Display device

Abstract

The display area (D) of the organic EL display device (1) has a second display area (D2) for transmitting light used in a camera inside a first display area (D1). The area of ​​a first electrode (51) of the second display area is smaller than the area of ​​the first electrode of the first display area. Among a plurality of upper contact holes (36h) of a TFT layer (20), a first upper contact hole (36h1) for connecting the first electrode of the first display area to the TFT is located at a position overlapping with an edge cover, and a second upper contact hole (36h2) for connecting the first electrode of the second display area to the TFT is located at a position corresponding to an opening of the edge cover.

Description

Technical Field

[0001] The technology disclosed herein relates to a display device. Background Art

[0002] In recent years, as a display device replacing a liquid crystal display device, a self-emissive organic EL display device using an organic electroluminescence (hereinafter referred to as “EL”) element has attracted attention.

[0003] The organic EL element includes a first electrode, an organic EL layer disposed on the first electrode, and a second electrode disposed on the organic EL layer. As the organic EL element, a top emission type organic EL element having excellent light extraction efficiency is preferably used. In the top emission type organic EL element, the first electrode includes a reflective conductive layer formed of a reflective conductive material, and the reflective conductive material reflects light emitted by the organic EL layer to the second electrode side.

[0004] When an organic EL display device is used as a display of an information terminal such as a smartphone or a tablet terminal, or as a display for two-way communication such as a video phone or a video conference, it is combined with a camera (so-called internal camera) for photographing the front side of the displayed image. In such an organic EL display device with a camera, a scheme has been proposed to arrange a camera at a position overlapping with a display area on the back side of the organic EL display device (for example, refer to Patent Document 1).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2018-124457 Summary of the invention

[0008] Technical Problems to be Solved by the Invention

[0009] In an organic EL display device having a top emission type organic EL element, since external light is reflected by the reflective conductive layer constituting the first electrode, the transmittance of light transmitted through the display region is significantly low. Therefore, when an electronic component such as a camera that utilizes light transmitted through the display region is arranged at a position overlapping the display region on the back side of the organic EL display device, it is desirable to increase the transmittance of light in the region of the display region that transmits light used by the electronic component.

[0010] Therefore, the first electrode is produced separately in the first display area which is a general area in the display area and the second display area which is located inside the first display area and transmits the light used by the electronic components. Specifically, it is considered to make the area of ​​the first electrode in the second display area smaller than the area of ​​the first electrode in the first display area. Thus, in the second display area, the amount of external light reflected by the first electrode can be reduced and the amount of transmitted light can be increased, and the transmittance of the light used by the electronic components can be improved.

[0011] In addition, in the sub-pixels constituting the display area, the size of the light-emitting area where the light emitted by the organic EL element is emitted is limited to the area of ​​the first electrode. Therefore, if the area of ​​the first electrode of the second display area is made smaller than that of the first display area, the size of the light-emitting area of ​​the sub-pixels in the second display area becomes smaller than that of the sub-pixels in the first display area, and the brightness is reduced. Such a reduction in the brightness of the sub-pixels in the second display area may become a major cause of deterioration in the display quality of the organic EL display device.

[0012] The technology disclosed herein has been developed in view of this point, and aims to improve the transmittance of light in a second display area where electronic components are used in the display area of ​​a display device, and to suppress a decrease in luminance of sub-pixels in the second display area.

[0013] Technical solutions for solving technical problems

[0014] The technology disclosed in the present invention is aimed at a display device, which includes: a substrate; a TFT layer, which is arranged on the substrate and includes a plurality of thin film transistors (Thin Film Transistor, hereinafter referred to as "TFT"); and a light-emitting element layer, which is arranged on the TFT layer and includes a plurality of light-emitting elements, and a display area is provided. The display area displays an image by light emission of the light-emitting elements controlled by the action of the TFT, and an electronic component that utilizes light transmitted through the light-emitting element layer, the TFT layer and the substrate is arranged on the back side of the display area relative to the substrate.

[0015] In a display device according to the technology disclosed in the present invention, the TFT layer further includes a planarization film, which is provided in a manner covering a plurality of TFTs. The light-emitting element layer includes a first electrode provided on the planarization film for each light-emitting element, an edge cover covering the periphery of the first electrode and having an opening for exposing the first electrode, a light-emitting functional layer provided on the first electrode in the opening of the edge cover, and a second electrode provided on the light-emitting functional layer. The first electrode is electrically connected to the TFT via a contact hole formed in the planarization film for each light-emitting element. The display area has a first display area and a second display area located inside the first display area and transmitting light used by the electronic component.

[0016] In a display device according to the technology disclosed in the present invention, the plurality of light-emitting elements include a first light-emitting element located in a first display area and a second light-emitting element located in a second display area. The area of ​​the first electrode of the second light-emitting element is smaller than the area of ​​the first electrode of the first light-emitting element. Among the plurality of contact holes, the first contact hole for electrically connecting the first electrode of the first light-emitting element to the TFT is located at a position overlapping with the edge cover, and the second contact hole for electrically connecting the first electrode of the second light-emitting element to the TFT is located at a position corresponding to the opening of the edge cover. The first electrode of the second light-emitting element, the light-emitting functional layer, and the second electrode are arranged in an area of ​​the planarization film including the second contact hole.

[0017] Beneficial Effects

[0018] According to the display device of the technology disclosed in the present invention, the area of ​​the first electrode of the second light-emitting element is smaller than the area of ​​the first electrode of the first light-emitting element. Therefore, in the second display area, the amount of external light reflected by the first electrode can be reduced and the amount of transmitted light can be increased, and the transmittance of light used by the electronic component can be improved. In addition, since the first contact hole that electrically connects the first electrode of the first light-emitting element to the TFT is located at a position overlapping with the edge cover, the first electrode of the first light-emitting element, the light-emitting functional layer, and the second electrode are not provided in the first contact hole.

[0019] On the other hand, the second contact hole electrically connecting the first electrode of the second light-emitting element to the TFT is located at a position corresponding to the opening of the edge cover. In addition, the first electrode, the light-emitting functional layer, and the second electrode of the second light-emitting element are provided in the area of ​​the planarization film including the second contact hole, so that the second light-emitting element can also emit light in the second contact hole. As a result, compared with the case where the second light-emitting element does not emit light in the second contact hole, the actual light-emitting area of ​​the second light-emitting element is increased, so that the brightness reduction of the sub-pixel in the second display area can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a plan view schematically showing the structure of the organic EL display device according to the first embodiment.

[0021] Figure 2 It is along Figure 1 A cross-sectional view of the organic EL display device taken along line II-II.

[0022] Figure 3 The present invention is a plan view showing pixels constituting a display region of an organic EL display device and display wiring lines of a first conductive layer, a second conductive layer, and a third conductive layer.

[0023] Figure 4 It is a plan view showing pixels constituting a display region of an organic EL display device and display wiring lines of a fourth conductive layer.

[0024] Figure 5 It is along Figure 3 A cross-sectional view of the organic EL display device taken along line VV.

[0025] Figure 6 FIG. 1 is an equivalent circuit diagram showing a pixel circuit of the organic EL display device according to the first embodiment.

[0026] Figure 7 It is a cross-sectional view showing a main part in a first display region of the organic EL display device according to the first embodiment.

[0027] Figure 8 It is a cross-sectional view showing a main part in a second display region of the organic EL display device according to the first embodiment.

[0028] Fig. 9 It is a cross-sectional view showing a stacked structure of organic EL layers constituting the organic EL display device according to the first embodiment.

[0029] Fig.10 It is a plan view showing the configuration of each light-emitting region and its surroundings in the first display region and the second display region of the organic EL display device according to the first embodiment.

[0030] Fig.11 It is a cross-sectional view showing a main part in the second display region of an organic EL display device according to Modification 1 of the first embodiment.

[0031] Fig.12 This is a plan view showing the configuration of each light-emitting region and its surroundings in the first display region and the second display region of an organic EL display device according to Modification 1 of the first embodiment.

[0032] Fig.13 It is a plan view showing the configuration of each light-emitting region and its surroundings in the first display region and the second display region of an organic EL display device according to Modification 2 of the first embodiment.

[0033] Fig.14 It is a cross-sectional view showing a main part of a second display region of an organic EL display device according to a second embodiment.

[0034] Fig.15 It is a plan view showing the configuration of each light-emitting region and its surroundings in the first display region and the second display region of the organic EL display device according to the second embodiment.

[0035] Fig.16 It is a cross-sectional view showing a main part in a second display region of an organic EL display device according to a modification example of the second embodiment.

[0036] Fig.17It is a plan view showing the configuration of each light-emitting region and its surroundings in the first display region and the second display region of an organic EL display device according to a modification example of the second embodiment.

[0037] Fig.18 It is a cross-sectional view showing a main part of a second display region of an organic EL display device according to another embodiment.

[0038] Fig.19 It is a cross-sectional view showing a main part of a second display region of an organic EL display device according to another embodiment. DETAILED DESCRIPTION

[0039] Hereinafter, exemplary embodiments will be described in detail with reference to the drawings. In the following embodiments, an organic EL display device including an organic EL element is taken as an example and described as a display device according to the technology disclosed herein.

[0040] In addition, in the following embodiments, the record of other films, layers, elements, etc. being arranged or formed on a certain film, layer, element, etc., not only means the situation where other elements exist directly above the certain element, but also includes the situation where other films, layers, elements, etc., exist between the two elements.

[0041] In addition, in the following embodiments, the description of connecting a certain film, layer, element, etc. to another film, layer, element, etc. means that it is electrically connected unless otherwise specified. The description does not deviate from the purpose of the technology disclosed herein, and refers not only to the case of direct connection, but also to the case of indirect connection via other film, layer, element, etc. The description also includes the case where other constituent elements are integrated with a certain constituent element, that is, a part of a certain constituent element constitutes another constituent element.

[0042] In addition, in the following embodiments, the record that a certain film, layer, element, etc. and other film, layer, element, etc. are the same layer means that a certain element is formed by the same process as other elements. A certain film, layer, element, etc. is the lower layer of other films, layers, elements, etc., which means that a certain element is formed by a process that is earlier than other elements. A record that a certain film, layer, element, etc. is the upper layer of other films, layers, elements, etc. means that a certain element is formed by a process that is later than other elements.

[0043] In addition, in the following embodiments, the description that a certain film, layer, element or other constituent element is the same or equivalent to other films, layers, elements or other constituent elements does not merely mean that the certain constituent element is completely the same as the other constituent elements, or is completely equivalent to the other constituent elements, but also includes the state that the certain constituent element is substantially the same as the other constituent elements, or is substantially equivalent to the other constituent elements, such as varying within the range of manufacturing deviations and tolerances.

[0044] In addition, in the following embodiments, descriptions such as "first", "second", "third", etc. are used to distinguish the sentences given these descriptions, and do not limit the number or order of the sentences.

[0045] 《First Implementation Mode》

[0046] Figure 1 to Figure 5 An example of the organic EL display device 1 according to the technology disclosed in the present invention is shown. Figure 1 It is a plan view schematically showing the structure of the organic EL display device 1 according to the first embodiment. Figure 2 It is along Figure 1 A cross-sectional view of the organic EL display device 1 taken along line II-II. Figure 3 1 is a plan view showing pixels Px constituting the display region D of the organic EL display device 1 and display wirings of the first conductive layer 24 , the second conductive layer 26 , and the third conductive layer 28 . Figure 4 1 is a plan view showing pixels Px constituting the display region D of the organic EL display device 1 and display wiring of the fourth conductive layer 35 . Figure 5 It is along Figure 3 FIG. 1 is a cross-sectional view of the organic EL display device 1 taken along line VV.

[0047] - Composition of organic EL display device -

[0048] like Figure 1 as well as Figure 2 As shown, the organic EL display device 1 is a display device with a camera combined with a camera 3 on the front side for photographing a display image. The organic EL display device 1 is provided with a display area D for displaying an image and a frame area F provided around the display area D. The camera 3 is arranged on the back side of the display area D relative to the resin substrate layer 10 of the organic EL display device 1, and is provided at a position overlapping with the display area D when viewed from above.

[0049] The camera 3 is an electronic component that uses light transmitted from the front side of the display area D in the organic EL display device 1 through the light emitting element layer 50, the TFT layer 20, and the resin substrate layer 10 described later for photographing. The camera 3 has, for example, an image sensor such as a Charge Coupled Device or a Complementary Metal Oxide Semiconductor. The camera 3 is disposed inside a housing (not shown) that houses the organic EL display device 1.

[0050] The display area D is a rectangular area constituting the screen. In this embodiment, a rectangular display area D is illustrated, but the display area D may also be a roughly rectangular shape with arc-shaped sides, arc-shaped corners, or a shape with a cutout on a portion of the side. Figure 3 and Figure 4 As shown, the display area D is composed of a plurality of pixels Px.

