Display panel, preparation method thereof and display device

Abstract

The application discloses a display panel, a preparation method thereof and a display device. The display panel has a hole region, a partition region and a display region. The display panel comprises a substrate, a display functional layer and a partition assembly. The display functional layer comprises a pixel circuit layer and a first light-emitting functional layer which are arranged in layers. The partition assembly is arranged on the substrate and located in the partition region. The partition assembly comprises a plurality of partition walls which are arranged at intervals. A second light-emitting functional layer is formed on the side of the partition wall away from the substrate. The partition wall comprises a partitioning part. The distance between the ends of adjacent partitioning parts close to the substrate is greater than the distance between the ends of adjacent partitioning parts away from the substrate. A third light-emitting functional layer is formed on the part of the substrate between the adjacent partition walls and arranged intermittently with the second light-emitting functional layer. The water and oxygen isolation effect of the display panel is improved, and the reliability of the display panel is enhanced.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Punch-hole screens, with their high screen-to-body ratio, offer a novel visual experience and sensory impact, leading to their increasingly widespread application. However, in punch-hole screens, water and oxygen can easily seep into the display area through the hole, affecting the display effect. Currently, the industry solution involves forming a partition wall around the hole to isolate the light-emitting device layer. This partition wall is formed using a side-cutting method, but the side-cutting depth is relatively small, resulting in poor screen reliability. Summary of the Invention

[0003] This application provides a display panel and its manufacturing method, as well as a display device, which can improve the water and oxygen isolation effect of the display panel and enhance its reliability.

[0004] An embodiment of a first aspect of this application provides a display panel having a hole area, a partition area, and a display area, wherein the partition area is disposed around at least a portion of the hole area and is located between the hole area and the display area, and the display panel includes:

[0005] Substrate;

[0006] A display functional layer is disposed on the substrate and located in the display area. The display functional layer includes a pixel circuit layer and a first light-emitting functional layer stacked together.

[0007] A partition assembly is disposed on the substrate and located in the partition area. The partition assembly includes a plurality of spaced partition walls surrounding at least a portion of the aperture area. A second light-emitting functional layer is formed on the side of the partition wall facing away from the substrate. The partition wall includes a partitioning portion. The distance between the ends of adjacent partitioning portions near the substrate is greater than the distance between the ends away from the substrate. A third light-emitting functional layer is formed on the portion of the substrate between adjacent partition walls. The second light-emitting functional layer and the third light-emitting functional layer are intermittently disposed.

[0008] According to an embodiment of the first aspect of the present invention, the difference between the spacing between the ends of adjacent partition portions near the substrate and the spacing between the ends away from the substrate is 1 μm-4 μm;

[0009] Preferably, the partition wall further includes a non-functional portion located on the side of the partition function portion away from the substrate, and the distance between adjacent non-functional portions near the substrate end is less than or equal to the distance away from the substrate end;

[0010] Preferably, in the partition area, the number of partition walls along the direction from the center of the hole area to the display area is 7 to 15.

[0011] The second aspect of this application also provides a method for manufacturing a display panel, comprising:

[0012] A substrate is provided having a first region, a second region, and a third region, the second region surrounding at least a portion of the first region and the second region being located between the first region and the third region;

[0013] A first material layer is formed on the second region of the substrate;

[0014] The first material layer is patterned to form alternating solid regions and via regions, each solid region surrounding at least a portion of the first region, and the spacing between two adjacent solid regions near the substrate is smaller than the spacing away from the substrate.

[0015] A second material layer is formed on the side of the first material layer away from the substrate, the second material layer including a first portion located in the via region and a second portion located on the side of the solid region away from the substrate;

[0016] The second material layer is patterned so that the first portion forms a spaced partition wall, the partition wall including a partition function portion located in the via area, the distance between the ends of two adjacent partition function portions near the substrate is greater than the distance between the ends away from the substrate;

[0017] Remove the first material layer.

[0018] According to a second aspect of the present invention, the first material layer is made of photoresist, and the second material layer is made of metal.

[0019] According to any of the foregoing embodiments of the second aspect of the present invention, the step of patterning the first material layer to form alternating solid regions and via regions, each of the solid regions surrounding at least a portion of the first region, wherein the spacing between two adjacent solid regions at the end closer to the substrate is smaller than the spacing at the end farther from the substrate, comprises:

[0020] The first material layer is patterned using photolithography.

