Chip burning device and chip burning method

Abstract

The present invention discloses a chip programming device and a chip programming method. The chip programming device according to an embodiment of the present invention includes a packaging system for packaging production files and generating production data packets; and a programming system connected to the packaging system to receive the production data packets. The programming system parses the production data packets and configures a corresponding programming environment for the production files. The chip programming device and the chip programming method according to the embodiments of the present invention can program multiple production files simultaneously, improving programming efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip burning, and in particular to a chip burning device and a chip burning method. Background Art

[0002] During the manufacturing process of electronic devices, the data areas of various programmable chips obtained from semiconductor manufacturers are blank. Before assembly, the latest versions of the control programs and data must be written using a chip programming device. Chip programming is an important part of the electronic device manufacturing process.

[0003] In the prior art, with the increase in the number of chip burning files and the increase in burning methods, there are more and more requirements for burning multiple production files during the chip burning process, more and more requirements for burning interface protocols, and more and more burning scenarios. Multiple production files may correspond to multiple hardware circuits. Multiple production files and hardware circuits need to be managed in each production. Multiple production files need to be burned multiple times, which makes production difficult, inefficient, and costly. The protocol of the burning interface is usually a private protocol, and the requirements of each manufacturer are different. In order to adapt to the requirements of different manufacturers, the burning tool needs to be continuously upgraded, which increases the R&D, management, and maintenance costs. In addition, according to the burning requirements, the burning scenarios include online automatic, online manual, offline automatic, offline manual and other application scenarios. Different burning tools adapted to different application scenarios will increase the management and maintenance costs of the burning tools.

[0004] Therefore, it is hoped that there will be a new chip programming device and chip programming method that can overcome the above problems. Summary of the Invention

[0005] In view of the above problems, the object of the present invention is to provide a chip burning device and a chip burning method, so as to realize the burning of multiple production files at one time, thereby improving the burning efficiency.

[0006] According to one aspect of the present invention, a chip burning device is provided, comprising a packaging system for packaging production files and generating a production data packet; and a burning system connected to the packaging system to receive the production data packet, the burning system parses the production data packet and configures a corresponding burning environment for the production file.

[0007] Preferably, the packaging system includes a file configuration unit, which independently configures different production files, generates corresponding configuration information, and generates a configuration file based on the configuration information, wherein the production data packet also includes the configuration file; the configuration information includes at least one of the interface, line sequence, protocol, rate, and address required by the production file.

[0008] Preferably, the burning system includes a switching unit connected to the file configuration unit to obtain the configuration information, and configure the interface and / or the line sequence for the corresponding production file according to the configuration information.

[0009] Preferably, the burning system includes a customization unit connected to the file configuration unit to obtain the configuration information and generate a customized communication protocol for the corresponding production file according to the configuration information.

[0010] Preferably, the burning system includes a parsing unit, which parses the production data packet to obtain a parsed production file and parsed configuration information; an association unit, which is connected to the parsing unit to obtain the parsed production file and the parsed configuration information, and associates the parsed production file with the corresponding parsed configuration information; and a burning configuration unit, which configures a burning environment for the corresponding parsed production file according to the parsed configuration information.

[0011] Preferably, the burning system parses the production data packet to obtain a parsed production file and parsed configuration information, and associates the parsed production file and the corresponding parsed configuration information to form a production data stream; the burning system includes a control unit, the control unit includes a first interface and a line sequence switching interface; the first interface receives the production data stream; the line sequence switching interface is provided with a plurality of pins, and the pins can be configured as at least one of a communication interface, a power supply, and a ground line; at least one line sequence switching circuit is respectively connected to the control unit and the chip to be burned, wherein the line sequence switching circuit supports the configuration of the pins; the burning system sets the hardware environment of the burning environment according to the production data stream and performs burning.

[0012] According to another aspect of the present invention, a chip burning method is provided, comprising the following steps: independently configuring different production files to generate corresponding configuration information, and generating a configuration file based on the configuration information; packaging the production files and the configuration file to generate a production data packet; sending the production data packet to a burning system; and the burning system parsing the production data packet to configure a corresponding burning environment for the production file.

