Display panel and display device

Abstract

This application provides a display panel and display device, relating to the field of display technology, to solve the technical problem of black spots easily appearing in the display area of ​​a display panel. The non-display area of ​​the display panel in this application includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and an encapsulation layer stacked sequentially. The first conductive layer includes a data line group; the second conductive layer includes a power line, the power line having a deformation region and a connection portion for connecting to an external circuit. The deformation region is the overlapping area of ​​the orthographic projection of the power line on the substrate and the orthographic projection of the data line group on the substrate. The orthographic projection of the side of the connection portion located within the deformation region on the substrate is at least partially a straight line. This display panel can improve the flatness of the encapsulation layer on the power line within the deformation region, prevent cracks in the encapsulation layer, and avoid black spots in the display area.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] In the field of display technology, organic light-emitting diode (OLED) display panels are widely used in display devices such as mobile phones, tablets, and computers due to their advantages such as self-illumination, low power consumption, high contrast, and fast response speed. However, black spots are prone to appear in the display area of ​​these panels, affecting their display performance. Summary of the Invention

[0003] In view of the above problems, this application provides a display panel and a display device to solve the technical problem that black spots easily appear in the display area of ​​the display panel in the related art.

[0004] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0005] A first aspect of this application provides a display panel having a display area and a non-display area surrounding the display area; the non-display area includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and an encapsulation layer stacked sequentially; the first conductive layer includes a data line group; the second conductive layer includes a power line, the power line having a deformation region and a connection portion for connecting to an external circuit, the deformation region being the overlapping area of ​​the orthographic projection of the power line on the substrate and the orthographic projection of the data line group on the substrate, and the orthographic projection of the side of the connection portion located within the deformation region on the substrate being at least partially a straight line.

[0006] In the display panel of this application embodiment, the data lines are located on a first conductive layer, and the power lines are located on a second conductive layer on top of the first conductive layer. The power lines have a deformation region located above the data line group. By setting at least a portion of the orthogonal projection of the power line connection portion located within the deformation region onto the substrate as a straight line, the groove on the connection portion within the deformation region is removed. This reduces the lateral area of ​​the connection portion within the deformation region, thereby reducing the area of ​​the connection portion within the deformation region exposed to the etching solution in subsequent etching processes. This further reduces the lateral etching depth of the connection portion within the deformation region, thereby improving the flatness of the encapsulation layer formed on the power lines within the deformation region, preventing cracks in the encapsulation layer, and thus avoiding black spots in the display area.

[0007] In one possible implementation, the orthographic projection of the side of the connecting portion located within the deformation zone onto the substrate is a straight line.

[0008] With this configuration, the orthographic projection of the side of the connector located above the data cable group onto the substrate is entirely a straight line, thereby eliminating all the grooves on the side of the connector located in the deformation zone and further reducing the lateral area of ​​the connector located in the deformation zone.

[0009] In one possible implementation, the data line group includes multiple data lines that are parallel to each other and spaced apart, and the straight lines are perpendicular to the extension direction of the data lines.

[0010] This design minimizes the area of ​​the side of the connection within the deformation zone, thereby reducing the area of ​​the power lines within the deformation zone exposed to the etching solution during subsequent etching processes.

[0011] In one possible implementation, the connecting portion has a plurality of grooves on its side outside the deformation zone, and the plurality of grooves are arranged along the extending direction of the side of the connecting portion.

[0012] With this design, the connector does not have multiple grooves on the side above the data cable to increase the path complexity on the side of the connector. This can block impurities such as moisture or oxygen, preventing them from entering the display area along the side of the connector and affecting the display effect of the display panel.

[0013] In one possible implementation, the non-display area further includes a first barrier and a second barrier located between the encapsulation layer and the second conductive layer; the first barrier surrounds the display area; the second barrier surrounds the first barrier, and the first barrier and the second barrier form a blocking area; the portion of the orthographic projection of the side of the connection located in the deformation area onto the substrate within the blocking area is a straight line.

