Display device

Abstract

The present application provides a display device, including a display panel and a supporting layer, the display panel having a light-transmitting area and a binding area, the supporting layer comprising a first supporting layer and a second supporting layer, the first supporting layer having a first part corresponding to the light-transmitting area, and the second supporting layer having a second part corresponding to the binding area, by setting the light phase delay coefficient of the first part to be smaller than the light phase delay coefficient of the second part, so that the phase delay effect of the supporting layer on the light passing through the light-transmitting area is alleviated or eliminated, preventing the light in the light-transmitting area from having light stripes, improving the lighting effect of the optical element under the screen, and compared with the design of digging holes in the supporting layer in the light-transmitting area, the present application can improve the pressure resistance of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] With the change of people's aesthetic level and the development of mobile terminal products, full screen is an inevitable trend of terminal product development. Based on flexible OLED panel, the pad bending technology can be used to bend the binding area to the bottom of the screen, thus narrowing the bottom frame; the under-screen optical or ultrasonic fingerprint technology, screen sound technology and under-screen camera technology can be used to place the sensor under the screen, further increasing the screen-to-body ratio.

[0003] There are two solutions for implementing under-screen cameras: blind holes and through holes. Compared with through-hole screens, blind hole screens can hide the camera under the screen and display it normally, which is conducive to improving the screen-to-body ratio, so it has a broader market prospect. In blind hole screens, a support layer and a heat dissipation layer are set under the display panel; the support layer supports and protects the display panel, and the support layer in the binding area has a small thermal expansion, so that the binding will not fail due to the change in the volume of the support layer during the chip binding process; the heat dissipation layer is used to dissipate heat and is usually an opaque layer. In order to meet the lighting needs of the camera, holes are dug in the heat dissipation layer, and the supporting layer itself has a certain degree of light transmittance. Therefore, there are usually two ways to deal with the supporting layer: one is to retain the entire supporting layer, so that the supporting layer can maintain the support and protection of the display panel in the blind hole area and the binding area. However, after the light passes through the supporting layer, it will cause serious interference and form light and dark stripes, which will affect the lighting of the camera; the other is to dig holes in the supporting layer in the blind hole area to eliminate the effect of the supporting layer on the light, but this will cause the display panel in the blind hole area to lack protection and support, and the pressure resistance of the display panel cannot meet the needs.

[0004] Therefore, the support layer of the current display device will cause the light to form light and dark stripes, affecting the lighting effect of the camera; if the support layer is dug, the pressure resistance of the display panel in the blind hole area will be insufficient. Summary of the invention

[0005] The present application provides a display device for solving the problem that the supporting layer of the light-transmitting area affects the lighting effect of the camera, and the problem that the pressure resistance of the display panel is insufficient after the supporting layer of the light-transmitting area is removed.

[0006] The present application provides a display device, comprising:

[0007] A display panel, including a light-transmitting area and a binding area;

[0008] A supporting layer is arranged on the back side of the display panel, and includes a first supporting layer and a second supporting layer, the first supporting layer includes a first part corresponding to the light-transmitting area, the second supporting layer includes a second part corresponding to the binding area, and the optical phase delay coefficient of the first part is smaller than the optical phase delay coefficient of the second part.

[0009] In the display device of the present application, the display panel includes a first area and a bending area, the bending area is connected between the first area and the binding area, the first area and the binding area are arranged opposite to each other, and the first area includes the light-transmitting area.

[0010] In the display device of the present application, the first supporting layer is arranged corresponding to the first area, and the second supporting layer is arranged corresponding to the binding area.

[0011] In the display device of the present application, the optical phase retardation coefficient of the first supporting layer is smaller than the optical phase retardation coefficient of the second supporting layer.

[0012] In the display device of the present application, the supporting layer further includes a third supporting layer arranged corresponding to the first area, a first opening is arranged on the third supporting layer, and the first supporting layer is arranged in the first opening.

[0013] In the display device of the present application, the supporting layer further includes a third supporting layer arranged corresponding to the first area, and the third supporting layer is arranged in the same layer and side by side with the first supporting layer.

[0014] In the display device of the present application, the supporting layer also includes a third supporting layer arranged corresponding to the first area, the third supporting layer is located on the lower side of the first supporting layer, and a second opening is arranged on the third supporting layer, and the position of the second opening corresponds to the position of the light-transmitting area.

[0015] In the display device of the present application, the display device further comprises an anti-reflection and anti-reflection film located on a side of the support layer away from the display panel, and the anti-reflection and anti-reflection film is arranged corresponding to the light-transmitting area.

[0016] In the display device of the present application, the display device further includes an optical component, and the optical component is arranged corresponding to the light-transmitting area.

[0017] In the display device of the present application, the display device further comprises a heat dissipation layer disposed on the back side of the support layer, and the heat dissipation layer comprises a third opening corresponding to the light-transmitting area.

[0018] In the display device of the present application, the optical phase delay coefficient of the first part is less than or equal to 100, and the optical phase delay coefficient of the second part is greater than 100.

[0019] In the display device of the present application, the material of the first part includes one of cycloolefin polymer, triacetyl cellulose, transparent polyimide, and acrylic plastic.

