Display assembly, display device comprising same and method of manufacturing a display device

Abstract

This invention discloses a display component, comprising: a substrate, multiple conductive structures, multiple light-emitting elements, and an encapsulation layer. The multiple conductive structures penetrate the substrate. Each light-emitting element has a first electrode and a second electrode, wherein the first electrode of the multiple light-emitting elements is electrically connected to the same conductive structure among the multiple conductive structures, and the second electrode of the multiple light-emitting elements is electrically connected to different conductive structures among the multiple conductive structures. The encapsulation layer covers the multiple light-emitting elements. Furthermore, a display device including the above-described display component and a method for manufacturing the display device are also proposed.

Description

Technical Field

[0001] This invention relates to a display component, a display device comprising the same, and a method for manufacturing the display device. Background Technology

[0002] Miniature light-emitting diodes (μLEDs) are suitable for constructing the pixel structure of μLED display devices due to their low power consumption, high brightness, high resolution, and high color saturation. Existing COB (Chip on Board) packaging technology fixes the bare μLED chips onto a printed circuit board (PCB) using conductive or insulating adhesive. However, because the linewidth of the PCB cannot be miniaturized, even with significant reductions in μLED chip size, the resolution of the μLED display device cannot be improved. Furthermore, the basic PCB thickness is at least 0.5mm, resulting in a certain height and weight after packaging. In addition, PCBs have multiple layers and are expensive. Summary of the Invention

[0003] The present invention provides a display component with reduced thickness and weight.

[0004] The present invention provides a display device with improved resolution.

[0005] The present invention provides a method for manufacturing a display device, which reduces manufacturing costs.

[0006] An embodiment of the present invention provides a display component, comprising: a substrate; a plurality of conductive structures respectively penetrating the substrate; a plurality of light-emitting elements, each light-emitting element having a first electrode and a second electrode, wherein the first electrode of the plurality of light-emitting elements is electrically connected to the same conductive structure among the plurality of conductive structures, and the second electrode of the plurality of light-emitting elements is electrically connected to different conductive structures among the plurality of conductive structures; and an encapsulation layer covering the plurality of light-emitting elements.

[0007] In one embodiment of the present invention, the plurality of light-emitting elements described above emit light of the same color or different colors.

[0008] In one embodiment of the present invention, the display component further includes a color conversion layer located between the encapsulation layer and a portion of the light-emitting element.

[0009] In one embodiment of the present invention, the display component further includes a dimming layer located between the encapsulation layer and the color conversion layer.

[0010] In one embodiment of the present invention, the display component further includes an isolation structure surrounding the color conversion layer.

[0011] In one embodiment of the present invention, the display component further includes a light-shielding layer, and the orthographic projection of the light-shielding layer onto the substrate is outside the orthographic projection of the plurality of conductive structures onto the substrate.

[0012] In one embodiment of the present invention, each of the above-mentioned conductive structures includes a connecting portion located on a first surface of the substrate and a through portion located in a through hole of the substrate, and the connecting portion electrically connects the light-emitting element and the through portion.

[0013] In one embodiment of the present invention, the minimum spacing between the connecting portions of the plurality of conductive structures is within the range of ±50% of the spacing between the first electrode and the second electrode of the light-emitting element.

[0014] In one embodiment of the present invention, the minimum spacing between the connecting portions of the plurality of conductive structures is between 1 μm and 10 μm.

[0015] One embodiment of the present invention provides a display device, comprising: a back plate having a plurality of pads disposed on its surface; and a plurality of the above-described display components, each electrically connected to the plurality of pads.

[0016] In one embodiment of the present invention, the conductive structure of the above-described display component electrically connects the pads and the light-emitting element.

[0017] One embodiment of the present invention provides a method for manufacturing a display device, comprising: forming a plurality of conductive structures on a substrate; disposing a plurality of light-emitting elements on the plurality of conductive structures, wherein each light-emitting element has a first electrode and a second electrode, wherein the first electrode of the plurality of light-emitting elements is electrically connected to the same conductive structure among the plurality of conductive structures, and the second electrode of the plurality of light-emitting elements is electrically connected to different conductive structures among the plurality of conductive structures; forming an encapsulation layer on the plurality of light-emitting elements and the substrate; and cutting the encapsulation layer and the substrate between the plurality of light-emitting elements to form a plurality of display components.

[0018] In one embodiment of the present invention, prior to forming the plurality of conductive structures on the substrate, the method further includes: forming a release layer on a carrier plate; forming a metal layer on the release layer; and forming a substrate on the metal layer.

