Stamping Die Replacement Method, System, Equipment and Readable Storage Medium

Abstract

The present application discloses a method, system, device and readable storage medium for replacing a stamping die. The method includes the steps of: receiving an abnormal fluctuation sound wave signal generated by a stamping die collected by an ultrasonic signal detection device arranged on the stamping equipment; determining the sound source position of the sound wave signal to obtain the abnormal point position in the production area where the stamping equipment is located; controlling a die replacement device arranged on the stamping equipment to replace the to-be-used die in the waiting area to the abnormal point position to maintain normal production in the production area; the waiting area is an area corresponding to the abnormal point position for storing the to-be-used die. The present application realizes the monitoring of the stamping die on the stamping equipment, and when it is monitored that the stamping die generates abnormal fluctuations, replaces the to-be-used die in the waiting area corresponding to the generation area to the stamping equipment, improving the efficiency of replacing the stamping die.

Description

Technical Field

[0001] This application relates to the field of stamping production, and particularly to a method, system, device, and readable storage medium for replacing a stamping die. Background Art

[0002] During the sheet metal stamping production process, different types of stamping dies are used to produce different parts. If a stamping die is damaged or other abnormalities occur in the stamping die, it is necessary to find a replacement die in the die library to replace the abnormal stamping die.

[0003] However, when looking for a replacement die, the production time is delayed, and there is also a problem that the replacement die cannot be used, resulting in a further delay in the time to resume normal production. Therefore, due to the low efficiency of replacing the die, the production efficiency is low. Summary of the Invention

[0004] In view of this, this application provides a method, system, device, and readable storage medium for replacing a stamping die, aiming to improve the efficiency of replacing the stamping die.

[0005] To achieve the above object, this application provides a method for replacing a stamping die, and the method for replacing a stamping die includes the following steps;

[0006] Receiving an abnormal fluctuation acoustic signal generated by a stamping die collected by an ultrasonic signal detection device disposed on the stamping equipment;

[0007] Determining the sound source position of the acoustic signal to obtain the abnormal point position in the production area where the stamping equipment is located;

[0008] Controlling a die replacement device disposed on the stamping equipment to replace a to-be-used die in a waiting area to the abnormal point position to maintain normal production in the production area; the waiting area is an area corresponding to the abnormal point position for storing the to-be-used die.

[0009] Exemplarily, the waiting area includes a first waiting area and a second waiting area, the to-be-used die includes a to-be-replaced die and a to-be-updated die, and the controlling a die replacement device disposed on the stamping equipment to replace a to-be-used die in a waiting area to the abnormal point position includes:

[0010] Based on a preset mapping relationship and the abnormal point position, determining the first waiting area and the second waiting area corresponding to the abnormal point position;

[0011] If there is a to-be-replaced die in the first waiting area, controlling a die replacement device disposed on the stamping equipment to retrieve and replace the to-be-replaced die to the abnormal point position, and the to-be-replaced die is used to maintain the current production content of the stamping equipment;

[0012] If the to-be-replaced mold does not exist in the first waiting area, control the mold replacement device to retrieve and replace the to-be-updated mold in the second waiting area to the abnormal point position, where the updated mold is used to update the production content of the stamping equipment.

[0013] Exemplarily, after controlling the mold replacement device to retrieve and replace the to-be-updated mold in the second waiting area to the abnormal point position, it includes:

[0014] Based on the preset production order schedule, determine the to-be-produced content of the next order in the order schedule;

[0015] Based on the to-be-produced content, determine the molds required for subsequent production;

[0016] Output a replenishment instruction to the transport vehicle, where the replenishment instruction is used to call the transport vehicle to transport and replenish the required molds to the waiting area.

[0017] Exemplarily, determining the source position of the acoustic wave signal to obtain the abnormal point position in the production area where the stamping equipment is located includes:

[0018] Based on the source position of the acoustic wave signal, determine the stamping equipment that generates abnormal fluctuations in the production area;

[0019] Output a stop instruction to the stamping equipment that generates abnormal fluctuations, where the stop instruction is used to stop the production process of the stamping equipment that generates abnormal fluctuations;

[0020] Mark the stamping equipment that stops production as the abnormal point position.

[0021] Exemplarily, before controlling the mold replacement device provided on the stamping equipment to replace the to-be-used mold in the waiting area to the abnormal point position, it includes:

[0022] After marking the stamping equipment that stops production as the abnormal point position, perform a shock wave detection on the stamping mold at the abnormal point position to obtain a detection result;

[0023] If the detection result does not meet the preset standard, mark the stamping mold as the to-be-replaced mold.

[0024] Exemplarily, performing a shock wave detection on the stamping mold at the abnormal point position to obtain a detection result includes:

[0025] Output an action instruction to the metal impact hammer, where the action instruction is used to call the metal impact hammer to impact the stamping mold at the abnormal point position;

[0026] Receive the impact echo data generated by the stamping mold;

[0027] Detect the change of the acoustic wave peak value of the impact echo data to obtain a detection result;

[0028] If the detection result does not meet the preset standard, marking the stamping die as a die to be replaced includes:

[0029] If the change of the acoustic wave peak value in the detection result is different from the preset acoustic wave change, it is determined that the detection result does not meet the preset standard, and the stamping die is marked as a die to be replaced.

