Sensor device

Abstract

The present invention provides a sensor device, comprising a packaging structure formed by a shell and a PCB board, wherein a MEMS chip is arranged inside the packaging structure, wherein two adjustable cavity partition structures are arranged inside the shell, and the two cavity partition structures divide the interior of the outer packaging structure into a front cavity and a rear cavity, wherein the MEMS chip is located on a PCB board in the rear cavity; a PCB cavity is arranged inside the PCB board, and a first PCB sound hole and a second PCB sound hole connected to the PCB cavity are arranged on the PCB board, wherein the first PCB sound hole is connected to the front cavity, and the second PCB sound hole is connected to the rear cavity and is arranged corresponding to the MEMS chip. The present invention can solve the problem that the front and rear cavities of the existing sensor device cannot be adjusted at will.

Description

Technical Field

[0001] The present invention relates to the field of electroacoustic technology, and more specifically, to a sensor device. Background Art

[0002] A sensor device is a device that converts acoustic signals into electrical signals and is made using micromachining technology. It has the characteristics of small size, good frequency response characteristics, and low noise. As electronic devices become smaller and thinner, sensor devices are increasingly widely used in these devices.

[0003] The acoustic performance of the sensor device can be adjusted by adjusting the size of the front and rear cavities. Currently, the size of the front and rear cavities of the sensor device cannot be changed at will after they are manufactured, and the acoustic performance cannot be adjusted.

[0004] In order to solve the above problems, the present invention urgently needs to provide a new sensor device. Summary of the invention

[0005] In view of the above problems, an object of the present invention is to provide a sensor device to solve the problem that the front and rear cavities of the existing sensor device cannot be adjusted at will.

[0006] A sensor device provided by the present invention comprises a packaging structure formed by a housing and a PCB board, wherein a MEMS chip is arranged inside the packaging structure, wherein:

[0007] Two adjustable cavity partition structures are arranged inside the shell, and the two cavity partition structures divide the interior of the external packaging structure into a front cavity and a rear cavity, wherein the MEMS chip is located on the PCB board of the rear cavity;

[0008] A PCB cavity is arranged inside the PCB board, and a first PCB sound hole and a second PCB sound hole communicating with the PCB cavity are arranged on the PCB board, wherein:

[0009] The first PCB sound hole is connected to the front cavity, and the second PCB sound hole is connected to the rear cavity and is arranged corresponding to the MEMS chip.

[0010] In addition, a preferred solution is that the two cavity partition structures include a front cavity partition structure and a rear cavity partition structure, wherein:

[0011] The front cavity partition structure includes a front cavity partition plate and a front cavity threaded rod for adjusting the movement of the front cavity partition plate, wherein:

[0012] One end of the front cavity partition is in contact with the top wall of the shell, and the other end of the front cavity partition is in contact with the PCB board. The front cavity partition moves back and forth along the top wall of the shell and the PCB board under the action of the front cavity threaded rod.

[0013] In addition, a preferred solution is that the front cavity threaded rod comprises a fixed end and a threaded rod body, wherein the fixed end is fixed to a side wall of a shell forming the front cavity, and the threaded rod body is connected to the front cavity partition;

[0014] A through hole is provided on the front cavity partition plate, and a thread matching the threaded rod body is provided inside the through hole;

[0015] The threaded rod body passes through the through hole, and the front cavity partition moves back and forth under the action of the threaded rod body.

[0016] In addition, a preferred solution is that the fixed end includes a top end, a baffle and a connecting portion arranged between the top end and the baffle, wherein the top end is arranged on the outer side of the side wall, the connecting portion passes through the side wall, and the baffle is arranged on the inner side of the side wall.

[0017] In addition, a preferred solution is that the rear cavity partition structure includes a rear cavity partition plate and a rear cavity threaded rod for adjusting the movement of the rear cavity partition plate, wherein the rear cavity partition plate is arranged in parallel with the front cavity partition plate;

[0018] One end of the rear cavity partition is in contact with the top wall of the shell, and the other end of the rear cavity partition is in contact with the PCB board. The rear cavity partition moves back and forth along the top wall of the shell and the PCB board under the action of the rear cavity threaded rod.

[0019] In addition, a preferred solution is that the rear cavity threaded rod comprises a fixed end and a threaded rod body, wherein the fixed end is fixed to the side wall of the shell forming the rear cavity, and the threaded rod body is connected to the rear cavity partition;

[0020] A through hole is provided on the rear cavity partition plate, and a thread matching the threaded rod body is provided inside the through hole;

[0021] The threaded rod body passes through the through hole, and the rear cavity partition moves back and forth under the action of the threaded rod body.