[0021] According to any of the foregoing embodiments of the second aspect of the present invention, the step of patterning the second material layer to form a spaced-apart partition wall in the first portion, the partition wall including a partitioning portion located within the via region, wherein the distance between the ends of two adjacent partitioning portions near the substrate is greater than the distance between the ends away from the substrate includes:

[0022] A first photoresist layer is formed on the side of the second material layer facing away from the substrate;

[0023] The first photoresist layer is patterned by photolithography to form a first light-shielding part covering the via area and a first light-transmitting part located between adjacent first light-shielding parts.

[0024] The second material layer is patterned by removing the area opposite to the first light-transmitting part in the second material layer through a wet etching process.

[0025] Preferably, the process further includes removing the first photoresist layer using a photolithography process;

[0026] Preferably, the step of removing the first material layer includes:

[0027] The first material layer is removed by photolithography.

[0028] According to any of the foregoing embodiments of the second aspect of the present invention, the first material layer is a metal and the second material layer is a photoresist.

[0029] According to any of the foregoing embodiments of the second aspect of the present invention, the step of patterning the first material layer to form alternating solid regions and via regions, each of the solid regions surrounding at least a portion of the first region, wherein the spacing between two adjacent solid regions at the end closer to the substrate is smaller than the spacing at the end farther from the substrate, comprises:

[0030] A second photoresist layer is formed on the side of the first material layer away from the substrate. The second photoresist layer includes a predetermined retention area opposite to the portion of the first material layer used to form a solid region and a predetermined removal area opposite to the portion of the first material layer used to form a via region.

[0031] The second photoresist layer is patterned using a photolithography process, and the preset removal area is removed to form the second light-transmitting part;

[0032] The first material layer is patterned by removing the area opposite to the second light-transmitting portion in the first material layer using a wet etching process.

[0033] According to any of the foregoing embodiments of the second aspect of the present invention, the step of patterning the second material layer to form a spaced-apart partition wall in the first portion, the partition wall including a partitioning portion located within the via region, wherein the distance between the ends of two adjacent partitioning portions near the substrate is greater than the distance between the ends away from the substrate includes:

[0034] The second part is removed using a photolithography process; or...

[0035] The second portion is removed by photolithography, and the thickness of the first portion along the thickness direction of the substrate is reduced.

[0036] Preferably, the step of removing the first material layer includes:

[0037] The first material layer is removed by a wet etching process.

[0038] An embodiment of the third aspect of this application also provides a display device, including any of the display panels provided in the first aspect of this application.

[0039] The display panel provided in this application embodiment includes a hole area, a partition area, and a display area. The partition area includes partition walls spaced apart. During the fabrication process of the display panel, the first light-emitting functional layer, the second light-emitting functional layer, and the third light-emitting functional layer are fabricated simultaneously. Since the distance between the ends of the partitioning portions of adjacent partition walls that are closer to the substrate is greater than the distance between the ends that are farther from the substrate, the second and third light-emitting functional layers can be better separated by the partition walls during fabrication. This results in the second light-emitting functional layer being located on the side of the partition wall away from the substrate, while the third light-emitting functional layer is directly located on the substrate. The second and third light-emitting functional layers are discontinuously arranged, thereby blocking the transmission of water and oxygen invading from the hole area to the first light-emitting functional layer, reducing the impact of water and oxygen on the first light-emitting functional layer, and thus improving the display effect of the display area and enhancing the reliability of the display panel. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0042] Figure 2 yes Figure 1 A cross-sectional view along P-P';

[0043] Figure 3 This is a partial cross-sectional view of another display panel provided in an embodiment of this application;

[0044] Figure 4 This is a partial cross-sectional view of another display panel provided in an embodiment of this application;

[0045] Figure 5This is a schematic diagram of the hole area and its surrounding structure of a display panel provided in an embodiment of this application;

[0046] Figure 6 This is a schematic diagram of the hole area and its surrounding structure of a display panel provided in an embodiment of this application;

[0047] Figure 7 This is a schematic flowchart of a method for manufacturing a display panel provided in this application;

[0048] Figures 8 to 13 This is a schematic diagram of film layer changes in a method for preparing a display panel provided in this application;