[0014] This configuration sets the side of the connector above the data line, located between the first and second barrier walls, as a straight line to reduce the lateral etching of the power line, improve the flatness of the encapsulation layer, and prevent cracks from forming in the encapsulation layer.

[0015] In one possible implementation, the orthographic projection of the side of the connector onto the substrate is a straight line.

[0016] This design also reduces the difficulty of manufacturing the connecting parts and improves the production efficiency of the display panel.

[0017] In one possible implementation, the straight line is perpendicular to the direction of extension of the data line.

[0018] This design minimizes the area of ​​the side of the shaped connection, thereby reducing the area of ​​the power line exposed to the etching solution in subsequent etching processes.

[0019] In one possible implementation, the first conductive layer includes a first metal layer, a third insulating layer, and a second metal layer sequentially disposed along a direction away from the substrate, and the data line group includes a plurality of data lines disposed parallel to each other and spaced apart, a portion of the data lines in the data group being composed of the first metal layer, and another portion of the data lines in the data group being composed of the second metal layer.

[0020] With this configuration, multiple data lines within multiple data line groups are located within the first metal layer and the second metal layer, respectively, to increase the distance between the data lines; the third insulating layer insulates the data lines in the first metal layer and the data lines in the second metal layer to prevent short circuits between multiple data lines from affecting the function of the display panel.

[0021] In one possible implementation, the second conductive layer includes a third metal layer and a fourth metal layer. The third metal layer is located on the side of the first insulating layer opposite to the first conductive layer and is provided with a first sub-power line. The fourth metal layer is located on the side of the third metal layer opposite to the first insulating layer and is provided with a second sub-power line. The second sub-power line is electrically connected to the first sub-power line to form the power line.

[0022] This configuration increases the line width of the power cord and reduces its resistance, thereby reducing power loss on the power cord and ultimately lowering the energy consumption of the display panel.

[0023] In one possible implementation, the non-display area further includes an inorganic layer located between the third metal layer and the fourth metal layer, the inorganic layer covering the first sub-power line.

[0024] In one possible implementation, the inorganic layer covers the side of the first sub-power line.

[0025] This configuration prevents the etching solution from etching the edges of the first sub-power line, further reducing the lateral etching amount of the power line.

[0026] A second aspect of this application provides a display device including the display panel described in any of the preceding claims.

[0027] The display device of this application embodiment includes the display panel described in any of the above claims, and therefore has the advantages of including the display panel described in any of the above claims. This application embodiment will not elaborate further on these advantages. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a partial top view of the structure of a display panel in related technologies;

[0030] Figure 2 for Figure 1 Enlarged view of point D in the middle;

[0031] Figure 3 for Figure 2 A cross-sectional view of the display panel along the EE direction.

[0032] Figure 4 This refers to a focused ion beam image of a display panel in related technologies.

[0033] Figure 5 This is a structural diagram for making a power cord;

[0034] Figure 6 for Figure 5 Enlarged structural diagram at point G;

[0035] Figure 7 This is a partial cross-sectional view of another display panel in the related technology;

[0036] Figure 8 This is a cross-sectional structural diagram of a display panel in related technologies;

[0037] Figure 9 This is a partial top view of the display panel according to an embodiment of this application;

[0038] Figure 10 for Figure 9 Enlarged structural diagram at point H;

[0039] Figure 11 for Figure 10 Schematic diagram of the cross-sectional structure along the JJ direction;

[0040] Figure 12 This is a partial top view of the display panel according to another embodiment of this application;

[0041] Figure 13 This is a partial top view of the display panel according to another embodiment of this application;

[0042] Figure 14This is a partial top view of the display panel according to another embodiment of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 10. Substrate;

[0045] 110. Second insulating layer;

[0046] 211 - Data cable;

[0047] 230 - Third insulation layer;

[0048] 30. First insulating layer;

[0049] 411. Power cord;

[0050] 412. Connecting part;

[0051] 413. Groove;

[0052] 414. Straight line;

[0053] 415. First power supply line;

[0054] 416. Second power supply line;

[0055] 430. Inorganic layer;

[0056] 50. Encapsulation layer;

[0057] 510. First inorganic encapsulation layer;