[0013] Preferably, the configuration information includes at least one of the interface, line sequence, protocol, rate, and address required by the production file; the burning system parses the production data packet to obtain the parsed configuration information, and configures at least one of the communication interface, communication line sequence, communication protocol, communication rate, and communication address of the burning environment according to the parsed configuration information.

[0014] Preferably, the chip burning method further comprises parsing the production data packet to obtain a parsed production file and parsed configuration information; and associating the parsed production file with the corresponding parsed configuration information to generate a production data stream.

[0015] Preferably, the chip programming method further comprises selecting a programming mode, wherein the programming mode comprises at least one of offline automatic, offline manual, online automatic, and online manual.

[0016] According to the chip burning device and chip burning method of the embodiment of the present invention, a packaging system is used to package production files, and a burning system is used to parse and burn production files, which can realize the burning of multiple production files at one time, greatly improving the burning efficiency.

[0017] Furthermore, different production files are independently configured according to production requirements and production data packages are generated, which greatly improves the burning efficiency of multiple production files.

[0018] Furthermore, the production files can be adapted to different communication protocols, thereby enhancing the adaptability of the link layer protocol and improving the compatibility of the burning system and method.

[0019] Furthermore, the interface and line sequence can be dynamically switched according to the interface requirements of the chip burning, reducing the switching of hardware circuits during the burning process.

[0020] Furthermore, it can be applied to four burning scenarios: online automatic, online manual, offline automatic, and offline manual, which reduces management and maintenance costs, is applicable to different scenarios, and improves the versatility of the burning system and method. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0022] Figure 1 A schematic structural diagram of a chip programming device according to an embodiment of the present invention is shown;

[0023] Figure 2 A schematic diagram of a packaging process according to an embodiment of the present invention is shown;

[0024] Figure 3 A schematic structural diagram of a programming system according to an embodiment of the present invention is shown;

[0025] Figure 4 A schematic diagram of the hardware structure of a burning system according to an embodiment of the present invention is shown;

[0026] Figure 5 A flowchart of a chip programming method according to an embodiment of the present invention is shown;

[0027] Figure 6 A schematic diagram of a multi-mode selection process of a chip programming method according to an embodiment of the present invention is shown;

[0028] Figure 7 A schematic diagram showing the process flow of an online automatic mode of a chip programming method according to an embodiment of the present invention is shown;

[0029] Figure 8 A schematic diagram showing the flow of an online manual mode of a chip programming method according to an embodiment of the present invention is shown;

[0030] Figure 9 A schematic diagram showing the process of an offline automatic mode of a chip programming method according to an embodiment of the present invention is shown;

[0031] Figure 10 A schematic flow chart of an offline manual mode of a chip programming method according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0032] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by identical or similar reference numerals. For clarity, the various parts in the accompanying drawings are not drawn to scale. In addition, certain well-known parts may not be shown in the drawings.

[0033] Specific embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. Numerous specific details of the present invention, such as component structures, materials, dimensions, processing techniques, and technologies, are described below to facilitate a clearer understanding of the present invention. However, as those skilled in the art will appreciate, the present invention may be practiced without these specific details.

[0034] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0035] Figure 1 FIG. 1 shows a schematic diagram of the structure of a chip programming device according to an embodiment of the present invention. Figure 1 As shown, the chip programming device according to an embodiment of the present invention includes a packaging system 100 and a programming system 200 .

[0036] Specifically, the packaging system 100 packages production files and generates production data packets. Production files are, for example, files to be burned into a chip.

[0037] Optionally, the packaging system 100 includes a file configuration unit. The file configuration unit independently configures different production files, generates corresponding configuration information, and generates a configuration file based on the configuration information. The production data package also includes the configuration file. The configuration information includes at least one of the interface, line sequence, protocol, rate, and address required by the production file.

[0038] The burning system 200 is connected to the packaging system 100 to receive the production data package. The burning system 200 parses the production data package and configures a corresponding burning environment for the production file.

[0039] Optionally, the burning system 200 includes a switching unit. The switching unit is connected to the file configuration unit to obtain configuration information and configures the interface and / or line sequence for the corresponding production file based on the configuration information. Optionally, the burning system 200 includes a customization unit. The customization unit is connected to the file configuration unit to obtain configuration information and generates a customized communication protocol for the corresponding production file based on the configuration information.

