Device for supporting MEMS and / or ASIC components

Abstract

The present invention relates to a device comprising at least one MEMS or ASIC component, the device comprising a first layer (3, 14, 114) and MEMS and / or ASIC components (9, 18, 118) on the first layer, and a second layer (15, 26, 126) disposed on or above the first layer, the second layer comprising cavities (21, 28, 128) for receiving the MEMS and / or ASIC components. The second layer further comprises at least one feedthrough (23, 30, 130) for transmitting electrical signals and / or electromagnetic signals and / or fluid and / or force.

Description

Technical Field

[0001] The present invention relates to a device for supporting microelectromechanical systems (MEMS) and / or application-specific integrated circuit (ASIC) components, and an array of such devices. Background Technology

[0002] MEMS can include pressure sensors, temperature sensors, accelerometers (variable capacitance or piezoresistive), force sensors, magnetic field sensors, etc.

[0003] To process the sensor signals captured by MEMS, MEMS sensors are typically connected to application-specific integrated circuits (ASICs). These ASICs are used for signal conditioning, converting the MEMS's analog signals into digital or analog signal outputs. The digital or analog signal outputs usually include sensor compensation associated with calibration data, which is acquired during the calibration process and stored in the ASIC.

[0004] As described in EP 3 309 826 A1, a cavity is formed within a ceramic substrate to enclose a MEMS component, thereby providing a gel-free device and allowing for a reduced device footprint. In practice, when using ceramic as the substrate, thinner walls can be used for the cavity and / or lid. The ceramic lid is bonded to the substrate to protect the MEMS component.

[0005] However, the cavity formed in the isolated ceramic substrate requires wire bonding connections to electrically connect the MEMS components to other elements of the device. Summary of the Invention

[0006] Therefore, one object of the present invention is to provide an apparatus comprising MEMS and / or (a plurality of) ASIC components that allows for simplified electrical connections of at least one MEMS or ASIC component.

[0007] The device is a device that includes at least one MEMS or ASIC component. The device includes a first layer and the MEMS and / or ASIC components on the first layer, and a second layer disposed on or above the first layer. The second layer includes a cavity for receiving the MEMS and / or ASIC components. The second layer also includes at least one feedthrough for transmitting electrical signals and / or electromagnetic signals and / or fluid and / or force.

[0008] Compared to existing technologies that use wires for electrical and / or electromagnetic signals and do not include devices for fluid or force transmission, the at least one feedthrough, which is different from the cavity, provides a simpler solution for the transmission of electrical and / or electromagnetic signals, fluid or force.

[0009] Furthermore, the second layer can therefore be provided with additional functions, that is, not only to allow protection of MEMS and / or ASIC components, but also to allow the transmission of signals or fluids or even forces through the at least one feedthrough.

[0010] Therefore, by using the feedthrough for electrical connection according to the present invention, the assembly of MEMS and / or ASIC components can be simplified. Thus, the feedthrough provided in the second layer can reduce wire or cable tangling.

[0011] The device can be further improved according to various advantageous embodiments.

[0012] According to one embodiment, the surface of the at least one feedthrough may be at least partially covered by a layer of conductive material, or the at least one feedthrough may be filled with conductive material.

[0013] Therefore, the at least one feedthrough is suitable for the transmission of electrical and / or electromagnetic signals. It allows electrical continuity to be maintained over the entire length of the feedthrough.

[0014] According to one embodiment, the surface of the second layer facing the first layer and / or the surface of the second layer opposite to the surface facing the first layer may include conductive traces.

[0015] Conductive traces can be formed from printed circuit patterns or printed dielectric material patterns. It allows electrical functionality to be provided to at least one surface of the second layer.

[0016] According to one embodiment, additional MEMS components and / or ASIC components may be disposed on or above the second layer, particularly on or above the surface of the second layer opposite to the surface facing the first layer, and the additional MEMS components and / or ASIC components of the second layer may be connected to the first layer via the at least one feedthrough electrical connection and / or fluid connection.

[0017] Therefore, the at least one feedthrough of the second layer provides a simplified solution for electrically and / or fluidly connecting additional MEMS or ASIC components of the second layer to the first layer.

[0018] For example, due to the at least one feedthrough that allows electrical connection, it is possible to avoid using wires for electrical connections of other MEMS or ASIC components in the second layer.

[0019] According to one embodiment, the MEMS components and / or ASIC components of the first layer can be electrically connected to additional MEMS components and / or additional ASIC components of the second layer via the at least one feedthrough and conductive trace.

[0020] Conductive traces can be formed from printed circuit patterns or printed dielectric material patterns.

[0021] This allows for the avoidance of multi-lead connections that could lead to wire tangling. Therefore, the electrical connections of MEMS components and / or ASIC components are simplified due to the at least one feedthrough and conductive trace.

[0022] According to one embodiment, the first layer may include at least one feedthrough, particularly arranged such that it is aligned with at least one feedthrough in the second layer.

[0023] Therefore, the aligned feedthroughs in the first and second layers allow for easy passage through any medium (e.g., liquid, gas, or solid material) and transmission to MEMS and / or ASIC components.

[0024] For example, two feedthroughs can be adapted to receive solid pins to transmit force to a MEMS component acting as a pressure sensor.

[0025] According to one embodiment, the device may further include at least one additional MEMS component and / or ASIC component disposed on or above the third layer, wherein the third layer is arranged such that the third layer and the first layer sandwich the second layer, and wherein the additional MEMS component and / or ASIC component of the third layer is electrically and / or fluidly connected to the first layer via the at least one feedthrough in the second layer.

[0026] Therefore, the second layer acts as an intermediate layer or spacer between the first and third layers. Thus, the second layer, including at least one feedthrough, provides a simplified solution for electrically and / or fluidly connecting additional MEMS or ASIC components of the second layer to the first layer.