[0049] Figures 14 to 15 This is a schematic diagram of film layer changes in another method for preparing a display panel provided in this application;

[0050] Figures 16 to 18 This is a schematic diagram of film layer changes in another method for preparing a display panel provided in this application;

[0051] Figures 19 to 21 This is a schematic diagram of film layer changes in another method for preparing a display panel provided in this application;

[0052] Figure 22 This is a schematic diagram of film layer changes in another method for preparing a display panel provided in this application;

[0053] Figures 23 to 24 This is a schematic diagram of film layer changes in another method for preparing a display panel provided in this application;

[0054] Figure 25 This is a schematic diagram of film layer changes in another method for preparing a display panel provided in this application;

[0055] Figures 26 to 27 This is a schematic diagram of film layer changes in another method for preparing a display panel provided in this application;

[0056] Figure 28 This is a schematic diagram of the structure of a display device provided in an embodiment of this application.

[0057] In the attached image:

[0058] HL - Hole area; NA - Isolation area; AA - Display area; 1 - Display panel; 10 - Substrate; 11 - Display functional layer; 111 - Pixel circuit layer; 112 - First light-emitting functional layer; 12 - Isolation assembly; 121 - Isolation wall; 1211 - Isolation function part; 1212 - Non-function part; 13 - Second light-emitting functional layer; 14 - Third light-emitting functional layer; 15 - First material layer; 151 - Solid area; 152 - Via area; 153 - Reservation area; 15 4-Area to be removed; 16-Second material layer; 161-First part; 162-Second part; 19-Photomask; 191-First region; 192-Second region; 20-First photoresist layer; 201-First light-shielding part; 202-First light-transmitting part; 21-Second photoresist layer; 211-Preset retention area; 212-Preset removal area; 213-Second light-transmitting part; Q1-First region; Q2-Second region; Q3-Third region; 2-Display device. Detailed Implementation

[0059] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description in order to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples thereof.

[0060] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0061] The inventors discovered that punch-hole displays, as a popular type of display screen, offer a high screen-to-body ratio, providing a novel visual experience and sensory impact, making them a sought-after product by display manufacturers. The manufacturing process of punch-hole displays requires using a laser to cut the substrate to form the hole area. During laser cutting, the substrate absorbs laser energy of a specific wavelength, causing ablation and cutting. During cutting, water and oxygen can easily penetrate the display area through the hole area, leading to screen failure. Current industry solutions involve forming a barrier wall around the hole area to isolate the light-emitting device layer. However, existing barrier walls are formed using a side-cutting method, resulting in a small cutting depth and complex manufacturing process, leading to poor screen reliability. Based on research into these problems, the inventors provide a display panel, its manufacturing method, and a display device to improve the water and oxygen isolation effect and enhance the reliability of the display panel.

[0062] To better understand this application, the following will be combined with... Figures 1 to 28 The display panel 1 and its preparation method, as well as the display device 2, according to embodiments of this application will be described in detail.

[0063] Please see Figure 1 This application provides a display panel 1 having an aperture area HL, a partition area NA, and a display area AA. The partition area NA is disposed around at least a portion of the aperture area HL and is located between the aperture area HL and the display area AA.

[0064] like Figure 2 As shown, the display panel 1 includes a substrate 10, a display functional layer 11, and a partition assembly 12. The display functional layer 11 is disposed on the substrate 10 and located in the display area AA. The display functional layer 11 includes a pixel circuit layer 111 and a first light-emitting functional layer 112 stacked together. The partition assembly 12 is disposed on the substrate 10 and located in the partition area NA. The partition assembly 12 includes a plurality of spaced partition walls 121. The partition walls 121 surround at least a portion of the aperture area HL. A second light-emitting functional layer 13 is formed on the side of the partition wall 121 facing away from the substrate 10. The partition wall 121 includes a partitioning portion 1211. The distance between the ends of adjacent partitioning portions 1211 near the substrate 10 is greater than the distance between the ends away from the substrate 10. A third light-emitting functional layer 14 is formed on the portion of the substrate 10 located between adjacent partition walls 121. The second light-emitting functional layer 13 and the third light-emitting functional layer 14 are intermittently disposed.

