LED package production line and production method thereof

Abstract

The application discloses an LED packaging production line and a production method thereof, which comprises a conveying mechanism, a first reflow soldering mechanism, a guide mechanism at the front end, and a first track assembly and a second track assembly at the rear end, wherein the first track assembly is used for conveying COB substrates, the second track assembly is used for conveying DOB substrates, one end of the first reflow soldering mechanism is connected with the conveying mechanism, and the guide mechanism is used for guiding the DOB substrates / COB substrates to rotate by 90 degrees to be connected with the corresponding first track assembly / second track assembly. The solidification of the tin paste on the COB substrates and the DOB substrates can be completed by using only one first reflow soldering machine, and the COB substrates and the DOB substrates of different specifications are separated and sequentially enter subsequent processing procedures under the action of the guide mechanism, so that the equipment and manpower are saved.

Description

Technical Field

[0001] This invention relates to the field of LED processing, and in particular to an LED packaging production line and its production method. Background Technology

[0002] LED (Light Emitting Diode) packaging refers to the packaging of the light-emitting chip. It not only needs to protect the chip but also needs to allow light to pass through. The function of packaging is to provide sufficient protection for the chip, preventing it from failing due to long-term exposure to air or mechanical damage, thereby improving the chip's stability. Currently, the most common LED packaging methods are COB and DOB. Because the substrate specifications for COB and DOB packaging are different, factories generally set up two production lines to deal with COB packaging and DOB packaging respectively. Each production line is equipped with two reflow soldering machines to solidify the solder paste on the substrate separately, which wastes equipment and manpower. Summary of the Invention

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide an LED packaging production line and its production method that saves equipment and manpower.

[0004] The technical solution adopted in this invention is:

[0005] According to a first aspect of the present invention, an LED packaging production line includes: a conveying mechanism at a front end, a first track assembly and a second track assembly at a rear end, wherein the conveying mechanism is used to convey a COB substrate and a DOB substrate, the first track assembly is used to convey the DOB substrate, and the second track assembly is used to convey the COB substrate; a first reflow soldering mechanism for curing solder paste on the COB substrate and the DOB substrate, one end of the first reflow soldering mechanism being connected to the conveying mechanism; and a guiding mechanism for guiding the DOB substrate / COB substrate to rotate 90 degrees to engage with the corresponding first track assembly / second track assembly, one end of the guiding mechanism being connected to the other end of the first reflow soldering mechanism, and the other end of the guiding mechanism being connected to the first track assembly and the second track assembly respectively.

[0006] The LED packaging production line according to embodiments of the present invention has at least the following beneficial effects: Since the front end of the first reflow soldering mechanism is connected to the conveying mechanism, and the rear end of the first reflow soldering mechanism is connected to the first track assembly and the second track assembly respectively, the conveying mechanism can convey the COB substrate and DOB substrate together to the first reflow soldering mechanism. After the solder paste is cured, the COB substrate and DOB substrate are conveyed to the guiding mechanism. Under the guidance of the guiding mechanism, the DOB substrate / COB substrate rotates 90 degrees so that its long or short side can connect with the corresponding first track assembly / second track assembly. The first track assembly / second track assembly then conveys the DOB substrate / COB substrate to subsequent processes. Only one first reflow soldering mechanism is needed to complete the curing of solder paste on the COB substrate and DOB substrate. Furthermore, under the action of the guiding mechanism, COB substrates and DOB substrates of different specifications are separated and orderly enter subsequent processing steps, saving equipment and manpower.

[0007] According to some embodiments of the present invention, the guiding mechanism includes a frame, a guide rail disposed on the frame, and a displacement rail perpendicular to the guide rail. The two ends of the displacement rail are respectively connected to a first rail assembly and a second rail assembly. The guide rail is provided with a guiding structure and a conveying structure. The guiding structure guides the DOB / COB substrate to rotate 90 degrees. The conveying structure conveys the DOB / COB substrate along the guide rail to the displacement rail. The displacement rail is provided with a displacement device to move the DOB / COB substrate to the corresponding first rail assembly / second rail assembly. First, the guiding structure guides the DOB / COB substrate to rotate 90 degrees on the guide rail. Simultaneously, the conveying structure conveys the DOB / COB substrate to the displacement rail. Then, the displacement device moves the DOB / COB substrate to the corresponding first rail assembly / second rail assembly. The structure is simple and easy to implement.

