Camera module and electronic device

Abstract

The present application discloses an imaging component and an electronic device. The imaging component includes: a base; a lens module movably disposed on the base; a circuit board, one end of the circuit board is connected to the lens module; a support board, the other end of the circuit board is connected to the support board; when the lens module moves, the circuit board can be deformed; an image sensor chip is disposed on a substrate, the image sensor chip is located between the substrate and the lens module, and the circuit board is electrically connected to the image sensor chip. When the lens module moves, the circuit board can be deformed, and by deforming the circuit board, a force can be generated on the lens module, so that the jitter and tilt range of the lens module are limited, and the jitter of the lens module is reduced. By using the deformable circuit board, the functions of anti-shake and electrical connection can be achieved simultaneously, without the need to specifically provide an additional anti-shake structure, reducing the space occupation.

Description

Technical Field

[0001] This application belongs to the technical field of terminals, and particularly relates to an imaging component and an electronic device. Background Art

[0002] With the development of mobile terminals, the requirements for the modules mounted on the terminals are getting higher and higher. Not only are they required to have a certain function, but also their functions are required to be powerful. Since the camera module of the mobile phone terminal was mounted on the mobile phone, its functions have become more and more powerful. For example, the original conventional zoom and fixed-focus methods are no longer able to meet people's needs. On the basis of variable zoom, people's requirements for the stability of the picture are getting higher and higher. For this reason, different anti-shake modes have been developed. The anti-shake structure of the existing imaging module has a large overall size of the module and poor anti-shake effect, which affects the shooting effect. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide an imaging component and an electronic device to solve the problems of the large overall size of the anti-shake structure of the existing imaging module and poor anti-shake effect.

[0004] In a first aspect, the embodiments of this application provide an imaging component, including:

[0005] A base;

[0006] A lens module, which is movably arranged on the base;

[0007] A circuit board, which is deformable, and one end of the circuit board is connected to the lens module;

[0008] A support plate, the other end of the circuit board is connected to the support plate;

[0009] When the lens module moves, the circuit board can be deformed;

[0010] An image sensor chip;

[0011] A substrate, the image sensor chip is arranged on the substrate, the image sensor chip is located between the substrate and the lens module, and the circuit board is electrically connected to the image sensor chip.

[0012] In a second aspect, the embodiments of this application provide an electronic device, including the imaging component described in the above embodiments.

[0013] The camera module of the embodiment of the present application includes: a base; a lens module movably disposed on the base; a circuit board deformable, one end of the circuit board is connected to the lens module; a support plate, the other end of the circuit board is connected to the support plate; when the lens module moves, the circuit board can deform; a photosensitive chip; a substrate, the photosensitive chip is disposed on the substrate, the photosensitive chip is located between the substrate and the lens module, and the circuit board is electrically connected to the photosensitive chip. In the camera module of the embodiment of the present application, the lens module is movably disposed on the base, the circuit board can deform, when the lens module moves, the circuit board can deform, the deformation of the circuit board can generate a force on the lens module, so that the jitter and tilt range of the lens module are limited, the jitter of the lens module is reduced, which is beneficial to anti-shake. The circuit board can be electrically connected to the photosensitive chip. The deformable circuit board can simultaneously achieve the functions of anti-shake and electrical connection, without specially setting an additional anti-shake structure, reducing the space occupation, which is beneficial to the miniaturization of the module. Description of the Drawings

[0014] Figure 1 It is a schematic diagram when the lens module is in an un-tilted state in the embodiment of the present application;

[0015] Figure 2 It is a schematic diagram when the lens module is in a tilted state in the embodiment of the present application;

[0016] Figure 3 It is a top view of the camera module in the embodiment of the present application;

[0017] Figure 4 It is a schematic diagram of the structure of the circuit board;

[0018] Figure 5 It is another schematic diagram of the structure of the circuit board;

[0019] Figure 6 It is a schematic diagram of the structure of the camera module in the embodiment of the present application.

[0020] Reference Signs

[0021] Base 10;

[0022] Lens module 20;

[0023] Circuit board 30; Insulating layer 31; Wiring layer 32;

[0024] Support layer 33; Reinforcing layer 34; Connector 35;

[0025] Support plate 40;

[0026] Photosensitive chip 50; Substrate 51;

[0027] The first magnet 61; the second magnet 62. Detailed implementation mode

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0029] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order different from those illustrated or described herein. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0030] The following combination of attached Figures 1 to 6 As shown, the camera component provided by the embodiments of the present application will be described in detail through specific embodiments and their application scenarios.

