Display substrate, detection and repair method, and display device

Abstract

An embodiment of the present invention provides a display substrate, a detection and repair method, and a display device, relating to the field of display technologies, for avoiding encapsulation residues and simplifying the detection and repair process while avoiding encapsulation residues. The display substrate includes: a driving backplane, the driving backplane including a plurality of pixel regions, and the pixel region including a first gasket and a second gasket; a light-emitting diode located in the pixel region, the light-emitting diode being electrically connected to the first gasket, and, in a direction perpendicular to the plane where the driving backplane is located, the light-emitting diode overlapping with the first gasket and the second gasket respectively.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and in particular, to a display substrate, a detection and repair method, and a display device.

Background Art

[0002] Light-Emitting Diode (LED) display substrates have increasingly attracted the attention of the display market due to their high brightness, low power consumption, long lifespan, impact resistance, and stable performance.

[0003] In the existing design, some spare pads are usually provided on the driving backplane of the display substrate. When it is detected that some light-emitting diodes cannot emit light normally, spare light-emitting diodes are re-bonded on the spare pads to replace the broken light-emitting diodes for light-emitting display. However, in this structure, there will eventually be a large number of spare pads on the driving backplane that are not bonded to the light-emitting diodes. When forming the encapsulation layer later, these spare pads will reflect ultraviolet light, resulting in encapsulation residue and further affecting the encapsulation performance.

Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a display substrate, a detection and repair method, and a display device to avoid encapsulation residue and simplify the detection and repair process.

[0005] On the one hand, embodiments of the present invention provide a display substrate, including:

[0006] A driving backplane, the driving backplane includes a plurality of pixel regions, and the pixel region includes a first pad and a second pad;

[0007] A light-emitting diode located in the pixel region, the light-emitting diode is electrically connected to the first pad, and in the direction perpendicular to the plane where the driving backplane is located, the light-emitting diode overlaps with the first pad and the second pad respectively.

[0008] On the other hand, embodiments of the present invention provide a detection and repair method for a display substrate, which is applied to the above display substrate, wherein the pixel region of the display substrate includes a conventional bonding region and a spare bonding region;

[0009] The detection and repair method includes:

[0010] Detect the light-emitting state of the light-emitting diodes bonded in the conventional bonding region. If it is detected that at least one of the light-emitting diodes does not emit light, remove the non-light-emitting light-emitting diodes, and then re-bond spare light-emitting diodes in the spare bonding region of the pixel region where the removed light-emitting diodes are located.

[0011] On the other hand, an embodiment of the present invention provides a display device, including the above-mentioned display substrate.

[0012] One of the above technical solutions has the following beneficial effects:

[0013] Compared with traditional light-emitting diodes, an embodiment of the present invention provides a light-emitting diode with a larger size. The coverage area of this kind of light-emitting diode is larger. After the light-emitting diode is bonded to the first pad, in addition to overlapping with the first pad to which it is bonded, the light-emitting diode also overlaps with the second pad that is not bonded to it. Exemplarily, when the light-emitting diode is the initially transferred light-emitting diode in a large quantity, the light-emitting diode simultaneously blocks the spare pads in the pixel area where it is located. When the light-emitting diode is a spare light-emitting diode re-bonded later, the light-emitting diode simultaneously blocks the conventional pads in the pixel area where it is located. In this way, after the bonding of the light-emitting diodes is completed, all the pads in the driving backplane are blocked by the light-emitting diodes. Then, when encapsulating the light-emitting diodes later, the reflection of ultraviolet light by the pads can be greatly reduced, thereby effectively solving the problem of encapsulation residue and improving the encapsulation effect.

[0014] In addition, when using the structure provided by the embodiment of the present invention to detect and repair the display substrate, when it is detected that some of the light-emitting diodes transferred in a large quantity cannot emit light normally, after removing these light-emitting diodes, the spare pads can be directly exposed. Then, the spare light-emitting diodes can be directly bonded to the spare pads later. Compared with the method of setting an anti-reflection layer in the prior art, the embodiment of the present invention simplifies the repair process, improves the bonding reliability of the spare light-emitting diodes, and thus improves the repair yield of the display substrate.

Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a top view of a display panel in the prior art;

[0017] Figure 2 It is a bonding schematic diagram of a light-emitting diode in the prior art;

[0018] Figure 3 It is a structural schematic diagram of an anti-reflection layer in the prior art;

[0019] Figure 4 It is a top view of a display substrate provided by an embodiment of the present invention;

[0020] Figure 5 A schematic structural diagram of a light-emitting diode provided by an embodiment of the present invention;

[0021] Figure 6 A partial schematic diagram of a display substrate provided by an embodiment of the present invention;

[0022] Figure 7 Another schematic structural diagram of a light-emitting diode provided by an embodiment of the present invention;

[0023] Figure 8 Still another schematic structural diagram of a light-emitting diode provided by an embodiment of the present invention;

[0024] Figure 9 A schematic diagram of the thickness of a substrate provided by an embodiment of the present invention;

[0025] Figure 10 Yet another schematic structural diagram of a light-emitting diode provided by an embodiment of the present invention;

[0026] Figure 11 Yet another schematic structural diagram of a light-emitting diode provided by an embodiment of the present invention;

[0027] Figure 12 A schematic diagram of the arrangement of pads provided by an embodiment of the present invention;

[0028] Figure 13 A schematic diagram of the arrangement of pads provided by an embodiment of the present invention;

[0029] Figure 14 A schematic structural diagram of a display device provided by an embodiment of the present invention.

Detailed implementation manners

[0030] In order to better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] It should be clear that the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0032] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms of "a", "the" and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0033] It should be understood that the term "and / or" used herein is merely a description of the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this text generally indicates that the associated objects before and after are in an "or" relationship.

[0034] As described in the background art, there is a problem of encapsulation residue in the existing display substrate due to the setting of spare spacers. As Figure 1 and Figure 2 shown, Figure 1 FIG. is a top view of a display panel in the prior art, Figure 2 FIG. is a bonding schematic diagram of a light-emitting diode in the prior art. The display substrate includes a driving backplane 101 and a light-emitting diode 102 bonded to one side of the driving backplane 101. Among them, the driving backplane 101 includes a conventional spacer 103 and a spare spacer 104. After the light-emitting diodes 102 are transferred in large quantities onto the driving backplane 101, the electrodes of the light-emitting diodes 102 are bonded to the conventional spacer 103 together.

[0035] To improve the product yield, before the display substrate leaves the factory, it is usually necessary to detect the light-emitting situation of the light-emitting diodes 102. When it is detected that some of the light-emitting diodes 102 cannot emit light normally, these light-emitting diodes 102 are removed from the driving backplane 101, and then new spare light-emitting diodes 102 are bonded onto the spare spacer 104.

[0036] After the display substrate is detected and repaired, based on some performance requirements, a thin film encapsulation is often made on one side of the light-emitting diodes 102 finally bonded to the driving backplane 101 to protect the light-emitting diodes 102 and extend their service life. However, since a large number of spare spacers 104 that are not bonded to the light-emitting diodes 102 will remain on the driving backplane 101, and the spacers are mostly formed of metal materials, then, during the subsequent encapsulation of the light-emitting diodes 102, referring to Figure 2 , during the exposure process, the exposed part of the spare spacer 104 will reflect ultraviolet light to the surrounding area, causing the surrounding negative photoresist to be illuminated and undergo a crosslinking reaction, and then remaining during development. In this way, obvious encapsulation residues will appear around the spare spacer 104 subsequently, affecting the encapsulation performance.

[0037] To solve the problem of encapsulation residue, a solution has been proposed in the prior art:

[0038] As Figure 3 shown, Figure 3FIG. 0 is a schematic structural diagram of an anti-reflection layer in the prior art. In the existing solution, an anti-reflection layer 105 can be covered on the spare gasket 104, and the anti-reflection layer 105 is used to reduce the reflection of ultraviolet light by the spare gasket 104. However, with this design, if it is detected that some light-emitting diodes 102 cannot emit light normally, when a spare light-emitting diode 102 needs to be bonded to the spare gasket 104, the anti-reflection layer 105 on this part of the spare gasket 104 also needs to be irradiated or heated to decompose this part of the anti-reflection layer 105, so as to expose the spare gasket 104 to achieve bonding with the spare light-emitting diode 102.