[0020] The beneficial effects of the present application are as follows: the display device provided by the present application, by setting the optical phase delay coefficient of the first part of the supporting layer arranged in the light-transmitting area corresponding to the display panel to be smaller than the optical phase delay coefficient of the second part of the supporting layer, the phase delay effect of the supporting layer on the light passing through the light-transmitting area is alleviated or eliminated, and the light in the light-transmitting area is prevented from having light and dark stripes, thereby improving the lighting effect of the optical components under the screen, and compared with the design of digging holes in the supporting layer in the light-transmitting area, the present application can enhance the compressive resistance of the display panel; in addition, the supporting layer in the binding area corresponding to the display panel has a lower thermal expansion coefficient, thereby preventing binding failure due to excessive expansion and contraction of the supporting layer during the binding process, thereby improving the manufacturing yield and reliability of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0022] Figure 1 is a schematic diagram of a first structure of a display device provided in an embodiment of the present application;

[0023] Figure 2 yes Figure 1 The structure schematic diagram of the display device shown in FIG. 1 is provided with an anti-reflection and anti-reflection film;

[0024] Figure 3 is a second structural schematic diagram of the display device provided in an embodiment of the present application;

[0025] Figure 4 yes Figure 3 A schematic diagram of the structure of a support layer in a display device during the manufacturing process is shown;

[0026] Figure 5 is a third structural schematic diagram of the display device provided in the embodiment of the present application;

[0027] Figure 6 yes Figure 5 A schematic diagram of the structure of a support layer in a display device during the manufacturing process is shown;

[0028] Figure 7 is a fourth structural schematic diagram of the display device provided in an embodiment of the present application;

[0029] Figure 8 yes Figure 7 A schematic diagram of the structure of a support layer in a display device during the manufacturing process is shown;

[0030] Fig. 9is a fifth structural schematic diagram of the display device provided in the embodiment of the present application;

[0031] Fig.10 yes Fig. 9 A schematic diagram of the structure of a support layer in a display device during the manufacturing process is shown;

[0032] Fig.11 is a sixth structural schematic diagram of the display device provided in an embodiment of the present application;

[0033] Fig.12 yes Figure 1 The structure diagram of the display device shown is supplemented with optical components. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0035] The embodiment of the present application provides a display device, including a display panel and a support layer for supporting the display panel, wherein the display panel has a light-transmitting area and a binding area connecting the light-transmitting area, and the support layer includes a first support layer and a second support layer, wherein the first support layer has a first portion corresponding to the light-transmitting area, and the second support layer has a second portion corresponding to the binding area, and the optical phase delay coefficient of the first portion is smaller than the optical phase delay coefficient of the second portion. The embodiment of the present application reduces the optical phase delay coefficient of the support layer corresponding to the light-transmitting area of ​​the display panel, thereby alleviating or eliminating the phase delay effect of the support layer on the light in the light-transmitting area, preventing the light in the light-transmitting area from forming light and dark stripes, and improving the lighting effect of the optical element under the screen; in addition, the support layer corresponding to the binding area of ​​the display panel has a lower thermal expansion coefficient, thereby preventing the binding failure caused by excessive expansion and contraction of the support layer during the binding process.

[0036] See also Figure 1 , Figure 1It is a first structural schematic diagram of the display device provided in an embodiment of the present application, wherein the display device includes a display panel 10, a support layer 20 arranged on the back side of the display panel 10, a polarizer layer 30 arranged on the display panel 10, a cover layer 40 arranged on the polarizer layer 30, and a heat dissipation layer 50 arranged on the lower side of the support layer 20. Among them, the display panel 10 can be an organic light emitting diode display panel, the display panel 10 can be flexible in at least a local area, and can be bent to the back side of the local area of ​​the display panel 10; the support layer 20 is used to support and protect the display panel 10 to ensure that the display panel 10 maintains a normal working state under external pressure or heat; the polarizer layer 30 has a polarizing effect and is used to adjust the visual effect of the display panel 10. The polarizer layer 30 can be a whole piece of polarizer; the cover layer 40 is used to seal and protect various components in the display device to prevent damage by external forces or erosion by external water vapor, etc., and the cover layer 40 can be a glass cover; the heat dissipation layer 50 is used to conduct and dissipate the heat in the display device to prevent heat accumulation from damaging the function of the display device, and the heat dissipation layer 50 can be a composite film layer composed of a composite adhesive layer, a metal copper layer, a polyimide layer and a foam layer.

[0037] The display panel 10 includes a light-transmitting area 101 and a binding area 102 connected to the light-transmitting area 101. It should be noted that the display panel 10 is the main body of the display device that performs the display function, and a plurality of pixel units are arranged inside the display panel 10; the light-transmitting area 101 has higher light transmittance than other areas on the display panel 10 to meet the lighting requirements of the optical elements arranged under the light-transmitting area 101; in order to achieve the high light transmittance of the light-transmitting area 101, the arrangement density of the pixel units arranged in the light-transmitting area 101 will be less than the pixel arrangement density of other areas in the display panel 10 to ensure that light passes through the light-transmitting area 101 smoothly. The binding area 102 may not have a display function, and a variety of wiring is arranged inside it; the chip IC or flexible circuit board is bound and connected to the display panel 10 through the binding area 102, and is used to provide a driving or control signal to the display panel 10; the method of binding and connecting the chip IC or flexible circuit board to the display panel 10 is a hot pressing method. Since the hot pressing method requires heating the binding area 102, the other functional layers arranged corresponding to the binding area 102 need to have a certain heat resistance, especially the thermal expansion coefficient must be able to meet the hot pressing requirements. The binding area 102 can be bent to the back side of the display panel 10 through a bending area to realize the narrow frame design of the display device. The heat dissipation layer 50 includes a third opening arranged corresponding to the light-transmitting area 101.

[0038] The support layer 20 is disposed on the back side of the display panel 10, or on the opposite side of the light emitting surface of the display panel 10. The support layer 20 includes a first support layer 21 and a second support layer 22; the first support layer 21 includes a first portion 211 corresponding to the light-transmitting area 101; the second support layer 22 includes a second portion corresponding to the binding area 102, and the second portion may be part or all of the second support layer 22. The optical phase delay coefficient of the first portion 211 is smaller than the optical phase delay coefficient of the second portion.

[0039] It should be noted that the support layer 20 is light-transmissive in at least the area corresponding to the first part 211. When light passes through the intermediate medium, due to the phase delay effect of the intermediate medium on the light, its phase will change to varying degrees. The greater the phase difference, the greater the effect of light interference between the light rays, and the more serious the phenomenon of light emission forming light and dark stripes. In the embodiment of the present application, the first part 211 is equivalent to the intermediate medium. By adjusting the light phase delay coefficient of the first part 211, the light phase delay coefficient of the first part 211 is made smaller than the light phase delay coefficient of the second part, or the light phase delay coefficient of the first part 211 is smaller than the light phase delay coefficient of other areas of the support layer 20 except the first part 211, thereby reducing or eliminating the light and dark stripes caused by the phase delay effect of the support layer on the light, which is beneficial to improve the lighting effect of the optical element set in the corresponding light-transmitting area 101.