[0058] 520. Second inorganic encapsulation layer;

[0059] 61. The first retaining wall;

[0060] 62. Second retaining wall;

[0061] A. Display area;

[0062] B. Non-display area;

[0063] C. Binding area;

[0064] I. Deformation region. Detailed Implementation

[0065] In related technologies, refer to Figure 1 , Figure 2 and Figure 3The display panel includes a display area A and a non-display area B located around the display area. The non-display area B includes a bonding area C for mounting external circuitry. The non-display area B includes a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, stacked sequentially. The first conductive layer includes two data line groups symmetrically arranged along the center line of the display panel. Each data line group includes multiple parallel and spaced data lines 211, one end of which extends into the bonding area C to connect with external circuitry within the bonding area C. The second conductive layer contains multiple spaced power lines 411. Each power line 411 includes a connecting portion 412 facing the bonding area C. The side of the connecting portion 412 has multiple grooves 413 penetrating the power line 411, arranged along the extending direction of the side of the connecting portion 412. Multiple grooves 413 can increase the path complexity on the side of the connecting part 412 to block impurities such as moisture and oxygen, and prevent impurities from entering the display area A along the side of the connecting part 412 and affecting the display function of the display panel.

[0066] As described in the background section, black spots are prone to appear on the display area of ​​display panels in related technologies. Through long-term research, the inventors have discovered that the main cause is that the encapsulation layer above the data cable 211 is prone to cracking at the position corresponding to the groove 413. During subsequent processes such as module bonding, when pressure is applied to the encapsulation layer, this crack can extend into the display area. Moisture or oxygen can then enter the light-emitting device in the display area through this crack, damaging the light-emitting device and resulting in black spots on the display area of ​​the display panel. (Reference) Figure 4 The image is obtained by focusing ion beam detection of a display panel in related technologies. Figure 4 As can be seen, the encapsulation layer 50 has cracks in region F.

[0067] Specifically, refer to Figure 5 and Figure 6 Multiple data lines 211 in each data line group are arranged parallel to each other and spaced apart on the substrate 10. A first insulating layer 30 covers the multiple data lines 211. Due to the limited thickness of the first insulating layer 30, continuous first protrusions are formed on the data lines 211. When fabricating the power line 411, a second conductive layer is first formed on the first insulating layer 30, covering the first insulating layer 30. The portion of the second conductive layer located on the continuous first protrusions forms continuous second protrusions, causing deformation of the originally flat second conductive layer. Then, the second conductive layer is etched to form the power line 411. (Reference) Figure 6 When etching the second conductive layer, a groove 413 on the side of the connection portion 412 will be formed on the second protrusion. (See also...) Figure 7Compared to a groove formed on a flat second conductive layer, the area of ​​the groove wall of the groove 413 formed on the second protrusion will be increased, thereby increasing the area of ​​the groove wall of the groove 413 on the power line 411.

[0068] refer to Figure 8 After the power line 411 is fabricated, for example, when fabricating the first barrier 61 and the second barrier 62 in the non-display area, an organic insulating layer is first formed on the second conductive layer, and then the organic insulating layer is etched to obtain the first barrier 61 and the second barrier 62. The etching solution used to etch the organic insulating layer will cause lateral corrosion to the power line 411. Due to the increased area of ​​the groove wall of the groove 413, the contact area between the groove 413 and the etching solution increases, thereby increasing the lateral etching amount of the groove wall of the groove 413. Subsequently, when fabricating the encapsulation layer 50, the encapsulation layer 50 covers the power line 411. Due to the large lateral etching amount of the groove 413, the encapsulation layer 50 will break and crack at the position corresponding to the groove 413.

[0069] To address the aforementioned technical problems, this application provides a display panel in which the power line has a deformation zone located above the data line group. The orthographic projection of the portion of the power line connection located within the deformation zone onto the substrate is at least partially set as a straight line to remove the groove on the connection within the deformation zone. This reduces the lateral area of ​​the connection within the deformation zone, thereby reducing the area of ​​the connection within the deformation zone exposed to the etching solution in subsequent etching processes. This further reduces the lateral etching depth of the connection within the deformation zone, thereby improving the flatness of the encapsulation layer formed on the power line within the deformation zone, preventing cracks in the encapsulation layer, and thus avoiding black spots in the display area.