[0039] In this way, on the one hand, an additional irradiation or heating process needs to be added to the detection process of the display panel, and the process is relatively cumbersome. Moreover, if the anti-reflection layer 105 is not completely decomposed, it will also affect the connection reliability between the spare light-emitting diode 102 and the spare gasket 104; on the other hand, after the spare light-emitting diode 102 is re-bonded to the spare gasket 104 subsequently, the conventional gasket 103 originally bonded to the removed light-emitting diode 102 will still be exposed, and there is no film layer covering the upper part of this part of the conventional gasket 103, which will also reflect ultraviolet light during the encapsulation process, resulting in obvious encapsulation residues around this part of the conventional gasket 103.

[0040] In view of this, the present invention provides a display substrate. In this display substrate, the problem of encapsulation residue can be effectively improved without setting an anti-reflection layer.

[0041] As Figure 4 and Figure 5 shown, Figure 4 FIG. 15 is a top view of a display substrate provided by an embodiment of the present invention. Figure 5 FIG. 17 is a schematic structural diagram of a light-emitting diode provided by an embodiment of the present invention. The display substrate includes a driving backplane 1 and a light-emitting diode 2 bonded to the driving backplane 1. The light-emitting diode 2 can specifically be a mini LED or a Micro LED.

[0042] Among them, the driving backplane 1 includes a plurality of pixel regions 3, and the pixel region 3 includes a first gasket 4 and a second gasket 5. The light-emitting diode 2 is located in the pixel region 3, the light-emitting diode 2 is electrically connected to the first gasket 4, and in the direction perpendicular to the plane where the driving backplane 1 is located, the light-emitting diode 2 overlaps with the first gasket 4 and the second gasket 5 respectively.

[0043] It should be noted that referring to Figure 4 and Figure 5, the light-emitting diode 2 includes an electrode 6. The electrode 6 in the light-emitting diode 2 is electrically connected to the first pad 4 to bond the light-emitting diode 2 to the driving backplane 1. Among them, the above-mentioned first pad 4 and the second pad 5 can be formed by a eutectic layer, and the material can include an Au-In alloy.

[0044] It should be emphasized that in the embodiments of the present invention, refer to Figure 4 and Figure 5 , the pads provided on the driving backplane 1 include a conventional pad 7 and a spare pad 8. Among them, the conventional pad 7 is a pad used to bind the light-emitting diodes 2 transferred in a large amount, and the spare pad 8 is a pad used to bind the spare light-emitting diodes 2 when the display substrate is detected and repaired subsequently. That is to say, in the final display substrate structure, if a certain light-emitting diode 2 is the light-emitting diode 2 transferred in a large amount initially, then the first pad 4 electrically connected to it is the conventional pad 7. Correspondingly, the second pad 5 in the pixel region 3 where the light-emitting diode 2 is located is the spare pad 8. If a certain light-emitting diode 2 is a spare light-emitting diode 2 re-bonded subsequently, then the first pad 4 electrically connected to it is the spare pad 8. Correspondingly, the first pad 4 in the pixel region 3 where the light-emitting diode 2 is located is the conventional pad 7.

[0045] Compared with the traditional light-emitting diode 2, the embodiments of the present invention provide a light-emitting diode 2 with a larger size. After the light-emitting diode 2 is bonded to the first pad 4, in addition to overlapping with the first pad 4 to which it is bonded itself, the light-emitting diode 2 also overlaps with the second pad 5 that is not bonded to it. Exemplarily, when the light-emitting diode 2 is the light-emitting diode 2 transferred in a large amount initially, after the light-emitting diode 2 is bonded to the conventional pad 7, it will also simultaneously block the spare pad 8 in the pixel region 3 where it is located; when the light-emitting diode 2 is a spare light-emitting diode 2 re-bonded subsequently, after the light-emitting diode 2 is bonded to the spare pad 8, it will also simultaneously block the conventional pad 7 in the pixel region 3 where it is located. In this way, after the bonding of the light-emitting diodes 2 is completed, all the pads in the driving backplane 1 are blocked by the light-emitting diodes 2. Then, when encapsulating the light-emitting diodes 2 subsequently, the reflection of ultraviolet light by the pads can be greatly reduced, thereby effectively solving the problem of encapsulation residue and improving the encapsulation effect.