[0019] In one embodiment of the present invention, the above-mentioned formation of a plurality of conductive structures on a substrate includes: forming a plurality of through holes penetrating the substrate; and forming a plurality of conductive structures in the plurality of through holes.

[0020] In one embodiment of the present invention, before or after the above-described arrangement of multiple light-emitting elements on multiple conductive structures, the method further includes: forming a light-shielding layer on a substrate.

[0021] In one embodiment of the present invention, the light-shielding layer described above surrounds a plurality of conductive structures.

[0022] In one embodiment of the present invention, after setting a plurality of light-emitting elements on a plurality of conductive structures as described above, the method further includes: forming a color conversion layer on a portion of the light-emitting elements.

[0023] In one embodiment of the present invention, the formation of the color conversion layer includes: forming an isolation structure that surrounds a plurality of light-emitting elements; forming a color conversion layer on a portion of the light-emitting elements; and forming an optical layer that covers another portion of the light-emitting elements, the color conversion layer, and the isolation structure.

[0024] In one embodiment of the present invention, before cutting the encapsulation layer and substrate between the plurality of light-emitting elements as described above, the method further includes: separating the release layer and the metal layer; removing a portion of the metal layer, leaving another portion of the metal layer; and electroplating the other portion of the metal layer.

[0025] In one embodiment of the present invention, after cutting the encapsulation layer and substrate between the plurality of light-emitting elements as described above, the method further includes: providing a back plate with a plurality of pads disposed on its surface; and disposing a plurality of display components on the plurality of pads of the back plate.

[0026] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0027] Figures 1A to 1M This is a cross-sectional schematic diagram showing the steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0028] Figure 2A This is a top view schematic diagram of a display component according to an embodiment of the present invention.

[0029] Figure 2B It is along Figure 2A A schematic diagram of the cross section line A-A'.

[0030] Figure 2C It is along Figure 2A A schematic diagram of the cross section drawn by section line B-B'.

[0031] Figure 3A This is a top view schematic diagram of a display component according to an embodiment of the present invention.

[0032] Figure 3B yes Figure 3A A bottom view of the display components.

[0033] Among them, the attached reference numerals

[0034] 10: Display device

[0035] 100, 200, 300: Display components

[0036] 110: Substrate

[0037] 111: First Surface

[0038] 112: Second Surface

[0039] 120, 220, 220A, 220B: Conductive structure

[0040] 121, 221A, 221B: Connecting parts

[0041] 122, 222A, 222B: Perforated section

[0042] 130, 230, 230A, 230B, 230C: Light-emitting elements

[0043] 131: Luminous Body

[0044] 132: First electrode

[0045] 133: Second electrode

[0046] 140: Encapsulation layer

[0047] 320A, 320B, 320C, 320D: Conductive Structure

[0048] 321A, 321B, 321C, 321D: Connecting parts

[0049] 322A, 322B, 322C, 322D: Perforated section

[0050] A-A', B-B': Section lines

[0051] BK: Isolation Structure

[0052] BM: Light-shielding layer

[0053] BP: Backplate

[0054] CA: Carrier Plate

[0055] CP, CP1, CP2, CPa, CPb, CPC, CPd: Pads

[0056] CT, CTa, CTc: Color conversion layers

[0057] D1: Minimum Spacing

[0058] D2: Spacing

[0059] DP: Connector Pad

[0060] LS: Laser Beam

[0061] ML: Metal layer

[0062] O1, O2: Openings

[0063] OC: Optical layer

[0064] P1: Flat area

[0065] P2, P21, P22: Pads

[0066] RL: Release layer

[0067] VA, VA1, VA2, VA3, VA4: Through holes

[0068] YL, YLa, YLc: Dimming layer Detailed Implementation

[0069] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the appended claims.

[0070] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to a physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other elements between two elements.

[0071] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, the first "element," "component," "region," "layer," or "part" discussed below may be referred to as a second element, component, region, layer, or part without departing from the teachings of this document.

[0072] The terminology used herein is for the purpose of describing particular embodiments only and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms, including "at least one" or indicating "and / or." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It should also be understood that, when used in this specification, the terms "comprising" and / or "including" specify the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or combinations thereof.

[0073] Furthermore, relative terms such as "down" or "bottom" and "up" or "top" may be used herein to describe the relationship between one element and another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in one figure is flipped, an element described as being "down" of another element will be oriented "up" of that element. Thus, the exemplary term "down" can include both "down" and "up" orientations, depending on the specific orientation of the figure. Similarly, if a device in one figure is flipped, an element described as being "down" or "below" of another element will be oriented "above" that element. Thus, the exemplary terms "down" or "below" can include both "up" and "down" orientations.