[0031] Such as Figures 1 to 6As shown in the figure, the camera module of the embodiment of the present application includes: a base 10, a lens module 20, a circuit board 30, a support plate 40, a photosensitive chip 50 and a substrate 51. The lens module 20 is movably arranged on the base 10. The circuit board 30 can be deformed. One end of the circuit board 30 is connected to the lens module 20. For example, one end of the circuit board 30 can be connected to the outer side wall of the lens module 20, and one end of the circuit board 30 can be connected to the end of the lens module 20 facing the support plate 40. The circuit board 30 can be one or more. Multiple circuit boards 30 can be arranged at intervals along the circumferential direction of the lens module 20, and multiple circuit boards 30 can be evenly arranged at intervals along the circumferential direction of the lens module 20, so that when the lens module 20 tilts in different directions, the circuit boards 30 at different positions can apply forces to the lens module 20 to reduce the jitter of the lens module 20. The other end of the circuit board 30 is connected to the support plate 40, and the support plate 40 can be connected to the base 10 together. When the lens module 20 moves, the circuit board 30 is elastic and can be deformed. When the lens module 20 tilts, the circuit board 30 can be deformed, and a pulling force can be generated on the lens module 20 through the circuit board 30. The circuit board 30 has a rebounding effect, which can prevent the lens module 20 from moving violently and reduce the tilt of the lens module 20. The photosensitive chip 50 can be arranged on the substrate 51. The photosensitive chip 50 can be located between the substrate 51 and the lens module 20. The circuit board 30 and the photosensitive chip 50 can be electrically connected. The functions of anti-shake and electrical connection can be realized through the circuit board 30, and no additional anti-shake structure needs to be specially set, reducing the occupation of space.

[0032] In the camera module of the embodiment of the present application, the lens module 20 is movably arranged on the base 10. The circuit board 30 can be deformed. When the lens module 20 moves, the circuit board 30 can be deformed. Through the deformation of the circuit board 30, a force can be generated on the lens module 20, so that the jitter and tilt range of the lens module 20 are limited, reducing the jitter of the lens module 20, which is beneficial to anti-shake. The circuit board 30 can be electrically connected to the photosensitive chip. The functions of anti-shake and electrical connection can be realized simultaneously through the deformable circuit board 30. Large-angle optical anti-shake can be realized, and no additional anti-shake structure needs to be specially set, reducing the occupation of space, which is beneficial to the miniaturization of the module.

[0033] In some other embodiments, the lens module 20 and the substrate 51 can be fixedly connected. The substrate 51 can be a circuit board, and the substrate 51 can be a rigid circuit board. The axis of the lens module 20 can be perpendicular to the substrate 51. The photosensitive chip 50 and the circuit board 30 can be electrically connected through the substrate 51 to facilitate signal transmission. The circuit board 30 and the substrate 51 can be connected by an anisotropic conductive film (ACF) or thermocompression bonding.

[0034] Optionally, as shown in Figure 1 and Figure 2 , the circuit board 30 may be located on the side of the substrate 51 away from the photosensitive chip 50, and one end of the circuit board 30 may be electrically connected to the side of the substrate 51 away from the photosensitive chip 50. When jitter occurs, a force can be applied to the substrate 51 through the circuit board 30 to limit the tilt of the substrate 51, thereby reducing the tilt of the lens module 20.

[0035] Optionally, as shown in Figure 1 and Figure 2 , the circuit board 30 may be located between the substrate 51 and the support plate 40. The other end of the circuit board 30 is connected to the support plate 40, which is convenient for applying a force when the substrate 51 tilts and is beneficial to the stability of the substrate 51. The circuit board 30 located between the substrate 51 and the support plate 40 may also have a buffering effect and can reduce the collision between the substrate 51 and the support plate 40.

[0036] In some embodiments, one end of the circuit board 30 may be connected to the edge area of the substrate 51 so as to apply a force when the substrate 51 tilts, which is beneficial to the stability of the substrate 51.

[0037] Optionally, as shown in Figure 1 and Figure 2 , there may be multiple circuit boards 30, such as two. The multiple circuit boards 30 may be arranged at intervals along the circumferential direction of the substrate 51, and the multiple circuit boards 30 may be evenly arranged at intervals along the circumferential direction of the substrate 51. When the substrate 51 tilts in different directions, forces can be applied to the substrate 51 through the circuit boards 30 at different positions, reducing the tilt jitter of the substrate 51 and further reducing the jitter of the lens module 20.