[0046] In addition, adopting the structure provided by the embodiments of the present invention, when the display substrate is detected and repaired, when it is detected that some of the light-emitting diodes 2 transferred in a large amount cannot emit light normally, after removing these light-emitting diodes 2, the spare pad 8 can be directly exposed, and then the spare light-emitting diodes 2 can be directly bonded to the spare pad 8 subsequently. Compared with the method of setting an anti-reflection layer in the prior art, the embodiments of the present invention simplify the repair process, improve the bonding reliability of the spare light-emitting diodes 2, and thus improve the repair yield of the display substrate.

[0047] In a feasible implementation, referring to Figure 4 and Figure 5 , in the direction of the plane where the vertical driving backplane 1 is located, the light-emitting diode 2 can cover the second gasket 5, so that the light-emitting diode 2 can block the second gasket 5 to a greater extent, further avoiding the reflection of ultraviolet light by the second gasket 5.

[0048] In a feasible implementation, as Figure 6 shown, Figure 6 is a partial schematic diagram of a display substrate provided by an embodiment of the present invention. The pixel region 3 includes a conventional bonding region 9 and a spare bonding region 10.

[0049] The light-emitting diode 2 includes a first light-emitting diode 11, and a first gasket 4 electrically connected to the first light-emitting diode 11 is located in the conventional bonding region 9; and / or, the light-emitting diode 2 includes a second light-emitting diode 12, and a first gasket 4 electrically connected to the second light-emitting diode 12 is located in the spare bonding region 10.

[0050] Combined with the above description, the conventional bonding region 9 refers to the region for setting the conventional gasket 7, and the spare bonding region 10 refers to the region for setting the spare gasket 8. When the first gasket 4 electrically connected to the first light-emitting diode 11 is located in the conventional bonding region 9, the first gasket 4 bonded to the first light-emitting diode 11 is the conventional gasket 7. At this time, the first light-emitting diode 11 is the light-emitting diode 2 transferred in a large amount. When the first gasket 4 electrically connected to the second light-emitting diode 12 is located in the spare bonding region 10, the second gasket 5 bonded to the second light-emitting diode 12 is the spare gasket 8. At this time, the second light-emitting diode 12 is the spare light-emitting diode 2 rebonded later. Regardless of the type of the light-emitting diode 2 being the above-mentioned type, after bonding it to the driving backplane 1, it can still block all the gaskets in the pixel region 3 where it is located, thus effectively improving the problem of packaging residue caused by partial exposure of some gaskets.

[0051] In a feasible implementation, as Figure 7 shown, Figure 7 is another structural schematic diagram of the light-emitting diode 2 provided by an embodiment of the present invention. The light-emitting diode 2 includes a first light-shielding layer 13. In the direction of the plane where the vertical driving backplane 1 is located, the first light-shielding layer 13 overlaps with the second gasket 5. Among them, the material of the first light-shielding layer 13 may include manganese iron, iron oxide, black polyimide, carbon black, black carbon nanotubes or black organic materials. The thickness of the first light-shielding layer 13 can be between 0.01 μm and 2 μm.

[0052] Based on the above structure, the first light-shielding layer 13 with better light-blocking performance can be used to more effectively block the second gasket 5, thereby further avoiding the reflection of ultraviolet light by the second gasket 5 to a greater extent.

[0053] It should be noted that since the first light-shielding layer 13 belongs to the light-emitting diode 2, when the display substrate is detected and repaired, if the light-emitting diode 2 that cannot emit light normally needs to be removed, the first light-shielding layer 13 will be removed accordingly. At this time, the spare pads 8 in the pixel region 3 where this part of the light-emitting diodes 2 are located can still be completely exposed.