[0051] A plurality of pixels Px are arranged in a matrix. Each pixel Px is composed of three sub-pixels Sp. The three sub-pixels Sp are a sub-pixel Spr having a light-emitting region E that emits red light, a sub-pixel Spg having a light-emitting region E that emits green light, and a sub-pixel Spb having a light-emitting region E that emits blue light. The three sub-pixels Spr, Spg, and Spb are arranged, for example, in a stripe shape.

[0052] like Figure 1 As shown, the display area D includes a first display area D1 and a second display area D2. The first display area D1 is an area occupying most of the display area D. The second display area D2 is located inside the first display area D1. The second display area D2 is an area including a portion of the display area D that transmits light used in photographing by the camera 3. The second display area D2 is, for example, arranged in a rectangular island shape on the upper side of the display area D and surrounded by the first display area D1. The second display area D2 may be the above-mentioned roughly rectangular shape, or may be other shapes such as a circle or an ellipse.

[0053] The frame area F is a rectangular frame-shaped area that constitutes the non-display portion outside the screen. A terminal portion T for connecting to an external circuit is provided on one side of the frame area F. A terminal portion T is provided between the display area D of the frame area F and the terminal portion T. Figure 1 The bent portion B is bent with the mid-lateral direction, that is, the first direction X, as the bending axis.

[0054] like Figure 2 As shown, the terminal portion T is bent at 180° (U-shaped) at the bending portion B through the frame region F and is arranged on the back side of the organic EL display device 1. The terminal portion T is connected to a wiring substrate Cb such as an FPC (Flexible Printed Circuit). Figure 1 As shown, a plurality of lead wires L1 extending from the display region D to the terminal portion T are provided in the frame region F. The plurality of lead wires L1 are connected to a display control circuit (not shown) at the terminal portion T via a wiring substrate Cb.

[0055] In the frame region F, in the flattening film 33 described later, the groove G is provided in a manner surrounding the display region D. The groove G extends in a substantially C-shaped manner when viewed from above, and opens on the terminal portion T side. The groove G penetrates the flattening film 33 and is cut in a manner that divides the flattening film 33 into the inner side and the outer side of the frame region F. The groove G plays a role in preventing moisture and the like from penetrating into the display region D. The groove G may also be provided on the entire circumference of the display region D.

[0056] In the frame region F, the side adjacent to the side provided with the terminal portion T is formed ( Figure 1 A driving circuit Dc including a gate driver Gd and an emission driver Ed is monolithically provided in a portion (i.e., the left and right sides of the groove G). The gate driver Gd is arranged on the display area D side relative to the groove G. The emission driver Ed is arranged on the outer peripheral side of the frame area F relative to the groove G. The gate driver Gd and the emission driver Ed may be arranged oppositely relative to the groove G.

[0057] In the frame region F, a first frame wiring La ( Figure 1 The upper left oblique line is marked in the middle) and the second frame wiring Lb ( Figure 1 (marked with upper right oblique hatching in the middle). The first frame wiring La is arranged in a frame shape to be closer to the display area D side than the groove G and the driving circuit Dc. The first frame wiring La extends to the terminal portion T through the opening portion of the groove G in the frame area F. On the first frame wiring La, a high-level power supply voltage (ELVDD) is input at the terminal portion T via the wiring substrate Cb. The second frame wiring Lb is arranged in a roughly C shape on the outer peripheral side of the frame area F closer to the groove G and the driving circuit Dc. The two ends of the second frame wiring Lb extend along the first frame wiring La on the terminal portion T. A low-level power supply voltage (ELVSS) is input to the second frame wiring Lb at the terminal portion T via the wiring substrate Cb.

[0058] A first barrier wall Wa and a second barrier wall Wb are provided in the frame region F. The first barrier wall Wa is provided in a frame shape on the outside of the groove G. The second barrier wall Wb is provided in a frame shape on the periphery of the first barrier wall Wa. The first barrier wall Wa and the second barrier wall Wb play the following role in the manufacturing process of the organic EL display device 1. When the organic material forming the organic sealing layer 82 constituting the sealing film 80 is applied, the organic material is prevented from expanding to the outside of the frame region F. The first barrier wall Wa and the second barrier wall Wb are not shown in the figure, but are composed of, for example, a first wall layer and a second wall layer provided on the first wall layer.

[0059] The organic EL display device 1 adopts an active matrix driving method in which the light emission of each sub-pixel Sp is controlled by the TFT 30 and an image is displayed by the operation of the TFT 30. Figure 2 and Figure 5 As shown, the organic EL display device 1 includes a resin substrate layer 10 , a TFT layer 20 provided on the resin substrate layer 10 , a light emitting element layer 50 provided on the TFT layer 20 , and a sealing film 80 provided to cover the light emitting element layer 50 .

[0060] <Resin substrate layer>

[0061] The resin substrate layer 10 is an example of a base substrate. The resin substrate layer 10 is formed of an organic material such as a polyimide resin, a polyamide resin, or an epoxy resin. The resin substrate layer has flexibility. The resin substrate layer 10 can be composed of a laminated film of an inorganic insulating layer and a resin layer composed of the above-mentioned organic material, and the inorganic insulating layer is composed of an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride. A back protective film 11 is attached to the back of the resin substrate layer 10.

[0062] 〈TFT layer〉

[0063] The TFT layer 20 includes a base coating film 21, a semiconductor layer 22, a gate insulating film 23, a first conductive layer 24, a first interlayer insulating film 25, a second conductive layer 26, a second interlayer insulating film 27, a third conductive layer 28, a planarizing film 33, a first wall layer, and a fourth conductive layer 35, which are arranged in sequence on the resin substrate layer 10.

[0064] <First Conductive Layer to Fourth Conductive Layer>

[0065] The first conductive layer 24 , the second conductive layer 26 , the third conductive layer 28 , and the fourth conductive layer 35 include various wirings and electrodes.

[0066] The first conductive layer 24 is provided on the gate insulating film 23. The first conductive layer 24 includes a plurality of gate wirings 24gl, a plurality of gates 24ge, a plurality of emission control wirings 24el, a plurality of first capacitor electrodes 24ce, and a plurality of first lead wirings. The gate wirings 24gl, the gates 24ge, the emission control wirings 24el, the first capacitor electrodes 24ce, and the first lead wirings are composed of, for example, a single-layer film or a stacked film of a metal layer, and are formed of the same material in the same layer, and the metal layer is composed of aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), etc.

[0067] The second conductive layer 26 is provided on the first interlayer insulating film 25. The second conductive layer 26 includes a plurality of initialization power wirings 26il, a plurality of first power wirings 26pl, and a plurality of second capacitor electrodes 26ce. The initialization power wirings 26il, the first power wirings 26pl, and the second capacitor electrodes 26ce are composed of, for example, a single-layer film or a stacked film of a metal layer, and are formed on the same layer by the same material, and the metal layer is composed of aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), etc.

[0068] The third conductive layer 28 is provided on the second interlayer insulating film 27. The third conductive layer 28 includes a plurality of source wirings 28sl, a plurality of source electrodes 28se, a plurality of drain electrodes 28de, a plurality of connecting conductive portions 28cp, a plurality of second power wirings 28pl, a plurality of second lead wirings, a first frame wiring La, and a second frame wiring Lb. The source wiring 28sl, the source electrode 28se, the drain electrode 28de, the second power wiring 28pl, the second lead wiring, the first frame wiring La, and the second frame wiring Lb are composed of, for example, a single-layer film or a laminated film of a metal layer, and are formed of the same material in the same layer, and the metal layer is composed of aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), etc.

[0069] The fourth conductive layer 35 is provided on the lower flattening film 34 constituting the flattening film 33. The fourth conductive layer 35 includes a third power wiring 35pl and a plurality of relay conductive portions 35cp. These third power wiring 35pl and the plurality of relay conductive portions 35cp are composed of, for example, a single layer film or a stacked film of a metal layer including aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), etc., and are formed of the same material in the same layer.

[0070] Since the wiring and electrodes of the third conductive layer 28 and the wiring and electrodes of the fourth conductive layer 35 allow more current to flow or transmit data signals, it is preferable that the resistance is low. Therefore, for the wiring and electrodes of the third conductive layer 38 and the wiring and electrodes of the fourth conductive layer 35, for example, a stacked film of a titanium layer, an aluminum layer and a titanium layer, a stacked film of a titanium layer and an aluminum layer, a stacked film of a copper layer and a titanium layer, or a stacked film in which the titanium layer is replaced by a molybdenum layer or a tungsten layer is preferably used.

[0071] Furthermore, the wiring and electrodes of the third conductive layer 28 and the wiring and electrodes of the fourth conductive layer 35 are thicker than the wiring and electrodes of the first conductive layer 24 and the wiring and electrodes of the second conductive layer 26. Therefore, the wiring and electrodes of the third conductive layer 28 and the wiring and electrodes of the fourth conductive layer 35 are less likely to transmit light than the wiring and electrodes of the first conductive layer 24 and the wiring and electrodes of the second conductive layer 26, and light is prevented from transmitting from the front side of the display area D to the back side where the camera 3 is arranged. The thickness of the wiring and electrodes of the first conductive layer 24 is about 100nm to 300nm. The thickness of the wiring and electrodes of the second conductive layer 26 is about 100nm to 300nm. The thickness of the wiring and electrodes of the third conductive layer 28 is about 400nm to 800nm. The thickness of the wiring and electrodes of the fourth conductive layer 35 is about 400nm to 800nm.

[0072] 〈Various wiring and conductive parts〉

[0073] like Figure 3 As shown, a plurality of gate wirings 24gl are provided in the display region D and extend parallel to each other in the first direction X. The gate wirings 24gl are display wirings for transmitting gate signals and are provided for each row of sub-pixels Sp. Each gate wiring 24gl is connected to a gate driver Gd and is selected at a predetermined timing to become active.

[0074] A plurality of emission control wirings 24el are provided in the display region D and extend parallel to each other in the first direction X. The emission control wirings 24el are display wirings for transmitting emission control signals and are provided for each row of sub-pixels Sp. Each emission control wiring 24el is connected to an emission driver Ed and is sequentially selected at a predetermined timing to become inactive.

[0075] A plurality of first lead-out wirings are arranged in the frame region F, in a direction perpendicular to the first direction X, Figure 1 The first lead lines extend parallel to each other in the second direction Y, which is the longitudinal direction. Each first lead line is a connection line that connects a display line such as the source line 28s1 and the terminal portion T, and constitutes a part of the lead line L1.

[0076] A plurality of initialization power supply wirings 26i1 are provided in the display region D, and extend parallel to each other in the first direction X. The initialization power supply wirings 26i1 are display wirings for applying initialization potentials, and are provided for each row of sub-pixels Sp.

[0077] A plurality of first power wirings 26pl are provided in the display region D and extend parallel to each other in the first direction X. The first power wirings 26pl are display wirings that provide a predetermined high-level potential and are provided for each row of sub-pixels Sp. Each first power wiring 26pl is connected to the first frame wiring La via a contact hole formed in the second interlayer insulating film 27.

[0078] A plurality of source wirings 28s1 are provided in the display region D and extend parallel to each other in the second direction Y. The source wirings 28s1 are display wirings for transmitting source signals and are provided for each column of sub-pixels Sp. Each source wiring 28s1 is connected to a lead wiring L1 and is connected to a display control circuit via the lead wiring L1 and a terminal portion T.

[0079] like Figure 5 As shown in FIG. 1 , a plurality of connection conductive portions 28cp are provided in the display region D. The connection conductive portion 28cp is formed in an island shape for each sub-pixel Sp, and is connected to a drain electrode 28de of a sixth TFT 30f described later. The connection conductive portion 28cp is connected to a relay conductive portion 35cp via a lower contact hole 34h formed in a lower planarization film 34. The connection conductive portion 28cp connects the drain electrode 28de of the sixth TFT 30f to the relay conductive portion 35cp.

[0080] like Figure 3 As shown, a plurality of second power wirings 28pl are provided in the display area D and extend in parallel with each other in the second direction Y. The second power wirings 28pl are display wirings that are given a predetermined high-level potential and are provided in columns of sub-pixels Sp. Each second power wiring 28pl is connected to the first frame wiring La and intersects with each first power wiring 26pl. Each second power wiring 28pl is connected to the first power wiring 26pl at the intersection with the first power wiring 26pl via a contact hole formed in the second interlayer insulating film 27. The plurality of second power wirings 28pl together with the plurality of first power wirings 26pl constitute a high-level power wiring Pl.