[0030] Exemplarily, after the mold replacement device disposed on the stamping equipment replaces the mold to be used in the waiting area to the abnormal point position, it includes:

[0031] Output a transportation instruction to the transport vehicle, and the transportation instruction is used to call the transport vehicle to transport the replaced stamping die to the mold library;

[0032] After the transport vehicle completes the transportation action, output a marking instruction to the management system of the mold library, and the marking instruction is used to mark the replaced die as a die to be repaired.

[0033] Exemplarily, to achieve the above object, the present application further provides a stamping die replacement system, the stamping die replacement system includes the stamping equipment and the transport vehicle, and the stamping equipment includes an ultrasonic signal detection device and a mold replacement device:

[0034] The ultrasonic signal detection device is used for: receiving the acoustic wave signal generated by the stamping die on the stamping equipment and analyzing the acoustic wave signal to determine whether the ultrasonic signal is an acoustic wave signal generated for normal production;

[0035] The mold replacement device is used for: retrieving the mold to be used in the waiting area corresponding to the stamping equipment and replacing the mold to be used to the stamping equipment;

[0036] The transport vehicle is used for: transporting the replaced die and the die to be used.

[0037] Exemplarily, to achieve the above object, the present application further provides a stamping die replacement device, the device includes: a memory, a processor, and a stamping die replacement program stored on the memory and executable on the processor, and the stamping die replacement program is configured to implement the steps of the stamping die replacement method as described above.

[0038] Exemplarily, to achieve the above object, the present application further provides a computer-readable storage medium, on which a stamping die replacement program is stored, and when the stamping die replacement program is executed by a processor, the steps of the stamping die replacement method as described above are implemented.

[0039] In the prior art, when a stamping die is damaged or has other abnormalities, it is necessary to go to the die library to find a replacement die to replace the abnormal stamping die. However, there is also a problem that the found replacement die may not be usable. As a result, due to the low efficiency of replacing the die, the production efficiency is low. In contrast, in the present application, by detecting the sound wave signal generated during the stamping production process, it is determined whether there is an abnormality in the stamping production. When an abnormal fluctuation sound wave signal is received, the position of the abnormal point in the current production area is determined, and it is determined that the die at the abnormal point needs to be replaced. At this time, the die to be used in the waiting area corresponding to the position of the abnormal point is directly called, and the die to be used is replaced to the position of the abnormal point, saving the time to go to the die library to find a die that can be used to resume production. After an abnormality occurs in the production area, the die at the position where the abnormality occurs is directly replaced. Thus, by improving the efficiency of replacing the die, the waiting time for resuming production is reduced, and the production efficiency is further improved. That is, when an abnormal fluctuation sound wave signal is detected, that is, when there is an abnormality in the production area, the die to be used in the waiting area is directly replaced to the abnormal point position in the production area, so as to improve the efficiency of replacing the die, thereby reducing the waiting time for resuming production and further improving the production efficiency. Brief Description of the Drawings

[0040] Figure 1 is a schematic flowchart of the first embodiment of the stamping die replacement method of the present application;

[0041] Figure 2 is a schematic flowchart of the second embodiment of the stamping die replacement method of the present application;

[0042] Figure 3 is a schematic structural diagram of the hardware operating environment involved in the solution of the embodiment of the present application.

[0043] The realization, functional features and advantages of the purpose of the present application will be further described with reference to the embodiments and the accompanying drawings. Detailed Embodiments

[0044] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0045] The present application provides a stamping die replacement method. Referring to Figure 1 , Figure 1 is a schematic flowchart of the first embodiment of the stamping die replacement method of the present application.

[0046] The embodiments of the present application provide embodiments of the stamping die replacement method. It should be noted that although the logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than here. For the convenience of description, the execution subject is omitted hereinafter to describe each step of the stamping die replacement method. The stamping die replacement method includes:

[0047] Step S110: Receive the abnormal fluctuating sound wave signal generated by the stamping die collected by the ultrasonic signal detection device provided on the stamping equipment;

[0048] The stamping production equipment will use the punching force generated by itself to press the workpiece to be processed against the die, causing the workpiece to undergo corresponding deformation, so as to achieve the effect of stamping production. However, during the stamping production process, the stamping die may cause problems such as die damage and abnormalities due to the number of uses or equipment failures.

[0049] During the stamping production process, it is necessary to monitor the stamping die to avoid the phenomenon of continuously using the die when the die is damaged or abnormal.

[0050] Exemplarily, during the normal stamping production process, corresponding stamping sound waves and workpiece deformation sound waves and other sound wave signals generated during normal processing will be generated. However, when the die is damaged by stamping or abnormal, a huge abnormal fluctuating sound wave signal will be generated.

[0051] Therefore, the stamping die is monitored by a sound wave detection device, such as using devices such as an ultrasonic signal detection device. The ultrasonic signal detection device outputs an ultrasonic signal into the die, collects the reflected sound wave signal generated by the die, or directly monitors and collects the sound wave signal generated by the die when the stamping equipment is in production, so as to monitor whether there are abnormal problems during stamping production.

[0052] Step S120: Determine the sound source position of the sound wave signal to obtain the abnormal point position in the production area where the stamping equipment is located;

[0053] There are usually multiple stamping equipments in the production area of stamping production. A sound wave signal detection device for monitoring the sound wave signal of the die is provided on the die of each stamping equipment. When an abnormal fluctuating sound wave signal is received, it is judged from which sound wave signal detection device of which stamping equipment in the production area the sound wave signal is emitted.