[0070] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0071] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of the invention. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0072] refer to Figure 9 , Figure 10 and Figure 11The display panel of this application embodiment (shown only partially) has a display area A and a non-display area B located around the display area A. Display area A is used to implement the display function of the display panel. Exemplarily, display area A includes light-emitting devices arranged in a matrix, and a driving array corresponding to and used to control the light-emitting devices. Non-display area B includes a bonding area C for setting external circuitry of the display panel, such as driving circuitry. Non-display area B is used to set circuit connection lines to connect the light-emitting devices and driving array in display area A to the external circuitry.

[0073] refer to Figure 11 The non-display area B includes a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, which are sequentially stacked. The substrate 10 provides support for the other film layers located thereon. Exemplarily, the substrate 10 can be a rigid substrate, such as glass. The substrate 10 can also be a flexible substrate, such as polyimide (PI), which gives the display panel bendable properties to enable the bending or folding function of the display device.

[0074] For example, refer to Figure 11 A second insulating layer 110 may also be disposed on the substrate 10. The second insulating layer 110 can serve as a gate insulating layer (GI layer) to insulate the gates of the thin-film transistors in the driving array within the display area A. The second insulating layer 110 can be silicon oxide, silicon nitride, or other organic or inorganic materials with insulating functions.

[0075] Within the non-display area B, a first conductive layer may be located on the substrate 10. The first conductive layer includes data line groups. Exemplarily, there may be multiple data line groups, which are symmetrically arranged with respect to the center line S of the display panel. Each data line group includes multiple data lines 211 that are parallel to each other and spaced apart. The end of each data line 211 away from the display area is used to connect to an external circuit in the bonding area C.

[0076] The first conductive layer may include a single metal layer or multiple metal layers. For example, refer to... Figure 11The first conductive layer includes a first metal layer, a third insulating layer 230, and a second metal layer sequentially disposed along a direction away from the substrate 10. A portion of the data lines in the data line group are formed by the first metal layer, for example, by a patterning process. Another portion of the data lines in the data line group are formed by the second metal layer, for example, by a patterning process. That is, multiple data lines 211 in multiple data line groups can be located in the first metal layer and the second metal layer respectively to increase the distance between the data lines 211. In addition, the third insulating layer 230 insulates the data lines 211 in the first metal layer and the data lines 211 in the second metal layer to prevent short circuits between multiple data lines 211 from affecting the function of the display panel.

[0077] For example, the first metal layer and the second metal layer may be formed as a single material layer or a composite material layer of at least one material selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and copper (Cu) or other suitable alloys.

[0078] A first insulating layer 30 and a second conductive layer are sequentially disposed on the side of the first conductive layer facing away from the substrate 10. The first insulating layer 30 insulates the first conductive layer and the second conductive layer to prevent short circuits in the circuits of the first conductive layer and the second conductive layer.

[0079] refer to Figure 10 and Figure 11 The second conductive layer is formed on the side of the first insulating layer 30 facing away from the first conductive layer. The second conductive layer includes a power line 411, which has a deformation region I and a connection portion 412 for connection with an external circuit. The deformation region I is the overlapping area of ​​the orthographic projection of the power line 411 on the substrate 10 and the orthographic projection of the data line group on the substrate 10. The orthographic projection of the side of the connection portion 412 within the deformation region I on the substrate is at least partially a straight line 414.

[0080] Since the orthographic projection of the side of the connection portion 412 of the power line 411 on the substrate 10 within the deformation region I is at least partially a straight line 414, the groove on the connection portion 412 within the deformation region I can be removed, and the lateral area of ​​the connection portion 412 within the deformation region I can be reduced. This reduces the area of ​​the connection portion 412 within the deformation region I exposed to the etching solution in subsequent etching processes, thereby reducing the lateral etching depth of the connection portion 412 within the deformation region I. This improves the flatness of the encapsulation layer 50 formed on the power line 411 within the deformation region I, prevents cracks in the encapsulation layer 50, and avoids black spots in the display area A.