[0040] Optionally, the optical phase delay coefficient of the first part 211 is less than or equal to 100, and the optical phase delay coefficient of the second part is greater than 100. It should be noted that, through multiple creative experiments and creative calculations based on the experiments, it is concluded that when the optical phase delay coefficient of the first part 211 is less than or equal to 100, its phase delay effect on the light will not cause the emitted light to form light and dark stripes, or have a significant impact on the lighting effect of the optical element under the screen.

[0041] Optionally, the material of the first portion 211 may include one of materials having a low phase retardation coefficient, such as cycloolefin polymer (COP), triacetyl cellulose (TAC), transparent polyimide (CPI), and acrylic plastic (PMMA).

[0042] Optionally, see Figure 2 The display device further includes an anti-reflection and anti-reflection film AR located on a side of the support layer 20 away from the display panel 10, and the anti-reflection and anti-reflection film AR is arranged corresponding to the light-transmitting area 101 to increase the light-transmitting ability of the display device at the light-transmitting area 101. The anti-reflection and anti-reflection film AR can be made of submicron transparent ceramic material.

[0043] Furthermore, the thermal expansion coefficient of the second part is smaller than the thermal expansion coefficient of the first part 211. It should be noted that the second part of the second supporting layer 22 corresponds to the binding area 102 of the display panel 10. The binding area 102 needs to use a hot pressing method in the process of binding and connecting with the chip IC or the flexible circuit board. Therefore, the supporting layer supporting the binding area 102 needs to have good heat resistance. The thermal expansion coefficient of a material is an indicator of the expansion and contraction performance of the material when heated. In this embodiment, the thermal expansion coefficient of the second part is adjusted so that the thermal expansion coefficient of the second part is smaller than the thermal expansion coefficient of the first part 211, or the thermal expansion coefficient of the second part is smaller than the thermal expansion coefficient of other areas of the supporting layer 20 except the second part, thereby avoiding the poor binding connection between the display panel 10 and the chip IC or the flexible circuit board due to excessive thermal expansion of the supporting layer, which is beneficial to improving the manufacturing yield and reliability of the display device.

[0044] Optionally, the second part may be made of a material with a relatively low thermal expansion coefficient, such as polyethylene terephthalate (PET).

[0045] It should be noted that the first part 211 may not only correspond to the light-transmitting area 101 of the display panel 10, but may also be arranged on the back side of other areas of the display panel 10 except the binding area 102; the second part may not only correspond to the binding area 102 of the display panel 10, but may also be arranged on the back side of other areas of the display panel 10 except the light-transmitting area 101.

[0046] In one embodiment, see Figure 3 , Figure 31 is a second structural schematic diagram of a display device provided in an embodiment of the present application. The display device includes a display panel 10, a support layer 20 disposed on the back side of the display panel 10, a polarizer layer 30 disposed on the display panel 10, a cover layer 40 disposed on the polarizer layer 30, and a heat dissipation layer 50 disposed on the lower side of the support layer 20. Among them, the display panel 10 can be an organic light emitting diode display panel, the display panel 10 can be flexible in at least a local area, and can be bent to the back side of the local area of ​​the display panel 10; the support layer 20 is used to support and protect the display panel 10 to ensure that the display panel 10 maintains a normal working state under external pressure or heat; the polarizer layer 30 has a polarizing effect and is used to adjust the visual effect of the display panel 10. The polarizer layer 30 can be a whole piece of polarizer; the cover layer 40 is used to seal and protect various components in the display device to prevent damage by external forces or erosion by external water vapor, etc., and the cover layer 40 can be a glass cover; the heat dissipation layer 50 is used to conduct and dissipate the heat in the display device to prevent heat accumulation from damaging the function of the display device, and the heat dissipation layer 50 can be a composite film layer composed of a composite adhesive layer, a metal copper layer, a polyimide layer and a foam layer.

[0047] The display panel 10 includes a first area 110 and a binding area 102 connected to the first area 110, and the first area 110 includes a light-transmitting area 101. The first area 110 may be an area with a display function in the display panel 10; the light-transmitting area 101 has a higher light transmittance than other areas on the display panel 10 to meet the lighting requirements of the optical elements arranged on the lower side of the light-transmitting area 101. The binding area 102 may not have a display function, and a variety of wiring is arranged inside it; the chip IC or the flexible circuit board is bound and connected to the display panel 10 through the binding area 102 to provide a driving or control signal for the display panel 10; the method for binding and connecting the chip IC or the flexible circuit board to the display panel 10 may be a hot pressing method. The binding area 102 can be bent to the back side of the display panel 10 through a bending area to realize the narrow frame design of the display device. The heat dissipation layer 50 includes a third opening arranged corresponding to the light-transmitting area 101.

[0048] The support layer 20 is disposed on the back side of the display panel 10, or on the opposite side of the light emitting surface of the display panel 10. The support layer 20 includes a first support layer 21 and a second support layer 22; the first support layer 21 is disposed corresponding to the first area 110, and the first support layer 21 is disposed on the lower side of the light-transmitting area 101; the second support layer 22 is disposed corresponding to the binding area 102. The optical phase delay coefficient of the first support layer 21 is smaller than the optical phase delay coefficient of the second support layer 22.

[0049] It should be noted that the first supporting layer 21 is light-transmissive in at least the region corresponding to the light-transmissive region 101. In this embodiment, by adjusting the optical phase retardation coefficient of the first supporting layer 21 so that the optical phase retardation coefficient of the first supporting layer 21 is smaller than the optical phase retardation coefficient of the second supporting layer 22, the phase retardation effect of the first supporting layer 21 on the light is reduced or eliminated, and the light passing through the light-transmissive region 101 is prevented from forming light and dark stripes, which is beneficial to improving the lighting effect of the optical element arranged in the corresponding light-transmissive region 101.