[0065] The display panel 1 provided in this application includes an aperture area HL, a partition area NA, and a display area AA. The partition area NA includes partition walls 121 spaced apart. Since the distance between the ends of the partitioning portions 1211 of adjacent partition walls 121 that are closer to the substrate 10 is greater than the distance between the ends that are farther away from the substrate 10, the second light-emitting functional layer 112, the second light-emitting functional layer 13, and the third light-emitting functional layer 14 can be better separated by the partition walls 121 when they are fabricated. This results in the second light-emitting functional layer 13 being located on the side of the partition wall 121 away from the substrate 10, and the third light-emitting functional layer 14 being directly located on the substrate 10. The second light-emitting functional layer 13 and the third light-emitting functional layer 14 are discontinuously arranged, thereby blocking the transmission of water and oxygen invading from the aperture area HL to the first light-emitting functional layer 112, reducing the impact of water and oxygen on the first light-emitting functional layer 112, and thus making the display area AA of the display panel 1 have a better display effect and making the display panel 1 more reliable.

[0066] In one feasible embodiment, the distance between the ends of adjacent partition portions 1211 closest to the substrate 10 and the distance between the ends furthest from the substrate 10 is 1μm-4μm. This further enhances the partitioning effect of the partition wall 12, thereby further reducing the impact of water and oxygen on the first light-emitting functional layer 112 and further improving the reliability of the display panel.

[0067] Specifically, the film structure of the first light-emitting functional layer 112, the second light-emitting functional layer 13, and the third light-emitting functional layer 14 may be the same, each including a common layer and an electrode layer located on the side of the common layer away from the substrate 10. The common layer includes at least one of an electron injection layer (EIL), an electron transport layer (ETL), a hole blocking layer (HBL), an electron blocking layer (EBL), a hole transport layer (HTL), and a hole injection layer (HIL) stacked along the direction away from the substrate 10. Specifically, the electrode layer may be a cathode layer.

[0068] In one feasible implementation, such as Figure 3 and Figure 4 As shown, the partition wall 121 may also include a non-functional portion 1212 located on the side of the partition functional portion 1211 away from the substrate 10, and the distance between adjacent non-functional portions 1212 near the end of the substrate 10 is less than or equal to the distance away from the end of the substrate 10.

[0069] In the above embodiment, the partition wall 121 further includes a non-functional portion 1212, which is located on the side of the functional portion away from the substrate 10 and is integrally formed with the functional portion. The distance between adjacent non-functional portions 1212 near the substrate 10 is less than or equal to the distance between the ends of the functional portions away from the substrate 10.

[0070] In one feasible implementation, the number of partition walls 121 in the partition area NA, along the direction from the center of the hole area HL to the display area AA, is 7 to 15. By setting 7 to 15 partition walls 121, the partitioning effect of the partition assembly 12 can be improved while taking into account the width of the partition area NA.

[0071] Specifically, the partition area NA is disposed around at least a portion of the hole area HL, and the partition wall 121 is also disposed around at least a portion of the hole area HL, extending in the direction surrounding the hole area HL. For example... Figure 5 As shown, when the hole area HL is a circular hole, the partition area NA can be a ring-shaped structure surrounding the hole area HL. In this case, the partition wall 121 can also be a ring-shaped structure surrounding the hole area HL, thereby achieving a better partition effect.

[0072] It is understood that the shape of the hole area HL is not limited to a circle, but can also be square, irregular, etc. The partition area NA is not limited to a circular or square ring shape that completely surrounds the hole area HL, but can also partially surround the hole area HL. The partition wall 121 extends along at least a portion of the direction surrounding the hole area HL, and can completely surround the hole area HL, or surround a portion of the hole area HL, and multiple partition walls 121 are arranged along the direction surrounding the hole area HL, etc., and this application does not make any special limitations. Figure 6 As shown, when the partition wall 121 surrounds the hole area HL and multiple partition walls 121 are arranged in the direction surrounding the hole area HL, multiple partition walls 121 can be staggered along the direction from the center of the hole area HL to the display area AA to achieve a better partitioning effect.

[0073] This application also provides a method for manufacturing the display panel 1, such as... Figure 7 As shown, it includes:

[0074] S100, such as Figure 8 As shown, a substrate 10 is provided, the substrate 10 having a first region Q1, a second region Q2 and a third region Q3, the second region Q2 surrounding at least a portion of the first region Q1, and the second region Q2 being located between the first region Q1 and the third region Q3.