[0054] The normal production sound wave signals generated during normal stamping production will cause relevant staff to ignore the abnormal fluctuating sound wave signals, and it is impossible to accurately locate the problem position in the production area by relying solely on manpower.

[0055] Exemplarily, the production area where the stamping equipment is located includes multiple stamping equipments. The sound wave signal detection devices on the stamping equipments will output the collected signals to the system. According to the production plan, one or more stamping equipments that are currently started and used for production.

[0056] Among them, when only one stamping device is used, there is no need to judge the source position of the acoustic wave signal. After detecting the abnormal fluctuation of the acoustic wave signal, the current stamping device is determined as the abnormal point position.

[0057] Among them, when multiple stamping devices are used, the system needs to identify the source position of the acoustic wave signal to determine which stamping device's acoustic wave signal detection device the acoustic wave signal is specifically collected from, so as to determine the specific position of the stamping device with abnormalities, that is, the abnormal point position.

[0058] Exemplarily, determining the sound source position of the acoustic wave signal to obtain the abnormal point position in the production area includes:

[0059] Step a: Based on the sound source position of the acoustic wave signal, determine the stamping device that generates abnormal fluctuations in the production area;

[0060] When receiving the abnormal fluctuation acoustic wave signal generated by the stamping die collected by the ultrasonic signal detection device set on the stamping device, it is necessary to analyze the source position of the acoustic wave, so as to perform subsequent processing on the stamping device with abnormal conditions.

[0061] Exemplarily, the abnormal fluctuations generated by the stamping device include problems such as die cracking, die corner chipping, and stamping workpiece fragmentation during the stamping production process. That is, the situations of abnormal fluctuations in stamping include two aspects. One is that the die has corresponding abnormal problems, resulting in the inability to continue normal production. The other is that the workpiece or the residue of the workpiece falls into the die, resulting in abnormal noises during the production process. For example, the workpiece breaks, and the residue deforms, causing the residue to fly and impact the die.

[0062] Step b: Output a stop instruction to the stamping device that generates abnormal fluctuations, and the stop instruction is used to stop the production process of the stamping device that generates abnormal fluctuations;

[0063] When receiving the abnormal fluctuation acoustic wave signal generated by the stamping die collected by the ultrasonic signal detection device set on the stamping device, according to the sound source position of the acoustic wave signal, determine the stamping device in the production area that generates the acoustic wave signal. At this time, it is necessary to stop the working state of the stamping device, that is, stop production, to avoid the phenomenon of mold damage and still maintaining production and obtaining defective products.

[0064] The stop instruction is a control instruction, which is output by the system to the stamping device that generates abnormal fluctuations. When the stamping device receives the stop instruction, it will stop the current processing process.

[0065] Exemplarily, when receiving the abnormal fluctuating acoustic signal generated by the stamping die collected by the ultrasonic signal detection device arranged on the stamping equipment, the stamping equipment using this stamping die is stopped. The purposes include two aspects. One is that the abnormal fluctuation may be generated when the die is damaged. Stopping the stamping equipment from continuing to operate can avoid producing defective products due to continued processing with a damaged die. The other is that the abnormal fluctuation may be abnormal noise generated by the workpiece or workpiece residue. At this time, stopping the stamping equipment can avoid the adverse impact of the workpiece or workpiece residue on the die in subsequent production.

[0066] That is, when receiving the acoustic signal with abnormal fluctuation generated by the stamping die, directly stop the operation of the stamping equipment. One is to avoid damage to the die, and the other is to avoid producing defective products.

[0067] Step c: Mark the stamping equipment that stops production as the abnormal point position.

[0068] At this time, the stamping equipment where the stamping die generates abnormal fluctuations stops operating, that is, the current state of this stamping equipment is a shutdown state. To ensure production efficiency, this stamping equipment needs to be adjusted, that is, it is necessary to detect the stamping die of this stamping equipment to determine whether the stamping die exists, and to clean the produced workpieces and workpiece residues to avoid problems such as damage to the stamping die caused by them.

[0069] Exemplarily, before the mold replacement device arranged on the stamping equipment replaces the to-be-used mold in the waiting area to the abnormal point position, it includes:

[0070] Step d: After marking the stamping equipment that stops production as the abnormal point position, perform shock wave detection on the stamping die at the abnormal point position to obtain the detection result;

[0071] An abnormal fluctuating acoustic signal is received, but it is impossible to determine which type of abnormal problem this acoustic signal represents. At this time, it is necessary to discriminate the type of abnormal fluctuation at the abnormal point position.

[0072] That is, after marking the abnormal point position, it is necessary to determine the type of abnormal fluctuation at the abnormal point position. By performing shock wave detection on the stamping die at the abnormal point position, it can be determined whether there is a problem with this stamping die, and then the type of abnormal fluctuation can be determined.

[0073] The detection result is the quality detection of the stamping die. A stamping wave is output to the stamping die, and the stamping die will generate a shock echo according to its own state. The detection result is to detect the shock echo generated by the stamping die.

[0074] Exemplarily, there are two types of abnormal fluctuations generated at the stamping die. One is the problem of the die itself being damaged, and the other is that the workpiece or workpiece residue causes abnormal noise in the stamping die. Different coping results will be produced for different types of abnormal problems.