[0081] A plurality of second lead-out wirings are provided in the frame region F and extend parallel to each other in the second direction Y. Each second lead-out wiring is connected to the first lead-out wiring via a contact hole formed in the first interlayer insulating film 25 and the second interlayer insulating film 27. Each second lead-out wiring is a connection wiring that connects a display wiring such as the source wiring 28s1 and the terminal portion T, and together with the first lead-out wiring, constitutes a lead-out wiring L1.

[0082] like Figure 4 As shown, the third power wiring 35pl is provided in the display area D, and extends in a grid shape in a manner parallel to each other in the first direction X and the second direction Y. The third power wiring 35pl is a display wiring that is given a predetermined high-level potential, and forms the eyes of the grid for each sub-pixel Sp, and extends between the light-emitting areas E of adjacent sub-pixels Sp. The third power wiring 35pl is connected to the first frame wiring La and the second power wiring 28pl through contact holes formed in the lower flattening film 34. The third power wiring 35pl and the plurality of second power wirings 28pl together form a high-level power wiring Pl.

[0083] A plurality of relay conductive portions 35cp are provided in the display region D. The relay conductive portion 35cp is formed in an island shape for each sub-pixel Sp, and is connected to the connection conductive portion 28cp via a lower contact hole 34h formed in the lower planarization film 34. The relay conductive portion 35cp is connected to the first electrode 51 via an upper contact hole 36h formed in the upper planarization film 36. The relay conductive portion 35cp connects the connection conductive portion 28cp and the first electrode 51.

[0084] <Various electrodes>

[0085] A plurality of gate electrodes 24ge, source electrodes 28se, and drain electrodes 28de are provided in each sub-pixel Sp, and together with the gate insulating film 23, the first interlayer insulating film 25, and the second interlayer insulating film 27, they constitute a TFT 30. At least one first capacitor electrode 24ce and one second capacitor electrode 26ce are provided in each sub-pixel Sp, and together with the first interlayer insulating film 25, they constitute a capacitor 32.

[0086] TFT

[0087] A plurality of TFTs 30 are provided in each sub-pixel Sp. That is, the TFT layer 20 includes a plurality of TFTs 30. The plurality of TFTs 30 are all top-gate TFTs. Each TFT 30 is composed of a semiconductor layer 22, a gate insulating film 23, a gate electrode 24ge, a first interlayer insulating film 25, a second interlayer insulating film 27, a source electrode 28se, and a drain electrode 28de.

[0088] The semiconductor layer 22 is provided in an island shape and is formed of an oxide semiconductor such as low temperature polycrystalline silicon (LTPS) or indium gallium zinc oxide (In-Ga-Zn-O system).

[0089] The gate insulating film 23 is provided so as to cover the semiconductor layer 22. The gate insulating film 23 is composed of a single layer film or a stacked film of an inorganic insulating layer composed of silicon oxide, silicon nitride, silicon oxynitride, etc. The gate 24ge is provided at a position overlapping with a part (channel region) of the semiconductor layer 22 via the gate insulating film 23.

[0090] The first interlayer insulating film 25 is provided in a manner covering the gate wiring 24gl, the gate 24ge, the emission control wiring 24el, and the first capacitor electrode 24ce. The second interlayer insulating film 27 is provided on the first interlayer insulating film 25 in a manner covering the initialization power wiring 26il, the first power wiring 26pl, and the second capacitor electrode 26ce. The first interlayer insulating film 25 and the second interlayer insulating film 27 are respectively composed of a single layer film or a laminated film of an inorganic insulating layer composed of, for example, silicon oxide, silicon nitride, silicon oxynitride, etc.

[0091] The source electrode 28se and the drain electrode 28de are separated from each other and are connected to different parts (source region, drain region) at positions sandwiching the region overlapping with the gate electrode 24ge in the semiconductor layer 22 via contact holes 31 formed in the gate insulating film 23, the first interlayer insulating film 25, and the second interlayer insulating film 27.

[0092] 〈Capacitors〉

[0093] At least one capacitor 32 is provided in each sub-pixel Sp. That is, the TFT layer 20 includes a plurality of capacitors 32. The plurality of capacitors 32 are respectively constituted by a first capacitor electrode 24ce, a first interlayer insulating film 25, and a second capacitor electrode 26ce.

[0094] The first capacitor electrode 24ce is connected to three TFTs 30 (first TFT 30a, second TFT 30b, and fourth TFT 30d) among the plurality of TFTs 30 provided for each sub-pixel Sp. The second capacitor electrode 26ce is provided at a position overlapping the first capacitor electrode 24ce via the first interlayer insulating film 25. The second capacitor electrode 26ce is connected to the high-level power supply wiring P1.

[0095] Figure 6 is an equivalent circuit diagram showing the pixel circuit 40 .

[0096] like Figure 6 As shown, the plurality of TFTs 30 and capacitors 32 provided for each sub-pixel Sp constitute a pixel circuit 40. The pixel circuit 40 controls light emission in the light-emitting region E of the corresponding sub-pixel Sp based on a gate signal supplied from the gate wiring 24gl, an emission signal supplied from the emission control wiring 24el, a source signal supplied from the source wiring 28sl, an initialization potential supplied from the initialization power wiring 26il, and a high-level potential supplied from the high-level power wiring PL.

[0097] Figure 6 The pixel circuit 40 shown is the pixel circuit 40 of the sub-pixel Sp in the m-th row and n-th column (m and n are positive integers). Figure 6 , the source wiring 28sl with (m) added to the reference symbol is the source wiring 28sl corresponding to the sub-pixel Sp in the m-th row. The gate wiring 24gl and the emission control wiring 24el with (n) added to the reference symbol are the gate wiring 24gl and the emission control wiring 24el corresponding to the sub-pixel Sp in the n-th column. In addition, the gate wiring 24gl with (n-1) added to the reference number is the gate wiring 24gl scanned before the gate wiring 24gl in the n-th column.

[0098] The plurality of TFTs 30 constituting the pixel circuit 40 include a first TFT 30a, a second TFT 30b, a third TFT 30c, a fourth TFT 30d, a fifth TFT 30e, a sixth TFT 30f, and a seventh TFT 30g. The first to seventh TFTs 30a, 30b, 30c, 30d, 30e, 30f, 30g are, for example, P-channel TFTs. In the first to seventh TFTs 30a, 30b, 30c, 30d, 30e, 30f, 30g, the gate 24ge corresponds to the control terminal, the electrode of one of the source 28se and the drain 28de corresponds to the first conduction terminal Na, and the electrode of the other corresponds to the second conduction terminal Nb.

[0099] The first TFT 30a is a first initialization TFT provided between the gate wiring 24gl(n-1), the initialization power wiring 26il and the capacitor 32. The control terminal of the first TFT 30a is connected to the gate wiring 24gl(n-1). The first conduction terminal Na of the first TFT 30a is connected to the initialization power wiring 26il. The second conduction terminal Nb of the first TFT 30a is connected to the first capacitor electrode 24ce of the capacitor 32. The first TFT 30a applies the voltage of the initialization power wiring 26il to the capacitor 32 according to the selection of the gate wiring 24gl(n-1), thereby initializing the voltage applied to the control terminal of the fourth TFT 30d.

[0100] The second TFT 30b is a TFT for threshold voltage compensation provided between the gate wiring 24gl (n) and the fourth TFT 30d. The control terminal of the second TFT 30b is connected to the gate wiring 24gl. The first conduction terminal Na of the second TFT 30b is connected to the second conduction terminal Nb of the fourth TFT 30d. The second conduction terminal Nb of the second TFT 30b is connected to the control terminal of the fourth TFT 30d. The second TFT 30b makes the fourth TFT 30d a diode connection state according to the selection of the gate wiring 24gl (n), thereby compensating the threshold voltage of the fourth TFT 30d.

[0101] The third TFT 30c is a TFT for writing control provided between the gate wiring 24gl(n), the source wiring 28sl(m) and the fourth TFT 30d. The control terminal of the third TFT 30c is connected to the gate wiring 24gl(n). The first conduction terminal Na of the third TFT 30c is connected to the source wiring 28sl(m). The second conduction terminal Nb of the third TFT 30c is connected to the first conduction terminal Na of the fourth TFT 30d. The third TFT 30c applies the voltage of the source wiring 28sl(m) to the first conduction terminal Na of the fourth TFT 30d according to the selection of the gate wiring 24gl.

[0102] The fourth TFT 30d is a driving TFT provided between the first TFT 30a, the second TFT 30b, the capacitor 32, the third TFT 30c, the fifth TFT 30e, and the sixth TFT 30f. The control terminal of the fourth TFT 30d is connected to the second conduction terminal Nb of the second TFT 30b and the second conduction terminal Nb of the first TFT 30a. The first conduction terminal Na of the fourth TFT 30d is connected to the second conduction terminal Nb of the third TFT 30c and the second conduction terminal Nb of the fifth TFT 30e. The second conduction terminal Nb of the fourth TFT 30d is connected to the first conduction terminal Na of the second TFT 30b and the first conduction terminal Na of the sixth TFT 30f. The fourth TFT 30d applies a driving current corresponding to the voltage applied between the control terminal and the first conduction terminal Na of the element to the first conduction terminal Na of the sixth TFT 30f.

[0103] The fifth TFT 30e is a TFT for power supply provided between the emission control wiring 24e1(n), the high-level power wiring P1 and the fourth TFT 30d. The control terminal of the fifth TFT 30e is connected to the emission control wiring 24e1(n). The first conduction terminal Na of the fifth TFT 30e is connected to the high-level power wiring P1. The second conduction terminal Nb of the fifth TFT 30e is connected to the first conduction terminal Na of the fourth TFT 30d. The fifth TFT 30e applies the potential of the high-level power wiring P1 to the first conduction terminal Na of the fourth TFT 30d according to the selection of the emission control wiring 24e1.

[0104] The sixth TFT 30f is a TFT for light emission control provided between the emission control wiring 24el(n), the second TFT 30b, the fourth TFT 30d, and the organic EL element 60. The control terminal of the sixth TFT 30f is connected to the emission control wiring 24el(n). The first conduction terminal Na of the sixth TFT 30f is connected to the second conduction terminal Nb of the fourth TFT 30d. The second conduction terminal Nb of the sixth TFT 30f is connected to the first electrode 51 of the organic EL element 60. The sixth TFT 30f applies a driving current to the organic EL element 60 according to the selection of the emission control wiring 24el(n).

[0105] The seventh TFT 30g is a second initialization TFT provided between the gate wiring 24gl(n), the initialization power wiring 26il and the organic EL element 60. The control terminal of the seventh TFT 30g is connected to the gate wiring 24gl(n). The second conduction terminal Nb of the seventh TFT 30g is connected to the initialization power wiring 26il. The first conduction terminal Na of the seventh TFT 30g is connected to the first electrode 51 of the organic EL element 60. The seventh TFT 30g resets the charge accumulated in the first electrode 51 of the organic EL element 60 according to the selection of the gate wiring 24gl.

[0106] The capacitor 32 is an element for data retention provided between the high-level power wiring P1, the first TFT 30a, and the fourth TFT 30d. The first capacitor electrode 24ce of the capacitor 32 is connected to the control terminal of the fourth TFT 30d, the second conduction terminal Nb of the first TFT 30a, and the second conduction terminal Nb of the second TFT 30b. The second capacitor electrode 26ce of the capacitor 32 is connected to the high-level power wiring P1. The capacitor 32 stores electricity at the voltage of the source wiring 28s1 when the gate wiring 24gl is in the selected state. The capacitor 32 maintains the voltage written by the storage, thereby maintaining the voltage applied to the control terminal of the fourth TFT 30d when the gate wiring 24gl is in the non-selected state.

[0107] <Planarization Film>

[0108] Figure 5 The planarization film 33 shown flattens the surface of the TFT layer 20 to reduce the step difference caused by the surface shape of the first TFT 30a, the second TFT 30b, the third TFT 30c, the fourth TFT 30d, the fifth TFT 30e, the sixth TFT 30f, and the seventh TFT 30g. The planarization film 33 has a lower planarization film 34 and an upper planarization film 36 provided on the lower planarization film 34.

[0109] The lower planarization film 34 covers the third conductive layer 28 (source wiring 28sl, second power wiring 28pl, source electrode 28se, and drain electrode 28de) except for a portion of the drain electrode 28de of the sixth TFT 30f in the display region D. The lower planarization film 34 is formed of an organic material such as a polyimide resin. A lower contact hole 34h is formed on the lower planarization film 34 for exposing the drain electrode 28de of the sixth TFT 30f at the bottom for each sub-pixel Sp.