[0075] The substrate 10 may include an organic layer 101 and an inorganic layer 102 stacked together, etc. This application does not make any special limitation. Specifically, the organic layer may be polyimide.

[0076] S200, such as Figure 9 As shown, a first material layer 15 is formed on the second region Q2 of the substrate 10.

[0077] S300, such as Figure 10As shown, the first material layer 15 is patterned to form alternating solid regions 151 and via regions 152, each solid region 151 surrounding at least a portion of the first region Q1, and the spacing between two adjacent solid regions 151 near the end of the substrate 10 is smaller than the spacing away from the end of the substrate 10.

[0078] S400, such as Figure 11 As shown, a second material layer 16 is formed on the side of the first material layer 15 away from the substrate 10. The second material layer 16 includes a first portion 161 located in the via region 152 and a second portion 162 located on the side of the solid region 151 away from the substrate 10.

[0079] S500, such as Figure 12 As shown, the second material layer 16 is patterned so that the first portion 161 forms a spaced partition wall 121. The partition wall 121 includes a partitioning portion 1211 located in the via region 152. The distance between two adjacent partitioning portions 1211 near the end of the substrate 10 is greater than the distance between the ends away from the substrate 10.

[0080] S600, such as Figure 13 As shown, the first material layer 15 is removed.

[0081] In the above embodiment, in step S300, the via area 152 between adjacent solid areas 151 provides space for the subsequent formation of partition wall 121. The shape and size of the subsequent partition wall 121 can be controlled by controlling the spacing between adjacent solid areas 151. For example, the spacing difference between the end of the adjacent partition function part 1211 that is close to the substrate 10 and the end that is far from the substrate 10 can be controlled, so that the partition wall 121 can achieve a better partitioning effect.

[0082] In the above embodiment, in step S500, patterning the second material layer 16 may include removing at least a portion of each second portion 162, thereby making each first portion 161 discontinuously arranged, thereby forming a partition wall 121 spaced apart.

[0083] In one feasible embodiment, the above-mentioned method for preparing the display panel 1 further includes simultaneously performing the above-mentioned steps on the first region Q1 of the substrate 10, that is, simultaneously forming a partition wall 121 in the first region Q1. This application does not make any particular limitation.

[0084] In one feasible embodiment, the method for manufacturing the display panel 1 further includes drilling holes in the area opposite to the first region Q1 to form a hole region HL, including removing the portion opposite to the first region Q1. Specifically, this may include using a laser to cut the area opposite to the first region Q1, and using laser energy to generate an ablation effect to cut and form the hole region HL of the display panel 1.

[0085] In one feasible implementation, the first material layer 15 and the second material layer 16 are made of materials that can be patterned by different processes, so as to avoid damaging the first material layer 15 during the patterning process of the second material layer 16 and affecting the final shape and size of the partition wall 121.

[0086] In one feasible implementation, the first material layer 15 is made of photoresist, and the second material layer 16 is made of metal.

[0087] In the above embodiments, the first material layer 15 and the second material layer 16 are made of different materials, which makes it easy to pattern the first material layer 15 and the second material layer 16 respectively through different patterning processes.

[0088] Specifically, in one feasible implementation, such as Figure 14 and Figure 15 As shown, step S300 includes:

[0089] S311, the first material layer 15 is patterned by photolithography.

[0090] The first material layer 15 is made of photoresist. S311 specifically includes: the first material layer 15 includes a retention area 153 corresponding to the portion used to form the solid region 151 and a region to be removed 154 corresponding to the portion used to form the via region 152. A photomask 19 can be disposed on the side of the first material layer 15 away from the substrate 10, and a light source (not shown in the figure) can be disposed on the side of the photomask 19 away from the substrate 10. The photomask 19 includes a first region Q1 opposite to the retention area 153 and a second region Q2 opposite to the region to be removed 154. The transmittance of the first region Q1 is less than that of the second region Q2. Specifically, the first region Q1 can be a via, and the transmittance of the second region Q2 can be a light-shielding area. Then, the region to be removed 154 can be removed by exposure and development to form the via region 152. The remaining retention area 153 forms the solid region 151, thereby forming alternating solid regions 151 and via regions 152 to achieve patterning of the first material layer 15.