[0008] According to some embodiments of the present invention, the guiding structure includes guide plates and two guide strips respectively disposed on the guide rail. The guide plates and the guide strips are arranged sequentially along the direction in which the DOB substrate / COB substrate moves on the guide rail. The guide plates extend into the interior of the guide rail to abut against the DOB substrate / COB substrate, and the DOB substrate / COB substrate can move through between the two guide strips. When the guide plates abut against the moving DOB substrate / COB substrate, the DOB substrate / COB substrate can automatically rotate 90 degrees, and then the DOB substrate / COB substrate moves between the two guide strips, which can prevent the DOB substrate / COB substrate from coming off the side of the guide rail.

[0009] According to some embodiments of the present invention, the spacing between the two guide strips gradually narrows along the direction in which the DOB substrate / COB substrate moves on the guide rail, so that the DOB substrate / COB substrate can gradually adjust its own angle to make it gradually parallel to the guide strip.

[0010] According to some embodiments of the present invention, the guide bar includes a bent section and a straight section connected to the bent section. The bent section bends away from the guide rail, and the bent section gives the DOB substrate / COB substrate a large range of motion on the guide rail, which facilitates the DOB substrate / COB substrate to gradually adjust its own angle, and finally becomes parallel to the guide bar in the straight section.

[0011] According to some embodiments of the present invention, the displacement device includes a driving component and push rods connected to the driving component. The push rods are respectively disposed on both sides of the displacement track. The conveying structure conveys the DOB substrate / COB substrate along the guide track to the displacement track to abut against the push rods. The driving component drives the push rods to move along the displacement track to move the DOB substrate / COB substrate to the entrance of the corresponding first track assembly / second track assembly. When the COB substrate abuts against the push rod, the push rod pushes the DOB substrate to the entrance of the first guide rail assembly. At this time, the push rod returns a short distance to abut against the COB substrate that has moved from the guide rail. The push rod can then push the COB substrate to the entrance of the second track assembly. This cycle repeats continuously. The structure is simple and easy to implement.

[0012] According to some embodiments of the present invention, a first COB detection mechanism and a first DOB detection mechanism are further included. The first COB detection mechanism is disposed along the second track assembly to detect the printing, bonding, and die bonding conditions on the COB substrate, and the first DOB detection mechanism is disposed along the first track assembly to detect the printing, bonding, and die bonding conditions on the DOB substrate.

[0013] According to some embodiments of the present invention, the device further includes a COB damming dispensing mechanism disposed along the second track assembly and a DOB damming dispensing mechanism disposed along the first track assembly. The COB damming dispensing mechanism is located to the right of the first COB detection mechanism, and the DOB damming dispensing mechanism is located to the right of the first DOB detection mechanism. The COB damming dispensing mechanism performs damming dispensing on the COB substrate that has completed the first detection, and the DOB damming dispensing mechanism performs damming dispensing on the DOB substrate that has completed the first detection.

[0014] According to some embodiments of the present invention, the invention further includes a COB reflow soldering mechanism disposed along the second track assembly and a DOB reflow soldering mechanism disposed along the first track assembly. The COB reflow soldering mechanism is located to the right of the COB damming dispensing mechanism to cure the damming adhesive and phosphor adhesive on the COB substrate. The DOB reflow soldering mechanism is located to the right of the DOB damming dispensing mechanism to cure the damming adhesive and phosphor adhesive on the DOB substrate. The COB substrate undergoes various processes in an orderly manner on its second track assembly, and the DOB substrate undergoes various processes in an orderly manner on its first track assembly, thereby improving production efficiency.

[0015] According to a second aspect of the present invention, a production method based on any of the above-described LED packaging production lines includes the following steps: the conveying mechanism conveys a COB substrate and a DOB substrate to a first reflow soldering mechanism; the first reflow soldering mechanism cures solder paste on the COB substrate and the DOB substrate and conveys the COB substrate and the DOB substrate to the guide rail; the guide structure guides the DOB substrate / COB substrate to rotate 90 degrees, and the conveying structure conveys the DOB substrate / COB substrate along the guide rail to the displacement rail; the displacement device moves the DOB substrate / COB substrate to a corresponding first rail assembly / second rail assembly.

