LED Chip, LED Chip Encapsulation Module and Display Device

Abstract

LED chip, LED chip packaging module and display device. The LED chip includes: a substrate, a first mesa structure and a second mesa structure; at least one cross-connected current blocking block; a cross-connected conductive block, the number of the cross-connected conductive blocks being the same as the number of the cross-connected current blocking blocks; a first conductive pad and a second conductive pad; the top view projection of the cross-connected current blocking block has a head and a tail; the top view projection of the cross-connected conductive block has a first contact portion, a junction portion and a second contact portion; the junction portion falls within the head, the first contact portion falls within the tail; the portion of the head that does not overlap with the junction portion has a first width, the portion of the tail that does not overlap with the first contact portion has a second width, and the first width is greater than the second width. The reliability of the LED chip is improved.

Description

Technical Field

[0001] The present invention relates to the field of LEDs, and particularly to an LED chip, an LED chip packaging module, and a display device. Background Art

[0002] LEDs (light-emitting diodes) have the advantages of low cost, high luminous efficiency, energy conservation and environmental protection, and are widely used in lighting, visible light communication, light-emitting display and other scenarios.

[0003] One of the development directions of LEDs is towards miniaturization and microminiaturization. After miniaturization, an array with a millimeter-level or even micron-level pitch is formed, which can achieve ultra-high resolution, and thus can be more widely used in information display and other fields. Since LEDs have the advantages of long luminous life, high brightness, thin and light volume, low power consumption, high pixel density, etc. compared with liquid crystal display (LCD) and organic light-emitting display (OLED), they have become one of the representatives of the third-generation display technology featuring high authenticity, interactivity and personalized display.

[0004] Currently, in the process of the development of LED chips towards miniaturization, one of the problems encountered is the reliability problem, that is, the industry is jointly faced with the situation that the corresponding LED chip structure needs to be optimized to improve product reliability. Summary of the Invention

[0005] The problem solved by the present invention is to provide an LED chip, an LED chip packaging module, and a display device to improve product reliability.

[0006] To solve the above problems, the present invention provides an LED chip, comprising: a substrate; a first mesa structure located on the substrate; a second mesa structure located on the substrate; at least one cross - connecting current blocking block covering a part of the upper surface and part of the side surface of the first mesa structure, and covering a part of the groove between the first mesa structure and the second mesa structure; a cross - connecting conductive block, the number of the cross - connecting conductive blocks being the same as the number of the cross - connecting current blocking blocks, the main body part of the cross - connecting conductive block being located on the cross - connecting current blocking block, a first end of the cross - connecting conductive block being electrically connected to the top layer of the first mesa structure, and a second end of the cross - connecting conductive block being electrically connected to the bottom layer of the second mesa structure; a first conductive pad located above the first mesa structure; a second conductive pad located above the second mesa structure; the top - view projection of the cross - connecting current blocking block having a head and a tail; the top - view projection of the cross - connecting conductive block having a first contact part, a junction part and a second contact part; the junction part falling within the head, the first contact part falling within the tail; a part of the head that does not overlap with the junction part having a first width, and a part of the tail that does not overlap with the first contact part having a second width, the first width being greater than the second width.

[0007] Optionally, the size of the first width is from 3 μm to 100 μm.

[0008] Optionally, the size of the second width is greater than or equal to 0 μm and less than or equal to 30 μm.

[0009] Optionally, the width of the head is more than 1.5 times the width of the tail.

[0010] Optionally, there are two cross - connecting conductive blocks, which are respectively located at two opposite edges of the entire top - view projection area.

[0011] Optionally, the top - view projection of the cross - connecting conductive block does not overlap with the top - view projections of the first conductive pad and the second conductive pad.

[0012] Optionally, a part of the top - view projection of the second conductive pad is sandwiched between the two cross - connecting conductive blocks, and the top - view shapes of the first conductive pad and the second conductive pad are substantially symmetrical.

[0013] Optionally, the width of the junction part is greater than the width of the first contact part; the width of the junction part is greater than the width of the second contact part.

[0014] Optionally, the bisector of the knot portion coincides with the bisector of the first contact portion on a first straight line, the bisector of the second contact portion is a second straight line, the first straight line is parallel to the second straight line, and the second contact portion connects the outer corner of the knot portion; or, the bisector of the knot portion coincides with the bisector of the second contact portion on a first straight line, the bisector of the first contact portion is a second straight line, the first straight line is parallel to the second straight line, and the first contact portion connects the inner corner of the knot portion.

[0015] Optionally, the LED chip further includes: a first current spreading layer located above the first mesa structure, a first conductive pad located above the first current spreading layer, and the bridging conductive block electrically connects the top layer of the first mesa structure by connecting the first current spreading layer; a second current spreading layer located above the second mesa structure, a second conductive pad located above the second current spreading layer; and the top view projection of the bridging conductive block does not overlap with the top view projection of the second current spreading layer.

[0016] Optionally, the LED chip further includes a first DBR reflective layer covering the first current spreading layer and the second current spreading layer; the first conductive pad is located on the first DBR reflective layer and penetrates through the first DBR reflective layer to electrically connect the bottom layer of the first mesa structure; the second conductive pad is located on the first DBR reflective layer and penetrates through the first DBR reflective layer to electrically connect the second current spreading layer; and the first DBR reflective layer also serves as a passivation protection layer.

[0017] Optionally, the LED chip further includes a built-in current blocking block which is on the same layer as the bridging current blocking block and is located between the second mesa structure and the second current spreading layer; the top view projection of the built-in current blocking block includes a middle part and two side parts connecting the middle part, and the width of the middle part is greater than the width of the side parts.

[0018] Optionally, the LED chip further includes a first conductive block which is on the same layer as the bridging conductive block; the top view projection of the top layer of the first mesa structure has an inward concave notch, and the top view projection of the first conductive block falls within the inward concave notch of the first mesa structure.

[0019] Optionally, the top view projection of the top layer of the second mesa structure is a chamfered rectangle with two corner notches, the corner notches face the first mesa structure, and the two corner notches are symmetrical; the corner notches match the bridging conductive block.

[0020] Optionally, the top view projection of the concave notch is funnel-shaped, and the top view projection of the first conductive block is circular or nail-shaped with a rounded head.

[0021] Optionally, the LED chip further includes a second conductive block. The second conductive block and the bridging conductive block are of the same layer structure. The second conductive block is located above the built-in current blocking block and on the second current spreading layer. The second conductive pad is electrically connected to the second current spreading layer by connecting the second conductive block. The top view projection of the second conductive block falls within the top view projection of the built-in current blocking block.

[0022] Optionally, the second conductive block includes a core portion and two wing portions located on both sides of the core portion. The first DBR reflective layer has a first through hole and a second through hole penetrating itself. The second through hole is located above the middle of the core portion of the second conductive block.

[0023] Optionally, the LED chip further includes a second DBR reflective layer, and the second DBR reflective layer is located on the back surface of the substrate.

[0024] To solve the above problems, the present invention further provides an LED chip packaging module, including the LED chip as described above.

[0025] To solve the above problems, the present invention further provides a display device, including the LED chip as described above, and the LED chip is used as a backlight source chip of the backlight module of the display device.