[0027] According to one embodiment, the at least one additional MEMS component and / or ASIC component may be disposed on the surface of the third layer facing the second layer, and the second layer may include a cavity for receiving the additional MEMS component and / or additional ASIC component of the third layer.

[0028] Therefore, MEMS components and / or ASIC components can be placed on opposite and facing layers of the device, thereby improving the device's compactness by reducing its volume and thus its footprint.

[0029] The presence of at least one feedthrough in the second layer, different from the first and second cavities, allows for the avoidance of the need to bond all component leads to the same layer. Therefore, the electrical connections are simplified by providing electrical connections between the first and third layers through this at least one feedthrough.

[0030] In addition, the third layer provides a cover for the device, thereby protecting MEMS and / or ASIC components from harsh environments.

[0031] According to one embodiment, the at least one additional MEMS component and / or additional ASIC component of the third layer and the first MEMS component and / or ASIC component of the first layer may be disposed in the same cavity in the second layer, which thereby extends through the second layer.

[0032] By receiving the MEMS and / or ASIC components of the first layer and the additional MEMS or ASIC components of the third layer into a common cavity in the second layer, the footprint of the device can be further reduced.

[0033] According to one embodiment, the third layer may further include at least one feedthrough aligned with at least one of the at least one feedthrough in the second layer.

[0034] Therefore, aligned feedthroughs in the second and third layers can easily pass through any medium (e.g., liquid, gas, or solid material) and transmit it to MEMS components and / or ASIC components.

[0035] For example, two feedthroughs can be adapted to receive solid pins to transmit force to a MEMS component acting as a pressure sensor.

[0036] According to one embodiment, the second layer may be formed of an electrically insulating material, particularly of ceramic.

[0037] Due to the material properties of ceramics, the wall thickness of the cavity forming the second layer can be advantageously reduced. Furthermore, ceramic cavity arrays can be manufactured with high precision and can be processed and further manufactured in a simple manner.

[0038] According to one embodiment, the device may include additional MEMS components and / or additional ASIC components disposed on or above MEMS components and / or ASIC components in a first layer, the MEMS components and / or ASIC components in the first layer being electrically connected to the first layer, and the additional MEMS components and / or additional ASIC components being electrically connected to a second layer.

[0039] Stacking MEMS components on top of ASIC components allows for signal conditioning and converts the analog signals from the MEMS into digital or analog signal outputs.

[0040] According to one embodiment, the first and second layers and / or the second and third layers can be attached to each other by an adhesive, particularly a release adhesive.

[0041] Therefore, the device can be implemented using a simple, cost-effective, and well-known manufacturing process.

[0042] According to one embodiment, the electrical connection between the at least one feedthrough of the first and second layers can be provided using conductive adhesive or solder bumps.

[0043] Therefore, the device can be implemented using a simple, cost-effective, and well-known manufacturing process.

[0044] The object of the present invention is also achieved by an array of the above-described devices, wherein at least two devices share the feedthrough of the second layer.

[0045] Therefore, the array can be sliced ​​into individual devices, wherein the slices are made by the at least one feedthrough of the second layer.

[0046] Additional features and advantages will be described with reference to the accompanying drawings. In the description, reference is made to the accompanying drawings, which are intended to illustrate preferred embodiments of the invention. It should be understood that these embodiments do not represent the full scope of the invention.

[0047] The accompanying drawings are incorporated in and form a part of this specification to illustrate several embodiments of the invention. These drawings, together with the specification, serve to explain the principles of the invention. The drawings are for illustrative purposes only, showing preferred and alternative examples of how the invention can be made and used, and should not be construed as limiting the invention to only the embodiments shown and described. Furthermore, several aspects of the embodiments can be formed individually or in different combinations to constitute a solution according to the invention. Therefore, the embodiments described below can be considered individually or in any combination thereof. Attached Figure Description

[0048] As shown in the accompanying drawings, further features and advantages will become apparent from the following more detailed description of various embodiments of the invention, in which the same reference numerals refer to the same elements, and in the drawings:

[0049] Figure 1 A cross-sectional view of the device according to a first embodiment of the present invention is shown;

[0050] Figure 2 A cross-sectional view of the device according to a second embodiment of the present invention is shown;

[0051] Figure 3A A cross-sectional view of the device according to a third embodiment of the present invention is shown;

[0052] Figure 3B A cross-sectional view of a variant of the device according to a third embodiment of the present invention is shown;

[0053] Figure 4 An exploded view of a device array for supporting MEMS and ASIC components according to a fourth embodiment of the present invention is shown;

[0054] Figure 5 A second layer for a device array according to a fourth embodiment of the present invention is shown;

[0055] Figure 6a , 6b Figures 6c illustrate the sequential steps of the manufacturing process of the first layer according to the fourth embodiment of the present invention;

[0056] Figure 7a , 7b Figures 7c illustrate the sequential steps of the manufacturing process of the second layer according to a fourth embodiment of the present invention;

[0057] Figure 8a and 8b The assembly steps of the first and second layers according to the fourth embodiment of the present invention are shown;

[0058] Figure 9a and 9b The assembly steps of the third layer according to the fourth embodiment of the present invention are shown;

[0059] Figure 10a and 10b The cutting steps of the array according to the fourth embodiment of the present invention are shown;

[0060] Figure 11 A cross-sectional view of the device according to a fourth embodiment of the present invention is shown;

[0061] Figure 12 A partial cross-sectional view of the device according to a fifth embodiment of the present invention is shown. Detailed Implementation

[0062] The invention will now be described with reference to the accompanying drawings. Various structures, systems, and apparatuses are depicted schematically in the drawings for purposes of explanation only, and in order not to obscure the disclosure with details well-known to those skilled in the art. However, the drawings are included to illustrate and explain illustrative examples of the disclosure. The words and phrases used herein should be understood and interpreted to have meanings consistent with those understood by those skilled in the art. Specific definitions of terms or phrases, i.e., definitions that differ from their common or customary meanings as understood by those skilled in the art, do not imply consistent use of the terms or phrases herein.