[0074] Given the specific number of measurements discussed and the associated errors (i.e., limitations of the measurement system), the terms "about," "approximately," or "substantially" as used herein include the value and the average value within an acceptable range of deviations from the specific value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "about," "approximately," or "substantially" as used herein may be chosen based on optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, rather than applying a single standard deviation to all properties.

[0075] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and this invention, and will not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0076] This document describes exemplary embodiments with reference to cross-sectional views, which are schematic diagrams of idealized embodiments. Therefore, variations in shape as a result of, for example, manufacturing techniques and / or tolerances, are expected in the illustrations. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include, for example, shape deviations caused by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0077] Figures 1A to 1MThis is a cross-sectional schematic diagram showing the steps of a method for manufacturing a display device 10 according to an embodiment of the present invention. Hereinafter, with reference to the drawings, embodiments of each step of the method for manufacturing the display device 10 will be described, but the present invention is not limited thereto.

[0078] Please refer to Figure 1A First, a carrier plate (CA) is provided. The carrier plate (CA) is, for example, a temporary carrier used to support the film layer formed in subsequent processing steps. The material of the carrier plate (CA) can be glass or other suitable materials.

[0079] Next, a release layer RL is formed on a carrier plate CA, and the carrier plate CA can be separated from the film layer (e.g., metal layer ML) formed in subsequent process steps through the release layer RL. The release layer RL is formed on the carrier plate CA, for example, by coating. The material of the release layer RL may include polyimide resin, diethylformamide, N-methylpyrrolidone, metal or oxide of said metal, wherein said metal is, for example, titanium (Ti), copper (Cu), aluminum (Al), silver (Ag), iron (Fe), nickel (Ni), molybdenum (Mo), tungsten (W), etc., but is not limited thereto.

[0080] Next, a metal layer ML is formed on the release layer RL. The metal layer ML may include a planar portion P1 and a plurality of pad portions P2, with the plurality of pad portions P2 located on the planar portion P1. In this embodiment, physical vapor deposition (e.g., sputtering), lithography, and etching processes may be used to form the metal layer ML, but are not limited thereto. The material of the metal layer ML may include a metal or alloy with good electrical conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver, or alloys thereof, or combinations thereof. In some embodiments, the metal layer ML may be a multilayer structure, such as including sequentially stacked titanium layers, aluminum layers, and titanium layers, but is not limited thereto.

[0081] Next, please refer to Figure 1BA substrate 110 with multiple vias VA is formed on a metal layer ML, and the vias VA can expose the pad portion P2 of the metal layer ML. In other words, the vias VA can completely overlap the pad portion P2 of the metal layer ML. The substrate 110 can be made of polyimide (PI), polycarbonate (PC), polyester (PET), cyclic olefin copolymer (COC), metallocene-based cyclic olefin copolymer (mCOC), or other suitable materials, but is not limited to these. In addition, the substrate 110 can also have a single-layer structure or a multi-layer structure. The multi-layer structure is, for example, a stack of any two or more layers of the above materials, which can be combined and varied as needed. The substrate 110 is formed on the metal layer ML by coating, and the vias VA can be formed by photolithography and etching processes, but is not limited to these methods.

[0082] Next, please refer to Figure 1C Multiple conductive structures 120 are formed in the vias VA of the substrate 110 and on the substrate 110. Specifically, the conductive structure 120 may include a connecting portion 121 located on the first surface 111 of the substrate 110 and a through portion 122 located in the via VA of the substrate 110, and the through portion 122 may electrically connect the connecting portion 121 to the pad portion P2 of the metal layer ML. In this embodiment, physical vapor deposition (e.g., sputtering), photolithography, and etching processes may be used to form the conductive structure 120. The material of the conductive structure 120 may include metals or alloys with good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver, their alloys, or combinations thereof. For example, in some embodiments, the through portion 122 of the conductive structure 120 may include a copper layer, and the connecting portion 121 may include sequentially stacked copper, nickel, and gold layers, but this is not a limitation.

[0083] Next, please refer to Figure 1DA light-shielding layer BM is formed on the substrate 110. The light-shielding layer BM can be formed on the substrate 110, for example, through a coating and developing process, but is not limited to this. The light-shielding layer BM can surround multiple conductive structures 120 without overlapping them, and the number of conductive structures 120 surrounded by the light-shielding layer BM can be determined as needed. The light-shielding layer BM can block the reflection of ambient light by the metal traces on the substrate 110, thereby reducing dark-state brightness and improving contrast. In addition, the light-shielding layer BM can have multiple openings O1, and the orthographic projection of the openings O1 onto the substrate 110 can overlap the orthographic projection of the surrounding conductive structures 120 onto the substrate 110, so as not to affect the subsequent placement of light-emitting elements. The material of the light-shielding layer BM can include black resin or light-shielding metals (e.g., chromium), materials with low reflectivity and light transmittance.