[0091] In the above embodiment, the angle between the sidewall of the solid region 151 and the substrate 10 can be adjusted by adjusting the thickness of the first material layer 15 and adjusting the illumination parameters, thereby providing a basis for adjusting the size of the partition wall 121 formed by the second material layer 16. The above-described method for adjusting the size of the partition wall 121 is simple, and at the same time, it can make the difference between the distance between the ends of adjacent partition function parts 1211 that are closer to the substrate 10 and the distance between the ends that are farther from the substrate 10 larger, thus making its partitioning effect better.

[0092] In one feasible implementation, such as Figures 16 to 18As shown, the second material layer 16 is made of metal, and step S500 includes:

[0093] S511, such as Figure 16 As shown, a first photoresist layer 20 is formed on the side of the second material layer 16 opposite to the substrate 10.

[0094] S512, such as Figure 17 As shown, the first photoresist layer 20 is patterned by photolithography to form a first light-shielding portion 201 covering the via area 152 and a first light-transmitting portion 202 located between adjacent first light-shielding portions 201.

[0095] S513, such as Figure 18 As shown, the area in the second material layer 16 opposite to the first light-transmitting portion 202 is removed by a wet etching process to pattern the second material layer 16.

[0096] In the above embodiments, the specific implementation of the photolithography process in step S512 is similar to that in step S311, and will not be repeated here. In step S513, the area in the second material layer 16 opposite to the first light-transmitting part 202 is removed by a wet etching process. Specifically, a wet etching solution that matches the metal material of the second material layer 16 can be used to remove the area in the second material layer 16 opposite to the first light-transmitting part 202. The etching effect of the wet etching process is better, and during the wet etching process of the second material layer 16, the wet etching solution only reacts with the second material layer 16 and does not react with the first material layer 15, the first photoresist layer 20, and the substrate 10, thereby preventing damage to the first material layer 15 and the substrate 10. Furthermore, the wet etching process has a shorter etching time and higher preparation efficiency.

[0097] Specifically, the area in the second material layer 16 opposite to the first light-transmitting part 202 can also be removed by dry etching process, but this application does not make any special limitation.

[0098] Specifically, the second material layer 16 can be a molybdenum metal layer, or a titanium metal layer, an aluminum metal layer, or a titanium metal layer stacked along the direction away from the substrate 10, etc., and this application does not make any special limitation.

[0099] In one feasible implementation, after step S513, the first photoresist layer 20 is removed by a photolithography process. The removal method is simple and does not damage the partition wall 121.

[0100] In one feasible implementation, step S600 includes:

[0101] S611, the first material layer 15 is removed by photolithography.

[0102] In the above embodiments, the removal of the first material layer 15 is simple and will not damage the partition wall 121.

[0103] In another feasible implementation, the first material layer 15 is metal and the second material layer 16 is photoresist.

[0104] In the above embodiments, the first material layer 15 and the second material layer 16 are made of different materials, which makes it easy to pattern the first material layer 15 and the second material layer 16 respectively through different patterning processes.

[0105] Specifically, in one feasible implementation, such as Figures 19 to 21 As shown, step S300 includes:

[0106] S321, such as Figure 19 As shown, a second photoresist layer 21 is formed on the side of the first material layer 15 away from the substrate 10. The second photoresist layer 21 includes a preset retention area 211 opposite to the portion of the first material layer 15 used to form the solid region 151, and a preset removal area 212 opposite to the portion of the first material layer 15 used to form the via region 152.

[0107] S322, such as Figure 20 As shown, the second photoresist layer 21 is patterned by photolithography, and the preset removal area 212 is removed to form the second light-transmitting part 213.

[0108] S323, such as Figure 21 As shown, the area in the first material layer 15 opposite to the second light-transmitting portion 213 is removed by a wet etching process to pattern the first material layer 15.

[0109] In the above embodiment, a patterned second photoresist layer 21 covers the portion of the first material layer 15 used to form the solid region 151, while a second light-transmitting portion 213 exposes the portion of the first material layer 15 used to form the via region 152. Then, a wet etching process (using an etching solution) is used to remove the portion of the first material layer 15 exposed by the second light-transmitting portion 213 to form the via region 152. The wet etching process provides a better etching effect for the patterned first material layer 15. Furthermore, during the wet etching process, the etching solution only reacts with the first material layer 15 and not with the second photoresist layer 21 or the substrate 10, thus preventing damage to the substrate 10. The wet etching process also has a shorter etching time and higher fabrication efficiency.

