fifth segment SG5 is located on the first side edge SS1 when viewed along the main axis AX.

[0126] As shown in Figure 6 , the outer side surface SG21 of the second segment SG2 and the outer side surface SG51 of the fifth segment SG5 face the same direction and do not overlap each other when viewed along the second axis AX2. The extending direction of the second segment SG2 and the fifth segment SG5 is the same, and the second segment SG2 and the fifth segment SG5 do not overlap each other when viewed along the second axis AX2.

[0127] Please refer back to Figures 3 to 5 . As shown in Figure 3 , the first elastic element 106 includes a first fixed end 1061, a second fixed end 1062, and a first elastic portion 1063. The first fixed end 1061 is fixedly connected to the movable portion 108, the second fixed end 1062 is fixedly connected to the first conductive element 121, and the first elastic portion 1063 has flexibility. The first fixed end 1061 moves relative to the second fixed end 1062 via the first elastic portion 1063.

[0128] Furthermore, the second fixed end 1062 can move relative to the housing 102 of the fixed assembly FA, that is, the second fixed end 1062 is not fixed to the housing 102 but is fixed to the fifth segment SG5. The second fixed end 1062 is located between the fifth segment SG5 and the first side wall SW1. As shown in Figure 4 , the first side wall SW1 has an opening structure 102H configured to expose the second fixed end 1062 or the fifth segment SG5. Based on the design of the opening structure 102H, a laser beam can pass through the opening structure 102H to weld the fifth segment SG5 and the first conductive element 121.

[0129] It is noted that the first elastic element 106 and the second elastic element 107 are symmetrically arranged, and thus the structural configuration of the second elastic element 107 and the relationship between the second elastic element 107 and other elements are omitted here.

[0130] As shown in Figure 3 , the haptic feedback system 100 further comprises a first transmission point TP1 and a second transmission point TP2. The first transmission point TP1 is located between the first elastic element 106 and the first transmission element 121, and the second transmission point TP2 is located between the second elastic element 107 and the second transmission element 122. When viewed along the main axis AX, the movable part 108 is located between the first transmission point TP1 and the second transmission point TP2. When viewed along the main axis AX, the line connecting the first transmission point TP1 and the second transmission point TP2 passes through the movable part 108.

[0131] Please refer to Figure 6 and Figure 7 , Figure 7 is a bottom view of the haptic feedback system 100 according to an embodiment of the present disclosure. As shown in Figure 6 and Figure 7 , the second circuit element 114 comprises a sixth segment SG6 and a seventh segment SG7. The seventh segment SG7 is electrically connected to the electrical contact 1121, and the drive coil CL of the drive assembly DA is electrically connected to the third contact CP3 via the seventh segment SG7 and the sixth segment SG6.

[0132] As shown in Figure 6 , when viewed along the second axis AX2, the first segment SG1 and the sixth segment SG6 do not overlap. When viewed along the second axis AX2, the movable part 108 is located between the first segment SG1 and the sixth segment SG6. As shown in Figure 7 , when viewed along the main axis AX, the first segment SG1 overlaps a part of the movable part 108. When viewed along the main axis AX, the sixth segment SG6 overlaps a part of the movable part 108.

[0133] Please refer to Figure 8 , Figure 8 is a cross-sectional view along the YZ plane of the haptic feedback system 100 and the electronic element 200 according to another embodiment of the present disclosure. In this embodiment, the first transmission element 121 can further comprise a first transmission part 1211 fixedly connected to the electronic element 200. The first transmission part 1211 is connected to the fifth segment SG5 via the fourth segment SG4, and then connected to the first elastic element 106 and the movable part 108.

[0134] The extending direction of the first conductive portion 1211 is different from the extending direction of the fourth segment portion SG4, and the extending direction of the first conductive portion 1211 is parallel to the main axis AX. Specifically, the first conductive portion 1211 is protruded by the fourth segment portion SG4 extending along the main axis AX, and a part of the first conductive portion 1211 is exposed by the housing 102 to be fixedly connected to the electronic element 200.

[0135] Similarly, the second conductive element 122 also has a second conductive portion 1221 configured to be fixedly connected to the electronic element 200. Based on the design of the first conductive portion 1211 and the second conductive portion 1221, the feedback force generated by the movable portion 108 can be effectively transmitted to the electronic element 200.