[0081] It should be noted that the orthographic projection of the side of the connecting portion 412 within the deformation zone I onto the substrate is at least partially a straight line 414, meaning that the orthographic projection of this side onto the substrate 10 can be partially a straight line 414 or entirely a straight line 414.

[0082] In some implementations of the embodiments of this application, reference is made to Figure 9 The orthographic projection of the side of the connector 412 within the deformation zone I onto the substrate 10 is a straight line 414. That is, the orthographic projection of the side of the portion of the connector 412 above the data line group onto the substrate 10 is all a straight line 414. This eliminates all the grooves on the side of the connector 412 within the deformation zone I, further reducing the lateral area of ​​the connector within the deformation zone I. This reduces the area of ​​the connector 412 exposed to the etching solution in the subsequent etching process, thereby reducing the lateral etching depth of the power lines within the deformation zone I. This improves the flatness of the encapsulation layer 50 formed on the power lines 411 within the deformation zone I, prevents cracks in the encapsulation layer 50, and thus avoids black spots in the display area A.

[0083] For example, refer to Figure 9 The connecting portion 412, located outside the deformation zone I, may have multiple grooves 413 on its side. These grooves 413 are arranged along the extending direction of the side of the connecting portion 412. The side of the connecting portion 412 not located above the data cable 211 retains multiple grooves 413 to increase the path complexity of the side of the connecting portion 412. This helps to block impurities such as moisture or oxygen, preventing them from entering the display area A along the side of the connecting portion 412 and affecting the display effect of the display panel.

[0084] Power line 411 may include a high-voltage power line (VDD) and a low-voltage power line (VSS). One end of the high-voltage power line is used to connect to the driving array and light-emitting devices within display area A, and the other end is used to connect to external circuitry to provide a high-level signal to the driving array and light-emitting devices. One end of the low-voltage power line is used to connect to the light-emitting devices within display area A, and the other end is used to connect to external circuitry to provide a low-level signal to the light-emitting devices.

[0085] In the display panel of this application embodiment, the orthographic projection of the side of the power line connection portion located within the deformation zone onto the substrate can be set as a straight line; such as... Figure 9 As shown, the orthographic projection of the side of all power line connection portions located within the deformation zone onto the substrate can also be set as a straight line, but this application embodiment does not limit this.

[0086] The second conductive layer may include a single metal layer or multiple metal layers. For example, refer to... Figure 11The second conductive layer includes a third metal layer and a fourth metal layer. The third metal layer is located on the side of the first insulating layer 30 facing away from the first conductive layer, and a first sub-power line 415 is disposed on the third metal layer. The fourth metal layer is located on the side of the third metal layer facing away from the first insulating layer 30, and a second sub-power line 416 is disposed on the fourth metal layer. The second sub-power line 416 is electrically connected to the first sub-power line 415 to form a power line 411. This arrangement increases the linewidth of the power line 411 and reduces its resistance, thereby reducing the power loss on the power line 411 and thus reducing the energy consumption of the display panel.

[0087] refer to Figure 11 The non-display area B may also include an inorganic layer 430, which is located between the third metal layer and the fourth metal layer and covers the first sub-power line 415. The inorganic layer 430 can cover the side of the first sub-power line 415 to prevent the etching solution from etching the side of the first sub-power line 415, thereby further reducing the lateral etching amount of the power line 411.

[0088] For example, the third metal layer and the fourth metal layer can be single metal layers or composite metal layers. For instance, both the third metal layer and the fourth metal layer can be titanium / aluminum / titanium (Ti / Al / Ti) structures.

[0089] refer to Figure 11 An encapsulation layer 50 is formed on the side of the second conductive layer opposite to the first insulating layer 30. The encapsulation layer 50 is used to encapsulate the light-emitting device in the display area A to prevent impurities such as moisture or oxygen from entering the light-emitting device and affecting the display function of the display panel. For example, in the non-display area B, the encapsulation layer 50 may include a first inorganic encapsulation layer 510 and a second inorganic encapsulation layer 520 sequentially formed on the second conductive layer.