[0022] In addition, a preferred solution is that a shell sound hole is provided on the shell forming the front cavity, and the front cavity is connected to the outside through the shell sound hole.

[0023] In addition, a preferred solution is that an ASIC chip is also arranged inside the packaging structure, and the ASIC chip is located on the PCB board in the back cavity.

[0024] In addition, a preferred solution is that the MEMS chip and the ASIC chip are electrically connected via metal wires.

[0025] In addition, a preferred solution is that the housing is fixed to the PCB board by solder paste or glue.

[0026] From the above technical solution, it can be seen that the sensor device provided by the present invention divides the interior of the packaging structure into a front cavity and a rear cavity through two adjustable cavity partition structures. Since the cavity partition structure has an adjustment function, the space size of the front cavity and the rear cavity can be adjusted. By changing the size of the front and rear cavities of the sensor device, the high-frequency curve and the low-frequency curve of the device can be adjusted respectively, and its sensitivity and signal-to-noise ratio can be adjusted. In addition, since the airflow and foreign matter need to pass through the sound hole of the shell and then pass through the first PCB sound hole, the PCB cavity, and the second PCB sound hole before acting on the MEMS, the sound path is tortuous, so that the product has the ability to resist blowing and foreign matter.

[0027] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings:

[0029] Figure 1 is a cross-sectional view of a sensor device according to an embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of the structure of a threaded rod according to an embodiment of the present invention;

[0031] Figure 3 is a schematic diagram of a three-dimensional structure of a sensor device according to an embodiment of the present invention;

[0032] Figure 4 FIG. 4 is a top view of a sensor device according to an embodiment of the present invention.

[0033] The accompanying drawings include: 1. shell, 2. PCB board, 3. MEMS chip, 4. ASIC chip, 5. front cavity threaded rod, 6. front cavity partition, 7. rear cavity partition, 8. rear cavity threaded rod, 9. front cavity, 10. rear cavity, 11. shell sound hole, 21. first PCB sound hole, 22. PCB cavity, 23. second PCB sound hole, 51. threaded rod body, 52. baffle, 53. top end, 54. connecting part.

[0034] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0035] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0036] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0037] In view of the aforementioned problem that the sizes of the front cavity and the rear cavity of the existing sensor device cannot be changed at will after being manufactured, and the acoustic performance thereof cannot be adjusted, the present invention provides a new sensor device.

[0038] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0039] In order to illustrate the structure of the sensor device provided by the present invention, Figure 1-Figure 4 The sensor device is exemplarily indicated from different angles. Specifically, Figure 1 shows a cross-sectional structure of a sensor device according to an embodiment of the present invention; Figure 2 shows a threaded rod structure according to an embodiment of the present invention; Figure 3 The three-dimensional structure of the sensor device according to the embodiment of the present invention is shown; Figure 4 The structure of a sensor device according to an embodiment of the present invention is shown from above.

[0040] like Figures 1 to 4 As shown together, the sensor device provided by the present invention includes a packaging structure formed by a shell 1 and a PCB board 2, and a MEMS chip 3 is arranged inside the packaging structure, wherein two adjustable cavity partition structures are arranged inside the shell 1, and the two cavity partition structures divide the interior of the external packaging structure into a front cavity 9 and a rear cavity 10, wherein the MEMS chip 3 is located on the PCB board 2 of the rear cavity; a PCB cavity 22 is arranged inside the PCB board 2, and a first PCB sound hole 21 and a second PCB sound hole 23 connected to the PCB cavity 22 are arranged on the PCB board 2, wherein the first PCB sound hole 21 is connected to the front cavity 9, and the second PCB sound hole 23 is connected to the rear cavity 10 and is arranged corresponding to the MEMS chip 3.

[0041] In an embodiment of the present invention, two cavity partition structures are provided inside the packaging structure, and the two cavity partition structures divide the interior of the packaging structure into a front cavity and a rear cavity. Since the cavity partition structure has an adjustment function, the spatial sizes of the front cavity and the rear cavity can be adjusted. By changing the sizes of the front and rear cavities of the sensor device, the high-frequency curve and the low-frequency curve of the device can be adjusted respectively, and its sensitivity and signal-to-noise ratio can be adjusted, thereby improving the acoustic performance of the sensor device.

[0042] In an embodiment of the present invention, the two cavity partition structures include a front cavity partition structure and a rear cavity partition structure, wherein the front cavity partition structure and the interior of the packaging structure form a front cavity, and the rear cavity partition structure and the interior of the packaging structure form a rear cavity.