[0026] In one aspect of the technical solution of the present invention, the bridging conductive block of the LED chip is designed to have a junction portion, a first contact portion, and a second contact portion, and the bridging current blocking block of the LED chip is designed to have a head portion and a tail portion. In the top view projection, the junction portion falls within the head portion, the first contact portion falls within the tail portion. The non-overlapping portion of the head portion and the junction portion has a first width, and the non-overlapping portion of the tail portion and the first contact portion has a second width. The first width is greater than the second width. At this time, since the head portion is located at the position of the groove and is usually uneven, the current blocking block on the slope will be thinner. Therefore, designing the width of the head portion wider can better ensure the reliability of the junction portion above the groove, prevent phenomena such as leakage, and improve the product reliability.

[0027] Furthermore, through the structural design of the provided LED chip, the top view projection of the bridging conductive block does not overlap with the top view projections of the first conductive pad and the second conductive pad, which can prevent chip leakage caused by the damage of the protective passivation layer, that is, it can reduce the leakage channel and improve the reliable performance of the product.

[0028] Furthermore, the top view projection of the bridging conductive block does not overlap with the top view projection of the second current spreading layer. In this structure, the bridging conductive block is located at the edge of the die. During the grasping process of this LED chip, the problem of LED chip failure caused by the middle bridging conductive block being damaged by the ejector pin (the ejector pin is a tool used to cooperate with the grasping of the chip) will not occur, improving the reliability of the product.

[0029] Furthermore, for the provided LED chip, two bridging conductive blocks are designed. When a single bridging conductive block is damaged, the die will not fail, making the reliability of the product better. At the same time, both of the two bridging conductive blocks are distributed on both sides of the die, further preventing the problem of LED chip failure caused by the middle bridging conductive block being damaged by the ejector pin, and further improving the reliability of the product.

[0030] Furthermore, for the provided LED chip, the first DBR reflective layer is simultaneously used as a protective passivation layer, and corresponding through holes are provided above the middle positions of the top view projections of the first conductive block and the second conductive block, which can make the corresponding current diffusion (expansion) effect better and the performance of the product better. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a partial cross-sectional structure schematic diagram of the LED chip in the first embodiment;

[0032] Figure 2 is a top view projection schematic diagram of the top layer of the first mesa structure, the top layer of the second mesa structure and the substrate in the first embodiment;

[0033] Figure 3 is a top view projection schematic diagram of the first deep trench, the second deep trench and the substrate in the first embodiment;

[0034] Figure 4 is a top view projection schematic diagram of the bridging current blocking block and its same-layer structure and the substrate in the first embodiment;

[0035] Figure 5 is in the first embodiment, on Figure 1 is a partial cross-sectional structure schematic diagram further showing the bridging current blocking block and its same-layer structure;

[0036] Figure 6 is a top view projection schematic diagram of the first current spreading layer, the second current spreading layer and the substrate in the first embodiment;

[0037] Figure 7 is in the first embodiment, on Figure 5 is a partial cross-sectional structure schematic diagram further showing the bridging conductive block and its same-layer structure;

[0038] Figure 8It is a top - down projection schematic diagram of the bridging conductive block, its same - layer structure, and the substrate in the first embodiment;

[0039] Figure 9 It is a common top - down projection schematic diagram of the layer where the bridging current - blocking block is located, the layer where the bridging conductive block is located, and the substrate in the first embodiment;

[0040] Figure 10 It is in the first embodiment, on Figure 7 A partial cross - sectional structure schematic diagram further showing the first DBR reflective layer;

[0041] Figure 11 It is a top - down projection schematic diagram of the first DBR reflective layer in the first embodiment;

[0042] Figure 12 It is a cross - sectional structure schematic diagram of the LED chip in the first embodiment;

[0043] Figure 13 It is a top - down projection schematic diagram of the first conductive pad, the second conductive pad, and the substrate in the first embodiment;

[0044] Figure 14 It is a top - down projection schematic diagram of the overall LED chip in the first embodiment, and it is a solid - line perspective structure schematic diagram;

[0045] Figure 15 It is a top - down projection schematic diagram of the top layer of the first mesa structure, the top layer of the second mesa structure, and the substrate in the second embodiment;

[0046] Figure 16 It is a top - down projection schematic diagram of the bridging current - blocking block, its same - layer structure, and the substrate in the second embodiment;

[0047] Figure 17 It is a top - down projection schematic diagram of the bridging conductive block, its same - layer structure, and the substrate in the second embodiment;

[0048] Figure 18 It is a common top - down projection schematic diagram of the layer where the bridging current - blocking block is located, the layer where the bridging conductive block is located, and the substrate in the second embodiment;

[0049] Figure 19 It is a top - down projection schematic diagram of the first conductive pad, the second conductive pad, and the substrate in the second embodiment;

[0050] Figure 20 It is a top - down projection schematic diagram of the overall LED chip in the second embodiment, and it is a solid - line perspective structure schematic diagram;

[0051] Figure 21 It is a top - down projection schematic diagram of the top layer of the first mesa structure, the top layer of the second mesa structure, and the substrate in the third embodiment;

[0052] Figure 22 It is a top-down projection schematic diagram of the bridging conductive block, its same-layer structure, and the substrate in the third embodiment;

[0053] Figure 23 It is a common top-down projection schematic diagram of the layer where the bridging current blocking block is located, the layer where the bridging conductive block is located, and the substrate in the third embodiment;

[0054] Figure 24 It is a top-down projection schematic diagram of the entire LED chip in the third embodiment and is a solid-line perspective structure schematic diagram;

[0055] Figure 25 It is a top-down projection schematic diagram of the top layer of the first mesa structure, the top layer of the second mesa structure, and the substrate in the fourth embodiment;

[0056] Figure 26 It is a top-down projection schematic diagram of the bridging current blocking block, its same-layer structure, and the substrate in the fourth embodiment;

[0057] Figure 27 It is a top-down projection schematic diagram of the bridging conductive block, its same-layer structure, and the substrate in the fourth embodiment;

[0058] Figure 28 It is a common top-down projection schematic diagram of the layer where the bridging current blocking block is located, the layer where the bridging conductive block is located, and the substrate in the fourth embodiment;

[0059] Figure 29 It is a top-down projection schematic diagram of the entire LED chip in the fourth embodiment and is a solid-line perspective structure schematic diagram;

[0060] Figure 30 It is a top-down projection schematic diagram of the top layer of the first mesa structure, the top layer of the second mesa structure, and the substrate in the fifth embodiment;

[0061] Figure 31 It is a top-down projection schematic diagram of the bridging current blocking block, its same-layer structure, and the substrate in the fifth embodiment;

[0062] Figure 32 It is a top-down projection schematic diagram of the bridging conductive block, its same-layer structure, and the substrate in the fifth embodiment;

[0063] Figure 33 It is a common top-down projection schematic diagram of the layer where the bridging current blocking block is located, the layer where the bridging conductive block is located, and the substrate in the fifth embodiment;

[0064] Figure 34 It is a top-down projection schematic diagram of the entire LED chip in the fifth embodiment and is a solid-line perspective structure schematic diagram. Detailed implementation manners

[0065] The present invention provides a new LED chip, an LED chip packaging module, and a display device. For a clearer illustration, the present invention will be described in detail below with reference to the accompanying drawings.