[0063] Figure 1 A cross-sectional view of the device 1 according to a first embodiment of the present invention is shown.

[0064] Device 1 includes at least one MEMS component or ASIC component.

[0065] Device 1 includes a first layer 3, the first layer 3 having a first surface 5 and a second surface 7, the second surface 7 along... Figure 1 The Cartesian coordinate axis X shown is opposite to the first surface 5.

[0066] The first MEMS component or ASIC component 9 is disposed on the first surface 5 of the first layer 3.

[0067] The first layer 3 is a functional layer, such as a substrate, on which conductive traces 11, such as printed circuits 11, MEMS or ASIC components 9 are electrically connected to the conductive traces 11 via wire bonding 13.

[0068] In one variation, the second surface 7 of the first layer 3 may also be provided with conductive traces.

[0069] The device 1 also includes a second layer 15 disposed on or above the first layer 3.

[0070] The second layer 15 has a first surface 17 and a second surface 19, the second surface 19 along... Figure 1 The Cartesian coordinate axis X shown is opposite to the first surface 17.

[0071] The second layer 15 is formed of an electrically insulating material, particularly ceramic.

[0072] The second layer 15 is attached to the first layer 3 by adhesive.

[0073] The second layer 15 includes a cavity 21. The cavity 21 is formed by a recess 21 that extends partially along axis X from the second surface 19 through the second layer 15 toward the first surface 17.

[0074] Cavity 21 receives MEMS or ASIC components 9. The size of cavity 21 is therefore adapted to the size of MEMS or ASIC components 9.

[0075] The second layer 15 also includes a feedthrough 23 extending from the second surface 19 to the first surface 17. The feedthrough 23 extends along... Figure 1 The Cartesian coordinates shown are extended along the X-axis. Feedthrough 23 differs from cavity 21.

[0076] In the first embodiment, the feedthrough 23 is filled with a conductive material 25. Therefore, Figure 1 The feedthrough 23 shown is a through-hole 27. The conductive material 25 is connected to the conductive trace 11 at the interface between the first surface 5 of the first layer 3 and the second layer 19 of the second layer 15.

[0077] Feedthrough 23 thus provides a simplified way to the second layer 15 for electrical connections to MEMS or ASIC components 9.

[0078] In one variant, feedthrough 23 is a hollow tube covered by a layer of conductive material. The hollow feedthrough is suitable for transmitting electrical and / or electromagnetic signals from fluids or forces.

[0079] Figure 2 A cross-sectional view of the apparatus 101 according to a second embodiment of the present invention is shown.

[0080] Already Figure 1 Elements described and shown in the figures with the same reference numerals will not be described in detail again, but will be referred to in the description above.

[0081] like Figure 1 The device 1 shown, device 101, is a device for supporting at least one MEMS component or ASIC component.

[0082] The device 101 according to the second embodiment differs from that of the first embodiment in that an additional MEMS or ASIC component 103 is provided on or above the first surface 17 of the second layer 15. The MEMS or ASIC component 103 is connected to a conductive trace 107 disposed on the first surface 17 of the second layer 15 via a wire bond 105.

[0083] Conductive trace 107 is electrically connected to the conductive material 25 of feedthrough 23. Therefore, feedthrough 23, which is via 27 in the illustrated example, provides a radio connection between the MEMS or ASIC component 103 of the second layer 15 and the first layer 3.

[0084] In a variant where feedthrough 23 is a hollow tube covered by a layer of conductive material, MEMS or ASIC components 103 can be electrically and fluidly connected, or only fluidly connected, to the first layer 15 via feedthrough 23.

[0085] A further difference between the device 101 according to the second embodiment and the first embodiment is that, in addition to the first feed passage 23, the second layer 15 also includes a second feed passage 109, which extends along axis X from the second surface 19 to the first surface 17.

[0086] The second feed passage 109 is different from the cavity 21 of the second layer 15 and the first feed passage 23.

[0087] In the second embodiment, the first layer 3 includes a feedthrough 111 extending along axis X from the first surface 5 to the second surface 7.

[0088] The feedthrough 111 of the first layer 3 and the second feedthrough 109 of the second layer 15 are arranged such that the feedthrough 111 is aligned with the second feedthrough 109 in the second layer 15. Figure 2 In the example shown, the feedthrough 111 of the first layer 3 and the second feedthrough 109 of the second layer 15 have the same diameter and are aligned with each other along the X axis.

[0089] It allows fluid or force to be transferred from the second surface 7 of the first layer 3 to the MEMS or ASIC component 103 (e.g., via an impression or rod for solid medium transfer), as indicated by arrow 113.

[0090] Figure 3AA cross-sectional view of a device 201 according to a third embodiment of the present invention is shown.

[0091] exist Figure 1 and 2 Elements that have been described and shown in the figures and have the same reference numerals will not be described in detail again, but will be referred to in the description above.

[0092] like Figure 1 The device 1 and device 201 shown are devices for supporting at least one MEMS component or ASIC component.

[0093] The device 201 according to the third embodiment differs from the first and second embodiments in that the device 201 includes three stacked layers instead of two.

[0094] The device 201 includes a first layer 3 on which MEMS or ASIC components 9 are provided on a first surface 5. The first layer 3 includes a first feedthrough 203 and a second feedthrough 205 extending along an axis X from the first surface 5 to a second surface 7. The MEMS or ASIC components 9 are disposed on the first surface 5 such that they are positioned between the first feedthrough 203 and the second feedthrough 205.