[0050] Optionally, the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, and the optical phase delay coefficient of the second supporting layer 22 is greater than 100. It should be noted that, through multiple creative experiments and creative calculations based on the experiments, it is concluded that when the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, its phase delay effect on the light will not cause the emitted light to form light and dark stripes, or have a significant impact on the lighting effect of the optical element under the screen.

[0051] Optionally, the material of the first support layer 21 may include one of materials with a low phase retardation coefficient, such as cycloolefin polymer (COP), triacetyl cellulose (TAC), transparent polyimide (CPI) or acrylic plastic (PMMA).

[0052] Furthermore, the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. It should be noted that the second supporting layer 22 corresponds to the binding area 102 of the display panel 10. The binding area 102 needs to be connected with the chip IC or the flexible circuit board using a hot pressing method. Therefore, the supporting layer supporting the binding area 102 needs to have good heat resistance. In this embodiment, the thermal expansion coefficient of the second supporting layer 22 is adjusted so that the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. By controlling the expansion amount of the second supporting layer 22 under hot pressing conditions, the poor binding connection between the display panel 10 and the chip IC or the flexible circuit board due to excessive expansion of the supporting layer is avoided, which is beneficial to improving the manufacturing yield and reliability of the display device.

[0053] Optionally, the second supporting layer 22 may be made of a material with a relatively low thermal expansion coefficient, such as polyethylene terephthalate (PET).

[0054] For further information, see Figure 3 and Figure 4 , Figure 4 yes Figure 3A schematic diagram of the structure of the support layer in the display device shown in the manufacturing process. Before the support layer 20 is bonded to the display panel 10, a release film C1 and a carrier film C2 are attached to its two sides respectively. In this embodiment, the method for manufacturing the support layer 20 includes the following steps: taking a first raw material including a first splicing layer L1 and a second raw material including a second splicing layer L2, wherein the first splicing layer L1 corresponds to the first support layer 21, and the second splicing layer L2 corresponds to the second support layer 22; removing the release film C1 and the carrier film C2 attached to both sides of the first raw material and the second raw material to obtain the first splicing layer L1 and the second splicing layer L2; pasting the first splicing layer L1 and the second splicing layer L2 side by side between the new carrier film C2 and the release film C1 ; Use a knife die to make a half cut along the cutting line B1 from the side of the carrier film C2, and the cutting depth reaches the bonding surface of the release film C1 and the first splicing layer L1 or the second splicing layer L2, and the cutting area surrounded by the cutting line B1 includes the connecting seam between the first splicing layer L1 and the second splicing layer L2; remove the cut carrier film C2, and paste the complete carrier film C2; remove the release film C1, and paste the first splicing layer L1 and the second splicing layer L2 to the first area 110 and the binding area 102 of the display panel 10 respectively; remove the carrier film C2, and complete the production of the support layer 20.

[0055] In one embodiment, see Figure 5 , Figure 5 1 is a third structural schematic diagram of a display device provided in an embodiment of the present application. The display device includes a display panel 10, a support layer 20 disposed on the back side of the display panel 10, a polarizer layer 30 disposed on the display panel 10, a cover layer 40 disposed on the polarizer layer 30, and a heat dissipation layer 50 disposed on the lower side of the support layer 20. Among them, the display panel 10 can be an organic light emitting diode display panel, the display panel 10 can be flexible in at least a local area, and can be bent to the back side of the local area of ​​the display panel 10; the support layer 20 is used to support and protect the display panel 10 to ensure that the display panel 10 maintains a normal working state under external pressure or heat; the polarizer layer 30 has a polarizing effect and is used to adjust the visual effect of the display panel 10, and it can be a whole piece of polarizer; the cover layer 40 is used to seal and protect various components in the display device to prevent damage from external forces or erosion from external water vapor, etc., and it can be a glass cover; the heat dissipation layer 50 is used to conduct and dissipate the heat in the display device to prevent heat accumulation from damaging the function of the display device, and it can be a composite film layer composed of a composite adhesive layer, a metal copper layer, a polyimide layer and a foam layer.

[0056] The display panel 10 includes a first area 110 and a binding area 102 connected to the first area 110, and the first area 110 includes a light-transmitting area 101. The first area 110 may be an area with a display function in the display panel 10; the light-transmitting area 101 has a higher light transmittance than other areas on the display panel 10 to meet the lighting requirements of the optical elements arranged on the lower side of the light-transmitting area 101. The binding area 102 may not have a display function, and a variety of wiring is arranged inside it; the chip IC or the flexible circuit board is bound and connected to the display panel 10 through the binding area 102 to provide a driving or control signal for the display panel 10; the method for binding and connecting the chip IC or the flexible circuit board to the display panel 10 may be a hot pressing method. The binding area 102 can be bent to the back side of the display panel 10 through a bending area to realize the narrow frame design of the display device. The heat dissipation layer 50 includes a third opening arranged corresponding to the light-transmitting area 101.

[0057] The support layer 20 is disposed on the back side of the display panel 10, or on the opposite side of the light emitting surface of the display panel 10. The support layer 20 includes a first support layer 21, a second support layer 22 and a third support layer 23; at least a part of the first support layer 21 is disposed corresponding to the light transmission area 101, the second support layer 22 is disposed corresponding to the binding area 102, the third support layer 23 is disposed corresponding to the first area 110, a first opening is disposed on the third support layer 23, and the first support layer 21 is disposed in the first opening. The optical phase delay coefficient of the first support layer 21 is smaller than the optical phase delay coefficient of the second support layer 22.

[0058] It should be noted that the first supporting layer 21 is light-transmissive in at least the region corresponding to the light-transmissive region 101. In this embodiment, by adjusting the optical phase retardation coefficient of the first supporting layer 21 so that the optical phase retardation coefficient of the first supporting layer 21 is smaller than the optical phase retardation coefficient of the second supporting layer 22, the phase retardation effect of the first supporting layer 21 on the light is reduced or eliminated, and the light passing through the light-transmissive region 101 is prevented from forming light and dark stripes, which is beneficial to improving the lighting effect of the optical element arranged in the corresponding light-transmissive region 101.