[0066] In this specification, simplified markings are adopted for each structure. Except for Figure 12 and Figure 14 , in the sectional view and the top-down projection, the same structure is only marked once respectively, so as to more clearly show the structure.

[0067] An LED chip according to an embodiment of the present invention is described with reference to Figures 1 to 14 , where Figure 14 is a top-down projection schematic diagram of each structure of the entire LED chip, and it shows a solid-line perspective schematic diagram, that is, each structure is superimposed and shown in solid lines.

[0068] As shown in Figures 1 to 14 , the LED chip includes a substrate 100, a first mesa structure 111, a second mesa structure 112, a cross-connected current blocking block 130 (refer to Figure 1 , Figure 4 and Figure 14 ), a cross-connected conductive block 150 (refer to Figure 7 , Figure 8 and Figure 14 ), a first conductive pad 171 (refer to Figure 12 , Figure 13 and Figure 14 ) and a second conductive pad 172 (refer to Figure 12 , Figure 13 and Figure 14 ).

[0069] Figure 1 It is shown that the first mesa structure 111 is located on the substrate 100, and the second mesa structure 112 is located on the substrate 100.

[0070] In this embodiment, the substrate 100 can be sapphire (Al2O3) or the like. As is well known in the art, the first mesa structure 111 and the second mesa structure 112 usually can include a first conductive-type semiconductor layer, a quantum well layer, and a second conductive-type semiconductor layer from bottom to top. The first conductive-type semiconductor layer serves as the bottom layer of the mesa structure, and it usually can include structures such as an N-type semiconductor layer and a buffer layer, that is, it is usually a stacked structure. The quantum well layer and the second conductive-type semiconductor layer usually can both be stacked structures, and the second conductive-type semiconductor layer usually can include a P-type semiconductor layer, which serves as the top layer of the mesa structure.

[0071] It should be noted that in other embodiments of the present invention, a third mesa structure (not shown) may also be included, that is, there can be more than three mesa structures. The corresponding series connection method and structure can be combined and referred to the entire content of this embodiment, and will not be elaborated here.

[0072] Figure 2 The top views of the top layer (second conductivity type semiconductor layer) of the first mesa structure 111, the top layer (second conductivity type semiconductor layer) of the second mesa structure 112, and the substrate 100 are shown separately. The top view of the top layer of the first mesa structure 111 has a concave notch 1111. The top view of the top layer of the second mesa structure 112 is a chamfered rectangle with two corner notches 1121, and the corner notches 1121 face the first mesa structure 111 and are symmetric. In other embodiments, there may also be only one corner notch 1121, and the corner notch 1121 may also be a structure similar to the concave notch 1111, exposing the first conductivity type semiconductor layer of the second mesa.

[0073] Figure 3 The top views of the first deep trench 121, the second deep trench 122, and the substrate 100 are shown separately. The first deep trench 121 and the second deep trench 122 are formed by a deep etching (ISO) process. They respectively surround the projections of the first mesa structure 111 and the second mesa structure 112, and a groove (not labeled) described later is formed between the regions surrounded by the first deep trench 121 and the second deep trench 122.

[0074] Figure 4 Shows Figure 1 In the structure shown, the top views of the bridging current blocking block 130, its same-layer structure, and the substrate are shown. The number of the bridging current blocking blocks 130 corresponds to the number of the notches 1121. In this embodiment, there are two. Combining Figures 1 to 4 it can be seen that the two bridging current blocking blocks 130 respectively cover a part of the upper surface and a part of the side surface of the first mesa structure 111, and cover a part of the groove (not labeled as described above) between the first mesa structure 111 and the second mesa structure 112.

[0075] Figure 7 The partial cross-sectional structure of the LED chip is shown. At this time, the topmost structure is the bridging conductive block 150.

[0076] Figure 8 It is shown that the number of the bridging conductive blocks 150 is the same as the number of the bridging current blocking blocks 130. Since there are two bridging current blocking blocks 130, there are also two bridging conductive blocks 150. The two bridging conductive blocks 150 are located on both sides (edge regions) of the die. In Figure 8 it is shown as the upper and lower sides, that is, the two bridging conductive blocks 150 are respectively located at two opposite edges of the entire top view area.

[0077] Combining Figure 7 and Figure 8It can be seen that the main body part of the bridging conductive block 150 is located on the bridging current blocking block 130. The first end of the bridging conductive block 150 is electrically connected to the top layer of the first mesa structure 111, and the second end of the bridging conductive block 150 is electrically connected to the bottom layer of the second mesa structure 112.

[0078] It should be noted that Figure 8 shows a dashed line (not labeled). This dashed line is used to illustrate the cutting direction of each cross-sectional schematic diagram of this embodiment, that is, each cross-sectional structure schematic diagram is cut along the Figure 8 shown broken line direction and then re-assembled onto a plane.

[0079] Figure 12 It is shown that the first conductive pad 171 is located above the first mesa structure 111, and the second conductive pad 172 is located above the second mesa structure 112. The first conductive pad 171 and the second conductive pad 172 can be various corresponding metals or alloys.

[0080] Figure 13 The top view projections of the first conductive pad 171, the second conductive pad 172, and the substrate 100 are separately shown.

[0081] Comparing Figure 8 and Figure 13 it can be concluded that in this embodiment, the top view projection of the bridging conductive block 150 does not overlap with the top view projections of the first conductive pad 171 and the second conductive pad 172, and this structural design can also be directly seen from Figure 14 .

[0082] Figure 14 It is shown that in this embodiment, the top view projections of the two bridging conductive blocks 150 are symmetrical, and a part of the top view projection of the first conductive pad 171 is sandwiched between the two bridging conductive blocks 150.

[0083] In this embodiment, both the bridging current blocking block 130 and the bridging conductive block 150 straddle the groove. The material of the bridging current blocking block 130 can be a corresponding transparent insulating material, such as SiO2, etc. The material of the bridging conductive block 150 can be various metals, metal conductive oxides, or other conductive materials, such as copper, silver, gold, or corresponding alloys, etc.

[0084] Please continue to refer to Figure 8 , in this embodiment, the top view projection of the bridging conductive block 150 has a first contact portion 1501, a junction portion 1502, and a second contact portion 1503. The junction portion 1502 straddles the groove. The outer end of the first contact portion 1501 is the first end, and the outer end of the second contact portion 1503 is the second end. The junction portion 1502 falls within the top view projection of the bridging current blocking block 130.

[0085] In this embodiment, the width of the junction part 1502 is greater than the width of the first contact part 1501, and the width of the second contact part 1503 is greater than the width of the junction part 1502. The width relationship of each part of the bridging conductive block 150 is reflected in Figure 8 the scale in the vertical direction, and the length of the bridging conductive block 150 is reflected in Figure 8 the scale in the horizontal direction. This design with different widths further optimizes the overall structure of the chip and improves the reliability.

[0086] The main part of the aforementioned bridging conductive block 150 is located on the bridging current blocking block 130, which is mainly manifested as: the junction part 1502 completely falls within the top view projection of the bridging current blocking block 130; most of the structures of the first contact part 1501 and the second contact part 1503 also fall within the top view projection of the bridging current blocking block 130, and a small section at the end of the first contact part 1501 and the second contact part 1503 crosses the bridging current blocking block 130 to achieve the corresponding electrical connection.