[0095] Device 201 includes a second layer 15 disposed on the first layer 3. The second layer 15 includes a first feedthrough 207 and a second feedthrough 209 extending along axis X from the first surface 17 to the second surface 19.

[0096] like Figure 2 As shown, the first feedthrough 203 of the first layer 3 is directly connected to the first feedthrough 207 of the second layer 15. The second feedthrough 205 of the first layer 3 is directly connected to the second feedthrough 209 of the second layer 15.

[0097] The device 201 according to the third embodiment further includes a third layer 211. The third layer 211 has a first surface 213 and a second surface 215, the second surface 215 being along... Figure 3A The Cartesian coordinate axis X shown is opposite to the first surface 213.

[0098] The second surface 7 of the first layer 3 is disposed on the first surface 213 of the third layer 211.

[0099] The third layer 211 includes a groove 217 disposed on the first surface 213 and extending along axis X toward the second surface 215 into the third layer 211. The groove 217 extends longitudinally along axis Y from the first feedthrough 203 of the first layer 3 to the second feedthrough 205. Therefore, as indicated by the arrows, the groove 217 and feedthroughs 205 and 209 form a direct connection, e.g., a fluid connection, from the first surface 17 of the second layer 25 through feedthroughs 207 and 203. Thus, fluid can pass from the first surface 17 through the device 201.

[0100] The first layer 3 includes a third feedthrough 219 extending from the first surface 5 of the first layer 3 to the groove 217 of the third layer 211. For example... Figure 3A As shown, the MEMS or ASIC component 9 is disposed on the first surface 5 above the third feedthrough 219. The third feedthrough 219 allows for fluid connection between the recess 217 and the MEMS or ASIC component 9.

[0101] Figure 3B A cross-sectional view of a variant of the device 221 according to a third embodiment of the present invention is shown.

[0102] exist Figure 1 , 2 Elements that have been described and shown in 3A and have the same reference numerals will not be described in detail again, but will be referred to in the description above.

[0103] As a device 201 according to the third embodiment, device 221 includes more than two layers. Compared with device 201 which includes three layers, device 221 includes four layers: a first layer 3, a second layer 15, a third layer 223, and a fourth layer 225.

[0104] MEMS or ASIC components 9 are disposed on or above the surface 7 of the first layer 3.

[0105] The first layer 3 includes a feedthrough 229 that fluidly connects the surface 5 of the first layer 3 to the MEMS or ASIC component 9.

[0106] The first layer 3 also includes a feedthrough 233 aligned with a corresponding feedthrough 237 in the second layer 15. The second layer 15 also includes a recess 21a for receiving a MEMS or ASIC component 9.

[0107] Additional MEMS or ASIC components 239 are disposed on or above the surface 19 of the second layer 15.

[0108] Feed 237 in the second layer 15, aligned with feed 233 of the first layer 3, allows a movable impression (or rod or bar) 241 along direction D to pass through for transmitting force to MEMS or ASIC components 239.

[0109] MEMS or ASIC component 239 is received in cavity 21b provided in the third layer 223. Cavity 242 is closed by the fourth layer 225, thereby enclosing MEMS or ASIC component 239 in cavity 21b.

[0110] like Figure 3BAs shown, the MEMS or ASIC component 9 is electrically connected to a contact pad 243 disposed on or above the back surface 245 of the fourth layer 225 through corresponding through-holes 247a, 247b, and 247c of the fourth layer 225, the third layer 223, and the second layer 15, i.e., feedthroughs filled with conductive material. The through-hole 247c of the second layer 15 is electrically connected to a conductive trace 249 (similar to a printed circuit), to which the leads of the MEMS or ASIC component 9 are bonded.

[0111] In a similar manner, MEMS or ASIC components 239 are wire-bonded to conductive traces 251 (similar to printed circuits), which are electrically connected to vias 253 extending through the third layer 223. The vias 253 are aligned with vias 255 extending through the fourth layer 225, up to contact pads 257 disposed on the back surface 245 of the fourth layer 225.

[0112] It should be noted that the number of layers, the number of MEMS and / or ASIC components, and the arrangement of these components and feedthroughs are not limited to the embodiments described above. Furthermore, arrangements and structures of each of the above embodiments can be combined.

[0113] Figure 4 An exploded view of the array 10 of the device 12 according to a fourth embodiment of the present invention is shown.

[0114] Array 10 is a device array used solely to support MEMS components or MEMS and ASIC components.

[0115] The devices 12 are formed as an array 10 having rows and lines. Each device 12 in the array 10 is identical. Therefore, for clarity, the invention will be described below with reference to one device 12. Thus, the description of one device 12 applies to the other devices 12 in the array 10.

[0116] In the fourth embodiment, the device 12 includes three layers.

[0117] The device 12 includes a first layer 14 corresponding to the bottom base 14 and a third layer 16 corresponding to the top base 16.

[0118] A first functional component 18, such as an ASIC or MEMS component 18, is disposed on the surface 14a of the first layer 14. Figure 1 In the embodiment shown, the first functional component 18 is an ASIC component.

[0119] A second functional component 20, such as a MEMS component 20, is disposed on surface 16a of the third layer 16. In a variant, the first functional component 18 is a MEMS component, not an ASIC component. In this variant, each device 12 thus includes two MEMS components 18, 20 disposed on the first layer 14 and the third layer 16, respectively. Therefore, the following description of the ASIC component 18 applies to a variant in which the first functional component 18 is a MEMS component 18.

[0120] Each corresponding surface 14a, 16a of the first layer 14 and the third layer 16 is also provided with a printed circuit 22. Functional components 18, 20 are electrically connected to the printed circuit 22 via lead bonding. Figure 4 A wire 24 is shown between the first ASIC component 18 and the printed circuit 22 disposed on the surface 14a of the first layer 14. Although in Figure 4 Although not visible in the view shown, the second MEMS component 20 is electrically connected to the printed circuit 22 disposed on the surface 16a of the third layer 16 via lead bonding.

