A sensor module, a sensor module manufacturing method, and a display device

Abstract

This invention discloses a sensor module, a method for fabricating the sensor module, and a display device, comprising: a flexible substrate; at least one sensor; and a bonding assembly including a first fitting structure and at least one second fitting structure; the first fitting structure includes at least one fitting through-hole, and the second fitting structure is located within the fitting through-hole; the shape of the first fitting structure facing the second fitting structure matches the shape of the second fitting structure facing the first fitting structure; the sensor is bonded to one side of the flexible substrate via the bonding assembly; and the sensor overlaps with at least one second fitting structure in a direction perpendicular to the plane of the flexible substrate. This invention provides a technical solution to reduce the bonding marks between the flexible substrate and the sensor, thereby improving the display effect of the display device including the sensor module.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a sensor module, a method for manufacturing the sensor module, and a display device. Background Technology

[0002] With the rapid development of display technology, people have increasingly higher requirements for the quality of display panels. Display panels typically integrate sensors with non-display functions, such as fingerprint recognition sensors. These sensors are usually bonded to the substrate of the display panel using adhesive.

[0003] However, when bonding the sensor, the stress on the inner and outer sides of the bonding edge is inconsistent, and there is a clear dividing line between the inner and outer deformation areas. Visible marks are formed near this dividing line. When the substrate is a flexible substrate, these marks can be seen from the display surface of the display panel, becoming a display defect and affecting the display effect of the display panel. Summary of the Invention

[0004] This invention provides a sensor module, a method for manufacturing the sensor module, and a display device, which reduces the bonding marks between the flexible substrate and the sensor, thereby improving the display effect of the display device including the sensor module.

[0005] In a first aspect, embodiments of the present invention provide a sensor module, comprising:

[0006] Flexible substrate;

[0007] At least one sensor;

[0008] A bonding assembly includes a first fitting structure and at least one second fitting structure; the first fitting structure includes at least one fitting through hole, and the second fitting structure is located within the fitting through hole; the shape of the first fitting structure facing the second fitting structure matches the shape of the second fitting structure facing the first fitting structure.

[0009] The sensor is attached to one side of the flexible substrate via the bonding assembly; in a direction perpendicular to the plane of the flexible substrate, the sensor overlaps with at least one of the second interlocking structures.

[0010] Secondly, embodiments of the present invention also provide a method for manufacturing a sensor module, comprising:

[0011] A flexible substrate, a bonding assembly, and at least one sensor are provided; the bonding assembly includes a first fitting structure and at least one second fitting structure; the first fitting structure includes at least one fitting through-hole;

[0012] The sensor is attached to the second fitting structure;

[0013] The second fitting structure, which is attached to the sensor, is placed inside the fitting through hole so that the shape of the second fitting structure facing the first fitting structure matches the shape of the first fitting structure facing the second fitting structure.

[0014] The first interlocking structure is attached to the flexible substrate; wherein, in a direction perpendicular to the plane of the flexible substrate, the sensor overlaps with at least one of the second interlocking structures.

[0015] Thirdly, embodiments of the present invention also provide a display device, including any of the sensor modules described in the first aspect.

[0016] In this embodiment of the invention, by bonding the sensor to the flexible substrate via a bonding assembly, the sensor does not directly contact the flexible substrate. Instead, the sensor is bonded to the bonding assembly, and then the bonding assembly bonds to the flexible substrate, thereby reducing the imprint caused by sensor bonding. Simultaneously, because the second fitting structure of the bonding assembly is located within the fitting through-hole of the first fitting structure, and the sensor overlaps with at least one second fitting structure in a direction perpendicular to the plane of the flexible substrate, the first and second fitting structures can limit the compression of the sensor edges against the flexible substrate during bonding. This allows for a greater degree of reduction, thereby weakening or even eliminating the imprint caused by the sensor bonding, and thus improving the display effect of the display device including the sensor module. In addition, since the second fitting structure is placed inside the fitting through hole of the first fitting structure, and the shape of the first fitting structure facing the second fitting structure matches the shape of the second fitting structure facing the first fitting structure, the first fitting structure and the second fitting structure can be located in the same layer, which helps to reduce the film thickness of the sensor module. When the sensor module is applied to the display device, it can meet the requirements of the display device to be thinner and lighter. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, although the drawings described below are some specific embodiments of the present invention, those skilled in the art can extend and extend the basic concepts of the device structure, driving method and manufacturing method disclosed and indicated by various embodiments of the present invention to other structures and drawings. Undoubtedly, these should all be within the scope of the claims of the present invention.

[0018] Figure 1 This is a cross-sectional structural diagram of a sensor module provided in an embodiment of the present invention;

[0019] Figure 2 This is a bottom view diagram of a sensor module provided in an embodiment of the present invention;

[0020] Figure 3 This is a bottom view schematic diagram of another sensor module provided in an embodiment of the present invention;

[0021] Figure 4 for Figure 2 A partially enlarged structural diagram;

[0022] Figure 5 This is a cross-sectional structural diagram of another sensor module provided in an embodiment of the present invention;

[0023] Figure 6 This is a bottom view structural diagram of another sensor module provided in an embodiment of the present invention;

[0024] Figure 7 This is a bottom view structural diagram of another sensor module provided in an embodiment of the present invention;

[0025] Figure 8 This is a bottom view structural diagram of another sensor module provided in an embodiment of the present invention;

[0026] Figure 9 This is a bottom view structural diagram of another sensor module provided in an embodiment of the present invention;

[0027] Figure 10 This is a cross-sectional structural diagram of another sensor module provided in an embodiment of the present invention;

[0028] Figure 11 This is a cross-sectional structural diagram of another sensor module provided in an embodiment of the present invention;

[0029] Figure 12 This is a cross-sectional structural diagram of another sensor module provided in an embodiment of the present invention;

[0030] Figure 13 This is a cross-sectional structural diagram of another sensor module provided in an embodiment of the present invention;

[0031] Figure 14 A flowchart illustrating a method for fabricating a sensor module according to an embodiment of the present invention;

[0032] Figure 15 This is a schematic diagram of a display device provided in an embodiment of the present invention. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this invention. Obviously, the described embodiments are only some embodiments of this invention, not all embodiments. Based on the basic concepts disclosed and indicated in the embodiments of this invention, all other embodiments obtained by those skilled in the art are within the scope of protection of this invention.