[0054] Furthermore, referring again to Figure 7 , the light-emitting diode 2 further includes a light-emitting body 14. In the direction perpendicular to the plane of the vertical driving backplane 1, the light-emitting body 14 overlaps with the first pad 4 and the second pad 5 respectively. The first light-shielding layer 13 is located on the side of the light-emitting body 14 facing the second pad 5. At this time, the first light-shielding layer 13 is close to the second pad 5, and the shielding effect on the second pad 5 is better. Moreover, when the first light-shielding layer 13 is located on the side of the light-emitting body 14 facing the second pad 5, in the manufacturing process of the light-emitting diode 2, the first light-shielding layer 13 can be formed last, thus not affecting the original process flow of the light-emitting body 14.

[0055] Furthermore, referring again to Figure 7 , in the direction perpendicular to the plane of the vertical driving backplane 1, and the first light-shielding layer 13 covers the second pad 5. The distance between the edge of the orthographic projection of the first light-shielding layer 13 and the edge of the orthographic projection of the second pad 5 is d, where 0 ≤ d ≤ 10 μm, to ensure that the first light-shielding layer 13 can completely cover the second pad 5.

[0056] In a feasible implementation manner, as Figure 8 shown, Figure 8 is another schematic structural diagram of the light-emitting diode 2 provided by the embodiment of the present invention. The light-emitting diode 2 includes a substrate 15, for example, it can be a sapphire substrate. In the direction perpendicular to the plane of the vertical driving backplane 1, the substrate 15 overlaps with the first pad 4 and the second pad 5 respectively.

[0057] In this implementation manner, the light-emitting diode 2 reduces the reflection of ultraviolet light by the second pad 5 by expanding the substrate 15 and using the substrate 15 to shield the second pad 5.

[0058] Furthermore, as Figure 9 shown, Figure 9A thickness schematic diagram of the substrate 15 provided by an embodiment of the present invention. The substrate 15 includes a first substrate portion 16 overlapping with the first gasket 4 and a second substrate portion 17 overlapping with the second gasket 5. In the direction perpendicular to the plane of the vertical driving backplane 1, the thickness of the second substrate portion 17 is greater than that of the first substrate portion 16. Exemplarily, when the overall thickness of the light-emitting diode 2 is between 6 μm and 10 μm, the thickness of the first substrate portion 16 can be between 4 μm and 8 μm, and the thickness of the second substrate portion 17 can be 0 to 2 μm greater than that of the first substrate portion 16.

[0059] With such a setting, the distance between the substrate 15 and the second gasket 5 can be reduced, improving the shielding effect of the light-emitting diode 2 on the second gasket 5. Moreover, when the display substrate is subjected to an external force, it can also prevent the light-emitting diode 2 from tilting too much towards the second gasket 5, improving the stability of the light-emitting diode 2, and further improving its bonding reliability.

[0060] It should be noted that based on the above structure, in the process of manufacturing the light-emitting diode 2, the part of the substrate 15 overlapping with the first gasket 4 can be thinned so that the thickness of the first substrate portion 16 is less than that of the second substrate portion 17.

[0061] Or, in another feasible embodiment, as Figure 10 shown, Figure 10 Another structural schematic diagram of the light-emitting diode 2 provided by an embodiment of the present invention. The light-emitting diode 2 further includes a first epitaxial layer 18 on one side of the substrate 15, a light-emitting layer 19 on the side of the first epitaxial layer 18 facing away from the substrate 15, and a second epitaxial layer 20 on the side of the light-emitting layer 19 facing away from the first epitaxial layer 18. Among them, the first epitaxial layer 18 can be an n-GaN layer, the second epitaxial layer 20 can be a p-GaN layer, and the electrodes 6 in the light-emitting diode 2 include a first electrode 21 and a second electrode 22. The first electrode 21 is electrically connected to the first epitaxial layer 18, and the second electrode 22 is electrically connected to the second epitaxial layer 20. Further, to improve the connection reliability, the first electrode 21 is electrically connected to the first epitaxial layer 18 through an auxiliary connection portion 23, and the second electrode 22 is electrically connected to the second epitaxial layer 20 through the auxiliary connection portion 23. In addition, an inorganic layer 30 for protection can also be covered on the side of the second epitaxial layer 20 facing away from the light-emitting layer 19, and the first electrode 21 and the second electrode 22 are electrically connected to the auxiliary connection portion 23 through vias penetrating the inorganic layer 30.