[0059] Optionally, the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, and the optical phase delay coefficient of the second supporting layer 22 is greater than 100. It should be noted that, through multiple creative experiments and creative calculations based on the experiments, it is concluded that when the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, its phase delay effect on the light will not cause the emitted light to form light and dark stripes, or have a significant impact on the lighting effect of the optical element under the screen.

[0060] Optionally, the material of the first support layer 21 may include one of materials with a low phase retardation coefficient, such as cycloolefin polymer (COP), triacetyl cellulose (TAC), transparent polyimide (CPI) or acrylic plastic (PMMA).

[0061] Furthermore, the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. It should be noted that the second supporting layer 22 corresponds to the binding area 102 of the display panel 10. The binding area 102 needs to be connected with the chip IC or the flexible circuit board using a hot pressing method. Therefore, the supporting layer supporting the binding area 102 needs to have good heat resistance. In this embodiment, the thermal expansion coefficient of the second supporting layer 22 is adjusted so that the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. By controlling the expansion amount of the second supporting layer 22 under hot pressing conditions, the poor binding connection between the display panel 10 and the chip IC or the flexible circuit board due to excessive expansion of the supporting layer is avoided, which is beneficial to improving the manufacturing yield and reliability of the display device.

[0062] Optionally, the second supporting layer 22 and the third supporting layer 23 may be made of a material with a relatively low thermal expansion coefficient, such as polyethylene terephthalate (PET).

[0063] For further information, see Figure 5 and Figure 6 , Figure 6 yes Figure 5 A schematic diagram of the structure of the support layer in the display device shown in the manufacturing process. Before the support layer 20 is bonded to the display panel 10, a release film C1 and a carrier film C2 are attached to its two sides respectively. In this embodiment, the method for manufacturing the support layer 20 includes the following steps: taking a first raw material including a first splicing layer L1, a second raw material including a second splicing layer L2, and a third raw material including a third splicing layer L3, wherein the first splicing layer L1 corresponds to the first support layer 21, a partial area of ​​the second splicing layer L2 corresponds to the second support layer 22, and the remaining area of ​​the second splicing layer L2 and the third splicing layer L3 correspond to the third support layer 23; bonding the first raw material, the second raw material, and the third raw material according to Figure 5The support layer 20 shown is cut to a size corresponding to the size shown; the release film C1 and the carrier film C2 pasted on both sides of the first raw material, the second raw material and the third raw material are removed to obtain the first splicing layer L1, the second splicing layer L2 and the third splicing layer L3; the third splicing layer L3, the first splicing layer L1 and the second splicing layer L2 are sequentially pasted side by side between the new carrier film C2 and the release film C1; a knife die is used to half-cut along the cutting line B1 from the side of the carrier film C2, and the cutting depth reaches the bonding surface of the release film C1 and the second splicing layer L2; the cut carrier film C2 is removed, and the complete carrier film C2 is pasted; the release film C1 is removed, and the third splicing layer L3, the first splicing layer L1 and the second splicing layer L2 are pasted according to Figure 5 The position shown in the embodiment is entirely pasted on the back side of the display panel 10 ; after removing the carrier film C2 , the support layer 20 is manufactured.

[0064] In one embodiment, see Figure 7 , Figure 7 1 is a fourth structural schematic diagram of a display device provided in an embodiment of the present application. The display device includes a display panel 10, a support layer 20 disposed on the back side of the display panel 10, a polarizer layer 30 disposed on the display panel 10, a cover layer 40 disposed on the polarizer layer 30, and a heat dissipation layer 50 disposed on the lower side of the support layer 20. Among them, the display panel 10 can be an organic light emitting diode display panel, the display panel 10 can be flexible in at least a local area, and can be bent to the back side of the local area of ​​the display panel 10; the support layer 20 is used to support and protect the display panel 10 to ensure that the display panel 10 maintains a normal working state under external pressure or heat; the polarizer layer 30 has a polarizing effect and is used to adjust the visual effect of the display panel 10, and it can be a whole piece of polarizer; the cover layer 40 is used to seal and protect various components in the display device to prevent damage from external forces or erosion from external water vapor, etc., and it can be a glass cover; the heat dissipation layer 50 is used to conduct and dissipate the heat in the display device to prevent heat accumulation from damaging the function of the display device, and it can be a composite film layer composed of a composite adhesive layer, a metal copper layer, a polyimide layer and a foam layer.

[0065] The display panel 10 includes a first area 110 and a binding area 102 connected to the first area 110, and the first area 110 includes a light-transmitting area 101. The first area 110 may be an area with a display function in the display panel 10; the light-transmitting area 101 has a higher light transmittance than other areas on the display panel 10 to meet the lighting requirements of the optical elements arranged on the lower side of the light-transmitting area 101. The binding area 102 may not have a display function, and a variety of wiring is arranged inside it; the chip IC or the flexible circuit board is bound and connected to the display panel 10 through the binding area 102 to provide a driving or control signal for the display panel 10; the method for binding and connecting the chip IC or the flexible circuit board to the display panel 10 may be a hot pressing method. The binding area 102 can be bent to the back side of the display panel 10 through a bending area to realize the narrow frame design of the display device. The heat dissipation layer 50 includes a third opening arranged corresponding to the light-transmitting area 101.

[0066] The support layer 20 is disposed on the back side of the display panel 10 or on the side opposite to the light emitting surface of the display panel 10. The support layer 20 includes a first support layer 21, a second support layer 22 and a third support layer 23. The third support layer 23 is disposed in parallel with the first support layer 21 in the same layer.