[0090] The non-display area B may further include a first barrier 61 and a second barrier 62 located between the encapsulation layer 50 and the second conductive layer. The first barrier 61 surrounds the display area A, and the second barrier 62 surrounds the first barrier 61. The second barrier 62 and the first barrier 61 form a blocking area. Exemplarily, the first barrier 61 and the second barrier 62 can be formed simultaneously when fabricating the planarization layer, pixel definition layer, and spacer layer in the display area A, thereby saving process steps and improving the production efficiency of the display panel.

[0091] Another embodiment of this application provides a display panel, see reference. Figure 12The display panel has a display area A and a non-display area B located around the display area A. The non-display area B includes a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, which are stacked sequentially. The first conductive layer includes a data line group. The second conductive layer includes a power line 411, which has a deformation area I overlapping with the data line group. The power line 411 also has a connection portion 412 for connecting to an external circuit. The orthographic projection of the side of the connection portion 412 within the deformation area I onto the substrate is at least partially a straight line 414.

[0092] The difference between this embodiment and the previous embodiment is that the straight line 414 is perpendicular to the extension direction of the data line 211. Because the straight line 414 is perpendicular to the extension direction of the data line 211, the area of ​​the side of the connection portion 412 within the deformation zone I is minimized. This reduces the area of ​​the power line 411 within the deformation zone I exposed to the etching solution in subsequent etching processes, thereby reducing the side etching depth of the power line 411 within the deformation zone I. This improves the flatness of the encapsulation layer 50 formed on the power line 411 within the deformation zone I, prevents cracks in the encapsulation layer 50, and thus avoids black spots in the display area A.

[0093] The remaining structure of the display panel in this embodiment can be referred to the above embodiments, and will not be repeated here.

[0094] refer to Figure 13 Another embodiment of this application provides a display panel having a display area A and a non-display area B located around the display area A. The non-display area B includes a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50 stacked sequentially. The first conductive layer includes a data line group. The second conductive layer includes a power line 411, which has a deformation area I overlapping with the data line group. The power line 411 also has a connection portion 412 for connecting to an external circuit. The orthographic projection of the side of the connection portion 412 within the deformation area I onto the substrate is at least partially a straight line 414.

[0095] The difference from the above embodiment is that the orthographic projection of the side of the connecting portion 412 located in the deformation region I onto the substrate within the blocking region is a straight line. Since the encapsulation layer 50 is located on the second conductive layer and covers the first barrier 61 and the second barrier 62, the flatness of the encapsulation layer 50 located between the first barrier 61 and the second barrier 62 is further reduced, making the encapsulation layer 50 between the first barrier 61 and the second barrier 62 more prone to cracking. In the display panel of this application embodiment, the side of the connecting portion 412 located above the area between the first barrier 61 and the second barrier 62 and above the data line 211 is set as a straight line to reduce the lateral etching amount of the power line 411, improve the flatness of the encapsulation layer 50, and prevent cracking of the encapsulation layer 50.

[0096] The remaining structure of the display panel in this embodiment can be referred to the above embodiments, and will not be repeated here.

[0097] refer to Figure 14 Another embodiment of this application provides a display panel, which includes a display area A and a non-display area B located around the display area A. The non-display area B includes a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50 stacked sequentially. The first conductive layer includes a data line group. The second conductive layer includes a power line 411, which has a deformation area I overlapping with the data line group. The power line 411 also has a connection portion 412 for connecting to an external circuit. The orthographic projection of the side of the connection portion 412 within the deformation area I onto the substrate is at least partially a straight line 414.