[0087] In this embodiment, the bisectors of the first contact part 1501, the junction part 1502, and the second contact part 1503 coincide on a straight line, that is, the top view projection of the entire bridging conductive block 150 is axially symmetric, like a nail-shaped structure with a flat top (i.e., the second contact part 1503) and a neck (i.e., the junction part 1502), and the first contact part 1501 is the nail part of the nail-shaped structure. This structure can better utilize the junction part 1502 to cross the groove, and utilize the wider front end of the second contact part 1503 to increase the corresponding conductive contact area, thereby being beneficial to improving the reliability of the product. Please refer to Figure 4 , in this embodiment, the top view projection of the bridging current blocking block 130 includes a head 1301 and a tail 1302.

[0088] Refer to Figure 9 , in each top view projection, the junction part 1502 falls within the head 1301, the first contact part 1501 falls within the tail 1302, and the second contact part 1503 has no overlapping part with the bridging current blocking block 130.

[0089] Continue to refer to Figure 9 , the part of the head 1301 that does not overlap with the junction part 1502 has a first width W1, and the part of the tail 1302 that does not overlap with the first contact part 1501 has a second width W2, and the first width W1 is greater than the second width W2. Figure 9 shows that the part of the head 1301 that does not overlap with the junction part 1502 surrounds the upper and lower sides of the junction part 1502, and the part of the tail 1302 that does not overlap with the first contact part 1501 surrounds the left side and the upper and lower sides of the first contact part 1501.

[0090] This design is because the head 1301 (of the jumper current blocking block 130) is located at the position of the groove, which is usually uneven. The current blocking block on the slope will be thinner, and during the etching process in the formation process, these parts of the current blocking block are prone to excessive etching. Therefore, in this embodiment, the width of the head 1301 is designed to be wider. At this time, it can better ensure the reliability of the structure above the groove (that is, mainly referring to the joint 1502 of the jumper conductive block 150), prevent phenomena such as leakage, and improve the product reliability. The directions of the first width W1 and the second width W2 are both perpendicular to the common bisector of the head 1301 and the tail 1302 in this embodiment, and can be directly referred to Figure 9 。

[0091] In this embodiment, Figure 9 the size of the shown first width W1 is between 3 μm and 100 μm. For example, it can specifically be 5 μm, 10 μm, 20 μm, 30 μm, or 50 μm, etc. The selection of these widths is to better ensure preventing corresponding leakage and ensuring good conductivity of the jumper conductive block 150.

[0092] In this embodiment, Figure 9 the size of the shown second width W2 is between 0 μm and 30 μm. For example, it can specifically be 0.5 μm, 1 μm, 5 μm, or 10 μm, etc., and the first width W1 is always greater than the second width W2.

[0093] Please return to refer to Figure 5 and Figure 6 , Figure 5 shows the partial cross-sectional structure of the LED chip. At this time, the topmost structure is the current spreading layer. From Figure 5 it can be seen that the LED chip further includes a first current spreading layer 141 and a second current spreading layer 142.

[0094] Figure 5 shows that the first current spreading layer 141 is located above the first mesa structure 111. Figure 12 shows that the first conductive pad 171 is located above the first current spreading layer 141. Figure 7 shows that the jumper conductive block 150 is electrically connected to the top layer of the first mesa structure 111 by connecting the first current spreading layer 141. Figure 5 shows that the second current spreading layer 142 is located above the second mesa structure 112, Figure 12 shows that the second conductive pad 172 is located above the second current spreading layer 142.

[0095] Figure 6 separately shows the top view projections of the first current spreading layer 141, the second current spreading layer 142, and the substrate 100.

[0096] FromFigure 6 and Figure 2 compare, and in combination with Figure 14 it can be seen that the top-down projection shapes of the first current spreading layer 141 and the top layer of the first mesa structure 111 are similar, and the first current spreading layer 141 falls within the first mesa structure 111. The top-down projection shapes of the second current spreading layer 142 and the top layer of the second mesa structure 112 are similar, and the second current spreading layer 142 falls within the second mesa structure 112. Therefore, Figure 6 it shows that the first current spreading layer 141 has a notch 1411 corresponding to the concave notch 1111, and the second current spreading layer 142 has two notches 1421 corresponding to the two corner notches 1121.

[0097] It should be specifically noted that the concave notch 1111 is caused by the difference between the bottom layer and the top layer's top-down projection of the first mesa structure 111. That is, the area corresponding to the concave notch 1111 still belongs to a part of the first mesa structure 111, and the corresponding first conductive block 151 is exactly located on this part of the bottom layer structure. However, the notch 1411 of the first current spreading layer 141 indicates that there is no corresponding current spreading layer structure at this position. Similarly, the corner notch 1121 is caused by the difference between the bottom layer and the top layer's top-down projection of the second mesa structure 112. That is, the area corresponding to the corner notch 1121 still belongs to a part of the second mesa structure 121. The corner notch 1121 corresponds to the bottom layer structure of the second mesa structure 112, and the second end of the bridging conductive block 150 is exactly connected to the bottom layer structure corresponding to the corner notch 1121. However, the notch 1421 of the second current spreading layer 142 indicates that there is no corresponding current spreading layer structure at this position.

[0098] In combination with Figure 6 and Figure 8 it can be seen that the top-down projection of the bridging conductive block 150 and the top-down projection of the second current spreading layer 142 have no overlapping part, and it can also be directly seen from Figure 14 However, the bridging conductive block 150 and the first current spreading layer 141 have an overlapping part. The overlapping part means the electrical connection between the bridging conductive block 150 and the first current spreading layer 141, and the overlapping structure can also be visually seen from Figure 7

[0099] Figure 10 shows the partial cross-sectional structure of the LED chip. At this time, the topmost structure is the first DBR reflective layer 160, that is, the LED chip further includes the first DBR reflective layer 160.

[0100] Figure 11 individually shows the top-down projection of the first DBR reflective layer 160.

[0101] In combination with Figure 10 and Figure 11 ​It can be seen that the first DBR reflective layer 160 covers the first current spreading layer 141 and the second current spreading layer 142. Figure 12 It is shown that the first conductive pad 171 is located on the first DBR reflective layer 160, and the first conductive pad 171 penetrates through the first DBR reflective layer 160 to electrically connect to the bottom layer of the first mesa structure 111. Figure 12 It is shown that the second conductive pad 172 is located on the first DBR reflective layer 160, and the second conductive pad 172 penetrates through the first DBR reflective layer 160 to electrically connect to the second current spreading layer 142.

[0102] In this embodiment, the first DBR reflective layer 160 also serves as a passivation protection layer, which not only simplifies the structure but also improves the reliability.

[0103] Refer to Figure 10 and Figure 11 , the positions where the first conductive pad 171 and the second conductive pad 172 penetrate through the first DBR reflective layer 160 utilize the first through hole 1601 and the second through hole 1602 of the first DBR reflective layer 160 respectively.