[0034] In view of the problems in the background art, embodiments of the present invention provide a sensor module, including: a flexible substrate; at least one sensor; a bonding assembly including a first fitting structure and at least one second fitting structure; the first fitting structure includes at least one fitting through hole, and the second fitting structure is located within the fitting through hole; the shape of the first fitting structure facing the second fitting structure matches the shape of the second fitting structure facing the first fitting structure; the sensor is bonded to one side of the flexible substrate through the bonding assembly; in a direction perpendicular to the plane of the flexible substrate, the sensor overlaps with at least one second fitting structure.

[0035] By employing the above technical solution, the sensor is bonded to the flexible substrate via a bonding assembly, preventing direct contact between the sensor and the flexible substrate. Instead, the sensor is bonded to the bonding assembly, which then bonds to the flexible substrate, thus minimizing the imprint caused by sensor bonding. Simultaneously, because the second fitting structure of the bonding assembly is located within the fitting through-hole of the first fitting structure, and the sensor overlaps with at least one second fitting structure in a direction perpendicular to the plane of the flexible substrate, the first and second fitting structures can limit the squeezing of the sensor edges onto the flexible substrate during bonding. The pressure is increased, which can further weaken or even eliminate the imprint caused by the bonding of the sensor, thereby improving the display effect of the display device including the sensor module; in addition, since the second fitting structure is placed in the fitting through hole of the first fitting structure, and the shape of the first fitting structure facing the second fitting structure matches the shape of the second fitting structure facing the first fitting structure, the first fitting structure and the second fitting structure can be located in the same layer, which helps to reduce the film thickness of the sensor module. When the sensor module is applied to the display device, it can meet the requirements of the display device to be thinner and lighter.

[0036] The above is the core idea of ​​this application. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0037] Figure 1This is a cross-sectional structural diagram of a sensor module provided in an embodiment of the present invention, with reference to... Figure 1 As shown, the sensor module includes a flexible substrate 10; at least one sensor 20; and a bonding assembly 30, including a first fitting structure 31 and at least one second fitting structure 32. The first fitting structure 31 includes at least one fitting through hole 311, and the second fitting structure 32 is located within the fitting through hole 311. The shape of the first fitting structure 31 facing the second fitting structure 32 matches the shape of the second fitting structure 32 facing the first fitting structure 31. The sensor 20 is bonded to one side of the flexible substrate 10 through the bonding assembly 30. In the direction Z perpendicular to the plane of the flexible substrate 10, the sensor 20 overlaps with at least one second fitting structure 32.

[0038] It is understood that the material of the flexible substrate 10 includes at least one of polyimide, polyethylene terephthalate, polycarbonate, polyarylate, and polyethersulfone, and this embodiment of the invention does not limit this. The sensor 20 includes, but is not limited to, a fingerprint sensor.

[0039] The sensor 20 is bonded to one side of the flexible substrate via a bonding assembly 30. The bonding assembly 30 includes a first fitting structure 31 and a second fitting structure 32, with the sensor 20 overlapping at least one of the second fitting structures 32. The second fitting structure 32 is located within a fitting through-hole 311 of the first fitting structure 31, forming a mutually matching bonding layer. In this configuration, the sensor 20 can first be bonded to the second fitting structure 32, and then fitted into the first fitting structure 31 via the second fitting structure 32, thus achieving bonding between the sensor 20 and the bonding assembly 30. Furthermore, by bonding the assembly 30 to the flexible substrate 10, the sensor 20 is bonded to the flexible substrate 10.

[0040] During the bonding process of sensor 20 to flexible substrate 10 via bonding assembly 30, pressure needs to be applied to sensor 20. At this time, in the direction Z perpendicular to the plane of flexible substrate 10, the second fitting structure 32 overlapping with sensor 20 will be subjected to pressure. That is, the pressure when bonding sensor 20 is not directly applied to flexible substrate 10, but directly applied to second fitting structure 32. This means that the pressure applied to sensor 20 needs to be transmitted to flexible substrate 10 through second fitting structure 32, thereby reducing the pressure transmitted to flexible substrate 10 and weakening the imprint generated on flexible substrate 10 due to pressure applied to sensor 20. At the same time, since the second fitting structure 32 is fitted into the fitting through hole 311 of the first fitting structure 31, and the second fitting structure 32 is fitted into the first fitting through hole 311, and the second fitting structure 32 is fitted into the first fitting through hole 311, and the second fitting through hole 311 is fitted into the first fitting through hole 311, the second fitting through hole 311 is fitted into the first fitting through hole 311. The edge of the fitting through hole 311 of the fitting structure 31 matches the edge shape of the second fitting structure 32, so that the pressure applied to the sensor 20 is transmitted to the first fitting structure 31 through the second fitting structure 32, so as to be distributed on the first fitting structure 31 and the second fitting structure 32, reducing the concentrated force on the second fitting structure 32 at a certain point or in a certain area, increasing the force-bearing area, so that the bonding assembly 30 can uniformly process the pressure applied by the sensor 20, limit the degree of compression of the edge of the sensor 20 on the flexible substrate 10 during bonding, and thus make the pressure on the flexible substrate 10 uniform, weakening or even eliminating the indentation caused by uneven force on the flexible substrate 10. Therefore, when the sensor module is applied to the display device, the display effect of the display device can be improved.

[0041] Optionally, the elastic modulus of the first interlocking structure 31 and the second interlocking structure 32 is greater than or equal to 1 GPa. In this way, the first interlocking structure 31 and the second interlocking structure 32 can have greater hardness, so that when the sensor 20 is bonded to the flexible substrate 10 through the bonding component 30, the first interlocking structure 31 and the second interlocking structure 32 will not undergo large deformation due to large pressure. This allows the first interlocking structure 31 and the second interlocking structure 32 to buffer and disperse the pressure, ensuring that the bonding component 30 can effectively disperse the pressure at the concentrated force point, thereby weakening or eliminating the indentation formed on the flexible substrate 10 due to the pressure on the sensor 20.