[0075] Among them, when the abnormal fluctuation generated by the stamping die is the die itself being damaged, then the stamping die needs to be replaced to ensure that the stamping equipment can continue to produce normally.

[0076] Among them, when the abnormal fluctuation generated by the stamping die is that the workpiece or workpiece residue causes abnormal noise in the stamping die, and it is determined at this time that the stamping die has no quality problems such as cracking and corner chipping, that is, the stamping equipment can continue to produce using the current stamping die, but the influencing factors on the stamping die are uncertain at this time. It may be that the workpiece or workpiece residue causes the stamping die to make noise, or it may be a problem with the stamping equipment itself. Then the system will output a prompt message to the relevant staff to prompt the relevant staff to check the stamping equipment to check whether the stamping equipment is normal and whether there are workpiece residues and other problems.

[0077] Step e: If the detection result does not meet the preset standard, then mark the stamping die as a die to be replaced.

[0078] The detection process of the stamping die is shock wave detection, and the detection result is the shock echo data of the stamping die. It is judged whether the detection result meets the standard, that is, it is judged whether the shock echo data of the detection result is close to the standard value.

[0079] The preset standard is the standard of the shock echo data when the stamping die is qualified in quality and does not have problems such as cracking, corner chipping, and holes.

[0080] Exemplarily, there are two results in the judgment process. The detection result meets the preset standard, and the detection result does not meet the preset standard. Different actions are performed according to different judgment results.

[0081] Among them, when the detection result meets the preset standard, it proves that the quality of the detected stamping die is not problematic, that is, the stamping die can continue to be used.

[0082] Among them, when the detection result does not meet the preset standard, it proves that the quality of the detected stamping die is problematic. At this time, mark the detected stamping die as a die to be replaced.

[0083] The die to be replaced is the stamping die with quality problems currently used by the stamping equipment. The stamping equipment can resume production only after replacing the stamping die with quality problems.

[0084] Exemplarily, the shock wave detection of the stamping die at the abnormal point position to obtain the detection result includes:

[0085] Step f: Output an action instruction to the metal impact hammer, where the action instruction is used to call the metal impact hammer to impact the stamping die at the abnormal point position;

[0086] When performing impact detection on the stamping die, it is necessary to call the metal impact hammer through the system, use the metal impact hammer to impact the stamping die, so that impact echoes are generated inside the stamping die, and then perform shock wave detection on the stamping die.

[0087] Exemplarily, when the metal impact hammer impacts the stamping die, corresponding shock waves will be generated. Its metal material includes but is not limited to common materials such as iron and copper. At the same time, the metal impact hammer can also be replaced by other devices that cause shock waves to the stamping die.

[0088] Step g: Receive the impact echo data generated by the stamping die;

[0089] When impacting the stamping die, since the stamping die is also made of metal, impact echoes will be generated inside the stamping die. Therefore, when performing shock wave detection on the stamping die, impact echoes can be received from the stamping die.

[0090] Exemplarily, there are various possibilities for the impact echo data. For example, there may be cracks in the stamping die or a hollow structure in the middle of the stamping die. When the shock wave reaches such a structure, the shock wave will generate an impact echo. That is, by the length of time for the impact echo to return, it is determined whether there are problems such as a hollow structure or cracks in the current die structure. Another example is that the solid part of the stamping die will direct the shock wave, and the shock wave will continuously generate shock waves at the solid structure of the stamping die. When the structure changes, impact echoes are generated.

[0091] Step h: Detect the change in the acoustic wave peak value of the impact echo data to obtain a detection result.

[0092] The impact echo data contains the change situation of the impact echo. When the shock wave hits the position where the structure of the stamping die changes, corresponding impact echoes will be generated. That is, detecting the impact echo data mainly detects the peak value of the acoustic wave peak value of the impact echo data, the change time of the acoustic wave peak value, etc.

[0093] Exemplarily, if the detection result does not meet the preset standard, then mark the stamping die as a die to be replaced, including:

[0094] Step i: If the change in the acoustic wave peak value in the detection result is different from the preset acoustic wave change, then determine that the detection result does not meet the preset standard, and mark the stamping die as a die to be replaced.

[0095] When determining whether the detection result meets the preset standard, it is to determine whether there are differences between the peak change of the sound wave in the detection result and the preset sound wave change.

[0096] The preset sound wave change is the peak change of the shock wave data in the preset standard.

[0097] When the stamping die is not damaged, a shock wave detection is performed on the stamping die, and the obtained detection result is the preset standard. The peak change of the sound wave of the impact echo in this preset standard is the preset sound wave change. When there are damage problems with the stamping die, such as die cracking, it will cause changes in the impact echo data of the stamping die. Among them, according to the different cracking positions of the stamping die, the peak change of the sound wave of the impact echo will change accordingly, that is, the appearance time of the highest peak value of the sound wave of the impact echo changes.

[0098] Exemplarily, when there is a crack at the middle position on the stamping die, when the shock wave reaches this crack position, the shock wave immediately generates an impact echo, that is, the time of the impact echo detected when the die is cracked is shorter than the time of the impact echo detected when the die is intact.