[0104] Please return to refer to Figure 1 and Figure 4 , the LED chip further includes an internal current blocking block 132. The internal current blocking block 132 and the bridging current blocking block 130 are of the same layer structure. The internal current blocking block 132 is located between the second mesa structure 112 and the second current spreading layer 142. Please refer to Figure 5 , Figure 7 , Figure 10 and Figure 12 .

[0105] It should be noted that in the chip structure, the same layer structure does not refer to the structures located on the same horizontal plane, but rather means: the structures that can be formed in the same process, which are formed together on the basis of the structure of the previous process and can be formed at different positions.

[0106] Continue to refer to Figure 4 , the top view projection of the internal current blocking block 132 includes a middle part 1321 and two side parts 1322 connecting the middle part 1321. The middle part 1321 is circular. The side parts 1322 are symmetrically arranged on both sides of the circle and are in an ear-like structure.

[0107] Please return to refer to Figure 7 and Figure 8 , the LED chip further includes a first conductive block 151. The first conductive block 151 and the bridging conductive block 150 are of the same layer structure. As mentioned above, the top view projection of the top layer of the first mesa structure 111 has an inward concave notch 1111 (the top view projection of the first mesa structure 111 is a chamfered rectangle with an inward concave notch 1111). Combining Figure 2 andFigure 8 It can be compared that the top view projection of the first conductive block 151 falls within the concave notch 1111 of the first tabletop structure 111, and this structural design can also be intuitively seen from Figure 14 this. In this embodiment, the top view projection of the first conductive block 151 is circular, as Figure 8 shown. As previously mentioned, the top view projection of the top layer of the second tabletop structure 112 is a chamfered rectangle with two corner notches 1121, and the corner notches 1121 face the first tabletop structure 111, and the two corner notches 1121 are symmetrical. The corner notches 1121 match the bridging conductive block 150. The specific matching is to achieve a mating structure of mutual nesting, that is, the top surface of the second tabletop structure 112 is offset from the bridging conductive block 150, while the bottom surface of the second tabletop structure 112 is connected to the bridging conductive block 150. Reference can be made in combination with Figure 12 and Figure 14 .

[0108] Please return to refer to Figure 7 and Figure 8 . The LED chip further includes a second conductive block 152. The second conductive block 152 and the bridging conductive block 150 are of the same layer structure. The second conductive block 152 is located above the built-in current blocking block 132 and on the second current spreading layer 142. The second conductive pad 172 is electrically connected to the second current spreading layer 142 by connecting the second conductive block 152. From Figure 7 and Figure 8 , it can be known that the top view projection of the second conductive block 152 falls within the top view projection of the built-in current blocking block 132.

[0109] Figure 7 shows that the second conductive block 152 and the built-in current blocking block 132 are separated by the second current spreading layer 142.

[0110] Figure 8 shows that the second conductive block 152 includes a core part 1521 and two wing parts 1522. The two wing parts 1522 are symmetrically located on both sides of the core part 1521. Combining reference with Figure 4 and Figure 8 , it can be known that the core part 1521 is located above the middle part 1321, and the core part 1521 falls within the middle part 1321; the wing parts 1522 are located above the side parts 1322, and the wing parts 1522 fall within the side parts 1322, and this can also be intuitively seen from Figure 14 .

[0111] As previously mentioned, the top view projection of the second conductive block 152 falls within the top view projection of the built-in current blocking block 132. Therefore, it can prevent direct downward injection of current. Direct reference can be made to Figure 14That is, the coordinated arrangement of the second conductive block 152 and the built-in current blocking block 132 enables the second current spreading layer 142 to fully exert its current spreading function, while preventing the current from being directly injected downward from the second conductive pad 172 on the second conductive block 152 to the mesa structure below the second conductive pad 172 .

[0112] In this embodiment, as mentioned above, the first DBR reflective layer 160 has a first through hole 1601 and a second through hole 1602 penetrating the first DBR reflective layer 160, and the second through hole 1602 is located above the middle of the core 1521 of the second conductive block 152. Figure 8 , Figure 10 and Figure 11 This structure can be intuitively compared to Figure 14 This structure design is directly derived from the conventional method of directly connecting the corresponding conductive structure to the end of the conductive structure. This structure ensures that the second conductive pad 172 is directly connected to the center of the core 1521 of the second conductive block 152, thereby ensuring that the current injection can be diffused from the middle of the second conductive block 152 to the surroundings (especially the two sides), and the two wings 1522 can also better assist the corresponding current diffusion effect, so the current diffusion effect is better and the chip reliability is higher.

[0113] Figure 12 As shown in FIG. 1 , the LED chip further includes a second DBR reflective layer 180 . The second DBR reflective layer 180 is located on the back side of the substrate 100 .

[0114] In the top view, the distances from the first conductive block 151 to the first conductive pad 171 and the second conductive pad 172 are equal. Figure 8 and Figure 13 , or you can directly refer to Figure 14 .

[0115] Figure 13 and Figure 14 It is shown that in the top view projection, the distances from the second conductive block 152 to the two bridging conductive blocks 150 are equal, or in other words, the top view projection of the second conductive block 152 falls on the common bisector of the first conductive pad 171 and the second conductive pad 172. This also means that the second through hole 1602 of the first DBR reflective layer 160 is set in the middle position in its width direction. Such a structure also ensures that the current injection can be diffused from the middle to both sides, the current diffusion effect is better, and the chip reliability is higher.

[0116] Figure 13 The top projection of the first conductive pad 171, the second conductive pad 172 and the substrate 100 is shown separately, from which it can be seen that the first conductive pad 171 adopts a convex design (protruding toward the second conductive pad 172 side), and Figure 8It can be seen that in the top-down projection, the first conductive pad 171 and the second conductive pad 172 do not overlap with the position of the bridging conductive block 150. It can also be referred to Figure 14 .

[0117] In this embodiment, the length direction of the bridging current blocking block 130 is perpendicular to the length direction of the built-in current blocking block 132. In other embodiments, the two length directions can also be parallel.

[0118] For the LED chip provided in this embodiment, through structural design, the top-down projection of the bridging conductive block 150 does not overlap with the top-down projections of the first conductive pad 171 and the second conductive pad 172, which can prevent chip leakage caused by the damage of the protective passivation layer (i.e., the first DBR reflective layer 160), that is, it can reduce the leakage path and improve the reliability of the product.

[0119] Furthermore, the top-down projection of the bridging conductive block 150 does not overlap with the top-down projection of the second current spreading layer 142 (on the contrary, the bridging conductive block 150 is connected to the bottom layer of the second mesa structure 112 below the second current spreading layer 142). In this structure, the bridging conductive block 150 is located at the edge of the die. During the grasping process of this LED chip, the problem of LED chip failure caused by the damage of the middle bridging conductive block by the ejector pin will not occur, improving the reliability of the product.

[0120] For the LED chip provided in this embodiment, two bridging conductive blocks 150 are designed. When a single bridging conductive block 150 is damaged, the die will not fail, making the reliability of the product better. At the same time, the two bridging conductive blocks 150 are both distributed on both sides of the die, which can further avoid the problem of LED chip failure caused by the damage of the middle bridging conductive block by the ejector pin, and further improve the reliability of the product.