[0038] In the embodiments of the present application, as shown in Figure 4 and Figure 5 , the circuit board 30 may include: two insulating layers 31 and a wiring layer 32. The insulating layer 31 may be an elastic layer to facilitate deformation. The two insulating layers 31 may be stacked. The wiring layer 32 is arranged between the two insulating layers 31 and has a conductive function. On the side of at least one insulating layer 31 away from the wiring layer 32, a support layer 33 may be provided, which can play a role in supporting and stretching. The support layer 33 has elasticity. The support layer 33 may be a metal layer, such as an alloy layer. The support layer 33 may be made of titanium alloy or other materials with certain elastic properties. The function of the support layer 33 is to support and rebound, similar to a spring. The support layer 33 may be a deformable hollow structure. The support layer 33 may be spring-shaped. The hollow structure facilitates deformation and can also have a rebounding effect to enhance the resilience. The hollow structure can reduce the resistance during deformation and increase its elastic coefficient. The hollow structure can be formed by die punching or laser processing.

[0039] In some embodiments, as Figure 4 shown, a reinforcing layer 34 may be provided in a region near the end of the insulating layer 31. The connection strength with other device structures can be enhanced through the reinforcing layer 34. A connector may be provided at the end of the circuit board 30. The support board 40 may be a circuit board. The circuit board 30 may be electrically connected to the support board 40 through the connector 35.

[0040] Optionally, the support board 40 may be a circuit board, the support board 40 may be a rigid circuit board, the support board 40 may be strip-shaped, the other end of the circuit board 30 may be electrically connected to the support board 40, the support board 40 may not need to be folded, the space occupation can be reduced, the size of the entire module can be effectively reduced, which is beneficial to the stacking of the whole machine.

[0041] In the embodiments of the present application, as Figure 6 shown, the base 10 may have a chamber, the chamber may extend along the axial direction of the base 10, the ends of both ends of the base 10 may have openings, and the openings may communicate with the chamber. The lens module 20 may be disposed in the chamber, the lens module 20 may be movable, the base 10 may be connected to the support board 40, the base 10 and the support board 40 may be fixedly connected together, the axis of the base 10 may be perpendicular to the support board 40. When the lens module 20 is tilted, the circuit board 30 may be deformed, and a pulling force may be generated on the lens module 20 through the circuit board 30 to reduce the tilt of the lens module 20.

[0042] Optionally, the imaging component may further include a driving structure. The driving structure may be disposed adjacent to the lens module, the driving structure may be connected to the lens module, the driving structure may drive the lens module 20 to move. When the lens module 20 is tilted, the driving structure may drive the lens module 20 to move, and the driving structure may drive the lens module 20 to move in a direction perpendicular to the optical axis of the lens module 20 so that the lens module 20 is in a non-tilted state.

[0043] In some embodiments, the driving structure may include a first magnet 61 and a second magnet 62. The first magnet 61 may be provided on the base 10, the number of the first magnets 61 may be multiple, such as two. The second magnet 62 may be provided on the lens module 20, the number of the second magnets 62 may be multiple, such as two. The setting positions of the first magnet 61 and the second magnet 62 may correspond to each other. At least one of the first magnet 61 and the second magnet 62 may include an electromagnet or an energized coil. The first magnet 61 and the second magnet 62 may be magnetically attracted or repelled. For example, the first magnet 61 may include an energized coil, the second magnet 62 may include a magnet or a magnetic stone. By energizing the energized coil, the first magnet 61 and the second magnet 62 may be magnetically attracted or repelled. When the energized coil is energized, it interacts with the magnet to generate a Lorentz force, which can push the lens module 20 to move.

[0044] When the first magnet 61 and the second magnet 62 attract each other magnetically, the lens module 20 moves along the first direction; when the first magnet 61 and the second magnet 62 repel each other, the lens module 20 moves along the second direction, and the first direction is opposite to the second direction. For example, the first magnet 61 can be an energized coil, and the second magnet 62 can be a magnet or a magnetic stone. By energizing the energized coil, the first magnet 61 and the second magnet 62 can attract or repel each other magnetically. When a first current is input into the energized coil, the first magnet 61 and the second magnet 62 attract each other magnetically, and under the action of the driving force, the lens module 20 can move along the first direction; when a second current is input into the energized coil, the first magnet 61 and the second magnet 62 repel each other, and under the action of the driving force, the lens module 20 can move along the second direction. The movement direction of the lens module 20 can be changed by changing the current input into the energized coil as needed. When the first magnet 61 and the second magnet 62 attract or repel each other magnetically, the movement trajectory directions of the lens module 20 can be opposite. When the lens module 20 is tilted, the first magnet 61 and the second magnet 62 can be used to push the lens module 20 to move so that the lens module 20 is in a non-tilted state. When the lens module 20 is tilted along the first direction, the first magnet 61 and the second magnet 62 can be made to repel each other to push the lens module 20 to move along the second direction so that the lens module 20 is in a non-tilted state.