[0040] Figure 2 FIG. 1 shows a schematic diagram of a packaging process according to an embodiment of the present invention. Figure 2 As shown, during packaging, the packaging system 100 according to an embodiment of the present invention generates configuration information based on different production files (production file 1, production file 2, production file 3, and production file 4 as shown in the figure), thereby obtaining a configuration file. The packaging system 100 packages the different production files and configuration files into a production data package.

[0041] In an optional embodiment of the present invention, the packaging system 100 is used to package multiple production files. Each production file corresponds to a configuration file, which contains information such as the interface, line sequence, protocol, rate, address, etc. required by the production file. Multiple production files and configuration files are packaged into a production data package. Specifically, when there are multiple production files, the specific packaging process is as follows:

[0042] Step 1: Select the first production file in the burning order.

[0043] Step 2: Set the communication interface and line sequence, communication protocol, communication rate, address, execution and other information of the production file, and add it to the production data package.

[0044] Step 3: Select all production files in sequence and complete the configuration.

[0045] Step 4: Package the production files and configuration files to generate a production data package.

[0046] Figure 3 FIG. 1 shows a schematic structural diagram of a programming system according to an embodiment of the present invention. Figure 3As shown, the burning system 200 according to the embodiment of the present invention includes a parsing unit 210 , a burning configuration unit 220 and an association unit 230 .

[0047] Specifically, the parsing unit 210 parses the production data packet to obtain parsed production files and parsed configuration information. The parsed production files are, for example, production files packaged by the packaging system 100. The parsed configuration information is, for example, configuration information obtained by the file configuration unit independently configuring different production files.

[0048] The associating unit 230 is connected to the parsing unit 210 to obtain the parsed production file and the parsed configuration information, and associate the parsed production file with the corresponding parsed configuration information.

[0049] In a specific embodiment, configuration information 1 is generated based on production file 1, and configuration information 2 is generated based on production file 2. A configuration file is obtained based on configuration information 1 and configuration information 2, and then production file 1, production file 2, and the configuration file are packaged into a production data packet. The parsing unit 210 parses the production data packet to obtain a parsed production file and parsed configuration information. The association unit 230 associates the parsed production file containing the relevant content of production file 1 with the parsed configuration information containing the relevant content of configuration information 1, and associates the parsed production file containing the relevant content of production file 2 with the parsed configuration information containing the relevant content of configuration information 2. Optionally, after associating the parsed production file and the corresponding parsed configuration information, a production data stream is formed.

[0050] The burning configuration unit 220 configures a burning environment for the corresponding parsed production file according to the parsed configuration information.

[0051] Figure 4 FIG. 1 shows a schematic diagram of the hardware structure of a programming system according to an embodiment of the present invention. Figure 4 As shown, the chip programming device according to an embodiment of the present invention includes a control unit 240 and a line sequence switching circuit 250. The control unit 240 includes a first interface 241 and a line sequence switching interface 242. Optionally, the chip programming device also includes other modules.

[0052] Specifically, the burning system 200 parses the production data packet to obtain a parsed production file and parsed configuration information, and associates the parsed production file with the corresponding parsed configuration information to form a production data stream.

[0053] The control unit 240 includes a first interface 241 and a line sequence switching interface 242. The first interface 241 receives the production data stream. The line sequence switching interface 242 is provided with multiple pins, which can be configured as at least one of a communication interface, a power supply, and a ground line. Optionally, the first interface 241 is a USB interface.

[0054] At least one line sequence switching circuit 250 is connected to the control unit 240 and the chip to be programmed, and the line sequence switching circuit 250 supports pin configuration. Optionally, the line sequence switching circuit 250 is connected to the chip to be programmed via a second interface 251.

[0055] The burning system 200 sets the hardware environment of the burning environment according to the production data flow and performs burning.