[0043] Among them, the front cavity partition structure includes a front cavity partition plate 6 and a front cavity threaded rod 5 for adjusting the movement of the front cavity partition plate 6, wherein one end of the front cavity partition plate 6 contacts the top wall of the outer shell 1, and the other end of the front cavity partition plate 6 contacts the PCB board 2, and the front cavity partition plate 6 moves back and forth along the top wall of the outer shell 1 and the PCB board 2 under the action of the front cavity threaded rod 5.

[0044] Among them, the front cavity threaded rod 5 includes a fixed end and a threaded rod body 51, wherein the fixed end is fixed to the side wall of the outer shell 1 forming the front cavity 9, and the threaded rod body 51 is connected to the front cavity partition 6; a through hole is provided on the front cavity partition 6, and a thread matching the threaded rod body 51 is provided inside the through hole; the threaded rod body 51 passes through the through hole, and the front cavity partition 6 moves back and forth under the action of the threaded rod body 51.

[0045] exist Figure 2In the illustrated embodiment, the fixed end includes a top end 53, a baffle 52, and a connecting portion 54 disposed between the top end 53 and the baffle 52, wherein the top end 53 is disposed on the outer side of the side wall, the connecting portion 54 passes through the side wall, and the baffle 52 is disposed on the inner side of the side wall.

[0046] Among them, an I-shaped or X-shaped groove is also provided at the top 53. An appropriate screwdriver is selected to adjust the front cavity threaded rod 5 through the I-shaped or X-shaped groove to drive the front cavity partition 6 to move back and forth, thereby changing the size of the front cavity 9.

[0047] In an embodiment of the present invention, the rear cavity partition structure includes a rear cavity partition plate 7 and a rear cavity threaded rod 8 for adjusting the movement of the rear cavity partition plate 7, wherein the rear cavity partition plate 7 is arranged parallel to the front cavity partition plate 6; one end of the rear cavity partition plate 7 contacts the top wall of the outer shell 1, and the other end of the rear cavity partition plate 7 contacts the PCB board 2, and the rear cavity partition plate 7 moves back and forth along the top wall of the outer shell 1 and the PCB board 2 under the action of the rear cavity threaded rod 8.

[0048] Among them, the structure of the rear cavity threaded rod 8 is exactly the same as that of the front cavity threaded rod 5, and the rear cavity threaded rod 8 includes a fixed end and a threaded rod body, wherein the fixed end is fixed to the side wall of the outer shell forming the rear cavity 10, and the threaded rod body is connected to the rear cavity partition 7; a through hole is provided on the rear cavity partition 7, and a thread matching the threaded rod body is provided inside the through hole; the threaded rod body passes through the through hole, and the rear cavity partition 7 moves back and forth under the action of the threaded rod body.

[0049] The fixed end of the rear cavity threaded rod 8 includes a top end, a baffle, and a connection portion disposed between the top end and the baffle, wherein the top end is disposed on the outer side of the side wall forming the rear cavity, the connection portion penetrates through the side wall forming the rear cavity, and the baffle is disposed on the inner side of the side wall forming the rear cavity. Similarly, a "I"-shaped or "X"-shaped groove is also disposed at the top end, and an appropriate screwdriver is selected to adjust the rear cavity threaded rod through the "I"-shaped or "X"-shaped groove to drive the rear cavity partition 7 to move back and forth, thereby changing the size of the rear cavity 10.

[0050] In the embodiment of the present invention, the front cavity partition structure is exactly the same as the rear cavity partition structure, but is arranged at different specific positions inside the packaging structure. The front cavity partition structure adjusts the size of the front cavity by adjusting the front cavity partition plate through the front cavity threaded rod, and the rear cavity partition structure adjusts the size of the rear cavity by adjusting the rear cavity partition plate through the rear cavity threaded rod. The size of the front and rear cavities is changed by the front cavity partition structure and the rear cavity partition structure, thereby improving the acoustic performance of the product.

[0051] In an embodiment of the present invention, a shell acoustic hole 11 is provided on the shell forming the front cavity 9, and the front cavity 9 is connected to the outside through the shell acoustic hole 11. A PCB cavity 22 is provided inside the PCB board 2, and two acoustic holes connected to the PCB cavity are provided on the PCB board 2, namely, a first PCB acoustic hole 21 and a second PCB acoustic hole 23. Since the first PCB acoustic hole 21 is connected to the front cavity 9, and the second PCB acoustic hole 23 is connected to the rear cavity 10 and is arranged corresponding to the MEMS chip, in this arrangement, airflow or foreign matter acts on the MEMS chip 3 after passing through the shell acoustic hole 11, the first PCB acoustic hole 21, the PCB cavity 22, and the second PCB acoustic hole 23. This transmission path is tortuous, so that foreign matter is not easy to enter the MEMS chip in the rear cavity, and the tortuous transmission path forms a buffer space, thereby preventing the airflow from directly impacting the MEMS chip, improving the anti-blow reliability of the product, and thus improving the acoustic performance of the product.