[0084] Next, a plurality of light-emitting elements 130 are disposed on the conductive structure 120. In some embodiments, a plurality of light-emitting elements 130 may be disposed on the conductive structure 120 first, and then a light-shielding layer BM may be formed on the substrate 110, wherein the orthographic projection of the light-shielding layer BM on the substrate 110 may be outside the orthographic projection of the light-emitting elements 130 on the substrate 110. The light-emitting element 130 may include a light-emitting body 131, a first electrode 132, and a second electrode 133, and the first electrode 132 and the second electrode 133 are electrically connected to the connection portions 121 of different conductive structures 120, respectively. In some embodiments, other conductive materials or conductive adhesives may also be included between the first electrode 132 and the connection portion 121, and between the second electrode 133 and the connection portion 121.

[0085] The light-emitting element 130 can be fabricated on a growth substrate and then transferred onto the substrate 110 via a mass transfer process. The first electrode 132 can act as or be electrically connected to the anode of the light-emitting element 130, and the second electrode 133 can act as or be electrically connected to the cathode of the light-emitting element 130. The light-emitting body 131 can, for example, include a stack of doped and undoped semiconductor materials. The materials of the first electrode 132 and the second electrode 133 can, for example, include alloys, nitrides of metal materials, oxides of metal materials, oxynitrides of metal materials, or other suitable materials, or a stack of metal materials and other conductive materials, or other low-resistivity materials. In this embodiment, the first electrode 132 and the second electrode 133 of the light-emitting element 130 are disposed on the same side of the light-emitting body 131. For example, the light-emitting element 130 can be a horizontal micro-light-emitting diode, but is not limited thereto. In some embodiments, the light-emitting element 130 can be a vertical micro-light-emitting diode.

[0086] Next, please refer to Figure 1EAn isolation structure BK is formed around the light-emitting element 130. In other words, the isolation structure BK can have multiple openings O2, and the orthographic projection of each opening O2 onto the substrate 110 can respectively overlap the orthographic projection of the light-emitting element 130 onto the substrate 110. The isolation structure BK is formed on the substrate 110, for example, by a coating process and a developing process. The material of the isolation structure BK is, for example, white photoresist, to isolate the color conversion materials used for different color conversions, while also preventing lateral light mixing of the light-emitting element 130 and refractioning the lateral light of the light-emitting element 130 to the positive viewing angle to increase the light emission field pattern. In this embodiment, the isolation structure BK can partially overlap the conductive structure 120, but is not limited thereto. In some embodiments, the isolation structure BK can not overlap the conductive structure 120 at all; for example, the isolation structure BK can be disposed between the conductive structure 120 and the light-shielding layer BM.

[0087] Next, please refer to Figure 1F A color conversion material is filled within the isolation structure BK and onto the light-emitting element 130 to form a color conversion layer CT on the light-emitting element 130. The color conversion layer CT may include phosphors or similar wavelength conversion materials to, for example, convert the blue light emitted by the light-emitting element 130 into red or green light, thereby achieving a full-color display effect. Therefore, the color conversion layer CT can be formed only on a portion of the light-emitting elements 130, instead of forming it on all of the light-emitting elements 130.

[0088] Next, please refer to Figure 1G The optical layer OC can be formed by coating, and the optical layer OC can encapsulate the color conversion layer CT and the isolation structure BK. The material of the optical layer OC is, for example, transparent photoresist, but is not limited to this. The optical layer OC can form a flat upper surface to facilitate subsequent processes.

[0089] Next, please refer to Figure 1H The dimming layer YL can be formed on the optical layer OC through a coating process and a developing process. In some embodiments, the dimming layer YL can be formed first on the color conversion layer CT and the isolation structure BK, and then the optical layer OC covering the dimming layer YL and the isolation structure BK can be formed. The material of the dimming layer YL is, for example, yellow photoresist, but is not limited to this.

[0090] Next, please refer to Figure 1I The encapsulation layer 140 can be formed by coating, and the encapsulation layer 140 can cover the dimming layer YL, the optical layer OC, and the light-shielding layer BM to provide protection for the light-emitting element 130 and its surrounding components. The material of the encapsulation layer 140 may include polymer materials, such as epoxy resins, but is not limited thereto.