[0121] For the LED chip provided in this embodiment, the corresponding first through hole 1601 of the first DBR reflective layer 160 is opened above the middle position of the top-down projection of the first conductive block 151, and the corresponding second through hole 1602 of the first DBR reflective layer 160 is opened above the middle position of the top-down projection of the second conductive block 152. It can be combined with reference to Figure 8 and Figure 11 , or directly refer to Figure 14 , which can make the corresponding current diffusion (expansion) effect better and the performance of the product better.

[0122] For the LED chip provided in this embodiment, setting the above-mentioned first width W1 greater than the second width W2 can better protect the bridging structure at the groove, achieving better anti-leakage and better ensuring the electrical connection effect, and further improving the reliability.

[0123] Another embodiment of the present invention provides another LED chip. Please refer to Figures 15 to 20 wherein Figure 20 is a top view projection schematic diagram of each structure of the entire LED chip. And, the cross-section of the previous embodiment can be combined Figure 12 because the cross-sectional structure of the LED chip in this embodiment is basically the same as that of the LED chip in the previous embodiment.

[0124] Refer to Figure 15 , the LED chip includes a substrate 100, a first mesa structure 111, a second mesa structure 112, a cross-connected current blocking block 130 (refer to Figure 16 and Figure 20 ), a cross-connected conductive block 150 (refer to Figure 17 and Figure 20 ), a first conductive pad 171 (refer to Figure 19 and Figure 20 ), and a second conductive pad 172 (refer to Figure 19 and Figure 20 ). The first mesa structure 111 is located on the substrate 100, and the second mesa structure 112 is located on the substrate 100.

[0125] Figure 15 Separate top views of the top layer of the first mesa structure 111, the top layer of the second mesa structure 112, and the substrate 100 are shown. The top view projection of the top layer of the first mesa structure 111 has an inward concave notch 1111. The top view projection of the top layer of the second mesa structure 112 is a chamfered rectangle with two corner notches 1121, and the corner notches 1121 face the first mesa structure 111 and are symmetric.

[0126] The corresponding deep trench projection is not separately shown in this embodiment. The deep trench projection can refer to that of the previous embodiment Figure 3 , or can also refer to Figure 20 .

[0127] Figure 16 It shows that there are two cross-connected current blocking blocks 130 in this embodiment.

[0128] Figure 17 It shows that there are also two cross-connected conductive blocks 150, which are respectively located at two opposite edges of the entire top view projection area.

[0129] Refer to Figure 18 which shows Figure 16 and Figure 17Schematic diagram after the structural layers are stacked together. The bridging current blocking block 130 includes a head portion 1301 and a tail portion 1302, which respectively have a junction portion 1502 and a first contact portion 1504 inside. In the top view projection, the junction portion 1502 falls within the head portion 1301, the first contact portion 1504 is located within the tail portion 1302, and the second contact portion 1505 does not overlap with the bridging current blocking block 130.

[0130] Reference Figure 18 , the non-overlapping part of the head portion 1301 and the junction portion 1502 has a first width W1, and the non-overlapping part of the tail portion 1302 and the first contact portion 1504 has a second width W2. The first width W1 is greater than the second width W2. Such a design is also to prevent phenomena such as leakage and improve product reliability.

[0131] In this embodiment, the size of the first width W1 is between 3 μm and 100 μm. For example, it can specifically be 5 μm, 10 μm, 20 μm, 30 μm, or 50 μm, etc. The selection of these widths is to better ensure preventing corresponding leakage and ensuring good conductivity of the bridging conductive block 150. The size of the second width W2 is between 0 μm and 30 μm. For example, it can specifically be 0.5 μm, 1 μm, 5 μm, or 10 μm, etc., and the first width W1 is always greater than the second width W2.

[0132] Figure 19 The top view projections of the first conductive pad 171, the second conductive pad 172, and the substrate 100 are separately shown. It can be seen that both the first conductive pad 171 and the second conductive pad 172 adopt a convex design. Moreover, a part of the top view projection of the second conductive pad 172 is also sandwiched between two bridging conductive blocks 150. The top view shape of the first conductive pad 171 and the top view shape of the second conductive pad 172 are basically symmetrical. The so-called "basically symmetrical" means that the top view shapes of the first conductive pad 171 and the second conductive pad 172 both present a chamfered rectangle with a pair of missing corners. Their differences are only that the corresponding missing corners are slightly different, including the size, shape, and angle of the missing corners, but they are generally symmetrical as Figure 19 shown.

[0133] In this embodiment, the top view projection of the bridging conductive block 150 does not overlap with the top view projections of the first conductive pad 171 and the second conductive pad 172, and this structural design can also be directly seen from Figure 20 it.

[0134] Figure 20 It shows that in this embodiment, the top view projections of the two bridging conductive blocks 150 are symmetrical, and a part of the top view projection of the first conductive pad 171 is sandwiched between the two bridging conductive blocks 150.

[0135] Please refer to the Figure 12, the LED chip of this embodiment also includes a first current spreading layer 141 and a second current spreading layer 142.

[0136] In this embodiment, the top view projection of the bridging conductive block 150 does not overlap with the top view projection of the second current spreading layer 142, and it can also be directly seen from Figure 20 . The top view projection of the bridging conductive block 150 has a corresponding overlapping part with the first current spreading layer 141.

[0137] The LED chip of this embodiment further includes a first DBR reflective layer 160. The first DBR reflective layer 160 has a first through hole 1601 and a second through hole 1602. For the corresponding content, reference can be made to the foregoing embodiments.

[0138] The LED chip further includes a built-in current blocking block 132. The top view projection of the built-in current blocking block 132 includes a middle part 1321 and two side parts 1322 connecting the middle part 1321.

[0139] The LED chip further includes a first conductive block 151. The top view projection of the first conductive block 151 falls within the concave notch 1111 of the first mesa structure 111, and this structural design can also be directly seen from Figure 20 .

[0140] The LED chip further includes a second conductive block 152. The top view projection of the second conductive block 152 falls within the top view projection of the built-in current blocking block 132. The second conductive block 152 includes a core part 1521 and two wing parts 1522. The core part 1521 is located above the middle part 1321, and the core part 1521 falls within the middle part 1321; the wing parts 1522 are located above the side parts 1322, and the wing parts 1522 fall within the side parts 1322, and it can also be directly seen from Figure 20 .

[0141] Please refer to the Figure 12 of the foregoing embodiments. The LED chip further includes a second DBR reflective layer 180. The second DBR reflective layer 180 is located on the back surface of the substrate 100.

[0142] In this embodiment, the length direction of the bridging current blocking block 130 is parallel to the length direction of the built-in current blocking block 132.

[0143] For more information about the structure, properties, and advantages of the LED chip provided in this embodiment, please refer to the corresponding content of the foregoing embodiments.

[0144] Different from the foregoing embodiments, Figure 15 shows that the shape of the corner notch 1121 in this embodiment is more special, which enables the second mesa structure 112 to be divided into three parts with different average widths. Figure 15In it, these three different parts are shown divided by dashed lines.

[0145] Different from the foregoing embodiment, correspondingly, the top view projection of the bridging conductive block 150 in this embodiment has a first contact portion 1504, a junction portion 1502, and a second contact portion 1505. The junction portion 1502 straddles the groove. The outer end of the first contact portion 1504 is the first end, and the outer end of the second contact portion 1505 is the second end. The junction portion 1502 falls within the top view projection of the bridging current blocking block 130.