[0016] The production method according to embodiments of the present invention has at least the following beneficial effects: Since the front end of the first reflow soldering mechanism is connected to the conveying mechanism, and the rear end of the first reflow soldering mechanism is connected to the first track assembly and the second track assembly respectively, the conveying mechanism can convey the COB substrate and the DOB substrate together to the first reflow soldering mechanism. After the solder paste is cured, the COB substrate and the DOB substrate are conveyed to the guiding mechanism. Under the guidance of the guiding mechanism, the DOB substrate / COB substrate rotates 90 degrees so that its long or short side can connect with the corresponding first track assembly / second track assembly. The first track assembly / second track assembly then conveys the DOB substrate / COB substrate to subsequent processes. Only one first reflow soldering mechanism is needed to complete the curing of solder paste on the COB substrate and the DOB substrate. Furthermore, under the action of the guiding mechanism, COB substrates and DOB substrates of different specifications are separated and orderly enter subsequent processing steps, saving equipment and manpower.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0019] Figure 1 This is an overall structural diagram of an embodiment of an LED packaging production line;

[0020] Figure 2 This is a structural diagram of the guiding mechanism in an embodiment of an LED packaging production line;

[0021] Figure 3 This is a structural diagram of the guide structure in an embodiment of an LED packaging production line;

[0022] Figure 4 It is a flowchart of the production process. Detailed Implementation

[0023] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0024] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0025] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0026] Reference Figure 1This invention discloses an LED packaging production line, comprising a conveying mechanism 100, a first reflow soldering mechanism 210, and a guiding mechanism 300 located at the front end, and a first track assembly 110 and a second track assembly 120 located at the rear end. The conveying mechanism 100 is used to convey COB substrates and DOB substrates, and the conveying mechanism 100 may be a conveyor belt; the first track assembly 110 is used to convey DOB substrates, and the second track assembly 120 is used to convey COB substrates. In some embodiments, both the first track assembly 110 and the second track assembly 120 consist of guide rails and motors and conveyor belts mounted on the guide rails. The system comprises: a first reflow soldering mechanism 210 for curing solder paste on COB and DOB substrates; the first reflow soldering mechanism can be an existing reflow soldering machine; one end of the first reflow soldering mechanism 210 is connected to the conveying mechanism 100; and a guiding mechanism 300 for guiding the DOB / COB substrate to rotate 90 degrees to engage with the corresponding first track assembly 110 / second track assembly 120; one end of the guiding mechanism 300 is connected to the other end of the first reflow soldering mechanism 210, and the other end of the guiding mechanism 300 is connected to the first track assembly 110 and the second track assembly 120 respectively. Since the front end of the first reflow soldering mechanism 210 is connected to the conveying mechanism 100, and the rear end of the first reflow soldering machine 210 is connected to the first track assembly 110 and the second track assembly 120 respectively, the conveying mechanism 100 can convey the COB substrate and the DOB substrate together to the first reflow soldering mechanism 210. After the solder paste is cured, the COB substrate and the DOB substrate are conveyed to the guiding mechanism 300. Under the guidance of the guiding mechanism 300, the DOB substrate / COB substrate is rotated 90 degrees so that its long side or short side can be connected with the corresponding first track assembly 110 / second track 120. The first track assembly 110 / second track assembly 120 conveys the DOB substrate / COB substrate to the subsequent process. Only one first reflow soldering machine 210 is needed to complete the curing of solder paste on the COB substrate and the DOB substrate. Under the action of the guiding mechanism 300, COB substrates and DOB substrates of different specifications are separated and orderly enter the subsequent processing process, saving equipment and manpower.