[0062] In the direction perpendicular to the plane of the vertical driving backplane 1, both the first epitaxial layer 18 and the second epitaxial layer 20 overlap with the first gasket 4 and the second gasket 5, and the light-emitting layer 19 overlaps with the first gasket 4.

[0063] In this setting method, since the light-emitting layer 19 only overlaps with the first spacer 4, the light-emitting diode 2 only emits light in the part overlapping with the first spacer 4 and does not emit light in the part overlapping with the second spacer 5. In this structure, the first epitaxial layer 18 and the second epitaxial layer 20 also extend to the position where the substrate 15 overlaps with the second spacer 5. At this time, the first epitaxial layer 18 and the second epitaxial layer 20 can also block the second spacer 5 and improve the blocking effect. Moreover, this setting method can use the first epitaxial layer 18 and the second epitaxial layer 20 to increase the film thickness of the part of the light-emitting diode 2 overlapping with the second spacer 5. While avoiding the skew of the light-emitting diode 2 towards the second spacer 5, the thickness difference between the first substrate part 16 and the second substrate part 17 in the substrate 15 can be reduced, the thinning difficulty can be lowered, and even the substrate 15 does not need to be thinned.

[0064] Or, in another feasible embodiment, as Figure 11 shown, Figure 11 FIG. is another schematic structural diagram of the light-emitting diode 2 provided by the embodiment of the present invention. The light-emitting diode 2 further includes a first epitaxial layer 18 on one side of the substrate 15, a light-emitting layer 19 on the side of the first epitaxial layer 18 facing away from the substrate 15, and a second epitaxial layer 20 on the side of the light-emitting layer 19 facing away from the first epitaxial layer 18. In the direction perpendicular to the plane of the vertical driving backplane 1, the first epitaxial layer 18, the light-emitting layer 19, and the second epitaxial layer 20 all overlap with the first spacer 4 and the second spacer 5.

[0065] At this time, the light-emitting diode 2 further includes a second light-shielding layer 24. The second light-shielding layer 24 is located on the side of the substrate 15 facing away from the second spacer 5. In the direction perpendicular to the plane of the vertical driving backplane 1, the second light-shielding layer 24 overlaps with the second spacer 5. Among them, the material of the second light-shielding layer 24 may include manganese iron, iron oxide, black polyimide, carbon black, black carbon nanotubes, or black organic materials.

[0066] In this structure, the first epitaxial layer 18, the light-emitting layer 19, and the second epitaxial layer 20 all extend to the position where the substrate 15 overlaps with the second spacer 5, and then more film layers are used to block the second spacer 5. Moreover, by providing the second light-shielding layer 24 overlapping with the second spacer 5 on the side of the substrate 15 facing away from the second spacer 5, the second light-shielding layer 24 can be used to block the light emitted by the light-emitting layer 19 at the position of the second spacer 5, avoiding affecting the light-emitting area of the light-emitting diode 2 and keeping it consistent with the original light-emitting area.

[0067] In a feasible embodiment, as Figure 12 shown, Figure 12It is a schematic diagram of an arrangement of pads provided by an embodiment of the present invention. The pixel region 3 includes a group of first pads 4 and a group of second pads 5, and the group of first pads 4 and the group of second pads 5 are arranged in a first direction. Specifically, the group of first pads 4 includes a first positive pad 25 and a first negative pad 26, and the group of second pads 5 includes a second positive pad 27 and a second negative pad 28. Among them, the first positive pad 25 and the second positive pad 27 are used to be electrically connected to the first electrode 21 in the light-emitting diode 2, and the first negative pad 26 and the second negative pad 28 are used to be electrically connected to the second electrode 22 in the light-emitting diode 2.

[0068] Based on this arrangement method, when the light-emitting diode 2 is bonded to the first pad 4, the risk of the electrode 6 of the light-emitting diode 2 coming into contact with the second pad 5 can be reduced, and the bonding reliability can be improved.