[0136] Please refer to Figure 9 and Figure 5 , Figure 9 is a cross-sectional view of a haptic feedback system 100 and an electronic element 200 along the YZ plane according to an embodiment of the present disclosure. As Figure 9 shown, the electronic element 200 is fixedly arranged on the housing 102 of the fixed assembly FA. Specifically, the electronic element 200 is fixedly arranged on the first surface 102S1. Furthermore, the haptic feedback system 100 can further include an adhesive element AD configured to be fixed to the electronic element 200 and the housing 102 of the fixed assembly FA.

[0137] As Figure 5 shown, when viewed in a direction perpendicular to the first surface 102S1, for example, viewed along the main axis AX, the adhesive element AD is around the first contact point CP1 and the fourth contact point CP4. Specifically, the adhesive element AD directly contacts the housing 102 of the fixed assembly FA, and the adhesive element AD directly contacts the first surface 102S1. The adhesive element AD directly contacts the electronic element 200, and the Young's modulus of the adhesive element AD is greater than 0.2 GPa. Therefore, the adhesive element AD can effectively transmit the feedback force to the electronic element 200.

[0138] Please refer to Figure 10 , Figure 10 is a cross-sectional view of a haptic feedback system 100 and an electronic element 200 mounted on an electronic device 50 according to an embodiment of the present disclosure. The haptic feedback system 100 is configured to be arranged on the electronic device 50. Specifically, as Figure 10 shown, the haptic feedback system 100 and the electronic element 200 are mounted on the electronic device 50 along the direction of the arrow.

[0139] The electronic device 50 has a housing 51, and the housing 51 has a device surface 52. The device surface 52 can define a feedback portion 53, which corresponds to a portion of the electronic element 200. In particular, the feedback portion 53 is the portion that is touched by a user's finger. Further, the electronic element 200 includes a first outer surface 201 and a second outer surface 202. The first outer surface 201 and the second outer surface 202 face in the same direction (upward), and at least a portion of the first outer surface 201 is exposed by the feedback portion 53.

[0140] When viewed in a direction perpendicular to the device surface 52, such as along the Z-axis, the device surface 52 overlaps at least a portion of the second outer surface 202. In the direction perpendicular to the device surface 52 (Z-axis), there is a gap GP between the first outer surface 201 and the second outer surface 202, which is, for example, a groove. Further, the haptic feedback system 100 also includes a sealing element 60 disposed in the gap GP. The sealing element 60 is, for example, a sealing ring or sealing glue, but is not limited thereto.

[0141] In this embodiment, the sealing element 60 directly contacts the electronic device 50. For example, when viewed in a direction perpendicular to the device surface 52, the device surface 52 overlaps at least a portion of the sealing element 60. In addition, the electronic element 200 also includes a third outer surface 203, and the third outer surface 203 faces in the same direction as the first outer surface 201.

[0142] In a direction parallel to the device surface 52, such as in the Y-axis direction, the third outer surface 203 is located between the first outer surface 201 and the second outer surface 202. When viewed in a direction perpendicular to the device surface 52, the device surface 52 overlaps the third outer surface 203. Further, when viewed in a direction perpendicular to the device surface 52, the second outer surface 202 is located between the first outer surface 201 and the third outer surface 203.

[0143] Based on the above configuration of the sealing element 60 and the electronic element 200, the functions of waterproofing and dustproofing can be effectively achieved, and the haptic feedback system 100 and the electronic element 200 can be protected from damage.

[0144] The present disclosure provides a haptic feedback system, which includes a movable portion, a stationary assembly, a driving assembly, and a circuit assembly. The driving assembly is configured to drive the movable portion to move relative to the stationary assembly to generate a feedback force. The circuit assembly can include a plurality of first circuit elements and a third circuit element, which are embedded in a housing of the stationary assembly. The ends (contacts) of the first circuit elements and the third circuit element can be exposed by a top wall of the housing, so that an electronic element can be connected to the contacts (first and fourth contacts) by soldering, so that the electronic element can be fixed to the housing.

[0145] In addition, the haptic feedback system further comprises a first conductive element and a second conductive element made of metal, which are connected to the movable part through the first elastic element and the second elastic element respectively. Therefore, when the movable part repeatedly moves along the first axis, the feedback force generated can be effectively conducted to the electronic element through the first conductive element and the second conductive element, providing a good touch feedback experience for the user.