[0091] Next, please refer to Figure 1JThe release layer RL is separated from the metal layer ML to remove the carrier plate CA and expose the metal layer ML. In this embodiment, the separation is performed by heat treatment, but it is not limited thereto. In some embodiments, the separation can be performed by laser.

[0092] Next, please refer to Figure 1K Remove the flat portion P1 of the metal layer ML, leaving the pad portion P2. The metal layer ML can be removed using a dry etching process or an isotropic etching process, but is not limited to these methods.

[0093] Next, please refer to Figure 1L Electroplating is performed on the pad portion P2 of the metal layer ML to form a contact pad CP on the outer surface of the pad portion P2, and the contact pad CP may be located on the second surface 112 of the substrate 110. In this embodiment, the contact pad CP may be a nickel layer and / or a gold layer formed by chemical electroplating, but is not limited thereto.

[0094] Next, the encapsulation layer 140 and substrate 110 between the light-emitting elements 130 are cut to form the display assembly 100. In this embodiment, a laser beam LS can be used for the above-mentioned cutting, but it is not a limitation. In other embodiments, the above-mentioned cutting can also be performed along a predetermined cutting line using, for example, a cutting tool or other suitable tool.

[0095] Next, please refer to Figure 1M A backplate BP with a plurality of pads DP on its surface is provided, and a plurality of display components 100 are disposed on the plurality of pads DP on the backplate BP, such that two pads CP of each display component 100 can be electrically connected to two pads DP on the backplate BP respectively, thereby forming a display device 10. In some embodiments, the pads CP and pads DP can also be electrically connected by conductive adhesive or other solder.

[0096] In this embodiment, the display device 10 may include: a backplate BP with a plurality of pads DP disposed on its surface; and a plurality of display components 100, each electrically connected to the plurality of pads DP. For example, two pads CP of each display component 100 may be physically connected to two pads DP on the backplate BP, or the pads CP of each display component 100 and the pads DP on the backplate BP may be electrically connected using other conductive materials or conductive adhesives. In this way, the light-emitting element 130 of the display component 100 can be electrically connected to the pads DP through the conductive structure 120, the pad P2 of the metal layer ML, and the pads CP. In addition, since the display device 10 does not require the use of a printed circuit board in its manufacturing process, the manufacturing cost of the display device 10 can be reduced.

[0097] The following uses Figures 2A to 3B Further embodiments of the present invention will be described, and the following will be used... Figures 1A to 1M The component designations and related content of the embodiments are as follows: the same designations are used to represent the same or similar components, and descriptions of identical technical content are omitted. For explanations of the omitted parts, please refer to... Figures 1A to 1M The embodiments described below will not be repeated.

[0098] Figure 2A This is a top view schematic diagram of a display component 200 according to an embodiment of the present invention. Figure 2B It is along Figure 2A A schematic diagram of the cross section line A-A'. Figure 2C It is along Figure 2A A schematic diagram of the cross-section along section line B-B'. To make the diagram more concise, Figure 2A The substrate 110, encapsulation layer 140, isolation structure BK, dimming layers YLa and YLc, optical layer OC, and pads CP1 and CP2 are omitted.

[0099] Please refer to the following at the same time Figures 2A to 2C The display component 200 includes: a substrate 110; a plurality of conductive structures 220 penetrating the substrate 110; a plurality of light-emitting elements 230 disposed on the plurality of conductive structures 220, each light-emitting element 230 including a light-emitting body 131, a first electrode 132 and a second electrode 133; and an encapsulation layer 140 covering the plurality of light-emitting elements 230.

[0100] In this embodiment, the conductive structure 220 of the display component 200 may include one conductive structure 220A and three conductive structures 220B, but is not limited thereto. The number of conductive structures 220A and 220B can be determined as needed, for example, depending on the number of light-emitting elements 230. In other embodiments, the display component 200 may include more conductive structures 220A and 220B. Furthermore, the conductive structure 220A may include a connecting portion 221A located on the first surface 111 of the substrate 110 and a through-hole portion 222A located in the through-hole VA of the substrate 110. The connecting portion 221A can electrically connect the light-emitting element 230 and the through-hole portion 222A, and the through-hole portion 222A can electrically connect the connecting portion 221A and the pad portion P21. Similarly, the conductive structure 220B may include a connection portion 221B located on the first surface 111 of the substrate 110 and a through portion 222B located in the through hole VA of the substrate 110. The connection portion 221B can electrically connect the light-emitting element 230 and the through portion 222B, and the through portion 222B can electrically connect the connection portion 221B and the pad portion P22.