[0099] That is, compare the similarity between the peak change of the sound wave in the detection result and the preset sound wave change. If the two sound wave changes are similar, there is no damage problem with the stamping die. If the two sound wave changes are different, there is a damage problem with the stamping die.

[0100] When it is determined that there is a damage problem with the stamping die, mark this stamping die as a die to be replaced. The die to be replaced is the stamping die that needs to be replaced to ensure the normal production operation of the stamping equipment.

[0101] Step S130: Control the die replacement device provided on the stamping equipment to replace the die to be used in the waiting area to the abnormal point position to maintain the normal production in the production area; the waiting area is the area corresponding to the abnormal point position for storing the die to be used.

[0102] Output a control instruction to control the die replacement device on the stamping equipment to remove the die at the abnormal point position and install the die in the waiting area at the abnormal point position, thereby achieving the effect of replacing the die.

[0103] The die replacement device can mobilize the die to be automatically put on the shelf and locked and fixed.

[0104] The waiting area corresponds to the production area, and the dies to be used stored in the waiting area have a mapping relationship with each stamping equipment in the production area, that is, a waiting area is demarcated at each stamping equipment for storing the dies to be used.

[0105] Among them, the mold to be used is the mold waiting to be used, which is used to replace the damaged mold on the stamping equipment or change the production content.

[0106] Exemplarily, after the mold replacement device disposed on the stamping equipment replaces the mold to be used in the waiting area to the abnormal point position, it includes:

[0107] Step j: Output a transportation instruction to the transport vehicle, and the transportation instruction is used to call the transport vehicle to transport the replaced stamping mold to the mold library;

[0108] The replaced stamping mold is the stamping mold with damage problems, and it is necessary to call a transport vehicle to transport it to the mold library. Among them, the transport vehicle usually adopts an Automated Guided Vehicle, abbreviated as AGV, and is usually also called an AGV cart. It refers to a transport vehicle equipped with automatic navigation devices such as electromagnetic or optical devices, which can travel along the specified navigation path, has safety protection and various transfer functions. In industrial applications, it is a transport vehicle without a driver, and its power source is a rechargeable battery. Generally, its travel path and behavior can be controlled by a computer, or its travel path can be set by using an electromagnetic track. The electromagnetic track is pasted on the floor, and the unmanned transport vehicle moves and acts relying on the information brought by the electromagnetic track.

[0109] At the same time, an identification device for identifying the stamping mold is provided on the AGV cart. Usually, a identification information card or identification two-dimensional code, etc. for recording the specific usage information of the stamping mold is set on the stamping mold. The identification device on the AGV cart can identify the identification information card or identification two-dimensional code, etc. on the stamping mold, and transport the stamping mold to the designated mold library according to the identified information.

[0110] Step k: After the transport vehicle completes the transportation action, output a marking instruction to the management system of the mold library, and the marking instruction is used to mark the replaced mold as a mold to be repaired.

[0111] When the transport vehicle transports the stamping mold into the mold library, output a marking instruction to the management system, and the marking instruction will mark the replaced mold as a mold to be repaired.

[0112] At the same time, the management system of the mold library will identify the mold to be repaired, and issue a change instruction for the mold to be repaired, make an appointment for the repair project according to the specific situation of the mold to be repaired, and output the appointment content to the relevant staff to prompt the relevant staff to repair the mold to be repaired in time.

[0113] In the prior art, when a stamping die is damaged or has other abnormalities, it is necessary to go to the die library to find a replacement die to replace the abnormal stamping die, and there is also a problem that the found replacement die cannot be used. As a result, due to the low efficiency of replacing the die, the production efficiency is low. In contrast, in the present application, by detecting the sound wave signal generated during the stamping production process, it is determined whether there is an abnormality in the stamping production. When an abnormal fluctuation sound wave signal is received, the position of the abnormal point in the current production area is determined, and it is determined that the die at the abnormal point needs to be replaced. At this time, the die to be used in the waiting area corresponding to the abnormal point position is directly called, and the die to be used is replaced to the abnormal point position, saving the time to go to the die library to find a die that can be used to resume production. After an abnormality occurs in the production area, the die at the position where the abnormality occurs is directly replaced, thereby reducing the waiting time for resuming production by improving the efficiency of replacing the die, and further improving the production efficiency. That is, when an abnormal fluctuation sound wave signal is detected, that is, when there is an abnormality in the production area, the die to be used in the waiting area is directly replaced to the abnormal point position in the production area, so as to improve the efficiency of replacing the die, thereby reducing the waiting time for resuming production, and further improving the production efficiency.

[0114] Exemplarily, referring to Figure 2 , Figure 2 FIG. is a schematic flow chart of the second embodiment of the stamping die replacement method of the present application. Based on the first embodiment of the stamping die replacement method of the present application, the second embodiment is proposed. The method further includes:

[0115] Step S210: Based on the preset mapping relationship and the abnormal point position, determine the first waiting area and the second waiting area corresponding to the abnormal point position;

[0116] The abnormal point position is the stamping equipment in the production area where an abnormal problem occurs. Each stamping equipment corresponds to a waiting area. Among them, each waiting area corresponding to the stamping equipment is divided into two waiting areas, namely the first waiting area and the second waiting area. Among them, different types of stamping dies are stored in the first waiting area and the second waiting area.