[0027] like Figure 2As shown, in some embodiments, the guiding mechanism 300 includes a frame 310, a guide rail 320 disposed on the frame 310, and a displacement rail 330 perpendicular to the guide rail 320. The two ends of the displacement rail 330 are respectively connected to a first rail assembly 110 and a second rail assembly 120. The guide rail 320 is provided with a guiding structure and a conveying structure. The guiding structure guides the DOB substrate / COB substrate to rotate 90 degrees, and the conveying structure conveys the DOB substrate / COB substrate along the guide rail 320 to the displacement rail 330. The displacement rail 330 is provided with a displacement device to move the DOB substrate... The COB substrate is moved onto the corresponding first track assembly 110 / second track assembly 120. The conveying structure can use a drive wheel, a driven wheel, and a conveyor belt. The conveyor belt moves under the drive of the drive wheel and the driven wheel to convey the DOB substrate / COB substrate. First, the guiding structure guides the DOB substrate / COB substrate to rotate 90 degrees on the guide track 320. At the same time, the conveying structure conveys the DOB substrate / COB substrate to the displacement track 330. Then, the displacement device moves the DOB substrate / COB substrate onto the corresponding first track assembly 110 / second track assembly 120. The structure is simple and easy to implement.

[0028] In some embodiments, there are two guide rails 320, one for guiding and conveying COB substrates and the other for guiding and conveying DOB substrates, thereby improving production efficiency.

[0029] like Figure 3 As shown, in some embodiments, the guiding structure includes guide pieces 321 and two guide bars 322 respectively disposed on the guide rail 320. The guide pieces 321 and guide bars 322 are arranged sequentially along the direction in which the DOB substrate / COB substrate moves on the guide rail 320. The guide pieces 321 extend into the interior of the guide rail 320 to abut against the DOB substrate / COB substrate. The DOB substrate / COB substrate can move through between the two guide bars 322. When the guide pieces 321 abut against the moving DOB substrate / COB substrate, the DOB substrate / COB substrate can automatically rotate 90 degrees. Then, the DOB substrate / COB substrate moves between the two guide bars 322, which can prevent the DOB substrate / COB substrate from coming off the side of the guide rail 320.

[0030] In some embodiments, the spacing between the two guide strips 322 gradually narrows along the direction in which the DOB substrate / COB substrate moves on the guide rail 320, so that the DOB substrate / COB substrate can gradually adjust its own angle to make it gradually parallel to the guide strips 322.

[0031] In some embodiments, the guide bar 322 includes a bent section and a straight section connected to the bent section. The bent section bends away from the guide rail 320, giving the DOB substrate / COB substrate a larger range of motion on the guide rail 320, which facilitates the DOB substrate / COB substrate to gradually adjust its own angle, and finally parallel to the guide bar 322 in the straight section.

[0032] In some embodiments, of the two guide bars 322, one guide bar 322 is straight, and the other guide bar 322 includes a bent section and a straight section. The guide plate is perpendicular to the guide rail 320. The straight guide bar is connected to the guide plate and is perpendicular to each other. The bent section of the other guide bar 322 is away from the guide rail, and its straight section is parallel to the straight guide bar 322. It is not necessary for both guide bars 322 to include bent sections, thus saving materials.

[0033] In some embodiments, the displacement device includes a drive assembly and push rods 321 connected to the drive assembly. The drive assembly typically employs a motor and a lead screw. The motor shaft is connected to the lead screw, and the lead screw is connected to the push rod. The motor's operation drives the lead screw to extend or retract, thereby causing the push rods 321 to reciprocate. The push rods 321 are respectively disposed on both sides of the displacement track 330. The conveying structure conveys the DOB / COB substrate along the guide track 320 onto the displacement track 330 to abut against the push rods 331. The drive assembly drives the push rods 321 to move along the displacement track 330. The DOB / COB substrate is moved to the entrance of the corresponding first track assembly 110 / second track assembly 120. When the COB substrate comes into contact with the push rod 321, the push rod 321 pushes the COB substrate to the entrance of the first guide rail assembly 110. At this time, the push rod 321 returns a short distance and comes into contact with the DOB substrate that has moved from the guide rail 320. The push rod 321 can then push the DOB substrate to the entrance of the second track assembly 120. This cycle repeats. The structure is simple and easy to implement.

[0034] In some embodiments, the LED production line includes a printer 411 for printing solder paste, a pick-and-place machine 412 for mounting components such as capacitors and resistors, and a die bonder 413 for bonding light-emitting diodes to a substrate. The printer 411 is connected to the pick-and-place machine 412, and the pick-and-place machine 412 is connected to multiple die bonders 413 via a material conveyor line. Multiple die bonders are respectively arranged on both sides of the conveying mechanism 100, one side being a COB die bonder and the other side being a DOB die bonder. The multiple die bonders transport the COB substrate and DOB substrate that have completed die bonding to the first reflow soldering mechanism 210 through the conveying mechanism 100.