[0042] Optionally, the material of the first interlocking structure 31 includes a polymer material or a metal material; the material of the second interlocking structure 32 includes a polymer material or a metal material.

[0043] Specifically, the polymer material can be a polymer material with relatively high hardness. The metal material includes foil, copper, silver, etc. The embodiments of the present invention do not limit this. It can be understood that both the first fitting structure 31 and the second fitting structure 32 need to have a relatively high elastic modulus to ensure that during the process of the sensor 20 pressing the first fitting structure 31 and the second fitting structure 32, the first fitting structure 31 and the second fitting structure 32 will not undergo obvious deformation and can play a certain supporting role for the sensor 20. Among them, the materials of the first fitting structure 31 and the second fitting structure 32 can be the same or different. The embodiments of the present invention do not specifically limit this.

[0044] In an optional embodiment, the materials of the first fitting structure 31 and the second fitting structure 32 can be the same material. At this time, the same process and the same equipment can be used to prepare the first fitting structure 31 and the second fitting structure 32, so as to simplify the preparation process of the fitting component and help reduce the manufacturing cost of the sensor module including the first fitting structure 31 and the second fitting structure 32.

[0045] Optionally, continue to refer to Figure 1 As shown, the value range of the thickness T1 of the first fitting structure 31 is: 0μm < T1 ≤ 200μm; the value range of the thickness T2 of the second fitting structure 32 is: 0μm < T2 ≤ 200μm.

[0046] Among them, setting the maximum values of T1 and T2 to 200μm can ensure that while the fitting component 30 can effectively weaken the indentation at the edge of the sensor 20, the thickness of the entire module can be further reduced, which is beneficial to the thinning of the display device including the sensor module. The values of the thickness T1 of the first fitting structure 31 and the thickness T2 of the second fitting structure 32 can be the same or different. The embodiments of the present invention do not specifically limit this.

[0047] In an optional embodiment, the thickness of the first fitting structure 31 is the same as the thickness of the second fitting structure 32. In this way, when the second fitting structure 32 is placed in the fitting through hole of the first fitting structure 31, the surfaces of the first fitting structure 31 and the second fitting structure 32 close to and / or away from the flexible substrate 10 can be flush, which is convenient for subsequent assembly and reduces the process difficulty.

[0048] It can be understood that the first fitting structure 31 and the second fitting structure 32 can be prepared in the same layer. At this time, the entire fitting layer can be prepared and then the fitting layer can be cut to obtain the first fitting structure 31 and the second fitting structure 32 respectively, which can further simplify the preparation process and reduce the manufacturing cost.

[0049] It should be noted that the shape of the first fitting structure 31 facing the second fitting structure 32 can be any shape. As long as the first fitting structure 31 and the second fitting structure 32 can be matched, the embodiments of the present invention do not limit this.

[0050] In an optional embodiment, Figure 2 This is a bottom view schematic diagram of a sensor module provided in an embodiment of the present invention, with reference to... Figure 2 As shown, the surface of the second fitting structure 32 facing the first fitting structure 31 has a concave-convex structure.

[0051] Specifically, the concave-convex structure can be any shape with grooves and protrusions; this embodiment of the invention does not limit this. For example... Figure 2 As shown, when the surface of the second fitting structure 32 facing the first fitting structure 31 is a rectangular concave-convex structure, the surface of the first fitting structure 31 facing the second fitting structure 32 is also a rectangular concave-convex structure that complements the aforementioned rectangular concave-convex structure; or, as... Figure 3 As shown, when the surface of the second fitting structure 32 facing the first fitting structure 31 is an arc-shaped concave-convex structure, the surface of the first fitting structure 31 facing the second fitting structure 32 is an arc-shaped concave-convex structure that complements the aforementioned arc-shaped concave-convex structure.

[0052] Thus, by setting the surface of the second fitting structure facing the first fitting structure as a concave-convex structure, and setting the surface of the first fitting structure 31 facing the second fitting structure 32 as a concave-convex structure, the alignment of the first fitting structure 31 and the second fitting structure 32 can be facilitated, thereby simplifying the assembly of the first fitting structure 31 and the second fitting structure 32. Simultaneously, when the sensor 20 is attached, the sensor 20 transmits the pressure it receives to the second fitting structure. Since the edge of the second fitting structure 32 is a concave-convex structure that matches the fitting through hole 311 of the first fitting structure 31, the second fitting... Structure 32 disperses the pressure from its contact with sensor 20 at the concave-convex structure. Because the distance between the concave and convex positions on the side of the second fitting structure 32 facing the first fitting structure 31 and the stress point is different, the stress on the concave and convex positions on the side of the second fitting structure 32 facing the first fitting structure 31 is different, thus preventing the formation of obvious marks. This further weakens the marks formed by the edge of sensor 20 pressing against the flexible substrate 10, thereby improving the display effect of the display device when the sensor module is applied to the display device.

[0053] It should be noted that, Figure 2 and Figure 3 The accompanying drawings are merely illustrative of embodiments of the present invention. Figure 2 and Figure 3 Only an exemplary upward view structural schematic diagram of the concave-convex structure on the surface of the second fitting structure 32 facing the first fitting structure 31 is shown. In the embodiment of the present invention, the shape of the concave-convex structure on the surface of the second fitting structure 32 facing the first fitting structure 31 includes but is not limited to Figure 2 and Figure 3 the structures shown. No further examples will be given here for illustration. For the sake of convenience in description, without special limitations, the embodiments of the present invention are all based on Figure 2 the shape of the concave-convex structure on the surface of the second fitting structure 32 facing the first fitting structure 31 shown as an example to exemplarily illustrate the technical solutions of the embodiments of the present invention.

[0054] Optionally, continue to refer to Figure 2 shown. The value range of the distance L between the bottom of the groove and the top of the protrusion in the concave-convex structure in the first direction X is: 0.1 mm < L < 10 mm; the first direction X is parallel to the plane where the flexible substrate 10 is located.