[0117] The preset mapping relationship is the relationship between the initially divided waiting area and the production area. The working areas of multiple stamping equipments are divided in the production area, and the corresponding working areas in the waiting area are divided into the combined areas of each first waiting area plus the second waiting area. The first waiting area and the second waiting area in each combined area correspond to the production area.

[0118] Step S220: If there is a die to be replaced in the first waiting area, control the die replacement device arranged on the stamping equipment to retrieve and replace the die to be replaced to the abnormal point position. The die to be replaced is used to maintain the current production content of the stamping equipment;

[0119] The process of the control device and the die replacement device on the stamping equipment replacing the stamping die on the stamping equipment is the same as that in the first embodiment, and will not be elaborated here.

[0120] When retrieving the die to be used, it is necessary to determine the type of the die to be used in the waiting area. Among them, the stamping die identical to the one currently used by the stamping equipment is stored in the first waiting area, that is, the die to be replaced. Among them, the stamping die different from the one currently used by the stamping equipment exists in the second waiting area, that is, the die to be updated.

[0121] Exemplarily, the die to be used is stored in the waiting area, where the die to be replaced is stored in the first waiting area and the die to be updated is stored in the second waiting area. However, there may be a situation where there is no replacement die for the stamping die currently used by the stamping equipment, that is, there is no stamping die in the first waiting area.

[0122] When retrieving the die to be used, the slide rail provided between the production area and the waiting area is used to transport the die to be used to the stamping equipment, and the replaced stamping die is transported to the waiting area through the slide rail. The replaced stamping die is placed in the waiting area and waits for the transport vehicle to transport it to the die library.

[0123] Therefore, before retrieving the die to be used in the waiting area, it is necessary to judge the type of the die in the waiting area, that is, to judge whether there is a die to be replaced in the first waiting area. When there are stamping dies in both the first waiting area and the second waiting area, the die to be replaced in the first waiting area is preferably used to maintain the production order schedule of the current stamping equipment being produced.

[0124] Step S230: If there is no die to be replaced in the first waiting area, control the die replacement device to retrieve and replace the die to be updated in the second waiting area to the abnormal point position, and the updated die is used to update the production content of the stamping equipment.

[0125] When it is judged that there is no die to be replaced in the first waiting area, directly retrieve the die to be updated in the second waiting area and replace it on the stamping equipment to update the production content of the stamping equipment.

[0126] The processes of retrieval and replacement are the same as the above content and will not be elaborated here.

[0127] Exemplarily, after controlling the die replacement device to retrieve and replace the die to be updated in the second waiting area to the abnormal point position, it includes:

[0128] Step l: Based on the preset production order schedule, determine the content to be produced for the next order in the order schedule;

[0129] When the mold to be updated in the second waiting area is in use, the content produced by the stamping equipment changes accordingly, that is, the current production content of the stamping equipment is updated. At this time, it is necessary to judge the current production order scheduling content and determine whether the previous production order scheduling has been completed.

[0130] If the production content of the previous work order scheduling is not completed, the previous work order scheduling will be automatically switched to the last. After the mold repair of the previous work order scheduling is completed, the production of the content of the previous work order scheduling will continue.

[0131] If the content of the previous work order scheduling has been completed, it is necessary to judge the content to be produced in the next work order scheduling according to the preset production order scheduling.

[0132] Step m: Based on the content to be produced, determine the molds required for subsequent production;

[0133] The content to be produced mainly includes the raw materials required for production and the stamping molds required by the stamping equipment. The information of the required raw materials is output to relevant staff to prompt the relevant staff to replace the raw materials in the production area, and the information of the required stamping molds is output to the transport vehicle.

[0134] Step n: Output a replenishment instruction to the transport vehicle, and the replenishment instruction is used to call the transport vehicle to transport and replenish the required molds to the waiting area.

[0135] Outputting a replenishment instruction to the transport vehicle means calling the transport vehicle to transport the molds required for subsequent production from the mold library to the waiting area to replenish the molds to be used in the waiting area.

[0136] Among them, when replenishing the molds to be used, the same molds as those currently used by the stamping equipment are also called from the mold library, and the same molds are replenished to the first waiting area as the molds to be replaced. The stamping molds required for the production content of the next work order scheduling are replenished to the second waiting area as the molds to be updated.

[0137] If the same molds as those currently used by the stamping equipment do not exist in the mold library, the molds to be replaced will not be replenished to the first waiting area.

[0138] In this embodiment, the stamping molds used by the stamping equipment are closely related to the production order scheduling. That is, the stamping molds required for the subsequent workpiece generation by the stamping equipment are determined through the production order scheduling, and according to the determination result, the transport vehicle is called to call the corresponding stamping molds from the mold library, and the stamping molds are replenished to the waiting area and stored in the waiting area as the molds to be used, so as to realize an intelligent and automated production process.

[0139] In addition, the present application also provides a stamping die replacement system. The stamping die replacement system includes the stamping equipment and the transport vehicle. The stamping equipment includes an ultrasonic signal detection device and a die replacement device:

[0140] The ultrasonic signal detection device is used to: receive the sound wave signal generated by the stamping die on the stamping equipment and analyze the sound wave signal to determine whether the ultrasonic signal is a sound wave signal generated for normal production;

[0141] The die replacement device is used to: retrieve the die to be used in the waiting area corresponding to the stamping equipment and replace the die to be used with the stamping equipment;

[0142] The transport vehicle is used to: transport the replaced die and the die to be used.