[0067] In this example, see Figure 7 , the third supporting layer 23 is arranged between the first supporting layer 21 and the second supporting layer 22, and when the display panel is bent, the third supporting layer 23 and the second supporting layer 22 are arranged relative to each other; or, the first supporting layer 21 can be arranged between the third supporting layer 23 and the second supporting layer 22, and when the display panel is bent, the first supporting layer 21 and the second supporting layer 22 are arranged relative to each other.

[0068] In this embodiment, the first supporting layer 21 and the third supporting layer 23 are arranged corresponding to the first area, a part of the first supporting layer 21 corresponds to the light-transmitting area 101, and the second supporting layer 22 corresponds to the binding area 102; the ratio of the area of ​​the first supporting layer 21 to the area of ​​the third supporting layer 23 is adjustable, and it is only necessary to ensure that the light-transmitting area 101 corresponds to the first supporting layer 21. The optical phase delay coefficient of the first supporting layer 21 is smaller than the optical phase delay coefficient of the second supporting layer 22.

[0069] It should be noted that the first supporting layer 21 is light-transmissive in at least the region corresponding to the light-transmissive region 101. In this embodiment, by adjusting the optical phase retardation coefficient of the first supporting layer 21 so that the optical phase retardation coefficient of the first supporting layer 21 is smaller than the optical phase retardation coefficient of the second supporting layer 22, the phase retardation effect of the first supporting layer 21 on the light is reduced or eliminated, and the light passing through the light-transmissive region 101 is prevented from forming light and dark stripes, which is beneficial to improving the lighting effect of the optical element arranged in the corresponding light-transmissive region 101.

[0070] Optionally, the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, and the optical phase delay coefficient of the second supporting layer 22 is greater than 100. It should be noted that, through multiple creative experiments and creative calculations based on the experiments, it is concluded that when the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, its phase delay effect on the light will not cause the emitted light to form light and dark stripes, or have a significant impact on the lighting effect of the optical element under the screen.

[0071] Optionally, the first supporting layer 21 may be made of a material with a low phase retardation coefficient, such as cycloolefin polymer (COP), triacetyl cellulose (TAC), transparent polyimide (CPI) or acrylic plastic (PMMA).

[0072] Furthermore, the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. It should be noted that the second supporting layer 22 corresponds to the binding area 102 of the display panel 10. The binding area 102 needs to be connected with the chip IC or the flexible circuit board using a hot pressing method. Therefore, the supporting layer supporting the binding area 102 needs to have good heat resistance. In this embodiment, the thermal expansion coefficient of the second supporting layer 22 is adjusted so that the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. By controlling the expansion amount of the second supporting layer 22 under hot pressing conditions, the poor binding connection between the display panel 10 and the chip IC or the flexible circuit board due to excessive expansion of the supporting layer is avoided, which is conducive to improving the manufacturing yield and reliability of the display device.

[0073] Optionally, the second supporting layer 22 and the third supporting layer 23 may be made of a material with a relatively low thermal expansion coefficient, such as polyethylene terephthalate (PET).

[0074] For further information, see Figure 7 and Figure 8 , Figure 8 yes Figure 7The structural schematic diagram of the support layer in the display device during the manufacturing process is shown. Before the support layer 20 is attached to the display panel 10, a release film C1 and a carrier film C2 are attached to both sides of the support layer 20 respectively. In this embodiment, the method for making the support layer 20 includes the following steps: taking a first raw material including a first splicing layer L1 and a second raw material including a second splicing layer L2, wherein the first splicing layer L1 corresponds to the first support layer 21, and partial areas of the second splicing layer L2 correspond to the second support layer 22 and the third support layer 23 respectively; removing the release film C1 and the carrier film C2 pasted on both sides of the first raw material and the second raw material to obtain the first splicing layer L1 and the second splicing layer L2; pasting the first splicing layer L1 and the second splicing layer L2 side by side between the new carrier film C2 and the release film C1; using a knife die to half-cut from the side of the carrier film C2 along the cutting line B1, and the cutting depth reaches the bonding surface of the release film C1 and the second splicing layer L2; removing the cut carrier film C2, and pasting the complete carrier film C2; removing the release film C1, and pasting the first splicing layer L1 and the second splicing layer L2 according to Figure 7 The position shown in the embodiment is entirely pasted on the back side of the display panel 10 ; after removing the carrier film C2 , the support layer 20 is manufactured.

[0075] In one embodiment, see Fig. 9 , Fig. 9 1 is a fifth structural schematic diagram of a display device provided in an embodiment of the present application. The display device includes a display panel 10, a support layer 20 disposed on the back side of the display panel 10, a polarizer layer 30 disposed on the display panel 10, a cover layer 40 disposed on the polarizer layer 30, and a heat dissipation layer 50 disposed on the lower side of the support layer 20. Among them, the display panel 10 can be an organic light emitting diode display panel, the display panel 10 can be flexible in at least a local area, and can be bent to the back side of the local area of ​​the display panel 10; the support layer 20 is used to support and protect the display panel 10 to ensure that the display panel 10 maintains a normal working state under external pressure or heat; the polarizer layer 30 has a polarizing effect and is used to adjust the visual effect of the display panel 10, and it can be a whole piece of polarizer; the cover layer 40 is used to seal and protect various components in the display device to prevent damage from external forces or erosion from external water vapor, etc., and it can be a glass cover; the heat dissipation layer 50 is used to conduct and dissipate the heat in the display device to prevent heat accumulation from damaging the function of the display device, and it can be a composite film layer composed of a composite adhesive layer, a metal copper layer, a polyimide layer and a foam layer.

[0076] The display panel 10 includes a first area 110 and a binding area 102 connected to the first area 110, and the first area 110 includes a light-transmitting area 101. The first area 110 may be an area with a display function in the display panel 10; the light-transmitting area 101 has a higher light transmittance than other areas on the display panel 10 to meet the lighting requirements of the optical elements arranged on the lower side of the light-transmitting area 101. The binding area 102 may not have a display function, and a variety of wiring is arranged inside it; the chip IC or the flexible circuit board is bound and connected to the display panel 10 through the binding area 102 to provide a driving or control signal for the display panel 10; the method for binding and connecting the chip IC or the flexible circuit board to the display panel 10 may be a hot pressing method. The binding area 102 can be bent to the back side of the display panel 10 through a bending area to realize the narrow frame design of the display device. The heat dissipation layer 50 includes a third opening arranged corresponding to the light-transmitting area 101.