[0146] Although the embodiments of the disclosure and their advantages have been disclosed as above, it should be understood that any person skilled in the art can make changes, replacements and modifications without departing from the concept and scope of the disclosure. In addition, the protection scope of the disclosure is not limited to the processes, machines, manufacture, material composition, devices, methods and steps in the specific embodiments described in the specification, and any person skilled in the art can understand the current or future developed processes, machines, manufacture, material composition, devices, methods and steps from the disclosure disclosed herein, as long as they can substantially achieve the same function or obtain substantially the same results as the embodiments described herein. Therefore, the protection scope of the disclosure includes the above-mentioned processes, machines, manufacture, material composition, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the disclosure also includes the combination of each claim and embodiment.

Claims

1. A haptic feedback system, comprising: One Activities Department; A fixed component, the movable part being able to move relative to the fixed component; A drive component configured to drive the movable part to move relative to the fixed component to generate a feedback force; as well as A circuit component configured to be electrically connected to the drive component; This circuit component is electrically connected to an external circuit. This circuit component includes: A first contact, configured for connection to an electronic component; A second contact is configured to connect to the external circuit; A third contact is configured to connect to the external circuit; A fourth contact, configured to connect to the electronic component; and A fifth contact is configured to connect to the external circuit; The electronic component is configured to output an input signal; The input signal is transmitted to the external circuit sequentially via the first contact and the second contact; The second contact extends along a first axis.

2. The haptic feedback system as described in claim 1, wherein... The circuit assembly also includes: A first circuit element is electrically connected to the first contact and the second contact; A second circuit element is electrically connected to the third contact; as well as A third circuit element is electrically connected to the fourth and fifth contacts; The first circuit element has a plate-like structure; The thickness of the first circuit element is greater than 0.03 mm; The first circuit element includes a first segment, a second segment, and a third segment; The direction of extension of the first segment is different from the direction of extension of the second segment; The extension direction of the second segment is different from the extension direction of the third segment; The extension direction of the third segment is parallel to the extension direction of the first segment; The first contact point is located in the first segment; The second contact point is located in the third segment; The third contact extends along the first axis; The drive component is electrically connected to the third contact; The drive component is electrically connected to the external circuit via the second circuit element and the third contact; The second contact and the third contact are arranged along a second axis; The second axis is perpendicular to the first axis; The first contact is electrically independent of the third contact; The fifth contact extends along the first axis; The extension direction of the fifth contact is opposite to the extension direction of the second contact. The electronic component is electrically connected to the fifth contact; The fifth contact is electrically independent of the third contact.

3. The haptic feedback system of claim 2, wherein the haptic feedback system has a polygonal structure when viewed along a principal axis; The main axis is perpendicular to the first axis; The main axis is perpendicular to the second axis; When viewed along the main axis, the second contact point is located on a first side of the tactile feedback system; When viewed along the main axis, the third joint is located on the first side; When viewed along the main axis, the fifth contact point is located on a second side of the tactile feedback system; The first contact point is exposed on a first surface of the fixing component; The fourth contact point is exposed on the first surface; The first surface is perpendicular to the principal axis; The fixing component also includes: A top wall, having a plate-like structure and perpendicular to the main axis; A first sidewall, parallel to the main axis; A second sidewall, parallel to the main axis; and A base having a plate-like structure and parallel to the top wall; The first surface is located on the top wall; The first section is located on the top wall; At least a portion of the first section is buried and a portion is exposed on the top wall; The second section is disposed on the first side wall; At least a portion of the second section is buried in the first sidewall.

4. The haptic feedback system as described in claim 3, wherein the haptic feedback system further comprises: A first conductive element, configured to conduct the feedback force to the electronic component; and A second conductive element is configured to conduct the feedback force to the electronic component; The first conductive element is configured to be fixedly connected to the electronic component; The material of the first conductive element is different from the material of the top wall; The Young's coefficient of the first conductive element is greater than that of the top wall; At least a portion of the first conductive element is embedded and not exposed in the top wall; The first conductive element is made of metal; The top wall is made of non-metallic material.