[0052] In addition, in the embodiment of the present invention, an ASIC chip 4 is also provided inside the packaging structure, and the ASIC chip 4 is located on the PCB board 2 of the back cavity 10. The MEMS chip 4 is electrically connected to the ASIC chip 4 through a metal wire. The housing 1 is fixed to the PCB board 2 through solder paste or glue. In addition, a pad is also provided at the bottom of the PCB board 2, and the PCB board is electrically connected to an external device through the pad.

[0053] It can be seen from the above embodiments that the sensor device provided by the present invention divides the interior of the packaging structure into a front cavity and a rear cavity through two adjustable cavity partition structures. Since the cavity partition structure has an adjustment function, the space size of the front cavity and the rear cavity can be adjusted. By changing the size of the front and rear cavities of the sensor device, the high-frequency curve and the low-frequency curve of the device can be adjusted respectively, as well as its sensitivity and signal-to-noise ratio can be adjusted. In addition, since the airflow and foreign matter need to pass through the sound hole of the shell and then pass through the first PCB sound hole, the PCB cavity, and the second PCB sound hole before acting on the MEMS, the sound path is tortuous, so that the product has the ability to resist blowing and foreign matter.

[0054] The sensor device proposed according to the present invention is described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various improvements can be made to the sensor device proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A sensor device, comprising a packaging structure formed by a housing and a PCB board, wherein a MEMS chip is arranged inside the packaging structure, characterized in that: Two adjustable cavity partition structures are arranged inside the shell, and the two cavity partition structures divide the interior of the packaging structure into a front cavity and a rear cavity, wherein the MEMS chip is located on the PCB board of the rear cavity; A PCB cavity is arranged inside the PCB board, and a first PCB sound hole and a second PCB sound hole communicating with the PCB cavity are arranged on the PCB board, wherein: The first PCB sound hole is connected to the front cavity, and the second PCB sound hole is connected to the rear cavity and is arranged corresponding to the MEMS chip; The two cavity partition structures include a front cavity partition structure and a rear cavity partition structure, wherein: The front cavity partition structure includes a front cavity partition plate and a front cavity threaded rod for adjusting the movement of the front cavity partition plate, wherein: One end of the front cavity partition is in contact with the top wall of the shell, and the other end of the front cavity partition is in contact with the PCB board. The front cavity partition moves back and forth along the top wall of the shell and the PCB board under the action of the front cavity threaded rod; The rear cavity partition structure comprises a rear cavity partition plate and a rear cavity threaded rod for adjusting the movement of the rear cavity partition plate, wherein the rear cavity partition plate is arranged in parallel with the front cavity partition plate; One end of the rear cavity partition is in contact with the top wall of the shell, and the other end of the rear cavity partition is in contact with the PCB board. The rear cavity partition moves back and forth along the top wall of the shell and the PCB board under the action of the rear cavity threaded rod.

2. The sensor device according to claim 1, characterized in that The front cavity threaded rod comprises a fixed end and a threaded rod body, wherein the fixed end is fixed to the side wall of the shell forming the front cavity, and the threaded rod body is connected to the front cavity partition; A through hole is provided on the front cavity partition plate, and a thread matching the threaded rod body is provided inside the through hole; The threaded rod body passes through the through hole, and the front cavity partition moves back and forth under the action of the threaded rod body.

3. The sensor device according to claim 2, characterized in that The fixed end includes a top end, a baffle and a connecting portion arranged between the top end and the baffle, wherein the top end is arranged on the outer side of the side wall, the connecting portion passes through the side wall, and the baffle is arranged on the inner side of the side wall.

4. The sensor device according to claim 1, wherein: The rear cavity threaded rod comprises a fixed end and a threaded rod body, wherein the fixed end is fixed to the side wall of the shell forming the rear cavity, and the threaded rod body is connected to the rear cavity partition; A through hole is provided on the rear cavity partition plate, and a thread matching the threaded rod body is provided inside the through hole; The threaded rod body passes through the through hole, and the rear cavity partition moves back and forth under the action of the threaded rod body.

5. The sensor device according to claim 1, wherein: A shell sound hole is arranged on the shell forming the front cavity, and the front cavity is communicated with the outside through the shell sound hole.

6. The sensor device according to claim 1, characterized in that An ASIC chip is also arranged inside the packaging structure, and the ASIC chip is located on the PCB board in the rear cavity.

7. The sensor device according to claim 6, characterized in that The MEMS chip is electrically connected to the ASIC chip via metal wires.

8. The sensor device according to claim 1, characterized in that The housing is fixed to the PCB board by solder paste or glue.

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