[0110] The upper planarization film 36 covers the fourth conductive layer (the third power wiring 35pl and the relay conductive portion 35cp) except for a part of the relay conductive portion 35cp in the display area D. The upper planarization film 36 is formed of, for example, an acrylic resin such as polymethyl methacrylate resin (PMMA). From the viewpoint of improving the transmittance of light, acrylic resin is preferably used as the material of the upper planarization film 36. The upper planarization film 36 can be formed of other organic materials such as polyimide resin. In the upper planarization film 36, an upper contact hole 36h is formed for each sub-pixel Sp so that the relay conductive portion 35cp is exposed at the bottom.

[0111] Two first wall layers are provided on the outer periphery of the planarization film 33 in the frame region F. Each first wall layer is formed into a rectangular frame shape extending all around the planarization film 33. The two first wall layers are, for example, formed into shapes similar to each other and are arranged at intervals from each other in the width direction of the frame region F. Each first wall layer is formed of the same material as that of either or both of the lower planarization film 34 and the upper planarization film 36.

[0112] <Light Emitting Element Layer>

[0113] Figure 7 1 is a cross-sectional view showing a main part of the first display region D1 of the organic EL display device 1 . Figure 8 1 is a cross-sectional view showing a main part of the second display region D2 of the organic EL display device 1 . Fig. 9 It is a cross-sectional view showing a stacked structure of an organic EL layer 53 constituting the organic EL display device 1 . Fig.10 It is a plan view showing the configuration of each light emitting region E and its surroundings in the first display region D1 and the second display region D2.

[0114] like Figure 5 , Figure 7 and Figure 8 As shown, the light emitting element layer 50 includes a first electrode 51 , an edge cover 52 , a second wall layer, an organic EL layer 53 , and a second electrode 54 which are sequentially provided on the planarizing film 33 (upper planarizing film 36 ).

[0115] The first electrode 51, the organic EL layer 53, and the second electrode 54 constitute an organic EL element 60. The organic EL element 60 is an example of a light-emitting element. The organic EL element 60 is provided for each sub-pixel Sp. That is, the light-emitting element layer 50 includes a plurality of organic EL elements 60. The plurality of organic EL elements 60 are all top-emitting organic EL elements.

[0116] <First Electrode>

[0117] The first electrode 51 is provided for each sub-pixel Sp. The first electrode 51 is connected to the drain electrode 28de of the sixth TFT 30f in the corresponding sub-pixel Sp via the relay conductive portion 35cp. The first electrode 51 is separately manufactured in such a manner that the areas of the first display area D1 and the second display area D2 are different. The first electrode 51 functions as an anode for injecting holes (holes) into the organic EL layer 53. The first electrode 51 has light reflectivity that reflects light.

[0118] As the material of the first electrode 51, for example, metal materials such as silver (Ag), aluminum (Al), vanadium (V), cobalt (Co), nickel (Ni), tungsten (W), gold (Au), titanium (Ti), ruthenium (Ru), manganese (Mn), indium (In), ytterbium (Yb), lithium fluoride (LiF), platinum (Pt), palladium (Pd), molybdenum (Mo), iridium (Ir), and tin (Sn) can be listed.

[0119] In addition, the material of the first electrode 51 may also be, for example, an alloy of astatine (At) and astatine oxide (AtO2). Moreover, the material of the first electrode 51 may also be, for example, a conductive oxide such as tin oxide (SnO), zinc oxide (ZnO), indium tin oxide (ITO), and indium zinc oxide (IZO). In order to improve the hole injection efficiency into the organic EL layer 53, it is preferred that the first electrode 51 is formed of a material with a large work function. The first electrode 51 may also be formed by stacking a plurality of layers composed of the above materials.

[0120] <Edge cover>

[0121] The edge cover 52 is shared by the first display area D1 and the second display area D2. Figure 5 As shown, the edge cover 52 divides the first electrodes 51 of the adjacent sub-pixels Sp. The edge cover 52 is formed in a lattice shape as a whole, and covers the peripheral edge of each first electrode 51. As a material of the edge cover 52, for example, organic materials such as polyimide resin, acrylic resin, polysiloxane resin, and novolac resin can be cited. A part of the surface of the edge cover 52 protrudes upward to form a light isolating member 69.

[0122] The edge cover 52 has an opening 68 for exposing the first electrode 51 for each organic EL element 60. The organic EL element 60 emits light in a region corresponding to the opening 68 of the edge cover 52. The region corresponding to the opening 68 of the edge cover 52 in the sub-pixel Sp constitutes a light-emitting region E. At least the sixth TFT 30f of the first to seventh TFTs 30a, 30b, 30c, 30d, 30e, 30f, and 30g is located at a portion overlapping the edge cover 52.

[0123] <Second wall layer>

[0124] The second wall layers are stacked on the two first wall layers, respectively. That is, each second wall layer is formed into a rectangular frame extending all around the planarization film 33. The two second wall layers are formed into shapes similar to each other and are spaced apart from each other in the width direction of the frame region F. Each second wall layer is formed of the same material as the edge cover 52 in the same layer.

[0125] <Organic EL Layer>

[0126] The organic EL layer 53 has the same structure in the first display area D1 and the second display area D2. The organic EL layer 53 is an example of a light-emitting functional layer. Figure 7 as well as Figure 8 As shown, the organic EL layer 53 is disposed on the first electrode 51 in each opening 68 of the edge cover 52. Fig. 9 As shown, the organic EL layer 53 includes a hole injection layer 70, a hole transport layer 71, a light emitting layer 72, an electron transport layer 73, and an electron injection layer 74 sequentially disposed on the first electrode 51. Some of the hole injection layer 70, the hole transport layer 71, the electron transport layer 73, and the electron injection layer 74 may be continuously and commonly disposed in a plurality of sub-pixels Sp.

[0127] The hole injection layer 70 is also called an anode buffer layer. The hole injection layer 70 makes the energy levels of the first electrode 51 and the organic EL layer 53 close to each other, and improves the efficiency of injecting holes from the first electrode 51 to the organic EL layer 53. Examples of the material of the hole injection layer 70 include triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, phenylenediamine derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, and stilbene derivatives.

[0128] The hole transport layer 71 has a function of efficiently moving holes to the light-emitting layer 72. Examples of the material of the hole transport layer 71 include porphyrin derivatives, aromatic tertiary amine compounds, styrylamine derivatives, polyvinylcarbazole, poly-p-phenylene vinylene, polysilane, triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amine-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, hydrogenated amorphous silicon, amorphous hydrogenated silicon carbide, zinc sulfide, or zinc selenide.

[0129] When a voltage is applied through the first electrode 51 and the second electrode 54, the light-emitting layer 72 emits light by recombination of holes injected from the first electrode 51 and electrons injected from the second electrode 54. The light-emitting layer 72 is formed of, for example, a different material depending on the light emission color (red, green, or blue) of the organic EL element 60 in each sub-pixel Sp.

[0130] Examples of materials for the light-emitting layer 72 include metal hydroxyquinolinone compounds [8-hydroxyquinoline metal complexes], naphthalene derivatives, anthracene derivatives, diphenylethylene derivatives, vinylacetone derivatives, triphenylamine derivatives, butadiene derivatives, coumarin derivatives, benzoxazole derivatives, oxadiazole derivatives, oxazole derivatives, benzimidazole derivatives, thiadiazole derivatives, benzothiazole derivatives, styryl derivatives, styrylamine derivatives, bis(styryl)benzene derivatives, tristyrylbenzene derivatives, perylene derivatives, pyrene derivatives, aminopyrene derivatives, pyridine derivatives, rhodamine derivatives, acridine derivatives, phenoxazone, quinacridone derivatives, rubrene, poly(p-phenylenevinylene), or polysilanes.

[0131] The electron transport layer 73 efficiently moves electrons to the light-emitting layer 72. Examples of the material of the electron transport layer 73 include oxadiazole derivatives, triazole derivatives, benzoquinone derivatives, naphthoquinone derivatives, anthraquinone derivatives, tetracyanoanthraquinodimethane derivatives, diphenoquinone derivatives, fluorenone derivatives, silole derivatives, and metal hydroxyquinolinone (8-hydroxyquinoline metal complex) compounds.

[0132] The electron injection layer 74 is also called a cathode buffer layer. The electron injection layer 74 has a function of making the energy levels of the second electrode 54 and the organic EL layer 53 close to each other, and improving the efficiency of injecting electrons from the second electrode 54 to the organic EL layer 53. Examples of the material of the electron injection layer 74 include inorganic alkaline compounds such as lithium fluoride (LiF), magnesium fluoride (MgF2), calcium fluoride (CaF2), strontium fluoride (SrF2), and barium fluoride (BaF2), aluminum oxide (Al2O3), and strontium oxide (SrO).

[0133] <Second Electrode>

[0134] The second electrode 54 has the same structure in the first display area D1 and the second display area D2. The second electrode 54 is provided to be shared by a plurality of sub-pixels Sp. The second electrode 54 covers the organic EL layer 53 and the edge cover 52, and overlaps with the first electrode 51 via the organic EL layer 53. The second electrode 54 functions as a cathode for injecting electrons into the organic EL layer 53. The second electrode 54 has light transmittance for transmitting light.

[0135] As the material of the second electrode 54, for example, silver (Ag), aluminum (Al), vanadium (V), calcium (Ca), titanium (Ti), yttrium (Y), sodium (Na), manganese (Mn), indium (In), magnesium (Mg), lithium (Li), ytterbium (Yb), lithium fluoride (LiF), etc. can be listed.

[0136] The second electrode 54 can also be formed of an alloy such as magnesium (Mg) / copper (Cu), magnesium (Mg) / silver (Ag), sodium (Na) / potassium (K), astatine (At) / astatine oxide (AtO2), lithium (Li) / aluminum (Al), lithium (Li) / calcium (Ca) / aluminum (Al), lithium fluoride (LiF) / calcium (Ca) / aluminum (Al), etc.

[0137] The second electrode 54 may also be formed of a conductive oxide such as tin oxide (SnO), zinc oxide (ZnO), indium tin oxide (ITO), indium zinc oxide (IZO), etc. In order to improve the efficiency of electron injection into the organic EL layer 53, the second electrode 54 is preferably formed of a material with a small work function. The second electrode 54 may also be formed by stacking a plurality of layers composed of the above materials.

[0138] <Configuration of Sub-Pixels in the First Display Area and the Second Display Area>

[0139] In the first display region D1 and the second display region D2 , the sub-pixels Sp have different structures, specifically, different forms of the relay conductive portion 35 cp, the upper layer contact hole 36 h, and the organic EL element 60 .

[0140] The plurality of organic EL elements 60 included in the light emitting element layer 50 include a plurality of first organic EL elements 60A located in the first display region D1 (see Figure 7 ) and a plurality of second organic EL elements 60B located in the second display area D2 (refer to Figure 8 ).like Figure 7 , Figure 8 and Fig.10 As shown, in the first organic EL element 60A and the second organic EL element 60B, the size and shape of the first electrode 51 and the size and shape of the portion of the light-emitting layer 72 sandwiched between the first electrode 51 and the second electrode 54 and emitting light are different from each other.

[0141] The size of the first electrode 51 of the second organic EL element 60B is smaller than that of the first electrode 51 of the first organic EL element 60B. When viewed from above, the area of ​​the first electrode 51 of the second organic EL element 60B is smaller than that of the first electrode 51 of the first organic EL element 60A. The first electrode 51 shields light transmitted from the front side of the display area D displaying an image to the back side where the camera 3 is arranged ( Figure 7 as well as Figure 8 Indicated by double dotted lines. Fig.11 , Fig.14 , Fig.16 and Fig.19 Therefore, the relatively small area of ​​the first electrode 51 of the second organic EL element 60B contributes to improving the transmittance of the light used for the camera 3 in the second display area D2.

[0142] In the edge cover 52, the size of the opening 68 through which the first electrode 51 of the first organic EL element 60A is exposed is different from the size of the opening 68 through which the first electrode 51 of the second organic EL element 60B is exposed. When viewed from above, the opening area of ​​the opening 68 through which the first electrode 51 of the second organic EL element 60B is exposed is smaller than the opening area of ​​the opening 68 through which the first electrode 51 of the first organic EL element 60A is exposed. That is, the area of ​​the light emitting region E of each sub-pixel Sp in the second display area D2 is smaller than the area of ​​the light emitting region E of each sub-pixel Sp in the first display area D1. The "area of ​​the opening 68" mentioned here refers to the area of ​​the region surrounded by the edge on the first electrode 51 side of the opening 68.

[0143] The organic EL layer 53 of the first organic EL element 60A and the organic EL layer 53 of the second organic EL element 60B are formed in the same shape and in the same size in the area including the opening 68 of the edge cover 52 and the peripheral portion of the opening 68. When viewed from above, the area of ​​the organic EL layer 53 of the first organic EL element 60A and the area of ​​the organic EL layer 53 of the second organic EL element 60B are the same. The "area of ​​the organic EL layer 53" mentioned here refers to the area of ​​the region in which the separate light-emitting layer 72 is provided in the organic EL layer 53 when viewed from above. The organic EL layers 53 of the first display area D1 and the organic EL layers 53 of the second display area D2, which have the same area when viewed from above, can be formed simultaneously by the vapor deposition method without changing the film forming mask.