[0045] In some embodiments, the electronic device may further include a detection element. The detection element can be disposed on the lens module 20. The detection element can include a gyroscope. The gyroscope can detect the change in the tilt angle of the lens module 20. When there is jitter during shooting, the gyroscope placed inside the lens module 20 detects the change in the tilt angle of the lens module 20, and then converts the detected change in the tilt angle into an electrical signal and transmits it to the control module. The control module can include a driving IC. The driving IC can calculate the displacement amount to be compensated and supply a current of a certain magnitude and direction to the energized coil. At this time, the first magnet 61 and the second magnet 62 generate a force, and the lens module 20 can be moved by the force between the first magnet 61 and the second magnet 62 so that the lens module 20 is in a non-tilted state.

[0046] Optionally, the imaging assembly may further include: a carrier, the lens module 20 can be provided on the carrier, and the second magnet 62 can be provided on the carrier. When the first magnet 61 and the second magnet 62 attract or repel each other magnetically, a force is generated to move the carrier, and the lens module 20 can be driven to move by the movement of the carrier.

[0047] An embodiment of the present application provides an electronic device, including the camera assembly described in the above embodiment. The electronic device with the camera assembly described in the above embodiment has good anti-shake effect and good shooting effect, which is beneficial to the miniaturization of the device.

[0048] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. An imaging component, characterized in that, Comprising: A base; A lens module movably disposed on the base; A plurality of circuit boards evenly spaced along the circumferential direction of the lens module, one end of each circuit board being connected to the lens module; A support plate, the other end of the circuit board being connected to the support plate. When the lens module moves, the circuit board can deform, and the deformation of the circuit board is used to limit the jitter and tilt range of the lens module; An image sensor chip; A substrate, the image sensor chip being disposed on the substrate, the image sensor chip being located between the substrate and the lens module, the circuit board being electrically connected to the image sensor chip, and the circuit board being located on the side of the substrate away from the image sensor chip; Wherein, the circuit board further comprises: Two insulating layers, the insulating layers being elastic layers, and the two insulating layers being stacked; A wiring layer disposed between the two insulating layers; A support layer is provided on the side of at least one of the insulating layers away from the wiring layer, and the support layer is a deformable hollow structure.

2. The imaging component according to claim 1, characterized in that, The lens module is fixedly connected to the substrate, the substrate is a circuit board, and the image sensor chip is electrically connected to the circuit board through the substrate.

3. The imaging component according to claim 2, wherein One end of the circuit board is electrically connected to the side of the substrate away from the image sensor chip.

4. The imaging component according to claim 2, characterized in that, The circuit board is located between the substrate and the support plate.

5. The imaging component according to claim 1, wherein A reinforcing layer is provided in the region of the insulating layer adjacent to the end.

6. The imaging component according to claim 1, wherein The support plate is a circuit board, the support plate is strip-shaped, and the other end of the circuit board is electrically connected to the support plate.

7. The imaging component according to claim 1, characterized in that The base has a chamber, the lens module is disposed in the chamber, the base is connected to the support plate, and the axis of the base is perpendicular to the support plate.

8. The imaging component according to claim 1, wherein Further comprising: A driving structure disposed adjacent to the lens module, the driving structure being capable of driving the lens module to move.

9. The imaging component according to claim 8, wherein, The driving structure includes a first magnet and a second magnet, the first magnet is disposed on the base, the second magnet is disposed on the lens module, at least one of the first magnet and the second magnet includes an electromagnet or an energized coil, and the first magnet and the second magnet can attract or repel magnetically; When the first magnet and the second magnet attract magnetically, the lens module moves along a first direction; When the first magnet and the second magnet repel each other, the lens module moves along a second direction, and the first direction is opposite to the second direction.

10. The imaging component according to claim 9, wherein Further comprising: A carrier, the lens module is disposed on the carrier, and the second magnet is disposed on the carrier.

11. An electronic device, characterized in that, An imaging assembly according to any one of claims 1-10.

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