Substrate processing method and substrate processing apparatus

By combining the coordinated operation of the ambient gas control component and the liquid ejection part in a horizontal position on the upper surface of the substrate, the problem of uneven distribution of ambient gas control and processing liquid in substrate processing is solved, and high-quality substrate processing is achieved.

CN115023793BActive Publication Date: 2026-07-24SCREEN HOLDINGS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SCREEN HOLDINGS CO LTD
Filing Date
2020-12-11
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing technologies make it difficult to simultaneously achieve ambient gas control and uniform distribution of treatment liquid on the upper surface of a substrate, resulting in uneven treatment quality and equipment contamination.

Method used

By maintaining the substrate in a horizontal position and utilizing the synergistic effect of the ambient gas control component and the liquid ejection section, the supply of inactive gas and the ejection of the processing liquid are controlled, and the supply amount and speed are adjusted to achieve a wide-range scanning of the ambient gas control and processing liquid on the upper surface of the substrate.

Benefits of technology

This technology enables the control of ambient gas and uniform distribution of processing liquid on the upper surface of the substrate, improving processing quality and avoiding equipment contamination and uneven processing.

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    Figure CN115023793B_ABST
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Abstract

The present invention is to simultaneously achieve environmental gas control on the upper surface of a substrate and reduction of unevenness in processing performed on the upper surface of the substrate, hold the substrate in a horizontal posture by a holding section, supply a non-active gas toward the upper surface of the substrate from an environmental gas control member in a state of being opposed to the upper surface of the substrate, and supply a processing liquid to the upper surface of the substrate by causing the holding section to rotate around a virtual rotation axis in a vertical direction and discharging the processing liquid from a discharge port of a liquid discharge section in a direction along the upper surface of the substrate. At this time, the amount of the processing liquid supplied per unit time from a processing liquid supply source to the liquid discharge section is changed to change the discharge speed of the processing liquid discharged from the liquid discharge section, thereby changing the liquid supply position on the upper surface of the substrate to which the processing liquid discharged from the liquid discharge section is supplied.
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Citation Information

Patent Citations

  • JP2014197571A

  • JP2017069346A

  • JP2017183595A

  • JP2018157061A

  • US20120247506A1