[0069] Or, in another feasible embodiment, as Figure 13 shown, Figure 13 It is a schematic diagram of an arrangement of pads provided by an embodiment of the present invention. The pixel region 3 includes a group of first pads 4 and a group of second pads 5. The group of first pads 4 includes a first positive pad 25 and a first negative pad 26, and the group of second pads 5 includes a second positive pad 27 and a second negative pad 28. The connection line between the first positive pad 25 and the first negative pad 26 intersects with the connection line between the second positive pad 27 and the second negative pad 28.

[0070] In this arrangement method, the first positive pad 25 and the first negative pad 26 in the first pad 4 and the second positive pad 27 and the second negative pad 28 in the second pad 5 are cross-arranged. Correspondingly, the first electrode 21 and the second electrode 22 in the light-emitting diode 2 are arranged along the diagonal direction of the light-emitting diode 2. It can be understood that the distance between the first electrode 21 and the second electrode 22 in the light-emitting diode 2 will restrict the design size of the light-emitting diode 2. And in this structure, the distance between the first electrode 21 and the second electrode 22 can be set smaller, and thus the overall design size of the light-emitting diode 2 can be effectively reduced. For example, compared with the Figure 12 shown arrangement method, the side length of the light-emitting diode 2 can be reduced by less than 10% in this setting method, and the overall area of the light-emitting diode 2 can be reduced by less than 20%.

[0071] Moreover, when the first electrode 21 and the second electrode 22 in the light-emitting diode 2 are arranged along the diagonal direction of the light-emitting diode 2, after the light-emitting diode 2 is bonded to the first pad 4, the light-emitting diode 2 has higher stability and is not prone to skew.

[0072] Based on the same inventive concept, combined with Figures 4 to 6, the present invention also provides a detection and repair method for a display substrate, which is applied to the above display substrate. Wherein, the pixel region 3 of the display substrate includes a conventional bonding region 9 and a spare bonding region 10.

[0073] The detection and repair method includes: detecting the light-emitting state of the light-emitting diodes 2 bonded in the conventional bonding region 9. If it is detected that at least one light-emitting diode 2 does not emit light, the non-light-emitting light-emitting diodes 2 are removed, and then spare light-emitting diodes 2 are re-bonded in the spare bonding region 10 in the pixel region 3 where the removed light-emitting diodes 2 are located.

[0074] It should be noted that, due to the large coverage area of the light-emitting diodes 2 in the embodiments of the present invention, therefore, whether it is the light-emitting diodes 2 initially transferred in large quantities or the subsequent spare light-emitting diodes 2 re-bonded, in addition to overlapping with the pads to which they are themselves bonded, they will also overlap with the pads in the pixel region 3 that are not bonded to them, thereby blocking the pads that do not have light-emitting diodes 2 bonded. When encapsulating the light-emitting diodes 2 subsequently, this part of the pads can be effectively prevented from reflecting ultraviolet light, thereby avoiding encapsulation residues.

[0075] When using the detection and repair method provided by the embodiments of the present invention to detect and repair the display substrate, when it is detected that some of the light-emitting diodes 2 transferred in large quantities cannot emit light normally, after removing these light-emitting diodes 2, the spare pads 8 can be directly exposed, and then the spare light-emitting diodes 2 can be directly bonded to the spare pads 8 subsequently. Compared with the prior art, the repair process can be simplified, and the bonding reliability of the spare light-emitting diodes 2 can be improved.

[0076] Based on the same inventive concept, the embodiments of the present invention also provide a display device, such as Figure 14 shown, Figure 14 is a schematic structural diagram of the display device provided by the embodiments of the present invention. The display device includes the above display substrate 100. The specific structure of the display substrate 100 has been described in detail in the above embodiments and will not be repeated here. Of course, Figure 14 the display device shown is only for illustrative purposes, and the display device can be any electronic device with a display function, such as a mobile phone, a tablet computer, a laptop computer, an e-book reader, or a television.