[0144] The plurality of connection conductive portions 28cp include: a first connection conductive portion 28cp1 provided for each first organic EL element 60A and located in the first display region D1; and a second connection conductive portion 28cp2 provided for each second organic EL element 60B and located in the second display region D2. The first connection conductive portion 28cp1 is a conductive portion for connecting the first electrode 51 of the first organic EL element 60A to the sixth TFT 30f. The second connection conductive portion 28cp2 is a conductive portion for connecting the first electrode 51 of the second organic EL element 60B to the sixth TFT 30f. These first connection conductive portion 28cp1 and the second connection conductive portion 28cp2 are formed, for example, in the same shape and the same size as each other.

[0145] The plurality of lower contact holes 34h in the lower planarization film 34 include a first lower contact hole 34h1 provided for the first organic EL element 60A and located in the first display area D1, and a second lower contact hole 34h2 provided for the second organic EL element 60B and located in the second display area D2. The first lower contact hole 34h1 is a contact hole for connecting the first electrode 51 of the first organic EL element 60A to the sixth TFT 30f. The second lower contact hole 34h2 is a contact hole for connecting the first electrode 51 of the second organic EL element 60B to the sixth TFT 30f. These first lower contact hole 34h1 and the second lower contact hole 34h2 are formed in the same shape and size as each other, for example.

[0146] The first lower contact hole 34h1 and the second lower contact hole 34h2 extend toward the front side of the display region D, respectively, and have inner circumferential surfaces that are inclined at predetermined inclination angles α1 and α2 in the direction facing the front side of the display region D relative to the surface direction of the resin substrate layer 10 in the display region D (the direction orthogonal to the thickness direction of the layer 10, the same below). The inclination angle α2 formed by the inner circumferential surface of the second lower contact hole 34h2 and the inclination angle α1 formed by the inner circumferential surface of the first lower contact hole 34h1 are equal to each other relative to the surface direction of the resin substrate layer 10 in the display region D.

[0147] The plurality of relay conductive portions 35cp include a first relay conductive portion 35cp1 provided for each first organic EL element 60A and located in the first display area D1, and a second relay conductive portion 35cp2 provided for each second organic EL element 60B and located in the second display area D2. The first relay conductive portion 35cp1 is a conductive portion for connecting the first electrode 51 of the first organic EL element 60A to the sixth TFT 30f. The second relay conductive portion 35cp2 is a conductive portion for connecting the first electrode 51 of the second organic EL element 60B to the sixth TFT 30f. The first relay conductive portion 35cp1 and the second relay conductive portion 35cp2 are different in size and shape from each other.

[0148] The plurality of upper contact holes 36h in the upper planarization film 36 include: a first upper contact hole 36h1 provided for the first organic EL element 60A and located in the first display area D1; and a second upper contact hole 36h2 provided for the second organic EL element 60B and located in the second display area D2. Here, the first upper contact hole 36h1 is equivalent to the first contact hole. The second upper contact hole 36h2 is equivalent to the second contact hole. The first upper contact hole 36h1 and the second upper contact hole 36h2 are different in positional relationship and size relative to the edge cover 52 and the light-emitting area E.

[0149] The first upper contact hole 36h1 and the second upper contact hole 36h2 are respectively extended toward the front side of the display area D and have inner peripheral surfaces (the second upper contact hole 36h2 is provided with a Fig.10 The part of the diagonal shadow line that tilts upward to the right will be referred to later. Fig.12 , Fig.13 , Fig.15 and Fig.17 The inner circumferential surface is the inner circumferential surface that is inclined at predetermined inclination angles β1 and β2 in the direction facing the front side of the display area D relative to the surface direction of the resin substrate layer 10 in the display area D. The inclination angle β2 of the inner circumferential surface of the second upper contact hole 36h2 relative to the surface direction of the resin substrate layer 10 in the display area D is smaller than the inclination angle β1 of the inner circumferential surface of the first upper contact hole 36h1.

[0150] like Figure 7 and Fig.10As shown, in the first display area D1, the first upper contact hole 36h1, the relay conductive portion 35, and the first lower contact hole 34h1 for connecting the first electrode 51 of each first organic EL element 60A to the drain electrode 28de of the sixth TFT 30f are all located at a portion overlapping with the edge cover 52. The first electrode 51 of each first organic EL element 60A is formed flat inside the opening 68 of the edge cover 52. The first electrode 51 of each first organic EL element 60A has an extension portion 51a extending from a portion corresponding to the opening 68 of the edge cover 52 to a portion overlapping with the edge cover 52.

[0151] The extension portion 51a of the first electrode 51 of each first organic EL element 60A is connected to the first relay conductive portion 35cp1 through the first upper layer contact hole 36h1. The first relay conductive portion 35cp1 does not extend to the light emitting region E of the sub-pixel Sp in which the first organic EL element 60A is provided when viewed from above. The first relay conductive portion 35cp1 may extend to the light emitting region E with a smaller area than the portion of the second relay conductive portion 35 described later located in the light emitting region E of the sub-pixel Sp.

[0152] The first relay conductive portion 35cp1 is connected to the first connection conductive portion 28cp1 through the first lower layer contact hole 34h1 at a portion overlapping with the edge cover 52. The organic EL layer 53 of each first organic EL element 60A overlaps with the flat first electrode 51 exposed at the bottom of the opening 68 of the edge cover 52. In each sub-pixel Sp of the first display area D1, the second electrode 54 overlaps with the flat organic EL layer 53 in the opening 68 of the edge cover 52.

[0153] like Figure 8 and Fig.10 As shown, in the second display area D2, the second upper contact hole 36h2 for connecting the first electrode 51 of each second organic EL element 60B to the drain electrode 28de of the sixth TFT 30f is located at a position corresponding to the opening 68 of the edge cover 52, that is, located in the light emitting area E when viewed from above. The second upper contact hole 36h2 is located inside the opening 68 of the edge cover 52, and is formed, for example, in a similar shape extending in a manner that the periphery of the opening 68 of the edge cover 52 is close to each other. The opening area of ​​the second upper contact hole 36h2 is larger than the opening area of ​​the first upper contact hole 36h1. The "opening area" mentioned here refers to the area of ​​the opening on the extended side (front side of the display area D) of the upper contact hole 36h.

[0154] The first electrode 51 of each second organic EL element 60B is provided in a region including the second upper contact hole 36h2 and its peripheral portion in the upper planarization film 36, and has a concave shape. The first electrode 51 of each second organic EL element 60B does not have a portion extending laterally like the extension portion 51a of the first electrode 51 of the first organic EL element 60A. The first electrode 51 of each second organic EL element 60B covers the inner peripheral surface of the second upper contact hole 36h2 on the inner side of the opening 68 of the edge cover 52, and overlaps with the flat second relay conductive portion 35cp2 exposed at the bottom of the second upper contact hole 36h2.

[0155] The second relay conductive portion 35cp2 extends from a portion corresponding to the opening 68 of the edge cover 52 to a portion overlapping the edge cover 52 at the periphery of the opening 68. In the second display region D2, the second lower contact hole 34h2 is located at a portion overlapping the edge cover 52 of the lower planarizing film 34. The second relay conductive portion 35cp2 is connected to the second connection conductive portion 28cp2 through the second lower contact hole 34h2 at a portion overlapping the edge cover 52.

[0156] The organic EL layer 53 of each second organic EL element 60B is provided in a region including the second upper contact hole 36h2 inside the opening 68 of the edge cover 52. The organic EL layer 53 of the second organic EL element 60B overlaps with the first electrode 51 exposed inside the opening 68 of the edge cover 52, and forms a deeper concave shape than the organic EL layer 53 of the first organic EL element 60A according to the surface shape of the first electrode 51.

[0157] In each sub-pixel Sp of the second display region D2, the second electrode 54 is provided in the region including the second upper contact hole 36h2. The second electrode 54 overlaps the organic EL layer 53 of the second organic EL element 60B inside the opening 68 of the edge cover 52, and forms a concave shape deeper than the portion constituting the first organic EL element 60A in accordance with the surface shape of the organic EL layer 53.

[0158] <Sealing film>

[0159] like Figure 5 As shown, the sealing film 80 is provided in a manner covering the plurality of organic EL elements 60. The sealing film 80 protects the organic EL layer 53 of each organic EL element 60 from moisture, oxygen, etc. The sealing film 80 includes a first inorganic sealing layer 81 provided in a manner covering the second electrode 54, an organic sealing layer 82 provided on the first inorganic sealing layer 81, and a second inorganic sealing layer 83 provided on the organic sealing layer 82.

[0160] The first inorganic sealing layer 81 and the second inorganic sealing layer 83 are composed of inorganic insulating films such as silicon oxide film, silicon nitride film, silicon oxynitride film, etc. The organic sealing layer 82 is formed of organic materials such as acrylic resin, epoxy resin, silicone resin, polyurea resin, polyparaxylene resin, polyimide resin, polyamide resin, etc. The sealing film 80 is covered by a surface protection film (not shown) attached to the surface side of the organic EL display device 1.

[0161] -Operation of the organic EL display device-

[0162] In the organic EL display device 1 having the above configuration, in each sub-pixel Sp, first, when the corresponding emission control wiring 24el is selected and becomes inactive, the organic EL element 60 becomes non-luminescent. Then, if the gate wiring 24gl scanned before the gate wiring 24gl corresponding to the organic EL element 60 in the non-luminescent state is selected, the gate signal is input to the first TFT 30a via the gate wiring 24gl, the first TFT 30a and the fourth TFT 30d become conductive, and the voltage of the initialization power supply wiring 26il is applied to the capacitor 32. As a result, the charge of the capacitor 32 is discharged, and the voltage applied to the gate 24ge of the fourth TFT 30d is initialized.

[0163] Next, when the gate wiring 24g1 corresponding to the organic EL element 60 in the non-light-emitting state is selected and becomes active, the second TFT 30b and the third TFT 30c become conductive, and a predetermined voltage corresponding to the source signal transmitted via the source wiring 28s1 is written into the capacitor 32 via the fourth TFT 30d in the diode-connected state. Furthermore, the seventh TFT 30g becomes conductive, and the voltage of the initialization power wiring 26i1 is applied to the first electrode 51 of the organic EL element 60, and the charge accumulated in the first electrode 51 is reset.

[0164] Then, if the emission control wiring 24e1 of the organic EL element 60 corresponding to the non-light-emitting state is not selected and becomes active, the fifth TFT 30e and the sixth TFT 30f become conductive, and the driving current corresponding to the voltage applied to the gate 24ge of the fourth TFT 30d is supplied from the high-level power wiring P1 to the organic EL element 60. In this way, each organic EL element 60 emits light at a brightness corresponding to the driving current. Thus, in the organic EL display device 1, an image is displayed in the display area D.

[0165] -Method for manufacturing an organic EL display device-

[0166] In order to manufacture such an organic EL display device 1, first, a resin substrate layer 10 is formed on the surface of a glass substrate by applying a resin material or the like. Next, a TFT layer 20, a light emitting element layer 50, and a sealing film 80 are sequentially formed on the resin substrate layer 10. Then, a laser or the like is irradiated from the glass substrate side toward the back side of the resin substrate layer 10, the glass substrate is peeled off from the resin substrate layer 10, and a back protective film 11 is attached to the back side of the resin substrate layer 10.

[0167] In addition, a surface protection film is attached to the surface of the substrate provided with the sealing film 80. Next, the wiring substrate Cb is connected to the terminal portion T of the organic EL display device 1, and the external circuit such as the display control circuit is mounted together with the wiring substrate Cb. Then, the organic EL display device 1 is accommodated in the housing together with the camera 3, and the camera 3 is provided at a position overlapping the second display area D2 when viewed from above on the back side of the organic EL display device 1.

[0168] In the manufacturing of the organic EL display device 1, in the process of forming the TFT layer 20, a photosensitive resin material is applied to the substrate on which the fourth conductive layer 35 (the third power wiring 35pl and the relay conductive portion 35cp) are formed by a known coating method such as spin coating. Then, the coating film of the photosensitive resin material is pre-baked, exposed, developed, and post-baked, and the coating film is patterned to form an upper flattening film 36. At this time, although it varies depending on the photosensitive resin material, by adjusting the presence or absence of intermediate baking before post-baking and the UV exposure of the i-line, the first upper contact holes 36h1 located in the first display area D1 and the second upper contact holes 36h2 located in the second display area D2 can be formed in a manner such that the inclination angles β1 and β2 of the inner circumferential surface and the opening area are different from each other as described above.