[0146] Different from the foregoing embodiment, correspondingly, the width of the junction portion 1502 in this embodiment is greater than both the width of the first contact portion 1504 and the width of the second contact portion 1505, while the width of the finger portion 1504 and the width of the second contact portion 1505 may be equal. This width structure design helps to optimize the structure and improve the reliability.

[0147] Figure 15 The corner notch 1121 of Figure 17 cooperates with the bridging conductive block 150 of

[0148] such that in this application, the corresponding bridging series conductive effect is stronger and the reliability is further improved. Figure 17 Different from the foregoing embodiment, the bisector of the junction portion 1502 in this embodiment coincides with the bisector of the first contact portion 1504 on a first straight line (not shown), the bisector of the second contact portion 1505 is a second straight line (not shown), the first straight line is parallel to the second straight line, and the second contact portion 1505 connects the outer corner of the junction portion 1502 (the outer corner refers to the corner facing the more edge). They jointly define

[0149] It should be noted that the coincidence of the above bisectors is a coincidence under the design. In the ideal state, the actual product should also coincide. However, due to process and other factors, there may be a certain deviation in some actual products, which should be understood in this field.

[0150] In other embodiments, it may also be that the bisector of the junction portion coincides with the bisector of the second contact portion on a first straight line, the bisector of the first contact portion is a second straight line, the first straight line is parallel to the second straight line, and the first contact portion connects the inner corner of the junction portion (the inner corner refers to the corner facing the more middle area).

[0151] Different from the foregoing embodiment, in this embodiment, the common bisector of the middle portion 1321 and the side portion 1322 is a third straight line (not shown), and the third straight line is parallel to the first straight line.

[0152] Similar to the foregoing embodiments, Figure 20 shows that the top view projection of the bridging current blocking block 130 has a head 1301 and a tail 1302. In the top view projection, the junction part 1502 falls within the head 1301, the first contact part 1504 falls within the tail 1302, and the second contact part 1505 does not overlap with the bridging current blocking block 130.

[0153] In this embodiment, the width of the head 1301 is more than 1.5 times the width of the tail 1302. For example, specifically, it can be 1.5 times, 2 times, or 2.5 times, etc.

[0154] Another embodiment of the present invention provides another LED chip. Please refer to Figures 21 to 24 where Figure 24 is a schematic top view projection of each structure of the entire LED chip. And, the cross-section of the foregoing embodiment can be combined Figure 12 because the cross-sectional structure of this embodiment is basically the same as that of the foregoing embodiment.

[0155] Most of the structures of the LED chip provided in this embodiment are the same as those of the LED chip shown in Figures 15 to 20 . Therefore, the corresponding content of the foregoing embodiment can be referred to.

[0156] The difference between this embodiment and the embodiment shown in Figures 15 to 20 lies in two aspects: First, as shown in Figure 21 , the shape of the concave notch 1111 formed by the top view projection of the first mesa structure 111 in this embodiment is different; Second, as shown in Figure 22 , correspondingly, the shape of the top view projection of the first conductive block 151 in this embodiment is different. In this embodiment, the top view projection of the concave notch 1111 is funnel-shaped, and the top view projection of the first conductive block 151 is nail-shaped with a round head.

[0157] Referring to Figure 23 shows the schematic diagram after the layer structure of the bridging conductive block 150 and the layer structure of the bridging current blocking block 130 (which can refer to Figure 22 of the foregoing embodiment) in Figure 16 are stacked together. The head 1301 and the tail 1302 included in the bridging current blocking block 130 respectively have a junction part 1502 and a first contact part 1504 inside. In the top view projection, the junction part 1502 falls within the head 1301, the first contact part 1504 is located within the tail 1302, and the second contact part 1505 does not overlap with the bridging current blocking block 130.

[0158] Referring to Figure 23, the portion of the head 1301 that does not overlap with the junction portion 1502 has a first width W1, and the portion of the tail 1302 that does not overlap with the first contact portion 1504 has a second width W2, and the first width W1 is greater than the second width W2. Such a design is also for preventing phenomena such as electric leakage and improving the product reliability.

[0159] The design that the first conductive block 151 also falls within the concave notch 1111 of the first mesa structure 111 can be referred to Figure 24 .

[0160] In this embodiment, the concave notch 1111 is located on the bisector (not shown) of the top view projection of the first mesa structure, and this bisector also bisects the concave notch 1111 and the first conductive block 151. That is, when the top view projection of the first conductive block 151 is in the shape of a nail with a round head, the bisector of this nail shape with a round head is also parallel to Figures 15 to 20 the first straight line described in the illustrated embodiment. Such a design is also beneficial to the expansion of the corresponding current.

[0161] For more information about the structure, properties, and advantages of the LED chip provided in this embodiment, please refer to Figures 15 to 20 the corresponding content of the illustrated embodiment.

[0162] Another embodiment of the present invention provides another LED chip. Please refer to Figures 25 to 29 in combination, where Figure 29 is the top view projection schematic diagram of each structure of the entire LED chip. And, its cross-sectional structure can be combined with the cross-section of the foregoing embodiment Figure 12 .

[0163] Some structures of the LED chip provided in this embodiment are the same as those in the foregoing embodiment. Therefore, the corresponding content of the foregoing embodiment can be referred to.

[0164] In this embodiment, as Figure 25 shown, the top view projection of the second mesa structure 112 also forms a concave notch 1122, rather than forming a corner notch, and the number of the concave notches 1122 is one.

[0165] More importantly, as Figure 26 shown, in this embodiment, there is only one cross-connect current blocking block 130, which includes a head 1301 and a tail 1302, and the width of the tail 1302 is greater than the width of the head 1301.

[0166] Correspondingly, as Figure 27As shown, there is also only one bridging conductive block 150, which is located at the middle position of the entire top-down projection area. The bridging conductive block 150 includes a junction part 1502, a first contact part 1506, and a second contact part 1507. The width of the first contact part 1506 is greater than that of the second contact part 1507, and the width of the second contact part 1507 is greater than that of the junction part.

[0167] In this embodiment, only one bridging current blocking block 130 and one bridging conductive block 150 are designed. However, accordingly, they are set at the middle position of the entire top-down structure, and their widths are correspondingly increased, which helps to improve their electrical conductivity and thus improve the product reliability.

[0168] Reference Figure 28 shows Figure 26 and Figure 27 a schematic diagram after the structures shown are stacked together. The bridging current blocking block 130 includes a head part 1301 and a tail part 1302, and the junction part 1502 and the first contact part 1506 are respectively inside them. In the top-down projection, the junction part 1502 falls inside the head part 1301, the first contact part 1506 is located inside the tail part 1302, and the second contact part 1507 does not overlap with the bridging current blocking block 130.

[0169] Reference Figure 28 shows that the part of the head part 1301 that does not overlap with the junction part 1502 has a first width W1, and the part of the tail part 1302 that does not overlap with the first contact part 1506 has a second width W2, and the first width W1 is greater than the second width W2. Such a design is also for preventing phenomena such as electric leakage and improving the product reliability.

[0170] For more information about the structure, properties, and advantages of the LED chip provided in this embodiment, please refer to the corresponding content of the foregoing embodiments.