[0055] Specifically, due to the limitations of the manufacturing process and the requirement of effectively weakening the imprint formed by the extrusion of the edge of the sensor 20 on the flexible substrate 10, the minimum value of the distance L between the bottom of the groove and the top of the protrusion in the concave-convex structure cannot be lower than 0.1 mm. At the same time, considering the size of the sensor 20 and the second fitting structure 32 can quickly disperse the pressure to achieve the effect of effectively weakening the imprint formed by the extrusion of the edge of the sensor 20 on the flexible substrate 10, the maximum value of the distance L between the bottom of the groove and the top of the protrusion in the concave-convex structure cannot be higher than 10 mm.

[0056] Optionally, Figure 4 is Figure 2 a partial enlarged structural schematic diagram. Referring to Figure 4 shown, the value range of the distance W between the surface of the second fitting structure 32 facing the first fitting structure 31 and the surface of the first fitting structure 31 facing the second fitting structure 32 is: 0.05 mm ≤ W ≤ 1 mm.

[0057] Specifically, since both the first interlocking structure 31 and the second interlocking structure 32 have a certain elastic modulus, they will undergo slight deformation when subjected to greater pressure. If the first interlocking structure 31 and the second interlocking structure 32 are not seamlessly matched, problems such as protrusions or unevenness caused by mutual compression will occur at the matching point, thus affecting the high-quality bonding between the sensor 20 and the flexible substrate 10. Therefore, a certain distance W is provided between the surface of the second interlocking structure 32 facing the first interlocking structure 31 and the surface of the first interlocking structure 31 facing the second interlocking structure 32. Due to limitations in the manufacturing process and assembly tolerances, the value of W ranges from 0.05mm ≤ W ≤ 1mm, ensuring that the marks formed by the edge of the sensor 20 pressing against the flexible substrate 10 are effectively reduced, thereby improving the display effect of the display device.

[0058] Optional, Figure 5 This is a cross-sectional structural diagram of another sensor module provided in an embodiment of the present invention. Figure 6 This is a bottom view structural diagram of another sensor module provided in an embodiment of the present invention, combined with... Figure 5 and Figure 6 As shown, in a direction perpendicular to the plane of the flexible substrate 10, the sensor 20 also overlaps with the first interlocking structure 31.

[0059] Specifically, if the sensor 20 overlaps with the first fitting structure 31 and the second fitting structure 32 simultaneously in the direction Z perpendicular to the plane of the flexible substrate 10, the pressure on the sensor 20 can be simultaneously transmitted to the first fitting structure 31 and the second fitting structure 32. The first fitting structure 31 and the second fitting structure 32 can simultaneously support the sensor 20, so that the pressure generated by attaching the sensor can be evenly distributed on the first fitting structure 31 and the second fitting structure 32 of the bonding assembly, increasing the force-bearing area of ​​the bonding assembly 30. This makes the pressure on the flexible substrate 10 more uniform and not concentrated in a single position, effectively alleviating the degree of compression of the flexible substrate 10 by the sensor 20, weakening the indentation formed by the edge of the sensor 20 on the flexible substrate 10, thereby improving the display quality of the display device. Meanwhile, when the sensor 20 overlaps with both the first fitting structure 31 and the second fitting structure 32, the sensor 20 can be simultaneously attached to both the first fitting structure 31 and the second fitting structure 32. At this time, even if the first fitting structure 31 and the second fitting structure 32 are not connected to each other, the first fitting structure 31 and the second fitting structure 32 can be relatively stable, which helps to improve the bonding stability of the entire bonding assembly.

[0060] It should be noted that, Figure 6The example shown is a bottom view of the sensor module. The first fitting structure 31 does not completely cover the edge of the sensor 20. In other words, the uneven structure of the fitting area of ​​the sensor 20 with the first fitting structure 31 and the second fitting structure 32 overlaps but does not completely cover it. This allows the first fitting structure 31 and the second fitting structure 32 to be subjected to pressure at the same time, which is beneficial to further homogenize the pressure and further weaken the indentation formed on the flexible substrate 10 by the edge of the sensor 20.

[0061] In some embodiments of the present invention, optionally, Figure 7 This is a bottom view schematic diagram of another sensor module provided in an embodiment of the present invention, with reference to... Figure 7 As shown, in the direction Z perpendicular to the plane of the flexible substrate 10, the sensor 20 covers at least one fitting through hole 311.

[0062] Specifically, the sensor 20 covers at least one complete fitting through-hole 311. At this time, the edge of the sensor 20 extends beyond the edge of the second fitting structure 32, so that in the direction Z perpendicular to the plane of the flexible substrate 10, the edge of the sensor 20 only overlaps with the first fitting structure 31. Thus, during the bonding process between the sensor 20 and the flexible substrate 10, the pressure received will be simultaneously transmitted to the first fitting structure 31 and the second fitting structure 32, so that the pressure of the first fitting structure 31 and the second fitting structure 32 is dispersed, further increasing the force-bearing area of ​​the bonding assembly 30, making the force on the flexible substrate 10 more uniform, and weakening the indentation caused by the sensor edge squeezing.

[0063] Understandable, Figure 7 The accompanying drawings are merely illustrative of embodiments of the present invention. Figure 7 The diagram shown is only an example of a bottom view showing a sensor 20 covering a complete fitting through hole 311. In this embodiment of the invention, the first fitting structure 31 may include a plurality of fitting through holes 311 provided with a second fitting structure 32. Each fitting through hole 311 may have a different shape. This embodiment of the invention does not limit this, so that multiple sensors 20 can all cover a complete fitting through hole 311.

[0064] Optional, Figure 8 This is a bottom view schematic diagram of another sensor module provided in an embodiment of the present invention, with reference to... Figure 8 As shown, in a direction perpendicular to the plane of the flexible substrate 10, each sensor 20 overlaps with a second fitting structure 32; in the overlapping sensor 20 and the second fitting structure 32, the outer contour of the second fitting structure 32 fits the outer contour of the sensor 20.