[0121] Device 12 further includes a second layer 26, such as the spacer 26 in the fourth embodiment, disposed between the first layer 14 and the third layer 16 along a first direction parallel to the first direction. Figure 4 The Z direction of the Cartesian coordinate system shown.

[0122] Figure 5 The second layer 26 according to the fourth embodiment of the present invention is shown.

[0123] The second layer 26 is made as a single piece. The second layer 26 is made of ceramic or any suitable printed circuit board material.

[0124] For each device 12, the second layer 26 is provided with cavities 28 sized to accommodate functional components 18, 20. An array of cavities 28 is created within the second layer 26 by cutting or cutting a portion of the second layer 26 from the first surface 26a to the second surface 26b along a first direction, i.e., the Z direction of the Cartesian coordinate system, with the second surface 26a opposite to the first surface 26b along the first direction.

[0125] exist Figure 4 and 5 In the fourth embodiment shown, each cavity 28 has a rectangular cross-section, the dimensions of which are adapted to accommodate functional components 18, 20.

[0126] According to the present invention, the second layer 26 also includes a feedthrough 30 array that is different from the cavity 28.

[0127] Multiple feedthroughs 30 are manufactured in an array of devices 12. Each individual device 12 is formed by cutting the array into individual devices. By cutting the array, the feedthroughs 30 are also cut such that each individual device 12 has a groove at at least one corner, which is a cut portion of the feedthrough 30. Figure 6a -c, 7a-c, 8a-b and 9a-b further describe the method for manufacturing apparatus 12 according to the fourth embodiment.

[0128] Each feedthrough 30 extends along a first direction from the first surface 26a of the second layer 26 to the second surface 26b.

[0129] The feedthrough 30 can be configured to transmit electrical or electromagnetic energy, electrical or electromagnetic signals, liquids, gases, or solids.

[0130] Each feedthrough 30 can have a circular cross-section. The diameter of each feedthrough 30 can be between 0.1 mm and 10 mm.

[0131] In one variant, each feedthrough 30 or at least one feedthrough 30 has an elliptical cross-section.

[0132] Each feedthrough 30 is covered by a conductive layer 32 along its inner wall 30a. For example... Figure 4 and 5 As shown, although the conductive layer 32 is deposited on the inner wall 30a, the feedthrough 30 is still hollow.

[0133] In one variation, the feedthrough 30 can be filled with conductive material from the first surface 26a to the second surface 26b of the second layer 26. In this case, the feedthrough 30 is a through-hole.

[0134] like Figure 4 and 5 As shown, the conductive layer 32 is applied on the first surface 26a and the second surface 26b of the second layer 26 onto the circumference 30b of the feedthrough 30, i.e., the peripheral portion 30b. The deposition of the conductive layer 32 in the peripheral portion 30b can correspond to an annulus 32 surrounding the feedthrough 30, the width W of which can be between 0.1 and 10 mm, particularly between 0.05 and 1 mm.

[0135] For each feedthrough 30, a conductive layer 32 at the periphery 30b of each surface 26a, 26b on the second layer 26 is connected to a conductive layer 32 disposed on the inner wall 30a, so as to ensure electrical continuity between the first surface 26a and the second surface 26b of the second layer 26 through the feedthrough 30.

[0136] In a variant, the second layer 26 may have printed dielectric material patterns on its first surface 26a and second surface 26b, as explained with respect to the first and second embodiments.

[0137] like Figure 4 As shown, for each of the first layer 14 and the third layer 16, conductive adhesive dots 34 are disposed on the printed circuit 22. The conductive adhesive dots 34 are configured to contact the peripheral portion 30b on each surface 26a, 26b of the feedthrough 30, wherein the conductive layer 32 is applied to the peripheral portion 30b.

[0138] Therefore, the conductive adhesive dots 34 provided on the surface 14a of the first layer 14 contact the conductive layer 32 of the periphery 30b of the second surface 26b of the second layer 26. Correspondingly, the conductive adhesive dots 34 provided on the surface 16a of the third layer 16 contact the conductive layer 32 of the periphery 30b of the first surface 26a of the second layer 26.

[0139] Therefore, the electrical connection between the first layer 14 (i.e., the first substrate 14) and the third layer 16 (i.e., the second substrate 16) is achieved through the feedthrough 30 of the second layer 26 disposed therebetween along the first direction (i.e., along axis Z).

[0140] from Figure 4 As can be seen, non-conductive adhesive patches 36 are provided on the first surface 26a and the second surface 26b of the second layer 26 to improve adhesion on the array 10 of the device 12. The non-conductive adhesive patches 36 are configured to be different from the conductive layer 32 of the periphery 30b of the feedthrough 30.

[0141] As will be further described below, each feeder 30 can be cut or split so that one feeder 30 can be used for electrical connection of two, three or four devices 12. Figure 6a -c, 7a-c, 8a-b and 9a-b illustrate a method for manufacturing an apparatus 12 for supporting ASIC and MEMS components 18, 20 according to a fourth embodiment of the present invention.

[0142] exist Figure 4 and 5 Elements that have been described and shown in the figures and have the same reference numerals will not be described in detail again, but will be referred to in the description above.

[0143] exist Figure 6a In the steps shown, an array of printed circuits 22 is provided on surface 14a of the first layer 14.

[0144] exist Figure 6b In the steps shown, the ASIC component 18 is disposed on the surface 14a of the first layer 14 and electrically connected to the printed circuit 22 via wire bonding 24. In a variation, the MEMS component 18 may be provided on the surface 14a of the first layer 14 instead of the ASIC component.