[0056] In an optional embodiment of the present invention, the parsing unit includes burning software. The burning software parses the production files and configuration files in the production data packet, and associates the parsed configuration file with the parsed production file to form a production data stream. The burning software and hardware circuit (for example, comprising the above-mentioned control unit 240 and line sequence switching circuit 250) implement the configuration of the burning environment. According to the configuration file, the communication interface and line sequence, communication protocol, communication rate, communication address and other information of the burning environment are configured. Optionally, the custom unit generates a custom communication protocol. In view of the production files of the custom communication protocol, the "transparent transmission protocol channel" of the burning tool (burning system) is adopted to implement the link layer protocol at the application layer to realize the burning of the production files of the custom communication protocol.

[0057] In a specific embodiment of the present invention, the circuit structure of the hardware circuit line sequence switching and the switching method are implemented as follows:

[0058] Step 1: The hardware circuit (e.g., control unit 240) has a first interface 241 (USB interface) and a line sequence switching interface 242. The hardware circuit is connected to the burning software via the USB interface. The hardware circuit is connected to the chip socket board via the line sequence switching interface.

[0059] Step 2: Each hardware circuit includes at least one line sequence switching circuit. Each line sequence switching circuit supports any configuration of 8 pins. The line sequence switching interface can be designed according to the interface of the chip socket board.

[0060] Step 3: Each line switching interface includes a communication interface, power supply, and ground line. Communication interfaces include SPI, UART, I2C, 1WI, 7816, and other interfaces. Any pin in the line switching interface can be configured as any communication interface, power supply, or ground.

[0061] In an optional embodiment of the present invention, in view of the configuration of multiple burning scenarios, the burning system can be applied to four burning scenarios: online automatic, online manual, offline automatic, and offline manual. In the burning scenarios of online automatic and online manual modes, the burning system (burning software) implements the parsing of production data packets and the formation of production data streams. The burning system (hardware circuit) implements the dynamic configuration of interfaces and line sequences, protocols, rates, addresses, etc. In the application scenarios of offline automatic and offline manual modes, the burning system implements the parsing of production data packets and the formation of production data streams. The burning system (hardware circuit) implements the storage of production data streams and the dynamic coordination of interfaces and line sequences, protocols, rates, and addresses.

[0062] Figure 5 FIG. 1 shows a flow chart of a chip programming method according to an embodiment of the present invention. Figure 5 As shown, the chip programming method according to an embodiment of the present invention includes the following steps:

[0063] In step S101, different production files are independently configured to generate corresponding configuration information, and a configuration file is generated based on the configuration information;

[0064] Different production files are configured independently to generate corresponding configuration information, and a configuration file is generated based on the configuration information. The configuration information includes at least one of the interface, line sequence, protocol, rate, and address required by the production file.

[0065] In step S102, the production file and the configuration file are packaged to generate a production data package;

[0066] Package the production files and configuration files to generate a production data package.

[0067] In step S103, the production data packet is sent to the burning system;

[0068] Send the production data package to the burning system.

[0069] In step S104, the production data package is parsed and a corresponding burning environment is configured for the production file.

[0070] Parse the production data packet and configure the corresponding burning environment for the production file. The burning system parses the production data packet to obtain parsed configuration information and configures at least one of the communication interface, communication line sequence, communication protocol, communication rate, and communication address of the burning environment according to the parsed configuration information.

[0071] In an optional embodiment of the present invention, the chip programming method further includes:

[0072] Parse the production data packet to obtain the parsed production file and parsed configuration information;

[0073] Associate the parsed production file with the corresponding parsed configuration information to generate a production data stream.

[0074] In an optional embodiment of the present invention, the chip programming method further includes selecting a programming mode, wherein the programming mode includes at least one of offline automatic, offline manual, online automatic, and online manual. Figure 6 FIG. 1 shows a schematic diagram of a multi-mode selection process of a chip programming method according to an embodiment of the present invention. Figure 6 As shown in Figure 1, the multi-mode selection process includes:

[0075] Step S201: system configuration;

[0076] Configure the system according to the burning requirements.

[0077] Step S202: Select a working mode.

[0078] Select the working mode, which includes online automatic, online manual, offline automatic and offline manual.

[0079] In online mode, the specific implementation method is as follows:

[0080] Step 1: After the hardware circuit is powered on, select online automatic or online manual mode according to the hardware configuration.