[0065] Specifically, since the size and shape of each sensor 20 may vary, the position where pressure is applied to the sensor 20 when it is bonded to the flexible substrate 10 will also vary depending on the size and shape of the sensor 20. Therefore, in order to ensure that the pressure on the sensor 20 is evenly distributed, the outer contour of the second fitting structure 32 can be made to fit the outer contour of the sensor 20. At this time, the pressure applied by the sensor 20 to the second fitting structure 32 can be evenly distributed on the second fitting structure 32, thereby weakening the indentation generated when the sensor 20 squeezes the flexible substrate 10 and improving the display effect of the display device.

[0066] For example, such as Figure 8 As shown, depending on the shape of the sensor 20, the shape of the second fitting structure 32 that overlaps with the sensor 20 is also different. For example, when the outer contour of the sensor 20 is circular, the outer contour of the second fitting structure 32 is also circular. Or, when the outer contour of the sensor 20 is rectangular, the outer contour of the second fitting structure 32 is also rectangular, so that the outer contour of the second fitting structure 32 fits the outer contour of the sensor 20, so that the second fitting structure 32 is subjected to more pressure, and the indentation generated when the sensor 20 squeezes the flexible substrate 10 is weakened.

[0067] It should be noted that, Figure 7 and Figure 8 The accompanying drawings are merely illustrative of embodiments of the present invention. Figure 7 and Figure 8 The diagram shown is only an example of a bottom view showing each sensor 20 covering a complete fitting through hole 311. In this embodiment of the invention, a sensor 20 may also cover multiple complete fitting through holes 311 at the same time, that is, cover multiple second fitting structures 32. The specific number of second fitting structures 32 is not limited in this embodiment of the invention.

[0068] Optional, Figure 9 This is a bottom view schematic diagram of another sensor module provided in an embodiment of the present invention, with reference to... Figure 9 As shown, the bonding assembly 30 includes a plurality of second interlocking structures 32; in a direction perpendicular to the plane of the flexible substrate 10, each sensor 20 overlaps with a plurality of second interlocking structures 32.

[0069] The multiple second interlocking structures 32 overlapping with the same sensor 20 can be completely identical, or they can be different in shape and size; this embodiment of the invention does not limit this. Simultaneously, each sensor 20 can partially overlap with or completely cover the multiple second interlocking structures 32; this embodiment of the invention does not specifically limit this. For example, as... Figure 9As shown, each sensor 20 covers multiple second interlocking structures 32. The sensor 20 also overlaps with the first interlocking structure 31 located around each second interlocking structure 32. Thus, when the sensor 20 is bonded to the flexible substrate 10, the pressure on the sensor 20 can be simultaneously transmitted to the first interlocking structure 31 and the multiple second interlocking structures 32, dispersing the pressure within these structures. This results in the bonding assembly 30 having a larger force-bearing area, reducing the pressure exerted by the sensor 20 on a single location on the flexible substrate 10, weakening the indentations caused by the bonding of the sensor 20 to the flexible substrate 10, and improving the display effect of the display device.

[0070] Optional, Figure 10 This is a cross-sectional structural schematic diagram of another sensor module provided in an embodiment of the present invention, with reference to... Figure 10 As shown, the bonding assembly 30 also includes at least one adhesive layer 33 located between the flexible substrate 10 and the first interlocking structure 31.

[0071] The adhesive layer 33 may include, but is not limited to, an optical adhesive layer. When the adhesive layer includes an optical adhesive, the optical adhesive may be transparent, and its materials include, but are not limited to, optically clear adhesive (OCA), optically clear resin (OCR), or pressure-sensitive adhesive (PSA), etc., and the embodiments of the present invention do not limit this. Furthermore, the adhesive layer 33 may have one or more layers, and the embodiments of the present invention do not specifically limit this either.

[0072] The adhesive layer 33 should have good adhesion to facilitate the bonding stability between the first interlocking structure 31 and the second interlocking structure 32 and the flexible substrate 10. At the same time, the adhesive layer 33 usually has a certain degree of fluidity before curing. In this case, even if the surfaces of the first interlocking structure 31 and the second interlocking structure 32 on the side close to the flexible substrate 10 are not flush, the adhesive layer 33 can compensate for the height difference between the first interlocking structure 31 and the second interlocking structure 32, thereby facilitating the assembly of the first interlocking structure 31 and the second interlocking structure 32 with the flexible substrate 10. Furthermore, due to the presence of the adhesive layer 33, when the sensor 20 is bonded to the flexible substrate 10 via the bonding assembly 30, the pressure on the sensor 20 is transmitted to the first interlocking structure 31 and the second interlocking structure 32, and then from the first interlocking structure 31 and the second interlocking structure to the adhesive layer 33, and finally from the adhesive layer 33 to the flexible substrate 10. After multiple layers of transmission, the pressure on the flexible substrate 10 can be significantly reduced, thereby weakening or eliminating the indentations formed on the flexible substrate 10 due to the bonding of the sensor 20.

[0073] Optionally, regardless of whether the adhesive layer 33 is a single layer or multiple layers, the thickness T4 of each adhesive layer 33 can be in the range of 1μm≤T4≤100μm. Thus, while meeting process and bonding requirements, setting the thickness T4 of each adhesive layer 33 to no more than 100μm facilitates the thinner and lighter design of the entire sensor module, and consequently, the thinner and lighter design of the display device including the sensor module.

[0074] Optional, Figure 11 This is a cross-sectional structural schematic diagram of another sensor module provided in an embodiment of the present invention, with reference to... Figure 11 As shown, the bonding assembly 30 further includes a rigid layer 34; at least one adhesive layer 33 includes a first adhesive layer 331 and a second adhesive layer 332; the first adhesive layer 331 is located on the side of the rigid layer 34 near the flexible substrate 10, and the second adhesive layer 332 is located on the side of the rigid layer 34 near the first interlocking structure 31; the elastic modulus of the rigid layer 34 is greater than the elastic modulus of the first adhesive layer 331 and / or the second adhesive layer 332.