[0035] In some embodiments, the LED production line further includes a first COB inspection mechanism 431 for inspecting the printing, chip mounting, and die bonding conditions on the COB substrate; a first DOB inspection mechanism 421 for inspecting the printing, chip mounting, and die bonding conditions on the DOB substrate; a COB damming dispensing mechanism 432; a DOB damming dispensing mechanism 422; a COB reflow soldering mechanism 433; and a DOB reflow soldering mechanism 423, wherein the first COB inspection mechanism 431, the COB damming dispensing mechanism 432, and the COB reflow soldering mechanism 423 are... The first DOB inspection mechanism 421, the DOB damming dispensing mechanism 422, and the DOB reflow soldering mechanism 423 are arranged sequentially from left to right along the second track assembly 110. They respectively complete the first inspection, damming dispensing, and second reflow soldering of the COB substrate and the DOB substrate, thereby improving production efficiency. The COB reflow soldering mechanism 433 is used to cure the phosphor adhesive on the COB substrate, and the DOB reflow soldering mechanism 423 is used to cure the phosphor adhesive on the DOB substrate.

[0036] In some embodiments, the LED production line further includes a second COB inspection mechanism 434 for inspecting the electrical characteristics on the COB substrate and a second DOB inspection mechanism 424 for inspecting the electrical characteristics on the DOB substrate. The second COB inspection mechanism 434 is connected to the COB reflow soldering mechanism 433, and the second DOB inspection mechanism 424 is connected to the DOB reflow soldering mechanism 423. The COB substrate undergoes various processes in an orderly manner on its second track assembly 120, and the DOB substrate undergoes various processes in an orderly manner on its first track assembly 110, thereby improving production efficiency.

[0037] The present invention also includes a production method based on any of the above-mentioned LED packaging production lines, comprising the following steps: Step S11, the conveying mechanism 100 conveys the COB substrate and the DOB substrate to the first reflow soldering mechanism 210; Step S12, the first reflow soldering mechanism 210 cures the solder paste on the COB substrate and the DOB substrate and conveys the COB substrate and the DOB substrate to the guide rail 320; Step S13, the guide structure guides the DOB substrate / COB substrate to rotate 90 degrees, and the conveying structure conveys the DOB substrate / COB substrate along the guide rail 320 to the displacement rail 330; Step S14, the displacement device moves the DOB substrate / COB substrate to the corresponding first rail assembly 110 / second rail assembly 120. Since the front end of the first reflow soldering mechanism 210 is connected to the conveying mechanism 100, and the rear end of the first reflow soldering mechanism 210 is connected to the first track assembly 110 and the second track assembly 120 respectively, the conveying mechanism 100 can convey the COB substrate and the DOB substrate together to the first reflow soldering mechanism 210. After the solder paste is cured, the COB substrate and the DOB substrate are conveyed to the guiding mechanism 300. Under the guidance of the guiding mechanism 300, the DOB substrate / COB substrate is rotated 90 degrees so that its long side or short side can be connected with the corresponding first track assembly 110 / second track assembly 120. The first track assembly 110 / second track assembly 120 conveys the DOB substrate / COB substrate to the subsequent process. Only one first reflow soldering mechanism 210 is needed to complete the curing of solder paste on the COB substrate and the DOB substrate. Under the action of the guiding mechanism 300, COB substrates and DOB substrates of different specifications are separated and orderly enter the subsequent processing process, saving equipment and manpower.

[0038] It will be readily understood by those skilled in the art that the above preferred methods can be freely combined and superimposed without conflict.