[0098] The difference from the above embodiment is that the orthographic projection of the side of the connecting portion 412 onto the substrate 10 is a straight line 414. That is, the orthographic projection of the side of the connecting portion 412 onto the substrate 10 is always a straight line 414. This configuration reduces the area of ​​the side of the connecting portion 412 within the deformation zone I, thereby reducing the area of ​​the power line 411 within the deformation zone I exposed to the etching solution in subsequent etching processes. This, in turn, reduces the side etching depth of the power line 411 within the deformation zone I, thereby improving the flatness of the encapsulation layer 50 formed on the power line 411 within the deformation zone I, preventing cracks in the encapsulation layer 50, and thus avoiding black spots in the display area A. Simultaneously, it also reduces the manufacturing difficulty of the connecting portion 412 and improves the production efficiency of the display panel.

[0099] For example, the straight line 414 can also be perpendicular to the extension direction of the data line 211. Since the straight line 414 is perpendicular to the extension direction of the data line 211, the side area of ​​the connection portion 412 in the deformation area I is minimized, thereby reducing the area of ​​the power line 411 in the deformation area I exposed to the etching solution in the subsequent etching process, and thus reducing the side etching depth of the power line 411 in the deformation area I. This improves the flatness of the encapsulation layer 50 formed on the power line 411 in the deformation area I, prevents cracks in the encapsulation layer 50, and thus avoids black spots in the display area A.

[0100] The remaining structure of the display panel in this embodiment can be referred to the above embodiments, and will not be repeated here.

[0101] This application also provides a display device, including the display panel of any of the above embodiments.

[0102] The display device of this application embodiment includes the display panel of any of the above embodiments, and therefore the display device has the advantages of the display panel of any of the above embodiments, which will not be repeated in this application embodiment.

[0103] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0104] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area located around the display area; the non-display area includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer and an encapsulation layer stacked sequentially; the first conductive layer includes a data line group; the second conductive layer includes a power line, the power line having a deformation area and a connection portion for connecting to an external circuit, the deformation area being the overlapping area of ​​the orthographic projection of the power line on the substrate and the orthographic projection of the data line group on the substrate, and the orthographic projection of the side of the connection portion located within the deformation area on the substrate being a straight line.

2. The display panel according to claim 1, characterized in that, The orthographic projection of the side of the connecting portion located within the deformation zone onto the substrate is a straight line.

3. The display panel according to claim 2, characterized in that, The data line group includes multiple data lines that are parallel to each other and spaced apart, and the straight line is perpendicular to the extension direction of the data line.

4. The display panel according to claim 2, characterized in that, The connecting part has multiple grooves on its side outside the deformation zone, and the multiple grooves are arranged along the extending direction of the side of the connecting part.

5. The display panel according to claim 1, characterized in that, The non-display area further includes a first barrier and a second barrier located between the encapsulation layer and the second conductive layer; the first barrier surrounds the display area; the second barrier surrounds the first barrier, and the second barrier and the first barrier form a blocking area; The orthographic projection of the side of the connecting portion located in the deformation zone onto the substrate within the blocking zone is a straight line.

6. The display panel according to claim 1, characterized in that, The side of the connector is projected onto the substrate as a straight line.

7. The display panel according to claim 6, characterized in that, The straight line is perpendicular to the extension direction of the data line.

8. The display panel according to any one of claims 1-7, characterized in that, The first conductive layer includes a first metal layer, a third insulating layer, and a second metal layer sequentially disposed along a direction away from the substrate; the data line group includes multiple data lines that are parallel to each other and spaced apart, a portion of the data lines in the data line group are composed of the first metal layer, and another portion of the data lines in the data line group are composed of the second metal layer.

9. The display panel according to any one of claims 1-7, characterized in that, The second conductive layer includes a third metal layer and a fourth metal layer. The third metal layer is located on the side of the first insulating layer opposite to the first conductive layer, and a first sub-power line is provided on the third metal layer. The fourth metal layer is located on the side of the third metal layer opposite to the first insulating layer, and a second sub-power line is provided on the fourth metal layer. The second sub-power line is electrically connected to the first sub-power line to form the power line.

10. The display panel according to claim 9, characterized in that, The non-display area also includes an inorganic layer located between the third metal layer and the fourth metal layer, which covers the first sub-power line.

11. The display panel according to claim 10, characterized in that, The inorganic layer covers the side of the first sub-power line.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11.

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