[0145] exist Figure 6cIn the steps shown, conductive adhesive dots 34 are provided on the printed circuit 22 of the first layer 14.

[0146] Figures 6a to 6c The steps shown are the same for surface 16a of the third layer 16, and therefore will not be described again.

[0147] exist Figure 7a In the steps shown, the second layer 26 is cut from the first surface 26a to the second surface 26b to form an array of cavities 28 and an array of feedthroughs 30 in the second layer 26. The cavities 28 are sized to accommodate the functional components 18 and 20 of the first layer 14 and the third layer 16.

[0148] exist Figure 7b In the steps shown, each circumference 30b, i.e., each periphery 30b, of each feedthrough 30 on the first surface 26a and the second surface 26b of the second layer 26 is covered by a conductive layer 12. The inner wall 30a of each feedthrough 30 is also covered by a conductive layer 12. For each feedthrough 30, the conductive layer 12 at the periphery 30b of each surface 26a, 26b on the second layer 26 is connected to a conductive layer 12 disposed on the inner wall of the feedthrough 30, so as to ensure electrical continuity between the first surface 26a and the second surface 26b of the second layer 26 through the feedthrough 30.

[0149] exist Figure 7c In the steps shown, a non-conductive adhesive patch 36 is provided on the second surface 26b of the second layer 26. The non-conductive adhesive patch 36 is configured to be different from the conductive layer 32 of the periphery 30b of the feedthrough 30.

[0150] exist Figure 8a In the steps shown, the second surface 26b of the second layer 26 is assembled and attached to the surface 14a of the first layer 14 by adhesive bonding.

[0151] Therefore, in Figure 8b In the next step shown, each ASIC component 18 of the first layer 14 is disposed within a corresponding cavity 28 of the second layer 26, thereby being surrounded by the walls of the cavity 28 of the second layer 16. Each conductive adhesive dot 34 contacts a conductive layer 32 disposed on each feedthrough periphery 30b on the second surface 26b of the second layer 26.

[0152] The non-conductive adhesive patch 36 disposed on the second surface 26b of the second layer 26 allows for improved adhesion between the second layer 26 and the surface 14a of the first layer 14.

[0153] exist Figure 8b In the steps shown, a non-conductive adhesive patch 36 is provided on the first surface 26a of the second layer 26. The non-conductive adhesive patch 36 is configured to be different from the conductive layer 32 of the periphery 30b of the feedthrough 30.

[0154] exist Figure 9a In the steps shown, surface 16a of the third layer 16 is assembled and attached to the first surface 26a of the second layer 26 by adhesive bonding. As described above, surface 16a of the third layer 16 has been... Figures 6a to 6c Prepare according to the steps shown.

[0155] Therefore, in Figure 9b In the next step shown, each MEMS component 20 of the third layer 16 is received within a corresponding cavity 28 of the second layer 26, thereby being surrounded by the walls of the second layer 16. Each conductive adhesive dot 34 contacts a conductive layer 32 disposed on each feedthrough periphery 30b on the first surface 26a of the second layer 26.

[0156] The non-conductive adhesive patch 36 disposed on the first surface 26b of the second layer 26 allows for improved adhesion between the second layer 26 and the surface 16a of the third layer 16.

[0157] exist Figure 9b In the steps described, array 10 according to the fourth embodiment of the present invention was obtained.

[0158] Figure 10a The steps of cutting (slicing or dicing) the array 10 into individual devices 12 are shown, as follows: Figure 10b As shown. After the cutting or slicing step, a feedthrough 30 can electrically connect two to four devices 12.

[0159] like Figure 11 As shown in the cross-sectional view of the device 12, the method according to the fourth embodiment allows for the acquisition of device 12, wherein functional components 18, 20 disposed on each surface 14a, 16a of the first and third layers 14, 16 at least partially face each other, thereby improving the compactness of device 12. Electrical connections are simplified via leads 30 or a portion of a feedthrough 30 created by the cutting process and are covered by a conductive layer 32. Therefore, wire bonding from the second MEMS component 20 to the first layer 14 is unnecessary, thus avoiding wire tangling between the first layer 14 and the third layer 16. In fact, the electrical connection between the first layer 14 and the third layer 16 is achieved through a feedthrough 30 contained within the second layer 26.

[0160] Furthermore, the device 12 obtained by this method allows for the protection of functional components 18, 20 in the cavity 28 of the second layer 26 from the external environment, while the third layer 16 acts as both a substrate and a cap. Therefore, the device 12 is particularly suitable for applications in harsh environments without requiring gel filling.

[0161] Figure 12 A partial view of the apparatus 112 according to a fifth embodiment of the present invention is shown.

[0162] Figure 12 The reference numerals in the figures described in the fourth embodiment plus one hundred refer to the same elements. Therefore, these reference numerals will not be described in detail again, and reference will be made to the description of the fourth embodiment.

[0163] The device 112 according to the fifth embodiment differs from that of the fourth embodiment in that multiple layers are disposed between the first layer 114 and the second layer 116, instead of just one second layer 126.

[0164] A further difference between device 112 and the four embodiments is that functional components, such as MEMS, are stacked on top of a first MEMS or ASIC component disposed on the first layer 114.

[0165] According to the fifth embodiment, compared to the second layer 26 of the fourth embodiment, the spacer 126 is formed by three intermediate plates 126A, 126B, and 126C stacked on top of each other. Each intermediate plate 126A, 126B, and 126C can have different shapes and distributions. Therefore, each intermediate plate 126A, 126B, and 126C can be provided with printed circuits of different arrangements and can be individually connected to any feedthrough.

[0166] Therefore, as further described below, multifunctional layers are feasible, such as intermediate lead bonding areas for stacked ASICs or MEMS, embedded cavities, and circuit redistribution between board stacks.