[0077] The support layer 20 is disposed on the back side of the display panel 10, or on the opposite side of the light emitting surface of the display panel 10. The support layer 20 includes a first support layer 21, a second support layer 22 and a third support layer 23; the first support layer 21 is disposed corresponding to the first area 110 and the binding area 102, the second support layer 22 is disposed on the lower side of the first support layer 21 corresponding to the binding area 102, the third support layer 23 is disposed on the lower side of the first support layer 21 corresponding to the first area 110, and the third support layer 23 is provided with a second opening 203 at a position corresponding to the light transmission area 101. The optical phase delay coefficient of the first support layer 21 is smaller than the optical phase delay coefficient of the second support layer 22.

[0078] Optionally, the first supporting layer 21 may be disposed only corresponding to the first area 110 or only corresponding to the light-transmitting area 101 , and the second supporting layer 22 is directly disposed on the lower side of the binding area.

[0079] It should be noted that the first supporting layer 21 is light-transmissive in at least the region corresponding to the light-transmissive region 101. In this embodiment, by adjusting the optical phase retardation coefficient of the first supporting layer 21 so that the optical phase retardation coefficient of the first supporting layer 21 is smaller than the optical phase retardation coefficient of the second supporting layer 22, the phase retardation effect of the first supporting layer 21 on the light is reduced or eliminated, and the light passing through the light-transmissive region 101 is prevented from forming light and dark stripes, which is beneficial to improving the lighting effect of the optical element arranged in the corresponding light-transmissive region 101.

[0080] Optionally, the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, and the optical phase delay coefficient of the second supporting layer 22 is greater than 100. It should be noted that, through multiple creative experiments and creative calculations based on the experiments, it is concluded that when the optical phase delay coefficient of the first supporting layer 21 is less than or equal to 100, its phase delay effect on the light will not cause the emitted light to form light and dark stripes, or have a significant impact on the lighting effect of the optical element under the screen.

[0081] Optionally, the material of the first support layer 21 may include one of materials with a low phase retardation coefficient, such as cycloolefin polymer (COP), triacetyl cellulose (TAC), transparent polyimide (CPI) or acrylic plastic (PMMA).

[0082] Furthermore, the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. It should be noted that the second supporting layer 22 corresponds to the binding area 102 of the display panel 10. The binding area 102 needs to be connected with the chip IC or the flexible circuit board using a hot pressing method. Therefore, the supporting layer supporting the binding area 102 needs to have good heat resistance. In this embodiment, the thermal expansion coefficient of the second supporting layer 22 is adjusted so that the thermal expansion coefficient of the second supporting layer 22 is smaller than that of the first supporting layer 21. By controlling the expansion amount of the second supporting layer 22 under hot pressing conditions, the poor binding connection between the display panel 10 and the chip IC or the flexible circuit board due to excessive expansion of the supporting layer is avoided, which is conducive to improving the manufacturing yield and reliability of the display device.

[0083] Optionally, the second supporting layer 22 and the third supporting layer 23 may be made of a material with a relatively low thermal expansion coefficient, such as polyethylene terephthalate (PET).

[0084] For further information, see Fig. 9 and Fig.10 , Fig.10 yes Fig. 9A schematic diagram of the structure of the support layer in the display device shown in the manufacturing process. Before the support layer 20 is bonded to the display panel 10, a release film C1 and a carrier film C2 are attached to its two sides respectively. In this embodiment, the method for manufacturing the support layer 20 includes the following steps: taking a first raw material including a first splicing layer L1 and a second raw material including a second splicing layer L2; removing the carrier film C2 of the first raw material and the release film C1 of the second raw material; pasting the second splicing layer L2 on the lower side of the first splicing layer L1; using a knife die to perform a first half cut along the cutting line B1 from the side of the carrier film C2, and the cutting depth reaches the bonding surface of the release film C1 and the first splicing layer L1, and using a knife die to perform a second half cut along the cutting line B2, and the cutting depth reaches the bonding surface of the second splicing layer L2 and the first splicing layer L1; removing the cut carrier film C2, and pasting the complete carrier film C2; removing the release film C1, and bonding the first splicing layer L1 and the second splicing layer L2 according to Fig. 9 The position shown in the embodiment is entirely pasted on the back side of the display panel 10 ; after removing the carrier film C2 , the support layer 20 is manufactured.

[0085] In one embodiment, see Fig.11 , Fig.11 It is a sixth structural schematic diagram of a display device provided in an embodiment of the present application, wherein the display device comprises a display panel 10, wherein the display panel 10 comprises a first area 110, a bending area 103 and a binding area 102, wherein the bending area 103 is connected between the first area 110 and the binding area 102, so that the first area 110 and the binding area 102 are opposite. A light-transmitting area 101 is provided in the first area 110. The first area 110 has a display function, and the binding area 102 and the bending area 103 may not have a display function; a variety of wirings are provided inside the binding area 102; a chip IC and a flexible circuit board FPC are bound and connected to the display panel 10 through the binding area 102, and are used to provide a driving or control signal for the display panel 10; an organic layer 70 is provided on the outside of the bending area 103, and the organic layer 70 has an insulating and protective effect on the bending area 103.

[0086] The display device further includes a support layer 20 disposed on the non-light-emitting surface of the display panel 10, and the support layer 20 includes a first support layer 21 disposed corresponding to the first area 110 and a second support layer 22 disposed corresponding to the binding area 102. The first support layer 21 includes a first portion 211 corresponding to the light-transmitting area 101, and the first portion 211 may be part or all of the first support layer 21; the second support layer 22 includes a second portion corresponding to the binding area 102, and the second portion may be part or all of the second support layer 22. The optical phase delay coefficient of the first portion 211 is smaller than the optical phase delay coefficient of the second portion. In this embodiment, the optical phase delay coefficient of the first portion 211 is adjusted so that the optical phase delay coefficient of the first portion 211 is smaller than the optical phase delay coefficient of the second portion, or the optical phase delay coefficient of the first portion 211 is smaller than the optical phase delay coefficient of other regions of the support layer 20 except the first portion 211, thereby reducing or eliminating the light and dark stripes generated by the phase delay effect of the support layer on the light, which is beneficial to improving the lighting effect of the optical element disposed corresponding to the light-transmitting area 101.