[0101] In this embodiment, the light-emitting element 230 of the display assembly 200 may include light-emitting elements 230A, 230B, and 230C. Each light-emitting element 230A, 230B, and 230C includes a light-emitting body 131, a first electrode 132, and a second electrode 133. The first electrode 132 of each light-emitting element 230A, 230B, and 230C is electrically connected to a conductive structure 220A, and the second electrode 133 of each light-emitting element 230A, 230B, and 230C is electrically connected to multiple separate conductive structures 220B. In other words, the conductive structure 220A can serve as part of a common electrode of the display assembly 200. Although Figure 2A , Figure 2C The display component 200 shown includes one light-emitting element 230A, 230B, and 230C, but is not limited thereto. In some embodiments, the display component 200 may include any one or both of the light-emitting elements 230A, 230B, and 230C. In other embodiments, the display component 200 may include more or different numbers of light-emitting elements 230A, 230B, and 230C. For example, the display component 200 may include two or three light-emitting elements 230A, 230B, and 230C, or the display component 200 may include two light-emitting elements 230A and one light-emitting element 230B and one light-emitting element 230C.

[0102] In this embodiment, light-emitting elements 230A, 230B, and 230C can emit the same color of light. For example, light-emitting elements 230A, 230B, and 230C can all emit blue light, and a color conversion layer CTa can be disposed above light-emitting element 230A. For example, the color conversion layer CTa can be located between the encapsulation layer 140 and light-emitting element 230A. A color conversion layer CTc can be disposed above light-emitting element 230C. For example, the color conversion layer CTc can be located between the encapsulation layer 140 and light-emitting element 230C. No color conversion layer can be disposed on light-emitting element 230B. In this way, light-emitting element 230A can convert blue light into, for example, red light through the color conversion layer CTa, and light-emitting element 230C can convert blue light into, for example, green light through the color conversion layer CTc, enabling the display component 200 to achieve a full-color display effect.

[0103] In some embodiments, at least two of the light-emitting elements 230A, 230B, and 230C can emit different colors of light. For example, light-emitting element 230A can emit red light, while light-emitting elements 230B and 230C can both emit blue light. Furthermore, light-emitting elements 230A and 230B may not have a color conversion layer, while a color conversion layer CTc may be provided above light-emitting element 230C to convert blue light into green light to achieve full-color illumination.

[0104] In some embodiments, the display component 200 may further include dimming layers YLa and YLc, wherein the dimming layer YLa may be located between the encapsulation layer 140 and the color conversion layer CTa, and the dimming layer YLc may be located between the encapsulation layer 140 and the color conversion layer CTc. When the color conversion layers CTa and CTc cannot completely convert the blue light emitted by the light-emitting elements 230A and 230C, the dimming layers YLa and YLc can respectively filter out the blue light passing through the color conversion layers CTa and CTc.

[0105] In some embodiments, the display component 200 may further include an optical layer OC, which may be located between the encapsulation layer 140 and the light-emitting elements 230A, 230B, and 230C. For example, if the light-emitting element 230B does not require a color conversion layer, the optical layer OC may be located between the encapsulation layer 140 and the light-emitting element 230B. If the light-emitting elements 230A and 230C have color conversion layers CTa and CTc and dimming layers YLa and YLc, the optical layer OC may be located between the encapsulation layer 140 or the dimming layers YLa and YLc and the color conversion layers CTa and CTc. In some embodiments, the dimming layers YLa and YLc may be respectively disposed between the optical layer OC and the color conversion layers CTa and CTc. By appropriately selecting the refractive index of the optical layer OC, the optical layer OC can prevent total internal reflection, thereby improving the light extraction efficiency of the light-emitting elements 230A, 230B, and 230C.

[0106] In some embodiments, the display component 200 may further include an isolation structure BK, which may surround the color conversion layer CTa and the color conversion layer CTc respectively, and in a direction parallel to the first surface 111 of the substrate 110, the isolation structure BK may be located between the color conversion layers CTa and CTc and the optical layer OC.

[0107] In some embodiments, the display component 200 may further include a light-shielding layer BM, which may be disposed around the optical layer OC. The light-shielding layer BM can shield the metal traces around the light-emitting elements 230A, 230B, and 230C in areas not covered by the optical layer OC, thereby preventing light leakage caused by scattering of these metal traces. For example, in a direction perpendicular to the first surface 111 of the substrate 110, the light-shielding layer BM may be located between the encapsulation layer 140 and the substrate 110, and in a direction parallel to the first surface 111 of the substrate 110, the light-shielding layer BM may be located between the encapsulation layer 140 and the optical layer OC.