[0110] The above step S300 also includes:

[0111] S324, such as Figure 22 As shown, the second photoresist layer 21 is removed. This second photoresist layer 21 can be removed via a stripping process.

[0112] Step S300 is followed by step S400, in which a second material layer 16 is formed on the side of the first material layer 15 made of metal away from the substrate 10. The second material layer 16 is made of photoresist and includes a first portion 161 located in the via region 152 and a second portion 162 located on the side of the solid region 151 away from the substrate 10.

[0113] In one feasible implementation, such as Figure 23 and Figure 24 As shown, step S500 includes:

[0114] S521, the second part 162 is removed by photolithography.

[0115] In the above embodiment, the material of the second material layer 16 is photoresist, specifically polyimide. The spacing between the portions of the second material layer 16 located between adjacent first portions 161 gradually increases from the end closer to the substrate 10 to the end farther from the substrate 10. The portion of the second material layer 16 located between adjacent solid regions 151 is the partitioning portion 1211 of the partition wall 121, and the non-functional portion 1212 located on the side of the partitioning portion 1211 away from the substrate 10.

[0116] Or, such as Figure 25 As shown, step S500 includes: including S522, removing the second portion 162 by photolithography, and thinning the thickness of the first portion 161 along the thickness direction of the substrate 10.

[0117] In the above embodiment, the material of the second material layer 16 is photoresist, specifically polyimide. After the second portion 162 and the portion of the first portion 161 that is higher than the solid region 151 are removed by photolithography, the spacing between the portions of the second material layer 16 located between adjacent first portions 161 can be gradually increased from the end closer to the substrate 10 to the end farther away from the substrate 10, thereby making the partition wall 121 include the partition function portion 1211 located in the via region 152 between adjacent solid regions 151.

[0118] In one feasible implementation, such as Figure 26 and Figure 27 As shown, step S600 includes:

[0119] The first material layer 15 is removed by a wet etching process.

[0120] Since the first material layer 15 is made of metal, it can be removed by wet etching. Since the second material layer 16 is made of photoresist, when the first material layer 15 is removed by wet etching, the wet etching solution only reacts with the first material layer 15 and does not react with the second material layer 16 or the substrate 10, thereby preventing damage to the second material layer 16 and the substrate 10. Furthermore, the etching time of the wet etching process is short and the removal effect is more thorough.

[0121] This application also provides a display device 2, such as... Figure 28 As shown, it includes any of the display panels 1 provided in the above embodiments.

[0122] The display device 2 can effectively prevent the phenomenon of poor display caused by water and oxygen intruding into the display area AA of the display panel 1 through the hole area HL, thereby improving the yield and display effect of the display device 2. The display device 2 can be a fixed terminal such as a monitor or television, or a mobile terminal such as a mobile phone or tablet computer, or a wearable device such as a watch. This application does not make any particular limitation.

[0123] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A method for manufacturing a display panel, characterized in that, include: A substrate is provided having a first region, a second region, and a third region, the second region surrounding at least a portion of the first region and the second region being located between the first region and the third region; A first material layer is formed on the second region of the substrate; The first material layer is patterned to form alternating solid regions and via regions, each solid region surrounding at least a portion of the first region, and the spacing between two adjacent solid regions near the substrate is smaller than the spacing away from the substrate. A second material layer is formed on the side of the first material layer away from the substrate. The second material layer includes a first portion located in the via region and a second portion located on the side of the solid region away from the substrate. One of the materials of the first material layer and the second material layer is photoresist, and the other is metal. The second material layer is patterned so that the first portion forms a spaced partition wall, the partition wall including a partitioning part located in the via area and a non-functional part located on the side of the partitioning part away from the substrate, the distance between the ends of two adjacent partitioning parts near the substrate is greater than the distance between the ends away from the substrate, and the distance between the ends of adjacent non-functional parts near the substrate is less than or equal to the distance between the ends away from the substrate. Remove the first material layer.