[0077] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the scope of protection of the present invention.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display substrate, characterized in that, Comprising: A driving backplane, the driving backplane includes a plurality of pixel regions, and the pixel region includes a first pad and a second pad; A light-emitting diode located in the pixel region, the light-emitting diode is electrically connected to the first pad, and in a direction perpendicular to the plane where the driving backplane is located, the light-emitting diode overlaps with the first pad and the second pad respectively; The pixel region includes a regular bonding region and a spare bonding region; The light-emitting diode includes a first light-emitting diode, the first pad electrically connected to the first light-emitting diode is a regular pad and is located in the regular bonding region, and the second pad overlapping with the first light-emitting diode is a spare pad and is located in the spare bonding region; And / or, the light-emitting diode includes a second light-emitting diode, the first pad electrically connected to the second light-emitting diode is the spare pad and is located in the spare bonding region, and the second pad overlapping with the second light-emitting diode is the regular pad and is located in the regular bonding region.

2. The display substrate according to claim 1, wherein In a direction perpendicular to the plane where the driving backplane is located, the light-emitting diode covers the second pad.

3. The display substrate according to claim 1, wherein The light-emitting diode includes a first light-shielding layer, and in a direction perpendicular to the plane where the driving backplane is located, the first light-shielding layer overlaps with the second pad.

4. The display substrate according to claim 3, wherein The light-emitting diode further includes a light-emitting body, and in a direction perpendicular to the plane where the driving backplane is located, the light-emitting body overlaps with the first pad and the second pad respectively; The first light-shielding layer is located on a side of the light-emitting body facing the second pad.

5. The display substrate according to claim 3, wherein In a direction perpendicular to the plane where the driving backplane is located, the first light-shielding layer covers the second pad, and the distance between the edge of the orthographic projection of the first light-shielding layer and the edge of the orthographic projection of the second pad is d, 0≤d≤10μm.

6. The display substrate according to claim 1, wherein The light-emitting diode includes a substrate; In a direction perpendicular to the plane where the driving backplane is located, the substrate overlaps with the first pad and the second pad respectively.

7. The display substrate according to claim 6, wherein The substrate includes a first substrate bottom overlapping with the first pad and a second substrate bottom overlapping with the second pad, and in a direction perpendicular to the plane where the driving backplane is located, the thickness of the second substrate bottom is greater than the thickness of the first substrate bottom.

8. The display substrate according to claim 6, wherein The light-emitting diode further includes a first epitaxial layer on one side of the substrate, a light-emitting layer on a side of the first epitaxial layer facing away from the substrate, and a second epitaxial layer on a side of the light-emitting layer facing away from the first epitaxial layer; In a direction perpendicular to the plane where the driving backplane is located, both the first epitaxial layer and the second epitaxial layer overlap with the first pad and the second pad, and the light-emitting layer overlaps with the first pad.

9. The display substrate according to claim 6, wherein the light-emitting diode further includes a first epitaxial layer on one side of the substrate, a light-emitting layer on the side of the first epitaxial layer facing away from the substrate, and a second epitaxial layer on the side of the light-emitting layer facing away from the first epitaxial layer; in a direction perpendicular to the plane of the driving backplane, the first epitaxial layer, the light-emitting layer, and the second epitaxial layer all overlap with the first pad and the second pad; the light-emitting diode further includes a second light-shielding layer, the second light-shielding layer is located on the side of the substrate facing away from the second pad, and in a direction perpendicular to the plane of the driving backplane, the second light-shielding layer overlaps with the second pad.

10. The display substrate according to claim 1, wherein the pixel region includes a set of the first pads and a set of the second pads, and the set of the first pads and the set of the second pads are arranged along a first direction.

11. The display substrate according to claim 1, wherein the pixel region includes a set of the first pads and a set of the second pads, the set of the first pads includes a first positive pad and a first negative pad, and the set of the second pads includes a second positive pad and a second negative pad; a line connecting the first positive pad and the first negative pad intersects a line connecting the second positive pad and the second negative pad.

12. A method for detecting and repairing a display substrate, characterized in that, Applied to the display substrate according to claim 1, wherein the pixel region of the display substrate includes a conventional bonding region and a spare bonding region; the detection and repair method includes: detecting the light-emitting state of the light-emitting diodes bonded in the conventional bonding region, if it is detected that at least one of the light-emitting diodes does not emit light, then removing the non-light-emitting light-emitting diodes, and then re-bonding spare light-emitting diodes in the spare bonding region of the pixel region where the removed light-emitting diodes are located.

13. A display device, characterized in that, Including the display substrate according to any one of claims 1 to 11.

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