[0081] Step 2: Receive production data stream via USB interface.

[0082] Step 3: Configure the hardware circuit production environment and burn the chip according to the production data stream data type.

[0083] Step 4: After the burning is completed, wait for the next production data flow.

[0084] Figure 7 FIG. 1 shows a flow chart of an online automatic mode of a chip programming method according to an embodiment of the present invention. Figure 7 As shown, the chip programming method in online automatic mode includes the following steps:

[0085] In step S301, the burning software is run;

[0086] Run the burning software, where the burning software is used to automatically complete the burning.

[0087] In step S302, the online automatic mode is selected;

[0088] The hardware circuit selects the online automatic mode. The hardware circuit exchanges data with the burning software to realize the selection of the hardware circuit online automatic mode.

[0089] In step S303, data processing;

[0090] Perform data processing.

[0091] In step S304, the data type is determined;

[0092] Determine the data type based on the processed data.

[0093] In step S305, hardware circuit setting;

[0094] Perform hardware circuit settings, set the interface, line sequence, protocol, rate, address, etc.

[0095] In step S306, the chip is burned.

[0096] Burn the chip.

[0097] Figure 8 FIG. 1 shows a flow chart of the online manual mode of the chip programming method according to an embodiment of the present invention. Figure 8 As shown in the figure, the chip programming method in online manual mode includes the following steps:

[0098] In step S401, the burning software is run;

[0099] Run the burning software, which is used to complete burning manually.

[0100] In step S402, the online manual mode is selected;

[0101] The hardware circuit selects the manual online mode. The hardware circuit exchanges data with the burning software to realize the selection of the manual online mode of the hardware circuit.

[0102] In step S403, data processing;

[0103] Perform data processing.

[0104] In step S404, the data type is determined;

[0105] Determine the data type based on the processed data.

[0106] In step S405, hardware circuit setting;

[0107] Perform hardware circuit settings, set the interface, line sequence, protocol, rate, address, etc.

[0108] In step S406, the chip is burned.

[0109] Burn the chip.

[0110] In offline mode, the specific implementation method is as follows:

[0111] Step 1: After the hardware circuit is powered on, select offline automatic or offline manual mode according to the hardware configuration.

[0112] Step 2: Receive the production data stream through the USB interface and store it in the designated area.

[0113] Step 3: Detect the programming signal. After detecting the programming start signal, programming starts and sends a programming signal to the outside. After programming is completed, a programming end signal is sent.

[0114] Step 4: After the burning is completed, wait for the next burning signal.

[0115] Figure 9 FIG. 1 shows a flow chart of an offline automatic mode of a chip programming method according to an embodiment of the present invention. Figure 9 As shown in the figure, the chip programming method in offline automatic mode includes the following steps:

[0116] In step S501, the burning software is run;

[0117] Run the burning software, wherein the burning software is used to automatically complete the sending of production data streams.

[0118] In step S502, the offline automatic mode is selected;

[0119] The hardware circuit selects the offline automatic mode. The hardware circuit exchanges data with the burning software to realize the selection of the hardware circuit offline automatic mode.

[0120] In step S503, data processing;

[0121] Perform data processing.

[0122] In step S504, the production data stream is stored;

[0123] Store production data streams.

[0124] In step S505, determine whether to burn;

[0125] Determine whether to burn. If the judgment is yes, execute step S507 to start burning. If the judgment is no, execute step S506 to detect the burning signal. For example, determine whether to burn based on whether the burning start signal is received.

[0126] In step S508, burning is performed;

[0127] Perform programming. Set up the hardware circuit and program the chip.

[0128] In step S509, the burning is completed;

[0129] The burning is completed, and then the process returns to step S506 to detect the burning signal.

[0130] In step S510, a burning control signal is sent.

[0131] Send a burn signal. Send a burn start signal to determine whether to burn. Send a burn in progress signal to start burning. Send a burn end signal to complete the burning.

[0132] Figure 10 FIG. 1 shows a flow chart of an offline manual mode of a chip programming method according to an embodiment of the present invention. Figure 10 As shown in the figure, the chip programming method in offline manual mode includes the following steps:

[0133] In step S601, the burning software is run;

[0134] Run the burning software, wherein the burning software is used to automatically complete the sending of production data streams.