[0075] The materials of the first adhesive layer 331 and the second adhesive layer 332 can be the same or different, and this embodiment of the invention does not limit this. Since the first adhesive layer 331 is located on the side of the rigid layer 34 near the flexible substrate 10, and the second adhesive layer 332 is located on the side of the rigid layer 34 near the first interlocking structure 31, the first interlocking structure 31 and the second interlocking structure 32 are bonded to the rigid layer 34 through the second adhesive layer 332, and the rigid layer 34 is then bonded to the flexible substrate 10 through the first adhesive layer 331. At this time, the second adhesive layer 332 can effectively compensate for the thickness difference between the first interlocking structure 31 and the second interlocking structure 32, so that the hard layer 34 has greater hardness. When the sensor 20 and the flexible substrate 10 are bonded by the bonding component 30, the pressure is transmitted from the sensor 20 to the first interlocking structure 31 and the second interlocking structure 32, and then from the first interlocking structure 31 and the second interlocking structure 32 to the hard layer 34 through the second adhesive layer 332. Finally, the hard layer 34 is transmitted to the flexible substrate 10 through the first adhesive layer 331. After the transmission layer by layer, the phenomenon of uneven force on the flexible substrate 10 will be significantly improved, thereby weakening the indentation caused by uneven force on the flexible substrate 10. Meanwhile, since the elastic modulus of the hard layer 34 is greater than that of the first adhesive layer 331 and / or the second adhesive layer 332, the hard layer 34 can play a certain supporting role, preventing the bonding component from being severely deformed. Thus, by bonding the sensor 20 and the flexible substrate 10 through the bonding component 30, the indentation caused by the compression of the flexible substrate 10 can be effectively weakened or eliminated.

[0076] Optionally, the material of the hard layer 34 may include a metal material, such as foil, copper, aluminum or silver. As long as the hard layer 34 can have a large hardness, the embodiments of the present invention do not make specific limitations in this regard.

[0077] Optionally, the thickness T3 of the hard layer 34 can be in the range of 1μm≤T3≤100μm. Thus, by setting the thickness T3 of the hard layer 34 to no more than 100μm, it is possible to achieve a thinner and lighter design for the entire sensor module while meeting all the requirements for bonding the sensor 20 to the flexible substrate 10.

[0078] Optional, continue to refer to Figure 11 In a direction perpendicular to the plane of the flexible substrate 10, both the first mating structure 31 and the second mating structure 32 overlap with the rigid layer 34. At this time, the projection of the second mating structure 32 on the rigid layer 34 falls entirely within the range of the rigid layer 24. Thus, the rigid layer 24 can simultaneously provide some support for the first mating structure 31 and the second mating structure 32, thereby dispersing the pressure on the first mating structure 31 and the second mating structure 32. This effectively weakens or eliminates the indentations generated on the flexible substrate 10 during the bonding process of the sensor 20, improving the display effect of the display device.

[0079] It should be noted that in this embodiment, sensor 20 can be either an optical sensor or a non-optical sensor. When sensor 20 is an optical sensor, it mainly detects light signals. Therefore, to ensure the normal operation of sensor 20, a corresponding light-transmitting structure needs to be set in the sensor module so that sensor 20 can sense light signals, such as an optical fingerprint sensor. The specific type of optical sensor 20 is not limited in this embodiment of the invention.

[0080] Optional, Figure 12 This is a cross-sectional structural schematic diagram of another sensor module provided in an embodiment of the present invention, with reference to... Figure 12 As shown, the bonding assembly 30 includes at least one light-transmitting area 35; the first interlocking structure 31 and the second interlocking structure 32 located in the light-transmitting area 35 are transparent; the light-transmitting area 35 includes a light-transmitting through hole 351; the light-transmitting through hole 351 penetrates the first adhesive layer 331, the second adhesive layer 332 and the rigid layer 34.

[0081] For example, taking sensor 20 as an optical fingerprint sensor, the photosensitive surface of sensor 20 is the surface near the flexible substrate 10, used to capture light passing through the light-transmitting aperture 351. Specifically, when a finger touches the side of the flexible substrate 10 away from sensor 20, the light beam reflected from the finger surface passes through the light-transmitting aperture 351 and can be received by sensor 20. Based on the light signal received by the sensor, the corresponding fingerprint image can be determined. Generally, the greater the light transmittance of the light-transmitting area 35, the higher the light intensity that sensor 20 can sense, which is more conducive to improving the sensitivity of sensor 20. Thus, by providing a light-transmitting hole 351 through the first adhesive layer 331, the second adhesive layer 332, and the hard layer 34 in the light-transmitting area 35, the light transmittance of the light-transmitting area 35 can be effectively increased. At the same time, by making the first interlocking structure 31 and the second interlocking structure 32 located in the light-transmitting area 35 transparent, the light beam passing through the light-transmitting hole 351 can pass through the first interlocking structure 31 and the second interlocking structure 32 to reach the sensor 20, so that the sensor 20 can receive the light beam and has high photosensitivity.

[0082] In an optional embodiment, a transparent adhesive material may be filled within the light-transmitting aperture 351. This transparent adhesive material includes water-based adhesives, such as OCA or OCR adhesives with high light transmittance; this embodiment of the invention is not limited to this. Thus, by filling the light-transmitting aperture 351 with a transparent adhesive material, while ensuring light transmission, the transparent adhesive material filling the light-transmitting aperture 351 can provide a certain degree of support for the first mating structure 31 and the second mating structure 32, thereby improving the bonding stability between the sensor 20 and the flexible substrate.

[0083] The thickness of the transparent adhesive material can be equal to the total thickness of the first adhesive layer 331, the second adhesive layer 332, and the rigid layer 34. This ensures that the surface of the transparent adhesive material near the flexible substrate 10 is flush with the surface of the first adhesive layer 331 near the flexible substrate 10, maintaining consistent pressure on the flexible substrate 10 at the transparent adhesive material and at the first adhesive layer 331. This improves the display quality of the display device by reducing pressure marks caused by uneven force during sensor bonding. Furthermore, the flush alignment of the transparent adhesive material near the flexible substrate 10 with the surface of the first adhesive layer 331 near the flexible substrate 10 facilitates assembly between the bonding component 30 and the flexible substrate, simplifying the bonding process.