[0143] In addition, the present application also provides a stamping die replacement device. The stamping die replacement device includes:

[0144] A receiving module: used to receive the abnormal fluctuation sound wave signal generated by the stamping die collected by the ultrasonic signal detection device arranged on the stamping equipment;

[0145] A determining module: used to determine the sound source position of the sound wave signal to obtain the abnormal point position in the production area where the stamping equipment is located;

[0146] A control module: used to control the die replacement device arranged on the stamping equipment to replace the die to be used in the waiting area to the abnormal point position to maintain normal production in the production area; the waiting area is the area where the die to be used corresponding to the abnormal point position is stored.

[0147] Exemplarily, the control module includes:

[0148] A first determining sub-module: used to determine the first waiting area and the second waiting area corresponding to the abnormal point position based on the preset mapping relationship and the abnormal point position;

[0149] A first control sub-module: used to control the die replacement device arranged on the stamping equipment to retrieve and replace the die to be replaced to the abnormal point position if there is a die to be replaced in the first waiting area, and the die to be replaced is used to maintain the current production content of the stamping equipment;

[0150] A second control sub-module: used to control the die replacement device to retrieve and replace the die to be updated in the second waiting area to the abnormal point position if there is no die to be replaced in the first waiting area, and the updated die is used to update the production content of the stamping equipment.

[0151] The second determination sub-module: configured to determine the content to be produced for the next order in the order scheduling based on a preset production order schedule;

[0152] The third determination sub-module: configured to determine the molds required for subsequent production based on the content to be produced;

[0153] The first output sub-module: configured to output a replenishment instruction to a transport vehicle, where the replenishment instruction is used to call the transport vehicle to transport and replenish the required molds to the waiting area.

[0154] Exemplarily, the determination module includes:

[0155] The fourth determination sub-module: configured to determine a stamping device that generates abnormal fluctuations in the production area based on the sound source position of the sound wave signal;

[0156] The second output sub-module: configured to output a stop instruction to the stamping device that generates abnormal fluctuations, where the stop instruction is used to stop the production process of the stamping device that generates abnormal fluctuations;

[0157] The first marking sub-module: configured to mark the stamping device that stops production as an abnormal point position.

[0158] The detection sub-module: configured to perform a shock wave detection on the stamping die at the abnormal point position after marking the stamping device that stops production as an abnormal point position, and obtain a detection result;

[0159] The second marking sub-module: configured to mark the stamping die as a die to be replaced if the detection result does not meet a preset standard.

[0160] Exemplarily, the detection sub-module includes:

[0161] The output unit: configured to output an action instruction to a metal impact hammer, where the action instruction is used to call the metal impact hammer to impact the stamping die at the abnormal point position;

[0162] The receiving unit: configured to receive the impact echo data generated by the stamping die;

[0163] The detection unit: configured to detect the change in the sound wave peak value of the impact echo data and obtain a detection result;

[0164] The marking unit: for marking the stamping die as a die to be replaced if the detection result does not meet a preset standard, includes:

[0165] The determination unit: configured to determine that the detection result does not meet the preset standard and mark the stamping die as a die to be replaced if the change in the sound wave peak value in the detection result is different from the preset sound wave change.

[0166] The specific implementation of the stamping die replacement device in this application is basically the same as that of the above-mentioned embodiments of the stamping die replacement method, and will not be elaborated here.

[0167] In addition, this application also provides a stamping die replacement device. As Figure 3 shown, Figure 3 is a schematic structural diagram of the hardware operating environment involved in the embodiment solution of this application.

[0168] Exemplarily, Figure 3 it can be a schematic structural diagram of the hardware operating environment of the stamping die replacement device.

[0169] As Figure 3 shown, the stamping die replacement device may include a processor 301, a communication interface 302, a memory 303, and a communication bus 304. Among them, the processor 301, the communication interface 302, and the memory 303 communicate with each other through the communication bus 304. The memory 303 is used to store a computer program; when the processor 301 executes the program stored on the memory 303, it implements the steps of the stamping die replacement method.

[0170] The communication bus 304 mentioned in the above stamping die replacement device may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This communication bus 304 can be divided into an address bus, a data bus, and a control bus, etc. For the sake of simplicity, only a thick line is used to represent it in the figure, but it does not mean that there is only one bus or one type of bus.

[0171] The communication interface 302 is used for communication between the above stamping die replacement device and other devices.

[0172] The memory 303 may include a Random Access Memory (RMD), and may also include a Non-Volatile Memory (NM), such as at least one disk memory. Optionally, the memory 303 may also be at least one storage device located far from the aforementioned processor 301.

[0173] The above-mentioned processor 301 may be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0174] The specific implementation manner of the stamping die replacement device in this application is basically the same as that of each embodiment of the above stamping die replacement method, and will not be elaborated here.

[0175] In addition, an embodiment of this application also proposes a computer-readable storage medium, on which a stamping die replacement program is stored. When the stamping die replacement program is executed by a processor, the steps of the stamping die replacement method as described above are implemented.

[0176] The specific implementation manner of the computer-readable storage medium of this application is basically the same as that of each embodiment of the above stamping die replacement method, and will not be elaborated here.

[0177] It should be noted that in this article, the terms "including", "comprising", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or system including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article, or system. Without more limitations, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article, or system including that element.