[0135] In step S602, the offline manual mode is selected;

[0136] The hardware circuit selects the offline manual mode. The hardware circuit interacts with the burning software to realize the selection of the offline manual mode of the hardware circuit.

[0137] In step S603, data processing;

[0138] Perform data processing.

[0139] In step S604, the production data stream is stored;

[0140] Store production data streams.

[0141] In step S605, determine whether to burn;

[0142] Determine whether to burn. If the judgment is yes, execute step S607 to start burning. If the judgment is no, execute step S606 to detect the burning signal. For example, determine whether to burn based on the received key signal.

[0143] In step S608, burning is performed;

[0144] Perform programming. Set up the hardware circuit and program the chip.

[0145] In step S609, the burning is completed;

[0146] The burning is completed, and then the process returns to step S606 to detect the burning signal.

[0147] In step S610, a key signal is sent.

[0148] Send a key signal. Send a key signal to determine whether to burn. For example, manually press a key to generate a key signal. There are multiple keys (for example, ten), and different keys can generate different key signals.

[0149] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0150] While embodiments of the present invention have been described above, these embodiments do not exhaustively describe all details and do not limit the invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification in order to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A chip burning device, characterized in that: include: The packaging system is used to package production files and generate production data packages; as well as A burning system connected to the packaging system to receive the production data packet, the burning system parses the production data packet, and configures a corresponding burning environment for the production file; A file configuration unit, configured to independently configure different production files, generate corresponding configuration information, and generate a configuration file based on the configuration information; A switching unit is connected to the file configuration unit to obtain the configuration information, and configures the interface and / or line sequence for the corresponding production file according to the configuration information, Wherein, the production data package also includes the configuration file; The configuration information includes at least one of the interface, line sequence, protocol, rate, and address required by the production file; The burning system includes: a parsing unit, which parses the production data packet to obtain a parsed production file and parsed configuration information; an associating unit connected to the parsing unit to obtain the parsed production file and the parsed configuration information, and associate the parsed production file with the corresponding parsed configuration information; and a burning configuration unit, configured to configure a burning environment for the corresponding parsed production file according to the parsed configuration information; The burning system parses the production data packet to obtain a parsed production file and parsed configuration information, and associates the parsed production file with the corresponding parsed configuration information to form a production data stream; The burning system also includes: A control unit, the control unit comprising a first interface and a line sequence switching interface; the first interface receives the production data stream; the line sequence switching interface is provided with a plurality of pins, the pins being configured as at least one of a communication interface, a power supply, and a ground line; At least one line sequence switching circuit is connected to the control unit and the chip to be programmed, respectively. Wherein, the line sequence switching circuit supports the configuration of the pins; The burning system sets the hardware environment of the burning environment according to the production data flow and performs burning.

2. The chip programming device according to claim 1, characterized in that: The burning system includes: The customization unit is connected to the file configuration unit to obtain the configuration information and generate a customized communication protocol for the corresponding production file according to the configuration information.

3. A chip programming method, applied to the chip programming device according to any one of claims 1 to 2, characterized in that: The following steps are involved: Independently configure different production files, generate corresponding configuration information, and generate configuration files based on the configuration information; Packaging the production file and the configuration file to generate a production data package; Sending the production data packet to the burning system; The burning system parses the production data packet and configures a corresponding burning environment for the production file; The configuration information includes at least one of the interface, line sequence, protocol, rate, and address required by the production file; The burning system parses the production data packet to obtain parsed configuration information, and configures at least one of a communication interface, a communication line sequence, a communication protocol, a communication rate, and a communication address of the burning environment according to the parsed configuration information.

4. The chip programming method according to claim 3, wherein: The chip programming method further includes: Parsing the production data packet to obtain a parsed production file and parsed configuration information; The parsed production file and the corresponding parsed configuration information are associated to generate a production data stream.

5. The chip programming method according to claim 3, wherein: The chip programming method further includes: Select the burning mode, The burning mode includes at least one of offline automatic, offline manual, online automatic, and online manual.

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