[0108] In some embodiments, the display assembly 200 may further include pads CP1 and CP2, which may be located on the second surface 112 of the substrate 110. Pad CP1 is located on the surface of pad P21 opposite to the conductive structure 220A, and pad CP2 is located on the surface of pad P22 opposite to the conductive structure 220B. Pads CP1 and CP2 may be formed by chemical electroplating, and the material of pads CP1 and CP2 may include, but is not limited to, nickel and / or gold. Since the display assembly 200 uses the substrate 110 and conductive structures 220A and 220B to replace the printed circuit board, the display assembly 200 can have reduced thickness and weight, and also eliminates the expensive cost of printed circuit boards.

[0109] Figure 3A This is a top view of a display component 300 according to an embodiment of the present invention. Figure 3B yes Figure 3A The above is a bottom view of the display component 300. The display component 300 may include: a substrate 110, a plurality of conductive structures 320A, 320B, 320C, 320D, a plurality of light-emitting elements 230A, 230B, 230C, pads CPa, CPb, CPc, CPd located on the second surface 112 of the substrate 110, and an encapsulation layer 140.

[0110] With Figures 2A to 2C Compared to the display component 200 shown, Figures 3A to 3BThe difference in the display component 300 shown is that the conductive structures 320A, 320B, 320C, and 320D of the display component 300 have different circuit layouts. For example, in this embodiment, the conductive structure 320A may include a connection portion 321A located on the first surface 111 of the substrate 110 and a through portion 322A located in the through hole VA1 of the substrate 110. The connection portion 321A can electrically connect the first electrode 132 of the light-emitting elements 230A, 230B, and 230C to the through portion 322A, and the through portion 322A can electrically connect the connection portion 321A to the pad CPa. Conductive structure 320B may include a connection portion 321B located on the first surface 111 of substrate 110 and a through portion 322B located in the through hole VA2 of substrate 110. The connection portion 321B can electrically connect the second electrode 133 of light-emitting element 230A to the through portion 322B, and the through portion 322B can electrically connect the connection portion 321B to the pad CPb. Conductive structure 320C may include a connection portion 321C located on the first surface 111 of substrate 110 and a through portion 322C located in the through hole VA3 of substrate 110. The connection portion 321C can electrically connect the second electrode 133 of light-emitting element 230B to the through portion 322C, and the through portion 322C can electrically connect the connection portion 321C to the pad CPc. The conductive structure 320D may include a connection portion 321D located on the first surface 111 of the substrate 110 and a through portion 322D located in the through hole VA4 of the substrate 110. The connection portion 321D can be electrically connected to the second electrode 133 of the light-emitting element 230C and the through portion 322D, and the through portion 322D can be electrically connected to the connection portion 321D and the pad CPd. It is worth noting that, in this embodiment, the minimum distance D1 between the connecting portion 321A and any one of the connecting portions 321B, 321C, and 321D can be equal to, substantially equal to, approximately equal to, or only slightly greater than or less than the distance D2 between the first electrode 132 and the second electrode 133 of the light-emitting elements 230A, 230B, and 230C. For example, the minimum distance D1 can be within approximately ±50% of the distance D2. In this way, the minimum distance required for the electrical connection between the first electrode 132 and the second electrode 133 of the light-emitting elements 230A, 230B, and 230C, where the distance D2 is less than 10 μm, and the connecting portions 321A, 321B, 321C, and 321D can be met. In some embodiments, the minimum distance D1 can be between 1 μm and 10 μm, for example, the minimum distance D1 can be 2.5 μm, 3 μm, or 6 μm.Compared to the traditional chip-on-board (COB) technology, which requires a trace spacing of 30μm to 40μm to package the chip onto the printed circuit board, the minimum trace spacing D1 of the display component 300 in this embodiment can be less than 10μm. This reduces the overall size of the display component 300, allowing the display device made from the display component 300 to have a higher resolution.

[0111] In summary, the manufacturing method of the display device of the present invention does not require the use of printed circuit boards to manufacture the display components and the display device. Therefore, it can not only eliminate the expensive costs associated with using printed circuit boards, but also reduce the thickness and weight of the display components, and further reduce the overall size of the display components, thereby improving the resolution of the display device.