[0084] Optional, continue to refer to Figure 12 In a direction perpendicular to the plane of the flexible substrate 10, the light-transmitting hole 351 at the second adhesive layer 332 covers the light-transmitting hole 351 at the hard layer 34, and its size in the first direction X is larger than the size of the light-transmitting hole 351 at the hard layer 34 in the first direction X; the first direction X is parallel to the plane of the flexible substrate 10.

[0085] Specifically, the edge of the light-transmitting hole 351 at the rigid layer 34 and the edge of the light-transmitting hole 351 at the second adhesive layer 332 form a stepped structure to accommodate the flowed second adhesive layer 332. It is understandable that when there is a thickness difference between the first fitting structure 31 and the second fitting mechanism 32, during the bonding process of the sensor 10, the second adhesive layer 332 has a certain fluidity. By squeezing the second adhesive layer 332, it flows towards the light-transmitting hole 351. To avoid affecting the light transmittance of the light-transmitting hole 351, the size of the light-transmitting hole 351 at the second adhesive layer 332 in the first direction X is set to be larger than the size of the light-transmitting hole 351 at the rigid layer 34 in the first direction X. This allows for the accommodation of the flowed second adhesive layer 332 and increases the light flux in the light-transmitting area.

[0086] Optional, continue to refer to Figure 12 The distance ΔL between the edge of the second adhesive layer 332 facing the light-transmitting hole 351 and the edge of the hard layer 34 facing the light-transmitting hole 351 in the first direction X is: 10μm≤ΔL≤10mm.

[0087] Specifically, the first interlocking structure 31 is bonded to the rigid layer via the second adhesive layer 332. If ΔL is too large, it will affect the stability and firmness of the bond. If ΔL is too small, the flow accommodation space provided by the second adhesive layer 332 will be too small, making it easy for light to enter the light-transmitting hole 351, thus affecting the light flux of the light-transmitting hole 351 and consequently affecting the normal application of the sensor 20. Therefore, by ensuring that 10μm≤ΔL≤10mm, the bonding stability and firmness can be ensured while increasing the light flux in the light-transmitting area.

[0088] Optional, Figure 13 This is a cross-sectional structural schematic diagram of another sensor module provided in an embodiment of the present invention, with reference to... Figure 13 As shown, the bonding assembly 30 also includes a third adhesive layer 36 located between the sensor 20 and the second mating structure 32.

[0089] Specifically, the third adhesive layer 36 includes, but is not limited to, an optical adhesive layer, and its material may include, but is not limited to, OCA, OCR, or PSA, etc., which are not limited in this embodiment of the invention. The sensor 20 is bonded to the second interlocking structure 32 through the third adhesive layer 36. The thickness T5 of the third adhesive layer 36 can be, for example, 1μm≤T5≤100μm, which is not limited in this embodiment of the invention. A smaller thickness is more conducive to the thinner and lighter design of the entire display module. In addition, the shape and size of the third adhesive layer 36 can be adapted to the shape and size of the sensor 20 to ensure that the sensor 20 can be firmly bonded.

[0090] Based on the same inventive concept, this invention also provides a method for fabricating a sensor module. Figure 14 A flowchart illustrating a method for fabricating a sensor module according to an embodiment of the present invention is provided, with reference to... Figure 14 As shown, the method includes the following steps:

[0091] S101, providing a flexible substrate, a bonding assembly, and at least one sensor; the bonding assembly includes a first fitting structure and at least one second fitting structure; the first fitting structure includes at least one fitting through-hole.

[0092] S102, attach the sensor to the second interlocking structure.

[0093] S103. Place the second fitting structure that is attached to the sensor into the fitting through hole so that the shape of the second fitting structure facing the first fitting structure matches the shape of the first fitting structure facing the second fitting structure.

[0094] S104. The first interlocking structure is attached to the flexible substrate; wherein, in a direction perpendicular to the plane of the flexible substrate, the sensor overlaps with at least one second interlocking structure.

[0095] In this embodiment, the sensor is first attached to the second fitting structure, and then the second fitting structure is placed in the fitting through hole of the first fitting structure, with the edge of the fitting through hole of the first fitting structure matching the edge shape of the second fitting structure. Then, the first fitting structure is attached to the flexible substrate. That is, the sensor is attached to the flexible substrate through the second fitting structure and the first fitting structure in sequence. This allows the pressure generated during the attachment process to the flexible substrate to be transmitted to the flexible substrate through the second fitting structure and the first fitting structure in sequence. After being transmitted layer by layer, the stress generated by the pressure is redistributed, which significantly improves the uneven stress distribution on the flexible substrate. This weakens or eliminates the indentations formed on the flexible substrate due to uneven pressure distribution when attaching the sensor. As a result, when this sensor module is applied to a display device, the display effect of the display device can be effectively improved.

[0096] It is understood that the method for preparing the sensor module provided in the embodiments of the present invention can be used to prepare the sensor module provided in the embodiments of the present invention. Therefore, the method for preparing the sensor module provided in the embodiments of the present invention has the features and effects of the sensor module provided in the embodiments of the present invention. At the same time, the sensor module provided in the embodiments of the present invention also has the features and effects of the method for preparing the sensor module provided in the embodiments of the present invention. The similarities can be referred to the above description, and will not be repeated here.

[0097] Furthermore, embodiments of the present invention also provide a display device, including the sensor module in any of the above embodiments. Specifically, the display device can be any electronic product with display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablets, digital cameras, mobile phones, smart bracelets, smart glasses, automotive displays, medical devices, industrial control equipment, touch interactive terminals, etc. Figure 15 This is a schematic diagram of a display device provided in an embodiment of the present invention. Figure 15 The display device of the present invention is illustrated using a mobile phone.