5. The haptic feedback system as described in claim 4, wherein... The first conductive element has a plate-like structure; The first conductive element includes a fourth segment and a fifth segment; When viewed along a direction perpendicular to the main axis, the fourth segment overlaps at least a portion of the first segment; At least a portion of the fourth section is buried and not exposed on the top wall; The extension direction of the fourth segment is parallel to the extension direction of the first segment; When viewed along the main axis, the area of ​​the fourth segment is larger than the area of ​​the first segment; The thickness of the first conductive element is the same as the thickness of the first circuit element; The first conductive element is electrically independent of the first circuit element; When viewed along the main axis, the fifth segment is located on the first side; When viewed along the second axis, the outer side of the second segment and the outer side of the fifth segment face the same direction and do not overlap. When viewed along the second axis, the second segment does not overlap with the fifth segment.

6. The haptic feedback system of claim 5, wherein the haptic feedback system further comprises: A first elastic element, wherein the movable portion is movably connected to the fixed assembly via the first elastic element; and A second elastic element, wherein the movable part is movably connected to the fixed component via the second elastic element; The first elastic element comprises: A first fixed end is fixedly connected to the movable part; A second fixed end, fixedly connected to the first conductive element; and A first elastic portion is flexible, and the first fixed end can move relative to the second fixed end via the first elastic portion; The second fixed end can move relative to the fixed component; The second fixed end is located between the fifth section and the first sidewall; The first sidewall has an opening structure configured to expose the second fixed end or the fifth segment; The haptic feedback system also includes: A first conductive point is located between the first elastic element and the first conductive element; and A second conductive point is located between the second elastic element and the second conductive element; When viewed along the main axis, the moving part is located between the first transmission point and the second transmission point; When viewed along the main axis, the line connecting the first transmission point and the second transmission point passes through the moving part.

7. The haptic feedback system as described in claim 6, wherein... The second circuit element includes a sixth segment; The drive component is electrically connected to the third contact via the sixth segment; When viewed along the second axis, the first segment does not overlap with the sixth segment; When viewed along the second axis, the movable part is located between the first segment and the sixth segment; When viewed along the main axis, the first segment overlaps with a portion of the moving part; When viewed along the main axis, the sixth segment overlaps with a portion of the active segment.

8. The haptic feedback system as claimed in claim 7, wherein The first conductive element includes a first conductive portion, which is fixedly connected to the electronic element; The first conductive section is connected to the fifth section via the fourth section; The extension direction of the first conductive part is different from the extension direction of the fourth segment; The extension direction of the first conductive part is parallel to the main axis.

9. The haptic feedback system as claimed in claim 8, wherein... The electronic component is fixedly mounted on the fixed assembly; The electronic component is fixedly disposed on the first surface; The haptic feedback system also includes a bonding element configured to secure the electronic component and the mounting assembly; When viewed along a direction perpendicular to the first surface, the connecting element surrounds the first contact point; The connecting element directly contacts the fixing assembly; The connecting element directly contacts the first surface; The connecting element is in direct contact with the electronic component; The Young's modulus of the connecting element is greater than 0.2 GPa.

10. The haptic feedback system of claim 9, wherein... The haptic feedback system is configured to be installed in an electronic device; The electronic device has a feedback section on its surface, corresponding to a portion of the electronic component; The electronic component includes a first outer surface and a second outer surface; The first outer surface and the second outer surface face the same direction; At least a portion of the first outer surface is exposed by the feedback section; When viewed along a direction perpendicular to the surface of the device, the surface of the device overlaps with at least a portion of the second outer surface; In a direction perpendicular to the surface of the device, there is a gap between the first outer surface and the second outer surface; The haptic feedback system also includes a sealing element disposed in the gap; The sealing element is in direct contact with the electronic device; When viewed along a direction perpendicular to the surface of the device, the surface of the device overlaps with at least a portion of the sealing element; The electronic component also includes a third outer surface, and the third outer surface faces the same direction as the first outer surface; In a direction parallel to the surface of the device, the third outer surface is located between the first outer surface and the second outer surface; When viewed along a direction perpendicular to the surface of the device, the surface of the device overlaps with the third outer surface; When viewed along a direction perpendicular to the surface of the device, the second outer surface is located between the first outer surface and the third outer surface.

Images