[0169] In addition, in the process of forming the light-emitting element layer 50, a conductive oxide film or a metal film is formed in a single layer or multiple layers by sputtering on the substrate on which the TFT layer 20 is formed, thereby forming a conductive film. Then, the conductive film is patterned by a known method such as photolithography to form a plurality of first electrodes 51. At this time, each first electrode 51 located in the first display area D1 and each first electrode 51 located in the second display area D2 may be formed in such a manner that the areas thereof are different from each other when viewed from above as described above.

[0170] - Features and Effects of the First Embodiment -

[0171] The feature (1) of the organic EL display device 1 of the first embodiment is as follows: the area of ​​the first electrode 51 of the second organic EL element 60B located in the second display area D2 is smaller than the area of ​​the first electrode 51 of the first organic EL element 60A located in the first display area D1, the first upper contact hole 36h1 for connecting the first electrode 51 of the first organic EL element 60A to the sixth TFT 30f is located at a position overlapping with the edge cover 52, the second upper contact hole 36h2 for connecting the first electrode 51 of the second organic EL element 60B to the sixth TFT 30f is located at a position corresponding to the opening 68 of the edge cover 52, and the first electrode 51 of the second organic EL element 60B, the organic EL layer 53 and the second electrode 54 are arranged in the area of ​​the upper planarizing film 36 including the second upper contact hole 36h2.

[0172] According to the feature (1) of the organic EL display device 1 of the first embodiment, since the area of ​​the first electrode 51 of the second organic EL element 60B is smaller than the area of ​​the first electrode 51 of the first organic EL element 60A, the amount of external light reflected by the first electrode 51 can be reduced and the amount of transmitted light can be increased in the second display area D2, thereby improving the transmittance of light used in photographing by the camera 3. In addition, since the first upper contact hole 36h1 is located at a position overlapping with the edge cover 52, the first electrode 51 of the first organic EL element 60A, the organic EL layer 53, and the second electrode 54 are not provided in the first upper contact hole 36h1.

[0173] On the other hand, the second upper contact hole 36h2 is located at a position corresponding to the opening 68 of the edge cover 52. Furthermore, since the first electrode 51, the organic EL layer 53, and the second electrode 54 of the second organic EL element 60B are provided in the region of the upper planarization film 36 including the second upper contact hole 36h2, the second organic EL element 60B can emit light in the second upper contact hole 36h2. As a result, the substantial area of ​​the portion where the second organic EL element 60B emits light becomes larger than when the second organic EL element 60B is not allowed to emit light in the second upper contact hole 36h2. Therefore, in the second display region D2, the area of ​​the light-emitting region E is relatively small, and the reduction in the brightness of each sub-pixel Sp can be suppressed.

[0174] The feature (2) of the organic EL display device 1 according to the first embodiment is that the opening area of ​​the second upper layer contact hole 36h2 is larger than the opening area of ​​the first upper layer contact hole 36h1.

[0175] According to feature (2) of the organic EL display device 1 of the first embodiment, since the area of ​​the inner circumferential surface of the second upper contact hole 36h2 is larger than the area of ​​the inner circumferential surface of the first upper contact hole 36h1, the actual area of ​​the light-emitting portion of the second organic EL element 60B can be appropriately increased compared to the case where the opening area of ​​the first upper contact hole 36h1 and the opening area of ​​the second upper contact hole 36h2 are the same.

[0176] The characteristic (3) of the organic EL display device 1 according to the first embodiment is that the area of ​​the organic EL layer 53 of the first organic EL element 60A and the area of ​​the organic EL layer 53 of the second organic EL element 60B are the same.

[0177] According to the feature (3) of the organic EL display device (1) of the first embodiment, the organic EL layers 53 of the first display area D1 and the organic EL layers 53 of the second display area D2, which have equal areas when viewed from above, can be formed at once without changing the film forming mask by the vapor deposition method. This contributes to inexpensive manufacturing of the organic EL display device 1. In addition, the film forming mask used in the vapor deposition method is generally relatively thin and is used in a state of being stretched and fixed by appropriate tension. Therefore, when it is used, the positional deviation of the opening for film formation caused by uneven deformation of the shape of the opening can be suppressed.

[0178] The characteristic (4) of the organic EL display device 1 of the first embodiment is that the tilt angle β2 formed by the inner peripheral surface of the second upper contact hole 36h2 relative to the surface direction of the resin substrate layer 10 is smaller than the tilt angle β1 formed by the inner peripheral surface of the first upper contact hole 36h1.

[0179] According to the feature (4) of the organic EL display device 1 of the first embodiment, compared with the case where the inclination angle β1 of the inner circumferential surface of the first upper contact hole 36h1 and the inclination angle β2 of the inner circumferential surface of the second upper contact hole 36h2 are the same, the area of ​​the inner circumferential surface of the second upper contact hole 36h2 becomes larger. This contributes to increasing the substantial area of ​​the portion where the second organic EL element 60B emits light.

[0180] The organic EL display device 1 according to the first embodiment has the feature (5) that the upper planarizing film 36 is formed of an acrylic resin.

[0181] According to the feature (5) of the organic EL display device 1 of the first embodiment, the amount of external light that passes through the upper planarizing film 36 can be increased compared to the case where the upper planarizing film 36 is formed of a polyimide resin. This can increase the transmittance of light used for photographing by the camera 3 in the second display area D2.

[0182] <<Variation 1 of the First Embodiment>>

[0183] Fig.11 It is a cross-sectional view showing a main part of the second display region D2 of the organic EL display device 1 according to the first modification of the first embodiment. Fig.12 It is a plan view showing the configuration of each light emitting region E and its surroundings in the first display region D1 and the second display region D2 of the organic EL display device 1 according to Modification 1 of the first embodiment.

[0184] In the organic EL display device 1 of the first embodiment, one second upper contact hole 36h2 is formed in the upper planarizing film 36 for each second organic EL element 60B. Fig.11 and Fig.12 As shown, in the organic EL display device 1 of this modification, a plurality of second upper contact holes 36 h 2 are formed in the upper planarizing film 36 for each second organic EL element 60B.

[0185] Specifically, the plurality of second upper contact holes 36h2 are a frame-shaped outer contact hole 36ho and a plurality of pinhole-shaped inner contact holes 36hi formed inside the outer contact hole 36ho. The outer contact hole 36ho extends along the periphery of the opening 68 of the edge cover 52. The plurality of inner contact holes 36hi are arranged at predetermined intervals.

[0186] Fig.12 Although the example shows a case where the plurality of inner contact holes 36hi are arranged in a row, the plurality of inner contact holes 36hi may be arranged in a matrix or in other arrangements. Fig.12 FIG. 4 shows an example in which the outer contact hole 36ho is a rectangular frame in a plan view, but the outer contact hole 36ho may be a circular, elliptical, or other frame shape other than a rectangular frame. Fig.12 2 shows an example in which each inner contact hole 36hi is a rectangular pinhole shape in a plan view, but the pinhole shape may be circular, elliptical, or other shapes other than rectangular.

[0187] With respect to the surface direction of the resin substrate layer 10, the tilt angle β2 formed by the inner circumference of the outer contact hole 36ho and the tilt angle β2 formed by the inner circumference of each inner contact hole 36hi are smaller than the tilt angle α1 formed by the inner circumference of the first upper contact hole 36h1. The opening area of ​​the second upper contact hole 36h2 is larger than the opening area of ​​the first upper contact hole 36h1. The "opening area of ​​the second upper contact hole 36h2" mentioned here refers to the total area of ​​the opening area of ​​the outer contact hole 36ho and the opening areas of each inner contact hole 36hi.

[0188] The first electrode 51 of the second organic EL element 60B is connected to the second relay conductive portion 35cp2 through the outer contact hole 36ho and each inner contact hole 36hi. The first electrode 51 of the second organic EL element 60B is provided in the upper flattening film 36 including the outer contact hole 36ho and its peripheral portion and the inner contact holes 36hi surrounded by the outer contact hole 36ho, forming a concavo-convex shape.

[0189] The organic EL layer 53 of the second organic EL element 60B is also provided in the outer contact hole 36ho and each inner contact hole 36hi inside the opening 68 of the edge cover 52. The organic EL layer 53 of the second organic EL element 60B overlaps with the first electrode 51 exposed inside the opening 68 of the edge cover 52, and forms a concavo-convex shape according to the surface shape of the first electrode 51.

[0190] In the second display area D2, the second electrode 54 is provided inside the outer contact hole 36ho and each inner contact hole 36hi inside the opening 68 of the edge cover 52. The second electrode 54 overlaps with the organic EL layer 53 of the second organic EL element 60B in the opening 68 of the edge cover 52, and forms a concavo-convex shape according to the surface shape of the organic EL layer 53.

[0191] - Features and Effects of Modification 1 of the First Embodiment -

[0192] The characteristic (1) of the organic EL display device 1 of the variant example 1 of the first embodiment is that a plurality of second upper contact holes 36h2 (36ho, 36hi) are formed for each second organic EL element 60B, and the first electrode 51 of the second organic EL element 60B is connected to the sixth TFT 30f respectively through the plurality of second upper contact holes 36h2 (36ho, 36hi).

[0193] According to the feature (1) of the organic EL display device 1 of the variant example 1 of the first embodiment, compared with the case where a second upper contact hole 36h2 is formed on the upper flattening film 36 for each second organic EL element 60B, the actual area of ​​the portion where the first electrode 51 is formed on the inner side of the opening 68 of the edge cover 52 can be increased.

[0194] The organic EL display device 1 according to the first modification of the first embodiment has the feature (2) that the outer contact hole 36ho among the plurality of second upper contact holes 36h is formed in a frame shape so as to extend along the periphery of the opening 68 of the edge cover 52 .

[0195] According to feature (2) of the organic EL display device 1 of the first modification of the first embodiment, since the outer contact hole 36ho is formed in a frame shape, the opening area and the inner peripheral surface area of ​​the second upper contact hole 36h2 can be appropriately increased. This helps to increase the substantial area of ​​the portion where the first electrode 51 is formed inside the opening 68 of the edge cover 52.

[0196] According to the features (1) and (2) of the present example, when the substantial area of ​​the portion where the first electrode 51 is formed inside the opening 68 of the edge cover 52 can be increased, the substantial area of ​​the portion where the second organic EL element 60B emits light can be increased. This is preferable because, in the second display region D2, although the area of ​​the light-emitting region E is relatively small, a decrease in the luminance of each sub-pixel Sp can be suppressed.

[0197] 《Variation 2 of the first embodiment》

[0198] Fig.13 It is a plan view showing the configuration of each light emitting region E and its surroundings in the first display region D1 and the second display region D2 of the organic EL display device 1 according to Modification 2 of the first embodiment.

[0199] In the organic EL display device 1 of the modification example 1, the plurality of second upper contact holes 36h2 are frame-shaped outer contact holes 36ho and a plurality of pinhole-shaped inner contact holes 36hi are provided inside the outer contact holes 36ho. Fig.13 As shown, in the organic EL display device 1 of this modification, the plurality of second upper layer contact holes 36h2 are all formed in a pinhole shape and are arranged in a matrix. The plurality of second upper layer contact holes 36h2 may be arranged in a row or in other arrangements.

[0200] - Features and Effects of Modification 2 of the First Embodiment -

[0201] The feature of the organic EL display device 1 of the variant example 2 of the first embodiment is the same as that of the above-mentioned variant example 1, in that a plurality of second upper contact holes 36h2 are formed for each second organic EL element 60B, and the first electrode 51 of the second organic EL element 60B is respectively connected to the sixth TFT 30f through the plurality of second upper contact holes 36h2, thereby being able to obtain the same effect as the feature (1) of the organic EL display device 1 of the above-mentioned variant example 1.

[0202] Second Implementation Method

[0203] The organic EL display device 1 of the second embodiment is different from the organic EL display device 1 of the first embodiment in the configuration of the sub-pixel Sp in the second display region D2, specifically, the configuration of the sixth TFT 30f, the second relay conductive portion 35cp2, the second lower contact hole 34h2, and the second organic EL element 60B. In addition, in this embodiment, except that the configuration of the first electrode 51 of the second organic EL element 60B is different from that of the first embodiment, the organic EL display device 1 is the same as that of the first embodiment.

[0204] Fig.14 1 is a cross-sectional view showing a main part of a second display region D2 of an organic EL display device 1 according to a second embodiment. Fig.15 It is a plan view showing the configuration of each light emitting region E and its surroundings in the first display region D1 and the second display region D2 of the organic EL display device 1 according to the second embodiment.