[0178] The serial numbers of the above embodiments of this application are only for description and do not represent the advantages and disadvantages of the embodiments.

[0179] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-described embodiment methods can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium as described above (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions for causing a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

[0180] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A method for replacing a stamping die, characterized in that, it is applied to a stamping device, the stamping device includes an ultrasonic signal detection device and a die replacement device, and the stamping die replacement method includes the following steps: Receiving the abnormal fluctuating sound wave signal generated by the stamping die collected by the ultrasonic signal detection device arranged on the stamping device, wherein the sound wave signal is the reflected sound wave signal generated by the die when the ultrasonic signal detection device outputs an ultrasonic signal into the die, or the sound wave signal generated by the stamping die when the stamping device is in production; Determining the sound source position of the sound wave signal to obtain the abnormal point position in the production area where the stamping device is located. The production area where the stamping device is located includes multiple stamping devices, and the ultrasonic signal detection device on the stamping device will output the collected signal to the system; Controlling the die replacement device arranged on the stamping device to replace the die to be used in the waiting area to the abnormal point position to maintain the normal production of the production area; the waiting area is the area corresponding to the abnormal point position for storing the die to be used, and the waiting area includes a first waiting area and a second waiting area, and the die to be used includes a die to be replaced and a die to be updated; The controlling the die replacement device arranged on the stamping device to replace the die to be used in the waiting area to the abnormal point position includes: Based on the preset mapping relationship and the abnormal point position, determining the first waiting area and the second waiting area corresponding to the abnormal point position, wherein the first waiting area stores the same stamping die as the one currently used by the stamping device, and the second waiting area has a stamping die different from the one currently used by the stamping device; If there is a die to be replaced in the first waiting area, controlling the die replacement device arranged on the stamping device to retrieve and replace the die to be replaced to the abnormal point position, and the die to be replaced is used to maintain the current production content of the stamping device; If there is no die to be replaced in the first waiting area, controlling the die replacement device to retrieve and replace the die to be updated in the second waiting area to the abnormal point position, and the updated die is used to update the production content of the stamping device; Wherein, after controlling the die replacement device to retrieve and replace the die to be updated in the second waiting area to the abnormal point position, it includes: Judging the current production work order scheduling content and determining whether the previous production work order scheduling has been completed; If the production content of the previous work order scheduling is not completed, automatically switching the previous work order scheduling to the last, and waiting for the die repair of the previous work order scheduling to be completed before continuing to produce the content of the previous work order scheduling; If the content of the previous work order scheduling has been completed, based on the preset production work order scheduling, determining the content to be produced for the next order in the work order scheduling; Based on the content to be produced, determining the dies required for subsequent production; Outputting a replenishment instruction to the transport vehicle, and the replenishment instruction is used to call the transport vehicle to transport and replenish the required dies to the waiting area.

2. The stamping die replacement method according to claim 1, characterized in that, Determining the sound source position of the acoustic wave signal to obtain the abnormal point position in the production area where the stamping equipment is located includes: Based on the sound source position of the acoustic wave signal, determining the stamping equipment that generates abnormal fluctuations in the production area; Outputting a stop instruction to the stamping equipment that generates abnormal fluctuations, where the stop instruction is used to stop the production process of the stamping equipment that generates abnormal fluctuations; Marking the stamping equipment that stops production as the abnormal point position.

3. The stamping die replacement method according to claim 2, characterized in that, Before the control sets the die replacement device provided on the stamping equipment to replace the die to be used in the waiting area to the abnormal point position, it includes: After marking the stamping equipment that stops production as the abnormal point position, performing a shock wave detection on the stamping die at the abnormal point position to obtain a detection result; If the detection result does not meet the preset standard, marking the stamping die as the die to be replaced.

4. The stamping die replacement method according to claim 3, characterized in that, Performing a shock wave detection on the stamping die at the abnormal point position to obtain a detection result, including: Outputting an action instruction to the metal impact hammer, where the action instruction is used to call the metal impact hammer to impact the stamping die at the abnormal point position; Receiving the impact echo data generated by the stamping die; Detecting the change in the acoustic wave peak value of the impact echo data to obtain a detection result; The step of if the detection result does not meet the preset standard, then marking the stamping die as the die to be replaced, includes: If the change in the acoustic wave peak value in the detection result is different from the preset acoustic wave change, determining that the detection result does not meet the preset standard, and marking the stamping die as the die to be replaced.

5. The stamping die replacement method according to claim 1, characterized in that, After the control sets the die replacement device provided on the stamping equipment to replace the die to be used in the waiting area to the abnormal point position, it includes: Outputting a transportation instruction to the transport vehicle, where the transportation instruction is used to call the transport vehicle to transport the replaced stamping die to the die library; After the transport vehicle completes the transportation action, outputting a marking instruction to the management system of the die library, where the marking instruction is used to mark the replaced die as the die to be repaired.

6. A stamping die replacement device, characterized in that, The device includes: a memory, a processor, and a stamping die replacement program stored on the memory and executable on the processor, and the stamping die replacement program is configured to implement the steps of the stamping die replacement method according to any one of claims 1 to 5.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a stamping die replacement program, and when the stamping die replacement program is executed by a processor, it implements the steps of the stamping die replacement method according to any one of claims 1 to 5.

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