[0087] The display device further includes a polarizer layer 30 disposed on the first area 110 and a cover layer 40 disposed on the polarizer layer 30. The polarizer layer 30 has a polarizing effect and is used to adjust the visual effect of the display panel 10. The polarizer layer 30 may be a whole polarizer. The cover layer 40 is used to seal and protect various components in the display device to prevent damage from external forces or erosion from external water vapor, etc. The cover layer 40 may be a glass cover.

[0088] The display device further includes a heat dissipation layer 50 disposed on the lower side of the support layer 20, and the heat dissipation layer 50 includes a third opening disposed corresponding to the light-transmitting area 101. The bending area 103 is connected to the heat dissipation layer 50 through the second support layer 22 and the support gasket 60. The heat dissipation layer 50 is used to conduct and dissipate the heat in the display device to prevent heat accumulation from damaging the function of the display device. The heat dissipation layer 50 may be a composite film layer composed of a composite adhesive layer, a metal copper layer, a polyimide layer, and a foam layer.

[0089] Optionally, the optical phase retardation coefficient of the first part 211 is less than or equal to 100, and the optical phase retardation coefficient of the second part is greater than 100. The material of the first part 211 may include one of materials with a low phase retardation coefficient, such as cycloolefin polymer (COP), triacetyl cellulose (TAC), transparent polyimide (CPI) or acrylic plastic (PMMA).

[0090] Optionally, the thermal expansion coefficient of the second portion is smaller than the thermal expansion coefficient of the first portion 211. The second portion may be made of a material with a lower thermal expansion coefficient, such as polyethylene terephthalate (PET).

[0091] For further information, see Fig.12 The display device further includes an optical component 90 and a frame 80. The optical component 90 is fixed to a side of the non-light-emitting surface of the display panel 10 through the frame 80, and the position of the optical component 90 corresponds to the position of the light-transmitting area 101. The optical component 90 can collect external light through the light-transmitting area 101 to perform its function.

[0092] In summary, the display device provided by the embodiment of the present application includes a display panel and a supporting layer, the display panel has a light-transmitting area and a binding area connected to the light-transmitting area, the supporting layer includes a first supporting layer and a second supporting layer, the first supporting layer has a first part corresponding to the light-transmitting area, and the second supporting layer has a second part corresponding to the binding area. By setting the optical phase delay coefficient of the first part to be smaller than the optical phase delay coefficient of the second part, the phase delay effect of the supporting layer on the light passing through the light-transmitting area is alleviated or eliminated, thereby preventing the light in the light-transmitting area from having light stripes, and improving the lighting effect of the optical element under the screen; in addition, the supporting layer corresponding to the binding area of ​​the display panel has a lower thermal expansion coefficient, thereby preventing binding failure due to excessive expansion and contraction of the supporting layer during the binding process, thereby improving the manufacturing yield and reliability of the display device.

[0093] It should be noted that although the present application is disclosed as above with specific embodiments, the above embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined in the claims.

Claims

1. A display device, characterized in that: include: A display panel, including a light-transmitting area and a binding area; A supporting layer is arranged on the back side of the display panel, and includes a first supporting layer and a second supporting layer, the first supporting layer includes a first part corresponding to the light-transmitting area, the second supporting layer includes a second part corresponding to the binding area, and the optical phase delay coefficient of the first part is smaller than the optical phase delay coefficient of the second part.

2. The display device according to claim 1, characterized in that The display panel includes a first area and a bending area, the bending area is connected between the first area and the binding area, the first area and the binding area are arranged opposite to each other, and the first area includes the light-transmitting area.

3. The display device according to claim 2, characterized in that: The first supporting layer is arranged corresponding to the first area, and the second supporting layer is arranged corresponding to the binding area.

4. The display device according to claim 3, characterized in that The optical phase retardation coefficient of the first supporting layer is smaller than the optical phase retardation coefficient of the second supporting layer.

5. The display device according to claim 2, characterized in that: The supporting layer further includes a third supporting layer arranged corresponding to the first area, a first opening is arranged on the third supporting layer, and the first supporting layer is arranged in the first opening.

6. The display device according to claim 2, characterized in that: The support layer further includes a third support layer arranged corresponding to the first area, and the third support layer is arranged in parallel with the first support layer in the same layer.

7. The display device according to claim 2, characterized in that: The support layer further includes a third support layer arranged corresponding to the first area, the third support layer is located at the lower side of the first support layer, a second opening is arranged on the third support layer, and the position of the second opening corresponds to the position of the light-transmitting area.

8. The display device according to claim 1, characterized in that: The display device further comprises an anti-reflection and anti-reflection film located on a side of the support layer away from the display panel, and the anti-reflection and anti-reflection film is arranged corresponding to the light-transmitting area.

9. The display device according to any one of claims 1 to 8, characterized in that: The display device further includes an optical component, and the optical component is arranged corresponding to the light-transmitting area.

10. The display device according to any one of claims 1 to 8, characterized in that: The display device further includes a heat dissipation layer disposed on the back side of the support layer, and the heat dissipation layer includes a third opening corresponding to the light-transmitting area.

11. The display device according to any one of claims 1 to 8, characterized in that: The optical phase delay coefficient of the first part is less than or equal to 100, and the optical phase delay coefficient of the second part is greater than 100.

12. The display device according to any one of claims 1 to 8, characterized in that: The material of the first part includes one of cycloolefin polymer, triacetyl cellulose, transparent polyimide and acrylic plastic.

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