[0205] like Fig.14 and Fig.15 As shown, the sixth TFT 30f of each sub-pixel Sp of the second display area D2 is arranged at a position where the drain 28de overlaps with the first electrode 51 of the second organic EL element 60B when viewed from above. The configuration of the sixth TFT 30f relative to the first electrode 51 of the second display area D2 is different from the configuration of the sixth TFT 30f relative to the first electrode 51 of the first display area D1. The configuration of the sixth TFT 30f relative to the first electrode 51 of the first display area D1 may be the same as the configuration of the sixth TFT 30f relative to the first electrode 51 of the second display area D2.

[0206] In each sub-pixel Sp of the second display area D2, the second upper contact hole 36h2 is located in a region corresponding to the opening 68 of the edge cover 52. The second lower contact hole 34h2 is located inside the second upper contact hole 36h2, and is formed, for example, in a similar shape extending in such a manner that the periphery of the second upper contact hole 36h2 and the opening are close to each other. The opening area of ​​the second lower contact hole 34h2 is larger than the opening area of ​​the first lower contact hole 34h1. The "opening area" mentioned here refers to the area of ​​the opening on the extended side (front side of the display area D) of the lower contact hole 34h.

[0207] The first lower contact hole 34h1 and the second lower contact hole 34h2 extend toward the front side of the display area D and have inner peripheral surfaces (the second lower contact hole 34h2 is located at Fig.15 The part with the upper left slanted hatched line is referred to later. Fig.17The inner circumference of the second lower contact hole 34h2 is inclined at predetermined inclination angles α1 and α2 relative to the surface direction of the resin substrate layer 10 in the display region D in the direction facing the front side of the display region D. The inclination angle α2 formed by the inner circumference of the second lower contact hole 34h2 relative to the surface direction of the resin substrate layer 10 in the display region D is smaller than the inclination angle α1 formed by the inner circumference of the first lower contact hole 34h1.

[0208] In each sub-pixel Sp in the second display area D2, the second relay conductive portion 35cp2 is provided in a region including the second lower contact hole 34h2 and its peripheral portion, and has a concave shape. The second relay conductive portion 35cp2 covers the inner peripheral surface of the second lower contact hole 34h2 in the light emitting area E, and overlaps with the second connection conductive portion 28cp2 exposed at the bottom of the second lower contact hole 34h2.

[0209] When viewed from above, the area of ​​the second relay conductive portion 35cp2 is larger than the area of ​​the first relay conductive portion 35cp1. In each sub-pixel Sp of the second display area D2, the second relay conductive portion 35cp2 is contained in the area where the first electrode 51 is provided when viewed from above. Furthermore, when viewed from above, the area of ​​the second connection conductive portion 28cp2 is larger than the area of ​​the first connection conductive portion 28cp1. In each sub-pixel Sp of the second display area D2, the second connection conductive portion 28cp2 is contained in the area where the first electrode 51 of the second organic EL element 60B is provided when viewed from above. In each sub-pixel Sp of the second display area D2, the first electrode 51 of the second organic EL element 60B covers the inner circumference of the second upper contact hole 36h2 and the inner circumference of the second lower contact hole 34h2 in the opening 68 of the edge cover 52. The first electrode 51 of the second organic EL element 60B overlaps with the second relay conductive portion 35cp2 exposed inside the second upper contact hole 36h2, and forms a concave shape deeper than the first electrode 51 of the first organic EL element 60A. The first electrode 51 of the second organic EL element 60B does not have a portion extending laterally like the extension portion 51a of the first electrode 51 of the first organic EL element 60A, as in the first embodiment.

[0210] In each sub-pixel Sp of the second display area D2, the organic EL layer 53 of the second organic EL element 60B is provided in the area including the second lower contact hole 34h2 and the second upper contact hole 36h2. The organic EL layer 53 of the second organic EL element 60B overlaps with the first electrode 51 exposed inside the opening 68 of the edge cover 52, and forms a deeper concave shape than the organic EL layer 53 of the first organic EL element 60A according to the surface shape of the first electrode 51.

[0211] In each sub-pixel Sp of the second display area D2, the second electrode 54 is provided in the region including the second lower contact hole 34h2 and the second upper contact hole 36h2. The second electrode 54 overlaps with the organic EL layer 53 of the second organic EL element 60B in the opening 68 of the edge cover 52, and forms a concave shape deeper than the portion constituting the first organic EL element 60A in accordance with the surface shape of the organic EL layer 53.

[0212] -Features and Effects of Second Embodiment-

[0213] The organic EL display device 1 of the second embodiment has the feature (1) that the area of ​​the second relay conductive portion 35cp2 is larger than that of the first relay conductive portion 35cp1 and the second relay conductive portion 35cp2 is accommodated in the region of the second organic EL element 60B where the first electrode 51 is provided in a plan view.

[0214] According to the feature (1) of the organic EL display device 1 of the second embodiment, since the second relay conductive portion 35cp2 is contained in the region of the second organic EL element 60B provided with the first electrode 51 when viewed from above, the second relay conductive portion 35cp2 is separated from the first electrode 51 and does not hinder the light transmitted from the front side to the back side of the second display area D2. This helps to improve the transmittance of the light used for shooting by the camera 3 in the second display area D2.

[0215] The characteristic (2) of the organic EL display device 1 of the second embodiment is that the area of ​​the second connecting conductive portion 28cp2 is larger than that of the first connecting conductive portion 28cp1 and the second connecting conductive portion 28cp2 is accommodated in the region where the first electrode 51 of the second organic EL element 60B is provided when viewed from above.

[0216] According to the feature (2) of the organic EL display device 1 of the second embodiment, since the second connecting conductive portion 28cp2 is contained in the region of the second organic EL element 60B provided with the first electrode 51 when viewed from above, the second connecting conductive portion 28cp2 is separated from the first electrode 51 and does not hinder the light transmitted from the front side to the back side of the second display area D2. This helps to improve the transmittance of the light used for shooting by the camera 3 in the second display area D2.

[0217] The characteristic (3) of the organic EL display device 1 of the second embodiment is that the first lower contact hole 34h1 and the second lower contact hole 34h2 respectively extend toward the front side of the display area D, and have inner peripheral surfaces inclined at specified inclination angles α1 and α2 relative to the surface direction of the resin substrate layer 10 of the display area D, and the inclination angle α2 of the inner peripheral surface of the second lower contact hole 34h2 is greater than the inclination angle α1 of the inner peripheral surface of the first lower contact hole 34h1.

[0218] According to the feature (3) of the organic EL display device 1 of the second embodiment, the area of ​​the inner peripheral surface of the second lower contact hole 34h2 can be increased compared with the case where the inclination angle a1 of the inner peripheral surface of the first lower contact hole 34h1 and the inclination angle a2 of the inner peripheral surface of the second lower contact hole 34h2 are equal. This is conducive to increasing the substantial area of ​​the first electrode 51, and further increasing the substantial area of ​​the portion where the second organic EL element 60B emits light.

[0219] The characteristic (4) of the organic EL display device 1 according to the second embodiment is that the opening area of ​​the second lower layer contact hole 34h2 is larger than the opening area of ​​the first lower layer contact hole 34h1.

[0220] According to feature (4) of the organic EL display device 1 of the second embodiment, since the area of ​​the inner circumferential surface of the second lower contact hole 34h2 is larger than the area of ​​the inner circumferential surface of the first lower contact hole 34h1, the actual area of ​​the light-emitting portion of the second organic EL element 60B can be appropriately increased compared to the case where the opening area of ​​the first lower contact hole 34h1 and the opening area of ​​the second lower contact hole 34h2 are the same.

[0221] The feature (5) of the organic EL display device 1 of the second embodiment is that, in a plan view, the channel region 22c in the semiconductor layer 22 of the sixth TFT 30f connected to the first electrode 51 of the second organic EL element 60B is contained in the region where the first electrode 51 of the second organic EL element 60B is provided.

[0222] According to the feature (5) of the organic EL display device 1 of the second embodiment, since the channel region 22c of the semiconductor layer 22 of the sixth TFT 30f overlaps with the first electrode 51 when viewed from above, the contact resistance between the first electrode 51 and the sixth TFT 30f can be reduced, and the degradation of the characteristics of the sixth TFT 30f caused by light irradiation of the channel region 22c of the semiconductor layer 22 by stray light can be suppressed.

[0223] <<Variation of the Second Embodiment>>

[0224] Fig.16 It is a cross-sectional view showing a main part of the second display region D2 of the organic EL display device 1 according to a modification of the second embodiment. Fig.17 It is a plan view showing the configuration of each light emitting region E and its surroundings in the first display region D1 and the second display region D2 of the organic EL display device 1 according to a modification of the second embodiment.

[0225] In the organic EL display device 1 of the second embodiment, one second upper contact hole 36h2 is formed on the upper planarization film 36 for each second organic EL element 60B, but in the organic EL display device 1 of this modified example, multiple second upper contact holes 36h2 are formed on the upper planarization film 36 for each second organic EL element 60B.

[0226] The plurality of second upper contact holes 36h2 are formed in pinhole shape and arranged in a matrix. The plurality of second upper contact holes 36h2 can be arranged in a row or in other arrangements. Fig.17 Although the example in which each second upper layer contact hole 36h2 is a rectangular pinhole shape in a plan view is shown, the pinhole shape may be a circular, elliptical, or other shapes other than a rectangular shape.

[0227] As in the first embodiment, the opening area of ​​the second upper contact hole 36h2 is larger than the opening area of ​​the first upper contact hole 36h1. In addition, the tilt angle β2 formed by the inner peripheral surface of each second upper contact hole 36h2 relative to the surface direction of the resin substrate layer 10 is smaller than the tilt angle β1 formed by the inner peripheral surface of the first upper contact hole 36h1.

[0228] In each sub-pixel Sp of the second display area D2, the first electrode 51 of the second organic EL element 60B overlaps with the second relay conductive portion 35cp2 exposed inside each of the plurality of second upper contact holes 36h2. The first electrode 51 of the second organic EL element 60B is formed in a shape in which a concave portion having two steps is provided with a concave-convex shape in accordance with the surface shape of the second relay conductive portion 35cp2.

[0229] In each sub-pixel Sp of the second display area D2, the organic EL layer 53 of the second organic EL element 60B is provided in the area including the second upper contact hole 36h2 and the second lower contact hole 34h2. The organic EL layer 53 of the second organic EL element 60B overlaps with the first electrode 51 exposed inside the opening 68 of the edge cover 52, and forms a shape with projections and depressions inside the recessed portion in accordance with the surface shape of the first electrode 51.

[0230] In each sub-pixel Sp of the second display area D2, the second electrode 54 is provided in the region including the second lower contact hole 34h2 and the second upper contact hole 36h2. The second electrode 54 overlaps with the organic EL layer 53 of the second organic EL element 60B in the opening 68 of the edge cover 52, and has a shape in which projections and depressions are provided in the recessed portion in accordance with the surface shape of the organic EL layer 53.

[0231] - Features and Effects of Modification Example of Second Embodiment -

[0232] The feature (1) of the organic EL display device 1 of the variant example of the second embodiment is the same as the feature (1) of the organic EL display device 1 of the variant example 2, a plurality of second upper contact holes 36h2 are formed for each second organic EL element 60B, and the first electrode 51 of the second organic EL element 60B is respectively connected to the sixth TFT 30f via the plurality of second upper contact holes 36h2, thereby being able to obtain the same effect as the feature (1) of the organic EL display device 1 of the variant example 1 of the first embodiment.

[0233] 《Other Implementation Methods》

[0234] Fig.18 and Fig.19 Each of them is a cross-sectional view showing a main part in the second display area D2 of an organic EL display device 1 according to another embodiment.

[0235] In the organic EL display device 1 of the first embodiment and its modified examples 1 and 2 and the second embodiment and its modified example, the planarization film 33 is a double-layer structure consisting of a lower planarization film 34 and an upper planarization film 36. Fig.18 As shown, the planarizing film 33 is a single-layer structure consisting of only one coating film.

[0236] At this time, among the contact holes 33h provided for each organic EL element 60 in the planarization film 33, a first contact hole (not shown) for connecting the first electrode 51 of the first organic EL element 60A to the sixth TFT 30f in the first display region D1 is formed at a portion overlapping with the edge cover 52, and a second contact hole 33h2 for connecting the first electrode 51 of the second organic EL element 60B to the drain electrode 28de of the sixth TFT 30f in the second display region D2 is formed at a portion corresponding to the opening 68 of the edge cover 52. Furthermore, the first electrode 51 of the second organic EL element 60B, the organic EL layer 53, and the second electrode 54 only need to be provided in the region including the second contact hole 33h2 in the planarization film 33.