[0098] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A sensor module, characterized in that, include: Flexible substrate; At least one sensor; A bonding assembly includes a first fitting structure and at least one second fitting structure; the first fitting structure includes at least one fitting through-hole, and the second fitting structure is located within the fitting through-hole; the shape of the first fitting structure facing the second fitting structure matches the shape of the second fitting structure facing the first fitting structure; the projections of the cross-section of the second fitting structure at any position parallel to the flexible substrate onto the flexible substrate coincide. The sensor is attached to one side of the flexible substrate via the bonding assembly; in a direction perpendicular to the plane of the flexible substrate, the sensor overlaps with at least one second interlocking structure; the surface of the second interlocking structure facing the first interlocking structure has an uneven structure. In a direction perpendicular to the plane of the flexible substrate, the sensor also overlaps with the first interlocking structure.

2. The sensor module according to claim 1, characterized in that, In a direction perpendicular to the plane of the flexible substrate, the sensor covers at least one of the fitted through-holes.

3. The sensor module according to claim 1, characterized in that, In a direction perpendicular to the plane of the flexible substrate, each sensor overlaps with one of the second interlocking structures; In the overlapping sensor and the second fitting structure, the outer contour of the second fitting structure fits the outer contour of the sensor.

4. The sensor module according to claim 1, characterized in that, The bonding component includes a plurality of second fitting structures; In a direction perpendicular to the plane of the flexible substrate, each sensor overlaps with a plurality of the second interlocking structures.

5. The sensor module according to claim 1, characterized in that, The elastic modulus of the first interlocking structure and the second interlocking structure is greater than or equal to 1 GPa.

6. The sensor module according to claim 1, characterized in that, The material of the first interlocking structure includes polymer materials or metallic materials; The material of the second interlocking structure includes polymer materials or metal materials.

7. The sensor module according to claim 1, characterized in that, The thickness T1 of the first interlocking structure has a range of 0 μm. <T1≤200μm; The thickness T2 of the second interlocking structure ranges from 0 μm. <T2≤200μm。 8. The sensor module according to claim 1, characterized in that, The distance W between the surface of the second fitting structure facing the first fitting structure and the surface of the first fitting structure facing the second fitting structure is in the range of 0.05mm≤W≤1mm.

9. The sensor module according to claim 1, characterized in that, The distance L between the bottom of the groove and the top of the protrusion in the first direction of the concave-convex structure is 0.1 mm. <L<10mm; The first direction is parallel to the plane containing the flexible substrate.

10. The sensor module according to claim 1, characterized in that, The thickness of the first interlocking structure is the same as the thickness of the second interlocking structure.

11. The sensor module according to claim 1, characterized in that, The bonding assembly further includes at least one adhesive layer located between the flexible substrate and the first interlocking structure.

12. The sensor module according to claim 11, characterized in that, The bonding assembly further includes a rigid layer; at least one adhesive layer includes a first adhesive layer and a second adhesive layer; the first adhesive layer is located on the side of the rigid layer closer to the flexible substrate, and the second adhesive layer is located on the side of the rigid layer closer to the first interlocking structure; The elastic modulus of the rigid layer is greater than that of the first adhesive layer and / or the second adhesive layer.

13. The sensor module according to claim 12, characterized in that, In a direction perpendicular to the plane of the flexible substrate, both the first interlocking structure and the second interlocking structure overlap with the rigid layer.

14. The sensor module according to claim 12, characterized in that, The bonding component includes at least one light-transmitting area; The first and second interlocking structures located in the light-transmitting area are transparent; The light-transmitting area includes a light-transmitting through hole; the light-transmitting through hole penetrates the first adhesive layer, the second adhesive layer, and the hard layer.

15. The sensor module according to claim 14, characterized in that, In a direction perpendicular to the plane of the flexible substrate, the light-transmitting aperture at the second adhesive layer covers the light-transmitting aperture at the rigid layer, and the size of the light-transmitting aperture at the second adhesive layer in the first direction is larger than the size of the light-transmitting aperture at the rigid layer in the first direction. The first direction is parallel to the plane containing the flexible substrate.

16. The sensor module according to claim 15, characterized in that, The distance ΔL between the edge of the second adhesive layer facing the light-transmitting hole and the edge of the rigid layer facing the light-transmitting hole in the first direction is in the range of 10μm≤ΔL≤10mm.

17. The sensor module according to claim 14, characterized in that, The light-transmitting holes are filled with transparent adhesive material.

18. The sensor module according to claim 17, characterized in that, The thickness of the transparent adhesive material is equal to the total thickness of the first adhesive layer, the second adhesive layer, and the hard layer.

19. The sensor module according to claim 12, characterized in that, The material of the hard layer includes metallic materials.

20. The sensor module according to claim 12, characterized in that, The thickness T3 of the hard layer is in the range of 1μm≤T3≤100μm.

21. The sensor module according to claim 11, characterized in that, The adhesive layer is an optical adhesive layer.

22. The sensor module according to claim 11, characterized in that, The thickness T4 of each adhesive layer is in the range of 1μm≤T4≤100μm.

23. The sensor module according to claim 1, characterized in that, The bonding assembly also includes a third adhesive layer located between the sensor and the second bonding structure.

24. A method for manufacturing a sensor module, characterized in that, include: A flexible substrate, a bonding assembly, and at least one sensor are provided; the bonding assembly includes a first fitting structure and at least one second fitting structure. The first fitting structure includes at least one fitting through hole; The sensor is attached to the second fitting structure; The second fitting structure, which is attached to the sensor, is placed inside the fitting through hole so that the shape of the second fitting structure facing the first fitting structure matches the shape of the first fitting structure facing the second fitting structure; the projections of the cross section of the second fitting structure at any position in a direction parallel to the flexible substrate on the flexible substrate all coincide. The first fitting structure is attached to the flexible substrate; wherein, in a direction perpendicular to the plane of the flexible substrate, the sensor overlaps with at least one of the second fitting structures; The second interlocking structure has a concave-convex surface facing the first interlocking structure; the sensor also overlaps with the first interlocking structure in a direction perpendicular to the plane of the flexible substrate.

25. A display device, characterized in that, include: The sensor module according to any one of claims 1-23.

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