[0171] Another embodiment of the present invention provides another LED chip. Please refer to Figures 30 to 34 in combination, where Figure 34 is a top-down projection schematic diagram of each structure of the entire LED chip. Moreover, its cross-sectional structure can be combined with the cross-section of the foregoing embodiment Figure 12 .

[0172] Some structures of the LED chip provided in this embodiment are the same as those in the foregoing embodiment. Therefore, the corresponding content of the foregoing embodiment can be referred to.

[0173] In this embodiment, as Figure 30 shown, the concave notch 1111 in the top-down projection of the first mesa structure 111, different from the foregoing embodiment, the concave notch 1111 in this embodiment is set at Figure 30 the upper left corner position of the top-down projection of the first mesa structure 111.

[0174] The top-down projection of the second tabletop structure 112 has a corner notch 1121, and the position of the corner notch 1121 is different from that of the previous embodiment. It is only provided at Figure 30 the lower left corner of the first tabletop structure 111 in

[0175] As Figure 31 shown, in this embodiment, there is also only one bridging current blocking block 130, which includes a head 1301 and a tail 1302. Figure 26 On the contrary, in this embodiment, the width of the tail 1302 is smaller than the width of the head 1301.

[0176] Correspondingly, as Figure 32 shown, there is also only one bridging conductive block 150, which is located at the relative edge of the top-down projection area. The bridging conductive block 150 includes a junction part 1502, a first contact part 1508, and a second contact part 1509. The first end part 1508 is linear, and the second contact part 1509 is not only connected to the lower side corner of the junction part 1502, but in this embodiment, the second contact part 1509 itself has a corner structure.

[0177] In this embodiment, only one bridging current blocking block 130 and one bridging conductive block 150 are designed. At the same time, the concave notch 1111 and the corner notch 1121 are arranged at different corner positions of the product, one at the upper corner and one at the lower corner, which also helps to expand the current and improve the reliability of the product.

[0178] Referring to Figure 33 , it shows Figure 31 and Figure 32 the schematic diagram after the structures shown are stacked together. The head 1301 and the tail 1302 included in the bridging current blocking block 130 respectively have a junction part 1502 and a first contact part 1508 inside. In the top-down projection, the junction part 1502 falls within the head 1301, the first contact part 1508 is located within the tail 1302, and the second contact part 1509 does not overlap with the bridging current blocking block 130.

[0179] Referring to Figure 33 , the part of the head 1301 that does not overlap with the junction part 1502 has a first width W1, and the part of the tail 1302 that does not overlap with the first contact part 1508 has a second width W2. The first width W1 is greater than the second width W2. Such a design is also to prevent phenomena such as leakage and improve the reliability of the product.

[0180] For more information about the structure, properties, and advantages of the LED chip provided in this embodiment, please refer to the corresponding content of the previous embodiments.

[0181] An embodiment of the present invention further provides an LED chip packaging module (not shown), and the LED chip packaging module may include any one of the LED chips in the foregoing embodiments. Therefore, the reliability of the LED chip packaging module is improved.

[0182] An embodiment of the present invention further provides a display device. The display device may include any one of the LED chips in the foregoing embodiments. The LED chip serves as a backlight source chip of the backlight module of the display device. Therefore, the reliability of the display device is improved.

[0183] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. An LED chip, characterized in that, Comprising: A substrate; A first mesa structure located on the substrate; A second mesa structure located on the substrate; A first current spreading layer located above the first mesa structure; A second current spreading layer located above the second mesa structure; A bridging current blocking block covering a part of the upper surface and part of the side surface of the first mesa structure, and covering a part of the groove between the first mesa structure and the second mesa structure; Two bridging conductive blocks respectively located at two opposite edges of the entire top view projection area, a first end of the bridging conductive block being electrically connected to the top layer of the first mesa structure, and a second end of the bridging conductive block being electrically connected to the bottom layer of the second mesa structure; An in-built current blocking block located between the second mesa structure and the second current spreading layer; A second conductive block located above the in-built current blocking block and on the second current spreading layer; The top view projection of the bridging conductive block has a first contact portion, a junction portion and a second contact portion, wherein the first contact portion is electrically connected to the top layer of the first mesa structure, and the second contact portion is electrically connected to the bottom layer of the second mesa structure; The bisector of the junction portion coincides with the bisector of the first contact portion on a first straight line, the bisector of the second contact portion is a second straight line, and the first straight line is parallel to the second straight line; the second contact portion connects to the outer corner of the junction portion; A first conductive pad located above the first mesa structure; A second conductive pad located above the second mesa structure, The top view projection of the bridging conductive block has no overlapping part with the top view projections of the first conductive pad and the second conductive pad.

2. The LED chip according to claim 1, wherein The main body part of the bridging conductive block is located on the bridging current blocking block.

3. The LED chip according to claim 2, wherein The top view projection of the bridging current blocking block has a head and a tail; the junction portion falls within the head, and the first contact portion falls within the tail.

4. The LED chip according to claim 2, wherein There are two bridging current blocking blocks, and they are respectively located at two opposite edges of the entire top view projection area.

5. The LED chip according to claim 1, characterized in that: In the top view projection, the distances from the second conductive block to the two bridging conductive blocks are equal.

6. The LED chip according to claim 1, characterized in that: It further includes a first DBR reflective layer covering the exposed surfaces of the first mesa structure and the second mesa structure, and the bridging conductive block, having a first through hole and a second through hole; the second conductive block includes a core part and two wing parts located on both sides of the core part; the top view projection of the second through hole falls on the core part of the second conductive block.

7. The LED chip according to claim 6, wherein The first conductive pad and the second conductive pad are arranged above the first DBR reflective layer, wherein the first conductive pad is electrically connected to the bottom layer of the first mesa structure through the first through hole; the second conductive pad is electrically connected to the second conductive block through the second through hole.

8. The LED chip according to claim 7, wherein A part of the top view projection of the second conductive pad is sandwiched between the two bridging conductive blocks.

9. The LED chip according to claim 7, wherein: The top view projection of the second conductive block extends beyond the top view projection of the second conductive pad.

10. The LED chip according to claim 1, wherein The top view projection of the built-in current blocking block includes a middle part and two side parts connecting the middle part, and the width of the middle part is greater than the width of the side parts.

11. The LED chip according to claim 10, wherein, The top view projection of the second conductive block falls within the top view projection of the built-in current blocking block.

12. The LED chip according to claim 1, characterized in that, It further includes a first conductive block. The top view projection of the top layer of the first mesa structure has a concave notch, and the top view projection of the first conductive block falls within the concave notch of the first mesa structure.

13. The LED chip according to claim 12, wherein, The concave notch is located on the bisector of the top view projection of the first mesa structure, and this bisector also bisects the first conductive block.

14. The LED chip according to claim 1, wherein, The top view projection of the top layer of the second mesa structure is a chamfered rectangle with two corner notches. The corner notches face the first mesa structure, and the two corner notches are symmetrical; the corner notches match the bridging conductive block.

15. An LED chip packaging module, characterized in that, It includes the LED chip according to any one of claims 1 to 14.

16. A display device, characterized in that, It includes the LED chip according to any one of claims 1 to 14.

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