[0237] In addition, when the planarization film 33 is a single-layer structure, as shown in FIG. Fig.19 As shown, a plurality of second contact holes 33h2 may be formed in the planarization film 33 for each second organic EL element 60B. In this case, the first electrode 51 of the second organic EL element 60B is preferably connected to the drain electrode 28de of the sixth TFT 30f via the plurality of second contact holes 33h2. This helps to increase the substantial area of ​​the portion where the first electrode 51 is formed inside the opening 68 of the edge cover 52, thereby increasing the substantial area of ​​the portion where the second organic EL element 60B emits light.

[0238] Even in Fig.18 and Fig.19When the flattening film 33 shown is composed of a single layer, from the viewpoint of increasing the substantial area of ​​the light-emitting portion of the second organic EL element 60B, it is preferred that the inclination angle γ2 formed by the inner peripheral surface of the second contact hole 33h2 relative to the surface direction of the resin substrate layer 10 is smaller than the inclination angle formed by the inner peripheral surface of the first contact hole.

[0239] As described above, as an illustration of the technology disclosed in the present invention, preferred embodiments and variations are described. However, the technology disclosed in the present invention is not limited thereto, and can also be applied to embodiments that have been appropriately changed, replaced, added, omitted, etc. In addition, the various components described in the embodiments can also be combined to form a new embodiment. In addition, the components described in the drawings and detailed descriptions also include components that are not necessary for solving the problem. Therefore, based on the fact that these non-essential components are recorded in the attached drawings and detailed descriptions, it should not be immediately determined that these non-essential components are necessary.

[0240] For example, the above-described embodiment and its modified examples may have the following configurations.

[0241] As a material of the lower planarization film 34, a polyimide resin is exemplified, but the technology disclosed in the present invention is not limited thereto. The lower planarization film 34 may also be formed of an acrylic resin such as polymethyl methacrylate resin (PMMA). From the viewpoint of improving the transmittance of light, an acrylic resin is also preferably used as a material of the lower planarization film 34.

[0242] The area of ​​the organic EL layer 53 of the first organic EL element 60A and the area of ​​the organic EL layer 53 of the second organic EL element 60B are the same, but the technology disclosed in the present invention is not limited thereto. The area of ​​the organic EL layer 53 of the first organic EL element 60A and the area of ​​the organic EL layer 53 of the second organic EL element 60B are preferably the same as each other, but may be different from each other.

[0243] The organic EL layer 53 is provided separately in each sub-pixel Sp, but the technology disclosed in the present invention is not limited thereto. The organic EL layer 53 may also include a light-emitting layer 72 and be provided in a plurality of sub-pixels Sp in succession. In this case, the organic EL display device 1 may also include a color filter or the like to perform a color tone expression of each sub-pixel Sp.

[0244] Each pixel Px is composed of three-color sub-pixels Sp, but the technology of the present invention is not limited to this. The sub-pixels Sp constituting each pixel Px are not limited to three colors, and may be four or more colors. In addition, the three-color sub-pixels Sp constituting each pixel Px are arranged in a stripe shape, but the technology of the present invention is not limited to this. The arrangement of the plurality of sub-pixels Sp constituting each pixel Px may also be another arrangement such as a pentilure arrangement.

[0245] The first TFT 30a, the second TFT 30b, the third TFT 30c, the fourth TFT 30d, the fifth TFT 30e, the sixth TFT 30f and the seventh TFT 30g are all top gate types, but the technology disclosed in the present invention is not limited thereto. The first TFT 30a, the second TFT 30b, the third TFT 30c, the fourth TFT 30d, the fifth TFT 30e, the sixth TFT 30f and the seventh TFT 30g may also be bottom gate types. In addition, the number of TFTs 30 provided in the sub-pixel Px may be less than 6 or more than 8.

[0246] The first electrode 51 is an anode and the second electrode 54 is a cathode, but the technology disclosed in the present invention is not limited thereto. Alternatively, the first electrode 51 is a cathode and the second electrode 54 is an anode. In this case, for example, the organic EL layer 53 has an inverted stacked structure.

[0247] The organic EL layer 53 is a five-layer stacked structure consisting of a hole injection layer 70, a hole transport layer 71, a light-emitting layer 72, an electron transport layer 73, and an electron injection layer 74, but the technology of the present invention is not limited thereto. The organic EL layer 53 may be a three-layer stacked structure consisting of a hole injection layer and hole transport layer, a light-emitting layer 72, and an electron transport layer and electron injection layer, and any structure may be adopted.

[0248] The camera 3 is exemplified as an electronic component combined with the organic EL display device 1, but the technology of the present invention is not limited thereto. As long as the electronic component is arranged at a position overlapping with the display area D when viewed from the back of the organic EL display device 1, and utilizes light transmitted through the light-emitting element layer 50, the TFT layer 20, and the resin substrate layer 10, it may be another electronic component such as a fingerprint sensor or a face recognition sensor.

[0249] The organic EL display device 1 is exemplified as a display device, but the technology of the present invention is not limited thereto. The technology disclosed in the present invention can be applied to a display device having a plurality of light-emitting elements driven by current. For example, the technology disclosed in the present invention can also be applied to a display device having a light-emitting element using a layer containing quantum dots, that is, a QLED (Quantum-dot Light Emitting Diode).

[0250] Description of Reference Numerals

[0251] α1: Inclination angle of the inner peripheral surface of the first lower contact hole

[0252] α2: Inclination angle of the inner peripheral surface of the second lower contact hole

[0253] β1: Inclination angle of the inner peripheral surface of the first upper contact hole

[0254] β2: Inclination angle of the inner peripheral surface of the second upper contact hole

[0255] γ2: Inclination angle of the inner surface of the second contact hole

[0256] D: Display area

[0257] D1: First display area

[0258] D2: Second display area

[0259] 1: Organic EL display device (display device)

[0260] 3: Camera (electronic components)

[0261] 10: Resin substrate layer (substrate)

[0262] 20: TFT layer (thin film transistor layer)

[0263] 28cp: Connecting conductive part

[0264] 28cp1: First connection conductive part

[0265] 28cp2: Second connecting conductive part

[0266] 30: TFT (Thin Film Transistor)

[0267] 33: Flattening film

[0268] 33h: Contact hole

[0269] 34h: Lower flattening film

[0270] 34h1: First lower contact hole

[0271] 34h2: Second lower contact hole

[0272] 35cp: Relay conductive part

[0273] 35cp1: First relay conductive part

[0274] 35cp2: Second relay conductive part

[0275] 36: Upper flattening film

[0276] 36h: Upper contact hole

[0277] 36h1: First upper contact hole (first contact hole)

[0278] 36h2: Second upper contact hole (second contact hole)

[0279] 50: Light-emitting element layer

[0280] 51: First electrode

[0281] 52: Edge hood

[0282] 53: Organic EL layer (light-emitting functional layer)

[0283] 54: Second electrode

[0284] 60: Organic EL element (light-emitting element)

[0285] 60A: first organic EL element (first light-emitting element)

[0286] 60B: second organic EL element (second light-emitting element)

[0287] 68: Opening

Claims

1. A display device, comprising: substrate; A thin film transistor layer, which is disposed on the substrate and includes a plurality of thin film transistors; a light emitting element layer, which is disposed on the thin film transistor layer and includes a plurality of light emitting elements, A display area is provided, the display area displays an image by light emission of the light emitting element controlled by the operation of the thin film transistor, An electronic component is disposed on the back side of the display region relative to the substrate, and the electronic component utilizes light that passes through the light emitting element layer, the thin film transistor layer, and the substrate. The display device is characterized in that: The thin film transistor layer further includes a planarization film, and the planarization film is provided in a manner of covering the plurality of thin film transistors. The light emitting element layer comprises: a first electrode provided on the planarization film for each of the light emitting elements; an edge cover covering a peripheral edge portion of the first electrode and having an opening for exposing the first electrode; a light-emitting functional layer disposed on the first electrode in the opening of the edge cover; and A second electrode is disposed on the light-emitting functional layer, The first electrode is electrically connected to the thin film transistor via a contact hole formed in the planarization film for each of the light emitting elements. The display area includes a first display area and a second display area, the second display area is located inside the first display area and transmits light used by the electronic component. The plurality of light emitting elements include a first light emitting element located in the first display area and a second light emitting element located in the second display area, An area of ​​the first electrode of the second light-emitting element is smaller than an area of ​​the first electrode of the first light-emitting element, Among the plurality of contact holes, a first contact hole for electrically connecting the first electrode of the first light-emitting element with the thin film transistor is located at a position overlapping with the edge cover, and a second contact hole for electrically connecting the first electrode of the second light-emitting element with the thin film transistor is located at a position corresponding to an opening of the edge cover, The first electrode, the light-emitting functional layer, and the second electrode of the second light-emitting element are provided in a region of the planarizing film including the second contact hole.

2. The display device according to claim 1, characterized in that An opening area of ​​the second contact hole is larger than an opening area of ​​the first contact hole.

3. The display device according to claim 1, characterized in that An area of ​​the light-emitting functional layer of the first light-emitting element and an area of ​​the light-emitting functional layer of the second light-emitting element are equal to each other.

4. The display device according to claim 1, characterized in that The first contact hole and the second contact hole each have an inner peripheral surface, the inner peripheral surface extends toward the front side of the display area where the image is displayed, and is inclined at a predetermined inclination angle relative to the surface direction of the substrate of the display area. The inclination angle of the inner circumferential surface of the second contact hole is smaller than the inclination angle of the inner circumferential surface of the first contact hole.

5. The display device according to claim 1, characterized in that: The planarization film includes a lower planarization film and an upper planarization film provided on the lower planarization film. The thin film transistor layer further includes a relay conductive portion, which is provided on the lower planarization film for each of the light emitting elements and is located under the upper planarization film. The plurality of relay conductive parts include: a first relay conductive portion connecting the first electrode of the first light emitting element and the thin film transistor; and a second relay conductive portion connecting the first electrode of the second light emitting element to the thin film transistor, The first relay conductive portion is connected to the first electrode via a first upper contact hole and is electrically connected to the thin film transistor via a first lower contact hole, the first upper contact hole is formed in the upper planarization film as the first contact hole, and the first lower contact hole is formed on the lower planarization film for each of the light-emitting elements, The second relay conductive portion is connected to the first electrode via a second upper contact hole and is electrically connected to the thin film transistor via a second lower contact hole. The second upper contact hole is formed in the upper planarization film as the second contact hole, and the second lower contact hole is formed in the lower planarization film for each of the light-emitting elements.

6. The display device according to claim 5, characterized in that: The area of ​​the second relay conductive portion is greater than the area of ​​the first relay conductive portion. The second relay conductive portion is accommodated in a region of the second light emitting element where the first electrode is provided, in a plan view.

7. The display device according to claim 5, characterized in that: The first lower contact hole and the second lower contact hole each have an inner peripheral surface, the inner peripheral surface extends toward the front side of the display area where an image is displayed, and is inclined at a predetermined inclination angle relative to the surface direction of the substrate of the display area. The inclination angle of the inner circumference of the first lower contact hole is greater than the inclination angle of the inner circumference of the second lower contact hole.

8. The display device according to claim 5, characterized in that The second lower contact hole is located at a position corresponding to the opening of the edge cover.

9. The display device according to claim 8, characterized in that: An opening area of ​​the second lower contact hole is larger than an opening area of ​​the first lower contact hole.

10. The display device according to claim 8, characterized in that: The thin film transistor layer further includes a connecting conductive portion, and the connecting conductive portion is provided on the lower planarizing film for each of the light emitting elements. The plurality of connecting conductive parts include: a first connecting conductive portion connecting the first relay conductive portion and the thin film transistor; and a second connecting conductive portion connecting the second relay conductive portion and the thin film transistor; The area of ​​the second connecting conductive portion is larger than the area of ​​the first connecting conductive portion. The second connecting conductive portion is accommodated in a region of the second light emitting element where the first electrode is provided, in a plan view.

11. The display device according to claim 5, characterized in that: The thin film transistor layer comprises: a semiconductor layer provided under the lower planarization film for each of the thin film transistors; a gate insulating film provided in a manner covering the semiconductor layer; a gate disposed on the gate insulating film at a position overlapping the semiconductor layer; and an interlayer insulating film provided so as to cover the gate, A channel region overlapping with the gate in the semiconductor layer of the thin film transistor electrically connected to the first electrode of the second light emitting element entirely overlaps with the first electrode of the second light emitting element.

12. The display device according to claim 5, characterized in that: The upper planarization film is formed of acrylic resin.

13. The display device according to any one of claims 1 to 12, characterized in that: A plurality of second contact holes are formed for each of the second light emitting elements. The first electrode of the second light emitting element is electrically connected to the thin film transistor via a plurality of second contact holes.

14. The display device according to any one of claims 1 to 12, characterized in that: The second contact hole is formed in a frame shape so as to extend along the opening periphery of the edge cover.

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