[0167] In cavity 128, a first ASIC component 118 is attached to a first layer 114, on which a printed circuit 122a is disposed. In a variant, the first functional component 118 is a MEMS component, not an ASIC component. Therefore, the following description of the ASIC component 118 applies to a variant of the MEMS component 118.

[0168] The second component 120, which is a MEMS component 120, is attached to the third layer 116, on which a printed circuit 122d is disposed.

[0169] In the fifth embodiment, an electronic device layer 138 is stacked on an ASIC component 118. The electronic device layer 138 includes functional components such as MEMS, for example, accelerometers or pressure sensors.

[0170] In one variation, the electronic device layer 138 may include ASIC components instead of MEMS components.

[0171] In another variation, the electronic device layer 138 may include MEMS and ASIC components.

[0172] In one variation, at least two electronic device layers may be stacked on the first functional component 118 and / or the second functional component 120.

[0173] like Figure 12 As shown in the embodiment, the ASIC component 118 is electrically connected to the printed circuit 122a disposed on the first layer 114 via a wire 124a.

[0174] The ASIC component 118 is also electrically connected via wire 124b to a printed circuit 122b disposed on a first intermediate board 126A of a spacer 126.

[0175] The electronic device layer 138 is electrically connected to the printed circuit 122c disposed on the second intermediate plate 126B of the spacer 126 via wire 124c.

[0176] In addition, the MEMS component 120 is electrically connected to the printed circuit 122d disposed on the third layer 116 via wire 124.

[0177] The first and third layers 114, 116 and the intermediate plates 126A, 126B, 126C are separated by non-conductive layers and are electrically connected to each other through feedthroughs as described below.

[0178] The printed circuit 122a of the first layer 114 and the printed circuit 122b of the first intermediate board 126A are electrically connected via a feedthrough 130A.

[0179] The printed circuit 122b of the first intermediate board 126A and the printed circuit 122c of the second intermediate board 126B are electrically connected via feedthrough 130B.

[0180] In addition to feedthrough 130B, the second intermediate plate 126B is provided with a vent 131 (i.e., a hollow tube) extending in a direction transverse to the longitudinal central axis of feedthrough 130B, i.e., transverse to the first direction. This vent 131 allows air, liquid, or solid media to pass through the cavity 128 including ASICs 118, 120, and 138 for sensing (e.g., for determining pressure).

[0181] exist Figure 12 In a variant not shown, device 112 may include a hollow feedthrough extending along a first direction from cavity 128 through first layer 114 and intermediate plate 126A to the outside of device 112.

[0182] The printed circuit 122d of the third layer 116 and the printed circuit 122c of the second intermediate board 126B are electrically connected by a feedthrough 130C extending through the intermediate board 126C of the spacer 126. Each end of the feedthrough 130C is covered by a conductive layer 132 at the interface between the third layer 116 and the intermediate board 126C, and at the interface between the two intermediate boards 126B and 126C, so that the conductive layer 132 contacts the printed circuits 122c and 122d, respectively.

[0183] exist Figure 12 In the example shown, feedpasses 126A, 126B, and 126C are staggered along a first direction (parallel to axis Z). In a variation, at least two feedpasses may be aligned with each other along the first direction.

[0184] exist Figure 12 In another variation not shown, one of the intermediate plates 126B and 126C may be provided with a second cavity that surrounds the additional MEMS component whose leads are connected to the first layer 114. This second cavity, distinct from cavities 128 and feedthroughs 130A-C, allows for the separation of sensing features. It is indeed necessary to isolate the pressure sensor from cavity 128. In this example, the second cavity has a through-hole for delivering air to the external cavity of device 112.

[0185] Although embodiments have been described in conjunction with specific examples, the invention is not limited, and various changes can be made to the disclosed embodiments without departing from the scope of the invention. Therefore, the various embodiments and examples are not intended to limit them to the specific forms disclosed. Rather, they include modifications and substitutions falling within the scope of the claims, and the various features can be freely combined with each other to obtain further embodiments or examples according to the invention. It should be understood that some or all of the foregoing features can also be combined in different ways.

[0186] List of reference numerals

[0187] 1. Apparatus according to the first embodiment

[0188] 3 First layer

[0189] 5 First surface of the first layer

[0190] 7. The second surface of the first layer

[0191] 9 MEMS or ASIC components

[0192] 11 Conductive traces

[0193] 13 Lead wire connection

[0194] 15 Second Floor

[0195] 17 The first surface of the second layer

[0196] 19 The second surface of the second layer

[0197] 21 cavities

[0198] 23 Feedthrough

[0199] 25. Conductive materials

[0200] 27 Through Hole

[0201] 101 Apparatus according to the second embodiment

[0202] 103 MEMS or ASIC components

[0203] 105 lead wire connection

[0204] 107 Conductive Traces

[0205] Feeders 109 and 111

[0206] 113 Arrow, direction of transmission

[0207] 201 Apparatus according to the third embodiment

[0208] Feeders 203, 205, 297, 209, 219

[0209] 211 Third Floor

[0210] 213 The first surface of the third layer

[0211] 215 The second surface of the third layer

[0212] 217 Groove

[0213] 221. Apparatus according to a variant of the third embodiment

[0214] Floors 3, 15, 223, and 225

[0215] 21a, 21b cavity, recess

[0216] Feeders 229, 233, 237

[0217] 239 MEMS or ASIC components

[0218] 241 Imprints used for force transmission

[0219] 245 Back

[0220] 247a-c, 253, 255 Back side

[0221] 243, 257 Contact pads

[0222] 249, 251 Conductive traces, printed circuit boards

[0223] D Shift direction

[0224] 10 array

[0225] 12. Apparatus according to the fourth embodiment

[0226] 14 First layer (first base)

[0227] 14a A surface of the first layer

[0228] 16 Third layer (second base)

[0229] 16a A surface of the third layer

[0230] 18. First functional component, MEMS or ASIC component

[0231] 20 Secondary functional components, MEMS or ASIC components

[0232] 22 Printed Circuits

[0233] 24 wires

[0234] 26 Second layer (partition)

[0235] 26a The first surface of the second layer

[0236] 26b Second surface of the second layer

[0237] 28 cavities

[0238] 30 Feedthrough

[0239] 30a Feedthrough inner wall

[0240] 30B feedthrough circumference, surrounding part

[0241] 32 Conductive Layer

[0242] 34 Conductive adhesive

[0243] 36 Non-conductive adhesive

[0244] D is the diameter of the feedthrough.