[0039] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct or indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An LED packaging production line, characterized in that, include: The conveying mechanism (100) is located at the front end, and the first track assembly (110) and the second track assembly (120) are located at the rear end. The conveying mechanism (100) is used to convey COB substrates and DOB substrates, the first track assembly (110) is used to convey DOB substrates, and the second track assembly (120) is used to convey COB substrates. A first reflow soldering mechanism (210) is used to solidify solder paste on COB substrates and DOB substrates. One end of the first reflow soldering mechanism (210) is connected to the conveying mechanism (100). A guiding mechanism (300) is used to guide the DOB substrate and COB substrate to rotate 90 degrees to engage with the corresponding first track assembly (110) or second track assembly (120). One end of the guiding mechanism (300) is connected to the other end of the first reflow soldering mechanism (210), and the other end of the guiding mechanism (300) is connected to the first track assembly (110) and the second track assembly (120) respectively. The guiding mechanism (300) includes a frame (310), a guide rail (320) disposed on the frame (310), and a displacement rail (330) perpendicular to the guide rail (320). The two ends of the displacement rail (330) are respectively connected to the first rail assembly (110) and the second rail assembly (120). The guide rail (320) is provided with a guide structure and a conveying structure. The guide structure guides the DOB substrate and COB substrate to rotate 90 degrees. The conveying structure conveys the DOB substrate and COB substrate along the guide rail (320) to the displacement rail (330). The displacement rail (330) is provided with a displacement device to move the DOB substrate and COB substrate to the corresponding first rail assembly (110) or second rail assembly (120). The guiding structure includes guide pieces (321) and two guide strips (322) respectively disposed on the guide rail (320). The guide pieces (321) and the guide strips (322) are arranged sequentially along the direction in which the DOB substrate and the COB substrate move on the guide rail (320). The guide pieces (321) extend into the interior of the guide rail (320) to abut against the DOB substrate and the COB substrate. The DOB substrate and the COB substrate can move through between the two guide strips (322). The displacement device includes a drive assembly and push rods (331) connected to the drive assembly. The push rods (331) are respectively disposed on both sides of the displacement track (330). The conveying structure conveys the DOB substrate and COB substrate along the guide track (320) to the displacement track (330) to abut against the push rods (331). The drive assembly drives the push rods (331) to move along the displacement track (330) to move the DOB substrate and COB substrate to the entrance of the corresponding first track assembly (110) or the entrance of the second track assembly (120).

2. The LED packaging production line according to claim 1, characterized in that: The spacing between the two guide bars (322) gradually narrows along the direction in which the DOB substrate and COB substrate move on the guide rail (320).

3. The LED packaging production line according to claim 2, characterized in that: The guide bar (322) includes a bent section and a straight section connected to the bent section, the bent section being bent away from the guide rail (320).

4. The LED packaging production line according to claim 1, characterized in that: It also includes a first COB detection mechanism (431) and a first DOB detection mechanism (421). The first COB detection mechanism (431) is disposed along the second track assembly (120) to detect the printing, bonding and die bonding status on the COB substrate. The first DOB detection mechanism (421) is disposed along the first track assembly (110) to detect the printing, bonding and die bonding status on the DOB substrate.

5. The LED packaging production line according to claim 4, characterized in that: It also includes a COB damming dispensing mechanism (432) disposed along the second track assembly (120) and a DOB damming dispensing mechanism (422) disposed along the first track assembly (110), wherein the COB damming dispensing mechanism (432) is located downstream of the substrate transport direction of the first COB detection mechanism (431) and the DOB damming dispensing mechanism (422) is located downstream of the substrate transport direction of the first DOB detection mechanism (421).

6. The LED packaging production line according to claim 5, characterized in that: It also includes a COB reflow soldering mechanism (433) disposed along the second track assembly (120) and a DOB reflow soldering mechanism disposed along the first track assembly (110). (423) The COB reflow soldering mechanism (433) is located downstream of the COB dam dispensing mechanism (432) in the substrate conveying direction to cure the dam adhesive and phosphor adhesive on the COB substrate. The DOB reflow soldering mechanism (423) is located downstream of the DOB dam dispensing mechanism (422) in the substrate conveying direction to cure the dam adhesive and phosphor adhesive on the DOB substrate.

7. A production method based on the LED packaging production line according to any one of claims 1 to 6, characterized in that, Includes the following steps: The conveying mechanism (100) conveys the COB substrate and the DOB substrate to the first reflow soldering mechanism (210); The first reflow soldering mechanism (210) cures the solder paste on the COB substrate and the DOB substrate and transfers the COB substrate and the DOB substrate onto the guide rail (320); The guiding structure guides the DOB substrate and COB substrate to rotate 90 degrees, and the conveying structure conveys the DOB substrate and COB substrate along the guiding track (320) to the displacement track (330). The displacement device moves the DOB substrate and COB substrate onto the corresponding first track assembly (110) or second track assembly (120).

Images