[0112] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A display component, characterized in that, include: substrate; Multiple conductive structures penetrate the substrate. A plurality of light-emitting elements, each of the light-emitting elements having a light-emitting body, a first electrode and a second electrode, wherein the first electrode of the plurality of light-emitting elements is electrically connected to a connection portion of the same conductive structure among the plurality of conductive structures, and the second electrode of the plurality of light-emitting elements is electrically connected to connection portions of different conductive structures among the plurality of conductive structures; An encapsulation layer covers the plurality of light-emitting elements; A color conversion layer is located between the encapsulation layer and a portion of the light-emitting element; An isolation structure surrounding the color conversion layer; and An optical layer that covers the color conversion layer and the isolation structure; Wherein, the first electrode and the corresponding connecting part are located between the light-emitting body and the substrate, and the second electrode and the corresponding connecting part are located between the light-emitting body and the substrate; It also includes a light-shielding layer, and the orthographic projection of the light-shielding layer onto the substrate is outside the orthographic projection of the plurality of conductive structures onto the substrate, and the light-shielding layer surrounds the plurality of conductive structures and their connecting portions.

2. The display component as claimed in claim 1, characterized in that, The multiple light-emitting elements emit the same color light or different colors light.

3. The display component as described in claim 1, characterized in that, It also includes a dimming layer located between the encapsulation layer and the color conversion layer.

4. The display component as claimed in claim 1, characterized in that, Each of the conductive structures includes a connecting portion located on a first surface of the substrate and a through portion located in a through hole of the substrate, and the connecting portion electrically connects the light-emitting element and the through portion.

5. The display component as claimed in claim 4, characterized in that, The minimum spacing between the connecting portions of the plurality of conductive structures is within ±50% of the spacing between the first electrode and the second electrode of the light-emitting element.

6. The display component as claimed in claim 4, characterized in that, The minimum spacing between the connecting portions of the plurality of conductive structures is between 1 μm and 10 μm.

7. A display device, characterized in that, include: The back panel has multiple pads on its surface; as well as Multiple display components as described in claim 1 are electrically connected to the multiple pads, respectively.

8. The display device as claimed in claim 7, characterized in that, The conductive structure of the display component electrically connects the pad and the light-emitting element.

9. A method for manufacturing a display device, characterized in that, include: Multiple conductive structures are formed on the substrate; Multiple light-emitting elements are disposed on the multiple conductive structures, and each light-emitting element has a light-emitting body, a first electrode and a second electrode. The first electrode of the multiple light-emitting elements is electrically connected to the connection portion of the same conductive structure among the multiple conductive structures, and the second electrode of the multiple light-emitting elements is electrically connected to the connection portions of different conductive structures among the multiple conductive structures. An encapsulation layer is formed on the plurality of light-emitting elements and the substrate; and Cut the encapsulation layer and the substrate between the plurality of light-emitting elements to form a plurality of display components; Wherein, the first electrode and the corresponding connecting part are located between the light-emitting body and the substrate, and the second electrode and the corresponding connecting part are located between the light-emitting body and the substrate; After setting the plurality of light-emitting elements on the plurality of conductive structures, the method further includes: A color conversion layer is formed on a portion of the light-emitting element; The color conversion layer includes: An isolation structure is formed around each of the plurality of light-emitting elements; The color conversion layer is formed on the portion of the light-emitting element; and An optical layer is formed, and the optical layer covers another portion of the light-emitting element, the color conversion layer, and the isolation structure; Before or after setting the plurality of light-emitting elements on the plurality of conductive structures, the method further includes: forming a light-shielding layer on the substrate, wherein the orthogonal projection of the light-shielding layer on the substrate is outside the orthogonal projection of the plurality of conductive structures on the substrate, and the light-shielding layer surrounds the plurality of conductive structures and their connecting portions.

10. The method for manufacturing a display device as claimed in claim 9, characterized in that, The method further includes, prior to forming the plurality of conductive structures on the substrate: A release layer is formed on the carrier plate; A metal layer is formed on the release layer; and The substrate is formed on the metal layer.

11. The method for manufacturing a display device as claimed in claim 9, characterized in that, The formation of multiple conductive structures on the substrate includes: Forming a plurality of through holes penetrating the substrate; and The plurality of conductive structures are formed in the plurality of through holes.

12. The method for manufacturing a display device as claimed in claim 10, characterized in that, Before cutting the encapsulation layer and the substrate between the plurality of light-emitting elements, the following is also included: Separate the release layer from the metal layer; Remove a portion of the metal layer, leaving another portion of the metal layer; and Electroplating is performed on the other portion of the metal layer.

13. The method for manufacturing a display device as claimed in claim 9, characterized in that, After cutting the encapsulation layer and the substrate between the plurality of light-emitting elements, the method further includes: Provides a backplate with multiple pads on its surface; and The plurality of display components are disposed on the plurality of pads on the back plate.

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