2. The preparation method according to claim 1, characterized in that, The first material layer is made of photoresist, and the second material layer is made of metal; the step of patterning the first material layer to form alternating solid regions and via regions, each solid region surrounding at least a portion of the first region, wherein the distance between the ends of two adjacent solid regions closer to the substrate is less than the distance between the ends farther from the substrate includes: The first material layer is patterned using photolithography.

3. The preparation method according to claim 2, characterized in that, The step of patterning the second material layer to form a spaced-apart partition wall in the first portion, wherein the partition wall includes a partitioning portion located within the via region, and the distance between two adjacent partitioning portions near the substrate is greater than the distance between them away from the substrate, includes: A first photoresist layer is formed on the side of the second material layer facing away from the substrate; The first photoresist layer is patterned by photolithography to form a first light-shielding part covering the via area and a first light-transmitting part located between adjacent first light-shielding parts. The second material layer is patterned by removing the area opposite to the first light-transmitting portion in the second material layer through a wet etching process.

4. The preparation method according to claim 3, characterized in that, It also includes removing the first photoresist layer through a photolithography process.

5. The preparation method according to claim 3, characterized in that, The step of removing the first material layer includes: The first material layer is removed by photolithography.

6. The preparation method according to claim 1, characterized in that, The first material layer is metal, and the second material layer is photoresist; the step of patterning the first material layer to form alternating solid regions and via regions, each of the solid regions surrounding at least a portion of the first region, wherein the spacing between two adjacent solid regions at the end closer to the substrate is smaller than the spacing at the end farther from the substrate includes: A second photoresist layer is formed on the side of the first material layer away from the substrate. The second photoresist layer includes a predetermined retention area opposite to the portion of the first material layer used to form a solid region and a predetermined removal area opposite to the portion of the first material layer used to form a via region. The second photoresist layer is patterned using a photolithography process, and the preset removal area is removed to form the second light-transmitting part; The first material layer is patterned by removing the area opposite to the second light-transmitting portion in the first material layer using a wet etching process.

7. The preparation method according to claim 1, characterized in that, The first material layer is metal, and the second material layer is photoresist; the step of patterning the second material layer to form spaced-apart partition walls in the first portion, wherein the partition walls include partitioning portions located within the via area, and the distance between the ends of two adjacent partitioning portions near the substrate is greater than the distance between the ends away from the substrate includes: The second part is removed using a photolithography process; or... The second portion is removed by photolithography, and the thickness of the first portion along the thickness direction of the substrate is reduced.

8. The preparation method according to claim 7, characterized in that, The step of removing the first material layer includes: The first material layer is removed by a wet etching process.

9. A display panel having a hole area, a partition area, and a display area, the partition area being disposed around at least a portion of the hole area and located between the hole area and the display area, characterized in that, The display panel is a display panel prepared by the method of preparing a display panel according to any one of claims 1 to 8, and the display panel comprises: Substrate; A display functional layer is disposed on the substrate and located in the display area. The display functional layer includes a pixel circuit layer and a first light-emitting functional layer stacked together. A partition assembly is disposed on the substrate and located in the partition area. The partition assembly includes a plurality of spaced partition walls surrounding at least a portion of the aperture area. A second light-emitting functional layer is formed on the side of the partition wall facing away from the substrate. The partition wall includes a partitioning portion. The distance between the ends of adjacent partitioning portions near the substrate is greater than the distance between the ends away from the substrate. A third light-emitting functional layer is formed on the portion of the substrate between adjacent partition walls. The second light-emitting functional layer and the third light-emitting functional layer are discontinuously disposed. The partition wall also includes a non-functional portion located on the side of the partition function portion away from the substrate, and the distance between adjacent non-functional portions near the substrate end is less than or equal to the distance away from the substrate end.

10. The display panel according to claim 9, characterized in that, The difference between the spacing between the ends of adjacent partitions that are closer to the substrate and the spacing between the ends that are farther from the substrate is 1μm-4μm.

11. The display panel according to claim 9, characterized in that, In the partition area, the number of partition walls is 7 to 15 along the direction from the center of the hole area to the display area.

12. A display device, characterized in that, This includes a display panel prepared by the method of preparing a display panel according to any one of claims 1 to 8, or a display panel according to any one of claims 9 to 11.

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