[0245] W width

[0246] 112 Apparatus according to the fifth embodiment

[0247] 114 First layer (first base)

[0248] 116 Third layer (second base)

[0249] 118, 120 MEMS or ASIC components

[0250] 122a-d Printed Circuit Boards

[0251] 124a-d lead bonding

[0252] 126 Second layer (partition)

[0253] 126A-C Intermediate Board

[0254] 128 chambers

[0255] 130A-C Feeder

[0256] 131: Ventilation hole

[0257] 132 Conductive Materials

[0258] 138 Electronic device layer including MEMS or ASIC

[0259] X, Y, Z Cartesian coordinate system

Claims

1. A device comprising at least one MEMS or ASIC component, Including the first layer (3, 14, 114) and the MEMS components and / or ASIC components (9, 18, 118) on the first layer, and A second layer (15, 26, 126) is located on or above the first layer. The second layer includes cavities (21, 28, 128) for receiving the MEMS components and / or ASIC components. Its features are, The second layer also includes at least one feedthrough (23, 30, 130) for transmitting electrical signals and / or electromagnetic signals and / or fluid and / or force; The surfaces (19, 26b) of the second layer (15, 26, 126) facing the first layer (3, 14, 114) and / or The surfaces (17, 26a) of the second layer (15, 26, 126) opposite to the surfaces (19, 26b) facing the first layer (3, 14, 114). Including conductive traces (107).

2. The apparatus according to claim 1, wherein, The surface (30a) of the at least one feedthrough (23, 30, 130) is at least partially covered by a conductive material layer (25, 32, 132), or the at least one feedthrough is filled with a conductive material (25, 32, 132).

3. The apparatus according to claim 1, wherein, Additional MEMS components and / or additional ASIC components (103) are disposed on or above the second layer (15), that is, on or above the surface (17) of the second layer (15) opposite to the surface (19) facing the first layer (3). The additional MEMS components and / or additional ASIC components (103) of the second layer (15) are electrically and / or fluidly connected to the first layer (3) through at least one of the at least one feedthrough (23).

4. The apparatus according to claim 3, wherein, The MEMS components and / or ASIC components (9) of the first layer (3) are electrically connected to the additional MEMS components and / or additional ASIC components (103) of the second layer (15) via the at least one feedthrough (23) and the conductive trace (107).

5. The apparatus according to claim 4, wherein, The first layer (3) includes at least one feedthrough (111, 203, 205), which is arranged to be aligned with at least one feedthrough (109, 207, 209) in the second layer (15).

6. The apparatus of claim 4, further comprising at least one additional MEMS component and / or ASIC component (20, 120) disposed on or above the third layer (16, 116), wherein, The third layer (16, 116) is arranged such that the third layer and the first layer (14, 114) sandwich the second layer (26, 126) in between, and wherein the additional MEMS components and / or ASIC components (20, 120) of the third layer (16, 116) are electrically or fluidly connected to the first layer (14, 114) via at least one feedthrough (30, 130A-C) in the second layer (26, 126).

7. The apparatus according to claim 6, wherein, The at least one additional MEMS component and / or ASIC component (20, 120) is disposed on or above the surface (16a) of the third layer (16, 116) facing the second layer (26, 126), and the second layer includes a cavity (28, 128) for receiving the additional MEMS component and / or ASIC component (20, 120) of the third layer (16, 116).

8. The apparatus according to claim 7, wherein, The at least one additional MEMS component and / or additional ASIC component (20, 120) of the third layer (16, 116) and the first MEMS component and / or ASIC component (18, 118) of the first layer (14, 114) are disposed in the same cavity (28, 128) of the second layer (26, 126), which thereby extends through the second layer (26, 126).

9. The apparatus according to claim 8, wherein, The third layer (16, 116) also includes at least one feedthrough aligned with at least one of the at least one feedthrough in the second layer (26, 126).

10. The apparatus according to claim 9, wherein, The second layer (15, 26, 126) is formed of an electrically insulating material.

11. The apparatus according to claim 9, wherein, The second layer (15, 26, 126) is formed of ceramic.

12. The apparatus of claim 10, further comprising additional MEMS components and / or additional ASIC components (137) disposed on or above the MEMS components and / or ASIC components (118) of the first layer (114), wherein, The MEMS components and / or ASIC components (118) of the first layer (114) are electrically connected to the first layer (114). The additional MEMS components and / or additional ASIC components (138) are electrically connected to the second layer (126B).

13. The apparatus according to claim 12, wherein, The first layer (14) and the second layer (26) and / or the second layer (26) and the third layer (14) are attached to each other by an adhesive (36).

14. The apparatus according to claim 12, wherein, The first layer (14) and the second layer (26) and / or the second layer (26) and the third layer (14) are attached to each other by a release adhesive.

15. The apparatus according to claim 13, wherein, Electrical connections between the first layer (14) and the at least one feedthrough (30) of the second layer (26) are provided using conductive adhesive (34) or solder bumps.

16. The device array according to claim 15, wherein, At least two devices (12) share the feedthrough (30) of the second layer (26).

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